MX573EBB125M000
Ultra-Low Jitter 125MHz LVDS XO
ClockWorks® FUSION
General Description
Features
The MX573EBB125M000 is an ultra-low phase jitter
XO with LVDS output optimized for high line rate
applications.
• 125MHz LVDS
• Typical phase noise:
- 98fs (Integration range: 1.875MHz-20MHz)
• ±50ppm total frequency stability
• -40°C to +85°C temperature range
• Industry standard 6-Pin 7mm x 5mm LGA
package
Applications
• Gigabit Ethernet
• Storage
Absolute Maximum Ratings¹
Operating Ratings²
Supply Voltage (VIN)..................................................+4.6V
Lead Temperature (soldering, 10s)..............................260°C
Case Temperature........................................................115°C
Storage Temperature (T )............................-65°C to +125°C
S
ESD Machine Model.....................................................200V
ESD Rating (HBM).........................................................2kV
Supply Voltage (VIN).......................+2.375V to +3.63V
Ambient Temperature (TA)....................-40°C to +85°C
Junction Thermal Resistance
LGA (T ) Still Air.....................................53°C/W
JA
Electrical Characteristics
VDD = 2.375 - 3.63V, TA = -40°C to +85°C, outputs terminated with 100 Ohms between Q and /Q.³
Symbol
Parameter
IDD
F0
Condition
Typ.
Max.
Units
Supply Current
90
100
mA
Center Frequency
125
Frequency Stability
Note 4
Øj
Phase Noise
Integration Range (12kHz to 20MHz)
Integration Range (1.875MHz to 20MHz)
Tstart
Start-Up Time
TR/TF
Rise/Fall time
Duty Cycle
Min.
MHz
±50
136
98
ppm
fsRMS
20
ms
100
400
ps
45
55
%
VOH
Output High Voltage
VOH max = VCM max + 1/2 VOD max
LVDS output levels
1.248
1.375
1.602
V
VOL
Output Low Voltage
VOL min = VCM min - 1/2 VOD max
LVDS output levels
0.898
1.025
1.252
V
VOD
Output Differential Voltage
247
350
454
mV
VCM
Common Mode Output Voltage
1.125
1.2
1.375
V
Notes:
1. Exceeding the absolute maximum ratings may damage the device.
2. The device is not guaranteed to function outside its operating ratings.
3. Guaranteed after thermal equilibrium.
4. Inclusive of initial accuracy, temperature drift, aging, shock, vibration.
ClockWorks is a registered trademark of Microchip Technology Inc.
Microchip Technology Inc.
June 26, 2019
MX573EB1-2178
http://www.microchip.com
Revision 1.0
tcghelp@microchip.com
Microchip Technology Inc.
MX573EBB125M000
Ordering Information
Ordering Part Number
Marking Line 1
Marking Line 3
Shipping
Package
MX573EBB125M000
MX573EB
B125M000
Tube
6-Pin 7mm x 5mm LGA
MX573EBB125M000-TR
MX573EB
B125M000
Tape and Reel
6-Pin 7mm x 5mm LGA
Devices are Green and RoHS compliant. Sample material may have only a partial top mark.
Pin Configuration
OE
VDD
DNC
/Q
GND
Q
Pin Description
Pin Number
Pin Name
Pin Type
Pin Level
1
OE
I, SE
LVCMOS
2
DNC
3
GND
PWR
4, 5
Q, /Q
O, Diff
6
VDD
PWR
Pin Function
Output Enable, disables output to tri-state,
0 = Disabled, 1 = Enabled, 50k Ohms Pull-Up (Internal)
Make no connection, leave floating.
Power Supply Ground
LVDS
Clock Output Frequency = 125MHz
Power Supply
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
Moisture Resistance
MIL-STD-883, Method 1004
Mechanical Shock
MIL-STD-883, Method 2002, Condition E
Mechanical Vibration
MIL-STD-883, Method 2007, Condition C
Resistance to Soldering Heat
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Hazardous Substance
Pb-Free / RoHS / Green Compliant
Solderability
JESD22-B102-D Method 2 (Preconditioning E)
Terminal Strength
MIL-STD-883, Method 2004, Test Condition D
Gross Leak
MIL-STD-883, Method 1014, Condition C
Fine Leak
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
Solvent Resistance
MIL-STD-202, Method 215
June 26, 2019
MX573EB1-2178
2
Revision 1.0
tcghelp@microchip.com
Microchip Technology Inc.
MX573EBB125M000
Figure 1. LVDS Output 125MHz 1.875MHz-20MHz 98fs
Figure 2. LVDS Output 125MHz 12kHz-20MHz 136fs
June 26, 2019
MX573EB1-2178
3
Revision 1.0
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Microchip Technology Inc.
MX573EBB125M000
Package Information and Recommended Land Pattern for 6-Pin LGA³
6-Pin LGA (7x5mm)
Note:
3. Package information is correct as of the publication date. For updates and most current information, go to www.microchip.com.
Microchip Technology Inc.
http://www.microchip.com
Microchip makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
information is not intended as a warranty and Microchip does not assume responsibility for its use. Microchip reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any
intellectual property rights is granted by this document. Except as provided in Microchip's terms and conditions of sale for such products, Microchip
assumes no liability whatsoever, and Microchip disclaims any express or implied warranty relating to the sale and/or use of Microchip products
including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right.
© 2019 Microchip Technology Inc.
June 26, 2019
MX573EB1-2178
4
Revision 1.0
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