MXLPLAD18KP150CAE3

MPLAD18KP7.0A – MPLAD18KP200CA Available Surface Mount 18,000 Watt Transient Voltage Suppressor High-Reliability screening available in reference to MIL-PRF-19500 DESCRIPTION Tested in accordance with the These high power 18 kW rated transient voltage suppressors in a surface mount package are requirements of provided with design features to minimize thermal resistance and cumulative heating. Typical AEC-Q101 applications include lightning and automotive load dump protection. They are particularly effective at meeting the multi-stroke lightning standard RTCA DO-160, section 22 for aircraft design. This efficient low profile package design is offered in standoff voltage selections (VWM) of 7 volts to 200 volts in either unidirectional or bidirectional construction. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • Available in both unidirectional and bidirectional construction (bidirectional with CA suffix) • High reliability with wafer fabrication and assembly lot traceability • All parts surge tested • Low profile surface mount package • Optional upscreening is available with various screening and conformance inspection options based on MIL-PRF-19500. Refer to Hirel Non-Hermetic Product Portfolio for more details on the screening options. PLAD (The cathode is the metal base under the body of this device.) • Suppresses transients up to 18,000 W @ 10/1000 μs (see Figure 1) • Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B • RoHS compliant versions are available • 3σ lot norm screening performed on standby current (ID) APPLICATIONS / BENEFITS • Protection from switching transients and induced RFI • Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4 • Secondary lightning protection per IEC 61000-4-5 with 42 ohms source impedance: Class 1,2,3,4,5: MPLAD18KP7.0A to 200CA • Secondary lightning protection per IEC 61000-4-5 with 12 ohms source impedance: Class 1,2,3,4: MPLAD18KP7.0A to 200CA • Secondary lightning protection per IEC 61000-4-5 with 2 ohms source impedance: Class 2,3: MPLAD18KP7.0A to 200CA Class 4: MPLAD18KP5.0 to 64CA • Pin injection protection per RTCA/DO-160F for Waveform 4 (6.4/69 μs at 25 ºC)*: Level 4: MPLAD18KP7.0A to 200CA Level 5: MPLAD18KP7.0A to 130CA • Pin injection protection per RTCA/DO-160F for Waveform 5A (40/120 μs at 25 ºC)*: Level 4: MPLAD18KP7.0A to 36CA *See MicroNote 132 for further temperature derating selection. RF01215, Rev B (12/14/16) 1 MPLAD18KP7.0A – MPLAD18KP200CA MAXIMUM RATINGS @ 25°C unless otherwise specified Symbol Parameters / Test Conditions TJ and TSTG Value Junction and Storage Temperature -55 to +150 RθJA Thermal Resistance Junction-to-Ambient (1) 50 RθJC Thermal Resistance Junction-to-Case 0.7 PPP Peak Pulse Power @ 10/1000 μs (2) tclamping (0 volts to V(BR min) Undirectional Bidirectional VFS Forward Clamping Voltage @ 500 Amps (3) IFSM Forward Surge Current TSP PD Notes: 1. 2. 3. 4. 5. (3) Solder Temperature @ 10s Steady-State Power dissipation TA =25°C TC =100°C (5) Unit °C/W 18,000 W