PIC12F675-I/P

PIC12F629/675 Data Sheet 8-Pin, Flash-Based 8-Bit CMOS Microcontrollers  2010 Microchip Technology Inc. DS41190G Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-160-4 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41190G-page 2  2010 Microchip Technology Inc. PIC12F629/675 8-Pin Flash-Based 8-Bit CMOS Microcontroller High-Performance RISC CPU: Low-Power Features: • Only 35 Instructions to Learn - All single-cycle instructions except branches • Operating Speed: - DC – 20 MHz oscillator/clock input - DC – 200 ns instruction cycle • Interrupt Capability • 8-Level Deep Hardware Stack • Direct, Indirect, and Relative Addressing modes • Standby Current: - 1 nA @ 2.0V, typical • Operating Current: - 8.5 A @ 32 kHz, 2.0V, typical - 100 A @ 1 MHz, 2.0V, typical • Watchdog Timer Current - 300 nA @ 2.0V, typical • Timer1 Oscillator Current: - 4 A @ 32 kHz, 2.0V, typical Special Microcontroller Features: Peripheral Features: • Internal and External Oscillator Options - Precision Internal 4 MHz oscillator factory calibrated to ±1% - External Oscillator support for crystals and resonators - 5 s wake-up from Sleep, 3.0V, typical • Power-Saving Sleep mode • Wide Operating Voltage Range – 2.0V to 5.5V • Industrial and Extended Temperature Range • Low-Power Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Brown-out Detect (BOD) • Watchdog Timer (WDT) with Independent Oscillator for Reliable Operation • Multiplexed MCLR/Input Pin • Interrupt-on-Pin Change • Individual Programmable Weak Pull-ups • Programmable Code Protection • High Endurance Flash/EEPROM Cell - 100,000 write Flash endurance - 1,000,000 write EEPROM endurance - Flash/Data EEPROM Retention: > 40 years Device Program Memory • 6 I/O Pins with Individual Direction Control • High Current Sink/Source for Direct LED Drive • Analog Comparator module with: - One analog comparator - Programmable on-chip comparator voltage reference (CVREF) module - Programmable input multiplexing from device inputs - Comparator output is externally accessible • Analog-to-Digital Converter module (PIC12F675): - 10-bit resolution - Programmable 4-channel input - Voltage reference input • Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler • Enhanced Timer1: - 16-bit timer/counter with prescaler - External Gate Input mode - Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator, if INTOSC mode selected • In-Circuit Serial ProgrammingTM (ICSPTM) via two pins Data Memory I/O 10-bit A/D (ch) Comparators Timers 8/16-bit 128 6 — 1 1/1 128 6 4 1 1/1 Flash (words) SRAM (bytes) EEPROM (bytes) PIC12F629 1024 64 PIC12F675 1024 64 * 8-bit, 8-pin devices protected by Microchip’s Low Pin Count Patent: U.S. Patent No. 5,847,450. Additional U.S. and foreign patents and applications may be issued or pending.  2010 Microchip Technology Inc. DS41190G-page 3 PIC12F629/675 Pin Diagrams DS41190G-page 4 1 GP5/T1CKI/OSC1/CLKIN 2 GP4/T1G/OSC2/CLKOUT 3 GP3/MCLR/VPP 4 VDD 1 GP5/T1CKI/OSC1/CLKIN 2 GP4/AN3/T1G/OSC2/CLKOUT 3 GP3/MCLR/VPP 4 PIC12F675 VDD PIC12F629 8-pin PDIP, SOIC, DFN-S, DFN 8 VSS 7 GP0/CIN+/ICSPDAT 6 GP1/CIN-/ICSPCLK 5 GP2/T0CKI/INT/COUT 8 VSS 7 GP0/AN0/CIN+/ICSPDAT 6 GP1/AN1/CIN-/VREF/ICSPCLK 5 GP2/AN2/T0CKI/INT/COUT  2010 Microchip Technology Inc. PIC12F629/675 Table of Contents 1.0 Device Overview ......................................................................................................................................................................... 7 2.0 Memory Organization.................................................................................................................................................................. 9 3.0 GPIO Port ................................................................................................................................................................................. 21 4.0 Timer0 Module .......................................................................................................................................................................... 29 5.0 Timer1 Module with Gate Control ............................................................................................................................................. 32 6.0 Comparator Module .................................................................................................................................................................. 37 7.0 Analog-to-Digital Converter (A/D) Module (PIC12F675 only) ................................................................................................... 43 8.0 Data EEPROM Memory ............................................................................................................................................................ 49 9.0 Special Features of the CPU .................................................................................................................................................... 53 10.0 Instruction Set Summary ........................................................................................................................................................... 71 11.0 Development Support ............................................................................................................................................................... 81 12.0 Electrical Specifications ............................................................................................................................................................ 85 13.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 107 14.0 Packaging Information ............................................................................................................................................................ 117 Appendix A: Data Sheet Revision History ......................................................................................................................................... 127 Appendix B: Device Differences ....................................................................................................................................................... 127 Appendix C: Device Migrations ......................................................................................................................................................... 128 Appendix D: Migrating from other PIC® Devices .............................................................................................................................. 128 Index ................................................................................................................................................................................................. 129 On-Line Support ................................................................................................................................................................................ 133 Systems Information and Upgrade Hot Line ..................................................................................................................................... 133 Reader Response ............................................................................................................................................................................. 134 Product Identification System ........................................................................................................................................................... 135 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products.  2010 Microchip Technology Inc. DS41190G-page 5 PIC12F629/675 NOTES: DS41190G-page 6  2010 Microchip Technology Inc. PIC12F629/675 1.0 DEVICE OVERVIEW Sheet, and is highly recommended reading for a better understanding of the device architecture and operation of the peripheral modules. This document contains device specific information for the PIC12F629/675. Additional information may be found in the PIC® Mid-Range Reference Manual (DS33023), which may be obtained from your local Microchip Sales Representative or downloaded from the Microchip web site. The Reference Manual should be considered a complementary document to this Data FIGURE 1-1: The PIC12F629 and PIC12F675 devices are covered by this Data Sheet. They are identical, except the PIC12F675 has a 10-bit A/D converter. They come in 8-pin PDIP, SOIC, MLF-S and DFN packages. Figure 1-1 shows a block diagram of the PIC12F629/ 675 devices. Table 1-1 shows the pinout description. PIC12F629/675 BLOCK DIAGRAM 13 Flash Program Memory 8 RAM File Registers 64 x 8 8-Level Stack (13-bit) 1K x 14 Program Bus Data Bus Program Counter 14 RAM Addr(1) 9 GP0/AN0/CIN+ GP1/AN1/CIN-/VREF GP2/AN2/T0CKI/INT/COUT GP3/MCLR/VPP GP4/AN3/T1G/OSC2/CLKOUT GP5/T1CKI/OSC1/CLKIN Addr MUX Instruction Reg 7 Direct Addr 8 Indirect Addr FSR Reg Internal 4 MHz Oscillator 3 Instruction Decode & Control Timing Generation OSC1/CLKIN OSC2/CLKOUT STATUS Reg 8 MUX Power-up Timer ALU Oscillator Start-up Timer 8 Power-on Reset Watchdog Timer Brown-out Detect VDD, VSS T1G W Reg T1CKI Timer0 Timer1 T0CKI Analog to Digital Converter (PIC12F675 only) Analog Comparator and reference EEDATA 8 128 bytes DATA EEPROM EEADDR CIN- CIN+ COUT VREF AN0 AN1 AN2 AN3 Note 1: Higher order bits are from STATUS register.  2010 Microchip Technology Inc. DS41190G-page 7 PIC12F629/675 TABLE 1-1: PIC12F629/675 PINOUT DESCRIPTION Name GP0/AN0/CIN+/ICSPDAT GP1/AN1/CIN-/VREF/ ICSPCLK GP2/AN2/T0CKI/INT/COUT GP3/MCLR/VPP GP4/AN3/T1G/OSC2/ CLKOUT GP5/T1CKI/OSC1/CLKIN VSS VDD Legend: Function Input Type Output Type GP0 TTL CMOS AN0 CIN+ ICSPDAT GP1 AN AN TTL TTL CMOS CMOS AN1 CINVREF ICSPCLK GP2 AN AN AN ST ST CMOS AN2 T0CKI INT COUT AN ST ST GP3 TTL Input port w/ interrupt-on-change MCLR VPP ST HV Master Clear Programming voltage GP4 TTL AN3 AN T1G OSC2 CLKOUT ST GP5 TTL CMOS CMOS XTAL CMOS CMOS Description Bidirectional I/O w/ programmable pull-up and interrupt-on-change A/D Channel 0 input Comparator input Serial programming I/O Bidirectional I/O w/ programmable pull-up and interrupt-on-change A/D Channel 1 input Comparator input External voltage reference Serial programming clock Bidirectional I/O w/ programmable pull-up and interrupt-on-change A/D Channel 2 input TMR0 clock input External interrupt Comparator output Bidirectional I/O w/ programmable pull-up and interrupt-on-change A/D Channel 3 input TMR1 gate Crystal/resonator FOSC/4 output Bidirectional I/O w/ programmable pull-up and interrupt-on-change TMR1 clock Crystal/resonator External clock input/RC oscillator connection Ground reference Positive supply T1CKI ST OSC1 XTAL CLKIN ST VSS Power VDD Power Shade = PIC12F675 only TTL = TTL input buffer, ST = Schmitt Trigger input buffer DS41190G-page 8  2010 Microchip Technology Inc. PIC12F629/675 2.0 MEMORY ORGANIZATION 2.2 2.1 Program Memory Organization The data memory (see Figure 2-2) is partitioned into two banks, which contain the General Purpose Registers and the Special Function Registers. The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-5Fh are General Purpose Registers, implemented as static RAM and are mapped across both banks. All other RAM is unimplemented and returns ‘0’ when read. RP0 (STATUS) is the bank select bit. The PIC12F629/675 devices have a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 1K x 14 (0000h-03FFh) for the PIC12F629/675 devices is physically implemented. Accessing a location above these boundaries will cause a wrap-around within the first 1K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 2-1). FIGURE 2-1: PROGRAM MEMORY MAP AND STACK FOR THE DSTEMP/675 PC CALL, RETURN RETFIE, RETLW • RP0 = 0 Bank 0 is selected • RP0 = 1 Bank 1 is selected Note: 2.2.1 13 Data Memory Organization The IRP and RP1 bits STATUS are reserved and should always be maintained as ‘0’s. GENERAL PURPOSE REGISTER FILE The register file is organized as 64 x 8 in the PIC12F629/675 devices. Each register is accessed, either directly or indirectly, through the File Select Register FSR (see Section 2.4 “Indirect Addressing, INDF and FSR Registers”). Stack Level 1 Stack Level 2 Stack Level 8 Reset Vector 000h Interrupt Vector 0004 0005 On-chip Program Memory 03FFh 0400h 1FFFh  2010 Microchip Technology Inc. DS41190G-page 9 PIC12F629/675 2.2.2 SPECIAL FUNCTION REGISTERS FIGURE 2-2: The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 2-1). These registers are static RAM. DATA MEMORY MAP OF THE PIC12F629/675 File Address Indirect addr.(1) TMR0 PCL STATUS FSR GPIO The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the “core” are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. PCLATH INTCON PIR1 TMR1L TMR1H T1CON CMCON ADRESH(2) ADCON0(2) 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h General Purpose Registers File Address Indirect addr.(1) OPTION_REG PCL STATUS FSR TRISIO PCLATH INTCON PIE1 PCON OSCCAL WPU IOC VRCON EEDATA EEADR EECON1 EECON2(1) ADRESL(2) ANSEL(2) 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h accesses 20h-5Fh 64 Bytes 5Fh 60h DFh E0h 7Fh Bank 0 1: 2: DS41190G-page 10 FFh Bank 1 Unimplemented data memory locations, read as ‘0’. Not a physical register. PIC12F675 only.  2010 Microchip Technology Inc. PIC12F629/675 TABLE 2-1: Address SPECIAL FUNCTION REGISTERS SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Page Bank 0 00h INDF(1) Addressing this Location uses Contents of FSR to Address Data Memory 0000 0000 20,61 01h TMR0 Timer0 Module’s Register xxxx xxxx 29 02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 19 03h STATUS 14 04h FSR 05h GPIO IRP(2) RP1(2) RP0 TO PD Z DC C 0001 1xxx xxxx xxxx 20 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 --xx xxxx 21 Indirect Data Memory Address Pointer — — GPIO5 06h — Unimplemented — — 07h — Unimplemented — — 08h — Unimplemented — — 09h — Unimplemented — — ---0 0000 19 0Ah PCLATH — — — Write Buffer for Upper 5 bits of Program Counter 0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 15 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 17 0Dh — — 0Eh TMR1L — Unimplemented Holding Register for the Least Significant Byte of the 16-bit Timer1 xxxx xxxx 32 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit Timer1 xxxx xxxx 32 10h T1CON -000 0000 35 11h — Unimplemented — — 12h — Unimplemented — — 13h — Unimplemented — — 14h — Unimplemented — — 15h — Unimplemented — — 16h — Unimplemented — — 17h — Unimplemented — — 18h — Unimplemented — — -0-0 0000 38 19h CMCON — — TMR1GE COUT T1CKPS1 — T1CKPS0 CINV T1OSCEN CIS T1SYNC CM2 TMR1CS CM1 TMR1ON CM0 1Ah — Unimplemented — — 1Bh — Unimplemented — — 1Ch — Unimplemented — — 1Dh — Unimplemented — — xxxx xxxx 44 00-- 0000 45,61 1Eh ADRESH(3) 1Fh ADCON0(3) Most Significant 8 bits of the Left Shifted A/D Result or 2 bits of the Right Shifted Result ADFM VCFG — — CHS1 CHS0 GO/DONE ADON — = unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: This is not a physical register. 2: These bits are reserved and should always be maintained as ‘0’. 3: PIC12F675 only. Legend:  2010 Microchip Technology Inc. DS41190G-page 11 PIC12F629/675 TABLE 2-1: Address SPECIAL FUNCTION REGISTERS SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Page Bank 1 80h INDF(1) 81h OPTION_REG 82h PCL 83h STATUS 84h FSR 85h TRISIO Addressing this Location uses Contents of FSR to Address Data Memory GPPU INTEDG T0CS 0000 0000 20,61 PSA PS2 PS1 PS0 1111 1111 14,31 0000 0000 19 TO PD Z DC C 0001 1xxx 14 xxxx xxxx 20 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 21 T0SE Program Counter’s (PC) Least Significant Byte IRP (2) RP0 (2) RP1 Indirect Data Memory Address Pointer — — TRISIO5 86h — Unimplemented — — 87h — Unimplemented — — 88h — Unimplemented — — 89h — Unimplemented — — ---0 0000 19 8Ah PCLATH — — — Write Buffer for Upper 5 bits of Program Counter 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 15 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 16 — — — — — — — POR BOD ---- --0x 18 — — CAL4 CAL3 CAL2 CAL1 CAL0 — — 1000 00-- 18 8Dh 8Eh — PCON Unimplemented — 8Fh — 90h OSCCAL 91h — Unimplemented — — 92h — Unimplemented — — 93h — Unimplemented — — 94h — Unimplemented — — 95h WPU 96h IOC Unimplemented CAL5 — — WPU5 WPU4 — WPU2 WPU1 WPU0 --11 -111 21 — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 23 97h — Unimplemented — — 98h — Unimplemented — — 0-0- 0000 42 99h VRCON 9Ah EEDATA 9Bh EEADR VREN — VRR — VR3 VR2 VR1 VR0 Data EEPROM Data Register — Data EEPROM Address Register 0000 0000 49 -000 0000 49 9Ch EECON1 ---- x000 50 9Dh EECON2(1) EEPROM Control Register 2 ---- ---- 50 9Eh ADRESL(3) Least Significant 2 bits of the Left Shifted A/D Result of 8 bits or the Right Shifted Result xxxx xxxx 44 9Fh ANSEL(3) -000 1111 46,61 — — — ADCS2 — ADCS1 — ADCS0 WRERR ANS3 WREN ANS2 WR ANS1 RD ANS0 — = unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: This is not a physical register. 2: These bits are reserved and should always be maintained as ‘0’. 3: PIC12F675 only. Legend: DS41190G-page 12  2010 Microchip Technology Inc. PIC12F629/675 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains: • the arithmetic status of the ALU • the Reset status • the bank select bits for data memory (SRAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. REGISTER 2-1: For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see the “Instruction Set Summary”. Note 1: Bits IRP and RP1 (STATUS) are not used by the PIC12F629/675 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. STATUS: STATUS REGISTER (ADDRESS: 03h OR 83h) Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 IRP: This bit is reserved and should be maintained as ‘0’ bit 6 RP1: This bit is reserved and should be maintained as ‘0’ bit 5 RP0: Register Bank Select bit (used for direct addressing) 0 = Bank 0 (00h - 7Fh) 1 = Bank 1 (80h - FFh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT Time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) For borrow, the polarity is reversed. 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0 C: Carry/borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: x = Bit is unknown For borrow the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register.  2010 Microchip Technology Inc. DS41190G-page 13 PIC12F629/675 2.2.2.2 OPTION Register Note: The OPTION register is a readable and writable register, which contains various control bits to configure: • • • • TMR0/WDT prescaler External GP2/INT interrupt TMR0 Weak pull-ups on GPIO REGISTER 2-2: To achieve a 1:1 prescaler assignment for TMR0, assign the prescaler to the WDT by setting PSA bit to ‘1’ (OPTION). See Section 4.4 “Prescaler”. OPTION_REG: OPTION REGISTER (ADDRESS: 81h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual PORT latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of GP2/INT pin 0 = Interrupt on falling edge of GP2/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on GP2/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on GP2/T0CKI pin 0 = Increment on low-to-high transition on GP2/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the TIMER0 module bit 2-0 PS2:PS0: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 DS41190G-page 14 x = Bit is unknown TMR0 Rate WDT Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128  2010 Microchip Technology Inc. PIC12F629/675 2.2.2.3 INTCON Register Note: The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, GPIO port change and external GP2/INT pin interrupts. REGISTER 2-3: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON: INTERRUPT CONTROL REGISTER (ADDRESS: 0Bh OR 8Bh) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: GP2/INT External Interrupt Enable bit 1 = Enables the GP2/INT external interrupt 0 = Disables the GP2/INT external interrupt bit 3 GPIE: Port Change Interrupt Enable bit(1) 1 = Enables the GPIO port change interrupt 0 = Disables the GPIO port change interrupt bit 2 T0IF: TMR0 Overflow Interrupt Flag bit(2) 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: GP2/INT External Interrupt Flag bit 1 = The GP2/INT external interrupt occurred (must be cleared in software) 0 = The GP2/INT external interrupt did not occur bit 0 GPIF: Port Change Interrupt Flag bit 1 = When at least one of the GP5:GP0 pins changed state (must be cleared in software) 0 = None of the GP5:GP0 pins have changed state Note 1: 2: IOC register must also be enabled to enable an interrupt-on-change. T0IF bit is set when TIMER0 rolls over. TIMER0 is unchanged on Reset and should be initialized before clearing T0IF bit.  2010 Microchip Technology Inc. DS41190G-page 15 PIC12F629/675 2.2.2.4 PIE1 Register The PIE1 register contains the interrupt enable bits, as shown in Register 2-4. REGISTER 2-4: Note: Bit PEIE (INTCON) must be set to enable any peripheral interrupt. PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 (ADDRESS: 8Ch) R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIE ADIE — — CMIE — — TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 EEIE: EE Write Complete Interrupt Enable bit 1 = Enables the EE write complete interrupt 0 = Disables the EE write complete interrupt bit 6 ADIE: A/D Converter Interrupt Enable bit (PIC12F675 only) 1 = Enables the A/D converter interrupt 0 = Disables the A/D converter interrupt bit 5-4 Unimplemented: Read as ‘0’ bit 3 CMIE: Comparator Interrupt Enable bit 1 = Enables the comparator interrupt 0 = Disables the comparator interrupt bit 2-1 Unimplemented: Read as ‘0’ bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt DS41190G-page 16 x = Bit is unknown  2010 Microchip Technology Inc. PIC12F629/675 2.2.2.5 PIR1 Register The PIR1 register contains the interrupt flag bits, as shown in Register 2-5. REGISTER 2-5: Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1: PERIPHERAL INTERRUPT REGISTER 1 (ADDRESS: 0Ch) R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 U-0 R/W-0 EEIF ADIF — — CMIF — — TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 EEIF: EEPROM Write Operation Interrupt Flag bit 1 = The write operation completed (must be cleared in software) 0 = The write operation has not completed or has not been started bit 6 ADIF: A/D Converter Interrupt Flag bit (PIC12F675 only) 1 = The A/D conversion is complete (must be cleared in software) 0 = The A/D conversion is not complete bit 5-4 Unimplemented: Read as ‘0’ bit 3 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 2-1 Unimplemented: Read as ‘0’ bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow  2010 Microchip Technology Inc. x = Bit is unknown DS41190G-page 17 PIC12F629/675 2.2.2.6 PCON Register The Power Control (PCON) register contains flag bits to differentiate between a: • • • • Power-on Reset (POR) Brown-out Detect (BOD) Watchdog Timer Reset (WDT) External MCLR Reset The PCON Register bits are shown in Register 2-6. REGISTER 2-6: PCON: POWER CONTROL REGISTER (ADDRESS: 8Eh) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-x — — — — — — POR BOD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOD: Brown-out Detect Status bit 1 = No Brown-out Detect occurred 0 = A Brown-out Detect occurred (must be set in software after a Brown-out Detect occurs) 2.2.2.7 OSCCAL Register The Oscillator Calibration register (OSCCAL) is used to calibrate the internal 4 MHz oscillator. It contains 6 bits to adjust the frequency up or down to achieve 4 MHz. The OSCCAL register bits are shown in Register 2-7. REGISTER 2-7: OSCCAL: OSCILLATOR CALIBRATION REGISTER (ADDRESS: 90h) R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 CAL5 CAL4 CAL3 CAL2 CAL1 CAL0 — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 CAL5:CAL0: 6-bit Signed Oscillator Calibration bits 111111 = Maximum frequency 100000 = Center frequency 000000 = Minimum frequency bit 1-0 Unimplemented: Read as ‘0’ DS41190G-page 18 x = Bit is unknown  2010 Microchip Technology Inc. PIC12F629/675 2.3 PCL and PCLATH 2.3.2 The Program Counter (PC) is 13-bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 2-3 shows the two situations for the loading of the PC. The upper example in Figure 2-3 shows how the PC is loaded on a write to PCL (PCLATH  PCH). The lower example in Figure 2-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH  PCH). FIGURE 2-3: LOADING OF PC IN DIFFERENT SITUATIONS PCH PCL 12 8 7 0 PC 8 PCLATH 5 Instruction with PCL as Destination ALU result PCLATH PCH 12 11 10 STACK The PIC12F629/675 family has an 8-level deep x 13-bit wide hardware stack (see Figure 2-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed, or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no Status bits to indicate Stack Overflow or Stack Underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions, or the vectoring to an interrupt address. PCL 8 0 7 PC GOTO, CALL 2 PCLATH 11 Opcode PCLATH 2.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the PC (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the Application Note, “Implementing a Table Read” (AN556).  2010 Microchip Technology Inc. DS41190G-page 19 PIC12F629/675 2.4 Indirect Addressing, INDF and FSR Registers A simple program to clear RAM location 20h-2Fh using indirect addressing is shown in Example 2-1. The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. EXAMPLE 2-1: Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS), as shown in Figure 2-2. FIGURE 2-2: MOVLW MOVWF CLRF INCF BTFSS GOTO NEXT 0x20 FSR INDF FSR FSR,4 NEXT CONTINUE ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue DIRECT/INDIRECT ADDRESSING PIC12F629/675 Direct Addressing RP1(1) RP0 INDIRECT ADDRESSING 6 From Opcode Indirect Addressing IRP(1) 0 7 Bank Select Bank Select Location Select 00 01 10 FSR Register 0 Location Select 11 00h 180h Data Memory Not Used 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail see Figure 2-2. Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear. DS41190G-page 20  2010 Microchip Technology Inc. PIC12F629/675 3.0 GPIO PORT There are as many as six general purpose I/O pins available. Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled, the associated pin may not be used as a general purpose I/O pin. Note: 3.1 Additional information on I/O ports may be found in the PIC® Mid-Range Reference Manual, (DS33023). GPIO and the TRISIO Registers GPIO is an 6-bit wide, bidirectional port. The corresponding data direction register is TRISIO. Setting a TRISIO bit (= 1) will make the corresponding GPIO pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISIO bit (= 0) will make the corresponding GPIO pin an output (i.e., put the contents of the output latch on the selected pin). The exception is GP3, which is input-only and its TRISIO bit will always read as ‘1’. Example 3-1 shows how to initialize GPIO. Reading the GPIO register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified, and then written to the PORT data latch. GP3 reads ‘0’ when MCLREN = 1. The TRISIO register controls the direction of the GP pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISIO REGISTER 3-1: register are maintained set when using them as analog inputs. I/O pins configured as analog inputs always read ‘0’. Note: The ANSEL (9Fh) and CMCON (19h) registers (9Fh) must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. The ANSEL register is defined for the PIC12F675. EXAMPLE 3-1: BCF CLRF MOVLW MOVWF BSF CLRF MOVLW MOVWF 3.2 STATUS,RP0 GPIO 07h CMCON STATUS,RP0 ANSEL 0Ch TRISIO INITIALIZING GPIO ;Bank 0 ;Init GPIO ;Set GP to ;digital IO ;Bank 1 ;Digital I/O ;Set GP as inputs ;and set GP ;as outputs Additional Pin Functions Every GPIO pin on the PIC12F629/675 has an interrupt-on-change option and every GPIO pin, except GP3, has a weak pull-up option. The next two sections describe these functions. 3.2.1 WEAK PULL-UP Each of the GPIO pins, except GP3, has an individually configurable weak internal pull-up. Control bits WPUx enable or disable each pull-up. Refer to Register 3-3. Each weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset by the GPPU bit (OPTION). GPIO: GPIO REGISTER (ADDRESS: 05h) U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 GPIO: General Purpose I/O pin 1 = Port pin is >VIH 0 = Port pin is VIN0 = VIN+ < VINWhen CINV = 1: 1 = VIN+ < VIN0 = VIN+ > VIN- bit 5 Unimplemented: Read as ‘0’ bit 4 CINV: Comparator Output Inversion bit 1 = Output inverted 0 = Output not inverted bit 3 CIS: Comparator Input Switch bit When CM2:CM0 = 110 or 101: 1 = VIN- connects to CIN+ 0 = VIN- connects to CIN- bit 2-0 CM2:CM0: Comparator Mode bits Figure 6-2 shows the Comparator modes and CM2:CM0 bit settings  2010 Microchip Technology Inc. x = Bit is unknown DS41190G-page 37 PIC12F629/675 6.1 Comparator Operation A single comparator is shown in Figure 6-1, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 6-1 represent the uncertainty due to input offsets and response time. Note: To use CIN+ and CIN- pins as analog inputs, the appropriate bits must be programmed in the CMCON (19h) register. The polarity of the comparator output can be inverted by setting the CINV bit (CMCON). Clearing CINV results in a non-inverted output. A complete table showing the output state versus input conditions and the polarity bit is shown in Table 6-1. TABLE 6-1: OUTPUT STATE VS. INPUT CONDITIONS Input Conditions CINV COUT VIN- > VIN+ 0 0 VIN- < VIN+ 0 1 VIN- > VIN+ 1 1 VIN- < VIN+ 1 0 FIGURE 6-1: SINGLE COMPARATOR VIN+ + VIN- – Output VINVIN+ Output Note: DS41190G-page 38 CINV bit (CMCON) is clear.  2010 Microchip Technology Inc. PIC12F629/675 6.2 Comparator Configuration There are eight modes of operation for the comparator. The CMCON register, shown in Register 6-1, is used to select the mode. Figure 6-2 shows the eight possible modes. The TRISIO register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for a specified period of time. Refer to the specifications in Section 12.0 “Electrical Specifications”. Note: Comparator interrupts should be disabled during a Comparator mode change. Otherwise, a false interrupt may occur. FIGURE 6-2: COMPARATOR I/O OPERATING MODES Comparator Reset (POR Default Value - low power) Comparator Off (Lowest power) CM2:CM0 = 000 CM2:CM0 = 111 GP1/CIN- A GP0/CIN+ A GP2/COUT D Off (Read as ‘0’) GP1/CIN- D GP0/CIN+ D GP2/COUT D Off (Read as ‘0’) Comparator without Output Comparator w/o Output and with Internal Reference CM2:CM0 = 010 CM2:CM0 = 100 GP1/CIN- A GP0/CIN+ A GP2/COUT D COUT GP1/CIN- A GP0/CIN+ D GP2/COUT D COUT From CVREF Module Comparator with Output and Internal Reference Multiplexed Input with Internal Reference and Output CM2:CM0 = 011 CM2:CM0 = 101 GP1/CIN- A GP0/CIN+ D GP2/COUT D COUT From CVREF Module GP1/CIN- A GP0/CIN+ A GP2/COUT D CIS = 0 CIS = 1 COUT From CVREF Module Comparator with Output Multiplexed Input with Internal Reference CM2:CM0 = 001 CM2:CM0 = 110 GP1/CIN- A GP0/CIN+ A GP2/COUT D COUT GP1/CIN- A GP0/CIN+ A GP2/COUT D CIS = 0 CIS = 1 COUT From CVREF Module A = Analog Input, ports always reads ‘0’ D = Digital Input CIS = Comparator Input Switch (CMCON)  2010 Microchip Technology Inc. DS41190G-page 39 PIC12F629/675 6.3 Analog Input Connection Considerations range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. A simplified circuit for an analog input is shown in Figure 6-3. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this FIGURE 6-3: ANALOG INPUT MODE VDD VT = 0.6V Rs < 10K AIN CPIN 5 pF VA VT = 0.6V RIC Leakage ±500 nA Vss Legend: 6.4 CPIN VT ILEAKAGE RIC RS VA = Input Capacitance = Threshold Voltage = Leakage Current at the pin due to Various Junctions = Interconnect Resistance = Source Impedance = Analog Voltage Comparator Output The TRISIO bit functions as an output enable/ disable for the GP2 pin while the comparator is in an Output mode. The comparator output, COUT, is read through the CMCON register. This bit is read-only. The comparator output may also be directly output to the GP2 pin in three of the eight possible modes, as shown in Figure 6-2. When in one of these modes, the output on GP2 is asynchronous to the internal clock. Figure 6-4 shows the comparator output block diagram. Note 1: When reading the GPIO register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert an analog input according to the TTL input specification. 2: Analog levels on any pin that is defined as a digital input, may cause the input buffer to consume more current than is specified. FIGURE 6-4: MODIFIED COMPARATOR OUTPUT BLOCK DIAGRAM GP0/CIN+ GP1/CIN- To GP2/T0CKI pin To Data Bus Q RD CMCON Set CMIF bit CVREF D EN Q CINV CM2:CM0 D RD CMCON EN Reset DS41190G-page 40  2010 Microchip Technology Inc. PIC12F629/675 6.5 Comparator Reference The following equations determine the output voltages: The comparator module also allows the selection of an internally generated voltage reference for one of the comparator inputs. The internal reference signal is used for four of the eight Comparator modes. The VRCON register, Register 6-2, controls the voltage reference module shown in Figure 6-5. 6.5.1 CONFIGURING THE VOLTAGE REFERENCE The voltage reference can output 32 distinct voltage levels, 16 in a high range and 16 in a low range. FIGURE 6-5: VRR = 1 (low range): CVREF = (VR3:VR0 / 24) x VDD VRR = 0 (high range): CVREF = (VDD / 4) + (VR3:VR0 x VDD / 32) 6.5.2 VOLTAGE REFERENCE ACCURACY/ERROR The full range of VSS to VDD cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 6-5) keep CVREF from approaching VSS or VDD. The Voltage Reference is VDD derived and therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 12.0 “Electrical Specifications”. COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM 16 Stages 8R R R R R VDD 8R VRR 16-1 Analog MUX VREN CVREF to Comparator Input VR3:VR0 6.6 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output is ensured to have a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (Table 12-7). 6.7 Operation During Sleep Both the comparator and voltage reference, if enabled before entering Sleep mode, remain active during Sleep. This results in higher Sleep currents than shown in the power-down specifications. The additional current consumed by the comparator and the voltage reference is shown separately in the specifications. To minimize power consumption while in Sleep mode, turn off the comparator, CM2:CM0 = 111, and voltage reference, VRCON = 0.  2010 Microchip Technology Inc. While the comparator is enabled during Sleep, an interrupt will wake-up the device. If the device wakes up from Sleep, the contents of the CMCON and VRCON registers are not affected. 6.8 Effects of a Reset A device Reset forces the CMCON and VRCON registers to their Reset states. This forces the comparator module to be in the Comparator Reset mode, CM2:CM0 = 000 and the voltage reference to its off state. Thus, all potential inputs are analog inputs with the comparator and voltage reference disabled to consume the smallest current possible. DS41190G-page 41 PIC12F629/675 REGISTER 6-2: VRCON: VOLTAGE REFERENCE CONTROL REGISTER (ADDRESS: 99h) R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN — VRR — VR3 VR2 VR1 VR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 VREN: CVREF Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down, no IDD drain bit 6 Unimplemented: Read as ‘0’ bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as ‘0’ bit 3-0 VR3:VR0: CVREF value selection 0  VR [3:0]  15 When VRR = 1: CVREF = (VR3:VR0 / 24) * VDD When VRR = 0: CVREF = VDD/4 + (VR3:VR0 / 32) * VDD 6.9 Comparator Interrupts The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: The comparator interrupt flag is set whenever there is a change in the output value of the comparator. Software will need to maintain information about the status of the output bits, as read from CMCON, to determine the actual change that has occurred. The CMIF bit, PIR1, is the comparator interrupt flag. This bit must be reset in software by clearing it to ‘0’. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. a) b) Any read or write of CMCON. This will end the mismatch condition. Clear flag bit CMIF. A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition, and allow flag bit CMIF to be cleared. Note: The CMIE bit (PIE1) and the PEIE bit (INTCON) must be set to enable the interrupt. In addition, the GIE bit must also be set. If any of these bits are cleared, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. TABLE 6-2: Address x = Bit is unknown If a change in the CMCON register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR1) interrupt flag may not get set. REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets 0Bh/8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 19h CMCON — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 8Ch PIE1 EEIE ADIE — — CMIE — — TMR1IE 00-- 0--0 00-- 0--0 85h TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 99h VRCON VREN — 0-0- 0000 0-0- 0000 Legend: VRR — VR3 VR2 VR1 VR0 x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the comparator module. DS41190G-page 42  2010 Microchip Technology Inc. PIC12F629/675 7.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE (PIC12F675 ONLY) circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a binary result via successive approximation and stores the result in a 10-bit register. The voltage reference used in the conversion is software selectable to either VDD or a voltage applied by the VREF pin. Figure 7-1 shows the block diagram of the A/D on the PIC12F675. The Analog-to-Digital converter (A/D) allows conversion of an analog input signal to a 10-bit binary representation of that signal. The PIC12F675 has four analog inputs, multiplexed into one sample and hold FIGURE 7-1: A/D BLOCK DIAGRAM VDD VCFG = 0 VREF VCFG = 1 GP0/AN0 GP1/AN1/VREF ADC GP2/AN2 10 GO/DONE GP4/AN3 ADFM CHS1:CHS0 10 ADON ADRESH ADRESL VSS 7.1 A/D Configuration and Operation There are two registers available to control the functionality of the A/D module: 1. 2. ADCON0 (Register 7-1) ANSEL (Register 7-2) 7.1.1 ANALOG PORT PINS The ANS3:ANS0 bits (ANSEL) and the TRISIO bits control the operation of the A/D port pins. Set the corresponding TRISIO bits to set the pin output driver to its high-impedance state. Likewise, set the corresponding ANS bit to disable the digital input buffer. Note: 7.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are four analog channels on the PIC12F675, AN0 through AN3. The CHS1:CHS0 bits (ADCON0) control which channel is connected to the sample and hold circuit. 7.1.3 controls the voltage reference selection. If VCFG is set, then the voltage on the VREF pin is the reference; otherwise, VDD is the reference. 7.1.4 CONVERSION CLOCK The A/D conversion cycle requires 11 TAD. The source of the conversion clock is software selectable via the ADCS bits (ANSEL). There are seven possible clock options: • • • • • • • FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal RC oscillator) For correct conversion, the A/D conversion clock (1/TAD) must be selected to ensure a minimum TAD of 1.6 s. Table 7-1 shows a few TAD calculations for selected frequencies. VOLTAGE REFERENCE There are two options for the voltage reference to the A/D converter: either VDD is used, or an analog voltage applied to VREF is used. The VCFG bit (ADCON0)  2010 Microchip Technology Inc. DS41190G-page 43 PIC12F629/675 TABLE 7-1: TAD vs. DEVICE OPERATING FREQUENCIES A/D Clock Source (TAD) Device Frequency Operation ADCS2:ADCS0 20 MHz 5 MHz 4 MHz 1.25 MHz 2 TOSC 000 100 ns(2) 400 ns(2) 500 ns(2) 1.6 s 4 TOSC 100 200 ns(2) 800 ns(2) 1.0 s(2) 3.2 s 001 400 ns(2) 1.6 s 2.0 s 6.4 s 8 TOSC (2) 16 TOSC 101 800 ns 3.2 s 4.0 s 12.8 s(3) (3) 32 TOSC 010 1.6 s 6.4 s 8.0 s 25.6 s(3) (3) (3) 64 TOSC 110 3.2 s 12.8 s 16.0 s 51.2 s(3) A/D RC x11 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The A/D RC source has a typical TAD time of 4 s for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When the device frequency is greater than 1 MHz, the A/D RC clock source is only recommended if the conversion will be performed during Sleep. 7.1.5 STARTING A CONVERSION previous conversion. After an aborted conversion, a 2 TAD delay is required before another acquisition can be initiated. Following the delay, an input acquisition is automatically started on the selected channel. The A/D conversion is initiated by setting the GO/DONE bit (ADCON0). When the conversion is complete, the A/D module: Note: • Clears the GO/DONE bit • Sets the ADIF flag (PIR1) • Generates an interrupt (if enabled) 7.1.6 If the conversion must be aborted, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete A/D conversion sample. Instead, the ADRESH:ADRESL registers will retain the value of the FIGURE 7-2: The GO/DONE bit should not be set in the same instruction that turns on the A/D. CONVERSION OUTPUT The A/D conversion can be supplied in two formats: left or right shifted. The ADFM bit (ADCON0) controls the output format. Figure 7-2 shows the output formats. 10-BIT A/D RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB Bit 7 Bit 0 Bit 7 Unimplemented: Read as ‘0’ 10-bit A/D Result (ADFM = 1) MSB Bit 7 Unimplemented: Read as ‘0’ DS41190G-page 44 Bit 0 LSB Bit 0 Bit 7 Bit 0 10-bit A/D Result  2010 Microchip Technology Inc. PIC12F629/675 REGISTER 7-1: ADCON0: A/D CONTROL REGISTER (ADDRESS: 1Fh) R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM VCFG — — CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Result Formed Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5-4 Unimplemented: Read as ‘0’ bit 3-2 CHS1:CHS0: Analog Channel Select bits 00 = Channel 00 (AN0) 01 = Channel 01 (AN1) 10 = Channel 02 (AN2) 11 = Channel 03 (AN3) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: A/D Conversion Status bit 1 = A/D converter module is operating 0 = A/D converter is shut-off and consumes no operating current  2010 Microchip Technology Inc. DS41190G-page 45 PIC12F629/675 REGISTER 7-2: ANSEL: ANALOG SELECT REGISTER (ADDRESS: 9Fh) U-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-4 ADCS: A/D Conversion Clock Select bits 000 = Fosc/2 001 = Fosc/8 010 = Fosc/32 x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max) 100 = Fosc/4 101 = Fosc/16 110 = Fosc/64 bit 3-0 ANS3:ANS0: Analog Select bits (Between analog or digital function on pins AN, respectively.) 1 = Analog input; pin is assigned as analog input(1) 0 = Digital I/O; pin is assigned to port or special function Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change. The corresponding TRISIO bit must be set to Input mode in order to allow external control of the voltage on the pin. DS41190G-page 46  2010 Microchip Technology Inc. PIC12F629/675 7.2 A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 7-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 7-3. The maximum recommended impedance for analog sources is 10 k. As the impedance EQUATION 7-1: TACQ TC TACQ is decreased, the acquisition time may be decreased. After the analog input channel is selected (changed), this acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 7-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. To calculate the minimum acquisition time, TACQ, see the PIC® Mid-Range Reference Manual (DS33023). ACQUISITION TIME = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = = = = = = = TAMP + TC + TCOFF 2s + TC + [(Temperature -25°C)(0.05s/°C)] CHOLD (RIC + RSS + RS) In(1/2047) - 120pF (1k + 7k + 10k) In(0.0004885) 16.47s 2s + 16.47s + [(50°C -25C)(0.05s/C) 19.72s Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. FIGURE 7-3: ANALOG INPUT MODEL VDD RS ANx VA CPIN 5 pF VT = 0.6V VT = 0.6V Sampling Switch RIC  1K SS RSS CHOLD = DAC capacitance = 120 pF I LEAKAGE ± 500 nA VSS Legend: CPIN = input capacitance = threshold voltage VT I LEAKAGE = leakage current at the pin due to various junctions RIC = interconnect resistance SS = sampling switch CHOLD = sample/hold capacitance (from DAC)  2010 Microchip Technology Inc. 6V 5V VDD 4V 3V 2V 5 6 7 8 9 10 11 Sampling Switch (k) DS41190G-page 47 PIC12F629/675 7.3 A/D Operation During Sleep The A/D converter module can operate during Sleep. This requires the A/D clock source to be set to the internal RC oscillator. When the RC clock source is selected, the A/D waits one instruction before starting the conversion. This allows the SLEEP instruction to be executed, thus eliminating much of the switching noise from the conversion. When the conversion is complete, the GO/DONE bit is cleared, and the result is loaded into the ADRESH:ADRESL registers. If the A/D interrupt is enabled, the device awakens from Sleep. If the A/D interrupt is not enabled, the A/D module is turned off, although the ADON bit remains set. TABLE 7-2: Address 05h Name GPIO When the A/D clock source is something other than RC, a SLEEP instruction causes the present conversion to be aborted, and the A/D module is turned off. The ADON bit remains set. 7.4 Effects of Reset A device Reset forces all registers to their Reset state. Thus the A/D module is turned off and any pending conversion is aborted. The ADRESH:ADRESL registers are unchanged. SUMMARY OF A/D REGISTERS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOD Value on all other Resets --uu uuuu — — GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 --xx xxxx 0Bh, 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000u 0Ch PIR1 EEIF ADIF — — CMIF — — TMR1IF 00-- 0--0 00-- 0--0 1Eh ADRESH Most Significant 8 bits of the Left Shifted A/D result or 2 bits of the Right Shifted Result xxxx xxxx uuuu uuuu 1Fh ADCON0 00-- 0000 00-- 0000 85h TRISIO --11 1111 --11 1111 00-- 0--0 00-- 0--0 8Ch PIE1 9Eh ADRESL 9Fh ANSEL ADFM VCFG — — CHS1 — — TRISIO5 TRISIO4 TRISIO3 EEIE ADIE — — CMIE CHS0 GO ADON TRISIO2 TRISIO1 TRISIO0 — — TMR1IE Least Significant 2 bits of the Left Shifted A/D Result or 8 bits of the Right Shifted Result — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 xxxx xxxx uuuu uuuu -000 1111 -000 1111 Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for A/D converter module. DS41190G-page 48  2010 Microchip Technology Inc. PIC12F629/675 8.0 DATA EEPROM MEMORY The EEPROM data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers. There are four SFRs used to read and write this memory: The EEPROM data memory allows byte read and write. A byte write automatically erases the location and writes the new data (erase before write). The EEPROM data memory is rated for high erase/write cycles. The write time is controlled by an on-chip timer. The write time will vary with voltage and temperature as well as from chip to chip. Please refer to AC Specifications for exact limits. • • • • EECON1 EECON2 (not a physically implemented register) EEDATA EEADR When the data memory is code-protected, the CPU may continue to read and write the data EEPROM memory. The device programmer can no longer access this memory. EEDATA holds the 8-bit data for read/write, and EEADR holds the address of the EEPROM location being accessed. PIC12F629/675 devices have 128 bytes of data EEPROM with an address range from 0h to 7Fh. Additional information on the data EEPROM is available in the PIC® Mid-Range Reference Manual, (DS33023). REGISTER 8-1: EEDAT: EEPROM DATA REGISTER (ADDRESS: 9Ah) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown EEDATn: Byte value to write to or read from data EEPROM REGISTER 8-2: EEADR: EEPROM ADDRESS REGISTER (ADDRESS: 9Bh) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — EADR6 EADR5 EADR4 EADR3 EADR2 EADR1 EADR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Should be set to ‘0’ bit 6-0 EEADR: Specifies one of 128 locations for EEPROM Read/Write Operation  2010 Microchip Technology Inc. DS41190G-page 49 PIC12F629/675 8.1 EEADR The EEADR register can address up to a maximum of 128 bytes of data EEPROM. Only seven of the eight bits in the register (EEADR) are required. The MSb (bit 7) is ignored. The upper bit should always be ‘0’ to remain upward compatible with devices that have more data EEPROM memory. 8.2 EECON1 and EECON2 Registers EECON1 is the control register with four low-order bits physically implemented. The upper four bits are nonimplemented and read as ‘0’s. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion REGISTER 8-3: of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset, or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit, clear it, and rewrite the location. The data and address will be cleared, therefore, the EEDATA and EEADR registers will need to be re-initialized. Interrupt flag bit EEIF in the PIR1 register is set when write is complete. This bit must be cleared in software. EECON2 is not a physical register. Reading EECON2 will read all ‘0’s. The EECON2 register is used exclusively in the data EEPROM write sequence. EECON1: EEPROM CONTROL REGISTER (ADDRESS: 9Ch) U-0 U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0 — — — — WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as ‘0’ bit 3 WRERR: EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during normal operation or BOD detect) 0 = The write operation completed bit 2 WREN: EEPROM Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the data EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle (The bit is cleared by hardware once write is complete. The WR bit can only be set, not cleared, in software.) 0 = Write cycle to the data EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set, not cleared, in software). 0 = Does not initiate an EEPROM read DS41190G-page 50  2010 Microchip Technology Inc. PIC12F629/675 8.3 Reading the EEPROM Data Memory To read a data memory location, the user must write the address to the EEADR register and then set control bit RD (EECON1), as shown in Example 8-1. The data is available, in the very next cycle, in the EEDATA register. Therefore, it can be read in the next instruction. EEDATA holds this value until another read, or until it is written to by the user (during a write operation). EXAMPLE 8-1: BSF MOVLW MOVWF BSF MOVF 8.4 DATA EEPROM READ STATUS,RP0 CONFIG_ADDR EEADR EECON1,RD EEDATA,W ;Bank 1 ; ;Address to read ;EE Read ;Move data to W After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. The EEIF bit (PIR) register must be cleared by software. 8.5 Depending on the application, good programming practice may dictate that the value written to the data EEPROM should be verified (see Example 8-3) to the desired value to be written. EXAMPLE 8-3: Writing to the EEPROM Data Memory To write an EEPROM data location, the user must first write the address to the EEADR register and the data to the EEDATA register. Then the user must follow a specific sequence to initiate the write for each byte, as shown in Example 8-2. Required Sequence EXAMPLE 8-2: BSF BSF BCF MOVLW MOVWF MOVLW MOVWF BSF BSF DATA EEPROM WRITE STATUS,RP0 EECON1,WREN INTCON,GIE 55h EECON2 AAh EECON2 EECON1,WR INTCON,GIE ;Bank 1 ;Enable write ;Disable INTs ;Unlock write ; ; ; ;Start the write ;Enable INTS The write will not initiate if the above sequence is not exactly followed (write 55h to EECON2, write AAh to EECON2, then set WR bit) for each byte. We strongly recommend that interrupts be disabled during this code segment. A cycle count is executed during the required sequence. Any number that is not equal to the required cycles to execute the required sequence will prevent the data from being written into the EEPROM. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware.  2010 Microchip Technology Inc. Write Verify WRITE VERIFY BCF : BSF MOVF STATUS,RP0 BSF EECON1,RD STATUS,RP0 EEDATA,W XORWF EEDATA,W BTFSS STATUS,Z GOTO WRITE_ERR : 8.5.1 ;Bank 0 ;Any code ;Bank 1 READ ;EEDATA not changed ;from previous write ;YES, Read the ;value written ;Is data the same ;No, handle error ;Yes, continue USING THE DATA EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specifications D120 or D120A. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. 8.6 Protection Against Spurious Write There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (72 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: • brown-out • power glitch • software malfunction DS41190G-page 51 PIC12F629/675 8.7 Data EEPROM Operation During Code Protect Data memory can be code protected by programming the CPD bit to ‘0’. When the data memory is code protected, the CPU is able to read and write data to the data EEPROM. It is recommended to code protect the program memory when code protecting data memory. This prevents anyone from programming zeroes over the existing code (which will execute as NOPs) to reach an added routine, programmed in unused program memory, which outputs the contents of data memory. Programming unused locations to ‘0’ will also help prevent data memory code protection from becoming breached. TABLE 8-1: Address 0Ch REGISTERS/BITS ASSOCIATED WITH DATA EEPROM Name PIR1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 EEIF ADIF — — CMIF — — 9Ah EEDATA 9Bh EEADR — 9Ch EECON1 — 9Dh EECON2(1) EEPROM Control Register 2 Bit 0 0000 0000 0000 0000 EEPROM Address Register — Value on all other Resets TMR1IF 00-- 0--0 00-- 0--0 EEPROM Data Register — Value on POR, BOD — -000 0000 -000 0000 WRERR WREN WR RD ---- x000 ---- q000 ---- ---- ---- ---- Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’, q = value depends upon condition. Shaded cells are not used by data EEPROM module. Note 1: EECON2 is not a physical register. DS41190G-page 52  2010 Microchip Technology Inc. PIC12F629/675 9.0 SPECIAL FEATURES OF THE CPU Certain special circuits that deal with the needs of real time applications are what sets a microcontroller apart from other processors. The PIC12F629/675 family has a host of such features intended to: • maximize system reliability • minimize cost through elimination of external components • provide power saving operating modes and offer code protection These features are: • Oscillator selection • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Detect (BOD) • Interrupts • Watchdog Timer (WDT) • Sleep • Code protection • ID Locations • In-Circuit Serial Programming  2010 Microchip Technology Inc. The PIC12F629/675 has a Watchdog Timer that is controlled by Configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only, designed to keep the part in Reset while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can provide at least a 72 ms Reset. With these three functions on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through: • External Reset • Watchdog Timer wake-up • An interrupt Several oscillator options are also made available to allow the part to fit the application. The INTOSC option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options (see Register 9.2). DS41190G-page 53 PIC12F629/675 9.1 Configuration Bits Note: The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’) to select various device configurations, as shown in Register 9.2. These bits are mapped in program memory location 2007h. REGISTER 9-1: Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h-3FFFh), which can be accessed only during programming. See PIC12F629/675 Programming Specification for more information. CONFIG: CONFIGURATION WORD (ADDRESS: 2007h) R/P-1 R/P-1 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 BG1 BG0 — — — CPD CP BODEN MCLRE PWRTE WDTE F0SC2 F0SC1 F0SC0 bit 13 bit 0 Legend: P = Programmed using ICSP™ R = Readable bit Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR 1 = bit is set 0 = bit is cleared bit 13-12 x = bit is unknown BG1:BG0: Bandgap Calibration bits for BOD and POR voltage(1) 00 = Lowest bandgap voltage 11 = Highest bandgap voltage bit 11-9 Unimplemented: Read as ‘0’ bit 8 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 7 CP: Code Protection bit(3) 1 = Program Memory code protection is disabled 0 = Program Memory code protection is enabled bit 6 BODEN: Brown-out Detect Enable bit(4) 1 = BOD enabled 0 = BOD disabled bit 5 MCLRE: GP3/MCLR Pin Function Select bit(5) 1 = GP3/MCLR pin function is MCLR 0 = GP3/MCLR pin function is digital I/O, MCLR internally tied to VDD bit 4 PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 2-0 FOSC2:FOSC0: Oscillator Selection bits 111 = RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 110 = RC oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 101 = INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 100 = INTOSC oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 011 = EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN 010 = HS oscillator: High speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN Note 1: 2: 3: 4: 5: The Bandgap Calibration bits are factory programmed and must be read and saved prior to erasing the device as specified in the PIC12F629/675 Programming Specification. These bits are reflected in an export of the Configuration Word. Microchip Development Tools maintain all Calibration bits to factory settings. The entire data EEPROM will be erased when the code protection is turned off. The entire program memory will be erased, including OSCCAL value, when the code protection is turned off. Enabling Brown-out Detect does not automatically enable Power-up Timer. When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled. DS41190G-page 54  2010 Microchip Technology Inc. PIC12F629/675 9.2 Oscillator Configurations 9.2.1 LP Low-Power Crystal XT Crystal/Resonator HS High-Speed Crystal/Resonator RC External Resistor/Capacitor (2 modes) INTOSC Internal Oscillator (2 modes) EC External Clock In Note: Additional information on oscillator configurations is available in the PIC® MidRange Reference Manual, (DS33023). 9.2.2 CRYSTAL OSCILLATOR / CERAMIC RESONATORS In XT, LP or HS modes a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation (see Figure 9-1). The PIC12F629/675 oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may yield a frequency outside of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1 pin (see Figure 9-2). FIGURE 9-1: CRYSTAL OPERATION (OR CERAMIC RESONATOR) HS, XT OR LP OSC CONFIGURATION OSC1 To Internal Logic C1(1) XTAL RF(3) Sleep Clock from External System C2(1) 1: 2: 3: RS(2) PIC12F629/675 See Table 9-1 and Table 9-2 for recommended values of C1 and C2. A series resistor may be required for AT strip cut crystals. RF varies with the Oscillator mode selected (Approx. value = 10 M  2010 Microchip Technology Inc. OSC1 PIC12F629/675 OSC2(1) Open Note 1: Functions as GP4 in EC Osc mode. TABLE 9-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Ranges Characterized: Mode Freq. OSC1(C1) OSC2(C2) XT 455 kHz 2.0 MHz 4.0 MHz 68-100 pF 15-68 pF 15-68 pF 68-100 pF 15-68 pF 15-68 pF HS 8.0 MHz 16.0 MHz 10-68 pF 10-22 pF 10-68 pF 10-22 pF Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. TABLE 9-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Mode Freq. OSC1(C1) OSC2(C2) LP 32 kHz 68-100 pF 68-100 pF XT 100 kHz 2 MHz 4 MHz 68-150 pF 15-30 pF 15-30 pF 150-200 pF 15-30 pF 15-30 pF HS 8 MHz 10 MHz 20 MHz 15-30 pF 15-30 pF 15-30 pF 15-30 pF 15-30 pF 15-30 pF OSC2 Note EXTERNAL CLOCK INPUT OPERATION (HS, XT, EC, OR LP OSC CONFIGURATION) OSCILLATOR TYPES The PIC12F629/675 can be operated in eight different oscillator option modes. The user can program three Configuration bits (FOSC2 through FOSC0) to select one of these eight modes: • • • • • • FIGURE 9-2: Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. DS41190G-page 55 PIC12F629/675 9.2.3 EXTERNAL CLOCK IN 9.2.5 For applications where a clock is already available elsewhere, users may directly drive the PIC12F629/ 675 provided that this external clock source meets the AC/DC timing requirements listed in Section 12.0 “Electrical Specifications”. Figure 9-2 shows how an external clock circuit should be configured. 9.2.4 RC OSCILLATOR For applications where precise timing is not a requirement, the RC oscillator option is available. The operation and functionality of the RC oscillator is dependent upon a number of variables. The RC oscillator frequency is a function of: • Supply voltage • Resistor (REXT) and capacitor (CEXT) values • Operating temperature. The oscillator frequency will vary from unit to unit due to normal process parameter variation. The difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to account for the tolerance of the external R and C components. Figure 9-3 shows how the R/C combination is connected. Two options are available for this Oscillator mode which allow GP4 to be used as a general purpose I/O or to output FOSC/4. FIGURE 9-3: RC OSCILLATOR MODE VDD REXT PIC12F629/675 GP5/OSC1/ CLKIN CEXT VSS FOSC/4 GP4/OSC2/CLKOUT DS41190G-page 56 Internal Clock INTERNAL 4 MHZ OSCILLATOR When calibrated, the internal oscillator provides a fixed 4 MHz (nominal) system clock. See Electrical Specifications, Section 12.0 “Electrical Specifications”, for information on variation over voltage and temperature. Two options are available for this Oscillator mode which allow GP4 to be used as a general purpose I/O or to output FOSC/4. 9.2.5.1 Calibrating the Internal Oscillator A calibration instruction is programmed into the last location of program memory. This instruction is a RETLW XX, where the literal is the calibration value. The literal is placed in the OSCCAL register to set the calibration of the internal oscillator. Example 9-1 demonstrates how to calibrate the internal oscillator. For best operation, decouple (with capacitance) VDD and VSS as close to the device as possible. Note: Erasing the device will also erase the preprogrammed internal calibration value for the internal oscillator. The calibration value must be saved prior to erasing part as specified in the PIC12F629/675 Programming specification. Microchip Development Tools maintain all Calibration bits to factory settings. EXAMPLE 9-1: BSF CALL MOVWF BCF 9.2.6 CALIBRATING THE INTERNAL OSCILLATOR STATUS, RP0 3FFh OSCCAL STATUS, RP0 ;Bank 1 ;Get the cal value ;Calibrate ;Bank 0 CLKOUT The PIC12F629/675 devices can be configured to provide a clock out signal in the INTOSC and RC oscillator modes. When configured, the oscillator frequency divided by four (FOSC/4) is output on the GP4/OSC2/CLKOUT pin. FOSC/4 can be used for test purposes or to synchronize other logic.  2010 Microchip Technology Inc. PIC12F629/675 9.3 Reset The PIC12F629/675 differentiates between various kinds of Reset: a) b) c) d) e) f) Power-on Reset (POR) WDT Reset during normal operation WDT Reset during Sleep MCLR Reset during normal operation MCLR Reset during Sleep Brown-out Detect (BOD) A simplified block diagram of the on-chip Reset Circuit is shown in Figure 9-4. Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on: • • • • • They are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations as indicated in Table 9-4. These bits are used in software to determine the nature of the Reset. See Table 9-7 for a full description of Reset states of all registers. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Table 12-4 in Electrical Specifications Section for pulse-width specification. Power-on Reset MCLR Reset WDT Reset WDT Reset during Sleep Brown-out Detect (BOD) Reset FIGURE 9-4: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/ VPP pin WDT WDT Module SLEEP Time-out Reset VDD Rise Detect Power-on Reset VDD Brown-out Detect BODEN S Q R Q OST/PWRT OST Chip_Reset 10-bit Ripple Counter OSC1/ CLKIN pin On-chip(1) RC OSC PWRT 10-bit Ripple Counter Enable PWRT See Table 9-3 for time-out situations. Enable OST Note 1: This is a separate oscillator from the INTOSC/EC oscillator.  2010 Microchip Technology Inc. DS41190G-page 57 PIC12F629/675 9.3.1 MCLR PIC12F629/675 devices have a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. The behavior of the ESD protection on the MCLR pin has been altered from previous devices of this family. Voltages applied to the pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 9-5, is suggested. An internal MCLR option is enabled by setting the MCLRE bit in the Configuration Word. When enabled, MCLR is internally tied to VDD. No internal pull-up option is available for the MCLR pin. FIGURE 9-5: RECOMMENDED MCLR CIRCUIT VDD PIC12F629/675 R1 1 kor greater MCLR C1 0.1 f (optional, not critical) 9.3.2 For additional information, refer to Application Note AN607, “Power-up Trouble Shooting”. 9.3.3 POWER-UP TIMER (PWRT) The Power-up Timer provides a fixed 72 ms (nominal) time-out on power-up only, from POR or Brown-out Detect. The Power-up Timer operates on an internal RC oscillator. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit, PWRTE can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should always be enabled when Brown-out Detect is enabled. The Power-up Time delay will vary from chip to chip and due to: • VDD variation • Temperature variation • Process variation. See DC parameters for details (Section 12.0 “Electrical Specifications”). 9.3.4 OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from Sleep. POWER-ON RESET (POR) The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply tie the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Electrical Specifications for details (see Section 12.0 “Electrical Specifications”). If the BOD is enabled, the maximum rise time specification does not apply. The BOD circuitry will keep the device in Reset until VDD reaches VBOD (see Section 9.3.5 “Brown-Out Detect (BOD)”). Note: The POR circuit does not produce an internal Reset when VDD declines. When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. DS41190G-page 58  2010 Microchip Technology Inc. PIC12F629/675 9.3.5 BROWN-OUT DETECT (BOD) On any Reset (Power-on, Brown-out, Watchdog, etc.), the chip will remain in Reset until VDD rises above BVDD (see Figure 9-6). The Power-up Timer will now be invoked, if enabled, and will keep the chip in Reset an additional 72 ms. The PIC12F629/675 members have on-chip Brown-out Detect circuitry. A Configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Detect circuitry. If VDD falls below VBOD for greater than parameter (TBOD) in Table 12-4 (see Section 12.0 “Electrical Specifications”), the Brown-out situation will reset the device. This will occur regardless of VDD slew-rate. A Reset is not guaranteed to occur if VDD falls below VBOD for less than parameter (TBOD). FIGURE 9-6: Note: A Brown-out Detect does not enable the Power-up Timer if the PWRTE bit in the Configuration Word is set. If VDD drops below BVDD while the Power-up Timer is running, the chip will go back into a Brown-out Detect and the Power-up Timer will be re-initialized. Once VDD rises above BVDD, the Power-up Timer will execute a 72 ms Reset. BROWN-OUT SITUATIONS VDD Internal Reset VBOD 72 ms(1) VDD Internal Reset VBOD VDD)20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Maximum current sunk by all GPIO ................................................................................................................ 125 mA Maximum current sourced all GPIO ................................................................................................................ 125 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD -  IOH} +  {(VDD-VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100  should be used when applying a “low” level to the MCLR pin, rather than pulling this pin directly to VSS.  2010 Microchip Technology Inc. DS41190G-page 85 PIC12F629/675 FIGURE 12-1: PIC12F629/675 WITH A/D DISABLED VOLTAGE-FREQUENCY GRAPH, -40°C  TA  +125°C 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.0 0 4 8 10 12 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. FIGURE 12-2: PIC12F675 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, -40°C  TA  +125°C 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.0 0 4 8 10 12 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS41190G-page 86  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 12-3: PIC12F675 WITH A/D ENABLED VOLTAGE-FREQUENCY GRAPH, 0°C  TA  +125°C 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.2 2.0 0 4 8 10 12 16 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency.  2010 Microchip Technology Inc. DS41190G-page 87 PIC12F629/675 12.1 DC Characteristics: PIC12F629/675-I (Industrial), PIC12F629/675-E (Extended) DC CHARACTERISTICS Param No. Sym VDD Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Min Typ† Max Units Supply Voltage D001 D001A D001B D001C D001D Conditions FOSC < = 4 MHz: PIC12F629/675 with A/D off PIC12F675 with A/D on, 0°C to +125°C PIC12F675 with A/D on, -40°C to +125°C 4 MHZ < FOSC < = 10 MHz 2.0 2.2 2.5 3.0 4.5 — — — — — 5.5 5.5 5.5 5.5 5.5 V V V V V 1.5* — — V Device in Sleep mode V See section on Power-on Reset for details D002 VDR RAM Data Retention Voltage(1) D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — D004 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05* — — D005 VBOD — 2.1 — V/ms See section on Power-on Reset for details V * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. DS41190G-page 88  2010 Microchip Technology Inc. PIC12F629/675 12.2 DC Characteristics: PIC12F629/675-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +85C for industrial Param No. D010 Conditions Device Characteristics Min Typ† Max Units Supply Current (IDD) — 9 16 A 2.0 — 18 28 A 3.0 D011 D012 D013 D014 D015 D016 D017 Note VDD — 35 54 A 5.0 — 110 150 A 2.0 — 190 280 A 3.0 — 330 450 A 5.0 — 220 280 A 2.0 — 370 650 A 3.0 — 0.6 1.4 mA 5.0 — 70 110 A 2.0 — 140 250 A 3.0 — 260 390 A 5.0 — 180 250 A 2.0 — 320 470 A 3.0 — 580 850 A 5.0 — 340 450 A 2.0 — 500 700 A 3.0 — 0.8 1.1 mA 5.0 — 180 250 A 2.0 — 320 450 A 3.0 — 580 800 A 5.0 — 2.1 2.95 mA 4.5 — 2.4 3.0 mA 5.0 FOSC = 32 kHz LP Oscillator Mode FOSC = 1 MHz XT Oscillator Mode FOSC = 4 MHz XT Oscillator Mode FOSC = 1 MHz EC Oscillator Mode FOSC = 4 MHz EC Oscillator Mode FOSC = 4 MHz INTOSC Mode FOSC = 4 MHz EXTRC Mode FOSC = 20 MHz HS Oscillator Mode † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.  2010 Microchip Technology Inc. DS41190G-page 89 PIC12F629/675 12.3 DC Characteristics: PIC12F629/675-I (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +85C for industrial Param No. D020 Conditions Device Characteristics Min Typ† Max Units Power-down Base Current (IPD) — 0.99 700 nA 2.0 — 1.2 770 nA 3.0 — 2.9 995 nA 5.0 — 0.3 1.5 A 2.0 — 1.8 3.5 A 3.0 — 8.4 17 A 5.0 — 58 70 A 3.0 — 109 130 A 5.0 — 3.3 6.5 A 2.0 — 6.1 8.5 A 3.0 D021 D022 D023 D024 D025 D026 Note VDD — 11.5 16 A 5.0 — 58 70 A 2.0 — 85 100 A 3.0 — 138 160 A 5.0 — 4.0 6.5 A 2.0 — 4.6 7.0 A 3.0 — 6.0 10.5 A 5.0 — 1.2 775 nA 3.0 — 0.0022 1.0 A 5.0 WDT, BOD, Comparators, VREF, and T1OSC disabled WDT Current(1) BOD Current(1) Comparator Current(1) CVREF Current(1) T1 OSC Current(1) A/D Current(1) † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. DS41190G-page 90  2010 Microchip Technology Inc. PIC12F629/675 12.4 DC Characteristics: PIC12F629/675-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +125C for extended Conditions Param No. Device Characteristics Min Typ† Max Units D010E Supply Current (IDD) — 9 16 A 2.0 — 18 28 A 3.0 D011E D012E D013E D014E D015E D016E D017E Note VDD — 35 54 A 5.0 — 110 150 A 2.0 — 190 280 A 3.0 — 330 450 A 5.0 — 220 280 A 2.0 — 370 650 A 3.0 — 0.6 1.4 mA 5.0 — 70 110 A 2.0 — 140 250 A 3.0 — 260 390 A 5.0 — 180 250 A 2.0 — 320 470 A 3.0 — 580 850 A 5.0 — 340 450 A 2.0 — 500 780 A 3.0 — 0.8 1.1 mA 5.0 — 180 250 A 2.0 — 320 450 A 3.0 — 580 800 A 5.0 — 2.1 2.95 mA 4.5 — 2.4 3.0 mA 5.0 FOSC = 32 kHz LP Oscillator Mode FOSC = 1 MHz XT Oscillator Mode FOSC = 4 MHz XT Oscillator Mode FOSC = 1 MHz EC Oscillator Mode FOSC = 4 MHz EC Oscillator Mode FOSC = 4 MHz INTOSC Mode FOSC = 4 MHz EXTRC Mode FOSC = 20 MHz HS Oscillator Mode † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.  2010 Microchip Technology Inc. DS41190G-page 91 PIC12F629/675 12.5 DC Characteristics: PIC12F629/675-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40C  TA  +125C for extended Param No. D020E Conditions Device Characteristics Min Typ† Max Units Power-down Base Current (IPD) — 0.00099 3.5 A 2.0 — 0.0012 4.0 A 3.0 D021E D022E D023E D024E D025E D026E Note VDD — 0.0029 8.0 A 5.0 — 0.3 6.0 A 2.0 — 1.8 9.0 A 3.0 — 8.4 20 A 5.0 — 58 70 A 3.0 — 109 130 A 5.0 — 3.3 10 A 2.0 — 6.1 13 A 3.0 — 11.5 24 A 5.0 — 58 70 A 2.0 — 85 100 A 3.0 — 138 165 A 5.0 — 4.0 10 A 2.0 — 4.6 12 A 3.0 — 6.0 20 A 5.0 — 0.0012 6.0 A 3.0 — 0.0022 8.5 A 5.0 WDT, BOD, Comparators, VREF, and T1OSC disabled WDT Current(1) BOD Current(1) Comparator Current(1) CVREF Current(1) T1 OSC Current(1) A/D Current(1) † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. DS41190G-page 92  2010 Microchip Technology Inc. PIC12F629/675 12.6 DC Characteristics: PIC12F629/675-I (Industrial), PIC12F629/675-E (Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended DC CHARACTERISTICS Param Sym No. VIL D030 D030A D031 D032 D033 D033A VIH D040 D040A D041 D042 D043 D043A D043B D070 IPUR D060 IIL D060A D060B D061 D063 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (RC mode) OSC1 (XT and LP modes) OSC1 (HS mode) Input High Voltage I/O ports with TTL buffer VOL D090 D092 VOH Typ† Max Units VSS VSS VSS VSS VSS VSS — 0.8 0.15 VDD 0.2 VDD 0.2 VDD 0.3 0.3 VDD V V V V V V 4.5V  VDD  5.5V Otherwise Entire range V V 4.5V  VDD 5.5V otherwise entire range 250 VDD VDD VDD VDD VDD VDD VDD 400* V V V V A Input Leakage I/O ports — 01 1 A — — 01 01 01 01 1 1 5 5 A A A A — — — — 0.6 0.6 V V IOL = 8.5 mA, VDD = 4.5V (Ind.) IOL = 1.6 mA, VDD = 4.5V (Ind.) IOL = 1.2 mA, VDD = 4.5V (Ext.) VDD - 0.7 VDD - 0.7 — — — — V V IOH = -3.0 mA, VDD = 4.5V (Ind.) IOH = -1.3 mA, VDD = 4.5V (Ind.) IOH = -1.0 mA, VDD = 4.5V (Ext.) — — — — — Conditions (Note 1) (Note 1) — 2.0 (0.25 VDD+0.8) with Schmitt Trigger buffer 0.8 VDD MCLR 0.8 VDD OSC1 (XT and LP modes) 1.6 OSC1 (HS mode) 0.7 VDD OSC1 (RC mode) 0.9 VDD GPIO Weak Pull-up Current 50* — — — — — — — (Note 1) (Note 1) VDD = 5.0V, VPIN = VSS Current(3) Analog inputs VREF MCLR(2) OSC1 D080 D083 Min Output Low Voltage I/O ports OSC2/CLKOUT (RC mode) Output High Voltage I/O ports OSC2/CLKOUT (RC mode) — — VSS VPIN VDD, Pin at high-impedance VSS VPIN VDD VSS VPIN VDD VSS VPIN VDD VSS VPIN VDD, XT, HS and LP osc configuration * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin.  2010 Microchip Technology Inc. DS41190G-page 93 PIC12F629/675 12.7 DC Characteristics: PIC12F629/675-I (Industrial), PIC12F629/675-E (Extended) (Cont.) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended DC CHARACTERISTICS Param No. Sym Characteristic Capacitive Loading Specs on Output Pins OSC2 pin D100 COSC2 D101 CIO D120 D120A D121 ED ED VDRW D122 D123 TDEW Erase/Write cycle time TRETD Characteristic Retention D124 TREF D130 D130A D131 EP ED VPR D132 D133 D134 VPEW VDD for Erase/Write TPEW Erase/Write cycle time TRETD Characteristic Retention All I/O pins Data EEPROM Memory Byte Endurance Byte Endurance VDD for Read/Write Number of Total Erase/Write Cycles before Refresh(1) Program Flash Memory Cell Endurance Cell Endurance VDD for Read Min Typ† Max Units Conditions — — 15* pF In XT, HS and LP modes when external clock is used to drive OSC1 — — 50* pF 100K 10K VMIN 1M 100K — — — 5.5 — 40 5 — 6 — 1M 10M — 10K 1K VMIN 100K 10K — — — 5.5 4.5 — 40 — 2 — 5.5 2.5 — E/W -40C  TA +85°C E/W +85°C  TA +125°C V Using EECON to read/write VMIN = Minimum operating voltage ms Year Provided no other specifications are violated E/W -40C  TA +85°C E/W -40C  TA +85°C E/W +85°C  TA +125°C V VMIN = Minimum operating voltage V ms Year Provided no other specifications are violated * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: See Section 8.5.1 “Using the Data EEPROM” for additional information. DS41190G-page 94  2010 Microchip Technology Inc. PIC12F629/675 12.8 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-Impedance) L Low FIGURE 12-4: T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-Impedance LOAD CONDITIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin VSS CL Pin VSS RL = 464 CL = 50 pF 15 pF  2010 Microchip Technology Inc. for all pins for OSC2 output DS41190G-page 95 PIC12F629/675 12.9 AC CHARACTERISTICS: PIC12F629/675 (INDUSTRIAL, EXTENDED) FIGURE 12-5: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 1 3 4 3 4 2 CLKOUT TABLE 12-1: Param No. Sym FOSC EXTERNAL CLOCK TIMING REQUIREMENTS Characteristic Min Typ† Max Units External CLKIN Frequency(1) DC DC DC DC 5 — DC 0.1 1 — — — — — 4 — — — 37 4 20 20 37 — 4 4 20 kHz MHz MHz MHz kHz MHz MHz MHz MHz LP Osc mode XT mode HS mode EC mode LP Osc mode INTOSC mode RC Osc mode XT Osc mode HS Osc mode 27 50 50 250 27 — 250 250 50 — — — — 250 — — —     200 — — 10,000 1,000 s ns ns ns s ns ns ns ns LP Osc mode HS Osc mode EC Osc mode XT Osc mode LP Osc mode INTOSC mode RC Osc mode XT Osc mode HS Osc mode 200 2* 20* TCY — — DC — — ns s ns TCY = 4/FOSC LP oscillator, TOSC L/H duty cycle HS oscillator, TOSC L/H duty cycle XT oscillator, TOSC L/H duty cycle LP oscillator XT oscillator HS oscillator Oscillator Frequency(1) 1 TOSC External CLKIN Period(1) Oscillator Period(1) 2 TCY 3 TosL, TosH 4 Instruction Cycle Time(1) External CLKIN (OSC1) High External CLKIN Low Conditions 100 * — — ns — — 50* ns — — 25* ns — — 15* ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TosR, TosF External CLKIN Rise External CLKIN Fall Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the ‘max’ cycle time limit is “DC” (no clock) for all devices. DS41190G-page 96  2010 Microchip Technology Inc. PIC12F629/675 TABLE 12-2: Param No. F10 F14 PRECISION INTERNAL OSCILLATOR PARAMETERS Sym Characteristic FOSC Internal Calibrated INTOSC Frequency Freq. Min Tolerance Typ† Max Units MHz VDD = 3.5V, 25C MHz 2.5V VDD  5.5V 0C  TA  +85C MHz 2.0V VDD  5.5V -40C  TA  +85C (IND) -40C  TA  +125C (EXT) s VDD = 2.0V, -40C to +85C s VDD = 3.0V, -40C to +85C s VDD = 5.0V, -40C to +85C 1 2 3.96 3.92 4.00 4.00 4.04 4.08 5 3.80 4.00 4.20 — — — — Sleep start-up time* — — * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise only and are not tested. TIOSCST Oscillator Wake-up from  2010 Microchip Technology Inc. 6 4 3 8 6 5 Conditions stated. These parameters are for design guidance DS41190G-page 97 PIC12F629/675 FIGURE 12-6: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 22 23 CLKOUT 13 19 14 12 18 16 I/O pin (Input) 15 17 I/O pin (Output) New Value Old Value 20, 21 TABLE 12-3: CLKOUT AND I/O TIMING REQUIREMENTS Param No. Sym Characteristic Min Typ† Max Units Conditions 10 TosH2ckL OSC1 to CLOUT — 75 200 ns (Note 1) 11 TosH2ckH OSC1 to CLOUT — 75 200 ns (Note 1) 12 TckR CLKOUT rise time — 35 100 ns (Note 1) 13 TckF CLKOUT fall time — 35 100 ns (Note 1) — — 20 ns (Note 1) TOSC + 200 ns — — ns (Note 1) (Note 1) 14 TckL2ioV CLKOUT to Port out valid 15 TioV2ckH Port in valid before CLKOUT 16 TckH2ioI Port in hold after CLKOUT 0 — — ns 17 TosH2ioV OSC1 (Q1 cycle) to Port out valid — 50 150 * ns — — 300 ns 100 — — ns 18 TosH2ioI 19 TioV2osH Port input valid to OSC1 (I/O in setup time) 0 — — ns 20 TioR Port output rise time — 10 40 ns 21 TioF Port output fall time — 10 40 ns 22 Tinp INT pin high or low time 25 — — ns 23 Trbp GPIO change INT high or low time TCY — — ns * † OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) These parameters are characterized but not tested. Data in “Typ” column is at 5.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4xTOSC. DS41190G-page 98  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 12-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 34 31 34 I/O Pins FIGURE 12-8: BROWN-OUT DETECT TIMING AND CHARACTERISTICS VDD BVDD (Device not in Brown-out Detect) (Device in Brown-out Detect) 35 Reset (due to BOD) 72 ms time-out(1) Note 1: 72 ms delay only if PWRTE bit in Configuration Word is programmed to ‘0’.  2010 Microchip Technology Inc. DS41190G-page 99 PIC12F629/675 TABLE 12-4: Param No. RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT DETECT REQUIREMENTS Sym Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 TBD — TBD — TBD s ms VDD = 5V, -40°C to +85°C Extended temperature 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 10 10 17 17 25 30 ms ms VDD = 5V, -40°C to +85°C Extended temperature 32 TOST Oscillation Start-up Timer Period — 1024TOSC — — TOSC = OSC1 period 33* TPWRT Power-up Timer Period 28* TBD 72 TBD 132* TBD ms ms VDD = 5V, -40°C to +85°C Extended Temperature 34 TIOZ I/O High-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s BVDD Brown-out Detect Voltage 2.025 — 2.175 V Brown-out Hysteresis TBD — — — Brown-out Detect Pulse Width 100* — — s 35 TBOD VDD  BVDD (D005) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41190G-page 100  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 12-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 48 47 TMR0 or TMR1 TABLE 12-5: Param No. 40* TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Sym Tt0H Characteristic T0CKI High Pulse Width Min No Prescaler With Prescaler 41* Tt0L T0CKI Low Pulse Width No Prescaler With Prescaler 42* Tt0P T0CKI Period 45* Tt1H T1CKI High Time Synchronous, No Prescaler Synchronous, with Prescaler Asynchronous 46* Tt1L T1CKI Low Time Synchronous, No Prescaler Synchronous, with Prescaler 47* — — ns 10 — — ns 0.5 TCY + 20 — — ns 10 — — ns Greater of: 20 or TCY + 40 N — — ns 0.5 TCY + 20 — — ns 15 — — ns 30 — — ns 0.5 TCY + 20 — — ns 15 — — ns 30 — — ns Synchronous Greater of: 30 or TCY + 40 N — — ns T1CKI Input Period Ft1 Timer1 oscillator input frequency range (oscillator enabled by setting bit T1OSCEN) TCKEZtmr1 Delay from external clock edge to timer increment * † 0.5 TCY + 20 Asynchronous Tt1P Asynchronous 48 Typ† Max Units 60 — — ns DC — 200* kHz 2 TOSC* — 7 TOSC* — Conditions N = prescale value (2, 4, ..., 256) N = prescale value (1, 2, 4, 8) These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2010 Microchip Technology Inc. DS41190G-page 101 PIC12F629/675 TABLE 12-6: COMPARATOR SPECIFICATIONS Comparator Specifications Sym Characteristics Standard Operating Conditions -40°C to +125°C (unless otherwise stated) Min Typ Max Units VOS Input Offset Voltage —  5.0  10 mV VCM Input Common Mode Voltage 0 — VDD - 1.5 V CMRR Common Mode Rejection Ratio +55* — — db — 150 400* ns — — 10* s Response Time TRT (1) TMC2COV Comparator Mode Change to Output Valid Comments * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD - 1.5)/2 while the other input transitions from VSS to VDD - 1.5V. TABLE 12-7: COMPARATOR VOLTAGE REFERENCE SPECIFICATIONS Voltage Reference Specifications Sym Characteristics Standard Operating Conditions -40°C to +125°C (unless otherwise stated) Min Typ Max Units Resolution — — VDD/24* VDD/32 — — LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Absolute Accuracy — — — —  1/2 1/2* LSb LSb Low Range (VRR = 1) High Range (VRR = 0) Unit Resistor Value (R) — 2k* —  — — 10* s Settling Time (1) Comments * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR transitions from 0000 to 1111. DS41190G-page 102  2010 Microchip Technology Inc. PIC12F629/675 TABLE 12-8: Param No. Sym PIC12F675 A/D CONVERTER CHARACTERISTICS: Characteristic Min Typ† Max Units Conditions A01 NR Resolution — — 10 bits A02 EABS Total Absolute Error* — — 1 LSb VREF = 5.0V bit A03 EIL Integral Error — — 1 LSb VREF = 5.0V A04 EDL Differential Error — — 1 LSb No missing codes to 10 bits VREF = 5.0V A05 EFS Full Scale Range 2.2* — 5.5* A06 EOFF Offset Error — — 1 LSb VREF = 5.0V A07 EGN Gain Error — — 1 LSb VREF = 5.0V A10 — Monotonicity — guaranteed(3) — — A20 A20A VREF Reference Voltage 2.0 2.5 — — VDD + 0.3 V A21 VREF Reference V High (VDD or VREF) VSS — VDD V A25 VAIN Analog Input Voltage VSS — VREF V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k A50 IREF VREF Input Current(2) 10 — 1000 A — — 10 A V VSS  VAIN  VREF+ Absolute minimum to ensure 10-bit accuracy During VAIN acquisition. Based on differential of VHOLD to VAIN. During A/D conversion cycle. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from External VREF or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.  2010 Microchip Technology Inc. DS41190G-page 103 PIC12F629/675 FIGURE 12-10: PIC12F675 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO 134 1 TCY (TOSC/2)(1) 131 Q4 130 A/D CLK 9 A/D DATA 8 7 3 6 2 1 0 NEW_DATA OLD_DATA ADRES 1 TCY ADIF GO DONE SAMPLING STOPPED 132 SAMPLE Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 12-9: Param No. PIC12F675 A/D CONVERSION REQUIREMENTS Sym Characteristic 130 TAD A/D Clock Period 130 TAD A/D Internal RC Oscillator Period 131 TCNV Conversion Time (not including Acquisition Time)(1) 132 TACQ Acquisition Time 134 TGO Q4 to A/D Clock Start Min Typ† Max Units Conditions 1.6 — — s TOSC based, VREF 3.0V 3.0* — — s TOSC based, VREF full range 3.0* 6.0 9.0* s ADCS = 11 (RC mode) At VDD = 2.5V 2.0* 4.0 6.0* s At VDD = 5.0V — 11 — TAD Set GO bit to new data in A/D result register (Note 2) 11.5 — s 5* — — s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). — TOSC/2 — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 “A/D Configuration and Operation” for minimum conditions. DS41190G-page 104  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 12-11: PIC12F675 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO 134 (TOSC/2 + TCY)(1) 1 TCY 131 Q4 130 A/D CLK 9 A/D DATA 8 7 3 6 2 1 NEW_DATA OLD_DATA ADRES 0 ADIF 1 TCY GO DONE SAMPLE SAMPLING STOPPED 132 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 12-10: PIC12F675 A/D CONVERSION REQUIREMENTS (SLEEP MODE) Param No. Sym Characteristic Min Typ† Max Units 1.6 — — s 3.0* — — s VREF full range s ADCS = 11 (RC mode) At VDD = 2.5V At VDD = 5.0V 130 TAD A/D Clock Period 130 TAD A/D Internal RC Oscillator Period 131 TCNV Conversion Time (not including Acquisition Time)(1) 132 TACQ Acquisition Time 134 TGO * † Q4 to A/D Clock Start Conditions VREF 3.0V 3.0* 6.0 9.0* 2.0* 4.0 6.0* s — 11 — TAD (Note 2) 11.5 — s 5* — — s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 4.1 mV @ 4.096V) from the last sampled voltage (as stored on CHOLD). — TOSC/2 + TCY — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. These parameters are characterized but not tested. Data in “Typ” column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 “A/D Configuration and Operation” for minimum conditions.  2010 Microchip Technology Inc. DS41190G-page 105 PIC12F629/675 NOTES: DS41190G-page 106  2010 Microchip Technology Inc. PIC12F629/675 13.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. “Typical” represents the mean of the distribution at 25°C. “Max” or “min” represents (mean + 3) or (mean - 3) respectively, where  is standard deviation, over the whole temperature range. FIGURE 13-1: TYPICAL IPD vs. VDD OVER TEMP (-40°C TO +25°C) Typical Baseline IPD 6.0E-09 5.0E-09 IPD (A) 4.0E-09 -40 3.0E-09 0 25 2.0E-09 1.0E-09 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 13-2: TYPICAL IPD vs. VDD OVER TEMP (+85°C) Typical Baseline IPD 3.5E-07 3.0E-07 IPD (A) 2.5E-07 2.0E-07 85 1.5E-07 1.0E-07 5.0E-08 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2010 Microchip Technology Inc. DS41190G-page 107 PIC12F629/675 FIGURE 13-3: TYPICAL IPD vs. VDD OVER TEMP (+125°C) Typical Baseline IPD 4.0E-06 3.5E-06 IPD (A) 3.0E-06 2.5E-06 125 2.0E-06 1.5E-06 1.0E-06 5.0E-07 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-4: MAXIMUM IPD vs. VDD OVER TEMP (-40°C TO +25°C) Maximum Baseline IPD 1.0E-07 9.0E-08 IPD (A) 8.0E-08 7.0E-08 6.0E-08 -40 5.0E-08 0 4.0E-08 25 3.0E-08 2.0E-08 1.0E-08 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) DS41190G-page 108  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 13-5: MAXIMUM IPD vs. VDD OVER TEMP (+85°C) Maximum Baseline IPD 9.0E-07 8.0E-07 IPD (A) 7.0E-07 6.0E-07 5.0E-07 4.0E-07 85 3.0E-07 2.0E-07 1.0E-07 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 13-6: MAXIMUM IPD vs. VDD OVER TEMP (+125°C) Maximum Baseline IPD 9.0E-06 8.0E-06 IPD (A) 7.0E-06 6.0E-06 5.0E-06 125 4.0E-06 3.0E-06 2.0E-06 1.0E-06 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2010 Microchip Technology Inc. DS41190G-page 109 PIC12F629/675 FIGURE 13-7: TYPICAL IPD WITH BOD ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical BOD IPD 130 120 IPD (uA) 110 -40 100 0 90 25 80 85 125 70 60 50 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 13-8: TYPICAL IPD WITH CMP ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical Comparator IPD 1.8E-05 1.6E-05 1.4E-05 -40 IPD (A) 1.2E-05 0 1.0E-05 25 8.0E-06 85 6.0E-06 125 4.0E-06 2.0E-06 0.0E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41190G-page 110  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 13-9: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (-40°C TO +25°C) IPD (A) Typical A/D IPD 5.0E-09 4.5E-09 4.0E-09 3.5E-09 3.0E-09 2.5E-09 2.0E-09 1.5E-09 1.0E-09 5.0E-10 0.0E+00 -40 0 25 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 13-10: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+85°C) Typical A/D IPD 3.5E-07 3.0E-07 IPD (A) 2.5E-07 2.0E-07 85 1.5E-07 1.0E-07 5.0E-08 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V)  2010 Microchip Technology Inc. DS41190G-page 111 PIC12F629/675 FIGURE 13-11: TYPICAL IPD WITH A/D ENABLED vs. VDD OVER TEMP (+125°C) Typical A/D IPD 3.5E-06 IPD (A) 3.0E-06 2.5E-06 2.0E-06 125 1.5E-06 1.0E-06 5.0E-07 0.0E+00 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 13-12: TYPICAL IPD WITH T1 OSC ENABLED vs. VDD OVER TEMP (-40°C TO +125°C), 32 kHZ, C1 AND C2=50 pF) Typical T1 IPD 1.20E-05 1.00E-05 -40 IPD (A) 8.00E-06 0 25 6.00E-06 85 4.00E-06 125 2.00E-06 0.00E+00 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41190G-page 112  2010 Microchip Technology Inc. PIC12F629/675 FIGURE 13-13: TYPICAL IPD WITH CVREF ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical CVREF IPD 160 IPD (uA) 140 -40 120 0 25 100 85 80 125 60 40 2 2.5 3 3.5 4 4.5 5 5.5 VDD (V) FIGURE 13-14: TYPICAL IPD WITH WDT ENABLED vs. VDD OVER TEMP (-40°C TO +125°C) Typical WDT IPD 16 IPD (uA) 14 12 -40 10 0 8 25 6 85 4 125 2 0 2 2.5 3 3.5 4 4.5 5 5.5 V DD (V)  2010 Microchip Technology Inc. DS41190G-page 113 PIC12F629/675 FIGURE 13-15: MAXIMUM AND MINIMUMINTOSC FREQ vs. TEMPERATURE WITH 0.1F AND 0.01F DECOUPLING (VDD = 3.5V) Internal Oscillator Frequency vs Temperature 4.20E+06 Frequency (Hz) 4.15E+06 4.10E+06 4.05E+06 -3sigma 4.00E+06 average 3.95E+06 +3sigma 3.90E+06 3.85E+06 3.80E+06 -40°C 0°C 25°C 85°C 125°C Temperature (°C) FIGURE 13-16: MAXIMUM AND MINIMUMINTOSC FREQ vs. VDD WITH 0.1F AND 0.01F DECOUPLING (+25°C) Internal Oscillator Frequency vs VDD Frequency (Hz) 4.20E+06 4.15E+06 4.10E+06 4.05E+06 4.00E+06 -3sigma 3.95E+06 3.90E+06 +3sigma average 3.85E+06 3.80E+06 2.0V 2.5V 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V VDD (V) DS41190G-page 114  2010 Microchip Technology Inc. PIC12F629/675 TYPICAL WDT PERIOD vs. VDD (-40C TO +125C) FIGURE 13-17: WDT Time-out 50 Time (mS) 45 40 35 -40 30 25 0 20 15 10 5 85 25 125 0 2 2.5 3 3.5 4 4.5 5 5.5 V DD (V)  2010 Microchip Technology Inc. DS41190G-page 115 PIC12F629/675 NOTES: DS41190G-page 116  2010 Microchip Technology Inc. PIC12F629/675 14.0 PACKAGING INFORMATION 14.1 Package Marking Information 8-Lead PDIP (Skinny DIP) XXXXXXXX XXXXXNNN YYWW Example 12F629-I /017 e3 0215 8-Lead SOIC Example XXXXXXXX XXXXYYWW NNN 12F629-E /0215 e3 017 Example 8-Lead DFN-S XXXXXXX XXXXXXX XXYYWW NNN 12F629 -E/021 e3 0215 017 8-Lead DFN (4x4 mm) Example XXXXXX XXXXXX XXXXXX YYWW XXXX 0610 NNN 017 Legend: XX...X Y YY WW NNN e3 * Note: e3 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2010 Microchip Technology Inc. DS41190G-page 117 PIC12F629/675 14.2 Package Details The following sections give the technical details of the packages.           )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$;  3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ±  0ROGHG3DFNDJH7KLFNQHVV $    %DVHWR6HDWLQJ3ODQH $  ± ± 6KRXOGHUWR6KRXOGHU:LGWK (    0ROGHG3DFNDJH:LGWK (    2YHUDOO/HQJWK '    7LSWR6HDWLQJ3ODQH /    /HDG7KLFNQHVV F    E    E    H% ± ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ† %6&    3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKWKHKDWFKHGDUHD  †6LJQLILFDQW&KDUDFWHULVWLF  'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH  'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(