PIC12F752-E/MF

PIC12F752/HV752 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers High-Performance RISC CPU Peripheral Features • Only 35 Instructions to Learn: - All single-cycle instructions except branches • Operating Speed: - DC – 20 MHz clock input - DC – 200 ns instruction cycle • 1024 x 14 On-chip Flash Program Memory • Self Read/Write Program Memory • 64 x 8 General Purpose Registers (SRAM) • Interrupt Capability • 8-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes • Five I/O Pins and One Input-only Pin • High Current Source/Sink: - 50 mA I/O, (2 pins) - 25 mA I/O, (3 pins) • Two High-Speed Analog Comparator modules: - 40 ns response time - Fixed Voltage Reference (FVR) - Programmable on-chip voltage reference via integrated 5-bit DAC - Internal/external inputs and outputs (selectable) - Built-in Hysteresis (software selectable) • A/D Converter: - 10-bit resolution - Four external channels - Two internal reference voltage channels • Dual Range Digital-to-Analog Converter (DAC): - 5-bit resolution - Full Range or Limited Range output - 4 mV steps @ 2.0V (Limited Range) - 65 mV steps @ 2.0V (Full Range) • Fixed Voltage Reference (FVR), 1.2V reference • Capture, Compare, PWM (CCP) module: - 16-bit Capture, max. resolution = 12.5 ns - Compare, max. resolution = 200 ns - 10-bit PWM, max. frequency = 20 kHz • Timer0: 8-Bit Timer/Counter with 8-Bit Prescaler • Enhanced Timer1: - 16-bit Timer/Counter with Prescaler - External Timer1 Gate (count enable) - Four Selectable Clock sources • Timer2: 8-Bit Timer/Counter with Prescaler: - 8-bit Period Register and Postscaler • Hardware Limit Timer (HLT): - 8-bit Timer with Prescaler - 8-bit period register and postscaler - Asynchronous H/W Reset sources • Complementary Output Generator (COG): - Complementary Waveforms from selectable sources - Two I/O (50 mA) for direct MOSFET drive - Rising and/or Falling edge dead-band control - Phase control, Blanking control - Auto-shutdown Microcontroller Features • Precision Internal Oscillator: - Factory calibrated to ±1%, typical - Software selectable frequency: 8 MHz, 4 MHz, 1 MHz or 31 kHz - Software tunable • Power-Saving Sleep mode • Voltage Range (PIC12F752): - 2.0V to 5.5V • Shunt Voltage Regulator (PIC12HV752) - 2.0V to user defined - 5-volt regulation - 1 mA to 50 mA shunt range • Multiplexed Master Clear with Pull-up/Input Pin • Interrupt-on-Change Pins • Individually Programmable Weak Pull-ups • Power-on Reset (POR) • Power-up Timer (PWRT) • Brown-out Reset (BOR) • Watchdog Timer (WDT) with Internal Oscillator for Reliable Operation • Industrial and Extended Temperature Range • High Endurance Flash: - 100,000 write Flash endurance - Flash retention: >40 years • Programmable Code Protection • In-Circuit Debug (ICD) via Two Pins • In-Circuit Serial Programming™ (ICSP™) via Two Pins eXtreme Low-Power (XLP) Features • Sleep Current: - 50 nA @ 2.0V, typical • Operating Current: - 11 µA @ 32 kHz, 2.0V, typical - 260 µA @ 4 MHz, 2.0V, typical • Watchdog Timer Current: • VIH 0 = Port pin is < VIL Note 1: Writes to any PORTx register are written to the corresponding LATx register. Reads from any PORTx register, return the value present on that PORTx I/O pins. REGISTER 5-3: TRISA: PORTA TRI-STATE REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — TRISA5 TRISA4 TRISA3(1) TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TRISA: PORTA Tri-State Control bits(1) 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output Note 1: TRISA3 always reads ‘1’. REGISTER 5-4: LATA: PORTA DATA LATCH REGISTER U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u — — LATA5 LATA4 — LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 LATA: PORTA Output Latch Value bits(1) bit 3 Unimplemented: Read as ‘0’ bit 2-0 LATA: PORTA Output Latch Value bits(1) Note 1: Writes to any PORTx register are written to the corresponding LATx register. Reads from any PORTx register, return the value present on that PORTx I/O pins. DS40001576D-page 40  2011-2015 Microchip Technology Inc. PIC12F752/HV752 5.5 Additional Pin Functions Every PORTA pin on the PIC12F752 has an interrupt-on-change option and a weak pull-up option. The next three sections describe these functions. 5.5.1 ANSELA REGISTER The ANSELA register (Register 5-8) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELA bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELA bits has no effect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELA bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. REGISTER 5-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 — — ANSA5 ANSA4 — ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 ANSA: Analog Select Between Analog or Digital Function on Pin RA bits 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. bit 3 Unimplemented: Read as ‘0’ bit 2-0 ANSA:Analog Select Between Analog or Digital Function on Pin RA bits 1 = Analog input. Pin is assigned as analog input.(1) 0 = Digital I/O. Pin is assigned to port or special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin.  2011-2015 Microchip Technology Inc. DS40001576D-page 41 PIC12F752/HV752 5.5.2 WEAK PULL-UPS Each of the PORTA pins, except RA3, has an individually configurable internal weak pull-up. Control bits WPUx enable or disable each pull-up. Refer to Register 5-9. Each weak pull-up is automatically turned off when the port pin is configured as an output. The REGISTER 5-6: pull-ups are disabled on a Power-on Reset by the RAPU bit of the OPTION_REG register). A weak pull-up is automatically enabled for RA3 when configured as MCLR and disabled when RA3 is an I/O. There is no software control of the MCLR pull-up. WPUA: WEAK PULL-UP PORTA REGISTER (1,2) U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 — — WPU5 WPU4 WPU3(3) WPU2 WPU1 WPU0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 WPU: Weak Pull-up Control bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: 2: 3: 5.5.3 x = Bit is unknown Global RAPU must be enabled for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is in Output mode (TRISA = 0). The RA3 pull-up is enabled when configured as MCLR in the Configuration Word, otherwise it is disabled as an input and reads as ‘0’. SLEW RATE CONTROL Two of the PORTA pins (RA0 and RA2) are equipped with high current driver circuitry. The SLRCONA register provides reduced slew rate control to mitigate possible EMI radiation from these pins. REGISTER 5-7: SLRCONA: SLEW RATE CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 R/W-0 — — — — — SLRA2 — SLRA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2 SLRA2: Slew Rate Control bit 1 = Pin voltage slews at limited rate 0 = Pin voltage slews at maximum rate bit 1 Unimplemented: Read as ‘0’ bit 0 SLRA0: Slew Rate Control bit 1 = Pin voltage slews at limited rate 0 = Pin voltage slews at maximum rate DS40001576D-page 42 x = Bit is unknown  2011-2015 Microchip Technology Inc. PIC12F752/HV752 5.5.4 INTERRUPT-ON-CHANGE All pins on all ports can be configured to operate as Interrupt-on-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual pin or combination of pins can be configured to generate an interrupt. The interrupt-on-change module has the following features: • • • • 5.5.4.5 Operation in Sleep The interrupt-on-change interrupt will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the affected IOCAF register will be updated prior to the first instruction executed out of Sleep. Interrupt-on-Change Enable (Master Switch) Individual Pin Configuration Rising and Falling Edge Detection Individual Pin Interrupt Flags Figure 14-1 is a block diagram of the IOC module. 5.5.4.1 Enabling the Module To allow individual pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 5.5.4.2 Individual Pin Configuration For each pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated bit of the IOCAP register is set. To enable a pin to detect a falling edge, the associated bit of the IOCAN register is set. A pin can be configured to detect rising and falling edges simultaneously by setting the associated bits in both of the IOCAP and IOCAN registers. 5.5.4.3 Interrupt Flags The bits located in the IOCAF registers are status flags that correspond to the interrupt-on-change pins of each port. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCAF bits. 5.5.4.4 Clearing Interrupt Flags The individual status flags (IOCAF register bits) can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. EXAMPLE 5-2: MOVLW XORWF ANDWF CLEARING INTERRUPT FLAGS (PORTA EXAMPLE) 0xff IOCAF, W IOCAF, F  2011-2015 Microchip Technology Inc. DS40001576D-page 43 PIC12F752/HV752 FIGURE 5-2: INTERRUPT-ON-CHANGE BLOCK DIAGRAM IOCBNx D Q4Q1 Q CK Edge Detect R RBx IOCBPx D Data Bus = 0 or 1 Q Write IOCBFx CK D S Q To Data Bus IOCBFx CK IOCIE R Q2 From all other IOCBFx individual Pin Detectors Q1 Q2 Q3 Q4 Q4Q1 DS40001576D-page 44 Q1 Q1 Q2 Q2 Q3 Q4 Q4Q1 IOC Interrupt to CPU Core Q3 Q4 Q4 Q4Q1 Q4Q1  2011-2015 Microchip Technology Inc. PIC12F752/HV752 REGISTER 5-8: IOCAP: INTERRUPT-ON-CHANGE POSITIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAP: Interrupt-on-Change Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and interrupt flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 5-9: IOCAN: INTERRUPT-ON-CHANGE NEGATIVE EDGE REGISTER U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAN: Interrupt-on-Change Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and interrupt flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 5-10: IOCAF: INTERRUPT-ON-CHANGE FLAG REGISTER U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOCAF: Interrupt-on-Change Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCAPx = 1 and a rising edge was detected on RBx, or when IOCANx = 1 and a falling edge was detected on RAx. 0 = No change was detected, or the user cleared the detected change.  2011-2015 Microchip Technology Inc. DS40001576D-page 45 PIC12F752/HV752 TABLE 5-2: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Bit 7 Bit 6 ADCON0 ADFM VCFG ADCON1 — ANSELA — APFCON Bit 5 Bit 4 Bit 2 CHS ADCS — Bit 3 ANSA5 ANSA4 Bit 1 Bit 0 Register on Page GO/DONE ADON 94 — — — — 94 — ANSA2 ANSA1 ANSA0 41 — — — T1GSEL — COG1FSEL COG1O1SEL COG1O0SEL 38 CM1CON0 C1ON C1OUT C1OE C1POL C1ZLF C1SP C1HYS C1SYNC 113 CM2CON0 C2ON C2OUT C2OE C2POL C2ZLF C2SP C2HYS C2SYNC 113 CM1CON1 C1INTP C1INTN C1PCH — — — C1NCH0 114 CM2CON1 C2NTP C2INTN C2PCH — — — C2NCH0 114 DACCON0 DACEN DACRNG DACOE — — DACPSS0 — — 105 IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 45 IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 45 IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 45 LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 RAPU INTEDG T0CS T0SE PSA PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 40 SLRCONA — — — — — SLRA2 — SLRA0 42 TRISA — — TRISA5 TRISA4 TRISA3(1) TRISA2 TRISA1 TRISA0 40 OPTION_REG Legend: Note 1: PS 40 14 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. TRISA3 always reads ‘1’. DS40001576D-page 46  2011-2015 Microchip Technology Inc. PIC12F752/HV752 6.0 TIMER0 MODULE 6.1 Timer0 Operation The Timer0 module is an 8-bit timer/counter with the following features: When used as a timer, the Timer0 module can be used as either an 8-bit timer or an 8-bit counter. • • • • • 6.1.1 8-Bit Timer/Counter Register (TMR0) 8-Bit Prescaler (shared with Watchdog Timer) Programmable Internal or External Clock Source Programmable External Clock Edge Selection Interrupt-on-Overflow 8-BIT TIMER MODE When used as a timer, the Timer0 module will increment every instruction cycle (without prescaler). Timer mode is selected by clearing the T0CS bit of the OPTION register to ‘0’. Figure 6-1 is a block diagram of the Timer0 module. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: 6.1.2 The value written to the TMR0 register can be adjusted, in order to account for the two instruction-cycle delay when TMR0 is written. 8-BIT COUNTER MODE When used as a counter, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION_REG register. Counter mode is selected by setting the T0CS bit of the OPTION register to ‘1’. FIGURE 6-1: TIMER0 WITH SHARED PRESCALE BLOCK DIAGRAM FOSC/4 Data Bus 0 8 1 1 Sync 2 TCY Shared Prescale T0CKI pin TMR0 0 0 T0CS T0SE Set Flag bit T0IF on Overflow PSA 8-bit Prescaler 1 PSA 8 PS Watchdog Timer LFINTOSC WDT Time-out 2 (Figure 4-1) 1 0 PSA PSA WDTE Note 1: 2: T0SE, T0CS, PSA, PS are bits in the OPTION_REG register. WDTE bit is in the Configuration Word register.  2011-2015 Microchip Technology Inc. DS40001576D-page 47 PIC12F752/HV752 6.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION register. To assign the prescaler to Timer0, the PSA bit must be cleared to a ‘0’. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS bits of the OPTION register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be assigned to the WDT module. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. When the prescaler is assigned to WDT (PSA = 1) a CLRWDT instruction will clear the prescaler along with the WDT. 6.1.3.1 Switching Prescaler Between Timer0 and WDT Modules As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 6-1, must be executed. EXAMPLE 6-1: BANKSEL TMR0 CLRWDT CLRF TMR0 CHANGING PRESCALER (TIMER0  WDT) ; ;Clear WDT ;Clear TMR0 and ;prescaler BANKSEL OPTION_REG ; BSF OPTION_REG,PSA ;Select WDT CLRWDT ; ; MOVLW b’11111000’ ;Mask prescaler ANDWF OPTION_REG,W ;bits IORLW b’00000101’ ;Set WDT prescaler MOVWF OPTION_REG ;to 1:32 DS40001576D-page 48 When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 6-2). EXAMPLE 6-2: CHANGING PRESCALER (WDT  TIMER0) CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b’11110000’ ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b’00000011’ ;Set prescale to 1:16 MOVWF OPTION_REG ; 6.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit must be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. Note: 6.1.5 The Timer0 interrupt cannot wake the processor from Sleep, since the timer is frozen during Sleep. USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in Section 20.0 “Electrical Specifications”.  2011-2015 Microchip Technology Inc. PIC12F752/HV752 6.2 Option and Timer0 Control Register REGISTER 6-1: OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RAPU INTEDG T0CS T0SE PSA R/W-1 R/W-1 R/W-1 PS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RAPU: PORTA Pull-up Enable bit 1 = PORTA pull-ups are disabled 0 = PORTA pull-ups are enabled by individual PORT latch values in WPU register bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS: Prescaler Rate Select bits Bit Value TMR0 Rate WDT Rate 000 001 010 011 100 101 110 111 TABLE 6-1: Name OPTION_REG Legend: Note 1: Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 T0IF INTF IOCIF Holding Register for the 8-bit Timer0 Register INTCON TRISA 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 TMR0 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 Register on Page 47* GIE PEIE T0IE INTE IOCIE RAPU INTEDG T0CS T0SE PSA — — TRISA5 TRISA4 TRISA3(1) PS TRISA2 TRISA1 15 14 TRISA0 40 — Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. * Page provides register information. TRISA3 always reads ‘1’.  2011-2015 Microchip Technology Inc. DS40001576D-page 49 PIC12F752/HV752 7.0 TIMER1 MODULE WITH GATE CONTROL • Wake-up on Overflow (External Clock, Asynchronous mode only) • Time Base for the Capture/Compare Function • Special Event Trigger (with CCP) • Selectable Gate Source Polarity • Gate Toggle mode • Gate Single-Pulse mode • Gate Value Status • Gate Event Interrupt The Timer1 module is a 16-bit timer/counter with the following features: • 16-Bit Timer/Counter Register Pair (TMR1H:TMR1L) • Selectable Internal or External Clock Sources • 2-Bit Prescaler • Synchronous or Asynchronous Operation • Multiple Timer1 Gate (Count Enable) Sources • Interrupt-on-Overflow FIGURE 7-1: Figure 7-1 is a block diagram of the Timer1 module. TIMER1 BLOCK DIAGRAM T1GSS T1GSPM 00 T1G From Timer0 Overflow 01 SYNCC1OUT 10 0 T1G_IN T1GVAL 0 SYNCC2OUT D Q CK R Q Single Pulse Acq. Control 1 1 Q1 11 Data Bus Q RD T1GCON EN Interrupt T1GGO/DONE det T1GPOL TMR1ON T1GTM TMR1GIF TMR1GE TMR1ON TMR1(2) Set flag bit TMR1IF on Overflow D TMR1H CCP Special Event Trigger EN T1CLK TMR1L R Q 0 TMR1CS1 T1SYNC Synchronized clock input D 1 TMR1CS Temperature Sense Oscillator 11 (1) Synchronize(3) Prescaler 1, 2, 4, 8 det 10 T1CKI 2 T1CKPS FOSC Internal Clock 01 FOSC/4 Internal Clock 00 FOSC/2 Internal Clock Sleep input Note 1: ST buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. DS40001576D-page 50  2011-2015 Microchip Technology Inc. PIC12F752/HV752 7.1 Timer1 Operation 7.2 Clock Source Selection The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. The TMR1CS bits of the T1CON register are used to select the clock source for Timer1. Table 7-2 displays the clock source selections. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and increments on every selected edge of the external source. TABLE 7-2: Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 7-1 displays the Timer1 enable selections. TABLE 7-1: TIMER1 ENABLE SELECTIONS TMR1ON TMR1GE 0 0 Timer1 Operation Off 0 1 Off 1 0 Always On 1 1 Count Enabled TMR1CS CLOCK SOURCE SELECTIONS Clock Source 11 Temperature Sense Oscillator 10 External Clocking on T1CKI Pin 01 System Clock (FOSC) 00 Instruction Clock (FOSC/4) 7.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of FOSC or FOSC/4 as determined by the Timer1 prescaler. 7.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge (see Figure 7-2) after any one or more of the following conditions: • Timer1 enabled after POR Reset • Write to TMR1H or TMR1L • Timer1 is disabled • Timer1 is disabled (TMR1ON = 0) when T1CKI is high; then Timer1 is enabled (TMR1ON=1) when T1CKI is low. 7.2.3 TEMPERATURE SENSE OSCILLATOR When the Temperature Sense Oscillator source is selected, the TMR1H:TMR1L register pair will increment on multiples of the Temperature Sense Oscillator as determined by the Timer1 prescaler. The Temperature Sense Oscillator operates at 16 kHz typical.  2011-2015 Microchip Technology Inc. DS40001576D-page 51 PIC12F752/HV752 7.3 Timer1 Prescaler 7.5 Timer1 Gate Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 gate count enable. 7.4 7.5.1 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If external clock source is selected, then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 7.4.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). Note: 7.4.1 When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment. Timer1 gate can also be driven by multiple selectable sources. TIMER1 GATE COUNT ENABLE The Timer1 gate is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 gate is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate (T1G) input is active, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 gate input is inactive, no incrementing will occur and Timer1 will hold the current count. See Figure 7-3 for timing details. TABLE 7-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G Timer1 Operation  0 0 Counts  0 1 Holds Count  1 0 Holds Count  1 1 Counts READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read, which is taken care of in hardware. However, the user should keep in mind that reading the 16-bit timer in two 8-bit values poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. DS40001576D-page 52  2011-2015 Microchip Technology Inc. PIC12F752/HV752 7.5.2 TIMER1 GATE SOURCE SELECTION The Timer1 gate source can be selected from one of four different sources. Source selection is controlled by the T1GSS bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TABLE 7-4: T1GSS TIMER1 GATE SOURCES Timer1 Gate Source 11 SYNCC2OUT 10 SYNCC1OUT 01 Overflow of Timer0 (TMR0 increments from FFh to 00h) 00 Timer1 Gate Pin 7.5.2.1 T1G Pin Gate Operation The T1G pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 7.5.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-to-high pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 7.5.2.3 C1OUT/C2OUT Gate Operation The outputs from the Comparator C1 and C2 modules can be used as gate sources for the Timer1 module. 7.5.3 TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 7-4 for timing details. 7.5.4 TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. Clearing the T1GSPM bit of the T1GCON register will also clear the T1GGO/DONE bit. See Figure 7-5 for timing details. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 7-6 for timing details. 7.5.5 TIMER1 GATE VALUE STATUS When Timer1 gate value status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 7.5.6 TIMER1 GATE EVENT INTERRUPT When Timer1 gate event interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Note: Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation.  2011-2015 Microchip Technology Inc. DS40001576D-page 53 PIC12F752/HV752 7.6 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the Interrupt-on-Rollover, you must set these bits: • • • • TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Note: 7.7 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, the clock source can be used to increment the counter. To set up the timer to wake the device: • • • • • TMR1ON bit of the T1CON register must be set TMR1IE bit of the PIE1 register must be set PEIE bit of the INTCON register must be set T1SYNC bit of the T1CON register must be set TMR1CS bits of the T1CON register must be configured • TMR1GE bit of the T1GCON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine (0004h). FIGURE 7-2: 7.8 CCP Capture/Compare Time Base The CCP module uses the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCPR1H:CCPR1L register pair on a configured event. In Compare mode, an event is triggered when the value CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. For more information, see Section 10.0 “Capture/ Compare/PWM Modules”. 7.9 CCP Special Event Trigger When the CCP is configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The CCP module may still be configured to generate a CCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair becomes the period register for Timer1. Timer1 should be synchronized to the FOSC/4 to utilize the Special Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the CCP, the write will take precedence. For more information, see Section 12.2.5 “Special Event Trigger”. TIMER1 INCREMENTING EDGE T1CKI T1CKI TMR1 enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. DS40001576D-page 54  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 7-3: TIMER1 GATE COUNT ENABLE MODE TMR1GE T1GPOL T1G_IN T1CKI T1GVAL TIMER1 N FIGURE 7-4: N+1 N+2 N+3 N+4 TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM T1G_IN T1CKI T1GVAL TIMER1 N  2011-2015 Microchip Technology Inc. N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 DS40001576D-page 55 PIC12F752/HV752 FIGURE 7-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_IN T1CKI T1GVAL TIMER1 TMR1GIF DS40001576D-page 56 N Cleared by software N+1 N+2 Set by hardware on falling edge of T1GVAL Cleared by software  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 7-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G T1G_IN T1CKI T1GVAL TIMER1 TMR1GIF N Cleared by software  2011-2015 Microchip Technology Inc. N+1 N+2 N+3 Set by hardware on falling edge of T1GVAL N+4 Cleared by software DS40001576D-page 57 PIC12F752/HV752 7.10 Timer1 Control Registers REGISTER 7-1: R/W-0 T1CON: TIMER1 CONTROL REGISTER R/W-0 TMR1CS R/W-0 R/W-0 T1CKPS R/W-0 R/W-0 U-0 R/W-0 Reserved T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 TMR1CS: Timer1 Clock Source Select bits 11 = Temperature Sense Oscillator 10 = External clock from T1CKI pin (on the rising edge) 01 = Timer1 clock source is system clock (FOSC) 00 = Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 Reserved: Do not use. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1X 1 = Do not synchronize external clock input 0 = Synchronize external clock input with system clock (FOSC) TMR1CS = 0X This bit is ignored. Timer1 uses the internal clock when TMR1CS = 1X. bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Clears Timer1 gate flip-flop DS40001576D-page 58  2011-2015 Microchip Technology Inc. PIC12F752/HV752 REGISTER 7-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0 R/W-0 T1GSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle mode bit 1 = Timer1 Gate Toggle mode is enabled. 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single Pulse mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started This bit is automatically cleared when T1GSPM is cleared. bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS: Timer1 Gate Source Select bits 11 = SYNCC2OUT 10 = SYNCC1OUT 01 = Timer0 overflow output 00 = Timer1 gate pin  2011-2015 Microchip Technology Inc. DS40001576D-page 59 PIC12F752/HV752 TABLE 7-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 — ANSA2 ANSA1 ANSA0 41 APFCON — — — T1GSEL — COG1SEL CCP1CON — — GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 PIE1 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF 18 — — RA5 RA4 RA3 RA2 RA1 RA0 40 Name INTCON PORTA DC1B TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register TRISA — T1CON TMR1CS T1GCON Legend: TMR1GE — T1GPOL TRISA5 TRISA4 T1CKPS T1GTM T1GSPM COG1O1SEL COG1O0SEL 38 CCP1M 73 50* 50* TRISA3 TRISA2 TRISA1 TRISA0 40 Reserved T1SYNC — TMR1ON 58 T1GGO/ DONE T1GVAL T1GSS 59 x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. * Page provides register information. DS40001576D-page 60  2011-2015 Microchip Technology Inc. PIC12F752/HV752 8.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: • • • • • 8-Bit Timer Register (TMR2) 8-Bit Period Register (PR2) Interrupt on TMR2 Match with PR2 Software Programmable Prescaler (1:1, 1:4, 1:16) Software Programmable Postscaler (1:1 to 1:16) See Figure 8-1 for a block diagram of Timer2. 8.1 Timer2 Operation The clock input to the Timer2 module is the system instruction clock (FOSC/4). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, two things happen: The match output of the Timer2/PR2 comparator is then fed into the Timer2 postscaler. The postscaler has postscale options of 1:1 to 1:16 inclusive. The output of the Timer2 postscaler is used to set the TMR2IF interrupt flag bit in the PIR1 register. The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a ‘1’. Timer2 is turned off by clearing the TMR2ON bit to a ‘0’. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The Timer2 postscaler is controlled by the TOUTPS bits in the T2CON register. The prescaler and postscaler counters are cleared when: • A write to TMR2 occurs • A write to T2CON occurs • Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset) FIGURE 8-1: FOSC/4 TMR2 is not cleared when T2CON is written. Note: • TMR2 is reset to 00h on the next increment cycle • The Timer2 postscaler is incremented TIMER2 BLOCK DIAGRAM Prescaler 1:1, 1:4, 1:16 2 TMR2 Reset Comparator EQ TMR2 Output Postscaler 1:1 to 1:16 Sets Flag bit TMR2IF T2CKPS PR2 4 TOUTPS  2011-2015 Microchip Technology Inc. DS40001576D-page 61 PIC12F752/HV752 8.2 Timer2 Control Registers REGISTER 8-1: T2CON: TIMER 2 CONTROL REGISTER U-0 R/W-0 R/W-0 — R/W-0 R/W-0 TOUTPS R/W-0 R/W-0 TMR2ON R/W-0 T2CKPS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS: Timer2 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 TABLE 8-1: x = Bit is unknown SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 PIE1 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF PR2 Timer2 Module Period Register TMR2 Holding Register for the 8-bit TMR2 Register T2CON Legend: — 18 61* TOUTPS 61* TMR2ON T2CKPS 62 x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information. DS40001576D-page 62  2011-2015 Microchip Technology Inc. PIC12F752/HV752 9.0 HARDWARE LIMIT TIMER (HLT) MODULE The HLT module incorporates the following features: • 8-Bit Read-Write Timer Register (HLTMR1) • 8-Bit Read-Write Period Register (HLTPR1) • Software Programmable Prescaler - 1:1 - 1:4 - 1:16 • Software Programmable Postscaler: - 1:1 to 1:16, inclusive • Interrupt on HLTMR1 Match with HLTPR1 • Eight Selectable Timer Reset Inputs (five reserved) • Reset on Rising and Falling Event The Hardware Limit Timer (HLT) module is a version of the Timer2-type modules. In addition to all the Timer2-type features, the HLT can be reset on rising and falling events from selected peripheral outputs. The HLT primary purpose is to act as a timed hardware limit to be used in conjunction with asynchronous analog feedback applications. The external reset source synchronizes the HLTMR1 to an analog application. In normal operation, the external reset source from the analog application should occur before the HLTMR1 matches the HLTPR1. This resets HLTMR1 for the next period and prevents the HLTimer1 Output from going active. Refer to Figure 9-1 for a block diagram of the HLT. When the external reset source fails to generate a signal within the expected time, allowing the HLTMR1 to match the HLTPR1, then the HLTimer1 Output becomes active. FIGURE 9-1: HLTMR1 BLOCK DIAGRAM CCP1 out C1OUT C2OUT COG1FLT COG1OUT0 COG1OUT1 ‘0’ ‘0’ H1ERS FOSC/4 H1ON 000 H1REREN Detect Detect H1FEREN 111 3 Prescaler 1:1, 1:4, 1:16 2 Reset HLTMR1 Comparator HLTimer1 Output (to COG module) EQ Postscaler 1:1 to 1:16 Sets Flag bit HLTMR1IF H1CKPS HLTPR1 4 H1OUTPS  2011-2015 Microchip Technology Inc. DS40001576D-page 63 PIC12F752/HV752 9.1 HLT Operation The clock input to the HLT module is the system instruction clock (FOSC/4). HLTMR1 increments on each rising clock edge. A 4-bit counter/prescaler on the clock input provides the following prescale options: • Direct Input • Divide-by-4 • Divide-by-16 The prescale options are selected by the prescaler control bits, H1CKPS of the HLT1CON0 register. The value of HLTMR1 is compared to that of the Period register, HLTPR1, on each clock cycle. When the two values match,then the comparator generates a match signal as the HLTimer1 output. This signal also resets the value of HLTMR1 to 00h on the next clock rising edge and drives the output counter/postscaler (see Section 9.2 “HLT Interrupt”). The time from HLT reset to the HLT output pulse is calculated as shown in Equation 9-1 below. EQUATION 9-1: HLT OUTPUT HLT Time =  HLTPR1 + 2   4  Fosc Unexpected operation may occur for HLT periods less than half the period of the expected external HLT Reset input. The HLTMR1 and HLTPR1 registers are both directly readable and writable. The HLTMR1 register is cleared on any device Reset, whereas the HLTPR1 register initializes to FFh. Both the prescaler and postscaler counters are cleared on any of the following events: • • • • • • • • • A Write to the HLTMR1 Register A Write to the HLT1CON0 Register Power-on Reset (POR) Brown-out Reset (BOR) MCLR Reset Watchdog Timer (WDT) Reset Stack Overflow Reset Stack Underflow Reset RESET Instruction. Note: HLTMR1 is not cleared when HLT1CON0 is written. 9.2 HLT Interrupt The HLT can also generate an optional device interrupt. The HLTMR1 output signal (HLTMR1-to-HLTPR1 match) provides the input for the 4-bit counter/ postscaler. The overflow output of the postscaler sets the HLTMR1IF bit of the PIR1 register. The interrupt is enabled by setting the HLTMR1 Match Interrupt Enable bit, HLTMR1IE of the PIE1 register. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, H1OUTPS, of the HLT1CON0 register. 9.3 Peripheral Resets Resets driven from the selected peripheral output prevents the HLTMR1 from matching the HLTPR1 register and generating an output. In this manner, the HLT can be used as a hardware time limit to other peripherals. In this device, the primary purpose of the HLT is to limit the COG PWM duty cycle. Normally, the COG operation uses analog feedback to determine the PWM duty cycle. The same feedback signal is used as an HLT Reset input. The HLTPR1 register is set to occur at the maximum allowed duty cycle. If the analog feedback to the COG exceeds the maximum time, then an HLTMR1-to-HLTPR1 match will occur and generate the output needed to limit the COG drive output. The HLTMR1 can be reset by one of several selectable peripheral sources. Reset inputs include: • CCP1 Output • Comparator 1 Output • Comparator 2 Output The Reset input is selected with the H1ERS bits of the HLT1CON1 register. HLTMR1 Resets are synchronous with the HLT clock, i.e. HLTMR1 is cleared on the rising edge of the HLT clock after the enabled Reset event occurs. The Reset can be enabled to occur on the rising and falling input event. Rising and falling event enables are selected with the respective H1REREN and H1FEREN bits of the HLT1CON1 register. External Resets do not cause an HLTMR1 output event. 9.4 HLTimer1 Output The unscaled output of HLTMR1 is available only to the COG module, where it is used as a selectable limit to the maximum COG period. 9.5 HLT Operation During Sleep The HLT cannot be operated while the processor is in Sleep mode. The contents of the HLTMR1 register will remain unchanged while the processor is in Sleep mode. DS40001576D-page 64  2011-2015 Microchip Technology Inc. PIC12F752/HV752 9.6 HLT Control Registers REGISTER 9-1: U-0 HLT1CON0: HLT1 CONTROL REGISTER 0 R/W-0/0 R/W-0/0 — R/W-0/0 H1OUTPS R/W-0/0 R/W-0/0 R/W-0/0 H1ON bit 7 R/W-0/0 H1CKPS bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 H1OUTPS: Hardware Limit Timer 1 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 H1ON: Hardware Limit Timer 1 On bit 1 = Timer is on 0 = Timer is off bit 1-0 H1CKPS: Hardware Limit Timer 1 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16  2011-2015 Microchip Technology Inc. DS40001576D-page 65 PIC12F752/HV752 REGISTER 9-2: HLT1CON1: HLT1 CONTROL REGISTER 1 U-0 U-0 U-0 — — — R/W-0/0 R/W-0/0 R/W-0/0 H1ERS R/W-0/0 R/W-0/0 H1FEREN H1REREN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-2 H1ERS: Hardware Limit Timer 1 Peripheral Reset Select bits 000 = CCP1 Out 001 = C1OUT 010 = C2OUT 011 = COG1FLT 100 = COG1OUT0 101 = COG1OUT1 110 = Reserved - ‘0’ input 111 = Reserved - ‘0’ input bit 1 H1FEREN: Hardware Limit Timer 1 Falling Edge Reset Enable bit 1 = HLTMR1 will reset on the first clock after a falling edge of selected Reset source 0 = Falling edges of selected source have no effect bit 0 H1REREN: Hardware Limit Timer 1 Rising Edge Reset Enable bit 1 = HLTMR1 will reset on the first clock after a rising edge of selected Reset source 0 = Rising edges of selected source have no effect TABLE 9-1: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH HLT Bit 7 Bit 6 — — CM1CON0 C1ON C1OUT CM1CON1 C1INTP C1INTN CM2CON0 C2ON C2OUT CM2CON1 C2INTP C2INTN INTCON PIE1 PIR1 Bit 5 Bit 4 Bit 3 DC1B C1OE C1POL C1PCH C2OE C2POL C2PCH Register on Page 73 C1SP C1HYS C1SYNC 113 — — — C1NCH0 114 C2ZLF C2SP C2HYS C2SYNC 113 — — — C2NCH0 114 GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF HLTPR1 HLTMR1 Module Period Register Legend: Bit 0 C1ZLF Holding Register for the 8-bit Hardware Limit Timer1 Register HLT1CON1 Bit 1 CCP1M HLTMR1 HLT1CON0 Bit 2 — — 63* H1OUTPS — — 18 63* H1ON H1ERS H1CKPS H1FEREN H1REREN 65 66 — = unimplemented location, read as ‘0’. Shaded cells do not affect the HLT module operation. * Page provides register information. DS40001576D-page 66  2011-2015 Microchip Technology Inc. PIC12F752/HV752 10.0 CAPTURE/COMPARE/PWM MODULES The Capture/Compare/PWM modules is a peripheral which allows the user to time and control different events, and to generate Pulse-Width Modulation (PWM) signals. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate Pulse-Width Modulated signals of varying frequency and duty cycle. 10.1 Capture Mode Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCP1 pin, the 16-bit CCPR1H:CCPR1L register pair captures and stores the 16-bit value of the TMR1H:TMR1L register pair, respectively. An event is defined as one of the following and is configured by the CCP1M bits of the CCP1CON register: • • • • Every Falling Edge Every Rising Edge Every 4th Rising Edge Every 16th Rising Edge Figure 10-1 shows a simplified diagram of the Capture operation. CCP1 PIN CONFIGURATION In Capture mode, the CCP1 pin should be configured as an input by setting the associated TRIS control bit. Note: If the CCP1 pin is configured as an output, a write to the port can cause a capture condition. FIGURE 10-1: Prescaler  1, 4, 16 CAPTURE MODE OPERATION BLOCK DIAGRAM TIMER1 MODE RESOURCE Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP1 module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. See Section 7.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. 10.1.3 SOFTWARE INTERRUPT MODE When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCP1IE interrupt enable bit of the PIE2 register clear to avoid false interrupts. Additionally, the user should clear the CCP1IF interrupt flag bit of the PIR2 register following any change in Operating mode. Note: 10.1.4 When a capture is made, the Interrupt Request Flag bit CCP1IF of the PIR2 register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPR1H, CCPR1L register pair is read, the old captured value is overwritten by the new captured value. 10.1.1 10.1.2 Clocking Timer1 from the system clock (FOSC) should not be used in Capture mode. In order for Capture mode to recognize the trigger event on the CCP1 pin, Timer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. CCP1 PRESCALER There are four prescaler settings specified by the CCP1M bits of the CCP1CON register. Whenever the CCP1 module is turned off or the CCP1 module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCP1CON register before changing the prescaler. Example 10-1 demonstrates the code to perform this function. EXAMPLE 10-1: CHANGING BETWEEN CAPTURE PRESCALERS BANKSEL CCP1CON CLRF MOVLW MOVWF ;Set Bank bits to point ;to CCP1CON CCP1CON ;Turn CCP1 module off NEW_CAPT_PS ;Load the W reg with ;the new prescaler ;move value and CCP1 ON CCP1CON ;Load CCP1CON with this ;value Set Flag bit CCP1IF (PIR2 register) CCP1 pin CCPR1H and Edge Detect CCPR1L Capture Enable TMR1H TMR1L CCP1M System Clock (FOSC)  2011-2015 Microchip Technology Inc. DS40001576D-page 67 PIC12F752/HV752 10.1.5 CAPTURE DURING SLEEP Capture mode depends upon the Timer1 module for proper operation. If the Timer1 clock input source is a clock that is not disabled during Sleep, Timer1 will continue to operate and Capture mode will operate during Sleep to wake the device. The T1CKI is an example of a clock source that will operate during Sleep. When the input source to Timer1 is disabled during Sleep, such as the HFINTOSC, Timer1 will not increment during Sleep. When the device wakes from Sleep, Timer1 will continue from its previous state. TABLE 10-1: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE Bit 7 Bit 6 — — Bit 5 Bit 4 DC1B CCPR1L Capture/Compare/PWM Register x Low Byte (LSB) CCPR1H Capture/Compare/PWM Register x High Byte (MSB) INTCON PIE1 Bit 3 Bit 2 Bit 1 Bit 0 CCP1M Register on Page 73 67* 67* GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 PIE2 — — C2IE C1IE — COG1IE — CCP1IE 17 PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF 18 PIR2 — — C2IF C1IF T1CON TMR1CS T1GCON TMR1GE T1GPOL T1CKPS T1GTM T1GSPM — COG1IF — CCP1IF 19 Reserved T1SYNC — TMR1ON 58 T1GGO/ DONE T1GVAL T1GSS 59 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 50* TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 50* TRISA — — TRISA5 TRISA4 TRISA3(1) TRISA2 TRISA1 TRISA0 40 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Capture mode. * Page provides register information. Note 1: TRISA3 always reads ‘1’. DS40001576D-page 68  2011-2015 Microchip Technology Inc. PIC12F752/HV752 10.2 10.2.2 Compare Mode Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCPR1H:CCPR1L register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a match occurs, one of the following events can occur: • • • • • Toggle the CCP1 Output Set the CCP1 Output Clear the CCP1 Output Generate a Special Event Trigger Generate a Software Interrupt In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. See Section 7.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. Note: The action on the pin is based on the value of the CCP1M control bits of the CCP1CON register. At the same time, the interrupt flag CCP1IF bit is set. All Compare modes can generate an interrupt. Figure 10-2 shows a simplified diagram of the Compare operation. FIGURE 10-2: COMPARE MODE OPERATION BLOCK DIAGRAM CCP1M Mode Select Set CCP1IF Interrupt Flag (PIR2) 4 CCPR1H CCPR1L CCP1 Pin Q S R Output Logic Match TRIS Output Enable Comparator TMR1H TMR1L Special Event Trigger 10.2.1 CCP1 PIN CONFIGURATION The user must configure the CCP1 pin as an output by clearing the associated TRIS bit. Note: Clearing the CCP1CON register will force the CCP1 compare output latch to the default low level. This is not the PORT I/O data latch. TIMER1 MODE RESOURCE 10.2.3 Clocking Timer1 from the system clock (FOSC) should not be used in Compare mode. In order for Compare mode to recognize the trigger event on the CCP1 pin, Timer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCP1M = 1010), the CCP1 module does not assert control of the CCP1 pin (see the CCP1CON register). 10.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCP1M = 1011), the CCP1 module does the following: • It resets Timer1 • It starts an ADC conversion if ADC is enabled The CCP1 module does not assert control of the CCP1 pin in this mode. The Special Event Trigger output of the CCP1 occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPR1H, CCPR1L register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. The Special Event Trigger output starts an A/D conversion (if the A/D module is enabled). This allows the CCPR1H, CCPR1L register pair to effectively provide a 16-bit programmable period register for Timer1. TABLE 10-2: SPECIAL EVENT TRIGGER Device PIC12F752 PIC12HV752 CCP1 CCP1 Refer to Section 12.0 “Analog-to-Digital Converter (ADC) Module” for more information. Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMR1IF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPR1H and CCPR1L register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring.  2011-2015 Microchip Technology Inc. DS40001576D-page 69 PIC12F752/HV752 10.2.5 COMPARE DURING SLEEP The Compare mode is dependent upon the system clock (FOSC) for proper operation. Since FOSC is shut down during Sleep mode, the Compare mode will not function properly during Sleep. TABLE 10-3: Name CCP1CON SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE Bit 7 Bit 6 — — Bit 5 Bit 4 Bit 3 DC1B Capture/Compare/PWM Register 1 Low Byte (LSB) CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) PIE1 Bit 1 Bit 0 CCP1M CCPR1L INTCON Bit 2 Register on Page 73 67* 67* GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 PIE2 — — C2IE C1IE — COG1IE — CCP1IE 17 PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF 18 PIR2 — — C2IF C1IF T1CON TMR1CS T1GCON TMR1GE T1GPOL T1CKPS T1GTM T1GSPM — COG1IF — CCP1IF 19 Reserved T1SYNC — TMR1ON 58 T1GGO/DONE T1GVAL TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register TRISA — — TRISA5 TRISA4 TRISA3(1) TRISA2 T1GSS 59 50* 50* TRISA1 TRISA0 40 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Compare mode. * Page provides register information. Note 1: TRISA3 always reads ‘1’. DS40001576D-page 70  2011-2015 Microchip Technology Inc. PIC12F752/HV752 10.3 PWM Overview Pulse-Width Modulation (PWM) is a scheme that provides power to a load by switching quickly between fully-on and fully-off states. The PWM signal resembles a square wave where the high portion of the signal is considered the on state and the low portion of the signal is considered the off state. The high portion, also known as the pulse width, can vary in time and is defined in steps. A larger number of steps applied, which lengthens the pulse width, also supplies more power to the load. Lowering the number of steps applied, which shortens the pulse width, supplies less power. The PWM period is defined as the duration of one complete cycle or the total amount of on and off time combined. FIGURE 10-3: CCP1 PWM OUTPUT SIGNAL Period Pulse Width TMR2 = PR2 TMR2 = CCPR1H:CCP1CON TMR2 = 0 FIGURE 10-4: SIMPLIFIED PWM BLOCK DIAGRAM PWM resolution defines the maximum number of steps that can be present in a single PWM period. A higher resolution allows for more precise control of the pulse width time and in turn the power that is applied to the load. Duty Cycle Registers The term duty cycle describes the proportion of the on time to the off time and is expressed in percentages, where 0% is fully off and 100% is fully on. A lower duty cycle corresponds to less power applied and a higher duty cycle corresponds to more power applied. CCPR1H(2) (Slave) CCP1CON CCPR1L CCP1 R Comparator TMR2 (1) Q S Figure 10-3 shows a typical waveform of the PWM signal. TRIS Comparator 10.3.1 STANDARD PWM OPERATION The standard PWM mode generates a Pulse-Width modulation (PWM) signal on the CCP1 pin with up to ten bits of resolution. The period, duty cycle and resolution are controlled by the following registers: • • • • PR2 Registers T2CON Registers CCPR1L Registers CCP1CON Registers PR2 Note 1: 2: Clear Timer, toggle CCP1 pin and latch duty cycle The 8-bit timer TMR2 register is concatenated with the 2-bit internal system clock (FOSC), or two bits of the prescaler, to create the 10-bit time base. In PWM mode, CCPR1H is a read-only register. Figure 10-4 shows a simplified block diagram of PWM operation. Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCP1 pin. 2: Clearing the CCP1CON register will relinquish control of the CCP1 pin.  2011-2015 Microchip Technology Inc. DS40001576D-page 71 PIC12F752/HV752 10.3.2 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP1 module for standard PWM operation: 1. 2. 3. 4. 5. 6. Disable the CCP1 pin output driver by setting the associated TRIS bit Load the PR2 register with the PWM period value Configure the CCP1 module for the PWM mode by loading the CCP1CON register with the appropriate values Load the CCPR1L register and the DC1B bits of the CCP1CON register, with the PWM duty cycle value Configure and start Timer2: • Clear the TMR2IF interrupt flag bit of the PIR1 register (see Note below) • Configure the T2CKPS bits of the T2CON register with the Timer prescale value • Enable the Timer by setting the TMR2ON bit of the T2CON register Enable PWM output pin: • Wait until the Timer overflows and the TMR2IF bit of the PIR1 register is set. See Note below • Enable the CCP1 pin output driver by clearing the associated TRIS bit Note: 10.3.3 In order to send a complete duty cycle and period on the first PWM output, the above steps must be included in the setup sequence. If it is not critical to start with a complete PWM signal on the first output, then step 6 may be ignored. PWM PERIOD The PWM period is specified by the PR2 register of Timer2. The PWM period can be calculated using the formula of Equation 10-1. EQUATION 10-1: PWM PERIOD 10.3.4 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPR1L register and DC1B bits of the CCP1CON register. The CCPR1L contains the eight MSbs and the DC1B bits of the CCP1CON register contain the two LSbs. CCPR1L and DC1B bits of the CCP1CON register can be written to at any time. The duty cycle value is not latched into CCPR1H until after the period completes (i.e. a match between PR2 and TMR2 registers occurs). While using the PWM, the CCPR1H register is read-only. Equation 10-2 is used to calculate the PWM pulse width. Equation 10-3 is used to calculate the PWM duty cycle ratio. EQUATION 10-2: PULSE WIDTH Pulse Width =  CCPR1L:CCP1CON   T OSC  (TMR2 Prescale Value) EQUATION 10-3: DUTY CYCLE RATIO  CCPRxL:CCPxCON  Duty Cycle Ratio = ----------------------------------------------------------------------4  PRx + 1  The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMR2 register is concatenated with either the 2-bit internal system clock (FOSC), or two bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2 prescaler is set to 1:1. When the 10-bit time base matches the CCPR1H and 2-bit latch, then the CCP1 pin is cleared (see Figure 10-4). PWM Period =   PR2  + 1   4  T OSC  (TMR2 Prescale Value) Note 1: TOSC = 1/FOSC When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set (exception: If the PWM duty cycle = 0%, the pin will not be set) • The PWM duty cycle is latched from CCPR1L into CCPR1H Note: The Timer postscaler (see Section 8.1 “Timer2 Operation”) is not used in the determination of the PWM frequency. DS40001576D-page 72  2011-2015 Microchip Technology Inc. PIC12F752/HV752 10.4 CCP Control Registers REGISTER 10-1: U-0 CCP1CON: CCP1 CONTROL REGISTER U-0 — R/W-0/0 R/W-0/0 R/W-0/0 DC1B — R/W-0/0 R/W-0/0 R/W-0/0 CCP1M bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DC1B: PWM Duty Cycle Least Significant bits Capture mode: Unused Compare mode: Unused PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L. bit 3-0 CCP1M: CCP1 Mode Select bits 0000 = Capture/Compare/PWM off (resets CCP1 module) 0001 = Reserved 0010 = Compare mode: toggle output on match 0011 = Reserved 0100 = 0101 = 0110 = 0111 = Capture mode: every falling edge Capture mode: every rising edge Capture mode: every 4th rising edge Capture mode: every 16th rising edge 1000 = 1001 = 1010 = 1011 = Compare mode: initialize CCP1 pin low; set output on compare match (set CCP1IF) Compare mode: initialize CCP1 pin high; clear output on compare match (set CCP1IF) Compare mode: generate software interrupt only; CCP1 pin reverts to I/O state Compare mode: Special Event Trigger (CCP1 resets Timer, sets CCP1IF bit, and starts A/D conversion if A/D module is enabled) 11xx = PWM mode  2011-2015 Microchip Technology Inc. DS40001576D-page 73 PIC12F752/HV752 11.0 COMPLEMENTARY OUTPUT GENERATOR (COG) MODULE The primary purpose of the Complementary Output Generator (COG) is to convert a single output PWM signal into a two output complementary PWM signal. The COG can also convert two separate input events into a single or complementary PWM output. The COG PWM frequency and duty cycle are determined by a rising event input and a falling event input. The rising event and falling event may be the same source. Sources may be synchronous or asynchronous to the COG_clock. The rate at which the rising event occurs determines the PWM frequency. The time from the rising event input to the falling event input determines the duty cycle. A selectable clock input is used to generate the phase delay, blanking and dead-band times. A simplified block diagram of the COG is shown in Figure 11-1. The COG module has the following features: • • • • • • • • Selectable clock source Selectable rising event source Selectable falling event source Selectable edge or level event sensitivity Independent output enables Independent output polarity selection Phase delay Dead-band control with independent rising and falling event dead-band times • Blanking control with independent rising and falling event blanking times • Auto-shutdown control with: - Selectable shutdown sources - Auto-restart enable - Auto-shutdown pin override control 11.1 Fundamental Operation The COG generates a two output complementary PWM waveform from rising and falling event sources. In the simplest configuration, the rising and falling event sources are the same signal, which is a PWM signal with the desired period and duty cycle. The COG converts this single PWM input into a dual complementary PWM output. The frequency and duty cycle of the dual PWM output match those of the single input PWM signal. The off-to-on transition of each output can be delayed from the on-to-off transition of the other output, thereby, creating a time immediately after the PWM transition where neither output is driven. This is referred to as dead time and is covered in Section 11.5 “Dead-Band Control”. A typical operating waveform, with dead band, generated from a single CCP1 input is shown in Figure 11-2. The COG can also generate a PWM waveform from a periodic rising event and a separate falling event. In this case, the falling event is usually derived from analog feedback within the external PWM driver circuit. In this configuration, high-power switching transients may trigger a false falling event that needs to be blanked out. The COG can be configured to blank falling (and rising) event inputs for a period of time immediately following the rising (and falling) event drive output. This is referred to as input blanking and is covered in Section 11.6 “Blanking Control”. It may be necessary to guard against the possibility of circuit faults. In this case, the active drive must be terminated before the Fault condition causes damage. This is referred to as auto-shutdown and is covered in Section 11.8 “Auto-Shutdown Control”. A feedback falling event arriving too late or not at all can be terminated with auto-shutdown or by using one of the event inputs that is logically or’d with the hardware limit timer (HLT). See Section 9.0 “Hardware Limit Timer (HLT) Module” for more information about the HLT. The COG can be configured to operate in phase delayed conjunction with another PWM. The active drive cycle is delayed from the rising event by a phase delay timer. Phase delay is covered in more detail in Section 11.7 “Phase Delay”. A typical operating waveform, with phase delay and dead band, generated from a single CCP1 input is shown in Figure 11-3. DS40001576D-page 74  2011-2015 Microchip Technology Inc.  2011-2015 Microchip Technology Inc. FIGURE 11-1: SIMPLIFIED COG BLOCK DIAGRAM HFINTOSC 10 Fosc/4 Fosc 01 00 COG_clock GxCS HLTimer1 or COGxFLT HLTimer1 or CCP1 HLTimer1 or C2OUT HLTimer1 or C1OUT COGxFLT CCP1 C2OUT C1OUT 7 6 5 4 3 2 1 0 HLTimer1 or COGxFLT HLTimer1 or CCP1 HLTimer1 or C2OUT HLTimer1 or C1OUT COGxFLT CCP1 C2OUT C1OUT Phase Delay Rising event source 7 6 5 4 3 2 1 0 GxFS0 Write GxASDE High Reset Dominates 1 COG1OUT0 0 GxPOL0 0 R Q GxRSIM GxOE1 GxDBF Dead Band Cnt/R = Falling event source GxOUT1SS 1 Blanking = Cnt/R 0 GxBLKR GxFSIM Auto-shutdown source S Q GxARSEN GxEN Write GxASDE Low R Set Dominates 1 COG1OUT1 0 GxPOL1 S D Q GxASDE DS40001576D-page 75 PIC12F752/HV752 COGxFLT GxASDSFLT C1OUT GxASDSC1 C2OUT GxASDSC2 HLTimer1 output GxASDSHLT 1 Dead Band Cnt/R = GxOE0 GxOUT0SS S Q Blanking = Cnt/R GxBLKF GxRS0 GxDBR GxPH PIC12F752/HV752 FIGURE 11-2: TYPICAL COG OPERATION WITH CCP1 COG_clock Source CCP1 COGxOUT0 Rising Source Dead Band Falling Source Dead Band Falling Source Dead Band COGxOUT1 FIGURE 11-3: COG OPERATION WITH CCP1 AND PHASE DELAY COG_clock Source CCP1 COGxOUT0 Rising Source Dead Band Falling Source Dead Band Phase Delay Falling Source Dead Band COGxOUT1 11.2 Clock Sources The COG_clock is used as the reference clock to the various timers in the peripheral. Timers that use the COG_clock include: • Rising and falling dead-band time • Rising and falling blanking time • Rising event phase delay Clock sources available for selection include: • 8 MHz HFINTOSC • Instruction clock (Fosc/4) • System clock (Fosc) The clock source is selected with the GxCS bits of the COGxCON0 register (Register 11-1). DS40001576D-page 76 11.3 Selectable Event Sources The COG uses two independently selectable event sources to generate the complementary waveform: • Rising event source • Falling event source Level or edge sensitive modes are available for each event input. The rising event source is selected with the GxRS bits and the mode is controlled with the GxRSIM bit. The falling event source is selected with the GxFS bits and the mode is controlled with the GxFSIM bit. Selection and mode control bits for both sources are located in the COGxCON1 register (Register 11-2).  2011-2015 Microchip Technology Inc. PIC12F752/HV752 11.3.1 EDGE VS. LEVEL SENSING Event input detection may be selected as level or edge sensitive. In general, events that are driven from a periodic source should be edge detected and events that are derived from voltage thresholds at the target circuit should be level sensitive. Consider the following two examples: 1. The first example is an application in which the period is determined by a 50% duty cycle clock and the COG output duty cycle is determined by a voltage level fed back through a comparator. If the clock input is level sensitive, then duty cycles less than 50% will exhibit erratic operation. 2. The second example is similar to the first except that the duty cycle is close to 100%. The feedback comparator high-to-low transition trips the COG drive off but almost immediately the period source turns the drive back on. If the off cycle is short enough then the comparator input may not reach the low side of the hysteresis band precluding an output change. The comparator output stays low and without a high-to-low transition to trigger the edge sense then the drive of the COG output will be stuck in a constant drive-on condition. See Figure 11-4 FIGURE 11-4: Rising (CCP1) EDGE VS LEVEL SENSE Level Sensitive 11.3.2 RISING EVENT The rising event starts the PWM output active duty cycle period. The rising event is the low-to-high transition of the selected rising event source. When the phase delay and rising event dead-band time values are zero, the COGxOUT0 output starts immediately. Otherwise, the COGxOUT0 output is delayed. The rising event causes all the following actions: • • • • • Start rising event phase delay counter (if enabled) Clear COGxOUT1 after phase delay Start falling event input blanking (if enabled) Start dead-band counter (if enabled) Set COGxOUT0 output after dead-band counter expires 11.3.3 FALLING EVENT The falling event terminates the PWM output active duty cycle period. The falling event is the high-to-low transition of the selected falling event source. When the falling event dead-band time value is zero, the COGxOUT1 output starts immediately. Otherwise, the COGxOUT1 output is delayed. The falling event causes all the following actions: • • • • Clear COGxOUT0 Start rising event input blanking (if enabled) Start falling event dead-band counter (if enabled) Set COGxOUT1 output after dead-band counter expires Falling (C1OUT) C1In- hyst COGOUT Edge Sensitive Rising (CCP1) Falling (C1OUT) C1In- hyst COGOUT  2011-2015 Microchip Technology Inc. DS40001576D-page 77 PIC12F752/HV752 11.4 Output Control Immediately after the COG module is enabled, the complementary drive is configured with COGxOUT0 drive cleared and COGxOUT1 drive active. 11.4.1 OUTPUT ENABLES Each COG output pin has individual output enable controls. Output enables are selected with the GxOE0 and GxOE1 bits of the COGxCON0 register. When an output enable control is cleared, the module asserts no control over the pin. When an output enable is set, the override value or active PWM waveform is applied to the pin per the port priority selection. The output pin enables are independent of the module enable bit, GxEN. When GxEN is cleared, the shutdown override levels are present on the COG output pins for which the output enables are active. 11.4.2 POLARITY CONTROL The polarity of each COG output can be selected independently. When the output polarity bit is set, the corresponding output is active low. Clearing the output polarity bit configures the corresponding output as active high. However, polarity does not affect the override levels. Output polarity is selected with the GxPOL0 and GxPOL1 bits of the COGxCON0 register. 11.5 Dead-Band Control The dead-band control provides for non-overlapping PWM output signals to prevent shoot through current in the external power switches. The COG contains two 4-bit dead-band counters. One dead-band counter is used for rising event dead-band control. The other is used for falling event dead-band control. Dead band is timed by counting COG_clock periods from zero up to the value in the dead-band count register. Use Equation 11-1 to calculate dead-band times. 11.5.1 RISING EVENT DEAD BAND Rising event dead band delays the turn-on of COGxOUT0 from when COGxOUT1 is turned off. The rising event dead-band time starts when the rising event output goes true. The rising event output into the dead-band counter may be delayed by the phase delay. When the phase delay time is zero, the rising event output goes true coincident with the unblanked rising input event. When the phase delay time is not zero, the rising event output goes true at the completion of the phase delay time. The rising event dead-band time is set by the value contained in the GxDBR bits of the COGxDB register. When the value is zero, rising event dead band is disabled. 11.5.2 FALLING EVENT DEAD BAND Falling event dead band delays the turn-on of COGxOUT1 from when COGxOUT0 is turned off. The falling event dead-band time starts when the falling event output goes true. The falling event output goes true coincident with the unblanked falling input event. The falling event dead-band time is set by the value contained in the GxDBF bits of the COGxDB register. When the value is zero, falling event dead band is disabled. 11.5.3 DEAD-BAND TIME UNCERTAINTY When the rising and falling events that trigger the dead-band counters come from asynchronous inputs, it creates uncertainty in the dead-band time. The maximum uncertainty is equal to one COG_clock period. Refer to Equation 11-1 for more detail. DS40001576D-page 78  2011-2015 Microchip Technology Inc. PIC12F752/HV752 11.5.4 DEAD-BAND OVERLAP There are two cases of dead-band overlap: • Rising-to-falling • Falling-to-rising 11.5.4.1 Rising-to-Falling Overlap In this case, the falling event occurs while the rising event dead-band counter is still counting. When this happens, the COGxOUT0 drive is suppressed and the dead band extends by the falling event dead-band time. At the termination of the extended dead-band time, the COGxOUT1 drive goes true. 11.5.4.2 Falling-to-Rising Overlap In this case, the rising event occurs while the falling event dead-band counter is still counting. When this happens, the COGxOUT1 drive is suppressed and the dead band extends by the rising event dead-band time. At the termination of the extended dead-band time, the COGxOUT0 drive goes true. 11.6 11.6.2 FALLING EVENT INPUT BLANKING The rising event blanking counter inhibits the falling input from triggering a falling event. The rising event blanking time starts when the falling event output drive goes false. The rising event blanking time is set by the value contained in the GxBLKR bits of the COGxBLK register. When the GxBLKR value is ‘0’, rising event blanking is disabled and the blanking counter output is true, thereby, allowing the event signal to pass straight through to the event trigger circuit. 11.6.3 BLANKING TIME UNCERTAINTY When the rising and falling events that trigger the blanking counters are asynchronous to the COG_clock, it creates uncertainty in the blanking time. The maximum uncertainty is equal to one COG_clock period. Refer to Equation 11-1 and Example 11-1 for more detail. Blanking Control Input blanking is a function whereby the event inputs can be masked or blanked for a short period of time. This is to prevent electrical transients caused by the turn-on/off of power components from generating a false input event. The COG contains two 4-bit blanking counters. The counters are cross coupled with the events they are blanking. The falling event blanking counter is used to blank rising input events and the rising event blanking counter is used to blank falling input events. Once started, blanking extends for the time specified by the corresponding blanking counter. Blanking is timed by counting COG_clock periods from zero up to the value in the blanking count register. Use Equation 11-1 to calculate blanking times. 11.6.1 RISING EVENT INPUT BLANKING The falling event blanking counter inhibits the rising input from triggering a rising event. The falling event blanking time starts when the rising event output drive goes false. The falling event blanking time is set by the value contained in the GxBLKF bits of the COGxBLK register. Blanking times are calculated using the formula shown in Equation 11-1. When the GxBLKF value is ‘0’, falling event blanking is disabled and the blanking counter output is true, thereby, allowing the event signal to pass straight through to the event trigger circuit.  2011-2015 Microchip Technology Inc. DS40001576D-page 79 PIC12F752/HV752 11.7 EXAMPLE 11-1: Phase Delay It is possible to delay the assertion of the rising event. This is accomplished by placing a non-zero value in COGxPH register. Refer to Register 11-6 and Figure 11-3 for COG operation with CCP1 and phase delay. The delay from the input rising event signal switching to the actual assertion of the events is calculated the same as the dead-band and blanking delays. Please see Equation 11-1. When the COGxPH value is ‘0’, phase delay is disabled and the phase delay counter output is true, thereby, allowing the event signal to pass straight through to complementary output driver flop. 11.7.1 CUMULATIVE UNCERTAINTY It is not possible to create more than one COG_clock of uncertainty by successive stages. Consider that the phase delay stage comes after the blanking stage, the dead-band stage comes after either the blanking or phase delay stages, and the blanking stage comes after the dead-band stage. When the preceding stage is enabled, the output of that stage is necessarily synchronous with the COG_clock, which removes any possibility of uncertainty in the succeeding stage. EQUATION 11-1: PHASE, DEAD-BAND, AND BLANKING TIME CALCULATION T min = Count TIMER UNCERTAINTY Given: Count = Ah = 10d F COG_Clock = 8MHz Therefore: 1 T uncertainty = -------------------------F COG_clock 1 = --------------- = 125ns 8MHz Proof: Count T min = -------------------------F COG_clock = 125ns  10d = 1.25s Count + 1 T max = -------------------------F COG_clock = 125ns   10d + 1  = 1.375s Therefore: T uncertainty = T max – T min = 1.375s – 1.25s = 125ns F COG_clock Count + 1 T max = -------------------------F COG_clock T uncertainty = T max – T min Also: 1 T uncertainty = -------------------------F COG_clock Where: T Count Phase Delay GxPH Rising Dead Band GxDBR Falling Dead Band GxDBF Rising Event Blanking GxBLKR Falling Event Blanking GxBLKF DS40001576D-page 80  2011-2015 Microchip Technology Inc. PIC12F752/HV752 11.8 Auto-Shutdown Control Auto-shutdown is a method to immediately override the COG output levels with specific overrides that allow for safe shutdown of the circuit. The shutdown state can be either cleared automatically or held until cleared by software. 11.8.1 SHUTDOWN The shutdown state can be entered by either of the following two mechanisms: • Software generated • External Input 11.8.1.1 Software Generated Shutdown Setting the GxASDE bit of the COGxASD register will force the COG into the shutdown state. When auto-restart is disabled, the shutdown state will persist as long as the GxASDE bit is set. When auto-restart is enabled, the GxASDE bit will clear automatically and resume operation on the next rising event. See Figure 11-5. 11.8.1.2 External Shutdown Source External shutdown inputs provide the fastest way to safely suspend COG operation in the event of a fault condition. When any of the selected shutdown inputs goes true, the output drive latches are reset and the COG outputs will immediately go to the selected override levels without software delay. Any combination of four input sources can be selected to cause a shutdown condition. The four sources include: • • • • HLTimer1 output C2OUT (low true) C1OUT (low true) COG1FLT pin (low true) 11.8.2 PIN OVERRIDE LEVELS The levels driven to the output pins, while the shutdown input is true, are controlled by the GxASDL0 and GxASDL1 bits of the COGxASD register (Register 11-3). GxASDL0 controls the GxOUT0 override level and GxASDL1 controls the GxOUT1 override level. The control bit logic level corresponds to the output logic drive level while in the shutdown state. Note: 11.8.3 The polarity control does not apply to the override level. AUTO-SHUTDOWN RESTART After an auto-shutdown event has occurred, there are two ways to have the module resume operation: • Software controlled • Auto-restart The restart method is selected with the GxARSEN bit of the COGxASD register. Waveforms of a software controlled automatic restart are shown in Figure 11-5. 11.8.3.1 Software Controlled Restart When the GxARSEN bit of the COGxASD register is cleared, the COG must be restarted after an auto-shutdown event by software. The COG will resume operation on the first rising event after the GxASDE bit is cleared. Clearing the shutdown state requires all selected shutdown inputs to be false, otherwise, the GxASDE bit will remain set. 11.8.3.2 Auto-Restart When the GxARSEN bit of the COGxASD register is set, then the COG will restart from the auto-shutdown state automatically. The GxASDE bit will clear automatically and the COG will resume operation on the first rising event after all selected shutdown inputs go false. Shutdown inputs are selected independently with bits of the COGxASD register (Register 11-3). Note: Shutdown inputs are level sensitive, not edge sensitive. The shutdown state cannot be cleared as long as the shutdown input level persists, except by disabling auto-shutdown,  2011-2015 Microchip Technology Inc. DS40001576D-page 81 DS40001576D-page 82 Operating State COGxOUT1 COGxOUT0 GxASDL1 GxASDL0 GxASDE Shutdown input NORMAL OUTPUT NORMAL OUTPUT Next rising event 3 SOFTWARE CONTROLLED RESTART SHUTDOWN Cleared in software 2 SHUTDOWN Cleared in hardware 4 AUTO-RESTART NORMAL OUTPUT Next rising event 5 FIGURE 11-5: GxARSEN CCP1 1 PIC12F752/HV752 AUTO-SHUTDOWN WAVEFORM – CCP1 AS RISING AND FALLING EVENT INPUT SOURCE  2011-2015 Microchip Technology Inc. PIC12F752/HV752 11.9 Buffer Updates Changes to the phase, dead band, and blanking count registers need to occur simultaneously during COG operation to avoid unintended operation that may occur as a result of delays between each register write. This is accomplished with the GxLD bit of the COGxCON0 register and double buffering of the phase, blanking, and dead-band count registers. Before the COG module is enabled, writing the count registers loads the count buffers without need of the GxLD bit. However, when the COG is enabled, the count buffers updates are suspended after writing the count registers until after the GxLD bit is set. When the GxLD bit is set, the phase, dead band and blanking register values are transferred to the corresponding buffers synchronous with COG operation. The GxLD bit is cleared by hardware to indicate that the transfer is complete. 11.10 Alternate Pin Selection The COGxOUT0, COGxOUT1 and COGxFLT functions can be directed to alternate pins with control bits of the APFCON register. Refer to Register 5-1. Note: 11.12 Configuring the COG The following steps illustrate how to properly configure the COG to ensure a synchronous start with the rising event input: 1. 2. 3. 4. 5. 6. 7. 8. The default COG outputs have high drive strength capability, whereas the alternate outputs do not. 11.11 Operation During Sleep The COG continues to operate in Sleep provided that the COG_clock, rising event and falling event sources remain active. 9. The HFINTSOC remains active during Sleep when the COG is enabled and the HFINTOSC is selected as the COG_clock source. 10. 11. 12. 13.  2011-2015 Microchip Technology Inc. Configure the desired COGxFLT input, COGxOUT0 and COGxOUT1 pins with the corresponding bits in the APFCON register. Clear all ANSELA register bits associated with pins that are used for COG functions. Ensure that the TRIS control bits corresponding to COGxOUT0 and COGxOUT1 are set so that both are configured as inputs. These will be set as outputs later. Clear the GxEN bit, if not already cleared. Set desired dead-band times with the COGxDB register. Set desired blanking times with the COGxBLK register. Set desired phase delay with the COGxPH register. Setup the following controls in COGxASD auto-shutdown register: • Select desired shutdown sources. • Select both output overrides to the desired levels (this is necessary, even if not using auto-shutdown because start-up will be from a shutdown state). • Set the GxASDE bit and clear the GxARSEN bit. Select the desired rising and falling event sources and input modes with the COGxCON1 register. Configure the following controls in COGxCON0 register: • Select the desired clock source • Select the desired output polarities • Set the output enables of the outputs to be used. Set the GxEN bit. Clear TRIS control bits corresponding to COGxOUT0 and COGxOUT1 to be used thereby configuring those pins as outputs. If auto-restart is to be used, set the GxARSEN bit and the GxASDE will be cleared automatically. Otherwise, clear the GxASDE bit to start the COG. DS40001576D-page 83 PIC12F752/HV752 11.13 COG Control Registers REGISTER 11-1: COGxCON0: COG CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 GxEN GxOE1 GxOE0 GxPOL1 GxPOL0 GxLD R/W-0/0 bit 7 R/W-0/0 GxCS bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxEN: COGx Enable bit 1 = Module is enabled 0 = Module is disabled bit 6 GxOE1: COGxOUT1 Output Enable bit 1 = COGxOUT1 is available on associated I/O pin 0 = COGxOUT1 is not available on associated I/O pin bit 5 GxOE0: COGxOUT0 Output Enable bit 1 = COGxOUT0 is available on associated I/O pin 0 = COGxOUT0 is not available on associated I/O pin bit 4 GxPOL1: COGxOUT1 Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 3 GxPOL0: COGxOUT0 Output Polarity bit 1 = Output is inverted polarity 0 = Output is normal polarity bit 2 GxLD: COGx Load Buffers bit 1 = Phase, blanking, and dead-band buffers to be loaded with register values on next input events 0 = Register to buffer transfer is complete bit 1-0 GxCS: COGx Clock Source Select bits 11 = Reserved 10 = 8 MHz HFINTOSC clock 01 = Instruction clock (Fosc/4) 00 = System clock (Fosc) DS40001576D-page 84  2011-2015 Microchip Technology Inc. PIC12F752/HV752 REGISTER 11-2: COGxCON1: COG CONTROL REGISTER 1 R/W-0/0 R/W-0/0 GxFSIM GxRSIM R/W-0/0 R/W-0/0 R/W-0/0 GxFS R/W-0/0 R/W-0/0 R/W-0/0 GxRS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxFSIM: COGx Falling Source Input Mode bit 1 = Input is edge sensitive 0 = Input is level sensitive bit 6 GxRSIM: COGx Rising Source Input Mode bit 1 = Input is edge sensitive 0 = Input is level sensitive bit 5-3 GxFS: COGx Falling Source Select bits 111 = COGxFLT or HLTimer1 110 = CCP1 or HLTimer1 101 = C2OUT or HLTimer1 100 = C1OUT or HLTimer1 011 = COGxFLT 010 = CCP1 001 = C2OUT 000 = C1OUT bit 2-0 GxRS: COGx Rising Source Select bits 111 = COGxFLT or HLTimer1 110 = CCP1 or HLTimer1 101 = C2OUT or HLTimer1 100 = C1OUT or HLTimer1 011 = COGxFLT 010 = CCP1 001 = C2OUT 000 = C1OUT  2011-2015 Microchip Technology Inc. DS40001576D-page 85 PIC12F752/HV752 REGISTER 11-3: COGxASD: COG AUTO-SHUTDOWN CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 GxASDE GxARSEN GxASDL1 GxASDL0 GxASDSHLT GxASDSC2 GxASDSC1 GxASDSFLT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 GxASDE: Auto-Shutdown Event Status bit 1 = COG is in the shutdown state 0 = COG is not in the shutdown state bit 6 GxARSEN: Auto-Restart Enable bit 1 = Auto-restart is enabled 0 = Auto-restart is disabled bit 5 GxASDL1: COGxOUT1 Auto-shutdown Override Level bit 1 = A logic ‘1’ is placed on COGxOUT1 when a shutdown input is true 0 = A logic ‘0’ is placed on COGxOUT1 when a shutdown input is true bit 4 GxASDL0: COGxOUT0 Auto-shutdown Override Level bit 1 = A logic ‘1’ is placed on COGxOUT0 when a shutdown input is true 0 = A logic ‘0’ is placed on COGxOUT0 when a shutdown input is true bit 3 GxASDSHLT: COG Auto-shutdown Source Enable bit 3 1 = COG is shutdown when HLTMR equals HLTPR is low 0 = HLTimer1 pin has no effect on shutdown bit 2 GxASDSC2: COG Auto-shutdown Source Enable bit 2 1 = COG is shutdown when C2OUT is low 0 = C2OUT pin has no effect on shutdown bit 1 GxASDSC1: COG Auto-shutdown Source Enable bit 1 1 = COG is shutdown when C1OUT is low 0 = C1OUT pin has no effect on shutdown bit 0 GxASDSFLT: COG Auto-shutdown Source Enable bit 0 1 = COG is shutdown when COGxFLT pin is low 0 = COGxFLT pin has no effect on shutdown DS40001576D-page 86  2011-2015 Microchip Technology Inc. PIC12F752/HV752 REGISTER 11-4: R/W-x/u COGxDB: COG DEAD-BAND COUNT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u GxDBR R/W-x/u R/W-x/u GxDBF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-4 GxDBR: Rising Event Dead-band Count Value bits Number of COG clock periods to delay primary output after rising event input bit 3-0 GxDBF: Falling Event Dead-band Count Value bits Number of COG clock periods to delay complementary output after falling event input REGISTER 11-5: R/W-x/u COGxBLK: COG BLANKING COUNT REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u GxBLKR R/W-x/u R/W-x/u R/W-x/u GxBLKF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-4 GxBLKR: Rising Event Blanking Count Value bits Number of COGx clock periods to inhibit falling event input bit 3-0 GxBLKF: Falling Event Blanking Count Value bits Number of COGx clock periods to inhibit rising event input REGISTER 11-6: COGxPH: COG PHASE COUNT REGISTER U-0 U-0 U-0 U-0 — — — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u GxPH bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-4 Unimplemented: Read as ‘0’ bit 3-0 GxPH: Rising Event Phase Delay Count Value bits Number of COG clock periods to delay rising edge event  2011-2015 Microchip Technology Inc. DS40001576D-page 87 PIC12F752/HV752 TABLE 11-1: SUMMARY OF REGISTERS ASSOCIATED WITH COG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 — ANSA2 ANSA1 ANSA0 41 APFCON — — — T1GSEL — Name COG1PH — — — — COG1FSEL COG1O1SEL COG1O0SEL 38 G1PH 87 COG1BLK G1BLKR G1BLKF 87 COG1DB G1DBR G1DBF 87 COG1CON0 G1EN COG1CON1 G1FSIM COG1ASD G1OE1 G1OE0 G1RSIM G1POL1 G1POL0 G1LD G1FS G1CS1 G1CS0 G1RS G1ASDE G1ARSEN G1ASDL1 G1ASDL0 G1ASDSHLT G1ASDSC2 84 85 G1ASDSC1 G1ASDSFLT 86 T0IF INTF IOCIF 15 GIE PEIE T0IE INTE IOCIE LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 40 PIE2 — — C2IE C1IE — COG1IE — CCP1IE 17 PIR2 — — C2IF C1IF — COG1IF — CCP1IF 19 — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 40 INTCON TRISA Legend: Note 1: 2: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by COG. Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. See Configuration Word register (Register 17-1) for operation of all register bits. DS40001576D-page 88  2011-2015 Microchip Technology Inc. PIC12F752/HV752 12.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESL and ADRESH). The ADC voltage reference is software selectable to either VDD or a voltage applied to the external reference pins. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Figure 12-1 shows the block diagram of the ADC. Note: The ADRESL and ADRESH registers are read-only. FIGURE 12-1: ADC BLOCK DIAGRAM VDD VCFG = 0 VREF+ AN0 0000 AN1/VREF+ 0001 AN2 0010 AN3 0011 VCFG = 1 A/D 10 GO/DONE dac_ref 1110 fvr_ref 1111 ADFM 0 = Left Justify 1 = Right Justify ADON CHS  2011-2015 Microchip Technology Inc. 10 Vss ADRESH ADRESL DS40001576D-page 89 PIC12F752/HV752 12.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • • • • • • Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Results formatting 12.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. See the corresponding port section for more information. Note: 12.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. 12.1.4 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are seven possible clock options: • • • • • • • FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 12-2. For correct conversion, the appropriate TAD specification must be met. See A/D conversion requirements in Section 20.0 “Electrical Specifications” for more information. Table 12-1 gives examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. When changing channels, a delay is required before starting the next conversion. Refer to Section 12.2 “ADC Operation” for more information. 12.1.3 ADC VOLTAGE REFERENCE The VCFG bit of the ADCON0 register provides control of the positive voltage reference. The positive voltage reference can be either VDD or an external voltage source. The negative voltage reference is always connected to the ground reference. DS40001576D-page 90  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 12-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V) ADC Clock Period (TAD) ADC Clock Source Device Frequency (FOSC) ADCS FOSC/2 20 MHz 000 100 ns (2) (2) 8 MHz 4 MHz 250 ns (2) 500 ns 500 ns (2) 1.0 s (2) (2) 1 MHz 2.0 s 4.0 s FOSC/4 100 200 ns FOSC/8 001 400 ns(2) 1.0 s(2) 2.0 s 8.0 s(3) FOSC/16 101 800 ns(2) 2.0 s 4.0 s 16.0 s(3) FOSC/32 010 1.6 s 4.0 s FOSC/64 110 3.2 s 8.0 s(3) FRC Legend: Note 1: 2: 3: 4: 2-6 s 2-6 s (1,4) x11 8.0 s 32.0 s(3) 16.0 s(3) 64.0 s(3) 2-6 s 2-6 s(1,4) (3) (1,4) (1,4) Shaded cells are outside of recommended range. The FRC source has a typical TAD time of 4 s for VDD > 3.0V. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the conversion will be performed during Sleep. FIGURE 12-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY to TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 Conversion Starts Holding Capacitor is Disconnected from Analog Input (typically 100 ns) Set GO/DONE bit 12.1.5 ADRESH and ADRESL registers are loaded, GO bit is cleared, ADIF bit is set, Holding capacitor is connected to analog input INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC interrupt flag is the ADIF bit in the PIR1 register. The ADC interrupt enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. Note: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the global interrupt must be disabled. If the global interrupt is enabled, execution will switch to the Interrupt Service Routine.  2011-2015 Microchip Technology Inc. DS40001576D-page 91 PIC12F752/HV752 12.1.6 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON0 register controls the output format. Figure 12-4 shows the two output formats. FIGURE 12-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB bit 7 bit 0 bit 7 10-bit A/D Result Unimplemented: Read as ‘0’ MSB (ADFM = 1) bit 7 LSB bit 0 Unimplemented: Read as ‘0’ 12.2 12.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 12.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 12.2.6 “A/D Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF flag bit • Update the ADRESH:ADRESL registers with new conversion result 12.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, a 2 TAD delay is required before another acquisition can be initiated. Following this delay, an input acquisition is automatically started on the selected channel. Note: bit 0 bit 7 bit 0 10-bit A/D Result 12.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 12.2.5 SPECIAL EVENT TRIGGER The CCP Special Event Trigger allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. Section 10.0 “Capture/Compare/PWM See Modules” for more information. A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. DS40001576D-page 92  2011-2015 Microchip Technology Inc. PIC12F752/HV752 12.2.6 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: • Disable pin output driver (See TRIS register) • Configure pin as analog Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Select result format • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2) Start conversion by setting the GO/DONE bit Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result Clear the ADC interrupt flag (required if interrupt is enabled) EXAMPLE 12-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Vdd reference, Frc clock ;and RA0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ADCON1 ; MOVLW B’01110000’ ;ADC Frc clock, IORWF ADCON1 ; and RA0 as analog BANKSEL ADCON0 ; MOVLW B’10000001’ ;Right justify, MOVWF ADCON0 ;Vdd Vref, AN0, On CALL SampleTime ;Acquisiton delay BSF ADCON0,GO ;Start conversion TEST AGAIN BTFSC ADCON0,GO ;Is conversion done? GOTO TEST AGAIN ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;Store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: See Section 12.4 “A/D Acquisition Requirements”.  2011-2015 Microchip Technology Inc. DS40001576D-page 93 PIC12F752/HV752 12.3 ADC Control Registers REGISTER 12-1: ADCON0: A/D CONTROL REGISTER 0 R/W-0 R/W-0 ADFM VCFG R/W-0 R/W-0 R/W-0 R/W-0 CHS R/W-0 R/W-0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Conversion Result Format Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5-2 CHS: Analog Channel Select bits 0000 = Channel 00 (AN0) 0001 = Channel 01 (AN1) 0010 = Channel 02 (AN2) 0011 = Channel 03 (AN3) 0100 = Reserved. Do not use. • • • 1101 = Reserved. Do not use. 1110 = Digital-to-Analog Converter (DAC output) 1111 = Fixed Voltage Reference (FVR) bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current DS40001576D-page 94  2011-2015 Microchip Technology Inc. PIC12F752/HV752 REGISTER 12-2: U-0 ADCON1: A/D CONTROL REGISTER 1 R/W-0/0 — R/W-0/0 R/W-0/0 ADCS U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-4 ADCS: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 011 = FRC (clock supplied from an internal oscillator with a divisor of 16) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 bit 3-0 Unimplemented: Read as ‘0’  2011-2015 Microchip Technology Inc. DS40001576D-page 95 PIC12F752/HV752 REGISTER 12-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 (READ-ONLY) R-x R-x R-x R-x R-x R-x R-x R-x ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown ADRES: ADC Result Register bits Upper eight bits of 10-bit conversion result REGISTER 12-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY) R-x R-x ADRES U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES: ADC Result Register bits Lower two bits of 10-bit conversion result bit 5-0 Unimplemented: Read as ‘0’ REGISTER 12-5: x = Bit is unknown ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY) U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — R-x R-x ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 ADRES: ADC Result Register bits Upper two bits of 10-bit conversion result REGISTER 12-6: R-x x = Bit is unknown ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY) R-x R-x R-x R-x R-x R-x R-x ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 x = Bit is unknown ADRES: ADC Result Register bits Lower eight bits of 10-bit conversion result DS40001576D-page 96  2011-2015 Microchip Technology Inc. PIC12F752/HV752 12.4 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 12-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 12-4. The maximum recommended impedance for analog sources is 10 k. As the source impedance is decreased, the acquisition time may be decreased. EQUATION 12-1: After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 12-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50°C and external impedance of 10k  5.0V V DD Assumptions: T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2µs + T C +   Temperature - 25°C   0.05µs/°C   The value for TC can be approximated with the following equations: 1 V AP PLIE D  1 – ------------ = V CHOLD 2047 ;[1] VCHOLD charged to within 1/2 lsb –TC ----------  RC V AP P LI ED  1 – e  = V CHOLD   ;[2] VCHOLD charge response to VAPPLIED – Tc ---------  RC 1 V AP P LIED  1 – e  = V A P PLIE D  1 – ------------ 2047   ;combining [1] and [2] Solving for TC: T C = – C HOLD  R IC + R SS + R S  ln(1/2047) = – 10pF  1k  + 7k  + 10k   ln(0.0004885) = 1.37 µs Therefore: T ACQ = 2µs + 1.37µs +   50°C- 25°C   0.05µs/°C   = 4.67µs Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification.  2011-2015 Microchip Technology Inc. DS40001576D-page 97 PIC12F752/HV752 FIGURE 12-4: ANALOG INPUT MODEL VDD ANx Rs Cpin 5 pF VA Vt = 0.6V Vt = 0.6V Ric  1k Sampling Switch SS Rss I leakage ± 500 nA Chold = 10 pF Vss/VREF- Legend: Cpin = Input Capacitance Vt = Threshold Voltage I leakage = Leakage current at the pin due to various junctions Ric = Interconnect Resistance SS = Sampling Switch Chold = Sample/Hold Capacitance FIGURE 12-5: 6V 5V VDD 4V 3V 2V Rss 5 6 7 8 9 10 11 Sampling Switch (k) ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 1 LSB ideal 3FBh Full-Scale Transition 004h 003h 002h 001h 000h Analog Input Voltage 1 LSB ideal VSS/VREF- DS40001576D-page 98 Zero-Scale Transition VDD/VREF+  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 12-2: Name SUMMARY OF ASSOCIATED ADC REGISTERS Bit 7 Bit 6 ADCON0 ADFM VCFG ADCON1 — ANSELA — Bit 5 — ANSA5 A/D Result Register High Byte ADRESL(2) A/D Result Register Low Byte INTCON Bit 3 Bit 2 CHS ADCS ADRESH(2) PORTA Bit 4 ANSA4 Bit 1 Bit 0 Register on Page GO/DONE ADON 94 — — — — 94 — ANSA2 ANSA1 ANSA0 41 96* 94* — — RA5 RA4 RA3 RA2 RA1 RA0 40 GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 PIE1 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 16 PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF 18 — — TRISA5 TRISA4 TRISA3(1) TRISA2 TRISA1 TRISA0 40 TRISA Legend: Note 1: 2: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module. * Page provides register information. TRISA3 always reads ‘1’. Read-only register.  2011-2015 Microchip Technology Inc. DS40001576D-page 99 PIC12F752/HV752 13.0 FIXED VOLTAGE REFERENCE (FVR) 13.2 When the Fixed Voltage Reference module is enabled, it requires time for the reference circuit to stabilize. Once the circuit stabilizes and is ready for use, the FVRRDY bit of the FVRCON register will be set. See Section 20.0 “Electrical Specifications” for the minimum delay requirement. The Fixed Voltage Reference (FVR) is a stable voltage reference, independent of VDD, with 1.2V output level. The output of the FVR can be configured to supply a reference voltage to the following: • • • • FVR Stabilization Period ADC input channel Comparator 1 positive input (C1VP) Comparator 2 positive input (C2VP) REFOUT pin 13.3 Operation During Sleep On the PIC12F752, the FVR is enabled by setting the FVREN bit of the FVRCON register. The FVR is always enabled on the PIC12HV752 device. When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the FVRCON register are not affected. To minimize current consumption in Sleep mode, FVR the voltage reference should be disabled. 13.1 13.4 Fixed Voltage Reference Output The FVR output can be applied to the REFOUT pin by setting the FVRBUFSS and FVRBUFEN bits of the FVRCON register. The FVRBUFSS bit selects either the FVR or DAC output reference to the REFOUT pin buffer. The FVRBUFEN bit enables the output buffer to the REFOUT pin. Effects of a Reset A device Reset clears the FVRCON register. As a result: • The FVR module is disabled • The FVR voltage output is disabled on the REFOUT pin Enabling the REFOUT pin automatically overrides any digital input or output functions of the pin. Reading the REFOUT pin when it has been configured for a reference voltage output will always return a ‘0’. FIGURE 13-1: VOLTAGE REFERENCE BLOCK DIAGRAM VDD 5V Shunt Regulator VREF+ DACPSS PIC12HV752 only DACR DACRNG DACEN DAC dac_ref EN To ADC, Comparators C1 and C2. Vss dac_ref 0 fvr_ref 1 VDD x1 FVRBUFSS ref fvr_ref To ADC, Comparators C1 and C2. + REFOUT DACOUT DACOE FVRBUFEN 1.2V 12HV752 FVREN rdy EN FVRRDY VSS DS40001576D-page 100  2011-2015 Microchip Technology Inc. PIC12F752/HV752 13.5 FVR Control Registers REGISTER 13-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 FVREN FVRRDY R/W-0/0 FVRBUFEN FVRBUFSS U-0 U-0 U-0 U-0 — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 0 = Fixed Voltage Reference is disabled 1 = Fixed Voltage Reference is enabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit 0 = Fixed Voltage Reference output is not ready or not enabled bit 1 = Fixed Voltage Reference output is ready for use bit 5 FVRBUFEN: Voltage Reference Output Pin Buffer Enable 0 = Output buffer is disabled 1 = Output buffer is enabled bit 4 FVRBUFSS: Voltage Reference Pin Buffer Source Select bit 0 = Bandgap (1.2V) is the input to the output voltage buffer 1 = dac_out is the input to the output voltage buffer bit 3-0 Unimplemented: Read as ‘0’ TABLE 13-1: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE Bit 7 Bit 6 FVREN FVRRDY Bit 5 Bit 4 FVRBUFEN FVRBUFSS Bit 3 Bit 2 Bit 1 Bit 0 Register on page — — — — 101 Shaded cells are not used with the Fixed Voltage Reference.  2011-2015 Microchip Technology Inc. DS40001576D-page 101 PIC12F752/HV752 14.0 DIGITAL-TO-ANALOG CONVERTER (DAC) MODULE The 5-bit, dual range Digital-to-Analog Converter (DAC) module supplies a variable voltage reference, with 64 selectable output levels of which three levels are duplicated. The output is ratiometric with respect to the input source, VSRC+. See Figure 14-1 for a block diagram of the DAC module. The output of the DAC module provides a reference voltage to the following: • • • • Comparator positive input ADC input channel FVR input reference DACOUT pin The DAC is enabled by setting the DACEN bit of the DACCON0 register. The input of the DAC can be connected to two external voltage connections: • VDD pin • VREF+ pin FIGURE 14-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM VREF+ 1 VDD 0 VSRC+ R2(31) DACPSS 11111 DACEN R2(30) 11110 dac_ref (to Comparator, FVR FVR and ADC modules) Full Range R2(2) 00010 00001 00000 1 DACOUT 0 DACR 5 DACRNG R1(31) DACOE 11111 R2(1) R1(30) 11110 R1(16) 10000 R1(15) 01111 Limited Range R2(0) R1(1) 00001 R1(0) 00000 Note: R2 = 16*R1 DS40001576D-page 102  2011-2015 Microchip Technology Inc. PIC12F752/HV752 14.1 DAC Positive Voltage Source 14.3 The DACPSS bit of the DACCON0 register selects the positive voltage source, VSRC+. The following voltage sources are available: The DAC output value is derived using a resistor ladder with one end of the ladder tied to the positive voltage reference and the other end tied to VSS. If the voltage of the input source fluctuates, a similar fluctuation will result in the DAC output value. • VDD pin (default) • VREF+ pin The resistor values within the ladder can be found in Section 20.0 “Electrical Specifications”. DAC module can select the positive voltage source using the DACPSS bit of the DACCON0 register. The default source, DACPSS = 0, connects VDD to the positive voltage source (VSRC+). VSRC+ can be changed to the VREF+ pin by setting DACPSS = 1. 14.2 14.4 DAC Output Voltage The DAC output voltage level of the DAC is determined by the DACRNG and the DACR bits of the DACCON0 and DACCON1 registers, respectively. DAC Range Selection Use Equation 14-1 to determine the value of the DAC output voltage. Example 14-1 illustrates the calculations of the minimum, maximum and increment size of the DAC output voltage in Full Range mode. Example 14-2 illustrates the Limited Range mode of the DAC output voltage values. The DACRNG bit of the DACCON0 register selects between full-range or limited-range DAC output voltage. Each range selects the output in 32 equal steps. In Full-Range mode, the output is (31/32)*VSRC+. In Limited-Range mode, the maximum VOUT is limited to 6% of VSRC+, (31/512) * VSRC+. EQUATION 14-1: Ratiometric Output Level DAC OUTPUT VOLTAGE   DACR  4:0   V OUT =   VSRC+   ------------------------------  n    2 Note: The value of ‘n’ is determined by the DACRNG bit. When: DACRNG = 0 (Limited Range mode); n = 9; DACRNG = 1 (Full Range mode); n = 5. EXAMPLE 14-1: FULL RANGE MODE VOUT = [VSRC+ * (DACR/25)] Given: VSRC = VDD = 5V, DACRNG = 1 Minimum VOUT Calculation: DACR = 0 0000b, (0d); Maximum VOUT Calculation: DACR = 1 1111b, (31d); VOUT = [5V * (0/32)] = 0V; VOUT = [5V * (31/32)] = 4.84V; Step Increment Calculation: DACR = 0 0001b, (1d); VOUT = [5V * (1/32)] = 156 mV Full Range Mode Operation: 0V VOUT 4.84V, with 32-step increments of 156 mV. EXAMPLE 14-2: LIMITED RANGE MODE Given: VSRC = VDD = 5V, DACRNG = 0 Minimum VOUT Calculation: DACR = 0 0000b, (0d); VOUT = [VSRC+ * (DACR/29)] Maximum VOUT Calculation: DACR = 1 1111b, (31d); VOUT = [5V * (0/512)] = 0V; VOUT = [5V * (31/512)] = 303 mV; Step Increment Calculation: DACR = 0 0001b, (1d); VOUT = [5V * (1/512)] = 9.8 mV Limited Range Mode Operation: 0V VOUT 303 mV, with 32-step increments of 9.8 mV.  2011-2015 Microchip Technology Inc. DS40001576D-page 103 PIC12F752/HV752 FIGURE 14-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC® MCU DAC Module R Voltage Reference Output Impedance 14.5 + – DACOUT DAC Voltage Reference Output The DAC output (dac_ref) can be applied to the DACOUT pin as an unbuffered signal by: • Setting the DACOE bit of the DACCON0 register • Clearing the FVRBUFSS bit of the FVRCON register • Clearing the FVRBUFEN bit of the FVRCON register Figure 14-3 shows a block diagram pin configuration for the dac_ref and fvr_ref signals. This unbuffered DACOUT pin has limited current drive capability. When a higher drive current is required, an external buffer can be used on the DACOUT pin. Figure 14-2 shows an example of buffering technique. 14.6 Buffered DAC Output Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 14.7 Effects of a Reset A device Reset clears the DACCON0 and DACCON1 registers. As a result: • The DAC module is disabled • The DAC voltage output is disabled on the DACOUT pin The DAC output can also be configured to use an internal buffer by: • Setting the FVRBUFEN bit of the FVRCON register changing the pin configuration to be the REFOUT pin Enabling the DACOUT pin automatically overrides any digital input or output functions of the pin. Reading the DACOUT pin when it has been configured for DAC reference voltage output will always return a ‘0’. FIGURE 14-3: DAC/FVR OUTPUT PIN dac_ref 0 fvr_ref 1 x1 REFOUT DACOUT FVRBUFSS DACOE FVRBUFEN DS40001576D-page 104  2011-2015 Microchip Technology Inc. PIC12F752/HV752 14.8 DAC Control Registers REGISTER 14-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 U-0 DACEN DACRNG DACOE — — DACPSS — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 DACRNG: DAC Range Selection bit(1) 1 = DAC is operating in Full Range mode 0 = DAC is operating in Limited Range mode bit 5 DACOE: DAC Voltage Output Enable bit 1 = DAC reference output is enabled to the DACOUT pin(2) 0 = DAC reference output is disabled bit 4-3 Unimplemented: Read as ‘0’ bit 2 DACPSS: DAC Positive Source Select bits 0 = VDD 1 = VREF+ pin bit 1-0 Unimplemented: Read as ‘0’ Note 1: 2: Refer to Equation 14-1. The DACOUT pin configuration requires additional control bits in the FVRCON register (see Figure 14-3). REGISTER 14-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 — — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DACR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR: DAC Voltage Output Select bits 1 1111 = DAC Voltage Maximum Output    0 0000 = DAC Voltage Minimum Output Note 1: Refer to Equation 14-1 to calculate the value of the DAC Voltage Output.  2011-2015 Microchip Technology Inc. DS40001576D-page 105 PIC12F752/HV752 TABLE 14-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on page DACCON0 DACEN DACRNG DACOE — — DACPSS — — 105 DACCON1 — — — FVREN FVRRDY — — FVRCON Legend: FVRBUFEN FVRBUFSS DACR — — 105 101 — = unimplemented, read as ‘0’. Shaded cells are unused by the DAC module. DS40001576D-page 106  2011-2015 Microchip Technology Inc. PIC12F752/HV752 15.0 COMPARATOR MODULE Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: • • • • • • • • • Independent comparator control Programmable input selection Comparator output is available internally/externally Programmable output polarity Interrupt-on-change Wake-up from Sleep Programmable Speed/Power optimization PWM shutdown Programmable and fixed voltage reference 15.1 Comparator Overview FIGURE 15-1: SINGLE COMPARATOR VIN+ + VIN- – Output VINVIN+ Output Note: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. A single comparator is shown in Figure 15-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level.  2011-2015 Microchip Technology Inc. DS40001576D-page 107 PIC12F752/HV752 FIGURE 15-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM CxNCH0 CxINTP Interrupt CxON(1) det Set CxIF CXIN0- 0 CXIN1- 1 MUX CxINTN Interrupt (2) det CXPOL CxVN 0 Cx CxVP CXOUT MCXOUT Q EN Q1 CXZLF CxHYS dac_ref 1 MUX 2 fvr_ref To Data Bus 1 + 0 CXIN+ ZLF D To COG Module CxSP (2) CXSYNC 3 CxON VSS 0 CXOE TRIS bit CXOUT CXPCH D 2 (from Timer1) T1CLK Note 1: 2: Q 1 To Timer1 SYNCCXOUT When CxON = 0, the comparator will produce a ‘0’ at the output. When CxON = 0, all multiplexer inputs are disconnected. DS40001576D-page 108  2011-2015 Microchip Technology Inc. PIC12F752/HV752 15.2 Comparator Control Each comparator has two control registers: CMxCON0 and CMxCON1. The CMxCON0 registers (see Register 15-1) contain Control and Status bits for the following: • • • • • • • Enable Output selection Output pin enable Output polarity Speed/Power selection Hysteresis enable Output synchronization The CMxCON1 registers (see Register 15-2) contain Control bits for the following: • Interrupt edge polarity (rising and/or falling) • Positive input channel selection • Negative input channel selection 15.2.1 COMPARATOR OUTPUT SELECTION The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set Note 1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched.  2011-2015 Microchip Technology Inc. COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 15-1 shows the output state versus input conditions, including polarity control. TABLE 15-1: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxPOL CxOUT CxVN > CxVP 0 0 CxVN < CxVP 0 1 CxVN > CxVP 1 1 CxVN < CxVP 1 0 15.2.4 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 15.2.2 15.2.3 COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is ‘1’ which selects the normal speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to ‘0’. 15.3 Comparator Hysteresis A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. See Section 20.0 “Electrical Specifications” for more information. 15.4 Timer1 Gate Operation The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section 7.5 “Timer1 Gate” for more information. This feature is useful for timing the duration or interval of an analog event. It is recommended that the comparator output be synchronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occurring. DS40001576D-page 109 PIC12F752/HV752 15.4.1 COMPARATOR OUTPUT SYNCHRONIZATION 15.6 Comparator Positive Input Selection The output from either comparator, C1 or C2, can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Configuring the CxPCH bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 15-2) and the Timer1 Block Diagram (Figure 7-1) for more information. • • • • 15.5 Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a Falling edge detector are present. When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. To enable the interrupt, you must set the following bits: • CxON, CxPOL and CxSP bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. Note: Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register. CxIN0+ analog pin DAC Reference Voltage (dac_ref) FVR Reference Voltage (fvr_ref) VSS (Ground) See Section 13.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section 14.0 “Digital-to-Analog Converter (DAC) Module” for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. 15.7 Comparator Negative Input Selection The CxNCH0 bit of the CMxCON0 register selects the analog input pin to the comparator inverting input. Note: 15.8 To use CxIN0+ and CxIN1x- pins as analog input, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section 20.0 “Electrical Specifications” for more details. 15.9 Interaction with the COG Module The comparator outputs can be brought to the COG module in order to facilitate auto-shutdown. If autorestart is also enabled, the comparators can be configured as a closed loop analog feedback to the COG, thereby creating an analog controlled PWM. DS40001576D-page 110  2011-2015 Microchip Technology Inc. PIC12F752/HV752 15.10 Zero Latency Filter In high-speed operation, and under proper circuit conditions, it is possible for the comparator output to oscillate. This oscillation can have adverse effects on the hardware and software relying on this signal. Therefore, a digital filter has been added to the comparator output to suppress the comparator output oscillation. Once the comparator output changes, the output is prevented from reversing the change for a nominal time of 20 ns. This allows the comparator output to stabilize without affecting other dependent devices. Refer to Figure 15-3. FIGURE 15-3: COMPARATOR ZERO LATENCY FILTER OPERATION CxOUT From Comparator CxOUT From ZLF TZLF Output waiting for TZLF to expire before an output change is allowed TZLF has expired so output change of ZLF is immediate based on comparator output change  2011-2015 Microchip Technology Inc. DS40001576D-page 111 PIC12F752/HV752 15.11 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 15-4. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. FIGURE 15-4: ANALOG INPUT MODEL VDD Rs < 10K Analog Input pin VT  0.6V RIC To Comparator VA CPIN 5 pF VT  0.6V ILEAKAGE(1) Vss Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions = Interconnect Resistance RIC = Source Impedance RS VA = Analog Voltage = Threshold Voltage VT Note 1: DS40001576D-page 112 See Section 20.0 “Electrical Specifications”  2011-2015 Microchip Technology Inc. PIC12F752/HV752 15.12 Comparator Control Registers REGISTER 15-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL CxZLF CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled 0 = Comparator is disabled and consumes no active power bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 CxZLF: Zero Latency Filter Enable bit 1 = Zero latency filter is enabled 0 = Zero latency filter is disabled bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in low-power, low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous.  2011-2015 Microchip Technology Inc. DS40001576D-page 113 PIC12F752/HV752 REGISTER 15-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 CxINTP CxINTN R/W-0/0 R/W-0/0 CxPCH U-0 — U-0 — U-0 R/W-0/0 — CxNCH0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bit 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH: Comparator Positive Input Channel Select bits 00 = CxVP connects to CxIN+ pin 01 = CxVP connects to DAC Voltage Reference (dac_ref) 10 = CxVP connects to FVR Voltage Reference (fvr_ref) 11 = CxVP connects to VSS bit 3-1 Unimplemented: Read as ‘0’ bit 0 CxNCH0: Comparator Negative Input Channel Select bits 0 = CxVN connects to CXIN0- pin 1 = CxVN connects to CXIN1- pin REGISTER 15-3: CMOUT: COMPARATOR OUTPUT REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 — — — — — — MC2OUT MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MC2OUT: Mirror Copy of C2OUT bit bit 0 MC1OUT: Mirror Copy of C1OUT bit DS40001576D-page 114  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 15-2: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page CM1CON0 C1ON C1OUT C1OE C1POL C1ZLF C1SP C1HYS C1SYNC 113 CM1CON1 C1INTP C1INTN CM2CON0 C2ON C2OUT CM2CON1 C2INTP C2INTN — — — DACCON0 DACEN DACRNG DACOE DACCON1 — — — FVRCON FVREN FVRRDY FVRBUFEN FVRBUFSS — INTCON Name CMOUT C1PCH C2OE — — — C1NCH0 114 C2ZLF C2SP C2HYS C2SYNC 113 — — — C2NCH0 114 — — — MCOUT2 MCOUT1 114 — — DACPSS0 — — C2POL C2PCH DACR 105 105 — — — 101 GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF 15 PIE2 — — C2IE C1IE — COG1IE — CCP1IE 17 PIR2 — — C2IF C1IF — COG1IF — CCP1IF 19 TRISA2 TRISA1 TRISA0 40 ANSA2 ANSA1 ANSA0 41 TRISA — — TRISA5 TRISA4 TRISA3(1) ANSELA — — ANSA5 ANSA4 — Legend: Note 1: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module. TRISA3 always reads ‘1’.  2011-2015 Microchip Technology Inc. DS40001576D-page 115 PIC12F752/HV752 16.0 INSTRUCTION SET SUMMARY The PIC12F752/HV752 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations TABLE 16-1: OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) Each PIC16 instruction is a 14-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 16-1, while the various opcode fields are summarized in Table 16-1. b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Table 16-2 lists the instructions recognized by the MPASMTM assembler. d For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a normal instruction execution time of 1 s. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. TO C DC Z Program Counter Time-out bit Carry bit Digit carry bit Zero bit PD Power-down bit FIGURE 16-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. Literal and control operations 16.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (RMW) operation. The register is read, the data is modified, and the result is stored according to either the instruction or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTA, clear all the data bits, then write the result back to PORTA. This example would have the unintended consequence of clearing the condition that set the IOCIF flag. DS40001576D-page 116 General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 16-2: PIC12F752/HV752 INSTRUCTION SET 14-Bit Opcode Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 C, DC, Z Z Z Z Z Z Z Z Z C C C, DC, Z Z 1, 2 1, 2 2 1, 2 1, 2 1, 2, 3 1, 2 1, 2, 3 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW Note 1: 2: 3: k k k – k k k – k – – k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 C, DC, Z Z TO, PD Z TO, PD C, DC, Z Z When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP.  2011-2015 Microchip Technology Inc. DS40001576D-page 117 PIC12F752/HV752 16.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW k Operands: 0  k  255 Operation: (W) + k  (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the 8-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [ label ] ADDWF Operands: BCF Bit Clear f Syntax: [ label ] BCF Operands: 0  f  127 0b7 Operation: 0  (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f f,b Syntax: [ label ] BSF 0  f  127 d 0,1 Operands: 0  f  127 0b7 Operation: (W) + (f)  (destination) Operation: 1  (f) Status Affected: C, DC, Z Status Affected: None Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Description: Bit ‘b’ in register ‘f’ is set. ANDLW AND literal with W BTFSC Syntax: [ label ] ANDLW Operands: 0  k  255 Operation: (W) .AND. (k)  (W) Status Affected: Z Description: The contents of W register are AND’ed with the 8-bit literal ‘k’. The result is placed in the W register. ANDWF f,d k AND W with f Syntax: [ label ] ANDWF Operands: 0  f  127 d 0,1 Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0  f  127 0b7 Operation: skip if (f) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. f,d Operation: (W) .AND. (f)  (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DS40001576D-page 118 f,b  2011-2015 Microchip Technology Inc. PIC12F752/HV752 BTFSS Bit Test f, Skip if Set CLRWDT Clear Watchdog Timer Syntax: [ label ] BTFSS f,b Syntax: [ label ] CLRWDT Operands: 0  f  127 0bVDD) 20 mA Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characteristics. See Table 20-6 to calculate device specific limitations. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. DS40001576D-page 150  2011-2015 Microchip Technology Inc. PIC12F752/HV752 20.1 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: Operating Temperature: VDDMIN VDD VDDMAX TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) PIC12F752 VDDMIN (Fosc  8 MHz) ........................................................................................................... +2.0V VDDMIN (8 MHz Fosc  10 MHz) ........................................................................................... +3.0V VDDMAX (10 MHz Fosc  20 MHz) ........................................................................................ +5.5V PIC12HV752 VDDMIN (Fosc  8 MHz) ........................................................................................................... +2.0V VDDMIN (8 MHz Fosc  10 MHz) ........................................................................................... +3.0V VDDMAX (10 MHz Fosc  20 MHz) ........................................................................................ +5.0V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN ...................................................................................................................................... -40°C TA_MAX .................................................................................................................................... +85°C Extended Temperature TA_MIN ...................................................................................................................................... -40°C TA_MAX .................................................................................................................................. +125°C Note 1: See Parameter D001, DS Characteristics: Supply Voltage.  2011-2015 Microchip Technology Inc. DS40001576D-page 151 PIC12F752/HV752 FIGURE 20-1: PIC12F752 VOLTAGE-FREQUENCY GRAPH, -40°C TA +125°C 5.5 5.0 VDD (V) 4.5 4.0 3.5 3.0 2.5 2.0 0 8 10 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. FIGURE 20-2: PIC12HV752 VOLTAGE-FREQUENCY GRAPH, -40°C TA +125°C 5.0 VDD (V) 4.5 4.0 3.5 3.0 2.5 2.0 0 8 10 20 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS40001576D-page 152  2011-2015 Microchip Technology Inc. PIC12F752/HV752 20.2 DC Characteristics TABLE 20-1: SUPPLY VOLTAGE PIC12F752 Standard Operating Conditions (unless otherwise stated) PIC12HV752 Param. No. D001 Sym. VDD Characteristic Min. Typ.† D001 VDR RAM Data Retention D002 D003* VPOR SVDD Conditions VDDMAX 2.0 — 5.5 V FOSC  8 MHz 3.0 — 5.5 V FOSC  10 MHz 4.5 — 5.5 V FOSC 20 MHz 2.0 — 5.0 V FOSC  8 MHz(2) 3.0 — 5.0 V FOSC  10 MHz(2) 4.5 — 5.0 V FOSC  20 MHz(2) Voltage(1) 1.5 — — V Device in Sleep mode 1.5 — — V Device in Sleep mode VDD Start Voltage to ensure internal Power-on Reset signal D003 D004* Units Supply Voltage VDDMIN D002* Max. — 1.6 — V — 1.6 — V VDD Rise Rate to ensure VDD Rise Rate internal Power-on Reset signal 0.05 — — V/ms See Table 17-1 for details. * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: On the PIC12HV752, VDD is regulated by a Shunt Regulator and is dependent on series resistor (connected between the unregulated supply voltage and the VDD pin) to limit the current to 50 mA. See Section “” for design requirements.  2011-2015 Microchip Technology Inc. DS40001576D-page 153 PIC12F752/HV752 TABLE 20-2: SUPPLY CURRENT (IDD)(1,2) PIC12F752 Standard Operating Conditions (unless otherwise stated) PIC12HV752 Param. No. Device Characteristics Supply Current (IDD) D010 D010 D016 D016 D011 D011 D012 D012 Min. Typ.† Max. 85°C Conditions Max. 125°C Units VDD Note (1, 2) — 13 25 25 A 2.0 — 19 29 29 A 3.0 — 32 51 51 A 5.0 — 160 230 230 A 2.0 — 240 310 310 A 3.0 — 280 400 400 A 4.5 — 75 280 280 A 2.0 — 155 320 320 A 3.0 — 345 530 530 A 5.0 — 215 310 310 A 2.0 — 375 470 470 A 3.0 — 570 650 650 A 4.5 — 130 280 280 A 2.0 — 175 320 320 A 3.0 — 290 535 535 A 5.0 — 195 296 296 A 2.0 — 315 440 440 A 3.0 — 425 650 650 A 4.5 — 185 340 340 A 2.0 — 325 475 475 A 3.0 — 665 845 845 A 5.0 — 330 475 475 A 2.0 — 550 800 800 A 3.0 — 850 1200 1200 A 4.5 FOSC = 31 kHz LFINTOSC mode FOSC = 31 kHz LFINTOSC mode FOSC = 1 MHz EC Oscillator mode FOSC = 1 MHz EC Oscillator mode FOSC = 1 MHz HFINTOSC mode FOSC = 1 MHz HFINTOSC mode FOSC = 4 MHz EC Oscillator mode FOSC = 4 MHz EC Oscillator mode * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. DS40001576D-page 154  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED) PIC12F752 Standard Operating Conditions (unless otherwise stated) PIC12HV752 Param. No. Device Characteristics Supply Current (IDD) Min. Typ.† Conditions Max. 85°C Max. 125°C Units VDD Note (1, 2) D013 D013 D014 D014 D015 D015 — 245 340 340 A 2.0 — 360 485 485 A 3.0 — 620 845 845 A 5.0 — 310 435 435 A 2.0 — 500 700 700 A 3.0 — 740 1100 1100 A 4.5 — 395 550 550 A 2.0 — 620 850 850 A 3.0 — 1.2 1.6 1.6 mA 5.0 — 460 650 650 A 2.0 — 750 1100 1100 A 3.0 — 1.2 1.6 1.6 mA 4.5 — 1.9 2.6 2.6 mA 4.5 — 2.2 3 3 mA 5.0 — 2.1 3 3 mA 4.5 FOSC = 4 MHz HFINTOSC mode FOSC = 4 MHz HFINTOSC mode FOSC = 8 MHz HFINTOSC mode FOSC = 8 MHz HFINTOSC mode FOSC = 20 MHz EC Oscillator mode FOSC = 20 MHz EC Oscillator mode * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption.  2011-2015 Microchip Technology Inc. DS40001576D-page 155 PIC12F752/HV752 TABLE 20-3: POWER-DOWN CURRENTS (IPD) (1,2) PIC12F752 Standard Operating Conditions (unless otherwise stated) Sleep mode PIC12HV752 Param. Device No. Characteristics Min. Typ.† Conditions Max. 85°C Max. 125°C Units Note VDD Power-down Base Current (IPD)(2) D020 D020 — 0.05 1.2 4.5 A 2.0 — 0.15 1.6 5.5 A 3.0 — 0.35 2.1 9 A 5.0 — 135 200 200 A 2.0 — 210 280 280 A 3.0 — 260 350 350 A 4.5 Power-down Base Current D021 D021 D022 D022 D023 D023 D024 D024 WDT, BOR, Comparator, VREF and T1OSC disabled (IPD)(2, 3) — 0.5 1.5 5 A 2.0 — 2.5 4 8 A 3.0 — 9.5 17 19 A 5.0 — 135 200 200 A 2.0 — 210 285 285 A 3.0 — 265 360 360 A 4.5 — 5 9 15 A 3.0 — 6 12 19 A 5.0 — 215 285 285 A 3.0 — 265 360 360 A 4.5 — 160 235 245 A 2.0 — 180 270 280 A 3.0 — 220 350 360 A 5.0 — 280 415 415 A 2.0 — 385 540 540 A 3.0 — 455 735 735 A 4.5 — 50 70 75 A 2.0 — 55 80 90 A 3.0 — 70 90 120 A 5.0 — 185 205 205 A 2.0 — 265 315 315 A 3.0 — 320 445 445 A 4.5 WDT Current(1) BOR Current(1) CxSP = 1, Comparator Current(1), single comparator enabled CxSP = 0, Comparator Current(1), single comparator enabled * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral  current can be determined by subtracting the base IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. 3: Shunt regulator is always on and always draws operating current. DS40001576D-page 156  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-3: POWER-DOWN CURRENTS (IPD) (CONTINUED)(1,2) PIC12F752 Standard Operating Conditions (unless otherwise stated) Sleep mode PIC12HV752 Param. Device No. Characteristics Min. Typ.† Max. 85°C Conditions Max. 125°C Units 6.5 A Note VDD Power-down Base Current (IPD)(2, 3) D025 — 0.2 3.0 3.0 — 0.36 3.5 10 A 5.0 D025 — 210 280 280 A 3.0 — 260 350 350 A 4.5 D026 — 20.0 30 30 A 2.0 — 30.0 40 40 A 3.0 — 50.0 70 70 A 5.0 — 160 238 238 A 2.0 — 250 322 322 A 3.0 D026 D027 D027 D028 D028 — 310 448 448 A 4.5 — 295.0 436 485 A 2.0 — 300 450 500 A 3.0 — 325 475 515 A 5.0 — 395.0 605 605 A 2.0 — 470 710 710 A 3.0 — 505 765 765 A 4.5 — 5.5 10 16 A 2.0 — 7.0 12 18 A 3.0 — 8.5 14 22 A 5.0 — 140.0 205 205 A 2.0 — 220.0 290 290 A 3.0 — 270.0 360 360 A 4.5 A/D Current(1), no conversion in progress DAC Current(1) FVR Current(1), FVRBUFEN = 1, REFOUT buffer enabled T1OSC Current, TMR1CS = 11 * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral  current can be determined by subtracting the base IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS. 3: Shunt regulator is always on and always draws operating current.  2011-2015 Microchip Technology Inc. DS40001576D-page 157 PIC12F752/HV752 TABLE 20-4: I/O PORTS DC CHARACTERISTICS Param. No. Sym. VIL Standard Operating Conditions (unless otherwise stated) Characteristic Min. Typ.† Max. Units — — Conditions — 0.8 V 4.5V  VDD  5.5V — 0.15 VDD V 2.0V  VDD  4.5V — — 0.2 VDD V 2.0V  VDD  5.5V — — 0.2 VDD V 2.0V  VDD  5.5V Input Low Voltage I/O PORT: D030 with TTL buffer D030A D031 with Schmitt Trigger buffer D032 MCLR VIH Input High Voltage I/O PORT: D040 with TTL buffer D040A D041 with Schmitt Trigger buffer D042 MCLR Input Leakage Current IIL 2.0 — — V 4.5V  VDD 5.5V 0.25 VDD + 0.8 — — V 2.0V  VDD  4.5V 0.8 VDD — — V 2.0V  VDD  5.5V 0.8 VDD — — V 2.0V  VDD  5.5V (1) D060 I/O ports — 0.1 1 A VSS VPIN VDD, Pin at high-impedance, 85°C D061 RA3/MCLR(2) — 0.7 5 A VSS VPIN VDD, Pin at high-impedance, 85°C — 0.1 5 A EC Configuration 50 250 400 A VDD = 5.0V, VPIN = VSS — — 0.6 V IOL = 7 mA, VDD = 4.5V -40°C TA +125°C — — 0.6 V IOL = 8.5 mA, VDD = 4.5V -40°C TA +85°C — — 0.6 V IOL = 14 mA, VDD = 4.5V -40°C TA +125°C — — 0.6 V IOL = 17 mA, VDD = 4.5V -40°C TA +85°C VDD-0.7 — — V IOH = -2.5 mA, VDD = 4.5V -40°C TA +125°C VDD-0.7 — — V IOH = -3 mA, VDD = 4.5V -40°C TA +85°C VDD-0.7 — — V IOH = -5 mA, VDD = 4.5V -40°C TA +125°C VDD-0.7 — — V IOH = -6 mA, VDD = 4.5V -40°C TA +85°C D063 IPUR Weak Pull-up Current VOL Output Low Voltage (3) D070* D080 I/O Ports RA1, RA4 and RA5 I/O Ports RA0 and RA2 VOH D090 Output High Voltage I/O Ports RA1, RA4 and RA5 I/O Ports RA0 and RA2 * † Note 1: 2: 3: These parameters are characterized but not tested. Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. This specification applies to all weak pull-up pins, including the weak pull-up found on RA3/MCLR. When RA3/MCLR is configured as MCLR Reset pin, the weak pull-up is always enabled. DS40001576D-page 158  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-4: I/O PORTS (CONTINUED) DC CHARACTERISTICS Param. No. Sym. Standard Operating Conditions (unless otherwise stated) Characteristic Min. Typ.† Max. Units Conditions Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF D101A* CIO All I/O pins — — 50 pF * † Note 1: 2: 3: These parameters are characterized but not tested. Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. This specification applies to all weak pull-up pins, including the weak pull-up found on RA3/MCLR. When RA3/MCLR is configured as MCLR Reset pin, the weak pull-up is always enabled. TABLE 20-5: MEMORY PROGRAMMING SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ.† Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP pin 10.0 — 13.0 V D112 VBE VDD for Bulk Erase 4.5 — VDDMAX V D113 VPEW VDD for Write or Row Erase 4.5 — VDDMAX V D114 IPPPGM Current on MCLR/VPP during Erase/Write — 300 1000 A D121 EP Cell Endurance 10K 100K — E/W -40C  TA +85C (Note 2) D121A EP Cell Endurance 1K 10K — E/W -40C  TA +125C (Note 2) (Note 1) Program Flash Memory D122 VPRW VDD for Read/Write VDDMIN — VDDMAX V D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Required only if single-supply programming is disabled. 2: Self-write and Block Erase.  2011-2015 Microchip Technology Inc. DS40001576D-page 159 PIC12F752/HV752 TABLE 20-6: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. No. TH01 TH02 Sym. JA JC Characteristic Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Typ. Units Conditions 84.6 °C/W 8-pin PDIP package 149.5 °C/W 8-pin SOIC package 8-pin DFN 3x3mm package 60 °C/W 41.2 °C/W 8-pin PDIP package 39.9 °C/W 8-pin SOIC package 9 °C/W 8-pin DFN 3x3mm package 150 °C — W PD = PINTERNAL + PI/O TH03 TJMAX Maximum Junction Temperature TH04 PD Power Dissipation TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2) Note 1: 2: IDD is current to run the chip alone without driving any load on the output pins. TA = Ambient temperature; TJ = Junction Temperature DS40001576D-page 160  2011-2015 Microchip Technology Inc. PIC12F752/HV752 20.3 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O Port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-Impedance) L Low FIGURE 20-3: T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-Impedance LOAD CONDITIONS Load Condition Pin CL VSS Note: CL = 50 pF for all pins.  2011-2015 Microchip Technology Inc. DS40001576D-page 161 PIC12F752/HV752 20.4 AC Characteristics: PIC12F752/HV752 (Industrial, Extended) FIGURE 20-4: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 CLKIN OS02 OS04 OS04 OS03 CLKOUT CLKOUT (CLKOUT Mode) TABLE 20-7: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. OS01 FOSC Characteristic External CLKIN Frequency(1) (1) OS02 TOSC External CLKIN Period OS03 TCY Instruction Cycle Time(1) * † Note 1: Min. Typ.† Max. Units DC — 20 MHz Conditions EC Oscillator mode 50 —  ns EC Oscillator mode 200 TCY DC ns TCY = 4/FOSC These parameters are characterized but not tested. Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. DS40001576D-page 162  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-8: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic OS06 TWARM Internal Oscillator Switch when running OS07 INTOSC Internal Calibrated INTOSC Frequency(1) (4 MHz) OS08 HFOSC OS09 LFOSC OS10* Internal Calibrated HFINTOSC Frequency(1) Internal LFINTOSC Frequency TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time * † Note 1: Freq. Tolerance Min. Typ.† Max. Units — — — 2 TOSC 1% 3.96 4.0 4.04 MHz VDD = 3.5V, TA = 25°C 2% 3.92 4.0 4.08 MHz 2.5V VDD  5.5V, 0°C  TA  +85°C 5% 3.80 4.0 4.20 MHz 2.0V VDD  5.5V, -40°C  TA  +85°C (Ind.), -40°C  TA  +125°C (Ext.) 1% 7.92 8 8.08 MHz VDD = 3.5V, TA = 25°C 2% 7.84 8 8.16 MHz 2.5V VDD  5.5V, 0°C  TA  +85°C 5% 7.60 8 8.40 MHz 2.0V VDD  5.5V, -40°C  TA  +85°C (Ind.), -40°C  TA  +125°C (Ext.) — — 31 — kHz — — — — 12 7 6 24 14 11 s s s Conditions VDD = 2.0V -40°C  TA  +85°C VDD = 3.0V -40°C  TA  +85°C VDD = 5.0V -40°C  TA  +85°C These parameters are characterized but not tested. Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended.  2011-2015 Microchip Technology Inc. DS40001576D-page 163 PIC12F752/HV752 FIGURE 20-5: CLKOUT AND I/O TIMING Cycle Write Fetch Read Execute Q4 Q1 Q2 Q3 FOSC OS20 CLKOUT OS21 OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 20-9: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. OS13 Sym. TCKL2IOV Characteristic CLKOUT to Port out valid(1) CLKOUT(1) Min. Typ.† Max. Units — — 20 ns Conditions OS14 TIOV2CKH Port input valid before TOSC + 200 ns — — ns OS15 TOSH2IOV FOSC (Q1 cycle) to Port out valid — 50 70* ns VDD =5.0V OS16 TOSH2IOI FOSC (Q2 cycle) to Port input invalid (I/O in setup time) 50 — — ns VDD =5.0V OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle) (I/O in setup time) 20 — — ns OS18* TIOR Port output rise time — — 40 15 72 32 ns ns VDD =2.0V VDD =5.0V OS19* TIOF Port output fall time — — 28 15 55 30 ns ns VDD =2.0V VDD =5.0V OS20* TINP INT pin input high or low time 25 — — ns OS21* TIOC Interrupt-on-change new input level time TCY — — ns * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. DS40001576D-page 164  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 20-6: RESET, WATCHDOG TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Start-Up Time Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note: Asserted low. FIGURE 20-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR + VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset (due to BOR) * 33* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.  2011-2015 Microchip Technology Inc. DS40001576D-page 165 PIC12F752/HV752 TABLE 20-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic MCLR Pulse Width (low) Min. Typ.† Max. Units Conditions 2 5 — — — — s s VDD = 5V, -40°C to +85°C VDD = 5V, -40°C to +125°C 10 10 20 20 30 35 ms ms VDD = 5V, -40°C to +85°C VDD = 5V, -40°C to +125°C 30 TMCL 31 TWDTLP Low-Power Watchdog Timer Time-out Period 32* TPWRT Power-up Timer Period, PWRTE = 0 (No Prescaler) 40 65 140 ms 33* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s 34 VBOR Brown-out Reset Voltage (1) 2 2.15 2.3 V 35* VHYST Brown-out Reset Hysteresis — 100 — mV -40°C  TA  +85°C 36* TBOR Brown-out Reset DC Minimum Detection Period 100 — — s VDD  VBOR * These parameters are characterized but not tested. † Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. DS40001576D-page 166  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 20-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 49 47 TMR0 or TMR1 TABLE 20-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic 40* TT0H T0CKI High Pulse Width 41* TT0L T0CKI Low Pulse Width No Prescaler Min. Typ.† Max. Units 0.5 TCY + 20 — — ns ns With Prescaler No Prescaler 10 — — 0.5 TCY + 20 — — ns 10 — — ns Greater of: 20 or TCY + 40 N — — ns With Prescaler 42* TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler 0.5 TCY + 20 — — ns 15 — — ns Asynchronous 30 — — ns Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns 46* TT1L T1CKI Low Time Asynchronous 47* TT1P T1CKI Input Synchronous Period 30 — — ns Greater of: 30 or TCY + 40 N — — ns Asynchronous 49* TCKEZTMR1 * † Delay from External Clock Edge to Timer Increment 2 60 — — ns TOSC — 7 TOSC — Conditions N = prescale value N = prescale value Timers in Sync mode These parameters are characterized but not tested. Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2011-2015 Microchip Technology Inc. DS40001576D-page 167 PIC12F752/HV752 FIGURE 20-9: PIC12F752/HV752 CAPTURE/COMPARE/PWM TIMINGS (CCP) CCP1 (Capture mode) CC01 CC02 CC03 Note: Refer to Figure 20-3 for load conditions. TABLE 20-12: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP) Standard Operating Conditions (unless otherwise stated) Param. Sym. No. Characteristic CC01* TccL CCP1 Input Low Time CC02* TccH CCP1 Input High Time CC03* TccP CCP1 Input Period No Prescaler Min. Typ.† Max. Units 0.5TCY + 20 — — ns With Prescaler 20 — — ns No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns 3TCY + 40 N — — ns Conditions N = prescale value (1, 4 or 16) * These parameters are characterized but not tested. † Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 20-13: COMPARATOR SPECIFICATIONS(1) Standard Operating Conditions (unless otherwise stated) Param. No. CM01 Sym. Characteristics Min. Typ.† Max. Units —  10  10  20  20 mV mV Comments VIOFF Input Offset Voltage CM02 VICM Input Common Mode Voltage 0 — VDD – 1.5 V CM03 CMRR Common Mode Rejection Ratio — 50 — dB Response Time — 38 45 ns CxSP = 1 — 81 100 ns CxSP = 0 CM04A* TRT CM05* TMC20V Comparator Mode Change to Output Valid — — 10 s CM06 CHYSTER Comparator Hysteresis — 35 50 mV CxSP = 1 CxSP = 0 * These parameters are characterized but not tested. † Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: See Section 21.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. DS40001576D-page 168  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-14: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS(1) Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristics Min. Typ.† Max. Units DAC01* CLSB Step Size(2) — VDD/ 32 — V DAC02* CACC Absolute Accuracy — —  1/2 LSb DAC03* CR Unit Resistor Value (R) — 5K —  DAC04* CST Settling Time(3) — — 10 s Comments * These parameters are characterized but not tested. † Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: See Section 21.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. 2: Setting DACRNG = 1 for full range mode. See Example 14-2 for limited range calculation. 3: Settling time measured while DACR transitions from ‘0000’ to ‘1111’. TABLE 20-15: FIXED VOLTAGE REFERENCE SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Param No. Symbol Characteristics Min. Typ. Max. Units VR01 VFVR FVR Voltage Output 1.116 1.2 1.284 V VR02* TSTABLE FVR Turn On Time — 200 — s * Comments These parameters are characterized but not tested. TABLE 20-16: SHUNT REGULATOR SPECIFICATIONS (PIC12HV752 only) Standard Operating Conditions (unless otherwise stated) Param. Symbol No. Characteristics SR01 VSHUNT Shunt Voltage SR02 ISHUNT SR03* TSETTLE Settling Time SR04 CLOAD Load Capacitance SR05 ISNT Regulator operating current * Shunt Current Min. Typ. Max. Units Comments 4.75 5 5.5 V 1 — 50 mA — — 150 ns To 1% of final value 0.01 — 10 F Bypass capacitor on VDD pin — 180 — A Includes band gap reference current These parameters are characterized but not tested.  2011-2015 Microchip Technology Inc. DS40001576D-page 169 PIC12F752/HV752 TABLE 20-17: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3) Standard Operating Conditions (unless otherwise stated) Param. Sym. No. Characteristic Min. Typ.† Max. Units Conditions AD01 NR Resolution — — 10 bit AD02 EIL Integral Error — — 1 LSb VREF = 3.0V AD03 EDL Differential Error — — 1 LSb No missing codes VREF = 3.0V AD04 EOFF Offset Error — 1.5 2.0 LSb VREF = 3.0V AD05 EGN Gain Error — — 1.0 LSb VREF = 3.0V AD06 VREF Reference Voltage 2.2 2.5 — — — VDD V Absolute minimum to ensure 1 LSb accuracy AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 k Can go higher if external 0.01 F capacitor is present on input pin. AD09* IREF VREF Input Current 10 — 1000 A During VAIN acquisition. Based on differential of VHOLD to VAIN. — — 50 A During A/D conversion cycle. * These parameters are characterized but not tested. † Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes. 3: See Section 21.0 “DC and AC Characteristics Graphs and Charts” for operating characterization. DS40001576D-page 170  2011-2015 Microchip Technology Inc. PIC12F752/HV752 TABLE 20-18: ADC CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Param. Sym. No. Characteristic Min. Typ.† ADC Internal FRC Oscillator Period 3.0 6.0 1.6 ADC Clock Period 1.6 Max. Units Conditions 9.0 s At VDD = 2.5V 4.0 6.0 s At VDD = 5.0V — 9.0 s FOSC-based, VREF 3.0V 3.0 — 9.0 s TOSC-based, VREF full range(2) — 11 — TAD Set GO/DONE bit to conversion complete AD132 TACQ Acquisition Time * — 11.5 — s AD133 TAMP Amplifier Settling Time * — — 5 s AD130 TAD * AD131 TCNV Conversion Time (not including Acquisition Time)(1) Q4 to A/D Clock Start AD134 TGO THCD Holding Capacitor Disconnect Time — TOSC/2 — — — — 1/2 TAD 1/2 TAD + 1 TCY — — — FOSC-based ADCS = x11 (ADC FRC mode) * These parameters are characterized but not tested. † Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. See Section 12.4 “A/D Acquisition Requirements” for minimum conditions. 2: Full range for PIC12HV752 powered by the shunt regulator is the 5V regulated voltage. FIGURE 20-10: PIC12F752/HV752 A/D CONVERSION TIMING (ADC CLOCK FOSC-BASED) BSF ADCON0, GO 1 TCY (TOSC/2) AD134 AD131 Q4 AD130 A/D CLK 9 A/D Data 8 7 6 OLD_DATA ADRES 2 1 0 NEW_DATA 1 TCY ADIF GO Sample 3 DONE AD132  2011-2015 Microchip Technology Inc. Sampling Stopped DS40001576D-page 171 PIC12F752/HV752 21.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.” represents (mean + 3) or (mean - 3) respectively, where  is a standard deviation, over each temperature range. DS40001576D-page 172  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-1: IDD, LFINTOSC, FOSC = 31 kHz, PIC12F752 ONLY 60 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 50 Max IDD (µA) 40 Typical 30 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-2: IDD, LFINTOSC, FOSC = 31 kHz, PIC12HV752 ONLY 450 Max 400 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 350 IDD (µA) 300 Typical 250 200 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 173 PIC12F752/HV752 FIGURE 21-3: IDD TYPICAL, HFINTOSC, PIC12F752 ONLY 1400 Typical: Mean (25°C) 1200 8 MHz IDD (µA) 1000 800 4 MHz 600 400 1 MHz 200 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-4: IDD MAXIMUM, HFINTOSC, PIC12F752 ONLY 1800 Max: Mean + 3ı (125°C) 1600 8 MHz 1400 IDD (µA) 1200 1000 4 MHz 800 600 1 MHz 400 200 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS40001576D-page 174  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-5: IDD TYPICAL, HFINTOSC, PIC12HV752 ONLY 1400 Typical: Mean (25°C) 1200 8 MHz IDD (µA) 1000 800 4 MHz 600 1 MHz 400 200 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) FIGURE 21-6: IDD MAXIMUM, HFINTOSC, PIC12HV752 ONLY 1800 1600 8 MHz Max: Mean + 3ı (125°C) 1400 1200 IDD (µA) 4 MHz 1000 800 1 MHz 600 400 200 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 175 PIC12F752/HV752 FIGURE 21-7: IDD TYPICAL, EXTERNAL CLOCK (EC), PIC12F752 ONLY 700 4 MHz Typical: Mean (25°C) 600 IDD (µA) 500 400 1 MHz 300 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-8: IDD MAXIMUM, EXTERNAL CLOCK (EC), PIC12F752 ONLY 900 4 MHz Max: Mean + 3ı (125°C) 800 700 IDD (µA) 600 1 MHz 500 400 300 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS40001576D-page 176  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-9: IDD TYPICAL, EXTERNAL CLOCK (EC), PIC12HV752 ONLY 900 4 MHz 800 Typical: Mean (25°C) 700 600 1 MHz IDD (µA) 500 400 300 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) FIGURE 21-10: IDD MAXIMUM, EXTERNAL CLOCK (EC), PIC12HV752 ONLY 1400 Max: Mean + 3ı (125°C) 1200 4 MHz IDD (µA) 1000 800 1 MHz 600 400 200 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 177 PIC12F752/HV752 FIGURE 21-11: IDD, EXTERNAL CLOCK (EC), FOSC = 20 MHz, PIC12F752 ONLY 3.5 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 3.0 Max 2.5 IDD (mA) Typical 2.0 1.5 1.0 0.5 0.0 4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1 VDD (V) DS40001576D-page 178  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-12: IPD BASE, PIC12F752 ONLY 10 9 Max125 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) 8 IPD (µA) 7 6 5 4 3 Max85 2 1 Typical 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-13: IPD BASE, PIC12HV752 ONLY 400 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 350 Max IPD (µA) 300 Typical 250 200 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 179 PIC12F752/HV752 FIGURE 21-14: IPD, WATCHDOG TIMER (WDT), PIC12F752 ONLY 20 Max125 18 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) 16 Max85 IPD (µ (µA) 14 12 10 Typical 8 6 4 2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-15: IPD, WATCHDOG TIMER (WDT), PIC12HV752 ONLY 400 350 300 IPD (µA (µA) Max Max: Mean + 3ı (125°C) Typical: Mean (25°C) Typical 250 200 150 100 50 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) DS40001576D-page 180  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-16: IPD FIXED VOLTAGE REFERENCE (FVR), PIC12F752 ONLY 600 Max125 Max85 500 IPD (µ (µA) 400 Typical 300 Max125: M 125 M Mean + 3 3ı (125°C) Max 85: Mean + 3ı (85°C) 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-17: IPD FIXED VOLTAGE REFERENCE (FVR), PIC12HV752 ONLY 900 M Max: M Mean + 3 3ı (125°C) Typical: Mean (25°C) 800 Max 700 IPD (µA (µA) 600 500 Typical yp 400 300 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 181 PIC12F752/HV752 FIGURE 21-18: IPD, BROWN-OUT RESET (BOR), PIC12F752 ONLY 22 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) 20 18 Max125 16 IPD (µA) 14 12 Max85 10 8 Typical 6 4 2 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-19: IPD, BROWN-OUT RESET (BOR), PIC12HV752 ONLY 400 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 350 Max 300 Typical IPD (µA) µA) 250 200 150 100 50 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) DS40001576D-page 182  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-20: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC12F752 ONLY 25 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) IPD (µ (µA) 20 Max125 15 Max85 10 Typical 5 0 1 5 1.5 2 0 2.0 2 5 2.5 3 0 3.0 3 5 3.5 4 0 4.0 4 5 4.5 5 0 5.0 5 5 5.5 VDD (V) FIGURE 21-21: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC12HV752 ONLY 400 Max 350 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 300 Typical IPD (µA (µA) 250 200 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 183 PIC12F752/HV752 FIGURE 21-22: IPD, DAC, PIC12F752 ONLY 80 70 Max: Mean + 3ı (125°C) Typical: Mean (25°C) Max 60 IPD (µA (µA) 50 Typical 40 30 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-23: IPD, DAC, PIC12HV752 ONLY 500 450 Max Max: Mean + 3ı (125°C) Typical: Mean (25°C) 400 IPD (µA (µA) 350 Typical 300 250 200 150 100 50 0 15 1.5 2 2.0 0 2 2.5 5 3 3.0 0 3 3.5 5 4 4.0 0 4 4.5 5 5 5.0 0 VDD (V) DS40001576D-page 184  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-24: IPD, COMPARATOR, LOW-POWER MODE, CxSP = 0, PIC12F752 ONLY 140 Max125: M 125 M Mean + 3 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) 120 Max125 100 IPD (µA (µA) Max85 80 Typical 60 40 20 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-25: IPD, COMPARATOR, LOW-POWER MODE, CxSP = 0, PIC12HV752 ONLY 500 450 Max Max: Mean + 3ı (125°C) Typical: Mean (25°C) 400 350 IPD ((µA) Typical 300 250 200 150 100 50 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 185 PIC12F752/HV752 FIGURE 21-26: IPD, COMPARATOR, NORMAL-POWER MODE, CxSP = 1, PIC12F752 ONLY 400 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) 350 Max125 Max85 IPD (µA (µA) 300 250 Typical 200 150 100 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-27: IPD, COMPARATOR, NORMAL-POWER MODE, CxSP = 1, PIC12HV752 ONLY 800 Max 700 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 600 IPD (µA (µA) 500 Typical 400 300 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V) DS40001576D-page 186  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-28: IPD, ADC NO CONVERSION IN PROGRESS, PIC12F752 ONLY 12 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) 10 Max125 IPD (µA (µA) 8 6 4 Max85 2 Typical 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-29: IPD, ADC NO CONVERSION IN PROGRESS, PIC12HV752 ONLY 400 Max: Mean + 3ı (125°C) Typical: Mean (25°C) 350 Max IPD (µA (µA) 300 Typical 250 200 150 100 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 187 PIC12F752/HV752 FIGURE 21-30: VOH vs. IOH, RA0/RA2, OVER TEMPERATURE, VDD = 5.0V 5.1 5.0 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 4.9 VOH (V) 4.8 4.7 4.6 Min 4.5 Typical 4.4 Max85 4.3 Max125 4.2 4.1 -21 -18 -15 -12 -9 -6 -3 0 IOH (mA) FIGURE 21-31: VOH vs. IOH, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 5.0V 5.2 Max: Mean + 3ı (125°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 5.0 Voh (V) 4.8 Min 4.6 4.4 Typical 4.2 Max 4.0 -5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 Ioh (mA) DS40001576D-page 188  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-32: ( VOH vs.)IOH, RA0/RA2, OVER TEMPERATURE, VDD = 3.0V 3.0 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) VOH (V) 2.8 2.6 Min 2.4 Typical Max85 2.2 Max125 2.0 -15 -12 -9 -6 -3 0 IOH (mA) FIGURE 21-33: VOH vs. IOH, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 3.0V 3.5 3.0 VOH (V) Min 2.5 Typical 2.0 1.5 1.0 -4.5 Max: Mean + 3ı (125°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) Max -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 IOH (mA)  2011-2015 Microchip Technology Inc. DS40001576D-page 189 PIC12F752/HV752 FIGURE 21-34: VOL vs. IOL, RA0/RA2, OVER TEMPERATURE, VDD = 5.0V 0.7 Max125 0.6 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 0.5 Max85 VOL (V) Typical 0.4 Min 0.3 0.2 0.1 0 0 10 FIGURE 21-35: 20 IOL (mA) 30 40 VOL vs. IOL, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 5.0V 0.45 Max125: Mean + 3ı (125°C) Max85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 0.40 0.35 Max125 Max85 VOL (V) 0.30 Typical 0.25 0.20 Min 0.15 0.10 0.05 4.5 5.0 DS40001576D-page 190 5.5 6.0 6.5 7.0 7.5 8.0 IOL (mA) 8.5 9.0 9.5 10.0 10.5  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-36: VOL vs. IOL, RA0/RA2, OVER TEMPERATURE, VDD = 3.0V 1.2 1.1 0.9 0.8 VOL (V) Max125 Max125: Mean + 3ı (125°C) Max 85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 1.0 Max85 Typical 0.7 0.6 Min 0.5 0.4 0.3 0.2 0.1 0.0 0 5 10 15 20 25 30 35 40 IOL (mA) FIGURE 21-37: VOL vs. IOL, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 3.0V 0.8 Max125: Mean + 3ı (125°C) Max85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C 0.7 0.6 Max125 Max85 VOL (V) 0.5 Typical 0.4 0.3 Min 0.2 0.1 0.0 4 5 6 7 8 9 10 11 IOL (mA)  2011-2015 Microchip Technology Inc. DS40001576D-page 191 PIC12F752/HV752 FIGURE 21-38: SCHMITT TRIGGER INPUT THRESHOLD, VIN vs. VDD, OVER TEMPERATURE 4.0 Min 3.5 Max125: Mean + 3ı (125°C) Max85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 3.0 Typical VIN(V) 2.5 2.0 Max85 1.5 Max125 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(V) FIGURE 21-39: TTL INPUT THRESHOLD, VIN vs. VDD, OVER TEMPERATURE 1.7 Max125: Mean + 3ı (125°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 1.5 Min Typical VIN (V) 1.3 Max 1.1 0.9 0.7 0.5 1.5 DS40001576D-page 192 2.0 2.5 3.0 3.5 4.0 VDD (V) 4.5 5.0 5.5 6.0  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-40: SHUNT REGULATOR VOLTAGE, PIC12HV752 ONLY 5.16 Max125: Mean + 3ı (125°C) Max85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) Shunt Regulator Voltage(V) 5.14 5.12 5.10 Min Typical Max85 Max125 5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 0 10 20 30 40 50 60 Input Current (mA) FIGURE 21-41: TYPICAL HFINTOSC, START-UP TIMES vs. VDD, OVER TEMPERATURE 16 Max 14 Time (us) 12 Max: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) Typical 10 Min 8 6 4 2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 193 PIC12F752/HV752 FIGURE 21-42: WDT TIME-OUT PERIOD 55 50 Max125: Mean + 3ı (125°C) Max85: Mean + 3ı (85°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) 45 Time (ms) 40 35 30 Max125 25 Max85 20 Typical 15 Min 10 5 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS40001576D-page 194  2011-2015 Microchip Technology Inc. PIC12F752/HV752 FIGURE 21-43: S COMPARATOR RESPONSE TIME OVER TEMPERATURE, NORMAL-POWER MODE, G G CxSP = 1, RISING EDGE 80 75 Max: Mean + 3ı (125°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) Time (ns) 70 65 60 55 50 45 Max 40 Typical 35 Min 30 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) FIGURE 21-44: COMPARATOR RESPONSE TIME OVER TEMPERATURE, NORMAL-POWER MODE, CxSP = 1, FALLING EDGE 90 Max: Mean + 3ı (125°C) Typical: Mean (25°C) Min: Mean - 3ı (-40°C) Time (ns) 80 70 60 50 Max Typical 40 Min 30 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2011-2015 Microchip Technology Inc. DS40001576D-page 195 PIC12F752/HV752 22.0 PACKAGING INFORMATION 22.1 Package Marking Information 8-Lead PDIP (300 mil) Example XXXXXXXX XXXXXNNN 12F752 E/P e3 121 YYWW 1109 8-Lead SOIC (3.90 mm) Example NNN Legend: XX...X Y YY WW NNN e3 * Note: DS40001576D-page 196 12F752 ESN1109 121 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2011-2015 Microchip Technology Inc. PIC12F752/HV752 22.1 Package Marking Information (Continued) 8-Lead DFN (3x3x0.9 mm) Example XXXX YYWW NNN MFU0 1109 121 PIN 1 TABLE 22-1: PIN 1 8-LEAD 3x3 DFN (MF) TOP MARKING Part Number Marking PIC12F752-E/MF MFU0 PIC12F752-I/MF MFV0 PIC12HV752-E/MF MFW0 PIC12HV752-I/MF MFX0 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2011-2015 Microchip Technology Inc. DS40001576D-page 197 PIC12F752/HV752 22.2 Package Details The following sections give the technical details of the packages. 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS40001576D-page 198  2011-2015 Microchip Technology Inc. PIC12F752/HV752 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2011-2015 Microchip Technology Inc. DS40001576D-page 199 PIC12F752/HV752 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001576D-page 200  2011-2015 Microchip Technology Inc. PIC12F752/HV752 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001576D-page 201 PIC12F752/HV752      !"#$% &  ! "# $% &"'"" ($)  % *++&&&!  !+$ DS40001576D-page 202  2011-2015 Microchip Technology Inc. PIC12F752/HV752 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001576D-page 203 PIC12F752/HV752 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001576D-page 204  2011-2015 Microchip Technology Inc. PIC12F752/HV752 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2015 Microchip Technology Inc. DS40001576D-page 205 PIC12F752/HV752 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (04/2011) APPENDIX B: MIGRATING FROM PIC12HV615 This compares the features of the PIC12HV615 to the PIC12HV752 family of devices. Original release. B.1 Revision B (11/2011) PIC12HV615 to PIC12HV752 TABLE B-1: FEATURE COMPARISON Redefined operation of the COG module; Added slew rate control to the COG module; Added zero latency filter to the comparator; Updated Electrical Specifications. Max Operating Speed Revision C (11/2013) Redefined operation of the COG module; Updated the I/O Ports chapter; Updated the Electrical Specifications chapter; Added graphs to the DC and AC Characteristics Graphs and Charts chapter; Other minor corrections. Feature PIC12HV615 PIC12HV752 20 MHz 20 MHz Max Program Memory (Words) 1024 1024 Flash Self Read/ Self Write No Yes SRAM (bytes) 64 64 Oscillator modes 8 2 4/8 MHz 1/4/8 MHz and 31 kHz Y Y Internal Pull-ups GP0/1/2/3/4/5 RA0/1/2/3/4/5 Interrupt-on-change GP0/1/2/3/4/5 RA0/1/2/3/4/5 4 4 10-bit 10-bit INTOSC Frequencies Brown-out Reset (BOR) Revision D (10/2015) Updated the eXtreme Low-Power Features section, Table 1, Figure 1 and the RA3 pin description in Table1-1; Updated PDIP package drawings in Section 22.2 (Package Details); Other minor corrections. Analog-to-Digital Converter (ADC) Channels A/D Resolution Timers (8/16-bit) 2/1 3/1 Comparator 1 2 High Speed ECCP/CCP 1/0 0/1 Complementary Output Generator (COG) No Yes Digital-to-Analog Converter (DAC) 5-bit Dual Range No Yes Fixed Voltage Reference (FVR) No Yes Internal Shunt Regulator Yes Yes Note: DS40001576D-page 206 This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device.  2011-2015 Microchip Technology Inc. PIC12F752/HV752 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2011-2015 Microchip Technology Inc. DS40001576D-page 207 PIC12F752/HV752 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) PART NO. Device - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Examples: a) b) Device: PIC12F752 PIC12HV752 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I E = -40C to +85C = -40C to +125C Package: P SN MF c) d) Pattern: = = = (Industrial) (Extended) Plastic DIP (PDIP) 8-lead Small Outline (3.90 mm) (SOIC) 8-lead Plastic Dual Flat, No Lead (3x3) (DFN) QTP, SQTP, Code or Special Requirements (blank otherwise) DS40001576D-page 208 PIC12F752T - I/MF 301 Tape and Reel, Industrial temperature, DFN 3x3 package, QTP pattern #301 PIC12F752 - E/P Extended temperature PDIP package PIC12F752 - E/SN Extended temperature, SOIC package PIC12HV752 - E/MF Extended temperature, DFN 3x3 package Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.  2011-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-887-1 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2011-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS40001576D-page 209 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Italy - Venice Tel: 39-049-7625286 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 01/27/15 DS40001576D-page 210  2011-2015 Microchip Technology Inc.