PIC16F1933-I/SS

厂商：
ACTEL(微芯科技)
封装：
SSOP28_208MIL
描述：
8位MCU单片机 PIC® XLP™ 16F SSOP28_10.2X5.3MM 256x8B 1.8~5.5V PIC

数据手册：

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数据手册
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PIC16F1933-I/SS 数据手册

PIC16(L)F1933 28-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver with XLP Technology High-Performance RISC CPU: PIC16LF1933 Low-Power Features: • Only 49 Instructions to Learn: - All single-cycle instructions except branches • Operating Speed: - DC – 32 MHz oscillator/clock input - DC – 125 ns instruction cycle • Up to 16K x 14 Words of Flash Program Memory • Up to 1024 Bytes of Data Memory (RAM) • Interrupt Capability with Automatic Context Saving • 16-Level Deep Hardware Stack • Direct, Indirect and Relative Addressing modes • Processor Read Access to Program Memory • Pinout Compatible to other 28-pin PIC16CXXX and PIC16FXXX Microcontrollers • Standby Current: - 60 nA @ 1.8V, typical • Operating Current: - 75 A/MHz, 1.8V, typical • Timer1 Oscillator Current: - 600 nA @ 32 kHz, 1.8V, typical • Low-Power Watchdog Timer Current: - 500 nA @ 1.8V, typical Special Microcontroller Features: • Precision Internal Oscillator: - Factory calibrated to ±1%, typical - Software selectable frequency range from 32 MHz to 31 kHz • Power-Saving Sleep mode • Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Brown-out Reset (BOR) - Selectable between two trip points - Disable in Sleep option • Multiplexed Master Clear with Pull-up/Input Pin • Programmable Code Protection • Wide Operating Voltage Range: - 1.8V-5.5V (PIC16F1933) - 1.8V-3.6V (PIC16LF1933)  2011-2012 Microchip Technology Inc. Peripheral Features: • Up to 35 I/O Pins and 1 Input-only pin: - High-current source/sink for direct LED drive - Individually programmable interrupt-on-pin change pins - Individually programmable weak pull-ups • Integrated LCD Controller: - Up to 96 segments - Variable clock input - Contrast control - Internal voltage reference selections • Capacitive Sensing module (mTouchTM) - Up to 16 selectable channels • A/D Converter: - 10-bit resolution and up to 14 channels - Selectable 1.024/2.048/4.096V voltage reference • Timer0: 8-Bit Timer/Counter with 8-Bit Programmable Prescaler • Enhanced Timer1 - Dedicated low-power 32 kHz oscillator driver - 16-bit timer/counter with prescaler - External Gate Input mode with Toggle and Single Shot modes - Interrupt-on-gate completion • Timer2, 4, 6: 8-Bit Timer/Counter with 8-Bit Period Register, Prescaler and Postscaler • Two Capture, Compare, PWM modules (CCP) - 16-bit Capture, max. resolution 125 ns - 16-bit Compare, max. resolution 125 ns - 10-bit PWM, max. frequency 31.25 kHz • Three Enhanced Capture, Compare, PWM modules (ECCP) - 3 PWM time-base options - Auto-shutdown and auto-restart - PWM steering - Programmable dead-band delay DS41575C-page 1 PIC16(L)F1933 Peripheral Features (Continued): • Master Synchronous Serial Port (MSSP) with SPI and I2 CTM with: - 7-bit address masking - SMBus/PMBusTM compatibility - Auto-wake-up on start • Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) - RS-232, RS-485 and LIN compatible - Auto-Baud Detect • SR Latch (555 Timer): - Multiple Set/Reset input options - Emulates 555 Timer applications • 2 Comparators: - Rail-to-rail inputs/outputs - Power mode control - Software enable hysteresis • Voltage Reference module: - Fixed Voltage Reference (FVR) with 1.024V, 2.048V and 4.096V output levels - 5-bit rail-to-rail resistive DAC with positive and negative reference selection XLP Debug(1) LCD (Com/Seg/Total) CCP ECCP MSSP (I2C™/SPI) EUSART Timers (8/16-bit) Comparators CapSense (ch) 10-bit ADC (ch) I/O’s(2) Data SRAM (bytes) Data EEPROM (bytes) Program Memory Flash (words) Device Data Sheet Index PIC16(L)F193X/194X Family Types PIC16(L)F1933 (1) 4096 256 256 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1934 (2) 4096 256 256 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1936 (2) 8192 256 512 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1937 (2) 8192 256 512 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1938 (3) 16384 256 1024 25 11 8 2 4/1 1 1 3 2 4/16/60(3) I/H Y PIC16(L)F1939 (3) 16384 256 1024 36 14 16 2 4/1 1 1 3 2 4/24/96 I/H Y PIC16(L)F1946 (4) 8192 256 512 54 17 17 3 4/1 2 2 3 2 4/46/184 I Y PIC16(L)F1947 (4) 16384 256 1024 54 17 17 3 4/1 2 2 3 2 4/46/184 I Y Note 1: I - Debugging, Integrated on Chip; H - Debugging, available using Debug Header. 2: One pin is input-only. 3: COM3 and SEG15 share the same physical pin, therefore SEG15 is not available when using 1/4 multiplex displays. Data Sheet Index: (Unshaded devices are described in this document.) 1: DS41575 PIC16(L)F1933 Data Sheet, 28-Pin Flash, 8-bit Microcontrollers. 2: DS41364 PIC16(L)F1934/6/7 Data Sheet, 28/40/44-Pin Flash, 8-bit Microcontrollers. 3: DS41574 PIC16(L)F1938/9 Data Sheet, 28/40/44-Pin Flash, 8-bit Microcontrollers. 4: DS41414 PIC16(L)F1946/1947 Data Sheet, 64-Pin Flash, 8-bit Microcontrollers. Note: For other small form-factor package availability and marking information, please visit http://www.microchip.com/packaging or contact your local sales office. DS41575C-page 2  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Pin Diagram – 28-Pin SPDIP/SOIC/SSOP (PIC16F1933, PIC16LF1933) 28-pin SPDIP, SOIC, SSOP RB7/ICSPDAT RA0 2 RB6/ICSPCLK RA1 3 26 RB5 RA2 4 25 RA3 5 24 RB4 RB3 RA4 RA5 VSS 6 23 RB2 22 21 RB1 RB0 RA7 RA6 RC0 RC1 RC2 RC3 7 8 9 PIC16LF1933 28 27 PIC16F1933 1 VPP/MCLR/RE3 20 VDD 10 11 19 VSS 18 RC7 12 17 RC6 13 16 RC5 14 15 RC4 Pin Diagram – 28-Pin QFN/UQFN (PIC16F1933, PIC16LF1933) RE3/MCLR/VPP RB7/ICSPDAT RB6/ICSPCLK RB5 RB4 28 27 26 25 24 23 22 RA1 RA0 28-pin QFN/UQFN PIC16F1933 PIC16LF1933 8 9 10 11 12 13 14 1 2 3 4 5 6 7 21 20 19 18 17 16 15 RB3 RB2 RB1 RB0 VDD VSS RC7 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RA2 RA3 RA4 RA5 VSS RA7 RA6  2011-2012 Microchip Technology Inc. DS41575C-page 3 PIC16(L)F1933 SRNQ(1) — — — Y AN1 — C12IN1- — — — — Y AN2/ VREF- — C2IN+/ DACOUT — — — — Y AN3/ VREF+ — C1IN+ — — — — Basic C12IN0-/ C2OUT(1) Pull-up — Interrupt 2 AN0 LCD 5 Y MSSP RA3 EUSART 1 CCP 28 4 Timers 3 RA2 SR Latch RA1 Comparator 27 Cap Sense 2 A/D 28-Pin QFN/UQFN RA0 ANSEL 28-Pin SPDIP/SOIC/SSOP 28-PIN SUMMARY (PIC16F1933, PIC16LF1933) I/O TABLE 1: SS(1) SEG12 — — VCAP(2) — SEG7 — — — — COM2 — — — — SEG15/ COM3 — — — RA4 6 3 Y — CPS6 C1OUT SRQ T0CKI CCP5 — — SEG4 — — — RA5 7 4 Y AN4 CPS7 C2OUT(1) SRNQ(1) — — — SS(1) SEG5 — — VCAP(2) RA6 10 7 — — — — — — — — — SEG1 — — OSC2/ CLKOUT VCAP(2) RA7 9 6 — — — — — — — — — SEG2 — — OSC1/ CLKIN RB0 21 18 Y AN12 CPS0 — SRI — CCP4 — — SEG0 INT/ IOC Y — RB1 22 19 Y AN10 CPS1 C12IN3- — — P1C — — VLCD1 IOC Y — RB2 23 20 Y AN8 CPS2 — — — P1B — — VLCD2 IOC Y — RB3 24 21 Y AN9 CPS3 C12IN2- — — CCP2(1)/ P2A(1) — — VLCD3 IOC Y — RB4 25 22 Y AN11 CPS4 — — — P1D — — COM0 IOC Y — RB5 26 23 Y AN13 CPS5 — — T1G(1) P2B(1) CCP3(1)/ P3A(1) — — COM1 IOC Y — RB6 27 24 — — — — — — — — — SEG14 IOC Y ICSPCLK/ ICDCLK RB7 28 25 — — — — — — — — — SEG13 IOC Y ICSPDAT/ ICDDAT RC0 11 8 — — — — — T1OSO/ T1CKI P2B(1) — — — — — — RC1 12 9 — — — — — T1OSI CCP2(1)/ P2A(1) — — — — — — RC2 13 10 — — — — — — CCP1/ P1A — — SEG3 — — — — RC3 14 11 — — — — — — — — SCK/SCL SEG6 — — RC4 15 12 — — — — — T1G(1) — — SDI/SDA SEG11 — — — RC5 16 13 — — — — — — — — SDO SEG10 — — — RC6 17 14 — — — — — — CCP3(1) P3A(1) TX/CK — SEG9 — — — RC7 18 15 — — — — — — P3B RX/DT — SEG8 — — — RE3 1 26 — — — — — — — — — — — Y MCLR/VPP VDD 20 17 — — — — — — — — — — — — VDD Vss 8, 19 5,16 — — — — — — — — — — — — VSS Note 1: 2: Pin functions can be moved using the APFCON register. PIC16F1933 devices only. DS41575C-page 4  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 13 3.0 Memory Organization ................................................................................................................................................................. 15 4.0 Device Configuration .................................................................................................................................................................. 45 5.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 51 6.0 Resets ........................................................................................................................................................................................ 69 7.0 Interrupts .................................................................................................................................................................................... 77 8.0 Low Dropout (LDO) Voltage Regulator ...................................................................................................................................... 91 9.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 93 10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 95 11.0 Data EEPROM and Flash Program Memory Control ................................................................................................................. 99 12.0 I/O Ports ................................................................................................................................................................................... 113 13.0 Interrupt-On-Change ................................................................................................................................................................ 129 14.0 Fixed Voltage Reference.......................................................................................................................................................... 133 15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 137 16.0 Temperature Indicator Module ................................................................................................................................................. 151 17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 153 18.0 Comparator Module.................................................................................................................................................................. 157 19.0 SR Latch................................................................................................................................................................................... 167 20.0 Timer0 Module ......................................................................................................................................................................... 171 21.0 Timer1 Module with Gate Control............................................................................................................................................. 175 22.0 Timer2/4/6 Modules.................................................................................................................................................................. 187 23.0 Capture/Compare/PWM Modules (ECCP1, ECCP2, ECCP3, CCP4, CCP5).......................................................................... 191 24.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 219 25.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 275 26.0 Capacitive Sensing Module...................................................................................................................................................... 305 27.0 Liquid Crystal Display (LCD) Driver Module............................................................................................................................. 313 28.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 347 29.0 Instruction Set Summary .......................................................................................................................................................... 351 30.0 Electrical Specifications............................................................................................................................................................ 365 31.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 397 32.0 Development Support............................................................................................................................................................... 433 33.0 Packaging Information.............................................................................................................................................................. 437 Appendix A: Data Sheet Revision History.......................................................................................................................................... 449 Appendix B: Migrating From Other PIC® Devices.............................................................................................................................. 449 Index .................................................................................................................................................................................................. 451 The Microchip Web Site ..................................................................................................................................................................... 459 Customer Change Notification Service .............................................................................................................................................. 459 Customer Support .............................................................................................................................................................................. 459 Reader Response .............................................................................................................................................................................. 460 Product Identification System ............................................................................................................................................................ 461  2011-2012 Microchip Technology Inc. DS41575C-page 5 PIC16(L)F1933 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS41575C-page 6  2011-2012 Microchip Technology Inc. PIC16(L)F1933 1.0 DEVICE OVERVIEW The PIC16(L)F1933 are described within this data sheet. They are available in 28-pin packages. Figure 1-1 shows a block diagram of the PIC16(L)F1933 devices. Table 1-2 shows the pinout descriptions. Reference Table 1-1 for peripherals available per device. Peripheral PIC16LF1933 DEVICE PERIPHERAL SUMMARY PIC16F1933 TABLE 1-1: ADC ● ● Capacitive Sensing Module ● ● Digital-to-Analog Converter (DAC) ● ● EUSART ● ● Fixed Voltage Reference (FVR) ● ● LCD ● ● SR Latch ● ● Temperature Indicator ● ● ECCP1 ● ● ECCP2 ● ● ECCP3 ● ● CCP4 ● ● CCP5 ● ● C1 ● ● C2 ● ● MSSP1 ● ● Timer0 ● ● Timer1 ● ● Timer2 ● ● Timer4 ● ● Timer6 ● ● Capture/Compare/PWM Modules Comparators Master Synchronous Serial Ports Timers  2011-2012 Microchip Technology Inc. DS41575C-page 7 PIC16(L)F1933 FIGURE 1-1: PIC16(L)F1933 BLOCK DIAGRAM Program Flash Memory RAM EEPROM PORTA OSC2/CLKOUT OSC1/CLKIN Timing Generation PORTB CPU INTRC Oscillator Figure 2-1 PORTC MCLR PORTE SR Latch ADC 10-Bit Timer0 Timer1 Timer2 Timer4 Timer6 Comparators LCD ECCP1 ECCP2 ECCP3 CCP4 CCP5 MSSP EUSART Note DS41575C-page 8 1: See applicable chapters for more information on peripherals.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 1-2: PIC16(L)F1933 PINOUT DESCRIPTION Name RA0/AN0/C12IN0-/C2OUT(1)/ SRNQ(1)/SS(1)/VCAP(2)/SEG12 RA1/AN1/C12IN1-/SEG7 RA2/AN2/C2IN+/VREF-/ DACOUT/COM2 RA3/AN3/C1IN+/VREF+/ COM3/SEG15 RA4/C1OUT/CPS6/T0CKI/SRQ/ CCP5/SEG4 RA5/AN4/C2OUT(1)/CPS7/ SRNQ(1)/SS(1)/VCAP(2)/SEG5 Function Input Type Output Type RA0 TTL AN0 AN C12IN0- AN C2OUT — CMOS Comparator output. SRNQ — CMOS SR latch inverting output. SS ST — Description CMOS General purpose I/O. — A/D Channel input. — Comparator negative input. VCAP Power Power SEG12 — AN RA1 TTL AN1 AN C12IN1SEG7 RA2 TTL AN2 AN Slave Select input. Filter capacitor for Voltage Regulator (PIC16F1933 only). LCD Analog output. CMOS General purpose I/O. — A/D Channel input. AN — Comparator negative input. — AN LCD Analog output. CMOS General purpose I/O. — A/D Channel input. Comparator positive input. C2IN+ AN — VREF- AN — A/D Negative Voltage Reference input. DACOUT — AN Voltage Reference output. COM2 — AN LCD Analog output. RA3 TTL AN3 AN — A/D Channel input. C1IN+ AN — Comparator positive input. VREF+ AN — A/D Voltage Reference input. CMOS General purpose I/O. COM3 — AN LCD Analog output. SEG15 — AN LCD Analog output. RA4 TTL C1OUT — CPS6 AN — Capacitive sensing input. T0CKI ST — Timer0 clock input. CMOS General purpose I/O. CMOS Comparator output. SRQ — CMOS SR latch non-inverting output. CCP5 ST CMOS Capture/Compare/PWM. SEG4 — RA5 TTL AN4 AN C2OUT — CPS7 AN SRNQ — AN LCD Analog output. CMOS General purpose I/O. — A/D Channel input. CMOS Comparator output. — Capacitive sensing input. CMOS SR latch inverting output. SS ST — VCAP Power Power SEG5 — AN Slave Select input. Filter capacitor for Voltage Regulator (PIC16F1933 only). LCD Analog output. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1933 devices only.  2011-2012 Microchip Technology Inc. DS41575C-page 9 PIC16(L)F1933 TABLE 1-2: PIC16(L)F1933 PINOUT DESCRIPTION (CONTINUED) Name RA6/OSC2/CLKOUT/VCAP(2)/ SEG1 RA7/OSC1/CLKIN/SEG2 RB0/AN12/CPS0/CCP4/SRI/INT/ SEG0 RB1/AN10/C12IN3-/CPS1/P1C/ VLCD1 RB2/AN8/CPS2/P1B/VLCD2 RB3/AN9/C12IN2-/CPS3/ CCP2(1)/P2A(1)/VLCD3 RB4/AN11/CPS4/P1D/COM0 Function Input Type RA6 TTL Output Type Description CMOS General purpose I/O. OSC2 — CLKOUT — XTAL VCAP Power Power SEG1 — AN Crystal/Resonator (LP, XT, HS modes). CMOS FOSC/4 output. Filter capacitor for Voltage Regulator (PIC16F1933 only). LCD Analog output. RA7 TTL OSC1 XTAL CMOS General purpose I/O. — Crystal/Resonator (LP, XT, HS modes). CLKIN CMOS — External clock input (EC mode). SEG2 — AN LCD Analog output. RB0 TTL AN12 AN CPS0 AN CCP4 ST CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. — A/D Channel input. — Capacitive sensing input. CMOS Capture/Compare/PWM. SRI — ST SR latch input. INT ST — External interrupt. AN LCD analog output. SEG0 — RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN10 AN — A/D Channel input. C12IN3- AN — Comparator negative input. CPS1 AN — Capacitive sensing input. P1C — VLCD1 AN RB2 TTL CMOS PWM output. — LCD analog input. CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN8 AN — A/D Channel input. CPS2 AN — Capacitive sensing input. P1B — VLCD2 AN RB3 TTL AN9 AN CMOS PWM output. — LCD analog input. CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. — A/D Channel input. C12IN2- AN — Comparator negative input. CPS3 AN — Capacitive sensing input. CCP2 ST CMOS Capture/Compare/PWM. P2A — CMOS PWM output. VLCD3 AN RB4 TTL — LCD analog input. CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. AN11 AN — A/D Channel input. CPS4 AN — Capacitive sensing input. P1D — COM0 — CMOS PWM output. AN LCD Analog output. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1933 devices only. DS41575C-page 10  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 1-2: PIC16(L)F1933 PINOUT DESCRIPTION (CONTINUED) Name RB5/AN13/CPS5/P2B/CCP3(1)/ P3A(1)/T1G(1)/COM1 RB6/ICSPCLK/ICDCLK/SEG14 RB7/ICSPDAT/ICDDAT/SEG13 RC0/T1OSO/T1CKI/P2B(1) RC1/T1OSI/CCP2(1)/P2A(1) RC2/CCP1/P1A/SEG3 RC3/SCK/SCL/SEG6 RC4/SDI/SDA/T1G(1)/SEG11 RC5/SDO/SEG10 Function Input Type Output Type RB5 TTL AN13 AN — A/D Channel input. CPS5 AN — Capacitive sensing input. Description CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. P2B — CMOS PWM output. CCP3 ST CMOS Capture/Compare/PWM. P3A — CMOS PWM output. T1G ST COM1 — RB6 TTL — Timer1 gate input. AN LCD Analog output. CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPCLK ST — Serial Programming Clock. ICDCLK ST — In-Circuit Debug Clock. AN LCD Analog output. SEG14 — RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change. Individually enabled pull-up. ICSPDAT ST CMOS ICSP™ Data I/O. ICDDAT ST CMOS In-Circuit Data I/O. SEG13 — RC0 ST AN T1OSO XTAL XTAL T1CKI ST — LCD Analog output. CMOS General purpose I/O. Timer1 oscillator connection. Timer1 clock input. P2B — CMOS PWM output. RC1 ST CMOS General purpose I/O. T1OSI XTAL CCP2 ST XTAL Timer1 oscillator connection. CMOS Capture/Compare/PWM. P2A — CMOS PWM output. RC2 ST CMOS General purpose I/O. CCP1 ST CMOS Capture/Compare/PWM. P1A — CMOS PWM output. SEG3 — RC3 ST CMOS General purpose I/O. SCK ST CMOS SPI clock. SCL I2C SEG6 — RC4 ST AN LCD Analog output. OD I2C™ clock. AN LCD Analog output. CMOS General purpose I/O. SDI ST — SPI data input. SDA I2C OD I2C™ data input/output. T1G ST — Timer1 gate input. SEG11 — AN LCD Analog output. RC5 ST CMOS General purpose I/O. SDO — CMOS SPI data output. SEG10 — AN LCD Analog output. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1933 devices only.  2011-2012 Microchip Technology Inc. DS41575C-page 11 PIC16(L)F1933 TABLE 1-2: PIC16(L)F1933 PINOUT DESCRIPTION (CONTINUED) Name RC6/TX/CK/CCP3/P3A/SEG9 RC7/RX/DT/P3B/SEG8 RE3/MCLR/VPP Function Input Type Output Type RC6 ST CMOS General purpose I/O. CMOS USART asynchronous transmit. Description TX — CK ST CMOS USART synchronous clock. CCP3 ST CMOS Capture/Compare/PWM. P3A — CMOS PWM output. SEG9 — RC7 ST AN LCD Analog output. CMOS General purpose I/O. RX ST DT ST CMOS USART synchronous data. — USART asynchronous input. CMOS PWM output. P3B — SEG8 — AN LCD Analog output. RE3 TTL — General purpose input. MCLR ST — Master Clear with internal pull-up. VPP HV — Programming voltage. VDD VDD Power — Positive supply. VSS VSS Power — Ground reference. Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C HV = High Voltage XTAL = Crystal levels Note 1: Pin function is selectable via the APFCON register. 2: PIC16F1933 devices only. DS41575C-page 12  2011-2012 Microchip Technology Inc. PIC16(L)F1933 2.0 ENHANCED MID-RANGE CPU This family of devices contain an enhanced mid-range 8-bit CPU core. The CPU has 49 instructions. Interrupt capability includes automatic context saving. The hardware stack is 16 levels deep and has Overflow and Underflow Reset capability. Direct, Indirect, and Relative addressing modes are available. Two File Select Registers (FSRs) provide the ability to read program and data memory. • • • • Automatic Interrupt Context Saving 16-level Stack with Overflow and Underflow File Select Registers Instruction Set 2.1 Automatic Interrupt Context Saving During interrupts, certain registers are automatically saved in shadow registers and restored when returning from the interrupt. This saves stack space and user code. See Section 7.5 “Automatic Context Saving”, for more information. 2.2 16-level Stack with Overflow and Underflow These devices have an external stack memory 15 bits wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF) in the PCON register, and if enabled will cause a software Reset. See section Section 3.5 “Stack” for more details. 2.3 File Select Registers There are two 16-bit File Select Registers (FSR). FSRs can access all file registers and program memory, which allows one Data Pointer for all memory. When an FSR points to program memory, there is one additional instruction cycle in instructions using INDF to allow the data to be fetched. General purpose memory can now also be addressed linearly, providing the ability to access contiguous data larger than 80 bytes. There are also new instructions to support the FSRs. See Section 3.6 “Indirect Addressing” for more details. 2.4 Instruction Set There are 49 instructions for the enhanced mid-range CPU to support the features of the CPU. See Section 29.0 “Instruction Set Summary” for more details.  2011-2012 Microchip Technology Inc. DS41575C-page 13 PIC16(L)F1933 FIGURE 2-1: CORE BLOCK DIAGRAM 15 Configuration Configuration 15 MUX Flash Program Memory Program Bus 16-Level 8 Level Stack Stack (13-bit) (15-bit) 14 Instruction Instruction Reg reg 8 Data Bus Program Counter RAM Program Memory Read (PMR) 12 RAM Addr Addr MUX Indirect Addr 12 12 Direct Addr 7 5 BSR FSR Reg reg 15 FSR0reg Reg FSR FSR1 Reg FSR reg 15 STATUS Reg reg STATUS 8 3 Power-up Timer OSC1/CLKIN OSC2/CLKOUT Instruction Decodeand & Decode Control Timing Generation Oscillator Start-up Timer Power-on Reset Watchdog Timer Brown-out Reset MUX ALU 8 W reg Internal Oscillator Block VDD DS41575C-page 14 VSS  2011-2012 Microchip Technology Inc. PIC16(L)F1933 3.0 MEMORY ORGANIZATION These devices contain the following types of memory: • Program Memory - Configuration Words - Device ID - User ID - Flash Program Memory • Data Memory - Core Registers - Special Function Registers - General Purpose RAM - Common RAM • Data EEPROM memory(1) The following features are associated with access and control of program memory and data memory: • PCL and PCLATH • Stack • Indirect Addressing 3.1 Program Memory Organization The enhanced mid-range core has a 15-bit program counter capable of addressing a 32K x 14 program memory space. Table 3-1 shows the memory sizes implemented for the PIC16(L)F1933 family. Accessing a location above these boundaries will cause a wrap-around within the implemented memory space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 3-1). Note 1: The Data EEPROM Memory and the method to access Flash memory through the EECON registers is described in Section 11.0 “Data EEPROM and Flash Program Memory Control”. TABLE 3-1: DEVICE SIZES AND ADDRESSES Device PIC16(L)F1933  2011-2012 Microchip Technology Inc. Program Memory Space (Words) Last Program Memory Address 4,096 0FFFh DS41575C-page 15 PIC16(L)F1933 FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR 4 KW PARTS PC CALL, CALLW RETURN, RETLW Interrupt, RETFIE On-chip Program Memory 15 3.1.1 READING PROGRAM MEMORY AS DATA There are two methods of accessing constants in program memory. The first method is to use tables of RETLW instructions. The second method is to set an FSR to point to the program memory. 3.1.1.1 RETLW Instruction Stack Level 0 Stack Level 1 The RETLW instruction can be used to provide access to tables of constants. The recommended way to create such a table is shown in Example 3-1. Stack Level 15 EXAMPLE 3-1: Reset Vector 0000h Interrupt Vector 0004h 0005h Page 0 07FFh 0800h Page 1 Rollover to Page 0 0FFFh 1000h constants BRW RETLW RETLW RETLW RETLW DATA0 DATA1 DATA2 DATA3 RETLW INSTRUCTION ;Add Index in W to ;program counter to ;select data ;Index0 data ;Index1 data my_function ;… LOTS OF CODE… MOVLW DATA_INDEX call constants ;… THE CONSTANT IS IN W The BRW instruction makes this type of table very simple to implement. If your code must remain portable with previous generations of microcontrollers, then the BRW instruction is not available so the older table read method must be used. Rollover to Page 1 DS41575C-page 16 7FFFh  2011-2012 Microchip Technology Inc. PIC16(L)F1933 3.1.1.2 Indirect Read with FSR The program memory can be accessed as data by setting bit 7 of the FSRxH register and reading the matching INDFx register. The MOVIW instruction will place the lower eight bits of the addressed word in the W register. Writes to the program memory cannot be performed via the INDF registers. Instructions that access the program memory via the FSR require one extra instruction cycle to complete. Example 3-2 demonstrates accessing the program memory via an FSR. The HIGH directive will set bit if a label points to a location in program memory. EXAMPLE 3-2: ACCESSING PROGRAM MEMORY VIA FSR constants RETLW DATA0 ;Index0 data RETLW DATA1 ;Index1 data RETLW DATA2 RETLW DATA3 my_function ;… LOTS OF CODE… MOVLW LOW constants MOVWF FSR1L MOVLW HIGH constants MOVWF FSR1H MOVIW 0[FSR1] ;THE PROGRAM MEMORY IS IN W 3.2 3.2.1 CORE REGISTERS The core registers contain the registers that directly affect the basic operation of the PIC16(L)F1933. These registers are listed below: • • • • • • • • • • • • INDF0 INDF1 PCL STATUS FSR0 Low FSR0 High FSR1 Low FSR1 High BSR WREG PCLATH INTCON Note: The core registers are the first 12 addresses of every data memory bank. Data Memory Organization The data memory is partitioned in 32 memory banks with 128 bytes in a bank. Each bank consists of (Figure 3-2): • • • • 12 core registers 20 Special Function Registers (SFR) Up to 80 bytes of General Purpose RAM (GPR) 16 bytes of common RAM The active bank is selected by writing the bank number into the Bank Select Register (BSR). Unimplemented memory will read as ‘0’. All data memory can be accessed either directly (via instructions that use the file registers) or indirectly via the two File Select Registers (FSR). See Section 3.6 “Indirect Addressing” for more information.  2011-2012 Microchip Technology Inc. DS41575C-page 17 PIC16(L)F1933 3.2.1.1 STATUS Register The STATUS register, shown in Register 3-1, contains: • the arithmetic status of the ALU • the Reset status The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. 3.3 For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as ‘000u u1uu’ (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits (Refer to Section 29.0 “Instruction Set Summary”). Note 1: The C and DC bits operate as Borrow and Digit Borrow out bits, respectively, in subtraction. Register Definitions: Status REGISTER 3-1: U-0 STATUS: STATUS REGISTER U-0 — — U-0 R-1/q — TO R-1/q PD R/W-0/u R/W-0/u R/W-0/u Z DC(1) C(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7-5 Unimplemented: Read as ‘0’ bit 4 TO: Time-Out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-Down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(1) 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. DS41575C-page 18  2011-2012 Microchip Technology Inc. PIC16(L)F1933 3.3.1 SPECIAL FUNCTION REGISTER The Special Function Registers (SFRs) are registers used by the application to control the desired operation of peripheral functions in the device. The Special Function Registers occupy the 20 bytes after the core registers of every data memory bank (addresses x0Ch/x8Ch through x1Fh/x9Fh). The registers associated with the operation of the peripherals are described in the appropriate peripheral chapter of this data sheet. 3.3.2 FIGURE 3-2: BANKED MEMORY PARTITIONING 00h Special Function Registers (20 bytes maximum) 1Fh Linear Access to GPR 20h The general purpose RAM can be accessed in a non-banked method via the FSRs. This can simplify access to large memory structures. See Section 3.6.2 “Linear Data Memory” for more information. 3.3.3 Core Registers (12 bytes) 0Bh 0Ch GENERAL PURPOSE RAM There are up to 80 bytes of GPR in each data memory bank. 3.3.2.1 Memory Region 7-bit Bank Offset COMMON RAM General Purpose RAM (80 bytes maximum) There are 16 bytes of common RAM accessible from all banks. 6Fh 70h Common RAM (16 bytes) 7Fh 3.3.4 DEVICE MEMORY MAPS The memory maps for the device family are as shown in Table 3-2. TABLE 3-2:  2011-2012 Microchip Technology Inc. MEMORY MAP TABLES Device Banks Table No. PIC16F1933 PIC16LF1933 0-7 Table 3-3 8-15 Table 3-4,Table 3-7 16-23 Table 3-5 23-31 Table 3-6, Table 3-8 DS41575C-page 19 PIC16(L)F1933 MEMORY MAP, BANKS 0-7 BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7  2011-2012 Microchip Technology Inc. 000h 001h 002h 003h 004h 005h 006h 007h 008h 009h 00Ah 00Bh 00Ch 00Dh 00Eh 00Fh 010h 011h 012h 013h 014h 015h 016h 017h 018h 019h 01Ah 01Bh 01Ch 01Dh 01Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON PORTA PORTB PORTC — PORTE PIR1 PIR2 PIR3 — TMR0 TMR1L TMR1H T1CON T1GCON TMR2 PR2 T2CON — CPSCON0 080h 081h 082h 083h 084h 085h 086h 087h 088h 089h 08Ah 08Bh 08Ch 08Dh 08Eh 08Fh 090h 091h 092h 093h 094h 095h 096h 097h 098h 099h 09Ah 09Bh 09Ch 09Dh 09Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON TRISA TRISB TRISC — TRISE PIE1 PIE2 PIE3 — OPTION_REG PCON WDTCON OSCTUNE OSCCON OSCSTAT ADRESL ADRESH ADCON0 ADCON1 100h 101h 102h 103h 104h 105h 106h 107h 108h 109h 10Ah 10Bh 10Ch 10Dh 10Eh 10Fh 110h 111h 112h 113h 114h 115h 116h 117h 118h 119h 11Ah 11Bh 11Ch 11Dh 11Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON LATA LATB LATC — — CM1CON0 CM1CON1 CM2CON0 CM2CON1 CMOUT BORCON FVRCON DACCON0 DACCON1 SRCON0 SRCON1 — APFCON — 180h 181h 182h 183h 184h 185h 186h 187h 188h 189h 18Ah 18Bh 18Ch 18Dh 18Eh 18Fh 190h 191h 192h 193h 194h 195h 196h 197h 198h 199h 19Ah 19Bh 19Ch 19Dh 19Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON ANSELA ANSELB — — — EEADRL EEADRH EEDATL EEDATH EECON1 EECON2 — — RCREG TXREG SPBRGL SPBRGH RCSTA TXSTA 200h 201h 202h 203h 204h 205h 206h 207h 208h 209h 20Ah 20Bh 20Ch 20Dh 20Eh 20Fh 210h 211h 212h 213h 214h 215h 216h 217h 218h 219h 21Ah 21Bh 21Ch 21Dh 21Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — WPUB — — WPUE SSPBUF SSPADD SSPMSK SSPSTAT SSPCON1 SSPCON2 SSPCON3 — — — — — — — 280h 281h 282h 283h 284h 285h 286h 287h 288h 289h 28Ah 28Bh 28Ch 28Dh 28Eh 28Fh 290h 291h 292h 293h 294h 295h 296h 297h 298h 299h 29Ah 29Bh 29Ch 29Dh 29Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — CCPR1L CCPR1H CCP1CON PWM1CON CCP1AS PSTR1CON — CCPR2L CCPR2H CCP2CON PWM2CON CCP2AS PSTR2CON CCPTMRS0 300h 301h 302h 303h 304h 305h 306h 307h 308h 309h 30Ah 30Bh 30Ch 30Dh 30Eh 30Fh 310h 311h 312h 313h 314h 315h 316h 317h 318h 319h 31Ah 31Bh 31Ch 31Dh 31Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — CCPR3L CCPR3H CCP3CON PWM3CON CCP3AS PSTR3CON — CCPR4L CCPR4H CCP4CON — CCPR5L CCPR5H CCP5CON 380h 381h 382h 383h 384h 385h 386h 387h 388h 389h 38Ah 38Bh 38Ch 38Dh 38Eh 38Fh 390h 391h 392h 393h 394h 395h 396h 397h 398h 399h 39Ah 39Bh 39Ch 39Dh 39Eh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — IOCBP IOCBN IOCBF — — — — — — — — 01Fh 020h CPSCON1 09Fh 0A0h — 11Fh 120h — 19Fh 1A0h BAUDCTR 21Fh 220h — 29Fh 2A0h CCPTMRS1 31Fh 320h — 39Fh 3A0h — General Purpose Register 80 Bytes 06Fh 070h 0EFh 0F0h Legend: 16Fh 170h Accesses 70h – 7Fh Common RAM 07Fh General Purpose Register 80 Bytes General Purpose Register 80 Bytes 0FFh Unimplemented Read as ‘0’ 1EFh 1F0h Accesses 70h – 7Fh 17Fh = Unimplemented data memory locations, read as ‘0’. Unimplemented Read as ‘0’ 26Fh 270h Accesses 70h – 7Fh) 1FFh Unimplemented Read as ‘0’ 27Fh 36Fh 370h 2EFh 2F0h Accesses 70h – 7Fh Unimplemented Read as ‘0’ Accesses 70h – 7Fh 2FFh Unimplemented Read as ‘0’ 3EFh 3F0h Accesses 70h – 7Fh 37Fh Accesses 70h – 7Fh 3FFh PIC16(L)F1933 DS41575C-page 20 TABLE 3-3: PIC16(L)F1933 MEMORY MAP, BANKS 8-15 BANK 8  2011-2012 Microchip Technology Inc. 400h 401h 402h 403h 404h 405h 406h 407h 408h 409h 40Ah 40Bh 40Ch 40Dh 40Eh 40Fh 410h 411h 412h 413h 414h 415h 416h 417h 418h 419h 41Ah 41Bh 41Ch 41Dh 41Eh 41Fh 420h INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — TMR4 PR4 T4CON — — — — TMR6 PR6 T6CON — BANK 9 480h 481h 482h 483h 484h 485h 486h 487h 488h 489h 48Ah 48Bh 48Ch 48Dh 48Eh 48Fh 490h 491h 492h 493h 494h 495h 496h 497h 498h 499h 49Ah 49Bh 49Ch 49Dh 49Eh 49Fh 4A0h Unimplemented Read as ‘0’ 46Fh 470h Legend: BANK 10 500h 501h 502h 503h 504h 505h 506h 507h 508h 509h 50Ah 50Bh 50Ch 50Dh 50Eh 50Fh 510h 511h 512h 513h 514h 515h 516h 517h 518h 519h 51Ah 51Bh 51Ch 51Dh 51Eh 51Fh 520h Unimplemented Read as ‘0’ 4EFh 4F0h Accesses 70h – 7Fh 47Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 11 580h 581h 582h 583h 584h 585h 586h 587h 588h 589h 58Ah 58Bh 58Ch 58Dh 58Eh 58Fh 590h 591h 592h 593h 594h 595h 596h 597h 598h 599h 59Ah 59Bh 59Ch 59Dh 59Eh 59Fh 5A0h Unimplemented Read as ‘0’ 56Fh 570h Accesses 70h – 7Fh 4FFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — Unimplemented Read as ‘0’ 5EFh 5F0h Accesses 70h – 7Fh 57Fh = Unimplemented data memory locations, read as ‘0’. BANK 12 600h 601h 602h 603h 604h 605h 606h 607h 608h 609h 60Ah 60Bh 60Ch 60Dh 60Eh 60Fh 610h 611h 612h 613h 614h 615h 616h 617h 618h 619h 61Ah 61Bh 61Ch 61Dh 61Eh 61Fh 620h BANK 13 680h 681h 682h 683h 684h 685h 686h 687h 688h 689h 68Ah 68Bh 68Ch 68Dh 68Eh 68Fh 690h 691h 692h 693h 694h 695h 696h 697h 698h 699h 69Ah 69Bh 69Ch 69Dh 69Eh 69Fh 6A0h Unimplemented Read as ‘0’ 66Fh 670h Accesses 70h – 7Fh 5FFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 14 700h 701h 702h 703h 704h 705h 706h 707h 708h 709h 70Ah 70Bh 70Ch 70Dh 70Eh 70Fh 710h 711h 712h 713h 714h 715h 716h 717h 718h 719h 71Ah 71Bh 71Ch 71Dh 71Eh 71Fh 720h Unimplemented Read as ‘0’ 6EFh 6F0h Accesses 70h – 7Fh 67Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 15 780h 781h 782h 783h 784h 785h 786h 787h 788h 789h 78Ah 78Bh 78Ch 78Dh 78Eh 78Fh 790h 791h 792h 793h 794h 795h 796h 797h 798h 799h 79Ah 79Bh 79Ch 79Dh 79Eh 79Fh 7A0h INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — See Table 3-7 Unimplemented Read as ‘0’ 76Fh 770h Accesses 70h – 7Fh 6FFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — 7EFh 7F0h Accesses 70h – 7Fh 77Fh Accesses 70h – 7Fh 7FFh PIC16(L)F1933 DS41575C-page 21 TABLE 3-4: PIC16(L)F1933 MEMORY MAP, BANKS 16-23 BANK 16  2011-2012 Microchip Technology Inc. 800h 801h 802h 803h 804h 805h 806h 807h 808h 809h 80Ah 80Bh 80Ch 80Dh 80Eh 80Fh 810h 811h 812h 813h 814h 815h 816h 817h 818h 819h 81Ah 81Bh 81Ch 81Dh 81Eh 81Fh 820h INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 17 880h 881h 882h 883h 884h 885h 886h 887h 888h 889h 88Ah 88Bh 88Ch 88Dh 88Eh 88Fh 890h 891h 892h 893h 894h 895h 896h 897h 898h 899h 89Ah 89Bh 89Ch 89Dh 89Eh 89Fh 8A0h Unimplemented Read as ‘0’ 86Fh 870h Legend: BANK 18 900h 901h 902h 903h 904h 905h 906h 907h 908h 909h 90Ah 90Bh 90Ch 90Dh 90Eh 90Fh 910h 911h 912h 913h 914h 915h 916h 917h 918h 919h 91Ah 91Bh 91Ch 91Dh 91Eh 91Fh 920h Unimplemented Read as ‘0’ 8EFh 8F0h 8FFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 19 980h 981h 982h 983h 984h 985h 986h 987h 988h 989h 98Ah 98Bh 98Ch 98Dh 98Eh 98Fh 990h 991h 992h 993h 994h 995h 996h 997h 998h 999h 99Ah 99Bh 99Ch 99Dh 99Eh 99Fh 9A0h Unimplemented Read as ‘0’ INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — Accesses 70h – 7Fh 97Fh = Unimplemented data memory locations, read as ‘0’. BANK 20 A00h A01h A02h A03h A04h A05h A06h A07h A08h A09h A0Ah A0Bh A0Ch A0Dh A0Eh A0Fh A10h A11h A12h A13h A14h A15h A16h A17h A18h A19h A1Ah A1Bh A1Ch A1Dh A1Eh A1Fh A20h Unimplemented Read as ‘0’ 9EFh 9F0h 96Fh 970h Accesses 70h – 7Fh Accesses 70h – 7Fh 87Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 21 A80h A81h A82h A83h A84h A85h A86h A87h A88h A89h A8Ah A8Bh A8Ch A8Dh A8Eh A8Fh A90h A91h A92h A93h A94h A95h A96h A97h A98h A99h A9Ah A9Bh A9Ch A9Dh A9Eh A9Fh AA0h Unimplemented Read as ‘0’ BANK 22 B00h B01h B02h B03h B04h B05h B06h B07h B08h B09h B0Ah B0Bh B0Ch B0Dh B0Eh B0Fh B10h B11h B12h B13h B14h B15h B16h B17h B18h B19h B1Ah B1Bh B1Ch B1Dh B1Eh B1Fh B20h Unimplemented Read as ‘0’ Accesses 70h – 7Fh A7Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — AEFh AF0h A6Fh A70h Accesses 70h – 7Fh 9FFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 23 B80h B81h B82h B83h B84h B85h B86h B87h B88h B89h B8Ah B8Bh B8Ch B8Dh B8Eh B8Fh B90h B91h B92h B93h B94h B95h B96h B97h B98h B99h B9Ah B9Bh B9Ch B9Dh B9Eh B9Fh BA0h Unimplemented Read as ‘0’ Unimplemented Read as ‘0’ Accesses 70h – 7Fh B7Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BEFh BF0h B6Fh B70h Accesses 70h – 7Fh AFFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — Accesses 70h – 7Fh BFFh PIC16(L)F1933 DS41575C-page 22 TABLE 3-5: PIC16(L)F1933 MEMORY MAP, BANKS 24-31 BANK 24  2011-2012 Microchip Technology Inc. C00h C01h C02h C03h C04h C05h C06h C07h C08h C09h C0Ah C0Bh C0Ch C0Dh C0Eh C0Fh C10h C11h C12h C13h C14h C15h C16h C17h C18h C19h C1Ah C1Bh C1Ch C1Dh C1Eh C1Fh C20h INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 25 C80h C81h C82h C83h C84h C85h C86h C87h C88h C89h C8Ah C8Bh C8Ch C8Dh C8Eh C8Fh C90h C91h C92h C93h C94h C95h C96h C97h C98h C99h C9Ah C9Bh C9Ch C9Dh C9Eh C9Fh CA0h Unimplemented Read as ‘0’ C6Fh C70h Legend: BANK 26 D00h D01h D02h D03h D04h D05h D06h D07h D08h D09h D0Ah D0Bh D0Ch D0Dh D0Eh D0Fh D10h D11h D12h D13h D14h D15h D16h D17h D18h D19h D1Ah D1Bh D1Ch D1Dh D1Eh D1Fh D20h Unimplemented Read as ‘0’ CEFh CF0h Accesses 70h – 7Fh CFFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 27 D80h D81h D82h D83h D84h D85h D86h D87h D88h D89h D8Ah D8Bh D8Ch D8Dh D8Eh D8Fh D90h D91h D92h D93h D94h D95h D96h D97h D98h D99h D9Ah D9Bh D9Ch D9Dh D9Eh D9Fh DA0h Unimplemented Read as ‘0’ D6Fh D70h Accesses 70h – 7Fh CFFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — Unimplemented Read as ‘0’ DEFh DF0h Accesses 70h – 7Fh D7Fh = Unimplemented data memory locations, read as ‘0’. BANK 28 E00h E01h E02h E03h E04h E05h E06h E07h E08h E09h E0Ah E0Bh E0Ch E0Dh E0Eh E0Fh E10h E11h E12h E13h E14h E15h E16h E17h E18h E19h E1Ah E1Bh E1Ch E1Dh E1Eh E1Fh E20h BANK 29 E80h E81h E82h E83h E84h E85h E86h E87h E88h E89h E8Ah E8Bh E8Ch E8Dh E8Eh E8Fh E90h E91h E92h E93h E94h E95h E96h E97h E98h E99h E9Ah E9Bh E9Ch E9Dh E9Eh E9Fh EA0h Unimplemented Read as ‘0’ E6Fh E70h Accesses 70h – 7Fh DFFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 30 F00h F01h F02h F03h F04h F05h F06h F07h F08h F09h F0Ah F0Bh F0Ch F0Dh F0Eh F0Fh F10h F11h F12h F13h F14h F15h F16h F17h F18h F19h F1Ah F1Bh F1Ch F1Dh F1Eh F1Fh F20h Unimplemented Read as ‘0’ EEFh EF0h Accesses 70h – 7Fh E7Fh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — BANK 31 F80h F81h F82h F83h F84h F85h F86h F87h F88h F89h F8Ah F8Bh F8Ch F8Dh F8Eh F8Fh F90h F91h F92h F93h F94h F95h F96h F97h F98h F99h F9Ah F9Bh F9Ch F9Dh F9Eh F9Fh FA0h INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON See Table 3-8 Unimplemented Read as ‘0’ F6Fh F70h Accesses 70h – 7Fh EFFh INDF0 INDF1 PCL STATUS FSR0L FSR0H FSR1L FSR1H BSR WREG PCLATH INTCON — — — — — — — — — — — — — — — — — — — — FEFh FF0h Accesses 70h – 7Fh F7Fh Accesses 70h – 7Fh FFFh PIC16(L)F1933 DS41575C-page 23 TABLE 3-6: PIC16(L)F1933 TABLE 3-7: PIC16(L)F1933 MEMORY MAP, BANK 15 TABLE 3-8: Bank 15 791h 792h 793h 794h 795h 796h 797h 798h 799h 79Ah 79Bh 79Ch 79Dh 79Eh 79Fh 7A0h 7A1h 7A2h 7A3h 7A4h 7A5h 7A6h 7A7h 7A8h 7A9h 7AAh 7ABh 7ACh 7ADh 7AEh 7AFh 7B0h 7B1h 7B2h 7B3h 7B4h 7B5h 7B6h 7B7h 7B8h LCDCON LCDPS LCDREF LCDCST LCDRL — — LCDSE0 LCDSE1 — — — — — — LCDDATA0 LCDDATA1 — LCDDATA3 LCDDATA4 — LCDDATA6 LCDDATA7 — LCDDATA9 LCDDATA10 — — — — — — — — — — — — — Bank 31 F8Ch Unimplemented Read as ‘0’ FE3h FE4h FE5h FE6h FE7h FE8h FE9h FEAh FEBh FECh FEDh FEEh FEFh Legend: 3.3.5 STATUS_SHAD WREG_SHAD BSR_SHAD PCLATH_SHAD FSR0L_SHAD FSR0H_SHAD FSR1L_SHAD FSR1H_SHAD — STKPTR TOSL TOSH = Unimplemented data memory locations, read as ‘0’. SPECIAL FUNCTION REGISTERS SUMMARY The Special Function Register Summary for the device family are as follows: Device PIC16(L)F1933 Unimplemented Read as ‘0’ 7EFh Legend: PIC16(L)F1933 MEMORY MAP, BANK 31 = Unimplemented data memory locations, read as ‘0’. DS41575C-page 24 Bank(s) Page No. 0 25 1 26 2 27 3 28 4 29 5 30 6 31 7 32 8 33 9-14 34 15 35 16-30 36 31 37  2011-2012 Microchip Technology Inc. PIC16(L)F1933 = TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 0 000h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 001h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 002h(2) PCL Program Counter (PC) Least Significant Byte 003h(2) STATUS 004h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 005h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 006h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 007h(2) FSR1H Indirect Data Memory Address 1 High Pointer 008h(2) BSR 009h(2) WREG 00Ah(1, 2) PCLATH — 00Bh(2) INTCON GIE — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE -000 0000 -000 0000 TMR0IF INTF IOCIF 0000 0000 0000 0000 00Ch PORTA PORTA Data Latch when written: PORTA pins when read xxxx xxxx uuuu uuuu 00Dh PORTB PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu 00Eh PORTC PORTC Data Latch when written: PORTC pins when read xxxx xxxx uuuu uuuu 00Fh — Unimplemented 010h PORTE 011h 012h 013h — — — — PIR1 TMR1GIF ADIF PIR2 OSFIF C2IF PIR3 — CCP5IF — — RE3 — — — ---- x--- ---- u--- RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000 C1IF EEIF BCLIF LCDIF — CCP2IF 0000 00-0 0000 00-0 CCP4IF CCP3IF TMR6IF — TMR4IF — -000 0-0- -000 0-0- 014h — Unimplemented 015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu 016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 018h T1CON 019h T1GCON 01Ah TMR2 Timer 2 Module Register 01Bh PR2 Timer 2 Period Register 01Ch T2CON 01Dh — 01Eh CPSCON0 CPSON CPSRM — — 01Fh CPSCON1 — — — — Legend: Note 1: 2: 3: — TMR1CS TMR1GE T1GPOL — T1CKPS T1GTM T1GSPM — xxxx xxxx uuuu uuuu T1OSCEN T1SYNC — T1GGO/ DONE T1GVAL T1GSS TMR1ON 0000 00-0 uuuu uu-u 0000 0x00 uuuu uxuu 0000 0000 0000 0000 1111 1111 1111 1111 T2OUTPS TMR2ON T2CKPS Unimplemented -000 0000 -000 0000 — CPSRNG1 CPSRNG0 CPSOUT — CPSCH T0XCS — 00-- 0000 00-- 0000 ---- -000 ---- -000 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 25 PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 1 080h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 081h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 082h(2) PCL Program Counter (PC) Least Significant Byte 083h(2) STATUS 084h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 085h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 086h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 087h(2) FSR1H Indirect Data Memory Address 1 High Pointer 088h(2) BSR 089h(2) WREG 08Ah(1, 2) PCLATH — 08Bh(2) INTCON GIE 08Ch TRISA PORTA Data Direction Register 1111 1111 1111 1111 08Dh TRISB PORTB Data Direction Register 1111 1111 1111 1111 08Eh TRISC PORTC Data Direction Register 1111 1111 1111 1111 08Fh — Unimplemented 090h TRISE — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE -000 0000 -000 0000 TMR0IF INTF IOCIF 0000 0000 0000 0000 — — — — — — —(3) — — — ---- 1--- ---- 1--0000 0000 0000 0000 091h PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 092h PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 0000 00-0 0000 00-0 093h PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — -000 0-0- -000 0-0- PSA 094h — 095h OPTION_REG WPUEN INTEDG TMROCS TMROSE 096h PCON STKOVF STKUNF — — 097h WDTCON — — 098h OSCTUNE — — 099h OSCCON SPLLEN 09Ah OSCSTAT T1OSCR 09Bh ADRESL A/D Result Register Low 09Ch ADRESH A/D Result Register High 09Dh ADCON0 09Eh ADCON1 09Fh — Legend: Note 1: 2: 3: Unimplemented — RMCLR ADFM POR OSTS HFIOFR BOR 00-- 11qq qq-- qquu SWDTEN --01 0110 --01 0110 --00 0000 --00 0000 — HFIOFL — 1111 1111 1111 1111 TUN MFIOFR SCS LFIOFR HFIOFS 0011 1-00 0011 1-00 00q0 0q0- qqqq qq0xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu — Unimplemented RI WDTPS IRCF PLLR PS CHS ADCS GO/DONE — ADNREF ADON -000 0000 -000 0000 ADPREF1 ADPREF0 0000 -000 0000 -000 — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 26  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 2 100h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 101h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 102h(2) PCL Program Counter (PC) Least Significant Byte 103h(2) STATUS 104h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 105h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 106h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 107h(2) FSR1H Indirect Data Memory Address 1 High Pointer 108h(2) BSR 109h(2) WREG 10Ah(1, 2) PCLATH — 10Bh(2) INTCON GIE — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE -000 0000 -000 0000 TMR0IF INTF IOCIF 0000 0000 0000 0000 10Ch LATA PORTA Data Latch xxxx xxxx uuuu uuuu 10Dh LATB PORTB Data Latch xxxx xxxx uuuu uuuu 10Eh LATC PORTC Data Latch xxxx xxxx uuuu uuuu 10Fh — Unimplemented — — 110h — Unimplemented — — 111h CM1CON0 C1ON C1OUT C1OE C1POL — 112h CM1CON1 C1INTP C1INTN C1PCH1 C1PCH0 — — 113h CM2CON0 C2ON C2OUT C2OE C2POL — C2SP 114h CM2CON1 C2INTP C2INTN C2PCH1 C2PCH0 — — 115h CMOUT — — — — — — MC2OUT MC1OUT ---- --00 ---- --00 116h BORCON SBOREN — — — — — — BORRDY 1--- ---q u--- ---u 117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR1 CDAFVR0 118h DACCON0 DACEN DACLPS DACOE --- C1SP DACPSS C1HYS C1SYNC 0000 -100 0000 -100 C1NCH C2HYS C2NCH ADFVR --- 0000 --00 0000 --00 C2SYNC 0000 -100 0000 -100 0000 --00 0000 --00 0q00 0000 0q00 0000 DACNSS 000- 00-0 000- 00-0 119h DACCON1 --- --- --- 11Ah SRCON0 SRLEN SRCLK2 SRCLK1 SRCLK0 SRQEN SRNQEN SRPS 11Bh SRCON1 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E 0000 0000 0000 0000 11Ch — 11Dh APFCON T1GSEL P2BSEL SSSEL CCP2SEL -000 0000 -000 0000 11Eh — Unimplemented — — 11Fh — Unimplemented — — Legend: Note 1: 2: 3: DACR ---0 0000 ---0 0000 Unimplemented — CCP3SEL SRPR 0000 0000 0000 0000 — SRNQSEL C2OUTSEL — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 27 PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 3 180h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 181h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 182h(2) PCL Program Counter (PC) Least Significant Byte 183h(2) STATUS 184h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 185h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 186h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 187h(2) FSR1H Indirect Data Memory Address 1 High Pointer 188h(2) BSR 189h(2) WREG 18Ah(1, 2) PCLATH — 18Bh(2) INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 18Ch ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 --11 1111 --11 1111 18Dh ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 --11 1111 --11 1111 18Eh — Unimplemented — — 18Fh — Unimplemented — — 190h — Unimplemented — — 191h EEADRL EEPROM / Program Memory Address Register Low Byte 192h EEADRH 193h EEDATL 194h EEDATH 195h EECON1 196h EECON2 EEPROM control register 2 197h — Unimplemented — — 198h — Unimplemented — — 199h RCREG USART Receive Data Register 19Ah TXREG USART Transmit Data Register 19Bh SPBRGL BRG 19Ch SPBRGH BRG 19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x 19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010 19Fh BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00 Legend: Note 1: 2: 3: — — — — — 0000 0000 0000 0000 TO PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register —(3) 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000 0000 0000 0000 0000 EEPROM / Program Memory Address Register High Byte 1000 0000 1000 0000 EEPROM / Program Memory Read Data Register Low Byte — — EEPGD CFGS ---1 1000 ---q quuu xxxx xxxx uuuu uuuu EEPROM / Program Memory Read Data Register High Byte LWLO FREE WRERR WREN WR --xx xxxx --uu uuuu RD 0000 x000 0000 q000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 28  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 4 200h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 201h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 202h(2) PCL Program Counter (PC) Least Significant Byte 203h(2) STATUS 204h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 205h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 206h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 207h(2) FSR1H Indirect Data Memory Address 1 High Pointer 208h(2) BSR 209h(2) WREG 20Ah(1, 2) PCLATH — 20Bh(2) INTCON GIE 20Ch — 20Dh WPUB 20Eh — Unimplemented — — 20Fh — Unimplemented — — 210h WPUE — — — — — 0000 0000 0000 0000 TO PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE -000 0000 -000 0000 TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111 Unimplemented WPUB7 — WPUB6 — ---1 1000 ---q quuu — — — WPUE3 — — — — ---- 1--- ---- 1--- 211h SSPBUF 212h SSPADD ADD 213h SSPMSK MSK 214h SSPSTAT SMP CKE D/A P 215h SSPCON1 WCOL SSPOV SSPEN CKP 216h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000 217h SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000 218h — Unimplemented — — 219h — Unimplemented — — 21Ah — Unimplemented — — 21Bh — Unimplemented — — 21Ch — Unimplemented — — 21Dh — Unimplemented — — 21Eh — Unimplemented — — 21Fh — Unimplemented — — Legend: Note 1: 2: 3: xxxx xxxx uuuu uuuu Synchronous Serial Port Receive Buffer/Transmit Register 0000 0000 0000 0000 1111 1111 1111 1111 S R/W UA BF SSPM 0000 0000 0000 0000 0000 0000 0000 0000 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 29 PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 5 280h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 281h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 282h(2) PCL Program Counter (PC) Least Significant Byte 283h(2) STATUS 284h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 285h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 286h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 287h(2) FSR1H Indirect Data Memory Address 1 High Pointer 288h(2) BSR 289h(2) WREG 28Ah(1, 2) PCLATH — 28Bh(2) INTCON GIE 28Ch — Unimplemented — — 28Dh — Unimplemented — — 28Eh — Unimplemented — — 28Fh — Unimplemented — — 290h — Unimplemented — — 291h CCPR1L Capture/Compare/PWM Register 1 (LSB) 292h CCPR1H Capture/Compare/PWM Register 1 (MSB) 293h CCP1CON 294h PWM1CON 295h CCP1AS 296h PSTR1CON 297h — Unimplemented 298h CCPR2L Capture/Compare/PWM Register 2 (LSB) 299h CCPR2H Capture/Compare/PWM Register 2 (MSB) 29Ah CCP2CON 29Bh PWM2CON 29Ch CCP2AS 29Dh PSTR2CON — — — STR2SYNC STR2D STR2C 29Eh CCPTMRS0 C4TSEL1 C4TSEL0 C3TSEL1 C3TSEL0 C2TSEL1 C2TSEL0 29Fh CCPTMRS1 — — — — — — Legend: Note 1: 2: 3: — — — — — 0000 0000 0000 0000 TO PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE P1M TMR0IE INTE IOCIE -000 0000 -000 0000 TMR0IF INTF IOCIF xxxx xxxx uuuu uuuu DC1B CCP1M 0000 0000 0000 0000 P1DC CCP1AS — — — 0000 0000 0000 0000 xxxx xxxx uuuu uuuu P1RSEN CCP1ASE ---1 1000 ---q quuu 0000 0000 0000 0000 PSS1AC STR1SYNC STR1D STR1C PSS1BD STR1B STR1A 0000 0000 0000 0000 ---0 0001 ---0 0001 — P2M xxxx xxxx uuuu uuuu DC2B P2RSEN CCP2M 0000 0000 0000 0000 P2DC CCP2ASE — xxxx xxxx uuuu uuuu CCP2AS 0000 0000 0000 0000 PSS2AC PSS2BD STR2B STR2A 0000 0000 0000 0000 ---0 0001 ---0 0001 C1TSEL1 C1TSEL0 0000 0000 0000 0000 C5TSEL ---- --00 ---- --00 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 30  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 6 300h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 301h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 302h(2) PCL Program Counter (PC) Least Significant Byte 303h(2) STATUS 304h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 305h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 306h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 307h(2) FSR1H Indirect Data Memory Address 1 High Pointer 308h(2) BSR 309h(2) WREG 30Ah(1, 2) PCLATH — 30Bh(2) INTCON GIE 30Ch — Unimplemented — — 30Dh — Unimplemented — — 30Eh — Unimplemented — — 30Fh — Unimplemented — — 310h — Unimplemented — — 311h CCPR3L Capture/Compare/PWM Register 3 (LSB) 312h CCPR3H Capture/Compare/PWM Register 3 (MSB) 313h CCP3CON 314h PWM3CON 315h CCP3AS 316h PSTR3CON — — — — — C 0000 0000 0000 0000 ---0 0000 ---0 0000 Write Buffer for the upper 7 bits of the Program Counter PEIE P3M TMR0IE INTE — INTF IOCIF — — xxxx xxxx uuuu uuuu CCP3M STR3SYNC 319h CCPR4H Capture/Compare/PWM Register 4 (MSB) 31Ah CCP4CON 0000 0000 0000 0000 xxxx xxxx uuuu uuuu CCP3AS Unimplemented 0000 0000 0000 0000 0000 0000 0000 0000 PSS3AC STR3D STR3C PSS3BD STR3B STR3A 0000 0000 0000 0000 ---0 0001 ---0 0001 — — DC4B 31Bh — Unimplemented 31Ch CCPR5L Capture/Compare/PWM Register 5 (LSB) 31Dh CCPR5H Capture/Compare/PWM Register 5 (MSB) 31Eh CCP5CON 31Fh — — -000 0000 -000 0000 TMR0IF P3DC Capture/Compare/PWM Register 4 (LSB) — IOCIE DC3B P3RSEN CCP3ASE ---1 1000 ---q quuu 0000 0000 uuuu uuuu — 2: 3: DC Working Register CCPR4L 1: Z BSR 318h Note PD — 317h Legend: 0000 0000 0000 0000 TO xxxx xxxx uuuu uuuu CCP4M --00 0000 --00 0000 — — Unimplemented DC5B — xxxx xxxx uuuu uuuu — xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu CCP5M --00 0000 --00 0000 — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 31 PIC16(L)F1933 TABLE 3-9: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 7 380h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 381h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 382h(2) PCL Program Counter (PC) Least Significant Byte 383h(2) STATUS 384h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 385h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 386h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 387h(2) FSR1H Indirect Data Memory Address 1 High Pointer 388h(2) BSR 389h(2) WREG 38Ah(1, 2) PCLATH — 38Bh(2) INTCON GIE 38Ch — Unimplemented — — 38Dh — Unimplemented — — 38Eh — Unimplemented — — 38Fh — Unimplemented — — 390h — Unimplemented — — 391h — Unimplemented — — 392h — Unimplemented — — 393h — Unimplemented — — 394h IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 0000 0000 0000 0000 395h IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 0000 0000 0000 0000 396h IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 0000 0000 0000 0000 397h — Unimplemented — — 398h — Unimplemented — — 399h — Unimplemented — — 39Ah — Unimplemented — — 39Bh — Unimplemented — — 39Ch — Unimplemented — — 39Dh — Unimplemented — — 39Eh — Unimplemented — — 39Fh — Unimplemented — — Legend: Note 1: 2: 3: — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE TMR0IF -000 0000 -000 0000 INTF IOCIF 0000 0000 0000 0000 x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 32  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 8 400h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 401h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 402h(2) PCL Program Counter (PC) Least Significant Byte 403h(2) STATUS 404h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 405h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 406h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 407h(2) FSR1H Indirect Data Memory Address 1 High Pointer 408h(2) BSR 409h(2) WREG 40Ah(1, 2) PCLATH — 40Bh(2) INTCON GIE 40Ch — Unimplemented — — 40Dh — Unimplemented — — 40Eh — Unimplemented — — 40Fh — Unimplemented — — 410h — Unimplemented — — 411h — Unimplemented — — 412h — Unimplemented — — 413h — Unimplemented — — 414h — Unimplemented — — 415h TMR4 Timer 4 Module Register 416h PR4 Timer 4 Period Register 417h T4CON 418h — Unimplemented — — 419h — Unimplemented — — 41Ah — Unimplemented — — 41Bh — Unimplemented — — 41Ch TMR6 Timer 6 Module Register 41Dh PR6 Timer 6 Period Register 41Eh T6CON 41Fh — Legend: Note 1: 2: 3: — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE — — Unimplemented ---1 1000 ---q quuu TMR0IE INTE IOCIE TMR0IF -000 0000 -000 0000 INTF IOCIF 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 T4OUTPS TMR4ON T4CKPS -000 0000 -000 0000 0000 0000 0000 0000 1111 1111 1111 1111 T6OUTPS TMR6ON T6CKPS -000 0000 -000 0000 — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 33 PIC16(L)F1933 TABLE 3-9: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Banks 9-14 x00h/ x80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x00h/ x81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x02h/ x82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x03h/ x83h(2) STATUS x04h/ x84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h/ x85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h/ x86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h/ x87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x08h/ x88h(2) BSR x09h/ x89h(2) WREG x0Ah/ PCLATH x8Ah(1),(2) x0Bh/ x8Bh(2) INTCON x0Ch/ x8Ch — x1Fh/ x9Fh — Legend: Note 1: 2: 3: — — — — — TO PD — Z DC C BSR ---0 0000 ---0 0000 Working Register — GIE 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE Unimplemented ---1 1000 ---q quuu TMR0IE INTE IOCIE TMR0IF -000 0000 -000 0000 INTF IOCIF 0000 0000 0000 0000 — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 34  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 15 780h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 781h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx 782h(2) PCL Program Counter (PC) Least Significant Byte 783h(2) STATUS 784h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu 785h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 786h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu 787h(2) FSR1H Indirect Data Memory Address 1 High Pointer 788h(2) BSR 789h(2) WREG 78Ah(1, 2) PCLATH — 78Bh(2) INTCON GIE 78Ch — 790h — 791h LCDCON 792h LCDPS 793h — — — — — 0000 0000 0000 0000 TO PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE -000 0000 -000 0000 TMR0IF INTF IOCIF Unimplemented 0000 0000 0000 0000 — — LCDEN SLPEN WERR — WFT BIASMD LCDA WA LCDREF LCDIRE LCDIRS LCDIRI — VLCD3PE 794h LCDCST — — — — — LCDCST ---- -000 ---- -000 795h LCDRL — LRLAT 0000 -000 0000 -000 796h — Unimplemented — — 797h — Unimplemented — — 798h LCDSE0 799h LCDSE1 79Ah — 79Fh — 7A0h LCDDATA0 SEG7 COM0 SEG6 COM0 SEG5 COM0 SEG4 COM0 SEG3 COM0 SEG2 COM0 SEG1 COM0 SEG0 COM0 xxxx xxxx uuuu uuuu 7A1h LCDDATA1 SEG15 COM0 SEG14 COM0 SEG13 COM0 SEG12 COM0 SEG11 COM0 SEG10 COM0 SEG9 COM0 SEG8 COM0 xxxx xxxx uuuu uuuu LRLAP CS LMUX LP LRLBP VLCD2PE VLCD1PE 000- 0011 000- 0011 0000 0000 0000 0000 — 000- 000- 000- 000- SE 0000 0000 uuuu uuuu SE 0000 0000 uuuu uuuu Unimplemented — — 7A2h — 7A3h LCDDATA3 SEG7 COM1 SEG6 COM1 SEG5 COM1 SEG4 COM1 SEG3 COM1 SEG2 COM1 SEG1 COM1 SEG0 COM1 xxxx xxxx uuuu uuuu 7A4h LCDDATA4 SEG15 COM1 SEG14 COM1 SEG13 COM1 SEG12 COM1 SEG11 COM1 SEG10 COM1 SEG9 COM1 SEG8 COM1 xxxx xxxx uuuu uuuu Unimplemented — — 7A5h — 7A6h LCDDATA6 SEG7 COM2 SEG6 COM2 SEG5 COM2 SEG4 COM2 SEG3 COM2 SEG2 COM2 SEG1 COM2 SEG0 COM2 xxxx xxxx uuuu uuuu 7A7h LCDDATA7 SEG15 COM2 SEG14 COM2 SEG13 COM2 SEG12 COM2 SEG11 COM2 SEG10 COM2 SEG9 COM2 SEG8 COM2 xxxx xxxx uuuu uuuu Unimplemented — — 7A8h — 7A9h LCDDATA9 SEG7 COM3 SEG6 COM3 SEG5 COM3 SEG4 COM3 SEG3 COM3 SEG2 COM3 SEG1 COM3 SEG0 COM3 xxxx xxxx uuuu uuuu 7AAh LCDDATA10 SEG15 COM3 SEG14 COM3 SEG13 COM3 SEG12 COM3 SEG11 COM3 SEG10 COM3 SEG9 COM3 SEG8 COM3 xxxx xxxx uuuu uuuu 7ABh — 7EFh — Legend: Note 1: 2: 3: Unimplemented Unimplemented — — — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 35 PIC16(L)F1933 TABLE 3-9: Address Name SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Banks 16-30 x00h/ x80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x00h/ x81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx x02h/ x82h(2) PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000 x03h/ x83h(2) STATUS x04h/ x84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu x05h/ x85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 x06h/ x86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu x07h/ x87h(2) FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000 x08h/ x88h(2) BSR x09h/ x89h(2) WREG x0Ah/ PCLATH x8Ah(1),(2) x0Bh/ x8Bh(2) INTCON x0Ch/ x8Ch — x1Fh/ x9Fh — Legend: Note 1: 2: 3: — — — — — TO PD — Z DC C BSR ---0 0000 ---0 0000 Working Register — GIE 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE Unimplemented ---1 1000 ---q quuu TMR0IE INTE IOCIE TMR0IF -000 0000 -000 0000 INTF IOCIF 0000 0000 0000 0000 — — x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’. DS41575C-page 36  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 3-9: Address SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Bank 31 F80h(2) INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory (not a physical register) xxxx xxxx xxxx xxxx F81h(2) INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory (not a physical register) xxxx xxxx xxxx xxxx F82h(2) PCL Program Counter (PC) Least Significant Byte F83h(2) STATUS F84h(2) FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu F85h(2) FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000 F86h(2) FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu F87h(2) FSR1H Indirect Data Memory Address 1 High Pointer F88h(2) BSR F89h(2) WREG F8Ah(1),(2) PCLATH F8Bh(2) INTCON F8Ch — FE3h — FE4h — — — — — TO 0000 0000 0000 0000 PD Z DC C 0000 0000 0000 0000 — BSR ---0 0000 ---0 0000 Working Register — GIE 0000 0000 uuuu uuuu Write Buffer for the upper 7 bits of the Program Counter PEIE ---1 1000 ---q quuu TMR0IE INTE IOCIE TMR0IF -000 0000 -000 0000 INTF Unimplemented IOCIF 0000 0000 0000 0000 — STATUS_ Z_SHAD — DC_SHAD C_SHAD ---- -xxx ---- -uuu SHAD FE5h WREG_ Working Register Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FE6h BSR_ Bank Select Register Normal (Non-ICD) Shadow ---x xxxx ---u uuuu SHAD FE7h PCLATH_ Program Counter Latch High Register Normal (Non-ICD) Shadow -xxx xxxx uuuu uuuu SHAD FE8h FSR0L_ Indirect Data Memory Address 0 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 0 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 Low Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu Indirect Data Memory Address 1 High Pointer Normal (Non-ICD) Shadow xxxx xxxx uuuu uuuu SHAD FE9h FSR0H_ SHAD FEAh FSR1L_ SHAD FEBh FSR1H_ SHAD FECh — FEDh STKPTR FEEh TOSL FEFh TOSH Legend: Note 1: 2: 3: Unimplemented — — — — Top of Stack Low byte — Top of Stack High byte Current Stack pointer — ---1 1111 ---1 1111 xxxx xxxx uuuu uuuu -xxx xxxx -uuu uuuu x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved. Shaded locations are unimplemented, read as ‘0’. The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC, whose contents are transferred to the upper byte of the program counter. These registers can be addressed from any bank. Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 37 PIC16(L)F1933 3.4 PCL and PCLATH 3.4.3 COMPUTED FUNCTION CALLS The Program Counter (PC) is 15 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 3-3 shows the five situations for the loading of the PC. A computed function CALL allows programs to maintain tables of functions and provide another way to execute state machines or look-up tables. When performing a table read using a computed function CALL, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). FIGURE 3-3: If using the CALL instruction, the PCH and PCL registers are loaded with the operand of the CALL instruction. PCH is loaded with PCLATH. PC LOADING OF PC IN DIFFERENT SITUATIONS 14 PCH 6 7 14 PCH PCL 0 PCLATH PC 8 ALU Result PCL 0 4 0 11 OPCODE PC 14 6 PCLATH PC Instruction with PCL as Destination GOTO, CALL 6 PCLATH 0 14 PCH 7 PCL 0 PCH 0 CALLW 8 W PCL 0 BRW 14 PCH 3.4.4 BRANCHING The branching instructions add an offset to the PC. This allows relocatable code and code that crosses page boundaries. There are two forms of branching, BRW and BRA. The PC will have incremented to fetch the next instruction in both cases. When using either branching instruction, a PCL memory boundary may be crossed. If using BRW, load the W register with the desired unsigned address and execute BRW. The entire PC will be loaded with the address PC + 1 + W. If using BRA, the entire PC will be loaded with PC + 1 +, the signed value of the operand of the BRA instruction. 15 PC + W PC The CALLW instruction enables computed calls by combining PCLATH and W to form the destination address. A computed CALLW is accomplished by loading the W register with the desired address and executing CALLW. The PCL register is loaded with the value of W and PCH is loaded with PCLATH. PCL 0 BRA 15 PC + OPCODE 3.4.1 MODIFYING PCL Executing any instruction with the PCL register as the destination simultaneously causes the Program Counter PC bits (PCH) to be replaced by the contents of the PCLATH register. This allows the entire contents of the program counter to be changed by writing the desired upper seven bits to the PCLATH register. When the lower eight bits are written to the PCL register, all 15 bits of the program counter will change to the values contained in the PCLATH register and those being written to the PCL register. 3.4.2 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to Application Note AN556, “Implementing a Table Read” (DS00556). DS41575C-page 38  2011-2012 Microchip Technology Inc. PIC16(L)F1933 3.5 Stack 3.5.1 The stack is available through the TOSH, TOSL and STKPTR registers. STKPTR is the current value of the Stack Pointer. TOSH:TOSL register pair points to the TOP of the stack. Both registers are read/writable. TOS is split into TOSH and TOSL due to the 15-bit size of the PC. To access the stack, adjust the value of STKPTR, which will position TOSH:TOSL, then read/write to TOSH:TOSL. STKPTR is five bits to allow detection of overflow and underflow. All devices have a 16-level x 15-bit wide hardware stack (refer to Figures 3-4 through 3-7). The stack space is not part of either program or data space. The PC is PUSHed onto the stack when CALL or CALLW instructions are executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer if the STVREN bit is programmed to ‘0‘ (Configuration Word 2). This means that after the stack has been PUSHed sixteen times, the seventeenth PUSH overwrites the value that was stored from the first PUSH. The eighteenth PUSH overwrites the second PUSH (and so on). The STKOVF and STKUNF flag bits will be set on an Overflow/Underflow, regardless of whether the Reset is enabled. Note: Care should be taken when modifying the STKPTR while interrupts are enabled. During normal program operation, CALL, CALLW and Interrupts will increment STKPTR while RETLW, RETURN, and RETFIE will decrement STKPTR. At any time, STKPTR can be inspected to see how much stack is left. The STKPTR always points at the currently used place on the stack. Therefore, a CALL or CALLW will increment the STKPTR and then write the PC, and a return will unload the PC and then decrement the STKPTR. Note 1: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, CALLW, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. FIGURE 3-4: ACCESSING THE STACK Reference Figure 3-4 through Figure 3-7 for examples of accessing the stack. ACCESSING THE STACK EXAMPLE 1 TOSH:TOSL 0x0F STKPTR = 0x1F Stack Reset Disabled (STVREN = 0) 0x0E 0x0D 0x0C 0x0B 0x0A Initial Stack Configuration: 0x09 After Reset, the stack is empty. The empty stack is initialized so the Stack Pointer is pointing at 0x1F. If the Stack Overflow/Underflow Reset is enabled, the TOSH/TOSL registers will return ‘0’. If the Stack Overflow/Underflow Reset is disabled, the TOSH/TOSL registers will return the contents of stack address 0x0F. 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 0x00 TOSH:TOSL  2011-2012 Microchip Technology Inc. 0x1F 0x0000 STKPTR = 0x1F Stack Reset Enabled (STVREN = 1) DS41575C-page 39 PIC16(L)F1933 FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2 0x0F 0x0E 0x0D 0x0C 0x0B 0x0A 0x09 This figure shows the stack configuration after the first CALL or a single interrupt. If a RETURN instruction is executed, the return address will be placed in the Program Counter and the Stack Pointer decremented to the empty state (0x1F). 0x08 0x07 0x06 0x05 0x04 0x03 0x02 0x01 TOSH:TOSL FIGURE 3-6: 0x00 Return Address STKPTR = 0x00 ACCESSING THE STACK EXAMPLE 3 0x0F 0x0E 0x0D 0x0C After seven CALLs or six CALLs and an interrupt, the stack looks like the figure on the left. A series of RETURN instructions will repeatedly place the return addresses into the Program Counter and pop the stack. 0x0B 0x0A 0x09 0x08 0x07 TOSH:TOSL DS41575C-page 40 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address STKPTR = 0x06  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4 TOSH:TOSL 3.5.2 0x0F Return Address 0x0E Return Address 0x0D Return Address 0x0C Return Address 0x0B Return Address 0x0A Return Address 0x09 Return Address 0x08 Return Address 0x07 Return Address 0x06 Return Address 0x05 Return Address 0x04 Return Address 0x03 Return Address 0x02 Return Address 0x01 Return Address 0x00 Return Address When the stack is full, the next CALL or an interrupt will set the Stack Pointer to 0x10. This is identical to address 0x00 so the stack will wrap and overwrite the return address at 0x00. If the Stack Overflow/Underflow Reset is enabled, a Reset will occur and location 0x00 will not be overwritten. STKPTR = 0x10 OVERFLOW/UNDERFLOW RESET If the STVREN bit in Configuration Word 2 is programmed to ‘1’, the device will be reset if the stack is PUSHed beyond the sixteenth level or POPed beyond the first level, setting the appropriate bits (STKOVF or STKUNF, respectively) in the PCON register. 3.6 Indirect Addressing The INDFn registers are not physical registers. Any instruction that accesses an INDFn register actually accesses the register at the address specified by the File Select Registers (FSR). If the FSRn address specifies one of the two INDFn registers, the read will return ‘0’ and the write will not occur (though Status bits may be affected). The FSRn register value is created by the pair FSRnH and FSRnL. The FSR registers form a 16-bit address that allows an addressing space with 65536 locations. These locations are divided into three memory regions: • Traditional Data Memory • Linear Data Memory • Program Flash Memory  2011-2012 Microchip Technology Inc. DS41575C-page 41 PIC16(L)F1933 FIGURE 3-8: INDIRECT ADDRESSING 0x0000 0x0000 Traditional Data Memory 0x0FFF 0x1000 0x1FFF 0x0FFF Reserved 0x2000 Linear Data Memory 0x29AF 0x29B0 FSR Address Range 0x7FFF 0x8000 Reserved 0x0000 Program Flash Memory 0xFFFF Note: 0x7FFF Not all memory regions are completely implemented. Consult device memory tables for memory limits. DS41575C-page 42  2011-2012 Microchip Technology Inc. PIC16(L)F1933 3.6.1 TRADITIONAL DATA MEMORY The traditional data memory is a region from FSR address 0x000 to FSR address 0xFFF. The addresses correspond to the absolute addresses of all SFR, GPR and common registers. FIGURE 3-9: TRADITIONAL DATA MEMORY MAP Direct Addressing 4 BSR 0 6 Indirect Addressing From Opcode 7 0 0 Bank Select Location Select 0x00 0000 0001 0010 FSRxH 0 0 0 7 FSRxL 0 0 Bank Select Location Select 1111 0x7F Bank 0 Bank 1 Bank 2  2011-2012 Microchip Technology Inc. Bank 31 DS41575C-page 43 PIC16(L)F1933 3.6.2 3.6.3 LINEAR DATA MEMORY The linear data memory is the region from FSR address 0x2000 to FSR address 0x29AF. This region is a virtual region that points back to the 80-byte blocks of GPR memory in all the banks. Unimplemented memory reads as 0x00. Use of the linear data memory region allows buffers to be larger than 80 bytes because incrementing the FSR beyond one bank will go directly to the GPR memory of the next bank. The 16 bytes of common memory are not included in the linear data memory region. FIGURE 3-10: 7 FSRnH 0 0 1 LINEAR DATA MEMORY MAP 0 7 FSRnL 0 PROGRAM FLASH MEMORY To make constant data access easier, the entire program Flash memory is mapped to the upper half of the FSR address space. When the MSB of FSRnH is set, the lower 15 bits are the address in program memory which will be accessed through INDF. Only the lower 8 bits of each memory location is accessible via INDF. Writing to the program Flash memory cannot be accomplished via the FSR/INDF interface. All instructions that access program Flash memory via the FSR/INDF interface will require one additional instruction cycle to complete. FIGURE 3-11: 7 1 FSRnH PROGRAM FLASH MEMORY MAP 0 Location Select Location Select 0x2000 7 FSRnL 0x8000 0 0x0000 0x020 Bank 0 0x06F 0x0A0 Bank 1 0x0EF 0x120 Program Flash Memory (low 8 bits) Bank 2 0x16F 0xF20 Bank 30 0x29AF DS41575C-page 44 0xF6F 0xFFFF 0x7FFF  2011-2012 Microchip Technology Inc. PIC16(L)F1933 4.0 DEVICE CONFIGURATION Device configuration consists of Configuration Words, Code Protection and Device ID. 4.1 Configuration Words There are several Configuration Word bits that allow different oscillator and memory protection options. These are implemented as Configuration Word 1 at 8007h and Configuration Word 2 at 8008h. Note: The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 45 PIC16(L)F1933 4.2 Register Definitions: Configuration Words REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 R/P-1 R/P-1 R/P-1 FCMEN IESO CLKOUTEN R/P-1 R/P-1 BOREN bit 13 R/P-1 R/P-1 R/P-1 CP MCLRE PWRTE R/P-1 CPD bit 8 R/P-1 R/P-1 WDTE R/P-1 R/P-1 R/P-1 FOSC bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 12 IESO: Internal External Switchover bit 1 = Internal/External Switchover mode is enabled 0 = Internal/External Switchover mode is disabled bit 11 CLKOUTEN: Clock Out Enable bit 1 = CLKOUT function is disabled. I/O or oscillator function on RA6/CLKOUT 0 = CLKOUT function is enabled on RA6/CLKOUT bit 10-9 BOREN: Brown-out Reset Enable bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the BORCON register 00 = BOR disabled bit 8 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 7 CP: Code Protection bit(3) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 6 MCLRE: MCLR/VPP Pin Function Select bit If LVP bit = 1: This bit is ignored. If LVP bit = 0: 1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled. 0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of WPUE3 bit. bit 5 PWRTE: Power-up Timer Enable bit(1) 1 = PWRT disabled 0 = PWRT enabled Note 1: 2: 3: Enabling Brown-out Reset does not automatically enable Power-up Timer. The entire data EEPROM will be erased when the code protection is turned off during The entire program memory will be erased when the code protection is turned off. DS41575C-page 46  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 (CONTINUED) bit 4-3 WDTE: Watchdog Timer Enable bit 11 = WDT enabled 10 = WDT enabled while running and disabled in Sleep 01 = WDT controlled by the SWDTEN bit in the WDTCON register 00 = WDT disabled bit 2-0 FOSC: Oscillator Selection bits 111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin 110 = ECM: External Clock, Medium-Power mode (0.5-4 MHz): device clock supplied to CLKIN pin 101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin 100 = INTOSC oscillator: I/O function on CLKIN pin 011 = EXTRC oscillator: External RC circuit connected to CLKIN pin 010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins 001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins 000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins Note 1: 2: 3: Enabling Brown-out Reset does not automatically enable Power-up Timer. The entire data EEPROM will be erased when the code protection is turned off during The entire program memory will be erased when the code protection is turned off.  2011-2012 Microchip Technology Inc. DS41575C-page 47 PIC16(L)F1933 REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2 R/P-1 (1) LVP R/P-1 DEBUG (3) U-1 R/P-1 R/P-1 R/P-1 — BORV STVREN PLLEN bit 13 U-1 U-1 — — R/P-1 bit 8 R/P-1 U-1 U-1 (2) — — VCAPEN R/P-1 R/P-1 WRT bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’ ‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase bit 13 LVP: Low-Voltage Programming Enable bit(1) 1 = Low-voltage programming enabled 0 = High-voltage on MCLR must be used for programming bit 12 DEBUG: In-Circuit Debugger Mode bit(3) 1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins 0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger bit 11 Unimplemented: Read as ‘1’ bit 10 BORV: Brown-out Reset Voltage Selection bit(4) 1 = Brown-out Reset voltage (Vbor), low trip point selected. 0 = Brown-out Reset voltage (Vbor), high trip point selected. bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit 1 = Stack Overflow or Underflow will cause a Reset 0 = Stack Overflow or Underflow will not cause a Reset bit 8 PLLEN: PLL Enable bit 1 = 4xPLL enabled 0 = 4xPLL disabled bit 7-5 Unimplemented: Read as ‘1’ bit 4 VCAPEN: Voltage Regulator Capacitor Enable bits(2) 00 = VCAP functionality is enabled on RA0 01 = VCAP functionality is enabled on RA5 10 = VCAP functionality is enabled on RA6 11 = No capacitor on VCAP pin bit 3-2 Unimplemented: Read as ‘1’ bit 1-0 WRT: Flash Memory Self-Write Protection bits 00 = VCAP functionality is enabled on RA0 01 = VCAP functionality is enabled on RA5 10 = VCAP functionality is enabled on RA6 11 = No capacitor on VCAP pin Note 1: 2: 3: 4: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP. Reads as ‘11’ on PIC16LF193X only. The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers and programmers. For normal device operation, this bit should be maintained as a ‘1’. See Vbor parameter for specific trip point voltages. DS41575C-page 48  2011-2012 Microchip Technology Inc. PIC16(L)F1933 4.3 Code Protection Code protection allows the device to be protected from unauthorized access. Program memory protection and data EEPROM protection are controlled independently. Internal access to the program memory and data EEPROM are unaffected by any code protection setting. 4.3.1 PROGRAM MEMORY PROTECTION The entire program memory space is protected from external reads and writes by the CP bit in Configuration Words. When CP = 0, external reads and writes of program memory are inhibited and a read will return all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the program memory is dependent upon the write protection setting. See Section 4.4 “Write Protection” for more information. 4.3.2 DATA EEPROM PROTECTION The entire data EEPROM is protected from external reads and writes by the CPD bit. When CPD = 0, external reads and writes of data EEPROM are inhibited. The CPU can continue to read and write data EEPROM regardless of the protection bit settings. 4.4 Write Protection Write protection allows the device to be protected from unintended self-writes. Applications, such as boot loader software, can be protected while allowing other regions of the program memory to be modified. The WRT bits in Configuration Words define the size of the program memory block that is protected. 4.5 User ID Four memory locations (8000h-8003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are readable and writable during normal execution. See Section 4.6 “Device ID and Revision ID” for more information on accessing these memory locations. For more information on checksum calculation, see the “PIC16F193X/LF193X/PIC16F194X/LF194X/PIC16LF 190X Memory Programming Specification” (DS41397).  2011-2012 Microchip Technology Inc. DS41575C-page 49 PIC16(L)F1933 4.6 Device ID and Revision ID The memory location 8006h is where the Device ID and Revision ID are stored. The upper nine bits hold the Device ID. The lower five bits hold the Revision ID. See Section 11.5 “User ID, Device ID and Configuration Word Access” for more information on accessing these memory locations. Development tools, such as device programmers and debuggers, may be used to read the Device ID and Revision ID. 4.7 Register Definitions: Device ID REGISTER 4-3: DEVID: DEVICE ID REGISTER R R R R R R DEV bit 13 R R bit 8 R R R DEV R R R REV bit 7 bit 0 Legend: R = Readable bit ‘1’ = Bit is set bit 13-5 ‘0’ = Bit is cleared DEV: Device ID bits Device bit 4-0 DEVID Values DEV REV PIC16F1933 10 0011 001 x xxxx PIC16LF1933 10 0100 001 x xxxx REV: Revision ID bits These bits are used to identify the revision (see Table under DEV above). DS41575C-page 50  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.0 OSCILLATOR MODULE (WITH FAIL-SAFE CLOCK MONITOR) 5.1 Overview The oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing performance and minimizing power consumption. Figure 5-1 illustrates a block diagram of the oscillator module. Clock sources can be supplied from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be supplied from one of two internal oscillators and PLL circuits, with a choice of speeds selectable via software. Additional clock features include: • Selectable system clock source between external or internal sources via software. • Two-Speed Start-up mode, which minimizes latency between external oscillator start-up and code execution. • Fail-Safe Clock Monitor (FSCM) designed to detect a failure of the external clock source (LP, XT, HS, EC or RC modes) and switch automatically to the internal oscillator. • Oscillator Start-up Timer (OST) ensures stability of crystal oscillator sources  2011-2012 Microchip Technology Inc. The oscillator module can be configured in one of eight clock modes. 1. 2. 3. 4. 5. 6. 7. 8. ECL – External Clock Low-Power mode (0 MHz to 0.5 MHz) ECM – External Clock Medium-Power mode (0.5 MHz to 4 MHz) ECH – External Clock High-Power mode (4 MHz to 32 MHz) LP – 32 kHz Low-Power Crystal mode. XT – Medium Gain Crystal or Ceramic Resonator Oscillator mode (up to 4 MHz) HS – High Gain Crystal or Ceramic Resonator mode (4 MHz to 20 MHz) RC – External Resistor-Capacitor (RC). INTOSC – Internal oscillator (31 kHz to 32 MHz). Clock Source modes are selected by the FOSC bits in the Configuration Words. The FOSC bits determine the type of oscillator that will be used when the device is first powered. The EC clock mode relies on an external logic level signal as the device clock source. The LP, XT, and HS clock modes require an external crystal or resonator to be connected to the device. Each mode is optimized for a different frequency range. The RC clock mode requires an external resistor and capacitor to set the oscillator frequency. The INTOSC internal oscillator block produces low, medium, and high-frequency clock sources, designated LFINTOSC, MFINTOSC and HFINTOSC. (see Internal Oscillator Block, Figure 5-1). A wide selection of device clock frequencies may be derived from these three clock sources. DS41575C-page 51 PIC16(L)F1933 SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM FIGURE 5-1: External Oscillator LP, XT, HS, RC, EC OSC2 Sleep 4x PLL Oscillator Timer1 FOSC = 100 T1OSO IRCF HFPLL 500 kHz Source 16 MHz (HFINTOSC) Postscaler Internal Oscillator Block 500 kHz (MFINTOSC) 31 kHz Source 31 kHz 31 kHz (LFINTOSC) DS41575C-page 52 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz 250 kHz 125 kHz 62.5 kHz 31.25 kHz MUX T1OSI T1OSCEN Enable Oscillator Sleep T1OSC MUX OSC1 CPU and Peripherals Internal Oscillator Clock Control FOSC SCS Clock Source Option for other modules WDT, PWRT, Fail-Safe Clock Monitor Two-Speed Start-up and other modules  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.2 Clock Source Types Clock sources can be classified as external or internal. External clock sources rely on external circuitry for the clock source to function. Examples are: oscillator modules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resistor-Capacitor (RC) mode circuits. Internal clock sources are contained within the oscillator module. The internal oscillator block has two internal oscillators and a dedicated Phase-Lock Loop (HFPLL) that are used to generate three internal system clock sources: the 16 MHz High-Frequency Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bits in the OSCCON register. See Section 5.3 “Clock Switching” for additional information. 5.2.1 FIGURE 5-2: OSC1/CLKIN Clock from Ext. System PIC® MCU FOSC/4 or I/O(1) Note 1: EXTERNAL CLOCK (EC) MODE OPERATION OSC2/CLKOUT Output depends upon CLKOUTEN bit of the Configuration Words. EXTERNAL CLOCK SOURCES An external clock source can be used as the device system clock by performing one of the following actions: • Program the FOSC bits in the Configuration Words to select an external clock source that will be used as the default system clock upon a device Reset. • Write the SCS bits in the OSCCON register to switch the system clock source to: - Timer1 oscillator during run-time, or - An external clock source determined by the value of the FOSC bits. See Section 5.3 information. 5.2.1.1 The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC® MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. “Clock Switching”for more EC Mode The External Clock (EC) mode allows an externally generated logic level signal to be the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. Figure 5-2 shows the pin connections for EC mode. 5.2.1.2 LP, XT, HS Modes The LP, XT and HS modes support the use of quartz crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure 5-3). The three modes select a low, medium or high gain setting of the internal inverter-amplifier to support various resonator types and speed. LP Oscillator mode selects the lowest gain setting of the internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to drive only 32.768 kHz tuning-fork type crystals (watch crystals). XT Oscillator mode selects the intermediate gain setting of the internal inverter-amplifier. XT mode current consumption is the medium of the three modes. This mode is best suited to drive resonators with a medium drive level specification. HS Oscillator mode selects the highest gain setting of the internal inverter-amplifier. HS mode current consumption is the highest of the three modes. This mode is best suited for resonators that require a high drive setting. Figure 5-3 and Figure 5-4 show typical circuits for quartz crystal and ceramic resonators, respectively. EC mode has three power modes to select from through Configuration Words: • High power, 4-32 MHz (FOSC = 111) • Medium power, 0.5-4 MHz (FOSC = 110) • Low power, 0-0.5 MHz (FOSC = 101)  2011-2012 Microchip Technology Inc. DS41575C-page 53 PIC16(L)F1933 FIGURE 5-3: QUARTZ CRYSTAL OPERATION (LP, XT OR HS MODE) FIGURE 5-4: CERAMIC RESONATOR OPERATION (XT OR HS MODE) PIC® MCU PIC® MCU OSC1/CLKIN C1 To Internal Logic Quartz Crystal C2 OSC1/CLKIN RS(1) RF(2) C1 Sleep OSC2/CLKOUT Note 1: A series resistor (RS) may be required for quartz crystals with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC® and PIC® Devices” (DS00826) • AN849, “Basic PIC® Oscillator Design” (DS00849) • AN943, “Practical PIC® Oscillator Analysis and Design” (DS00943) • AN949, “Making Your Oscillator Work” (DS00949) To Internal Logic RP(3) C2 Ceramic RS(1) Resonator Note 1: RF(2) Sleep OSC2/CLKOUT A series resistor (RS) may be required for ceramic resonators with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 M to 10 M. 3: An additional parallel feedback resistor (RP) may be required for proper ceramic resonator operation. 5.2.1.3 Oscillator Start-up Timer (OST) If the oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not increment and program execution is suspended unless either FSCM or Two-Speed Start-Up are enabled. In this case code will continue to execute at the selected INTOSC frequency while the OST is counting. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is providing a stable system clock to the oscillator module. In order to minimize latency between external oscillator start-up and code execution, the Two-Speed Clock Start-up mode can be selected (see Section 5.4 “Two-Speed Clock Start-up Mode”). 5.2.1.4 4x PLL The oscillator module contains a 4x PLL that can be used with both external and internal clock sources to provide a system clock source. The input frequency for the 4x PLL must fall within specifications. See the PLL Clock Timing specifications in Section 30.0 “Electrical Specifications”. DS41575C-page 54  2011-2012 Microchip Technology Inc. PIC16(L)F1933 The 4x PLL may be enabled for use by one of two methods: 1. 2. Program the PLLEN bit in Configuration Words to a ‘1’. Write the SPLLEN bit in the OSCCON register to a ‘1’. If the PLLEN bit in Configuration Words is programmed to a ‘1’, then the value of SPLLEN is ignored. 5.2.1.5 Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: TIMER1 Oscillator The Timer1 oscillator is a separate crystal oscillator that is associated with the Timer1 peripheral. It is optimized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins. • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC® and PIC® Devices” (DS00826) • AN849, “Basic PIC® Oscillator Design” (DS00849) • AN943, “Practical PIC® Oscillator Analysis and Design” (DS00943) • AN949, “Making Your Oscillator Work” (DS00949) • TB097, “Interfacing a Micro Crystal MS1V-T1K 32.768 kHz Tuning Fork Crystal to a PIC16F690/SS” (DS91097) • AN1288, “Design Practices for Low-Power External Oscillators” (DS01288) The Timer1 oscillator can be used as an alternate system clock source and can be selected during run-time using clock switching. Refer to Section 5.3 “Clock Switching” for more information. FIGURE 5-5: QUARTZ CRYSTAL OPERATION (TIMER1 OSCILLATOR) PIC® MCU T1OSI C1 To Internal Logic 32.768 kHz Quartz Crystal C2 T1OSO 5.2.1.6 External RC Mode The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required. The RC circuit connects to OSC1. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the CLKOUTEN bit in Configuration Words. Figure 5-6 shows the external RC mode connections.  2011-2012 Microchip Technology Inc. DS41575C-page 55 PIC16(L)F1933 FIGURE 5-6: VDD EXTERNAL RC MODES PIC® MCU REXT OSC1/CLKIN Internal Clock CEXT VSS FOSC/4 or I/O(1) OSC2/CLKOUT Recommended values: 10 k  REXT  100 k, 20 pF, 2-5V Note 1: Output depends upon CLKOUTEN bit of the Configuration Words. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. Other factors affecting the oscillator frequency are: • threshold voltage variation • component tolerances • packaging variations in capacitance The user also needs to take into account variation due to tolerance of external RC components used. DS41575C-page 56  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.2.2 INTERNAL CLOCK SOURCES The device may be configured to use the internal oscillator block as the system clock by performing one of the following actions: • Program the FOSC bits in Configuration Words to select the INTOSC clock source, which will be used as the default system clock upon a device Reset. • Write the SCS bits in the OSCCON register to switch the system clock source to the internal oscillator during run-time. See Section 5.3 “Clock Switching”for more information. In INTOSC mode, OSC1/CLKIN is available for general purpose I/O. OSC2/CLKOUT is available for general purpose I/O or CLKOUT. The function of the OSC2/CLKOUT pin is determined by the CLKOUTEN bit in Configuration Words. The internal oscillator block has two independent oscillators and a dedicated Phase-Lock Loop, HFPLL that can produce one of three internal system clock sources. 1. 2. 3. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 16 MHz. The HFINTOSC source is generated from the 500 kHz MFINTOSC source and the dedicated Phase-Lock Loop, HFPLL. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). The MFINTOSC (Medium-Frequency Internal Oscillator) is factory calibrated and operates at 500 kHz. The frequency of the MFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 5-3). The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. 5.2.2.1 HFINTOSC The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 16 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of multiple frequencies derived from the HFINTOSC can be selected via software using the IRCF bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The HFINTOSC is enabled by: • Configure the IRCF bits of the OSCCON register for the desired HF frequency, and • FOSC = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’. A fast start-up oscillator allows internal circuits to power-up and stabilize before switching to HFINTOSC. The High-Frequency Internal Oscillator Ready bit (HFIOFR) of the OSCSTAT register indicates when the HFINTOSC is running. The High-Frequency Internal Oscillator Status Locked bit (HFIOFL) of the OSCSTAT register indicates when the HFINTOSC is running within 2% of its final value. The High-Frequency Internal Oscillator Stable bit (HFIOFS) of the OSCSTAT register indicates when the HFINTOSC is running within 0.5% of its final value. 5.2.2.2 MFINTOSC The Medium-Frequency Internal Oscillator (MFINTOSC) is a factory calibrated 500 kHz internal clock source. The frequency of the MFINTOSC can be altered via software using the OSCTUNE register (Register 5-3). The output of the MFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). One of nine frequencies derived from the MFINTOSC can be selected via software using the IRCF bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The MFINTOSC is enabled by: • Configure the IRCF bits of the OSCCON register for the desired HF frequency, and • FOSC = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ The Medium Frequency Internal Oscillator Ready bit (MFIOFR) of the OSCSTAT register indicates when the MFINTOSC is running.  2011-2012 Microchip Technology Inc. DS41575C-page 57 PIC16(L)F1933 5.2.2.3 Internal Oscillator Frequency Adjustment The 500 kHz internal oscillator is factory calibrated. This internal oscillator can be adjusted in software by writing to the OSCTUNE register (Register 5-3). Since the HFINTOSC and MFINTOSC clock sources are derived from the 500 kHz internal oscillator a change in the OSCTUNE register value will apply to both. The default value of the OSCTUNE register is ‘0’. The value is a 6-bit two’s complement number. A value of 1Fh will provide an adjustment to the maximum frequency. A value of 20h will provide an adjustment to the minimum frequency. When the OSCTUNE register is modified, the oscillator frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT), Fail-Safe Clock Monitor (FSCM) and peripherals, are not affected by the change in frequency. 5.2.2.4 LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a multiplexer (see Figure 5-1). Select 31 kHz, via software, using the IRCF bits of the OSCCON register. See Section 5.2.2.7 “Internal Oscillator Clock Switch Timing” for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). The LFINTOSC is enabled by selecting 31 kHz (IRCF bits of the OSCCON register = 000) as the system clock source (SCS bits of the OSCCON register = 1x), or when any of the following are enabled: 5.2.2.5 Internal Oscillator Frequency Selection The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF of the OSCCON register. The output of the 16 MHz HFINTOSC and 31 kHz LFINTOSC connects to a postscaler and multiplexer (see Figure 5-1). The Internal Oscillator Frequency Select bits IRCF of the OSCCON register select the frequency output of the internal oscillators. One of the following frequencies can be selected via software: - 32 MHz (requires 4x PLL) 16 MHz 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz (default after Reset) 250 kHz 125 kHz 62.5 kHz 31.25 kHz 31 kHz (LFINTOSC) Note: Following any Reset, the IRCF bits of the OSCCON register are set to ‘0111’ and the frequency selection is set to 500 kHz. The user can modify the IRCF bits to select a different frequency. The IRCF bits of the OSCCON register allow duplicate selections for some frequencies. These duplicate choices can offer system design trade-offs. Lower power consumption can be obtained when changing oscillator sources for a given frequency. Faster transition times can be obtained between frequency changes that use the same oscillator source. • Configure the IRCF bits of the OSCCON register for the desired LF frequency, and • FOSC = 100, or • Set the System Clock Source (SCS) bits of the OSCCON register to ‘1x’ Peripherals that use the LFINTOSC are: • Power-up Timer (PWRT) • Watchdog Timer (WDT) • Fail-Safe Clock Monitor (FSCM) The Low-Frequency Internal Oscillator Ready bit (LFIOFR) of the OSCSTAT register indicates when the LFINTOSC is running. DS41575C-page 58  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.2.2.6 32 MHz Internal Oscillator Frequency Selection The Internal Oscillator Block can be used with the 4x PLL associated with the External Oscillator Block to produce a 32 MHz internal system clock source. The following settings are required to use the 32 MHz internal clock source: • The FOSC bits in Configuration Words must be set to use the INTOSC source as the device system clock (FOSC = 100). • The SCS bits in the OSCCON register must be cleared to use the clock determined by FOSC in Configuration Words (SCS = 00). • The IRCF bits in the OSCCON register must be set to the 8 MHz HFINTOSC set to use (IRCF = 1110). • The SPLLEN bit in the OSCCON register must be set to enable the 4x PLL, or the PLLEN bit of the Configuration Words must be programmed to a ‘1’. Note: When using the PLLEN bit of the Configuration Words, the 4x PLL cannot be disabled by software and the 8 MHz HFINTOSC option will no longer be available. The 4x PLL is not available for use with the internal oscillator when the SCS bits of the OSCCON register are set to ‘1x’. The SCS bits must be set to ‘00’ to use the 4x PLL with the internal oscillator.  2011-2012 Microchip Technology Inc. 5.2.2.7 Internal Oscillator Clock Switch Timing When switching between the HFINTOSC, MFINTOSC and the LFINTOSC, the new oscillator may already be shut down to save power (see Figure 5-7). If this is the case, there is a delay after the IRCF bits of the OSCCON register are modified before the frequency selection takes place. The OSCSTAT register will reflect the current active status of the HFINTOSC, MFINTOSC and LFINTOSC oscillators. The sequence of a frequency selection is as follows: 1. 2. 3. 4. 5. 6. 7. IRCF bits of the OSCCON register are modified. If the new clock is shut down, a clock start-up delay is started. Clock switch circuitry waits for a falling edge of the current clock. The current clock is held low and the clock switch circuitry waits for a rising edge in the new clock. The new clock is now active. The OSCSTAT register is updated as required. Clock switch is complete. See Figure 5-7 for more details. If the internal oscillator speed is switched between two clocks of the same source, there is no start-up delay before the new frequency is selected. Clock switching time delays are shown in Table 5-1. Start-up delay specifications are located in the oscillator tables in Section 30.0 “Electrical Specifications”. DS41575C-page 59 PIC16(L)F1933 FIGURE 5-7: HFINTOSC/ MFINTOSC INTERNAL OSCILLATOR SWITCH TIMING LFINTOSC (FSCM and WDT disabled) HFINTOSC/ MFINTOSC Start-up Time 2-cycle Sync Running LFINTOSC IRCF 0 0 System Clock HFINTOSC/ MFINTOSC LFINTOSC (Either FSCM or WDT enabled) HFINTOSC/ MFINTOSC 2-cycle Sync Running LFINTOSC 0 IRCF 0 System Clock LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled LFINTOSC Start-up Time 2-cycle Sync Running HFINTOSC/ MFINTOSC IRCF =0 0 System Clock DS41575C-page 60  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.3 Clock Switching 5.3.3 TIMER1 OSCILLATOR The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bits of the OSCCON register. The following clock sources can be selected using the SCS bits: The Timer1 oscillator is a separate crystal oscillator associated with the Timer1 peripheral. It is optimized for timekeeping operations with a 32.768 kHz crystal connected between the T1OSO and T1OSI device pins. • Default system oscillator determined by FOSC bits in Configuration Words • Timer1 32 kHz crystal oscillator • Internal Oscillator Block (INTOSC) The Timer1 oscillator is enabled using the T1OSCEN control bit in the T1CON register. See Section 21.0 “Timer1 Module with Gate Control” for more information about the Timer1 peripheral. 5.3.1 SYSTEM CLOCK SELECT (SCS) BITS The System Clock Select (SCS) bits of the OSCCON register selects the system clock source that is used for the CPU and peripherals. • When the SCS bits of the OSCCON register = 00, the system clock source is determined by value of the FOSC bits in the Configuration Words. • When the SCS bits of the OSCCON register = 01, the system clock source is the Timer1 oscillator. • When the SCS bits of the OSCCON register = 1x, the system clock source is chosen by the internal oscillator frequency selected by the IRCF bits of the OSCCON register. After a Reset, the SCS bits of the OSCCON register are always cleared. Note: 5.3.4 TIMER1 OSCILLATOR READY (T1OSCR) BIT The user must ensure that the Timer1 oscillator is ready to be used before it is selected as a system clock source. The Timer1 Oscillator Ready (T1OSCR) bit of the OSCSTAT register indicates whether the Timer1 oscillator is ready to be used. After the T1OSCR bit is set, the SCS bits can be configured to select the Timer1 oscillator. Any automatic clock switch, which may occur from Two-Speed Start-up or Fail-Safe Clock Monitor, does not update the SCS bits of the OSCCON register. The user can monitor the OSTS bit of the OSCSTAT register to determine the current system clock source. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 5-1. 5.3.2 OSCILLATOR START-UP TIMER STATUS (OSTS) BIT The Oscillator Start-up Timer Status (OSTS) bit of the OSCSTAT register indicates whether the system clock is running from the external clock source, as defined by the FOSC bits in the Configuration Words, or from the internal clock source. In particular, OSTS indicates that the Oscillator Start-up Timer (OST) has counted 1024 clock cycles for LP, XT or HS modes. The OST does not reflect the status of the Timer1 oscillator.  2011-2012 Microchip Technology Inc. DS41575C-page 61 PIC16(L)F1933 5.4 Two-Speed Clock Start-up Mode 5.4.1 Two-Speed Start-up mode provides additional power savings by minimizing the latency between external oscillator start-up and code execution. In applications that make heavy use of the Sleep mode, Two-Speed Start-up will remove the external oscillator start-up time from the time spent awake and can reduce the overall power consumption of the device. This mode allows the application to wake-up from Sleep, perform a few instructions using the INTOSC internal oscillator block as the clock source and go back to Sleep without waiting for the external oscillator to become stable. Two-Speed Start-up provides benefits when the oscillator module is configured for LP, XT or HS modes. The Oscillator Start-up Timer (OST) is enabled for these modes and must count 1024 oscillations before the oscillator can be used as the system clock source. TWO-SPEED START-UP MODE CONFIGURATION Two-Speed Start-up mode is configured by the following settings: • IESO (of the Configuration Words) = 1; Internal/External Switchover bit (Two-Speed Start-up mode enabled). • SCS (of the OSCCON register) = 00. • FOSC bits in the Configuration Words configured for LP, XT or HS mode. Two-Speed Start-up mode is entered after: • Power-on Reset (POR) and, if enabled, after Power-up Timer (PWRT) has expired, or • Wake-up from Sleep. Note: If the oscillator module is configured for any mode other than LP, XT or HS mode, then Two-Speed Start-up is disabled. This is because the external clock oscillator does not require any stabilization time after POR or an exit from Sleep. When FSCM is enabled, Two-Speed Start-Up will automatically be enabled. If the OST count reaches 1024 before the device enters Sleep mode, the OSTS bit of the OSCSTAT register is set and program execution switches to the external oscillator. However, the system may never operate from the external oscillator if the time spent awake is very short. Note: Executing a SLEEP instruction will abort the oscillator start-up time and will cause the OSTS bit of the OSCSTAT register to remain clear. TABLE 5-1: OSCILLATOR SWITCHING DELAYS Switch From Switch To Frequency Oscillator Delay LFINTOSC(1) Sleep/POR MFINTOSC(1) HFINTOSC(1) 31 kHz 31.25 kHz-500 kHz 31.25 kHz-16 MHz 2 cycles Sleep/POR EC, RC(1) DC – 32 MHz 2 cycles LFINTOSC EC, RC(1) DC – 32 MHz 1 cycle of each Sleep/POR Timer1 Oscillator LP, XT, HS(1) 32 kHz-20 MHz 1024 Clock Cycles (OST) Any clock source MFINTOSC(1) HFINTOSC(1) 31.25 kHz-500 kHz 31.25 kHz-16 MHz 2 s (approx.) Any clock source LFINTOSC(1) 31 kHz 1 cycle of each Any clock source Timer1 Oscillator 32 kHz 1024 Clock Cycles (OST) PLL inactive PLL active 16-32 MHz 2 ms (approx.) Note 1: PLL inactive. DS41575C-page 62  2011-2012 Microchip Technology Inc. PIC16(L)F1933 5.4.2 1. 2. 3. 4. 5. 6. 7. TWO-SPEED START-UP SEQUENCE 5.4.3 Wake-up from Power-on Reset or Sleep. Instructions begin execution by the internal oscillator at the frequency set in the IRCF bits of the OSCCON register. OST enabled to count 1024 clock cycles. OST timed out, wait for falling edge of the internal oscillator. OSTS is set. System clock held low until the next falling edge of new clock (LP, XT or HS mode). System clock is switched to external clock source. FIGURE 5-8: CHECKING TWO-SPEED CLOCK STATUS Checking the state of the OSTS bit of the OSCSTAT register will confirm if the microcontroller is running from the external clock source, as defined by the FOSC bits in the Configuration Words, or the internal oscillator. TWO-SPEED START-UP INTOSC TOST OSC1 0 1 1022 1023 OSC2 Program Counter PC - N PC PC + 1 System Clock  2011-2012 Microchip Technology Inc. DS41575C-page 63 PIC16(L)F1933 5.5 Fail-Safe Clock Monitor 5.5.3 The Fail-Safe Clock Monitor (FSCM) allows the device to continue operating should the external oscillator fail. The FSCM can detect oscillator failure any time after the Oscillator Start-up Timer (OST) has expired. The FSCM is enabled by setting the FCMEN bit in the Configuration Words. The FSCM is applicable to all external Oscillator modes (LP, XT, HS, EC, Timer1 Oscillator and RC). FIGURE 5-9: FSCM BLOCK DIAGRAM Clock Monitor Latch External Clock LFINTOSC Oscillator ÷ 64 31 kHz (~32 s) 488 Hz (~2 ms) S Q R Q Sample Clock 5.5.1 FAIL-SAFE DETECTION The FSCM module detects a failed oscillator by comparing the external oscillator to the FSCM sample clock. The sample clock is generated by dividing the LFINTOSC by 64. See Figure 5-9. Inside the fail detector block is a latch. The external clock sets the latch on each falling edge of the external clock. The sample clock clears the latch on each rising edge of the sample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the external clock goes low. 5.5.2 The Fail-Safe condition is cleared after a Reset, executing a SLEEP instruction or changing the SCS bits of the OSCCON register. When the SCS bits are changed, the OST is restarted. While the OST is running, the device continues to operate from the INTOSC selected in OSCCON. When the OST times out, the Fail-Safe condition is cleared after successfully switching to the external clock source. The OSFIF bit should be cleared prior to switching to the external clock source. If the Fail-Safe condition still exists, the OSFIF flag will again become set by hardware. 5.5.4 Clock Failure Detected FAIL-SAFE CONDITION CLEARING RESET OR WAKE-UP FROM SLEEP The FSCM is designed to detect an oscillator failure after the Oscillator Start-up Timer (OST) has expired. The OST is used after waking up from Sleep and after any type of Reset. The OST is not used with the EC or RC Clock modes so that the FSCM will be active as soon as the Reset or wake-up has completed. When the FSCM is enabled, the Two-Speed Start-up is also enabled. Therefore, the device will always be executing code while the OST is operating. Note: Due to the wide range of oscillator start-up times, the Fail-Safe circuit is not active during oscillator start-up (i.e., after exiting Reset or Sleep). After an appropriate amount of time, the user should check the Status bits in the OSCSTAT register to verify the oscillator start-up and that the system clock switchover has successfully completed. FAIL-SAFE OPERATION When the external clock fails, the FSCM switches the device clock to an internal clock source and sets the bit flag OSFIF of the PIR2 register. Setting this flag will generate an interrupt if the OSFIE bit of the PIE2 register is also set. The device firmware can then take steps to mitigate the problems that may arise from a failed clock. The system clock will continue to be sourced from the internal clock source until the device firmware successfully restarts the external oscillator and switches back to external operation. The internal clock source chosen by the FSCM is determined by the IRCF bits of the OSCCON register. This allows the internal oscillator to be configured before a failure occurs. DS41575C-page 64  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 5-10: FSCM TIMING DIAGRAM Sample Clock Oscillator Failure System Clock Output Clock Monitor Output (Q) Failure Detected OSCFIF Test Note: Test Test The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity.  2011-2012 Microchip Technology Inc. DS41575C-page 65 PIC16(L)F1933 5.6 Register Definitions: Oscillator Control REGISTER 5-1: R/W-0/0 OSCCON: OSCILLATOR CONTROL REGISTER R/W-0/0 SPLLEN R/W-1/1 R/W-1/1 R/W-1/1 IRCF U-0 R/W-0/0 — R/W-0/0 SCS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPLLEN: Software PLL Enable bit If PLLEN in Configuration Words = 1: SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements) If PLLEN in Configuration Words = 0: 1 = 4x PLL Is enabled 0 = 4x PLL is disabled bit 6-3 IRCF: Internal Oscillator Frequency Select bits 1111 = 16 MHz HF 1110 = 8 MHz or 32 MHz HF(see Section 5.2.2.1 “HFINTOSC”) 1101 = 4 MHz HF 1100 = 2 MHz HF 1011 = 1 MHz HF 1010 = 500 kHz HF(1) 1001 = 250 kHz HF(1) 1000 = 125 kHz HF(1) 0111 = 500 kHz MF (default upon Reset) 0110 = 250 kHz MF 0101 = 125 kHz MF 0100 = 62.5 kHz MF 0011 = 31.25 kHz HF(1) 0010 = 31.25 kHz MF 000x = 31 kHz LF bit 2 Unimplemented: Read as ‘0’ bit 1-0 SCS: System Clock Select bits 1x = Internal oscillator block 01 = Timer1 oscillator 00 = Clock determined by FOSC in Configuration Words. Note 1: Duplicate frequency derived from HFINTOSC. DS41575C-page 66  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional bit 7 T1OSCR: Timer1 Oscillator Ready bit If T1OSCEN = 1: 1 = Timer1 oscillator is ready 0 = Timer1 oscillator is not ready If T1OSCEN = 0: 1 = Timer1 clock source is always ready bit 6 PLLR 4x PLL Ready bit 1 = 4x PLL is ready 0 = 4x PLL is not ready bit 5 OSTS: Oscillator Start-up Timer Status bit 1 = Running from the clock defined by the FOSC bits of the Configuration Words 0 = Running from an internal oscillator (FOSC = 100) bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit 1 = HFINTOSC is ready 0 = HFINTOSC is not ready bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit 1 = HFINTOSC is at least 2% accurate 0 = HFINTOSC is not 2% accurate bit 2 MFIOFR: Medium-Frequency Internal Oscillator Ready bit 1 = MFINTOSC is ready 0 = MFINTOSC is not ready bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit 1 = LFINTOSC is ready 0 = LFINTOSC is not ready bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit 1 = HFINTOSC is at least 0.5% accurate 0 = HFINTOSC is not 0.5% accurate  2011-2012 Microchip Technology Inc. DS41575C-page 67 PIC16(L)F1933 REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TUN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 TUN: Frequency Tuning bits 100000 = Minimum frequency • • • 111111 = 000000 = Oscillator module is running at the factory-calibrated frequency 000001 = • • • 011110 = 011111 = Maximum frequency TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 OSCCON SPLLEN OSCSTAT T1OSCR OSCTUNE Bit 6 Bit 5 PLLR OSTS Bit 4 Bit 3 Bit 2 HFIOFR HFIOFL MFIOFR BCLIE IRCF — — — PIE2 OSFIE C2IE C1IE EEIE PIR2 OSFIF C2IF C1IF EEIF T1CON Legend: CONFIG1 CONFIG2 Legend: Note 1: Bit 0 SCS T1CKPS Register on Page 66 LFIOFR HFIOFS 67 LCDIE — CCP2IE 84 BCLIF LCDIF — CCP2IF 87 T1OSCEN T1SYNC — TMR1ON 183 TUN TMR1CS 68 — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. TABLE 5-3: Name Bit 1 Bits SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 IESO CLKOUTEN 13:8 — — FCMEN 7:0 CP MCLRE PWRTE 13:8 — — LVP — VCAPEN(1) 7:0 — Bit 10/2 BOREN WDTE DEBUG Bit 9/1 Bit 8/0 CPD FOSC — BORV — — STVREN PLLEN WRT Register on Page 46 48 — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources. PIC16F1933 only. DS41575C-page 68  2011-2012 Microchip Technology Inc. PIC16(L)F1933 6.0 RESETS There are multiple ways to reset this device: • • • • • • • • Power-on Reset (POR) Brown-out Reset (BOR) MCLR Reset WDT Reset RESET instruction Stack Overflow Stack Underflow Programming mode exit To allow VDD to stabilize, an optional power-up timer can be enabled to extend the Reset time after a BOR or POR event. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 6-1. FIGURE 6-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Programming Mode Exit RESET Instruction Stack Stack Overflow/Underflow Reset Pointer External Reset MCLRE MCLR Sleep WDT Time-out Device Reset Power-on Reset VDD Brown-out Reset BOR Enable PWRT Zero LFINTOSC 64 ms PWRTEN  2011-2012 Microchip Technology Inc. DS41575C-page 69 PIC16(L)F1933 6.1 Power-On Reset (POR) 6.2 Brown-Out Reset (BOR) The POR circuit holds the device in Reset until VDD has reached an acceptable level for minimum operation. Slow rising VDD, fast operating speeds or analog performance may require greater than minimum VDD. The PWRT, BOR or MCLR features can be used to extend the start-up period until all device operation conditions have been met. The BOR circuit holds the device in Reset when VDD reaches a selectable minimum level. Between the POR and BOR, complete voltage range coverage for execution protection can be implemented. 6.1.1 • • • • POWER-UP TIMER (PWRT) The Power-up Timer provides a nominal 64 ms timeout on POR or Brown-out Reset. The device is held in Reset as long as PWRT is active. The PWRT delay allows additional time for the VDD to rise to an acceptable level. The Power-up Timer is enabled by clearing the PWRTE bit in Configuration Words. The Power-up Timer starts after the release of the POR and BOR. For additional information, refer to Application Note AN607, “Power-up Trouble Shooting” (DS00607). TABLE 6-1: The Brown-out Reset module has four operating modes controlled by the BOREN bits in Configuration Words. The four operating modes are: BOR is always on BOR is off when in Sleep BOR is controlled by software BOR is always off Refer to Table 6-3 for more information. The Brown-out Reset voltage level is selectable by configuring the BORV bit in Configuration Words. A VDD noise rejection filter prevents the BOR from triggering on small events. If VDD falls below VBOR for a duration greater than parameter TBORDC, the device will reset. See Figure 6-2 for more information. BOR OPERATING MODES BOREN SBOREN Device Mode BOR Mode 11 X X Active 10 X Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled 01 00 Instruction Execution upon: Release of POR or Wake-up from Sleep Waits for BOR ready(1) (BORRDY = 1) Waits for BOR ready (BORRDY = 1) Waits for BOR ready(1) (BORRDY = 1) Begins immediately (BORRDY = x) Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR circuit is forced on by the BOREN bits. 6.2.1 BOR IS ALWAYS ON When the BOREN bits of Configuration Words are programmed to ‘11’, the BOR is always on. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. BOR protection is active during Sleep. The BOR does not delay wake-up from Sleep. 6.2.2 BOR IS OFF IN SLEEP When the BOREN bits of Configuration Words are programmed to ‘10’, the BOR is on, except in Sleep. The device start-up will be delayed until the BOR is ready and VDD is higher than the BOR threshold. 6.2.3 BOR CONTROLLED BY SOFTWARE When the BOREN bits of Configuration Words are programmed to ‘01’, the BOR is controlled by the SBOREN bit of the BORCON register. The device startup is not delayed by the BOR ready condition or the VDD level. BOR protection begins as soon as the BOR circuit is ready. The status of the BOR circuit is reflected in the BORRDY bit of the BORCON register. BOR protection is unchanged by Sleep. BOR protection is not active during Sleep. The device wake-up will be delayed until the BOR is ready. DS41575C-page 70  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 6-2: BROWN-OUT SITUATIONS VDD VBOR Internal Reset TPWRT(1) VDD VBOR Internal Reset < TPWRT TPWRT(1) VDD VBOR Internal Reset Note 1: 6.3 TPWRT(1) TPWRT delay only if PWRTE bit is programmed to ‘0’. Register Definitions: BOR Control REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER R/W-1/u U-0 U-0 U-0 U-0 U-0 U-0 R-q/u SBOREN — — — — — — BORRDY bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 SBOREN: Software Brown-out Reset Enable bit If BOREN in Configuration Words  01: SBOREN is read/write, but has no effect on the BOR. If BOREN in Configuration Words = 01: 1 = BOR Enabled 0 = BOR Disabled bit 6-1 Unimplemented: Read as ‘0’ bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit 1 = The Brown-out Reset circuit is active 0 = The Brown-out Reset circuit is inactive  2011-2012 Microchip Technology Inc. DS41575C-page 71 PIC16(L)F1933 6.4 MCLR 6.9 Power-up Timer The MCLR is an optional external input that can reset the device. The MCLR function is controlled by the MCLRE bit of Configuration Words and the LVP bit of Configuration Words (Table 6-2). The Power-up Timer optionally delays device execution after a BOR or POR event. This timer is typically used to allow VDD to stabilize before allowing the device to start running. TABLE 6-2: The Power-up Timer is controlled by the PWRTE bit of Configuration Words. MCLR CONFIGURATION MCLRE LVP MCLR 0 0 Disabled 1 0 Enabled x 1 Enabled 6.4.1 MCLR ENABLED When MCLR is enabled and the pin is held low, the device is held in Reset. The MCLR pin is connected to VDD through an internal weak pull-up. The device has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. Note: 6.4.2 A Reset does not drive the MCLR pin low. MCLR DISABLED When MCLR is disabled, the pin functions as a general purpose input and the internal weak pull-up is under software control. See Section 12.6 “PORTE Registers” for more information. 6.5 6.10 Start-up Sequence Upon the release of a POR or BOR, the following must occur before the device will begin executing: 1. 2. 3. Power-up Timer runs to completion (if enabled). Oscillator start-up timer runs to completion (if required for oscillator source). MCLR must be released (if enabled). The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See Section 5.0 “Oscillator Module (with Fail-Safe Clock Monitor)” for more information. The Power-up Timer and oscillator start-up timer run independently of MCLR Reset. If MCLR is kept low long enough, the Power-up Timer and oscillator start-up timer will expire. Upon bringing MCLR high, the device will begin execution immediately (see Figure 6-3). This is useful for testing purposes or to synchronize more than one device operating in parallel. Watchdog Timer (WDT) Reset The Watchdog Timer generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The TO and PD bits in the STATUS register are changed to indicate the WDT Reset. See Section 10.0 “Watchdog Timer (WDT)” for more information. 6.6 RESET Instruction A RESET instruction will cause a device Reset. The RI bit in the PCON register will be set to ‘0’. See Table 6-4 for default conditions after a RESET instruction has occurred. 6.7 Stack Overflow/Underflow Reset The device can reset when the Stack Overflows or Underflows. The STKOVF or STKUNF bits of the PCON register indicate the Reset condition. These Resets are enabled by setting the STVREN bit in Configuration Words. See Section 3.5.2 “Overflow/Underflow Reset” for more information. 6.8 Programming Mode Exit Upon exit of Programming mode, the device will behave as if a POR had just occurred. DS41575C-page 72  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 6-3: RESET START-UP SEQUENCE VDD Internal POR TPWRT Power-Up Timer MCLR TMCLR Internal RESET Oscillator Modes External Crystal TOST Oscillator Start-Up Timer Oscillator FOSC Internal Oscillator Oscillator FOSC External Clock (EC) CLKIN FOSC  2011-2012 Microchip Technology Inc. DS41575C-page 73 PIC16(L)F1933 6.11 Determining the Cause of a Reset Upon any Reset, multiple bits in the STATUS and PCON register are updated to indicate the cause of the Reset. Table 6-3 and Table 6-4 show the Reset conditions of these registers. TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE STKOVF STKUNF RMCLR RI POR BOR TO PD Condition 0 0 1 1 0 x 1 1 Power-on Reset 0 0 1 1 0 x 0 x Illegal, TO is set on POR 0 0 1 1 0 x x 0 Illegal, PD is set on POR 0 0 1 1 u 0 1 1 Brown-out Reset u u u u u u 0 u WDT Reset u u u u u u 0 0 WDT Wake-up from Sleep u u u u u u 1 0 Interrupt Wake-up from Sleep u u 0 u u u u u MCLR Reset during normal operation u u 0 u u u 1 0 MCLR Reset during Sleep u u u 0 u u u u RESET Instruction Executed 1 u u u u u u u Stack Overflow Reset (STVREN = 1) u 1 u u u u u u Stack Underflow Reset (STVREN = 1) TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS(2) Program Counter STATUS Register PCON Register Power-on Reset 0000h ---1 1000 00-- 110x MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu WDT Reset 0000h ---0 uuuu uu-- uuuu WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu Brown-out Reset 0000h ---1 1uuu 00-- 11u0 ---1 0uuu uu-- uuuu ---u uuuu uu-- u0uu Condition Interrupt Wake-up from Sleep RESET Instruction Executed PC + 1 (1) 0000h Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1. 2: If a Status bit is not implemented, that bit will be read as ‘0’. DS41575C-page 74  2011-2012 Microchip Technology Inc. PIC16(L)F1933 6.12 Power Control (PCON) Register The Power Control (PCON) register contains flag bits to differentiate between a: • • • • • • Power-on Reset (POR) Brown-out Reset (BOR) Reset Instruction Reset (RI) Stack Overflow Reset (STKOVF) Stack Underflow Reset (STKUNF) MCLR Reset (RMCLR) The PCON register bits are shown in Register 6-2. 6.13 Register Definitions: Power Control REGISTER 6-2: R/W/HS-0/q PCON: POWER CONTROL REGISTER R/W/HS-0/q U-0 U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u STKUNF — — RMCLR RI POR BOR STKOVF bit 7 bit 0 Legend: HC = Bit is cleared by hardware HS = Bit is set by hardware R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 STKOVF: Stack Overflow Flag bit 1 = A Stack Overflow occurred 0 = A Stack Overflow has not occurred or set to ‘0’ by firmware bit 6 STKUNF: Stack Underflow Flag bit 1 = A Stack Underflow occurred 0 = A Stack Underflow has not occurred or set to ‘0’ by firmware bit 5-4 Unimplemented: Read as ‘0’ bit 3 RMCLR: MCLR Reset Flag bit 1 = A MCLR Reset has not occurred or set to ‘1’ by firmware 0 = A MCLR Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs) bit 2 RI: RESET Instruction Flag bit 1 = A RESET instruction has not been executed or set to ‘1’ by firmware 0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction) bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs)  2011-2012 Microchip Technology Inc. DS41575C-page 75 PIC16(L)F1933 TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page BORCON SBOREN — — — — — — BORRDY 71 PCON STKOVF STKUNF — — RMCLR RI POR BOR 75 STATUS — — — TO PD Z DC C 18 WDTCON — — SWDTEN 97 WDTPS Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. DS41575C-page 76  2011-2012 Microchip Technology Inc. PIC16(L)F1933 7.0 INTERRUPTS The interrupt feature allows certain events to preempt normal program flow. Firmware is used to determine the source of the interrupt and act accordingly. Some interrupts can be configured to wake the MCU from Sleep mode. This chapter contains the following information for Interrupts: • • • • • Operation Interrupt Latency Interrupts During Sleep INT Pin Automatic Context Saving Many peripherals produce interrupts. Refer to the corresponding chapters for details. A block diagram of the interrupt logic is shown in Figure 7-1. FIGURE 7-1: INTERRUPT LOGIC TMR0IF TMR0IE Peripheral Interrupts (TMR1IF) PIR1 (TMR1IF) PIR1 Wake-up (If in Sleep mode) INTF INTE IOCIF IOCIE Interrupt to CPU PEIE PIRn PIEn  2011-2012 Microchip Technology Inc. GIE DS41575C-page 77 PIC16(L)F1933 7.1 Operation Interrupts are disabled upon any device Reset. They are enabled by setting the following bits: • GIE bit of the INTCON register • Interrupt Enable bit(s) for the specific interrupt event(s) • PEIE bit of the INTCON register (if the Interrupt Enable bit of the interrupt event is contained in the PIE1, PIE2 and PIE3 registers) 7.2 Interrupt Latency Interrupt latency is defined as the time from when the interrupt event occurs to the time code execution at the interrupt vector begins. The latency for synchronous interrupts is three or four instruction cycles. For asynchronous interrupts, the latency is three to five instruction cycles, depending on when the interrupt occurs. See Figure 7-2 and Figure 7-3 for more details. The INTCON, PIR1, PIR2 and PIR3 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will be set, regardless of the status of the GIE, PEIE and individual interrupt enable bits. The following events happen when an interrupt event occurs while the GIE bit is set: • Current prefetched instruction is flushed • GIE bit is cleared • Current Program Counter (PC) is pushed onto the stack • Critical registers are automatically saved to the shadow registers (See Section 7.5 “Automatic Context Saving”) • PC is loaded with the interrupt vector 0004h The firmware within the Interrupt Service Routine (ISR) should determine the source of the interrupt by polling the interrupt flag bits. The interrupt flag bits must be cleared before exiting the ISR to avoid repeated interrupts. Because the GIE bit is cleared, any interrupt that occurs while executing the ISR will be recorded through its interrupt flag, but will not cause the processor to redirect to the interrupt vector. The RETFIE instruction exits the ISR by popping the previous address from the stack, restoring the saved context from the shadow registers and setting the GIE bit. For additional information on a specific interrupt’s operation, refer to its peripheral chapter. Note 1: Individual interrupt flag bits are set, regardless of the state of any other enable bits. 2: All interrupts will be ignored while the GIE bit is cleared. Any interrupt occurring while the GIE bit is clear will be serviced when the GIE bit is set again. DS41575C-page 78  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 7-2: INTERRUPT LATENCY OSC1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CLKOUT Interrupt Sampled during Q1 Interrupt GIE PC Execute PC-1 PC 1 Cycle Instruction at PC PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) PC+1/FSR ADDR New PC/ PC+1 0004h 0005h Inst(PC) NOP NOP Inst(0004h) FSR ADDR PC+1 PC+2 0004h 0005h INST(PC) NOP NOP NOP Inst(0004h) Inst(0005h) FSR ADDR PC+1 0004h 0005h INST(PC) NOP NOP Inst(0004h) Interrupt GIE PC Execute PC-1 PC 2 Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3 Cycle Instruction at PC Interrupt GIE PC Execute PC-1 PC 3 Cycle Instruction at PC  2011-2012 Microchip Technology Inc. PC+2 NOP NOP DS41575C-page 79 PIC16(L)F1933 FIGURE 7-3: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT (3) (4) INT pin (1) (1) INTF Interrupt Latency (2) (5) GIE INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Note 1: PC Inst (PC) Inst (PC – 1) PC + 1 Inst (PC + 1) Inst (PC) PC + 1 — Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT not available in all Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 30.0 “Electrical Specifications”. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. DS41575C-page 80  2011-2012 Microchip Technology Inc. PIC16(L)F1933 7.3 Interrupts During Sleep Some interrupts can be used to wake from Sleep. To wake from Sleep, the peripheral must be able to operate without the system clock. The interrupt source must have the appropriate Interrupt Enable bit(s) set prior to entering Sleep. On waking from Sleep, if the GIE bit is also set, the processor will branch to the interrupt vector. Otherwise, the processor will continue executing instructions after the SLEEP instruction. The instruction directly after the SLEEP instruction will always be executed before branching to the ISR. Refer to the Section 9.0 “PowerDown Mode (Sleep)” for more details. 7.4 INT Pin The INT pin can be used to generate an asynchronous edge-triggered interrupt. This interrupt is enabled by setting the INTE bit of the INTCON register. The INTEDG bit of the OPTION_REG register determines on which edge the interrupt will occur. When the INTEDG bit is set, the rising edge will cause the interrupt. When the INTEDG bit is clear, the falling edge will cause the interrupt. The INTF bit of the INTCON register will be set when a valid edge appears on the INT pin. If the GIE and INTE bits are also set, the processor will redirect program execution to the interrupt vector. 7.5 Automatic Context Saving Upon entering an interrupt, the return PC address is saved on the stack. Additionally, the following registers are automatically saved in the Shadow registers: • • • • • W register STATUS register (except for TO and PD) BSR register FSR registers PCLATH register Upon exiting the Interrupt Service Routine (ISR), these registers are automatically restored. Any modifications to these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding Shadow register should be modified and the value will be restored when exiting the ISR. The Shadow registers are available in Bank 31 and are readable and writable. Depending on the user’s application, other registers may also need to be saved.  2011-2012 Microchip Technology Inc. DS41575C-page 81 PIC16(L)F1933 7.6 Register Definitions: Interrupt Control REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 GIE: Global Interrupt Enable bit 1 = Enables all active interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all active peripheral interrupts 0 = Disables all peripheral interrupts bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: INT External Interrupt Enable bit 1 = Enables the INT external interrupt 0 = Disables the INT external interrupt bit 3 IOCIE: Interrupt-on-Change Enable bit 1 = Enables the interrupt-on-change 0 = Disables the interrupt-on-change bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed 0 = TMR0 register did not overflow bit 1 INTF: INT External Interrupt Flag bit 1 = The INT external interrupt occurred 0 = The INT external interrupt did not occur bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit 1 = When at least one of the interrupt-on-change pins changed state 0 = None of the interrupt-on-change pins have changed state Note 1: Note: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCBF register have been cleared by software. Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS41575C-page 82  2011-2012 Microchip Technology Inc. PIC16(L)F1933 7.6.1 PIE1 REGISTER REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit 1 = Enables the Timer1 Gate Acquisition interrupt 0 = Disables the Timer1 Gate Acquisition interrupt bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 RCIE: USART Receive Interrupt Enable bit 1 = Enables the USART receive interrupt 0 = Disables the USART receive interrupt bit 4 TXIE: USART Transmit Interrupt Enable bit 1 = Enables the USART transmit interrupt 0 = Disables the USART transmit interrupt bit 3 SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2011-2012 Microchip Technology Inc. DS41575C-page 83 PIC16(L)F1933 7.6.2 PIE2 REGISTER REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIE: Oscillator Fail Interrupt Enable bit 1 = Enables the Oscillator Fail interrupt 0 = Disables the Oscillator Fail interrupt bit 6 C2IE: Comparator C2 Interrupt Enable bit 1 = Enables the Comparator C2 interrupt 0 = Disables the Comparator C2 interrupt bit 5 C1IE: Comparator C1 Interrupt Enable bit 1 = Enables the Comparator C1 interrupt 0 = Disables the Comparator C1 interrupt bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit 1 = Enables the EEPROM Write Completion interrupt 0 = Disables the EEPROM Write Completion interrupt bit 3 BCLIE: MSSP Bus Collision Interrupt Enable bit 1 = Enables the MSSP Bus Collision Interrupt 0 = Disables the MSSP Bus Collision Interrupt bit 2 LCDIE: LCD Module Interrupt Enable bit 1 = Enables the LCD module interrupt 0 = Disables the LCD module interrupt bit 1 Unimplemented: Read as ‘0’ bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enables the CCP2 interrupt 0 = Disables the CCP2 interrupt Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. DS41575C-page 84  2011-2012 Microchip Technology Inc. PIC16(L)F1933 7.6.3 PIE3 REGISTER REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IE: CCP5 Interrupt Enable bit 1 = Enables the CCP5 interrupt 0 = Disables the CCP5 interrupt bit 5 CCP4IE: CCP4 Interrupt Enable bit 1 = Enables the CCP4 interrupt 0 = Disables the CCP4 interrupt bit 4 CCP3IE: CCP3 Interrupt Enable bit 1 = Enables the CCP3 interrupt 0 = Disables the CCP3 interrupt bit 3 TMR6IE: TMR6 to PR6 Match Interrupt Enable bit 1 = Enables the TMR6 to PR6 match interrupt 0 = Disables the TMR6 to PR6 match interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IE: TMR4 to PR4 Match Interrupt Enable bit 1 = Enables the TMR4 to PR4 match interrupt 0 = Disables the TMR4 to PR4 match interrupt bit 0 Unimplemented: Read as ‘0’ Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.  2011-2012 Microchip Technology Inc. DS41575C-page 85 PIC16(L)F1933 7.6.4 PIR1 REGISTER REGISTER 7-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 RCIF: USART Receive Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 TXIF: USART Transmit Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 CCP1IF: CCP1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS41575C-page 86  2011-2012 Microchip Technology Inc. PIC16(L)F1933 7.6.5 PIR2 REGISTER REGISTER 7-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSFIF: Oscillator Fail Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 6 C2IF: Comparator C2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 C1IF: Comparator C1 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 BCLIF: MSSP Bus Collision Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 LCDIF: LCD Module Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 1 Unimplemented: Read as ‘0’ bit 0 CCP2IF: CCP2 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt.  2011-2012 Microchip Technology Inc. DS41575C-page 87 PIC16(L)F1933 7.6.6 PIR3 REGISTER REGISTER 7-7: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6 CCP5IF: CCP5 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 5 CCP4IF: CCP4 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 4 CCP3IF: CCP3 Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 3 TMR6IF: TMR6 to PR6 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 2 Unimplemented: Read as ‘0’ bit 1 TMR4IF: TMR4 to PR4 Match Interrupt Flag bit 1 = Interrupt is pending 0 = Interrupt is not pending bit 0 Unimplemented: Read as ‘0’ Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Enable bit, GIE, of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. DS41575C-page 88  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 7-1: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 OPTION_REG WPUEN INTEDG TMROCS TMROSE PIE1 TMR1GIE ADIE RCIE PIE2 OSFIE C2IE C1IE PIE3 — CCP5IE CCP4IE PIR1 TMR1GIF ADIF RCIF PIR2 OSFIF C2IF PIR3 — CCP5IF TXIE PSA PS SSPIE CCP1IE EEIE BCLIE CCP3IE TMR6IE TXIF C1IF CCP4IF 173 TMR2IE TMR1IE 83 LCDIE — CCP2IE 84 — TMR4IE — 85 SSPIF CCP1IF TMR2IF TMR1IF 86 EEIF BCLIF LCDIF — CCP2IF 87 CCP3IF TMR6IF — TMR4IF — 88 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Interrupts.  2011-2012 Microchip Technology Inc. DS41575C-page 89 PIC16(L)F1933 NOTES: DS41575C-page 90  2011-2012 Microchip Technology Inc. PIC16(L)F1933 8.0 LOW DROPOUT (LDO) VOLTAGE REGULATOR The PIC16F193X has an internal Low Dropout Regulator (LDO) which provides operation above 3.6V. The LDO regulates a voltage for the internal device logic while permitting the VDD and I/O pins to operate at a higher voltage. There is no user enable/disable control available for the LDO, it is always active. The PIC16LF193X operates at a maximum VDD of 3.6V and does not incorporate an LDO. On power-up, the external capacitor will load the LDO voltage regulator. To prevent erroneous operation, the device is held in Reset while a constant current source charges the external capacitor. After the cap is fully charged, the device is released from Reset. For more information on the constant current rate, refer to the LDO Regulator Characteristics Table in Section 30.0 “Electrical Specifications”. A device I/O pin may be configured as the LDO voltage output, identified as the VCAP pin. Although not required, an external low-ESR capacitor may be connected to the VCAP pin for additional regulator stability. The VCAPEN bits of Configuration Words determines which pin is assigned as the VCAP pin. Refer to Table 8-1. TABLE 8-1: VCAPEN SELECT BITS VCAPEN Pin 00 RA0 01 RA5 10 RA6 11 No VCAP TABLE 8-2: Name CONFIG2 Legend: Note 1: SUMMARY OF CONFIGURATION WORD WITH LDO Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 13:8 — — LVP DEBUG — BORV STVREN PLLEN — VCAPEN(1) — — WRT1 WRT0 7:0 — Register on Page 48 — = unimplemented locations read as ‘0’. Shaded cells are not used by LDO. PIC16F1933 only.  2011-2012 Microchip Technology Inc. DS41575C-page 91 PIC16(L)F1933 NOTES: DS41575C-page 92  2011-2012 Microchip Technology Inc. PIC16(L)F1933 9.0 POWER-DOWN MODE (SLEEP) 9.1 Wake-up from Sleep The Power-Down mode is entered by executing a SLEEP instruction. The device can wake-up from Sleep through one of the following events: Upon entering Sleep mode, the following conditions exist: 1. 2. 3. 4. 5. 6. 1. WDT will be cleared but keeps running, if enabled for operation during Sleep. 2. PD bit of the STATUS register is cleared. 3. TO bit of the STATUS register is set. 4. CPU clock is disabled. 5. 31 kHz LFINTOSC is unaffected and peripherals that operate from it may continue operation in Sleep. 6. Timer1 and peripherals that operate from Timer1 continue operation in Sleep when the Timer1 clock source selected is: • LFINTOSC • T1CKI • Timer1 oscillator • CapSense oscillator 7. ADC is unaffected, if the dedicated FRC clock is selected. 8. Capacitive Sensing oscillator is unaffected. 9. I/O ports maintain the status they had before SLEEP was executed (driving high, low or highimpedance). 10. Resets other than WDT are not affected by Sleep mode. Refer to individual chapters for more details on peripheral operation during Sleep. External Reset input on MCLR pin, if enabled BOR Reset, if enabled POR Reset Watchdog Timer, if enabled Any external interrupt Interrupts by peripherals capable of running during Sleep (see individual peripheral for more information) The first three events will cause a device Reset. The last three events are considered a continuation of program execution. To determine whether a device Reset or wake-up event occurred, refer to Section 6.11 “Determining the Cause of a Reset”. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will occur regardless of the state of the GIE bit. If the GIE bit is disabled, the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is enabled, the device executes the instruction after the SLEEP instruction, the device will then call the Interrupt Service Routine. In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. To minimize current consumption, the following conditions should be considered: • • • • • • I/O pins should not be floating External circuitry sinking current from I/O pins Internal circuitry sourcing current from I/O pins Current draw from pins with internal weak pull-ups Modules using 31 kHz LFINTOSC Modules using Timer1 oscillator I/O pins that are high-impedance inputs should be pulled to VDD or VSS externally to avoid switching currents caused by floating inputs. Examples of internal circuitry that might be sourcing current include modules such as the DAC and FVR modules. See Section 17.0 “Digital-to-Analog Converter (DAC) Module” and Section 14.0 “Fixed Voltage Reference (FVR)” for more information on these modules.  2011-2012 Microchip Technology Inc. DS41575C-page 93 PIC16(L)F1933 9.1.1 WAKE-UP USING INTERRUPTS • If the interrupt occurs during or after the execution of a SLEEP instruction - SLEEP instruction will be completely executed - Device will immediately wake-up from Sleep - WDT and WDT prescaler will be cleared - TO bit of the STATUS register will be set - PD bit of the STATUS register will be cleared. When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction - SLEEP instruction will execute as a NOP. - WDT and WDT prescaler will not be cleared - TO bit of the STATUS register will not be set - PD bit of the STATUS register will not be cleared. FIGURE 9-1: Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1(1) TOST(3) CLKOUT(2) Interrupt Latency (4) Interrupt flag GIE bit (INTCON reg.) Processor in Sleep Instruction Flow PC PC Instruction Fetched Instruction Executed Note 1: 2: 3: 4: PC + 1 Inst(PC) = Sleep Inst(PC - 1) PC + 2 PC + 2 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) Forced NOP 0004h 0005h Inst(0004h) Inst(0005h) Forced NOP Inst(0004h) XT, HS or LP Oscillator mode assumed. CLKOUT is not available in XT, HS, or LP Oscillator modes, but shown here for timing reference. TOST = 1024 TOSC (drawing not to scale). This delay applies only to XT, HS or LP Oscillator modes. GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line. TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 131 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 131 IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 131 PIE1 IOCBP TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 88 STATUS — — — TO PD Z DC C 18 — — SWDTEN 97 WDTCON Legend: WDTPS — = unimplemented location, read as ‘0’. Shaded cells are not used in Power-Down mode. DS41575C-page 94  2011-2012 Microchip Technology Inc. PIC16(L)F1933 10.0 WATCHDOG TIMER (WDT) The Watchdog Timer is a system timer that generates a Reset if the firmware does not issue a CLRWDT instruction within the time-out period. The Watchdog Timer is typically used to recover the system from unexpected events. The WDT has the following features: • Independent clock source • Multiple operating modes - WDT is always on - WDT is off when in Sleep - WDT is controlled by software - WDT is always off • Configurable time-out period is from 1 ms to 256 seconds (nominal) • Multiple Reset conditions • Operation during Sleep FIGURE 10-1: WATCHDOG TIMER BLOCK DIAGRAM WDTE = 01 SWDTEN WDTE = 11 LFINTOSC 23-bit Programmable Prescaler WDT WDT Time-out WDTE = 10 Sleep  2011-2012 Microchip Technology Inc. WDTPS DS41575C-page 95 PIC16(L)F1933 10.1 Independent Clock Source 10.3 The WDT derives its time base from the 31 kHz LFINTOSC internal oscillator. Time intervals in this chapter are based on a nominal interval of 1 ms. See the Electrical Specifications Chapters for the LFINTOSC tolerances. 10.2 The Watchdog Timer module has four operating modes controlled by the WDTE bits in Configuration Words. See Table 10-1. 10.2.1 WDT IS ALWAYS ON When the WDTE bits of Configuration Words are set to ‘11’, the WDT is always on. WDT protection is active during Sleep. 10.2.2 WDT IS OFF IN SLEEP WDT protection is not active during Sleep. WDT CONTROLLED BY SOFTWARE When the WDTE bits of Configuration Words are set to ‘01’, the WDT is controlled by the SWDTEN bit of the WDTCON register. WDT protection is unchanged Table 10-1 for more details. TABLE 10-1: by Sleep. See WDT OPERATING MODES WDTE SWDTEN Device Mode WDT Mode 11 X X Active 10 X Awake Active Sleep Disabled 1 X Active 0 X Disabled X X Disabled 01 00 TABLE 10-2: Clearing the WDT The WDT is cleared when any of the following conditions occur: • • • • • • • Any Reset CLRWDT instruction is executed Device enters Sleep Device wakes up from Sleep Oscillator fail WDT is disabled Oscillator Start-up TImer (OST) is running See Table 10-2 for more information. When the WDTE bits of Configuration Words are set to ‘10’, the WDT is on, except in Sleep. 10.2.3 The WDTPS bits of the WDTCON register set the time-out period from 1 ms to 256 seconds (nominal). After a Reset, the default time-out period is two seconds. 10.4 WDT Operating Modes Time-Out Period 10.5 Operation During Sleep When the device enters Sleep, the WDT is cleared. If the WDT is enabled during Sleep, the WDT resumes counting. When the device exits Sleep, the WDT is cleared again. The WDT remains clear until the OST, if enabled, completes. See Section 5.0 “Oscillator Module (with Fail-Safe Clock Monitor)” for more information on the OST. When a WDT time-out occurs while the device is in Sleep, no Reset is generated. Instead, the device wakes up and resumes operation. The TO and PD bits in the STATUS register are changed to indicate the event. See Section 3.0 “Memory Organization” and STATUS register (Register 3-1) for more information. WDT CLEARING CONDITIONS Conditions WDT WDTE = 00 WDTE = 01 and SWDTEN = 0 WDTE = 10 and enter Sleep CLRWDT Command Cleared Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Change INTOSC divider (IRCF bits) DS41575C-page 96 Cleared until the end of OST Unaffected  2011-2012 Microchip Technology Inc. PIC16(L)F1933 10.6 Register Definitions: Watchdog Control REGISTER 10-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 — — R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 WDTPS bit 7 R/W-0/0 SWDTEN bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-1 WDTPS: Watchdog Timer Period Select bits Bit Value = Prescale Rate 11111 = Reserved. Results in minimum interval (1:32) • • • 10011 = Reserved. Results in minimum interval (1:32) 10010 10001 10000 01111 01110 01101 01100 01011 01010 01001 01000 00111 00110 00101 00100 00011 00010 00001 00000 bit 0 = = = = = = = = = = = = = = = = = = = 1:8388608 (223) (Interval 256s nominal) 1:4194304 (222) (Interval 128s nominal) 1:2097152 (221) (Interval 64s nominal) 1:1048576 (220) (Interval 32s nominal) 1:524288 (219) (Interval 16s nominal) 1:262144 (218) (Interval 8s nominal) 1:131072 (217) (Interval 4s nominal) 1:65536 (Interval 2s nominal) (Reset value) 1:32768 (Interval 1s nominal) 1:16384 (Interval 512 ms nominal) 1:8192 (Interval 256 ms nominal) 1:4096 (Interval 128 ms nominal) 1:2048 (Interval 64 ms nominal) 1:1024 (Interval 32 ms nominal) 1:512 (Interval 16 ms nominal) 1:256 (Interval 8 ms nominal) 1:128 (Interval 4 ms nominal) 1:64 (Interval 2 ms nominal) 1:32 (Interval 1 ms nominal) SWDTEN: Software Enable/Disable for Watchdog Timer bit If WDTE = 00: This bit is ignored. If WDTE = 01: 1 = WDT is turned on 0 = WDT is turned off If WDTE = 1x: This bit is ignored.  2011-2012 Microchip Technology Inc. DS41575C-page 97 PIC16(L)F1933 TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER Name Bit 7 OSCCON SPLLEN STATUS WDTCON Legend: CONFIG1 Legend: Bit 5 Bit 4 Bit 3 IRCF — — — — — Bit 2 Bit 1 — TO PD Bit 0 SCS Z DC WDTPS Register on Page 66 C 18 SWDTEN 97 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer. TABLE 10-4: Name Bit 6 SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — FCMEN IESO CLKOUTEN 7:0 CP MCLRE PWRTE Bit 10/2 Bit 9/1 BOREN WDTE FOSC Bit 8/0 CPD Register on Page 46 — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer. DS41575C-page 98  2011-2012 Microchip Technology Inc. PIC16(L)F1933 11.0 DATA EEPROM AND FLASH PROGRAM MEMORY CONTROL The Data EEPROM and Flash program memory are readable and writable during normal operation (full VDD range). These memories are not directly mapped in the register file space. Instead, they are indirectly addressed through the Special Function Registers (SFRs). There are six SFRs used to access these memories: • • • • • • EECON1 EECON2 EEDATL EEDATH EEADRL EEADRH When interfacing the data memory block, EEDATL holds the 8-bit data for read/write, and EEADRL holds the address of the EEDATL location being accessed. These devices have 256 bytes of data EEPROM with an address range from 0h to 0FFh. When accessing the program memory block, the EEDATH:EEDATL register pair forms a 2-byte word that holds the 14-bit data for read/write, and the EEADRL and EEADRH registers form a 2-byte word that holds the 15-bit address of the program memory location being read. The EEPROM data memory allows byte read and write. An EEPROM byte write automatically erases the location and writes the new data (erase before write). The write time is controlled by an on-chip timer. The write/erase voltages are generated by an on-chip charge pump rated to operate over the voltage range of the device for byte or word operations. Depending on the setting of the Flash Program Memory Self Write Enable bits WRT of the Configuration Words, the device may or may not be able to write certain blocks of the program memory. However, reads from the program memory are always allowed. 11.1 EEADRL and EEADRH Registers The EEADRH:EEADRL register pair can address up to a maximum of 256 bytes of data EEPROM or up to a maximum of 32K words of program memory. When selecting a program address value, the MSB of the address is written to the EEADRH register and the LSB is written to the EEADRL register. When selecting a EEPROM address value, only the LSB of the address is written to the EEADRL register. 11.1.1 EECON1 AND EECON2 REGISTERS EECON1 is the control register for EE memory accesses. Control bit EEPGD determines if the access will be a program or data memory access. When clear, any subsequent operations will operate on the EEPROM memory. When set, any subsequent operations will operate on the program memory. On Reset, EEPROM is selected by default. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set, in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation to occur. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and execute the appropriate error handling routine. Interrupt flag bit EEIF of the PIR2 register is set when write is complete. It must be cleared in the software. Reading EECON2 will read all ‘0’s. The EECON2 register is used exclusively in the data EEPROM write sequence. To enable writes, a specific pattern must be written to EECON2. When the device is code-protected, the device programmer can no longer access data or program memory. When code-protected, the CPU may continue to read and write the data EEPROM memory and Flash program memory.  2011-2012 Microchip Technology Inc. DS41575C-page 99 PIC16(L)F1933 11.2 Using the Data EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). When variables in one section change frequently, while variables in another section do not change, it is possible to exceed the total number of write cycles to the EEPROM without exceeding the total number of write cycles to a single byte. Refer to Section 30.0 “Electrical Specifications”. If this is the case, then a refresh of the array must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. 11.2.1 READING THE DATA EEPROM MEMORY To read a data memory location, the user must write the address to the EEADRL register, clear the EEPGD and CFGS control bits of the EECON1 register, and then set control bit RD. The data is available at the very next cycle, in the EEDATL register; therefore, it can be read in the next instruction. EEDATL will hold this value until another read or until it is written to by the user (during a write operation). EXAMPLE 11-1: DATA EEPROM READ BANKSEL EEADRL ; MOVLW DATA_EE_ADDR ; MOVWF EEADRL ;Data Memory ;Address to read BCF EECON1, CFGS ;Deselect Config space BCF EECON1, EEPGD;Point to DATA memory BSF EECON1, RD ;EE Read MOVF EEDATL, W ;W = EEDATL Note: Data EEPROM can be read regardless of the setting of the CPD bit. 11.2.2 WRITING TO THE DATA EEPROM MEMORY To write an EEPROM data location, the user must first write the address to the EEADRL register and the data to the EEDATL register. Then the user must follow a specific sequence to initiate the write for each byte. The write will not initiate if the above sequence is not followed exactly (write 55h to EECON2, write AAh to EECON2, then set the WR bit) for each byte. Interrupts should be disabled during this code segment. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. EEIF must be cleared by software. 11.2.3 PROTECTION AGAINST SPURIOUS WRITE There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, WREN is cleared. Also, the Power-up Timer (64 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: • Brown-out • Power Glitch • Software Malfunction 11.2.4 DATA EEPROM OPERATION DURING CODE-PROTECT Data memory can be code-protected by programming the CPD bit in the Configuration Words to ‘0’. When the data memory is code-protected, only the CPU is able to read and write data to the data EEPROM. It is recommended to code-protect the program memory when code-protecting data memory. This prevents anyone from replacing your program with a program that will access the contents of the data EEPROM. DS41575C-page 100  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Required Sequence EXAMPLE 11-2: DATA EEPROM WRITE BANKSEL MOVLW MOVWF MOVLW MOVWF BCF BCF BSF EEADRL DATA_EE_ADDR EEADRL DATA_EE_DATA EEDATL EECON1, CFGS EECON1, EEPGD EECON1, WREN ; ; ;Data Memory Address to write ; ;Data Memory Value to write ;Deselect Configuration space ;Point to DATA memory ;Enable writes BCF MOVLW MOVWF MOVLW MOVWF BSF BSF BCF BTFSC GOTO INTCON, 55h EECON2 0AAh EECON2 EECON1, INTCON, EECON1, EECON1, $-2 ;Disable INTs. ; ;Write 55h ; ;Write AAh ;Set WR bit to begin write ;Enable Interrupts ;Disable writes ;Wait for write to complete ;Done FIGURE 11-1: GIE WR GIE WREN WR FLASH PROGRAM MEMORY READ CYCLE EXECUTION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Flash ADDR Flash Data PC PC + 1 INSTR (PC) INSTR(PC - 1) executed here EEADRH,EEADRL INSTR (PC + 1) BSF EECON1,RD executed here PC +3 PC+3 EEDATH,EEDATL INSTR(PC + 1) executed here PC + 5 PC + 4 INSTR (PC + 3) Forced NOP executed here INSTR (PC + 4) INSTR(PC + 3) executed here INSTR(PC + 4) executed here RD bit EEDATH EEDATL Register  2011-2012 Microchip Technology Inc. DS41575C-page 101 PIC16(L)F1933 11.3 Flash Program Memory Overview It is important to understand the Flash program memory structure for erase and programming operations. Flash Program memory is arranged in rows. A row consists of a fixed number of 14-bit program memory words. A row is the minimum block size that can be erased by user software. Flash program memory may only be written or erased if the destination address is in a segment of memory that is not write-protected, as defined in bits WRT of Configuration Words. After a row has been erased, the user can reprogram all or a portion of this row. Data to be written into the program memory row is written to 14-bit wide data write latches. These write latches are not directly accessible to the user, but may be loaded via sequential writes to the EEDATH:EEDATL register pair. Note: If the user wants to modify only a portion of a previously programmed row, then the contents of the entire row must be read and saved in RAM prior to the erase. The number of data write latches may not be equivalent to the number of row locations. During programming, user software may need to fill the set of write latches and initiate a programming operation multiple times in order to fully reprogram an erased row. For example, a device with a row size of 32 words and eight write latches will need to load the write latches with data and initiate a programming operation four times. TABLE 11-1: The size of a program memory row and the number of program memory write latches may vary by device. See Table 11-1 for details. 11.3.1 READING THE FLASH PROGRAM MEMORY To read a program memory location, the user must: 1. 2. 3. 4. Write the Least and Most Significant address bits to the EEADRH:EEADRL register pair. Clear the CFGS bit of the EECON1 register. Set the EEPGD control bit of the EECON1 register. Then, set control bit RD of the EECON1 register. Once the read control bit is set, the program memory Flash controller will use the second instruction cycle to read the data. This causes the second instruction immediately following the “BSF EECON1,RD” instruction to be ignored. The data is available in the very next cycle, in the EEDATH:EEDATL register pair; therefore, it can be read as two bytes in the following instructions. EEDATH:EEDATL register pair will hold this value until another read or until it is written to by the user. Note 1: The two instructions following a program memory read are required to be NOPs. This prevents the user from executing a two-cycle instruction on the next instruction after the RD bit is set. 2: Flash program memory can be read regardless of the setting of the CP bit. FLASH MEMORY ORGANIZATION BY DEVICE Device PIC16(L)F1933 DS41575C-page 102 Erase Block (Row) Size/Boundary Number of Write Latches/Boundary 32 words, EEADRL = 00000 8 words, EEADRL = 000  2011-2012 Microchip Technology Inc. PIC16(L)F1933 EXAMPLE 11-3: FLASH PROGRAM MEMORY READ * This code block will read 1 word of program * memory at the memory address: PROG_ADDR_HI: PROG_ADDR_LO * data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF MOVLW MOVWL EEADRL PROG_ADDR_LO EEADRL PROG_ADDR_HI EEADRH ; Select Bank for EEPROM registers ; ; Store LSB of address ; ; Store MSB of address BCF BSF BCF BSF NOP NOP BSF EECON1,CFGS EECON1,EEPGD INTCON,GIE EECON1,RD INTCON,GIE ; ; ; ; ; ; ; Do not select Configuration Space Select Program Memory Disable interrupts Initiate read Executed (Figure 11-1) Ignored (Figure 11-1) Restore interrupts MOVF MOVWF MOVF MOVWF EEDATL,W PROG_DATA_LO EEDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location  2011-2012 Microchip Technology Inc. DS41575C-page 103 PIC16(L)F1933 11.3.2 ERASING FLASH PROGRAM MEMORY While executing code, program memory can only be erased by rows. To erase a row: 1. 2. 3. 4. 5. 6. Load the EEADRH:EEADRL register pair with the address of new row to be erased. Clear the CFGS bit of the EECON1 register. Set the EEPGD, FREE and WREN bits of the EECON1 register. Write 55h, then AAh, to EECON2 (Flash programming unlock sequence). Set control bit WR of the EECON1 register to begin the erase operation. Poll the FREE bit in the EECON1 register to determine when the row erase has completed. See Example 11-4. After the “BSF EECON1,WR” instruction, the processor requires two cycles to set up the erase operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms erase time. This is not Sleep mode as the clocks and peripherals will continue to run. After the erase cycle, the processor will resume operation with the third instruction after the EECON1 write instruction. 11.3.3 WRITING TO FLASH PROGRAM MEMORY Program memory is programmed using the following steps: 1. 2. 3. 4. Load the starting address of the word(s) to be programmed. Load the write latches with data. Initiate a programming operation. Repeat steps 1 through 3 until all data is written. Before writing to program memory, the word(s) to be written must be erased or previously unwritten. Program memory can only be erased one row at a time. No automatic erase occurs upon the initiation of the write. Program memory can be written one or more words at a time. The maximum number of words written at one time is equal to the number of write latches. See Figure 11-2 (block writes to program memory with eight write latches) for more details. The write latches are aligned to the address boundary defined by EEADRL as shown in Table 11-1. Write operations do not cross these boundaries. At the completion of a program memory write operation, the write latches are reset to contain 0x3FFF. DS41575C-page 104 The following steps should be completed to load the write latches and program a block of program memory. These steps are divided into two parts. First, all write latches are loaded with data except for the last program memory location. Then, the last write latch is loaded and the programming sequence is initiated. A special unlock sequence is required to load a write latch with data or initiate a Flash programming operation. This unlock sequence should not be interrupted. 1. Set the EEPGD and WREN bits of the EECON1 register. 2. Clear the CFGS bit of the EECON1 register. 3. Set the LWLO bit of the EECON1 register. When the LWLO bit of the EECON1 register is ‘1’, the write sequence will only load the write latches and will not initiate the write to Flash program memory. 4. Load the EEADRH:EEADRL register pair with the address of the location to be written. 5. Load the EEDATH:EEDATL register pair with the program memory data to be written. 6. Write 55h, then AAh, to EECON2, then set the WR bit of the EECON1 register (Flash programming unlock sequence). The write latch is now loaded. 7. Increment the EEADRH:EEADRL register pair to point to the next location. 8. Repeat steps 5 through 7 until all but the last write latch has been loaded. 9. Clear the LWLO bit of the EECON1 register. When the LWLO bit of the EECON1 register is ‘0’, the write sequence will initiate the write to Flash program memory. 10. Load the EEDATH:EEDATL register pair with the program memory data to be written. 11. Write 55h, then AAh, to EECON2, then set the WR bit of the EECON1 register (Flash programming unlock sequence). The entire latch block is now written to Flash program memory. It is not necessary to load the entire write latch block with user program data. However, the entire write latch block will be written to program memory. An example of the complete write sequence for eight words is shown in Example 11-5. The initial address is loaded into the EEADRH:EEADRL register pair; the eight words of data are loaded using indirect addressing. Note: The code sequence provided in Example 11-5 must be repeated multiple times to fully program an erased program memory row.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 After the “BSF EECON1,WR” instruction, the processor requires two cycles to set up the write operation. The user must place two NOP instructions after the WR bit is set. The processor will halt internal operations for the typical 2 ms, only during the cycle in which the write takes place (i.e., the last word of the block write). This is not Sleep mode as the clocks and peripherals will FIGURE 11-2: continue to run. The processor does not stall when LWLO = 1, loading the write latches. After the write cycle, the processor will resume operation with the third instruction after the EECON1 write instruction. BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 8 WRITE LATCHES 7 5 0 0 7 EEDATH EEDATA 8 6 Last word of block to be written First word of block to be written 14 EEADRL = 000 14 EEADRL = 010 EEADRL = 001 Buffer Register 14 Buffer Register Buffer Register 14 EEADRL = 111 Buffer Register Program Memory  2011-2012 Microchip Technology Inc. DS41575C-page 105 PIC16(L)F1933 EXAMPLE 11-4: ERASING ONE ROW OF PROGRAM MEMORY Required Sequence ; This row erase routine assumes the following: ; 1. A valid address within the erase block is loaded in ADDRH:ADDRL ; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF BSF BCF BSF BSF INTCON,GIE EEADRL ADDRL,W EEADRL ADDRH,W EEADRH EECON1,EEPGD EECON1,CFGS EECON1,FREE EECON1,WREN MOVLW MOVWF MOVLW MOVWF BSF NOP 55h EECON2 0AAh EECON2 EECON1,WR NOP ; Disable ints so required sequences will execute properly ; Load lower 8 bits of erase address boundary ; Load upper 6 bits of erase address boundary ; ; ; ; Point to program memory Not configuration space Specify an erase operation Enable writes ; ; ; ; ; ; ; ; Start of required sequence to initiate erase Write 55h Write AAh Set WR bit to begin erase Any instructions here are ignored as processor halts to begin erase sequence Processor will stop here and wait for erase complete. ; after erase processor continues with 3rd instruction BCF BSF DS41575C-page 106 EECON1,WREN INTCON,GIE ; Disable writes ; Enable interrupts  2011-2012 Microchip Technology Inc. PIC16(L)F1933 EXAMPLE 11-5: ; ; ; ; ; ; ; WRITING TO FLASH PROGRAM MEMORY This write routine assumes the following: 1. The 16 bytes of data are loaded, starting at the address in DATA_ADDR 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR, stored in little endian format 3. A valid starting address (the least significant bits = 000) is loaded in ADDRH:ADDRL 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM) BCF BANKSEL MOVF MOVWF MOVF MOVWF MOVLW MOVWF MOVLW MOVWF BSF BCF BSF BSF INTCON,GIE EEADRH ADDRH,W EEADRH ADDRL,W EEADRL LOW DATA_ADDR FSR0L HIGH DATA_ADDR FSR0H EECON1,EEPGD EECON1,CFGS EECON1,WREN EECON1,LWLO ; ; ; ; ; ; ; ; ; ; ; ; ; ; Disable ints so required sequences will execute properly Bank 3 Load initial address MOVIW MOVWF MOVIW MOVWF FSR0++ EEDATL FSR0++ EEDATH ; Load first data byte into lower ; ; Load second data byte into upper ; MOVF XORLW ANDLW BTFSC GOTO EEADRL,W 0x07 0x07 STATUS,Z START_WRITE ; Check if lower bits of address are '000' ; Check if we're on the last of 8 addresses ; ; Exit if last of eight words, ; MOVLW MOVWF MOVLW MOVWF BSF NOP 55h EECON2 0AAh EECON2 EECON1,WR ; ; ; ; ; ; ; ; Load initial data address Load initial data address Point to program memory Not configuration space Enable writes Only Load Write Latches Required Sequence LOOP NOP Start of required write sequence: Write 55h Write AAh Set WR bit to begin write Any instructions here are ignored as processor halts to begin write sequence Processor will stop here and wait for write to complete. ; After write processor continues with 3rd instruction. INCF GOTO Required Sequence START_WRITE BCF MOVLW MOVWF MOVLW MOVWF BSF NOP EEADRL,F LOOP ; Still loading latches Increment address ; Write next latches EECON1,LWLO ; No more loading latches - Actually start Flash program ; memory write 55h EECON2 0AAh EECON2 EECON1,WR ; ; ; ; ; ; ; ; NOP BCF BSF EECON1,WREN INTCON,GIE  2011-2012 Microchip Technology Inc. Start of required write sequence: Write 55h Write AAh Set WR bit to begin write Any instructions here are ignored as processor halts to begin write sequence Processor will stop here and wait for write complete. ; after write processor continues with 3rd instruction ; Disable writes ; Enable interrupts DS41575C-page 107 PIC16(L)F1933 11.4 Modifying Flash Program Memory When modifying existing data in a program memory row, and data within that row must be preserved, it must first be read and saved in a RAM image. Program memory is modified using the following steps: 1. 2. 3. 4. 5. 6. 7. 8. Load the starting address of the row to be modified. Read the existing data from the row into a RAM image. Modify the RAM image to contain the new data to be written into program memory. Load the starting address of the row to be rewritten. Erase the program memory row. Load the write latches with data from the RAM image. Initiate a programming operation. Repeat steps 6 and 7 as many times as required to reprogram the erased row. TABLE 11-2: 11.5 User ID, Device ID and Configuration Word Access Instead of accessing program memory or EEPROM data memory, the User ID’s, Device ID/Revision ID and Configuration Words can be accessed when CFGS = 1 in the EECON1 register. This is the region that would be pointed to by PC = 1, but not all addresses are accessible. Different access may exist for reads and writes. Refer to Table 11-2. When read access is initiated on an address outside the parameters listed in Table 11-2, the EEDATH:EEDATL register pair is cleared. USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1) Address Function 8000h-8003h 8006h 8007h-8008h Read Access Write Access Yes Yes Yes Yes No No User IDs Device ID/Revision ID Configuration Words 1 and 2 EXAMPLE 11-3: CONFIGURATION WORD AND DEVICE ID ACCESS * This code block will read 1 word of program memory at the memory address: * PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables; * PROG_DATA_HI, PROG_DATA_LO BANKSEL MOVLW MOVWF CLRF EEADRL PROG_ADDR_LO EEADRL EEADRH ; Select correct Bank ; ; Store LSB of address ; Clear MSB of address BSF BCF BSF NOP NOP BSF EECON1,CFGS INTCON,GIE EECON1,RD INTCON,GIE ; ; ; ; ; ; Select Configuration Space Disable interrupts Initiate read Executed (See Figure 11-1) Ignored (See Figure 11-1) Restore interrupts MOVF MOVWF MOVF MOVWF EEDATL,W PROG_DATA_LO EEDATH,W PROG_DATA_HI ; ; ; ; Get LSB of word Store in user location Get MSB of word Store in user location DS41575C-page 108  2011-2012 Microchip Technology Inc. PIC16(L)F1933 11.6 Write Verify Depending on the application, good programming practice may dictate that the value written to the data EEPROM or program memory should be verified (see Example 11-6) to the desired value to be written. Example 11-6 shows how to verify a write to EEPROM. EXAMPLE 11-6: EEPROM WRITE VERIFY BANKSEL EEDATL MOVF EEDATL, W BSF XORWF BTFSS GOTO : ; ;EEDATL not changed ;from previous write EECON1, RD ;YES, Read the ;value written EEDATL, W ; STATUS, Z ;Is data the same WRITE_ERR ;No, handle error ;Yes, continue  2011-2012 Microchip Technology Inc. DS41575C-page 109 PIC16(L)F1933 11.7 Register Definitions: Data EEPROM Control REGISTER 11-1: R/W-x/u EEDATL: EEPROM DATA LOW BYTE REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u EEDAT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEDAT: Read/Write Value for EEPROM Data Byte or Least Significant bits of Program Memory REGISTER 11-2: EEDATH: EEPROM DATA HIGH BYTE REGISTER U-0 U-0 — — R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u EEDAT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 EEDAT: Read/Write Value for Most Significant bits of Program Memory REGISTER 11-3: R/W-0/0 EEADRL: EEPROM ADDRESS LOW BYTE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 EEADR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 EEADR: Specifies the Least Significant bits for Program Memory Address or EEPROM Address REGISTER 11-4: U-1 EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER R/W-0/0 R/W-0/0 —(1) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 EEADR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘1’ bit 6-0 EEADR: Specifies the Most Significant bits for Program Memory Address or EEPROM Address Note 1: Unimplemented, read as ‘1’. DS41575C-page 110  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 11-5: EECON1: EEPROM CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W-x/q R/W-0/0 R/S/HC-0/0 R/S/HC-0/0 EEPGD CFGS LWLO FREE WRERR WREN WR RD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 EEPGD: Flash Program/Data EEPROM Memory Select bit 1 = Accesses program space Flash memory 0 = Accesses data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Accesses Configuration, User ID and Device ID Registers 0 = Accesses Flash Program or data EEPROM Memory bit 5 LWLO: Load Write Latches Only bit If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash): 1 = The next WR command does not initiate a write; only the program memory latches are updated. 0 = The next WR command writes a value from EEDATH:EEDATL into program memory latches and initiates a write of all the data stored in the program memory latches. If CFGS = 0 and EEPGD = 0: (Accessing data EEPROM) LWLO is ignored. The next WR command initiates a write to the data EEPROM. bit 4 FREE: Program Flash Erase Enable bit If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash): 1 = Performs an erase operation on the next WR command (cleared by hardware after completion of erase). 0 = Performs a write operation on the next WR command. If EEPGD = 0 and CFGS = 0: (Accessing data EEPROM) FREE is ignored. The next WR command will initiate both a erase cycle and a write cycle. bit 3 WRERR: EEPROM Error Flag bit 1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically on any set attempt (write ‘1’) of the WR bit). 0 = The program or erase operation completed normally. bit 2 WREN: Program/Erase Enable bit 1 = Allows program/erase cycles 0 = Inhibits programming/erasing of program Flash and data EEPROM bit 1 WR: Write Control bit 1 = Initiates a program Flash or data EEPROM program/erase operation. The operation is self-timed and the bit is cleared by hardware once operation is complete. The WR bit can only be set (not cleared) in software. 0 = Program/erase operation to the Flash or data EEPROM is complete and inactive. bit 0 RD: Read Control bit 1 = Initiates an program Flash or data EEPROM read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. 0 = Does not initiate a program Flash or data EEPROM data read.  2011-2012 Microchip Technology Inc. DS41575C-page 111 PIC16(L)F1933 REGISTER 11-6: W-0/0 EECON2: EEPROM CONTROL 2 REGISTER W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 EEPROM Control Register 2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Data EEPROM Unlock Pattern bits To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the EECON1 register. The value written to this register is used to unlock the writes. There are specific timing requirements on these writes. Refer to Section 11.2.2 “Writing to the Data EEPROM Memory” for more information. TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 111 EECON2 EEPROM Control Register 2 (not a physical register) EEADRL EEADRL EEADRH —(1) 99* 110 EEADRH VIH 0 = Port pin is < VIL bit 7-0 Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. REGISTER 12-3: TRISA: PORTA TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISA: PORTA Tri-State Control bits 1 = PORTA pin configured as an input (tri-stated) 0 = PORTA pin configured as an output REGISTER 12-4: LATA: PORTA DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATA7 LATA6 LATA5 LATA4 LATA3 LATA2 LATA1 LATA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: LATA: PORTA Output Latch Value bits(1) Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return of actual I/O pin values. DS41575C-page 116  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 12-5: ANSELA: PORTA ANALOG SELECT REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ANSA: Analog Select between Analog or Digital Function on pins RA, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin.  2011-2012 Microchip Technology Inc. DS41575C-page 117 PIC16(L)F1933 TABLE 12-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 ADCON0 — ADCON1 ADFM ANSELA — — ANSA5 ANSA4 APFCON — CCP3SEL T1GSEL P2BSEL Bit 2 CHS ADCS — ADNREF ANSA3 ANSA2 Bit 1 Bit 0 GO/DONE ADON Register on Page 143 ADPREF SRNQSEL C2OUTSEL 144 ANSA1 ANSA0 117 SSSEL CCP2SEL 114 CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 163 CM2CON0 C2ON C2OUT C2OE C2POL — C2SP C2HYS C2SYNC 163 CM1CON1 C1NTP C1INTN C1PCH — — C1NCH 164 CM2CON1 C2NTP C2INTN C2PCH — — C2NCH 164 CPSCON0 CPSON CPSRM — — CPSRNG CPSCON1 — — — — — DACCON0 DACEN DACLPS DACOE — DACPSS LATA LATA7 LATA6 LATA5 LATA4 LCDCON LCDEN SLPEN WERR — CPSOUT T0XCS 311 CPSCH LATA3 LATA2 312 — DACNSS LATA1 LATA0 CS 156 116 LMUX 315 LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 319 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 319 WPUEN INTEDG TMR0CS TMR0SE PSA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 SRQEN SRNQEN SRPS SRPR OPTION_REG PORTA SRCON0 SRLEN SSPCON1 WCOL SSPOV SSPEN CKP TRISA7 TRISA6 TRISA5 TRISA4 TRISA Legend: CONFIG1 CONFIG2 Legend: Note 1: 173 116 169 SSPM TRISA3 TRISA2 268 TRISA1 TRISA0 116 x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. TABLE 12-4: Name SRCLK PS SUMMARY OF CONFIGURATION WORD WITH PORTA Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 13:8 — — FCMEN IESO CLKOUTEN 7:0 CP MCLRE PWRTE 13:8 — — LVP 7:0 — — VCAPEN(1) Bit 10/2 BOREN WDTE DEBUG Bit 9/1 Bit 8/0 CPD FOSC — BORV — — STVREN PLLEN WRT Register on Page 46 48 — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA. PIC16F1933 only. DS41575C-page 118  2011-2012 Microchip Technology Inc. PIC16(L)F1933 12.4 12.4.1 PORTB Registers DATA REGISTER PORTB is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB (Register 12-7). Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. Note: The ANSELB bits default to the Analog mode after Reset. To use any pins as digital general purpose or peripheral inputs, the corresponding ANSEL bits must be initialized to ‘0’ by user software. Reading the PORTB register (Register 12-6) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATB). 12.4.2 DIRECTION CONTROL The TRISB register (Register 12-7) controls the PORTB pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISB register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.4.3 WEAK PULL-UPS Each of the PORTB pins has an individually configurable internal weak pull-up. Control bits WPUB enable or disable each pull-up (see Register 12-10). Each weak pull-up is automatically turned off when the port pin is configured as an output. All pull-ups are disabled on a Power-on Reset by the WPUEN bit of the OPTION_REG register. 12.4.4 INTERRUPT-ON-CHANGE All of the PORTB pins are individually configurable as an interrupt-on-change pin. Control bits IOCB enable or disable the interrupt function for each pin. The interrupt-on-change feature is disabled on a Power-on Reset. Reference Section 13.0 “Interrupt-on-Change” for more information. 12.4.5 ANALOG CONTROL The ANSELB register (Register 12-9) is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSELB bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSELB bits has no effect on digital output functions. A pin with TRIS clear and ANSELB set will still operate as a digital output, but the Input mode  2011-2012 Microchip Technology Inc. DS41575C-page 119 PIC16(L)F1933 12.4.6 PORTB FUNCTIONS AND OUTPUT PRIORITIES Each PORTB pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-5. When multiple outputs are enabled, the actual pin control goes to the peripheral with the highest priority. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in the priority list. TABLE 12-5: PORTB OUTPUT PRIORITY Pin Name Function Priority(1) RB0 SEG0 (LCD) CCP4 RB0 RB1 P1C (ECCP1) RB1 RB2 P1B (ECCP1) RB2 RB3 CCP2/P2A RB3 RB4 COM0 P1D RB4 RB5 COM1 P2B CCP3/P3A RB5 RB6 ICSPCLK (Programming) ICDCLK (enabled by Config. Word) SEG14 (LCD) RB6 RB7 ICSPDAT (Programming) ICDDAT (enabled by Config. Word) SEG13 (LCD) RB7 Note 1: Priority listed from highest to lowest. DS41575C-page 120  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 12-6: PORTB: PORTB REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RB: PORTB I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-7: TRISB: PORTB TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISB: PORTB Tri-State Control bits 1 = PORTB pin configured as an input (tri-stated) 0 = PORTB pin configured as an output REGISTER 12-8: LATB: PORTB DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: LATB: PORTB Output Latch Value bits(1) Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of actual I/O pin values.  2011-2012 Microchip Technology Inc. DS41575C-page 121 PIC16(L)F1933 REGISTER 12-9: ANSELB: PORTB ANALOG SELECT REGISTER U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 ANSB: Analog Select between Analog or Digital Function on Pins RB, respectively 0 = Digital I/O. Pin is assigned to port or digital special function. 1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled. Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. REGISTER 12-10: WPUB: WEAK PULL-UP PORTB REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: 2: WPUB: Weak Pull-up Register bits 1 = Pull-up enabled 0 = Pull-up disabled Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is configured as an output. DS41575C-page 122  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 12-6: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 CHS Bit 1 Bit 0 Register on Page GO/DONE ADON 143 ADCON0 — ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 114 CCPxCON PxM CPSCON0 CPSON CPSCON1 INTCON CPSRM DCxB — — CCPxM CPSRNG — — — — — GIE PEIE TMR0IE INTE IOCIE 214 CPSOUT T0XCS CPSCH TMR0IF INTF 311 312 IOCIF 82 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 131 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 131 IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 131 LATB LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 121 LCDCON LCDEN SLPEN WERR — LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 SE1 SE0 319 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 SE9 SE8 319 WPUEN INTEDG TMR0CS TMR0SE PSA OPTION_REG PORTB T1GCON CS LMUX PS RB7 RB6 RB5 RB4 RB3 RB2 TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL RB1 315 173 RB0 T1GSS 121 184 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 122 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTB.  2011-2012 Microchip Technology Inc. DS41575C-page 123 PIC16(L)F1933 12.5 12.5.1 PORTC Registers DATA REGISTER PORTC is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISC (Register 12-12). Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., enable the output driver and put the contents of the output latch on the selected pin). Example 12-1 shows how to initialize an I/O port. Reading the PORTC register (Register 12-11) reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch (LATC). 12.5.2 DIRECTION CONTROL The TRISC register (Register 12-12) controls the PORTC pin output drivers, even when they are being used as analog inputs. The user should ensure the bits in the TRISC register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. 12.5.3 Each PORTC pin is multiplexed with other functions. The pins, their combined functions and their output priorities are shown in Table 12-7. When multiple outputs are enabled, the actual pin control goes to the peripheral with the lowest number in the following lists. Analog input and some digital input functions are not included in the list below. These input functions can remain active when the pin is configured as an output. Certain digital input functions override other port functions and are included in the priority list. TABLE 12-7: Pin Name PORTC OUTPUT PRIORITY Function Priority(1) RC0 T1OSO (Timer1 Oscillator) CCP2/P2B RC0 RC1 T1OSI (Timer1 Oscillator) CCP2/P2A RC1 RC2 SEG3 (LCD) CCP1/P1A RC2 RC3 SEG6 (LCD) SCL (MSSP) SCK (MSSP) RC3 RC4 SEG11 (LCD) SDA (MSSP) RC4 RC5 SEG10 (LCD) SDO (MSSP) RC5 RC6 ISEG9 (LCD) TX (EUSART) CK (EUSART) CCP3/P3A RC6 RC7 SEG8 (LCD) DT (EUSART) CCP3/P3B RC7 Note 1: DS41575C-page 124 PORTC FUNCTIONS AND OUTPUT PRIORITIES Priority listed from highest to lowest.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 12-11: PORTC: PORTC REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 RC: PORTC General Purpose I/O Pin bits 1 = Port pin is > VIH 0 = Port pin is < VIL REGISTER 12-12: TRISC: PORTC TRI-STATE REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 TRISC: PORTC Tri-State Control bits 1 = PORTC pin configured as an input (tri-stated) 0 = PORTC pin configured as an output REGISTER 12-13: LATC: PORTC DATA LATCH REGISTER R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u LATC7 LATC6 LATC5 LATC4 LATC3 LATC2 LATC1 LATC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: LATC: PORTC Output Latch Value bits(1) Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual I/O pin values.  2011-2012 Microchip Technology Inc. DS41575C-page 125 PIC16(L)F1933 TABLE 12-8: Name SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Bit 7 Bit 6 Bit 5 Bit 4 — CCP3SEL T1GSEL P2BSEL APFCON CCPxCON PxM Bit 3 Bit 2 SRNQSEL C2OUTSEL DCxB LATC4 Bit 1 Bit 0 Register on Page SSSEL CCP2SEL 114 CCPxM LATC7 LATC6 LATC5 LCDCON LCDEN SLPEN WERR — LCDSE0 SE7 SE6 SE5 SE4 SE3 SE2 LCDSE1 SE15 SE14 SE13 SE12 SE11 SE10 PORTC RC7 RC6 RC5 RC4 RC3 RC2 ADDEN FERR OERR RX9D RCSTA SPEN RX9 SREN CREN SSPCON1 WCOL SSPOV SSPEN CKP SSPSTAT SMP CKE D/A P T1CON TMR1CS T1CKPS LATC3 LATC2 214 LATC LATC1 CS LATC0 LMUX SE1 125 315 SE0 319 SE9 SE8 319 RC1 RC0 125 SSPM 286 268 S R/W UA BF 267 T1OSCEN T1SYNC — TMR1ON 183 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 285 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTC. DS41575C-page 126  2011-2012 Microchip Technology Inc. PIC16(L)F1933 12.6 PORTE Registers 12.6.1 12.6.2 DATA REGISTER PORTE FUNCTIONS AND OUTPUT PRIORITIES No output priorities, RE3 is an input only pin. RE3 is input only, and also functions as MCLR. The MCLR feature can be disabled via a configuration fuse. RE3 also supplies the programming voltage. The TRIS bit for RE3 (TRISE3) always reads ‘1’. REGISTER 12-14: PORTE: PORTE REGISTER U-0 U-0 U-0 U-0 R-x/u U-0 U-0 U-0 — — — — RE3 — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 RE3: PORTE Input Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL bit 2-0 Unimplemented: Read as ‘0’ REGISTER 12-15: TRISE: PORTE TRI-STATE REGISTER U-0 U-0 U-0 U-0 U-1(1) U-0 U-0 U-0 — — — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 Unimplemented: Read as ‘1’ bit 2-0 Unimplemented: Read as ‘0’ Note 1: Unimplemented, read as ‘1’.  2011-2012 Microchip Technology Inc. DS41575C-page 127 PIC16(L)F1933 REGISTER 12-16: WPUE: WEAK PULL-UP PORTE REGISTER U-0 U-0 U-0 U-0 R/W-1/1 U-0 U-0 U-0 — — — — WPUE3 — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-4 Unimplemented: Read as ‘0’ bit 3 WPUE3: Weak Pull-up Register bit 1 = Pull-up enabled 0 = Pull-up disabled bit 2-0 Unimplemented: Read as ‘0’ Note 1: 2: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled. The weak pull-up device is automatically disabled if the pin is configured as an output. TABLE 12-9: Name ADCON0 SUMMARY OF REGISTERS ASSOCIATED WITH PORTE Bit 7 Bit 6 Bit 5 Bit 3 Bit 2 CHS — PxM CCPxCON Bit 4 DCxB Bit 1 Bit 0 Register on Page GO/DONE ADON 143 CCPxM 214 LCDCON LCDEN SLPEN WERR — LCDSE2 SE23 SE22 SE21 SE20 SE19 SE18 SE17 SE16 319 PORTE — — — — RE3 — — — 127 — — — 127 — — — 128 LMUX CS TRISE — — — — —(3) WPUE — — — — WPUE3 315 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTE. Note 1: Unimplemented, read as ‘1’. DS41575C-page 128  2011-2012 Microchip Technology Inc. PIC16(L)F193X 13.0 INTERRUPT-ON-CHANGE The PORTB pins can be configured to operate as Interrupt-On-Change (IOC) pins. An interrupt can be generated by detecting a signal that has either a rising edge or a falling edge. Any individual PORT IOC pin, or combination of PORT IOC pins, can be configured to generate an interrupt. The interrupt-on-change module has the following features: • • • • Interrupt-on-Change enable (Master Switch) Individual pin configuration Rising and falling edge detection Individual pin interrupt flags Figure 13-1 is a block diagram of the IOC module. 13.1 Enabling the Module To allow individual PORTB pins to generate an interrupt, the IOCIE bit of the INTCON register must be set. If the IOCIE bit is disabled, the edge detection on the pin will still occur, but an interrupt will not be generated. 13.2 Individual Pin Configuration 13.3 The IOCBFx bits located in the IOCBF register are status flags that correspond to the Interrupt-on-change pins of PORTB. If an expected edge is detected on an appropriately enabled pin, then the status flag for that pin will be set, and an interrupt will be generated if the IOCIE bit is set. The IOCIF bit of the INTCON register reflects the status of all IOCBFx bits. 13.4 Clearing Interrupt Flags The individual status flags, (IOCBFx bits), can be cleared by resetting them to zero. If another edge is detected during this clearing operation, the associated status flag will be set at the end of the sequence, regardless of the value actually being written. In order to ensure that no detected edge is lost while clearing flags, only AND operations masking out known changed bits should be performed. The following sequence is an example of what should be performed. EXAMPLE 13-1: For each PORTB pin, a rising edge detector and a falling edge detector are present. To enable a pin to detect a rising edge, the associated IOCBPx bit of the IOCBP register is set. To enable a pin to detect a falling edge, the associated IOCBNx bit of the IOCBN register is set. A pin can be configured to detect rising and falling edges simultaneously by setting both the IOCBPx bit and the IOCBNx bit of the IOCBP and IOCBN registers, respectively. Interrupt Flags MOVLW XORWF ANDWF 13.5 CLEARING INTERRUPT FLAGS (PORTA EXAMPLE) 0xff IOCBF, W IOCBF, F Operation in Sleep The interrupt-on-change interrupt sequence will wake the device from Sleep mode, if the IOCIE bit is set. If an edge is detected while in Sleep mode, the IOCBF register will be updated prior to the first instruction executed out of Sleep.  2011-2012 Microchip Technology Inc. DS41575C-page 129 PIC16(L)F193X FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM IOCBNx D Q4Q1 Q CK edge detect R RBx IOCBPx D data bus = 0 or 1 Q write IOCBFx CK D S Q to data bus IOCBFx CK IOCIE R Q2 from all other IOCBFx individual pin detectors Q1 Q3 Q4 Q4Q1 DS41575C-page 130 Q1 Q1 Q2 Q2 Q2 Q3 Q4 Q4Q1 IOC interrupt to CPU core Q3 Q4 Q4 Q4Q1 Q4Q1  2011-2012 Microchip Technology Inc. PIC16(L)F193X 13.6 Register Definitions: Interrupt-on-Change Control REGISTER 13-1: IOCBP: INTERRUPT-ON-CHANGE POSITIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBP: Interrupt-on-Change Positive Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCBFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-2: IOCBN: INTERRUPT-ON-CHANGE NEGATIVE EDGE REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 IOCBN: Interrupt-on-Change Negative Edge Enable bits 1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCBFx bit and IOCIF flag will be set upon detecting an edge. 0 = Interrupt-on-Change disabled for the associated pin. REGISTER 13-3: IOCBF: INTERRUPT-ON-CHANGE FLAG REGISTER R/W/HS-0/0 R/W/HS-0/0 IOCBF7 IOCBF6 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 IOCBF5 IOCBF4 IOCBF3 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 IOCBF2 IOCBF1 IOCBF0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware bit 7-0 IOCBF: Interrupt-on-Change Flag bits 1 = An enabled change was detected on the associated pin. Set when IOCBPx = 1 and a rising edge was detected on RBx, or when IOCBNx = 1 and a falling edge was detected on RBx. 0 = No change was detected, or the user cleared the detected change.  2011-2012 Microchip Technology Inc. DS41575C-page 131 PIC16(L)F193X TABLE 13-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 Name IOCBF IOCBF7 IOCBF6 IOCBF5 IOCBF4 IOCBF3 IOCBF2 IOCBF1 IOCBF0 131 IOCBN IOCBN7 IOCBN6 IOCBN5 IOCBN4 IOCBN3 IOCBN2 IOCBN1 IOCBN0 131 IOCBP IOCBP7 IOCBP6 IOCBP5 IOCBP4 IOCBP3 IOCBP2 IOCBP1 IOCBP0 131 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change. DS41575C-page 132  2011-2012 Microchip Technology Inc. PIC16(L)F1933 14.0 FIXED VOLTAGE REFERENCE (FVR) The Fixed Voltage Reference, or FVR, is a stable voltage reference, independent of VDD, with 1.024V, 2.048V or 4.096V selectable output levels. The output of the FVR can be configured to supply a reference voltage to the following: • • • • • • ADC input channel ADC positive reference Comparator positive input Digital-to-Analog Converter (DAC) Capacitive Sensing (CPS) module LCD bias generator The FVR can be enabled by setting the FVREN bit of the FVRCON register. 14.1 Independent Gain Amplifiers The output of the FVR supplied to the ADC, Comparators, DAC and CPS is routed through two independent programmable gain amplifiers. Each amplifier can be programmed for a gain of 1x, 2x or 4x, to produce the three possible voltage levels. The ADFVR bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the ADC module. Reference Section 15.0 “Analog-to-Digital Converter (ADC) Module” for additional information. The CDAFVR bits of the FVRCON register are used to enable and configure the gain amplifier settings for the reference supplied to the DAC, CPS and Comparator module. Reference Section 17.0 “Digital-to-Analog Converter (DAC) Module”, Section 18.0 “Comparator Module” and Section 26.0 “Capacitive Sensing (CPS) Module” for additional information. 14.2 FVR Stabilization Period When the Fixed Voltage Reference module is enabled, it requires time for the reference and amplifier circuits to stabilize. Once the circuits stabilize and are ready for use, the FVRRDY bit of the FVRCON register will be set. See in Section 30.0 “Electrical Specifications” for the minimum delay requirement.  2011-2012 Microchip Technology Inc. DS41575C-page 133 PIC16(L)F1933 FIGURE 14-1: VOLTAGE REFERENCE BLOCK DIAGRAM ADFVR CDAFVR 2 X1 X2 X4 FVR BUFFER1 (To ADC Module) X1 X2 X4 FVR BUFFER2 (To Comparators, DAC) 2 1.024V Fixed Reference FVREN FVR VREF (To LCD Bias Generator) + _ FVRRDY Any peripheral requiring the Fixed Reference (See Table 14-1) DS41575C-page 134  2011-2012 Microchip Technology Inc. PIC16(L)F1933 14.3 Register Definitions: FVR Control REGISTER 14-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER R/W-0/0 R-q/q R/W-0/0 R/W-0/0 FVREN FVRRDY(1) TSEN TSRNG R/W-0/0 R/W-0/0 R/W-0/0 CDAFVR R/W-0/0 ADFVR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition bit 7 FVREN: Fixed Voltage Reference Enable bit 1 = Fixed Voltage Reference is enabled 0 = Fixed Voltage Reference is disabled bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1) 1 = Fixed Voltage Reference output is ready for use 0 = Fixed Voltage Reference output is not ready or not enabled bit 5 TSEN: Temperature Indicator Enable bit(3) 1 = Temperature Indicator is enabled 0 = Temperature Indicator is disabled bit 4 TSRNG: Temperature Indicator Range Selection bit(3) 1 = VOUT = VDD - 4VT (High Range) 0 = VOUT = VDD - 2VT (Low Range) bit 3-2 CDAFVR: Comparator and DAC Fixed Voltage Reference Selection bit 11 = Comparator and DAC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 = Comparator and DAC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 = Comparator and DAC Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 = Comparator and DAC Fixed Voltage Reference Peripheral output is off bit 1-0 ADFVR: ADC Fixed Voltage Reference Selection bit 11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2) 10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2) 01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V) 00 = ADC Fixed Voltage Reference Peripheral output is off Note 1: 2: 3: FVRRDY is always ‘1’ on devices with PIC16F1933 only. Fixed Voltage Reference output cannot exceed VDD. See Section 16.0 “Temperature Indicator Module” for additional information. TABLE 14-1: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR Bit 1 Bit 0 ADFVR Register on page 135 Shaded cells are not used with Fixed Voltage Reference.  2011-2012 Microchip Technology Inc. DS41575C-page 135 PIC16(L)F1933 NOTES: DS41575C-page 136  2011-2012 Microchip Technology Inc. PIC16(L)F1933 15.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESH:ADRESL register pair). Figure 15-1 shows the block diagram of the ADC. The ADC voltage reference is software selectable to be either internally generated or externally supplied. FIGURE 15-1: ADC BLOCK DIAGRAM ADNREF = 1 VREF- ADNREF = 0 VDD VSS ADPREF = 00 ADPREF = 11 VREF+ AN0 00000 AN1 00001 AN2 00010 AN3 00011 AN4 00100 Reserved 00101 Reserved 00110 Reserved 00111 AN8 01000 AN9 01001 AN10 01010 AN11 01011 AN12 01100 AN13 01101 ADPREF = 10 ref+ ADC 10 GO/DONE ADFM 11101 DAC_output 11110 FVR Buffer1 11111 0 = Left Justify 1 = Right Justify ADON(1) 16 VSS Temp Indicator ref- ADRESH ADRESL CHS Note 1: When ADON = 0, all multiplexer inputs are disconnected.  2011-2012 Microchip Technology Inc. DS41575C-page 137 PIC16(L)F1933 15.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • • • • • • Port configuration Channel selection ADC voltage reference selection ADC conversion clock source Interrupt control Result formatting 15.1.1 PORT CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. Refer to Section 12.0 “I/O Ports” for more information. Note: 15.1.2 Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. CHANNEL SELECTION There are 14 channel selections available: • • • • AN pins Temperature Indicator DAC_output FVR (Fixed Voltage Reference) Output 15.1.4 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There are seven possible clock options: • • • • • • • FOSC/2 FOSC/4 FOSC/8 FOSC/16 FOSC/32 FOSC/64 FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11.5 TAD periods as shown in Figure 15-2. For correct conversion, the appropriate TAD specification must be met. Refer to the A/D conversion requirements in Section 30.0 “Electrical Specifications” for more information. Table 15-1 gives examples of appropriate ADC clock selections. Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. Refer to Section 16.0 “Temperature Indicator Module”, Section 17.0 “Digital-to-Analog Converter (DAC) Module” and Section 14.0 “Fixed Voltage Reference (FVR)” for more information on these channel selections. The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 15.2 “ADC Operation” for more information. 15.1.3 ADC VOLTAGE REFERENCE The ADPREF bits of the ADCON1 register provides control of the positive voltage reference. The positive voltage reference can be: • VREF+ pin • VDD The ADNREF bits of the ADCON1 register provides control of the negative voltage reference. The negative voltage reference can be: • VREF- pin • VSS See Section 14.0 “Fixed Voltage Reference (FVR)” for more details on the fixed voltage reference. DS41575C-page 138  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES Device Frequency (FOSC) Device Frequency (FOSC) ADC Clock Period (TAD) ADC Clock Source ADCS 32 MHz 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz Fosc/2 000 62.5ns(2) 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s Fosc/4 100 125 ns (2) (2) (2) (2) 1.0 s 4.0 s Fosc/8 001 0.5 s(2) 400 ns(2) 0.5 s(2) 1.0 s 2.0 s 8.0 s(3) Fosc/16 101 800 ns 800 ns 1.0 s 2.0 s 4.0 s 16.0 s(3) Fosc/32 010 1.0 s 1.6 s 2.0 s 4.0 s 8.0 s(3) 32.0 s(3) s(3) 64.0 s(3) Fosc/64 FRC Legend: Note 1: 2: 3: 4: 2.0 s 110 x11 1.0-6.0 s 200 ns 3.2 s (1,4) 1.0-6.0 s 250 ns 4.0 s (1,4) 1.0-6.0 s 500 ns 8.0 (1,4) s(3) 1.0-6.0 s (1,4) 16.0 1.0-6.0 s (1,4) 1.0-6.0 s(1,4) Shaded cells are outside of recommended range. The FRC source has a typical TAD time of 1.6 s for VDD. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the system clock FOSC. However, the FRC clock source must be used when conversions are to be performed with the device in Sleep mode. FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 b4 b1 b0 b6 b7 b2 b9 b8 b3 b5 Conversion starts Holding capacitor is disconnected from analog input (typically 100 ns) Set GO bit On the following cycle: ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input.  2011-2012 Microchip Technology Inc. DS41575C-page 139 PIC16(L)F1933 15.1.5 INTERRUPTS 15.1.6 The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC Interrupt Flag is the ADIF bit in the PIR1 register. The ADC Interrupt Enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON1 register controls the output format. Figure 15-3 shows the two output formats. Note 1: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. 2: The ADC operates during Sleep only when the FRC oscillator is selected. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the GIE and PEIE bits of the INTCON register must be disabled. If the GIE and PEIE bits of the INTCON register are enabled, execution will switch to the Interrupt Service Routine. FIGURE 15-3: 10-BIT A/D CONVERSION RESULT FORMAT ADRESH (ADFM = 0) ADRESL MSB LSB bit 7 bit 0 bit 7 10-bit A/D Result Unimplemented: Read as ‘0’ MSB (ADFM = 1) bit 7 Unimplemented: Read as ‘0’ DS41575C-page 140 bit 0 LSB bit 0 bit 7 bit 0 10-bit A/D Result  2011-2012 Microchip Technology Inc. PIC16(L)F1933 15.2 15.2.1 ADC Operation STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/ DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. Note: 15.2.2 The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 15.2.6 “A/D Conversion Procedure”. COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF Interrupt Flag bit • Update the ADRESH and ADRESL registers with new conversion result 15.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH and ADRESL registers will be updated with the partially complete Analog-to-Digital conversion sample. Incomplete bits will match the last bit converted. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated.  2011-2012 Microchip Technology Inc. 15.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 15.2.5 SPECIAL EVENT TRIGGER The Special Event Trigger of the CCPx/ECCPX module allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. TABLE 15-2: SPECIAL EVENT TRIGGER Device CCPx/ECCPx PIC16(L)F1933 CCP5 Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. Refer to Section 23.0 “Capture/Compare/PWM Modules” for more information. DS41575C-page 141 PIC16(L)F1933 15.2.6 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. 2. 3. 4. 5. 6. 7. 8. Configure Port: • Disable pin output driver (Refer to the TRIS register) • Configure pin as analog (Refer to the ANSEL register) Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Turn on ADC module Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) Wait the required acquisition time(2). Start conversion by setting the GO/DONE bit. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) Read ADC Result. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 15-1: A/D CONVERSION ;This code block configures the ADC ;for polling, Vdd and Vss references, Frc ;clock and AN0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL ADCON1 ; MOVLW B’11110000’ ;Right justify, Frc ;clock MOVWF ADCON1 ;Vdd and Vss Vref BANKSEL TRISA ; BSF TRISA,0 ;Set RA0 to input BANKSEL ANSEL ; BSF ANSEL,0 ;Set RA0 to analog BANKSEL ADCON0 ; MOVLW B’00000001’ ;Select channel AN0 MOVWF ADCON0 ;Turn ADC On CALL SampleTime ;Acquisiton delay BSF ADCON0,ADGO ;Start conversion BTFSC ADCON0,ADGO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: Refer to Section 15.4 “A/D Acquisition Requirements”. DS41575C-page 142  2011-2012 Microchip Technology Inc. PIC16(L)F1933 15.3 Register Definitions: ADC Control REGISTER 15-1: U-0 ADCON0: A/D CONTROL REGISTER 0 R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 CHS R/W-0/0 R/W-0/0 R/W-0/0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-2 CHS: Analog Channel Select bits 11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(2) 11110 = DAC_output(1) 11101 = Temperature Indicator(3) 11100 = Reserved. No channel connected. • • • 01110 = Reserved. No channel connected. 01101 = AN13 01100 = AN12 01011 = AN11 01010 = AN10 01001 = AN9 01000 = AN8 00111 = Reserved. No channel connected. 00110 = Reserved. No channel connected. 00101 = Reserved. No channel connected. 00100 = AN4 00011 = AN3 00010 = AN2 00001 = AN1 00000 = AN0 bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current Note 1: 2: 3: See Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information. See Section 14.0 “Fixed Voltage Reference (FVR)” for more information. See Section 16.0 “Temperature Indicator Module” for more information.  2011-2012 Microchip Technology Inc. DS41575C-page 143 PIC16(L)F1933 REGISTER 15-2: R/W-0/0 ADCON1: A/D CONTROL REGISTER 1 R/W-0/0 ADFM R/W-0/0 R/W-0/0 ADCS U-0 R/W-0/0 — ADNREF R/W-0/0 R/W-0/0 ADPREF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: A/D Result Format Select bit 1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is loaded. 0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is loaded. bit 6-4 ADCS: A/D Conversion Clock Select bits 111 = FRC (clock supplied from a dedicated RC oscillator) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock supplied from a dedicated RC oscillator) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 bit 3 Unimplemented: Read as ‘0’ bit 2 ADNREF: A/D Negative Voltage Reference Configuration bit 1 = VREF- is connected to external VREF- pin(1) 0 = VREF- is connected to VSS bit 1-0 ADPREF: A/D Positive Voltage Reference Configuration bits 11 = VREF+ is connected to internal Fixed Voltage Reference (FVR) module(1) 10 = VREF+ is connected to external VREF+ pin(1) 01 = Reserved 00 = VREF+ is connected to VDD Note 1: When selecting the FVR or the VREF+ pin as the source of the positive reference, be aware that a minimum voltage specification exists. See Section 30.0 “Electrical Specifications” for details. DS41575C-page 144  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 15-3: R/W-x/u ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES: ADC Result Register bits Upper eight bits of 10-bit conversion result REGISTER 15-4: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 ADRES: ADC Result Register bits Lower two bits of 10-bit conversion result bit 5-0 Reserved: Do not use.  2011-2012 Microchip Technology Inc. DS41575C-page 145 PIC16(L)F1933 REGISTER 15-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u — — — — — — R/W-x/u R/W-x/u ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Reserved: Do not use. bit 1-0 ADRES: ADC Result Register bits Upper two bits of 10-bit conversion result REGISTER 15-6: R/W-x/u ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u ADRES bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 ADRES: ADC Result Register bits Lower eight bits of 10-bit conversion result DS41575C-page 146  2011-2012 Microchip Technology Inc. PIC16(L)F1933 15.4 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 15-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), refer to Figure 15-4. The maximum recommended impedance for analog sources is 10 k. As the EQUATION 15-1: Assumptions: source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 15-1 may be used. This equation assumes that 1/2 LSb error is used (1,024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. ACQUISITION TIME EXAMPLE Temperature = 50°C and external impedance of 10k  5.0V V DD T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient = T AMP + T C + T COFF = 2µs + T C +   Temperature - 25°C   0.05µs/°C   The value for TC can be approximated with the following equations: 1  = V CHOLD V AP P LI ED  1 – -------------------------n+1   2 –1 ;[1] VCHOLD charged to within 1/2 lsb –TC ----------  RC V AP P LI ED  1 – e  = V CHOLD   ;[2] VCHOLD charge response to VAPPLIED – Tc ---------  1 RC  ;combining [1] and [2] V AP P LI ED  1 – e  = V A PP LIE D  1 – -------------------------n+1    2 –1 Note: Where n = number of bits of the ADC. Solving for TC: T C = – C HOLD  R IC + R SS + R S  ln(1/2047) = – 13.5pF  1k  + 7k  + 10k   ln(0.0004885) = 1.20 µs Therefore: T A CQ = 5µs + 1.20µs +   50°C- 25°C   0.05 µs/°C   = 7.45µs Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification.  2011-2012 Microchip Technology Inc. DS41575C-page 147 PIC16(L)F1933 FIGURE 15-4: ANALOG INPUT MODEL VDD Analog Input pin Rs VT  0.6V CPIN 5 pF VA RIC  1k Sampling Switch SS Rss I LEAKAGE(1) VT  0.6V CHOLD = 10 pF Ref- Legend: CHOLD CPIN 6V 5V VDD 4V 3V 2V = Sample/Hold Capacitance = Input Capacitance RSS I LEAKAGE = Leakage current at the pin due to various junctions = Interconnect Resistance RIC = Resistance of Sampling Switch RSS SS = Sampling Switch VT = Threshold Voltage Note 1: FIGURE 15-5: 5 6 7 8 9 10 11 Sampling Switch (k) Refer to in Section 30.0 “Electrical Specifications”. ADC TRANSFER FUNCTION Full-Scale Range 3FFh 3FEh ADC Output Code 3FDh 3FCh 3FBh 03h 02h 01h 00h Analog Input Voltage 0.5 LSB Ref- DS41575C-page 148 Zero-Scale Transition 1.5 LSB Full-Scale Transition Ref+  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 15-3: Name ADCON0 ADCON1 SUMMARY OF REGISTERS ASSOCIATED WITH ADC Bit 7 Bit 6 Bit 5 — ADFM ADRESL A/D Result Register Low ANSELB — Bit 2 ADNREF Bit 1 Bit 0 Register on Page GO/DONE ADON 143 ADPREF 144 145 145 — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 117 — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 P1M CCP1CON — ADCS A/D Result Register High — Bit 3 CHS ADRESH ANSELA Bit 4 DC1B CCP1M 214 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 INTCON TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB3 TRISB2 TRISB1 TRISB0 121 TRISB TRISB7 TRISB6 TRISB5 TRISB4 FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR DACCON0 DACEN DACLPS DACOE — DACPSS DACCON1 — — — Legend: DACR ADFVR — DACNSS 135 156 156 x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for ADC module.  2011-2012 Microchip Technology Inc. DS41575C-page 149 PIC16(L)F1933 NOTES: DS41575C-page 150  2011-2012 Microchip Technology Inc. PIC16(L)F1933 16.0 TEMPERATURE INDICATOR MODULE FIGURE 16-1: This family of devices is equipped with a temperature circuit designed to measure the operating temperature of the silicon die. The circuit’s range of operating temperature falls between -40°C and +85°C. The output is a voltage that is proportional to the device temperature. The output of the temperature indicator is internally connected to the device ADC. TEMPERATURE CIRCUIT DIAGRAM VDD TSEN TSRNG The circuit may be used as a temperature threshold detector or a more accurate temperature indicator, depending on the level of calibration performed. A onepoint calibration allows the circuit to indicate a temperature closely surrounding that point. A two-point calibration allows the circuit to sense the entire range of temperature more accurately. Reference Application Note AN1333, “Use and Calibration of the Internal Temperature Indicator” (DS01333) for more details regarding the calibration process. 16.1 Circuit Operation Figure 16-1 shows a simplified block diagram of the temperature circuit. The proportional voltage output is achieved by measuring the forward voltage drop across multiple silicon junctions. Equation 16-1 describes the output characteristics of the temperature indicator. EQUATION 16-1: VOUT RANGES VOUT 16.2 To ADC Minimum Operating VDD When the temperature circuit is operated in low range, the device may be operated at any operating voltage that is within specifications. When the temperature circuit is operated in high range, the device operating voltage, VDD, must be high enough to ensure that the temperature circuit is correctly biased. Table 16-1 shows the recommended minimum VDD vs. range setting. High Range: VOUT = VDD - 4VT TABLE 16-1: Low Range: VOUT = VDD - 2VT The temperature sense circuit is integrated with the Fixed Voltage Reference (FVR) module. See Section 14.0 “Fixed Voltage Reference (FVR)” for more information. The circuit is enabled by setting the TSEN bit of the FVRCON register. When disabled, the circuit draws no current. The circuit operates in either high or low range. The high range, selected by setting the TSRNG bit of the FVRCON register, provides a wider output voltage. This provides more resolution over the temperature range, but may be less consistent from part to part. This range requires a higher bias voltage to operate and thus, a higher VDD is needed. The low range is selected by clearing the TSRNG bit of the FVRCON register. The low range generates a lower voltage drop and thus, a lower bias voltage is needed to operate the circuit. The low range is provided for low voltage operation.  2011-2012 Microchip Technology Inc. RECOMMENDED VDD VS. RANGE Min. VDD, TSRNG = 1 Min. VDD, TSRNG = 0 3.6V 1.8V 16.3 Temperature Output The output of the circuit is measured using the internal Analog-to-Digital Converter. A channel is reserved for the temperature circuit output. Refer to Section 15.0 “Analog-to-Digital Converter (ADC) Module” for detailed information. 16.4 ADC Acquisition Time To ensure accurate temperature measurements, the user must wait at least 200 s after the ADC input multiplexer is connected to the temperature indicator output before the conversion is performed. In addition, the user must wait 200 s between sequential conversions of the temperature indicator output. DS41575C-page 151 PIC16(L)F1933 TABLE 16-2: Name FVRCON Legend: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR Bit 7 Bit 6 Bit 5 Bit 4 FVREN FVRRDY TSEN TSRNG Bit 3 Bit 2 CDAFVR Bit 1 Bit 0 ADFVR Register on page 118 Shaded cells are unused by the temperature indicator module. DS41575C-page 152  2011-2012 Microchip Technology Inc. PIC16(L)F1933 17.0 DIGITAL-TO-ANALOG CONVERTER (DAC) MODULE The Digital-to-Analog Converter supplies a variable voltage reference, ratiometric with the input source, with 32 selectable output levels. The input of the DAC can be connected to: 17.1 Output Voltage Selection The DAC has 32 voltage level ranges. The 32 levels are set with the DACR bits of the DACCON1 register. The DAC output voltage is determined by the following equations: • External VREF pins • VDD supply voltage • FVR (Fixed Voltage Reference) The output of the DAC can be configured to supply a reference voltage to the following: • • • • Comparator positive input ADC input channel DACOUT pin Capacitive Sensing module (CPS) The Digital-to-Analog Converter (DAC) can be enabled by setting the DACEN bit of the DACCON0 register. EQUATION 17-1: DAC OUTPUT VOLTAGE IF DACEN = 1 DACR  4:0  VOUT =   VSOURCE+ – VSOURCE-   ----------------------------+ VSOURCE5   2 IF DACEN = 0 and DACLPS = 1 and DACR[4:0] = 11111 V OUT = V SOURCE + IF DACEN = 0 and DACLPS = 0 and DACR[4:0] = 00000 V OUT = V SOURCE – VSOURCE+ = VDD, VREF+, or FVR BUFFER 2 VSOURCE- = VSS or VREF- 17.2 Ratiometric Output Level The DAC output value is derived using a resistor ladder with each end of the ladder tied to a positive and negative voltage reference input source. If the voltage of either input source fluctuates, a similar fluctuation will result in the DAC output value. The value of the individual resistors within the ladder can be found in Section 30.0 “Electrical Specifications”. 17.3 DAC Voltage Reference Output The DAC can be output to the DACOUT pin by setting the DACOE bit of the DACCON0 register to ‘1’. Selecting the DAC reference voltage for output on the DACOUT pin automatically overrides the digital output buffer and digital input threshold detector functions of that pin. Reading the DACOUT pin when it has been configured for DAC reference voltage output will always return a ‘0’. Due to the limited current drive capability, a buffer must be used on the DAC voltage reference output for external connections to DACOUT. Figure 17-2 shows an example buffering technique.  2011-2012 Microchip Technology Inc. DS41575C-page 153 PIC16(L)F1933 FIGURE 17-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM Digital-to-Analog Converter (DAC) FVR BUFFER2 VSOURCE+ VDD VREF+ R R 2 R DACEN DACLPS R R 32 Steps R 32-to-1 MUX DACPSS DACR 5 DAC_OUTPUT (To Comparator, CPS and ADC Modules) R DACOUT R DACOE DACNSS VREF- VSOURCE- VSS FIGURE 17-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC® MCU DAC Module R Voltage Reference Output Impedance DS41575C-page 154 DACOUT + – Buffered DAC Output  2011-2012 Microchip Technology Inc. PIC16(L)F1933 17.4 Low-Power Voltage State In order for the DAC module to consume the least amount of power, one of the two voltage reference input sources to the resistor ladder must be disconnected. Either the positive voltage source, (VSOURCE+), or the negative voltage source, (VSOURCE-) can be disabled. The negative voltage source is disabled by setting the DACLPS bit in the DACCON0 register. Clearing the DACLPS bit in the DACCON0 register disables the positive voltage source. 17.4.1 OUTPUT CLAMPED TO POSITIVE VOLTAGE SOURCE The DAC output voltage can be set to VSOURCE+ with the least amount of power consumption by performing the following: • Clearing the DACEN bit in the DACCON0 register. • Setting the DACLPS bit in the DACCON0 register. • Configuring the DACPSS bits to the proper positive source. • Configuring the DACR bits to ‘11111’ in the DACCON1 register. FIGURE 17-3: This is also the method used to output the voltage level from the FVR to an output pin. See Section 17.5 “Operation During Sleep” for more information. Reference Figure 17-3 for output clamping examples. 17.4.2 OUTPUT CLAMPED TO NEGATIVE VOLTAGE SOURCE The DAC output voltage can be set to VSOURCE- with the least amount of power consumption by performing the following: • Clearing the DACEN bit in the DACCON0 register. • Clearing the DACLPS bit in the DACCON0 register. • Configuring the DACNSS bits to the proper negative source. • Configuring the DACR bits to ‘00000’ in the DACCON1 register. This allows the comparator to detect a zero-crossing while not consuming additional current through the DAC module. Reference Figure 17-3 for output clamping examples. OUTPUT VOLTAGE CLAMPING EXAMPLES Output Clamped to Positive Voltage Source VSOURCE+ Output Clamped to Negative Voltage Source VSOURCE+ R R DACR = 11111 R DACEN = 0 DACLPS = 1 R DAC Voltage Ladder (see Figure 17-1) DACEN = 0 DACLPS = 0 R VSOURCE- 17.5 DAC Voltage Ladder (see Figure 17-1) R DACR = 00000 VSOURCE- Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the DACCON0 register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 17.6 Effects of a Reset A device Reset affects the following: • DAC is disabled. • DAC output voltage is removed from the DACOUT pin. • The DACR range select bits are cleared.  2011-2012 Microchip Technology Inc. DS41575C-page 155 PIC16(L)F1933 17.7 Register Definitions: DAC Control REGISTER 17-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 DACEN DACLPS DACOE — R/W-0/0 R/W-0/0 DACPSS U-0 R/W-0/0 — DACNSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 DACEN: DAC Enable bit 1 = DAC is enabled 0 = DAC is disabled bit 6 DACLPS: DAC Low-Power Voltage State Select bit 1 = DAC Positive reference source selected 0 = DAC Negative reference source selected bit 5 DACOE: DAC Voltage Output Enable bit 1 = DAC voltage level is also an output on the DACOUT pin 0 = DAC voltage level is disconnected from the DACOUT pin bit 4 Unimplemented: Read as ‘0’ bit 3-2 DACPSS: DAC Positive Source Select bits 11 = Reserved, do not use 10 = FVR Buffer2 output 01 = VREF+ pin 00 = VDD bit 1 Unimplemented: Read as ‘0’ bit 0 DACNSS: DAC Negative Source Select bits 1 = VREF0 = VSS REGISTER 17-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1 U-0 U-0 U-0 — — — R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 DACR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 DACR: DAC Voltage Output Select bits TABLE 17-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE Bit 7 Bit 6 FVRCON FVREN DACCON0 DACEN DACCON1 — Legend: Bit 5 Bit 4 Bit 3 Bit 2 FVRRDY TSEN TSRNG CDAFVR DACLPS DACOE — DACPSS — — Bit 1 Bit 0 ADFVR — DACR DACNSS Register on page 135 156 156 — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module. DS41575C-page 156  2011-2012 Microchip Technology Inc. PIC16(L)F1933 18.0 COMPARATOR MODULE FIGURE 18-1: Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. Comparators are very useful mixed signal building blocks because they provide analog functionality independent of program execution. The analog comparator module includes the following features: • • • • • • • • • Independent comparator control Programmable input selection Comparator output is available internally/externally Programmable output polarity Interrupt-on-change Wake-up from Sleep Programmable Speed/Power optimization PWM shutdown Programmable and fixed voltage reference 18.1 Comparator Overview SINGLE COMPARATOR VIN+ + VIN- – Output VINVIN+ Output Note: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. A single comparator is shown in Figure 18-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. The comparators available for this device are located in Table 18-1. TABLE 18-1: COMPARATOR AVAILABILITY PER DEVICE Device PIC16(L)F1933  2011-2012 Microchip Technology Inc. C1 C2 ● ● DS41575C-page 157 PIC16(L)F1933 FIGURE 18-2: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM CxNCH CxON(1) 2 CxINTP Interrupt det C12IN0- 0 C12IN1- 1 MUX 2 (1) C12IN2C12IN3- 3 Set CxIF det CXPOL CxVN D Cx(2) CxVP 0 MUX 1 (1) CXIN+ DAC_OUTPUT To Data Bus EN Q1 CxHYS CxSP async_CxOUT To ECCP PWM Logic 3 CXSYNC CxON VSS CXOUT MCXOUT Q + 2 FVR Buffer2 CxINTN Interrupt CXPCH CXOE TRIS bit CXOUT 0 2 D (from Timer1) T1CLK Note 1: 2: Q 1 sync_CXOUT To Timer1 or SR Latch When CxON = 0, all multiplexer inputs are disconnected and the Comparator will product a ‘0’ at the output. Output of comparator can be frozen during debugging. DS41575C-page 158  2011-2012 Microchip Technology Inc. PIC16(L)F1933 18.2 Comparator Control Each comparator has two control registers: CMxCON0 and CMxCON1. The CMxCON0 registers (see Register 18-1) contain Control and Status bits for the following: • • • • • • Enable Output selection Output polarity Speed/Power selection Hysteresis enable Output synchronization The CMxCON1 registers (see Register 18-2) contain Control bits for the following: • • • • Interrupt enable Interrupt edge polarity Positive input channel selection Negative input channel selection 18.2.1 COMPARATOR ENABLE Setting the CxON bit of the CMxCON0 register enables the comparator for operation. Clearing the CxON bit disables the comparator resulting in minimum current consumption. 18.2.2 COMPARATOR OUTPUT SELECTION 18.2.3 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CxPOL bit of the CMxCON0 register. Clearing the CxPOL bit results in a non-inverted output. Table 18-2 shows the output state versus input conditions, including polarity control. TABLE 18-2: COMPARATOR OUTPUT STATE VS. INPUT CONDITIONS Input Condition CxPOL CxOUT CxVN > CxVP 0 0 CxVN < CxVP 0 1 CxVN > CxVP 1 1 CxVN < CxVP 1 0 18.2.4 COMPARATOR SPEED/POWER SELECTION The trade-off between speed or power can be optimized during program execution with the CxSP control bit. The default state for this bit is ‘1’ which selects the normal speed mode. Device power consumption can be optimized at the cost of slower comparator propagation delay by clearing the CxSP bit to ‘0’. The output of the comparator can be monitored by reading either the CxOUT bit of the CMxCON0 register or the MCxOUT bit of the CMOUT register. In order to make the output available for an external connection, the following conditions must be true: • CxOE bit of the CMxCON0 register must be set • Corresponding TRIS bit must be cleared • CxON bit of the CMxCON0 register must be set Note 1: The CxOE bit of the CMxCON0 register overrides the PORT data latch. Setting the CxON bit of the CMxCON0 register has no impact on the port override. 2: The internal output of the comparator is latched with each instruction cycle. Unless otherwise specified, external outputs are not latched.  2011-2012 Microchip Technology Inc. DS41575C-page 159 PIC16(L)F1933 18.3 Comparator Hysteresis A selectable amount of separation voltage can be added to the input pins of each comparator to provide a hysteresis function to the overall operation. Hysteresis is enabled by setting the CxHYS bit of the CMxCON0 register. 18.5 Comparator Interrupt An interrupt can be generated upon a change in the output value of the comparator for each comparator, a rising edge detector and a Falling edge detector are present. See Section 30.0 “Electrical Specifications” for more information. When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of the CMxCON1 register), the Corresponding Interrupt Flag bit (CxIF bit of the PIR2 register) will be set. 18.4 To enable the interrupt, you must set the following bits: Timer1 Gate Operation The output resulting from a comparator operation can be used as a source for gate control of Timer1. See Section 21.6 “Timer1 Gate” for more information. This feature is useful for timing the duration or interval of an analog event. It is recommended that the comparator output be synchronized to Timer1. This ensures that Timer1 does not increment while a change in the comparator is occurring. 18.4.1 COMPARATOR OUTPUT SYNCHRONIZATION The output from either comparator, C1 or C2, can be synchronized with Timer1 by setting the CxSYNC bit of the CMxCON0 register. Once enabled, the comparator output is latched on the falling edge of the Timer1 source clock. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 18-2) and the Timer1 Block Diagram (Figure 22-1) for more information. • CxON, CxPOL and CxSP bits of the CMxCON0 register • CxIE bit of the PIE2 register • CxINTP bit of the CMxCON1 register (for a rising edge detection) • CxINTN bit of the CMxCON1 register (for a falling edge detection) • PEIE and GIE bits of the INTCON register The associated interrupt flag bit, CxIF bit of the PIR2 register, must be cleared in software. If another edge is detected while this flag is being cleared, the flag will still be set at the end of the sequence. Note: 18.6 Although a comparator is disabled, an interrupt can be generated by changing the output polarity with the CxPOL bit of the CMxCON0 register, or by switching the comparator on or off with the CxON bit of the CMxCON0 register. Comparator Positive Input Selection Configuring the CxPCH bits of the CMxCON1 register directs an internal voltage reference or an analog pin to the non-inverting input of the comparator: • • • • CxIN+ analog pin DAC_output DAC FVR Buffer2 VSS (Ground) See Section 14.0 “Fixed Voltage Reference (FVR)” for more information on the Fixed Voltage Reference module. See Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information on the DAC input signal. Any time the comparator is disabled (CxON = 0), all comparator inputs are disabled. DS41575C-page 160  2011-2012 Microchip Technology Inc. PIC16(L)F1933 18.7 Comparator Negative Input Selection The CxNCH bits of the CMxCON0 register direct one of four analog pins to the comparator inverting input. Note: 18.8 To use CxIN+ and CxINx- pins as analog input, the appropriate bits must be set in the ANSEL register and the corresponding TRIS bits must also be set to disable the output drivers. Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference specifications in Section 30.0 “Electrical Specifications” for more details. 18.9 Interaction with ECCP Logic 18.10 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 18-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 k is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. The C1 and C2 comparators can be used as general purpose comparators. Their outputs can be brought out to the C1OUT and C2OUT pins. When the ECCP auto-shutdown is active it can use one or both comparator signals. If auto-restart is also enabled, the comparators can be configured as a closed loop analog feedback to the ECCP, thereby, creating an analog controlled PWM. Note: When the comparator module is first initialized the output state is unknown. Upon initialization, the user should verify the output state of the comparator prior to relying on the result, primarily when using the result in connection with other peripheral features, such as the ECCP Auto-Shutdown mode.  2011-2012 Microchip Technology Inc. DS41575C-page 161 PIC16(L)F1933 FIGURE 18-3: ANALOG INPUT MODEL VDD Rs < 10K Analog Input pin VT  0.6V RIC To Comparator VA CPIN 5 pF VT  0.6V ILEAKAGE(1) Vss Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions = Interconnect Resistance RIC = Source Impedance RS = Analog Voltage VA = Threshold Voltage VT Note 1: See Section 30.0 “Electrical Specifications”. DS41575C-page 162  2011-2012 Microchip Technology Inc. PIC16(L)F1933 18.11 Register Definitions: Comparator Control REGISTER 18-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0 CxON CxOUT CxOE CxPOL — CxSP CxHYS CxSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxON: Comparator Enable bit 1 = Comparator is enabled and consumes no active power 0 = Comparator is disabled bit 6 CxOUT: Comparator Output bit If CxPOL = 1 (inverted polarity): 1 = CxVP < CxVN 0 = CxVP > CxVN If CxPOL = 0 (non-inverted polarity): 1 = CxVP > CxVN 0 = CxVP < CxVN bit 5 CxOE: Comparator Output Enable bit 1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually drive the pin. Not affected by CxON. 0 = CxOUT is internal only bit 4 CxPOL: Comparator Output Polarity Select bit 1 = Comparator output is inverted 0 = Comparator output is not inverted bit 3 Unimplemented: Read as ‘0’ bit 2 CxSP: Comparator Speed/Power Select bit 1 = Comparator operates in normal power, higher speed mode 0 = Comparator operates in low-power, low-speed mode bit 1 CxHYS: Comparator Hysteresis Enable bit 1 = Comparator hysteresis enabled 0 = Comparator hysteresis disabled bit 0 CxSYNC: Comparator Output Synchronous Mode bit 1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source. Output updated on the falling edge of Timer1 clock source. 0 = Comparator output to Timer1 and I/O pin is asynchronous  2011-2012 Microchip Technology Inc. DS41575C-page 163 PIC16(L)F1933 REGISTER 18-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1 R/W-0/0 R/W-0/0 CxINTP CxINTN R/W-0/0 R/W-0/0 CxPCH U-0 U-0 — — R/W-0/0 R/W-0/0 CxNCH bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit 0 = No interrupt flag will be set on a positive going edge of the CxOUT bit bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits 1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit 0 = No interrupt flag will be set on a negative going edge of the CxOUT bit bit 5-4 CxPCH: Comparator Positive Input Channel Select bits 11 = CxVP connects to VSS 10 = CxVP connects to FVR Voltage Reference 01 = CxVP connects to DAC Voltage Reference 00 = CxVP connects to CxIN+ pin bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 CxNCH: Comparator Negative Input Channel Select bits 11 = CxVN connects to C12IN3- pin 10 = CxVN connects to C12IN2- pin 01 = CxVN connects to C12IN1- pin 00 = CxVN connects to C12IN0- pin REGISTER 18-3: CMOUT: COMPARATOR OUTPUT REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R-0/0 R-0/0 — — — — — — MC2OUT MC1OUT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1 MC2OUT: Mirror Copy of C2OUT bit bit 0 MC1OUT: Mirror Copy of C1OUT bit DS41575C-page 164  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 18-3: Name CM1CON0 SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page C1ON C1OUT C1OE C1POL --- C1SP C1HYS C1SYNC 163 C2OE C2POL C2HYS C2SYNC CM2CON0 C2ON C2OUT CM1CON1 C1NTP C1INTN CM2CON1 C2NTP C2INTN — — FVRCON FVREN DACCON0 DACEN DACCON1 CMOUT — C2SP C1PCH — — C2PCH — — — — 163 C1NCH 164 C2NCH 164 — — FVRRDY TSEN TSRNG CDAFVR DACLPS DACOE — DACPSS — — — GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 117 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 INTCON Legend: MC2OUT MC1OUT ADFVR — DACNSS DACR 164 135 156 156 82 — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module.  2011-2012 Microchip Technology Inc. DS41575C-page 165 PIC16(L)F1933 NOTES: DS41575C-page 166  2011-2012 Microchip Technology Inc. PIC16(L)F1933 19.0 SR LATCH The module consists of a single SR latch with multiple Set and Reset inputs as well as separate latch outputs. The SR latch module includes the following features: • • • • Programmable input selection SR latch output is available externally Separate Q and Q outputs Firmware Set and Reset The SR latch can be used in a variety of analog applications, including oscillator circuits, one-shot circuit, hysteretic controllers, and analog timing applications. 19.1 Latch Operation The latch is a Set-Reset Latch that does not depend on a clock source. Each of the Set and Reset inputs are active-high. The latch can be set or reset by: • • • • • 19.2 Latch Output The SRQEN and SRNQEN bits of the SRCON0 register control the Q and Q latch outputs. Both of the SR latch outputs may be directly output to an I/O pin at the same time. The Q latch output pin function can be moved to an alternate pin using the SRNQSEL bit of the APFCON register. The applicable TRIS bit of the corresponding port must be cleared to enable the port pin output driver. 19.3 Effects of a Reset Upon any device Reset, the SR latch output is not initialized to a known state. The user’s firmware is responsible for initializing the latch output before enabling the output pins. Software control (SRPS and SRPR bits) Comparator C1 output (sync_C1OUT) Comparator C2 output (sync_C2OUT) SRI pin Programmable clock (SRCLK) The SRPS and the SRPR bits of the SRCON0 register may be used to set or reset the SR latch, respectively. The latch is Reset-dominant. Therefore, if both Set and Reset inputs are high, the latch will go to the Reset state. Both the SRPS and SRPR bits are self resetting which means that a single write to either of the bits is all that is necessary to complete a latch Set or Reset operation. The output from Comparator C1 or C2 can be used as the Set or Reset inputs of the SR latch. The output of either comparator can be synchronized to the Timer1 clock source. See Section 18.0 “Comparator Module” and Section 21.0 “Timer1 Module with Gate Control” for more information. An external source on the SRI pin can be used as the Set or Reset inputs of the SR latch. An internal clock source is available that can periodically set or reset the SR latch. The SRCLK bits in the SRCON0 register are used to select the clock source period. The SRSCKE and SRRCKE bits of the SRCON1 register enable the clock source to set or reset the SR latch, respectively.  2011-2012 Microchip Technology Inc. DS41575C-page 167 PIC16(L)F1933 FIGURE 19-1: SR LATCH SIMPLIFIED BLOCK DIAGRAM SRPS SRLEN SRQEN Pulse Gen(2) SRI S SRSPE SRCLK Q SRQ SRSCKE sync_C2OUT(3) SRSC2E sync_C1OUT(3) SRSC1E SRPR SR Latch(1) Pulse Gen(2) SRI R SRRPE SRCLK Q SRNQ SRRCKE sync_C2OUT(3) SRRC2E SRLEN SRNQEN sync_C1OUT(3) SRRC1E Note 1: 2: 3: TABLE 19-1: If R = 1 and S = 1 simultaneously, Q = 0, Q = 1 Pulse generator causes a 1 Q-state pulse width. Name denotes the connection point at the comparator output. SRCLK FREQUENCY TABLE SRCLK Divider FOSC = 32 MHz FOSC = 20 MHz FOSC = 16 MHz FOSC = 4 MHz FOSC = 1 MHz 111 512 110 256 62.5 kHz 39.0 kHz 31.3 kHz 7.81 kHz 1.95 kHz 125 kHz 78.1 kHz 62.5 kHz 15.6 kHz 3.90 kHz 101 100 128 250 kHz 156 kHz 125 kHz 31.25 kHz 7.81 kHz 64 500 kHz 313 kHz 250 kHz 62.5 kHz 15.6 kHz 011 32 1 MHz 625 kHz 500 kHz 125 kHz 31.3 kHz 010 16 2 MHz 1.25 MHz 1 MHz 250 kHz 62.5 kHz 001 8 4 MHz 2.5 MHz 2 MHz 500 kHz 125 kHz 000 4 8 MHz 5 MHz 4 MHz 1 MHz 250 kHz DS41575C-page 168  2011-2012 Microchip Technology Inc. PIC16(L)F1933 19.4 Register Definitions: SR Latch Control REGISTER 19-1: R/W-0/0 SRCON0: SR LATCH CONTROL 0 REGISTER R/W-0/0 SRLEN R/W-0/0 R/W-0/0 SRCLK R/W-0/0 R/W-0/0 R/S-0/0 R/S-0/0 SRQEN SRNQEN SRPS SRPR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared S = Bit is set only bit 7 SRLEN: SR Latch Enable bit 1 = SR latch is enabled 0 = SR latch is disabled bit 6-4 SRCLK: SR Latch Clock Divider bits 111 = Generates a 1 FOSC wide pulse every 512th FOSC cycle clock 110 = Generates a 1 FOSC wide pulse every 256th FOSC cycle clock 101 = Generates a 1 FOSC wide pulse every 128th FOSC cycle clock 100 = Generates a 1 FOSC wide pulse every 64th FOSC cycle clock 011 = Generates a 1 FOSC wide pulse every 32nd FOSC cycle clock 010 = Generates a 1 FOSC wide pulse every 16th FOSC cycle clock 001 = Generates a 1 FOSC wide pulse every 8th FOSC cycle clock 000 = Generates a 1 FOSC wide pulse every 4th FOSC cycle clock bit 3 SRQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRQ pin 0 = External Q output is disabled If SRLEN = 0: SR latch is disabled bit 2 SRNQEN: SR Latch Q Output Enable bit If SRLEN = 1: 1 = Q is present on the SRnQ pin 0 = External Q output is disabled If SRLEN = 0: SR latch is disabled bit 1 SRPS: Pulse Set Input of the SR Latch bit(1) 1 = Pulse set input for 1 Q-clock period 0 = No effect on set input. bit 0 SRPR: Pulse Reset Input of the SR Latch bit(1) 1 = Pulse reset input for 1 Q-clock period 0 = No effect on reset input. Note 1: Set only, always reads back ‘0’. REGISTER 19-2: SRCON1: SR LATCH CONTROL 1 REGISTER R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SRSPE SRSCKE SRSC2E SRSC1E SRRPE SRRCKE SRRC2E SRRC1E bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets  2011-2012 Microchip Technology Inc. DS41575C-page 169 PIC16(L)F1933 REGISTER 19-2: SRCON1: SR LATCH CONTROL 1 REGISTER (CONTINUED) ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SRSPE: SR Latch Peripheral Set Enable bit 1 = SR latch is set when the SRI pin is high. 0 = SRI pin has no effect on the set input of the SR latch bit 6 SRSCKE: SR Latch Set Clock Enable bit 1 = Set input of SR latch is pulsed with SRCLK 0 = SRCLK has no effect on the set input of the SR latch bit 5 SRSC2E: SR Latch C2 Set Enable bit 1 = SR latch is set when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the set input of the SR latch bit 4 SRSC1E: SR Latch C1 Set Enable bit 1 = SR latch is set when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the set input of the SR latch bit 3 SRRPE: SR Latch Peripheral Reset Enable bit 1 = SR latch is reset when the SRI pin is high. 0 = SRI pin has no effect on the reset input of the SR latch bit 2 SRRCKE: SR Latch Reset Clock Enable bit 1 = Reset input of SR latch is pulsed with SRCLK 0 = SRCLK has no effect on the reset input of the SR latch bit 1 SRRC2E: SR Latch C2 Reset Enable bit 1 = SR latch is reset when the C2 Comparator output is high 0 = C2 Comparator output has no effect on the reset input of the SR latch bit 0 SRRC1E: SR Latch C1 Reset Enable bit 1 = SR latch is reset when the C1 Comparator output is high 0 = C1 Comparator output has no effect on the reset input of the SR latch TABLE 19-2: Name ANSELA SUMMARY OF REGISTERS ASSOCIATED WITH SR LATCH MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 117 SRPS SRCON0 SRLEN SRQEN SRNQEN SRCON1 SRSPE SRSCKE SRCLK SRSC2E SRSC1E SRRPE SRRCKE SRRC2E TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 SRPR 169 SRRC1E 169 TRISA0 116 Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the SR latch module. DS41575C-page 170  2011-2012 Microchip Technology Inc. PIC16(L)F1933 20.0 TIMER0 MODULE 20.1.2 In 8-Bit Counter mode, the Timer0 module will increment on every rising or falling edge of the T0CKI pin or the Capacitive Sensing Oscillator (CPSCLK) signal. The Timer0 module is an 8-bit timer/counter with the following features: • • • • • • 8-bit timer/counter register (TMR0) 8-bit prescaler (independent of Watchdog Timer) Programmable internal or external clock source Programmable external clock edge selection Interrupt on overflow TMR0 can be used to gate Timer1 8-Bit Counter mode using the T0CKI pin is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’ and resetting the T0XCS bit in the CPSCON0 register to ‘0’. 8-Bit Counter mode using the Capacitive Sensing Oscillator (CPSCLK) signal is selected by setting the TMR0CS bit in the OPTION_REG register to ‘1’ and setting the T0XCS bit in the CPSCON0 register to ‘1’. Figure 20-1 is a block diagram of the Timer0 module. 20.1 Timer0 Operation The rising or falling transition of the incrementing edge for either input source is determined by the TMR0SE bit in the OPTION_REG register. The Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 20.1.1 8-BIT COUNTER MODE 8-BIT TIMER MODE The Timer0 module will increment every instruction cycle, if used without a prescaler. 8-bit Timer mode is selected by clearing the TMR0CS bit of the OPTION_REG register. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. FIGURE 20-1: BLOCK DIAGRAM OF THE TIMER0 FOSC/4 Data Bus 0 T0CKI 1 0 From CPSCLK 1 8 Sync 2 TCY TMR0 0 1 TMR0SE TMR0CS 8-bit Prescaler PSA T0XCS Set Flag bit TMR0IF on Overflow Overflow to Timer1 8 PS  2011-2012 Microchip Technology Inc. DS41575C-page 171 PIC16(L)F1933 20.1.3 SOFTWARE PROGRAMMABLE PRESCALER A software programmable prescaler is available for exclusive use with Timer0. The prescaler is enabled by clearing the PSA bit of the OPTION_REG register. Note: The Watchdog Timer (WDT) uses its own independent prescaler. There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS bits of the OPTION_REG register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be disabled by setting the PSA bit of the OPTION_REG register. The prescaler is not readable or writable. All instructions writing to the TMR0 register will clear the prescaler. 20.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The TMR0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The TMR0IF bit can only be cleared in software. The Timer0 interrupt enable is the TMR0IE bit of the INTCON register. Note: 20.1.5 The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. 8-BIT COUNTER MODE SYNCHRONIZATION When in 8-Bit Counter mode, the incrementing edge on the T0CKI pin must be synchronized to the instruction clock. Synchronization can be accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the instruction clock. The high and low periods of the external clocking source must meet the timing requirements as shown in Section 30.0 “Electrical Specifications”. 20.1.6 OPERATION DURING SLEEP Timer0 cannot operate while the processor is in Sleep mode. The contents of the TMR0 register will remain unchanged while the processor is in Sleep mode. DS41575C-page 172  2011-2012 Microchip Technology Inc. PIC16(L)F1933 20.2 Register Definitions: Option Register REGISTER 20-1: OPTION_REG: OPTION REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 WPUEN INTEDG TMR0CS TMR0SE PSA R/W-1/1 R/W-1/1 R/W-1/1 PS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 WPUEN: Weak Pull-Up Enable bit 1 = All weak pull-ups are disabled (except MCLR, if it is enabled) 0 = Weak pull-ups are enabled by individual WPUx latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 TMR0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 TMR0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is not assigned to the Timer0 module 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS: Prescaler Rate Select bits TABLE 20-1: Name CPSCON0 INTCON OPTION_REG TMR0 TRISA Legend: * Bit Value Timer0 Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 CPSON CPSRM — — GIE PEIE TMR0IE INTE IOCIE WPUEN INTEDG TMR0CS TMR0SE PSA Bit 2 CPSRNG TMR0IF Bit 1 Bit 0 Register on Page CPSOUT T0XCS 311 INTF IOCIF 82 PS 173 Timer0 Module Register TRISA7 TRISA6 171* TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module. Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 173 PIC16(L)F1933 NOTES: DS41575C-page 174  2011-2012 Microchip Technology Inc. PIC16(L)F1933 21.0 TIMER1 MODULE WITH GATE CONTROL • • • • The Timer1 module is a 16-bit timer/counter with the following features: Figure 21-1 is a block diagram of the Timer1 module. • • • • • • • • 16-bit timer/counter register pair (TMR1H:TMR1L) Programmable internal or external clock source 2-bit prescaler Dedicated 32 kHz oscillator circuit Optionally synchronized comparator out Multiple Timer1 gate (count enable) sources Interrupt on overflow Wake-up on overflow (external clock, Asynchronous mode only) • Time base for the Capture/Compare function • Special Event Trigger (with CCP/ECCP) • Selectable Gate Source Polarity FIGURE 21-1: Gate Toggle mode Gate Single-pulse mode Gate Value Status Gate Event Interrupt TIMER1 BLOCK DIAGRAM T1GSS T1GSPM 00 T1G From Timer0 Overflow 01 Comparator 1 sync_C1OUT 10 Comparator 2 sync_C2OUT 11 T1GTM T1GVAL 0 Single Pulse TMR1ON T1GPOL 0 t1g_in D Q CK R Q 1 Acq. Control 1 Q1 Data Bus D Q RD T1GCON EN Interrupt T1GGO/DONE Set TMR1GIF det TMR1GE Set flag bit TMR1IF on Overflow To ADC Auto-Conversion TMR1ON To Comparator Module TMR1(2) TMR1H EN TMR1L Q D T1CLK Synchronized clock input 0 1 TMR1CS T1OSO OUT T1OSC T1OSI 1 Cap. Sensing Oscillator T1SYNC 11 Synchronize(3) Prescaler 1, 2, 4, 8 det 10 EN 0 T1OSCEN (1) FOSC Internal Clock 01 FOSC/4 Internal Clock 00 2 T1CKPS FOSC/2 Internal Clock Sleep input T1CKI To LCD and Clock Switching Modules Note 1: ST Buffer is high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep.  2011-2012 Microchip Technology Inc. DS41575C-page 175 PIC16(L)F1933 21.1 Timer1 Operation 21.2 The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer and increments on every instruction cycle. When used with an external clock source, the module can be used as either a timer or counter and increments on every selected edge of the external source. Timer1 is enabled by configuring the TMR1ON and TMR1GE bits in the T1CON and T1GCON registers, respectively. Table 21-1 displays the Timer1 enable selections. TABLE 21-1: Clock Source Selection The TMR1CS and T1OSCEN bits of the T1CON register are used to select the clock source for Timer1. Table 21-2 displays the clock source selections. 21.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected, the TMR1H:TMR1L register pair will increment on multiples of FOSC as determined by the Timer1 prescaler. When the FOSC internal clock source is selected, the Timer1 register value will increment by four counts every instruction clock cycle. Due to this condition, a 2 LSB error in resolution will occur when reading the Timer1 value. To utilize the full resolution of Timer1, an asynchronous input signal must be used to gate the Timer1 clock input. The following asynchronous sources may be used: TIMER1 ENABLE SELECTIONS Timer1 Operation • Asynchronous event on the T1G pin to Timer1 gate • C1 or C2 comparator input to Timer1 gate TMR1ON TMR1GE 0 0 Off 21.2.2 0 1 Off 1 0 Always On When the external clock source is selected, the Timer1 module may work as a timer or a counter. 1 1 Count Enabled EXTERNAL CLOCK SOURCE When enabled to count, Timer1 is incremented on the rising edge of the external clock input T1CKI or the capacitive sensing oscillator signal. Either of these external clock sources can be synchronized to the microcontroller system clock or they can run asynchronously. When used as a timer with a clock oscillator, an external 32.768 kHz crystal can be used in conjunction with the dedicated internal oscillator circuit. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge after any one or more of the following conditions: • • • • TABLE 21-2: Timer1 enabled after POR Write to TMR1H or TMR1L Timer1 is disabled Timer1 is disabled (TMR1ON = 0) when T1CKI is high then Timer1 is enabled (TMR1ON=1) when T1CKI is low. CLOCK SOURCE SELECTIONS TMR1CS T1OSCEN 11 x Capacitive Sensing Oscillator 10 0 External Clocking on T1CKI Pin 01 x System Clock (FOSC) 00 x Instruction Clock (FOSC/4) DS41575C-page 176 Clock Source  2011-2012 Microchip Technology Inc. PIC16(L)F1933 21.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 21.4 Timer1 Oscillator 21.5.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. A dedicated low-power 32.768 kHz oscillator circuit is built-in between pins T1OSI (input) and T1OSO (amplifier output). This internal circuit is to be used in conjunction with an external 32.768 kHz crystal. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TMR1L register pair. The oscillator circuit is enabled by setting the T1OSCEN bit of the T1CON register. The oscillator will continue to run during Sleep. 21.6 Note: 21.5 The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to using Timer1. A suitable delay similar to the OST delay can be implemented in software by clearing the TMR1IF bit then presetting the TMR1H:TMR1L register pair to FC00h. The TMR1IF flag will be set when 1024 clock cycles have elapsed, thereby indicating that the oscillator is running and reasonably stable. Timer1 Operation in Asynchronous Counter Mode If the control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer increments asynchronously to the internal phase clocks. If the external clock source is selected then the timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 21.5.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). Note: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce an additional increment.  2011-2012 Microchip Technology Inc. Timer1 Gate Timer1 can be configured to count freely or the count can be enabled and disabled using Timer1 gate circuitry. This is also referred to as Timer1 Gate Enable. Timer1 gate can also be driven by multiple selectable sources. 21.6.1 TIMER1 GATE ENABLE The Timer1 Gate Enable mode is enabled by setting the TMR1GE bit of the T1GCON register. The polarity of the Timer1 Gate Enable mode is configured using the T1GPOL bit of the T1GCON register. When Timer1 Gate Enable mode is enabled, Timer1 will increment on the rising edge of the Timer1 clock source. When Timer1 Gate Enable mode is disabled, no incrementing will occur and Timer1 will hold the current count. See Figure 21-3 for timing details. TABLE 21-3: TIMER1 GATE ENABLE SELECTIONS T1CLK T1GPOL T1G Timer1 Operation  0 0 Counts  0 1 Holds Count  1 0 Holds Count  1 1 Counts DS41575C-page 177 PIC16(L)F1933 21.6.2 TIMER1 GATE SOURCE SELECTION The Timer1 gate source can be selected from one of four different sources. Source selection is controlled by the T1GSS bits of the T1GCON register. The polarity for each available source is also selectable. Polarity selection is controlled by the T1GPOL bit of the T1GCON register. TABLE 21-4: TIMER1 GATE SOURCES T1GSS Timer1 Gate Pin 01 Overflow of Timer0 (TMR0 increments from FFh to 00h) 10 Comparator 1 Output sync_C1OUT (optionally Timer1 synchronized output) 11 Comparator 2 Output sync_C2OUT (optionally Timer1 synchronized output) T1G Pin Gate Operation The T1G pin is one source for Timer1 gate control. It can be used to supply an external source to the Timer1 gate circuitry. 21.6.2.2 Timer0 Overflow Gate Operation When Timer0 increments from FFh to 00h, a low-to-high pulse will automatically be generated and internally supplied to the Timer1 gate circuitry. 21.6.2.3 Comparator C1 Gate Operation The output resulting from a Comparator 1 operation can be selected as a source for Timer1 gate control. The Comparator 1 output (sync_C1OUT) can be synchronized to the Timer1 clock or left asynchronous. For more information see Section 18.4.1 “Comparator Output Synchronization”. 21.6.2.4 Note: 21.6.4 Timer1 Gate Source 00 21.6.2.1 Timer1 Gate Toggle mode is enabled by setting the T1GTM bit of the T1GCON register. When the T1GTM bit is cleared, the flip-flop is cleared and held clear. This is necessary in order to control which edge is measured. Comparator C2 Gate Operation Enabling Toggle mode at the same time as changing the gate polarity may result in indeterminate operation. TIMER1 GATE SINGLE-PULSE MODE When Timer1 Gate Single-Pulse mode is enabled, it is possible to capture a single-pulse gate event. Timer1 Gate Single-Pulse mode is first enabled by setting the T1GSPM bit in the T1GCON register. Next, the T1GGO/DONE bit in the T1GCON register must be set. The Timer1 will be fully enabled on the next incrementing edge. On the next trailing edge of the pulse, the T1GGO/DONE bit will automatically be cleared. No other gate events will be allowed to increment Timer1 until the T1GGO/DONE bit is once again set in software. See Figure 21-5 for timing details. If the Single-Pulse Gate mode is disabled by clearing the T1GSPM bit in the T1GCON register, the T1GGO/DONE bit should also be cleared. Enabling the Toggle mode and the Single-Pulse mode simultaneously will permit both sections to work together. This allows the cycle times on the Timer1 gate source to be measured. See Figure 21-6 for timing details. 21.6.5 TIMER1 GATE VALUE STATUS When Timer1 Gate Value Status is utilized, it is possible to read the most current level of the gate control value. The value is stored in the T1GVAL bit in the T1GCON register. The T1GVAL bit is valid even when the Timer1 gate is not enabled (TMR1GE bit is cleared). 21.6.6 TIMER1 GATE EVENT INTERRUPT The output resulting from a Comparator 2 operation can be selected as a source for Timer1 gate control. The Comparator 2 output (sync_C2OUT) can be synchronized to the Timer1 clock or left asynchronous. For more information see Section 18.4.1 “Comparator Output Synchronization”. When Timer1 Gate Event Interrupt is enabled, it is possible to generate an interrupt upon the completion of a gate event. When the falling edge of T1GVAL occurs, the TMR1GIF flag bit in the PIR1 register will be set. If the TMR1GIE bit in the PIE1 register is set, then an interrupt will be recognized. 21.6.3 The TMR1GIF flag bit operates even when the Timer1 gate is not enabled (TMR1GE bit is cleared). TIMER1 GATE TOGGLE MODE When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate signal, as opposed to the duration of a single level pulse. The Timer1 gate source is routed through a flip-flop that changes state on every incrementing edge of the signal. See Figure 21-4 for timing details. DS41575C-page 178  2011-2012 Microchip Technology Inc. PIC16(L)F1933 21.7 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • • • • TMR1ON bit of the T1CON register TMR1IE bit of the PIE1 register PEIE bit of the INTCON register GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. The TMR1H:TMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. Note: 21.8 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • • • • • TMR1ON bit of the T1CON register must be set TMR1IE bit of the PIE1 register must be set PEIE bit of the INTCON register must be set T1SYNC bit of the T1CON register must be set TMR1CS bits of the T1CON register must be configured • T1OSCEN bit of the T1CON register must be configured The device will wake-up on an overflow and execute the next instructions. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine. 21.9 ECCP/CCP Capture/Compare Time Base The CCP modules use the TMR1H:TMR1L register pair as the time base when operating in Capture or Compare mode. In Capture mode, the value in the TMR1H:TMR1L register pair is copied into the CCPR1H:CCPR1L register pair on a configured event. In Compare mode, an event is triggered when the value CCPR1H:CCPR1L register pair matches the value in the TMR1H:TMR1L register pair. This event can be a Special Event Trigger. For more information, see Section 12.0 “I/O Ports”. 21.10 ECCP/CCP Special Event Trigger When any of the CCP’s are configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The CCP module may still be configured to generate a CCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair becomes the period register for Timer1. Timer1 should be synchronized and FOSC/4 should be selected as the clock source in order to utilize the Special Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the CCP, the write will take precedence. For more information, see Section 15.2.5 “Special Event Trigger”. Timer1 oscillator will continue to operate in Sleep regardless of the T1SYNC bit setting. FIGURE 21-2: TIMER1 INCREMENTING EDGE T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: 2: Arrows indicate counter increments. In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.  2011-2012 Microchip Technology Inc. DS41575C-page 179 PIC16(L)F1933 FIGURE 21-3: TIMER1 GATE ENABLE MODE TMR1GE T1GPOL t1g_in T1CKI T1GVAL TIMER1 N FIGURE 21-4: N+1 N+2 N+3 N+4 TIMER1 GATE TOGGLE MODE TMR1GE T1GPOL T1GTM t1g_in T1CKI T1GVAL TIMER1 DS41575C-page 180 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 21-5: TIMER1 GATE SINGLE-PULSE MODE TMR1GE T1GPOL T1GSPM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL TIMER1 TMR1GIF N Cleared by software  2011-2012 Microchip Technology Inc. N+1 N+2 Set by hardware on falling edge of T1GVAL Cleared by software DS41575C-page 181 PIC16(L)F1933 FIGURE 21-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE TMR1GE T1GPOL T1GSPM T1GTM T1GGO/ Cleared by hardware on falling edge of T1GVAL Set by software DONE Counting enabled on rising edge of T1G t1g_in T1CKI T1GVAL TIMER1 TMR1GIF DS41575C-page 182 N Cleared by software N+1 N+2 N+3 Set by hardware on falling edge of T1GVAL N+4 Cleared by software  2011-2012 Microchip Technology Inc. PIC16(L)F1933 21.11 Register Definitions: Timer1 Control REGISTER 21-1: R/W-0/u T1CON: TIMER1 CONTROL REGISTER R/W-0/u R/W-0/u TMR1CS R/W-0/u T1CKPS R/W-0/u R/W-0/u U-0 R/W-0/u T1OSCEN T1SYNC — TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 TMR1CS: Timer1 Clock Source Select bits 11 = Timer1 clock source is Capacitive Sensing Oscillator (CAPOSC) 10 = Timer1 clock source is pin or oscillator: If T1OSCEN = 0: External clock from T1CKI pin (on the rising edge) If T1OSCEN = 1: Crystal oscillator on T1OSI/T1OSO pins 01 = Timer1 clock source is system clock (FOSC) 00 = Timer1 clock source is instruction clock (FOSC/4) bit 5-4 T1CKPS: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 T1OSCEN: LP Oscillator Enable Control bit 1 = Dedicated Timer1 oscillator circuit enabled 0 = Dedicated Timer1 oscillator circuit disabled bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1X 1 = Do not synchronize external clock input 0 = Synchronize external clock input with system clock (FOSC) TMR1CS = 0X This bit is ignored. bit 1 Unimplemented: Read as ‘0’ bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 and clears Timer1 gate flip-flop  2011-2012 Microchip Technology Inc. DS41575C-page 183 PIC16(L)F1933 REGISTER 21-2: T1GCON: TIMER1 GATE CONTROL REGISTER R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ DONE T1GVAL R/W-0/u R/W-0/u T1GSS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware bit 7 TMR1GE: Timer1 Gate Enable bit If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 counting is controlled by the Timer1 gate function 0 = Timer1 counts regardless of Timer1 gate function bit 6 T1GPOL: Timer1 Gate Polarity bit 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 5 T1GTM: Timer1 Gate Toggle Mode bit 1 = Timer1 Gate Toggle mode is enabled 0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared Timer1 gate flip-flop toggles on every rising edge. bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit 1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate 0 = Timer1 Gate Single-Pulse mode is disabled bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit 1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge 0 = Timer1 gate single-pulse acquisition has completed or has not been started bit 2 T1GVAL: Timer1 Gate Current State bit Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L. Unaffected by Timer1 Gate Enable (TMR1GE). bit 1-0 T1GSS: Timer1 Gate Source Select bits 11 = Comparator 2 optionally synchronized output (sync_C2OUT) 10 = Comparator 1 optionally synchronized output (sync_C1OUT) 01 = Timer0 overflow output 00 = Timer1 gate pin DS41575C-page 184  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 21-5: Name ANSELB SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 CCP1CON P1M DC1B CCP1M CCP2CON P2M DC2B CCP2M INTCON PIE1 PIR1 PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF Holding Register for the Most Significant Byte of the 16-bit TMR1 Register TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISC TRISC7 TRISC6 TRISC5 TRISC4 T1GCON Legend: * 214 GIE TMR1H T1CON 214 TMR1CS TMR1GE T1GPOL T1CKPS T1GTM T1GSPM TRISB3 86 179* 179* TRISB2 TRISB1 TRISB0 121 TRISC3 TRISC2 TRISC1 TRISC0 125 T1OSCEN T1SYNC — TMR1ON 183 T1GGO/ DONE T1GVAL T1GSS 184 — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module. Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 185 PIC16(L)F1933 NOTES: DS41575C-page 186  2011-2012 Microchip Technology Inc. PIC16(L)F1933 22.0 TIMER2/4/6 MODULES There are up to three identical Timer2-type modules available. To maintain pre-existing naming conventions, the Timers are called Timer2, Timer4 and Timer6 (also Timer2/4/6). Note: The ‘x’ variable used in this section is used to designate Timer2, Timer4, or Timer6. For example, TxCON references T2CON, T4CON, or T6CON. PRx references PR2, PR4, or PR6. The Timer2/4/6 modules incorporate the following features: • 8-bit Timer and Period registers (TMRx and PRx, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4, 1:16, and 1:64) • Software programmable postscaler (1:1 to 1:16) • Interrupt on TMRx match with PRx, respectively • Optional use as the shift clock for the MSSP module (Timer2 only) See Figure 22-1 for a block diagram of Timer2/4/6. FIGURE 22-1: TIMER2/4/6 BLOCK DIAGRAM TMRx Output FOSC/4 Prescaler 1:1, 1:4, 1:16, 1:64 2 TMRx Comparator Sets Flag bit TMRxIF Reset EQ Postscaler 1:1 to 1:16 TxCKPS PRx 4 TxOUTPS  2011-2012 Microchip Technology Inc. DS41575C-page 187 PIC16(L)F1933 22.1 Timer2/4/6 Operation The clock input to the Timer2/4/6 modules is the system instruction clock (FOSC/4). TMRx increments from 00h on each clock edge. A 4-bit counter/prescaler on the clock input allows direct input, divide-by-4 and divide-by-16 prescale options. These options are selected by the prescaler control bits, TxCKPS of the TxCON register. The value of TMRx is compared to that of the Period register, PRx, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMRx to 00h on the next cycle and drives the output counter/postscaler (see Section 22.2 “Timer2/4/6 Interrupt”). 22.3 Timer2/4/6 Output The unscaled output of TMRx is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can be optionally used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 24.0 “Master Synchronous Serial Port Module” 22.4 Timer2/4/6 Operation During Sleep The Timer2/4/6 timers cannot be operated while the processor is in Sleep mode. The contents of the TMRx and PRx registers will remain unchanged while the processor is in Sleep mode. The TMRx and PRx registers are both directly readable and writable. The TMRx register is cleared on any device Reset, whereas the PRx register initializes to FFh. Both the prescaler and postscaler counters are cleared on the following events: • • • • • • • • • a write to the TMRx register a write to the TxCON register Power-on Reset (POR) Brown-out Reset (BOR) MCLR Reset Watchdog Timer (WDT) Reset Stack Overflow Reset Stack Underflow Reset RESET Instruction Note: 22.2 TMRx is not cleared when TxCON is written. Timer2/4/6 Interrupt Timer2/4/6 can also generate an optional device interrupt. The Timer2/4/6 output signal (TMRx-to-PRx match) provides the input for the 4-bit counter/postscaler. This counter generates the TMRx match interrupt flag which is latched in TMRxIF of the PIRx register. The interrupt is enabled by setting the TMRx Match Interrupt Enable bit, TMRxIE, of the PIEx register. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, TxOUTPS, of the TxCON register. DS41575C-page 188  2011-2012 Microchip Technology Inc. PIC16(L)F1933 22.5 Register Definitions: Timer2/4/6 Control REGISTER 22-1: U-0 TXCON: TIMER2/TIMER4/TIMER6 CONTROL REGISTER R/W-0/0 R/W-0/0 — R/W-0/0 R/W-0/0 TxOUTPS R/W-0/0 R/W-0/0 TMRxON bit 7 R/W-0/0 TxCKPS bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 TxOUTPS: Timer Output Postscaler Select bits 1111 = 1:16 Postscaler 1110 = 1:15 Postscaler 1101 = 1:14 Postscaler 1100 = 1:13 Postscaler 1011 = 1:12 Postscaler 1010 = 1:11 Postscaler 1001 = 1:10 Postscaler 1000 = 1:9 Postscaler 0111 = 1:8 Postscaler 0110 = 1:7 Postscaler 0101 = 1:6 Postscaler 0100 = 1:5 Postscaler 0011 = 1:4 Postscaler 0010 = 1:3 Postscaler 0001 = 1:2 Postscaler 0000 = 1:1 Postscaler bit 2 TMRxON: Timerx On bit 1 = Timerx is on 0 = Timerx is off bit 1-0 TxCKPS: Timer2-type Clock Prescale Select bits 11 = Prescaler is 64 10 = Prescaler is 16 01 = Prescaler is 4 00 = Prescaler is 1  2011-2012 Microchip Technology Inc. DS41575C-page 189 PIC16(L)F1933 TABLE 22-1: Name SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2/4/6 Bit 7 CCP2CON Bit 6 P2M Bit 5 Bit 4 Bit 3 DC2B Bit 2 Bit 1 Bit 0 CCP2M Register on Page 214 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — INTCON PIE1 88 PR2 Timer2 Module Period Register 187* PR4 Timer4 Module Period Register 187* PR6 Timer6 Module Period Register 187* T2CON — T2OUTPS TMR2ON T2CKPS 189 T4CON — T4OUTPS TMR4ON T4CKPS 189 — T6OUTPS TMR2ON T6CKPS 189 T6CON TMR2 Holding Register for the 8-bit TMR2 Register 187* TMR4 Holding Register for the 8-bit TMR4 Register(1) 187* TMR6 Holding Register for the 8-bit TMR6 Register(1) 187* Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module. * Page provides register information. DS41575C-page 190  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.0 CAPTURE/COMPARE/PWM MODULES The Capture/Compare/PWM module is a peripheral which allows the user to time and control different events, and to generate Pulse-Width Modulation (PWM) signals. In Capture mode, the peripheral allows the timing of the duration of an event. The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate Pulse-Width Modulated signals of varying frequency and duty cycle. This family of devices contains three Enhanced Capture/Compare/PWM modules (ECCP1, ECCP2, and ECCP3) and two standard Capture/Compare/PWM modules (CCP4 and CCP5). The Capture and Compare functions are identical for all five CCP modules (ECCP1, ECCP2, ECCP3, CCP4, and CCP5). The only differences between CCP modules are in the Pulse-Width Modulation (PWM) function. The standard PWM function is identical in modules CCP4 and CCP5. In CCP modules ECCP1, ECCP2 and ECCP3, the Enhanced PWM function has slight variations from one another. Full-Bridge ECCP modules have four available I/O pins while Half-Bridge ECCP modules only have two available I/O pins. See Table 23-1 for more information. TABLE 23-1: 2: Throughout this section, generic references to a CCP module in any of its operating modes may be interpreted as being equally applicable to ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Register names, module signals, I/O pins, and bit names may use the generic designator ‘x’ to indicate the use of a numeral to distinguish a particular module, when required. PWM RESOURCES Device Name PIC16(L)F1933 Note 1: In devices with more than one CCP module, it is very important to pay close attention to the register names used. A number placed after the module acronym is used to distinguish between separate modules. For example, the CCP1CON and CCP2CON control the same operational aspects of two completely different CCP modules. ECCP1 ECCP2 ECCP3 CCP4 CCP5 Enhanced PWM Full-Bridge Enhanced PWM Half-Bridge Enhanced PWM Half-Bridge Standard PWM Standard PWM  2011-2012 Microchip Technology Inc. DS41575C-page 191 PIC16(L)F1933 23.1 Capture Mode 23.1.2 The Capture mode function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Capture mode makes use of the 16-bit Timer1 resource. When an event occurs on the CCPx pin, the 16-bit CCPRxH:CCPRxL register pair captures and stores the 16-bit value of the TMR1H:TMR1L register pair, respectively. An event is defined as one of the following and is configured by the CCPxM bits of the CCPxCON register: • • • • Every falling edge Every rising edge Every 4th rising edge Every 16th rising edge Figure 23-1 shows a simplified diagram of the Capture operation. 23.1.1 CCP PIN CONFIGURATION In Capture mode, the CCPx pin should be configured as an input by setting the associated TRIS control bit. Also, the CCPx pin function can be moved to alternative pins using the APFCON register. Refer to Section 12.1 “Alternate Pin Function” for more details. Note: Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. See Section 21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. 23.1.3 If the CCPx pin is configured as an output, a write to the port can cause a capture condition. Prescaler  1, 4, 16 CAPTURE MODE OPERATION BLOCK DIAGRAM Set Flag bit CCPxIF (PIRx register) CCPx pin CCPRxH and Edge Detect Capture Enable TMR1H CCPxM System Clock (FOSC) DS41575C-page 192 CCPRxL TMR1L CCP PRESCALER There are four prescaler settings specified by the CCPxM bits of the CCPxCON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCPxCON register before changing the prescaler. Example 23-1 demonstrates the code to perform this function. EXAMPLE 23-1: CHANGING BETWEEN CAPTURE PRESCALERS BANKSEL CCPxCON CLRF MOVLW MOVWF FIGURE 23-1: SOFTWARE INTERRUPT MODE When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCPxIE interrupt enable bit of the PIEx register clear to avoid false interrupts. Additionally, the user should clear the CCPxIF interrupt flag bit of the PIRx register following any change in Operating mode. 23.1.4 When a capture is made, the Interrupt Request Flag bit CCPxIF of the PIRx register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPRxH, CCPRxL register pair is read, the old captured value is overwritten by the new captured value. TIMER1 MODE RESOURCE 23.1.5 ;Set Bank bits to point ;to CCPxCON CCPxCON ;Turn CCP module off NEW_CAPT_PS ;Load the W reg with ;the new prescaler ;move value and CCP ON CCPxCON ;Load CCPxCON with this ;value CAPTURE DURING SLEEP Capture mode depends upon the Timer1 module for proper operation. There are two options for driving the Timer1 module in Capture mode. It can be driven by the instruction clock (FOSC/4), or by an external clock source. When Timer1 is clocked by FOSC/4, Timer1 will not increment during Sleep. When the device wakes from Sleep, Timer1 will continue from its previous state. Capture mode will operate during Sleep when Timer1 is clocked by an external clock source.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.1.6 ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. TABLE 23-2: Name APFCON CCPxCON SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL PxM(1) DCxB CCPxM CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) CCPRxH Capture/Compare/PWM Register x High Byte (MSB) Register on Page 114 214 192 192 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 88 T1OSCEN T1SYNC — TMR1ON 183 T1GGO/DONE T1GVAL INTCON T1CON T1GCON TMR1CS TMR1GE T1GPOL T1CKPS T1GTM T1GSPM TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register T1GSS 82 184 179 179 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Capture mode. Note 1: Applies to ECCP modules only.  2011-2012 Microchip Technology Inc. DS41575C-page 193 PIC16(L)F1933 23.2 Compare Mode 23.2.2 The Compare mode function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. Compare mode makes use of the 16-bit Timer1 resource. The 16-bit value of the CCPRxH:CCPRxL register pair is constantly compared against the 16-bit value of the TMR1H:TMR1L register pair. When a match occurs, one of the following events can occur: • • • • • In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. See Section 21.0 “Timer1 Module with Gate Control” for more information on configuring Timer1. Note: Toggle the CCPx output Set the CCPx output Clear the CCPx output Generate a Special Event Trigger Generate a Software Interrupt The action on the pin is based on the value of the CCPxM control bits of the CCPxCON register. At the same time, the interrupt flag CCPxIF bit is set. All Compare modes can generate an interrupt. Figure 23-2 shows a simplified diagram of the Compare operation. FIGURE 23-2: COMPARE MODE OPERATION BLOCK DIAGRAM CCPxM Mode Select Set CCPxIF Interrupt Flag (PIRx) 4 CCPRxH CCPRxL CCPx Pin Q S R Output Logic Match TRIS Output Enable Comparator TMR1H TMR1L Special Event Trigger 23.2.1 CCP PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the associated TRIS bit. Also, the CCPx pin function can be moved to alternative pins using the APFCON register. Refer to Section 12.1 “Alternate Pin Function” for more details. Note: Clearing the CCPxCON register will force the CCPx compare output latch to the default low level. This is not the PORT I/O data latch. DS41575C-page 194 TIMER1 MODE RESOURCE 23.2.3 Clocking Timer1 from the system clock (FOSC) should not be used in Compare mode. In order for Compare mode to recognize the trigger event on the CCPx pin, TImer1 must be clocked from the instruction clock (FOSC/4) or from an external clock source. SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCPxM = 1010), the CCPx module does not assert control of the CCPx pin (see the CCPxCON register). 23.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCPxM = 1011), the CCPx module does the following: • Resets Timer1 • Starts an ADC conversion if ADC is enabled The CCPx module does not assert control of the CCPx pin in this mode. The Special Event Trigger output of the CCP occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPRxH, CCPRxL register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. The Special Event Trigger output starts an A/D conversion (if the A/D module is enabled). This allows the CCPRxH, CCPRxL register pair to effectively provide a 16-bit programmable period register for Timer1. TABLE 23-3: SPECIAL EVENT TRIGGER Device CCPx/ECCPx PIC16(L)F1933 CCP5 Refer to Section 15.2.5 “Special Event Trigger”for more information. Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMR1IF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPRxH and CCPRxL register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.2.5 COMPARE DURING SLEEP 23.2.6 The Compare mode is dependent upon the system clock (FOSC) for proper operation. Since FOSC is shut down during Sleep mode, the Compare mode will not function properly during Sleep. TABLE 23-4: Name APFCON CCPxCON This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL PxM(1) DCxB CCPxM CCPRxL Capture/Compare/PWM Register x Low Byte (LSB) CCPRxH Capture/Compare/PWM Register x High Byte (MSB) INTCON ALTERNATE PIN LOCATIONS GIE PEIE TMR0IE Register on Page 114 214 192 192 INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 88 T1CON TMR1CS T1OSCEN T1SYNC — TMR1ON 183 T1GCON TMR1GE T1GPOL T1CKPS T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS 184 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 179 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 179 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Compare mode. Note 1: Applies to ECCP modules only.  2011-2012 Microchip Technology Inc. DS41575C-page 195 PIC16(L)F1933 23.3 PWM Overview Pulse-Width Modulation (PWM) is a scheme that provides power to a load by switching quickly between fully on and fully off states. The PWM signal resembles a square wave where the high portion of the signal is considered the on state and the low portion of the signal is considered the off state. The high portion, also known as the pulse width, can vary in time and is defined in steps. A larger number of steps applied, which lengthens the pulse width, also supplies more power to the load. Lowering the number of steps applied, which shortens the pulse width, supplies less power. The PWM period is defined as the duration of one complete cycle or the total amount of on and off time combined. PWM resolution defines the maximum number of steps that can be present in a single PWM period. A higher resolution allows for more precise control of the pulse width time and in turn the power that is applied to the load. FIGURE 23-3: Period Pulse Width 23.3.1 TMRx = 0 FIGURE 23-4: The standard PWM mode generates a Pulse-Width Modulation (PWM) signal on the CCPx pin with up to 10 bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: • • • • SIMPLIFIED PWM BLOCK DIAGRAM CCPxCON Duty Cycle Registers CCPRxL CCPRxH(2) (Slave) CCPx R Comparator TMRx (1) Q S TRIS Comparator STANDARD PWM OPERATION The standard PWM function described in this section is available and identical for CCP modules ECCP1, ECCP2, ECCP3, CCP4 and CCP5. TMRx = PRx TMRx = CCPRxH:CCPxCON The term duty cycle describes the proportion of the on time to the off time and is expressed in percentages, where 0% is fully off and 100% is fully on. A lower duty cycle corresponds to less power applied and a higher duty cycle corresponds to more power applied. Figure 23-3 shows a typical waveform of the PWM signal. CCP PWM OUTPUT SIGNAL PRx Note 1: 2: Clear Timer, toggle CCPx pin and latch duty cycle The 8-bit timer TMRx register is concatenated with the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. In PWM mode, CCPRxH is a read-only register. PRx registers TxCON registers CCPRxL registers CCPxCON registers Figure 23-4 shows a simplified block diagram of PWM operation. Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. 2: Clearing the CCPxCON register will relinquish control of the CCPx pin. DS41575C-page 196  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.3.2 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for standard PWM operation: 1. 2. 3. 4. 5. 6. Disable the CCPx pin output driver by setting the associated TRIS bit. Load the PRx register with the PWM period value. Configure the CCP module for the PWM mode by loading the CCPxCON register with the appropriate values. Load the CCPRxL register and the DCxBx bits of the CCPxCON register, with the PWM duty cycle value. Configure and start Timer2/4/6: • Select the Timer2/4/6 resource to be used for PWM generation by setting the CxTSEL bits in the CCPTMRSx register. • Clear the TMRxIF interrupt flag bit of the PIRx register. See Note below. • Configure the TxCKPS bits of the TxCON register with the Timer prescale value. • Enable the Timer by setting the TMRxON bit of the TxCON register. Enable PWM output pin: • Wait until the Timer overflows and the TMRxIF bit of the PIRx register is set. See Note below. • Enable the CCPx pin output driver by clearing the associated TRIS bit. Note: 23.3.3 In order to send a complete duty cycle and period on the first PWM output, the above steps must be included in the setup sequence. If it is not critical to start with a complete PWM signal on the first output, then step 6 may be ignored. TIMER2/4/6 TIMER RESOURCE The PWM standard mode makes use of one of the 8-bit Timer2/4/6 timer resources to specify the PWM period. Configuring the CxTSEL bits in the CCPTMRSx register selects which Timer2/4/6 timer is used. 23.3.4 PWM PERIOD The PWM period is specified by the PRx register of Timer2/4/6. The PWM period can be calculated using the formula of Equation 23-1. EQUATION 23-1: PWM PERIOD PWM Period =   PRx  + 1   4  T OSC  When TMRx is equal to PRx, the following three events occur on the next increment cycle: • TMRx is cleared • The CCPx pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) • The PWM duty cycle is latched from CCPRxL into CCPRxH. Note: 23.3.5 The Timer postscaler (see Section 22.1 “Timer2/4/6 Operation”) is not used in the determination of the PWM frequency. PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPRxL register and DCxB bits of the CCPxCON register. The CCPRxL contains the eight MSbs and the DCxB bits of the CCPxCON register contain the two LSbs. CCPRxL and DCxB bits of the CCPxCON register can be written to at any time. The duty cycle value is not latched into CCPRxH until after the period completes (i.e., a match between PRx and TMRx registers occurs). While using the PWM, the CCPRxH register is read-only. Equation 23-2 is used to calculate the PWM pulse width. Equation 23-3 is used to calculate the PWM duty cycle ratio. EQUATION 23-2: PULSE WIDTH Pulse Width =  CCPRxL:CCPxCON   T OSC  (TMRx Prescale Value) EQUATION 23-3: DUTY CYCLE RATIO  CCPRxL:CCPxCON  Duty Cycle Ratio = ----------------------------------------------------------------------4  PRx + 1  The CCPRxH register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMRx register is concatenated with either the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2/4/6 prescaler is set to 1:1. When the 10-bit time base matches the CCPRxH and 2-bit latch, then the CCPx pin is cleared (see Figure 23-4). (TMRx Prescale Value) Note 1: TOSC = 1/FOSC  2011-2012 Microchip Technology Inc. DS41575C-page 197 PIC16(L)F1933 23.3.6 PWM RESOLUTION EQUATION 23-4: The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PRx is 255. The resolution is a function of the PRx register value as shown by Equation 23-4. TABLE 23-5: Timer Prescale PRx Value Maximum Resolution (bits) Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. 1.95 kHz 7.81 kHz 31.25 kHz 125 kHz 250 kHz 333.3 kHz 16 4 1 1 1 1 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6.6 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) PWM Frequency Timer Prescale PRx Value Maximum Resolution (bits) TABLE 23-7: log  4  PRx + 1   Resolution = ------------------------------------------ bits log  2  EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz) PWM Frequency TABLE 23-6: PWM RESOLUTION 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz 16 4 1 1 1 1 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 10 10 10 8 7 6.6 EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) PWM Frequency Timer Prescale PRx Value Maximum Resolution (bits) DS41575C-page 198 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz 16 4 1 1 1 1 0x65 0x65 0x65 0x19 0x0C 0x09 8 8 8 6 5 5  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.3.7 OPERATION IN SLEEP MODE 23.3.10 In Sleep mode, the TMRx register will not increment and the state of the module will not change. If the CCPx pin is driving a value, it will continue to drive that value. When the device wakes up, TMRx will continue from its previous state. 23.3.8 CHANGES IN SYSTEM CLOCK FREQUENCY ALTERNATE PIN LOCATIONS This module incorporates I/O pins that can be moved to other locations with the use of the alternate pin function register, APFCON. To determine which pins can be moved and what their default locations are upon a Reset, see Section 12.1 “Alternate Pin Function” for more information. The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section 5.0 “Oscillator Module (with Fail-Safe Clock Monitor)” for additional details. 23.3.9 EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. TABLE 23-8: Name APFCON SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL Register on Page 114 PxM(1) DCxB CCPTMRS0 C4TSEL C3TSEL C2TSEL C1TSEL 215 CCPTMRS1 — — — — — — C5TSEL 215 CCPxCON CCPxM 214 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 INTCON PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 88 PRx TxCON TMRx TRISA Timer2/4/6 Period Register — 187* TxOUTPS TMRxON TxCKPS1 Timer2/4/6 Module Register TRISA7 TRISA6 189 187 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 199 PIC16(L)F1933 23.4 PWM (Enhanced Mode) To select an Enhanced PWM Output mode, the PxM bits of the CCPxCON register must be configured appropriately. The enhanced PWM function described in this section is available for CCP modules ECCP1, ECCP2 and ECCP3, with any differences between modules noted. The PWM outputs are multiplexed with I/O pins and are designated PxA, PxB, PxC and PxD. The polarity of the PWM pins is configurable and is selected by setting the CCPxM bits in the CCPxCON register appropriately. The enhanced PWM mode generates a Pulse-Width Modulation (PWM) signal on up to four different output pins with up to 10 bits of resolution. The period, duty cycle, and resolution are controlled by the following registers: • • • • Figure 23-5 shows an example of a simplified block diagram of the Enhanced PWM module. Table 23-9 shows the pin assignments for various Enhanced PWM modes. PRx registers TxCON registers CCPRxL registers CCPxCON registers Note 1: The corresponding TRIS bit must be cleared to enable the PWM output on the CCPx pin. The ECCP modules have the following additional PWM registers which control Auto-shutdown, Auto-restart, Dead-band Delay and PWM Steering modes: 2: Clearing the CCPxCON register will relinquish control of the CCPx pin. 3: Any pin not used in the enhanced PWM mode is available for alternate pin functions, if applicable. • CCPxAS registers • PSTRxCON registers • PWMxCON registers 4: To prevent the generation of an incomplete waveform when the PWM is first enabled, the ECCP module waits until the start of a new PWM period before generating a PWM signal. The enhanced PWM module can generate the following five PWM Output modes: • • • • • Single PWM Half-Bridge PWM Full-Bridge PWM, Forward mode Full-Bridge PWM, Reverse mode Single PWM with PWM Steering mode FIGURE 23-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE Duty Cycle Registers DCxB CCPxM 4 PxM 2 CCPRxL CCPx/PxA CCPx/PxA TRISx CCPRxH (Slave) PxB Comparator R Q Output Controller PxB TRISx PxC TMRx Comparator PRx Note 1: (1) PxC TRISx S PxD Clear Timer, toggle PWM pin and latch duty cycle PxD TRISx PWMxCON The 8-bit timer TMRx register is concatenated with the 2-bit internal Q clock, or two bits of the prescaler to create the 10-bit time base. DS41575C-page 200  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 23-9: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES ECCP Mode PxM CCPx/PxA PxB PxC PxD Single 00 Yes(1) Yes(1) Yes(1) Yes(1) Half-Bridge 10 Yes Yes No No Full-Bridge, Forward 01 Yes Yes Yes Yes Full-Bridge, Reverse 11 Yes Yes Yes Yes Note 1: PWM Steering enables outputs in Single mode. FIGURE 23-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) PxM Signal PRX+1 Pulse Width 0 Period 00 (Single Output) PxA Modulated Delay Delay PxA Modulated 10 (Half-Bridge) PxB Modulated PxA Active 01 (Full-Bridge, Forward) PxB Inactive PxC Inactive PxD Modulated PxA Inactive 11 (Full-Bridge, Reverse) PxB Modulated PxC Active PxD Inactive Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL:CCPxCON) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON)  2011-2012 Microchip Technology Inc. DS41575C-page 201 PIC16(L)F1933 FIGURE 23-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) PxM Signal PRx+1 Pulse Width 0 Period 00 (Single Output) PxA Modulated PxA Modulated 10 (Half-Bridge) Delay Delay PxB Modulated PxA Active 01 (Full-Bridge, Forward) PxB Inactive PxC Inactive PxD Modulated PxA Inactive 11 (Full-Bridge, Reverse) PxB Modulated PxC Active PxD Inactive Relationships: • Period = 4 * TOSC * (PRx + 1) * (TMRx Prescale Value) • Pulse Width = TOSC * (CCPRxL:CCPxCON) * (TMRx Prescale Value) • Delay = 4 * TOSC * (PWMxCON) DS41575C-page 202  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.4.1 HALF-BRIDGE MODE In Half-Bridge mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the CCPx/PxA pin, while the complementary PWM output signal is output on the PxB pin (see Figure 23-9). This mode can be used for Half-Bridge applications, as shown in Figure 23-9, or for Full-Bridge applications, where four power switches are being modulated with two PWM signals. In Half-Bridge mode, the programmable dead-band delay can be used to prevent shoot-through current in Half-Bridge power devices. The value of the PDC bits of the PWMxCON register sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 23.4.5 “Programmable Dead-Band Delay Mode” for more details of the dead-band delay operations. Since the PxA and PxB outputs are multiplexed with the PORT data latches, the associated TRIS bits must be cleared to configure PxA and PxB as outputs. FIGURE 23-8: Period Period Pulse Width PxA(2) td td PxB(2) (1) (1) (1) td = Dead-Band Delay Note 1: 2: FIGURE 23-9: EXAMPLE OF HALF-BRIDGE PWM OUTPUT At this time, the TMRx register is equal to the PRx register. Output signals are shown as active-high. EXAMPLE OF HALF-BRIDGE APPLICATIONS Standard Half-Bridge Circuit (“Push-Pull”) FET Driver + PxA Load FET Driver + PxB - Half-Bridge Output Driving a Full-Bridge Circuit V+ FET Driver FET Driver PxA FET Driver Load FET Driver PxB  2011-2012 Microchip Technology Inc. DS41575C-page 203 PIC16(L)F1933 23.4.2 FULL-BRIDGE MODE In Full-Bridge mode, all four pins are used as outputs. An example of Full-Bridge application is shown in Figure 23-10. In the Forward mode, pin CCPx/PxA is driven to its active state, pin PxD is modulated, while PxB and PxC will be driven to their inactive state as shown in Figure 23-11. In the Reverse mode, PxC is driven to its active state, pin PxB is modulated, while PxA and PxD will be driven to their inactive state as shown Figure 23-11. PxA, PxB, PxC and PxD outputs are multiplexed with the PORT data latches. The associated TRIS bits must be cleared to configure the PxA, PxB, PxC and PxD pins as outputs. FIGURE 23-10: EXAMPLE OF FULL-BRIDGE APPLICATION V+ FET Driver QC QA FET Driver PxA Load PxB FET Driver PxC FET Driver QD QB VPxD DS41575C-page 204  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 23-11: EXAMPLE OF FULL-BRIDGE PWM OUTPUT Forward Mode Period PxA (2) Pulse Width PxB(2) PxC(2) PxD(2) (1) (1) Reverse Mode Period Pulse Width PxA(2) PxB(2) PxC(2) PxD(2) (1) Note 1: 2: (1) At this time, the TMRx register is equal to the PRx register. Output signal is shown as active-high.  2011-2012 Microchip Technology Inc. DS41575C-page 205 PIC16(L)F1933 23.4.2.1 Direction Change in Full-Bridge Mode In the Full-Bridge mode, the PxM1 bit in the CCPxCON register allows users to control the forward/reverse direction. When the application firmware changes this direction control bit, the module will change to the new direction on the next PWM cycle. A direction change is initiated in software by changing the PxM1 bit of the CCPxCON register. The following sequence occurs four Timer cycles prior to the end of the current PWM period: • The modulated outputs (PxB and PxD) are placed in their inactive state. • The associated unmodulated outputs (PxA and PxC) are switched to drive in the opposite direction. • PWM modulation resumes at the beginning of the next period. See Figure 23-12 for an illustration of this sequence. The Full-Bridge mode does not provide dead-band delay. As one output is modulated at a time, dead-band delay is generally not required. There is a situation where dead-band delay is required. This situation occurs when both of the following conditions are true: 1. 2. The direction of the PWM output changes when the duty cycle of the output is at or near 100%. The turn off time of the power switch, including the power device and driver circuit, is greater than the turn on time. Figure 23-13 shows an example of the PWM direction changing from forward to reverse, at a near 100% duty cycle. In this example, at time t1, the output PxA and PxD become inactive, while output PxC becomes active. Since the turn-off time of the power devices is longer than the turn-on time, a shoot-through current will flow through power devices QC and QD (see Figure 23-10) for the duration of ‘t’. The same phenomenon will occur to power devices QA and QB for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, two possible solutions for eliminating the shoot-through current are: 1. 2. Reduce PWM duty cycle for one PWM period before changing directions. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. FIGURE 23-12: EXAMPLE OF PWM DIRECTION CHANGE Period(1) Signal Period PxA (Active-High) PxB (Active-High) Pulse Width PxC (Active-High) (2) PxD (Active-High) Pulse Width Note 1: 2: The direction bit PxM1 of the CCPxCON register is written any time during the PWM cycle. When changing directions, the PxA and PxC signals switch before the end of the current PWM cycle. The modulated PxB and PxD signals are inactive at this time. The length of this time is four Timer counts. DS41575C-page 206  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 23-13: EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE Forward Period t1 Reverse Period PxA PxB PW PxC PxD PW TON External Switch C TOFF External Switch D Potential Shoot-Through Current Note 1: T = TOFF – TON All signals are shown as active-high. 2: TON is the turn-on delay of power switch QC and its driver. 3: TOFF is the turn-off delay of power switch QD and its driver.  2011-2012 Microchip Technology Inc. DS41575C-page 207 PIC16(L)F1933 23.4.3 ENHANCED PWM AUTO-SHUTDOWN MODE The PWM mode supports an Auto-Shutdown mode that will disable the PWM outputs when an external shutdown event occurs. Auto-Shutdown mode places the PWM output pins into a predetermined state. This mode is used to help prevent the PWM from damaging the application. Note 1: The auto-shutdown condition is a level-based signal, not an edge-based signal. As long as the level is present, the auto-shutdown will persist. 2: Writing to the CCPxASE bit is disabled while an auto-shutdown condition persists. The auto-shutdown sources are selected using the CCPxAS bits of the CCPxAS register. A shutdown event may be generated by: 3: Once the auto-shutdown condition has been removed and the PWM restarted (either through firmware or auto-restart) the PWM signal will always restart at the beginning of the next PWM period. • A logic ‘0’ on the INT pin • A logic ‘1’ on a Comparator (Cx) output 4: Prior to an auto-shutdown event caused by a comparator output or INT pin event, a software shutdown can be triggered in firmware by setting the CCPxASE bit of the CCPxAS register to ‘1’. The Auto-Restart feature tracks the active status of a shutdown caused by a comparator output or INT pin event only. If it is enabled at this time, it will immediately clear this bit and restart the ECCP module at the beginning of the next PWM period. A shutdown condition is indicated by the CCPxASE (Auto-Shutdown Event Status) bit of the CCPxAS register. If the bit is a ‘0’, the PWM pins are operating normally. If the bit is a ‘1’, the PWM outputs are in the shutdown state. When a shutdown event occurs, two things happen: The CCPxASE bit is set to ‘1’. The CCPxASE will remain set until cleared in firmware or an auto-restart occurs (see Section 23.4.4 “Auto-Restart Mode”). The enabled PWM pins are asynchronously placed in their shutdown states. The PWM output pins are grouped into pairs [PxA/PxC] and [PxB/PxD]. The state of each pin pair is determined by the PSSxAC and PSSxBD bits of the CCPxAS register. Each pin pair may be placed into one of three states: • Drive logic ‘1’ • Drive logic ‘0’ • Tri-state (high-impedance) FIGURE 23-14: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PXRSEN = 0) Missing Pulse (Auto-Shutdown) Timer Overflow Timer Overflow Missing Pulse (CCPxASE not clear) Timer Overflow Timer Overflow Timer Overflow PWM Period PWM Activity Start of PWM Period Shutdown Event CCPxASE bit Shutdown Event Occurs DS41575C-page 208 Shutdown Event Clears PWM Resumes CCPxASE Cleared by Firmware  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.4.4 AUTO-RESTART MODE The Enhanced PWM can be configured to automatically restart the PWM signal once the auto-shutdown condition has been removed. Auto-restart is enabled by setting the PxRSEN bit in the PWMxCON register. If auto-restart is enabled, the CCPxASE bit will remain set as long as the auto-shutdown condition is active. When the auto-shutdown condition is removed, the CCPxASE bit will be cleared via hardware and normal operation will resume. FIGURE 23-15: PWM AUTO-SHUTDOWN WITH AUTO-RESTART (PXRSEN = 1) Missing Pulse (Auto-Shutdown) Timer Overflow Timer Overflow Missing Pulse (CCPxASE not clear) Timer Overflow Timer Overflow Timer Overflow PWM Period PWM Activity Start of PWM Period Shutdown Event CCPxASE bit PWM Resumes Shutdown Event Occurs Shutdown Event Clears  2011-2012 Microchip Technology Inc. CCPxASE Cleared by Hardware DS41575C-page 209 PIC16(L)F1933 23.4.5 PROGRAMMABLE DEAD-BAND DELAY MODE FIGURE 23-16: In half-bridge applications where all power switches are modulated at the PWM frequency, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on, and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shoot-through current) will flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. In Half-Bridge mode, a digitally programmable dead-band delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the non-active state to the active state. See Figure 23-16 for illustration. The lower seven bits of the associated PWMxCON register (Register 23-5) sets the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). FIGURE 23-17: EXAMPLE OF HALF-BRIDGE PWM OUTPUT Period Period Pulse Width PxA(2) td td PxB(2) (1) (1) (1) td = Dead-Band Delay Note 1: 2: At this time, the TMRx register is equal to the PRx register. Output signals are shown as active-high. EXAMPLE OF HALF-BRIDGE APPLICATIONS V+ Standard Half-Bridge Circuit (“Push-Pull”) FET Driver + V - PxA Load FET Driver + V - PxB V- DS41575C-page 210  2011-2012 Microchip Technology Inc. PIC16(L)F1933 23.4.6 PWM STEERING MODE In Single Output mode, PWM steering allows any of the PWM pins to be the modulated signal. Additionally, the same PWM signal can be simultaneously available on multiple pins. Once the Single Output mode is selected (CCPxM = 11 and PxM = 00 of the CCPxCON register), the user firmware can bring out the same PWM signal to one, two, three or four output pins by setting the appropriate STRx bits of the PSTRxCON register, as shown in Table 23-9. The associated TRIS bits must be set to output (‘0’) to enable the pin output driver in order to see the PWM signal on the pin. Note: While the PWM Steering mode is active, CCPxM bits of the CCPxCON register select the PWM output polarity for the Px pins. The PWM auto-shutdown operation also applies to PWM Steering mode as described in Section 23.4.3 “Enhanced PWM Auto-Shutdown mode”. An auto-shutdown event will only affect pins that have PWM outputs enabled. FIGURE 23-18: SIMPLIFIED STEERING BLOCK DIAGRAM STRxA PxA Signal CCPxM1 PORT Data 0 STRxB CCPxM0 PORT Data PORT Data 0 PORT Data PxB pin TRIS PxC pin 1 0 TRIS STRxD CCPxM0 TRIS 1 STRxC CCPxM1 PxA pin 1 PxD pin 1 0 TRIS Note 1: Port outputs are configured as shown when the CCPxCON register bits PxM = 00 and CCPxM = 11. 2: Single PWM output requires setting at least one of the STRx bits.  2011-2012 Microchip Technology Inc. DS41575C-page 211 PIC16(L)F1933 23.4.6.1 Steering Synchronization The STRxSYNC bit of the PSTRxCON register gives the user two selections of when the steering event will happen. When the STRxSYNC bit is ‘0’, the steering event will happen at the end of the instruction that writes to the PSTRxCON register. In this case, the output signal at the Px pins may be an incomplete PWM waveform. This operation is useful when the user firmware needs to immediately remove a PWM signal from the pin. When the STRxSYNC bit is ‘1’, the effective steering update will happen at the beginning of the next PWM period. In this case, steering on/off the PWM output will always produce a complete PWM waveform. Figures 23-19 and 23-20 illustrate the timing diagrams of the PWM steering depending on the STRxSYNC setting. 23.4.7 drivers are enabled. Changing the polarity configuration while the PWM pin output drivers are enable is not recommended since it may result in damage to the application circuits. The PxA, PxB, PxC and PxD output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pin output drivers at the same time as the Enhanced PWM modes may cause damage to the application circuit. The Enhanced PWM modes must be enabled in the proper Output mode and complete a full PWM cycle before enabling the PWM pin output drivers. The completion of a full PWM cycle is indicated by the TMRxIF bit of the PIRx register being set as the second PWM period begins. Note: START-UP CONSIDERATIONS When any PWM mode is used, the application hardware must use the proper external pull-up and/or pull-down resistors on the PWM output pins. When the microcontroller is released from Reset, all of the I/O pins are in the high-impedance state. The external circuits must keep the power switch devices in the Off state until the microcontroller drives the I/O pins with the proper signal levels or activates the PWM output(s). The CCPxM bits of the CCPxCON register allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (PxA/PxC and PxB/PxD). The PWM output polarities must be selected before the PWM pin output FIGURE 23-19: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRxSYNC = 0) PWM Period PWM STRx P1 PORT Data PORT Data P1n = PWM FIGURE 23-20: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION (STRxSYNC = 1) PWM STRx P1 PORT Data PORT Data P1n = PWM DS41575C-page 212  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 23-10: SUMMARY OF REGISTERS ASSOCIATED WITH ENHANCED PWM Name CCPxCON CCPxAS Bit 7 Bit 6 Bit 5 PxM(1) CCPxASE Bit 4 Bit 3 DCxB CCPxAS Bit 2 Bit 1 Bit 0 CCPxM Register on Page 214 PSSxAC PSSxBD 216 CCPTMRS0 C4TSEL C3TSEL C2TSEL C1TSEL 215 CCPTMRS1 — — — — — — C5TSEL 215 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 INTCON 82 PIE3 — CCP5IE CCP4IE CCP3IE TMR6IE — TMR4IE — 85 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 PIR3 — CCP5IF CCP4IF CCP3IF TMR6IF — TMR4IF — 88 — STRxSYNC STRxD STRxC STRxB STRxA PRx Timer2/4/6 Period Register PSTRxCON — PWMxCON PxRSEN TxCON TMRx — 187* PxDC — TxOUTPS 218 217 TMRxON TxCKPS1 Timer2/4/6 Module Register 189 187 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM. Note 1: Applies to ECCP modules only. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 213 PIC16(L)F1933 23.5 CCP Control Register REGISTER 23-1: R/W-00 CCPxCON: CCPx CONTROL REGISTER R/W-0/0 R/W-0/0 (1) PxM R/W-0/0 R/W-0/0 DCxB R/W-0/0 R/W-0/0 R/W-0/0 CCPxM bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 PxM: Enhanced PWM Output Configuration bits(1) Capture mode: Unused Compare mode: Unused If CCPxM = 00, 01, 10: xx = PxA assigned as Capture/Compare input; PxB, PxC, PxD assigned as port pins If CCPxM = 11: 11 = Full-Bridge output reverse; PxB modulated; PxC active; PxA, PxD inactive 10 = Half-Bridge output; PxA, PxB modulated with dead-band control; PxC, PxD assigned as port pins 01 = Full-Bridge output forward; PxD modulated; PxA active; PxB, PxC inactive 00 = Single output; PxA modulated; PxB, PxC, PxD assigned as port pins bit 5-4 DCxB: PWM Duty Cycle Least Significant bits Capture mode: Unused Compare mode: Unused PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL. bit 3-0 CCPxM: ECCPx Mode Select bits 1011 = Compare mode: Special Event Trigger (ECCPx resets Timer, sets CCPxIF bit starts A/D conversion if A/D module is enabled)(1) 1010 = Compare mode: generate software interrupt only; ECCPx pin reverts to I/O state 1001 = Compare mode: initialize ECCPx pin high; clear output on compare match (set CCPxIF) 1000 = Compare mode: initialize ECCPx pin low; set output on compare match (set CCPxIF) 0111 = 0110 = 0101 = 0100 = Capture mode: every 16th rising edge Capture mode: every 4th rising edge Capture mode: every rising edge Capture mode: every falling edge 0011 = Reserved 0010 = Compare mode: toggle output on match 0001 = Reserved 0000 = Capture/Compare/PWM off (resets ECCPx module) CCP4/CCP5 only: 11xx = PWM mode ECCP1/ECCP2/ECCP3 only: 1111 = PWM mode: PxA, PxC active-low; PxB, PxD active-low 1110 = PWM mode: PxA, PxC active-low; PxB, PxD active-high 1101 = PWM mode: PxA, PxC active-high; PxB, PxD active-low 1100 = PWM mode: PxA, PxC active-high; PxB, PxD active-high Note 1: This function is available on the CCP module(s) listed in Table 23-3. DS41575C-page 214  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 23-2: R/W-0/0 CCPTMRS0: PWM TIMER SELECTION CONTROL REGISTER 0 R/W-0/0 R/W-0/0 C4TSEL R/W-0/0 R/W-0/0 C3TSEL R/W-0/0 R/W-0/0 C2TSEL R/W-0/0 C1TSEL bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 C4TSEL: CCP4 Timer Selection 11 = Reserved 10 = CCP4 is based off Timer6 in PWM mode 01 = CCP4 is based off Timer4 in PWM mode 00 = CCP4 is based off Timer2 in PWM mode bit 5-4 C3TSEL: CCP3 Timer Selection 11 = Reserved 10 = CCP3 is based off Timer6 in PWM mode 01 = CCP3 is based off Timer4 in PWM mode 00 = CCP3 is based off Timer2 in PWM mode bit 3-2 C2TSEL: CCP2 Timer Selection 11 = Reserved 10 = CCP2 is based off Timer6 in PWM mode 01 = CCP2 is based off Timer4 in PWM mode 00 = CCP2 is based off Timer2 in PWM mode bit 1-0 C1TSEL: CCP1 Timer Selection 11 = Reserved 10 = CCP1 is based off Timer6 in PWM mode 01 = CCP1 is based off Timer4 in PWM mode 00 = CCP1 is based off Timer2 in PWM mode REGISTER 23-3: CCPTMRS1: PWM TIMER SELECTION CONTROL REGISTER 1 U-0 U-0 U-0 U-0 U-0 U-0 — — — — — — R/W-0/0 bit 7 R/W-0/0 C5TSEL bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-2 Unimplemented: Read as ‘0’ bit 1-0 C5TSEL: CCP5 Timer Selection bits 11 = Reserved 10 = CCP5 is based off Timer6 in PWM mode 01 = CCP5 is based off Timer4 in PWM mode 00 = CCP5 is based off Timer2 in PWM mode  2011-2012 Microchip Technology Inc. DS41575C-page 215 PIC16(L)F1933 REGISTER 23-4: R/W-0/0 CCPxAS: CCPX AUTO-SHUTDOWN CONTROL REGISTER R/W-0/0 CCPxASE R/W-0/0 R/W-0/0 CCPxAS R/W-0/0 R/W-0/0 R/W-0/0 PSSxAC R/W-0/0 PSSxBD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CCPxASE: CCPx Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; CCPx outputs are in shutdown state 0 = CCPx outputs are operating bit 6-4 CCxPAS: CCPx Auto-Shutdown Source Select bits 111 = VIL on INT pin or Comparator C1 or Comparator C2 high(1) 110 = VIL on INT pin or Comparator C2 high(1) 101 = VIL on INT pin or Comparator C1 high(1) 100 = VIL on INT pin 011 = Either Comparator C1 or C2 high(1) 010 = Comparator C2 output high(1) 001 = Comparator C1 output high(1) 000 = Auto-shutdown is disabled bit 3-2 PSSxAC: Pins PxA and PxC Shutdown State Control bits 1x = Pins PxA and PxC tri-state 01 = Drive pins PxA and PxC to ‘1’ 00 = Drive pins PxA and PxC to ‘0’ bit 1-0 PSSxBD: Pins PxB and PxD Shutdown State Control bits 1x = Pins PxB and PxD tri-state 01 = Drive pins PxB and PxD to ‘1’ 00 = Drive pins PxB and PxD to ‘0’ Note 1: If CxSYNC is enabled, the shutdown will be delayed by Timer1. DS41575C-page 216  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 23-5: R/W-0/0 PWMxCON: ENHANCED PWM CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 PxRSEN R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 PxDC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PxRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the CCPxASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, CCPxASE must be cleared in software to restart the PWM bit 6-0 PxDC: PWM Delay Count bits PxDCx = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal should transition active and the actual time it transitions active Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe mode is enabled.  2011-2012 Microchip Technology Inc. DS41575C-page 217 PIC16(L)F1933 PSTRxCON: PWM STEERING CONTROL REGISTER(1) REGISTER 23-6: U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1 — — — STRxSYNC STRxD STRxC STRxB STRxA bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4 STRxSYNC: Steering Sync bit 1 = Output steering update occurs on next PWM period 0 = Output steering update occurs at the beginning of the instruction cycle boundary bit 3 STRxD: Steering Enable bit D 1 = PxD pin has the PWM waveform with polarity control from CCPxM 0 = PxD pin is assigned to port pin bit 2 STRxC: Steering Enable bit C 1 = PxC pin has the PWM waveform with polarity control from CCPxM 0 = PxC pin is assigned to port pin bit 1 STRxB: Steering Enable bit B 1 = PxB pin has the PWM waveform with polarity control from CCPxM 0 = PxB pin is assigned to port pin bit 0 STRxA: Steering Enable bit A 1 = PxA pin has the PWM waveform with polarity control from CCPxM 0 = PxA pin is assigned to port pin Note 1: The PWM Steering mode is available only when the CCPxCON register bits CCPxM = 11 and PxM = 00. DS41575C-page 218  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.0 MASTER SYNCHRONOUS SERIAL PORT MODULE 24.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C™) The SPI interface supports the following modes and features: • • • • • Master mode Slave mode Clock Parity Slave Select Synchronization (Slave mode only) Daisy-chain connection of slave devices Figure 24-1 is a block diagram of the SPI Interface module. FIGURE 24-1: MSSP BLOCK DIAGRAM (SPI MODE) Data Bus Read Write SSPBUF Reg SDI SSPSR Reg SDO bit 0 SS SS Control Enable Shift Clock 2 (CKP, CKE) Clock Select Edge Select SSPM 4 SCK Edge Select TRIS bit  2011-2012 Microchip Technology Inc. ( TMR22Output ) Prescaler TOSC 4, 16, 64 Baud Rate Generator (SSPADD) DS41575C-page 219 PIC16(L)F1933 The I2C interface supports the following modes and features: • • • • • • • • • • • • • Master mode Slave mode Byte NACKing (Slave mode) Limited Multi-master support 7-bit and 10-bit addressing Start and Stop interrupts Interrupt masking Clock stretching Bus collision detection General call address matching Address masking Address Hold and Data Hold modes Selectable SDA hold times Figure 24-2 is a block diagram of the I2C Interface module in Master mode. Figure 24-3 is a diagram of the I2C Interface module in Slave mode. MSSP BLOCK DIAGRAM (I2C™ MASTER MODE) Internal Data Bus Read [SSPM 3:0] Write SSPBUF Shift Clock SDA in Receive Enable (RCEN) SCL SCL in Bus Collision DS41575C-page 220 LSb Start bit, Stop bit, Acknowledge Generate (SSPCON2) Start bit detect, Stop bit detect Write collision detect Clock arbitration State counter for end of XMIT/RCV Address Match detect Clock Cntl SSPSR MSb (Hold off clock source) SDA Baud Rate Generator (SSPADD) Clock arbitrate/BCOL detect FIGURE 24-2: Set/Reset: S, P, SSPSTAT, WCOL, SSPOV Reset SEN, PEN (SSPCON2) Set SSPIF, BCLIF  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-3: MSSP BLOCK DIAGRAM (I2C™ SLAVE MODE) Internal Data Bus Read Write SSPBUF Reg SCL Shift Clock SSPSR Reg SDA MSb LSb SSPMSK Reg Match Detect Addr Match SSPADD Reg Start and Stop bit Detect  2011-2012 Microchip Technology Inc. Set, Reset S, P bits (SSPSTAT Reg) DS41575C-page 221 PIC16(L)F1933 24.2 SPI Mode Overview The Serial Peripheral Interface (SPI) bus is a synchronous serial data communication bus that operates in Full-Duplex mode. Devices communicate in a master/slave environment where the master device initiates the communication. A slave device is controlled through a Chip Select known as Slave Select. The SPI bus specifies four signal connections: • • • • Serial Clock (SCK) Serial Data Out (SDO) Serial Data In (SDI) Slave Select (SS) Figure 24-1 shows the block diagram of the MSSP module when operating in SPI Mode. The SPI bus operates with a single master device and one or more slave devices. When multiple slave devices are used, an independent Slave Select connection is required from the master device to each slave device. Figure 24-4 shows a typical connection between a master device and multiple slave devices. The master selects only one slave at a time. Most slave devices have tri-state outputs so their output signal appears disconnected from the bus when they are not selected. Transmissions involve two shift registers, eight bits in size, one in the master and one in the slave. With either the master or the slave device, data is always shifted out one bit at a time, with the Most Significant bit (MSb) shifted out first. At the same time, a new Least Significant bit (LSb) is shifted into the same register. During each SPI clock cycle, a full-duplex data transmission occurs. This means that while the master device is sending out the MSb from its shift register (on its SDO pin) and the slave device is reading this bit and saving it as the LSb of its shift register, that the slave device is also sending out the MSb from its shift register (on its SDO pin) and the master device is reading this bit and saving it as the LSb of its shift register. After eight bits have been shifted out, the master and slave have exchanged register values. If there is more data to exchange, the shift registers are loaded with new data and the process repeats itself. Whether the data is meaningful or not (dummy data), depends on the application software. This leads to three scenarios for data transmission: • Master sends useful data and slave sends dummy data. • Master sends useful data and slave sends useful data. • Master sends dummy data and slave sends useful data. Transmissions may involve any number of clock cycles. When there is no more data to be transmitted, the master stops sending the clock signal and it deselects the slave. Every slave device connected to the bus that has not been selected through its slave select line must disregard the clock and transmission signals and must not transmit out any data of its own. Figure 24-5 shows a typical connection between two processors configured as master and slave devices. Data is shifted out of both shift registers on the programmed clock edge and latched on the opposite edge of the clock. The master device transmits information out on its SDO output pin which is connected to, and received by, the slave’s SDI input pin. The slave device transmits information out on its SDO output pin, which is connected to, and received by, the master’s SDI input pin. To begin communication, the master device first sends out the clock signal. Both the master and the slave devices should be configured for the same clock polarity. The master device starts a transmission by sending out the MSb from its shift register. The slave device reads this bit from that same line and saves it into the LSb position of its shift register. DS41575C-page 222  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION SPI Master SCK SCK SDO SDI SDI SDO General I/O General I/O SS General I/O SCK SDI SDO SPI Slave #1 SPI Slave #2 SS SCK SDI SDO SPI Slave #3 SS 24.2.1 SPI MODE REGISTERS The MSSP module has five registers for SPI mode operation. These are: • • • • • • MSSP STATUS register (SSPSTAT) MSSP Control register 1 (SSPCON1) MSSP Control register 3 (SSPCON3) MSSP Data Buffer register (SSPBUF) MSSP Address register (SSPADD) MSSP Shift register (SSPSR) (Not directly accessible) SSPCON1 and SSPSTAT are the control and STATUS registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower six bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. In one SPI master mode, SSPADD can be loaded with a value used in the Baud Rate Generator. More information on the Baud Rate Generator is available in Section 24.7 “Baud Rate Generator”. SSPSR is the shift register used for shifting data in and out. SSPBUF provides indirect access to the SSPSR register. SSPBUF is the buffer register to which data bytes are written, and from which data bytes are read. In receive operations, SSPSR and SSPBUF together create a buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not buffered. A write to SSPBUF will write to both SSPBUF and SSPSR.  2011-2012 Microchip Technology Inc. DS41575C-page 223 PIC16(L)F1933 24.2.2 SPI MODE OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1 and SSPSTAT). These control bits allow the following to be specified: • • • • Master mode (SCK is the clock output) Slave mode (SCK is the clock input) Clock Polarity (Idle state of SCK) Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) To enable the serial port, SSP Enable bit, SSPEN of the SSPCON1 register, must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, re-initialize the SSPCONx registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI must have corresponding TRIS bit set • SDO must have corresponding TRIS bit cleared • SCK (Master mode) must have corresponding TRIS bit cleared • SCK (Slave mode) must have corresponding TRIS bit set • SS must have corresponding TRIS bit set The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the eight bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full Detect bit, BF of the SSPSTAT register, and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit WCOL of the SSPCON1 register, will be set. User software must clear the WCOL bit to allow the following write(s) to the SSPBUF register to complete successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF of the SSPSTAT register, indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the SSPSTAT register indicates the various Status conditions. Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. FIGURE 24-5: SPI MASTER/SLAVE CONNECTION SPI Master SSPM = 00xx SPI Slave SSPM = 010x SDI = 1010 SDO Serial Input Buffer (BUF) LSb SCK General I/O Processor 1 DS41575C-page 224 SDO SDI Shift Register (SSPSR) MSb Serial Input Buffer (SSPBUF) Serial Clock Slave Select (optional) Shift Register (SSPSR) MSb LSb SCK SS Processor 2  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.2.3 SPI MASTER MODE The master can initiate the data transfer at any time because it controls the SCK line. The master determines when the slave (Processor 2, Figure 24-5) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and Status bits appropriately set). The clock polarity is selected by appropriately programming the CKP bit of the SSPCON1 register and the CKE bit of the SSPSTAT register. This then, would give waveforms for SPI communication as shown in Figure 24-6, Figure 24-8, Figure 24-9 and Figure 24-10, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • • • • • FOSC/4 (or TCY) FOSC/16 (or 4 * TCY) FOSC/64 (or 16 * TCY) Timer2 output/2 Fosc/(4 * (SSPADD + 1)) Figure 24-6 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 24-6: SPI MODE WAVEFORM (MASTER MODE) Write to SSPBUF SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) 4 Clock Modes SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) SDO (CKE = 0) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDO (CKE = 1) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDI (SMP = 0) bit 0 bit 7 Input Sample (SMP = 0) SDI (SMP = 1) bit 7 bit 0 Input Sample (SMP = 1) SSPIF SSPSR to SSPBUF  2011-2012 Microchip Technology Inc. DS41575C-page 225 PIC16(L)F1933 24.2.4 SPI SLAVE MODE In Slave mode, the data is transmitted and received as external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit of the SSPCON1 register. While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the Electrical Specifications. While in Sleep mode, the slave can transmit/receive data. The shift register is clocked from the SCK pin input and when a byte is received, the device will generate an interrupt. If enabled, the device will wake-up from Sleep. 24.2.4.1 Daisy-Chain Configuration The SPI bus can sometimes be connected in a daisy-chain configuration. The first slave output is connected to the second slave input, the second slave output is connected to the third slave input, and so on. The final slave output is connected to the master input. Each slave sends out, during a second group of clock pulses, an exact copy of what was received during the first group of clock pulses. The whole chain acts as one large communication shift register. The daisy-chain feature only requires a single Slave Select line from the master device. Figure 24-7 shows the block diagram of a typical daisy-chain connection when operating in SPI mode. In a daisy-chain configuration, only the most recent byte on the bus is required by the slave. Setting the BOEN bit of the SSPCON3 register will enable writes to the SSPBUF register, even if the previous byte has not been read. This allows the software to ignore data that may not apply to it. 24.2.5 SLAVE SELECT SYNCHRONIZATION The Slave Select can also be used to synchronize communication. The Slave Select line is held high until the master device is ready to communicate. When the Slave Select line is pulled low, the slave knows that a new transmission is starting. If the slave fails to receive the communication properly, it will be reset at the end of the transmission, when the Slave Select line returns to a high state. The slave is then ready to receive a new transmission when the Slave Select line is pulled low again. If the Slave Select line is not used, there is a risk that the slave will eventually become out of sync with the master. If the slave misses a bit, it will always be one bit off in future transmissions. Use of the Slave Select line allows the slave and master to align themselves at the beginning of each transmission. The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1 = 0100). When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the application. Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON1 = 0100), the SPI module will reset if the SS pin is set to VDD. 2: When the SPI is used in Slave mode with CKE set; the user must enable SS pin control. 3: While operated in SPI Slave mode the SMP bit of the SSPSTAT register must remain clear. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. DS41575C-page 226  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-7: SPI DAISY-CHAIN CONNECTION SPI Master SCK SCK SDO SDI SDI SPI Slave #1 SDO General I/O SS SCK SDI SPI Slave #2 SDO SS SCK SDI SPI Slave #3 SDO SS FIGURE 24-8: SLAVE SELECT SYNCHRONOUS WAVEFORM SS SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) Write to SSPBUF Shift register SSPSR and bit count are reset SSPBUF to SSPSR SDO bit 7 bit 6 bit 7 SDI bit 6 bit 0 bit 0 bit 7 bit 7 Input Sample SSPIF Interrupt Flag SSPSR to SSPBUF  2011-2012 Microchip Technology Inc. DS41575C-page 227 PIC16(L)F1933 FIGURE 24-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) SS Optional SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) Write to SSPBUF Valid SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDI bit 0 bit 7 Input Sample SSPIF Interrupt Flag SSPSR to SSPBUF Write Collision detection active FIGURE 24-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SS Not Optional SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) Write to SSPBUF Valid SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDI bit 7 bit 0 Input Sample SSPIF Interrupt Flag SSPSR to SSPBUF Write Collision detection active DS41575C-page 228  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.2.6 SPI OPERATION IN SLEEP MODE In SPI Master mode, module clocks may be operating at a different speed than when in Full-Power mode; in the case of the Sleep mode, all clocks are halted. Special care must be taken by the user when the MSSP clock is much faster than the system clock. In Slave mode, when MSSP interrupts are enabled, after the master completes sending data, an MSSP interrupt will wake the controller from Sleep. If an exit from Sleep mode is not desired, MSSP interrupts should be disabled. TABLE 24-1: In SPI Master mode, when the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the device wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in Sleep mode and data to be shifted into the SPI Transmit/Receive Shift register. When all eight bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 117 APFCON — CCP3SEL T1GSEL P2BSEL SRNQSEL C2OUTSEL SSSEL CCP2SEL 114 Name GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF INTCON SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register SSPCON1 WCOL SSPOV SSPEN CKP SSPCON3 ACKTIM PCIE SCIE BOEN SSPSTAT TRISA TRISC Legend: * 86 223* SSPM SDAHT SBCDE AHEN 268 DHEN 271 SMP CKE D/A P S R/W UA BF 267 TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISB2 TRISC1 TRISC0 125 — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode. Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 229 PIC16(L)F1933 24.3 I2C Mode Overview The Inter-Integrated Circuit Bus (I2C) is a multi-master serial data communication bus. Devices communicate in a master/slave environment where the master devices initiate the communication. A slave device is controlled through addressing. VDD SCL The I2C bus specifies two signal connections: • Serial Clock (SCL) • Serial Data (SDA) Figure 24-2 and Figure 24-3 show the block diagram of the MSSP module when operating in I2C mode. Both the SCL and SDA connections are bidirectional open-drain lines, each requiring pull-up resistors for the supply voltage. Pulling the line to ground is considered a logical zero and letting the line float is considered a logical one. Figure 24-11 shows a typical connection between two processors configured as master and slave devices. The I2C bus can operate with one or more master devices and one or more slave devices. There are four potential modes of operation for a given device: • Master Transmit mode (master is transmitting data to a slave) • Master Receive mode (master is receiving data from a slave) • Slave Transmit mode (slave is transmitting data to a master) • Slave Receive mode (slave is receiving data from the master) To begin communication, a master device starts out in Master Transmit mode. The master device sends out a Start bit followed by the address byte of the slave it intends to communicate with. This is followed by a single Read/Write bit, which determines whether the master intends to transmit to or receive data from the slave device. If the requested slave exists on the bus, it will respond with an Acknowledge bit, otherwise known as an ACK. The master then continues in either Transmit mode or Receive mode and the slave continues in the complement, either in Receive mode or Transmit mode, respectively. A Start bit is indicated by a high-to-low transition of the SDA line while the SCL line is held high. Address and data bytes are sent out, Most Significant bit (MSb) first. The Read/Write bit is sent out as a logical one when the master intends to read data from the slave, and is sent out as a logical zero when it intends to write data to the slave. DS41575C-page 230 I2C MASTER/SLAVE CONNECTION FIGURE 24-11: SCL VDD Master Slave SDA SDA The Acknowledge bit (ACK) is an active-low signal, which holds the SDA line low to indicate to the transmitter that the slave device has received the transmitted data and is ready to receive more. The transition of a data bit is always performed while the SCL line is held low. Transitions that occur while the SCL line is held high are used to indicate Start and Stop bits. If the master intends to write to the slave, then it repeatedly sends out a byte of data, with the slave responding after each byte with an ACK bit. In this example, the master device is in Master Transmit mode and the slave is in Slave Receive mode. If the master intends to read from the slave, then it repeatedly receives a byte of data from the slave, and responds after each byte with an ACK bit. In this example, the master device is in Master Receive mode and the slave is Slave Transmit mode. On the last byte of data communicated, the master device may end the transmission by sending a Stop bit. If the master device is in Receive mode, it sends the Stop bit in place of the last ACK bit. A Stop bit is indicated by a low-to-high transition of the SDA line while the SCL line is held high. In some cases, the master may want to maintain control of the bus and re-initiate another transmission. If so, the master device may send another Start bit in place of the Stop bit or last ACK bit when it is in receive mode. The I2C bus specifies three message protocols; • Single message where a master writes data to a slave. • Single message where a master reads data from a slave. • Combined message where a master initiates a minimum of two writes, or two reads, or a combination of writes and reads, to one or more slaves.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 When one device is transmitting a logical one, or letting the line float, and a second device is transmitting a logical zero, or holding the line low, the first device can detect that the line is not a logical one. This detection, when used on the SCL line, is called clock stretching. Clock stretching gives slave devices a mechanism to control the flow of data. When this detection is used on the SDA line, it is called arbitration. Arbitration ensures that there is only one master device communicating at any single time. Slave Transmit mode can also be arbitrated, when a master addresses multiple slaves, but this is less common. 24.3.1 Arbitration usually occurs very rarely, but it is a necessary process for proper multi-master support. CLOCK STRETCHING When a slave device has not completed processing data, it can delay the transfer of more data through the process of clock stretching. An addressed slave device may hold the SCL clock line low after receiving or sending a bit, indicating that it is not yet ready to continue. The master that is communicating with the slave will attempt to raise the SCL line in order to transfer the next bit, but will detect that the clock line has not yet been released. Because the SCL connection is open-drain, the slave has the ability to hold that line low until it is ready to continue communicating. Clock stretching allows receivers that cannot keep up with a transmitter to control the flow of incoming data. 24.3.2 ARBITRATION Each master device must monitor the bus for Start and Stop bits. If the device detects that the bus is busy, it cannot begin a new message until the bus returns to an Idle state. However, two master devices may try to initiate a transmission on or about the same time. When this occurs, the process of arbitration begins. Each transmitter checks the level of the SDA data line and compares it to the level that it expects to find. The first transmitter to observe that the two levels do not match, loses arbitration, and must stop transmitting on the SDA line. For example, if one transmitter holds the SDA line to a logical one (lets it float) and a second transmitter holds it to a logical zero (pulls it low), the result is that the SDA line will be low. The first transmitter then observes that the level of the line is different than expected and concludes that another transmitter is communicating. The first transmitter to notice this difference is the one that loses arbitration and must stop driving the SDA line. If this transmitter is also a master device, it also must stop driving the SCL line. It then can monitor the lines for a Stop condition before trying to reissue its transmission. In the meantime, the other device that has not noticed any difference between the expected and actual levels on the SDA line continues with its original transmission. It can do so without any complications, because so far, the transmission appears exactly as expected with no other transmitter disturbing the message.  2011-2012 Microchip Technology Inc. If two master devices are sending a message to two different slave devices at the address stage, the master sending the lower slave address always wins arbitration. When two master devices send messages to the same slave address, and addresses can sometimes refer to multiple slaves, the arbitration process must continue into the data stage. 24.4 I2C™ Mode Operation All MSSP I2C communication is byte oriented and shifted out MSb first. Six SFR registers and two interrupt flags interface the module with the PIC® microcontroller and user software. Two pins, SDA and SCL, are exercised by the module to communicate with other external I2C devices. 24.4.1 BYTE FORMAT All communication in I2C is done in 9-bit segments. A byte is sent from a master to a slave or vice-versa, followed by an Acknowledge bit sent back. After the 8th falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and reads in an acknowledge value on the next clock pulse. The clock signal, SCL, is provided by the master. Data is valid to change while the SCL signal is low, and sampled on the rising edge of the clock. Changes on the SDA line while the SCL line is high define special conditions on the bus, explained below. 24.4.2 DEFINITION OF I2C TERMINOLOGY There is language and terminology in the description of I2C communication that have definitions specific to I2C. That word usage is defined below and may be used in the rest of this document without explanation. This table was adapted from the Philips I2C specification. 24.4.3 SDA AND SCL PINS Selection of any I2C mode with the SSPEN bit set, forces the SCL and SDA pins to be open-drain. These pins should be set by the user to inputs by setting the appropriate TRIS bits. Note: Data is tied to output zero when an I2C mode is enabled. 24.4.4 SDA HOLD TIME The hold time of the SDA pin is selected by the SDAHT bit of the SSPCON3 register. Hold time is the time SDA is held valid after the falling edge of SCL. Setting the SDAHT bit selects a longer 300 ns minimum hold time and may help on buses with large capacitance. DS41575C-page 231 PIC16(L)F1933 TABLE 24-2: I2C BUS TERMS TERM Transmitter Description The device which shifts data out onto the bus. Receiver The device which shifts data in from the bus. Master The device that initiates a transfer, generates clock signals and terminates a transfer. Slave The device addressed by the master. Multi-master A bus with more than one device that can initiate data transfers. Arbitration Procedure to ensure that only one master at a time controls the bus. Winning arbitration ensures that the message is not corrupted. Synchronization Procedure to synchronize the clocks of two or more devices on the bus. Idle No master is controlling the bus, and both SDA and SCL lines are high. Active Any time one or more master devices are controlling the bus. Addressed Slave device that has received a Slave matching address and is actively being clocked by a master. Matching Address byte that is clocked into a Address slave that matches the value stored in SSPADD. Write Request Slave receives a matching address with R/W bit clear, and is ready to clock in data. Read Request Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of the Slave. This data is the next and all following bytes until a Restart or Stop. Clock Stretching When a device on the bus hold SCL low to stall communication. Bus Collision Any time the SDA line is sampled low by the module while it is outputting and expected high state. DS41575C-page 232 24.4.5 START CONDITION 2 The I C specification defines a Start condition as a transition of SDA from a high to a low state while SCL line is high. A Start condition is always generated by the master and signifies the transition of the bus from an Idle to an Active state. Figure 24-12 shows wave forms for Start and Stop conditions. A bus collision can occur on a Start condition if the module samples the SDA line low before asserting it low. This does not conform to the I2C specification that states no bus collision can occur on a Start. 24.4.6 STOP CONDITION A Stop condition is a transition of the SDA line from low-to-high state while the SCL line is high. Note: At least one SCL low time must appear before a Stop is valid, therefore, if the SDA line goes low then high again while the SCL line stays high, only the Start condition is detected. 24.4.7 RESTART CONDITION A Restart is valid any time that a Stop would be valid. A master can issue a Restart if it wishes to hold the bus after terminating the current transfer. A Restart has the same effect on the slave that a Start would, resetting all slave logic and preparing it to clock in an address. The master may want to address the same or another slave. Figure 24-13 shows the wave form for a Restart condition. In 10-bit Addressing Slave mode a Restart is required for the master to clock data out of the addressed slave. Once a slave has been fully addressed, matching both high and low address bytes, the master can issue a Restart and the high address byte with the R/W bit set. The slave logic will then hold the clock and prepare to clock out data. After a full match with R/W clear in 10-bit mode, a prior match flag is set and maintained. Until a Stop condition, a high address with R/W clear, or high address match fails. 24.4.8 START/STOP CONDITION INTERRUPT MASKING The SCIE and PCIE bits of the SSPCON3 register can enable the generation of an interrupt in Slave modes that do not typically support this function. Slave modes where interrupt on Start and Stop detect are already enabled, these bits will have no effect.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-12: I2C START AND STOP CONDITIONS SDA SCL S Start P Change of Change of Data Allowed Data Allowed Condition FIGURE 24-13: Stop Condition I2C RESTART CONDITION Sr Change of Change of Data Allowed Restart Data Allowed Condition  2011-2012 Microchip Technology Inc. DS41575C-page 233 PIC16(L)F1933 24.4.9 ACKNOWLEDGE SEQUENCE The 9th SCL pulse for any transferred byte in I2C is dedicated as an Acknowledge. It allows receiving devices to respond back to the transmitter by pulling the SDA line low. The transmitter must release control of the line during this time to shift in the response. The Acknowledge (ACK) is an active-low signal, pulling the SDA line low indicated to the transmitter that the device has received the transmitted data and is ready to receive more. The result of an ACK is placed in the ACKSTAT bit of the SSPCON2 register. Slave software, when the AHEN and DHEN bits are set, allow the user to set the ACK value sent back to the transmitter. The ACKDT bit of the SSPCON2 register is set/cleared to determine the response. Slave hardware will generate an ACK response if the AHEN and DHEN bits of the SSPCON3 register are clear. There are certain conditions where an ACK will not be sent by the slave. If the BF bit of the SSPSTAT register or the SSPOV bit of the SSPCON1 register are set when a byte is received. When the module is addressed, after the 8th falling edge of SCL on the bus, the ACKTIM bit of the SSPCON3 register is set. The ACKTIM bit indicates the acknowledge time of the active bus. The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is enabled. 24.5 I2C Slave Mode Operation The MSSP Slave mode operates in one of four modes selected in the SSPM bits of SSPCON1 register. The modes can be divided into 7-bit and 10-bit Addressing mode. 10-bit Addressing modes operate the same as 7-bit with some additional overhead for handling the larger addresses. Modes with Start and Stop bit interrupts operated the same as the other modes with SSPIF additionally getting set upon detection of a Start, Restart, or Stop condition. 24.5.1 SLAVE MODE ADDRESSES The SSPADD register (Register 24-6) contains the Slave mode address. The first byte received after a Start or Restart condition is compared against the value stored in this register. If the byte matches, the value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the module goes Idle and no indication is given to the software that anything happened. The SSP Mask register (Register 24-5) affects the address matching process. See Section 24.5.9 “SSP Mask Register” for more information. 24.5.1.1 I2C Slave 7-bit Addressing Mode In 7-bit Addressing mode, the LSb of the received data byte is ignored when determining if there is an address match. 24.5.1.2 I2C Slave 10-bit Addressing Mode In 10-bit Addressing mode, the first received byte is compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9 and A8 are the two MSb of the 10-bit address and stored in bits 2 and 1 of the SSPADD register. After the acknowledge of the high byte the UA bit is set and SCL is held low until the user updates SSPADD with the low address. The low address byte is clocked in and all eight bits are compared to the low address value in SSPADD. Even if there is not an address match; SSPIF and UA are set, and SCL is held low until SSPADD is updated to receive a high byte again. When SSPADD is updated the UA bit is cleared. This ensures the module is ready to receive the high address byte on the next communication. A high and low address match as a write request is required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a Restart once the slave is addressed, and clocking in the high address with the R/W bit set. The slave hardware will then acknowledge the read request and prepare to clock out data. This is only valid for a slave after it has received a complete high and low address byte match. DS41575C-page 234  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.5.2 SLAVE RECEPTION When the R/W bit of a matching received address byte is clear, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and acknowledged. When the overflow condition exists for a received address, then not Acknowledge is given. An overflow condition is defined as either bit BF bit of the SSPSTAT register is set, or bit SSPOV bit of the SSPCON1 register is set. The BOEN bit of the SSPCON3 register modifies this operation. For more information see Register 24-4. An MSSP interrupt is generated for each transferred data byte. Flag bit, SSPIF, must be cleared by software. When the SEN bit of the SSPCON2 register is set, SCL will be held low (clock stretch) following each received byte. The clock must be released by setting the CKP bit of the SSPCON1 register, except sometimes in 10-bit mode. See Section 24.2.3 “SPI Master Mode” for more detail. 24.5.2.1 7-bit Addressing Reception This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 7-bit Addressing mode. All decisions made by hardware or software and their effect on reception. Figure 24-14 and Figure 24-15 is used as a visual reference for this description. This is a step by step process of what typically must be done to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Start bit detected. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. Matching address with R/W bit clear is received. The slave pulls SDA low sending an ACK to the master, and sets SSPIF bit. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. If SEN = 1; Slave software sets CKP bit to release the SCL line. The master clocks out a data byte. Slave drives SDA low sending an ACK to the master, and sets SSPIF bit. Software clears SSPIF. Software reads the received byte from SSPBUF clearing BF. Steps 8-12 are repeated for all received bytes from the Master. Master sends Stop condition, setting P bit of SSPSTAT, and the bus goes Idle.  2011-2012 Microchip Technology Inc. 24.5.2.2 7-bit Reception with AHEN and DHEN Slave device reception with AHEN and DHEN set operate the same as without these options with extra interrupts and clock stretching added after the 8th falling edge of SCL. These additional interrupts allow the slave software to decide whether it wants to ACK the receive address or data byte, rather than the hardware. This functionality adds support for PMBus™ that was not present on previous versions of this module. This list describes the steps that need to be taken by slave software to use these options for I2C communication. Figure 24-16 displays a module using both address and data holding. Figure 24-17 includes the operation with the SEN bit of the SSPCON2 register set. 1. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 2. Matching address with R/W bit clear is clocked in. SSPIF is set and CKP cleared after the 8th falling edge of SCL. 3. Slave clears the SSPIF. 4. Slave can look at the ACKTIM bit of the SSPCON3 register to determine if the SSPIF was after or before the ACK. 5. Slave reads the address value from SSPBUF, clearing the BF flag. 6. Slave sets ACK value clocked out to the master by setting ACKDT. 7. Slave releases the clock by setting CKP. 8. SSPIF is set after an ACK, not after a NACK. 9. If SEN = 1 the slave hardware will stretch the clock after the ACK. 10. Slave clears SSPIF. Note: SSPIF is still set after the 9th falling edge of SCL even if there is no clock stretching and BF has been cleared. Only if NACK is sent to master is SSPIF not set 11. SSPIF set and CKP cleared after 8th falling edge of SCL for a received data byte. 12. Slave looks at ACKTIM bit of SSPCON3 to determine the source of the interrupt. 13. Slave reads the received data from SSPBUF clearing BF. 14. Steps 7-14 are the same for each received data byte. 15. Communication is ended by either the slave sending an ACK = 1, or the master sending a Stop condition. If a Stop is sent and Interrupt-on-Stop Detect is disabled, the slave will only know by polling the P bit of the SSTSTAT register. DS41575C-page 235 DS41575C-page 236 SSPOV BF SSPIF S 1 A7 2 A6 3 A5 4 A4 5 A3 6 A2 7 A1 8 9 ACK 1 D7 2 D6 4 D4 5 D3 6 D2 7 D1 SSPBUF is read Cleared by software 3 D5 Receiving Data 8 9 2 D6 First byte of data is available in SSPBUF 1 D0 ACK D7 4 D4 5 D3 6 D2 7 D1 SSPOV set because SSPBUF is still full. ACK is not sent. Cleared by software 3 D5 Receiving Data From Slave to Master 8 D0 9 P SSPIF set on 9th falling edge of SCL ACK = 1 FIGURE 24-14: SCL SDA Receiving Address Bus Master sends Stop condition PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. CKP SSPOV BF SSPIF 1 SCL S A7 2 A6 3 A5 4 A4 5 A3 6 A2 7 A1 8 9 R/W=0 ACK SEN 2 D6 3 D5 4 D4 5 D3 6 D2 7 D1 8 D0 CKP is written to ‘1’ in software, releasing SCL SSPBUF is read Cleared by software Clock is held low until CKP is set to ‘1’ 1 D7 Receive Data 9 ACK SEN 3 D5 4 D4 5 D3 First byte of data is available in SSPBUF 6 D2 7 D1 SSPOV set because SSPBUF is still full. ACK is not sent. Cleared by software 2 D6 CKP is written to 1 in software, releasing SCL 1 D7 Receive Data 8 D0 9 ACK SCL is not held low because ACK= 1 SSPIF set on 9th falling edge of SCL P FIGURE 24-15: SDA Receive Address Bus Master sends Stop condition PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) DS41575C-page 237 DS41575C-page 238 P S ACKTIM CKP ACKDT BF SSPIF S Receiving Address 1 3 5 6 7 8 ACK the received byte Slave software clears ACKDT to Address is read from SSBUF If AHEN = 1: SSPIF is set 4 ACKTIM set by hardware on 8th falling edge of SCL When AHEN=1: CKP is cleared by hardware and SCL is stretched 2 A7 A6 A5 A4 A3 A2 A1 Receiving Data 9 2 3 4 5 6 7 ACKTIM cleared by hardware in 9th rising edge of SCL When DHEN=1: CKP is cleared by hardware on 8th falling edge of SCL SSPIF is set on 9th falling edge of SCL, after ACK 1 8 ACK D7 D6 D5 D4 D3 D2 D1 D0 Received Data 1 2 4 5 6 ACKTIM set by hardware on 8th falling edge of SCL CKP set by software, SCL is released 8 Slave software sets ACKDT to not ACK 7 Cleared by software 3 D7 D6 D5 D4 D3 D2 D1 D0 Data is read from SSPBUF 9 ACK 9 P No interrupt after not ACK from Slave ACK=1 Master sends Stop condition FIGURE 24-16: SCL SDA Master Releases SDA to slave for ACK sequence PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. P S ACKTIM CKP ACKDT BF SSPIF S Receiving Address 4 5 6 7 8 When AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared Slave software clears ACKDT to ACK the received byte Received address is loaded into SSPBUF 2 3 ACKTIM is set by hardware on 8th falling edge of SCL 1 A7 A6 A5 A4 A3 A2 A1 9 ACK Receive Data 2 3 4 5 6 7 8 ACKTIM is cleared by hardware on 9th rising edge of SCL When DHEN = 1; on the 8th falling edge of SCL of a received data byte, CKP is cleared Received data is available on SSPBUF Cleared by software 1 D7 D6 D5 D4 D3 D2 D1 D0 9 ACK Receive Data 1 3 4 5 6 7 8 Set by software, release SCL Slave sends not ACK SSPBUF can be read any time before next byte is loaded 2 D7 D6 D5 D4 D3 D2 D1 D0 9 ACK CKP is not cleared if not ACK No interrupt after if not ACK from Slave P Master sends Stop condition FIGURE 24-17: SCL SDA R/W = 0 Master releases SDA to slave for ACK sequence PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1) DS41575C-page 239 PIC16(L)F1933 24.5.3 SLAVE TRANSMISSION 24.5.3.2 7-bit Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register, and an ACK pulse is sent by the slave on the ninth bit. A master device can transmit a read request to a slave, and then clock data out of the slave. The list below outlines what software for a slave will need to do to accomplish a standard transmission. Figure 24-18 can be used as a reference to this list. Following the ACK, slave hardware clears the CKP bit and the SCL pin is held low (see Section 24.5.6 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. 1. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then the SCL pin should be released by setting the CKP bit of the SSPCON1 register. The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time. The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. This ACK value is copied to the ACKSTAT bit of the SSPCON2 register. If ACKSTAT is set (not ACK), then the data transfer is complete. In this case, when the not ACK is latched by the slave, the slave goes Idle and waits for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, the SCL pin must be released by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared by software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. 24.5.3.1 Slave Mode Bus Collision A slave receives a Read request and begins shifting data out on the SDA line. If a bus collision is detected and the SBCDE bit of the SSPCON3 register is set, the BCLIF bit of the PIR register is set. Once a bus collision is detected, the slave goes Idle and waits to be addressed again. User software can use the BCLIF bit to handle a slave bus collision. DS41575C-page 240 Master sends a Start condition on SDA and SCL. 2. S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Matching address with R/W bit set is received by the Slave setting SSPIF bit. 4. Slave hardware generates an ACK and sets SSPIF. 5. SSPIF bit is cleared by user. 6. Software reads the received address from SSPBUF, clearing BF. 7. R/W is set so CKP was automatically cleared after the ACK. 8. The slave software loads the transmit data into SSPBUF. 9. CKP bit is set releasing SCL, allowing the master to clock the data out of the slave. 10. SSPIF is set after the ACK response from the master is loaded into the ACKSTAT register. 11. SSPIF bit is cleared. 12. The slave software checks the ACKSTAT bit to see if the master wants to clock out more data. Note 1: If the master ACKs the clock will be stretched. 2: ACKSTAT is the only bit updated on the rising edge of SCL (9th) rather than the falling. 13. Steps 9-13 are repeated for each transmitted byte. 14. If the master sends a not ACK; the clock is not held, but SSPIF is still set. 15. The master sends a Restart condition or a Stop. 16. The slave is no longer addressed.  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. P S D/A R/W ACKSTAT CKP BF SSPIF S Receiving Address 1 2 5 6 7 Received address is read from SSPBUF 4 Indicates an address has been received R/W is copied from the matching address byte When R/W is set SCL is always held low after 9th SCL falling edge 3 A7 A6 A5 A4 A3 A2 A1 8 9 R/W = 1 Automatic ACK Transmitting Data Automatic 2 3 4 5 Set by software Data to transmit is loaded into SSPBUF Cleared by software 1 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 ACK Transmitting Data 2 3 4 5 7 8 CKP is not held for not ACK 6 Masters not ACK is copied to ACKSTAT BF is automatically cleared after 8th falling edge of SCL 1 D7 D6 D5 D4 D3 D2 D1 D0 9 ACK P FIGURE 24-18: SCL SDA Master sends Stop condition PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0) DS41575C-page 241 PIC16(L)F1933 24.5.3.3 7-bit Transmission with Address Hold Enabled Setting the AHEN bit of the SSPCON3 register enables additional clock stretching and interrupt generation after the 8th falling edge of a received matching address. Once a matching address has been clocked in, CKP is cleared and the SSPIF interrupt is set. Figure 24-19 displays a standard waveform of a 7-bit Address Slave Transmission with AHEN enabled. 1. 2. Bus starts Idle. Master sends Start condition; the S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. 3. Master sends matching address with R/W bit set. After the 8th falling edge of the SCL line the CKP bit is cleared and SSPIF interrupt is generated. 4. Slave software clears SSPIF. 5. Slave software reads ACKTIM bit of SSPCON3 register, and R/W and D/A of the SSPSTAT register to determine the source of the interrupt. 6. Slave reads the address value from the SSPBUF register clearing the BF bit. 7. Slave software decides from this information if it wishes to ACK or not ACK and sets ACKDT bit of the SSPCON2 register accordingly. 8. Slave sets the CKP bit releasing SCL. 9. Master clocks in the ACK value from the slave. 10. Slave hardware automatically clears the CKP bit and sets SSPIF after the ACK if the R/W bit is set. 11. Slave software clears SSPIF. 12. Slave loads value to transmit to the master into SSPBUF setting the BF bit. Note: SSPBUF cannot be loaded until after the ACK. 13. Slave sets CKP bit releasing the clock. 14. Master clocks out the data from the slave and sends an ACK value on the 9th SCL pulse. 15. Slave hardware copies the ACK value into the ACKSTAT bit of the SSPCON2 register. 16. Steps 10-15 are repeated for each byte transmitted to the master from the slave. 17. If the master sends a not ACK the slave releases the bus allowing the master to send a Stop and end the communication. Note: Master must send a not ACK on the last byte to ensure that the slave releases the SCL line to receive a Stop. DS41575C-page 242  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. D/A R/W ACKTIM CKP ACKSTAT ACKDT BF SSPIF S Receiving Address 2 4 5 6 7 8 Slave clears ACKDT to ACK address ACKTIM is set on 8th falling edge of SCL 9 ACK When R/W = 1; CKP is always cleared after ACK R/W = 1 Received address is read from SSPBUF 3 When AHEN = 1; CKP is cleared by hardware after receiving matching address. 1 A7 A6 A5 A4 A3 A2 A1 3 4 5 6 Cleared by software 2 Set by software, releases SCL Data to transmit is loaded into SSPBUF 1 7 8 9 Transmitting Data Automatic D7 D6 D5 D4 D3 D2 D1 D0 ACK ACKTIM is cleared on 9th rising edge of SCL Automatic Transmitting Data 1 3 4 5 6 7 after not ACK CKP not cleared Master’s ACK response is copied to SSPSTAT BF is automatically cleared after 8th falling edge of SCL 2 8 D7 D6 D5 D4 D3 D2 D1 D0 9 ACK P Master sends Stop condition FIGURE 24-19: SCL SDA Master releases SDA to slave for ACK sequence PIC16(L)F1933 I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1) DS41575C-page 243 PIC16(L)F1933 24.5.4 SLAVE MODE 10-BIT ADDRESS RECEPTION This section describes a standard sequence of events for the MSSP module configured as an I2C Slave in 10-bit Addressing mode. Figure 24-20 is used as a visual reference for this description. This is a step by step process of what must be done by slave software to accomplish I2C communication. 1. 2. 3. 4. 5. 6. 7. 8. Bus starts Idle. Master sends Start condition; S bit of SSPSTAT is set; SSPIF is set if interrupt on Start detect is enabled. Master sends matching high address with R/W bit clear; UA bit of the SSPSTAT register is set. Slave sends ACK and SSPIF is set. Software clears the SSPIF bit. Software reads received address from SSPBUF clearing the BF flag. Slave loads low address into SSPADD, releasing SCL. Master sends matching low address byte to the Slave; UA bit is set. 24.5.5 10-BIT ADDRESSING WITH ADDRESS OR DATA HOLD Reception using 10-bit addressing with AHEN or DHEN set is the same as with 7-bit modes. The only difference is the need to update the SSPADD register using the UA bit. All functionality, specifically when the CKP bit is cleared and SCL line is held low are the same. Figure 24-21 can be used as a reference of a slave in 10-bit addressing with AHEN set. Figure 24-22 shows a standard waveform for a slave transmitter in 10-bit Addressing mode. Note: Updates to the SSPADD register are not allowed until after the ACK sequence. 9. Slave sends ACK and SSPIF is set. Note: If the low address does not match, SSPIF and UA are still set so that the slave software can set SSPADD back to the high address. BF is not set because there is no match. CKP is unaffected. 10. Slave clears SSPIF. 11. Slave reads the received matching address from SSPBUF clearing BF. 12. Slave loads high address into SSPADD. 13. Master clocks a data byte to the slave and clocks out the slaves ACK on the 9th SCL pulse; SSPIF is set. 14. If SEN bit of SSPCON2 is set, CKP is cleared by hardware and the clock is stretched. 15. Slave clears SSPIF. 16. Slave reads the received byte from SSPBUF clearing BF. 17. If SEN is set the slave sets CKP to release the SCL. 18. Steps 13-17 repeat for each received byte. 19. Master sends Stop to end the transmission. DS41575C-page 244  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. CKP UA BF SSPIF S 1 1 2 1 5 6 7 0 A9 A8 8 Set by hardware on 9th falling edge 4 1 When UA = 1; SCL is held low If address matches SSPADD it is loaded into SSPBUF 3 1 Receive First Address Byte 9 ACK 1 3 4 5 6 7 8 Software updates SSPADD and releases SCL 2 9 A7 A6 A5 A4 A3 A2 A1 A0 ACK Receive Second Address Byte 1 3 4 5 6 7 8 9 1 3 4 5 6 7 Data is read from SSPBUF SCL is held low while CKP = 0 2 8 9 D7 D6 D5 D4 D3 D2 D1 D0 ACK Receive Data Set by software, When SEN = 1; releasing SCL CKP is cleared after 9th falling edge of received byte Receive address is read from SSPBUF Cleared by software 2 D7 D6 D5 D4 D3 D2 D1 D0 ACK Receive Data P FIGURE 24-20: SCL SDA Master sends Stop condition PIC16(L)F1933 I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0) DS41575C-page 245 DS41575C-page 246 ACKTIM CKP UA ACKDT BF 2 1 5 0 6 A9 7 A8 Set by hardware on 9th falling edge 4 1 ACKTIM is set by hardware on 8th falling edge of SCL If when AHEN = 1; on the 8th falling edge of SCL of an address byte, CKP is cleared Slave software clears ACKDT to ACK the received byte 3 1 8 R/W = 0 9 ACK UA 2 A6 3 A5 4 A4 5 A3 6 A2 7 A1 Update to SSPADD is not allowed until 9th falling edge of SCL SSPBUF can be read anytime before the next received byte Cleared by software 1 A7 Receive Second Address Byte 8 A0 9 ACK UA 2 D6 3 D5 4 D4 6 D2 Set CKP with software releases SCL 7 D1 Update of SSPADD, clears UA and releases SCL 5 D3 Receive Data Cleared by software 1 D7 8 9 2 Received data is read from SSPBUF 1 D6 D5 Receive Data D0 ACK D7 FIGURE 24-21: SSPIF 1 SCL S 1 SDA Receive First Address Byte PIC16(L)F1933 I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. D/A R/W ACKSTAT CKP UA BF SSPIF 4 5 6 7 Set by hardware 3 Indicates an address has been received UA indicates SSPADD must be updated SSPBUF loaded with received address 2 8 9 1 SCL S Receiving Address R/W = 0 1 1 1 1 0 A9 A8 ACK 1 3 4 5 6 7 8 After SSPADD is updated, UA is cleared and SCL is released Cleared by software 2 9 A7 A6 A5 A4 A3 A2 A1 A0 ACK Receiving Second Address Byte 1 4 5 6 7 8 Set by hardware 2 3 R/W is copied from the matching address byte When R/W = 1; CKP is cleared on 9th falling edge of SCL High address is loaded back into SSPADD Received address is read from SSPBUF Sr 1 1 1 1 0 A9 A8 Receive First Address Byte 9 ACK 2 3 4 5 6 7 8 Masters not ACK is copied Set by software releases SCL Data to transmit is loaded into SSPBUF 1 D7 D6 D5 D4 D3 D2 D1 D0 Transmitting Data Byte 9 P Master sends Stop condition ACK = 1 Master sends not ACK FIGURE 24-22: SDA Master sends Restart event PIC16(L)F1933 I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0) DS41575C-page 247 PIC16(L)F1933 24.5.6 CLOCK STRETCHING 24.5.6.2 Clock stretching occurs when a device on the bus holds the SCL line low effectively pausing communication. The slave may stretch the clock to allow more time to handle data or prepare a response for the master device. A master device is not concerned with stretching as anytime it is active on the bus and not transferring data it is stretching. Any stretching done by a slave is invisible to the master software and handled by the hardware that generates SCL. The CKP bit of the SSPCON1 register is used to control stretching in software. Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. Setting CKP will release SCL and allow more communication. 24.5.6.1 Normal Clock Stretching Following an ACK if the R/W bit of SSPSTAT is set, a read request, the slave hardware will clear CKP. This allows the slave time to update SSPBUF with data to transfer to the master. If the SEN bit of SSPCON2 is set, the slave hardware will always stretch the clock after the ACK sequence. Once the slave is ready; CKP is set by software and communication resumes. Note 1: The BF bit has no effect on if the clock will be stretched or not. This is different than previous versions of the module that would not stretch the clock, clear CKP, if SSPBUF was read before the 9th falling edge of SCL. 2: Previous versions of the module did not stretch the clock for a transmission if SSPBUF was loaded before the 9th falling edge of SCL. It is now always cleared for read requests. FIGURE 24-23: 10-bit Addressing Mode In 10-bit Addressing mode, when the UA bit is set, the clock is always stretched. This is the only time the SCL is stretched without CKP being cleared. SCL is released immediately after a write to SSPADD. Note: Previous versions of the module did not stretch the clock if the second address byte did not match. 24.5.6.3 Byte NACKing When the AHEN bit of SSPCON3 is set; CKP is cleared by hardware after the 8th falling edge of SCL for a received matching address byte. When the DHEN bit of SSPCON3 is set; CKP is cleared after the 8th falling edge of SCL for received data. Stretching after the 8th falling edge of SCL allows the slave to look at the received address or data and decide if it wants to ACK the received data. 24.5.7 CLOCK SYNCHRONIZATION AND THE CKP BIT Any time the CKP bit is cleared, the module will wait for the SCL line to go low and then hold it. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have released SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 24-23). CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDA DX ‚ – 1 DX SCL CKP Master device asserts clock Master device releases clock WR SSPCON1 DS41575C-page 248  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.5.8 GENERAL CALL ADDRESS SUPPORT In 10-bit Address mode, the UA bit will not be set on the reception of the general call address. The slave will prepare to receive the second byte as data, just as it would in 7-bit mode. The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master device. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. If the AHEN bit of the SSPCON3 register is set, just as with any other address reception, the slave hardware will stretch the clock after the 8th falling edge of SCL. The slave must then set its ACKDT value and release the clock with communication progressing as it would normally. The general call address is a reserved address in the I2C protocol, defined as address 0x00. When the GCEN bit of the SSPCON2 register is set, the slave module will automatically ACK the reception of this address regardless of the value stored in SSPADD. After the slave clocks in an address of all zeros with the R/W bit clear, an interrupt is generated and slave software can read SSPBUF and respond. Figure 24-24 shows a general call reception sequence. FIGURE 24-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE Address is compared to General Call Address after ACK, set interrupt R/W = 0 ACK D7 General Call Address SDA SCL S 1 2 3 4 5 6 7 8 9 1 Receiving Data ACK D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPIF BF (SSPSTAT) Cleared by software GCEN (SSPCON2) SSPBUF is read ’1’ 24.5.9 SSP MASK REGISTER An SSP Mask (SSPMSK) register (Register 24-5) is available in I2C Slave mode as a mask for the value held in the SSPSR register during an address comparison operation. A zero (‘0’) bit in the SSPMSK register has the effect of making the corresponding bit of the received address a “don’t care”. This register is reset to all ‘1’s upon any Reset condition and, therefore, has no effect on standard SSP operation until written with a mask value. The SSP Mask register is active during: • 7-bit Address mode: address compare of A. • 10-bit Address mode: address compare of A only. The SSP mask has no effect during the reception of the first (high) byte of the address.  2011-2012 Microchip Technology Inc. DS41575C-page 249 PIC16(L)F1933 24.6 I2C Master Mode 24.6.1 I2C MASTER MODE OPERATION Master mode is enabled by setting and clearing the appropriate SSPM bits in the SSPCON1 register and by setting the SSPEN bit. In Master mode, the SDA and SCK pins must be configured as inputs. The MSSP peripheral hardware will override the output driver TRIS controls when necessary to drive the pins low. The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set, or the bus is Idle. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted eight bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Firmware Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit condition detection. Start and Stop condition detection is the only active circuitry in this mode. All other communication is done by the user software directly manipulating the SDA and SCL lines. The following events will cause the SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt, if enabled): • • • • • Start condition detected Stop condition detected Data transfer byte transmitted/received Acknowledge transmitted/received Repeated Start generated Note 1: The MSSP module, when configured in I2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received eight bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. A Baud Rate Generator (BRG) is used to set the clock frequency output on SCL. See Section 24.7 “Baud Rate Generator” for more detail. 2: When in Master mode, Start/Stop detection is masked and an interrupt is generated when the SEN/PEN bit is cleared and the generation is complete. DS41575C-page 250  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.6.2 CLOCK ARBITRATION Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, releases the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 24-25). FIGURE 24-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA DX ‚ – 1 DX SCL deasserted but slave holds SCL low (clock arbitration) SCL allowed to transition high SCL BRG decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h SCL is sampled high, reload takes place and BRG starts its count BRG Reload 24.6.3 WCOL STATUS FLAG If the user writes the SSPBUF when a Start, Restart, Stop, Receive or Transmit sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write does not occur). Any time the WCOL bit is set it indicates that an action on SSPBUF was attempted while the module was not idle. Note: Because queueing of events is not allowed, writing to the lower five bits of SSPCON2 is disabled until the Start condition is complete.  2011-2012 Microchip Technology Inc. DS41575C-page 251 PIC16(L)F1933 24.6.4 I2C MASTER MODE START CONDITION TIMING hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. To initiate a Start condition (Figure 24-26), the user sets the Start Enable bit, SEN bit of the SSPCON2 register. If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit of the SSPSTAT1 register to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit of the SSPCON2 register will be automatically cleared by FIGURE 24-26: Note 1: If at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its Idle state. 2: The Philips I2C specification states that a bus collision cannot occur on a Start. FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPSTAT) At completion of Start bit, hardware clears SEN bit and sets SSPIF bit SDA = 1, SCL = 1 TBRG TBRG Write to SSPBUF occurs here SDA 2nd bit 1st bit TBRG SCL S DS41575C-page 252 TBRG  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.6.5 I2C MASTER MODE REPEATED START CONDITION TIMING SSPCON2 register will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit of the SSPSTAT register will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. A Repeated Start condition (Figure 24-27) occurs when the RSEN bit of the SSPCON2 register is programmed high and the master state machine is no longer active. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. SCL is asserted low. Following this, the RSEN bit of the FIGURE 24-27: Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. REPEAT START CONDITION WAVEFORM S bit set by hardware Write to SSPCON2 occurs here SDA = 1, SCL (no change) At completion of Start bit, hardware clears RSEN bit and sets SSPIF SDA = 1, SCL = 1 TBRG TBRG TBRG 1st bit SDA Write to SSPBUF occurs here TBRG SCL Sr TBRG Repeated Start  2011-2012 Microchip Technology Inc. DS41575C-page 253 PIC16(L)F1933 24.6.6 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF, and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high. When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKSTAT bit on the rising edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 24-28). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will release the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT Status bit of the SSPCON2 register. Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 24.6.6.1 BF Status Flag 24.6.6.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit of the SSPCON2 register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 24.6.6.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Typical Transmit Sequence: The user generates a Start condition by setting the SEN bit of the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. The MSSP module will wait the required start time before any other operation takes place. The user loads the SSPBUF with the slave address to transmit. Address is shifted out the SDA pin until all eight bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. The user loads the SSPBUF with eight bits of data. Data is shifted out the SDA pin until all eight bits are transmitted. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. Steps 8-11 are repeated for all transmitted data bytes. The user generates a Stop or Restart condition by setting the PEN or RSEN bits of the SSPCON2 register. Interrupt is generated once the Stop/Restart condition is complete. In Transmit mode, the BF bit of the SSPSTAT register is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 24.6.6.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write does not occur). WCOL must be cleared by software before the next transmission. DS41575C-page 254  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. RCEN ACKEN SSPOV BF (SSPSTAT) SDA = 0, SCL = 1 while CPU responds to SSPIF SSPIF S 1 A7 2 4 5 6 Cleared by software 3 A6 A5 A4 A3 A2 Transmit Address to Slave 7 8 9 ACK 2 3 5 6 7 8 D0 9 ACK 2 3 4 RCEN cleared automatically 5 6 7 Cleared by software Set SSPIF interrupt at end of Acknowledge sequence Data shifted in on falling edge of CLK 1 ACK from Master SDA = ACKDT = 0 Cleared in software Set SSPIF at end of receive 9 ACK is not sent ACK P Set SSPIF interrupt at end of Acknowledge sequence Bus master terminates transfer Set P bit (SSPSTAT) and SSPIF PEN bit = 1 written here SSPOV is set because SSPBUF is still full 8 D0 RCEN cleared automatically D7 D6 D5 D4 D3 D2 D1 RCEN cleared automatically Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 Receiving Data from Slave RCEN = 1, start next receive ACK from Master SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF Cleared by software Set SSPIF interrupt at end of receive 4 Cleared by software 1 D7 D6 D5 D4 D3 D2 D1 Receiving Data from Slave RCEN cleared automatically Master configured as a receiver by programming SSPCON2 (RCEN = 1) A1 R/W ACK from Slave Master configured as a receiver by programming SSPCON2 (RCEN = 1) FIGURE 24-28: SCL SDA SEN = 0 Write to SSPBUF occurs here, start XMIT Write to SSPCON2 (SEN = 1), begin Start condition Write to SSPCON2 to start Acknowledge sequence SDA = ACKDT (SSPCON2) = 0 PIC16(L)F1933 I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) DS41575C-page 255 PIC16(L)F1933 24.6.7 I2C MASTER MODE RECEPTION Master mode reception (Figure 24-29) is enabled by programming the Receive Enable bit, RCEN bit of the SSPCON2 register. Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable, ACKEN bit of the SSPCON2 register. 24.6.7.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 24.6.7.2 SSPOV Status Flag 24.6.7.4 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. In receive operation, the SSPOV bit is set when eight bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 13. 14. 24.6.7.3 15. WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). DS41575C-page 256 Typical Receive Sequence: The user generates a Start condition by setting the SEN bit of the SSPCON2 register. SSPIF is set by hardware on completion of the Start. SSPIF is cleared by software. User writes SSPBUF with the slave address to transmit and the R/W bit set. Address is shifted out the SDA pin until all eight bits are transmitted. Transmission begins as soon as SSPBUF is written to. The MSSP module shifts in the ACK bit from the slave device and writes its value into the ACKSTAT bit of the SSPCON2 register. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. User sets the RCEN bit of the SSPCON2 register and the master clocks in a byte from the slave. After the 8th falling edge of SCL, SSPIF and BF are set. Master clears SSPIF and reads the received byte from SSPBUF, clears BF. Master sets ACK value sent to slave in ACKDT bit of the SSPCON2 register and initiates the ACK by setting the ACKEN bit. Masters ACK is clocked out to the Slave and SSPIF is set. User clears SSPIF. Steps 8-13 are repeated for each received byte from the slave. Master sends a not ACK or Stop to end communication.  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. RCEN ACKEN SSPOV BF (SSPSTAT) SDA = 0, SCL = 1 while CPU responds to SSPIF SSPIF S 1 A7 2 4 5 6 Cleared by software 3 A6 A5 A4 A3 A2 Transmit Address to Slave 7 8 9 ACK 2 3 5 6 7 8 D0 9 ACK 2 3 4 RCEN cleared automatically 5 6 7 Cleared by software Set SSPIF interrupt at end of Acknowledge sequence Data shifted in on falling edge of CLK 1 ACK from Master SDA = ACKDT = 0 Cleared in software Set SSPIF at end of receive 9 ACK is not sent ACK P Set SSPIF interrupt at end of Acknowledge sequence Bus master terminates transfer Set P bit (SSPSTAT) and SSPIF PEN bit = 1 written here SSPOV is set because SSPBUF is still full 8 D0 RCEN cleared automatically D7 D6 D5 D4 D3 D2 D1 RCEN cleared automatically Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 Receiving Data from Slave RCEN = 1, start next receive ACK from Master SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF Cleared by software Set SSPIF interrupt at end of receive 4 Cleared by software 1 D7 D6 D5 D4 D3 D2 D1 Receiving Data from Slave RCEN cleared automatically Master configured as a receiver by programming SSPCON2 (RCEN = 1) A1 R/W ACK from Slave Master configured as a receiver by programming SSPCON2 (RCEN = 1) FIGURE 24-29: SCL SDA SEN = 0 Write to SSPBUF occurs here, start XMIT Write to SSPCON2 (SEN = 1), begin Start condition Write to SSPCON2 to start Acknowledge sequence SDA = ACKDT (SSPCON2) = 0 PIC16(L)F1933 I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) DS41575C-page 257 PIC16(L)F1933 24.6.8 ACKNOWLEDGE SEQUENCE TIMING 24.6.9 A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN bit of the SSPCON2 register. At the end of a receive/transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit of the SSPSTAT register is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 24-31). An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN bit of the SSPCON2 register. When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 24-30). 24.6.8.1 24.6.9.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write does not occur). WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write does not occur). FIGURE 24-30: STOP CONDITION TIMING ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, write to SSPCON2 ACKEN = 1, ACKDT = 0 ACKEN automatically cleared TBRG TBRG SDA SCL D0 ACK 8 9 SSPIF SSPIF set at the end of receive Cleared in software Cleared in software SSPIF set at the end of Acknowledge sequence Note: TBRG = one Baud Rate Generator period. DS41575C-page 258  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-31: STOP CONDITION RECEIVE OR TRANSMIT MODE SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT) is set. Write to SSPCON2, set PEN PEN bit (SSPCON2) is cleared by hardware and the SSPIF bit is set Falling edge of 9th clock TBRG SCL SDA ACK P TBRG TBRG TBRG SCL brought high after TBRG SDA asserted low before rising edge of clock to setup Stop condition Note: TBRG = one Baud Rate Generator period. 24.6.10 SLEEP OPERATION the I2C slave While in Sleep mode, module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 24.6.11 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 24.6.12 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit of the SSPSTAT register is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed by hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • • • • • Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition 24.6.13 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF, and reset the I2C port to its Idle state (Figure 24-32). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared.  2011-2012 Microchip Technology Inc. DS41575C-page 259 PIC16(L)F1933 FIGURE 24-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Data changes while SCL = 0 SDA line pulled low by another source SDA released by master Sample SDA. While SCL is high, data does not match what is driven by the master. Bus collision has occurred. SDA SCL Set bus collision interrupt (BCLIF) BCLIF 24.6.13.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 24-33). SCL is sampled low before SDA is asserted low (Figure 24-34). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 24-33). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded and counts down. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. DS41575C-page 260 If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 24-35). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to zero; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 24-33: BUS COLLISION DURING START CONDITION (SDA ONLY) SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1. SDA SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN cleared automatically because of bus collision. SSP module reset into Idle state. SEN SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. BCLIF SSPIF and BCLIF are cleared by software S SSPIF SSPIF and BCLIF are cleared by software FIGURE 24-34: BUS COLLISION DURING START CONDITION (SCL = 0) SDA = 0, SCL = 1 TBRG TBRG SDA Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SEN SCL = 0 before BRG time-out, bus collision occurs. Set BCLIF. BCLIF Interrupt cleared by software S ’0’ ’0’ SSPIF ’0’ ’0’  2011-2012 Microchip Technology Inc. DS41575C-page 261 PIC16(L)F1933 FIGURE 24-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA = 0, SCL = 1 Set S Less than TBRG SDA SCL TBRG SDA pulled low by other master. Reset BRG and assert SDA. S SCL pulled low after BRG time-out SEN BCLIF Set SSPIF Set SEN, enable Start sequence if SDA = 1, SCL = 1 ’0’ S SSPIF SDA = 0, SCL = 1, set SSPIF DS41575C-page 262 Interrupts cleared by software  2011-2012 Microchip Technology Inc. PIC16(L)F1933 24.6.13.2 Bus Collision During a Repeated Start Condition If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 24-36). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from a low level to a high level. SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition, see Figure 24-37. When the user releases SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to zero. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. FIGURE 24-36: If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDA SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN BCLIF Cleared by software S ’0’ SSPIF ’0’ FIGURE 24-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) TBRG TBRG SDA SCL BCLIF SCL goes low before SDA, set BCLIF. Release SDA and SCL. Interrupt cleared by software RSEN S ’0’ SSPIF  2011-2012 Microchip Technology Inc. DS41575C-page 263 PIC16(L)F1933 24.6.13.3 Bus Collision During a Stop Condition The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to zero. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 24-38). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 24-39). Bus collision occurs during a Stop condition if: a) b) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. FIGURE 24-38: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG TBRG SDA SDA sampled low after TBRG, set BCLIF SDA asserted low SCL PEN BCLIF P ’0’ SSPIF ’0’ FIGURE 24-39: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG TBRG TBRG SDA Assert SDA SCL SCL goes low before SDA goes high, set BCLIF PEN BCLIF P ’0’ SSPIF ’0’ DS41575C-page 264  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 24-3: Name INTCON SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ OPERATION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page: GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 TRISC SSPADD SSPBUF ADD 272 MSSP Receive Buffer/Transmit Register 223* SSPCON1 WCOL SSPOV SSPEN CKP SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 270 SSPCON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 271 R/W UA BF 267 SSPMSK SSPSTAT Legend: * SSPM 268 MSK SMP CKE D/A P 272 S — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C™ mode. Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 265 PIC16(L)F1933 24.7 Baud Rate Generator The MSSP module has a Baud Rate Generator available for clock generation in both I2C and SPI Master modes. The Baud Rate Generator (BRG) reload value is placed in the SSPADD register (Register 24-6). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting down. Once the given operation is complete, the internal clock will automatically stop counting and the clock pin will remain in its last state. clock line. The logic dictating when the reload signal is asserted depends on the mode the MSSP is being operated in. Table 24-4 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. EQUATION 24-1: FOSC FCLOCK = ------------------------------------------------ SSPxADD + 1   4  An internal signal “Reload” in Figure 24-40 triggers the value from SSPADD to be loaded into the BRG counter. This occurs twice for each oscillation of the module FIGURE 24-40: BAUD RATE GENERATOR BLOCK DIAGRAM SSPM SSPM Reload SSPADD Reload Control SCL SSPCLK BRG Down Counter FOSC/2 Note: Values of 0x00, 0x01 and 0x02 are not valid for SSPADD when used as a Baud Rate Generator for I2C. This is an implementation limitation. TABLE 24-4: Note 1: MSSP CLOCK RATE W/BRG FOSC FCY BRG Value FCLOCK (2 Rollovers of BRG) 32 MHz 8 MHz 13h 400 kHz(1) 32 MHz 8 MHz 19h 308 kHz 32 MHz 8 MHz 4Fh 100 kHz 16 MHz 4 MHz 09h 400 kHz(1) 16 MHz 4 MHz 0Ch 308 kHz 16 MHz 4 MHz 27h 100 kHz 4 MHz 1 MHz 09h 100 kHz The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. DS41575C-page 266  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 24-1: SSPSTAT: SSP STATUS REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SMP: SPI Data Input Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode In I2 C Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high speed mode (400 kHz) bit 6 CKE: SPI Clock Edge Select bit (SPI mode only) In SPI Master or Slave mode: 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state In I2 C™ mode only: 1 = Enable input logic so that thresholds are compliant with SMBus specification 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit (I2C mode only) 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit (I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset) 0 = Stop bit was not detected last bit 3 S: Start bit (I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.) 1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset) 0 = Start bit was not detected last bit 2 R/W: Read/Write bit information (I2C mode only) This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit, or not ACK bit. In I2 C Slave mode: 1 = Read 0 = Write In I2 C Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode. bit 1 UA: Update Address bit (10-bit I2C mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit Receive (SPI and I2 C modes): 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Transmit (I2 C mode only): 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty  2011-2012 Microchip Technology Inc. DS41575C-page 267 PIC16(L)F1933 REGISTER 24-2: SSPCON1: SSP CONTROL REGISTER 1 R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 WCOL SSPOV SSPEN CKP R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SSPM bit 7 bit 0 Legend: R = Readable bit W = Writable bit u = Bit is unchanged x = Bit is unknown U = Unimplemented bit, read as ‘0’ -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared bit 7 WCOL: Write Collision Detect bit Master mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started 0 = No collision Slave mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) In SPI mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register (must be cleared in software). 0 = No overflow In I2 C mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode (must be cleared in software). 0 = No overflow bit 5 SSPEN: Synchronous Serial Port Enable bit In both modes, when enabled, these pins must be properly configured as input or output In SPI mode: 1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins(2) 0 = Disables serial port and configures these pins as I/O port pins In I2 C mode: 1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(3) 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit In SPI mode: 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level In I2 C Slave mode: SCL release control 1 = Enable clock 0 = Holds clock low (clock stretch). (Used to ensure data setup time.) In I2 C Master mode: Unused in this mode DS41575C-page 268  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 24-2: bit 3-0 SSPCON1: SSP CONTROL REGISTER 1 (CONTINUED) SSPM: Synchronous Serial Port Mode Select bits 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1101 = Reserved 1100 = Reserved 1011 = I2C firmware controlled Master mode (slave idle) 1010 = SPI Master mode, clock = FOSC/(4 * (SSPADD+1))(5) 1001 = Reserved 1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))(4) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note 1: 2: 3: 4: 5: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, these pins must be properly configured as input or output. When enabled, the SDA and SCL pins must be configured as inputs. SSPADD values of 0, 1 or 2 are not supported for I2C mode. SSPADD value of ‘0’ is not supported. Use SSPM = 0000 instead.  2011-2012 Microchip Technology Inc. DS41575C-page 269 PIC16(L)F1933 REGISTER 24-3: SSPCON2: SSP CONTROL REGISTER 2 R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set bit 7 GCEN: General Call Enable bit (in I2C Slave mode only) 1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only) 1 = Acknowledge was not received 0 = Acknowledge was received bit 5 ACKDT: Acknowledge Data bit (in I2C mode only) In Receive mode: Value transmitted when the user initiates an Acknowledge sequence at the end of a receive 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only) In Master Receive mode: 1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence idle bit 3 RCEN: Receive Enable bit (in I2C Master mode only) 1 = Enables Receive mode for I2C 0 = Receive idle bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only) SCKMSSP Release Control: 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable/Stretch Enable bit In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). DS41575C-page 270  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 24-4: SSPCON3: SSP CONTROL REGISTER 3 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ACKTIM: Acknowledge Time Status bit (I2C mode only)(3) 1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8TH falling edge of SCL clock 0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCL clock bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are disabled(2) bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only) 1 = Enable interrupt on detection of Start or Restart conditions 0 = Start detection interrupts are disabled(2) bit 4 BOEN: Buffer Overwrite Enable bit In SPI Slave mode:(1) 1 = SSPBUF updates every time that a new data byte is shifted in ignoring the BF bit 0 = If new byte is received with BF bit of the SSPSTAT register already set, SSPOV bit of the SSPCON1 register is set, and the buffer is not updated In I2C Master and SPI Master mode: This bit is ignored. In I2C Slave mode: 1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of the SSPOV bit only if the BF bit = 0. 0 = SSPBUF is only updated when SSPOV is clear bit 3 SDAHT: SDA Hold Time Selection bit (I2C mode only) 1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only) If on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the BCLIF bit of the PIR2 register is set, and bus goes idle 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts are disabled bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit of the SSPCON1 register will be cleared and the SCL will be held low. 0 = Address holding is disabled bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit of the SSPCON1 register and SCL is held low. 0 = Data holding is disabled Note 1: 2: 3: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPOV is still set when a new byte is received and BF = 1, but hardware continues to write the most recent byte to SSPBUF. This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled. The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.  2011-2012 Microchip Technology Inc. DS41575C-page 271 PIC16(L)F1933 REGISTER 24-5: R/W-1/1 SSPMSK: SSP MASK REGISTER R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 MSK bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 MSK: Mask bits 1 = The received address bit n is compared to SSPADD to detect I2C address match 0 = The received address bit n is not used to detect I2C address match bit 0 MSK: Mask bit for I2C Slave mode, 10-bit Address I2C Slave mode, 10-bit address (SSPM = 0111 or 1111): 1 = The received address bit 0 is compared to SSPADD to detect I2C address match 0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address, the bit is ignored REGISTER 24-6: R/W-0/0 SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2C MODE) R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 ADD bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared Master mode: bit 7-0 ADD: Baud Rate Clock Divider bits SCL pin clock period = ((ADD + 1) *4)/FOSC 10-Bit Slave mode — Most Significant Address Byte: bit 7-3 Not used: Unused for Most Significant Address Byte. Bit state of this register is a “don’t care”. Bit pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits are compared by hardware and are not affected by the value in this register. bit 2-1 ADD: Two Most Significant bits of 10-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. 10-Bit Slave mode — Least Significant Address Byte: bit 7-0 ADD: Eight Least Significant bits of 10-bit address 7-Bit Slave mode: bit 7-1 ADD: 7-bit address bit 0 Not used: Unused in this mode. Bit state is a “don’t care”. DS41575C-page 272  2011-2012 Microchip Technology Inc. PIC16(L)F1933 NOTES:  2011-2012 Microchip Technology Inc. DS41575C-page 273 PIC16(L)F1933 DS41575C-page 274  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The EUSART module includes the following capabilities: • • • • • • • • • • Full-duplex asynchronous transmit and receive Two-character input buffer One-character output buffer Programmable 8-bit or 9-bit character length Address detection in 9-bit mode Input buffer overrun error detection Received character framing error detection Half-duplex synchronous master Half-duplex synchronous slave Programmable clock polarity in synchronous modes • Sleep operation The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is a serial I/O communications peripheral. It contains all the clock generators, shift registers and data buffers necessary to perform an input or output serial data transfer independent of device program execution. The EUSART, also known as a Serial Communications Interface (SCI), can be configured as a full-duplex asynchronous system or half-duplex synchronous system. Full-Duplex mode is useful for communications with peripheral systems, such as CRT terminals and personal computers. Half-Duplex Synchronous mode is intended for communications with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs or other microcontrollers. These devices typically do not have internal clocks for baud rate generation and require the external clock signal provided by a master synchronous device. FIGURE 25-1: The EUSART module implements the following additional features, making it ideally suited for use in Local Interconnect Network (LIN) bus systems: • Automatic detection and calibration of the baud rate • Wake-up on Break reception • 13-bit Break character transmit Block diagrams of the EUSART transmitter and receiver are shown in Figure 25-1 and Figure 25-2. EUSART TRANSMIT BLOCK DIAGRAM Data Bus TXIE Interrupt TXIF TXREG Register 8 MSb TX/CK pin LSb (8) • • • 0 Pin Buffer and Control TRMT SPEN Transmit Shift Register (TSR) TXEN Baud Rate Generator FOSC ÷n +1 SPBRGH TX9 n BRG16 SPBRGL Multiplier x4 x16 x64 SYNC 1 X 0 0 0 BRGH X 1 1 0 0 BRG16 X 1 0 1 0  2011-2012 Microchip Technology Inc. TX9D DS41575C-page 275 PIC16(L)F1933 FIGURE 25-2: EUSART RECEIVE BLOCK DIAGRAM SPEN CREN RX/DT pin Baud Rate Generator Data Recovery FOSC BRG16 SPBRGH SPBRGL Multiplier x4 x16 x64 SYNC 1 X 0 0 0 BRGH X 1 1 0 0 BRG16 X 1 0 1 0 Stop RCIDL RSR Register MSb Pin Buffer and Control +1 OERR (8) ••• 7 1 LSb 0 START RX9 ÷n n FERR RX9D RCREG Register 8 FIFO Data Bus RCIF RCIE Interrupt The operation of the EUSART module is controlled through three registers: • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCON) These registers are detailed in Register 25-1, Register 25-2 and Register 25-3, respectively. When the receiver or transmitter section is not enabled then the corresponding RX or TX pin may be used for general purpose input and output. DS41575C-page 276  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.1 EUSART Asynchronous Mode The EUSART transmits and receives data using the standard non-return-to-zero (NRZ) format. NRZ is implemented with two levels: a VOH mark state which represents a ‘1’ data bit, and a VOL space state which represents a ‘0’ data bit. NRZ refers to the fact that consecutively transmitted data bits of the same value stay at the output level of that bit without returning to a neutral level between each bit transmission. An NRZ transmission port idles in the mark state. Each character transmission consists of one Start bit followed by eight or nine data bits and is always terminated by one or more Stop bits. The Start bit is always a space and the Stop bits are always marks. The most common data format is eight bits. Each transmitted bit persists for a period of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud Rate Generator is used to derive standard baud rate frequencies from the system oscillator. See Table 25-5 for examples of baud rate configurations. 25.1.1.2 Transmitting Data A transmission is initiated by writing a character to the TXREG register. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR register. If the TSR still contains all or part of a previous character, the new character data is held in the TXREG until the Stop bit of the previous character has been transmitted. The pending character in the TXREG is then transferred to the TSR in one TCY immediately following the Stop bit transmission. The transmission of the Start bit, data bits and Stop bit sequence commences immediately following the transfer of the data to the TSR from the TXREG. 25.1.1.3 Transmit Data Polarity The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent, but share the same data format and baud rate. Parity is not supported by the hardware, but can be implemented in software and stored as the ninth data bit. The polarity of the transmit data can be controlled with the SCKP bit of the BAUDCON register. The default state of this bit is ‘0’ which selects high true transmit idle and data bits. Setting the SCKP bit to ‘1’ will invert the transmit data resulting in low true idle and data bits. The SCKP bit controls transmit data polarity in Asynchronous mode only. In Synchronous mode, the SCKP bit has a different function. See Section 25.5.1.2 “Clock Polarity”. 25.1.1 25.1.1.4 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 25-1. The heart of the transmitter is the serial Transmit Shift Register (TSR), which is not directly accessible by software. The TSR obtains its data from the transmit buffer, which is the TXREG register. 25.1.1.1 Enabling the Transmitter The EUSART transmitter is enabled for asynchronous operations by configuring the following three control bits: • TXEN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the TXEN bit of the TXSTA register enables the transmitter circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART and automatically configures the TX/CK I/O pin as an output. If the TX/CK pin is shared with an analog peripheral, the analog I/O function must be disabled by clearing the corresponding ANSEL bit. Transmit Interrupt Flag The TXIF interrupt flag bit of the PIR1 register is set whenever the EUSART transmitter is enabled and no character is being held for transmission in the TXREG. In other words, the TXIF bit is only clear when the TSR is busy with a character and a new character has been queued for transmission in the TXREG. The TXIF flag bit is not cleared immediately upon writing TXREG. TXIF becomes valid in the second instruction cycle following the write execution. Polling TXIF immediately following the TXREG write will return invalid results. The TXIF bit is read-only, it cannot be set or cleared by software. The TXIF interrupt can be enabled by setting the TXIE interrupt enable bit of the PIE1 register. However, the TXIF flag bit will be set whenever the TXREG is empty, regardless of the state of TXIE enable bit. To use interrupts when transmitting data, set the TXIE bit only when there is more data to send. Clear the TXIE interrupt enable bit upon writing the last character of the transmission to the TXREG. Note 1: The TXIF Transmitter Interrupt flag is set when the TXEN enable bit is set.  2011-2012 Microchip Technology Inc. DS41575C-page 277 PIC16(L)F1933 25.1.1.5 TSR Status 25.1.1.7 The TRMT bit of the TXSTA register indicates the status of the TSR register. This is a read-only bit. The TRMT bit is set when the TSR register is empty and is cleared when a character is transferred to the TSR register from the TXREG. The TRMT bit remains clear until all bits have been shifted out of the TSR register. No interrupt logic is tied to this bit, so the user has to poll this bit to determine the TSR status. Note: 25.1.1.6 1. 2. 3. The TSR register is not mapped in data memory, so it is not available to the user. Transmitting 9-Bit Characters The EUSART supports 9-bit character transmissions. When the TX9 bit of the TXSTA register is set, the EUSART will shift nine bits out for each character transmitted. The TX9D bit of the TXSTA register is the ninth, and Most Significant, data bit. When transmitting 9-bit data, the TX9D data bit must be written before writing the eight Least Significant bits into the TXREG. All nine bits of data will be transferred to the TSR shift register immediately after the TXREG is written. A special 9-bit Address mode is available for use with multiple receivers. See Section 25.1.2.7 “Address Detection” for more information on the address mode. FIGURE 25-3: Write to TXREG BRG Output (Shift Clock) TX/CK pin TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) DS41575C-page 278 4. 5. 6. 7. 8. Asynchronous Transmission Set-up: Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.4 “EUSART Baud Rate Generator (BRG)”). Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. If 9-bit transmission is desired, set the TX9 control bit. A set ninth data bit will indicate that the eight Least Significant data bits are an address when the receiver is set for address detection. Set SCKP bit if inverted transmit is desired. Enable the transmission by setting the TXEN control bit. This will cause the TXIF interrupt bit to be set. If interrupts are desired, set the TXIE interrupt enable bit of the PIE1 register. An interrupt will occur immediately provided that the GIE and PEIE bits of the INTCON register are also set. If 9-bit transmission is selected, the ninth bit should be loaded into the TX9D data bit. Load 8-bit data into the TXREG register. This will start the transmission. ASYNCHRONOUS TRANSMISSION Word 1 Start bit bit 0 bit 1 bit 7/8 Stop bit Word 1 1 TCY Word 1 Transmit Shift Reg.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 25-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK) Write to TXREG TX/CK pin Start bit bit 0 bit 1 Word 1 1 TCY TXIF bit (Transmit Buffer Reg. Empty Flag) bit 7/8 Stop bit Start bit Word 2 bit 0 1 TCY Word 1 Transmit Shift Reg. TRMT bit (Transmit Shift Reg. Empty Flag) Note: Word 2 Word 1 BRG Output (Shift Clock) Word 2 Transmit Shift Reg. This timing diagram shows two consecutive transmissions. TABLE 25-1: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D Name BAUDCON INTCON RCSTA 286 SPBRGL BRG 288* SPBRGH BRG 288* TRISC TXREG TXSTA TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 SYNC SENDB BRGH TRMT TX9D EUSART Transmit Data Register CSRC TX9 TXEN 125 277* 285 Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous transmission. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 279 PIC16(L)F1933 25.1.2 EUSART ASYNCHRONOUS RECEIVER The Asynchronous mode is typically used in RS-232 systems. The receiver block diagram is shown in Figure 25-2. The data is received on the RX/DT pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at 16 times the baud rate, whereas the serial Receive Shift Register (RSR) operates at the bit rate. When all eight or nine bits of the character have been shifted in, they are immediately transferred to a two character First-In-First-Out (FIFO) memory. The FIFO buffering allows reception of two complete characters and the start of a third character before software must start servicing the EUSART receiver. The FIFO and RSR registers are not directly accessible by software. Access to the received data is via the RCREG register. 25.1.2.1 Enabling the Receiver The EUSART receiver is enabled for asynchronous operation by configuring the following three control bits: • CREN = 1 • SYNC = 0 • SPEN = 1 All other EUSART control bits are assumed to be in their default state. Setting the CREN bit of the RCSTA register enables the receiver circuitry of the EUSART. Clearing the SYNC bit of the TXSTA register configures the EUSART for asynchronous operation. Setting the SPEN bit of the RCSTA register enables the EUSART. The programmer must set the corresponding TRIS bit to configure the RX/DT I/O pin as an input. Note 1: If the RX/DT function is on an analog pin, the corresponding ANSEL bit must be cleared for the receiver to function. 25.1.2.2 Receiving Data The receiver data recovery circuit initiates character reception on the falling edge of the first bit. The first bit, also known as the Start bit, is always a zero. The data recovery circuit counts one-half bit time to the center of the Start bit and verifies that the bit is still a zero. If it is not a zero then the data recovery circuit aborts character reception, without generating an error, and resumes looking for the falling edge of the Start bit. If the Start bit zero verification succeeds then the data recovery circuit counts a full bit time to the center of the next bit. The bit is then sampled by a majority detect circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR. This repeats until all data bits have been sampled and shifted into the RSR. One final bit time is measured and the level sampled. This is the Stop bit, which is always a ‘1’. If the data recovery circuit samples a ‘0’ in the Stop bit position then a framing error is set for this character, otherwise the framing error is cleared for this character. See Section 25.1.2.4 “Receive Framing Error” for more information on framing errors. Immediately after all data bits and the Stop bit have been received, the character in the RSR is transferred to the EUSART receive FIFO and the RCIF interrupt flag bit of the PIR1 register is set. The top character in the FIFO is transferred out of the FIFO by reading the RCREG register. Note: 25.1.2.3 If the receive FIFO is overrun, no additional characters will be received until the overrun condition is cleared. See Section 25.1.2.5 “Receive Overrun Error” for more information on overrun errors. Receive Interrupts The RCIF interrupt flag bit of the PIR1 register is set whenever the EUSART receiver is enabled and there is an unread character in the receive FIFO. The RCIF interrupt flag bit is read-only, it cannot be set or cleared by software. RCIF interrupts are enabled by setting all of the following bits: • RCIE, Interrupt Enable bit of the PIE1 register • PEIE, Peripheral Interrupt Enable bit of the INTCON register • GIE, Global Interrupt Enable bit of the INTCON register The RCIF interrupt flag bit will be set when there is an unread character in the FIFO, regardless of the state of interrupt enable bits. DS41575C-page 280  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.1.2.4 Receive Framing Error Each character in the receive FIFO buffer has a corresponding framing error Status bit. A framing error indicates that a Stop bit was not seen at the expected time. The framing error status is accessed via the FERR bit of the RCSTA register. The FERR bit represents the status of the top unread character in the receive FIFO. Therefore, the FERR bit must be read before reading the RCREG. The FERR bit is read-only and only applies to the top unread character in the receive FIFO. A framing error (FERR = 1) does not preclude reception of additional characters. It is not necessary to clear the FERR bit. Reading the next character from the FIFO buffer will advance the FIFO to the next character and the next corresponding framing error. The FERR bit can be forced clear by clearing the SPEN bit of the RCSTA register which resets the EUSART. Clearing the CREN bit of the RCSTA register does not affect the FERR bit. A framing error by itself does not generate an interrupt. Note: 25.1.2.5 25.1.2.7 Address Detection A special Address Detection mode is available for use when multiple receivers share the same transmission line, such as in RS-485 systems. Address detection is enabled by setting the ADDEN bit of the RCSTA register. Address detection requires 9-bit character reception. When address detection is enabled, only characters with the ninth data bit set will be transferred to the receive FIFO buffer, thereby setting the RCIF interrupt bit. All other characters will be ignored. Upon receiving an address character, user software determines if the address matches its own. Upon address match, user software must disable address detection by clearing the ADDEN bit before the next Stop bit occurs. When user software detects the end of the message, determined by the message protocol used, software places the receiver back into the Address Detection mode by setting the ADDEN bit. If all receive characters in the receive FIFO have framing errors, repeated reads of the RCREG will not clear the FERR bit. Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before the FIFO is accessed. When this happens the OERR bit of the RCSTA register is set. The characters already in the FIFO buffer can be read but no additional characters will be received until the error is cleared. The error must be cleared by either clearing the CREN bit of the RCSTA register or by resetting the EUSART by clearing the SPEN bit of the RCSTA register. 25.1.2.6 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift nine bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth and Most Significant data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the eight Least Significant bits from the RCREG.  2011-2012 Microchip Technology Inc. DS41575C-page 281 PIC16(L)F1933 25.1.2.8 Asynchronous Reception Set-up: 25.1.2.9 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.4 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 5. If 9-bit reception is desired, set the RX9 bit. 6. Enable reception by setting the CREN bit. 7. The RCIF interrupt flag bit will be set when a character is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 8. Read the RCSTA register to get the error flags and, if 9-bit data reception is enabled, the ninth data bit. 9. Get the received eight Least Significant data bits from the receive buffer by reading the RCREG register. 10. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. FIGURE 25-5: Rcv Shift Reg Rcv Buffer Reg. RCIDL This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.4 “EUSART Baud Rate Generator (BRG)”). 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the serial port by setting the SPEN bit. The SYNC bit must be clear for asynchronous operation. 4. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 5. Enable 9-bit reception by setting the RX9 bit. 6. Enable address detection by setting the ADDEN bit. 7. Enable reception by setting the CREN bit. 8. The RCIF interrupt flag bit will be set when a character with the ninth bit set is transferred from the RSR to the receive buffer. An interrupt will be generated if the RCIE interrupt enable bit was also set. 9. Read the RCSTA register to get the error flags. The ninth data bit will always be set. 10. Get the received eight Least Significant data bits from the receive buffer by reading the RCREG register. Software determines if this is the device’s address. 11. If an overrun occurred, clear the OERR flag by clearing the CREN receiver enable bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and generate interrupts. ASYNCHRONOUS RECEPTION Start bit bit 0 RX/DT pin 9-bit Address Detection Mode Set-up bit 1 bit 7/8 Stop bit Start bit Word 1 RCREG bit 0 bit 7/8 Stop bit Start bit bit 7/8 Stop bit Word 2 RCREG Read Rcv Buffer Reg. RCREG RCIF (Interrupt Flag) OERR bit CREN Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word, causing the OERR (overrun) bit to be set. DS41575C-page 282  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 25-2: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 RCREG EUSART Receive Data Register CREN ADDEN FERR OERR RX9D Name BAUDCON INTCON PIE1 RCSTA SPEN RX9 SREN 280* 286 SPBRGL BRG 288* SPBRGH BRG 288* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for asynchronous reception. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 283 PIC16(L)F1933 25.2 Clock Accuracy with Asynchronous Operation The factory calibrates the internal oscillator block output (INTOSC). However, the INTOSC frequency may drift as VDD or temperature changes, and this directly affects the asynchronous baud rate. Two methods may be used to adjust the baud rate clock, but both require a reference clock source of some kind. The first (preferred) method uses the OSCTUNE register to adjust the INTOSC output. Adjusting the value in the OSCTUNE register allows for fine resolution changes to the system clock source. See Section 5.2.2 “Internal Clock Sources” for more information. The other method adjusts the value in the Baud Rate Generator. This can be done automatically with the Auto-Baud Detect feature (see Section 25.4.1 “Auto-Baud Detect”). There may not be fine enough resolution when adjusting the Baud Rate Generator to compensate for a gradual change in the peripheral clock frequency. DS41575C-page 284  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.3 Register Definitions: EUSART Control REGISTER 25-1: R/W-/0 TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-0/0 CSRC TX9 R/W-0/0 TXEN (1) R/W-0/0 R/W-0/0 R/W-0/0 R-1/1 R/W-0/0 SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit enabled 0 = Transmit disabled bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: Ninth bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode.  2011-2012 Microchip Technology Inc. DS41575C-page 285 PIC16(L)F1933 RCSTA: RECEIVE STATUS AND CONTROL REGISTER(1) REGISTER 25-2: R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-x/x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave Don’t care bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enable interrupt and load the receive buffer when RSR is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 8-bit (RX9 = 0): Don’t care bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receive next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: Ninth bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware. DS41575C-page 286  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 25-3: BAUDCON: BAUD RATE CONTROL REGISTER R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ABDOVF: Auto-Baud Detect Overflow bit Asynchronous mode: 1 = Auto-baud timer overflowed 0 = Auto-baud timer did not overflow Synchronous mode: Don’t care bit 6 RCIDL: Receive Idle Flag bit Asynchronous mode: 1 = Receiver is Idle 0 = Start bit has been received and the receiver is receiving Synchronous mode: Don’t care bit 5 Unimplemented: Read as ‘0’ bit 4 SCKP: Synchronous Clock Polarity Select bit Asynchronous mode: 1 = Transmit inverted data to the TX/CK pin 0 = Transmit non-inverted data to the TX/CK pin Synchronous mode: 1 = Data is clocked on rising edge of the clock 0 = Data is clocked on falling edge of the clock bit 3 BRG16: 16-bit Baud Rate Generator bit 1 = 16-bit Baud Rate Generator is used 0 = 8-bit Baud Rate Generator is used bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE will automatically clear after RCIF is set. 0 = Receiver is operating normally Synchronous mode: Don’t care bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete) 0 = Auto-Baud Detect mode is disabled Synchronous mode: Don’t care  2011-2012 Microchip Technology Inc. DS41575C-page 287 PIC16(L)F1933 25.4 EUSART Baud Rate Generator (BRG) The Baud Rate Generator (BRG) is an 8-bit or 16-bit timer that is dedicated to the support of both the asynchronous and synchronous EUSART operation. By default, the BRG operates in 8-bit mode. Setting the BRG16 bit of the BAUDCON register selects 16-bit mode. The SPBRGH, SPBRGL register pair determines the period of the free running baud rate timer. In Asynchronous mode the multiplier of the baud rate period is determined by both the BRGH bit of the TXSTA register and the BRG16 bit of the BAUDCON register. In Synchronous mode, the BRGH bit is ignored. Table 25-3 contains the formulas for determining the baud rate. Example 25-1 provides a sample calculation for determining the baud rate and baud rate error. Typical baud rates and error values for various asynchronous modes have been computed for your convenience and are shown in Table 25-3. It may be advantageous to use the high baud rate (BRGH = 1), or the 16-bit BRG (BRG16 = 1) to reduce the baud rate error. The 16-bit BRG mode is used to achieve slow baud rates for fast oscillator frequencies. EXAMPLE 25-1: CALCULATING BAUD RATE ERROR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: F OS C Desired Baud Rate = --------------------------------------------------------------------64  [SPBRGH:SPBRG] + 1  Solving for SPBRGH:SPBRGL: FOSC --------------------------------------------Desired Baud Rate X = --------------------------------------------- – 1 64 16000000 -----------------------9600 = ------------------------ – 1 64 =  25.042  = 25 16000000 Calculated Baud Rate = --------------------------64  25 + 1  = 9615 Calc. Baud Rate – Desired Baud Rate Error = -------------------------------------------------------------------------------------------Desired Baud Rate  9615 – 9600  = ---------------------------------- = 0.16% 9600 Writing a new value to the SPBRGH, SPBRGL register pair causes the BRG timer to be reset (or cleared). This ensures that the BRG does not wait for a timer overflow before outputting the new baud rate. If the system clock is changed during an active receive operation, a receive error or data loss may result. To avoid this problem, check the status of the RCIDL bit to make sure that the receive operation is Idle before changing the system clock. DS41575C-page 288  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 25-3: BAUD RATE FORMULAS Configuration Bits BRG/EUSART Mode Baud Rate Formula 0 8-bit/Asynchronous FOSC/[64 (n+1)] 0 1 8-bit/Asynchronous 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous 1 x 16-bit/Synchronous SYNC BRG16 BRGH 0 0 0 1 Legend: Name BAUDCON SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 286 SPBRGL BRG SPBRGH BRG TXSTA FOSC/[4 (n+1)] x = Don’t care, n = value of SPBRGH, SPBRGL register pair TABLE 25-4: RCSTA FOSC/[16 (n+1)] CSRC TX9 TXEN SYNC SENDB 288* 288* BRGH TRMT TX9D 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for the Baud Rate Generator. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 289 PIC16(L)F1933 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE FOSC = 32.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 20.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 18.432 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — — — — 1200 — — — 1221 1.73 255 1200 0.00 239 1200 0.00 143 2400 2404 0.16 207 2404 0.16 129 2400 0.00 119 2400 0.00 71 9600 9615 0.16 51 9470 -1.36 32 9600 0.00 29 9600 0.00 17 10417 10417 0.00 47 10417 0.00 29 10286 -1.26 27 10165 -2.42 16 19.2k 19.23k 0.16 25 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8 57.6k 55.55k -3.55 3 — — — 57.60k 0.00 7 57.60k 0.00 2 115.2k — — — — — — — — — — — — SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE FOSC = 8.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 4.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 3.6864 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 1.000 MHz Actual Rate % Error SPBRG value (decimal) 300 — — — 300 0.16 207 300 0.00 191 300 0.16 51 1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12 2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — — 9600 9615 0.16 12 — — — 9600 0.00 5 — — — 10417 10417 0.00 11 10417 0.00 5 — — — — — — 19.2k — — — — — — 19.20k 0.00 2 — — — 57.6k — — — — — — 57.60k 0.00 0 — — — 115.2k — — — — — — — — — — — — SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE FOSC = 32.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 20.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 18.432 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) 300 — — — — — — — — — — — — 1200 — — — — — — — — — — — — 2400 — — — — — — — — — — — — 9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71 10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65 19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 57.6k 57.14k -0.79 34 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11 115.2k 117.64k 2.12 16 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5 DS41575C-page 290  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE FOSC = 8.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 4.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 3.6864 MHz Actual Rate FOSC = 1.000 MHz % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 1200 — — — — — — — 1202 — 0.16 — 207 — 1200 — 0.00 — 191 300 1202 0.16 0.16 207 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 — 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — — SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE FOSC = 32.000 MHz Actual Rate FOSC = 20.000 MHz % Error SPBRG value (decimal) Actual Rate FOSC = 18.432 MHz % Error SPBRG value (decimal) Actual Rate FOSC = 11.0592 MHz % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 300.0 0.00 6666 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303 1200 1200 -0.02 3332 1200 -0.03 1041 1200 0.00 959 1200 0.00 575 2400 2401 -0.04 832 2399 -0.03 520 2400 0.00 479 2400 0.00 287 71 9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65 19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 57.6k 57.14k -0.79 34 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11 115.2k 117.6k 2.12 16 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5 SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE FOSC = 8.000 MHz Actual Rate % Error SPBRG value (decimal) FOSC = 4.000 MHz Actual Rate FOSC = 3.6864 MHz % Error SPBRG value (decimal) Actual Rate FOSC = 1.000 MHz % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207 1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51 2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25 9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — — 10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5 19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — — 57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — — 115.2k — — — — — — 115.2k 0.00 1 — — —  2011-2012 Microchip Technology Inc. DS41575C-page 291 PIC16(L)F1933 TABLE 25-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz Actual Rate % Error SPBRG value (decimal) 300 1200 300.0 1200 0.00 0.00 26666 6666 300.0 1200 0.00 -0.01 16665 4166 300.0 1200 0.00 0.00 15359 3839 300.0 1200 0.00 0.00 9215 2303 2400 2400 0.01 3332 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151 Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 9600 9604 0.04 832 9597 -0.03 520 9600 0.00 479 9600 0.00 287 10417 10417 0.00 767 10417 0.00 479 10425 0.08 441 10433 0.16 264 19.2k 19.18k -0.08 416 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143 57.6k 57.55k -0.08 138 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47 115.2k 115.9k 0.64 68 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23 SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE FOSC = 8.000 MHz Actual Rate FOSC = 4.000 MHz % Error SPBRG value (decimal) Actual Rate FOSC = 3.6864 MHz % Error SPBRG value (decimal) Actual Rate FOSC = 1.000 MHz % Error SPBRG value (decimal) Actual Rate % Error SPBRG value (decimal) 832 300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207 2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103 9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25 10417 10417 0 191 10417 0.00 95 10473 0.53 87 10417 0.00 23 19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12 57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — — 115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — — DS41575C-page 292  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.4.1 AUTO-BAUD DETECT The EUSART module supports automatic detection and calibration of the baud rate. and SPBRGL registers are clocked at 1/8th the BRG base clock rate. The resulting byte measurement is the average bit time when clocked at full speed. In the Auto-Baud Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. The Baud Rate Generator is used to time the period of a received 55h (ASCII “U”) which is the Sync character for the LIN bus. The unique feature of this character is that it has five rising edges including the Stop bit edge. Setting the ABDEN bit of the BAUDCON register starts the auto-baud calibration sequence (Figure 25-6). While the ABD sequence takes place, the EUSART state machine is held in Idle. On the first rising edge of the receive line, after the Start bit, the SPBRG begins counting up using the BRG counter clock as shown in Table 25-6. The fifth rising edge will occur on the RX pin at the end of the eighth bit period. At that time, an accumulated value totaling the proper BRG period is left in the SPBRGH, SPBRGL register pair, the ABDEN bit is automatically cleared and the RCIF interrupt flag is set. The value in the RCREG needs to be read to clear the RCIF interrupt. RCREG content should be discarded. When calibrating for modes that do not use the SPBRGH register the user can verify that the SPBRGL register did not overflow by checking for 00h in the SPBRGH register. Note 1: If the WUE bit is set with the ABDEN bit, auto-baud detection will occur on the byte following the Break character (see Section 25.4.3 “Auto-Wake-up on Break”). 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible. 3: During the auto-baud process, the auto-baud counter starts counting at 1. Upon completion of the auto-baud sequence, to achieve maximum accuracy, subtract 1 from the SPBRGH:SPBRGL register pair. TABLE 25-6: The BRG auto-baud clock is determined by the BRG16 and BRGH bits as shown in Table 25-6. During ABD, both the SPBRGH and SPBRGL registers are used as a 16-bit counter, independent of the BRG16 bit setting. While calibrating the baud rate period, the SPBRGH FIGURE 25-6: BRG16 BRGH BRG Base Clock BRG ABD Clock 0 0 FOSC/64 FOSC/512 0 1 FOSC/16 FOSC/128 1 0 FOSC/16 FOSC/128 1 FOSC/4 FOSC/32 1 Note: During the ABD sequence, SPBRGL and SPBRGH registers are both used as a 16-bit counter, independent of BRG16 setting. AUTOMATIC BAUD RATE CALIBRATION XXXXh BRG Value BRG COUNTER CLOCK RATES 0000h RX pin 001Ch Start Edge #1 bit 1 bit 0 Edge #2 bit 3 bit 2 Edge #3 bit 5 bit 4 Edge #4 bit 7 bit 6 Edge #5 Stop bit BRG Clock Auto Cleared Set by User ABDEN bit RCIDL RCIF bit (Interrupt) Read RCREG SPBRGL XXh 1Ch SPBRGH XXh 00h Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode.  2011-2012 Microchip Technology Inc. DS41575C-page 293 PIC16(L)F1933 25.4.2 AUTO-BAUD OVERFLOW During the course of automatic baud detection, the ABDOVF bit of the BAUDCON register will be set if the baud rate counter overflows before the fifth rising edge is detected on the RX pin. The ABDOVF bit indicates that the counter has exceeded the maximum count that can fit in the 16 bits of the SPBRGH:SPBRGL register pair. After the ABDOVF bit has been set, the counter continues to count until the fifth rising edge is detected on the RX pin. Upon detecting the fifth RX edge, the hardware will set the RCIF interrupt flag and clear the ABDEN bit of the BAUDCON register. The RCIF flag can be subsequently cleared by reading the RCREG register. The ABDOVF flag of the BAUDCON register can be cleared by software directly. To terminate the auto-baud process before the RCIF flag is set, clear the ABDEN bit then clear the ABDOVF bit of the BAUDCON register. The ABDOVF bit will remain set if the ABDEN bit is not cleared first. 25.4.3 AUTO-WAKE-UP ON BREAK During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper character reception cannot be performed. The Auto-Wake-up feature allows the controller to wake-up due to activity on the RX/DT line. This feature is available only in Asynchronous mode. The Auto-Wake-up feature is enabled by setting the WUE bit of the BAUDCON register. Once set, the normal receive sequence on RX/DT is disabled, and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a wake-up signal character for the LIN protocol.) The EUSART module generates an RCIF interrupt coincident with the wake-up event. The interrupt is generated synchronously to the Q clocks in normal CPU operating modes (Figure 25-7), and asynchronously if the device is in Sleep mode (Figure 25-8). The interrupt condition is cleared by reading the RCREG register. 25.4.3.1 Special Considerations Break Character To avoid character errors or character fragments during a wake-up event, the wake-up character must be all zeros. When the wake-up is enabled the function works independent of the low time on the data stream. If the WUE bit is set and a valid non-zero character is received, the low time from the Start bit to the first rising edge will be interpreted as the wake-up event. The remaining bits in the character will be received as a fragmented character and subsequent characters can result in framing or overrun errors. Therefore, the initial character in the transmission must be all ‘0’s. This must be ten or more bit times, 13-bit times recommended for LIN bus, or any number of bit times for standard RS-232 devices. Oscillator Start-up Time Oscillator start-up time must be considered, especially in applications using oscillators with longer start-up intervals (i.e., LP, XT or HS/PLL mode). The Sync Break (or wake-up signal) character must be of sufficient length, and be followed by a sufficient interval, to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. WUE Bit The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared in hardware by a rising edge on RX/DT. The interrupt condition is then cleared in software by reading the RCREG register and discarding its contents. To ensure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process before setting the WUE bit. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. The WUE bit is automatically cleared by the low-to-high transition on the RX line at the end of the Break. This signals to the user that the Break event is over. At this point, the EUSART module is in Idle mode waiting to receive the next character. DS41575C-page 294  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 25-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Auto Cleared Bit set by user WUE bit RX/DT Line RCIF Note 1: Cleared due to User Read of RCREG The EUSART remains in Idle while the WUE bit is set. FIGURE 25-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 OSC1 Auto Cleared Bit Set by User WUE bit RX/DT Line Note 1 RCIF Sleep Command Executed Note 1: 2: Sleep Ends Cleared due to User Read of RCREG If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. The EUSART remains in Idle while the WUE bit is set.  2011-2012 Microchip Technology Inc. DS41575C-page 295 PIC16(L)F1933 25.4.4 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. A Break character consists of a Start bit, followed by 12 ‘0’ bits and a Stop bit. To send a Break character, set the SENDB and TXEN bits of the TXSTA register. The Break character transmission is then initiated by a write to the TXREG. The value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). The TRMT bit of the TXSTA register indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 25-9 for the timing of the Break character sequence. 25.4.4.1 Break and Sync Transmit Sequence The following sequence will start a message frame header made up of a Break, followed by an auto-baud Sync byte. This sequence is typical of a LIN bus master. 1. 2. 3. 4. 5. 25.4.5 RECEIVING A BREAK CHARACTER The Enhanced EUSART module can receive a Break character in two ways. The first method to detect a Break character uses the FERR bit of the RCSTA register and the Received data as indicated by RCREG. The Baud Rate Generator is assumed to have been initialized to the expected baud rate. A Break character has been received when; • RCIF bit is set • FERR bit is set • RCREG = 00h The second method uses the Auto-Wake-up feature described in Section 25.4.3 “Auto-Wake-up on Break”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt, and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Detect feature. For both methods, the user can set the ABDEN bit of the BAUDCON register before placing the EUSART in Sleep mode. Configure the EUSART for the desired mode. Set the TXEN and SENDB bits to enable the Break sequence. Load the TXREG with a dummy character to initiate transmission (the value is ignored). Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. After the Break has been sent, the SENDB bit is reset by hardware and the Sync character is then transmitted. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. FIGURE 25-9: Write to TXREG SEND BREAK CHARACTER SEQUENCE Dummy Write BRG Output (Shift Clock) TX (pin) Start bit bit 0 bit 1 bit 11 Stop bit Break TXIF bit (Transmit Interrupt Flag) TRMT bit (Transmit Shift Empty Flag) SENDB (send Break control bit) DS41575C-page 296 SENDB Sampled Here Auto Cleared  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.5 EUSART Synchronous Mode Synchronous serial communications are typically used in systems with a single master and one or more slaves. The master device contains the necessary circuitry for baud rate generation and supplies the clock for all devices in the system. Slave devices can take advantage of the master clock by eliminating the internal clock generation circuitry. There are two signal lines in Synchronous mode: a bidirectional data line and a clock line. Slaves use the external clock supplied by the master to shift the serial data into and out of their respective receive and transmit shift registers. Since the data line is bidirectional, synchronous operation is half-duplex only. Half-duplex refers to the fact that master and slave devices can receive and transmit data, but not both simultaneously. The EUSART can operate as either a master or slave device. Start and Stop bits are not used in synchronous transmissions. 25.5.1 SYNCHRONOUS MASTER MODE Clearing the SCKP bit sets the Idle state as low. When the SCKP bit is cleared, the data changes on the rising edge of each clock. 25.5.1.3 Data is transferred out of the device on the RX/DT pin. The RX/DT and TX/CK pin output drivers are automatically enabled when the EUSART is configured for synchronous master transmit operation. A transmission is initiated by writing a character to the TXREG register. If the TSR still contains all or part of a previous character the new character data is held in the TXREG until the last bit of the previous character has been transmitted. If this is the first character, or the previous character has been completely flushed from the TSR, the data in the TXREG is immediately transferred to the TSR. The transmission of the character commences immediately following the transfer of the data to the TSR from the TXREG. Each data bit changes on the leading edge of the master clock and remains valid until the subsequent leading clock edge. Note: The TSR register is not mapped in data memory, so it is not available to the user. 25.5.1.4 Synchronous Master Transmission Set-up: The following bits are used to configure the EUSART for synchronous master operation: • • • • • SYNC = 1 CSRC = 1 SREN = 0 (for transmit); SREN = 1 (for receive) CREN = 0 (for transmit); CREN = 1 (for receive) SPEN = 1 Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Setting the CSRC bit of the TXSTA register configures the device as a master. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 25.5.1.1 25.5.1.2 1. 2. 3. 4. 5. 6. Master Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a master transmits the clock on the TX/CK line. The TX/CK pin output driver is automatically enabled when the EUSART is configured for synchronous transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are generated as there are data bits. Synchronous Master Transmission 7. 8. Initialize the SPBRGH, SPBRGL register pair and the BRGH and BRG16 bits to achieve the desired baud rate (see Section 25.4 “EUSART Baud Rate Generator (BRG)”). Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. Disable Receive mode by clearing bits SREN and CREN. Enable Transmit mode by setting the TXEN bit. If 9-bit transmission is desired, set the TX9 bit. If interrupts are desired, set the TXIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. If 9-bit transmission is selected, the ninth bit should be loaded in the TX9D bit. Start transmission by loading data to the TXREG register. Clock Polarity A clock polarity option is provided for Microwire compatibility. Clock polarity is selected with the SCKP bit of the BAUDCON register. Setting the SCKP bit sets the clock Idle state as high. When the SCKP bit is set, the data changes on the falling edge of each clock.  2011-2012 Microchip Technology Inc. DS41575C-page 297 PIC16(L)F1933 FIGURE 25-10: SYNCHRONOUS TRANSMISSION RX/DT pin bit 0 bit 1 Word 1 bit 2 bit 7 bit 0 bit 1 Word 2 bit 7 TX/CK pin (SCKP = 0) TX/CK pin (SCKP = 1) Write to TXREG Reg Write Word 1 Write Word 2 TXIF bit (Interrupt Flag) TRMT bit TXEN bit Note: ‘1’ ‘1’ Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words. FIGURE 25-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) RX/DT pin bit 0 bit 1 bit 2 bit 6 bit 7 TX/CK pin Write to TXREG reg TXIF bit TRMT bit TXEN bit DS41575C-page 298  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 25-7: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D Name BAUDCON INTCON RCSTA 286 SPBRGL BRG 288* SPBRGH BRG 288* TRISC TXREG TXSTA TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 SYNC SENDB BRGH TRMT TX9D EUSART Transmit Data Register CSRC TX9 TXEN 125 277* 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 299 PIC16(L)F1933 25.5.1.5 Synchronous Master Reception Data is received at the RX/DT pin. The RX/DT pin output driver is automatically disabled when the EUSART is configured for synchronous master receive operation. In Synchronous mode, reception is enabled by setting either the Single Receive Enable bit (SREN of the RCSTA register) or the Continuous Receive Enable bit (CREN of the RCSTA register). When SREN is set and CREN is clear, only as many clock cycles are generated as there are data bits in a single character. The SREN bit is automatically cleared at the completion of one character. When CREN is set, clocks are continuously generated until CREN is cleared. If CREN is cleared in the middle of a character the CK clock stops immediately and the partial character is discarded. If SREN and CREN are both set, then SREN is cleared at the completion of the first character and CREN takes precedence. To initiate reception, set either SREN or CREN. Data is sampled at the RX/DT pin on the trailing edge of the TX/CK clock pin and is shifted into the Receive Shift Register (RSR). When a complete character is received into the RSR, the RCIF bit is set and the character is automatically transferred to the two character receive FIFO. The Least Significant eight bits of the top character in the receive FIFO are available in RCREG. The RCIF bit remains set as long as there are unread characters in the receive FIFO. 25.5.1.6 Slave Clock Synchronous data transfers use a separate clock line, which is synchronous with the data. A device configured as a slave receives the clock on the TX/CK line. The TX/CK pin output driver is automatically disabled when the device is configured for synchronous slave transmit or receive operation. Serial data bits change on the leading edge to ensure they are valid at the trailing edge of each clock. One data bit is transferred for each clock cycle. Only as many clock cycles should be received as there are data bits. 25.5.1.7 Receive Overrun Error The receive FIFO buffer can hold two characters. An overrun error will be generated if a third character, in its entirety, is received before RCREG is read to access the FIFO. When this happens, the OERR bit of the RCSTA register is set. Previous data in the FIFO will not be overwritten. The two characters in the FIFO buffer can be read, however, no additional characters will be received until the error is cleared. The OERR bit can only be cleared by clearing the overrun condition. If the overrun error occurred when the SREN bit is set and CREN is clear then the error is cleared by reading RCREG. If the overrun occurred when the CREN bit is DS41575C-page 300 set then the error condition is cleared by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. 25.5.1.8 Receiving 9-bit Characters The EUSART supports 9-bit character reception. When the RX9 bit of the RCSTA register is set the EUSART will shift 9-bits into the RSR for each character received. The RX9D bit of the RCSTA register is the ninth, and Most Significant, data bit of the top unread character in the receive FIFO. When reading 9-bit data from the receive FIFO buffer, the RX9D data bit must be read before reading the eight Least Significant bits from the RCREG. 25.5.1.9 Synchronous Master Reception Set-up: 1. Initialize the SPBRGH, SPBRGL register pair for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Clear the ANSEL bit for the RX pin (if applicable). 3. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 4. Ensure bits CREN and SREN are clear. 5. If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. 6. If 9-bit reception is desired, set bit RX9. 7. Start reception by setting the SREN bit or for continuous reception, set the CREN bit. 8. Interrupt flag bit RCIF will be set when reception of a character is complete. An interrupt will be generated if the enable bit RCIE was set. 9. Read the RCSTA register to get the ninth bit (if enabled) and determine if any error occurred during reception. 10. Read the 8-bit received data by reading the RCREG register. 11. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 25-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) RX/DT pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 TX/CK pin (SCKP = 0) TX/CK pin (SCKP = 1) Write to bit SREN SREN bit CREN bit ‘0’ ‘0’ RCIF bit (Interrupt) Read RXREG Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TABLE 25-8: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 RCREG EUSART Receive Data Register RCSTA RX9 CREN ADDEN FERR OERR RX9D Name BAUDCON INTCON SPEN SREN 280* 286 SPBRGL BRG 288* SPBRGH BRG 288* TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 301 PIC16(L)F1933 25.5.2 SYNCHRONOUS SLAVE MODE The following bits are used to configure the EUSART for synchronous slave operation: • • • • • SYNC = 1 CSRC = 0 SREN = 0 (for transmit); SREN = 1 (for receive) CREN = 0 (for transmit); CREN = 1 (for receive) SPEN = 1 1. 2. 3. 4. Setting the SYNC bit of the TXSTA register configures the device for synchronous operation. Clearing the CSRC bit of the TXSTA register configures the device as a slave. Clearing the SREN and CREN bits of the RCSTA register ensures that the device is in the Transmit mode, otherwise the device will be configured to receive. Setting the SPEN bit of the RCSTA register enables the EUSART. 25.5.2.1 If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: 5. 25.5.2.2 1. EUSART Synchronous Slave Transmit The operation of the Synchronous Master and Slave Section 25.5.1.3 modes are identical (see “Synchronous Master Transmission”), except in the case of the Sleep mode. 2. 3. 4. 5. 6. 7. 8. TABLE 25-9: The first character will immediately transfer to the TSR register and transmit. The second word will remain in TXREG register. The TXIF bit will not be set. After the first character has been shifted out of TSR, the TXREG register will transfer the second character to the TSR and the TXIF bit will now be set. If the PEIE and TXIE bits are set, the interrupt will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will call the Interrupt Service Routine. Synchronous Slave Transmission Set-up: Set the SYNC and SPEN bits and clear the CSRC bit. Clear the ANSEL bit for the CK pin (if applicable). Clear the CREN and SREN bits. If interrupts are desired, set the TXIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. If 9-bit transmission is desired, set the TX9 bit. Enable transmission by setting the TXEN bit. If 9-bit transmission is selected, insert the Most Significant bit into the TX9D bit. Start transmission by writing the Least Significant eight bits to the TXREG register. SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on Page ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 287 GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 82 PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 86 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 286 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 Name BAUDCON INTCON TXREG TXSTA EUSART Transmit Data Register CSRC TX9 TXEN 277* SYNC SENDB BRGH TRMT TX9D 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission. * Page provides register information. DS41575C-page 302  2011-2012 Microchip Technology Inc. PIC16(L)F1933 25.5.2.3 EUSART Synchronous Slave Reception 25.5.2.4 The operation of the Synchronous Master and Slave modes is identical (Section 25.5.1.5 “Synchronous Master Reception”), with the following exceptions: • Sleep • CREN bit is always set, therefore the receiver is never Idle • SREN bit, which is a “don’t care” in Slave mode 1. 2. 3. A character may be received while in Sleep mode by setting the CREN bit prior to entering Sleep. Once the word is received, the RSR register will transfer the data to the RCREG register. If the RCIE enable bit is set, the interrupt generated will wake the device from Sleep and execute the next instruction. If the GIE bit is also set, the program will branch to the interrupt vector. 4. 5. 6. 7. 8. 9. Synchronous Slave Reception Set-up: Set the SYNC and SPEN bits and clear the CSRC bit. Clear the ANSEL bit for both the CK and DT pins (if applicable). If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. If 9-bit reception is desired, set the RX9 bit. Set the CREN bit to enable reception. The RCIF bit will be set when reception is complete. An interrupt will be generated if the RCIE bit was set. If 9-bit mode is enabled, retrieve the Most Significant bit from the RX9D bit of the RCSTA register. Retrieve the eight Least Significant bits from the receive FIFO by reading the RCREG register. If an overrun error occurs, clear the error by either clearing the CREN bit of the RCSTA register or by clearing the SPEN bit which resets the EUSART. TABLE 25-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name Bit 7 Bit 6 ABDOVF GIE PIE1 Bit 2 Bit 1 Bit 0 Register on Page BRG16 — WUE ABDEN 287 IOCIE TMR0IF INTF IOCIF 82 TXIE SSPIE CCP1IE TMR2IE TMR1IE 83 TXIF SSPIF CCP1IF TMR2IF TMR1IF Bit 5 Bit 4 Bit 3 RCIDL — SCKP PEIE TMR0IE INTE TMR1GIE ADIE RCIE PIR1 TMR1GIF ADIF RCIF RCREG EUSART Receive Data Register BAUDCON INTCON 86 280* RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 286 TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 125 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 285 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. * Page provides register information.  2011-2012 Microchip Technology Inc. DS41575C-page 303 PIC16(L)F1933 25.6 EUSART Operation During Sleep The EUSART will remain active during Sleep only in the Synchronous Slave mode. All other modes require the system clock and therefore cannot generate the necessary signals to run the Transmit or Receive Shift registers during Sleep. Synchronous Slave mode uses an externally generated clock to run the Transmit and Receive Shift registers. 25.6.1 SYNCHRONOUS RECEIVE DURING SLEEP To receive during Sleep, all the following conditions must be met before entering Sleep mode: • RCSTA and TXSTA Control registers must be configured for Synchronous Slave Reception (see Section 25.5.2.4 “Synchronous Slave Reception Set-up:”). • If interrupts are desired, set the RCIE bit of the PIE1 register and the GIE and PEIE bits of the INTCON register. • The RCIF interrupt flag must be cleared by reading RCREG to unload any pending characters in the receive buffer. Upon entering Sleep mode, the device will be ready to accept data and clocks on the RX/DT and TX/CK pins, respectively. When the data word has been completely clocked in by the external device, the RCIF interrupt flag bit of the PIR1 register will be set. Thereby, waking the processor from Sleep. 25.6.2 SYNCHRONOUS TRANSMIT DURING SLEEP To transmit during Sleep, all the following conditions must be met before entering Sleep mode: • RCSTA and TXSTA Control registers must be configured for Synchronous Slave Transmission (see Section 25.5.2.2 “Synchronous Slave Transmission Set-up:”). • The TXIF interrupt flag must be cleared by writing the output data to the TXREG, thereby filling the TSR and transmit buffer. • If interrupts are desired, set the TXIE bit of the PIE1 register and the PEIE bit of the INTCON register. • Interrupt enable bits TXIE of the PIE1 register and PEIE of the INTCON register must set. Upon entering Sleep mode, the device will be ready to accept clocks on TX/CK pin and transmit data on the RX/DT pin. When the data word in the TSR has been completely clocked out by the external device, the pending byte in the TXREG will transfer to the TSR and the TXIF flag will be set. Thereby, waking the processor from Sleep. At this point, the TXREG is available to accept another character for transmission, which will clear the TXIF flag. Upon waking from Sleep, the instruction following the SLEEP instruction will be executed. If the Global Interrupt Enable (GIE) bit is also set then the Interrupt Service Routine at address 0004h will be called. Upon waking from Sleep, the instruction following the SLEEP instruction will be executed. If the Global Interrupt Enable (GIE) bit of the INTCON register is also set, then the Interrupt Service Routine at address 004h will be called. DS41575C-page 304  2011-2012 Microchip Technology Inc. PIC16(L)F1933 26.0 CAPACITIVE SENSING (CPS) MODULE The Capacitive Sensing (CPS) module allows for an interaction with an end user without a mechanical interface. In a typical application, the CPS module is attached to a pad on a Printed Circuit Board (PCB), which is electrically isolated from the end user. When the end user places their finger over the PCB pad, a capacitive load is added, causing a frequency shift in the CPS module. The CPS module requires software and at least one timer resource to determine the change in frequency. Key features of this module include: • • • • • • • Analog MUX for monitoring multiple inputs Capacitive sensing oscillator Multiple current ranges Multiple voltage reference modes Multiple timer resources Software control Operation during Sleep FIGURE 26-1: CAPACITIVE SENSING BLOCK DIAGRAM Timer0 Module FOSC/4 T0CKI CPSCH CPSON(1) Set TMR0IF TMR0CS T0XCS 0 1 0 TMR0 Overflow 1 CPSRNG CPS0 CPSON CPS1 CPS2 Capacitive Sensing Oscillator CPS3 CPS4 Timer1 Module T1CS CPSOSC CPS5 CPS6 CPS7 Ref- Int. Ref. 0 1 CPSCLK FOSC FOSC/4 T1OSC/ T1CKI DAC Output 0 Ref+ 1 FVR EN TMR1H:TMR1L T1GSEL T1G CPSOUT sync_C1OUT sync_C2OUT Timer1 Gate Control Logic CPSRM Note 1: If CPSON = 0, disabling capacitive sensing, no channel is selected.  2011-2012 Microchip Technology Inc. DS41575C-page 305 PIC16(L)F1933 FIGURE 26-2: CAPACITIVE SENSING OSCILLATOR BLOCK DIAGRAM Oscillator Module VDD (1) + (2) - S CPSx (1) Analog Pin - (2) Q CPSCLK R + Internal References Ref- 0 0 1 Ref+ DAC 1 FVR CPSRM Note 1: 2: Module enable, voltage reference mode, and current range selections are not shown. Comparators remain active in Noise Detection mode. DS41575C-page 306  2011-2012 Microchip Technology Inc. PIC16(L)F1933 26.1 Analog MUX 26.3 Voltage Reference Modes The CPS module can monitor up to 16 inputs. The capacitive sensing inputs are defined as CPS. To determine if a frequency change has occurred the user must: The capacitive sensing oscillator uses voltage references to provide two voltage thresholds for oscillation. The upper voltage threshold is referred to as Ref+ and the lower voltage threshold is referred to as Ref-. • Select the appropriate CPS pin by setting the CPSCH bits of the CPSCON1 register. • Set the corresponding ANSEL bit. • Set the corresponding TRIS bit. • Run the software algorithm. The user can elect to use Fixed Voltage References, which are internal to the capacitive sensing oscillator, or variable voltage references, which are supplied by the Fixed Voltage Reference (FVR) module and the Digital-to-Analog Converter (DAC) module. Selection of the CPSx pin while the module is enabled will cause the capacitive sensing oscillator to be on the CPSx pin. Failure to set the corresponding ANSEL and TRIS bits can cause the capacitive sensing oscillator to stop, leading to false frequency readings. 26.2 Capacitive Sensing Oscillator The capacitive sensing oscillator consists of a constant current source and a constant current sink, to produce a triangle waveform. The CPSOUT bit of the CPSCON0 register shows the status of the capacitive sensing oscillator, whether it is a sinking or sourcing current. The oscillator is designed to drive a capacitive load (single PCB pad) and at the same time, be a clock source to either Timer0 or Timer1. The oscillator has several different current settings as defined by CPSRNG of the CPSCON0 register. The different current settings for the oscillator serve two purposes: • Maximize the number of counts in a timer for a fixed time base. • Maximize the count differential in the timer during a change in frequency.  2011-2012 Microchip Technology Inc. When the Fixed Voltage References are used, the VSS voltage determines the lower threshold level (Ref-) and the VDD voltage determines the upper threshold level (Ref+). When the variable voltage references are used, the DAC voltage determines the lower threshold level (Ref-) and the FVR voltage determines the upper threshold level (Ref+). An advantage of using these reference sources is that oscillation frequency remains constant with changes in VDD. Different oscillation frequencies can be obtained through the use of these variable voltage references. The more the upper voltage reference level is lowered and the more the lower voltage reference level is raised, the higher the capacitive sensing oscillator frequency becomes. Selection between the voltage references is controlled by the CPSRM bit of the CPSCON0 register. Setting this bit selects the variable voltage references and clearing this bit selects the fixed voltage references. Please see Section 14.0 “Fixed Voltage Reference (FVR)” and Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information on configuring the variable voltage levels. DS41575C-page 307 PIC16(L)F1933 26.4 Current Ranges The capacitive sensing oscillator can operate within different current ranges, depending on the voltage reference mode and current range selections. Within each of the two voltage reference modes, there are four current ranges. Selection between the voltage reference modes is controlled by the CPSRM bit of the CPSCON0 register. Clearing this bit selects the fixed voltage references provided by the capacitive sensing oscillator module. Setting this bit selects the variable voltage references supplied by the Fixed Voltage Reference (FVR) module and the Digital-to-Analog Converter (DAC) module. See Section Section 26.3 “Voltage Reference Modes” for more information on configuring the voltage references. The Noise Detection mode is unique in that it disables the constant current source associated with the selected input pin, but leaves the rest of the oscillator circuitry and pin structure active. This eliminates the oscillation frequency on the analog pin and greatly reduces the current consumed by the oscillator module. When noise is introduced onto the pin, the oscillator is driven at the frequency determined by the noise. This produces a detectable signal at the comparator stage, indicating the presence of activity on the pin. Figure 26-2 shows a more detailed drawing of the constant current sources and comparators associated with the oscillator and input pin. Selecting the current range within the voltage reference mode is controlled by configuring the CPSRNG bits in the CPSCON0 register. See Table 26-1 for proper current mode selection. TABLE 26-1: CURRENT RANGE MODE SELECTION CPSRM 1 0 Note 1: Voltage Reference Mode Variable Fixed CPSRNG Current Range(1) 00 Noise Detection 01 Low 10 Medium 11 High 00 Off 01 Low 10 Medium 11 High See Power-Down Currents (IPD) in Section 30.0 “Electrical Specifications” for more information. DS41575C-page 308  2011-2012 Microchip Technology Inc. PIC16(L)F1933 26.5 Timer Resources 26.7 To measure the change in frequency of the capacitive sensing oscillator, a fixed time base is required. For the period of the fixed time base, the capacitive sensing oscillator is used to clock either Timer0 or Timer1. The frequency of the capacitive sensing oscillator is equal to the number of counts in the timer divided by the period of the fixed time base. 26.6 Fixed Time Base To measure the frequency of the capacitive sensing oscillator, a fixed time base is required. Any timer resource or software loop can be used to establish the fixed time base. It is up to the end user to determine the method in which the fixed time base is generated. Note: 26.6.1 The fixed time base can not be generated by the timer resource that the capacitive sensing oscillator is clocking. TIMER0 To select Timer0 as the timer resource for the capacitive sensing module: • Set the T0XCS bit of the CPSCON0 register. • Clear the TMR0CS bit of the OPTION_REG register. Software Control The software portion of the capacitive sensing module is required to determine the change in frequency of the capacitive sensing oscillator. This is accomplished by the following: • Setting a fixed time base to acquire counts on Timer0 or Timer1. • Establishing the nominal frequency for the capacitive sensing oscillator. • Establishing the reduced frequency for the capacitive sensing oscillator due to an additional capacitive load. • Set the frequency threshold. 26.7.1 NOMINAL FREQUENCY (NO CAPACITIVE LOAD) To determine the nominal frequency of the capacitive sensing oscillator: • Remove any extra capacitive load on the selected CPSx pin. • At the start of the fixed time base, clear the timer resource. • At the end of the fixed time base save the value in the timer resource. When Timer0 is chosen as the timer resource, the capacitive sensing oscillator will be the clock source for Timer0. Refer to Section 20.0 “Timer0 Module” for additional information. The value of the timer resource is the number of oscillations of the capacitive sensing oscillator for the given time base. The frequency of the capacitive sensing oscillator is equal to the number of counts on in the timer divided by the period of the fixed time base. 26.6.2 26.7.2 TIMER1 To select Timer1 as the timer resource for the Capacitive Sensing module, set the TMR1CS of the T1CON register to ‘11’. When Timer1 is chosen as the timer resource, the capacitive sensing oscillator will be the clock source for Timer1. Because the Timer1 module has a gate control, developing a time base for the frequency measurement can be simplified by using the Timer0 overflow flag. It is recommend that the Timer0 overflow flag, in conjunction with the Toggle mode of the Timer1 gate, be used to develop the fixed time base required by the software portion of the Capacitive Sensing module. Refer to Section 21.11 “Register Definitions: Timer1 Control” for additional information. TABLE 26-2: TIMER1 ENABLE FUNCTION TMR1ON TMR1GE Timer1 Operation 0 0 Off 0 1 Off 1 0 On 1 1 Count Enabled by input  2011-2012 Microchip Technology Inc. REDUCED FREQUENCY (ADDITIONAL CAPACITIVE LOAD) The extra capacitive load will cause the frequency of the capacitive sensing oscillator to decrease. To determine the reduced frequency of the capacitive sensing oscillator: • Add a typical capacitive load on the selected CPSx pin. • Use the same fixed time base as the nominal frequency measurement. • At the start of the fixed time base, clear the timer resource. • At the end of the fixed time base save the value in the timer resource. The value of the timer resource is the number of oscillations of the capacitive sensing oscillator with an additional capacitive load. The frequency of the capacitive sensing oscillator is equal to the number of counts on in the timer divided by the period of the fixed time base. This frequency should be less than the value obtained during the nominal frequency measurement. DS41575C-page 309 PIC16(L)F1933 26.7.3 FREQUENCY THRESHOLD The frequency threshold should be placed midway between the value of nominal frequency and the reduced frequency of the capacitive sensing oscillator. Refer to Application Note AN1103, “Software Handling for Capacitive Sensing” (DS01103) for more detailed information on the software required for the capacitive sensing module. Note: For more information on general capacitive sensing refer to Application Notes: • AN1101, “Introduction to Capacitive Sensing” (DS01101) • AN1102, “Layout and Physical Design Guidelines for Capacitive Sensing” (DS01102) 26.8 Operation during Sleep The capacitive sensing oscillator will continue to run as long as the module is enabled, independent of the part being in Sleep. In order for the software to determine if a frequency change has occurred, the part must be awake. However, the part does not have to be awake when the timer resource is acquiring counts. Note: Timer0 does not operate when in Sleep, and therefore cannot be used for capacitive sense measurements in Sleep. DS41575C-page 310  2011-2012 Microchip Technology Inc. PIC16(L)F1933 26.9 Register Definitions: CPS Control REGISTER 26-1: CPSCON0: CAPACITIVE SENSING CONTROL REGISTER 0 R/W-0/0 R/W-0/0 U-0 U-0 CPSON CPSRM — — R/W-0/0 R/W-0/0 CPSRNG R-0/0 R/W-0/0 CPSOUT T0XCS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CPSON: CPS Module Enable bit 1 = CPS module is enabled 0 = CPS module is disabled bit 6 CPSRM: Capacitive Sensing Reference Mode bit 1 = Capacitive sensing module is in Variable Voltage Reference mode 0 = Capacitive sensing module is in Fixed Voltage Reference mode bit 5-4 Unimplemented: Read as ‘0’ bit 3-2 CPSRNG: Capacitive Sensing Current Range If CPSRM = 1 (Variable Voltage Reference mode): 11 = Oscillator is in high-current range 10 = Oscillator is in medium-current range 01 = Oscillator is in low-current range 00 = Oscillator is on. Noise Detection mode If CPSRM = 0 (Fixed Voltage Reference mode): 11 = Oscillator is in high-current range 10 = Oscillator is in medium-current range 01 = Oscillator is in low-current range 00 = Oscillator is off bit 1 CPSOUT: Capacitive Sensing Oscillator Status bit 1 = Oscillator is sourcing current (Current flowing out of the pin) 0 = Oscillator is sinking current (Current flowing into the pin) bit 0 T0XCS: Timer0 External Clock Source Select bit If TMR0CS = 1: The T0XCS bit controls which clock external to the core/Timer0 module supplies Timer0: 1 = Timer0 clock source is the capacitive sensing oscillator, CPSLK 0 = Timer0 clock source is the T0CKI pin If TMR0CS = 0: Timer0 clock source is controlled by the core/Timer0 module and is FOSC/4  2011-2012 Microchip Technology Inc. DS41575C-page 311 PIC16(L)F1933 REGISTER 26-2: CPSCON1: CAPACITIVE SENSING CONTROL REGISTER 1 U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 CPSCH bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 CPSCH: Capacitive Sensing Channel Select bits If CPSON = 0: These bits are ignored. No channel is selected. If CPSON = 1: 000 = channel 0, (CPS0) 001 = channel 1, (CPS1) 010 = channel 2, (CPS2) 011 = channel 3, (CPS3) 100 = channel 4, (CPS4) 101 = channel 5, (CPS5) 110 = channel 6, (CPS6) 111 = channel 7, (CPS7) TABLE 26-3: Name SUMMARY OF REGISTERS ASSOCIATED WITH CAPACITIVE SENSING Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 ANSELA — — ANSA5 ANSA4 ANSA3 ANSA2 ANSA1 ANSA0 117 ANSELB — — ANSB5 ANSB4 ANSB3 ANSB2 ANSB1 ANSB0 122 CPSCON0 CPSON CPSRM — — CPSRNG CPSOUT T0XCS CPSCON1 — — — — — WPUEN INTEDG TMR0CS TMR0SE OPTION_REG T1CON TMR1CS T1CKPS CPSCH Register on Page 311 312 PSA PS2 PS1 PS0 173 T1OSCEN T1SYNC — TMR1ON 183 TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 116 TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 121 Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the CPS module. DS41575C-page 312  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.0 LIQUID CRYSTAL DISPLAY (LCD) DRIVER MODULE Note: The Liquid Crystal Display (LCD) driver module generates the timing control to drive a static or multiplexed LCD panel. In the PIC16(L)F1933 device, the module drives the panels of up to four commons and up to 24 segments. The LCD module also provides control of the LCD pixel data. COM3 and SEG15 share the same physical pin on the PIC16(L)F1933, therefore SEG15 is not available when using 1/4 multiplex displays. The LCD driver module supports: • Direct driving of LCD panel • Three LCD clock sources with selectable prescaler • Up to four common pins: - Static (1 common) - 1/2 multiplex (2 commons) - 1/3 multiplex (3 commons) - 1/4 multiplex (4 commons) • Segment pins up to: - 16 (PIC16(L)F1933) • Static, 1/2 or 1/3 LCD Bias FIGURE 27-1: LCD DRIVER MODULE BLOCK DIAGRAM Data Bus SEG(1, 2) LCDDATAx Registers To I/O Pads(1) MUX Timing Control LCDCON LCDPS COM(2) To I/O Pads(1) LCDSEn FOSC/256 T1OSC LFINTOSC Note 1: 2: Clock Source Select and Prescaler These are not directly connected to the I/O pads, but may be tri-stated, depending on the configuration of the LCD module. COM3 and SEG15 share the same physical pin on the PIC16(L)F1933, therefore SEG15 is not available when using 1/4 multiplex displays.  2011-2012 Microchip Technology Inc. DS41575C-page 313 PIC16(L)F1933 27.1 LCD Registers TABLE 27-1: The module contains the following registers: • • • • • LCD Control register (LCDCON) LCD Phase register (LCDPS) LCD Reference Ladder register (LCDRL) LCD Contrast Control register (LCDCST) LCD Reference Voltage Control register (LCDREF) • Up to 3 LCD Segment Enable registers (LCDSEn) • Up to 12 LCD data registers (LCDDATAn) LCD SEGMENT AND DATA REGISTERS # of LCD Registers Device Segment Enable Data 2 8 PIC16(L)F1933 The LCDCON register (Register 27-1) controls the operation of the LCD driver module. The LCDPS register (Register 27-2) configures the LCD clock source prescaler and the type of waveform; Type-A or Type-B. The LCDSEn registers (Register 27-5) configure the functions of the port pins. The following LCDSEn registers are available: • LCDSE0 • LCDSE1 SE SE Once the module is initialized for the LCD panel, the individual bits of the LCDDATAn registers are cleared/set to represent a clear/dark pixel, respectively: • • • • • • • • LCDDATA0 LCDDATA1 LCDDATA3 LCDDATA4 LCDDATA6 LCDDATA7 LCDDATA9 LCDDATA10 SEGCOM0 SEGCOM0 SEGCOM1 SEGCOM1 SEGCOM2 SEGCOM2 SEGCOM3 SEGCOM3 As an example, Register 27-6. LCDDATAn is detailed in Once the module is configured, the LCDEN bit of the LCDCON register is used to enable or disable the LCD module. The LCD panel can also operate during Sleep by clearing the SLPEN bit of the LCDCON register. DS41575C-page 314  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.2 Register Definitions: Liquid Crystal Display (LCD) Control REGISTER 27-1: LCDCON: LIQUID CRYSTAL DISPLAY (LCD) CONTROL REGISTER R/W-0/0 R/W-0/0 R/C-0/0 U-0 LCDEN SLPEN WERR — R/W-0/0 R/W-0/0 R/W-1/1 CS R/W-1/1 LMUX bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDEN: LCD Driver Enable bit 1 = LCD driver module is enabled 0 = LCD driver module is disabled bit 6 SLPEN: LCD Driver Enable in Sleep Mode bit 1 = LCD driver module is disabled in Sleep mode 0 = LCD driver module is enabled in Sleep mode bit 5 WERR: LCD Write Failed Error bit 1 = LCDDATAn register written while the WA bit of the LCDPS register = 0 (must be cleared in software) 0 = No LCD write error bit 4 Unimplemented: Read as ‘0’ bit 3-2 CS: Clock Source Select bits 00 = FOSC/256 01 = T1OSC (Timer1) 1x = LFINTOSC (31 kHz) bit 1-0 LMUX: Commons Select bits LMUX Maximum Number of Pixels Bias PIC16(L)F1933 00 Static (COM0) 16 Static 01 1/2 (COM) 32 1/2 or 1/3 10 1/3 (COM) 48 1/2 or 1/3 11 Note 1: Multiplex 1/4 (COM) 60 (1) 1/3 On these devices, COM3 and SEG15 are shared on one pin, limiting the device from driving 64 pixels.  2011-2012 Microchip Technology Inc. DS41575C-page 315 PIC16(L)F1933 REGISTER 27-2: LCDPS: LCD PHASE REGISTER R/W-0/0 R/W-0/0 R-0/0 R-0/0 WFT BIASMD LCDA WA R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 LP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 WFT: Waveform Type bit 1 = Type-B phase changes on each frame boundary 0 = Type-A phase changes within each common type bit 6 BIASMD: Bias Mode Select bit When LMUX = 00: 0 = Static Bias mode (do not set this bit to ‘1’) When LMUX = 01: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX = 10: 1 = 1/2 Bias mode 0 = 1/3 Bias mode When LMUX = 11: 0 = 1/3 Bias mode (do not set this bit to ‘1’) bit 5 LCDA: LCD Active Status bit 1 = LCD driver module is active 0 = LCD driver module is inactive bit 4 WA: LCD Write Allow Status bit 1 = Writing to the LCDDATAn registers is allowed 0 = Writing to the LCDDATAn registers is not allowed bit 3-0 LP: LCD Prescaler Selection bits 1111 = 1:16 1110 = 1:15 1101 = 1:14 1100 = 1:13 1011 = 1:12 1010 = 1:11 1001 = 1:10 1000 = 1:9 0111 = 1:8 0110 = 1:7 0101 = 1:6 0100 = 1:5 0011 = 1:4 0010 = 1:3 0001 = 1:2 0000 = 1:1 DS41575C-page 316  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 27-3: LCDREF: LCD REFERENCE VOLTAGE CONTROL REGISTER R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 LCDIRE LCDIRS LCDIRI — VLCD3PE VLCD2PE VLCD1PE — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7 LCDIRE: LCD Internal Reference Enable bit 1 = Internal LCD Reference is enabled and connected to the Internal Contrast Control circuit 0 = Internal LCD Reference is disabled bit 6 LCDIRS: LCD Internal Reference Source bit If LCDIRE = 1: 0 = Internal LCD Contrast Control is powered by VDD 1 = Internal LCD Contrast Control is powered by a 3.072V output of the FVR If LCDIRE = 0: Internal LCD Contrast Control is unconnected. LCD bandgap buffer is disabled. bit 5 LCDIRI: LCD Internal Reference Ladder Idle Enable bit Allows the Internal FVR buffer to shut down when the LCD Reference Ladder is in power mode ‘B’ 1 = When the LCD Reference Ladder is in power mode ‘B’, the LCD Internal FVR buffer is disabled 0 = The LCD Internal FVR Buffer ignores the LCD Reference Ladder power mode bit 4 Unimplemented: Read as ‘0’ bit 3 VLCD3PE: VLCD3 Pin Enable bit 1 = The VLCD3 pin is connected to the internal bias voltage LCDBIAS3(1) 0 = The VLCD3 pin is not connected bit 2 VLCD2PE: VLCD2 Pin Enable bit 1 = The VLCD2 pin is connected to the internal bias voltage LCDBIAS2(1) 0 = The VLCD2 pin is not connected bit 1 VLCD1PE: VLCD1 Pin Enable bit 1 = The VLCD1 pin is connected to the internal bias voltage LCDBIAS1(1) 0 = The VLCD1 pin is not connected bit 0 Unimplemented: Read as ‘0’ Note 1: Normal pin controls of TRISx and ANSELx are unaffected.  2011-2012 Microchip Technology Inc. DS41575C-page 317 PIC16(L)F1933 REGISTER 27-4: LCDCST: LCD CONTRAST CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 — — — — — R/W-0/0 R/W-0/0 R/W-0/0 LCDCST bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared C = Only clearable bit bit 7-3 Unimplemented: Read as ‘0’ bit 2-0 LCDCST: LCD Contrast Control bits Selects the resistance of the LCD contrast control resistor ladder Bit Value = Resistor ladder 000 = Minimum Resistance (Maximum contrast). Resistor ladder is shorted. 001 = Resistor ladder is at 1/7th of maximum resistance 010 = Resistor ladder is at 2/7th of maximum resistance 011 = Resistor ladder is at 3/7th of maximum resistance 100 = Resistor ladder is at 4/7th of maximum resistance 101 = Resistor ladder is at 5/7th of maximum resistance 110 = Resistor ladder is at 6/7th of maximum resistance 111 = Resistor ladder is at maximum resistance (Minimum contrast) DS41575C-page 318  2011-2012 Microchip Technology Inc. PIC16(L)F1933 REGISTER 27-5: LCDSEn: LCD SEGMENT ENABLE REGISTERS R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 SEn SEn SEn SEn SEn SEn SEn SEn bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEn: Segment Enable bits 1 = Segment function of the pin is enabled 0 = I/O function of the pin is enabled REGISTER 27-6: R/W-x/u LCDDATAn: LCD DATA REGISTERS R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy SEGx-COMy bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 SEGx-COMy: Pixel On bits 1 = Pixel on (dark) 0 = Pixel off (clear)  2011-2012 Microchip Technology Inc. DS41575C-page 319 PIC16(L)F1933 27.3 LCD Clock Source Selection Using bits CS of the LCDCON register can select any of these clock sources. The LCD module has three possible clock sources: 27.3.1 • FOSC/256 • T1OSC • LFINTOSC The first clock source is the system clock divided by 256 (FOSC/256). This divider ratio is chosen to provide about 1 kHz output when the system clock is 8 MHz. The divider is not programmable. Instead, the LCD prescaler bits LP of the LCDPS register are used to set the LCD frame clock rate. LCD PRESCALER A 4-bit counter is available as a prescaler for the LCD clock. The prescaler is not directly readable or writable; its value is set by the LP bits of the LCDPS register, which determine the prescaler assignment and prescale ratio. The prescale values are selectable from 1:1 through 1:16. The second clock source is the T1OSC. This also gives about 1 kHz when a 32.768 kHz crystal is used with the Timer1 oscillator. To use the Timer1 oscillator as a clock source, the T1OSCEN bit of the T1CON register should be set. The third clock source is the 31 kHz LFINTOSC, which provides approximately 1 kHz output. The second and third clock sources may be used to continue running the LCD while the processor is in Sleep. FOSC LCD CLOCK GENERATION ÷256 To Ladder Power Control T1OSC 32 kHz Crystal Osc. Static ÷2 1/2 4-bit Prog Prescaler ÷ 32 Counter Segment Clock ÷1, 2, 3, 4 Ring Counter 1/3, 1/4 LFINTOSC Nominal = 31 kHz LP CS DS41575C-page 320 ÷4 COM0 COM1 COM2 COM3 FIGURE 27-2: LMUX  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.4 LCD Bias Voltage Generation The LCD module can be configured for one of three bias types: • Static Bias (two voltage levels: VSS and VLCD) • 1/2 Bias (three voltage levels: VSS, 1/2 VLCD and VLCD) • 1/3 Bias (four voltage levels: VSS, 1/3 VLCD, 2/3 VLCD and VLCD) FIGURE 27-3: TABLE 27-2: LCD BIAS VOLTAGES Static Bias 1/2 Bias 1/3 Bias LCD Bias 0 VSS VSS VSS LCD Bias 1 — 1/2 VDD 1/3 VDD LCD Bias 2 — 1/2 VDD 2/3 VDD LCD Bias 3 VLCD3 VLCD3 VLCD3 So that the user is not forced to place external components and use up to three pins for bias voltage generation, internal contrast control and an internal reference ladder are provided internally to the PIC16(L)F1933. Both of these features may be used in conjunction with the external VLCD pins, to provide maximum flexibility. Refer to Figure 27-3. LCD BIAS VOLTAGE GENERATION BLOCK DIAGRAM VDD 1.024V from FVR x3 LCDIRE LCDIRS LCDA 3.072V LCDRLP1 LCDRLP0 LCDIRE LCDIRS LCDA LCDCST VLCD3PE LCDA VLCD3 lcdbias3 VLCD2PE VLCD2 lcdbias2 BIASMD VLCD1PE VLCD1 lcdbias1 lcdbias0  2011-2012 Microchip Technology Inc. DS41575C-page 321 PIC16(L)F1933 27.5 LCD Bias Internal Reference Ladder The internal reference ladder can be used to divide the LCD bias voltage two or three equally spaced voltages that will be supplied to the LCD segment pins. To create this, the reference ladder consists of three matched resistors. Refer to Figure 27-3. 27.5.2 POWER MODES The internal reference ladder may be operated in one of three power modes. This allows the user to trade off LCD contrast for power in the specific application. The larger the LCD glass, the more capacitance is present on a physical LCD segment, requiring more current to maintain the same contrast level. When in 1/2 bias mode (BIASMD = 1), then the middle resistor of the ladder is shorted out so that only two voltages are generated. The current consumption of the ladder is higher in this mode, with the one resistor removed. Three different power modes are available, LP, MP and HP. The internal reference ladder can also be turned off for applications that wish to provide an external ladder or to minimize power consumption. Disabling the internal reference ladder results in all of the ladders being disconnected, allowing external voltages to be supplied. TABLE 27-3: Whenever the LCD module is inactive (LCDA = 0), the internal reference ladder will be turned off. 27.5.1 Power Mode BIAS MODE INTERACTION LCD INTERNAL LADDER POWER MODES (1/3 BIAS) Nominal Resistance of Entire Ladder Nominal IDD 3 Mohm 300 kohm 30 kohm 1 µA 10 µA 100 µA Low Medium High DS41575C-page 322  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.5.3 AUTOMATIC POWER MODE SWITCHING The LCDRL register allows switching between two power modes, designated ‘A’ and ‘B’. ‘A’ power mode is active for a programmable time, beginning at the time when the LCD segments transition. ‘B’ power mode is the remaining time before the segments or commons change again. The LRLAT bits select how long, if any, that the ‘A’ power mode is active. Refer to Figure 27-4. As an LCD segment is electrically only a capacitor, current is drawn only during the interval where the voltage is switching. To minimize total device current, the LCD internal reference ladder can be operated in a different power mode for the transition portion of the duration. This is controlled by the LCDRL Register (Register 27-7). FIGURE 27-4: To implement this, the 5-bit prescaler used to divide the 32 kHz clock down to the LCD controller’s 1 kHz base rate is used to select the power mode. LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A Single Segment Time 32 kHz Clock Ladder Power Control ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F ‘H00 ‘H01 Segment Clock ‘H3 LRLAT Segment Data LRLAT Power Mode Power Mode A COM0 Power Mode B Mode A V1 V0 V1 SEG0 V0 V1 COM0-SEG0 V0 -V1  2011-2012 Microchip Technology Inc. DS41575C-page 323 LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE A WAVEFORM (1/2 MUX, 1/2 BIAS DRIVE) Single Segment Time PIC16(L)F1933 DS41575C-page 324 FIGURE 27-5: Single Segment Time 32 kHz Clock Ladder Power Control ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F ‘H00 ‘H01 ‘H02 ‘H03 ‘H04 ‘H05 ‘H06 ‘H07 ‘H0E ‘H0F Segment Clock Segment Data Power Mode Power Mode A LRLAT = 011 Power Mode B Power Mode A Power Mode B LRLAT = 011 V2 V1 COM0-SEG0 V0 -V1 -V2  2011-2012 Microchip Technology Inc.  2011-2012 Microchip Technology Inc. FIGURE 27-6: LCD INTERNAL REFERENCE LADDER POWER MODE SWITCHING DIAGRAM – TYPE B WAVEFORM (1/2 MUX, 1/2 BIAS DRIVE) Single Segment Time Single Segment Time Single Segment Time Single Segment Time 32 kHz Clock Ladder Power Control ‘H00 ‘H01 ‘H02 ‘H03 ‘H0E ‘H0F ‘H10 ‘H11 ‘H12 ‘H13 ‘H1E ‘H1F ‘H00 ‘H01 ‘H02 ‘H03 ‘H0E ‘H0F ‘H10 ‘H11 ‘H12 ‘H13 ‘H1E ‘H1F Mode B Mode B Segment Clock Segment Data Power Mode Power Mode A LRLAT = 011 Power Mode B Power Mode A LRLAT = 011 Power Mode B Power Mode A LRLAT = 011 Power Power Mode A Power LRLAT = 011 V2 V1 COM0-SEG0 V0 -V1 DS41575C-page 325 PIC16(L)F1933 -V2 PIC16(L)F1933 REGISTER 27-7: R/W-0/0 LCDRL: LCD REFERENCE LADDER CONTROL REGISTERS R/W-0/0 LRLAP R/W-0/0 R/W-0/0 LRLBP U-0 R/W-0/0 — R/W-0/0 R/W-0/0 LRLAT bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 LRLAP: LCD Reference Ladder A Time Power Control bits During Time interval A (Refer to Figure 27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 5-4 LRLBP: LCD Reference Ladder B Time Power Control bits During Time interval B (Refer to Figure 27-4): 00 = Internal LCD Reference Ladder is powered down and unconnected 01 = Internal LCD Reference Ladder is powered in Low-Power mode 10 = Internal LCD Reference Ladder is powered in Medium-Power mode 11 = Internal LCD Reference Ladder is powered in High-Power mode bit 3 Unimplemented: Read as ‘0’ bit 2-0 LRLAT: LCD Reference Ladder A Time Interval Control bits Sets the number of 32 kHz clocks that the A Time Interval power mode is active For type A waveforms (WFT = 0): 000 = Internal LCD Reference Ladder is always in ‘B’ Power mode 001 = Internal LCD Reference Ladder is in ‘A’ power mode for 1 clock and ‘B’ power mode for 15 clocks 010 = Internal LCD Reference Ladder is in ‘A’ power mode for 2 clocks and ‘B’ power mode for 14 clocks 011 = Internal LCD Reference Ladder is in ‘A’ power mode for 3 clocks and ‘B’ power mode for 13 clocks 100 = Internal LCD Reference Ladder is in ‘A’ power mode for 4 clocks and ‘B’ power mode for 12 clocks 101 = Internal LCD Reference Ladder is in ‘A’ power mode for 5 clocks and ‘B’ power mode for 11 clocks 110 = Internal LCD Reference Ladder is in ‘A’ power mode for 6 clocks and ‘B’ power mode for 10 clocks 111 = Internal LCD Reference Ladder is in ‘A’ power mode for 7 clocks and ‘B’ power mode for 9 clocks For type B waveforms (WFT = 1): 000 = Internal LCD Reference Ladder is always in ‘B’ power mode. 001 = Internal LCD Reference Ladder is in ‘A’ power mode for 1 clock and ‘B’ power mode for 31 clocks 010 = Internal LCD Reference Ladder is in ‘A’ power mode for 2 clocks and ‘B’ power mode for 30 clocks 011 = Internal LCD Reference Ladder is in ‘A’ power mode for 3 clocks and ‘B’ power mode for 29 clocks 100 = Internal LCD Reference Ladder is in ‘A’ power mode for 4 clocks and ‘B’ power mode for 28 clocks 101 = Internal LCD Reference Ladder is in ‘A’ power mode for 5 clocks and ‘B’ power mode for 27 clocks 110 = Internal LCD Reference Ladder is in ‘A’ power mode for 6 clocks and ‘B’ power mode for 26 clocks 111 = Internal LCD Reference Ladder is in ‘A’ power mode for 7 clocks and ‘B’ power mode for 25 clocks DS41575C-page 326  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.5.4 CONTRAST CONTROL The LCD contrast control circuit consists of a seven-tap resistor ladder, controlled by the LCDCST bits. Refer to Figure 27-7. FIGURE 27-7: The contrast control circuit is used to decrease the output voltage of the signal source by a total of approximately 10%, when LCDCST = 111. Whenever the LCD module is inactive (LCDA = 0), the contrast control ladder will be turned off (open). INTERNAL REFERENCE AND CONTRAST CONTROL BLOCK DIAGRAM VDDIO 7 Stages R R R R 3.072V Analog MUX From FVR Buffer 7 To top of Reference Ladder 0 LCDCST 3 Internal Reference 27.5.5 Contrast Control INTERNAL REFERENCE Under firmware control, an internal reference for the LCD bias voltages can be enabled. When enabled, the source of this voltage can be either VDDIO or a voltage 3 times the main fixed voltage reference (3.072V). When no internal reference is selected, the LCD contrast control circuit is disabled and LCD bias must be provided externally. Whenever the LCD module is inactive (LCDA = 0), the internal reference will be turned off. When the internal reference is enabled and the Fixed Voltage Reference is selected, the LCDIRI bit can be used to minimize power consumption by tieing into the LCD Reference Ladder Automatic power mode switching. When LCDIRI = 1 and the LCD reference ladder is in power mode ‘B’, the LCD internal FVR buffer is disabled. 27.5.6 VLCD PINS The VLCD pins provide the ability for an external LCD bias network to be used instead of the internal ladder. Use of the VLCD pins does not prevent use of the internal ladder. Each VLCD pin has an independent control in the LCDREF register (Register 27-3), allowing access to any or all of the LCD Bias signals. This architecture allows for maximum flexibility in different applications For example, the VLCD pins may be used to add capacitors to the internal reference ladder, increasing the drive capacity. For applications where the internal contrast control is insufficient, the firmware can choose to only enable the VLCD3 pin, allowing an external contrast control circuit to use the internal reference divider. . Note: The LCD module automatically turns on the Fixed Voltage Reference when needed.  2011-2012 Microchip Technology Inc. DS41575C-page 327 PIC16(L)F1933 27.6 LCD Multiplex Types TABLE 27-5: The LCD driver module can be configured into one of four multiplex types: • • • • Static (only COM0 is used) 1/2 multiplex (COM are used) 1/3 multiplex (COM are used) 1/4 multiplex (COM are used) The LMUX bit setting of the LCDCON register decides which of the LCD common pins are used (see Table 27-4 for details). If the pin is a digital I/O, the corresponding TRIS bit controls the data direction. If the pin is a COM drive, then the TRIS setting of that pin is overridden. TABLE 27-4: COMMON PIN USAGE LMUX Multiplex COM3 COM2 FRAME FREQUENCY FORMULAS Multiplex Frame Frequency = Static Clock source/(4 x 1 x (LCD Prescaler) x 32)) 1/2 Clock source/(2 x 2 x (LCD Prescaler) x 32)) 1/3 Clock source/(1 x 3 x (LCD Prescaler) x 32)) 1/4 Clock source/(1 x 4 x (LCD Prescaler) x 32)) Note: Clock source is FOSC/256, T1OSC or LFINTOSC. TABLE 27-6: APPROXIMATE FRAME FREQUENCY (IN Hz) USING FOSC @ 8 MHz, TIMER1 @ 32.768 kHz OR LFINTOSC LP Static 1/2 1/3 1/4 COM1 2 122 122 162 122 3 81 81 108 81 4 61 61 81 61 49 49 65 49 Static 00 Unused Unused Unused 1/2 01 Unused Unused Active 1/3 10 Unused Active Active 5 1/4 11 Active Active Active 6 41 41 54 41 7 35 35 47 35 27.7 Segment Enables The LCDSEn registers are used to select the pin function for each segment pin. The selection allows each pin to operate as either an LCD segment driver or as one of the pin’s alternate functions. To configure the pin as a segment pin, the corresponding bits in the LCDSEn registers must be set to ‘1’. If the pin is a digital I/O, the corresponding TRIS bit controls the data direction. Any bit set in the LCDSEn registers overrides any bit settings in the corresponding TRIS register. Note: 27.8 On a Power-on Reset, these pins are configured as normal I/O, not LCD pins. Pixel Control The LCDDATAx registers contain bits which define the state of each pixel. Each bit defines one unique pixel. Register 27-6 shows the correlation of each bit in the LCDDATAx registers to the respective common and segment signals. Any LCD pixel location not being used for display can be used as general purpose RAM. 27.9 LCD Frame Frequency The rate at which the COM and SEG outputs change is called the LCD frame frequency. DS41575C-page 328  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 27-7: LCD Function LCD SEGMENT MAPPING WORKSHEET COM0 LCDDATAx Address COM1 LCD Segment LCDDATAx Address COM2 LCD Segment LCDDATAx Address COM3 LCD Segment LCDDATAx Address SEG0 LCDDATA0, 0 LCDDATA3, 0 LCDDATA6, 0 LCDDATA9, 0 SEG1 LCDDATA0, 1 LCDDATA3, 1 LCDDATA6, 1 LCDDATA9, 1 SEG2 LCDDATA0, 2 LCDDATA3, 2 LCDDATA6, 2 LCDDATA9, 2 SEG3 LCDDATA0, 3 LCDDATA3, 3 LCDDATA6, 3 LCDDATA9, 3 SEG4 LCDDATA0, 4 LCDDATA3, 4 LCDDATA6, 4 LCDDATA9, 4 SEG5 LCDDATA0, 5 LCDDATA3, 5 LCDDATA6, 5 LCDDATA9, 5 SEG6 LCDDATA0, 6 LCDDATA3, 6 LCDDATA6, 6 LCDDATA9, 6 SEG7 LCDDATA0, 7 LCDDATA3, 7 LCDDATA6, 7 LCDDATA9, 7 SEG8 LCDDATA1, 0 LCDDATA4, 0 LCDDATA7, 0 LCDDATA10, 0 SEG9 LCDDATA1, 1 LCDDATA4, 1 LCDDATA7, 1 LCDDATA10, 1 SEG10 LCDDATA1, 2 LCDDATA4, 2 LCDDATA7, 2 LCDDATA10, 2 SEG11 LCDDATA1, 3 LCDDATA4, 3 LCDDATA7, 3 LCDDATA10, 3 SEG12 LCDDATA1, 4 LCDDATA4, 4 LCDDATA7, 4 LCDDATA10, 4 SEG13 LCDDATA1, 5 LCDDATA4, 5 LCDDATA7, 5 LCDDATA10, 5 SEG14 LCDDATA1, 6 LCDDATA4, 6 LCDDATA7, 6 LCDDATA10, 6 SEG15 LCDDATA1, 7 LCDDATA4, 7 LCDDATA7, 7 LCDDATA10, 7 SEG16 LCDDATA2, 0 LCDDATA5, 0 LCDDATA8, 0 LCDDATA11, 0 SEG17 LCDDATA2, 1 LCDDATA5, 1 LCDDATA8, 1 LCDDATA11, 1 SEG18 LCDDATA2, 2 LCDDATA5, 2 LCDDATA8, 2 LCDDATA11, 2 SEG19 LCDDATA2, 3 LCDDATA5, 3 LCDDATA8, 3 LCDDATA11, 3 SEG20 LCDDATA2, 4 LCDDATA5, 4 LCDDATA8, 4 LCDDATA11, 4 SEG21 LCDDATA2, 5 LCDDATA5, 5 LCDDATA8, 5 LCDDATA11, 5 SEG22 LCDDATA2, 6 LCDDATA5, 6 LCDDATA8, 6 LCDDATA11, 6 SEG23 LCDDATA2, 7 LCDDATA5, 7 LCDDATA8, 7 LCDDATA11, 7  2011-2012 Microchip Technology Inc. LCD Segment DS41575C-page 329 PIC16(L)F1933 27.10 LCD Waveform Generation LCD waveforms are generated so that the net AC voltage across the dark pixel should be maximized and the net AC voltage across the clear pixel should be minimized. The net DC voltage across any pixel should be zero. The COM signal represents the time slice for each common, while the SEG contains the pixel data. The pixel signal (COM-SEG) will have no DC component and it can take only one of the two RMS values. The higher RMS value will create a dark pixel and a lower RMS value will create a clear pixel. As the number of commons increases, the delta between the two RMS values decreases. The delta represents the maximum contrast that the display can have. The LCDs can be driven by two types of waveform: Type-A and Type-B. In Type-A waveform, the phase changes within each common type, whereas in Type-B waveform, the phase changes on each frame boundary. Thus, Type-A waveform maintains 0 VDC over a single frame, whereas Type-B waveform takes two frames. Note 1: If Sleep has to be executed with LCD Sleep disabled (LCDCON is ‘1’), then care must be taken to execute Sleep only when VDC on all the pixels is ‘0’. 2: When the LCD clock source is FOSC/256, if Sleep is executed, irrespective of the LCDCON setting, the LCD immediately goes into Sleep. Thus, take care to see that VDC on all pixels is ‘0’ when Sleep is executed. Figure 27-8 through Figure 27-18 provide waveforms for static, half-multiplex, 1/3-multiplex and 1/4-multiplex drives for Type-A and Type-B waveforms. FIGURE 27-8: TYPE-A/TYPE-B WAVEFORMS IN STATIC DRIVE V1 COM0 pin V0 COM0 V1 SEG0 pin V0 V1 SEG1 pin V0 V1 V0 DS41575C-page 330 SEG1 SEG0 SEG2 SEG7 SEG6 SEG5 SEG4 SEG3 COM0-SEG0 segment voltage (active) COM0-SEG1 segment voltage (inactive) -V1 V0 1 Frame  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 27-9: TYPE-A WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V2 COM0 pin COM1 V1 V0 V2 COM1 pin COM0 V1 V0 V2 V1 SEG0 pin V0 V2 V1 SEG1 pin SEG1 V2 SEG0 SEG2 SEG3 V0 V1 V0 COM0-SEG0 segment voltage (active) -V1 -V2 V2 V1 V0 COM0-SEG1 segment voltage (inactive) -V1 1 Frame -V2 1 Segment Time Note: 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. DS41575C-page 331 PIC16(L)F1933 FIGURE 27-10: TYPE-B WAVEFORMS IN 1/2 MUX, 1/2 BIAS DRIVE V2 COM1 V1 COM0 pin V0 COM0 V2 COM1 pin V1 V0 V2 SEG0 pin V1 SEG1 SEG0 SEG3 SEG2 V0 V2 SEG1 pin V1 V0 V2 V1 V0 COM0-SEG0 segment voltage (active) -V1 -V2 V2 V1 V0 COM0-SEG1 segment voltage (inactive) -V1 2 Frames -V2 1 Segment Time Note: 1 Frame = 2 single segment times. DS41575C-page 332  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 27-11: TYPE-A WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V3 COM1 V2 COM0 pin V1 V0 V3 COM0 V2 COM1 pin V1 V0 V3 V2 SEG0 pin V1 V0 SEG1 SEG0 SEG2 SEG3 V3 V2 SEG1 pin V1 V0 V3 V2 V1 V0 COM0-SEG0 segment voltage (active) -V1 -V2 -V3 V3 V2 V1 V0 COM0-SEG1 segment voltage (inactive) -V1 1 Frame -V2 -V3 1 Segment Time Note: 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. DS41575C-page 333 PIC16(L)F1933 FIGURE 27-12: TYPE-B WAVEFORMS IN 1/2 MUX, 1/3 BIAS DRIVE V3 COM1 V2 COM0 pin V1 V0 V3 COM0 V2 COM1 pin V1 V0 V3 V2 SEG0 pin V1 V0 SEG1 SEG0 SEG2 SEG3 V3 V2 SEG1 pin V1 V0 V3 V2 V1 V0 COM0-SEG0 segment voltage (active) -V1 -V2 -V3 V3 V2 V1 V0 COM0-SEG1 segment voltage (inactive) -V1 2 Frames -V2 -V3 1 Segment Time Note: 1 Frame = 2 single segment times. DS41575C-page 334  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 27-13: TYPE-A WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V2 COM0 pin V1 V0 V2 COM2 COM1 pin V1 V0 COM1 V2 COM0 COM2 pin V1 V0 V2 SEG0 and SEG2 pins V1 V0 V2 V1 V0 SEG0 SEG1 SEG2 SEG1 pin V2 V1 V0 COM0-SEG0 segment voltage (inactive) -V1 -V2 V2 V1 V0 COM0-SEG1 segment voltage (active) -V1 -V2 1 Frame 1 Segment Time Note: 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. DS41575C-page 335 PIC16(L)F1933 FIGURE 27-14: TYPE-B WAVEFORMS IN 1/3 MUX, 1/2 BIAS DRIVE V2 COM0 pin V1 V0 COM2 V2 COM1 pin V1 COM1 V0 COM0 V2 COM2 pin V1 V0 V2 V1 V0 SEG0 SEG1 SEG2 SEG0 pin V2 SEG1 pin V1 V0 V2 V1 V0 COM0-SEG0 segment voltage (inactive) -V1 -V2 V2 V1 V0 COM0-SEG1 segment voltage (active) -V1 -V2 2 Frames 1 Segment Time Note: DS41575C-page 336 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 27-15: TYPE-A WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V3 V2 COM0 pin V1 V0 V3 COM2 V2 COM1 pin V1 COM1 V0 COM0 V3 V2 COM2 pin V1 V0 V3 V2 V1 V0 SEG0 SEG1 SEG2 SEG0 and SEG2 pins V3 V2 SEG1 pin V1 V0 V3 V2 V1 V0 COM0-SEG0 segment voltage (inactive) -V1 -V2 -V3 V3 V2 V1 V0 COM0-SEG1 segment voltage (active) -V1 -V2 -V3 1 Frame 1 Segment Time Note: 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. DS41575C-page 337 PIC16(L)F1933 FIGURE 27-16: TYPE-B WAVEFORMS IN 1/3 MUX, 1/3 BIAS DRIVE V3 V2 COM0 pin V1 V0 V3 COM2 V2 COM1 pin V1 COM1 V0 COM0 V3 V2 COM2 pin V1 V0 V3 V2 V1 V0 SEG0 SEG1 SEG2 SEG0 pin V3 V2 SEG1 pin V1 V0 V3 V2 V1 V0 COM0-SEG0 segment voltage (inactive) -V1 -V2 -V3 V3 V2 V1 V0 COM0-SEG1 segment voltage (active) -V1 -V2 -V3 2 Frames 1 Segment Time Note: DS41575C-page 338 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 27-17: TYPE-A WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE COM3 COM2 COM1 COM0 pin V3 V2 V1 V0 COM1 pin V3 V2 V1 V0 COM2 pin V3 V2 V1 V0 COM3 pin V3 V2 V1 V0 SEG0 pin V3 V2 V1 V0 SEG1 pin V3 V2 V1 V0 SEG0 SEG1 COM0 V3 V2 V1 V0 -V1 -V2 -V3 COM0-SEG0 segment voltage (active) COM0-SEG1 segment voltage (inactive) 1 Frame V3 V2 V1 V0 -V1 -V2 -V3 1 Segment Time Note: 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. DS41575C-page 339 PIC16(L)F1933 FIGURE 27-18: TYPE-B WAVEFORMS IN 1/4 MUX, 1/3 BIAS DRIVE COM3 COM0 pin V3 V2 V1 V0 COM1 pin V3 V2 V1 V0 COM2 pin V3 V2 V1 V0 COM3 pin V3 V2 V1 V0 SEG0 pin V3 V2 V1 V0 SEG1 pin V3 V2 V1 V0 COM2 COM1 SEG0 SEG1 COM0 V3 V2 V1 V0 -V1 -V2 -V3 COM0-SEG0 segment voltage (active) COM0-SEG1 segment voltage (inactive) V3 V2 V1 V0 -V1 -V2 -V3 2 Frames 1 Segment Time Note: DS41575C-page 340 1 Frame = 2 single segment times.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.11 LCD Interrupts The LCD module provides an interrupt in two cases. An interrupt when the LCD controller goes from active to inactive controller. An interrupt also provides unframe boundaries for Type B waveform. The LCD timing generation provides an interrupt that defines the LCD frame timing. 27.11.1 LCD INTERRUPT ON MODULE SHUTDOWN An LCD interrupt is generated when the module completes shutting down (LCDA goes from ‘1’ to ‘0’). 27.11.2 LCD FRAME INTERRUPTS A new frame is defined to begin at the leading edge of the COM0 common signal. The interrupt will be set immediately after the LCD controller completes accessing all pixel data required for a frame. This will occur at a fixed interval before the frame boundary (TFINT), as shown in Figure 27-19. The LCD controller will begin to access data for the next frame within the interval from the interrupt to when the controller begins to access data after the interrupt (TFWR). New data must be written within TFWR, as this is when the LCD controller will begin to access the data for the next frame. When the LCD driver is running with Type-B waveforms and the LMUX bits are not equal to ‘00’ (static drive), there are some additional issues that must be addressed. Since the DC voltage on the pixel takes two frames to maintain zero volts, the pixel data must not change between subsequent frames. If the pixel data were allowed to change, the waveform for the odd frames would not necessarily be the complement of the waveform generated in the even frames and a DC component would be introduced into the panel. Therefore, when using Type-B waveforms, the user must synchronize the LCD pixel updates to occur within a subframe after the frame interrupt. To correctly sequence writing while in Type-B, the interrupt will only occur on complete phase intervals. If the user attempts to write when the write is disabled, the WERR bit of the LCDCON register is set and the write does not occur. Note: The LCD frame interrupt is not generated when the Type-A waveform is selected and when the Type-B with no multiplex (static) is selected.  2011-2012 Microchip Technology Inc. DS41575C-page 341 PIC16(L)F1933 FIGURE 27-19: WAVEFORMS AND INTERRUPT TIMING IN QUARTER-DUTY CYCLE DRIVE (EXAMPLE – TYPE-B, NON-STATIC) LCD Interrupt Occurs Controller Accesses Next Frame Data COM0 V3 V2 V1 V0 COM1 V3 V2 V1 V0 COM2 V3 V2 V1 V0 V3 V2 V1 V0 COM3 2 Frames TFINT Frame Boundary Frame Boundary TFWR Frame Boundary TFWR = TFRAME/2*(LMUX + 1) + TCY/2 TFINT = (TFWR/2 – (2 TCY + 40 ns))  minimum = 1.5(TFRAME/4) – (2 TCY + 40 ns) (TFWR/2 – (1 TCY + 40 ns))  maximum = 1.5(TFRAME/4) – (1 TCY + 40 ns) DS41575C-page 342  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.12 Operation During Sleep The LCD module can operate during Sleep. The selection is controlled by bit SLPEN of the LCDCON register. Setting the SLPEN bit allows the LCD module to go to Sleep. Clearing the SLPEN bit allows the module to continue to operate during Sleep. If a SLEEP instruction is executed and SLPEN = 1, the LCD module will cease all functions and go into a very low-current consumption mode. The module will stop operation immediately and drive the minimum LCD voltage on both segment and common lines. Figure 27-20 shows this operation. The LCD module can be configured to operate during Sleep. The selection is controlled by bit SLPEN of the LCDCON register. Clearing SLPEN and correctly configuring the LCD module clock will allow the LCD module to operate during Sleep. Setting SLPEN and correctly executing the LCD module shutdown will disable the LCD module during Sleep and save power. If a SLEEP instruction is executed and SLPEN = 1, the LCD module will immediately cease all functions, drive the outputs to Vss and go into a very low-current mode. The SLEEP instruction should only be executed after the LCD module has been disabled and the current cycle completed, thus ensuring that there are no DC voltages on the glass. To disable the LCD module, clear the LCDEN bit. The LCD module will complete the disabling process after the current frame, clear the LCDA bit and optionally cause an interrupt. The steps required to properly enter Sleep with the LCD disabled are: • Clear LCDEN • Wait for LCDA = 0 either by polling or by interrupt • Execute SLEEP If SLPEN = 0 and SLEEP is executed while the LCD module clock source is FOSC/4, then the LCD module will halt with the pin driving the last LCD voltage pattern. Prolonged exposure to a fixed LCD voltage pattern will cause damage to the LCD glass. To prevent LCD glass damage, either perform the proper LCD module shutdown prior to Sleep, or change the LCD module clock to allow the LCD module to continue operation during Sleep. If a SLEEP instruction is executed and SLPEN = 0 and the LCD module clock is either T1OSC or LFINTOSC, the module will continue to display the current contents of the LCDDATA registers. While in Sleep, the LCD data cannot be changed. If the LCDIE bit is set, the device will wake from Sleep on the next LCD frame boundary. The LCD module current consumption will not decrease in this mode; however, the overall device power consumption will be lower due to the shutdown of the CPU and other peripherals.  2011-2012 Microchip Technology Inc. Table 27-8 shows the status of the LCD module during a Sleep while using each of the three available clock sources. Note: When the LCDEN bit is cleared, the LCD module will be disabled at the completion of frame. At this time, the port pins will revert to digital functionality. To minimize power consumption due to floating digital inputs, the LCD pins should be driven low using the PORT and TRIS registers. If a SLEEP instruction is executed and SLPEN = 0, the module will continue to display the current contents of the LCDDATA registers. To allow the module to continue operation while in Sleep, the clock source must be either the LFINTOSC or T1OSC external oscillator. While in Sleep, the LCD data cannot be changed. The LCD module current consumption will not decrease in this mode; however, the overall consumption of the device will be lower due to shut down of the core and other peripheral functions. Table 27-8 shows the status of the LCD module during Sleep while using each of the three available clock sources: TABLE 27-8: Clock Source T1OSC LFINTOSC FOSC/4 Note: LCD MODULE STATUS DURING SLEEP SLPEN Operational During Sleep 0 Yes 1 No 0 Yes 1 No 0 No 1 No The LFINTOSC or external T1OSC oscillator must be used to operate the LCD module during Sleep. If LCD interrupts are being generated (Type-B waveform with a multiplex mode not static) and LCDIE = 1, the device will awaken from Sleep on the next frame boundary. DS41575C-page 343 PIC16(L)F1933 FIGURE 27-20: SLEEP ENTRY/EXIT WHEN SLPEN = 1 V3 V2 V1 COM0 V0 V3 V2 V1 V0 COM1 V3 V2 V1 V0 COM2 V3 V2 V1 V0 SEG0 2 Frames SLEEP Instruction Execution DS41575C-page 344 Wake-up  2011-2012 Microchip Technology Inc. PIC16(L)F1933 27.13 Configuring the LCD Module 27.15 LCD Current Consumption The following is the sequence of steps to configure the LCD module. When using the LCD module the current consumption consists of the following three factors: 1. • Oscillator Selection • LCD Bias Source • Capacitance of the LCD segments 2. 3. 4. 5. 6. 7. Select the frame clock prescale using bits LP of the LCDPS register. Configure the appropriate pins to function as segment drivers using the LCDSEn registers. Configure the LCD module for the following using the LCDCON register: - Multiplex and bias mode, bits LMUX - Timing source, bits CS - Sleep mode, bit SLPEN Write initial values to pixel data registers, LCDDATA0 through LCDDATA11. Clear LCD Interrupt Flag, LCDIF bit of the PIR2 register and if desired, enable the interrupt by setting bit LCDIE of the PIE2 register. Configure bias voltages by setting the LCDRL, LCDREF and the associated ANSELx registers as needed. Enable the LCD module by setting bit LCDEN of the LCDCON register. 27.14 Disabling the LCD Module To disable the LCD module, write all ‘0’s to the LCDCON register.  2011-2012 Microchip Technology Inc. The current consumption of just the LCD module can be considered negligible compared to these other factors. 27.15.1 OSCILLATOR SELECTION The current consumed by the clock source selected must be considered when using the LCD module. See Section 30.0 “Electrical Specifications” for oscillator current consumption information. 27.15.2 LCD BIAS SOURCE The LCD bias source, internal or external, can contribute significantly to the current consumption. Use the highest possible resistor values while maintaining contrast to minimize current. 27.15.3 CAPACITANCE OF THE LCD SEGMENTS The LCD segments which can be modeled as capacitors which must be both charged and discharged every frame. The size of the LCD segment and its technology determines the segment’s capacitance. DS41575C-page 345 PIC16(L)F1933 TABLE 27-9: Name SUMMARY OF REGISTERS ASSOCIATED WITH LCD OPERATION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 IOCIE TMR0IF INTF IOCIF INTCON GIE PEIE TMR0IE INTE LCDCON LCDEN SLPEN WERR — LCDCST CS LMUX 82 315 — — — — — LCDDATA0 SEG7 COM0 SEG6 COM0 SEG5 COM0 SEG4 COM0 SEG3 COM0 SEG2 COM0 SEG1 COM0 SEG0 COM0 319 LCDDATA1 SEG15 COM0 SEG14 COM0 SEG13 COM0 SEG12 COM0 SEG11 COM0 SEG10 COM0 SEG9 COM0 SEG8 COM0 319 LCDDATA3 SEG7 COM1 SEG6 COM1 SEG5 COM1 SEG4 COM1 SEG3 COM1 SEG2 COM1 SEG1 COM1 SEG0 COM1 319 LCDDATA4 SEG15 COM1 SEG14 COM1 SEG13 COM1 SEG12 COM1 SEG11 COM1 SEG10 COM1 SEG9 COM1 SEG8 COM1 319 LCDDATA6 SEG7 COM2 SEG6 COM2 SEG5 COM2 SEG4 COM2 SEG3 COM2 SEG2 COM2 SEG1 COM2 SEG0 COM2 319 LCDDATA7 SEG15 COM2 SEG14 COM2 SEG13 COM2 SEG12 COM2 SEG11 COM2 SEG10 COM2 SEG9 COM2 SEG8 COM2 319 LCDDATA9 SEG7 COM3 SEG6 COM3 SEG5 COM3 SEG4 COM3 SEG3 COM3 SEG2 COM3 SEG1 COM3 SEG0 COM3 319 LCDDATA10 SEG15 COM3 SEG14 COM3 SEG13 COM3 SEG12 COM3 SEG11 COM3 SEG10 COM3 SEG9 COM3 SEG8 COM3 319 WFT BIASMD LCDA WA LCDIRE LCDIRS LCDIRI — LCDPS LCDREF LCDRL LRLAP LRLBP LCDCST Register on Page 318 LP VLCD3PE VLCD2PE — 316 VLCD1PE — LRLAT 317 326 LCDSE0 SE 319 LCDSE1 SE 319 PIE2 OSFIE C2IE C1IE EEIE BCLIE LCDIE — CCP2IE 84 PIR2 OSFIF C2IF C1IF EEIF BCLIF LCDIF — CCP2IF 87 T1OSCEN T1SYNC — TMR1ON 183 T1CON Legend: TMR1CS T1CKPS — = unimplemented location, read as ‘0’. Shaded cells are not used by the LCD module. DS41575C-page 346  2011-2012 Microchip Technology Inc. PIC16(L)F1933 28.0 IN-CIRCUIT SERIAL PROGRAMMING™ (ICSP™) ICSP™ programming allows customers to manufacture circuit boards with unprogrammed devices. Programming can be done after the assembly process, allowing the device to be programmed with the most recent firmware or a custom firmware. Five pins are needed for ICSP™ programming: • ICSPCLK • ICSPDAT • MCLR/VPP • VDD • VSS In Program/Verify mode the program memory, user IDs and the Configuration Words are programmed through serial communications. The ICSPDAT pin is a bidirectional I/O used for transferring the serial data and the ICSPCLK pin is the clock input. For more information on ICSP™ refer to the “PIC16193X/PIC16LF193X Memory Programming Specification” (DS41360A). 28.1 High-Voltage Programming Entry Mode The device is placed into High-Voltage Programming Entry mode by holding the ICSPCLK and ICSPDAT pins low then raising the voltage on MCLR/VPP to VIHH. Some programmers produce VPP greater than VIHH (9.0V), an external circuit is required to limit the VPP voltage. See Figure 28-1 for example circuit. FIGURE 28-1: VPP LIMITER EXAMPLE CIRCUIT RJ11-6PIN 6 5 4 3 2 1 1 VPP 2 VDD 3 VSS 4 ICSP_DATA 5 ICSP_CLOCK 6 NC RJ11-6PIN ® To MPLAB ICD 2 R1 To Target Board 270 Ohm LM431BCMX 1 2 A K 3 A U1 6 A NC 4 7 A NC 5 R2 VREF 8 10k 1% Note: R3 24k 1% The MPLAB® ICD 2 produces a VPP voltage greater than the maximum VPP specification of the PIC16(L)F1933.  2011-2012 Microchip Technology Inc. DS41575C-page 347 PIC16(L)F1933 28.2 Low-Voltage Programming Entry Mode FIGURE 28-2: The Low-Voltage Programming Entry mode allows the PIC® Flash MCUs to be programmed using VDD only, without high voltage. When the LVP bit of Configuration Words is set to ‘1’, the low-voltage ICSP programming entry is enabled. To disable the Low-Voltage ICSP mode, the LVP bit must be programmed to ‘0’. VDD Entry into the Low-Voltage Programming Entry mode requires the following steps: 1. 2. ICD RJ-11 STYLE CONNECTOR INTERFACE ICSPDAT NC 2 4 6 ICSPCLK 1 3 5 VPP/MCLR MCLR is brought to VIL. A 32-bit key sequence is presented on ICSPDAT, while clocking ICSPCLK. VSS Target PC Board Bottom Side Pin Description* Once the key sequence is complete, MCLR must be held at VIL for as long as Program/Verify mode is to be maintained. 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) If low-voltage programming is enabled (LVP = 1), the MCLR Reset function is automatically enabled and cannot be disabled. See Section 6.4 “MCLR” for more information. 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect The LVP bit can only be reprogrammed to ‘0’ by using the High-Voltage Programming mode. 28.3 Another connector often found in use with the PICkit™ programmers is a standard 6-pin header with 0.1 inch spacing. Refer to Figure 28-3. Common Programming Interfaces Connection to a target device is typically done through an ICSP™ header. A commonly found connector on development tools is the RJ-11 in the 6P6C (6 pin, 6 connector) configuration. See Figure 28-2. FIGURE 28-3: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE Pin 1 Indicator Pin Description* 1 2 3 4 5 6 1 = VPP/MCLR 2 = VDD Target 3 = VSS (ground) 4 = ICSPDAT 5 = ICSPCLK 6 = No Connect * DS41575C-page 348 The 6-pin header (0.100" spacing) accepts 0.025" square pins.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 For additional interface recommendations, refer to your specific device programmer manual prior to PCB design. It is recommended that isolation devices be used to separate the programming pins from other circuitry. The type of isolation is highly dependent on the specific application and may include devices such as resistors, diodes, or even jumpers. See Figure 28-4 for more information. FIGURE 28-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING External Programming Signals Device to be Programmed VDD VDD VDD VPP MCLR/VPP VSS VSS Data ICSPDAT Clock ICSPCLK * * * To Normal Connections * Isolation devices (as required).  2011-2012 Microchip Technology Inc. DS41575C-page 349 PIC16(L)F1933 NOTES: DS41575C-page 350  2011-2012 Microchip Technology Inc. PIC16(L)F1933 29.0 INSTRUCTION SET SUMMARY 29.1 Read-Modify-Write Operations • Byte Oriented • Bit Oriented • Literal and Control Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. The literal and control category contains the most varied instruction word format. TABLE 29-1: Each instruction is a 14-bit word containing the operation code (opcode) and all required operands. The opcodes are broken into three broad categories. Table 29-3 lists the instructions recognized by the MPASMTM assembler. All instructions are executed within a single instruction cycle, with the following exceptions, which may take two or three cycles: • Subroutine takes two cycles (CALL, CALLW) • Returns from interrupts or subroutines take two cycles (RETURN, RETLW, RETFIE) • Program branching takes two cycles (GOTO, BRA, BRW, BTFSS, BTFSC, DECFSZ, INCSFZ) • One additional instruction cycle will be used when any instruction references an indirect file register and the file select register is pointing to program memory. One instruction cycle consists of 4 oscillator cycles; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution rate of 1 MHz. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. OPCODE FIELD DESCRIPTIONS Field f Description Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. n FSR or INDF number. (0-1) mm Pre-post increment-decrement mode selection TABLE 29-2: ABBREVIATION DESCRIPTIONS Field PC Program Counter TO Time-out bit C DC Z PD  2011-2012 Microchip Technology Inc. Description Carry bit Digit carry bit Zero bit Power-down bit DS41575C-page 351 PIC16(L)F1933 FIGURE 29-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 OPCODE 8 7 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 OPCODE 0 k (literal) k = 11-bit immediate value MOVLP instruction only 13 OPCODE 7 6 0 k (literal) k = 7-bit immediate value MOVLB instruction only 13 OPCODE 5 4 0 k (literal) k = 5-bit immediate value BRA instruction only 13 OPCODE 9 8 0 k (literal) k = 9-bit immediate value FSR Offset instructions 13 OPCODE 7 6 n 5 0 k (literal) n = appropriate FSR k = 6-bit immediate value FSR Increment instructions 13 OPCODE 3 2 1 0 n m (mode) n = appropriate FSR m = 2-bit mode value OPCODE only 13 0 OPCODE DS41575C-page 352  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 29-3: PIC16(L)F1933 INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ADDWFC ANDWF ASRF LSLF LSRF CLRF CLRW COMF DECF INCF IORWF MOVF MOVWF RLF RRF SUBWF SUBWFB SWAPF XORWF f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d f, d Add W and f Add with Carry W and f AND W with f Arithmetic Right Shift Logical Left Shift Logical Right Shift Clear f Clear W Complement f Decrement f Increment f Inclusive OR W with f Move f Move W to f Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Subtract with Borrow W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 00 11 00 11 11 11 00 00 00 00 00 00 00 00 00 00 00 11 00 00 0111 1101 0101 0111 0101 0110 0001 0001 1001 0011 1010 0100 1000 0000 1101 1100 0010 1011 1110 0110 dfff dfff dfff dfff dfff dfff lfff 0000 dfff dfff dfff dfff dfff 1fff dfff dfff dfff dfff dfff dfff ffff ffff ffff ffff ffff ffff ffff 00xx ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z C, DC, Z Z C, Z C, Z C, Z Z Z Z Z Z Z Z C C C, DC, Z C, DC, Z Z 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BYTE ORIENTED SKIP OPERATIONS DECFSZ INCFSZ f, d f, d Decrement f, Skip if 0 Increment f, Skip if 0 BCF BSF f, b f, b Bit Clear f Bit Set f 1(2) 1(2) 00 00 1, 2 1, 2 1011 dfff ffff 1111 dfff ffff BIT-ORIENTED FILE REGISTER OPERATIONS 1 1 01 01 00bb bfff ffff 01bb bfff ffff 2 2 1, 2 1, 2 BIT-ORIENTED SKIP OPERATIONS BTFSC BTFSS f, b f, b Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 (2) 1 (2) 01 01 10bb bfff ffff 11bb bfff ffff 1 1 1 1 1 1 1 1 11 11 11 00 11 11 11 11 1110 1001 1000 0000 0001 0000 1100 1010 LITERAL OPERATIONS ADDLW ANDLW IORLW MOVLB MOVLP MOVLW SUBLW XORLW k k k k k k k k Add literal and W AND literal with W Inclusive OR literal with W Move literal to BSR Move literal to PCLATH Move literal to W Subtract W from literal Exclusive OR literal with W kkkk kkkk kkkk 001k 1kkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z Z Z C, DC, Z Z Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle.  2011-2012 Microchip Technology Inc. DS41575C-page 353 PIC16(L)F1933 TABLE 29-3: PIC16(L)F1933 INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes CONTROL OPERATIONS BRA BRW CALL CALLW GOTO RETFIE RETLW RETURN k – k – k k k – Relative Branch Relative Branch with W Call Subroutine Call Subroutine with W Go to address Return from interrupt Return with literal in W Return from Subroutine CLRWDT NOP OPTION RESET SLEEP TRIS – – – – – f Clear Watchdog Timer No Operation Load OPTION_REG register with W Software device Reset Go into Standby mode Load TRIS register with W ADDFSR MOVIW n, k n mm MOVWI k[n] n mm Add Literal k to FSRn Move Indirect FSRn to W with pre/post inc/dec modifier, mm Move INDFn to W, Indexed Indirect. Move W to Indirect FSRn with pre/post inc/dec modifier, mm Move W to INDFn, Indexed Indirect. 2 2 2 2 2 2 2 2 11 00 10 00 10 00 11 00 001k 0000 0kkk 0000 1kkk 0000 0100 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 0000 kkkk 1011 kkkk 1010 kkkk 1001 kkkk 1000 00 00 00 00 00 00 0000 0000 0000 0000 0000 0000 0110 0000 0110 0000 0110 0110 0100 TO, PD 0000 0010 0001 0011 TO, PD 0fff INHERENT OPERATIONS 1 1 1 1 1 1 C-COMPILER OPTIMIZED k[n] 1 1 11 00 0001 0nkk kkkk 0000 0001 0nmm Z 2, 3 1 1 11 00 1111 0nkk kkkk Z 0000 0001 1nmm 2 2, 3 1 11 1111 1nkk kkkk 2 Note 1:If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one additional instruction cycle. 3: See Table in the MOVIW and MOVWI instruction descriptions. DS41575C-page 354  2011-2012 Microchip Technology Inc. PIC16(L)F1933 29.2 Instruction Descriptions ADDFSR Add Literal to FSRn ANDLW AND literal with W Syntax: [ label ] ADDFSR FSRn, k Syntax: [ label ] ANDLW Operands: -32  k  31 n  [ 0, 1] Operands: 0  k  255 Operation: (W) .AND. (k)  (W) Operation: FSR(n) + k  FSR(n) Status Affected: Z Status Affected: None Description: Description: The signed 6-bit literal ‘k’ is added to the contents of the FSRnH:FSRnL register pair. The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. AND W with f k FSRn is limited to the range 0000h FFFFh. Moving beyond these bounds will cause the FSR to wrap-around. ADDLW Add literal and W ANDWF Syntax: [ label ] ADDLW Syntax: [ label ] ANDWF Operands: 0  f  127 d 0,1 Operation: (W) .AND. (f)  (destination) k Operands: 0  k  255 Operation: (W) + k  (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f f,d Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ASRF Arithmetic Right Shift Syntax: [ label ] ADDWF Syntax: [ label ] ASRF Operands: 0  f  127 d 0,1 Operands: 0  f  127 d [0,1] Operation: (W) + (f)  (destination) Operation: (f) dest (f)  dest, (f)  C, f,d Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ADDWFC ADD W and CARRY bit to f Syntax: [ label ] ADDWFC Operands: 0  f  127 d [0,1] Operation: (W) + (f) + (C)  dest Status Affected: C, DC, Z Description: Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’.  2011-2012 Microchip Technology Inc. f {,d} Status Affected: C, Z Description: The contents of register ‘f’ are shifted one bit to the right through the Carry flag. The MSb remains unchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. register f C f {,d} DS41575C-page 355 PIC16(L)F1933 BCF Bit Clear f Syntax: [ label ] BCF BTFSC f,b Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b 0  f  127 0b7 Operands: 0  f  127 0b7 Operands: Operation: 0  (f) Operation: skip if (f) = 0 Status Affected: None Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. BRA Relative Branch BTFSS Bit Test f, Skip if Set Syntax: [ label ] BRA label [ label ] BRA $+k Syntax: [ label ] BTFSS f,b Operands: 0  f  127 0b VDD) 20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.  2011-2012 Microchip Technology Inc. DS41575C-page 365 PIC16(L)F1933 PIC16F1933 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C FIGURE 30-1: Vdd (V) 5.5 2.5 1.8 4 0 10 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies. PIC16LF1933 VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C Vdd (V) FIGURE 30-2: 3.6 2.5 1.8 0 4 10 16 32 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies. DS41575C-page 366  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 30-3: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE 125 ± 5% 85 Temperature (°C) ± 3% 60 ± 2% 25 0 -20 -40 1.8 ± 5% 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 367 PIC16(L)F1933 30.1 DC Characteristics: Supply Voltage PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param. No. D001 Sym. VDD D001 D002* VDR D002* Characteristic Min. Typ† Max. Units PIC16LF1933 1.8 2.5 — — 3.6 3.6 V V FOSC  16 MHz: FOSC  32 MHz (Note 2) PIC16F1933 1.8 2.5 — — 5.5 5.5 V V FOSC  16 MHz: FOSC  32 MHz (Note 2) PIC16LF1933 1.5 — — V Device in Sleep mode PIC16F1933 1.7 — — V Device in Sleep mode — 1.6 — V V Supply Voltage (VDDMIN, VDDMAX) RAM Data Retention Voltage(1) D002A* VPOR* Power-on Reset Release Voltage D002B* VPORR* Power-on Reset Rearm Voltage D002B* Conditions PIC16LF1933 — 0.8 — PIC16F1933 — 1.42 — V D003 VADFVR Fixed Voltage Reference Voltage for ADC -8 — 6 % 1.024V, VDD  2.5V 2.048V, VDD  2.5V 4.096V, VDD  4.75V D003A VCDAFVR Fixed Voltage Reference Voltage for Comparator and DAC -11 — 7 % 1.024V, VDD  2.5V 2.048V, VDD  2.5V 4.096V, VDD  4.75V D003B VLCDFVR Fixed Voltage Reference Voltage for LCD Bias -11 — 10 % 3.072V, VDD  3.6V D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms See Section 6.1 “Power-On Reset (POR)” for details. * † Note These parameters are characterized but not tested. Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2: PLL required for 32 MHz operation. DS41575C-page 368  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 30-4: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS NPOR POR REARM VSS TVLOW(2) Note 1: 2: 3: TPOR(3) When NPOR is low, the device is held in Reset. TPOR 1 s typical. TVLOW 2.7 s typical.  2011-2012 Microchip Technology Inc. DS41575C-page 369 PIC16(L)F1933 30.2 DC Characteristics: Supply Currents (IDD) PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Characteristics Supply Current (IDD) LDO Regulator D009 D010 D010 D010A D010A Conditions Min. Typ† Max. Units — 350 — A — HS, EC OR INTOSC/INTOSCIO (8-16 MHZ) Clock modes with all VCAP pins disabled — 50 — A — All VCAP pins disabled — 30 — A — VCAP enabled — 5 — A — LP Clock mode and Sleep (requires FVR and BOR to be disabled) — 8 14 A 1.8 — 12 18 A 3.0 FOSC = 32 kHz LP Oscillator mode (Note 4), -40°C  TA  +85°C — 23 63 A 1.8 — 28 74 A 3.0 — 33 79 A 5.0 — 10 18 A 1.8 — 15 20 A 3.0 — 24 79 A 1.8 — 30 93 A 3.0 VDD — 35 99 A 5.0 D011 — 120 160 A 1.8 — 200 255 A 3.0 D011 — 160 195 A 1.8 — 230 275 A 3.0 — 280 410 A 5.0 — 325 370 A 1.8 — 600 710 A 3.0 — 350 410 A 1.8 — 625 765 A 3.0 — 700 850 A 5.0 D012 D012 Note 1: 2: 3: 4: 5: 6: Note (1, 2) FOSC = 32 kHz LP Oscillator mode (Note 4, Note 5), -40°C  TA  +85°C FOSC = 32 kHz LP Oscillator mode (Note 4) -40°C  TA  +125°C FOSC = 32 kHz LP Oscillator mode (Note 4, Note 5) -40°C  TA  +125°C FOSC = 1 MHz XT Oscillator mode FOSC = 1 MHz XT Oscillator mode (Note 5) FOSC = 4 MHz XT Oscillator mode FOSC = 4 MHz XT Oscillator mode (Note 5) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k FVR and BOR are disabled. 0.1 F capacitor on VCAP. 8 MHz crystal oscillator with 4x PLL enabled. DS41575C-page 370  2011-2012 Microchip Technology Inc. PIC16(L)F1933 30.2 DC Characteristics: Supply Currents (IDD) (Continued) PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Characteristics Min. Typ† — — Conditions Max. Units 60 90 A 1.8 85 135 A 3.0 — 60 137 A 1.8 — 85 194 A 3.0 VDD Note Supply Current (IDD)(1, 2) D013 D013 D014 D014 — 95 230 A 5.0 — 300 340 A 1.8 — 400 650 A 3.0 — 350 375 A 1.8 — 550 700 A 3.0 — 600 900 A 5.0 — 3.7 4.2 mA 3.0 — 4.2 5.2 mA 3.6 D015 — 3.7 4.2 mA 3.0 — 3.9 4.7 mA 5.0 D016 — 4 10 A 1.8 — 7 13 A 3.0 — 27 61 A 1.8 — 33 74 A 3.0 — 34 76 A 5.0 D015 D016 Note 1: 2: 3: 4: 5: 6: FOSC = 500 kHz EC Oscillator Low-Power mode FOSC = 500 kHz EC Oscillator Low-Power mode (Note 5) FOSC = 4 MHz EC Oscillator mode Medium-Power mode FOSC = 4 MHz EC Oscillator mode (Note 5) Medium-Power mode FOSC = 32 MHz EC Oscillator High-Power mode FOSC = 32 MHz EC Oscillator High-Power mode (Note 5) FOSC = 32 kHz LFINTOSC mode, 85°C FOSC = 32 kHz LFINTOSC mode, 85°C (Note 5) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k FVR and BOR are disabled. 0.1 F capacitor on VCAP. 8 MHz crystal oscillator with 4x PLL enabled.  2011-2012 Microchip Technology Inc. DS41575C-page 371 PIC16(L)F1933 30.2 DC Characteristics: Supply Currents (IDD) (Continued) PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Characteristics Conditions Min. Typ† Max. Units — 130 175 A 1.8 — 165 210 A 3.0 — 150 200 A 1.8 — 210 240 A 3.0 VDD Note Supply Current (IDD)(1, 2) D017 D017 D018 D018 D019 D019 — 270 330 A 5.0 — 0.8 1.1 mA 1.8 — 1.3 1.7 mA 3.0 — 0.9 1.1 mA 1.8 — 1.4 1.7 mA 3.0 — 1.6 1.8 mA 5.0 — 1.3 1.7 mA 1.8 — 2.2 2.6 mA 3.0 — 1.4 1.6 mA 1.8 — 2.2 2.6 mA 3.0 — 2.4 3.0 mA 5.0 D020 — 3.9 4.5 mA 3.0 — 4.7 5.6 mA 3.6 D020 — 3.9 4.5 mA 3.0 — 4.1 5.7 mA 5.0 D021 — 300 350 A 1.8 — 500 675 A 3.0 D021 — 350 390 A 1.8 — 550 720 A 3.0 — 620 790 A 5.0 — 2.7 4.4 mA 3.0 — 2.9 5.7 mA 3.6 — 3.6 4.4 mA 3.0 — 3.9 4.7 mA 5.0 D022 D022 Note 1: 2: 3: 4: 5: 6: FOSC = 500 kHz MFINTOSC mode FOSC = 500 kHz MFINTOSC mode (Note 5) FOSC = 8 MHz HFINTOSC mode FOSC = 8 MHz HFINTOSC mode (Note 5) FOSC = 16 MHz HFINTOSC mode FOSC = 16 MHz HFINTOSC mode (Note 5) FOSC = 32 MHz HFINTOSC mode FOSC = 32 MHz HFINTOSC mode FOSC = 4 MHz EXTRC mode (Note 3) FOSC = 4 MHz EXTRC mode (Note 3, Note 5) FOSC = 32 MHz HS Oscillator mode (Note 6) FOSC = 32 MHz HS Oscillator mode (Note 5, Note 6) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k FVR and BOR are disabled. 0.1 F capacitor on VCAP. 8 MHz crystal oscillator with 4x PLL enabled. DS41575C-page 372  2011-2012 Microchip Technology Inc. PIC16(L)F1933 30.3 DC Characteristics: Power-Down Currents (IPD) PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Characteristics Power-down Base Current Min. Typ† Max. +85°C Max. +125°C Units 1 7 A Conditions VDD D023 — 0.06 — 0.08 2 8 A 3.0 D023 — 20 55 69 A 1.8 — 24 58 72 A 3.0 — 26 60 75 A 5.0 — 0.5 6 8 A 1.8 — 0.8 7 9 A 3.0 — 20 56 70 A 1.8 — 25 59 73 A 3.0 D024 D024 Note (IPD)(2) 1.8 WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive WDT, BOR, FVR, and T1OSC disabled, all Peripherals Inactive LPWDT Current (Note 1) LPWDT Current (Note 1) — 26 61 76 A 5.0 — 9 20 20 A 1.8 — 9 23 23 A 3.0 — 36 96 120 A 1.8 — 43 110 140 A 3.0 — 75 140 170 A 5.0 D026 — 8 17 17 A 3.0 BOR Current (Note 1) D026 — 28 96 120 A 3.0 BOR Current (Note 1, Note 4) — 30 130 170 A 5.0 D027 — 0.6 5 5 A 1.8 — 3.9 9 9.5 A 3.0 — 22 57 71 A 1.8 — 28 62 78 A 3.0 — 33 66 83 A 5.0 D025 D025 D027 * † Note 1: 2: 3: 4: FVR current FVR current (Note 4) T1OSC Current (Note 1) T1OSC Current (Note 1) These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. A/D oscillator source is FRC. 0.1 F capacitor on VCAP.  2011-2012 Microchip Technology Inc. DS41575C-page 373 PIC16(L)F1933 30.3 DC Characteristics: Power-Down Currents (IPD) (Continued) PIC16LF1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended PIC16F1933 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Characteristics Max. +85°C Max. +125°C Units — 0.1 1 7 A 1.8 — 0.1 2 8 A 3.0 — 16 56 70 A 1.8 — 21 58 78 A 3.0 Power-down Base Current (IPD) D028 D028 Conditions Typ† Min. VDD Note (2) A/D Current (Note 1, Note 3), no conversion in progress A/D Current (Note 1, Note 3), no conversion in progress — 25 61 88 A 5.0 D028A — 250 — — A 1.8 — 250 — — A 3.0 D028A — 280 — — A 1.8 — 280 — — A 3.0 — 280 — — A 5.0 — 1.9 6 6 A 1.8 — 3.6 9 9 A 3.0 — 20 61 76 A 1.8 — 24 64 79 A 3.0 — 26 66 83 A 5.0 — 1 — — A 3.0 LCD Bias Ladder, Low-power — 10 — — A 3.0 LCD Bias Ladder, Medium-power — 75 — — A 3.0 LCD Bias Ladder, High-power — 1 — — A 5.0 LCD Bias Ladder, Low-power — 10 — — A 5.0 LCD Bias Ladder, Medium-power — 75 — — A 5.0 LCD Bias Ladder, High-power — 16 18 18 A 1.8 Comparator, Low-Power mode — 18 20 20 A 3.0 — 27 65 81 A 1.8 — 30 75 94 A 3.0 — 32 76 95 A 5.0 D029 D029 D030 D030 D031 D031 * † Note 1: 2: 3: 4: A/D Current (Note 1, Note 3), conversion in progress A/D Current (Note 1, Note 3, Note 4), conversion in progress Cap Sense, Low-Power mode CPSRM = 0, cpsrng = 01 (Note 1) Cap Sense, Low-Power mode CPSRM = 0, cpsrng = 01 (Note 1) Comparator, Low-Power mode These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. A/D oscillator source is FRC. 0.1 F capacitor on VCAP. DS41575C-page 374  2011-2012 Microchip Technology Inc. PIC16(L)F1933 30.4 DC Characteristics: I/O Ports DC CHARACTERISTICS Param No. Sym. VIL Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Min. Typ† Max. Units — — with Schmitt Trigger buffer Conditions — 0.8 V 4.5V  VDD  5.5V — 0.15 VDD V 1.8V  VDD  4.5V — — 0.2 VDD V 2.0V  VDD  5.5V with I2C™ levels — — 0.3 VDD V Input Low Voltage I/O PORT: D032 with TTL buffer D032A D033 with SMBus levels — — 0.8 V 2.7V  VDD  5.5V D034 MCLR, OSC1 (RC mode) — — 0.2 VDD V (Note 1) D034A OSC1 (HS mode) — — 0.3 VDD V VIH Input High Voltage I/O PORT: D040 2.0 — — V 4.5V  VDD 5.5V 0.25 VDD + 0.8 — — V 1.8V  VDD  4.5V with Schmitt Trigger buffer 0.8 VDD — — V 2.0V  VDD  5.5V with I2C™ levels 0.7 VDD — — V with TTL buffer D040A D041 with SMBus levels 2.7V  VDD  5.5V 2.1 — — V D042 MCLR 0.8 VDD — — V D043A OSC1 (HS mode) 0.7 VDD — — V D043B OSC1 (RC mode) 0.9 VDD — — V VDD > 2.0V (Note 1) IIL Input Leakage Current(2) D060 I/O ports — ±5 ± 125 nA ±5 ± 1000 nA VSS  VPIN  VDD, Pin at highimpedance @ 85°C 125°C D061 MCLR(3) — ± 50 ± 200 nA VSS  VPIN  VDD @ 85°C 25 25 100 140 200 300 A VDD = 3.3V, VPIN = VSS VDD = 5.0V, VPIN = VSS — — 0.6 V IOL = 8mA, VDD = 5V IOL = 6mA, VDD = 3.3V IOL = 1.8mA, VDD = 1.8V VDD - 0.7 — — V IOH = 3.5mA, VDD = 5V IOH = 3mA, VDD = 3.3V IOH = 1mA, VDD = 1.8V IPUR Weak Pull-up Current D070* VOL D080 Output Low Voltage(4) I/O ports VOH D090 Output High Voltage(4) I/O ports * † Note 1: 2: 3: 4: These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Including OSC2 in CLKOUT mode.  2011-2012 Microchip Technology Inc. DS41575C-page 375 PIC16(L)F1933 30.4 DC Characteristics: I/O Ports (Continued) DC CHARACTERISTICS Param No. Sym. Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Min. Typ† Max. Units — — 15 pF — — 50 pF Conditions Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin D101A* CIO All I/O pins In XT, HS and LP modes when external clock is used to drive OSC1 VCAP Capacitor Charging D102 Charging current — 200 — A D102A Source/sink capability when charging complete — 0.0 — mA * † Note 1: 2: 3: 4: These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. Negative current is defined as current sourced by the pin. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Including OSC2 in CLKOUT mode. DS41575C-page 376  2011-2012 Microchip Technology Inc. PIC16(L)F1933 30.5 Memory Programming Requirements Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C DC CHARACTERISTICS Param No. Sym. Characteristic Min. Typ† Max. Units Conditions Program Memory Programming Specifications D110 VIHH Voltage on MCLR/VPP/RE3 pin 8.0 — 9.0 V D111 IDDP Supply Current during Programming — — 10 mA VDD for Bulk Erase 2.7 — VDDMAX V VDDMIN — VDDMAX V D112 D113 VPEW D114 IPPPGM Current on MCLR/VPP during Erase/Write — — 1.0 mA D115 IDDPGM Current on VDD during Erase/ Write — — 5.0 mA D116 ED Byte Endurance 100K — — E/W VDD for Write or Row Erase (Note 3, Note 4) Data EEPROM Memory -40C to +85C D117 VDRW VDD for Read/Write VDDMIN — VDDMAX V D118 TDEW Erase/Write Cycle Time — 4.0 5.0 ms D119 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated D120 TREF Number of Total Erase/Write Cycles before Refresh(2) 1M 10M — E/W -40°C to +85°C D121 EP Cell Endurance 10K — — E/W -40C to +85C (Note 1) Program Flash Memory D122 VPRW VDD for Read/Write VDDMIN — VDDMAX V D123 TIW Self-timed Write Cycle Time — 2 2.5 ms D124 TRETD Characteristic Retention — 40 — Year Provided no other specifications are violated † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Self-write and Block Erase. 2: Refer to Section 11.2 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance. 3: Required only if single-supply programming is disabled. 4: The MPLAB ICD 2 does not support variable VPP output. Circuitry to limit the ICD 2 VPP voltage must be placed between the ICD 2 and target system when programming or debugging with the ICD 2.  2011-2012 Microchip Technology Inc. DS41575C-page 377 PIC16(L)F1933 30.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param No. TH01 TH02 TH03 TH04 TH05 Sym. Characteristic JA Thermal Resistance Junction to Ambient JC TJMAX PD Thermal Resistance Junction to Case Maximum Junction Temperature Power Dissipation PINTERNAL Internal Power Dissipation Typ. Units Conditions 60.0 C/W 28-pin SPDIP package 69.7 C/W 28-pin SOIC package 71.0 C/W 28-pin SSOP package 27.5 C/W 28-pin UQFN 4x4mm package 31.1 C/W 28-pin QFN 6x6mm package 29.0 C/W 28-pin SPDIP package 18.9 C/W 28-pin SOIC package 24.0 C/W 28-pin SSOP package 24.0 C/W 28-pin UQFN 4x4mm package 5.0 C/W 28-pin QFN 6x6mm package 150 C — W PD = PINTERNAL + PI/O — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature DS41575C-page 378  2011-2012 Microchip Technology Inc. PIC16(L)F1933 30.7 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O PORT mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low FIGURE 30-5: T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance LOAD CONDITIONS Load Condition Pin Cl Vss Legend: CL = 50 pF for all pins, 15 pF for OSC2 output  2011-2012 Microchip Technology Inc. DS41575C-page 379 PIC16(L)F1933 30.8 AC Characteristics: PIC16(L)F1933-I/E FIGURE 30-6: CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1/CLKIN OS02 OS04 OS04 OS03 OSC2/CLKOUT (LP,XT,HS Modes) OSC2/CLKOUT (CLKOUT Mode) TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param No. OS01 Sym. FOSC Characteristic External CLKIN Frequency(1) Oscillator Frequency(1) OS02 TOSC External CLKIN Period(1) Oscillator Period(1) OS03 TCY Instruction Cycle Time(1) OS04* TosH, TosL External CLKIN High, External CLKIN Low TosR, TosF External CLKIN Rise, External CLKIN Fall OS05* Min. Typ† Max. Units Conditions DC — 0.5 MHz EC Oscillator mode (low) DC — 4 MHz EC Oscillator mode (medium) DC — 20 MHz EC Oscillator mode (high) — 32.768 — kHz LP Oscillator mode 0.1 — 4 MHz XT Oscillator mode 1 — 4 MHz HS Oscillator mode 1 — 20 MHz HS Oscillator mode, VDD > 2.7V DC — 4 MHz 27 —  s 250 —  ns XT Oscillator mode 50 —  ns HS Oscillator mode EC Oscillator mode RC Oscillator mode, VDD > 2.0V LP Oscillator mode 50 —  ns — 30.5 — s LP Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 1,000 ns HS Oscillator mode 250 — — ns RC Oscillator mode 200 TCY DC ns TCY = 4/FOSC 2 — — s LP oscillator 100 — — ns XT oscillator 20 — — ns HS oscillator 0 —  ns LP oscillator 0 —  ns XT oscillator 0 —  ns HS oscillator * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. DS41575C-page 380  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 30-2: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. OS08 Sym. Characteristic Freq. Tolerance Min. Typ† Max. Units Conditions 0°C  TA  +60°C, VDD 2.5V 60°C TA 85°C, VDD 2.5V HFOSC Internal Calibrated HFINTOSC Frequency(1) ±2% ±3% — — 16.0 16.0 — — MHz MHz ±5% — 16.0 — MHz -40°C  TA  +125°C OS08A MFOSC Internal Calibrated MFINTOSC Frequency(1) ±2% ±3% — — 500 500 — — kHz kHz 0°C  TA  +60°C, VDD 2.5V 60°C TA 85°C, VDD 2.5V ±5% — 500 — kHz -40°C  TA  +125°C OS09 LFOSC Internal LFINTOSC Frequency ±25% — 31 — kHz -40°C  TA  +125°C OS10* TIOSC ST HFINTOSC Wake-up from Sleep Start-up Time MFINTOSC Wake-up from Sleep Start-up Time — — 3.2 8 s — — 24 35 s * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. TABLE 30-3: Param No. Sym. F10 PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.7V TO 5.5V) Characteristic Min. Typ† Max. Units FOSC Oscillator Frequency Range (Note 1) 4 — 8 MHz F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz F12 TRC PLL Start-up Time (Lock Time) — — 2 ms F13* CLK CLKOUT Stability (Jitter) -0.25% — +0.25% % Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The min. and max. frequency specifications are the oscillator nominal frequencies. Oscillators may have frequency tolerances of up to ±5%.  2011-2012 Microchip Technology Inc. DS41575C-page 381 PIC16(L)F1933 FIGURE 30-7: CLKOUT AND I/O TIMING Cycle Write Fetch Q1 Q4 Read Execute Q2 Q3 FOSC OS12 OS11 OS20 OS21 CLKOUT OS19 OS18 OS16 OS13 OS17 I/O pin (Input) OS14 OS15 I/O pin (Output) New Value Old Value OS18, OS19 TABLE 30-4: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. OS11 OS12 Sym. TosH2ckL Characteristic Min. Typ† Max. Units Conditions FOSC to CLKOUT (1) — — 70 ns VDD = 3.3-5.0V (1) — — 72 ns VDD = 3.3-5.0V TosH2ckH FOSC to CLKOUT valid(1) OS13 TckL2ioV CLKOUT to Port out OS14 OS15 OS16 TioV2ckH TosH2ioV TosH2ioI OS17 TioV2osH OS18 TioR Port input valid before CLKOUT(1) Fosc (Q1 cycle) to Port out valid Fosc (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to Fosc(Q2 cycle) (I/O in setup time) Port output rise time OS19 TioF Port output fall time OS20* Tinp OS21* Tioc — — 20 ns TOSC + 200 ns — 50 — 50 — — 70* — ns ns ns 20 — — ns — — — — 25 25 40 15 28 15 — — 72 32 55 30 — — ns INT pin input high or low time Interrupt-on-change new input level time * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. DS41575C-page 382 ns VDD = 3.3-5.0V VDD = 3.3-5.0V VDD = 1.8V VDD = 3.3-5.0V VDD = 1.8V VDD = 3.3-5.0V ns ns  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 30-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Start-Up Time Internal Reset(1) Watchdog Timer Reset(1) 31 34 34 I/O pins Note 1: Asserted low. FIGURE 30-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset (due to BOR) 33(1) Note 1: 64 ms delay only if PWRTE bit in the Configuration Words register is programmed to ‘0’. 2 ms delay if PWRTE = 0 and VREGEN = 1.  2011-2012 Microchip Technology Inc. DS41575C-page 383 PIC16(L)F1933 TABLE 30-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. Characteristic Min. Typ† Max. Units Conditions 2 — — s 10 16 27 ms Oscillator Start-up Timer Period(1) — 1024 — Tosc TPWRT Power-up Timer Period, PWRTE = 0 40 65 140 ms 34* TIOZ I/O high-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 s 35 VBOR Brown-out Reset Voltage(2) 2.38 1.80 2.5 1.9 2.73 2.11 V V 36* VHYST Brown-out Reset Hysteresis 0 25 60 mV -40°C to +85°C 37* TBORDC Brown-out Reset DC Response Time 1 3 35 s VDD  VBOR 30 TMCL 31 TWDTLP Low-Power Watchdog Timer Time-out Period MCLR Pulse Width (low) 32 TOST 33* VDD = 3.3V-5V 1:16 Prescaler used BORV = 0 BORV = 1 * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency. 2: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 F and 0.01 F values in parallel are recommended. FIGURE 30-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 40 41 42 T1CKI 45 46 47 49 TMR0 or TMR1 DS41575C-page 384  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 30-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param No. Sym. TT0H 40* Characteristic T0CKI High Pulse Width Min. No Prescaler TT0L T0CKI Low Pulse Width No Prescaler TT0P T0CKI Period 45* TT1H T1CKI High Synchronous, No Prescaler Time Synchronous, with Prescaler — — ns — — ns 0.5 TCY + 20 — — ns 10 — — ns Greater of: 20 or TCY + 40 N — — ns 0.5 TCY + 20 — — ns 15 — — ns Asynchronous TT1L 46* T1CKI Low Time 30 — — ns Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns Greater of: 30 or TCY + 40 N — — ns 47* TT1P T1CKI Input Synchronous Period 48 FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment Asynchronous * † Units 10 With Prescaler 42* Max. 0.5 TCY + 20 With Prescaler 41* Typ† 60 — — ns 32.4 32.768 33.1 kHz 2 TOSC — 7 TOSC — Conditions N = prescale value (2, 4, ..., 256) N = prescale value (1, 2, 4, 8) Timers in Sync mode These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-11: CAPTURE/COMPARE/PWM TIMINGS (CCP) CCPx (Capture mode) CC01 CC02 CC03 Note: Refer to Figure 30.5 for load conditions. TABLE 30-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C  TA  +125°C Param Sym. No. CC01* TccL CC02* TccH CC03* TccP * † Characteristic CCPx Input Low Time CCPx Input High Time CCPx Input Period Min. Typ† Max. Units No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns 3TCY + 40 N — — ns Conditions N = prescale value These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2011-2012 Microchip Technology Inc. DS41575C-page 385 PIC16(L)F1933 TABLE 30-8: PIC16(L)F1933 A/D CONVERTER (ADC) CHARACTERISTICS:(1,2,3) Standard Operating Conditions (unless otherwise stated) Operating temperature Tested at25°C Param Sym. No. Characteristic Min. Typ† Max. Units Conditions AD01 NR Resolution — — 10 AD02 EIL Integral Error — — ±1.7 AD03 EDL Differential Error — — ±1 AD04 EOFF Offset Error — — ±2.5 LSb VREF = 3.0V AD05 EGN LSb VREF = 3.0V AD06 VREF Reference Voltage(4) AD07 VAIN Full-Scale Range AD08 ZAIN Recommended Impedance of Analog Voltage Source * † Note 1: 2: 3: 4: Gain Error bit LSb VREF = 3.0V LSb No missing codes VREF = 3.0V — — ±2.0 1.8 — VDD V VSS — VREF V — — 10 VREF = (VREF+ minus VREF-) k Can go higher if external 0.01F capacitor is present on input pin. These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Total Absolute Error includes integral, differential, offset and gain errors. The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input. ADC Reference Voltage (Ref+) is the selected reference input, VREF+ pin, VDD pin or the FVR Buffer1. When the FVR is selected as the reference input, the FVR Buffer1 output selection must be 2.048V or 4.096V, (ADFVR = 1x). TABLE 30-9: PIC16(L)F1933 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +125°C Param No. Sym. AD130* TAD AD131 TCNV AD132* TACQ Characteristic Min. Typ† Max. Units Conditions A/D Clock Period 1.0 — 9.0 s TOSC-based A/D Internal RC Oscillator Period 1.0 2.5 6.0 s ADCS = 11 (ADRC mode) Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO/DONE bit to conversion complete Acquisition Time — 5.0 — s * † These parameters are characterized but not tested. Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The ADRES register may be read on the following TCY cycle. DS41575C-page 386  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 30-12: PIC16(L)F1933 A/D CONVERSION TIMING (NORMAL MODE) BSF ADCON0, GO AD134 1 Tcy (TOSC/2(1)) AD131 Q4 AD130 A/D CLK 7 A/D Data 6 4 5 3 2 1 0 NEW_DATA OLD_DATA ADRES 1 Tcy ADIF GO Sample DONE Sampling Stopped AD132 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. FIGURE 30-13: PIC16(L)F1933 A/D CONVERSION TIMING (SLEEP MODE) BSF ADCON0, GO AD134 (TOSC/2 + TCY(1)) 1 Tcy AD131 Q4 AD130 A/D CLK 7 A/D Data 6 5 4 OLD_DATA ADRES 2 1 0 NEW_DATA 1 Tcy ADIF GO Sample 3 DONE AD132 Sampling Stopped Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed.  2011-2012 Microchip Technology Inc. DS41575C-page 387 PIC16(L)F1933 TABLE 30-10: COMPARATOR SPECIFICATIONS Operating Conditions: 1.8V < VDD < 5.5V, -40°C < TA < +125°C (unless otherwise stated). Param No. Sym. Characteristics Min. Typ. Max. Units Comments — ±7.5 ±60 mV High-Power mode VICM = VDD/2 CM01 VIOFF CM02 VICM Input Common Mode Voltage 0 — VDD V CM03 CMRR Common Mode Rejection Ratio — 50 — dB Input Offset Voltage(1) CM04A Response Time Rising Edge — 400 800 ns High-Power mode CM04B Response Time Falling Edge — 200 400 ns High-Power mode Response Time Rising Edge — 1200 — ns Low-Power mode Response Time Falling Edge — 550 — ns Low-Power mode Comparator Mode Change to Output Valid* — — 10 s — 45 — mV CM04C TRESP CM04D CM05 TMC2OV CM06 CHYSTER Comparator Hysteresis(2) * Note 1: 2: CxHYS = 1 These parameters are characterized but not tested. High-Power mode only. Comparator Hysteresis is available when the CxHYS bit of the CMxCON0 register is enabled. TABLE 30-11: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS Operating Conditions: 2.5V < VDD < 5.5V, -40°C < Ta < +125°C (unless otherwise stated). Param No. Sym. Characteristics Min. Typ. Max. Units DAC01* CLSB Step Size(2) — VDD/32 — V DAC02* CACC Absolute Accuracy — —  1/2 LSb DAC03* CR Unit Resistor Value (R) — 5000 —  DAC04* CST Settling Time(1) — — 10 s * Note 1: Comments These parameters are characterized but not tested. Settling time measured while DACR transitions from ‘0000’ to ‘1111’. FIGURE 30-14: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING CK US121 US121 DT US120 Note: US122 Refer to Figure 30-5 for load conditions. DS41575C-page 388  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 30-12: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Symbol Characteristic Min. Max. Units — 80 ns US120 TCKH2DTV SYNC XMIT (Master and Slave) Clock high to data-out valid 3.0-5.5V 1.8-5.5V — 100 ns US121 TCKRF Clock out rise time and fall time (Master mode) 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns 1.8-5.5V — 50 ns FIGURE 30-15: Conditions USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING CK US125 DT US126 Note: Refer to Figure 30-5 for load conditions. TABLE 30-13: USART SYNCHRONOUS RECEIVE REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Symbol Characteristic US125 TDTV2CKL SYNC RCV (Master and Slave) Data-hold before CK  (DT hold time) US126 TCKL2DTL Data-hold after CK  (DT hold time)  2011-2012 Microchip Technology Inc. Min. Max. Units 10 — ns 15 — ns Conditions DS41575C-page 389 PIC16(L)F1933 FIGURE 30-16: SPI MASTER MODE TIMING (CKE = 0, SMP = 0) SS SP70 SCK (CKP = 0) SP71 SP72 SP78 SP79 SP79 SP78 SCK (CKP = 1) SP80 bit 6 - - - - - -1 MSb SDO LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure 30-5 for load conditions. FIGURE 30-17: SPI MASTER MODE TIMING (CKE = 1, SMP = 1) SS SP81 SCK (CKP = 0) SP71 SP72 SP79 SP73 SCK (CKP = 1) SP80 SDO MSb bit 6 - - - - - -1 SP78 LSb SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure 30-5 for load conditions. DS41575C-page 390  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 30-18: SPI SLAVE MODE TIMING (CKE = 0) SS SP70 SCK (CKP = 0) SP83 SP71 SP72 SP78 SP79 SP79 SP78 SCK (CKP = 1) SP80 MSb SDO LSb bit 6 - - - - - -1 SP77 SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 SP73 Note: Refer to Figure 30-5 for load conditions. FIGURE 30-19: SS SPI SLAVE MODE TIMING (CKE = 1) SP82 SP70 SP83 SCK (CKP = 0) SP71 SP72 SCK (CKP = 1) SP80 SDO MSb bit 6 - - - - - -1 LSb SP77 SP75, SP76 SDI MSb In bit 6 - - - -1 LSb In SP74 Note: Refer to Figure 30-5 for load conditions.  2011-2012 Microchip Technology Inc. DS41575C-page 391 PIC16(L)F1933 TABLE 30-14: SPI MODE REQUIREMENTS Param No. Symbol Characteristic SP70* TSSL2SCH, SS to SCK or SCK input TSSL2SCL Min. Typ† Max. Units Conditions TCY — — ns SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns 100 — — ns 100 — — ns 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns — 10 25 ns SP73* TDIV2SCH, Setup time of SDI data input to SCK edge TDIV2SCL SP74* TSCH2DIL, TSCL2DIL Hold time of SDI data input to SCK edge SP75* TDOR SDO data output rise time SP76* TDOF SDO data output fall time SP77* TSSH2DOZ SS to SDO output high-impedance 10 — 50 ns SP78* TSCR SCK output rise time (Master mode) 3.0-5.5V — 10 25 ns 1.8-5.5V — 25 50 ns SP79* TSCF SCK output fall time (Master mode) — 10 25 ns 3.0-5.5V — — 50 ns 1.8-5.5V — — 145 ns Tcy — — ns — — 50 ns 1.5TCY + 40 — — ns SP80* TSCH2DOV, SDO data output valid after TSCL2DOV SCK edge SP81* TDOV2SCH, SDO data output setup to SCK edge TDOV2SCL SP82* TSSL2DOV SDO data output valid after SS edge SP83* TSCH2SSH, SS after SCK edge TSCL2SSH * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-20: I2C™ BUS START/STOP BITS TIMING SCL SP93 SP91 SP90 SP92 SDA Start Condition Stop Condition Note: Refer to Figure 30-5 for load conditions. DS41575C-page 392  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 30-15: I2C™ BUS START/STOP BITS REQUIREMENTS Param No. Symbol Characteristic SP90* TSU:STA Start condition SP91* THD:STA SP92* TSU:STO SP93 THD:STO Stop condition Typ 4700 — Max. Units — Setup time 400 kHz mode 600 — — Start condition 100 kHz mode 4000 — — Hold time 400 kHz mode 600 — — Stop condition 100 kHz mode 4700 — — Setup time Hold time * 100 kHz mode Min. 400 kHz mode 600 — — 100 kHz mode 4000 — — 400 kHz mode 600 — — Conditions ns Only relevant for Repeated Start condition ns After this period, the first clock pulse is generated ns ns These parameters are characterized but not tested. FIGURE 30-21: I2C™ BUS DATA TIMING SP103 SCL SP100 SP90 SP102 SP101 SP106 SP107 SP91 SDA In SP92 SP110 SP109 SP109 SDA Out Note: Refer to Figure 30-5 for load conditions.  2011-2012 Microchip Technology Inc. DS41575C-page 393 PIC16(L)F1933 TABLE 30-16: I2C™ BUS DATA REQUIREMENTS Param. No. Symbol SP100* THIGH Characteristic Clock high time Min. Max. Units 100 kHz mode 4.0 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s Device must operate at a minimum of 10 MHz SSP module SP101* TLOW Clock low time 1.5TCY — 100 kHz mode 4.7 — s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s Device must operate at a minimum of 10 MHz 1.5TCY — SDA and SCL rise time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1CB 300 ns SDA and SCL fall time 100 kHz mode — 250 ns 400 kHz mode 20 + 0.1CB 250 ns SSP module SP102* TR SP103* TF SP106* THD:DAT SP107* TSU:DAT SP109* TAA SP110* SP111 * Note 1: 2: TBUF CB Data input hold time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s Data input setup time 100 kHz mode 250 — ns 400 kHz mode 100 — ns Output valid from clock 100 kHz mode — 3500 ns 400 kHz mode — — ns Bus free time Conditions 100 kHz mode 4.7 — s 400 kHz mode 1.3 — s — 400 pF Bus capacitive loading CB is specified to be from 10-400 pF CB is specified to be from 10-400 pF (Note 2) (Note 1) Time the bus must be free before a new transmission can start These parameters are characterized but not tested. As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. A Fast mode (400 kHz) I2C™ bus device can be used in a Standard mode (100 kHz) I2C bus system, but the requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released. DS41575C-page 394  2011-2012 Microchip Technology Inc. PIC16(L)F1933 TABLE 30-17: CAP SENSE OSCILLATOR SPECIFICATIONS Param. No. Symbol CS01* ISRC CS02* ISNK Characteristic Current Source Current Sink Min. Typ† Max. Units High — -8 — A Medium — -1.5 — A Low — -0.3 — A High — 7.5 — A Medium — 1.5 — A — 0.25 — A — 0.8 — mV — 0.4 — mV — — — 525 375 300 — — — mV mV mV Low CS03* VCTH Cap Threshold CS04* VCTL Cap Threshold CS05* VCHYST Cap Hysteresis (VCTH-VCTL) High Medium Low Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. FIGURE 30-22: CAP SENSE OSCILLATOR VCTH VCTL ISRC Enabled  2011-2012 Microchip Technology Inc. ISNK Enabled DS41575C-page 395 PIC16(L)F1933 NOTES: DS41575C-page 396  2011-2012 Microchip Technology Inc. PIC16(L)F1933 31.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. “Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.” represents (mean + 3) or (mean - 3) respectively, where  is a standard deviation, over each temperature range.  2011-2012 Microchip Technology Inc. DS41575C-page 397 PIC16(L)F1933 FIGURE 31-1: IDD, LP OSCILLATOR MODE, FOSC = 32 kHz, PIC16LF1933 ONLY 14 Max. Max: 85°C + 3 Typical: 25°C 12 10 Typical IDD (μA) 8 6 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-2: IDD, LP OSCILLATOR MODE, FOSC = 32 kHz, PIC16F1933 ONLY 60 IDD (μA) Max: 85°C + 3 Typical: 25°C 50 Max. 40 Typical 30 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 398  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-3: IDD TYPICAL, XT AND EXTRC OSCILLATOR MODE, PIC16LF1933 ONLY 600 4 MHz XT Typical: 25°C 500 4 MHz EXTRC IDD (μA) 400 300 1 MHz XT 200 100 1 MHz EXTRC 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 3.6 3.8 VDD (V) FIGURE 31-4: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC16LF1933 ONLY 700 Max: 85°C + 3 600 4 MHz XT IDD (μA) 500 4 MHz EXTRC 400 300 1 MHz XT 200 100 1 MHz EXTRC 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 399 PIC16(L)F1933 FIGURE 31-5: IDD TYPICAL, XT AND EXTRC OSCILLATOR, PIC16F1933 ONLY 700 4 MHz XT Typical: 25°C 600 4 MHz EXTRC IDD (μA) 500 400 300 1 MHz XT 200 1 MHz EXTRC 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 31-6: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC16F1933 ONLY 800 4 MHz XT 700 Max: 85°C + 3 600 4 MHz EXTRC IDD (μA) 500 400 300 1 MHz XT 200 1 MHz EXTRC 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 400  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-7: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC16LF1933 ONLY 120 Max: 85°C + 3 Typical: 25°C 100 Max. IDD (μA) 80 Typical 60 40 20 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-8: IDD, EC OSCILLATOR, LOW-POWER MODE, FOSC = 500 kHz, PIC16F1933 ONLY 120 Max: 85°C + 3 Typical: 25°C 100 Max. Typical IDD (μA) 80 60 40 20 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 401 PIC16(L)F1933 FIGURE 31-9: IDD TYPICAL, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16LF1933 ONLY 400 350 Typical: 25°C 4 MHz 300 IDD (μA) 250 200 150 100 50 1 MHz 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16LF1933 ONLY FIGURE 31-10: 450 400 4 MHz 350 Max: 85°C + 3 IDD (μA) 300 250 200 150 100 1 MHz 50 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS41575C-page 402  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-11: IDD TYPICAL, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16F1933 ONLY 700 Typical: 25°C 600 4 MHz IDD (μA) 500 400 300 200 1 MHz 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 31-12: IDD MAXIMUM, EC OSCILLATOR, MEDIUM-POWER MODE, PIC16F1933 ONLY 700 4 MHz Max: 85°C + 3 600 IDD (μA) 500 400 300 1 MHz 200 100 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 403 PIC16(L)F1933 FIGURE 31-13: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC16LF1933 ONLY 4.5 Typical: 25°C 4.0 32 MHz (PLL) 3.5 IDD (mA) 3.0 2.5 2.0 16 MHz 1.5 1.0 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-14: IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC16LF1933 ONLY 5.0 4.5 Max: 85°C + 3 32 MHz (PLL) 4.0 IDD (mA) 3.5 3.0 2.5 2.0 16 MHz 1.5 1.0 8 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS41575C-page 404  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-15: IDD TYPICAL, EC OSCILLATOR, HIGH-POWER MODE, PIC16F1933 ONLY 4.0 Typical: 25°C 3.5 32 MHz (PLL) 3.0 IDD (mA) 2.5 2.0 16 MHz 1.5 8 MHz 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 31-16: IDD MAXIMUM, EC OSCILLATOR, HIGH-POWER MODE, PIC16F1933 ONLY 4.5 Max: 85°C + 3 4.0 32 MHz (PLL) 3.5 IDD (mA) 3.0 2.5 2.0 16 MHz 1.5 8 MHz 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 405 PIC16(L)F1933 FIGURE 31-17: IDD, LFINTOSC MODE, FOSC = 31 kHz, PIC16LF1933 ONLY 12 Max: 85°C + 3 Typical: 25°C 10 Max. IDD (μA) 8 6 Typical 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-18: IDD, LFINTOSC MODE, FOSC = 31 kHz, PIC16F1933 ONLY 45 40 Max. 35 Typical IDD (μA) 30 25 20 15 10 Max: 85°C + 3 Typical: 25°C 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) DS41575C-page 406  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-19: IDD, MFINTOSC MODE, FOSC = 500 kHz, PIC16LF1933 ONLY 200 190 Max. Max: 85°C + 3 Typical: 25°C 180 IDD (μA) 170 Typical 160 150 140 130 120 110 100 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-20: IDD, MFINTOSC MODE, FOSC = 500 kHz, PIC16F1933 ONLY 300 Max. 280 Max: 85°C + 3 Typical: 25°C 260 Typical IDD (μA) 240 220 200 180 160 140 120 100 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 407 PIC16(L)F1933 FIGURE 31-21: IDD TYPICAL, HFINTOSC MODE, PIC16LF1933 ONLY 5.0 Typical: 25°C 4.5 32 MHz (PLL) 4.0 IDD (mA) 3.5 3.0 2.5 16 MHz 2.0 8 MHz 1.5 1.0 4 MHz 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, HFINTOSC MODE, PIC16LF1933 ONLY FIGURE 31-22: 6.0 Max: 85°C + 3 5.0 32 MHz (PLL) IDD (mA) 4.0 3.0 16 MHz 2.0 8 MHz 4 MHz 1.0 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) DS41575C-page 408  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-23: IDD TYPICAL, HFINTOSC MODE, PIC16F1933 ONLY 4.5 Typical: 25°C 4.0 32 MHz (PLL) 3.5 IDD (mA) 3.0 16 MHz 2.5 2.0 8 MHz 1.5 1.0 4 MHz 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 5.5 6.0 VDD (V) FIGURE 31-24: IDD MAXIMUM, HFINTOSC MODE, PIC16F1933 ONLY 4.5 Max: 85°C + 3 4.0 32 MHz (PLL) 3.5 IDD (mA) 3.0 16 MHz 2.5 2.0 8 MHz 1.5 4 MHz 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 409 PIC16(L)F1933 FIGURE 31-25: IDD TYPICAL, HS OSCILLATOR, PIC16LF1933 ONLY 3.5 3 Typical: 25°C 32 MHz (PLL) IDD (mA) 2.5 20 MHz 2 1.5 1 8 MHz 0.5 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 3.4 3.6 3.8 VDD (V) IDD MAXIMUM, HS OSCILLATOR, PIC16LF1933 ONLY FIGURE 31-26: 3.5 3.0 Max: 85°C + 3 32 MHz (PLL) IDD (mA) 2.5 20 MHz 2.0 1.5 8 MHz 1.0 0.5 0.0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 VDD (V) DS41575C-page 410  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-27: IDD TYPICAL, HS OSCILLATOR, PIC16F1933 ONLY 4.5 32 MHz (PLL) Typical: 25°C 4 3.5 3 IDD (mA) 2.5 20 MHz 2 1.5 8 MHz 1 0.5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 5.5 6.0 VDD (V) FIGURE 31-28: IDD MAXIMUM, HS OSCILLATOR, PIC16F1933 ONLY 4.5 4.0 Max: 85°C + 3 32 MHz (PLL) 3.5 IDD (mA) 3.0 20 MHz 2.5 2.0 1.5 8 MHz 1.0 0.5 0.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 411 PIC16(L)F1933 FIGURE 31-29: IPD BASE, LOW-POWER SLEEP MODE, PIC16LF1933 ONLY 1,200 Max. Max: 85°C + 3 Typical: 25°C 1,000 IPD D (nA) 800 600 400 200 Typical yp 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-30: IPD BASE, LOW-POWER SLEEP MODE, PIC16F1933 ONLY 50 Max: 85°C + 3 M 3 Typical: 25°C 45 Max. 40 IPD (μA) 35 30 Typical 25 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 412  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-31: IPD, WATCHDOG TIMER (WDT), PIC16LF1933 ONLY 2500 Max: 85°C + 3 Typical: 25°C 2000 IPD (μA (μA) Max. 1500 1000 Typical 500 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-32: IPD, WATCHDOG TIMER (WDT), PIC16F1933 ONLY 45 Max: 85°C + 3 M 3 Typical: 25°C 40 Max. 35 IPD (μA A) 30 Typical 25 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 413 PIC16(L)F1933 FIGURE 31-33: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16LF1933 ONLY 14 Max. 12 IPD (μA A) 10 Typical 8 6 4 Max: 85°C + 3 yp Typical: 25°C 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-34: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC16F1933 ONLY 120 Max: 85°C + 3 Typical: 25°C 100 Max. Typical IPD (μA) 80 60 40 20 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 414  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-35: IPD, BROWN-OUT RESET (BOR), PIC16LF1933 ONLY 12 Max. Max: 85°C + 3 Typical: 25°C 11 10 9 IPD (μA) Typical 8 7 6 5 4 1 8 1.8 2 0 2.0 2 2 2.2 2 4 2.4 2 6 2.6 2 8 2.8 3 0 3.0 3 2 3.2 3 4 3.4 3 6 3.6 3 8 3.8 VDD (V) FIGURE 31-36: IPD, BROWN-OUT RESET (BOR), PIC16F1933 ONLY 50 Max: 85°C + 3 Typical: 25°C 45 Max Max. 40 35 Typical IPD (μA) 30 25 20 15 10 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 415 PIC16(L)F1933 FIGURE 31-37: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC16LF1933 ONLY 6 Max: 85°C + 3 M 3 Typical: 25°C 5 Max. IPD (μA A) 4 3 Typical 2 1 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-38: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC16F1933 ONLY 60 Max. 50 IPD (μA) 40 Typical 30 20 Max: 85°C + 3 Typical: 25°C 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 416  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-39: IPD, CAPACITIVE SENSING (CPS) MODULE, LOW-CURRENT RANGE, CPSRM = 0, CPSRNG = 01, PIC16LF1933 ONLY 8 Max. Max: 85°C + 3 M 3 Typical: 25°C 7 6 IPD (μA A) 5 4 Typical 3 2 1 0 16 1.6 1 8 1.8 2 0 2.0 2 2 2.2 2 4 2.4 2 6 2.6 2 8 2.8 3 0 3.0 3 2 3.2 3 4 3.4 3 6 3.6 3 8 3.8 VDD (V) FIGURE 31-40: IPD, CAPACITIVE SENSING (CPS) MODULE, LOW-CURRENT RANGE, CPSRM = 0, CPSRNG = 01, PIC16F1933 ONLY 45 Max: 85°C + 3 Typical: 25°C 40 Max. 35 30 IPD (μA A) Typical 25 20 15 10 5 0 1 5 1.5 2 0 2.0 2 5 2.5 3 0 3.0 3 5 3.5 4 0 4.0 4 5 4.5 5 0 5.0 5 5 5.5 6 0 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 417 PIC16(L)F1933 FIGURE 31-41: IPD, CAPACITIVE SENSING (CPS) MODULE, MEDIUM-CURRENT RANGE, CPSRM = 0, CPSRNG = 10, PIC16LF1933 ONLY 14 Max: 85°C + 3 Typical: 25°C 12 Max. IPD D (μA) 10 8 6 Typical 4 2 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-42: IPD, CAPACITIVE SENSING (CPS) MODULE, MEDIUM-CURRENT RANGE, CPSRM = 0, CPSRNG = 10, PIC16F1933 ONLY 60 Max. 50 IPD (μA A) 40 Typical 30 20 10 Max: 85°C + 3 yp Typical: 25°C 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 418  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-43: IPD, CAPACITIVE SENSING (CPS) MODULE, HIGH-CURRENT RANGE, CPSRM = 0, CPSRNG = 11, PIC16LF1933 ONLY 70 Max: 85°C + 3 M 3 Typical: 25°C 60 Max. IPD (μA A) 50 40 30 20 Typical 10 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-44: IPD, CAPACITIVE SENSING (CPS) MODULE, HIGH-CURRENT RANGE, CPSRM = 0, CPSRNG = 11, PIC16F1933 ONLY 140 Max Max. Max: 85°C + 3 Typical: 25°C 120 IPD (μA A) 100 80 Typical 60 40 20 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 419 PIC16(L)F1933 FIGURE 31-45: IPD, COMPARATOR, LOW-POWER MODE, CxSP = 0, PIC16LF1933 ONLY 30 Max Max. 25 IPD (μA) 20 Typical 15 10 Max: 85°C + 3 Typical: 25°C 5 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD (V) FIGURE 31-46: IPD, COMPARATOR, LOW-POWER MODE, CxSP = 0, PIC16F1933 ONLY 60 Max. 50 IPD (μA) 40 Typical 30 20 Max: 85°C + 3 Typical: 25°C 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 420  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-47: IPD, COMPARATOR, NORMAL-POWER MODE, CxSP = 1, PIC16LF1933 ONLY 50 45 Max. 40 35 IPD (μA A) Typical 30 25 20 15 Max: 85°C + 3 Typical: 25°C 10 5 0 16 1.6 1 1.8 8 2 2.0 0 2 2.2 2 2 2.4 4 2 2.6 6 2 2.8 8 3 3.0 0 3 3.2 2 3 3.4 4 3 3.6 6 3 3.8 8 VDD (V) FIGURE 31-48: IPD, COMPARATOR, NORMAL-POWER MODE, CxSP = 1, PIC16F1933 ONLY 80 M Max. 70 60 IPD (μA A) 50 Typical 40 30 20 Max: 85°C + 3 yp Typical: 25°C 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 421 PIC16(L)F1933 FIGURE 31-49: VOH vs. IOH, OVER TEMPERATURE, VDD = 5.0V, PIC16F1933 ONLY 6 Graph represents 3 Limits 5 VOH (V) 4 -40°C 3 125°C 2 Typical 1 0 -30 -25 -20 -15 -10 -5 0 IOH (mA) FIGURE 31-50: VOL vs. IOL, OVER TEMPERATURE, VDD = 5.0V, PIC16F1933 ONLY 5 Graph represents 3 Limits VOL (V) 4 3 -40°C 2 Typical 125°C 1 0 0 DS41575C-page 422 10 20 30 40 IOL (mA) 50 60 70 80  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-51: VOH vs. IOH, OVER TEMPERATURE, VDD = 3.0V 3.5 Graph represents 3 Limits 3.0 VOH (V) 2.5 2.0 1.5 125°C Typical 1.0 -40°C 0.5 0.0 -14 -12 -10 -8 -6 -4 -2 0 IOH (mA) FIGURE 31-52: VOL vs. IOL, OVER TEMPERATURE, VDD = 3.0V 3.0 Graph represents 3 Limits 2.5 VOL (V) 2.0 -40°C Typical 1.5 125°C 1.0 0.5 0.0 0 5 10 15 20 25 30 IOL (mA)  2011-2012 Microchip Technology Inc. DS41575C-page 423 PIC16(L)F1933 FIGURE 31-53: VOH vs. IOH, OVER TEMPERATURE, VDD = 1.8V 2.0 Graph represents 3 Limits 1.8 1.6 VOH (V) 1.4 1.2 125°C 1.0 0.8 Typical -40°C 0.6 0.4 0.2 0.0 -4 -3.5 -3 -2.5 -2 -1.5 -1 -0.5 0 IOH (mA) FIGURE 31-54: VOL vs. IOL, OVER TEMPERATURE, VDD = 1.8V 1.8 Graph represents 3 Limits 1.6 1.4 VOL (V) 1.2 1.0 125°C Typical 0.8 -40°C 0.6 0.4 0.2 0.0 0 1 2 3 4 5 6 7 8 9 10 IOL (mA) DS41575C-page 424  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-55: POR RELEASE VOLTAGE 1.70 1.68 Max. 1.66 Voltage (V) 1.64 Typical 1.62 Min. 1.60 1.58 1.56 Max: Typical + 3 Typical: 25°C Min: Typical - 3 1.54 1.52 1.50 -40 -20 0 20 40 60 80 100 120 100 120 Temperature (°C) FIGURE 31-56: POR REARM VOLTAGE, PIC16F1933 ONLY 1.54 Max: Typical + 3 Typical: 25°C Min: Typical - 3 1.52 1.50 Max. Voltage (V) 1.48 1.46 1.44 Typical 1.42 1.40 Min. 1.38 1.36 1.34 -40 -20 0 20 40 60 80 Temperature (°C)  2011-2012 Microchip Technology Inc. DS41575C-page 425 PIC16(L)F1933 FIGURE 31-57: BROWN-OUT RESET VOLTAGE, BORV = 1 2.10 Max: Typical + 3 Min: Typical - 3 2.05 Voltage (V) 2.00 1.95 Max. 1.90 1.85 Min. 1.80 1.75 1.70 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 31-58: BROWN-OUT RESET HYSTERESIS, BORV = 1 70 Max. 60 Voltage (mV) 50 Typical 40 30 Min. 20 Max: Typical + 3 Typical: 25°C Min: Typical - 3 10 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) DS41575C-page 426  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-59: BROWN-OUT RESET VOLTAGE, BORV = 0 2.65 2.60 Max. Voltage (V) 2.55 2.50 2.45 Min. Max: Typical + 3 Min: Typical - 3 2.40 2.35 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) FIGURE 31-60: BROWN-OUT RESET HYSTERESIS, BORV = 0 90 80 Max. 70 Voltage (mV) 60 50 Typical 40 30 20 Max: Typical Min. + 3 Typical: 25°C Min: Typical - 3 Min. 10 0 -60 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C)  2011-2012 Microchip Technology Inc. DS41575C-page 427 PIC16(L)F1933 FIGURE 31-61: WDT TIME-OUT PERIOD 24 22 Max. Time (mS) 20 18 Typical 16 14 Min. Max: Typical + 3 (-40°C to +125°C) Typical: statistical mean @ 25°C Min: Typical - 3 (-40°C to +125°C) 12 10 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Voltage (V) FIGURE 31-62: PWRT PERIOD 110 100 Max. Time (mS) 90 80 Typical 70 Min. 60 Max: Typical + 3 (-40°C to +125°C) Typical: statistical mean @ 25°C Min: Typical - 3 (-40°C to +125°C) 50 40 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Voltage (V) DS41575C-page 428  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-63: COMPARATOR HYSTERESIS, NORMAL-POWER MODE, CxSP = 1, CxHYS = 1 100 90 Hysteresis (mV) 80 Max. 70 Typical 60 50 Max: Typical + 3 Typical: 25°C Min: Typical - 3 40 30 Min. 20 10 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 31-64: COMPARATOR HYSTERESIS, LOW-POWER MODE, CxSP = 0, CxHYS = 1 25 Max: Typical + 3 Typical: 25°C Min: Typical - 3 Hysteresis (mV) 20 15 Max. Typical 10 Min. 5 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V)  2011-2012 Microchip Technology Inc. DS41575C-page 429 PIC16(L)F1933 FIGURE 31-65: COMPARATOR RESPONSE TIME, NORMAL-POWER MODE, CxSP = 1 390 Max: Typical + 3 Typical: 25°C 340 Time (nS) 290 240 Max. 190 Typical 140 90 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) FIGURE 31-66: COMPARATOR RESPONSE TIME OVER TEMPERATURE, NORMAL-POWER MODE, CxSP = 1 260 Graph represents 3 Limits 240 Time (nS) 220 200 180 125°C 160 Typical -40°C 140 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (V) DS41575C-page 430  2011-2012 Microchip Technology Inc. PIC16(L)F1933 FIGURE 31-67: COMPARATOR INPUT OFFSET AT 25°C, NORMAL-POWER MODE, CxSP = 1, PIC16F1933 ONLY 60 40 Offset Voltage (mV) Max. 20 Typical 0 Min. -20 Max: Typical + 3 Typical: 25°C Min: Typical - 3 -40 -60 0.0 1.0 2.0 3.0 4.0 5.0 Common Mode Voltage (V)  2011-2012 Microchip Technology Inc. DS41575C-page 431 PIC16(L)F1933 NOTES: DS41575C-page 432  2011-2012 Microchip Technology Inc. PIC16(L)F1933 32.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C® for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 32.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power.  2011-2012 Microchip Technology Inc. DS41575C-page 433 PIC16(L)F1933 32.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 32.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 32.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 32.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 32.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process DS41575C-page 434  2011-2012 Microchip Technology Inc. PIC16(L)F1933 32.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 32.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables.  2011-2012 Microchip Technology Inc. 32.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 32.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. DS41575C-page 435 PIC16(L)F1933 32.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 32.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 32.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS41575C-page 436 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2011-2012 Microchip Technology Inc. PIC16(L)F1933 33.0 PACKAGING INFORMATION 33.1 Package Marking Information 28-Lead SPDIP (.300”) Example PIC16F1933 -E/SP e3 1210017 28-Lead SOIC (7.50 mm) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX Example PIC16F1933 -E/SO e3 1210017 YYWWNNN 28-Lead SSOP (5.30 mm) Example PIC16F1933 -E/SS e3 1210017 Legend: XX...X Y YY WW NNN e3 * Note: * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.  2011-2012 Microchip Technology Inc. DS41575C-page 437 PIC16(L)F1933 Package Marking Information (Continued) 28-Lead QFN (6x6 mm) PIN 1 Example PIN 1 16LF1933 -I/ML e3 1210017 XXXXXXXX XXXXXXXX YYWWNNN 28-Lead UQFN (4x4x0.5 mm) PIN 1 PIN 1 Legend: XX...X Y YY WW NNN e3 * Note: * Example PIC16 F1933 E/MV e3 210017 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PICmicro® device marking consists of Microchip part number, year code, week code and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS41575C-page 438  2011-2012 Microchip Technology Inc. PIC16(L)F1933 33.2 Package Details The following sections give the technical details of the packages. /HDG6NLQQ\3ODVWLF'XDO,Q/LQH63±PLO%RG\>63',3@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ N NOTE 1 E1 1 2 3 D E A2 A L c b1 A1 b e eB 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 7RSWR6HDWLQJ3ODQH $ ± ± 0ROGHG3DFNDJH7KLFNQHVV $ %DVHWR6HDWLQJ3ODQH $ ± ± 6KRXOGHUWR6KRXOGHU:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' 7LSWR6HDWLQJ3ODQH / /HDG7KLFNQHVV F E E H% ± ± 8SSHU/HDG:LGWK /RZHU/HDG:LGWK 2YHUDOO5RZ6SDFLQJ %6& 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(6623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D N E E1 1 2 NOTE 1 b e c A2 A φ A1 L L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ ± %6& ± 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ ± ± 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' )RRW/HQJWK / )RRWSULQW / 5() /HDG7KLFNQHVV F ± )RRW$QJOH /HDG:LGWK E ± 1RWHV 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(4)1@ ZLWKPP&RQWDFW/HQJWK 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS41575C-page 446  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2011-2012 Microchip Technology Inc. DS41575C-page 447 PIC16(L)F1933 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS41575C-page 448  2011-2012 Microchip Technology Inc. PIC16(L)F1933 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (05/2011) Initial release. Revision B (06/2012) Update to Electrical Specifications. APPENDIX B: This discusses some of the issues in migrating from other PIC® devices to the PIC16(L)F1933 family of devices. B.1 PIC16F917 to PIC16(L)F1933 TABLE B-1: Revision C (09/2012) Updated Note 1 in Register 23-1; Updated Table 26-1; Updated the Electrical Specifications section; Updated Figure 31-37; Other minor corrections. MIGRATING FROM OTHER PIC® DEVICES FEATURE COMPARISON Feature PIC16F917 PIC16F1933 Max. Operating Speed 20 MHz 32 MHz 8K 8K Max. Program Memory (Words) Max. SRAM (Bytes) 368 512 10-bit 10-bit Timers (8/16-bit) 2/1 4/1 Oscillator Modes 4 8 A/D Resolution Brown-out Reset Y Y Internal Pull-ups RB RB Interrupt-on-change RB RB 2 2 Comparator AUSART/EUSART 1/0 0/1 Extended WDT Y Y Software Control Option of WDT/BOR N Y INTOSC Frequencies 30 kHz 8 MHz 500 kHz 32 MHz Y Y Clock Switching Capacitive Sensing CCP/ECCP Enhanced PIC16 CPU MSSP/SSP LCD  2011-2012 Microchip Technology Inc. N Y 2/0 2/3 N Y 0/1 1/0 Y Y DS41575C-page 449 PIC16(L)F1933 NOTES: DS41575C-page 450  2011-2012 Microchip Technology Inc. PIC16(L)F1933 INDEX A A/D Specifications............................................................ 386 Absolute Maximum Ratings (PIC16F/LF1933) ................. 365 AC Characteristics Industrial and Extended (PIC16F/LF1933) ............... 380 Load Conditions ........................................................ 379 ACKSTAT ......................................................................... 254 ACKSTAT Status Flag ...................................................... 254 ADC .................................................................................. 137 Acquisition Requirements ......................................... 147 Associated registers.................................................. 149 Block Diagram........................................................... 137 Calculating Acquisition Time..................................... 147 Channel Selection..................................................... 138 Configuration............................................................. 138 Configuring Interrupt ................................................. 142 Conversion Clock...................................................... 138 Conversion Procedure .............................................. 142 Internal Sampling Switch (RSS) Impedance.............. 147 Interrupts................................................................... 140 Operation .................................................................. 141 Operation During Sleep ............................................ 141 Port Configuration ..................................................... 138 Reference Voltage (VREF)......................................... 138 Source Impedance.................................................... 147 Special Event Trigger................................................ 141 Starting an A/D Conversion ...................................... 140 ADCON0 Register....................................................... 26, 143 ADCON1 Register....................................................... 26, 144 ADDFSR ........................................................................... 355 ADDWFC .......................................................................... 355 ADRESH Register............................................................... 26 ADRESH Register (ADFM = 0) ......................................... 145 ADRESH Register (ADFM = 1) ......................................... 146 ADRESL Register (ADFM = 0).......................................... 145 ADRESL Register (ADFM = 1).......................................... 146 Alternate Pin Function....................................................... 114 Analog-to-Digital Converter. See ADC ANSELA Register ............................................................. 117 ANSELB Register ............................................................. 122 APFCON Register............................................................. 114 Assembler MPASM Assembler................................................... 434 B BAUDCON Register.......................................................... 287 BF ............................................................................. 254, 256 BF Status Flag .......................................................... 254, 256 Block Diagram Capacitive Sensing ........................................... 305, 306 Block Diagrams (CCP) Capture Mode Operation ............................... 192 ADC .......................................................................... 137 ADC Transfer Function ............................................. 148 Analog Input Model ........................................... 148, 162 CCP PWM................................................................. 196 Clock Source............................................................... 52 Comparator ............................................................... 158 Compare ................................................................... 194 Crystal Operation .................................................. 54, 55 Digital-to-Analog Converter (DAC)............................ 154 EUSART Receive ..................................................... 276  2011-2012 Microchip Technology Inc. EUSART Transmit .................................................... 275 External RC Mode ...................................................... 56 Fail-Safe Clock Monitor (FSCM)................................. 64 Generic I/O Port........................................................ 113 Interrupt Logic............................................................. 77 LCD Bias Voltage Generation .................................. 321 LCD Clock Generation.............................................. 320 On-Chip Reset Circuit................................................. 69 PIC16F193X/LF193X ............................................. 8, 14 PWM (Enhanced) ..................................................... 200 Resonator Operation .................................................. 54 Timer0 ...................................................................... 171 Timer1 ...................................................................... 175 Timer1 Gate.............................................. 180, 181, 182 Timer2/4/6 ................................................................ 187 Voltage Reference.................................................... 134 Voltage Reference Output Buffer Example .............. 154 BORCON Register.............................................................. 71 BRA .................................................................................. 356 Break Character (12-bit) Transmit and Receive ............... 296 Brown-out Reset (BOR)...................................................... 71 Specifications ........................................................... 384 Timing and Characteristics ....................................... 383 C C Compilers MPLAB C18.............................................................. 434 CALL................................................................................. 357 CALLW ............................................................................. 357 Capacitive Sensing ........................................................... 305 Associated registers w/ Capacitive Sensing............. 312 Specifications ........................................................... 395 Capture Module. See Enhanced Capture/Compare/PWM (ECCP) Capture/Compare/PWM ................................................... 191 Capture/Compare/PWM (CCP) Associated Registers w/ Capture ............................. 193 Associated Registers w/ Compare ........................... 195 Associated Registers w/ PWM ......................... 199, 213 Capture Mode........................................................... 192 CCPx Pin Configuration............................................ 192 Compare Mode......................................................... 194 CCPx Pin Configuration.................................... 194 Software Interrupt Mode ........................... 192, 194 Special Event Trigger ....................................... 194 Timer1 Mode Resource ............................ 192, 194 Prescaler .................................................................. 192 PWM Mode Duty Cycle ........................................................ 197 Effects of Reset ................................................ 199 Example PWM Frequencies and Resolutions, 20 MHZ ................................ 198 Example PWM Frequencies and Resolutions, 32 MHZ ................................ 198 Example PWM Frequencies and Resolutions, 8 MHz .................................. 198 Operation in Sleep Mode.................................. 199 Resolution ........................................................ 198 System Clock Frequency Changes .................. 199 PWM Operation ........................................................ 196 PWM Overview......................................................... 196 PWM Period ............................................................. 197 PWM Setup .............................................................. 197 CCP1CON Register...................................................... 30, 31 DS41575C-page 451 PIC16(L)F1933 CCPR1H Register ......................................................... 30, 31 CCPR1L Register.......................................................... 30, 31 CCPTMRS0 Register ........................................................ 215 CCPTMRS1 Register ........................................................ 215 CCPxAS Register.............................................................. 216 CCPxCON (ECCPx) Register ........................................... 214 Clock Accuracy with Asynchronous Operation ................. 284 Clock Sources External Modes ........................................................... 53 EC ....................................................................... 53 HS ....................................................................... 53 LP........................................................................ 53 OST..................................................................... 54 RC....................................................................... 55 XT ....................................................................... 53 Internal Modes ............................................................ 57 HFINTOSC.......................................................... 57 Internal Oscillator Clock Switch Timing............... 59 LFINTOSC .......................................................... 58 MFINTOSC ......................................................... 57 Clock Switching................................................................... 61 CMOUT Register............................................................... 164 CMxCON0 Register .......................................................... 163 CMxCON1 Register .......................................................... 164 Code Examples A/D Conversion ......................................................... 142 Changing Between Capture Prescalers .................... 192 Initializing PORTA ..................................................... 113 Write Verify ............................................................... 109 Writing to Flash Program Memory ............................ 107 Comparator Associated Registers ........................................ 165, 166 Operation .................................................................. 157 Comparator Module .......................................................... 157 Cx Output State Versus Input Conditions ................. 159 Comparator Specifications ................................................ 388 Comparators C2OUT as T1 Gate ................................................... 177 Compare Module. See Enhanced Capture/Compare/ PWM (ECCP) CONFIG1 Register.............................................................. 46 CONFIG2 Register.............................................................. 48 Core Registers .................................................................... 25 CPSCON0 Register .......................................................... 311 CPSCON1 Register .......................................................... 312 Customer Change Notification Service ............................. 459 Customer Notification Service........................................... 459 Customer Support ............................................................. 459 D DACCON0 (Digital-to-Analog Converter Control 0) Register..................................................................... 156 DACCON1 (Digital-to-Analog Converter Control 1) Register..................................................................... 156 Data EEPROM Memory ...................................................... 99 Associated Registers ................................................ 112 Code Protection ........................................................ 100 Reading..................................................................... 100 Writing ....................................................................... 100 Data Memory................................................................. 17, 20 DC and AC Characteristics ............................................... 397 Graphs and Tables ................................................... 397 DC Characteristics Extended and Industrial (PIC16F/LF1933) ............... 375 Industrial and Extended (PIC16F/LF1933) ............... 368 Development Support ....................................................... 433 DS41575C-page 452 Device Configuration .......................................................... 45 Code Protection .......................................................... 49 Configuration Word..................................................... 45 User ID ................................................................. 49, 50 Device ID Register.............................................................. 50 Device Overview............................................................. 7, 95 Digital-to-Analog Converter (DAC) ................................... 153 Effects of a Reset ..................................................... 154 Specifications ........................................................... 388 E ECCP/CCP. See Enhanced Capture/Compare/PWM EEADR Registers ............................................................... 99 EEADRH Registers............................................................. 99 EEADRL Register ............................................................. 110 EEADRL Registers ............................................................. 99 EECON1 Register....................................................... 99, 111 EECON2 Register....................................................... 99, 112 EEDATH Register............................................................. 110 EEDATL Register ............................................................. 110 EEPROM Data Memory Avoiding Spurious Write ........................................... 100 Write Verify ............................................................... 109 Effects of Reset PWM mode ............................................................... 199 Electrical Specifications (PIC16F/LF1933) ....................... 365 Enhanced Capture/Compare/PWM (ECCP) Enhanced PWM Mode.............................................. 200 Auto-Restart ..................................................... 209 Auto-shutdown.................................................. 208 Direction Change in Full-Bridge Output Mode.. 206 Full-Bridge Application...................................... 204 Full-Bridge Mode .............................................. 204 Half-Bridge Application ..................................... 203 Half-Bridge Application Examples .................... 210 Half-Bridge Mode.............................................. 203 Output Relationships (Active-High and Active-Low)............................................... 201 Output Relationships Diagram.......................... 202 Programmable Dead Band Delay..................... 210 Shoot-through Current ...................................... 210 Start-up Considerations .................................... 212 Specifications ........................................................... 385 Enhanced Mid-range CPU.................................................. 13 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) .............................. 275 Errata .................................................................................... 6 EUSART ........................................................................... 275 Associated Registers Baud Rate Generator ....................................... 289 Asynchronous Mode ................................................. 277 12-bit Break Transmit and Receive .................. 296 Associated Registers Receive .................................................... 283 Transmit.................................................... 279 Auto-Wake-up on Break ................................... 294 Baud Rate Generator (BRG) ............................ 288 Clock Accuracy................................................. 284 Receiver ........................................................... 280 Setting up 9-bit Mode with Address Detect ...... 282 Transmitter ....................................................... 277 Baud Rate Generator (BRG) Auto Baud Rate Detect..................................... 293 Baud Rate Error, Calculating............................ 288 Baud Rates, Asynchronous Modes .................. 290 Formulas........................................................... 289  2011-2012 Microchip Technology Inc. PIC16(L)F1933 High Baud Rate Select (BRGH Bit) .................. 288 Synchronous Master Mode ............................... 297, 302 Associated Registers Receive..................................................... 301 Transmit.................................................... 299 Reception.......................................................... 300 Transmission .................................................... 297 Synchronous Slave Mode Associated Registers Receive..................................................... 303 Transmit.................................................... 302 Reception.......................................................... 303 Transmission .................................................... 302 Extended Instruction Set ADDFSR ................................................................... 355 F Fail-Safe Clock Monitor....................................................... 64 Fail-Safe Condition Clearing ....................................... 64 Fail-Safe Detection ..................................................... 64 Fail-Safe Operation..................................................... 64 Reset or Wake-up from Sleep..................................... 64 Firmware Instructions........................................................ 351 Fixed Voltage Reference (FVR) Associated Registers ................................................ 135 Flash Program Memory ...................................................... 99 Erasing...................................................................... 104 Modifying................................................................... 108 Writing....................................................................... 104 FSR Register25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37 FVRCON (Fixed Voltage Reference Control) Register ..... 135 I I2C Mode (MSSP) Acknowledge Sequence Timing................................ 258 Bus Collision During a Repeated Start Condition ................... 263 During a Stop Condition.................................... 264 Effects of a Reset...................................................... 259 I2C Clock Rate w/BRG.............................................. 267 Master Mode Operation .......................................................... 250 Reception.......................................................... 256 Start Condition Timing .............................. 252, 253 Transmission .................................................... 254 Multi-Master Communication, Bus Collision and Arbitration ......................................................... 259 Multi-Master Mode .................................................... 259 Read/Write Bit Information (R/W Bit) ........................ 235 Slave Mode Transmission .................................................... 240 Sleep Operation ........................................................ 259 Stop Condition Timing............................................... 258 INDF Register25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37 Indirect Addressing ............................................................. 41 Instruction Format ............................................................. 352 Instruction Set ................................................................... 351 ADDLW ..................................................................... 355 ADDWF..................................................................... 355 ADDWFC .................................................................. 355 ANDLW ..................................................................... 355 ANDWF..................................................................... 355 BRA........................................................................... 356 CALL ......................................................................... 357 CALLW...................................................................... 357 LSLF ......................................................................... 359  2011-2012 Microchip Technology Inc. LSRF ........................................................................ 359 MOVF ....................................................................... 359 MOVIW ..................................................................... 360 MOVLB ..................................................................... 360 MOVWI ..................................................................... 361 OPTION.................................................................... 361 RESET...................................................................... 361 SUBWFB .................................................................. 363 TRIS ......................................................................... 364 BCF .......................................................................... 356 BSF........................................................................... 356 BTFSC...................................................................... 356 BTFSS ...................................................................... 356 CALL......................................................................... 357 CLRF ........................................................................ 357 CLRW ....................................................................... 357 CLRWDT .................................................................. 357 COMF ....................................................................... 357 DECF........................................................................ 357 DECFSZ ................................................................... 358 GOTO ....................................................................... 358 INCF ......................................................................... 358 INCFSZ..................................................................... 358 IORLW ...................................................................... 358 IORWF...................................................................... 358 MOVLW .................................................................... 360 MOVWF.................................................................... 360 NOP.......................................................................... 361 RETFIE..................................................................... 362 RETLW ..................................................................... 362 RETURN................................................................... 362 RLF........................................................................... 362 RRF .......................................................................... 363 SLEEP ...................................................................... 363 SUBLW..................................................................... 363 SUBWF..................................................................... 363 SWAPF..................................................................... 364 XORLW .................................................................... 364 XORWF .................................................................... 364 INTCON Register................................................................ 82 Internal Oscillator Block INTOSC Specifications ................................................... 381 Internal Sampling Switch (RSS) Impedance ..................... 147 Internet Address ............................................................... 459 Interrupt-On-Change......................................................... 129 Associated Registers................................................ 132 Interrupts ............................................................................ 77 ADC .......................................................................... 142 Associated registers w/ Interrupts .............................. 89 Configuration Word w/ Clock Sources........................ 68 Configuration Word w/ LDO........................................ 91 TMR1........................................................................ 179 INTOSC Specifications ..................................................... 381 IOCBF Register ................................................................ 131 IOCBN Register ................................................................ 131 IOCBP Register ................................................................ 131 L LATA Register .......................................................... 116, 125 LATB Register .................................................................. 121 LCD Associated Registers................................................ 346 Bias Voltage Generation................................... 321, 322 Clock Source Selection ............................................ 320 Configuring the Module ............................................ 345 DS41575C-page 453 PIC16(L)F1933 Disabling the Module ................................................ 345 Frame Frequency...................................................... 328 Interrupts ................................................................... 341 LCDCON Register .................................................... 314 LCDPS Register........................................................ 314 Multiplex Types ......................................................... 328 Operation During Sleep ............................................ 343 Pixel Control.............................................................. 328 Prescaler ................................................................... 320 Segment Enables...................................................... 328 Waveform Generation ............................................... 330 LCDCON Register..................................................... 314, 315 LCDCST Register ............................................................. 318 LCDDATAx Registers ............................................... 319, 326 LCDPS Register........................................................ 314, 316 LP Bits....................................................................... 320 LCDREF Register ............................................................. 317 LCDRL Register ................................................................ 326 LCDSEn Registers ............................................................ 319 Liquid Crystal Display (LCD) Driver .................................. 313 Load Conditions ................................................................ 379 LSLF.................................................................................. 359 LSRF ................................................................................. 359 M Master Synchronous Serial Port. See MSSP MCLR .................................................................................. 72 Internal ........................................................................ 72 Memory Organization Data ...................................................................... 17, 20 Program ...................................................................... 15 Microchip Internet Web Site .............................................. 459 Migrating from other PIC Microcontroller Devices............. 449 MOVIW.............................................................................. 360 MOVLB.............................................................................. 360 MOVWI.............................................................................. 361 MPLAB ASM30 Assembler, Linker, Librarian ................... 434 MPLAB Integrated Development Environment Software .. 433 MPLAB PM3 Device Programmer..................................... 436 MPLAB REAL ICE In-Circuit Emulator System................. 435 MPLINK Object Linker/MPLIB Object Librarian ................ 434 MSSP ................................................................................ 219 SPI Mode .................................................................. 222 SSPBUF Register ..................................................... 225 SSPSR Register ....................................................... 225 O OPCODE Field Descriptions ............................................. 351 OPTION ............................................................................ 361 OPTION Register .............................................................. 173 OSCCON Register .............................................................. 66 Oscillator Associated Registers .................................................. 68 Oscillator Module ................................................................ 51 ECH ............................................................................ 51 ECL ............................................................................. 51 ECM ............................................................................ 51 HS ............................................................................... 51 INTOSC ...................................................................... 51 LP................................................................................ 51 RC ............................................................................... 51 XT ............................................................................... 51 Oscillator Parameters........................................................ 381 Oscillator Specifications .................................................... 380 Oscillator Start-up Timer (OST) Specifications ............................................................ 384 DS41575C-page 454 Oscillator Switching Fail-Safe Clock Monitor .............................................. 64 Two-Speed Clock Start-up.......................................... 62 OSCSTAT Register ............................................................ 67 OSCTUNE Register............................................................ 68 P P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM (ECCP)............................................................ 200 Packaging ......................................................................... 437 Marking ............................................................. 437, 438 PDIP Details ............................................................. 439 PCL and PCLATH............................................................... 14 PCL Register25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37 PCLATH Register25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37 PCON Register ............................................................. 26, 75 PIE1 Register................................................................ 26, 83 PIE2 Register................................................................ 26, 84 PIE3 Register...................................................................... 85 Pin Diagram PIC16F1933, PIC16LF1933, 28-pin QFN..................... 3 PIC16F1933, PICLF1933, 28-pin PDIP/SOIC/SSOP ... 3 Pinout Descriptions PIC16F193X/PIC16LF193X.......................................... 9 PIR1 Register ............................................................... 25, 86 PIR2 Register ............................................................... 25, 87 PIR3 Register ..................................................................... 88 PORTA ............................................................................. 115 Associated Registers ................................................ 118 Configuration Word w/ PORTA................................. 118 PORTA Register ................................................... 25, 27 Specifications ........................................................... 382 PORTA Register ............................................................... 116 PORTB ............................................................................. 119 Additional Pin Functions Weak Pull-up .................................................... 120 Associated Registers ................................................ 123 Interrupt-on-Change ................................................. 119 P1B/P1C/P1D.See Enhanced Capture/Compare/ PWM+ (ECCP+) ............................................... 119 Pin Descriptions and Diagrams ................................ 120 PORTB Register ................................................... 25, 27 PORTB Register ............................................................... 121 PORTC ............................................................................. 124 Associated Registers ................................................ 126 P1A.See Enhanced Capture/Compare/PWM+ (ECCP+) ........................................................... 124 Pin Descriptions and Diagrams ................................ 124 PORTC Register................................................... 25, 27 Specifications ........................................................... 382 PORTC Register............................................................... 125 PORTE ............................................................................. 127 Associated Registers ................................................ 128 Pin Descriptions and Diagrams ................................ 127 PORTE Register ......................................................... 25 PORTE Register ............................................................... 127 Power-Down Mode (Sleep)................................................. 93 Associated Registers .................................................. 94 Power-on Reset .................................................................. 70 Power-up Timer (PWRT) .................................................... 70 Specifications ........................................................... 384 PR2 Register ................................................................ 25, 33 Precision Internal Oscillator Parameters .......................... 381  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Program Memory ................................................................ 15 Map and Stack (PIC16F1933/LF1933, PIC16F1934/LF1934) ................................... 15, 20 Map and Stack (PIC16F1936/LF1936, PIC16F1937/LF1937) ................................... 16, 20 Map and Stack (PIC16F1938/LF1938, PIC16F1939/LF1939) ......................................... 20 Programming Mode Exit ..................................................... 72 Programming, Device Instructions .................................... 351 PSTRxCON Register ........................................................ 218 PWM (ECCP Module) PWM Steering........................................................... 211 Steering Synchronization .......................................... 212 PWM Mode. See Enhanced Capture/Compare/PWM ...... 200 PWM Steering ................................................................... 211 PWMxCON Register ......................................................... 217 R RCREG ............................................................................. 282 RCREG Register................................................................. 28 RCSTA Register ......................................................... 28, 286 Reader Response ............................................................. 460 Read-Modify-Write Operations ......................................... 351 Register RCREG Register....................................................... 293 Registers ADCON0 (ADC Control 0) ........................................ 143 ADCON1 (ADC Control 1) ........................................ 144 ADRESH (ADC Result High) with ADFM = 0)........... 145 ADRESH (ADC Result High) with ADFM = 1)........... 146 ADRESL (ADC Result Low) with ADFM = 0) ............ 145 ADRESL (ADC Result Low) with ADFM = 1) ............ 146 ANSELA (PORTA Analog Select)............................. 117 ANSELB (PORTB Analog Select)............................. 122 APFCON (Alternate Pin Function Control)................ 114 BAUDCON (Baud Rate Control) ............................... 287 BORCON Brown-out Reset Control)........................... 71 CCPTMRS0 (PWM Timer Selection Control 0) ........ 215 CCPTMRS1 (PWM Timer Selection Control 1) ........ 215 CCPxAS (CCPx Auto-Shutdown Control)................. 216 CCPxCON (ECCPx Control)..................................... 214 CMOUT (Comparator Output)................................... 164 CMxCON0 (Cx Control) ............................................ 163 CMxCON1 (Cx Control 1) ......................................... 164 Configuration Word 1 .................................................. 46 Configuration Word 2 .................................................. 48 CPSCON0 (Capacitive Sensing Control Register 0) 311 CPSCON1 (Capacitive Sensing Control Register 1) 312 DACCON0 ................................................................ 156 DACCON1 ................................................................ 156 Device ID .................................................................... 50 EEADRL (EEPROM Address) .................................. 110 EECON1 (EEPROM Control 1)................................. 111 EECON2 (EEPROM Control 2)................................. 112 EEDATH (EEPROM Data)........................................ 110 EEDATL (EEPROM Data) ........................................ 110 FVRCON................................................................... 135 INTCON (Interrupt Control)......................................... 82 IOCBF (Interrupt-on-Change Flag) ........................... 131 IOCBN (Interrupt-on-Change Negative Edge) .......... 131 IOCBP (Interrupt-on-Change Positive Edge) ............ 131 LATA (Data Latch PORTA)....................................... 116 LATB (Data Latch PORTB)....................................... 121 LATC (Data Latch PORTC) ...................................... 125 LCDCON (LCD Control)............................................ 315 LCDCST (LCD Contrast Control).............................. 318  2011-2012 Microchip Technology Inc. LCDDATAx (LCD Data) .................................... 319, 326 LCDPS (LCD Phase)................................................ 316 LCDREF (LCD Reference Voltage Control) ............. 317 LCDRL (LCD Reference Voltage Control)................ 326 LCDSEn (LCD Segment Enable) ............................. 319 OPTION_REG (OPTION)......................................... 173 OSCCON (Oscillator Control)..................................... 66 OSCSTAT (Oscillator Status) ..................................... 67 OSCTUNE (Oscillator Tuning).................................... 68 PCON (Power Control Register)................................. 75 PCON (Power Control) ............................................... 75 PIE1 (Peripheral Interrupt Enable 1) .......................... 83 PIE2 (Peripheral Interrupt Enable 2) .......................... 84 PIE3 (Peripheral Interrupt Enable 3) .......................... 85 PIR1 (Peripheral Interrupt Register 1) ........................ 86 PIR2 (Peripheral Interrupt Request 2) ........................ 87 PIR3 (Peripheral Interrupt Request 3) ........................ 88 PORTA ..................................................................... 116 PORTB ..................................................................... 121 PORTC ..................................................................... 125 PORTE ..................................................................... 127 PSTRxCON (PWM Steering Control) ....................... 218 PWMxCON (Enhanced PWM Control) ..................... 217 RCSTA (Receive Status and Control) ...................... 286 Special Function, Summary........................................ 25 SRCON0 (SR Latch Control 0)................................. 169 SRCON1 (SR Latch Control 1)................................. 169 SSPADD (MSSP Address and Baud Rate, I2C Mode) ......................................................... 273 SSPCON1 (MSSP Control 1) ................................... 269 SSPCON2 (SSP Control 2) ...................................... 271 SSPCON3 (SSP Control 3) ...................................... 272 SSPMSK (SSP Mask) .............................................. 273 SSPSTAT (SSP Status) ........................................... 268 STATUS ..................................................................... 18 T1CON (Timer1 Control) .......................................... 183 T1GCON (Timer1 Gate Control)............................... 184 TRISA (Tri-State PORTA) ........................................ 116 TRISB (Tri-State PORTB) ........................................ 121 TRISC (Tri-State PORTC) ........................................ 125 TRISE (Tri-State PORTE) ........................................ 127 TXCON ..................................................................... 189 TXSTA (Transmit Status and Control)...................... 285 WDTCON (Watchdog Timer Control) ......................... 97 WPUB (Weak Pull-up PORTB)................................. 122 RESET.............................................................................. 361 Reset .................................................................................. 69 Reset Instruction................................................................. 72 Resets ................................................................................ 69 Associated Registers.................................................. 76 Revision History................................................................ 449 S Shoot-through Current ...................................................... 210 Software Simulator (MPLAB SIM) .................................... 435 SPBRG Register........................................................... 27, 28 SPBRGH .......................................................................... 288 SPBRGL ........................................................................... 288 Special Event Trigger ....................................................... 141 Special Function Registers (SFRs)..................................... 25 SPI Mode (MSSP) Associated Registers................................................ 229 SPI Clock.................................................................. 225 SR Latch ........................................................................... 167 Associated registers w/ SR Latch............................. 170 SRCON0 Register ............................................................ 169 DS41575C-page 455 PIC16(L)F1933 SRCON1 Register............................................................. 169 SSPADD Register ....................................................... 29, 273 SSPBUF Register ............................................................... 29 SSPCON Register............................................................... 29 SSPCON1 Register........................................................... 269 SSPCON2 Register........................................................... 271 SSPCON3 Register........................................................... 272 SSPMSK Register............................................................. 273 SSPOV.............................................................................. 256 SSPOV Status Flag........................................................... 256 SSPSTAT Register ..................................................... 29, 268 R/W Bit ...................................................................... 235 Stack ................................................................................... 39 Accessing.................................................................... 39 Reset........................................................................... 41 Stack Overflow/Underflow................................................... 72 STATUS Register................................................................ 18 SUBWFB........................................................................... 363 T T1CON Register.......................................................... 25, 183 T1GCON Register............................................................. 184 T2CON Register............................................................ 25, 33 Temperature Indicator Associated Registers ................................................ 152 Temperature Indicator Module .......................................... 151 Thermal Considerations (PIC16F/LF1933) ....................... 378 Timer0 ............................................................................... 171 Associated Registers ................................................ 173 Operation .................................................................. 171 Specifications ............................................................ 385 Timer1 ............................................................................... 175 Associated registers.................................................. 185 Asynchronous Counter Mode ................................... 177 Reading and Writing ......................................... 177 Clock Source Selection ............................................. 176 Interrupt..................................................................... 179 Operation .................................................................. 176 Operation During Sleep ............................................ 179 Oscillator ................................................................... 177 Prescaler ................................................................... 177 Specifications ............................................................ 385 Timer1 Gate Selecting Source............................................... 177 TMR1H Register ....................................................... 175 TMR1L Register ........................................................ 175 Timer2 Associated registers.................................................. 190 Timer2/4/6 ......................................................................... 187 Associated registers.................................................. 190 Timers Timer1 T1CON.............................................................. 183 T1GCON ........................................................... 184 Timer2/4/6 TXCON ............................................................. 189 Timing Diagrams A/D Conversion ......................................................... 387 A/D Conversion (Sleep Mode) .................................. 387 Acknowledge Sequence ........................................... 258 Asynchronous Reception .......................................... 282 Asynchronous Transmission ..................................... 278 Asynchronous Transmission (Back to Back) ............ 279 Auto Wake-up Bit (WUE) During Normal Operation . 295 Auto Wake-up Bit (WUE) During Sleep .................... 295 Automatic Baud Rate Calibration .............................. 293 DS41575C-page 456 Baud Rate Generator with Clock Arbitration............. 251 BRG Reset Due to SDA Arbitration During Start Condition .......................................................... 262 Brown-out Reset (BOR)............................................ 383 Brown-out Reset Situations ........................................ 71 Bus Collision During a Repeated Start Condition (Case 1)............................................................ 263 Bus Collision During a Repeated Start Condition (Case 2)............................................................ 264 Bus Collision During a Start Condition (SCL = 0) ..... 261 Bus Collision During a Stop Condition (Case 1) ....... 264 Bus Collision During a Stop Condition (Case 2) ....... 265 Bus Collision During Start Condition (SDA only) ...... 261 Bus Collision for Transmit and Acknowledge ........... 260 CLKOUT and I/O ...................................................... 382 Clock Synchronization .............................................. 248 Clock Timing ............................................................. 380 Comparator Output ................................................... 157 Enhanced Capture/Compare/PWM (ECCP)............. 385 Fail-Safe Clock Monitor (FSCM)................................. 65 First Start Bit Timing ................................................. 252 Full-Bridge PWM Output........................................... 205 Half-Bridge PWM Output .................................. 203, 210 I2C Bus Data............................................................. 393 I2C Bus Start/Stop Bits ............................................. 392 I2C Master Mode (7-Bit Reception)................... 255, 257 I2C Stop Condition Receive or Transmit Mode......... 259 INT Pin Interrupt ......................................................... 80 Internal Oscillator Switch Timing ................................ 60 LCD Interrupt Timing in Quarter-Duty Cycle Drive ... 342 LCD Sleep Entry/Exit when SLPEN = 1 or CS = 00 . 344 PWM Auto-shutdown ................................................ 209 Firmware Restart .............................................. 208 PWM Direction Change ............................................ 206 PWM Direction Change at Near 100% Duty Cycle... 207 PWM Output (Active-High) ....................................... 201 PWM Output (Active-Low) ........................................ 202 Repeat Start Condition ............................................. 253 Reset Start-up Sequence ........................................... 73 Reset, WDT, OST and Power-up Timer ................... 383 Send Break Character Sequence ............................. 296 SPI Master Mode (CKE = 1, SMP = 1) ..................... 390 SPI Mode (Master Mode).......................................... 225 SPI Slave Mode (CKE = 0) ....................................... 391 SPI Slave Mode (CKE = 1) ....................................... 391 Synchronous Reception (Master Mode, SREN) ....... 301 Synchronous Transmission ...................................... 298 Synchronous Transmission (Through TXEN) ........... 298 Timer0 and Timer1 External Clock ........................... 384 Timer1 Incrementing Edge ....................................... 179 Two Speed Start-up.................................................... 63 Type-A in 1/2 MUX, 1/2 Bias Drive ........................... 331 Type-A in 1/2 MUX, 1/3 Bias Drive ........................... 333 Type-A in 1/3 MUX, 1/2 Bias Drive ........................... 335 Type-A in 1/3 MUX, 1/3 Bias Drive ........................... 337 Type-A in 1/4 MUX, 1/3 Bias Drive ........................... 339 Type-A/Type-B in Static Drive .................................. 330 Type-B in 1/2 MUX, 1/2 Bias Drive ........................... 332 Type-B in 1/2 MUX, 1/3 Bias Drive ........................... 334 Type-B in 1/3 MUX, 1/2 Bias Drive ........................... 336 Type-B in 1/3 MUX, 1/3 Bias Drive ........................... 338 Type-B in 1/4 MUX, 1/3 Bias Drive ........................... 340 USART Synchronous Receive (Master/Slave) ......... 389 USART Synchronous Transmission (Master/Slave). 388 Wake-up from Interrupt............................................... 94  2011-2012 Microchip Technology Inc. PIC16(L)F1933 Timing Diagrams and Specifications PLL Clock.................................................................. 381 Timing Parameter Symbology........................................... 379 Timing Requirements I2C Bus Data ............................................................. 394 I2C Bus Start/Stop Bits ............................................. 393 SPI Mode .................................................................. 392 TMR0 Register .................................................................... 25 TMR1H Register ................................................................. 25 TMR1L Register .................................................................. 25 TMR2 Register .............................................................. 25, 33 TRIS .................................................................................. 364 TRISA Register ........................................................... 26, 116 TRISB ............................................................................... 119 TRISB Register ........................................................... 26, 121 TRISC ............................................................................... 124 TRISC Register ........................................................... 26, 125 TRISE ............................................................................... 127 TRISE Register ........................................................... 26, 127 Two-Speed Clock Start-up Mode ........................................ 62 TXCON (Timer2/4/6) Register .......................................... 189 TXREG.............................................................................. 277 TXREG Register ................................................................. 28 TXSTA Register .......................................................... 28, 285 BRGH Bit .................................................................. 288 U USART Synchronous Master Mode Requirements, Synchronous Receive .............. 389 Requirements, Synchronous Transmission ...... 389 Timing Diagram, Synchronous Receive ........... 389 Timing Diagram, Synchronous Transmission ... 388 V VREF. SEE ADC Reference Voltage W Wake-up on Break ............................................................ 294 Wake-up Using Interrupts ................................................... 94 Watchdog Timer (WDT) ...................................................... 72 Associated Registers .................................................. 98 Configuration Word w/ Watchdog Timer ..................... 98 Modes ......................................................................... 96 Specifications............................................................ 384 WCOL ....................................................... 251, 254, 256, 258 WCOL Status Flag .................................... 251, 254, 256, 258 WDTCON Register ............................................................. 97 WPUB Register ................................................................. 122 Write Protection .................................................................. 49 WWW Address.................................................................. 459 WWW, On-Line Support ........................................... 2, 6, 461  2011-2012 Microchip Technology Inc. DS41575C-page 457 PIC16(L)F1933 NOTES: DS41575C-page 458  2011-2012 Microchip Technology Inc. PIC16(L)F1933 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2011-2012 Microchip Technology Inc. DS41575C-page 459 PIC16(L)F1933 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: PIC16(L)F1933 Literature Number: DS41575C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41575C-page 460  2011-2012 Microchip Technology Inc. PIC16(L)F1933 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device [X](1) - X Tape and Reel Temperature Option Range /XX XXX Package Pattern Device: PIC16F1933, PIC16LF1933 Tape and Reel Option: Blank T Temperature Range: I E = = -40C to +85C -40C to +125C Package:(2) ML MV SO SP SS = = = = = Micro Lead Frame (QFN) Micro Lead Frame (UQFN) SOIC Skinny Plastic DIP SSOP Pattern: Examples: a) b) PIC16LF1933 - I/P = Industrial temp., Plastic DIP package PIC16F1933 - E/ML = Extended temp., QFN package = Standard packaging (tube or tray) = Tape and Reel(1) Note 1: 3-Digit Pattern Code for QTP (blank otherwise) 2:  2011-2012 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Small-form factor packaging options may be available. Please check http://www.microchip.com/packaging for small-form factor package availability, or contact your local Sales Office. DS41575C-page 461 PIC16(L)F1933 NOTES: DS41575C-page 462  2011-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2011-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620765746 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2011-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS41575C-page 463 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-66-152-7160 Fax: 81-66-152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS41575C-page 464 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 11/29/11  2011-2012 Microchip Technology Inc.

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型号：PIC16F1933-I/SS
品牌：Microchip
封装：SSOP28_208MIL
描述：8位MCU单片机 PIC® XLP™ 16F SSOP28_10.2X5.3MM 256x8B 1.8~5.5V PIC

国内价格
1+6.87009

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