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PIC18F8310T-I/PT

PIC18F8310T-I/PT

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    TQFP80

  • 描述:

    IC MCU 8BIT 8KB FLASH 80TQFP

  • 数据手册
  • 价格&库存
PIC18F8310T-I/PT 数据手册
PIC18F6310/6410/8310/8410 Data Sheet 64/80-Pin Flash Microcontrollers with nanoWatt XLP Technology  2010 Microchip Technology Inc. DS39635C Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-582-4 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS39635C-page 2  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 64/80-Pin Flash Microcontrollers with nanoWatt Technology Power-Managed Modes: Peripheral Highlights (Continued): • • • • • • • • • • • Master Synchronous Serial Port (MSSP) module Supporting 3-Wire SPI (all 4 modes) and I2C™ Master and Slave modes • Addressable USART module: - Supports RS-485 and RS-232 • Enhanced Addressable USART module: - Supports RS-485, RS-232 and LIN/J2602 - Auto-Wake-up on Start bit - Auto-Baud Detect • 10-Bit, up to 12-Channel Analog-to-Digital (A/D) Converter module: - Auto-acquisition capability - Conversion available during Sleep • Dual Analog Comparators with Input Multiplexing • Programmable 16-Level High/Low-Voltage Detection (HLVD) module: - Supports interrupt on High/Low-Voltage Detection Run: CPU on, Peripherals on Idle: CPU off, Peripherals on Sleep: CPU off, Peripherals off Ultra Low 50 nA Input Leakage Idle mode Currents Down to 2.3 A Typical Ultra Low 50 nA Input Leakage Sleep mode Currents Down to 0.1 A Typical Timer1 Oscillator: 1.0 A, 32 kHz, 2V Typical Watchdog Timer: 1.7 A Typical Two-Speed Oscillator Start-up Flexible Oscillator Structure: • Four Crystal modes up to 40 MHz • 4x Phase Lock Loop (available for crystal and internal oscillators) • Two External RC modes, up to 4 MHz • Two External Clock modes, up to 40 MHz • Internal Oscillator Block: - Fast wake from Sleep and Idle, 1 s typical - 8 user-selectable frequencies, from 31 kHz to 8 MHz - Provides a complete range of clock speeds, from 31 kHz to 32 MHz, when used with PLL - User-tunable to compensate for frequency drift • Secondary Oscillator using Timer1 @ 32 kHz • Fail-Safe Clock Monitor: - Allows for safe shutdown if peripheral clock stops Special Microcontroller Features: • Address Capability of up to 2 Mbytes • 16-Bit/8-Bit Interface Peripheral Highlights: • • • • • High-Current Sink/Source 25 mA/25 mA Four External Interrupts Four Input Change Interrupts Four 8-Bit/16-Bit Timer/Counter modules Up to 3 Capture/Compare/PWM (CCP) modules Program Memory (On-Board/External) Device Flash (bytes) PIC18F6310 8K/0 PIC18F6410 16K/0 PIC18F8310 8K/2M PIC18F8410 16K/2M Data Memory # Single-Word Instructions SRAM (bytes) 4096/0 8192/0 4096/1M 8192/1M 768 768 768 768  2010 Microchip Technology Inc. MSSP I/O 54 54 70 70 10-Bit CCP A/D (ch) (PWM) 12 12 12 12 3 3 3 3 SPI Master I2C™ Y Y Y Y Y Y Y Y Comparators External Memory Interface (PIC18F8310/8410 Devices only): EUSART/ AUSART • C Compiler Optimized Architecture: - Optional extended instruction set designed to optimize re-entrant code • 1000 Erase/Write Cycle Flash Program Memory Typical • Flash Retention: 100 Years Typical • Priority Levels for Interrupts • 8 x 8 Single-Cycle Hardware Multiplier • Extended Watchdog Timer (WDT): - Programmable period from 4 ms to 131s - 2% stability over VDD and temperature • In-Circuit Serial Programming™ (ICSP™) via Two Pins • In-Circuit Debug (ICD) via Two Pins • Wide Operating Voltage Range: 2.0V to 5.5V • Programmable Brown-out Reset (BOR) with Software Enable Option 1/1 1/1 1/1 1/1 2 2 2 2 Timers Ext. 8/16-Bit Bus 1/3 1/3 1/3 1/3 N N Y Y DS39635C-page 3 PIC18F6310/6410/8310/8410 Pin Diagrams RD7/PSP7 RD6/PSP6 RD5/PSP5 RD4/PSP4 RD3/PSP3 RD2/PSP2 RD1/PSP1 VSS VDD RD0/PSP0 RE7/CCP2(1) RE6 RE5 RE4 RE3 RE2/CS 64-Pin TQFP 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RE1/WR RE0/RD RG0/CCP3 RG1/TX2/CK2 RG2/RX2/DT2 RG3 RG5/MCLR/VPP RG4 VSS VDD RF7/SS RF6/AN11 RF5/AN10/CVREF RF4/AN9 RF3/AN8 RF2/AN7/C1OUT 48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 47 46 45 44 43 42 41 40 PIC18F6310 PIC18F6410 39 38 37 36 35 34 33 15 16 RB0/INT0 RB1/INT1 RB2/INT2 RB3/INT3 RB4/KBI0 RB5/KBI1 RB6/KBI2/PGC VSS OSC2/CLKO/RA6 OSC1/CLKI/RA7 VDD RB7/KBI3/PGD RC5/SDO RC4/SDI/SDA RC3/SCK/SCL RC2/CCP1 RC7/RX1/DT1 RC6/TX1/CK1 RC0/T1OSO/T13CKI RA4/T0CKI RC1/T1OSI/CCP2(1) RA5/AN4/HLVDIN VDD VSS RA0/AN0 RA1/AN1 RA2/AN2/VREF- AVSS RA3/AN3/VREF+ AVDD RF0/AN5 RF1/AN6/C2OUT 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Note 1: RE7 is the alternate pin for CCP2 multiplexing. DS39635C-page 4  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 Pin Diagrams (Continued) RJ1/OE RJ0/ALE RD7/AD7/PSP7 RD6/AD6/PSP6 RD5/AD5/PSP5 RD4/AD4/PSP4 RD3/AD3/PSP3 RD2/AD2/PSP2 RD1/AD1/PSP1 VSS VDD RE7/CCP2(1)/AD15 RD0/AD0/PSP0 RE6/AD14 RE5/AD13 RE4/AD12 RE3/AD11 RH0/A16 RE2/AD10/CS RH1/A17 80-Pin TQFP 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 RH2/A18 RH3/A19 RE1/AD9/WR RE0/AD8/RD RG0/CCP3 RG1/TX2/CK2 RG2/RX2/DT2 RG3 RG5/MCLR/VPP RG4 VSS VDD RF7/SS RF6/AN11 RF5/AN10/CVREF RF4/AN9 RF3/AN8 RF2/AN7/C1OUT RH7 RH6 1 60 2 59 58 57 56 55 3 4 5 6 7 8 9 10 11 12 13 14 15 16 54 53 52 51 50 PIC18F8310 PIC18F8410 49 48 47 46 45 44 43 42 41 17 18 19 20 RJ2/WRL RJ3/WRH RB0/INT0 RB1/INT1 RB2/INT2 RB3/INT3/CCP2(1) RB4/KBI0 RB5/KBI1 RB6/KBI2/PGC VSS OSC2/CLKO/RA6 OSC1/CLKI/RA7 VDD RB7/KBI3/PGD RC5/SDO RC4/SDI/SDA RC3/SCK/SCL RC2/CCP1 RJ7/UB RJ6/LB RJ5/CE RJ4/BA0 RC7/RX1/DT1 RC6/TX1/CK1 RC0/T1OSO/T13CKI RA4/T0CKI RC1/T1OSI/CCP2(1) RA5/AN4/HLVDIN VDD VSS RA0/AN0 RA1/AN1 RA2/AN2/VREF- AVSS RA3/AN3/VREF+ AVDD RF0/AN5 RF1/AN6/C2OUT RH4 RH5 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Note 1: RE7 is the alternate pin for CCP2 multiplexing.  2010 Microchip Technology Inc. DS39635C-page 5 PIC18F6310/6410/8310/8410 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 9 2.0 Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 31 3.0 Oscillator Configurations ............................................................................................................................................................ 35 4.0 Power-Managed Modes ............................................................................................................................................................. 45 5.0 Reset .......................................................................................................................................................................................... 55 6.0 Memory Organization ................................................................................................................................................................. 67 7.0 Program Memory........................................................................................................................................................................ 89 8.0 External Memory Interface ......................................................................................................................................................... 95 9.0 8 x 8 Hardware Multiplier.......................................................................................................................................................... 107 10.0 Interrupts .................................................................................................................................................................................. 109 11.0 I/O Ports ................................................................................................................................................................................... 125 12.0 Timer0 Module ......................................................................................................................................................................... 151 13.0 Timer1 Module ......................................................................................................................................................................... 155 14.0 Timer2 Module ......................................................................................................................................................................... 161 15.0 Timer3 Module ......................................................................................................................................................................... 163 16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 167 17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 177 18.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217 19.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) ........................................................... 241 20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 255 21.0 Comparator Module.................................................................................................................................................................. 265 22.0 Comparator Voltage Reference Module ................................................................................................................................... 271 23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 275 24.0 Special Features of the CPU .................................................................................................................................................... 281 25.0 Instruction Set Summary .......................................................................................................................................................... 297 26.0 Development Support............................................................................................................................................................... 347 27.0 Electrical Characteristics .......................................................................................................................................................... 351 28.0 Packaging Information.............................................................................................................................................................. 389 Appendix A: Revision History............................................................................................................................................................. 395 Appendix B: Device Differences......................................................................................................................................................... 395 Appendix C: Conversion Considerations ........................................................................................................................................... 396 Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 396 Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 397 Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 397 Index .................................................................................................................................................................................................. 399 The Microchip Web Site ..................................................................................................................................................................... 409 Customer Change Notification Service .............................................................................................................................................. 409 Customer Support .............................................................................................................................................................................. 409 Reader Response .............................................................................................................................................................................. 410 PIC18F6310/6410/8310/8410 Product Identification System ............................................................................................................ 411 DS39635C-page 6  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) • The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products.  2010 Microchip Technology Inc. DS39635C-page 7 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 8  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 1.0 DEVICE OVERVIEW This document contains device specific information for the following devices: • PIC18F6310 • PIC18LF6310 • PIC18F6410 • PIC18LF6410 • PIC18F8310 • PIC18LF8310 • PIC18F8410 • PIC18LF8410 This family offers the advantages of all PIC18 microcontrollers – namely, high computational performance at an economical price. In addition to these features, the PIC18F6310/6410/8310/8410 family introduces design enhancements that make these microcontrollers a logical choice for many high-performance, power-sensitive applications. 1.1 1.1.1 New Core Features nanoWatt TECHNOLOGY All of the devices in the PIC18F6310/6410/8310/8410 family incorporate a range of features that can significantly reduce power consumption during operation. Key items include: • Alternate Run Modes: By clocking the controller from the Timer1 source or the internal oscillator block, power consumption during code execution can be reduced by as much as 90%. • Multiple Idle Modes: The controller can also run with its CPU core disabled, but the peripherals still active. In these states, power consumption can be reduced even further – to as little as 4% of normal operation requirements. • On-the-Fly Mode Switching: The power-managed modes are invoked by user code during operation, allowing the user to incorporate power-saving ideas into their application’s software design. • Lower Consumption in Key Modules: The power requirements for both Timer1 and the Watchdog Timer have been reduced by up to 80%, with typical values of 1.1 A and 2.1 A, respectively.  2010 Microchip Technology Inc. 1.1.2 MULTIPLE OSCILLATOR OPTIONS AND FEATURES All of the devices in the PIC18F6310/6410/8310/8410 family offer nine different oscillator options, allowing users a wide range of choices in developing application hardware. These include: • Four Crystal modes, using crystals or ceramic resonators. • Two External Clock modes, offering the option of using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the second pin reassigned as general I/O). • Two External RC Oscillator modes, with the same pin options as the External Clock modes. • An internal oscillator block which provides an 8 MHz clock (±2% accuracy) and an INTRC source (approximately 31 kHz, stable over temperature and VDD), as well as a range of six user-selectable clock frequencies between 125 kHz to 4 MHz for a total of eight clock frequencies. This option frees the two oscillator pins for use as additional general purpose I/O. • A Phase Lock Loop (PLL) frequency multiplier, available to both the High-Speed Crystal and Internal Oscillator modes, which allows clock speeds of up to 40 MHz. Used with the internal oscillator, the PLL gives users a complete selection of clock speeds from 31 kHz to 32 MHz – all without using an external crystal or clock circuit. Besides its availability as a clock source, the internal oscillator block provides a stable reference source that gives the family additional features for robust operation: • Fail-Safe Clock Monitor: This option constantly monitors the main clock source against a reference signal provided by the internal oscillator. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued low-speed operation or a safe application shutdown. • Two-Speed Start-up: This option allows the internal oscillator to serve as the clock source from Power-on Reset or wake-up from Sleep mode until the primary clock source is available. DS39635C-page 9 PIC18F6310/6410/8310/8410 1.2 Other Special Features • Memory Endurance: The Flash cells for program memory are rated to last for approximately a thousand erase/write cycles. Data retention without refresh is conservatively estimated to be greater than 100 years. • External Memory Interface: For those applications where more program or data storage is needed, the PIC18F8310/8410 devices provide the ability to access external memory devices. The memory interface is configurable for both 8-bit and 16-bit data widths and uses a standard range of control signals to enable communication with a wide range of memory devices. With their 21-bit program counters, the 80-pin devices can access a linear memory space of up to 2 Mbytes. • Extended Instruction Set: The PIC18F6310/6410/8310/8410 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instructions and an Indexed Addressing mode. This extension, enabled as a device configuration option, has been specifically designed to optimize re-entrant application code originally developed in high-level languages such as ‘C’. • Enhanced Addressable USART: This serial communication module is capable of standard RS-232 operation and provides support for the LIN/J2602 bus protocol. Other enhancements include Automatic Baud Rate Detection (ABD) and a 16-bit Baud Rate Generator for improved resolution. When the microcontroller is using the internal oscillator block, the EUSART provides stable operation for applications that talk to the outside world, without using an external crystal (or its accompanying power requirement). • 10-Bit A/D Converter: This module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period, and thus, reduces code overhead. • Extended Watchdog Timer (WDT): This enhanced version incorporates a 16-bit prescaler, allowing a time-out range from 4 ms to over 2 minutes that is stable across operating voltage and temperature. DS39635C-page 10 1.3 Details on Individual Family Members Devices in the PIC18F6310/6410/8310/8410 family are available in 64-pin (PIC18F6310/8310) and 80-pin (PIC18F6410/8410) packages. Block diagrams for the two groups are shown in Figure 1-1 and Figure 1-2, respectively. The devices are differentiated from each other in three ways: 1. 2. 3. Flash Program Memory: 8 Kbytes in PIC18FX310 devices, 16 Kbytes in PIC18FX410 devices. I/O Ports: 7 bidirectional ports on 64-pin devices, 9 bidirectional ports on 80-pin devices. External Memory Interface: present on 80-pin devices only. All other features for devices in this family are identical. These are summarized in Table 1-1. The pinouts for all devices are listed in Table 1-2 and Table 1-3. Like all Microchip PIC18 devices, members of the PIC18F6310/6410/8310/8410 family are available as both standard and low-voltage devices. Standard devices with Flash memory, designated with an “F” in the part number (such as PIC18F6310), accommodate an operating VDD range of 4.2V to 5.5V. Low-voltage parts, designated by “LF” (such as PIC18LF6410), function over an extended VDD range of 2.0V to 5.5V.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-1: DEVICE FEATURES Features PIC18F6310 PIC18F6410 PIC18F8310 PIC18F8410 DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz 8K 16K 8K 16K Program Memory (Instructions) 4096 8192 4096 8192 Data Memory (Bytes) 768 768 768 768 External Memory Interface No No Yes Yes Interrupt Sources 22 22 22 22 Operating Frequency Program Memory (Bytes) I/O Ports Ports A, B, C, D, E, Ports A, B, C, D, E, Ports A, B, C, D, E, Ports A, B, C, D, E, F, G F, G F, G, H, J F, G, H, J Timers 4 4 4 4 Capture/Compare/PWM Modules 3 3 3 3 Serial Communications Parallel Communications MSSP, AUSART MSSP, AUSART MSSP, AUSART MSSP, AUSART Enhanced USART Enhanced USART Enhanced USART Enhanced USART PSP PSP PSP PSP 10-Bit Analog-to-Digital Module 12 Input Channels 12 Input Channels 12 Input Channels 12 Input Channels Resets (and Delays) POR, BOR, POR, BOR, POR, BOR, POR, BOR, RESET Instruction, RESET Instruction, RESET Instruction, RESET Instruction, Stack Full, Stack Full, Stack Full, Stack Full, Stack Underflow Stack Underflow Stack Underflow Stack Underflow (PWRT, OST), (PWRT, OST), (PWRT, OST), (PWRT, OST), MCLR (optional), MCLR (optional), MCLR (optional), MCLR (optional), WDT WDT WDT WDT Programmable Low-Voltage Detect Programmable Brown-out Reset Instruction Set Packages  2010 Microchip Technology Inc. Yes Yes Yes Yes Yes Yes Yes Yes 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled 64-Pin TQFP 64-Pin TQFP 80-Pin TQFP 80-Pin TQFP DS39635C-page 11 PIC18F6310/6410/8310/8410 FIGURE 1-1: PIC18F6310/6410 (64-PIN) BLOCK DIAGRAM PORTA Data Bus Table Pointer Data Latch 8 8 inc/dec logic Data Memory (8/16 Kbytes) PCLATU PCLATH 21 20 Address Latch PCU PCH PCL Program Counter 31 Level Stack Program Memory 8/16 Kbytes) 4 BSR STKPTR RB0/INT0 RB1/INT1 RB2/INT2 RB3/INT3 RB4/KBI0 RB5/KBI1 RB6/KBI2/PGC RB7/KBI3/PGD 4 Access Bank 12 FSR0 FSR1 FSR2 Data Latch 8 PORTB 12 Data Address Address Latch 12 inc/dec logic Table Latch PORTC RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX1/CK1 RC7/RX1/DT1 Address Decode ROM Latch Instruction Bus IR Instruction Decode and Control 8 State Machine Control Signals 8 W OSC2(3) T1OSI INTRC Oscillator T1OSO 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger MCLR(2) VDD, VSS BOR HLVD ADC 10-Bit Comparators CCP1 Note Timer0 CCP2 Power-up Timer 8 Oscillator Start-up Timer Power-on Reset 8 8 PORTF RF0/AN5 RF1/AN6/C2OUT RF2/AN7/C1OUT RF3/AN8 RF4/AN9 RF5/AN10/CVREF RF6/AN11 RF7/SS Precision Band Gap Reference Brown-out Reset Fail-Safe Clock Monitor CCP3 RE0/RD RE1/WR RE2/CS RE3 RE4 RE5 RE6 RE7/CCP2(1) ALU Watchdog Timer Timer1 PORTE 8 8 8 Internal Oscillator Block RD7/PSP7:RD0/PSP0 8 x 8 Multiply BITOP OSC1(3) PORTD PRODH PRODL 3 Timer2 MSSP Timer3 EUSART1 RA0/AN0 RA1/AN1 RA2/AN2/VREFRA3/AN3/VREF+ RA4/T0CKI RA5/AN4/HLVDIN OSC2/CLKO(3)/RA6 OSC1/CLKI(3)/RA7 PORTG AUSART2 RG0/CCP3 RG1/TX2/CK2 RG2/RX2/DT2 RG3 RG4 RG5(2)/MCLR/VPP 1: CCP2 is multiplexed with RC1 when Configuration bit, CCP2MX, is set or RE7 when CCP2MX is not set. 2: RG5 is only available when MCLR functionality is disabled. 3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 3.0 “Oscillator Configurations” for additional information. DS39635C-page 12  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 1-2: PIC18F8310/8410 (80-PIN) BLOCK DIAGRAM PORTA Data Bus Table Pointer 8 inc/dec logic 21 Data Latch 8 Data Memory (8/16 Kbytes) PCLATU PCLATH 20 Address Latch PCU PCH PCL Program Counter 12 Data Address 31 Level Stack 4 System Bus Interface Address Latch Program Memory (8/16 Kbytes) PORTB 4 12 BSR STKPTR Access Bank FSR0 FSR1 FSR2 Data Latch TABLE LATCH RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX1/CK1 RC7/RX1/DT1 Address Decode ROM LATCH Instruction Bus PORTD IR AD, A (Multiplexed with PORTD, PORTE and PORTH) RD7/AD7/PSP7: RD0/AD0/PSP0 8 PORTE State Machine Control Signals PRODH PRODL Instruction Decode & Control 8 x 8 Multiply 3 8 W BITOP 8 Internal Oscillator Block OSC1(3) OSC2(3) T1OSI INTRC Oscillator T1OSO 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger MCLR(2) VDD, VSS RB0/INT0 RB1/INT1 RB2/INT2 RB3/INT3/CCP2(1) RB4/KBI0 RB5/KBI1 RB6/KBI2/PGC RB7/KBI3/PGD PORTC 12 inc/dec logic 8 RA0/AN0 RA1/AN1 RA2/AN2/VREFRA3/AN3/VREF+ RA4/T0CKI RA5/AN4/HLVDIN OSC2/CLKO(3)/RA6 OSC1/CLKI(3)/RA7 Power-up Timer 8 8 Oscillator Start-up Timer Power-on Reset 8 8 PORTF ALU 8 Watchdog Timer Precision Band Gap Reference Brown-out Reset Fail-Safe Clock Monitor PORTG RE0/AD8/RD RE1/AD9/WR RE2/AD10/CS RE3/AD11 RE4/AD12 RE5/AD13 RE6/AD14 RE7/CCP2(1)/AD15 RF0/AN5 RF1/AN6/C2OUT RF2/AN7/C1OUT RF3/AN8 RF4/AN9 RF5/AN10/CVREF RF6/AN11 RF7/SS RG0/CCP3 RG1/TX2/CK2 RG2/RX2/DT2 RG3 RG4 RG5(2)/MCLR/VPP PORTH ADC 10-Bit BOR HLVD RH3/AD19:RH0/AD16 Timer0 Timer1 Timer2 Timer3 RH PORTJ Comparators Note 1: 2: 3: CCP1 CCP2 CCP3 MSSP EUSART1 AUSART2 RJ0/ALE RJ1/OE RJ2/WRL RJ3/WRH RJ4/BA0 RJ5/CE RJ6/LB RJ7/UB CCP2 multiplexing is determined by the settings of the CCP2MX and PM Configuration bits. RG5 is only available when MCLR functionality is disabled. OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 3.0 “Oscillator Configurations” for additional information.  2010 Microchip Technology Inc. DS39635C-page 13 PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS Pin Number Pin Name TQFP RG5/MCLR/VPP RG5 MCLR I I ST ST P 39 I CLKI I RA7 OSC2/CLKO/RA6 OSC2 Buffer Type 7 VPP OSC1/CLKI/RA7 OSC1 Pin Type I/O Description Master Clear (input) or programming voltage (input). Digital input. Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode, CMOS otherwise. CMOS External clock source input. Always associated with pin function, OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) TTL General purpose I/O pin. ST 40 O — CLKO O — RA6 I/O TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. DS39635C-page 14  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 24 RA1/AN1 RA1 AN1 23 RA2/AN2/VREFRA2 AN2 VREF- 22 RA3/AN3/VREF+ RA3 AN3 VREF+ 21 RA4/T0CKI RA4 T0CKI 28 RA5/AN4/HLVDIN RA5 AN4 HLVDIN 27 I/O I TTL Analog Digital I/O. Analog Input 0. I/O I TTL Analog Digital I/O. Analog Input 1. I/O I I TTL Analog Analog Digital I/O. Analog Input 2. A/D reference voltage (low) input. I/O I I TTL Analog Analog Digital I/O. Analog Input 3. A/D reference voltage (high) input. I/O I ST ST I/O I I TTL Analog Analog Digital I/O. Timer0 external clock input. Digital I/O. Analog Input 4. High/Low-Voltage Detect input. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  2010 Microchip Technology Inc. DS39635C-page 15 PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0 RB0 INT0 48 RB1/INT1 RB1 INT1 47 RB2/INT2 RB2 INT2 46 RB3/INT3 RB3 INT3 45 RB4/KBI0 RB4 KBI0 44 RB5/KBI1 RB5 KBI1 43 RB6/KBI2/PGC RB6 KBI2 PGC 42 RB7/KBI3/PGD RB7 KBI3 PGD 37 I/O I TTL ST Digital I/O. External Interrupt 0. I/O I TTL ST Digital I/O. External Interrupt 1. I/O I TTL ST Digital I/O. External Interrupt 2. I/O I TTL ST Digital I/O. External Interrupt 3. I/O I TTL TTL Digital I/O. Interrupt-on-change pin. I/O I TTL TTL Digital I/O. Interrupt-on-change pin. I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP™ programming clock pin. I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. DS39635C-page 16  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 30 RC1/T1OSI/CCP2 RC1 T1OSI CCP2(1) 29 RC2/CCP1 RC2 CCP1 33 RC3/SCK/SCL RC3 SCK SCL 34 RC4/SDI/SDA RC4 SDI SDA 35 RC5/SDO RC5 SDO 36 RC6/TX1/CK1 RC6 TX1 CK1 31 RC7/RX1/DT1 RC7 RX1 DT1 32 I/O O I ST — ST I/O I I/O ST Analog ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. I/O I/O ST ST Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. I/O I/O I/O ST ST I2C Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C mode. I/O I I/O ST ST I2C Digital I/O. SPI data in. I2C data I/O. I/O O ST — Digital I/O. SPI data out. I/O O I/O ST — ST Digital I/O. EUSART1 asynchronous transmit. EUSART1 synchronous clock (see related RX1/DT1). I/O I I/O ST ST ST Digital I/O. EUSART1 asynchronous receive. EUSART1 synchronous data (see related TX1/CK1). Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  2010 Microchip Technology Inc. DS39635C-page 17 PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTD is a bidirectional I/O port. RD0/PSP0 RD0 PSP0 58 RD1/PSP1 RD1 PSP1 55 RD2/PSP2 RD2 PSP2 54 RD3/PSP3 RD3 PSP3 53 RD4/PSP4 RD4 PSP4 52 RD5/PSP5 RD5 PSP5 51 RD6/PSP6 RD6 PSP6 50 RD7/PSP7 RD7 PSP7 49 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. I/O I/O ST TTL Digital I/O. Parallel Slave Port data. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. DS39635C-page 18  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTE is a bidirectional I/O port. RE0/RD RE0 RD 2 RE1/WR RE1 WR 1 RE2/CS RE2 CS 64 RE3 I/O I ST TTL Digital I/O. Read control for Parallel Slave Port. I/O I ST TTL Digital I/O. Write control for Parallel Slave Port. I/O I ST TTL Digital I/O. Chip select control for Parallel Slave Port. 63 I/O ST Digital I/O. RE4 62 I/O ST Digital I/O. RE5 61 I/O ST Digital I/O. RE6 60 I/O ST Digital I/O. RE7/CCP2 RE7 CCP2(2) 59 I/O I/O ST ST Digital I/O. Capture 2 input/Compare 2 output/PWM2 output. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  2010 Microchip Technology Inc. DS39635C-page 19 PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTF is a bidirectional I/O port. RF0/AN5 RF0 AN5 18 RF1/AN6/C2OUT RF1 AN6 C2OUT 17 RF2/AN7/C1OUT RF2 AN7 C1OUT 16 RF3/AN8 RF3 AN8 15 RF4/AN9 RF4 AN9 14 RF5/AN10/CVREF RF5 AN10 CVREF 13 RF6/AN11 RF6 AN11 12 RF7/SS RF7 SS 11 I/O I ST Analog Digital I/O. Analog Input 5. I/O I O ST Analog — Digital I/O. Analog Input 6. Comparator 2 output. I/O I O ST Analog — Digital I/O. Analog Input 7. Comparator 1 output. I/O I ST Analog Digital I/O. Analog Input 8. I/O I ST Analog Digital I/O. Analog Input 9. I/O I O ST Analog Analog Digital I/O. Analog Input 10. Comparator reference voltage output. I/O I ST Analog Digital I/O. Analog Input 11. I/O I ST TTL Digital I/O. SPI slave select input. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. DS39635C-page 20  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-2: PIC18F6310/6410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTG is a bidirectional I/O port. RG0/CCP3 RG0 CCP3 3 RG1/TX2/CK2 RG1 TX2 CK2 4 RG2/RX2/DT2 RG2 RX2 DT2 5 RG3 RG4 I/O I/O ST ST Digital I/O. Capture 3 input/Compare 3 output/PWM3 output. I/O O I/O ST — ST Digital I/O. AUSART2 asynchronous transmit. AUSART2 synchronous clock (see related RX2/DT2). I/O I I/O ST ST ST Digital I/O. AUSART2 asynchronous receive. AUSART2 synchronous data (see related TX2/CK2). 6 I/O ST Digital I/O. 8 I/O ST Digital I/O. See RG5/MCLR/VPP pin. RG5 VSS 9, 25, 41, 56 P — Ground reference for logic and I/O pins. VDD 10, 26, 38, 57 P — Positive supply for logic and I/O pins. AVSS 20 P — Ground reference for analog modules. AVDD 19 P — Positive supply for analog modules. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Default assignment for CCP2 when Configuration bit, CCP2MX, is set. 2: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared.  2010 Microchip Technology Inc. DS39635C-page 21 PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS Pin Number Pin Name TQFP RG5/MCLR/VPP RG5 MCLR I I ST ST P 49 I CLKI I RA7 OSC2/CLKO/RA6 OSC2 Buffer Type 9 VPP OSC1/CLKI/RA7 OSC1 Pin Type I/O Description Master Clear (input) or programming voltage (input). Digital input. Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode, CMOS otherwise. CMOS External clock source input. Always associated with pin function, OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) TTL General purpose I/O pin. ST 50 O — CLKO O — RA6 I/O TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only). DS39635C-page 22  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 30 RA1/AN1 RA1 AN1 29 RA2/AN2/VREFRA2 AN2 VREF- 28 RA3/AN3/VREF+ RA3 AN3 VREF+ 27 RA4/T0CKI RA4 T0CKI 34 RA5/AN4/HLVDIN RA5 AN4 HLVDIN 33 I/O I TTL Analog Digital I/O. Analog Input 0. I/O I TTL Analog Digital I/O. Analog Input 1. I/O I I TTL Analog Analog Digital I/O. Analog Input 2. A/D reference voltage (low) input. I/O I I TTL Analog Analog Digital I/O. Analog Input 3. A/D reference voltage (high) input. I/O I ST ST I/O I I TTL Analog Analog Digital I/O. Timer0 external clock input. Digital I/O. Analog Input 4. High/Low-Voltage Detect input. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only).  2010 Microchip Technology Inc. DS39635C-page 23 PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0 RB0 INT0 58 RB1/INT1 RB1 INT1 57 RB2/INT2 RB2 INT2 56 RB3/INT3/CCP2 RB3 INT3 CCP2(1) 55 RB4/KBI0 RB4 KBI0 54 RB5/KBI1 RB5 KBI1 53 RB6/KBI2/PGC RB6 KBI2 PGC 52 RB7/KBI3/PGD RB7 KBI3 PGD 47 I/O I TTL ST Digital I/O. External Interrupt 0. I/O I TTL ST Digital I/O. External Interrupt 1. I/O I TTL ST Digital I/O. External Interrupt 2. I/O I O TTL ST Analog I/O I TTL TTL Digital I/O. Interrupt-on-change pin. I/O I TTL TTL Digital I/O. Interrupt-on-change pin. I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP™ programming clock pin. I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. Digital I/O. External Interrupt 3. Capture 2 input/Compare 2 output/PWM2 output. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only). DS39635C-page 24  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 36 RC1/T1OSI/CCP2 RC1 T1OSI CCP2(2) 35 RC2/CCP1 RC2 CCP1 43 RC3/SCK/SCL RC3 SCK SCL 44 RC4/SDI/SDA RC4 SDI SDA 45 RC5/SDO RC5 SDO 46 RC6/TX1/CK1 RC6 TX1 CK1 37 RC7/RX1/DT1 RC7 RX1 DT1 38 I/O O I ST — ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. I/O I I/O ST CMOS ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM2 output. I/O I/O ST ST Digital I/O. Capture 1 input/Compare 1 output/PWM1 output. I/O I/O I/O ST ST I2C Digital I/O. Synchronous serial clock input/output for SPI mode. Synchronous serial clock input/output for I2C mode. I/O I I/O ST ST I2C Digital I/O. SPI data in. I2C data I/O. I/O O ST — Digital I/O. SPI data out. I/O O I/O ST — ST Digital I/O. EUSART1 asynchronous transmit. EUSART1 synchronous clock (see related RX1/DT1). I/O I I/O ST ST ST Digital I/O. EUSART1 asynchronous receive. EUSART1 synchronous data (see related TX1/CK1). Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only).  2010 Microchip Technology Inc. DS39635C-page 25 PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTD is a bidirectional I/O port. RD0/AD0/PSP0 RD0 AD0 PSP0 72 RD1/AD1/PSP1 RD1 AD1 PSP1 69 RD2/AD2/PSP2 RD2 AD2 PSP2 68 RD3/AD3/PSP3 RD3 AD3 PSP3 67 RD4/AD4/PSP4 RD4 AD4 PSP4 66 RD5/AD5/PSP5 RD5 AD5 PSP5 65 RD6/AD6/PSP6 RD6 AD6 PSP6 64 RD7/AD7/PSP7 RD7 AD7 PSP7 63 I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 0. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 1. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 2. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 3. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 4. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 5. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 6. Parallel Slave Port data. I/O I/O I/O ST TTL TTL Digital I/O. External Memory Address/Data 7. Parallel Slave Port data. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only). DS39635C-page 26  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTE is a bidirectional I/O port. RE0/AD8/RD RE0 AD8 RD 4 RE1/AD9/WR RE1 AD9 WR 3 RE2/AD10/CS RE2 AD10 CS 78 RE3/AD11 RE3 AD11 77 RE4/AD12 RE4 AD12 76 RE5/AD13 RE5 AD13 75 RE6/AD14 RE6 AD14 74 RE7/CCP2/AD15 RE7 CCP2(3) AD15 73 I/O I/O I ST TTL TTL Digital I/O. External Memory Address/Data 8. Read control for Parallel Slave Port. I/O I/O I ST TTL TTL Digital I/O. External Memory Address/Data 9. Write control for Parallel Slave Port. I/O I/O I ST TTL TTL Digital I/O. External Memory Address/Data 10. Chip Select control for Parallel Slave Port. I/O I/O ST TTL Digital I/O. External Memory Address/Data 11. I/O I/O ST TTL Digital I/O. External Memory Address/Data 12. I/O I/O ST TTL Digital I/O. External Memory Address/Data 13. I/O I/O ST TTL Digital I/O. External Memory Address/Data 14. I/O I/O I/O ST ST TTL Digital I/O. Capture 2 input/Compare 2 output/PWM2 output. External Memory Address/Data 15. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only).  2010 Microchip Technology Inc. DS39635C-page 27 PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTF is a bidirectional I/O port. RF0/AN5 RF0 AN5 24 RF1/AN6/C2OUT RF1 AN6 C2OUT 23 RF2/AN7/C1OUT RF2 AN7 C1OUT 18 RF3/AN8 RF3 AN8 17 RF4/AN9 RF4 AN9 16 RF5/AN10/CVREF RF5 AN10 CVREF 15 RF6/AN11 RF6 AN11 14 RF7/SS RF7 SS 13 I/O I ST Analog Digital I/O. Analog Input 5. I/O I O ST Analog — Digital I/O. Analog Input 6. Comparator 2 output. I/O I O ST Analog — Digital I/O. Analog Input 7. Comparator 1 output. I/O I ST Analog Digital I/O. Analog Input 8. I/O I ST Analog Digital I/O. Analog Input 9. I/O I O ST Analog Analog Digital I/O. Analog Input 10. Comparator reference voltage output. I/O I ST Analog Digital I/O. Analog Input 11. I/O I ST TTL Digital I/O. SPI slave select input. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only). DS39635C-page 28  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTG is a bidirectional I/O port. RG0/CCP3 RG0 CCP3 5 RG1/TX2/CK2 RG1 TX2 CK2 6 RG2/RX2/DT2 RG2 RX2 DT2 7 RG3 RG4 I/O I/O ST ST Digital I/O. Capture 3 input/Compare 3 output/PWM3 output. I/O O I/O ST — ST Digital I/O. AUSART2 asynchronous transmit. AUSART2 synchronous clock (see related RX2/DT2). I/O I I/O ST ST ST Digital I/O. AUSART2 asynchronous receive. AUSART2 synchronous data (see related TX2/CK2). 8 I/O ST Digital I/O. 10 I/O ST Digital I/O. See RG5/MCLR/VPP pin. RG5 PORTH is a bidirectional I/O port. RH0/AD16 RH0 AD16 79 RH1/AD17 RH1 AD17 80 RH2/AD18 RH2 AD18 1 RH3/AD19 RH3 AD19 2 RH4 I/O I/O ST TTL Digital I/O. External Memory Address/Data 16. I/O I/O ST TTL Digital I/O. External Memory Address/Data 17. I/O I/O ST TTL Digital I/O. External Memory Address/Data 18. I/O I/O ST TTL Digital I/O. External Memory Address/Data 19. 22 I/O ST Digital I/O. RH5 21 I/O ST Digital I/O. RH6 20 I/O ST Digital I/O. RH7 19 I/O ST Digital I/O. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only).  2010 Microchip Technology Inc. DS39635C-page 29 PIC18F6310/6410/8310/8410 TABLE 1-3: PIC18F8310/8410 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name TQFP Pin Type Buffer Type Description PORTJ is a bidirectional I/O port. RJ0/ALE RJ0 ALE 62 RJ1/OE RJ1 OE 61 RJ2/WRL RJ2 WRL 60 RJ3/WRH RJ3 WRH 59 RJ4/BA0 RJ4 BA0 39 RJ5/CE RJ4 CE 40 RJ6/LB RJ6 LB 41 RJ7/UB RJ7 UB 42 VSS 11, 31, 51, 70 I/O O ST — Digital I/O. External memory address latch enable. I/O O ST — Digital I/O. External memory output enable. I/O O ST — Digital I/O. External memory write low control. I/O O ST — Digital I/O. External memory write high control. I/O O ST — Digital I/O. External Memory Byte Address 0 control. I/O O ST — Digital I/O External memory chip enable control. I/O O ST — Digital I/O. External memory low byte control. I/O O ST — Digital I/O. External memory high byte control. P — Ground reference for logic and I/O pins. VDD 12, 32, 48, 71 P — Positive supply for logic and I/O pins. AVSS 26 P — Ground reference for analog modules. AVDD 25 P — Positive supply for analog modules. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels Analog = Analog input I = Input O = Output P = Power I2C = ST with I2C™ or SMB levels Note 1: Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared (all operating modes except Microcontroller mode). 2: Default assignment for CCP2 in all operating modes (CCP2MX is set). 3: Alternate assignment for CCP2 when CCP2MX is cleared (Microcontroller mode only). DS39635C-page 30  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 2.0 GUIDELINES FOR GETTING STARTED WITH PIC18F MICROCONTROLLERS FIGURE 2-1: RECOMMENDED MINIMUM CONNECTIONS C2(1) MCLR VDD C1 Additionally, the following pins may be required: • VREF+/VREF- pins are used when external voltage reference for analog modules is implemented Note: C3(1) PIC18FXXXX VSS VSS C6(1) VDD C5(1) These pins must also be connected if they are being used in the end application: • PGC/PGD pins used for In-Circuit Serial Programming™ (ICSP™) and debugging purposes (see Section 2.4 “ICSP Pins”) • OSCI and OSCO pins when an external oscillator source is used (see Section 2.5 “External Oscillator Pins”) VSS R2 VSS • All VDD and VSS pins (see Section 2.2 “Power Supply Pins”) • All AVDD and AVSS pins, regardless of whether or not the analog device features are used (see Section 2.2 “Power Supply Pins”) • MCLR pin (see Section 2.3 “Master Clear (MCLR) Pin”) R1 VDD The following pins must always be connected: VDD Getting started with the PIC18F6310/6410/8310/8410 family of 8-bit microcontrollers requires attention to a minimal set of device pin connections before proceeding with development. VDD AVSS Basic Connection Requirements AVDD 2.1 C4(1) Key (all values are recommendations): C1 through C6: 0.1 µF, 20V ceramic R1: 10 kΩ R2: 100Ω to 470Ω Note 1: The example shown is for a PIC18F device with five VDD/VSS and AVDD/AVSS pairs. Other devices may have more or less pairs; adjust the number of decoupling capacitors appropriately. The AVDD and AVSS pins must always be connected, regardless of whether any of the analog modules are being used. The minimum mandatory connections are shown in Figure 2-1.  2010 Microchip Technology Inc. DS39635C-page 31 PIC18F6310/6410/8310/8410 2.2 2.2.1 Power Supply Pins DECOUPLING CAPACITORS The use of decoupling capacitors on every pair of power supply pins, such as VDD, VSS, AVDD and AVSS, is required. Consider the following criteria when using decoupling capacitors: • Value and type of capacitor: A 0.1 F (100 nF), 10-20V capacitor is recommended. The capacitor should be a low-ESR device, with a resonance frequency in the range of 200 MHz and higher. Ceramic capacitors are recommended. • Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is no greater than 0.25 inch (6 mm). • Handling high-frequency noise: If the board is experiencing high-frequency noise (upward of tens of MHz), add a second ceramic type capacitor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 F to 0.001 F. Place this second capacitor next to each primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible (e.g., 0.1 F in parallel with 0.001 F). • Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling capacitors first, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB trace inductance. DS39635C-page 32 2.2.2 TANK CAPACITORS On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits, including microcontrollers, to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that connects the power supply source to the device, and the maximum current drawn by the device in the application. In other words, select the tank capacitor so that it meets the acceptable voltage sag at the device. Typical values range from 4.7 F to 47 F. 2.2.3 CONSIDERATIONS WHEN USING BOR When the Brown-out Reset (BOR) feature is enabled, a sudden change in VDD may result in a spontaneous BOR event. This can happen when the microcontroller is operating under normal operating conditions, regardless of what the BOR set point has been programmed to, and even if VDD does not approach the set point. The precipitating factor in these BOR events is a rise or fall in VDD with a slew rate faster than 0.15V/s. An application that incorporates adequate decoupling between the power supplies will not experience such rapid voltage changes. Additionally, the use of an electrolytic tank capacitor across VDD and VSS, as described above, will be helpful in preventing high slew rate transitions. If the application has components that turn on or off, and share the same VDD circuit as the microcontroller, the BOR can be disabled in software by using the SBOREN bit before switching the component. Afterwards, allow a small delay before re-enabling the BOR. By doing this, it is ensured that the BOR is disabled during the interval that might cause high slew rate changes of VDD. Note: Not all devices incorporate software BOR control. See Section 5.0 “Reset” for device-specific information.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 2.3 Master Clear (MCLR) Pin The MCLR pin provides two specific device functions: Device Reset, and Device Programming and Debugging. If programming and debugging are not required in the end application, a direct connection to VDD may be all that is required. The addition of other components, to help increase the application’s resistance to spurious Resets from voltage sags, may be beneficial. A typical configuration is shown in Figure 2-1. Other circuit designs may be implemented, depending on the application’s requirements. During programming and debugging, the resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR pin. Consequently, specific voltage levels (VIH and VIL) and fast signal transitions must not be adversely affected. Therefore, specific values of R1 and C1 will need to be adjusted based on the application and PCB requirements. For example, it is recommended that the capacitor, C1, be isolated from the MCLR pin during programming and debugging operations by using a jumper (Figure 2-2). The jumper is replaced for normal run-time operations. Any components associated with the MCLR pin should be placed within 0.25 inch (6 mm) of the pin. FIGURE 2-2: EXAMPLE OF MCLR PIN CONNECTIONS 2.4 ICSP Pins The PGC and PGD pins are used for In-Circuit Serial Programming™ (ICSP™) and debugging purposes. It is recommended to keep the trace length between the ICSP connector and the ICSP pins on the device as short as possible. If the ICSP connector is expected to experience an ESD event, a series resistor is recommended, with the value in the range of a few tens of ohms, not to exceed 100Ω. Pull-up resistors, series diodes, and capacitors on the PGC and PGD pins are not recommended as they will interfere with the programmer/debugger communications to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits and pin input voltage high (VIH) and input low (VIL) requirements. For device emulation, ensure that the “Communication Channel Select” (i.e., PGCx/PGDx pins) programmed into the device matches the physical connections for the ICSP to the Microchip debugger/emulator tool. For more information on available Microchip development tools connection requirements, refer to Section 26.0 “Development Support”. VDD R1 R2 MCLR JP PIC18FXXXX C1 Note 1: R1  10 k is recommended. A suggested starting value is 10 k. Ensure that the MCLR pin VIH and VIL specifications are met. 2: R2  470 will limit any current flowing into MCLR from the external capacitor, C, in the event of MCLR pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR pin VIH and VIL specifications are met.  2010 Microchip Technology Inc. DS39635C-page 33 PIC18F6310/6410/8310/8410 2.5 External Oscillator Pins FIGURE 2-3: Many microcontrollers have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 3.0 “Oscillator Configurations” for details). The oscillator circuit should be placed on the same side of the board as the device. Place the oscillator circuit close to the respective oscillator pins with no more than 0.5 inch (12 mm) between the circuit components and the pins. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate it from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. Single-Sided and In-Line Layouts: Copper Pour (tied to ground) For additional information and design guidance on oscillator circuits, please refer to these Microchip Application Notes, available at the corporate web site (www.microchip.com): • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC™ and PICmicro® Devices” • AN849, “Basic PICmicro® Oscillator Design” • AN943, “Practical PICmicro® Oscillator Analysis and Design” • AN949, “Making Your Oscillator Work” 2.6 Unused I/Os Primary Oscillator Crystal DEVICE PINS Primary Oscillator OSC1 C1 ` OSC2 GND C2 ` T1OSO T1OS I Timer1 Oscillator Crystal Layout suggestions are shown in Figure 2-4. In-line packages may be handled with a single-sided layout that completely encompasses the oscillator pins. With fine-pitch packages, it is not always possible to completely surround the pins and components. A suitable solution is to tie the broken guard sections to a mirrored ground layer. In all cases, the guard trace(s) must be returned to ground. In planning the application’s routing and I/O assignments, ensure that adjacent port pins and other signals in close proximity to the oscillator are benign (i.e., free of high frequencies, short rise and fall times, and other similar noise). SUGGESTED PLACEMENT OF THE OSCILLATOR CIRCUIT ` T1 Oscillator: C1 T1 Oscillator: C2 Fine-Pitch (Dual-Sided) Layouts: Top Layer Copper Pour (tied to ground) Bottom Layer Copper Pour (tied to ground) OSCO C2 Oscillator Crystal GND C1 OSCI DEVICE PINS Unused I/O pins should be configured as outputs and driven to a logic low state. Alternatively, connect a 1 kΩ to 10 kΩ resistor to VSS on unused pins and drive the output to logic low. DS39635C-page 34  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 3.0 OSCILLATOR CONFIGURATIONS 3.1 Oscillator Types FIGURE 3-1: PIC18F6310/6410/8310/8410 devices can be operated in ten different oscillator modes. The user can program the Configuration bits, FOSC, in Configuration Register 1H to select one of these ten modes: 1. 2. 3. 4. Low-Power Crystal Crystal/Resonator High-Speed Crystal/Resonator High-Speed Crystal/Resonator with PLL enabled 5. RC External Resistor/Capacitor with FOSC/4 output on RA6 6. RCIO External Resistor/Capacitor with I/O on RA6 7. INTIO1 Internal Oscillator with FOSC/4 output on RA6 and I/O on RA7 8. INTIO2 Internal Oscillator with I/O on RA6 and RA7 9. EC External Clock with FOSC/4 output 10. ECIO External Clock with I/O on RA6 C1(1) Crystal Oscillator/Ceramic Resonators In XT, LP, HS or HSPLL Oscillator modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation. Figure 3-1 shows the pin connections. The oscillator design requires the use of a parallel resonant crystal. Note: Use of a series resonant crystal may give a frequency out of the crystal manufacturer’s specifications. OSC1 XTAL LP XT HS HSPLL 3.2 CRYSTAL/CERAMIC RESONATOR OPERATION (XT, LP, HS OR HSPLL CONFIGURATION) To Internal Logic RF(3) Sleep RS(2) C2(1) PIC18FXXXX OSC2 Note 1: See Table 3-1 and Table 3-2 for initial values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the oscillator mode chosen. TABLE 3-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Typical Capacitor Values Used: Mode Freq OSC1 OSC2 XT 455 kHz 2.0 MHz 4.0 MHz 56 pF 47 pF 33 pF 56 pF 47 pF 33 pF HS 8.0 MHz 16.0 MHz 27 pF 22 pF 27 pF 22 pF Capacitor values are for design guidance only. These capacitors were tested with the resonators listed below for basic start-up and operation. These values are not optimized. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following Table 3-2 for additional information. Resonators Used: 455 kHz 4.0 MHz 2.0 MHz 8.0 MHz 16.0 MHz  2010 Microchip Technology Inc. DS39635C-page 35 PIC18F6310/6410/8310/8410 TABLE 3-2: Osc Type LP XT HS CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Crystal Freq Typical Capacitor Values Tested: C1 C2 32 kHz 33 pF 33 pF 200 kHz 15 pF 15 pF 1 MHz 33 pF 33 pF 4 MHz 27 pF 27 pF 4 MHz 27 pF 27 pF 8 MHz 22 pF 22 pF 20 MHz 15 pF 15 pF Capacitor values are for design guidance only. These capacitors were tested with the crystals listed below for basic start-up and operation. These values are not optimized. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following this table for additional information. Crystals Used: 32 kHz An external clock source may also be connected to the OSC1 pin in the HS mode, as shown in Figure 3-2. FIGURE 3-2: EXTERNAL CLOCK INPUT OPERATION (HS OSCILLATOR CONFIGURATION) OSC1 Clock from Ext. System PIC18FXXXX Open 3.3 External Clock Input The EC and ECIO Oscillator modes require an external clock source to be connected to the OSC1 pin. There is no oscillator start-up time required after a Power-on Reset or after an exit from Sleep mode. In the EC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 3-3 shows the pin connections for the EC Oscillator mode. FIGURE 3-3: EXTERNAL CLOCK INPUT OPERATION (EC CONFIGURATION) 4 MHz 200 kHz 8 MHz 1 MHz 20 MHz OSC1/CLKI Clock from Ext. System Note 1: Higher capacitance increases the stability of oscillator, but also increases the start-up time. 2: When operating below 3V VDD, or when using certain ceramic resonators at any voltage, it may be necessary to use the HS mode or switch to a crystal oscillator. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. PIC18FXXXX FOSC/4 DS39635C-page 36 OSC2/CLKO The ECIO Oscillator mode functions like the EC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). Figure 3-4 shows the pin connections for the ECIO Oscillator mode. FIGURE 3-4: EXTERNAL CLOCK INPUT OPERATION (ECIO CONFIGURATION) 4: Rs may be required to avoid overdriving crystals with low drive level specification. 5: Always verify oscillator performance over the VDD and temperature range that is expected for the application. (HS Mode) OSC2 OSC1/CLKI Clock from Ext. System PIC18FXXXX RA6 I/O (OSC2)  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 3.4 RC Oscillator 3.5 For timing-insensitive applications, the “RC” and “RCIO” device options offer additional cost savings. The actual oscillator frequency is a function of several factors: • Supply voltage • Values of the external resistor (REXT) and capacitor (CEXT) • Operating temperature PLL Frequency Multiplier A Phase Locked Loop (PLL) circuit is provided as an option for users who want to use a lower frequency oscillator circuit, or to clock the device up to its highest rated frequency from a crystal oscillator. This may be useful for customers who are concerned with EMI due to high-frequency crystals, or users who require higher clock speeds from an internal oscillator. 3.5.1 HSPLL OSCILLATOR MODE Given the same device, operating voltage and temperature and component values, there will also be unit-to-unit frequency variations. These are due to factors such as: The HSPLL mode makes use of the HS Oscillator mode for frequencies up to 10 MHz. A PLL then multiplies the oscillator output frequency by 4 to produce an internal clock frequency up to 40 MHz. • Normal manufacturing variation • Difference in lead frame capacitance between package types (especially for low CEXT values) • Variations within the tolerance of limits of REXT and CEXT The PLL is only available to the crystal oscillator when the FOSC Configuration bits are programmed for HSPLL mode (= 0110). FIGURE 3-7: In the RC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 3-5 shows how the R/C combination is connected. FIGURE 3-5: RC OSCILLATOR MODE VDD REXT OSC1 PLL BLOCK DIAGRAM (HS MODE) HS Oscillator Enable PLL Enable (from Configuration Register 1H) OSC2 HS Mode Crystal OSC1 Oscillator FIN Phase Comparator FOUT Internal Clock Loop Filter CEXT PIC18FXXXX VSS 4 VCO MUX FOSC/4 OSC2/CLKO Recommended values: 3 k  REXT  100 k CEXT > 20 pF The RCIO Oscillator mode (Figure 3-6) functions like the RC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). FIGURE 3-6: RCIO OSCILLATOR MODE VDD REXT OSC1 3.5.2 SYSCLK PLL AND INTOSC The PLL is also available to the internal oscillator block in selected oscillator modes. In this configuration, the PLL is enabled in software and generates a clock output of up to 32 MHz. The operation of INTOSC with the PLL is described in Section 3.6.4 “PLL in INTOSC Modes”. Internal Clock CEXT PIC18FXXXX VSS RA6 I/O (OSC2) Recommended values: 3 k  REXT  100 k CEXT > 20 pF  2010 Microchip Technology Inc. DS39635C-page 37 PIC18F6310/6410/8310/8410 3.6 Internal Oscillator Block The PIC18F6310/6410/8310/8410 devices include an internal oscillator block, which generates two different clock signals; either can be used as the microcontroller’s clock source. This may eliminate the need for external oscillator circuits on the OSC1 and/or OSC2 pins. The main output (INTOSC) is an 8 MHz clock source, which can be used to directly drive the device clock. It also drives a postscaler, which can provide a range of clock frequencies from 31 kHz to 4 MHz. The INTOSC output is enabled when a clock frequency from 125 kHz to 8 MHz is selected. The other clock source is the internal RC oscillator (INTRC), which provides a nominal 31 kHz output. INTRC is enabled if it is selected as the device clock source; it is also enabled automatically when any of the following are enabled: • • • • Power-up Timer Fail-Safe Clock Monitor Watchdog Timer Two-Speed Start-up These features are discussed in greater detail in Section 24.0 “Special Features of the CPU”. The clock source frequency (INTOSC direct, INTRC direct or INTOSC postscaler) is selected by configuring the IRCF bits of the OSCCON register (Register 3-2). 3.6.1 INTIO MODES When the OSCTUNE register is modified, the INTOSC frequency will begin shifting to the new frequency. The INTOSC clock will stabilize within 1 ms. Code execution continues during this shift. There is no indication that the shift has occurred. The OSCTUNE register also implements the INTSRC and PLLEN bits, which control certain features of the internal oscillator block. The INTSRC bit allows users to select which internal oscillator provides the clock source when the 31 kHz frequency option is selected. This is covered in greater detail in Section 3.7.1 “Oscillator Control Register”. The PLLEN bit controls the operation of the frequency multiplier, PLL, in internal oscillator modes. 3.6.4 PLL IN INTOSC MODES The 4x frequency multiplier can be used with the internal oscillator block to produce faster device clock speeds than are normally possible with an internal oscillator. When enabled, the PLL produces a clock speed of up to 32 MHz. Unlike HSPLL mode, the PLL is controlled through software. The control bit, PLLEN (OSCTUNE), is used to enable or disable its operation. The PLL is available when the device is configured to use the internal oscillator block as its primary clock source (FOSC = 1001 or 1000). Additionally, the PLL will only function when the selected output frequency is either 4 MHz or 8 MHz (OSCCON = 111 or 110). If both of these conditions are not met, the PLL is disabled. Using the internal oscillator as the clock source eliminates the need for up to two external oscillator pins, which can then be used for digital I/O. Two distinct configurations are available: The PLLEN control bit is only functional in those internal oscillator modes where the PLL is available. In all other modes, it is forced to ‘0’ and is effectively unavailable. • In INTIO1 mode, the OSC2 pin outputs FOSC/4, while OSC1 functions as RA7 for digital input and output. • In INTIO2 mode, OSC1 functions as RA7 and OSC2 functions as RA6, both for digital input and output. 3.6.5 3.6.2 INTOSC OUTPUT FREQUENCY The internal oscillator block is calibrated at the factory to produce an INTOSC output frequency of 8.0 MHz. The INTRC oscillator operates independently of the INTOSC source. Any changes in INTOSC across voltage and temperature are not necessarily reflected by changes in INTRC and vice versa. 3.6.3 OSCTUNE REGISTER The internal oscillator’s output has been calibrated at the factory, but can be adjusted in the user’s application. This is done by writing to the OSCTUNE register (Register 3-1). DS39635C-page 38 INTOSC FREQUENCY DRIFT The factory calibrates the internal oscillator block output (INTOSC) for 8 MHz. However, this frequency may drift as VDD or temperature changes, which can affect the controller operation in a variety of ways. It is possible to adjust the INTOSC frequency by modifying the value in the OSTUNE register. This has no effect on the INTRC clock source frequency. Tuning the INTOSC source requires knowing when to make the adjustment, in which direction it should be made and in some cases, how large a change is needed. Three examples follow, but other techniques may be used. Three compensation techniques are discussed in Section 3.6.5.1 “Compensating with the AUSART”, Section 3.6.5.2 “Compensating with the Timers”” and Section 3.6.5.3 “Compensating with the Timers”, but other techniques may be used.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 3.6.5.1 Compensating with the AUSART An adjustment may be required when the AUSART begins to generate framing errors or receives data with errors while in Asynchronous mode. Framing errors indicate that the device clock frequency is too high; to adjust for this, decrement the value in OSTUNE to reduce the clock frequency. On the other hand, errors in data may suggest that the clock speed is too low; to compensate, increment OSTUNE to increase the clock frequency. 3.6.5.2 Compensating with the Timers This technique compares device clock speed to some reference clock. Two timers may be used; one timer is clocked by the peripheral clock, while the other is clocked by a fixed reference source, such as the Timer1 oscillator. Both timers are cleared, but the timer clocked by the reference generates interrupts. When an interrupt occurs, the internally clocked timer is read and both timers are cleared. If the internally clocked timer value REGISTER 3-1: is greater than expected, then the internal oscillator block is running too fast. To adjust for this, decrement the OSCTUNE register. 3.6.5.3 Compensating with the Timers A CCP module can use free running Timer1 (or Timer3), clocked by the internal oscillator block and an external event with a known period (i.e., AC power frequency). The time of the first event is captured in the CCPRxH:CCPRxL registers and is recorded. When the second event causes a capture, the time of the first event is subtracted from the time of the second event. Since the period of the external event is known, the time difference between events can be calculated. If the measured time is much greater than the calculated time, then the internal oscillator block is running too fast; to compensate, decrement the OSTUNE register. If the measured time is much less than the calculated time, then the internal oscillator block is running too slow; to compensate, increment the OSTUNE register. OSCTUNE: OSCILLATOR TUNING REGISTER R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INTSRC PLLEN(1) — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit 1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled) 0 = 31 kHz device clock derived directly from INTRC internal oscillator bit 6 PLLEN: Frequency Multiplier PLL for INTOSC Enable bit(1) 1 = PLL enabled for INTOSC (4 MHz and 8 MHz only) 0 = PLL disabled bit 5 Unimplemented: Read as ‘0’ bit 4-0 TUN: Frequency Tuning bits 01111 = Maximum frequency • • • • 00001 00000 = Center frequency. Oscillator module is running at the calibrated frequency. 11111 • • • • 10000 = Minimum frequency Note 1: Available only in certain oscillator configurations; otherwise, this bit is unavailable and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes” for details.  2010 Microchip Technology Inc. DS39635C-page 39 PIC18F6310/6410/8310/8410 The secondary oscillators are those external sources not connected to the OSC1 or OSC2 pins. These sources may continue to operate even after the controller is placed in a power-managed mode. Clock Sources and Oscillator Switching Like previous PIC18 devices, the PIC18F6310/6410/8310/8410 family includes a feature that allows the device clock source to be switched from the main oscillator to an alternate low-frequency clock source. PIC18F6310/6410/8310/8410 devices offer two alternate clock sources. When an alternate clock source is enabled, the various power-managed operating modes are available. PIC18F6310/6410/8310/8410 devices offer the Timer1 oscillator as a secondary oscillator. This oscillator, in all power-managed modes, is often the time base for functions such as a Real-Time Clock (RTC). Most often, a 32.768 kHz watch crystal is connected between the RC0/T1OSO/T13CKI and RC1/T1OSI/CCP2 pins. Like the LP mode oscillator circuit, loading capacitors are also connected from each pin to ground. Essentially, there are three clock sources for these devices: • Primary oscillators • Secondary oscillators • Internal oscillator block The Timer1 oscillator is discussed in greater detail in Section 13.3 “Timer1 Oscillator”. In addition to being a primary clock source, the internal oscillator block is available as a power-managed mode clock source. The INTRC source is also used as the clock source for several special features, such as the WDT and Fail-Safe Clock Monitor. The primary oscillators include the External Crystal and Resonator modes, the External RC modes, the External Clock modes and the internal oscillator block. The particular mode is defined by the FOSC Configuration bits. The details of these modes are covered earlier in this chapter. FIGURE 3-8: The clock sources for the PIC18F6310/6410/8310/8410 devices are shown in Figure 3-8. See Section 24.0 “Special Features of the CPU” for Configuration register details. PIC18F6310/6410/8310/8410 CLOCK DIAGRAM Primary Oscillator LP, XT, HS, RC, EC OSC2 Sleep OSC1 4 x PLL HSPLL, INTOSC/PLL OSCTUNE Secondary Oscillator T1OSC T1OSO OSCCON 8 MHz OSCCON INTRC Source 4 MHz 2 MHz 8 MHz (INTOSC) 31 kHz (INTRC) Postscaler Internal Oscillator Block 8 MHz Source 1 MHz 500 kHz 250 kHz 125 kHz 1 31 kHz Internal Oscillator CPU 111 110 IDLEN 101 100 011 MUX T1OSI T1OSCEN Enable Oscillator Peripherals MUX 3.7 010 001 000 Clock Control FOSC OSCCON Clock Source Option for other Modules 0 OSCTUNE WDT, PWRT, FSCM and Two-Speed Start-up DS39635C-page 40  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 3.7.1 OSCILLATOR CONTROL REGISTER The OSCCON register (Register 3-2) controls several aspects of the device clock’s operation, both in full-power operation and in power-managed modes. The System Clock Select bits, SCS, select the clock source. The available clock sources are the primary clock (defined by the FOSC Configuration bits), the secondary clock (Timer1 oscillator) and the internal oscillator block. The clock source changes immediately after one or more of the bits is written to, following a brief clock transition interval. The SCS bits are cleared on all forms of Reset. The Internal Oscillator Frequency Select bits, IRCF, select the frequency output of the internal oscillator block to drive the device clock. The choices are the INTRC source, the INTOSC source (8 MHz) or one of the frequencies derived from the INTOSC postscaler (31.25 kHz to 4 MHz). If the internal oscillator block is supplying the device clock, changing the states of these bits will have an immediate change on the internal oscillator’s output. Resets, the default output frequency of the internal oscillator block, are set at 1 MHz. When an output frequency of 31 kHz is selected (IRCF = 000), users may choose which internal oscillator acts as the source. This is done with the INTSRC bit in the OSCTUNE register (OSCTUNE). Setting this bit selects INTOSC as a 31.25 kHz clock source by enabling the divide-by-256 output of the INTOSC postscaler. Clearing INTSRC selects INTRC (nominally 31 kHz) as the clock source. This option allows users to select the tunable and more precise INTOSC as a clock source, while maintaining power savings with a very low clock speed. Regardless of the setting of INTSRC, INTRC always remains the clock source for features such as the Watchdog Timer and the Fail-Safe Clock Monitor. The OSTS, IOFS and T1RUN bits indicate which clock source is currently providing the device clock. The OSTS bit indicates that the Oscillator Start-up Timer has timed out and the primary clock is providing the  2010 Microchip Technology Inc. device clock in primary clock modes. The IOFS bit indicates when the internal oscillator block has stabilized and is providing the device clock in RC Clock modes. The T1RUN bit (T1CON) indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. In power-managed modes, only one of these three bits will be set at any time. If none of these bits are set, the INTRC is providing the clock, or the internal oscillator block has just started and is not yet stable. The IDLEN bit determines if the device goes into Sleep mode or one of the Idle modes when the SLEEP instruction is executed. The use of the flag and control bits in the OSCCON register is discussed in more detail in Section 4.0 “Power-Managed Modes”. Note 1: The Timer1 oscillator must be enabled to select the secondary clock source. The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 Control register (T1CON). If the Timer1 oscillator is not enabled, then any attempt to select a secondary clock source when executing a SLEEP instruction will be ignored. 2: It is recommended that the Timer1 oscillator be operating and stable before executing the SLEEP instruction or a very long delay may occur while the Timer1 oscillator starts. 3.7.2 OSCILLATOR TRANSITIONS PIC18F6310/6410/8310/8410 devices contain circuitry to prevent clock “glitches” when switching between clock sources. A short pause in the device clock occurs during the clock switch. The length of this pause is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Clock transitions are discussed in greater detail in Section 4.1.2 “Entering Power-Managed Modes”. DS39635C-page 41 PIC18F6310/6410/8310/8410 REGISTER 3-2: OSCCON: OSCILLATOR CONTROL REGISTER R/W-0 R/W-1 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0 IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IDLEN: Idle Enable bit 1 = Device enters Idle mode on SLEEP instruction 0 = Device enters Sleep mode on SLEEP instruction bit 6-4 IRCF: Internal Oscillator Frequency Select bits 111 = 8 MHz (INTOSC drives clock directly) 110 = 4 MHz 101 = 2 MHz 100 = 1 MHz(3) 011 = 500 kHz 010 = 250 kHz 001 = 125 kHz 000 = 31 kHz (from either INTOSC/256 or INTRC directly)(2) bit 3 OSTS: Oscillator Start-up Time-out Status bit(1) 1 = Oscillator Start-up Timer time-out has expired; primary oscillator is running 0 = Oscillator Start-up Timer time-out is running; primary oscillator is not ready bit 2 IOFS: INTOSC Frequency Stable bit 1 = INTOSC frequency is stable 0 = INTOSC frequency is not stable bit 1-0 SCS: System Clock Select bits 1x = Internal oscillator block 01 = Secondary (Timer1) oscillator 00 = Primary oscillator Note 1: 2: 3: Depends on the state of the IESO Configuration bit. Source selected by the INTSRC bit (OSCTUNE), see Section 3.6.3 “OSCTUNE Register”. Default output frequency of INTOSC on Reset. DS39635C-page 42  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 3.8 Effects of Power-Managed Modes on the Various Clock Sources When PRI_IDLE mode is selected, the designated primary oscillator continues to run without interruption. For all other power-managed modes, the oscillator using the OSC1 pin is disabled. The OSC1 pin (and OSC2 pin, if used by the oscillator) will stop oscillating. In secondary clock modes (SEC_RUN and SEC_IDLE), the Timer1 oscillator is operating and providing the device clock. The Timer1 oscillator may also run in all power-managed modes if required to clock Timer1 or Timer3. In internal oscillator modes (RC_RUN and RC_IDLE), the internal oscillator block provides the device clock source. The 31 kHz INTRC output can be used directly to provide the clock and may be enabled to support various special features, regardless of the power-managed mode (see Section 24.2 “Watchdog Timer (WDT)” through Section 24.4 “Fail-Safe Clock Monitor” for more information on WDT, Fail-Safe Clock Monitor and Two-Speed Start-up). The INTOSC output at 8 MHz may be used directly to clock the device, or may be divided down by the postscaler. The INTOSC output is disabled if the clock is provided directly from the INTRC output. If the Sleep mode is selected, all clock sources are stopped. Since all the transistor switching currents have been stopped, Sleep mode achieves the lowest current consumption of the device (only leakage currents). 3.9 Power-up Delays Power-up delays are controlled by two timers, so that no external Reset circuitry is required for most applications. The delays ensure that the device is kept in Reset until the device power supply is stable under normal circumstances and the primary clock is operating and stable. For additional information on power-up delays, see Section 5.5 “Device Reset Timers”. The first timer is the Power-up Timer (PWRT), which provides a fixed delay on power-up (Parameter 33, Table 27-12). It is enabled by clearing (= 0) the PWRTEN Configuration bit. The second timer is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable (LP, XT and HS modes). The OST does this by counting 1024 oscillator cycles before allowing the oscillator to clock the device. When the HSPLL Oscillator mode is selected, the device is kept in Reset for an additional 2 ms, following the HS mode OST delay, so the PLL can lock to the incoming clock frequency. There is a delay of interval, TCSD (Parameter 38, Table 27-12), following POR while the controller becomes ready to execute instructions. This delay runs concurrently with any other delays. This may be the only delay that occurs when any of the EC, RC or INTIO modes are used as the primary clock source. Enabling any on-chip feature that will operate during Sleep will increase the current consumed during Sleep. The INTRC is required to support WDT operation. The Timer1 oscillator may be operating to support a real-time clock. Other features may be operating that do not require a device clock source (i.e., MSSP slave, PSP, INTx pins and others). Peripherals that may add significant current consumption are listed in Section 27.2 “DC Characteristics: Power-Down and Supply Current”. TABLE 3-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE(1) Oscillator Mode OSC1 Pin OSC2 Pin RC, INTIO1 Floating, external resistor should pull high At logic low (clock/4 output) RCIO, INTIO2 Floating, external resistor should pull high Configured as PORTA, bit 6 ECIO Floating, pulled by external clock Configured as PORTA, bit 6 EC Floating, pulled by external clock At logic low (clock/4 output) LP, XT and HS Feedback inverter disabled at quiescent voltage level Feedback inverter disabled at quiescent voltage level Note 1: See Table 5-2 in Section 5.0 “Reset” for time-outs due to Sleep and MCLR Reset.  2010 Microchip Technology Inc. DS39635C-page 43 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 44  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 4.0 4.1.1 POWER-MANAGED MODES The SCS bits allow the selection of one of three clock sources for power-managed modes. They are: PIC18F6310/6410/8310/8410 devices offer a total of seven operating modes for more efficient power management. These modes provide a variety of options for selective power conservation in applications where resources may be limited (i.e., battery-powered devices). • The primary clock, as defined by the FOSC Configuration bits • The secondary clock (the Timer1 oscillator) • The internal oscillator block (for RC modes) There are three categories of power-managed modes: 4.1.2 • Sleep mode • Idle modes • Run modes The power-managed modes include several power-saving features. One of these is the clock switching feature, offered in other PIC18 devices, allowing the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PIC® devices, where all device clocks are stopped. Entry to the power-managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit. Depending on the current mode and the mode being switched to, a change to a power-managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode. Selecting Power-Managed Modes Selecting a power-managed mode requires deciding if the CPU is to be clocked or not and selecting a clock source. The IDLEN bit controls CPU clocking, while the SCS bits select a clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 4-1. TABLE 4-1: POWER-MANAGED MODES OSCCON Bits Mode (1) Module Clocking Available Clock and Oscillator Source SCS CPU Peripherals 0 N/A Off Off PRI_RUN N/A 00 Clocked Clocked IDLEN Sleep ENTERING POWER-MANAGED MODES Entering power-managed Run mode, or switching from one power-managed mode to another, begins by loading the OSCCON register. The SCS bits select the clock source and determine which Run or Idle mode is being used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. These are discussed in Section 4.1.3 “Clock Transitions and Status Indicators” and subsequent sections. These categories define which portions of the device are clocked and sometimes, what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or INTOSC multiplexer); the Sleep mode does not use a clock source. 4.1 CLOCK SOURCES None – All clocks are disabled. Primary – LP, XT, HS, HSPLL, RC, EC, INTRC(2) This is the normal Full-Power Execution mode SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2) PRI_IDLE 1 00 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC SEC_IDLE 1 01 Off Clocked Secondary – Timer1 Oscillator RC_IDLE 1 1x Off Clocked Internal Oscillator Block(2) Note 1: 2: IDLEN reflects its value when the SLEEP instruction is executed. Includes INTOSC and INTOSC postscaler, as well as the INTRC source.  2010 Microchip Technology Inc. DS39635C-page 45 PIC18F6310/6410/8310/8410 4.1.3 CLOCK TRANSITIONS AND STATUS INDICATORS The length of the transition between clock sources is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Three bits indicate the current clock source and its status. They are: • OSTS (OSCCON) • IOFS (OSCCON) • T1RUN (T1CON) In general, only one of these bits will be set while in a given power-managed mode. When the OSTS bit is set, the primary clock is providing the device clock. When the IOFS bit is set, the INTOSC output is providing a stable, 8 MHz clock source to a divider that actually drives the device clock. When the T1RUN bit is set, the Timer1 oscillator is providing the clock. If none of these bits are set, then either the INTRC clock source is clocking the device or the INTOSC source is not yet stable. If the internal oscillator block is configured as the primary clock source by the FOSC Configuration bits, then both the OSTS and IOFS bits may be set when in PRI_RUN or PRI_IDLE modes. This indicates that the primary clock (INTOSC output) is generating a stable 8 MHz output. Entering another power-managed RC mode at the same frequency would clear the OSTS bit. Note 1: Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. 2: Executing a SLEEP instruction does not necessarily place the device into Sleep mode. It acts as the trigger to place the controller into either the Sleep mode or one of the Idle modes, depending on the setting of the IDLEN bit. 4.1.4 Upon resuming normal operation, after waking from Sleep or Idle, the internal state machines require at least one TCY delay before another SLEEP instruction can be executed. If two back to back SLEEP instructions will be executed, the process shown in Example 4-1 should be used: EXAMPLE 4-1: SLEEP NOP ;Wait at least 1 Tcy before executing another sleep instruction SLEEP 4.2 DS39635C-page 46 Run Modes In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source. 4.2.1 PRI_RUN MODE The PRI_RUN mode is the normal full-power execution mode of the microcontroller. This is also the default mode upon a device Reset unless Two-Speed Start-up is enabled (see Section 24.3 “Two-Speed Start-up” for details). In this mode, the OSTS bit is set. The IOFS bit may be set if the internal oscillator block is the primary clock source (see Section 3.7.1 “Oscillator Control Register”). 4.2.2 SEC_RUN MODE The SEC_RUN mode is the compatible mode to the “clock switching” feature offered in other PIC18 devices. In this mode, the CPU and peripherals are clocked from the Timer1 oscillator. This gives users the option of lower power consumption while still using a high-accuracy clock source. SEC_RUN mode is entered by setting the SCS bits to ‘01’. The device clock source is switched to the Timer1 oscillator (see Figure 4-1), the primary oscillator is shut down, the T1RUN bit (T1CON) is set and the OSTS bit is cleared. MULTIPLE SLEEP COMMANDS The power-managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit at the time the instruction is executed. If another SLEEP instruction is executed, the device will enter the power-managed mode specified by IDLEN at that time. If IDLEN has changed, the device will enter the new power-managed mode specified by the new setting. EXECUTING BACK TO BACK SLEEP INSTRUCTIONS Note: The Timer1 oscillator should already be running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS bits are set to ‘01’, entry to SEC_RUN mode will not occur. If the Timer1 oscillator is enabled, but not yet running, peripheral clocks will be delayed until the oscillator has started; in such situations, initial oscillator operation is far from stable and unpredictable operation may result.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 On transitions from SEC_RUN mode to PRI_RUN, the peripherals and CPU continue to be clocked from the Timer1 oscillator while the primary clock is started. When the primary clock becomes ready, a clock switch back to the primary clock occurs (see Figure 4-2). FIGURE 4-1: When the clock switch is complete, the T1RUN bit is cleared, the OSTS bit is set and the primary clock is providing the clock. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run. TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE Q1 Q2 Q3 Q4 Q1 Q2 1 T1OSI 2 3 n-1 Q3 Q4 Q1 Q2 Q3 n Clock Transition OSC1 CPU Clock Peripheral Clock Program Counter FIGURE 4-2: PC PC + 2 PC + 4 TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL) Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 T1OSI OSC1 TOST(1) TPLL(1) PLL Clock Output 1 CPU Clock 2 n-1 Clock Transition n Peripheral Clock Program Counter PC + 2 PC SCS bits Changed PC + 4 OSTS bit Set Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  2010 Microchip Technology Inc. DS39635C-page 47 PIC18F6310/6410/8310/8410 4.2.3 RC_RUN MODE In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator block using the INTOSC multiplexer and the primary clock is shut down. When using the INTRC source, this mode provides the best power conservation of all the Run modes, while still executing code. It works well for user applications which are not highly timing-sensitive, or do not require high-speed clocks at all times. If the primary clock source is the internal oscillator block (either INTRC or INTOSC), there are no distinguishable differences between PRI_RUN and RC_RUN modes during execution. However, a clock switch delay will occur during entry to and exit from RC_RUN mode. Therefore, if the primary clock source is the internal oscillator block, the use of RC_RUN mode is not recommended. This mode is entered by setting the SCS1 bit to ‘1’. Although it is ignored, it is recommended that the SCS0 bit also be cleared; this is to maintain software compatibility with future devices. When the clock source is switched to the INTOSC multiplexer (see Figure 4-3), the primary oscillator is shut down and the OSTS bit is cleared.The IRCF bits may be modified at any time to immediately change the clock speed. Note: If the IRCF bits and the INTSRC bit are all clear, the INTOSC output is not enabled and the IOFS bit will remain clear; there will be no indication of the current clock source. The INTRC source is providing the device clocks. If the IRCF bits are changed from all clear (thus, enabling the INTOSC output), or if INTSRC is set, the IOFS bit becomes set after the INTOSC output becomes stable. Clocks to the device continue while the INTOSC source stabilizes after an interval of TIOBST. If the IRCF bits were previously at a non-zero value, or if INTSRC was set before setting SCS1 and the INTOSC source was already stable, the IOFS bit will remain set. On transitions from RC_RUN mode to PRI_RUN, the device continues to be clocked from the INTOSC multiplexer while the primary clock is started. When the primary clock becomes ready, a clock switch to the primary clock occurs (see Figure 4-4). When the clock switch is complete, the IOFS bit is cleared, the OSTS bit is set and the primary clock is providing the device clock. The IDLEN and SCS bits are not affected by the switch. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. DS39635C-page 48  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 4-3: TRANSITION TIMING TO RC_RUN MODE Q1 Q2 Q3 Q4 Q1 Q2 1 INTRC 2 3 n-1 Q3 Q4 Q1 Q2 Q3 n Clock Transition OSC1 CPU Clock Peripheral Clock Program Counter PC FIGURE 4-4: PC + 2 PC + 4 TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE Q1 Q2 Q3 Q4 Q2 Q3 Q4 Q1 Q2 Q3 Q1 INTOSC Multiplexer OSC1 TOST(1) TPLL(1) PLL Clock Output 1 2 n-1 n Clock Transition CPU Clock Peripheral Clock Program Counter PC + 2 PC SCS bits Changed PC + 4 OSTS bit Set Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.  2010 Microchip Technology Inc. DS39635C-page 49 PIC18F6310/6410/8310/8410 4.3 Sleep Mode 4.4 The power-managed Sleep mode in the PIC18F6310/6410/8310/8410 devices is identical to the legacy Sleep mode offered in all other PIC® devices. It is entered by clearing the IDLEN bit (the default state on device Reset) and executing the SLEEP instruction. This shuts down the selected oscillator (see Figure 4-5). All clock source status bits are cleared. Idle Modes The Idle modes allow the controller’s CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption. If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected using the SCS bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing SLEEP provides a quick method of switching from a given Run mode to its corresponding Idle mode. Entering the Sleep mode from any other mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the primary clock source becomes ready (see Figure 4-6), or it will be clocked from the internal oscillator block if either the Two-Speed Start-up or the Fail-Safe Clock Monitor are enabled (see Section 24.0 “Special Features of the CPU”). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up. Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out or a Reset. When a wake event occurs, CPU execution is delayed by an interval of TCSD (Parameter 38, Table 27-12), while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up. While in any Idle mode or the Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS bits. FIGURE 4-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE Q1 Q2 Q3 Q4 Q1 OSC1 CPU Clock Peripheral Clock Sleep Program Counter PC FIGURE 4-6: PC + 2 TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL) Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 OSC1 PLL Clock Output TOST(1) TPLL(1) CPU Clock Peripheral Clock Program Counter PC Wake Event PC + 2 PC + 4 PC + 6 OSTS bit Set Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. DS39635C-page 50  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 4.4.1 PRI_IDLE MODE This mode is unique among the three low-power Idle modes, in that it does not disable the primary device clock. For timing-sensitive applications, this allows for the fastest resumption of device operation with its more accurate primary clock source, since the clock source does not have to “warm up” or transition from another oscillator. When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval, TCSD, is required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wake-up, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 4-8). PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then clear the SCS bits and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC Configuration bits. The OSTS bit remains set (see Figure 4-7). FIGURE 4-7: TRANSITION TIMING FOR ENTRY TO PRI_IDLE MODE Q1 Q4 Q3 Q2 Q1 OSC1 CPU Clock Peripheral Clock Program Counter PC FIGURE 4-8: PC + 2 TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE Q1 Q2 Q3 Q4 OSC1 TCSD CPU Clock Peripheral Clock Program Counter PC Wake Event  2010 Microchip Technology Inc. DS39635C-page 51 PIC18F6310/6410/8310/8410 4.4.2 SEC_IDLE MODE In SEC_IDLE mode, the CPU is disabled, but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then set SCS to ‘01’ and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set. When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval of TCSD following the wake event, the CPU begins executing code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 4-8). Note: The Timer1 oscillator should already be running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the SLEEP instruction will be ignored and entry to SEC_IDLE mode will not occur. If the Timer1 oscillator is enabled, but not yet running, peripheral clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result. 4.4.3 RC_IDLE MODE In RC_IDLE mode, the CPU is disabled, but the peripherals continue to be clocked from the internal oscillator block using the INTOSC multiplexer. This mode allows for controllable power conservation during Idle periods. From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then set the SCS1 bit and execute SLEEP. Although its value is ignored, it is recommended that SCS0 also be cleared; this is to maintain software compatibility with future devices. The INTOSC multiplexer may be used to select a higher clock frequency by modifying the IRCF bits before executing the SLEEP instruction. When the clock source is switched to the INTOSC multiplexer, the primary oscillator is shut down and the OSTS bit is cleared. If the IRCF bits are set to any non-zero value, or the INTSRC bit is set, the INTOSC output is enabled. The IOFS bit becomes set after the INTOSC output becomes stable, after an interval of TIOBST (Parameter 39, Table 27-12). Clocks to the peripherals continue while the INTOSC source stabilizes. If the IRCF bits were previously at a non-zero value, or INTSRC was set before the SLEEP instruction was executed and the INTOSC source was already stable, the IOFS bit will remain set. If the IRCF bits and INTSRC are all clear, the INTOSC output will not be enabled; the IOFS bit will remain clear and there will be no indication of the current clock source. When a wake event occurs, the peripherals continue to be clocked from the INTOSC multiplexer. After a delay of TCSD following the wake event, the CPU begins executing code, being clocked by the INTOSC multiplexer. The IDLEN and SCS bits are not affected by the wake-up. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. DS39635C-page 52  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 4.5 Exiting Idle and Sleep Modes An exit from Sleep mode or any of the Idle modes is triggered by an interrupt, a Reset or a WDT time-out. This section discusses the triggers that cause exits from power-managed modes. The clocking subsystem actions are discussed in each of the power-managed modes (see Section 4.2 “Run Modes” through Section 4.4 “Idle Modes”). 4.5.1 EXIT BY INTERRUPT Any of the available interrupt sources can cause the device to exit from an Idle or Sleep mode to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The exit sequence is initiated when the corresponding interrupt flag bit is set. On all exits from Idle or Sleep modes by interrupt, code execution branches to the interrupt vector if the GIE/GIEH bit (INTCON) is set. Otherwise, code execution continues or resumes without branching (see Section 10.0 “Interrupts”). A fixed delay of interval, TCSD, following the wake event, is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. 4.5.2 EXIT BY WDT TIME-OUT A WDT time-out will cause different actions depending on which power-managed mode the device is in when the time-out occurs. If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power-managed mode (see Section 4.2 “Run Modes” and Section 4.3 “Sleep Mode”). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 24.2 “Watchdog Timer (WDT)”). The WDT timer and postscaler are cleared by executing a SLEEP or CLRWDT instruction, losing a currently selected clock source (if the Fail-Safe Clock Monitor is enabled) and modifying the IRCF bits in the OSCCON register if the internal oscillator block is the device clock source.  2010 Microchip Technology Inc. 4.5.3 EXIT BY RESET Normally, the device is held in Reset by the Oscillator Start-up Timer (OST) until the primary clock becomes ready. At that time, the OSTS bit is set and the device begins executing code. If the internal oscillator block is the new clock source, the IOFS bit is set instead. The exit delay time from Reset to the start of code execution depends on both the clock sources before and after the wake-up and the type of oscillator if the new clock source is the primary clock. Exit delays are summarized in Table 4-2. Code execution can begin before the primary clock becomes ready. If either the Two-Speed Start-up (see Section 24.3 “Two-Speed Start-up”) or Fail-Safe Clock Monitor (see Section 24.4 “Fail-Safe Clock Monitor”) is enabled, the device may begin execution as soon as the Reset source has cleared. Execution is clocked by the INTOSC multiplexer driven by the internal oscillator block. Execution is clocked by the internal oscillator block until either the primary clock becomes ready, or a power-managed mode is entered before the primary clock becomes ready; the primary clock is then shut down. 4.5.4 EXIT WITHOUT AN OSCILLATOR START-UP DELAY Certain exits from power-managed modes do not invoke the OST at all. There are two cases: • PRI_IDLE mode, where the primary clock source is not stopped; and • the primary clock source is not any of the LP, XT, HS or HSPLL modes. In these instances, the primary clock source either does not require an oscillator start-up delay since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (RC, EC and INTIO Oscillator modes). However, a fixed delay of interval, TCSD, following the wake event, is still required when leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. DS39635C-page 53 PIC18F6310/6410/8310/8410 TABLE 4-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE (BY CLOCK SOURCES) Clock Source Before Wake-up Clock Source After Wake-up Exit Delay LP, XT, HS Primary Device Clock (PRI_IDLE mode) HSPLL EC, RC, INTRC(1) OSTS TCSD (2) — INTOSC(3) T1OSC or INTRC(1) TOST(4) HSPLL TOST + trc(4) EC, RC, INTRC(1) TCSD(2) INTOSC INTOSC(3) 3: 4: 5: — IOFS TOST(5) HSPLL TOST + trc(4) EC, RC, INTRC(1) TCSD(2) — None IOFS INTOSC Note 1: 2: TIOBST (5) OSTS LP, XT, HS (2) None (Sleep mode) IOFS LP, XT, HS (2) Clock Ready Status Bit (OSCCON) OSTS LP, XT, HS TOST(4) HSPLL TOST + trc(4) EC, RC, INTRC(1) TCSD(2) — INTOSC(2) TIOBST(5) IOFS OSTS In this instance, refers specifically to the 31 kHz INTRC clock source. TCSD (Parameter 38) is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other required delays (see Section 4.4 “Idle Modes”). Includes both the INTOSC 8 MHz source and postscaler derived frequencies. TOST is the Oscillator Start-up Timer (Parameter 32). trc is the PLL Lock-out Timer (Parameter F12); it is also designated as TPLL. Execution continues during TIOBST (Parameter 39), the INTOSC stabilization period. DS39635C-page 54  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 5.0 RESET 5.1 The PIC18F6310/6410/8310/8410 devices differentiate between various kinds of Reset: a) b) c) d) e) f) g) h) Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during power-managed modes Watchdog Timer (WDT) Reset (during execution) Programmable Brown-out Reset (BOR) RESET Instruction Stack Full Reset Stack Underflow Reset This section discusses Resets generated by MCLR, POR and BOR and covers the operation of the various start-up timers. Stack Reset events are covered in Section 6.1.3.4 “Stack Full and Underflow Resets”. WDT Resets are covered in Section 24.2 “Watchdog Timer (WDT)”. RCON Register Device Reset events are tracked through the RCON register (Register 5-1). The lower five bits of the register indicate that a specific Reset event has occurred. In most cases, these bits can only be set by the event and must be cleared by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 5.6 “Reset State of Registers”. The RCON register also has control bits for setting interrupt priority (IPEN) and software control of the BOR (SBOREN). Interrupt priority is discussed in Section 10.0 “Interrupts”. BOR is covered in Section 5.4 “Brown-out Reset (BOR)”. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 5-1. FIGURE 5-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT RESET Instruction Stack Full/Underflow Reset Stack Pointer External Reset MCLR MCLRE ( )_IDLE Sleep WDT Time-out VDD Rise Detect VDD POR Pulse Brown-out Reset BOREN S OST/PWRT OST 1024 Cycles 10-Bit Ripple Counter Chip_Reset R Q OSC1 32 s INTRC PWRT 65.5 ms 11-Bit Ripple Counter Enable PWRT Enable OST(1) Note 1: See Table 5-2 for time-out situations.  2010 Microchip Technology Inc. DS39635C-page 55 PIC18F6310/6410/8310/8410 REGISTER 5-1: RCON: RESET CONTROL REGISTER R/W-0 R/W-0(1) U-0 R/W-1 R-1 R-1 R/W-0 R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: BOR Software Enable bit(1) If BOREN = 01: 1 = BOR is enabled 0 = BOR is disabled If BOREN = 00, 10 or 11: Bit is disabled and read as ‘0’. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit 1 = The RESET instruction was not executed (set by firmware only) 0 = The RESET instruction was executed causing a device Reset (must be set in software after a Brown-out Reset occurs) bit 3 TO: Watchdog Timer Time-out Flag bit 1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 2 PD: Power-Down Detection Flag bit 1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction bit 1 POR: Power-on Reset Status bit 1 = A Power-on Reset has not occurred (set by firmware only) 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’. Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected, so that subsequent Power-on Resets may be detected. 2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to ‘1’ by software immediately after a Power-on Reset). DS39635C-page 56  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 5.2 Master Clear (MCLR) The MCLR pin provides a method for triggering a hard external Reset of the device. A Reset is generated by holding the pin low. PIC18 Extended MCU devices have a noise filter in the MCLR Reset path which detects and ignores small pulses. The MCLR pin is not driven low by any internal Resets, including the WDT. In PIC18F6310/6410/8310/8410 devices, the MCLR input can be disabled with the MCLRE Configuration bit. When MCLR is disabled, the pin becomes a digital input. See Section 11.7 “PORTG, TRISG and LATG Registers” for more information. 5.3 POR events are captured by the POR bit (RCON). The state of the bit is set to ‘0’ whenever a POR occurs; it does not change for any other Reset event. POR is not reset to ‘1’ by any hardware event. To capture multiple events, the user manually resets the bit to ‘1’ in software following any POR. FIGURE 5-2: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) VDD VDD D(1) R(2) R1(3) Power-on Reset (POR) A Power-on Reset pulse is generated on-chip whenever VDD rises above a certain threshold. This allows the device to start in the initialized state when VDD is adequate for operation. C MCLR PIC18FXXXX To take advantage of the POR circuitry, tie the MCLR pin through a resistor (1 k to 10 k) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise rate for VDD is specified (Parameter D004). For a slow rise time, see Figure 5-2. Note 1: External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode, D, helps discharge the capacitor quickly when VDD powers down. 2: R < 40 k is recommended to make sure that the voltage drop across R does not violate the device’s electrical specification. When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. 3: R1  1 k will limit any current flowing into MCLR from external capacitor, C, in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS).  2010 Microchip Technology Inc. DS39635C-page 57 PIC18F6310/6410/8310/8410 5.4 Brown-out Reset (BOR) PIC18F6310/6410/8310/8410 devices implement a BOR circuit that provides the user with a number of configuration and power-saving options. The BOR is controlled by the BORV and BOREN Configuration bits. There are a total of four BOR configurations, which are summarized in Table 5-1. The BOR threshold is set by the BORV bits. If BOR is enabled (any values of BOREN except ‘00’), any drop of VDD below VBOR (Parameter D005) for greater than TBOR (Parameter 35) will reset the device. A Reset may or may not occur if VDD falls below VBOR for less than TBOR. The chip will remain in Brown-out Reset until VDD rises above VBOR. If the Power-up Timer is enabled, it will be invoked after VDD rises above VBOR; it then will keep the chip in Reset for an additional time delay, TPWRT (Parameter 33). If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above VBOR, the Power-up Timer will execute the additional time delay. BOR and the Power-up Timer (PWRT) are independently configured. Enabling the Brown-out Reset does not automatically enable the PWRT. 5.4.1 SOFTWARE ENABLED BOR When BOREN = 01, the BOR can be enabled or disabled by the user in software. This is done with the control bit, SBOREN (RCON). Setting SBOREN enables the BOR to function as previously described. Clearing SBOREN disables the BOR entirely. The SBOREN bit operates only in this mode; otherwise, it is read as ‘0’. TABLE 5-1: Placing the BOR under software control gives the user the additional flexibility of tailoring the application to its environment without having to reprogram the device to change the BOR configuration. It also allows the user to tailor device power consumption in software by eliminating the incremental current that the BOR consumes. While the BOR current is typically very small, it may have some impact in low-power applications. Note: 5.4.2 Even when BOR is under software control, the Brown-out Reset voltage level is still set by the BORV Configuration bits. It cannot be changed in software. DETECTING BOR When Brown-out Reset is enabled, the BOR bit always resets to ‘0’ on any BOR or POR event. This makes it difficult to determine if a Brown-out Reset event has occurred just by reading the state of BOR alone. A more reliable method is to simultaneously check the state of both POR and BOR. This assumes that the POR bit is reset to ‘1’ in software immediately after any POR event. If BOR is ‘0’ while POR is ‘1’, it can be reliably assumed that a BOR event has occurred. 5.4.3 DISABLING BOR IN SLEEP MODE When BOREN = 10, the BOR remains under hardware control and operates as previously described. Whenever the device enters Sleep mode, however, the BOR is automatically disabled. When the device returns to any other operating mode, BOR is automatically re-enabled. This mode allows for applications to recover from brown-out situations, while actively executing code, when the device requires BOR protection the most. At the same time, it saves additional power in Sleep mode by eliminating the small incremental BOR current. BOR CONFIGURATIONS BOR Configuration BOREN1 BOREN0 Status of SBOREN (RCON) 0 0 Unavailable 0 1 Available 1 0 Unavailable BOR is enabled in hardware and active during the Run and Idle modes; disabled during Sleep mode. 1 1 Unavailable BOR is enabled in hardware; must be disabled by reprogramming the Configuration bits. DS39635C-page 58 BOR Operation BOR is disabled; must be enabled by reprogramming the Configuration bits. BOR is enabled in software; operation controlled by SBOREN.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 5.5 5.5.3 Device Reset Timers PIC18F6310/6410/8310/8410 devices incorporate three separate on-chip timers that help regulate the Power-on Reset process. Their main function is to ensure that the device clock is stable before code is executed. These timers are: • Power-up Timer (PWRT) • Oscillator Start-up Timer (OST) • PLL Lock Time-out 5.5.1 With the PLL enabled in its PLL mode, the time-out sequence following a Power-on Reset is slightly different from other oscillator modes. A separate timer is used to provide a fixed time-out that is sufficient for the PLL to lock to the main oscillator frequency. This PLL lock time-out (TPLL) is typically 2 ms and follows the oscillator start-up time-out. 5.5.4 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: POWER-UP TIMER (PWRT) The Power-up Timer (PWRT) of the PIC18F6310/6410/8310/8410 devices is an 11-bit counter which uses the INTRC source as the clock input. This yields an approximate time interval of 2048 x 32 s = 65.6 ms. While the PWRT is counting, the device is held in Reset. The power-up time delay depends on the INTRC clock and will vary from chip to chip due to temperature and process variation. See DC Parameter 33 for details. The PWRT is enabled by clearing the PWRTEN Configuration bit. 5.5.2 PLL LOCK TIME-OUT OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over (Parameter 33). This ensures that the crystal oscillator or resonator has started and is stabilized. 1. 2. After the POR pulse has cleared, PWRT time-out is invoked (if enabled). Then, the OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. Figure 5-3, Figure 5-4, Figure 5-5, Figure 5-6 and Figure 5-7 all depict time-out sequences on power-up, with the Power-up Timer enabled and the device operating in HS Oscillator mode. Figures 5-3 through 5-6 also apply to devices operating in XT or LP modes. For devices in RC mode and with the PWRT disabled, on the other hand, there will be no time-out at all. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, all time-outs will expire. Bringing MCLR high will begin execution immediately (Figure 5-5). This is useful for testing purposes or to synchronize more than one PIC18FXXXX device operating in parallel. The OST time-out is invoked only for XT, LP, HS and HSPLL modes, and only on Power-on Reset or on exit from most power-managed modes. TABLE 5-2: TIME-OUT IN VARIOUS SITUATIONS Power-up(2) and Brown-out Oscillator Configuration HSPLL PWRTEN = 0 66 ms(1) + 1024 TOSC + 2 ms(2) PWRTEN = 1 Exit from Power-Managed Mode 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC EC, ECIO 66 ms(1) — — RC, RCIO ms(1) — — (1) — — 66 INTIO1, INTIO2 Note 1: 2: 66 ms 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay. 2 ms is the nominal time required for the PLL to lock.  2010 Microchip Technology Inc. DS39635C-page 59 PIC18F6310/6410/8310/8410 FIGURE 5-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT) VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 5-4: VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 5-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET DS39635C-page 60  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 5-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT) 5V VDD 1V 0V MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD) FIGURE 5-7: VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT OST TIME-OUT TOST TPLL PLL TIME-OUT INTERNAL RESET Note: TOST = 1024 clock cycles. TPLL  2 ms max. First three stages of the PWRT timer.  2010 Microchip Technology Inc. DS39635C-page 61 PIC18F6310/6410/8310/8410 5.6 Reset State of Registers Most registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other Resets. The other registers are forced to a “Reset state” depending on the type of Reset that occurred. Table 5-4 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI, TO, PD, POR and BOR, are set or cleared differently in different Reset situations, as indicated in Table 5-3. These bits are used in software to determine the nature of the Reset. TABLE 5-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR RCON REGISTER RCON Register STKPTR Register Program Counter SBOREN RI TO PD 0000h 1 1 1 1 0 0 0 0 RESET Instruction 0000h u(2) 0 u u u u u u Brown-out Reset 0000h u(2) 1 1 1 u 0 u u MCLR Reset during Power-Managed Run Modes 0000h u(2) u 1 u u u u u MCLR Reset during Power-Managed Idle Modes and Sleep Mode 0000h u(2) u 1 0 u u u u WDT Time-out during Full-Power or Power-Managed Run Modes 0000h u(2) u 0 u u u u u MCLR Reset during Full-Power Execution 0000h u(2) u u u u u u u Stack Full Reset (STVREN = 1) 0000h u(2) u u u u u 1 u Stack Underflow Reset (STVREN = 1) 0000h u(2) u u u u u u 1 Stack Underflow Error (not an actual Reset, STVREN = 0) 0000h u(2) u u u u u u 1 WDT Time-out during Power-Managed Idle or Sleep Modes PC + 2 u(2) u 0 0 u u u u PC + 2(1) u(2) u u 0 u u u u Condition Power-on Reset Interrupt Exit from Power-Managed Modes POR BOR STKFUL STKUNF Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the interrupt vector (008h or 0018h). 2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled (BOREN Configuration bits = 01 and SBOREN = 1); otherwise, the Reset state is ‘0’. DS39635C-page 62  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 5-4: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets WDT Reset RESET Instruction Stack Resets Wake-up via WDT or Interrupt TOSU 6X10 8X10 ---0 0000 ---0 0000 ---0 uuuu(3) TOSH 6X10 8X10 0000 0000 0000 0000 uuuu uuuu(3) TOSL 6X10 8X10 0000 0000 0000 0000 uuuu uuuu(3) STKPTR 6X10 8X10 uu-0 0000 00-0 0000 uu-u uuuu(3) PCLATU 6X10 8X10 ---0 0000 ---0 0000 ---u uuuu PCLATH 6X10 8X10 0000 0000 0000 0000 uuuu uuuu PCL 6X10 8X10 0000 0000 0000 0000 PC + 2(2) TBLPTRU 6X10 8X10 --00 0000 --00 0000 --uu uuuu TBLPTRH 6X10 8X10 0000 0000 0000 0000 uuuu uuuu TBLPTRL 6X10 8X10 0000 0000 0000 0000 uuuu uuuu TABLAT 6X10 8X10 0000 0000 0000 0000 uuuu uuuu PRODH 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PRODL 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu INTCON 6X10 8X10 0000 000x 0000 000u uuuu uuuu(1) INTCON2 6X10 8X10 1111 1111 1111 1111 uuuu uuuu(1) INTCON3 6X10 8X10 1100 0000 1100 0000 uuuu uuuu(1) INDF0 6X10 8X10 N/A N/A N/A POSTINC0 6X10 8X10 N/A N/A N/A POSTDEC0 6X10 8X10 N/A N/A N/A PREINC0 6X10 8X10 N/A N/A N/A PLUSW0 6X10 8X10 N/A N/A N/A FSR0H 6X10 8X10 ---- xxxx ---- uuuu ---- uuuu FSR0L 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu WREG 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu INDF1 6X10 8X10 N/A N/A N/A POSTINC1 6X10 8X10 N/A N/A N/A POSTDEC1 6X10 8X10 N/A N/A N/A PREINC1 6X10 8X10 N/A N/A N/A PLUSW1 6X10 8X10 N/A N/A N/A FSR1H 6X10 8X10 ---- xxxx ---- uuuu ---- uuuu FSR1L 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu BSR 6X10 8X10 ---- 0000 ---- 0000 ---- uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 5-3 for Reset value for specific condition. 5: Bits, 6 and 7 of PORTA, LATA and TRISA, are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’.  2010 Microchip Technology Inc. DS39635C-page 63 PIC18F6310/6410/8310/8410 TABLE 5-4: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets WDT Reset RESET Instruction Stack Resets Wake-up via WDT or Interrupt INDF2 6X10 8X10 N/A N/A N/A POSTINC2 6X10 8X10 N/A N/A N/A POSTDEC2 6X10 8X10 N/A N/A N/A PREINC2 6X10 8X10 N/A N/A N/A PLUSW2 6X10 8X10 N/A N/A N/A FSR2H 6X10 8X10 ---- xxxx ---- uuuu ---- uuuu FSR2L 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu STATUS 6X10 8X10 ---x xxxx ---u uuuu ---u uuuu TMR0H 6X10 8X10 0000 0000 0000 0000 uuuu uuuu TMR0L 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu T0CON 6X10 8X10 1111 1111 1111 1111 uuuu uuuu OSCCON 6X10 8X10 0100 q000 0100 00q0 uuuu uuqu HLVDCON 6X10 8X10 0-00 0101 0-00 0101 u-uu uuuu WDTCON 6X10 8X10 ---- ---0 ---- ---0 ---- ---u RCON 6X10 8X10 0q-1 11q0 0q-q qquu uq-u qquu TMR1H 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu TMR1L 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu T1CON 6X10 8X10 0000 0000 u0uu uuuu uuuu uuuu TMR2 6X10 8X10 1111 1111 0000 0000 uuuu uuuu PR2 6X10 8X10 -000 0000 -111 1111 -111 1111 T2CON 6X10 8X10 -000 0000 -000 0000 -uuu uuuu SSPBUF 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu SSPADD 6X10 8X10 0000 0000 0000 0000 uuuu uuuu SSPSTAT 6X10 8X10 0000 0000 0000 0000 uuuu uuuu SSPCON1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu SSPCON2 6X10 8X10 0000 0000 0000 0000 uuuu uuuu ADRESH 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu ADRESL 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu ADCON0 6X10 8X10 --00 0000 --00 0000 --uu uuuu ADCON1 6X10 8X10 --00 qqqq --00 0000 --uu uuuu ADCON2 6X10 8X10 0-00 0000 0-00 0000 u-uu uuuu (4) Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 5-3 for Reset value for specific condition. 5: Bits, 6 and 7 of PORTA, LATA and TRISA, are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. DS39635C-page 64  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 5-4: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets WDT Reset RESET Instruction Stack Resets Wake-up via WDT or Interrupt CCPR1H 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu CCPR1L 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 6X10 8X10 --00 0000 --00 0000 --uu uuuu CCPR2H 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu CCPR2L 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu CCP2CON 6X10 8X10 --00 0000 --00 0000 --uu uuuu CCPR3H 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu CCPR3L 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu CCP3CON 6X10 8X10 --00 0000 --00 0000 --uu uuuu CVRCON 6X10 8X10 0000 0000 0000 0000 uuuu uuuu CMCON 6X10 8X10 0000 0111 0000 0111 uuuu uuuu TMR3H 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu TMR3L 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu T3CON 6X10 8X10 0000 0000 uuuu uuuu uuuu uuuu PSPCON 6X10 8X10 0000 ---- 0000 ---- uuuu ---- SPBRG1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu RCREG1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu TXREG1 6X10 8X10 xxxx xxxx 0000 0000 uuuu uuuu TXSTA1 6X10 8X10 0000 0010 0000 0010 uuuu uuuu RCSTA1 6X10 8X10 0000 000x 0000 000x uuuu uuuu IPR3 6X10 8X10 --11 ---1 --11 ---1 --uu ---u PIR3 6X10 8X10 --00 ---0 --00 ---0 --uu ---u(1) PIE3 6X10 8X10 --00 ---0 --00 ---0 --uu ---u IPR2 6X10 8X10 11-- 1111 11-- 1111 uu-- uuuu PIR2 6X10 8X10 00-- 0000 00-- 0000 uu-- uuuu(1) PIE2 6X10 8X10 00-- 0000 00-- 0000 uu-- uuuu IPR1 6X10 8X10 1111 1111 1111 1111 uuuu uuuu PIR1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu(1) PIE1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu MEMCON 6X10 8X10 0-00 --00 0-00 --00 u-uu --uu OSCTUNE 6X10 8X10 00-0 0000 00-0 0000 uu-u uuuu TRISJ 6X10 8X10 1111 1111 1111 1111 uuuu uuuu TRISH 6X10 8X10 1111 1111 1111 1111 uuuu uuuu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 5-3 for Reset value for specific condition. 5: Bits, 6 and 7 of PORTA, LATA and TRISA, are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’.  2010 Microchip Technology Inc. DS39635C-page 65 PIC18F6310/6410/8310/8410 TABLE 5-4: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets WDT Reset RESET Instruction Stack Resets Wake-up via WDT or Interrupt TRISG 6X10 8X10 ---1 1111 ---1 1111 ---u uuuu TRISF 6X10 8X10 1111 1111 1111 1111 uuuu uuuu TRISE 6X10 8X10 1111 1111 1111 1111 uuuu uuuu TRISD 6X10 8X10 1111 1111 1111 1111 uuuu uuuu TRISC 6X10 8X10 1111 1111 1111 1111 uuuu uuuu TRISB 6X10 8X10 1111 1111 1111 1111 (5) (5) uuuu uuuu (5) uuuu uuuu(5) TRISA 6X10 8X10 1111 1111 LATJ 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATH 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATG 6X10 8X10 ---x xxxx ---u uuuu ---u uuuu 1111 1111 LATF 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATE 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATD 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATC 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATB 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu LATA(5) 6X10 8X10 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5) PORTJ 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTH 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTG 6X10 8X10 --xx xxxx --uu uuuu --uu uuuu PORTF 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTE 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTD 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTC 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu PORTB 6X10 8X10 xxxx xxxx uuuu uuuu uuuu uuuu (5) 0000(5) 0000(5) uuuu uuuu(5) PORTA 6X10 8X10 xx0x SPBRGH1 6X10 8X10 0000 0000 0000 0000 uuuu uuuu BAUDCON1 6X10 8X10 0100 0-00 0100 0-00 uuuu u-uu SPBRG2 6X10 8X10 0000 0000 0000 0000 uuuu uuuu RCREG2 6X10 8X10 0000 0000 0000 0000 uuuu uuuu TXREG2 6X10 8X10 xxxx xxxx 0000 0000 uuuu uuuu TXSTA2 6X10 8X10 0000 -010 0000 -010 uuuu -uuu RCSTA2 6X10 8X10 0000 000x 0000 000x uuuu uuuu uu0u Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 5-3 for Reset value for specific condition. 5: Bits, 6 and 7 of PORTA, LATA and TRISA, are enabled depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. DS39635C-page 66  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.0 MEMORY ORGANIZATION 6.1 There are two types of memory in PIC18 Flash microcontroller devices: • Program Memory • Data RAM As Harvard architecture devices, the data and program memories use separate busses; this allows for concurrent access of the two memory spaces. Additional detailed information on the operation of the Flash program memory is provided in Section 7.0 “Program Memory”. Program Memory Organization PIC18 microcontrollers implement a 21-bit program counter, which is capable of addressing a 2-Mbyte program memory space. Accessing a location between the upper boundary of the physically implemented memory and the 2-Mbyte address will return all ‘0’s (a NOP instruction). The PIC18F6310 and PIC18F8310 each have 8 Kbytes of Flash memory and can store up to 4,096 single-word instructions. The PIC18F6410 and PIC18F8410 each have 16 Kbytes of Flash memory and can store up to 8,192 single-word instructions. PIC18 devices have two interrupt vectors. The Reset vector address is at 0000h and the interrupt vector addresses are at 0008h and 0018h. The program memory maps for the PIC18F6310/6410/8310/8410 devices are shown in Figure 6-1. FIGURE 6-1: PROGRAM MEMORY MAP AND STACK FOR PIC18F6310/6410/8310/8410 DEVICES PIC18FX310 PIC18FX410 PC 21 CALL,RCALL,RETURN RETFIE,RETLW Stack Level 1 PC 21 CALL,RCALL,RETURN RETFIE,RETLW Stack Level 1       Stack Level 31 Stack Level 31 Reset Vector 0000h Reset Vector 0000h High-Priority Interrupt Vector 0008h High-Priority Interrupt Vector 0008h Low-Priority Interrupt Vector 0018h Low-Priority Interrupt Vector 0018h On-Chip Program Memory User Memory Space 3FFFh 4000h Read ‘0’ Read ‘0’ 1FFFFFh  2010 Microchip Technology Inc. On-Chip Program Memory User Memory Space 1FFFh 2000h 1FFFFFh DS39635C-page 67 PIC18F6310/6410/8310/8410 6.1.1 PIC18F8310/8410 PROGRAM MEMORY MODES In addition to available on-chip Flash program memory, 80-pin devices in this family can also address up to 2 Mbytes of external program memory through an external memory interface. There are four distinct operating modes available to the controllers: • • • • Microprocessor (MP) Microprocessor with Boot Block (MPBB) Extended Microcontroller (EMC) Microcontroller (MC) The program memory mode is determined by setting the two Least Significant bits of the CONFIG3L Configuration byte, as shown in Register 6-1. (See also Section 24.1 “Configuration Bits” for additional details on the device Configuration bits.) The program memory modes operate as follows: • The Microcontroller Mode accesses only on-chip Flash memory. Attempts to read above the physical limit of the on-chip Flash (3FFFh) causes a read of all ‘0’s (a NOP instruction). The Microcontroller mode is also the only operating mode available to PIC18F6310 and PIC18F6410 devices. REGISTER 6-1: • The Extended Microcontroller Mode allows access to both internal and external program memories as a single block. The device can access its entire on-chip Flash memory; above this, the device accesses external program memory up to the 2-Mbyte program space limit. As with Boot Block mode, execution automatically switches between the two memories as required. • The Microprocessor Mode permits access only to external program memory; the contents of the on-chip Flash memory is ignored. The 21-bit program counter permits access to the entire 2-Mbyte linear program memory space. • The Microprocessor with Boot Block Mode accesses on-chip Flash memory from addresses 000000h to 0007FFh. Above this, external program memory is accessed all the way up to the 2-Mbyte limit. Program execution automatically switches between the two memories as required. In all modes, the microcontroller has complete access to data RAM. Figure 6-2 compares the memory maps of the different program memory modes. The differences between on-chip and external memory access limitations are more fully explained in Table 6-1. CONFIG3L: CONFIGURATION BYTE REGISTER LOW R/P-1 R/P-1 U-0 U-0 U-0 U-0 R/P-1 R/P-1 WAIT BW — — — — PM1 PM0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value after erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WAIT: External Bus Data Wait Enable bit 1 = Wait selections unavailable, device will not wait 0 = Wait programmed by WAIT1 and WAIT0 bits of MEMCOM register (MEMCOM) bit 6 BW: External Bus Data Width Select bit 1 = 16-bit external bus data width 0 = 8-bit external bus data width bit 5-2 Unimplemented: Read as ‘0’ bit 1-0 PM: Processor Data Memory Mode Select bits 11 = Microcontroller mode 10 = Microprocessor mode(1) 01 = Microcontroller with Boot Block mode(1) 00 = Extended Microcontroller mode(1) Note 1: This mode is available only on PIC18F8410 devices. DS39635C-page 68  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 6-2: MEMORY MAPS FOR PIC18FX310/X410 PROGRAM MEMORY MODES Microcontroller Mode(1) Extended Microcontroller Mode(2) 000000h 000000h On-Chip Program Memory On-Chip Program Memory (Top of Memory) (Top of Memory) + 1 (Top of Memory) (Top of Memory) + 1 Reads ‘0’s External Program Memory 1FFFFFh 1FFFFFh On-Chip Flash External Memory Microprocessor Mode(2) 000000h On-Chip Flash Microprocessor with Boot Block Mode(2) On-Chip Program Memory 000000h 0007FFh 000800h (No access) On-Chip Program Memory (No access) (Top of Memory) + 1 External Program Memory External Program Memory 1FFFFFh 1FFFFFh External Memory Legend: Note 1: 2: External Memory On-Chip Flash On-Chip Flash (Top of Memory) represents upper boundary of on-chip program memory space (1FFFh for PIC18FX310, 3FFFh for PIC18FX410). Shaded areas represent unimplemented or inaccessible areas, depending on the mode. This mode is the only available mode on 64-pin devices and the default on 80-pin devices. These modes are only available on 80-pin devices. TABLE 6-1: MEMORY ACCESS FOR PIC18F8310/8410 PROGRAM MEMORY MODES Internal Program Memory Operating Mode External Program Memory Execution From Table Read From Table Write To Execution From Table Read From Table Write To Microcontroller Yes Yes Yes No Access No Access No Access Extended Microcontroller Yes Yes Yes Yes Yes Yes Microprocessor No Access No Access No Access Yes Yes Yes Microprocessor w/Boot Block Yes Yes Yes Yes Yes Yes  2010 Microchip Technology Inc. DS39635C-page 69 PIC18F6310/6410/8310/8410 6.1.2 PROGRAM COUNTER The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 21 bits wide and is contained in three separate 8-bit registers. The low byte, known as the PCL register, is both readable and writable. The high byte, or PCH register, contains the PC bits; it is not directly readable or writable. Updates to the PCH register are performed through the PCLATH register. The upper byte is called PCU. This register contains the PC bits; it is also not directly readable or writable. Updates to the PCU register are performed through the PCLATU register. The contents of PCLATH and PCLATU are transferred to the program counter by any operation that writes PCL. Similarly, the upper two bytes of the program counter are transferred to PCLATH and PCLATU by an operation that reads PCL. This is useful for computed offsets to the PC (see Section 6.1.5.1 “Computed GOTO”). The PC addresses bytes in the program memory. To prevent the PC from becoming misaligned with word instructions, the Least Significant bit of PCL is fixed to a value of ‘0’. The PC increments by 2 to address sequential instructions in the program memory. The CALL, RCALL, GOTO and program branch instructions write to the program counter directly. For these instructions, the contents of PCLATH and PCLATU are not transferred to the program counter. 6.1.3 RETURN ADDRESS STACK The Return Address Stack allows any combination of up to 31 program calls and interrupts to occur. The PC is pushed onto the stack when a CALL or RCALL instruction is executed, or an interrupt is Acknowledged. The PC value is pulled off the stack on a RETURN, RETLW or a RETFIE instruction. PCLATU and PCLATH are not affected by any of the RETURN or CALL instructions. FIGURE 6-3: The stack operates as a 31-word by 21-bit RAM and a 5-bit Stack Pointer register, STKPTR. The stack space is not part of either program or data space. The Stack Pointer is readable and writable and the address on the top of the stack is readable and writable through the Top-of-Stack (TOS) Special File Registers. Data can also be pushed to or popped from the stack using these registers. A CALL type instruction causes a push onto the stack; the Stack Pointer is first incremented and the location pointed to by the Stack Pointer is written with the contents of the PC (already pointing to the instruction following the CALL). A RETURN type instruction causes a pop from the stack; the contents of the location pointed to by the STKPTR are transferred to the PC and then the Stack Pointer is decremented. The Stack Pointer is initialized to ‘00000’ after all Resets. There is no RAM associated with the location corresponding to a Stack Pointer value of ‘00000’; this is only a Reset value. Status bits indicate if the stack is full, has overflowed or has underflowed. 6.1.3.1 Top-of-Stack Access Only the top of the Return Address Stack (TOS) is readable and writable. A set of three registers, TOSU:TOSH:TOSL, hold the contents of the stack location pointed to by the STKPTR register (Figure 6-3). This allows users to implement a software stack if necessary. After a CALL, RCALL or interrupt, the software can read the pushed value by reading the TOSU:TOSH:TOSL registers. These values can be placed on a user-defined software stack. At return time, the software can return these values to TOSU:TOSH:TOSL and do a return. The user must disable the global interrupt enable bits while accessing the stack to prevent inadvertent stack corruption. RETURN ADDRESS STACK AND ASSOCIATED REGISTERS Return Address Stack Stack Pointer Top-of-Stack Registers TOSU 00h TOSH 1Ah 11111 11110 11101 TOSL 34h Top-of-Stack DS39635C-page 70 001A34h 000D58h STKPTR 00010 00011 00010 00001 00000  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.1.3.2 Return Stack Pointer (STKPTR) When the stack has been popped enough times to unload the stack, the next pop will return a value of zero to the PC and sets the STKUNF bit, while the Stack Pointer remains at zero. The STKUNF bit will remain set until cleared by software, or until a POR occurs. The STKPTR register (Register 6-2) contains the Stack Pointer value, the STKFUL (Stack Full) status bit and the STKUNF (Stack Underflow) status bit. The value of the Stack Pointer can be 0 through 31. The Stack Pointer increments before values are pushed onto the stack and decrements after values are popped off the stack. On Reset, the Stack Pointer value will be zero. The user may read and write the Stack Pointer value. This feature can be used by a Real-Time Operating System for return stack maintenance. Note: After the PC is pushed onto the stack 31 times (without popping any values off the stack), the STKFUL bit is set. The STKFUL bit is cleared by software or by a POR. 6.1.3.3 PUSH and POP Instructions Since the Top-of-Stack is readable and writable, the ability to push values onto the stack and pull values off the stack, without disturbing normal program execution, is a desirable feature. The PIC18 instruction set includes two instructions, PUSH and POP, that permit the TOS to be manipulated under software control. TOSU, TOSH and TOSL can be modified to place data or a return address on the stack. The action that takes place when the stack becomes full depends on the state of the STVREN (Stack Overflow Reset Enable) Configuration bit. (Refer to Section 24.1 “Configuration Bits” for a description of the device Configuration bits.) If STVREN is set (default), the 31st push will push the (PC + 2) value onto the stack, set the STKFUL bit and reset the device. The STKFUL bit will remain set and the Stack Pointer will be set to zero. The PUSH instruction places the current PC value onto the stack. This increments the Stack Pointer and loads the current PC value onto the stack. If STVREN is cleared, the STKFUL bit will be set on the 31st push and the Stack Pointer will increment to 31. Any additional pushes will not overwrite the 31st push and STKPTR will remain at 31. REGISTER 6-2: Returning a value of zero to the PC on an underflow has the effect of vectoring the program to the Reset vector where the stack conditions can be verified and appropriate actions can be taken. This is not the same as a Reset, as the contents of the SFRs are not affected. The POP instruction discards the current TOS by decrementing the Stack Pointer. The previous value pushed onto the stack then becomes the TOS value. STKPTR: STACK POINTER REGISTER R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ C = Clearable bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 STKFUL: Stack Full Flag bit(1) 1 = Stack became full or overflowed 0 = Stack has not become full or overflowed bit 6 STKUNF: Stack Underflow Flag bit(1) 1 = Stack underflow occurred 0 = Stack underflow did not occur bit 5 Unimplemented: Read as ‘0’ bit 4-0 SP: Stack Pointer Location bits Note 1: Bit 7 and bit 6 are cleared by user software or by a POR.  2010 Microchip Technology Inc. DS39635C-page 71 PIC18F6310/6410/8310/8410 6.1.3.4 Stack Full and Underflow Resets Device Resets on stack overflow and stack underflow conditions are enabled by setting the STVREN bit in Configuration Register 4L. When STVREN is set, a full or underflow condition will set the appropriate STKFUL or STKUNF bit and then cause a device Reset. When STVREN is cleared, a full or underflow condition will set the appropriate STKFUL or STKUNF bit, but not cause a device Reset. The STKFUL or STKUNF bits are cleared by the user software or a Power-on Reset. 6.1.4 FAST REGISTER STACK A Fast Register Stack is provided for the STATUS, WREG and BSR registers to provide a “fast return” option for interrupts. This stack is only one level deep and is neither readable nor writable. It is loaded with the current value of the corresponding register when the processor vectors for an interrupt. All interrupt sources will push values into the stack registers. The values in the registers are then loaded back into the working registers if the RETFIE, FAST instruction is used to return from the interrupt. 6.1.5 LOOK-UP TABLES IN PROGRAM MEMORY There may be programming situations that require the creation of data structures, or look-up tables, in program memory. For PIC18 devices, look-up tables can be implemented in two ways: • Computed GOTO • Table Reads 6.1.5.1 Computed GOTO A computed GOTO is accomplished by adding an offset to the program counter. An example is shown in Example 6-2. A look-up table can be formed with an ADDWF PCL instruction and a group of RETLW nn instructions. The W register is loaded with an offset into the table before executing a call to that table. The first instruction of the called routine is the ADDWF PCL instruction. The next instruction executed will be one of the RETLW nn instructions that returns the value ‘nn’ to the calling function. If both low and high-priority interrupts are enabled, the stack registers cannot be used reliably to return from low-priority interrupts. If a high-priority interrupt occurs while servicing a low-priority interrupt, the stack register values stored by the low-priority interrupt will be overwritten. In these cases, users must save the key registers in software during a low-priority interrupt. The offset value (in WREG) specifies the number of bytes that the program counter should advance and should be multiples of 2 (LSb = 0). If interrupt priority is not used, all interrupts may use the Fast Register Stack for returns from interrupt. If no interrupts are used, the Fast Register Stack can be used to restore the STATUS, WREG and BSR registers at the end of a subroutine call. To use the Fast Register Stack for a subroutine call, a CALL label, FAST instruction must be executed to save the STATUS, WREG and BSR registers to the Fast Register Stack. A RETURN, FAST instruction is then executed to restore these registers from the Fast Register Stack. EXAMPLE 6-2: Example 6-1 shows a source code example that uses the Fast Register Stack during a subroutine call and return. EXAMPLE 6-1: CALL SUB1, FAST FAST REGISTER STACK CODE EXAMPLE ;STATUS, WREG, BSR ;SAVED IN FAST REGISTER ;STACK   SUB1   RETURN FAST DS39635C-page 72 ;RESTORE VALUES SAVED ;IN FAST REGISTER STACK In this method, only one data byte may be stored in each instruction location and room on the Return Address Stack is required. ORG TABLE 6.1.5.2 MOVF CALL nn00h ADDWF RETLW RETLW RETLW . . . COMPUTED GOTO USING AN OFFSET VALUE OFFSET, W TABLE PCL nnh nnh nnh Table Reads A better method of storing data in program memory allows two bytes of data to be stored in each instruction location. Look-up table data may be stored two bytes per program word while programming. The Table Pointer (TBLPTR) register specifies the byte address and the Table Latch (TABLAT) register contains the data that is read from the program memory. Data is transferred from program memory one byte at a time. Table read operation is discussed further Section 7.1 “Table Reads and Table Writes”. in  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.2 6.2.2 PIC18 Instruction Cycle 6.2.1 An “Instruction Cycle” consists of four Q cycles, Q1 through Q4. The instruction fetch and execute are pipelined in such a manner that a fetch takes one instruction cycle, while the decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 6-3). CLOCKING SCHEME The microcontroller clock input, whether from an internal or external source, is internally divided by four to generate four non-overlapping quadrature clocks (Q1, Q2, Q3 and Q4). Internally, the program counter is incremented on every Q1; the instruction is fetched from the program memory and latched into the instruction register during Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow are shown in Figure 6-4. FIGURE 6-4: INSTRUCTION FLOW/PIPELINING A fetch cycle begins with the Program Counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal Phase Clock Q3 Q4 PC PC PC + 2 PC + 4 OSC2/CLKO (RC mode) Execute INST (PC – 2) Fetch INST (PC) EXAMPLE 6-3: TCY0 TCY1 Fetch 1 Execute 1 2. MOVWF PORTB 4. BSF Execute INST (PC + 2) Fetch INST (PC + 4) INSTRUCTION PIPELINE FLOW 1. MOVLW 55h 3. BRA Execute INST (PC) Fetch INST (PC + 2) SUB_1 PORTA, BIT3 (Forced NOP) 5. Instruction @ address SUB_1 Fetch 2 TCY2 TCY3 TCY4 TCY5 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush (NOP) Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is “flushed” from the pipeline, while the new instruction is being fetched and then executed.  2010 Microchip Technology Inc. DS39635C-page 73 PIC18F6310/6410/8310/8410 6.2.3 INSTRUCTIONS IN PROGRAM MEMORY The program memory is addressed in bytes. Instructions are stored as two bytes or four bytes in program memory. The Least Significant Byte of an instruction word is always stored in a program memory location with an even address (LSb = 0). To maintain alignment with instruction boundaries, the PC increments in steps of 2 and the LSb will always read ‘0’ (see Section 6.1.2 “Program Counter”). Figure 6-5 shows an example of how instruction words are stored in the program memory. FIGURE 6-5: INSTRUCTIONS IN PROGRAM MEMORY Program Memory Byte Locations  6.2.4 The CALL and GOTO instructions have the absolute program memory address embedded into the instruction. Since instructions are always stored on word boundaries, the data contained in the instruction is a word address. The word address is written to PC, which accesses the desired byte address in program memory. Instruction #2 in Figure 6-5 shows how the instruction, GOTO 0006h, is encoded in the program memory. Program branch instructions, which encode a relative address offset, operate in the same manner. The offset value stored in a branch instruction represents the number of single-word instructions that the PC will be offset by. Section 25.0 “Instruction Set Summary” provides further details of the instruction set. Instruction 1: Instruction 2: MOVLW GOTO 055h 0006h Instruction 3: MOVFF 123h, 456h TWO-WORD INSTRUCTIONS The standard PIC18 instruction set has four two-word instructions: CALL, MOVFF, GOTO and LSFR. In all cases, the second word of the instructions always has ‘1111’ as its four Most Significant bits; the other 12 bits are literal data, usually a data memory address. The use of ‘1111’ in the 4 MSbs of an instruction specifies a special form of NOP. If the instruction is executed in proper sequence – immediately after the first word – the data in the second word is accessed EXAMPLE 6-4: LSB = 1 LSB = 0 0Fh EFh F0h C1h F4h 55h 03h 00h 23h 56h Word Address  000000h 000002h 000004h 000006h 000008h 00000Ah 00000Ch 00000Eh 000010h 000012h 000014h and used by the instruction sequence. If the first word is skipped for some reason and the second word is executed by itself, a NOP is executed instead. This is necessary for cases when the two-word instruction is preceded by a conditional instruction that changes the PC. Example 6-4 shows how this works. Note: See Section 6.5 “Data Memory and the Extended Instruction Set” for information on two-word instructions in the extended instruction set. TWO-WORD INSTRUCTIONS CASE 1: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word ADDWF REG3 ; continue code 1111 0100 0101 0110 0010 0100 0000 0000 ; Execute this word as a NOP CASE 2: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word ADDWF REG3 ; continue code 1111 0100 0101 0110 0010 0100 0000 0000 DS39635C-page 74 ; 2nd word of instruction  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.3 Note: Data Memory Organization The operation of some aspects of data memory are changed when the PIC18 extended instruction set is enabled. See Section 6.5 “Data Memory and the Extended Instruction Set” for more information. The data memory in PIC18 devices is implemented as static RAM. Each register in the data memory has a 12-bit address, allowing up to 4096 bytes of data memory. The memory space is divided into as many as 16 banks that contain 256 bytes each. PIC18F6310/6410/8310/8410 devices implement only 3 complete banks, for a total of 768 bytes. Figure 6-6 shows the data memory organization for the devices. The data memory contains Special Function Registers (SFRs) and General Purpose Registers (GPRs). The SFRs are used for control and status of the controller and peripheral functions, while GPRs are used for data storage and scratchpad operations in the user’s application. Any read of an unimplemented location will read as ‘0’s. The instruction set and architecture allow operations across all banks. The entire data memory may be accessed by Direct, Indirect or Indexed Addressing modes. Addressing modes are discussed later in this section. To ensure that commonly used registers (SFRs and select GPRs) can be accessed in a single cycle, PIC18 devices implement an Access Bank. This is a 256-byte memory space that provides fast access to SFRs and the lower portion of GPR Bank 0 without using the BSR. Section 6.3.2 “Access Bank” provides a detailed description of the Access RAM. 6.3.1 BANK SELECT REGISTER Large areas of data memory require an efficient addressing scheme to make rapid access to any address possible. Ideally, this means that an entire address does not need to be provided for each read or write operation. For PIC18 devices, this is accomplished with a RAM banking scheme. This divides the memory space into16 contiguous banks of 256 bytes. Depending on the instruction, each location can be addressed directly by its full 12-bit address, or an 8-bit low-order address and a 4-bit Bank Pointer. Most instructions in the PIC18 instruction set make use of the Bank Pointer, known as the Bank Select Register (BSR). This SFR holds the 4 Most Significant bits of a location’s address; the instruction itself includes the 8 Least Significant bits. Only the four lower bits of the BSR are implemented (BSR). The upper four bits are unused; they will always read ‘0’ and cannot be written to. The BSR can be loaded directly by using the MOVLB instruction. The value of the BSR indicates the bank in data memory; the 8 bits in the instruction show the location in the bank and can be thought of as an offset from the bank’s lower boundary. The relationship between the BSR’s value and the bank division in data memory is shown in Figure 6-7. Since up to 16 registers may share the same low-order address, the user must always be careful to ensure that the proper bank is selected before performing a data read or write. For example, writing what should be program data to an 8-bit address of F9h while the BSR is 0Fh will end up resetting the program counter. While any bank can be selected, only those banks that are actually implemented can be read or written to. Writes to unimplemented banks are ignored, while reads from unimplemented banks will return ‘0’s. Even so, the STATUS register will still be affected as if the operation was successful. The data memory map in Figure 6-6 indicates which banks are implemented. In the core PIC18 instruction set, only the MOVFF instruction fully specifies the 12-bit address of the source and target registers. This instruction ignores the BSR completely when it executes. All other instructions include only the low-order address as an operand and must use either the BSR or the Access Bank to locate their target registers.  2010 Microchip Technology Inc. DS39635C-page 75 PIC18F6310/6410/8310/8410 FIGURE 6-6: DATA MEMORY MAP FOR PIC18F6310/6410/8310/8410 DEVICES BSR 00h = 0000 = 0001 = 0010 Bank 0 FFh 00h GPR 000h 05Fh 060h 0FFh 100h GPR Bank 1 Bank 2 Access RAM 1FFh 200h FFh 00h The BSR is ignored and the Access Bank is used. The first 128 bytes are general purpose RAM (from Bank 0). The second 128 bytes are Special Function Registers (from Bank 15). When a = 1: GPR FFh 00h = 0011 When a = 0: Data Memory Map 2FFh 300h The BSR specifies the bank used by the instruction. Bank 3 Access Bank to = 1110 = 1111 DS39635C-page 76 Access RAM Low Unused Read as 00h 00h 5Fh Access RAM High 60h (SFRs) FFh Bank 14 FFh 00h Unused FFh SFR Bank 15 EFFh F00h F3Fh F40h FFFh  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 6-7: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING) BSR(1) 7 0 0 0 0 0 0 0 1 0 000h Data Memory Bank 0 100h Bank 1 Bank Select(2) 200h 300h Bank 2 00h 7 FFh 00h 11 From Opcode(2) 11 11 11 11 1 0 1 1 FFh 00h FFh 00h Bank 3 through Bank 13 E00h Bank 14 F00h FFFh Note 1: 2: 6.3.2 Bank 15 FFh 00h FFh 00h FFh The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR) to the registers of the Access Bank. The MOVFF instruction embeds the entire 12-bit address in the instruction. ACCESS BANK While the use of the BSR with an embedded 8-bit address allows users to address the entire range of data memory, it also means that the user must always ensure that the correct bank is selected. Otherwise, data may be read from or written to the wrong location. This can be disastrous if a GPR is the intended target of an operation but an SFR is written to instead. Verifying and/or changing the BSR for each read or write to data memory can become very inefficient. To streamline access for the most commonly used data memory locations, the data memory is configured with an Access Bank, which allows users to access a mapped block of memory without specifying a BSR. The Access Bank consists of the first 96 bytes of memory (00h-5Fh) in Bank 0 and the last 160 bytes of memory (60h-FFh) in Block 15. The lower half is known as the “Access RAM” and is composed of GPRs. This upper half is where the device’s SFRs are mapped. These two areas are mapped contiguously in the Access Bank and can be addressed in a linear fashion by an 8-bit address (Figure 6-6). The Access Bank is used by core PIC18 instructions that include the Access RAM bit (the ‘a’ parameter in the instruction). When ‘a’ is equal to ‘1’, the instruction uses the BSR and the 8-bit address included in the opcode for the data memory address. When ‘a’ is ‘0’, however, the instruction is forced to use the Access Bank address map; the current value of the BSR is ignored entirely.  2010 Microchip Technology Inc. Using this “forced” addressing allows the instruction to operate on a data address in a single cycle without updating the BSR first. For 8-bit addresses of 80h and above, this means that users can evaluate and operate on SFRs more efficiently. The Access RAM below 60h is a good place for data values that the user might need to access rapidly, such as immediate computational results or common program variables. Access RAM also allows for faster and more code efficient context saving and switching of variables. The mapping of the Access Bank is slightly different when the extended instruction set is enabled (XINST Configuration bit = 1). This is discussed in more detail in Section 6.5.3 “Mapping the Access Bank in Indexed Literal Offset Mode”. 6.3.3 GENERAL PURPOSE REGISTER FILE PIC18 devices may have banked memory in the GPR area. This is data RAM, which is available for use by all instructions. GPRs start at the bottom of Bank 0 (address 000h) and grow upwards towards the bottom of the SFR area. GPRs are not initialized by a Power-on Reset and are unchanged on all other Resets. DS39635C-page 77 PIC18F6310/6410/8310/8410 6.3.4 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. SFRs start at the top of data memory (FFFh) and extend downward to occupy more than the top half of Bank 15 (F60h to FFFh). A list of these registers is given in Table 6-2 and Table 6-3. The SFRs can be classified into two sets: those associated with the “core” device functionality (ALU, Resets and interrupts) and those related to the peripheral functions. The Reset and interrupt registers are described in their respective chapters, while the ALU’s STATUS register is described later in this section. Registers related to the operation of the peripheral features are described in the chapter for that peripheral. The SFRs are typically distributed among the peripherals whose functions they control. Unused SFR locations are unimplemented and read as ‘0’s. TABLE 6-2: Address SPECIAL FUNCTION REGISTER MAP FOR PIC18F6310/6410/8310/8410 DEVICES Name Address Name Name Address Name Address Name FFFh TOSU FDFh FBFh CCPR1H F9Fh IPR1 F7Fh SPBRGH1 FFEh TOSH FDEh POSTINC2(1) FBEh CCPR1L F9Eh PIR1 F7Eh BAUDCON1 FFDh TOSL FDDh POSTDEC2(1) FBDh CCP1CON F9Dh PIE1 F7Dh —(2) F7Ch —(2) FFCh FFBh STKPTR FDCh PCLATU FDBh INDF2 Address (1) (1) FBCh CCPR2H F9Ch (1) FBBh CCPR2L F9Bh OSCTUNE F7Bh —(2) F7Ah —(2) PREINC2 PLUSW2 MEMCON (3) FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah TRISJ(3) FF9h PCL FD9h FSR2L FB9h CCPR3H F99h TRISH(3) F79h —(2) FF8h TBLPTRU FD8h STATUS FB8h CCPR3L F98h TRISG F78h —(2) FF7h TBLPTRH FD7h TMR0H FB7h CCP3CON F97h TRISF F77h —(2) F96h TRISE F76h —(2) (2) FF6h TBLPTRL FD6h TMR0L FB6h — FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD F75h —(2) FB4h CMCON F94h TRISC F74h —(2) FF4h PRODH FD4h —(2) FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB F73h —(2) FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA F72h —(2) FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h LATJ(3) F71h —(2) F90h (3) F70h —(2) FF0h FEFh INTCON3 INDF0 (1) FD0h RCON FB0h PSPCON LATH FCFh TMR1H FAFh SPBRG1 F8Fh LATG F6Fh SPBRG2 FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG1 F8Eh LATF F6Eh RCREG2 FEDh POSTDEC0(1) TXREG1 F8Dh LATE F6Dh TXREG2 FCDh T1CON FADh FECh PREINC0 (1) FCCh TMR2 FACh TXSTA1 F8Ch LATD F6Ch TXSTA2 FEBh PLUSW0(1) FCBh PR2 FABh RCSTA1 F8Bh LATC F6Bh RCSTA2 FEAh FSR0H FCAh T2CON FAAh —(2) F8Ah LATB F6Ah —(2) FE9h FSR0L FC9h SSPBUF FA9h —(2) F89h LATA F69h —(2) FA8h —(2) F88h PORTJ(3) F68h —(2) FA7h (2) F87h (3) F67h —(2) (2) FE8h FE7h WREG INDF1 FC8h (1) FC7h SSPADD SSPSTAT — PORTH (1) FC6h SSPCON1 FA6h — F86h PORTG F66h —(2) FE5h POSTDEC1(1) FE6h POSTINC1 FC5h SSPCON2 FA5h IPR3 F85h PORTF F65h —(2) FE4h PREINC1 (1) FC4h ADRESH FA4h PIR3 F84h PORTE F64h —(2) FE3h PLUSW1(1) FC3h ADRESL FA3h PIE3 F83h PORTD F63h —(2) FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC F62h —(2) FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB F61h —(2) FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA F60h —(2) Note 1: 2: 3: This is not a physical register. Unimplemented registers are read as ‘0’. This register is not available on 64-pin devices. DS39635C-page 78  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 6-3: File Name REGISTER FILE SUMMARY (PIC18F6310/6410/8310/8410) Bit 7 Bit 6 Bit 5 — — — Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Details on page: ---0 0000 63, 70 TOSH Top-of-Stack High Byte (TOS) 0000 0000 63, 70 TOSL Top-of-Stack Low Byte (TOS) 0000 0000 63, 70 TOSU STKPTR PCLATU Top-of-Stack Upper Byte (TOS) Value on POR, BOR STKFUL(6) STKUNF(6) — Return Stack Pointer 00-0 0000 63, 71 — — — Holding Register for PC ---0 0000 63, 70 PCLATH Holding Register for PC 0000 0000 63, 70 PCL PC Low Byte (PC) 0000 0000 63, 70 --00 0000 63, 93 TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR) TBLPTRH Program Memory Table Pointer High Byte (TBLPTR) 0000 0000 63, 93 TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR) 0000 0000 63, 93 TABLAT Program Memory Table Latch 0000 0000 63, 93 PRODH Product Register High Byte xxxx xxxx 63, 107 PRODL Product Register Low Byte INTCON xxxx xxxx 63, 107 RBIF 0000 000x 63, 111 INT3IP RBIP 1111 1111 63, 112 INT2IF INT1IF 1100 0000 63, 113 GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INTCON3 INT2IP INT1IP INT3IE INT2IE INT1IE INT3IF INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 63, 85 POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 63, 85 POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 63, 85 PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 63, 85 PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register), value of FSR0 offset by W N/A 63, 85 FSR0H ---- xxxx 63, 85 FSR0L Indirect Data Memory Address Pointer 0 Low Byte — xxxx xxxx 63, 85 WREG Working Register xxxx xxxx 63 INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 63, 85 POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 63, 85 POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 63, 85 PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 63, 85 PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register), value of FSR1 offset by W N/A 63, 85 ---- xxxx 63, 85 FSR1H — FSR1L — — — — — — Indirect Data Memory Address Pointer 0 High Byte Indirect Data Memory Address Pointer 1 High Byte Indirect Data Memory Address Pointer 1 Low Byte BSR — — — — Bank Select Register xxxx xxxx 63, 85 ---- 0000 63, 75 INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 64, 85 POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 64, 85 POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 64, 85 PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 64, 85 PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register), value of FSR2 offset by W N/A 64, 85 ---- xxxx 64, 85 FSR2H — FSR2L — — — Indirect Data Memory Address Pointer 2 High Byte Indirect Data Memory Address Pointer 2 Low Byte STATUS Legend: Note 1: 2: 3: 4: 5: 6: — — — N OV Z DC C xxxx xxxx 64, 85 ---x xxxx 64, 83 x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded locations are unimplemented, read as ‘0’. The SBOREN bit is only available when the BOREN Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”. These registers and/or bits are not implemented on 64-pin devices, read as ‘0’. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes”. The RG5 bit is only available when Master Clear is disabled (MCLRE Configuration bit = 0); otherwise, RG5 reads as ‘0’. This bit is read-only. RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. STKFUL and STKUNF bits are cleared by user software or by a POR.  2010 Microchip Technology Inc. DS39635C-page 79 PIC18F6310/6410/8310/8410 TABLE 6-3: File Name REGISTER FILE SUMMARY (PIC18F6310/6410/8310/8410) (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: TMR0H Timer0 Register High Byte 0000 0000 64, 153 TMR0L Timer0 Register Low Byte xxxx xxxx 64, 153 64, 151 T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 42, 64 HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 64, 275 WDTCON — — — — — — — SWDTEN ---- ---0 64, 291 — RI TO PD POR BOR 0q-1 11q0 56, 64, 123 RCON IPEN SBOREN (1) TMR1H Timer1 Register High Byte xxxx xxxx 64, 159 TMR1L Timer1 Register Low Byte 0000 0000 64, 159 0000 0000 64, 155 64, 162 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON TMR2 Timer2 Register 1111 1111 PR2 Timer2 Period Register -000 0000 64, 162 -000 0000 64, 161 0000 0000 64, 178, 186 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 SSPBUF MSSP Receive Buffer/Transmit Register SSPADD MSSP Address Register in I2C™ Slave Mode. MSSP Baud Rate Reload Register in I2C Master Mode. 0000 0000 64, 186 SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 64, 178, 188 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 64, 179, 179 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN SSPCON2 0000 0000 64, 189 ADRESH A/D Result Register High Byte xxxx xxxx 64, 264 ADRESL A/D Result Register Low Byte 0000 0000 64, 264 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 64, 255 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 qqqq 64, 256 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 ADCON2 0-00 0000 64, 257 CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 65, 168 CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 65, 168 --00 0000 65, 167 65, 168 CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx CCPR2L Capture/Compare/PWM Register 2 Low Byte 0000 0000 65, 168 --00 0000 65, 167 65, 168 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 CCPR3H Capture/Compare/PWM Register 3 High Byte xxxx xxxx CCPR3L Capture/Compare/PWM Register 3 Low Byte 0000 0000 65, 168 CCP3CON — — CVRCON CVREN CMCON C2OUT DC3B1 DC3B0 CCP3M3 CCP3M2 CCP3M1 CCP3M0 --00 0000 65, 167 CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 65, 271 C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 65, 265 TMR3H Timer3 Register High Byte 0000 0000 65, 163 TMR3L Timer3 Register Low Byte 0000 0000 65, 165 T3CON PSPCON Legend: Note 1: 2: 3: 4: 5: 6: RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 65, 163 IBF OBF IBOV PSPMODE — — — — 0000 ---- 65, 149 x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded locations are unimplemented, read as ‘0’. The SBOREN bit is only available when the BOREN Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”. These registers and/or bits are not implemented on 64-pin devices, read as ‘0’. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes”. The RG5 bit is only available when Master Clear is disabled (MCLRE Configuration bit = 0); otherwise, RG5 reads as ‘0’. This bit is read-only. RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. STKFUL and STKUNF bits are cleared by user software or by a POR. DS39635C-page 80  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 6-3: File Name REGISTER FILE SUMMARY (PIC18F6310/6410/8310/8410) (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: SPBRG1 EUSART1 Baud Rate Generator Low Byte 0000 0000 65, 221 RCREG1 EUSART1 Receive Register 0000 0000 65, 229 TXREG1 EUSART1 Transmit Register xxxx xxxx 65, 226 65, 218 TXSTA1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 65, 219 IPR3 — — RC2IP TX2IP — — — CCP3IP --11 ---1 65, 122 PIR3 — — RC2IF TX2IF — — — CCP3IF --00 ---0 65, 116 PIE3 — — RC2IE TX2IE — — — CCP3IE --00 ---0 65, 119 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 11-- 1111 65, 121 65, 115 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 00-- 0000 PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 00-- 0000 65, 118 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 65, 120 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 65, 114 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 65, 117 MEMCON(2) EBDIS — WAIT1 WAIT0 — — WM1 WM0 0-00 --00 65, 95 INTSRC PLLEN(3) — TUN4 TUN3 TUN2 TUN1 TUN0 00-0 0000 39, 65 OSCTUNE TRISJ(2) PORTJ Data Direction Register 1111 1111 65, 147 TRISH(2) PORTH Data Direction Register 1111 1111 65, 145 ---1 1111 66, 143 TRISG — — — PORTG Data Direction Register TRISF PORTF Data Direction Register 1111 1111 66, 141 TRISE PORTE Data Direction Register 1111 1111 66, 139 TRISD PORTD Data Direction Register 1111 1111 66, 136 TRISC PORTC Data Direction Register 1111 1111 66, 133 TRISB PORTB Data Direction Register 1111 1111 66, 130 TRISA7(5) TRISA TRISA6(5) PORTA Data Direction Register LATJ(2) LATJ Output Latch Register LATH(2) LATH Output Latch Register LATG — — — LATG Output Latch Register 1111 1111 66, 127 xxxx xxxx 66, 147 xxxx xxxx 66, 145 ---x xxxx 66, 143 LATF LATF Output Latch Register xxxx xxxx 66, 141 LATE LATE Output Latch Register xxxx xxxx 66, 139 LATD LATD Output Latch Register xxxx xxxx 66, 136 LATC LATC Output Latch Register xxxx xxxx 66, 133 LATB LATB Output Latch Register xxxx xxxx 66, 130 LATA7(5) LATA LATA6(5) LATA Output Latch Register xxxx xxxx 66, 127 PORTJ(2) Read PORTJ pins, Write PORTJ Data Latch xxxx xxxx 66, 147 PORTH(2) Read PORTH pins, Write PORTH Data Latch xxxx xxxx 66, 145 --xx xxxx 66, 143 PORTG — — RG5(4) Read PORTG pins, Write PORTG Data Latch PORTF Read PORTF pins, Write PORTF Data Latch xxxx xxxx 66, 141 PORTE Read PORTE pins, Write PORTE Data Latch xxxx xxxx 66, 139 PORTD Read PORTD pins, Write PORTD Data Latch xxxx xxxx 66, 136 PORTC Read PORTC pins, Write PORTC Data Latch xxxx xxxx 66, 133 PORTB Read PORTB pins, Write PORTB Data Latch xxxx xxxx 66, 130 xx0x 0000 66, 127 RA7(5) PORTA Legend: Note 1: 2: 3: 4: 5: 6: RA6(5) Read PORTA pins, Write PORTA Data Latch x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded locations are unimplemented, read as ‘0’. The SBOREN bit is only available when the BOREN Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”. These registers and/or bits are not implemented on 64-pin devices, read as ‘0’. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes”. The RG5 bit is only available when Master Clear is disabled (MCLRE Configuration bit = 0); otherwise, RG5 reads as ‘0’. This bit is read-only. RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. STKFUL and STKUNF bits are cleared by user software or by a POR.  2010 Microchip Technology Inc. DS39635C-page 81 PIC18F6310/6410/8310/8410 TABLE 6-3: File Name SPBRGH1 BAUDCON1 REGISTER FILE SUMMARY (PIC18F6310/6410/8310/8410) (CONTINUED) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR 0000 0000 66, 221 TXCKP BRG16 — WUE ABDEN 0100 0-00 66, 220 EUSART1 Baud Rate Generator High Byte ABDOVF RCIDL RXDTP Details on page: SPBRG2 AUSART2 Baud Rate Generator 0000 0000 66, 234 RCREG2 AUSART2 Receive Register 0000 0000 66, 248 TXREG2 AUSART2 Transmit Register xxxx xxxx 66, 246 TXSTA2 CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 66, 242 RCSTA2 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 66, 243 Legend: Note 1: 2: 3: 4: 5: 6: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition. Shaded locations are unimplemented, read as ‘0’. The SBOREN bit is only available when the BOREN Configuration bits = 01; otherwise, it is disabled and reads as ‘0’. See Section 5.4 “Brown-out Reset (BOR)”. These registers and/or bits are not implemented on 64-pin devices, read as ‘0’. The PLLEN bit is only available in specific oscillator configurations; otherwise, it is disabled and reads as ‘0’. See Section 3.6.4 “PLL in INTOSC Modes”. The RG5 bit is only available when Master Clear is disabled (MCLRE Configuration bit = 0); otherwise, RG5 reads as ‘0’. This bit is read-only. RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. STKFUL and STKUNF bits are cleared by user software or by a POR. DS39635C-page 82  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.3.5 STATUS REGISTER The STATUS register, shown in Register 6-3, contains the arithmetic status of the ALU. As with any other SFR, it can be the operand for any instruction. If the STATUS register is the destination for an instruction that affects the Z, DC, C, OV or N bits, the results of the instruction are not written; instead, the status is updated according to the instruction performed. Therefore, the result of an instruction with the STATUS register as its destination may be different than intended. As an example, CLRF STATUS, will set the Z bit and leave the remaining Status bits unchanged (‘000u u1uu’). It is recommended that only BCF, BSF, SWAPF, MOVFF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect the Z, C, DC, OV or N bits in the STATUS register. For other instructions that do not affect Status bits, see the instruction set summaries in Table 25-2 and Table 25-3. Note: REGISTER 6-3: The C and DC bits operate as a Borrow and Digit Borrow bit, respectively, in subtraction. STATUS REGISTER U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — N OV Z DC(1) C(2) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4 N: Negative bit This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative (ALU MSB = 1). 1 = Result was negative 0 = Result was positive bit 3 OV: Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude, which causes the sign bit (bit 7) to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Borrow bit(1) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(2) For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: 2: For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register. For Borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register.  2010 Microchip Technology Inc. DS39635C-page 83 PIC18F6310/6410/8310/8410 6.4 Data Addressing Modes Note: The execution of some instructions in the core PIC18 instruction set are changed when the PIC18 extended instruction set is enabled. See Section 6.5 “Data Memory and the Extended Instruction Set” for more information. While the program memory can be addressed in only one way – through the program counter – information in the data memory space can be addressed in several ways. For most instructions, the addressing mode is fixed. Other instructions may use up to three modes, depending on which operands are used and whether or not the extended instruction set is enabled. The addressing modes are: • • • • Inherent Literal Direct Indirect An additional addressing mode, Indexed Literal Offset, is available when the extended instruction set is enabled (XINST Configuration bit = 1). Its operation is discussed in greater detail in Section 6.5.1 “Indexed Addressing with Literal Offset”. 6.4.1 INHERENT AND LITERAL ADDRESSING Many PIC18 control instructions do not need any argument at all; they either perform an operation that globally affects the device, or they operate implicitly on one register. This addressing mode is known as Inherent Addressing. Examples include SLEEP, RESET and DAW. Other instructions work in a similar way but require an additional explicit argument in the opcode. This is known as Literal Addressing mode, because they require some literal value as an argument. Examples include ADDLW and MOVLW, which respectively, add or move a literal value to the W register. Other examples include CALL and GOTO, which include a 20-bit program memory address. 6.4.2 DIRECT ADDRESSING Direct Addressing specifies all or part of the source and/or destination address of the operation within the opcode itself. The options are specified by the arguments accompanying the instruction. In the core PIC18 instruction set, bit-oriented and byte-oriented instructions use some version of Direct Addressing by default. All of these instructions include some 8-bit literal address as their Least Significant Byte. This address specifies either a register address in one of the banks of data RAM (Section 6.3.3 “General DS39635C-page 84 Purpose Register File”), or a location in the Access Bank (Section 6.3.2 “Access Bank”) as the data source for the instruction. The Access RAM bit, ‘a’, determines how the address is interpreted. When ‘a’ is ‘1’, the contents of the BSR (Section 6.3.1 “Bank Select Register”) are used with the address to determine the complete 12-bit address of the register. When ‘a’ is ‘0’, the address is interpreted as being a register in the Access Bank. Addressing that uses the Access RAM is sometimes also known as Direct Forced Addressing mode. A few instructions, such as MOVFF, include the entire 12-bit address (either source or destination) in their opcodes. In these cases, the BSR is ignored entirely. The destination of the operation’s results is determined by the destination bit, ‘d’. When ‘d’ is ‘1’, the results are stored back in the source register, overwriting its original contents. When ‘d’ is ‘0’, the results are stored in the W register. Instructions without the ‘d’ argument have a destination that is implicit in the instruction; their destination is either the target register being operated on, or the W register. 6.4.3 INDIRECT ADDRESSING Indirect Addressing allows the user to access a location in data memory without giving a fixed address in the instruction. This is done by using File Select Registers (FSRs) as pointers to the locations to be read or written to. Since the FSRs are themselves located in RAM as Special File Registers, they can also be directly manipulated under program control. This makes FSRs very useful in implementing data structures, such as tables and arrays in data memory. The registers for Indirect Addressing are also implemented with Indirect File Operands (INDFs) that permit automatic manipulation of the pointer value with auto-incrementing, auto-decrementing or offsetting with another value. This allows for efficient code using loops, such as the example of clearing an entire RAM bank in Example 6-5. It also enables users to perform Indexed Addressing and other Stack Pointer operations for program memory in data memory. EXAMPLE 6-5: NEXT LFSR CLRF BTFSS BRA CONTINUE HOW TO CLEAR RAM (BANK 1) USING INDIRECT ADDRESSING FSR0, 100h ; POSTINC0 ; Clear INDF ; register then ; inc pointer FSR0H, 1 ; All done with ; Bank1? NEXT ; NO, clear next ; YES, continue  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 6.4.3.1 FSR Registers and the INDF Operand mapped in the SFR space but are not physically implemented. Reading or writing to a particular INDF register actually accesses its corresponding FSR register pair. A read from INDF1, for example, reads the data at the address indicated by FSR1H:FSR1L. Instructions that use the INDF registers as operands actually use the contents of their corresponding FSR as a pointer to the instruction’s target. The INDF operand is just a convenient way of using the pointer. At the core of Indirect Addressing are three sets of registers: FSR0, FSR1 and FSR2. Each represents a pair of 8-bit registers, FSRnH and FSRnL. The four upper bits of the FSRnH register are not used, so each FSR pair holds a 12-bit value. This represents a value that can address the entire range of the data memory in a linear fashion. The FSR register pairs, then, serve as pointers to data memory locations. Because Indirect Addressing uses a full 12-bit address, data RAM banking is not necessary. Thus, the current contents of the BSR and the Access RAM bit have no effect on determining the target address. Indirect Addressing is accomplished with a set of Indirect File Operands, INDF0 through INDF2. These can be thought of as “virtual” registers”; they are FIGURE 6-8: INDIRECT ADDRESSING 000h Using an instruction with one of the indirect addressing registers as the operand.... Bank 0 ADDWF, INDF1, 1 100h Bank 1 200h ...uses the 12-bit address stored in the FSR pair associated with that register.... 300h FSR1H:FSR1L 7 0 x x x x 1 1 1 1 7 0 Bank 2 Bank 3 through Bank 13 1 1 0 0 1 1 0 0 ...to determine the data memory location to be used in that operation. In this case, the FSR1 pair contains FCCh. This means the contents of location FCCh will be added to that of the W register and stored back in FCCh. E00h Bank 14 F00h FFFh Bank 15 Data Memory 6.4.3.2 FSR Registers and POSTINC, POSTDEC, PREINC and PLUSW In addition to the INDF operand, each FSR register pair also has four additional indirect operands. Like INDF, these are “virtual” registers that cannot be indirectly read or written to. Accessing these registers actually accesses the associated FSR register pair, but also performs a specific action on its stored value. They are: • POSTDEC: accesses the FSR value, then automatically decrements it by ‘1’ afterwards • POSTINC: accesses the FSR value, then automatically increments it by ‘1’ afterwards • PREINC: increments the FSR value by ‘1’, then uses it in the operation • PLUSW: adds the signed value of the W register (range of -127 to 128) to that of the FSR and uses the new value in the operation.  2010 Microchip Technology Inc. In this context, accessing an INDF register uses the value in the FSR registers without changing them. Similarly, accessing a PLUSW register gives the FSR value offset by the value in the W register; neither value is actually changed in the operation. Accessing the other virtual registers changes the value of the FSR registers. Operations on the FSRs with POSTDEC, POSTINC and PREINC affect the entire register pair; that is, rollovers of the FSRnL register from FFh to 00h carry over to the FSRnH register. On the other hand, results of these operations do not change the value of any flags in the STATUS register (e.g., Z, N, OV, etc.). DS39635C-page 85 PIC18F6310/6410/8310/8410 The PLUSW register can be used to implement a form of Indexed Addressing in the data memory space. By manipulating the value in the W register, users can reach addresses that are fixed offsets from pointer addresses. In some applications, this can be used to implement some powerful program control structure, such as software stacks, inside of data memory. 6.4.3.3 Operations by FSRs on FSRs Indirect Addressing operations that target other FSRs or virtual registers represent special cases. For example, using an FSR to point to one of the virtual registers will not result in successful operations. As a specific case, assume that FSR0H:FSR0L contains FE7h, the address of INDF1. Attempts to read the value of the INDF1, using INDF0 as an operand, will return 00h. Attempts to write to INDF1, using INDF0 as the operand, will result in a NOP. On the other hand, using the virtual registers to write to an FSR pair may not occur as planned. In these cases, the value will be written to the FSR pair, but without any incrementing or decrementing. Thus, writing to INDF2 or POSTDEC2 will write the same value to the FSR2H:FSR2L. Since the FSRs are physical registers mapped in the SFR space, they can be manipulated through all direct operations. Users should proceed cautiously when working on these registers, particularly if their code uses Indirect Addressing. Similarly, operations by Indirect Addressing are generally permitted on all other SFRs. Users should exercise the appropriate caution that they do not inadvertently change settings that might affect the operation of the device. 6.5 Data Memory and the Extended Instruction Set Enabling the PIC18 extended instruction set (XINST Configuration bit = 1) significantly changes certain aspects of data memory and its addressing. Specifically, the use of the Access Bank for many of the core PIC18 instructions is different; this is due to the introduction of a new addressing mode for the data memory space. What does not change is just as important. The size of the data memory space is unchanged, as well as its linear addressing. The SFR map remains the same. Core PIC18 instructions can still operate in both Direct and Indirect Addressing mode; inherent and literal instructions do not change at all. Indirect Addressing with FSR0 and FSR1 also remain unchanged. DS39635C-page 86 6.5.1 INDEXED ADDRESSING WITH LITERAL OFFSET Enabling the PIC18 extended instruction set changes the behavior of Indirect Addressing using the FSR2 register pair and its associated file operands. Under the proper conditions, instructions that use the Access Bank – that is, most bit-oriented and byte-oriented instructions – can invoke a form of Indexed Addressing using an offset specified in the instruction. This special addressing mode is known as Indexed Addressing with Literal Offset, or Indexed Literal Offset mode. When using the extended instruction set, this addressing mode requires the following: • The use of the Access Bank is forced (‘a’ = 0); and • The file address argument is less than or equal to 5Fh. Under these conditions, the file address of the instruction is not interpreted as the lower byte of an address (used with the BSR in Direct Addressing), or as an 8-bit address in the Access Bank. Instead, the value is interpreted as an offset value to an Address Pointer specified by FSR2. The offset and the contents of FSR2 are added to obtain the target address of the operation. 6.5.2 INSTRUCTIONS AFFECTED BY INDEXED LITERAL OFFSET MODE Any of the core PIC18 instructions that can use Direct Addressing are potentially affected by the Indexed Literal Offset Addressing mode. This includes all byte-oriented and bit-oriented instructions, or almost one-half of the standard PIC18 instruction set. Instructions that only use Inherent or Literal Addressing modes are unaffected. Additionally, byte-oriented and bit-oriented instructions are not affected if they do not use the Access Bank (Access RAM bit is ‘1’), or include a file address of 60h or above. Instructions meeting these criteria will continue to execute as before. A comparison of the different possible addressing modes when the extended instruction set is enabled is shown in Figure 6-9. Those who desire to use byte-oriented or bit-oriented instructions in the Indexed Literal Offset mode should note the changes to assembler syntax for this mode. This is described in more detail in Section 25.2.1 “Extended Instruction Syntax”.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 6-9: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED) EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff) When a = 0 and f  60h: The instruction executes in Direct Forced mode. ‘f’ is interpreted as a location in the Access RAM between 060h and FFFh. This is the same as locations F60h to FFFh (Bank 15) of data memory. Locations below 060h are not available in this addressing mode. 000h 060h Bank 0 100h 00h Bank 1 through Bank 14 60h Valid Range for ‘f’ FFh F00h Access RAM Bank 15 F40h SFRs FFFh Data Memory When a = 0 and f5Fh: The instruction executes in Indexed Literal Offset mode. ‘f’ is interpreted as an offset to the address value in FSR2. The two are added together to obtain the address of the target register for the instruction. The address can be anywhere in the data memory space. Note that in this mode, the correct syntax is now: ADDWF [k], d where ‘k’ is the same as ‘f’. 000h Bank 0 060h 100h 001001da ffffffff Bank 1 through Bank 14 FSR2H FSR2L F00h Bank 15 F40h SFRs FFFh Data Memory When a = 1 (all values of f): The instruction executes in Direct mode (also known as Direct Long mode). ‘f’ is interpreted as a location in one of the 16 banks of the data memory space. The bank is designated by the Bank Select Register (BSR). The address can be in any implemented bank in the data memory space. BSR 00000000 000h Bank 0 060h 100h Bank 1 through Bank 14 001001da ffffffff F00h Bank 15 F40h SFRs FFFh Data Memory  2010 Microchip Technology Inc. DS39635C-page 87 PIC18F6310/6410/8310/8410 6.5.3 MAPPING THE ACCESS BANK IN INDEXED LITERAL OFFSET MODE The use of Indexed Literal Offset Addressing mode effectively changes how the lower part of Access RAM (00h to 5Fh) is mapped. Rather than containing just the contents of the bottom part of Bank 0, this mode maps the contents from Bank 0 and a user-defined “window” that can be located anywhere in the data memory space. The value of FSR2 establishes the lower boundary of the addresses mapped into the window, while the upper boundary is defined by FSR2 plus 95 (5Fh). Addresses in the Access RAM above 5Fh are mapped as previously described (see Section 6.3.2 “Access Bank”). An example of Access Bank remapping in this addressing mode is shown in Figure 6-10. FIGURE 6-10: Remapping of the Access Bank applies only to operations using the Indexed Literal Offset mode. Operations that use the BSR (Access RAM bit is ‘1’) will continue to use Direct Addressing as before. 6.6 PIC18 Instruction Execution and the Extended Instruction Set Enabling the extended instruction set adds eight additional commands to the existing PIC18 instruction set. These instructions are executed as described in Section 25.2 “Extended Instruction Set”. REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET ADDRESSING Example Situation: ADDWF f, d, a FSR2H:FSR2L = 120h Locations in the region from the FSR2 Pointer (120h) to the pointer plus 05Fh (17Fh) are mapped to the bottom of the Access RAM (000h-05Fh). 000h 05Fh 07Fh Bank 0 100h 120h 17Fh 200h Bank 0 addresses below 5Fh can still be addressed by using the BSR. Bank 1 Window Bank 1 00h Bank 1 “Window” 5Fh Locations in Bank 0 from 060h to 07Fh are mapped, as usual, to the middle of the Access Bank. Special Function Registers at F80h through FFFh are mapped to 80h through FFh, as usual. Bank 0 Bank 0 Bank 2 through Bank 14 7Fh 80h SFRs FFh Access Bank F00h Bank 15 F80h FFFh SFRs Data Memory DS39635C-page 88  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 7.0 PROGRAM MEMORY For PIC18FX310/X410 devices, the on-chip program memory is implemented as read-only memory. It is readable over the entire VDD range during normal operation; it cannot be written to or erased. Reads from program memory are executed one byte at a time. PIC18F8410 devices also implement the ability to read, write to and execute code from external memory devices using the external memory interface. In this implementation, external memory is used as all or part of the program memory space. The operation of the physical interface is discussed in Section 8.0 “External Memory Interface”. In all devices, a value written to the program memory space does not need to be a valid instruction. Executing a program memory location that forms an invalid instruction results in a NOP. 7.1 Table Reads and Table Writes Table read operations retrieve data from program memory and places it into the data RAM space. Table write operations place data from the data memory space on the external data bus. The actual process of writing the data to the particular memory device is determined by the requirements of the device itself. Figure 7-1 shows the table operations as they relate to program memory and data RAM. Table operations work with byte entities. A table block containing data, rather than program instructions, is not required to be word-aligned. Therefore, a table block can start and end at any byte address. If a table write is being used to write executable code into an external program memory, program instructions will need to be word-aligned. Note: To read and write to the program memory space, there are two operations that allow the processor to move bytes between the program memory space and the data RAM: table read (TBLRD) and table write (TBLWT). FIGURE 7-1: The program memory space is 16 bits wide, while the data RAM space is 8 bits wide. Table reads and table writes move data between these two memory spaces through an 8-bit register (TABLAT). Although it cannot be used in PIC18F6310 devices in normal operation, the TBLWT instruction is still implemented in the instruction set. Executing the instruction takes two instruction cycles, but effectively results in a NOP. The TBLWT instruction is available in programming modes and is used during In-Circuit Serial Programming (ICSP). TABLE READ AND TABLE WRITE OPERATIONS Program Memory Space Instruction: TBLRD* Table Pointer Data Memory Space (1) TBLPTRU TBLPTRH TBLPTRL Table Latch (8-bit) TABLAT Instruction: TBLWT* Table Pointer(1) TBLPTRU TBLPTRH TBLPTRL Program Memory Space Data Memory Space Table Latch (8-bit)(2) TABLAT Note 1: 2: The Table Pointer register points to a byte in the program memory space. Data is actually written to the memory location by the memory write algorithm. See Section 7.4 “Writing to Program Memory Space (PIC18F8310/8410 only)” for more information.  2010 Microchip Technology Inc. DS39635C-page 89 PIC18F6310/6410/8310/8410 7.2 Control Registers Two control registers are used in conjunction with the TBLRD and TBLWT instructions: the TABLAT register and the TBLPTR register set. 7.2.1 TABLAT – TABLE LATCH REGISTER The Table Latch (TABLAT) is an 8-bit register mapped into the SFR space. The Table Latch register is used to hold 8-bit data during data transfers between the program memory space and data RAM. 7.2.2 TBLPTR – TABLE POINTER REGISTER The Table Pointer register (TBLPTR) addresses a byte within the program memory. It is comprised of three SFR registers: Table Pointer Upper Byte, Table Pointer High Byte and Table Pointer Low Byte (TBLPTRU:TBLPTRH:TBLPTRL). Only the lower six bits of TBLPTRU are used with TBLPTRH and TBLPTRL to form a 22-bit wide pointer. The contents of TBLPTR indicate a location in program memory space. The low-order 21 bits allow the device to address the full 2 Mbytes of program memory space. The 22nd bit allows access to the configuration space, including the device ID, user ID locations and the Configuration bits. The TBLPTR register set is updated when executing a TBLRD or TBLWT operation in one of four ways, based on the instruction’s arguments. These are detailed in Table 7-1. These operations on the TBLPTR only affect the low-order 21 bits. TABLE 7-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS Example Operation on Table Pointer TBLRD* TBLWT* TBLPTR is not modified TBLRD*+ TBLWT*+ TBLPTR is incremented after the read/write TBLRD*TBLWT*- TBLPTR is decremented after the read/write TBLRD+* TBLWT+* TBLPTR is incremented before the read/write 7.3 Reading the Flash Program Memory The TBLRD instruction is used to retrieve data from the program memory space and places it into data RAM. Table reads from program memory are performed one byte at a time. TBLPTR points to a byte address in program space. Executing TBLRD places the byte pointed to into TABLAT. The internal program memory is typically organized by words. The Least Significant bit of the address selects between the high and low bytes of the word. Figure 7-2 shows the interface between the internal program memory and the TABLAT. A typical method for reading data from program memory is shown in Example 7-1. When a TBLRD or TBLWT is executed, all 22 bits of the TBLPTR determine which address in the program memory space is to be read or written to. DS39635C-page 90  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 7-2: READS FROM PROGRAM MEMORY Program Memory Space (Even Byte Address) (Odd Byte Address) TBLPTR = xxxxx1 Instruction Register (IR) EXAMPLE 7-1: FETCH TBLRD TBLPTR = xxxxx0 TABLAT Read Register READING A FLASH PROGRAM MEMORY WORD MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF CODE_ADDR_UPPER TBLPTRU CODE_ADDR_HIGH TBLPTRH CODE_ADDR_LOW TBLPTRL ; Load TBLPTR with the base ; address of the word READ_WORD TBLRD*+ MOVF MOVWF TBLRD*+ MOVF MOVF TABLAT, W WORD_EVEN TABLAT, W WORD_ODD  2010 Microchip Technology Inc. ; read into TABLAT and increment ; get data ; read into TABLAT and increment ; get data DS39635C-page 91 PIC18F6310/6410/8310/8410 7.4 Writing to Program Memory Space (PIC18F8310/8410 only) The table write operation outputs the contents of the TBLPTR and TABLAT registers to the external address and data busses of the external memory interface. Depending on the program memory mode selected, the operation may target any byte address in the device’s memory space. What happens to this data depends largely on the external memory device being used. For PIC18 devices with Enhanced Flash memory, a single algorithm is used for writing to the on-chip program array. In the case of external devices, however, the algorithm is determined by the type of memory device and its requirements. In some cases, a specific instruction sequence must be sent before data can be written or erased. Address and data demultiplexing, chip select operation and write time requirements must all be considered in creating the appropriate code. The connection of the data and address busses to the memory device are dictated by the interface being used, the data bus width and the target device. When using a 16-bit data path, the algorithm must take into account the width of the target memory. Another important consideration is the write time requirement of the target device. If this is longer than the time that a TBLWT operation makes data available on the interface, the algorithm must be adjusted to lengthen this time. It may be possible, for example, to buy enough time by increasing the length of the wait state on table operations. In all cases, it is important to remember that instructions in the program memory space are word-aligned, with the Least Significant bit always being written to an even-numbered address (LSb = 0). If data is being stored in the program memory space, word alignment of the data is not required. A complete overview of interface algorithms is beyond the scope of this data sheet. The best place for timing and instruction sequence requirements is the data sheet of the memory device in question. For additional information on algorithm design for the external memory interface, refer to Microchip application note AN869, “External Memory Interfacing Techniques for the PIC18F8XXX” (DS00869). 7.4.1 WRITE VERIFY 7.4.2 UNEXPECTED TERMINATION OF WRITE OPERATION If a write is terminated by an unplanned event, such as loss of power or an unexpected Reset, the memory location just programmed should be verified and reprogrammed if needed. If the application writes to external memory on a frequent basis, it may be necessary to implement an error trapping routine to handle these unplanned events. 7.5 Erasing External Memory (PIC18F8310/8410 only) Erasure is implemented in different ways on different devices. In many cases, it is possible to erase all or part of the memory by issuing a specific command. In some devices, it may be necessary to write ‘0’s to the locations to be erased. For specific information, consult the external memory device’s data sheet for clarification. 7.6 Writing and Erasing On-Chip Program Memory (ICSP Mode) While the on-chip program memory is read-only in normal operating mode, it can be written to and erased as a function of In-Circuit Serial Programming (ICSP). In this mode, the TBLWT operation is used in all devices to write to blocks of 64 bytes (32 words) at one time. Write blocks are boundary-aligned with the code protection blocks. Special commands are used to erase one or more code blocks of the program memory, or the entire device. The TBLWT operation on write blocks is somewhat different than the word write operations for PIC18F8310/8410 devices described here. A more complete description of block write operations is provided in the Microchip document “Programming Specifications for PIC18FX410/X490 Flash MCUs” (DS39624). 7.7 Flash Program Operation During Code Protection See Section 24.5 “Program Verification and Code Protection” for details on code protection of Flash program memory. Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. DS39635C-page 92  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 7-2: Name TBLPTRU REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY Bit 7 Bit 6 Bit 5 — — bit 21 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Program Memory Table Pointer Upper Byte (TBLPTR) Reset Values on Page 63 TBLPTRH Program Memory Table Pointer High Byte (TBLPTR) 63 TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR) 63 TABLAT Program Memory Table Latch 63 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access.  2010 Microchip Technology Inc. DS39635C-page 93 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 94  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 8.0 EXTERNAL MEMORY INTERFACE Note: The external memory interface is not implemented on PIC18F6310 and PIC18F6410 (64-pin) devices. The external memory interface allows the device to access external memory devices (such as Flash, EPROM, SRAM, etc.) as program or data memory. It is implemented with 28 pins, multiplexed across four I/O ports. Three ports (PORTD, PORTE and PORTH) are multiplexed with the address/data bus for a total of 20 available lines, while PORTJ is multiplexed with the bus control signals. A list of the pins and their functions is provided in Table 8-1. REGISTER 8-1: As implemented here, the interface is similar to that introduced on PIC18F8X20 microcontrollers. The most notable difference is that the interface on PIC18F8310/8410 devices supports both 16-Bit and Multiplexed 8-Bit Data Width modes; it does not support the 8-Bit Demultiplexed mode. The Bus Width mode is set by the BW Configuration bit when the device is programmed and cannot be changed in software. The operation of the interface is controlled by the MEMCON register (Register 8-1). Clearing the EBDIS bit (MEMCON) enables the interface and disables the I/O functions of the ports, as well as any other multiplexed functions. Setting the bit disables the interface and enables the ports. For a more complete discussion of the operating modes that use the external memory interface, refer to Section 8.1 “Program Memory Modes and the External Memory Interface”. MEMCON: MEMORY CONTROL REGISTER R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 EBDIS — WAIT1 WAIT0 — — WM1 WM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EBDIS: External Bus Disable bit 1 = External system bus disabled, all external bus drivers are mapped as I/O ports 0 = External system bus enabled, I/O ports are disabled bit 6 Unimplemented: Read as ‘0’ bit 5-4 WAIT: Table Reads and Writes Bus Cycle Wait Count bits 11 = Table reads and writes will wait 0 TCY 10 = Table reads and writes will wait 1 TCY 01 = Table reads and writes will wait 2 TCY 00 = Table reads and writes will wait 3 TCY bit 3-2 Unimplemented: Read as ‘0’ bit 1-0 WM: TBLWRT Operation with 16-Bit Bus Width bits 1x = Word Write mode: TABLAT0 and TABLAT1 word output; WRH active when TABLAT1 is written 01 = Byte Select mode: TABLAT data copied on both MSB and LSB; WRH and (UB or LB) will activate 00 = Byte Write mode: TABLAT data copied on both MSB and LSB; WRH or WRL will activate Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’.  2010 Microchip Technology Inc. DS39635C-page 95 PIC18F6310/6410/8310/8410 TABLE 8-1: Name PIC18F8310/8410 EXTERNAL BUS – I/O PORT FUNCTIONS Port Bit Function RD0/AD0/PSP0 PORTD 0 Input/Output or System Bus Address bit 0 or Data bit 0 or Parallel Slave Port bit 0 RD1/AD1/PSP1 PORTD 1 Input/Output or System Bus Address bit 1 or Data bit 1 or Parallel Slave Port bit 1 RD2/AD2/PSP2 PORTD 2 Input/Output or System Bus Address bit 2 or Data bit 2 or Parallel Slave Port bit 2 RD3/AD3/PSP3 PORTD 3 Input/Output or System Bus Address bit 3 or Data bit 3 or Parallel Slave Port bit 3 RD4/AD4/PSP4 PORTD 4 Input/Output or System Bus Address bit 4 or Data bit 4 or Parallel Slave Port bit 4 RD5/AD5/PSP5 PORTD 5 Input/Output or System Bus Address bit 5 or Data bit 5 or Parallel Slave Port bit 5 RD6/AD6/PSP6 PORTD 6 Input/Output or System Bus Address bit 6 or Data bit 6 or Parallel Slave Port bit 6 RD7/AD7/PSP7 PORTD 7 Input/Output or System Bus Address bit 7 or Data bit 7 or Parallel Slave Port bit 7 RE0/AD8/RD PORTE 0 Input/Output or System Bus Address bit 8 or Data bit 8 or Parallel Slave Port Read Control pin RE1/AD9/WR PORTE 1 Input/Output or System Bus Address bit 9 or Data bit 9 or Parallel Slave Port Write Control pin RE2/AD10/CS PORTE 2 Input/Output or System Bus Address bit 10 or Data bit 10 or Parallel Slave Port Chip Select pin RE3/AD11 PORTE 3 Input/Output or System Bus Address bit 11 or Data bit 11 RE4/AD12 PORTE 4 Input/Output or System Bus Address bit 12 or Data bit 12 RE5/AD13 PORTE 5 Input/Output or System Bus Address bit 13 or Data bit 13 RE6/AD14 PORTE 6 Input/Output or System Bus Address bit 14 or Data bit 14 RE7/CCP2(1)/AD15 PORTE 7 Input/Output or Capture 2 Input/Compare 2 Output/PWM 2 Output pin or System Bus Address bit 15 or Data bit 15 RH0/AD16 PORTH 0 Input/Output or System Bus Address bit 16 RH1/AD17 PORTH 1 Input/Output or System Bus Address bit 17 RH2/AD18 PORTH 2 Input/Output or System Bus Address bit 18 RH3/AD19 PORTH 3 Input/Output or System Bus Address bit 19 RJ0/ALE PORTJ 0 Input/Output or System Bus Address Latch Enable (ALE) Control pin RJ1/OE PORTJ 1 Input/Output or System Bus Output Enable (OE) Control pin RJ2/WRL PORTJ 2 Input/Output or System Bus Write Low (WRL) Control pin RJ3/WRH PORTJ 3 Input/Output or System Bus Write High (WRH) Control pin RJ4/BA0 PORTJ 4 Input/Output or System Bus Byte Address bit 0 RJ5/CE PORTJ 5 Input/Output or System Bus Chip Enable (CE) Control pin RJ6/LB PORTJ 6 Input/Output or System Bus Lower Byte Enable (LB) Control pin RJ7/UB PORTJ 7 Input/Output or System Bus Upper Byte Enable (UB) Control pin Note 1: 8.1 Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared (all devices in Microcontroller mode). Program Memory Modes and the External Memory Interface As previously noted, PIC18F8310/8410 devices are capable of operating in any one of four program memory modes, using combinations of on-chip and external program memory. The functions of the multiplexed port pins depends on the program memory mode selected, as well as the setting of the EBDIS bit. In Microcontroller mode, the bus is not active and the pins have their port functions only. Writes to the MEMCOM register are not permitted. In Microprocessor mode, the external bus is always active and the port pins have only the external bus function. DS39635C-page 96 In Microprocessor with Boot Block or Extended Microcontroller mode, the external program memory bus shares I/O port functions on the pins. When the device is fetching or doing table read/table write operations on the external program memory space, the pins will have the external bus function. If the device is fetching and accessing internal program memory locations only, the EBDIS control bit will change the pins from external memory to I/O port functions. When EBDIS = 0, the pins function as the external bus. When EBDIS = 1, the pins function as I/O ports. If the device fetches or accesses external memory while EBDIS = 1, the pins will switch to external bus. If the EBDIS bit is set by a program executing from external memory, the action of setting the bit will be delayed until the program branches into the internal memory. At that time, the pins will change from external bus to I/O ports.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 When the device is executing out of internal memory (EBDIS = 0) in Microprocessor with Boot Block mode or Extended Microcontroller mode, the control signals will NOT be active. They will go to a state where the AD and A are tri-state; the CE, OE, WRH, WRL, UB and LB signals are ‘1’; ALE and BA0 are ‘0’. Note that only those pins associated with the current address width are forced to tri-state; the other pins continue to function as I/O. In the case of a 16-bit address width, for example, only AD (PORTD and PORTE) are affected; A (PORTH) continue to function as I/O. In all external memory modes, the bus takes priority over any other peripherals that may share pins with it. This includes the Parallel Slave Port and serial communications modules which would otherwise take priorityover the I/O port. 8.2 16-Bit Mode In 16-bit mode, the external memory interface can be connected to external memories in three different configurations: • 16-Bit Byte Write • 16-Bit Word Write • 16-Bit Byte Select The configuration to be used is determined by the WM bits in the MEMCON register (MEMCON). These three different configurations allow the designer maximum flexibility in using both 8-bit and 16-bit devices with 16-bit data. FIGURE 8-1: For all 16-bit modes, the Address Latch Enable (ALE) pin indicates that the address bits, A, are available on the external memory interface bus. Following the address latch, the Output Enable signal (OE) will enable both bytes of program memory at once to form a 16-bit instruction word. The Chip Enable signal (CE) is active at any time that the microcontroller accesses external memory, whether reading or writing; it is inactive (asserted high) whenever the device is in Sleep mode. In Byte Select mode, JEDEC standard Flash memories will require BA0 for the byte address line and one I/O line to select between Byte and Word mode. The other 16-bit modes do not need BA0. JEDEC standard static RAM memories will use the UB or LB signals for byte selection. 8.2.1 16-BIT BYTE WRITE MODE Figure 8-1 shows an example of 16-Bit Byte Write mode for PIC18F8310/8410 devices. This mode is used for two separate 8-bit memories connected for 16-bit operation. This generally includes basic EPROM and Flash devices. It allows table writes to byte-wide external memories. During a TBLWT instruction cycle, the TABLAT data is presented on the upper and lower bytes of the AD bus. The appropriate WRH or WRL control line is strobed on the LSb of the TBLPTR. 16-BIT BYTE WRITE MODE EXAMPLE D PIC18F8410 (MSB) AD 373 A D (LSB) A A D D CE AD 373 OE D CE WR(1) OE WR(1) ALE A CE OE WRH WRL Address Bus Data Bus Control Lines Note 1: This signal only applies to table writes. See Section 7.1 “Table Reads and Table Writes”.  2010 Microchip Technology Inc. DS39635C-page 97 PIC18F6310/6410/8310/8410 8.2.2 16-BIT WORD WRITE MODE Figure 8-2 shows an example of 16-Bit Word Write mode for PIC18F8410 devices. This mode is used for word-wide memories, which includes some of the EPROM and Flash type memories. This mode allows opcode fetches and table reads from all forms of 16-bit memory and table writes to any type of word-wide external memories. This method makes a distinction between TBLWT cycles to even or odd addresses. During a TBLWT cycle to an even address (TBLPTR = 0), the TABLAT data is transferred to a holding latch and the external address data bus is tri-stated for the data portion of the bus cycle. No write signals are activated. FIGURE 8-2: During a TBLWT cycle to an odd address (TBLPTR = 1), the TABLAT data is presented on the upper byte of the AD bus. The contents of the holding latch are presented on the lower byte of the AD bus. The WRH signal is strobed for each write cycle; the WRL pin is unused. The signal on the BA0 pin indicates the LSb of TBLPTR, but it is left unconnected. Instead, the UB and LB signals are active to select both bytes. The obvious limitation to this method is that the table write must be done in pairs on a specific word boundary to correctly write a word location. 16-BIT WORD WRITE MODE EXAMPLE PIC18F8410 AD 373 A D A D CE AD JEDEC Word EPROM Memory OE WR(1) 373 ALE A CE OE WRH Address Bus Data Bus Control Lines Note 1: DS39635C-page 98 This signal only applies to table writes. See Section 7.1 “Table Reads and Table Writes”.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 8.2.3 16-BIT BYTE SELECT MODE Figure 8-3 shows an example of 16-Bit Byte Select mode. This mode allows table write operations to word-wide external memories with byte selection capability. This generally includes both word-wide Flash and SRAM devices. During a TBLWT cycle, the TABLAT data is presented on the upper and lower byte of the AD bus. The WRH signal is strobed for each write cycle; the WRL pin is not used. The BA0 or UB/LB signals are used to select the byte to be written, based on the Least Significant bit of the TBLPTR register. FIGURE 8-3: Flash and SRAM devices use different control signal combinations to implement Byte Select mode. JEDEC standard Flash memories require that a controller I/O port pin be connected to the memory’s BYTE/WORD pin to provide the select signal. They also use the BA0 signal from the controller as a byte address. JEDEC standard static RAM memories, on the other hand, use the UB or LB signals to select the byte. 16-BIT BYTE SELECT MODE EXAMPLE PIC18F8410 AD 373 A A JEDEC Word Flash Memory D 138(2) AD 373 ALE D CE A0 BYTE/WORD OE WR(1) A OE WRH WRL A A BA0 JEDEC Word SRAM Memory I/O D D CE LB LB UB UB OE WR(1) Address Bus Data Bus Control Lines Note 1: 2: This signal only applies to table writes. See Section 7.1 “Table Reads and Table Writes”. Demultiplexing is only required when multiple memory devices are accessed.  2010 Microchip Technology Inc. DS39635C-page 99 PIC18F6310/6410/8310/8410 8.2.4 16-BIT MODE TIMING The presentation of control signals on the external memory bus is different for the various operating modes. Typical signal timing diagrams are shown in Figure 8-4 through Figure 8-6. FIGURE 8-4: EXTERNAL MEMORY BUS TIMING FOR TBLRD (MICROPROCESSOR MODE) Apparent Q Actual Q Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 00h A 3AABh AD Q4 Q1 Q4 Q2 Q4 Q3 Q4 Q4 0Ch 0E55h 9256h CF33h BA0 ALE OE WRH ‘1’ ‘1’ WRL ‘1’ ‘1’ CE ‘0’ ‘0’ 1 TCY Wait Memory Cycle Opcode Fetch MOVLW 55h from 007556h Table Read of 92h from 199E67h Instruction Execution TBLRD Cycle 1 TBLRD Cycle 2 FIGURE 8-5: EXTERNAL MEMORY BUS TIMING FOR TBLRD (EXTENDED MICROCONTROLLER MODE) Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 0Ch A CF33h AD 9256h CE ALE OE Memory Cycle Opcode Fetch TBLRD * from 000100h Opcode Fetch MOVLW 55h from 000102h TBLRD 92h from 199E67h Opcode Fetch ADDLW 55h from 000104h Instruction Execution INST(PC – 2) TBLRD Cycle 1 TBLRD Cycle 2 MOVLW DS39635C-page 100  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 8-6: EXTERNAL MEMORY BUS TIMING FOR SLEEP (MICROPROCESSOR MODE) Q1 Q2 Q4 Q1 Q2 00h A AD Q3 3AAAh Q3 Q4 Q1 00h 0003h 3AABh 0E55h CE ALE OE Memory Cycle Instruction Execution Note 1: Opcode Fetch SLEEP from 007554h Opcode Fetch MOVLW 55h from 007556h INST(PC – 2) SLEEP Sleep Mode, Bus Inactive(1) Bus becomes inactive regardless of power-managed mode entered when SLEEP is executed.  2010 Microchip Technology Inc. DS39635C-page 101 PIC18F6310/6410/8310/8410 8.3 The Address Latch Enable (ALE) pin indicates that the address bits, A, are available on the external memory interface bus. The Output Enable signal (OE) will enable one byte of program memory for a portion of the instruction cycle, then BA0 will change and the second byte will be enabled to form the 16-bit instruction word. The Least Significant bit of the address, BA0, must be connected to the memory devices in this mode. The Chip Enable signal (CE) is active at any time that the microcontroller accesses external memory, whether reading or writing; it is inactive (asserted high) whenever the device is in Sleep mode. 8-Bit Mode The external memory interface implemented in PIC18F8410 devices operates only in 8-Bit Multiplexed mode; data shares the 8 Least Significant bits of the address bus. Figure 8-1 shows an example of 8-Bit Multiplexed mode for PIC18F8410 devices. This mode is used for a single 8-bit memory connected for 16-bit operation. The instructions will be fetched as two 8-bit bytes on a shared data/address bus. The two bytes are sequentially fetched within one instruction cycle (TCY). Therefore, the designer must choose external memory devices according to timing calculations based on 1/2 TCY (2 times the instruction rate). For proper memory speed selection, glue logic propagation delay times must be considered along with setup and hold times. FIGURE 8-7: This generally includes basic EPROM and Flash devices. It allows table writes to byte-wide external memories. During a TBLWT instruction cycle, the TABLAT data is presented on the upper and lower bytes of the AD bus. The appropriate level of the BA0 control line is strobed on the LSb of the TBLPTR. 8-BIT MULTIPLEXED MODE EXAMPLE D PIC18F8410 AD ALE 373 A A A0 D D AD CE A OE WR(2) BA0 CE OE WRL Address Bus Data Bus Control Lines Note 1: 2: DS39635C-page 102 Upper order address bits are used only for 20-bit address width. The upper AD byte is used for all address widths except 8-bit. This signal only applies to table writes. See Section 7.1 “Table Reads and Table Writes”.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 8.3.1 8-BIT MODE TIMING The presentation of control signals on the external memory bus is different for the various operating modes. Typical signal timing diagrams are shown in Figure 8-4 through Figure 8-6. FIGURE 8-8: EXTERNAL MEMORY BUS TIMING FOR TBLRD (MICROPROCESSOR MODE) Apparent Q Actual Q Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 Q4 Q1 A 00h 0Ch AD 3Ah CFh ABh AD 55h 0Eh Q4 Q2 Q4 Q3 Q4 Q4 92h 33h BA0 ALE OE WRL ‘1’ ‘1’ CE ‘0’ ‘0’ 1 TCY Wait Memory Cycle Instruction Execution FIGURE 8-9: Opcode Fetch MOVLW 55h from 007556h Table Read of 92h from 199E67h TBLRD Cycle 1 TBLRD Cycle 2 EXTERNAL MEMORY BUS TIMING FOR TBLRD (EXTENDED MICROCONTROLLER MODE) Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 A 0Ch AD CFh 33h AD Q4 Q1 Q2 Q3 Q4 92h CE ALE OE Memory Cycle Instruction Execution Opcode Fetch TBLRD * from 000100h Opcode Fetch MOVLW 55h from 000102h TBLRD 92h from 199E67h Opcode Fetch ADDLW 55h from 000104h INST(PC – 2) TBLRD Cycle 1 TBLRD Cycle 2 MOVLW  2010 Microchip Technology Inc. DS39635C-page 103 PIC18F6310/6410/8310/8410 FIGURE 8-10: EXTERNAL MEMORY BUS TIMING FOR SLEEP (MICROPROCESSOR MODE) Q1 Q2 Q3 Q4 Q1 Q2 00h A AD AAh 00h Q4 Q1 00h 3Ah AD Q3 3Ah 03h ABh 0Eh 55h CE ALE OE Memory Cycle Instruction Execution Note 1: Opcode Fetch SLEEP from 007554h Opcode Fetch MOVLW 55h from 007556h INST(PC – 2) SLEEP Sleep Mode, Bus Inactive(1) Bus becomes inactive regardless of power-managed mode entered when SLEEP is executed. DS39635C-page 104  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 8.4 Operation in Power-Managed Modes In alternate, power-managed Run modes, the external bus continues to operate normally. If a clock source with a lower speed is selected, bus operations will run at that speed. In these cases, excessive access times for the external memory may result if wait states have been enabled and added to external memory operations. TABLE 8-2: Name If operations in a lower power Run mode are anticipated, users should provide in their applications for adjusting memory access times at the lower clock speeds. In Sleep and Idle modes, the microcontroller core does not need to access data; bus operations are suspended. The state of the external bus is frozen with the address/data pins and most of the control pins holding at the same state they were in when the mode was invoked. The only potential changes are the CE, LB and UB pins which are held at logic high. REGISTERS ASSOCIATED WITH THE EXTERNAL MEMORY INTERFACE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page MEMCON EBDIS — WAIT1 WAIT0 — — WM1 WM0 65 CONFIG3L WAIT BW — — — — PM1 PM0 285 CONFIG3H MCLRE — — — — LPT1OSC — CCP2MX 286 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for the external memory interface.  2010 Microchip Technology Inc. DS39635C-page 105 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 106  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 9.0 8 x 8 HARDWARE MULTIPLIER 9.1 Introduction EXAMPLE 9-1: MOVF MULWF All PIC18 devices include an 8 x 8 hardware multiplier as part of the ALU. The multiplier performs an unsigned operation and yields a 16-bit result that is stored in the product register pair PRODH:PRODL. The multiplier’s operation does not affect any flags in the STATUS register. ARG1, W ARG2 EXAMPLE 9-2: Making multiplication a hardware operation allows it to be completed in a single instruction cycle. This has the advantages of higher computational throughput and reduced code size for multiplication algorithms and allows the PIC18 devices to be used in many applications previously reserved for digital signal processors. A comparison of various hardware and software multiply operations, along with the savings in memory and execution time, is shown in Table 9-1. 9.2 8 x 8 UNSIGNED MULTIPLY ROUTINE ; ; ARG1 * ARG2 -> ; PRODH:PRODL 8 x 8 SIGNED MULTIPLY ROUTINE MOVF MULWF ARG1, W ARG2 BTFSC SUBWF ARG2, SB PRODH, F MOVF BTFSC SUBWF ARG2, W ARG1, SB PRODH, F ; ; ; ; ; ARG1 * ARG2 -> PRODH:PRODL Test Sign Bit PRODH = PRODH - ARG1 ; Test Sign Bit ; PRODH = PRODH ; - ARG2 Operation Example 9-1 shows the instruction sequence for an 8 x 8 unsigned multiplication. Only one instruction is required when one of the arguments is already loaded in the WREG register. Example 9-2 shows the sequence to do an 8 x 8 signed multiplication. To account for the sign bits of the arguments, each argument’s Most Significant bit (MSb) is tested and the appropriate subtractions are done. TABLE 9-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS Routine 8 x 8 Unsigned 8 x 8 Signed 16 x 16 Unsigned 16 x 16 Signed Multiply Method Without Hardware Multiply Program Memory (Words) Cycles (Max) Time @ 40 MHz @ 10 MHz @ 4 MHz 13 69 6.9 s 27.6 s 69 s Hardware Multiply 1 1 100 ns 400 ns 1 s Without Hardware Multiply 33 91 9.1 s 36.4 s 91 s Hardware Multiply 6 6 600 ns 2.4 s 6 s Without Hardware Multiply 21 242 24.2 s 96.8 s 242 s Hardware Multiply 28 28 2.8 s 11.2 s 28 s Without Hardware Multiply 52 254 25.4 s 102.6 s 254 s Hardware Multiply 35 40 4.0 s 16.0 s 40 s  2010 Microchip Technology Inc. DS39635C-page 107 PIC18F6310/6410/8310/8410 Example 9-3 shows the sequence to do a 16 x 16 unsigned multiplication. Equation 9-1 shows the algorithm that is used. The 32-bit result is stored in four registers (RES3:RES0). EQUATION 9-1: RES3:RES0 = = EXAMPLE 9-3: 16 x 16 UNSIGNED MULTIPLICATION ALGORITHM ARG1H:ARG1L  ARG2H:ARG2L (ARG1H  ARG2H  216) + (ARG1H  ARG2L  28) + (ARG1L  ARG2H  28) + (ARG1L  ARG2L) EQUATION 9-2: RES3:RES0= ARG1H:ARG1L  ARG2H:ARG2L = (ARG1H  ARG2H  216) + (ARG1H  ARG2L  28) + (ARG1L  ARG2H  28) + (ARG1L  ARG2L) + (-1  ARG2H  ARG1H:ARG1L  216) + (-1  ARG1H  ARG2H:ARG2L  216) EXAMPLE 9-4: ARG1L, W ARG2L MOVFF MOVFF PRODH, RES1 PRODL, RES0 MOVF MULWF ARG1H, W ARG2H MOVFF MOVFF PRODH, RES3 PRODL, RES2 MOVF MULWF ARG1L, W ARG2H MOVF ADDWF MOVF ADDWFC CLRF ADDWFC PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F MOVF MULWF ARG1H, W ARG2L MOVF ADDWF MOVF ADDWFC CLRF ADDWFC PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F ; ARG1L * ARG2L-> ; PRODH:PRODL ; ; ARG1L, W ARG2L MOVFF MOVFF PRODH, RES1 PRODL, RES0 MOVF MULWF ARG1H, W ARG2H MOVFF MOVFF PRODH, RES3 PRODL, RES2 MOVF MULWF ARG1L, W ARG2H MOVF ADDWF MOVF ADDWFC CLRF ADDWFC PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F MOVF MULWF ARG1H, W ARG2L MOVF ADDWF MOVF ADDWFC CLRF ADDWFC PRODL, W RES1, F PRODH, W RES2, F WREG RES3, F BTFSS BRA MOVF SUBWF MOVF SUBWFB ARG2H, 7 SIGN_ARG1 ARG1L, W RES2 ARG1H, W RES3 ; ARG2H:ARG2L neg? ; no, check ARG1 ; ; ; ; SIGN_ARG1 BTFSS BRA MOVF SUBWF MOVF SUBWFB ; CONT_CODE ARG1H, 7 CONT_CODE ARG2L, W RES2 ARG2H, W RES3 ; ARG1H:ARG1L neg? ; no, done ; ; ; ARG1L * ARG2H-> PRODH:PRODL Add cross products ARG1H * ARG2L-> PRODH:PRODL Add cross products Example 9-4 shows the sequence to do a 16 x 16 signed multiply. Equation 9-2 shows the algorithm used. The 32-bit result is stored in four registers (RES3:RES0). To account for the sign bits of the arguments, the MSb for each argument pair is tested and the appropriate subtractions are done. DS39635C-page 108 ; ; ; ; ; ; ; ; ARG1L * ARG2H -> PRODH:PRODL Add cross products ; ; ; ; ; ; ; ; ; ; ; ; ARG1H * ARG2H -> ; PRODH:PRODL ; ; ; ; ; ; ; ; ; ; ; ; ; ARG1L * ARG2L -> ; PRODH:PRODL ; ; ; ; ; ARG1H * ARG2H-> ; PRODH:PRODL ; ; 16 x 16 SIGNED MULTIPLY ROUTINE MOVF MULWF 16 x 16 UNSIGNED MULTIPLY ROUTINE MOVF MULWF 16 x 16 SIGNED MULTIPLICATION ALGORITHM ; ; ; ; ; ; ; ; ; ARG1H * ARG2L -> PRODH:PRODL Add cross products ;  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 10.0 INTERRUPTS The PIC18F6310/6410/8310/8410 devices have multiple interrupt sources and an interrupt priority feature that allows most interrupt sources to be assigned a high-priority level or a low-priority level. The high-priority interrupt vector is at 0008h and the lowpriority interrupt vector is at 0018h. High-priority interrupt events will interrupt any low-priority interrupts that may be in progress. There are ten registers which are used to control interrupt operation. These registers are: • • • • • • • RCON INTCON INTCON2 INTCON3 PIR1, PIR2, PIR3 PIE1, PIE2, PIE3 IPR1, IPR2, IPR3 It is recommended that the Microchip header files supplied with MPLAB® IDE be used for the symbolic bit names in these registers. This allows the assembler/ compiler to automatically take care of the placement of these bits within the specified register. In general, interrupt sources have three bits to control their operation. They are: • Flag bit to indicate that an interrupt event occurred • Enable bit that allows program execution to branch to the interrupt vector address when the flag bit is set • Priority bit to select high priority or low priority The interrupt priority feature is enabled by setting the IPEN bit (RCON). When interrupt priority is enabled, there are two bits which enable interrupts globally. Setting the GIEH bit (INTCON) enables all interrupts that have the priority bit set (high priority). Setting the GIEL bit (INTCON) enables all interrupts that have the priority bit cleared (low priority). When the interrupt flag, enable bit and appropriate global interrupt enable bit are set, the interrupt will vector immediately to address 0008h or 0018h, depending on the priority bit setting. Individual interrupts can be disabled through their corresponding enable bits.  2010 Microchip Technology Inc. When the IPEN bit is cleared (default state), the interrupt priority feature is disabled and interrupts are compatible with PIC® mid-range devices. In Compatibility mode, the interrupt priority bits for each source have no effect. INTCON is the PEIE bit, which enables/disables all peripheral interrupt sources. INTCON is the GIE bit, which enables/disables all interrupt sources. All interrupts branch to address 0008h in Compatibility mode. When an interrupt is responded to, the global interrupt enable bit is cleared to disable further interrupts. If the IPEN bit is cleared, this is the GIE bit. If interrupt priority levels are used, this will either be the GIEH or GIEL bit. High-priority interrupt sources can interrupt a lowpriority interrupt. Low-priority interrupts are not processed while high-priority interrupts are in progress. The return address is pushed onto the stack and the PC is loaded with the interrupt vector address (0008h or 0018h). Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bits must be cleared in software before re-enabling interrupts to avoid recursive interrupts. The “return from interrupt” instruction, RETFIE, exits the interrupt routine and sets the GIE bit (GIEH or GIEL if priority levels are used), which re-enables interrupts. For external interrupt events, such as the INTx pins or the PORTB input change interrupt, the interrupt latency will be three to four instruction cycles. The exact latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set, regardless of the status of their corresponding enable bit or the GIE bit. Note: Do not use the MOVFF instruction to modify any of the interrupt control registers while any interrupt is enabled. Doing so may cause erratic microcontroller behavior. DS39635C-page 109 PIC18F6310/6410/8310/8410 FIGURE 10-1: PIC18F6310/6410/8310/8410 INTERRUPT LOGIC Wake-up if in Idle or Sleep modes TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP INT0IF INT0IE INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP INT3IF INT3IE INT3IP PIR1 PIE1 IPR1 PIR2 PIE2 IPR2 Interrupt to CPU Vector to Location 0008h GIEH/GIE IPE PIR3 PIE3 IPR3 IPEN GIEL/PEIE IPEN High-Priority Interrupt Generation Low-Priority Interrupt Generation PIR1 PIE1 IPR1 PIR2 PIE2 IPR2 PIR3 PIE3 IPR3 TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP INT3IF INT3IE INT3IP DS39635C-page 110 Interrupt to CPU Vector to Location 0018h IPEN GIEH/GIE GIEL/PEIE  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 10.1 INTCON Registers Note: The INTCON registers are readable and writable registers which contain various enable, priority and flag bits. REGISTER 10-1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure that the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GIE/GIEH: Global Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked interrupts 0 = Disables all interrupts When IPEN = 1: 1 = Enables all high-priority interrupts 0 = Disables all interrupts bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts When IPEN = 1: 1 = Enables all low-priority peripheral interrupts 0 = Disables all low-priority peripheral interrupts bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 overflow interrupt 0 = Disables the TMR0 overflow interrupt bit 4 INT0IE: INT0 External Interrupt Enable bit 1 = Enables the INT0 external interrupt 0 = Disables the INT0 external interrupt bit 3 RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INT0IF: INT0 External Interrupt Flag bit 1 = The INT0 external interrupt occurred (must be cleared in software) 0 = The INT0 external interrupt did not occur bit 0 RBIF: RB Port Change Interrupt Flag bit(1) 1 = At least one of the RB pins changed state (must be cleared in software) 0 = None of the RB pins have changed state Note 1: A mismatch condition will continue to set this bit. Reading PORTB will end the mismatch condition and allow the bit to be cleared.  2010 Microchip Technology Inc. DS39635C-page 111 PIC18F6310/6410/8310/8410 REGISTER 10-2: INTCON2: INTERRUPT CONTROL REGISTER 2 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INT3IP RBIP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 RBPU: PORTB Pull-up Enable bit 1 = All PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6 INTEDG0: External Interrupt 0 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 5 INTEDG1: External Interrupt 1 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 4 INTEDG2: External Interrupt 2 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 3 INTEDG3: External Interrupt 3 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 INT3IP: INT3 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 RBIP: RB Port Change Interrupt Priority bit 1 = High priority 0 = Low priority Note: x = Bit is unknown Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. DS39635C-page 112  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 10-3: INTCON3: INTERRUPT CONTROL REGISTER 3 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INT2IP INT1IP INT3IE INT2IE INT1IE INT3IF INT2IF INT1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 INT2IP: INT2 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 INT1IP: INT1 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 INT3IE: INT3 External Interrupt Enable bit 1 = Enables the INT3 external interrupt 0 = Disables the INT3 external interrupt bit 4 INT2IE: INT2 External Interrupt Enable bit 1 = Enables the INT2 external interrupt 0 = Disables the INT2 external interrupt bit 3 INT1IE: INT1 External Interrupt Enable bit 1 = Enables the INT1 external interrupt 0 = Disables the INT1 external interrupt bit 2 INT3IF: INT3 External Interrupt Flag bit 1 = The INT3 external interrupt occurred (must be cleared in software) 0 = The INT3 external interrupt did not occur bit 1 INT2IF: INT2 External Interrupt Flag bit 1 = The INT2 external interrupt occurred (must be cleared in software) 0 = The INT2 external interrupt did not occur bit 0 INT1IF: INT1 External Interrupt Flag bit 1 = The INT1 external interrupt occurred (must be cleared in software) 0 = The INT1 external interrupt did not occur Note: x = Bit is unknown Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global interrupt enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling.  2010 Microchip Technology Inc. DS39635C-page 113 PIC18F6310/6410/8310/8410 10.2 PIR Registers The PIR registers contain the individual flag bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Request (Flag) registers (PIR1, PIR2, PIR3). Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE (INTCON). 2: User software should ensure the appropriate interrupt flag bits are cleared prior to enabling an interrupt and after servicing that interrupt. REGISTER 10-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1 R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit 1 = A read or a write operation has taken place (must be cleared in software) 0 = No read or write has occurred bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete bit 5 RC1IF: EUSART Receive Interrupt Flag bit 1 = The EUSART receive buffer, RCREG1, is full (cleared when RCREG1 is read) 0 = The EUSART receive buffer is empty bit 4 TX1IF: EUSART Transmit Interrupt Flag bit 1 = The EUSART transmit buffer, TXREG1, is empty (cleared when TXREG1 is written) 0 = The EUSART transmit buffer is full bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit 1 = The transmission/reception is complete (must be cleared in software) 0 = Waiting to transmit/receive bit 2 CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1/TMR3 register capture occurred (must be cleared in software) 0 = No TMR1/TMR3 register capture occurred Compare mode: 1 = A TMR1/TMR3 register compare match occurred (must be cleared in software) 0 = No TMR1/TMR3 register compare match occurred PWM mode: Unused in this mode. bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow DS39635C-page 114  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 10-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit 1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software) 0 = Device clock operating bit 6 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 5-4 Unimplemented: Read as ‘0’ bit 3 BCLIF: Bus Collision Interrupt Flag bit 1 = A bus collision occurred (must be cleared in software) 0 = No bus collision occurred bit 2 HLVDIF: High/Low-Voltage Detect Interrupt Flag bit 1 = A low-voltage condition occurred (must be cleared in software) 0 = The device voltage is above the Low-Voltage Detect trip point bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit 1 = TMR3 register overflowed (must be cleared in software) 0 = TMR3 register did not overflow bit 0 CCP2IF: CCP2 Interrupt Flag bit Capture mode: 1 = A TMR1/TMR3 register capture occurred (must be cleared in software) 0 = No TMR1/TMR3 register capture occurred Compare mode: 1 = A TMR1/TMR3 register compare match occurred (must be cleared in software) 0 = No TMR1/TMR3 register compare match occurred PWM mode: Unused in this mode.  2010 Microchip Technology Inc. DS39635C-page 115 PIC18F6310/6410/8310/8410 REGISTER 10-6: PIR3: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 3 U-0 U-0 R-0 R-0 U-0 U-0 U-0 U-0 — — RC2IF TX21F — — — CCP3IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5 RC2IF: AUSART Receive Interrupt Flag bit 1 = The AUSART receive buffer, RCREG2, is full (cleared when RCREG2 is read) 0 = The AUSART receive buffer is empty bit 4 TX2IF: AUSART Transmit Interrupt Flag bit 1 = The AUSART transmit buffer, TXREG2, is empty (cleared when TXREG2 is written) 0 = The AUSART transmit buffer is full bit 3-1 Unimplemented: Read as ‘0’ bit 0 CCP3IF: CCP3 Interrupt Flag bit Capture mode: 1 = A TMR1/TMR3 register capture occurred (must be cleared in software) 0 = No TMR1/TMR3 register capture occurred Compare mode: 1 = A TMR1/TMR3 register compare match occurred (must be cleared in software) 0 = No TMR1/TMR3 register compare match occurred PWM mode: Unused in this mode. DS39635C-page 116  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 10.3 PIE Registers The PIE registers contain the individual enable bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Enable registers (PIE1, PIE2, PIE3). When IPEN = 0, the PEIE bit must be set to enable any of these peripheral interrupts. REGISTER 10-7: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit 1 = Enables the PSP read/write interrupt 0 = Disables the PSP read/write interrupt bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt bit 5 RC1IE: EUSART Receive Interrupt Enable bit 1 = Enables the EUSART receive interrupt 0 = Disables the EUSART receive interrupt bit 4 TX1IE: EUSART Transmit Interrupt Enable bit 1 = Enables the EUSART transmit interrupt 0 = Disables the EUSART transmit interrupt bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt  2010 Microchip Technology Inc. x = Bit is unknown DS39635C-page 117 PIC18F6310/6410/8310/8410 REGISTER 10-8: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit 1 = Enabled 0 = Disabled bit 6 CMIE: Comparator Interrupt Enable bit 1 = Enabled 0 = Disabled bit 5-4 Unimplemented: Read as ‘0’ bit 3 BCLIE: Bus Collision Interrupt Enable bit 1 = Enabled 0 = Disabled bit 2 HLVDIE: High/Low-Voltage Detect Interrupt Enable bit 1 = Enabled 0 = Disabled bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit 1 = Enabled 0 = Disabled bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enabled 0 = Disabled DS39635C-page 118 x = Bit is unknown  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 10-9: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3 U-0 U-0 R-0 R-0 U-0 U-0 U-0 R/W-0 — — RC2IE TX2IE — — — CCP3IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 RC2IE: AUSART Receive Interrupt Enable bit 1 = Enabled 0 = Disabled bit 4 TX2IE: AUSART Transmit Interrupt Enable bit 1 = Enabled 0 = Disabled bit 3-1 Unimplemented: Read as ‘0’ bit 0 CCP3IE: CCP3 Interrupt Enable bit 1 = Enabled 0 = Disabled  2010 Microchip Technology Inc. x = Bit is unknown DS39635C-page 119 PIC18F6310/6410/8310/8410 10.4 IPR Registers The IPR registers contain the individual priority bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are three Peripheral Interrupt Priority registers (IPR1, IPR2, IPR3). Using the priority bits requires that the Interrupt Priority Enable (IPEN) bit be set. REGISTER 10-10: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 PSPIP: Parallel Slave Port Read/Write Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 ADIP: A/D Converter Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 RC1IP: EUSART Receive Interrupt Priority bit 1 = High priority 0 = Low priority bit 4 TX1IP: EUSART Transmit Interrupt Priority bit x = Bit is unknown 1 = High priority 0 = Low priority bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit 1 = High priority 0 = Low priority’ bit 2 CCP1IP: CCP1 Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority DS39635C-page 120  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 10-11: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2 R/W-1 R/W-1 U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 CMIP: Comparator Interrupt Priority bit 1 = High priority 0 = Low priority bit 5-4 Unimplemented: Read as ‘0’ bit 3 BCLIP: Bus Collision Interrupt Priority bit 1 = High priority 0 = Low priority bit 2 HLVDIP: High/Low-Voltage Detect Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 CCP2IP: CCP2 Interrupt Priority bit 1 = High priority 0 = Low priority  2010 Microchip Technology Inc. x = Bit is unknown DS39635C-page 121 PIC18F6310/6410/8310/8410 REGISTER 10-12: IPR3: PERIPHERAL INTERRUPT PRIORITY REGISTER 3 U-0 U-0 R-1 R-1 U-0 U-0 U-0 R/W-1 — — RC2IP TX21P — — — CCP3IP bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5 RC2IP: AUSART Receive Priority Flag bit 1 = High priority 0 = Low priority bit 4 TX2IP: AUSART Transmit Interrupt Priority bit 1 = High priority 0 = Low priority bit 3-1 Unimplemented: Read as ‘0’ bit 0 CCP3IP: CCP3 Interrupt Priority bit 1 = High priority 0 = Low priority DS39635C-page 122 x = Bit is unknown  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 10.5 RCON Register The RCON register contains bits used to determine the cause of the last Reset or wake-up from Idle or Sleep modes. RCON also contains the bit that enables interrupt priorities (IPEN). REGISTER 10-13: RCON REGISTER R/W-0 R/W-1 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: Software BOR Enable bit For details of bit operation and Reset state, see Register 5-1. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit For details of bit operation, see Register 5-1. bit 3 TO: Watchdog Timer Time-out Flag bit For details of bit operation, see Register 5-1. bit 2 PD: Power-Down Detection Flag bit For details of bit operation, see Register 5-1. bit 1 POR: Power-on Reset Status bit For details of bit operation, see Register 5-1. bit 0 BOR: Brown-out Reset Status bit For details of bit operation, see Register 5-1.  2010 Microchip Technology Inc. DS39635C-page 123 PIC18F6310/6410/8310/8410 10.6 INTx Pin Interrupts 10.7 TMR0 Interrupt External interrupts on the RB0/INT0, RB1/INT1, RB2/ INT2 and RB3/INT3 pins are edge-triggered. If the corresponding INTEDGx bit in the INTCON2 register is set (= 1), the interrupt is triggered by a rising edge; if the bit is clear, the trigger is on the falling edge. When a valid edge appears on the RBx/INTx pin, the corresponding flag bit, INTxIF, is set. This interrupt can be disabled by clearing the corresponding enable bit, INTxIE. Flag bit, INTxIF, must be cleared in software in the Interrupt Service Routine before re-enabling the interrupt. In 8-bit mode (which is the default), an overflow in the TMR0 register (FFh  00h) will set flag bit, TMR0IF. In 16-bit mode, an overflow in the TMR0H:TMR0L register pair (FFFFh 0000h) will set TMR0IF. The interrupt can be enabled/disabled by setting/clearing enable bit, TMR0IE (INTCON). Interrupt priority for Timer0 is determined by the value contained in the interrupt priority bit, TMR0IP (INTCON2). See Section 12.0 “Timer0 Module” for further details on the Timer0 module. All external interrupts (INT0, INT1, INT2 and INT3) can wake-up the processor from the power-managed modes if bit, INTxIE, was set prior to going into powermanaged modes. If the Global Interrupt Enable bit, GIE, is set, the processor will branch to the interrupt vector following wake-up. 10.8 Interrupt priority for INT1, INT2 and INT3 is determined by the value contained in the interrupt priority bits, INT1IP (INTCON3), INT2IP (INTCON3) and INT3IP (INTCON2). There is no priority bit associated with INT0. It is always a high-priority interrupt source. EXAMPLE 10-1: An input change on PORTB sets flag bit, RBIF (INTCON). The interrupt can be enabled/disabled by setting/clearing enable bit, RBIE (INTCON). Interrupt priority for PORTB interrupt-on-change is determined by the value contained in the interrupt priority bit, RBIP (INTCON2). 10.9 Context Saving During Interrupts During interrupts, the return PC address is saved on the stack. Additionally, the WREG, STATUS and BSR registers are saved on the fast return stack. If a fast return from interrupt is not used (see Section 6.3 “Data Memory Organization”), the user may need to save the WREG, STATUS and BSR registers on entry to the Interrupt Service Routine. Depending on the user’s application, other registers may also need to be saved. Example 10-1 saves and restores the WREG, STATUS and BSR registers during an Interrupt Service Routine. SAVING STATUS, WREG AND BSR REGISTERS IN RAM MOVWF W_TEMP MOVFF STATUS, STATUS_TEMP MOVFF BSR, BSR_TEMP ; ; USER ISR CODE ; MOVFF BSR_TEMP, BSR MOVF W_TEMP, W MOVFF STATUS_TEMP, STATUS DS39635C-page 124 PORTB Interrupt-on-Change ; W_TEMP is in virtual bank ; STATUS_TEMP located anywhere ; BSR_TMEP located anywhere ; Restore BSR ; Restore WREG ; Restore STATUS  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 11.0 I/O PORTS 11.1 Depending on the device selected and features enabled, there are up to nine ports available. Some pins of the I/O ports are multiplexed with an alternate function from the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has three registers for its operation. These registers are: • TRIS register (Data Direction register) • PORT register (reads the levels on the pins of the device) • LAT register (Output Latch register) The Output Latch (LAT register) is useful for read-modify-write operations on the value that the I/O pins are driving. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 11-1. FIGURE 11-1: GENERIC I/O PORT OPERATION RD LAT Data Bus WR LAT or Port D Q I/O pin(1) CK D WR TRIS Reading the PORTA register reads the status of the pins, whereas writing to it, will write to the port latch. The Output Latch register (LATA) is also memory mapped. Read-modify-write operations on the LATA register read and write the latched output value for PORTA. The RA4 pin is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. Pins, RA6 and RA7, are multiplexed with the main oscillator pins. They are enabled as oscillator or I/O pins by the selection of the main oscillator in the Configuration register (see Section 24.1 “Configuration Bits” for details). When they are not used as port pins, RA6 and RA7 and their associated TRIS and LAT bits are read as ‘0’. The other PORTA pins are multiplexed with the analog VREF+ and VREF- inputs. The operation of pins, RA, as A/D Converter inputs is selected by clearing or setting the PCFG control bits in the ADCON1 register. Q CK TRIS Latch Input Buffer RD TRIS Q D ENEN The TRISA register controls the direction of the PORTA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 11-1: I/O pins have diode protection to VDD and VSS. CLRF MOVLW MOVWF MOVWF MOVWF MOVLW MOVWF  2010 Microchip Technology Inc. On a Power-on Reset, RA5 and RA are configured as analog inputs and read as ‘0’. RA4 is configured as a digital input. The RA4/T0CKI pin is a Schmitt Trigger input and an open-drain output. All other PORTA pins have TTL input levels and full CMOS output drivers. CLRF RD Port Note 1: PORTA is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). Note: Data Latch PORTA, TRISA and LATA Registers PORTA ; ; ; LATA ; ; ; 07h ; ADCON1 ; 07h ; CMCON ; 0CFh ; ; ; TRISA ; ; INITIALIZING PORTA Initialize PORTA by clearing output data latches Alternate method to clear output data latches Configure A/D for digital inputs Configure comparators for digital input Value used to initialize data direction Set RA as inputs RA as outputs DS39635C-page 125 PIC18F6310/6410/8310/8410 TABLE 11-1: Pin Name PORTA FUNCTIONS Function TRIS Setting I/O I/O Type RA0 0 O DIG LATA data output; not affected by analog input. 1 I TTL PORTA data input; disabled when analog input enabled. AN0 1 I ANA A/D Input Channel 0. Default input configuration on POR; does not affect digital output. RA1 0 O DIG LATA data output; not affected by analog input. 1 I TTL PORTA data input; disabled when analog input enabled. AN1 1 I ANA A/D Input Channel 1. Default input configuration on POR; does not affect digital output. RA2 0 O DIG LATA data output; not affected by analog input. Disabled when CVREF output enabled. 1 I TTL PORTA data input. Disabled when analog functions enabled; disabled when CVREF output enabled. AN2 1 I ANA A/D Input Channel 2. Default input configuration on POR; not affected by analog output. VREF- 1 I ANA Comparator voltage reference low input and A/D voltage reference low input. RA3 0 O DIG LATA data output; not affected by analog input. 1 I TTL PORTA data input; disabled when analog input enabled. RA0/AN0 RA1/AN1 RA2/AN2/VREF- RA3/AN3/VREF+ RA4/T0CKI RA5/AN4/HLVDIN AN3 1 I ANA A/D Input Channel 3. Default input configuration on POR. VREF+ 1 I ANA Comparator voltage reference high input and A/D voltage reference high input. RA4 0 O DIG LATA data output 1 I ST PORTA data input; default configuration on POR. T0CKI x I ST Timer0 clock input. RA5 0 O DIG LATA data output; not affected by analog input. 1 I TTL PORTA data input; disabled when analog input enabled. AN4 1 I ANA A/D Input Channel 4. Default configuration on POR. HLVDIN 1 I ANA High/Low-Voltage Detect external trip point input. OSC2 x O ANA Main oscillator feedback output connection (XT, HS and LP modes). CLKO x O DIG System cycle clock output (FOSC/4) in all oscillator modes except RCIO, INTIO2 and ECIO. RA6 0 O DIG LATA data output. Enabled in RCIO, INTIO2 and ECIO modes only. 1 I TTL PORTA data input. Enabled in RCIO, INTIO2 and ECIO modes only. OSC1 x I ANA Main oscillator input connection. CLKI x I ANA Main clock input connection. RA7 0 O DIG LATA data output. Disabled in External Oscillator modes. 1 I TTL PORTA data input. Disabled in External Oscillator modes. OSC2/CLKO/RA6 OSC1/CLKI/RA7 Legend: Description O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST= Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). DS39635C-page 126  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-2: Name PORTA SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 66 (1) LATA LATA7 TRISA TRISA7(1) ADCON1 LATA6(1) LATA Output Latch Register TRISA6 — — (1) 66 PORTA Data Direction Register VCFG1 VCFG0 PCFG3 66 PCFG2 PCFG1 PCFG0 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA. Note 1: RA and their associated latch and data direction bits are enabled as I/O pins based on oscillator configuration; otherwise, they are read as ‘0’.  2010 Microchip Technology Inc. DS39635C-page 127 PIC18F6310/6410/8310/8410 11.2 PORTB, TRISB and LATB Registers PORTB is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATB) is also memory mapped. Read-modify-write operations on the LATB register read and write the latched output value for PORTB. EXAMPLE 11-2: CLRF PORTB CLRF LATB MOVLW 0CFh MOVWF TRISB Four of the PORTB pins (RB) have an interrupt-on-change feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB pin configured as an output is excluded from the interrupt-on-change comparison). The input pins (of RB) are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB are ORed together to generate the RB Port Change Interrupt with Flag bit, RBIF (INTCON). This interrupt can wake the device from power-managed modes. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) INITIALIZING PORTB ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTB by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RB as inputs RB as outputs RB as inputs Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit, RBPU (INTCON2). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. DS39635C-page 128 b) c) Any read or write of PORTB (except with the MOVFF (ANY), PORTB instruction). This will end the mismatch condition. Wait one TCY delay (for example, execute one NOP instruction). Clear flag bit, RBIF. A mismatch condition will continue to set flag bit, RBIF. Reading PORTB will end the mismatch condition and allow flag bit, RBIF, to be cleared after a one TCY delay. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. For 80-pin devices, RB3 can be configured as the alternate peripheral pin for the CCP2 module by clearing the CCP2MX Configuration bit. This applies only when the device is in one of the operating modes other than the default Microcontroller mode. If the device is in Microcontroller mode, the alternate assignment for CCP2 is RE7. As with other CCP2 configurations, the user must ensure that the TRISB bit is set appropriately for the intended operation.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-3: Pin Name RB0/INT0 RB1/INT1 RB2/INT2 RB3/INT3/ CCP2 RB4/KBI0 RB5/KBI1 RB6/KBI2/PGC RB7/KBI3/PGD Legend: Note 1: 2: PORTB FUNCTIONS Function TRIS Setting I/O I/O Type RB0 0 O DIG 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. INT0 1 I ST External Interrupt 0 input. RB1 0 O DIG LATB data output. Description LATB data output. 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. INT1 1 I ST External Interrupt 1 input. RB2 0 O DIG LATB data output. 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. INT2 1 I ST External Interrupt 2 input. RB3 0 O DIG LATB data output. 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. INT3 1 I ST External Interrupt 3 input. CCP2(1) 0 O DIG CCP2 compare output and CCP2 PWM output; takes priority over port data. 1 I ST CCP2 capture input. RB4 0 O DIG LATB data output. 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. KBI0 1 I TTL Interrupt-on-change pin. RB5 0 O DIG LATB data output 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. KBI1 1 I TTL Interrupt-on-change pin. RB6 0 O DIG LATB data output 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. KBI2 1 I TTL Interrupt-on-change pin. PGC x I ST Serial execution (ICSP™) clock input for ICSP and ICD operation.(2) RB7 0 O DIG LATB data output. 1 I TTL PORTB data input; weak pull-up when RBPU bit is cleared. KBI3 1 I TTL Interrupt-on-change pin. PGD x O DIG Serial execution data output for ICSP and ICD operation.(2) x I ST Serial execution data input for ICSP and ICD operation.(2) O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Alternate assignment for CCP2 when the CCP2MX Configuration bit is cleared (Microprocessor, Extended Microcontroller and Microcontroller with Boot Block modes, 80-pin devices only); default assignment is RC1. All other pin functions are disabled when ICSP or ICD operations are enabled.  2010 Microchip Technology Inc. DS39635C-page 129 PIC18F6310/6410/8310/8410 TABLE 11-4: Name PORTB SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 66 LATB LATB Output Latch Register 66 TRISB PORTB Data Direction Register 66 INTCON GIE/GIEH PEIE/GIEL INTCON2 RBPU INTCON3 INT2IP TMR0IF INT0IF RBIF 63 INTEDG0 INTEDG1 INTEDG2 INTEDG3 TMR0IP INT3IP RBIP 63 INT2IF INT1IF 63 INT1IP TMR0IE INT3IE INT0IE INT2IE RBIE INT1IE INT3IF Legend: Shaded cells are not used by PORTB. DS39635C-page 130  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 11.3 PORTC, TRISC and LATC Registers PORTC is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISC. Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATC) is also memory mapped. Read-modify-write operations on the LATC register read and write the latched output value for PORTC. PORTC is multiplexed with several peripheral functions (Table 11-5). The pins have Schmitt Trigger input buffers. RC1 is normally configured by Configuration bit, CCP2MX, as the default peripheral pin of the CCP2 module (default/erased state, CCP2MX = 1). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for the correct TRIS bit settings.  2010 Microchip Technology Inc. Note: On a Power-on Reset, these pins are configured as digital inputs. The contents of the TRISC register are affected by peripheral overrides. Reading TRISC always returns the current contents, even though a peripheral device may be overriding one or more of the pins. EXAMPLE 11-3: CLRF PORTC CLRF LATC MOVLW 0CFh MOVWF TRISC INITIALIZING PORTC ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTC by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RC as inputs RC as outputs RC as inputs DS39635C-page 131 PIC18F6310/6410/8310/8410 TABLE 11-5: PORTC FUNCTIONS Pin Name Function RC0/T1OSO/T13CKI RC0 RC1/T1OSI/CCP2 RC2/CCP1 RC3/SCK/SCL RC7/RX1/DT1 Legend: Note 1: Description O DIG I ST T1OSO x O ANA T13CKI 1 I ST Timer1/Timer3 counter input. RC1 0 O DIG LATC data output. 1 I ST PORTC data input. T1OSI x I ANA Timer1 oscillator input; enabled when Timer1 oscillator is enabled. Disables digital I/O. CCP2(1) 0 O DIG CCP2 compare output and CCP2 PWM output; takes priority over port data. LATC data output. PORTC data input. Timer1 oscillator output; enabled when Timer1 oscillator is enabled. Disables digital I/O. 1 I ST CCP2 capture input RC2 0 O DIG LATC data output. 1 I ST PORTC data input. CCP1 0 O DIG CCP1 compare output and CCP1 PWM output; takes priority over port data. 1 I ST CCP1 capture input. RC3 0 O DIG LATC data output. 1 I ST PORTC data input. 0 O DIG SPI clock output (MSSP module); takes priority over port data. 1 I ST SPI clock input (MSSP module). 0 O DIG I2C™ clock output (MSSP module); takes priority over port data. 1 I ST I2C clock input (MSSP module); input type depends on module setting. RC4 0 O DIG LATC data output. 1 I ST PORTC data input. SDI 1 I ST SPI data input (MSSP module). SDA 1 O DIG I2C data output (MSSP module); takes priority over port data. 1 I ST I2C data input (MSSP module); input type depends on module setting. 0 O DIG LATC data output. 1 I ST PORTC data input. SDO 0 O DIG SPI data output (MSSP module); takes priority over port data. RC6 0 O DIG LATC data output. RC5 RC6/TX1/CK1 I/O Type 0 SCL RC5/SDO I/O 1 SCK RC4/SDI/SDA TRIS Setting 1 I ST PORTC data input. TX1 1 O DIG Synchronous serial data output (EUSART module); takes priority over port data. CK1 1 O DIG Synchronous serial data input (EUSART module). User must configure as an input. 1 I ST Synchronous serial clock input (EUSART module). 0 O DIG LATC data output. 1 I ST PORTC data input. RX1 1 I ST Asynchronous serial receive data input (EUSART module) DT1 1 O DIG Synchronous serial data output (EUSART module); takes priority over port data. 1 I ST Synchronous serial data input (EUSART module). User must configure as an input. RC7 O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Default assignment for CCP2 when CCP2MX Configuration bit is set. DS39635C-page 132  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-6: Name PORTC SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 66 LATC LATC Output Latch Register 66 TRISC PORTC Data Direction Register 66  2010 Microchip Technology Inc. DS39635C-page 133 PIC18F6310/6410/8310/8410 11.4 PORTD, TRISD and LATD Registers PORTD is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISD. Setting a TRISD bit (= 1) will make the corresponding PORTD pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISD bit (= 0) will make the corresponding PORTD pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATD) is also memory mapped. Read-modify-write operations on the LATD register read and write the latched output value for PORTD. All pins on PORTD are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Note: On a Power-on Reset, these pins are configured as digital inputs. In 80-pin devices, PORTD is multiplexed with the system bus as part of the external memory interface. I/O port and other functions are only available when the interface is disabled by setting the EBDIS bit (MEMCON). When the interface is enabled, PORTD is the low-order byte of the multiplexed address/data bus (AD). The TRISD bits are also overridden. DS39635C-page 134 PORTD can also be configured to function as an 8-bit wide parallel microprocessor port by setting the PSPMODE Control bit (PSPCON). In this mode, parallel port data takes priority over other digital I/O (but not the external memory interface). When the parallel port is active, the input buffers are TTL. For more information, refer to Section 11.10 “Parallel Slave Port”. EXAMPLE 11-4: CLRF PORTD CLRF LATD MOVLW 0CFh MOVWF TRISD INITIALIZING PORTD ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTD by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RD as inputs RD as outputs RD as inputs  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-7: PORTD FUNCTIONS Pin Name Function TRIS Setting I/O I/O Type RD0/AD0/PSP0 RD0 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 0 output.(1) x I TTL External memory interface, Data Bit 0 input.(1) AD0(2) PSP0 RD1/AD1/PSP1 RD1 AD1(2) PSP1 RD2/AD2/PSP2 RD2 (2) AD2 PSP2 RD3/AD3/PSP3 RD3 AD3(2) PSP3 RD4/AD4/PSP4 RD4 (2) AD4 PSP4 RD5/AD5/PSP5 RD5 AD5(2) PSP5 RD6/AD6/PSP6 RD6 (2) AD6 PSP6 Legend: Note 1: 2: Description x O DIG PSP read data output (LATD); takes priority over port data. x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 1 output.(1) x I TTL External memory interface, Data Bit 1 input.(1) PSP read data output (LATD); takes priority over port data. x O DIG x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 2 output.(1) x I TTL External memory interface, Data Bit 2 input.(1) x O DIG PSP read data output (LATD); takes priority over port data. x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 3 output.(1) x I TTL External memory interface, Data Bit 3 input.(1) PSP read data output (LATD); takes priority over port data. x O DIG x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 4 output.(1) x I TTL External memory interface, Data Bit 4 input.(1) x O DIG PSP read data output (LATD); takes priority over port data. x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 5 output.(1) x I TTL External memory interface, Data Bit 5 input.(1) PSP read data output (LATD); takes priority over port data. x O DIG x I TTL PSP write data input. 0 O DIG LATD data output. 1 I ST PORTD data input. x O DIG-3 x I TTL External memory interface, Data Bit 6 input.(1) x O DIG PSP read data output (LATD); takes priority over port data. x I TTL PSP write data input. External memory interface, Address/Data Bit 6 output.(1) O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). External memory interface I/O takes priority over all other digital and PSP I/O. Implemented on 80-pin devices only.  2010 Microchip Technology Inc. DS39635C-page 135 PIC18F6310/6410/8310/8410 TABLE 11-7: PORTD FUNCTIONS (CONTINUED) Pin Name Function TRIS Setting I/O I/O Type RD7/AD7/PSP7 RD7 0 O DIG LATD data output. AD7(2) PSP7 Legend: Note 1: 2: PORTD 1 I ST PORTD data input. x O DIG External memory interface, Address/Data Bit 7 output(1). x I TTL External memory interface, Data Bit 7 input(1). x O DIG PSP read data output (LATD); takes priority over port data. x I TTL PSP write data input. O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). External memory interface I/O takes priority over all other digital and PSP I/O. Implemented on 80-pin devices only. TABLE 11-8: Name Description SUMMARY OF REGISTERS ASSOCIATED WITH PORTD Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 66 LATD LATD Output Latch Register 66 TRISD PORTD Data Direction Register 66 DS39635C-page 136  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 11.5 PORTE, TRISE and LATE Registers PORTE is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISE. Setting a TRISE bit (= 1) will make the corresponding PORTE pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISE bit (= 0) will make the corresponding PORTE pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATE) is also memory mapped. Read-modify-write operations on the LATE register read and write the latched output value for PORTE. All pins on PORTE are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Note: On a Power-on Reset, these pins are configured as digital inputs. When the Parallel Slave Port is active on PORTD, three of the PORTE pins (RE0/AD8/RD, RE1/AD9/WR and RE2/AD10/CS) are configured as digital control inputs for the port. The control functions are summarized in Table 11-9. The reconfiguration occurs automatically when the PSPMODE Control bit (PSPCON) is set. Users must still make certain the corresponding TRISE bits are set to configure these pins as digital inputs. EXAMPLE 11-5: CLRF PORTE CLRF LATE MOVLW 03h MOVWF TRISE INITIALIZING PORTE ; ; ; ; ; ; ; ; ; ; ; Initialize PORTE by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RE as inputs RE as outputs When the device is operating in Microcontroller mode, pin RE7 can be configured as the alternate peripheral pin for the CCP2 module. This is done by clearing the CCP2MX Configuration bit. In 80-pin devices, PORTE is multiplexed with the system bus as part of the external memory interface. I/O port and other functions are only available when the interface is disabled by setting the EBDIS bit (MEMCON). When the interface is enabled (80-pin devices only), PORTE is the high-order byte of the multiplexed address/data bus (AD). The TRISE bits are also overridden.  2010 Microchip Technology Inc. DS39635C-page 137 PIC18F6310/6410/8310/8410 TABLE 11-9: Pin Name PORTE FUNCTIONS Function TRIS Setting I/O I/O Type RE0 0 O DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 8 output.(2) x I TTL External memory interface, Data Bit 8 input.(2) RD 1 I TTL Parallel Slave Port read enable control input. RE1 0 O DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 9 output.(2) x I TTL External memory interface, Data Bit 9 input.(2) RE0/AD8/RD AD8(3) RE1/AD9/WR AD9(3) RE2/AD10/CS WR 1 I TTL Parallel Slave Port write enable control input. RE2 0 O DIG LATE data output. AD10(3) RE3/AD11 x I TTL External memory interface, Data Bit 10 input.(2) I TTL Parallel Slave Port chip select control input. DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 11 output.(2) x I TTL External memory interface, Data Bit 11 input.(2) 0 O DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 12 output.(2) x I TTL External memory interface, Data Bit 12 input.(2) 0 O DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 13 output.(2) x I TTL External memory interface, Data Bit 13 input.(2) 0 O DIG LATE data output. 1 I ST PORTE data input. x O DIG External memory interface, Address/Data Bit 14 output.(2) x I TTL External memory interface, Data Bit 14 input.(2) 0 O DIG LATE data output. 1 I ST PORTE data input. 0 O DIG CCP2 compare output and CCP2 PWM output; takes priority over port data. 1 I ST CCP2 capture input. x O DIG External memory interface, Address/Data Bit 15 output.(2) x I TTL External memory interface, Data Bit 15 input.(2) (3) (3) RE6 AD14 (3) RE7 CCP2 (1) AD15(3) Note 1: 2: 3: External memory interface, Address/Data Bit 10 output.(2) O AD13(3) Legend: PORTE data input. DIG 0 RE5 RE7/CCP2/AD15 ST O 1 AD12 RE6/AD14 I x CS RE4 RE5/AD13 1 RE3 AD11 RE4/AD12 Description O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Alternate assignment for CCP2 when CCP2MX Configuration bit is cleared (all devices in Microcontroller mode). External memory interface I/O takes priority over all other digital and PSP I/O. Implemented on 80-pin devices only. DS39635C-page 138  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE Name PORTE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 66 LATE LATE Output Latch Register 66 TRISE PORTE Data Direction Register 66  2010 Microchip Technology Inc. DS39635C-page 139 PIC18F6310/6410/8310/8410 11.6 PORTF, LATF and TRISF Registers PORTF is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISF. Setting a TRISF bit (= 1) will make the corresponding PORTF pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISF bit (= 0) will make the corresponding PORTF pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATF) is also memory mapped. Read-modify-write operations on the LATF register read and write the latched output value for PORTF. All pins on PORTF are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. PORTF is multiplexed with several analog peripheral functions, including the A/D Converter and comparator inputs, as well as the comparator outputs. Pins, RF2 through RF6, may be used as comparator inputs or outputs by setting the appropriate bits in the CMCON register. To use RF as digital inputs, it is also necessary to turn off the comparators. Note: Note 1: On a Power-on Reset, the RF pins are configured as inputs and read as ‘0’. 2: To configure PORTF as a digital I/O, turn off the comparators and set the ADCON1 value. EXAMPLE 11-6: CLRF CLRF MOVLW MOVWF MOVLW MOVWF MOVLW MOVWF PORTF ; ; ; LATF ; ; ; 0x07 ; CMCON ; 0x0F ; ADCON1 ; 0xCF ; ; ; TRISF ; ; ; INITIALIZING PORTF Initialize PORTF by clearing output data latches Alternate method to clear output data latches Turn off comparators Set PORTF as digital I/O Value used to initialize data direction Set RF3:RF0 as inputs RF5:RF4 as outputs RF7:RF6 as inputs On a Power-on Reset, RA5 and RA are configured as analog inputs and read as ‘0’. RA4 is configured as a digital input. DS39635C-page 140  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-11: PORTF FUNCTIONS Pin Name Function TRIS Setting I/O I/O Type RF0 0 O DIG LATF data output; not affected by analog input. 1 I ST PORTF data input; disabled when analog input is enabled. RF0/AN5 RF1/AN6/C2OUT AN5 1 I ANA A/D Input Channel 5. Default configuration on POR. RF1 0 O DIG LATF data output; not affected by analog input. 1 I ST 1 I ANA A/D Input Channel 6. Default configuration on POR. C2OUT 0 O DIG Comparator 2 output; takes priority over port data. RF2 0 O DIG LATF data output; not affected by analog input. AN6 RF2/AN7/C1OUT PORTF data input; disabled when analog input is enabled. 1 I ST 1 I ANA A/D Input Channel 7. Default configuration on POR. C1OUT 0 O TTL Comparator 1 output; takes priority over port data. RF3 0 O DIG LATF data output; not affected by analog input. AN7 RF3/AN8 AN8 RF4/AN9 RF4 PORTF data input; disabled when analog input is enabled. 1 I ST PORTF data input; disabled when analog input is enabled. 1 I ANA A/D Input Channel 8 and Comparator C2+ input. Default input configuration on POR; not affected by analog output. 0 O DIG LATF data output; not affected by analog input. 1 I ST PORTF data input; disabled when analog input is enabled. AN9 1 I ANA A/D Input Channel 9 and Comparator C2- input. Default input configuration on POR; does not affect digital output. RF5 0 O DIG LATF data output; not affected by analog input. Disabled when CVREF output is enabled. 1 I ST PORTF data input; disabled when analog input is enabled. Disabled when CVREF output is enabled AN10 1 I ANA A/D Input Channel 10 and Comparator C1+ input. Default input configuration on POR. CVREF x O ANA Comparator voltage reference output. Enabling this feature disables digital I/O. RF6 0 O DIG LATF data output; not affected by analog input. 1 I ST PORTF data input; disabled when analog input is enabled. AN11 1 I ANA A/D Input Channel 11 and Comparator C1- input. Default input configuration on POR; does not affect digital output. RF7 0 O DIG LATF data output. 1 I ST PORTF data input. SS 1 I TTL Slave select input for MSSP (MSSP module). RF5/AN10/CVREF RF6/AN11 RF7/SS Legend: Description O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Buffer Input, TTL = TTL Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). TABLE 11-12: SUMMARY OF REGISTERS ASSOCIATED WITH PORTF Name TRISF PORTF LATF ADCON1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RF4 RF3 RF2 RF1 RF0 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 PORTF Data Direction Register RF7 RF6 RF5 66 LATF Output Latch Register — — VCFG1 Reset Values on Page 66 66 64 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 65 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTF.  2010 Microchip Technology Inc. DS39635C-page 141 PIC18F6310/6410/8310/8410 11.7 PORTG, TRISG and LATG Registers PORTG is a 6-bit wide, bidirectional port. The corresponding Data Direction register is TRISG. Setting a TRISG bit (= 1) will make the corresponding PORTG pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISG bit (= 0) will make the corresponding PORTG pin an output (i.e., put the contents of the output latch on the selected pin). The sixth pin of PORTG (RG5/MCLR/VPP) is an input only pin. Its operation is controlled by the MCLRE Configuration bit. When selected as a port pin (MCLRE = 0), it functions as a digital input only pin; as such, it does not have TRIS or LAT bits associated with its operation. Otherwise, it functions as the device’s Master Clear input. In either configuration, RG5 also functions as the programming voltage input during programming. Note: The Output Latch register (LATG) is also memory mapped. Read-modify-write operations on the LATG register, read and write the latched output value for PORTG. PORTG is multiplexed with USART functions (Table 11-13). PORTG pins have Schmitt Trigger input buffers. When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTG pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. The pin override value is not loaded into the TRIS register. This allows read-modify-write of the TRIS register without concern due to peripheral overrides. DS39635C-page 142 On a Power-on Reset, RG5 is enabled as a digital input only if Master Clear functionality is disabled. All other 5 pins are configured as digital inputs. EXAMPLE 11-7: CLRF PORTG CLRF LATG MOVLW 0x04 MOVWF TRISG INITIALIZING PORTG ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTG by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RG1:RG0 as outputs RG2 as input RG4:RG3 as inputs  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-13: PORTG FUNCTIONS Pin Name RG0/CCP3 Function TRIS Setting I/O I/O Type RG0 0 O DIG LATG data output. 1 I ST PORTG data input. 0 O DIG CCP3 compare and PWM output; takes priority over port data. 1 I ST CCP3 capture input. 0 O DIG LATG data output. 1 I ST PORTG data input. TX2 1 O DIG Synchronous serial data output (AUSART module); takes priority over port data. CK2 1 O DIG Synchronous serial data input (AUSART module). User must configure as an input. Synchronous serial clock input (AUSART module). CCP3 RG1/TX2/CK2 RG2/RX2/DT2 RG3 R21 1 I ST 0 O DIG LATG data output. 1 I ST PORTG data input. RX2 1 I ST Asynchronous serial receive data input (AUSART module). DT2 1 O DIG Synchronous serial data output (AUSART module); takes priority over port data. 1 I ST Synchronous serial data input (AUSART module). User must configure as an input. 0 O DIG LATG data output. 1 I ST PORTG data input. 0 O DIG LATG data output. 1 I ST PORTG data input. RG5 —(1) I ST PORTG data input; enabled when MCLRE Configuration bit is clear. MCLR — I ST External Master Clear input; enabled when MCLRE Configuration bit is set. VPP — I ANA RG2 RG3 RG4 RG4 RG5/MCLR/VPP Legend: Note 1: Description High-Voltage Detection; used for ICSP™ mode entry detection. Always available, regardless of pin mode. O = Output, I = Input, ANA = Analog Signal, DIG = Digital Output, ST = Schmitt Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). RG5 does not have a corresponding TRISG bit. TABLE 11-14: SUMMARY OF REGISTERS ASSOCIATED WITH PORTG Name Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RG4 RG3 RG2 RG1 RG0 66 Bit 7 Bit 6 Bit 5 PORTG — — RG5(1) LATG — — — LATG Output Latch Register 66 TRISG — — — PORTG Data Direction Register 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTG. Note 1: RG5 is available as an input only when MCLR is disabled.  2010 Microchip Technology Inc. DS39635C-page 143 PIC18F6310/6410/8310/8410 11.8 Note: PORTH, LATH and TRISH Registers PORTH is only available PIC18F8310/8410 devices. on PORTH is an 8-bit wide, bidirectional I/O port. The corresponding Data Direction register is TRISH. Setting a TRISH bit (= 1) will make the corresponding PORTH pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISH bit (= 0) will make the corresponding PORTH pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATH) is also memory mapped. Read-modify-write operations on the LATH register, read and write the latched output value for PORTH. All pins on PORTH are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Note: When the external memory interface is enabled, four of the PORTH pins function as the high-order address lines for the interface. The address output from the interface takes priority over other digital I/O. The corresponding TRISH bits are also overridden. EXAMPLE 11-8: CLRF PORTH CLRF LATH MOVLW 0CFh MOVWF TRISH INITIALIZING PORTH ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTH by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RH3:RH0 as inputs RH5:RH4 as outputs RH7:RH6 as inputs On a Power-on Reset, these pins are configured as digital inputs. DS39635C-page 144  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-15: PORTH FUNCTIONS Pin Name RH0/AD16 RH1/AD17 RH2/AD18 RH3/AD19 RH4 RH5 RH6 RH7 Legend: Function TRIS Setting I/O I/O Type RH0 0 O DIG LATH data output. 1 I ST PORTH data input. AD16 x O DIG External memory interface, Address Line 16. Takes priority over port data. RH1 0 O DIG LATH data output. 1 I ST PORTH data input. AD17 x O DIG External memory interface, Address Line 17. Takes priority over port data. RH2 0 O DIG LATH data output. 1 I ST PORTH data input. AD18 x O DIG External memory interface, Address Line 18. Takes priority over port data. RH3 0 O DIG LATH data output. Description 1 I ST PORTH data input. AD19 x O DIG External memory interface, Address Line 19. Takes priority over port data. RH4 0 O DIG LATH data output. 1 I ST PORTH data input. 0 O DIG LATH data output. 1 I ST PORTH data input. 0 O DIG LATH data output. 1 I ST PORTH data input. 0 O DIG LATH data output. 1 I ST PORTH data input. RH5 RH6 RH7 O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). TABLE 11-16: SUMMARY OF REGISTERS ASSOCIATED WITH PORTH Name TRISH PORTH LATH Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RH4 RH3 RH2 RH1 RH0 PORTH Data Direction Register RH7 RH6 RH5 PORTH Output Latch Register  2010 Microchip Technology Inc. Reset Values on Page 65 66 66 DS39635C-page 145 PIC18F6310/6410/8310/8410 11.9 Note: PORTJ, TRISJ and LATJ Registers PORTJ is available PIC18F8310/8410 devices. only on PORTJ is an 8-bit wide, bidirectional port. The corresponding Data Direction register is TRISJ. Setting a TRISJ bit (= 1) will make the corresponding PORTJ pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISJ bit (= 0) will make the corresponding PORTJ pin an output (i.e., put the contents of the output latch on the selected pin). The Output Latch register (LATJ) is also memory mapped. Read-modify-write operations on the LATJ register, read and write the latched output value for PORTJ. All pins on PORTJ are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Note: When the external memory interface is enabled, all of the PORTJ pins function as control outputs for the interface. This occurs automatically when the interface is enabled by clearing the EBDIS control bit (MEMCON). The TRISJ bits are also overridden. EXAMPLE 11-9: CLRF PORTJ CLRF LATJ MOVLW 0xCF MOVWF TRISJ INITIALIZING PORTJ ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTG by clearing output data latches Alternate method to clear output data latches Value used to initialize data direction Set RJ3:RJ0 as inputs RJ5:RJ4 as output RJ7:RJ6 as inputs On a Power-on Reset, these pins are configured as digital inputs. DS39635C-page 146  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 11-17: PORTJ FUNCTIONS Pin Name RJ0/ALE RJ1/OE RJ2/WRL RJ3/WRH RJ4/BA0 RJ5/CE RJ6/LB RJ7/UB Function TRIS Setting I/O I/O Type RJ0 0 O DIG LATJ data output. 1 I ST PORTJ data input. ALE x O DIG External memory interface address latch enable control output; takes priority over digital I/O. RJ1 0 O DIG LATJ data output. 1 I ST PORTJ data input. OE x O DIG External memory interface output enable control output; takes priority over digital I/O. RJ2 0 O DIG LATJ data output. 1 I ST PORTJ data input. WRL x O DIG External memory bus write low byte control; takes priority over digital I/O. RJ3 0 O DIG LATJ data output. 1 I ST PORTJ data input. WRH x O DIG External memory interface write high byte control output; takes priority over digital I/O. RJ4 0 O DIG LATJ data output. 1 I ST PORTJ data input. BA0 x O DIG External Memory Interface Byte Address 0 control output; takes priority over digital I/O. RJ5 0 O DIG LATJ data output. 1 I ST PORTJ data input. CE x O DIG External memory interface chip enable control output; takes priority over digital I/O. RJ6 0 O DIG LATJ data output. 1 I ST PORTJ data input. LB x O DIG External memory interface lower byte enable control output; takes priority over digital I/O. RJ7 0 O DIG LATJ data output. 1 I ST PORTJ data input. x O DIG External memory interface upper byte enable control output; takes priority over digital I/O. UB Legend: Description O = Output, I = Input, DIG = Digital Output, ST = Schmitt Buffer Input, x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). TABLE 11-18: SUMMARY OF REGISTERS ASSOCIATED WITH PORTJ Name PORTJ Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RJ7 RJ6 RJ5 RJ4 RJ3 RJ2 RJ1 RJ0 66 LATJ LATJ Output Latch Register 66 TRISJ PORTJ Data Direction Register 65  2010 Microchip Technology Inc. DS39635C-page 147 PIC18F6310/6410/8310/8410 11.10 Parallel Slave Port PORTD can also function as an 8-bit wide Parallel Slave Port (PSP), or microprocessor port, when control bit, PSPMODE (PSPCON), is set. It is asynchronously readable and writable by the external world through RD control input pin, RE0/RD and WR control input pin, RE1/WR. Note: For PIC18F8310/8410 devices, the Parallel Slave Port is available only in Microcontroller mode. The PSP can directly interface to an 8-bit microprocessor data bus. The external microprocessor can read or write the PORTD latch as an 8-bit latch. Setting bit, PSPMODE, enables port pin, RE0/RD, to be the RD input, RE1/WR to be the WR input and RE2/CS to be the CS (Chip Select) input. For this functionality, the corresponding data direction bits of the TRISE register (TRISE) must be configured as inputs (set). A write to the PSP occurs when both the CS and WR lines are first detected low and ends when either are detected high. The PSPIF and IBF flag bits are both set when the write ends. A read from the PSP occurs when both the CS and RD lines are first detected low. The data in PORTD is read out and the OBF bit is set. If the user writes new data to PORTD to set OBF, the data is immediately read out; however, the OBF bit is not set. When either the CS or RD lines are detected high, the PORTD pins return to the input state and the PSPIF bit is set. User applications should wait for PSPIF to be set before servicing the PSP; when this happens, the IBF and OBF bits can be polled and the appropriate action taken. The timing for the control signals in Write and Read modes is shown in Figure 11-3 and Figure 11-4, respectively. DS39635C-page 148 FIGURE 11-2: Data Bus WR LATD or PORTD PORTD AND PORTE BLOCK DIAGRAM (PARALLEL SLAVE PORT) D Q RDx Pin CK TTL Data Latch Q RD PORTD D ENEN TRIS Latch RD LATD One bit of PORTD Set Interrupt Flag PSPIF (PIR1) Read TTL RD Chip Select TTL CS Write TTL WR Note: I/O pin has protection diodes to VDD and VSS.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 11-1: PSPCON: PARALLEL SLAVE PORT CONTROL REGISTER R-0 R-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 IBF OBF IBOV PSPMODE — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IBF: Input Buffer Full Status bit 1 = A word has been received and is waiting to be read by the CPU 0 = No word has been received bit 6 OBF: Output Buffer Full Status bit 1 = The output buffer still holds a previously written word 0 = The output buffer has been read bit 5 IBOV: Input Buffer Overflow Detect bit 1 = A write occurred when a previously input word has not been read (must be cleared in software) 0 = No overflow occurred bit 4 PSPMODE: Parallel Slave Port Mode Select bit 1 = Parallel Slave Port mode 0 = General Purpose I/O mode bit 3-0 Unimplemented: Read as ‘0’ FIGURE 11-3: PARALLEL SLAVE PORT WRITE WAVEFORMS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CS WR RD PORTD IBF OBF PSPIF  2010 Microchip Technology Inc. DS39635C-page 149 PIC18F6310/6410/8310/8410 FIGURE 11-4: PARALLEL SLAVE PORT READ WAVEFORMS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 CS WR RD PORTD IBF OBF PSPIF TABLE 11-19: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT Name PORTD Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 66 LATD LATD Output Latch Register TRISD PORTD Data Direction Register PORTE RE7 RE6 RE5 66 66 RE4 RE3 RE2 RE1 RE0 66 LATE LATE Output Latch Register 66 TRISE PORTE Data Direction Register 66 PSPCON INTCON IBF OBF GIE/GIEH PEIE/GIEL IBOV PSPMODE — — — — 65 TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port. DS39635C-page 150  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 12.0 TIMER0 MODULE The Timer0 module incorporates the following features: • Software-selectable operation as a timer or counter in both 8-bit or 16-bit modes • Readable and writable registers • Dedicated 8-bit software-programmable prescaler • Selectable clock source (internal or external) • Edge select for external clock • Interrupt-on-overflow REGISTER 12-1: The T0CON register (Register 12-1) controls all aspects of the module’s operation, including the prescale selection. It is both readable and writable. A simplified block diagram of the Timer0 module in 8-bit mode is shown in Figure 12-1. Figure 12-2 shows a simplified block diagram of the Timer0 module in 16-bit mode. T0CON: TIMER0 CONTROL REGISTER REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TMR0ON T08BIT T0CS TOSE PSA T0PS2 T0PS1 T0PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 TMR0ON: Timer0 On/Off Control bit 1 = Enables Timer0 0 = Stops Timer0 bit 6 T08BIT: Timer0 8-Bit/16-Bit Control bit 1 = Timer0 is configured as an 8-bit timer/counter 0 = Timer0 is configured as a 16-bit timer/counter bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin input edge 0 = Internal clock (FOSC/4) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Timer0 Prescaler Assignment bit 1 = TImer0 prescaler is not assigned; Timer0 clock input bypasses prescaler 0 = Timer0 prescaler is assigned; Timer0 clock input comes from prescaler output bit 2-0 T0PS: Timer0 Prescaler Select bits 111 = 1:256 Prescale value 110 = 1:128 Prescale value 101 = 1:64 Prescale value 100 = 1:32 Prescale value 011 = 1:16 Prescale value 010 = 1:8 Prescale value 001 = 1:4 Prescale value 000 = 1:2 Prescale value  2010 Microchip Technology Inc. DS39635C-page 151 PIC18F6310/6410/8310/8410 12.1 Timer0 Operation Timer0 can operate as either a timer or a counter; the mode is selected by clearing the T0CS bit (T0CON). In Timer mode (T0CS = 0), the module increments on every clock by default, unless a different prescaler value is selected (see Section 12.3 “Prescaler”). If the TMR0 register is written to, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. The Counter mode is selected by setting the T0CS bit (= 1). In Counter mode, Timer0 increments either on every rising or falling edge of pin, RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit, T0SE (T0CON); clearing this bit selects the rising edge. Restrictions on the external clock input are discussed below. An external clock source can be used to drive Timer0; however, it must meet certain requirements to ensure that the external clock can be synchronized with the FIGURE 12-1: internal phase clock (TOSC). There is a delay between synchronization and the onset of incrementing the timer/counter. 12.2 Timer0 Reads and Writes in 16-Bit Mode TMR0H is not the actual high byte of Timer0 in 16-bit mode; it is actually a buffered version of the real high byte of Timer0, which is not directly readable nor writable (refer to Figure 12-2). TMR0H is updated with the contents of the high byte of Timer0 during a read of TMR0L. This provides the ability to read all 16 bits of Timer0, without having to verify that the read of the high and low byte were valid, due to a rollover between successive reads of the high and low byte. Similarly, a write to the high byte of Timer0 must also take place through the TMR0H Buffer register. The high byte is updated with the contents of TMR0H when a write occurs to TMR0L. This allows all 16 bits of Timer0 to be updated at once. TIMER0 BLOCK DIAGRAM (8-BIT MODE) FOSC/4 0 0 1 Programmable Prescaler T0CKI pin T0SE 1 Sync with Internal Clocks (2 TCY Delay) 8 3 T0CS Set TMR0IF on Overflow TMR0L 8 T0PS Internal Data Bus PSA Note: Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI maximum prescale. FIGURE 12-2: FOSC/4 TIMER0 BLOCK DIAGRAM (16-BIT MODE) 0 0 1 T0CKI pin T0SE T0CS Programmable Prescaler 1 Sync with Internal Clocks TMR0 High Byte TMR0L 8 (2 TCY Delay) 3 Read TMR0L T0PS PSA Set TMR0IF on Overflow Write TMR0L 8 8 TMR0H 8 8 Internal Data Bus Note: Upon Reset, Timer0 is enabled in 8-bit mode with the clock input from T0CKI maximum prescale. DS39635C-page 152  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 12.3 12.3.1 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module. The prescaler is not directly readable or writable; its value is set by the PSA and T0PS bits (T0CON), which determine the prescaler assignment and prescale ratio. Clearing the PSA bit assigns the prescaler to the Timer0 module. When it is assigned, prescale values from 1:2 through 1:256 in power-of-2 increments are selectable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, BSF TMR0,etc.) clear the prescaler count. Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count, but will not change the prescaler assignment. TABLE 12-1: Name Bit 7 Bit 6 Bit 5 Timer0 Module Low Byte Register TMR0H Timer0 Module High Byte Register INTCON GIE/GIEH PEIE/GIEL TMR0IE TRISA The prescaler assignment is fully under software control and can be changed “on-the-fly” during program execution. 12.4 Timer0 Interrupt The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h in 8-bit mode, or from FFFFh to 0000h in 16-bit mode. This overflow sets the TMR0IF flag bit. The interrupt can be masked by clearing the TMR0IE bit (INTCON). Before reenabling the interrupt, the TMR0IF bit must be cleared in software by the Interrupt Service Routine. Since Timer0 is shut down in Sleep mode, the TMR0 interrupt cannot awaken the processor from Sleep. REGISTERS ASSOCIATED WITH TIMER0 TMR0L T0CON SWITCHING PRESCALER ASSIGNMENT TMR0ON T08BIT T0CS PORTA Data Direction Register Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page 64 64 INT0IE RBIE TMR0IF INT0IF RBIF 63 T0SE PSA T0PS2 T0PS1 T0PS0 64 66 Legend: Shaded cells are not used by Timer0.  2010 Microchip Technology Inc. DS39635C-page 153 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 154  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 13.0 TIMER1 MODULE The Timer1 timer/counter module incorporates these features: • Software-selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR1H and TMR1L) • Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Reset on CCP Special Event Trigger • Device clock status flag (T1RUN) REGISTER 13-1: A simplified block diagram of the Timer1 module is shown in Figure 13-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 13-2. The module incorporates its own low-power oscillator to provide an additional clocking option. The Timer1 oscillator can also be used as a low-power clock source for the microcontroller in power-managed operation. Timer1 can also be used to provide Real-Time Clock (RTC) functionality to applications with only a minimal addition of external components and code overhead. Timer1 is controlled through the T1CON Control register (Register 13-1). It also contains the Timer1 Oscillator Enable bit (T1OSCEN). Timer1 can be enabled or disabled by setting or clearing control bit, TMR1ON (T1CON). T1CON: TIMER1 CONTROL REGISTER R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of TImer1 in one 16-bit operation 0 = Enables register read/write of Timer1 in two 8-bit operations bit 6 T1RUN: Timer1 System Clock Status bit 1 = Device clock is derived from Timer1 oscillator 0 = Device clock is derived from another source bit 5-4 T1CKPS: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 T1OSCEN: Timer1 Oscillator Enable bit 1 = Timer1 oscillator is enabled 0 = Timer1 oscillator is shut off The oscillator inverter and feedback resistor are turned off to eliminate power drain. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit When TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin RC0/T1OSO/T13CKI (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1  2010 Microchip Technology Inc. DS39635C-page 155 PIC18F6310/6410/8310/8410 13.1 cycle (FOSC/4). When the bit is set, Timer1 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. Timer1 Operation Timer1 can operate in one of these modes: • Timer • Synchronous Counter • Asynchronous Counter When Timer1 is enabled, the RC1/T1OSI and RC0/ T1OSO/T13CKI pins become inputs. This means the values of TRISC are ignored and the pins are read as ‘0’. The operating mode is determined by the clock select bit, TMR1CS (T1CON). When TMR1CS is cleared (= 0), Timer1 increments on every internal instruction FIGURE 13-1: TIMER1 BLOCK DIAGRAM Timer1 Oscillator On/Off T1OSO/T13CKI 1 1 FOSC/4 Internal Clock T1OSI Synchronize Prescaler 1, 2, 4, 8 Detect 0 0 2 T1OSCEN (1) Sleep Input TMR1CS Timer1 On/Off T1CKPS T1SYNC TMR1ON Clear TMR1 (CCP Special Event Trigger) Set TMR1IF on Overflow TMR1 High Byte TMR1L Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. FIGURE 13-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) Timer1 Oscillator 1 T1OSO/T13CKI 1 FOSC/4 Internal Clock T1OSI Synchronize Prescaler 1, 2, 4, 8 Detect 0 0 2 (1) T1OSCEN T1CKPS T1SYNC Sleep Input TMR1CS Timer1 On/Off TMR1ON Clear TMR1 (CCP Special Event Trigger) TMR1 High Byte TMR1L 8 Set TMR1IF on Overflow Read TMR1L Write TMR1L 8 8 TMR1H 8 8 Internal Data Bus Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. DS39635C-page 156  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 13.2 Timer1 16-Bit Read/Write Mode Timer1 can be configured for 16-bit reads and writes (see Figure 13-2). When the RD16 control bit (T1CON) is set, the address for TMR1H is mapped to a buffer register for the high byte of Timer1. A read from TMR1L will load the contents of the high byte of Timer1 into the Timer1 high byte buffer. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. TABLE 13-1: Osc Type LP 13.3 Timer1 Oscillator An on-chip crystal oscillator circuit is incorporated between pins, T1OSI (input) and T1OSO (amplifier output). It is enabled by setting the Timer1 Oscillator Enable bit, T1OSCEN (T1CON). The oscillator is a low-power circuit rated for 32 kHz crystals. It will continue to run during all power-managed modes. The circuit for a typical LP oscillator is shown in Figure 13-3. Table 13-1 shows the capacitor selection for the Timer1 oscillator. The user must provide a software time delay to ensure proper start-up of the Timer1 oscillator. FIGURE 13-3: EXTERNAL COMPONENTS FOR THE TIMER1 LP OSCILLATOR C1 27 pF PIC18FXXXX T1OSI XTAL 32.768 kHz T1OSO C2 27 pF Note: See the Notes with Table 13-1 for additional information about capacitor selection. Freq 32 kHz C1 27 pF(1) C2 27 pF(1) Note 1: Microchip suggests these values as a starting point in validating the oscillator circuit. 2: Higher capacitance increases the stability of the oscillator, but also increases the start-up time. A write to the high byte of Timer1 must also take place through the TMR1H Buffer register. The Timer1 high byte is updated with the contents of TMR1H when a write occurs to TMR1L. This allows a user to write all 16 bits to both the high and low bytes of Timer1 at once. The high byte of Timer1 is not directly readable or writable in this mode. All reads and writes must take place through the Timer1 High Byte Buffer register. Writes to TMR1H do not clear the Timer1 prescaler. The prescaler is only cleared on writes to TMR1L. CAPACITOR SELECTION FOR THE TIMER OSCILLATOR 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Capacitor values are for design guidance only. 13.3.1 USING TIMER1 AS A CLOCK SOURCE The Timer1 oscillator is also available as a clock source in power-managed modes. By setting the clock select bits, SCS (OSCCON), to ‘01’, the device switches to SEC_RUN mode; both the CPU and peripherals are clocked from the Timer1 oscillator. If the IDLEN bit (OSCCON) is cleared and a SLEEP instruction is executed, the device enters SEC_IDLE mode. Additional details are available in Section 4.0 “Power-Managed Modes”. Whenever the Timer1 oscillator is providing the clock source, the Timer1 System Clock Status Flag, T1RUN (T1CON), is set. This can be used to determine the controller’s current clocking mode. It can also indicate the clock source being currently used by the Fail-Safe Clock Monitor. If the Clock Monitor is enabled and the Timer1 oscillator fails while providing the clock, polling the T1RUN bit will indicate whether the clock is being provided by the Timer1 oscillator or another source. 13.3.2 LOW-POWER TIMER1 OPTION The Timer1 oscillator can operate at two distinct levels of power consumption based on device configuration. When the LPT1OSC Configuration bit is set, the Timer1 oscillator operates in a low-power mode. When LPT1OSC is not set, Timer1 operates at a higher power level. Power consumption for a particular mode is relatively constant, regardless of the device’s operating mode. The default Timer1 configuration is the higher power mode. As the Low-Power Timer1 mode tends to be more sensitive to interference, high noise environments may cause some oscillator instability. The low-power option is therefore best suited for low noise applications where power conservation is an important design consideration.  2010 Microchip Technology Inc. DS39635C-page 157 PIC18F6310/6410/8310/8410 13.3.3 TIMER1 OSCILLATOR LAYOUT CONSIDERATIONS The Timer1 oscillator circuit draws very little power during operation. Due to the low-power nature of the oscillator, it may also be sensitive to rapidly changing signals in close proximity. The oscillator circuit, shown in Figure 13-3, should be located as close as possible to the microcontroller. There should be no circuits passing within the oscillator circuit boundaries other than VSS or VDD. If a high-speed circuit must be located near the oscillator (such as the CCP1 pin in Output Compare or PWM mode, or the primary oscillator using the OSC2 pin), a grounded guard ring around the oscillator circuit may be helpful when used on a single sided PCB, or in addition to a ground plane. 13.4 Timer1 Interrupt The TMR1 register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The Timer1 interrupt, if enabled, is generated on overflow, which is latched in interrupt flag bit, TMR1IF (PIR1). This interrupt can be enabled or disabled by setting or clearing the Timer1 Interrupt Enable bit, TMR1IE (PIE1). 13.5 Resetting Timer1 Using the CCP Special Event Trigger If CCP1 or CCP2 is configured in Compare mode to generate a Special Event Trigger (CCP1M or CCP2M = 1011), this signal will reset Timer1. The trigger from CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 16.3.4 “Special Event Triggers” for more information.). 13.6 Using Timer1 as a Real-Time Clock Adding an external LP oscillator to Timer1 (such as the one described in Section 13.3 “Timer1 Oscillator”, above), gives users the option to include RTC functionality to their applications. This is accomplished with an inexpensive watch crystal to provide an accurate time base and several lines of application code to calculate the time. When operating in Sleep mode and using a battery or supercapacitor as a power source, it can completely eliminate the need for a separate RTC device and battery backup. The application code routine, RTCisr, shown in Example 13-1, demonstrates a simple method to increment a counter at one-second intervals using an Interrupt Service Routine. Incrementing the TMR1 register pair to overflow triggers the interrupt and calls the routine, which increments the seconds counter by one; additional counters for minutes and hours are incremented as the previous counter overflow. Since the register pair is 16 bits wide, counting up to overflow the register directly from a 32.768 kHz clock would take 2 seconds. To force the overflow at the required one-second intervals, it is necessary to preload it; the simplest method is to set the Most Significant bit of TMR1H with a BSF instruction. Note that the TMR1L register is never preloaded or altered; doing so may introduce cumulative error over many cycles. For this method to be accurate, Timer1 must operate in Asynchronous mode and the Timer1 overflow interrupt must be enabled (PIE1 = 1), as shown in the routine RTCinit. The Timer1 oscillator must also be enabled and running at all times. The module must be configured as either a timer or a synchronous counter to take advantage of this feature. When used this way, the CCPRH:CCPRL register pair effectively becomes a period register for Timer1. If Timer1 is running in Asynchronous Counter ‘mode, this Reset operation may not work. In the event that a write to Timer1 coincides with a Special Event Trigger, the write operation will take precedence. Note: The special event triggers from the CCP2 module will not set the TMR1IF interrupt flag bit (PIR1). DS39635C-page 158  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 EXAMPLE 13-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE RTCinit MOVLW MOVWF CLRF MOVLW MOVWF CLRF CLRF MOVLW MOVWF BSF RETURN 80h ; Preload TMR1 register pair TMR1H ; for 1 second overflow TMR1L b‘00001111’ ; Configure for external clock, T1CON ; Asynchronous operation, external oscillator secs ; Initialize timekeeping registers mins ; .12 hours PIE1, TMR1IE ; Enable Timer1 interrupt BSF BCF INCF MOVLW CPFSGT RETURN CLRF INCF MOVLW CPFSGT RETURN CLRF INCF MOVLW CPFSGT RETURN MOVLW MOVWF RETURN TMR1H, 7 PIR1, TMR1IF secs, F .59 secs RTCisr TABLE 13-2: Name INTCON secs mins, F .59 mins mins hours, F .23 hours .01 hours ; ; ; ; Preload for 1 sec overflow Clear interrupt flag Increment seconds 60 seconds elapsed? ; ; ; ; No, done Clear seconds Increment minutes 60 minutes elapsed? ; ; ; ; No, done clear minutes Increment hours 24 hours elapsed? ; No, done ; Reset hours to 1 ; Done REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Bit 7 Bit 6 GIE/GIEH PEIE/GIEL Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 IPR1 TMR1L Holding Register for the Least Significant Byte of the 16-Bit TMR1 Register TMR1H Holding Register for the Most Significant Byte of the 16-Bit TMR1 Register T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS 64 64 TMR1ON 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.  2010 Microchip Technology Inc. DS39635C-page 159 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 160  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 14.0 TIMER2 MODULE 14.1 The Timer2 timer module incorporates the following features: • 8-bit Timer and Period registers (TMR2 and PR2, respectively) • Readable and writable (both registers) • Software-programmable prescaler (1:1, 1:4 and 1:16) • Software-programmable postscaler (1:1 through 1:16) • Interrupt on TMR2-to-PR2 match • Optional use as the shift clock for the MSSP module The module is controlled through the T2CON register (Register 14-1), which enables or disables the timer and configures the prescaler and postscaler. Timer2 can be shut off by clearing control bit, TMR2ON (T2CON), to minimize power consumption. A simplified block diagram of the module is shown in Figure 14-1. Timer2 Operation In normal operation, TMR2 is incremented from 00h on each clock (FOSC/4). A 2-bit counter/prescaler on the clock input gives direct input, divide-by-4 and divide-by-16 prescale options; these are selected by the prescaler control bits, T2CKPS (T2CON). The value of TMR2 is compared to that of the period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output counter/ postscaler (see Section 14.2 “Timer2 Interrupt”). The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, while the PR2 register initializes at FFh. Both the prescaler and postscaler counters are cleared on the following events: • a write to the TMR2 register • a write to the T2CON register • any device Reset (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset) TMR2 is not cleared when T2CON is written. REGISTER 14-1: T2CON: TIMER2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 Unimplemented: Read as ‘0’ bit 6-3 T2OUTPS: Timer2 Output Postscale Select bits 0000 = 1:1 Postscale 0001 = 1:2 Postscale • • • 1111 = 1:16 Postscale bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16  2010 Microchip Technology Inc. x = Bit is unknown DS39635C-page 161 PIC18F6310/6410/8310/8410 14.2 Timer2 Interrupt 14.3 Timer2 also can generate an optional device interrupt. The Timer2 output signal (TMR2-to-PR2 match) provides the input for the 4-bit output counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF (PIR1). The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE (PIE1). TMR2 Output The unscaled output of TMR2 is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can be optionally used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 17.0 “Master Synchronous Serial Port (MSSP) Module”. A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS (T2CON). FIGURE 14-1: TIMER2 BLOCK DIAGRAM 4 T2OUTPS 1:1 to 1:16 Postscaler Set TMR2IF 2 T2CKPS 1:1, 1:4, 1:16 Prescaler FOSC/4 TMR2/PR2 Match Reset TMR2 TMR2 Output (to PWM or MSSP) Comparator 8 PR2 8 8 Internal Data Bus TABLE 14-1: Name REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 INTCON GIE/GIEH PEIE/GIEL TMR2 T2CON PR2 Timer2 Register — 64 T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 Timer2 Period Register 64 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module. DS39635C-page 162  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 15.0 TIMER3 MODULE The Timer3 timer/counter module incorporates these features: • Software-selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR3H and TMR3L) • Selectable clock source (internal or external), with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Module Reset on CCP Special Event Trigger REGISTER 15-1: A simplified block diagram of the Timer3 module is shown in Figure 15-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 15-2. The Timer3 module is controlled through the T3CON register (Register 15-1). It also selects the clock source options for the CCP modules (see Section 16.1.1 “CCP Modules and Timer Resources” for more information). T3CON: TIMER3 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 RD16: 16-Bit Read/Write Mode Enable bit 1 = Enables register read/write of Timer3 in one 16-bit operation 0 = Enables register read/write of Timer3 in two 8-bit operations bit 6, 3 T3CCP: Timer3 and Timer1 to CCPx Enable bits 11 = Timer3 is the clock source for compare/capture of all CCP modules 10 = Timer3 is the clock source for compare/capture of CCP3, Timer1 is the clock source for compare/capture of CCP1 and CCP2 01 = Timer3 is the clock source for compare/capture of CCP2 and CCP3, Timer1 is the clock source for compare/capture of CCP1 00 = Timer1 is the clock source for compare/capture of all CCP modules bit 5-4 T3CKPS: Timer3 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit (Not usable if the device clock comes from Timer1/Timer3.) When TMR3CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR3CS = 0: This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0. bit 1 TMR3CS: Timer3 Clock Source Select bit 1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first falling edge) 0 = Internal clock (FOSC/4) bit 0 TMR3ON: Timer3 On bit 1 = Enables Timer3 0 = Stops Timer3  2010 Microchip Technology Inc. DS39635C-page 163 PIC18F6310/6410/8310/8410 15.1 cycle (FOSC/4). When the bit is set, Timer3 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. Timer3 Operation Timer3 can operate in one of three modes: • Timer • Synchronous counter • Asynchronous counter As with Timer1, the RC1/T1OSI and RC0/T1OSO/ T13CKI pins become inputs when the Timer1 oscillator is enabled. This means the values of TRISC are ignored and the pins are read as ‘0’. The operating mode is determined by the clock select bit, TMR3CS (T3CON). When TMR3CS is cleared (= 0), Timer3 increments on every internal instruction FIGURE 15-1: TIMER3 BLOCK DIAGRAM Timer1 Oscillator 1 T1OSO/T13CKI 1 FOSC/4 Internal Clock T1OSI Synchronize Prescaler 1, 2, 4, 8 Detect 0 0 2 T1OSCEN(1) Sleep Input TMR3CS Timer3 On/Off T3CKPS T3SYNC TMR3ON CCP1/CCP2 Special Event Trigger TCCPx Clear TMR3 Set TMR3IF on Overflow TMR3 High Byte TMR3L Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. FIGURE 15-2: TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) Timer1 clock input Timer1 Oscillator 1 T1OSO/T13CKI 1 FOSC/4 Internal Clock T1OSI Synchronize Prescaler 1, 2, 4, 8 Detect 0 0 2 (1) T1OSCEN T3CKPS T3SYNC TMR3ON Sleep Input TMR3CS CCP1/CCP2 Special Event Trigger TCCPx Clear TMR3 Timer3 On/Off Set TMR3IF on Overflow TMR3 High Byte TMR3L 8 Read TMR3L Write TMR3L 8 8 TMR3H 8 8 Internal Data Bus Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. DS39635C-page 164  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 15.2 Timer3 16-Bit Read/Write Mode 15.4 Timer3 Interrupt Timer3 can be configured for 16-bit reads and writes (see Figure 15-2). When the RD16 control bit (T3CON) is set, the address for TMR3H is mapped to a buffer register for the high byte of Timer3. A read from TMR3L will load the contents of the high byte of Timer3 into the Timer3 High Byte Buffer register. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. The TMR3 register pair (TMR3H:TMR3L) increments from 0000h to FFFFh and overflows to 0000h. The Timer3 interrupt, if enabled, is generated on overflow and is latched in interrupt flag bit, TMR3IF (PIR2). This interrupt can be enabled or disabled by setting or clearing the Timer3 Interrupt Enable bit, TMR3IE (PIE2). A write to the high byte of Timer3 must also take place through the TMR3H Buffer register. The Timer3 high byte is updated with the contents of TMR3H when a write occurs to TMR3L. This allows a user to write all 16 bits to both the high and low bytes of Timer3 at once. If either the CCP1 or CCP2 modules is configured to generate a Special Event Trigger in Compare mode (CCP1M or CCP2M = 1011), this signal will reset Timer3. The trigger of CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 16.3.4 “Special Event Triggers” for more information). The high byte of Timer3 is not directly readable or writable in this mode. All reads and writes must take place through the Timer3 High Byte Buffer register. 15.5 Resetting Timer3 Using the CCP Special Event Trigger Writes to TMR3H do not clear the Timer3 prescaler. The prescaler is only cleared on writes to TMR3L. The module must be configured as either a timer or synchronous counter to take advantage of this feature. When used this way, the CCPR2H:CCPR2L register pair effectively becomes a period register for Timer3. 15.3 If Timer3 is running in Asynchronous Counter mode, the Reset operation may not work. Using the Timer1 Oscillator as the Timer3 Clock Source The Timer1 internal oscillator may be used as the clock source for Timer3. The Timer1 oscillator is enabled by setting the T1OSCEN (T1CON) bit. To use it as the Timer3 clock source, the TMR3CS bit must also be set. As previously noted, this also configures Timer3 to increment on every rising edge of the oscillator source. In the event that a write to Timer3 coincides with a Special Event Trigger from a CCP module, the write will take precedence. Note: The special event triggers from the CCP2 module will not set the TMR3IF interrupt flag bit (PIR1). The Timer1 oscillator is described in Section 13.0 “Timer1 Module”. TABLE 15-1: Name INTCON REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER Bit 7 Bit 6 GIE/GIEH PEIE/GIEL Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 65 PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 65 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 65 TMR3L Holding Register for the Least Significant Byte of the 16-Bit TMR3 Register 65 TMR3H Holding Register for the Most Significant Byte of the 16-Bit TMR3 Register 65 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 64 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 TMR3CS TMR3ON 65 T3CCP1 T3SYNC Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module.  2010 Microchip Technology Inc. DS39635C-page 165 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 166  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 16.0 CAPTURE/COMPARE/PWM (CCP) MODULES PIC18F6310/6410/8310/8410 devices have three CCP (Capture/Compare/PWM) modules, labelled CCP1, CCP2 and CCP3. All modules implement standard Capture, Compare and Pulse-Width Modulation (PWM) modes. REGISTER 16-1: Each CCP module contains a 16-bit register which can operate as a 16-bit Capture register, a 16-bit Compare register or a PWM Master/Slave Duty Cycle register. For the sake of clarity, all CCP module operation in the following sections is described with respect to CCP2, but are equally applicable to CCP1 and CCP3. CCPxCON: CCP1/CCP2/CCP3 CONTROL REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DCxB: PWM Duty Cycle bit 1 and bit 0 for CCP Module x Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two Least Significant bits (bit 1 and bit 0) of the 10-bit PWM Duty Cycle register. The eight Most Significant bits (DCx) of the PWM Duty Cycle are found in CCPRxL. bit 3-0 CCPxM: CCP Module x Mode Select bits 0000 = Capture/Compare/PWM disabled (resets CCPx module) 0001 = Reserved 0010 = Compare mode, toggle output on match (CCPxIF bit is set) 0011 = Reserved 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode: initialize CCPx pin low; on compare match, force CCPx pin high (CCPxIF bit is set) 1001 = Compare mode: initialize CCPx pin high; on compare match, force CCPx pin low (CCPxIF bit is set) 1010 = Compare mode: generate software interrupt on compare match (CCPxIF bit is set, CCPx pin reflects I/O state) 1011 = Compare mode: trigger special event, reset timer, start A/D conversion on CCPx match (CCPxIF bit is set)(1,2) 11xx = PWM mode Note 1: 2: The Special Event Trigger on CCP1 will reset the timer but not start an A/D conversion on a CCP1 match. For CCP3, the Special Event Trigger is not available. This mode functions the same as Compare Generate Interrupt mode (CCP3M = 1010).  2010 Microchip Technology Inc. DS39635C-page 167 PIC18F6310/6410/8310/8410 16.1 CCP Module Configuration Each Capture/Compare/PWM module is associated with a control register (generically, CCPxCON) and a data register (CCPRx). The data register, in turn, is comprised of two 8-bit registers: CCPRxL (low byte) and CCPRxH (high byte). All registers are both readable and writable. 16.1.1 CCP MODULES AND TIMER RESOURCES CCP MODE – TIMER RESOURCE CCP Mode Timer Resource Capture Compare PWM Timer1 or Timer3 Timer1 or Timer3 Timer2 The assignment of a particular timer to a module is determined by the Timer-to-CCP enable bits in the T3CON register (Register 15-1). All three modules may be active at any given time and may share the same FIGURE 16-1: CCP2 PIN ASSIGNMENT The CCP2MX Configuration bit determines if CCP2 is multiplexed to its default or alternate assignment. By default, CCP2 is assigned to RC1 (CCP2MX = 1). If CCP2MX is cleared, CCP2 is multiplexed with either RE7 or RB3 (RE7 is the only alternative assignment for 64-pin devices). For any device in Microcontroller mode, the alternate CCP2 assignment is RE7. For 80-pin devices in Microcprocessor, Extended Microcontroller or Microcontroller with Boot Block mode, the alternate assignment is RB3. Note that RE7 is the only alternative assignment for 64-pin devices. Changing the pin assignment of CCP2 does not automatically change any requirements for configuring the port pin. Users must always verify that the appropriate TRIS register is configured correctly for CCP2 operation, regardless of where it is located. CCP AND TIMER INTERCONNECT CONFIGURATIONS T3CCP = 00 TMR1 Depending on the configuration selected, up to three timers may be active at once, with modules in the same configuration (Capture/Compare or PWM) sharing timer resources. The possible configurations are shown in Figure 16-1. 16.1.2 The CCP modules utilize Timers 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available to modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode. TABLE 16-1: timer resource if they are configured to operate in the same mode (Capture/Compare or PWM) at the same time. TMR3 CCP1 T3CCP = 01 TMR1 TMR3 CCP1 CCP2 CCP2 CCP3 CCP3 TMR2 Timer1 is used for all Capture and Compare operations for all three CCP modules. Timer2 is used for PWM operations for all three CCP modules. Timer3 is not used. All modules may share Timer1 and Timer2 resources as common time bases. DS39635C-page 168 TMR2 T3CCP = 10 T3CCP = 11 TMR1 TMR1 TMR3 TMR3 CCP1 CCP1 CCP2 CCP2 CCP3 TMR2 Timer1 is used for Capture and Compare operations for CCP1 and Timer 3 is used for CCP2 and CCP3. Timer1 is used for Capture and Compare operations for CCP1 and CCP2. Timer 3 is used for CCP3. All three modules share Timer2 as a common time base for PWM operation. All three modules share Timer2 as a common time base for PWM operation. CCP3 TMR2 Timer3 is used for all Capture and Compare operations for all three CCP modules. Timer2 is used for PWM operations for all three CCP modules. Timer1 is not used. All modules may share Timer2 and Timer3 resources as common time bases.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 16.2 16.2.1 Capture Mode In Capture mode, the appropriate CCPx pin should be configured as an input by setting the corresponding TRIS direction bit. In Capture mode, the CCPR2H:CCPR2L register pair captures the 16-bit value of the TMR1 or TMR3 registers when an event occurs on the CCP2 pin (RC1 or RE7, depending on device configuration). An event is defined as one of the following: • • • • Note: every falling edge every rising edge every 4th rising edge every 16th rising edge 16.2.2 If RC1/CCP2 or RE7/CCP2 is configured as an output, a write to the port can cause a capture condition. TIMER1/TIMER3 MODE SELECTION The timers that are to be used with the capture feature (Timer1 and/or Timer3) must be running in Timer mode or Synchronized Counter mode. In Asynchronous Counter mode, the capture operation may not work. The timer to be used with each CCP module is selected in the T3CON register (see Section 16.1.1 “CCP Modules and Timer Resources”). The event is selected by the mode select bits, CCP2M (CCP2CON). When a capture is made, the interrupt request flag bit, CCP2IF (PIR2), is set; it must be cleared in software. If another capture occurs before the value in register CCPR2 is read, the old captured value is overwritten by the new captured value. FIGURE 16-2: CCP PIN CONFIGURATION CAPTURE MODE OPERATION BLOCK DIAGRAM TMR3H Set CCP1IF T3CCP2 CCP1 Pin Prescaler  1, 4, 16 and Edge Detect CCP1CON Q1:Q4 4 4 T3CCP1 Prescaler  1, 4, 16 and Edge Detect TMR1H TMR1L TMR3H TMR3L TMR3 Enable CCPR2H T3CCP1 CCPR2L TMR1 Enable TMR1H TMR1L TMR3H TMR3L Set CCP3IF 4 4 T3CCP1 T3CCP2 CCP3 Pin Prescaler  1, 4, 16 TMR1 Enable Set CCP2IF CCP2 Pin CCP3CON CCPR1L 4 CCP2CON Q1:Q4 TMR3 Enable CCPR1H T3CCP2 TMR3L and Edge Detect TMR3 Enable CCPR3H CCPR3L TMR1 Enable T3CCP2 T3CCP1  2010 Microchip Technology Inc. TMR1H TMR1L DS39635C-page 169 PIC18F6310/6410/8310/8410 16.2.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep bit, CCP2IE (PIE2), clear to avoid false interrupts and should clear the flag bit, CCP2IF, following any such change in operating mode. 16.2.4 Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore, the first capture may be from a non-zero prescaler. Example 16-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the “false” interrupt. EXAMPLE 16-1: MOVWF 16.3 CHANGING BETWEEN CAPTURE PRESCALERS CCP2CON ; Turn CCP module off NEW_CAPT_PS ; Load WREG with the ; new prescaler mode ; value and CCP ON CCP2CON ; Load CCP2CON with ; this value Compare Mode In Compare mode, the 16-bit CCPR2 register value is constantly compared against either the TMR1 or TMR3 register pair value. When a match occurs, the CCP2 pin can be: • • • • driven high driven low toggled (high-to-low or low-to-high) remain unchanged (that is, reflects the state of the I/O latch) The action on the pin is based on the value of the mode select bits (CCP2M). At the same time, the interrupt flag bit, CCP2IF, is set. DS39635C-page 170 CCP PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the appropriate TRIS bit. Note: CCP PRESCALER There are four prescaler settings in Capture mode; they are specified as part of the operating mode selected by the mode select bits (CCP2M). Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. This means that any Reset will clear the prescaler counter. CLRF MOVLW 16.3.1 16.3.2 Clearing the CCPxCON register will force the RC1 or RE7 compare output latch (depending on device configuration) to the default low level. This is not the PORTC or PORTE I/O data latch. TIMER1/TIMER3 MODE SELECTION Timer1 and/or Timer3 must be running in Timer mode, or Synchronized Counter mode, if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work. 16.3.3 SOFTWARE INTERRUPT MODE When the Generate Software Interrupt mode is chosen (CCP2M = 1010), the CCP2 pin is not affected. Only a CCP interrupt is generated if enabled and the CCP2IE bit is set. 16.3.4 SPECIAL EVENT TRIGGERS CCP1 and CCP2 are both equipped with a Special Event Trigger. This is an internal hardware signal, generated in Compare mode, to trigger actions by other modules. The Special Event Trigger is enabled by selecting the Compare Special Event Trigger mode (CCP2M = 1011). For either CCP module, the Special Event Trigger resets the Timer register pair for whichever timer resource is currently assigned as the module’s time base. This allows the CCPRx registers to serve as a programmable period register for either timer. The Special Event Trigger for CCP2 can also start an A/D conversion. In order to do this, the A/D Converter must already be enabled. Note: The Special Event Trigger of CCP1 only resets Timer1/Timer3 and cannot start an A/D conversion even when the A/D Converter is enabled. CCP3 is not equipped with a Special Event Trigger. Selecting the Compare Special Event Trigger mode for this device (CCP3M = 1011) is functionally the same as selecting the Generate Software Interrupt mode (CCP3M = 1010).  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 16-3: COMPARE MODE OPERATION BLOCK DIAGRAM Special Event Trigger (Timer1/Timer3 Reset) T3CCP2 Comparator 1 CCPR1H TMR1H TMR1L T3CCP1 TMR3H TMR3L 0 CCP1 Pin Set CCP1IF 0 Compare Match Output Logic S Q R TRIS Output Enable 4 CCP1CON CCPR1L Special Event Trigger (Timer1/Timer3 Reset, A/D Trigger) Set CCP2IF Comparator 1 CCPR2H Compare Match CCP2 Pin Output Logic S Q R TRIS Output Enable 4 CCP2CON CCPR2L T3CCP1 T3CCP2 Set CCP3IF CCP3 Pin 0 Comparator 1 CCPR3H  2010 Microchip Technology Inc. CCPR3L Compare Match Output Logic 4 CCP3CON S Q R TRIS Output Enable DS39635C-page 171 PIC18F6310/6410/8310/8410 TABLE 16-2: Name INTCON REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3 Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 RCON IPEN SBOREN — RI TO PD POR BOR 64 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 65 PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 65 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 65 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 IPR3 — — RC2IP TX2IP — — — CCP3IP 65 TRISB PORTB Data Direction Register 66 TRISC PORTC Data Direction Register 66 TRISE PORTE Data Direction Register 66 TMR1L Holding Register for the Least Significant Byte of the 16-Bit TMR1 Register 64 TMR1H Holding Register for the Most Significant Byte of the 16-Bit TMR1 Register 64 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR3H Timer3 Register High Byte TMR3L Timer3 Register Low Byte T3CON RD16 T3CCP2 TMR1CS TMR1ON 64 65 65 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 65 CCPR1L Capture/Compare/PWM Register 1 (LSB) 65 CCPR1H Capture/Compare/PWM Register 1 (MSB) 65 — CCP1CON — DC1B1 DC1B0 CCPR2L Capture/Compare/PWM Register 2 (LSB) CCPR2H Capture/Compare/PWM Register 2 (MSB) — CCP2CON — DC2B1 DC2B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 65 65 65 CCP2M3 CCP2M2 CCP2M1 CCP2M0 65 CCPR3L Capture/Compare/PWM Register 3 (LSB) 65 CCPR3H Capture/Compare/PWM Register 3 (MSB) 65 CCP3CON — — DC3B1 DC3B0 CCP3M3 CCP3M2 CCP3M1 CCP3M0 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3. DS39635C-page 172  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 16.4 PWM Mode In Pulse-Width Modulation (PWM) mode, the CCP2 pin produces up to a 10-bit resolution PWM output. Since the CCP2 pin is multiplexed with a PORTC or PORTE data latch, the appropriate TRIS bit must be cleared to make the CCP2 pin an output. A PWM output (Figure 16-5) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 16-5: Period Clearing the CCP2CON register will force the RC1 or RE7 output latch (depending on device configuration) to the default low level. This is not the PORTC or PORTE I/O data latch. Note: PWM OUTPUT Duty Cycle TMR2 = PR2 Figure 16-4 shows a simplified block diagram of the CCP module in PWM mode. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 16.4.3 “Setup for Pwm Operation”. FIGURE 16-4: SIMPLIFIED PWM BLOCK DIAGRAM Duty Cycle Registers TMR2 = Duty Cycle TMR2 = PR2 16.4.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula: CCP1CON EQUATION 16-1: CCPR1L PWM Period = (PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) PWM frequency is defined as 1/[PWM period]. CCPR1H (Slave) R Comparator When TMR2 is equal to PR2, the following three events occur on the next increment cycle: Q RC2/CCP1 TMR2 (Note 1) S TRISC Comparator PR2 Clear Timer, CCP1 pin and latch D.C. Note 1: The 8-bit TMR2 value is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base.  2010 Microchip Technology Inc. • TMR2 is cleared • The CCP2 pin is set (exception: if PWM duty cycle = 0%, the CCP2 pin will not be set) • The PWM duty cycle is latched from CCPR2L into CCPR2H Note: The Timer2 postscalers (see Section 14.0 “Timer2 Module”) are not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. DS39635C-page 173 PIC18F6310/6410/8310/8410 16.4.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPR2L register and to the CCP2CON bits. Up to 10-bit resolution is available. The CCPR2L contains the eight MSbs and the CCP2CON contains the two LSbs. This 10-bit value is represented by CCPR2L:CCP2CON. The following equation is used to calculate the PWM duty cycle in time: The maximum PWM resolution (bits) for a given PWM frequency is given by the equation: EQUATION 16-3: F OSC log  ---------------  F PWM PWM Resolution (max) = -----------------------------bits log  2  Note: EQUATION 16-2: PWM Duty Cycle = (CCPR2L:CCP2CON) • TOSC • (TMR2 Prescale Value) CCPR2L and CCP2CON can be written to at any time, but the duty cycle value is not latched into CCPR2H until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR2H is a read-only register. The CCPR2H register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPR2H and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCP2 pin is cleared. TABLE 16-3: 16.4.3 If the PWM duty cycle value is longer than the PWM period, the CCP2 pin will not be cleared. SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. 2. 3. 4. 5. Set the PWM period by writing to the PR2 register. Set the PWM duty cycle by writing to the CCPR2L register and CCP2CON bits. Make the CCP2 pin an output by clearing the appropriate TRIS bit. Set the TMR2 prescale value, then enable Timer2 by writing to T2CON. Configure the CCP2 module for PWM operation. EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz PWM Frequency Timer Prescaler (1, 4, 16) PR2 Value Maximum Resolution (bits) DS39635C-page 174 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz 16 4 1 1 1 1 FFh FFh FFh 3Fh 1Fh 17h 10 10 10 8 7 6.58  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 16-4: Name INTCON REGISTERS ASSOCIATED WITH PWM AND TIMER2 Bit 7 Bit 6 GIE/GIEH PEIE/GIEL Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 RCON IPEN SBOREN — RI TO PD POR BOR 64 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 TRISB PORTB Data Direction Register 66 TRISC PORTC Data Direction Register 66 TRISE PORTE Data Direction Register 66 TMR2 Timer2 Register 64 PR2 Timer2 Period Register 64 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 64 CCPR1L Capture/Compare/PWM Register 1 (LSB) 65 CCPR1H Capture/Compare/PWM Register 1 (MSB) 65 CCP1CON — — DC1B1 DC1B0 CCPR2L Capture/Compare/PWM Register 2 (LSB) CCPR2H Capture/Compare/PWM Register 2 (MSB) CCP2CON — — DC2B1 DC2B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 65 65 65 CCP2M3 CCP2M2 CCP2M1 CCP2M0 65 CCPR3L Capture/Compare/PWM Register 3 (LSB) 65 CCPR3H Capture/Compare/PWM Register 3 (MSB) 65 CCP3CON — — DC3B1 DC3B0 CCP3M3 CCP3M2 CCP3M1 CCP3M0 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PWM or Timer2.  2010 Microchip Technology Inc. DS39635C-page 175 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 176  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.0 17.1 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C) - Full Master mode - Slave mode (with general address call) 17.3 SPI Mode The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: • Serial Data Out (SDO) • Serial Data In (SDI) • Serial Clock (SCK) Additionally, a fourth pin may be used when in a Slave mode of operation: • Slave Select (SS) Figure 17-1 shows the block diagram of the MSSP module when operating in SPI mode. FIGURE 17-1: MSSP BLOCK DIAGRAM (SPI MODE) The I2C interface supports the following modes in hardware: Internal Data Bus Read • Master mode • Multi-Master mode • Slave mode 17.2 Control Registers The MSSP module has three associated registers. These include a status register (SSPSTAT) and two control registers (SSPCON1 and SSPCON2). The use of these registers and their individual configuration bits differ significantly depending on whether the MSSP module is operated in SPI or I2C mode. Additional details are provided under the individual sections. Write SSPBUF reg SDI SSPSR reg SDO SS Shift Clock bit 0 SS Control Enable Edge Select 2 Clock Select SCK SSPM SMP:CKE 4 TMR2 Output 2 2 ( Edge Select ) Prescaler TOSC 4, 16, 64 Data to TXx/RXx in SSPSR TRIS bit  2010 Microchip Technology Inc. DS39635C-page 177 PIC18F6310/6410/8310/8410 17.3.1 REGISTERS SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. The MSSP module has four registers for SPI mode operation. These are: • • • • In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. MSSP Control Register 1 (SSPCON1) MSSP Status Register (SSPSTAT) Serial Receive/Transmit Buffer Register (SSPBUF) MSSP Shift Register (SSPSR) – Not directly accessible During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. SSPCON1 and SSPSTAT are the control and status registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper 2 bits of the SSPSTAT are read/write. REGISTER 17-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 6 CKE: SPI Clock Edge Select bit When CKP = 0: 1 = Data transmitted on rising edge of SCK 0 = Data transmitted on falling edge of SCK When CKP = 1: 1 = Data transmitted on falling edge of SCK 0 = Data transmitted on rising edge of SCK bit 5 D/A: Data/Address bit Used in I2C mode only. bit 4 P: Stop bit Used in I2C™ mode only. This bit is cleared when the MSSP module is disabled; SSPEN is cleared. bit 3 S: Start bit Used in I2C mode only. bit 2 R/W: Read/Write bit Information Used in I2C mode only. bit 1 UA: Update Address bit Used in I2C mode only. bit 0 BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty DS39635C-page 178  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 17-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV(1) SSPEN(2) CKP SSPM3(3) SSPM2(3) SSPM1(3) SSPM0(3) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WCOL: Write Collision Detect bit (Transmit mode only) 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit(1) SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared in software). 0 = No overflow bit 5 SSPEN: Master Synchronous Serial Port Enable bit(2) 1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins bit 4 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level bit 3-0 SSPM: Master Synchronous Serial Port Mode Select bits(3) 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note 1: 2: 3: In Master mode, the overflow bit is not set, since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, these pins must be properly configured as inputs or outputs. Bit combinations not specifically listed here are either reserved or implemented in I2C™ mode only.  2010 Microchip Technology Inc. DS39635C-page 179 PIC18F6310/6410/8310/8410 17.3.2 OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1 and SSPSTAT). These control bits allow the following to be specified: • • • • Master mode (SCK is the clock output) Slave mode (SCK is the clock input) Clock Polarity (Idle state of SCK) Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF (SSPSTAT), and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before EXAMPLE 17-1: LOOP reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit, WCOL (SSPCON1), will be set. User software must clear the WCOL bit so that it can be determined if the following write(s) to the SSPBUF register completed successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF (SSPSTAT), indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. The SSPBUF must be read and/or written. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 17-1 shows the loading of the SSPBUF (SSPSR) for data transmission. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the MSSP Status register (SSPSTAT) indicates the various status conditions. LOADING THE SSPBUF (SSPSR) REGISTER BTFSS BRA MOVF SSPSTAT, BF LOOP SSPBUF, W ;Has data been received (transmit complete)? ;No ;WREG reg = contents of SSPBUF MOVWF RXDATA ;Save in user RAM, if data is meaningful MOVF MOVWF TXDATA, W SSPBUF ;W reg = contents of TXDATA ;New data to xmit Note 1: The SSPBUF register cannot be used with read-modify-write instructions, such as BCF, BTFSC and COMF, etc. 2: To avoid lost data in Master mode, a read of the SSPBUF must be performed to clear the Buffer Full (BF) detect bit (SSPSTAT) between each transmission. DS39635C-page 180  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.3.3 ENABLING SPI I/O 17.3.4 To enable the serial port, MSSP Enable bit, SSPEN (SSPCON1), must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, reinitialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI must have TRISC bit cleared • SDO must have TRISC bit cleared • SCK (Master mode) must have TRISC bit cleared • SCK (Slave mode) must have TRISC bit set • SS must have TRISF bit set TYPICAL CONNECTION Figure 17-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: • Master sends data–Slave sends dummy data • Master sends data–Slave sends data • Master sends dummy data–Slave sends data Any serial port function that is not desired may be overridden by programming the corresponding Data Direction (TRIS) register to the opposite value. FIGURE 17-2: SPI MASTER/SLAVE CONNECTION SPI Master SSPM = 00xxb SPI Slave SSPM = 010xb SDO SDI Serial Input Buffer (SSPBUF) SDI Shift Register (SSPSR) MSb Serial Input Buffer (SSPBUF) LSb  2010 Microchip Technology Inc. Shift Register (SSPSR) MSb SCK PROCESSOR 1 SDO Serial Clock LSb SCK PROCESSOR 2 DS39635C-page 181 PIC18F6310/6410/8310/8410 17.3.5 MASTER MODE The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 17-2) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). This could be useful in receiver applications as a “Line Activity Monitor” mode. FIGURE 17-3: The clock polarity is selected by appropriately programming the CKP bit (SSPCON1). This then, would give waveforms for SPI communication as shown in Figure 17-3, Figure 17-5 and Figure 17-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • • • • FOSC/4 (or TCY) FOSC/16 (or 4 • TCY) FOSC/64 (or 16 • TCY) Timer2 output/2 Figure 17-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. SPI MODE WAVEFORM (MASTER MODE) Write to SSPBUF SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) 4 Clock Modes SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) SDO (CKE = 0) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDO (CKE = 1) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SDI (SMP = 0) bit 0 bit 7 Input Sample (SMP = 0) SDI (SMP = 1) bit 7 bit 0 Input Sample (SMP = 1) SSPIF SSPSR to SSPBUF DS39635C-page 182 Next Q4 Cycle after Q2  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.3.6 SLAVE MODE In Slave mode, the data is transmitted and received as the external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. 17.3.7 SLAVE SELECT SYNCHRONIZATION The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1 = 04h). The pin must not be driven low for the SS pin to function as an input. The data latch must be high. When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, FIGURE 17-4: even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable, depending on the application. Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON = 0100), the SPI module will reset if the SS pin is set to VDD. 2: If the SPI is used in Slave mode with CKE set, then the SS pin control must be enabled When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. To emulate two-wire communication, the SDO pin can be connected to the SDI pin. When the SPI needs to operate as a receiver, the SDO pin can be configured as an input. This disables transmissions from the SDO. The SDI can always be left as an input (SDI function) since it cannot create a bus conflict. SLAVE SYNCHRONIZATION WAVEFORM SS SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) Write to SSPBUF SDO SDI (SMP = 0) bit 7 bit 6 bit 7 bit 0 bit 0 bit 7 bit 7 Input Sample (SMP = 0) SSPIF Interrupt Flag SSPSR to SSPBUF  2010 Microchip Technology Inc. Next Q4 Cycle after Q2 DS39635C-page 183 PIC18F6310/6410/8310/8410 FIGURE 17-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) SS Optional SCK (CKP = 0 CKE = 0) SCK (CKP = 1 CKE = 0) Write to SSPBUF SDO SDI (SMP = 0) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 0 bit 7 Input Sample (SMP = 0) SSPIF Interrupt Flag Next Q4 Cycle after Q2 SSPSR to SSPBUF FIGURE 17-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SS Not Optional SCK (CKP = 0 CKE = 1) SCK (CKP = 1 CKE = 1) Write to SSPBUF SDO bit 7 SDI (SMP = 0) bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 0 Input Sample (SMP = 0) SSPIF Interrupt Flag SSPSR to SSPBUF DS39635C-page 184 Next Q4 Cycle after Q2  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.3.8 SLEEP OPERATION 17.3.9 In SPI Master mode, module clocks may be operating at a different speed than when in Full-Power mode; in the case of the Sleep mode, all clocks are halted. In most power-managed modes, a clock is provided to the peripherals. That clock should be from the primary clock source, the secondary clock (Timer1 oscillator at 32.768 kHz) or the INTOSC source. See Section 3.7 “Clock Sources and Oscillator Switching” for additional information. In most cases, the speed that the master clocks SPI data is not important; however, this should be evaluated for each system. A Reset disables the MSSP module and terminates the current transfer. 17.3.10 BUS MODE COMPATIBILITY Table 17-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. TABLE 17-1: SPI BUS MODES Control Bits State Standard SPI Mode Terminology CKP CKE 0, 0 0 1 0, 1 0 0 1, 0 1 1 1, 1 1 0 If MSSP interrupts are enabled, they can wake the controller from Sleep mode, or one of the Idle modes, when the master completes sending data. If an exit from Sleep or Idle mode is not desired, MSSP interrupts should be disabled. If the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the devices wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. EFFECTS OF A RESET There is also an SMP bit which controls when the data is sampled. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in any power-managed mode and data to be shifted into the SPI Transmit/ Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. TABLE 17-2: Name INTCON REGISTERS ASSOCIATED WITH SPI OPERATION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 IPR1 TRISC PORTC Data Direction Register 66 TRISF PORTF Data Direction Register 66 SSPBUF Master Synchronous Serial Port Receive Buffer/Transmit Register 64 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 64 SSPSTAT SMP CKE D/A P S R/W UA BF 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode.  2010 Microchip Technology Inc. DS39635C-page 185 PIC18F6310/6410/8310/8410 17.4 I2C Mode 17.4.1 The MSSP module in I 2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications as well as 7-bit and 10-bit addressing. Two pins are used for data transfer: • Serial clock (SCL) – RC3/SCK/SCL • Serial data (SDA) – RC4/SDI/SDA The user must configure these pins as inputs through the TRISC bits. FIGURE 17-7: MSSP BLOCK DIAGRAM (I2C™ MODE) Internal Data Bus Read Write SSPBUF reg SCL Shift Clock MSb Match Detect LSb Addr Match SSPADD reg Start and Stop bit Detect DS39635C-page 186 The MSSP module has six registers for I2C operation. These are: • • • • MSSP Control Register 1 (SSPCON1) MSSP Control Register 2 (SSPCON2) MSSP Status Register (SSPSTAT) Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible • MSSP Address Register (SSPADD) SSPCON1, SSPCON2 and SSPSTAT are the control and status registers in I2C mode operation. The SSPCON1 and SSPCON2 registers are readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper 2 bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to, or read from. SSPADD register holds the slave device address when the MSSP is configured in I2C Slave mode. When the MSSP is configured in Master mode, the lower 7 bits of SSPADD act as the Baud Rate Generator reload value. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. SSPSR reg SDA REGISTERS During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. Set, Reset S, P bits (SSPSTAT reg)  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 17-3: SSPSTAT: MSSP STATUS REGISTER (I2C™ MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P(1) S(1) R/W(2,3) UA BF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for High-Speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit(1) 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last bit 3 S: Start bit(1) 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last bit 2 R/W: Read/Write bit Information (I2C mode only) In Slave mode:(2) 1 = Read 0 = Write In Master mode:(3) 1 = Transmit is in progress 0 = Transmit is not in progress bit 1 UA: Update Address bit (10-Bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty In Receive mode: 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty Note 1: 2: 3: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. When enabled, these pins must be properly configured as input or output. Bit combinations not specifically listed here are either reserved or implemented in I2C mode only.  2010 Microchip Technology Inc. DS39635C-page 187 PIC18F6310/6410/8310/8410 SSPCON1: MSSP CONTROL REGISTER 1 (I2C™ MODE) REGISTER 17-4: R/W-0 SMP R/W-0 CKE R/W-0 D/A R/W-0 R/W-0 (1) P (1) S R/W-0 R/W (2,3) R/W-0 R/W-0 UA BF bit 7 bit 0 bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for High-Speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit(1) 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last bit 3 S: Start bit(1) 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last bit 2 R/W: Read/Write bit Information (I2C mode only) In Slave mode:(2) 1 = Read 0 = Write In Master mode:(3) 1 = Transmit is in progress 0 = Transmit is not in progress bit 1 UA: Update Address bit (10-Bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty In Receive mode: 1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full 0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty Note 1: 2: 3: DS39635C-page 188 This bit is cleared on Reset and when SSPEN is cleared. This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 SSPCON2: MSSP CONTROL REGISTER 2 (I2C™ MODE) REGISTER 17-5: R/W-0 GCEN R/W-0 R/W-0 (1) ACKSTAT ACKDT R/W-0 (2) ACKEN R/W-0 (2) RCEN R/W-0 (2) PEN R/W-0 (2) RSEN R/W-0 SEN(2) bit 7 bit 0 bit 7 GCEN: General Call Enable bit (Slave mode only) 1 = Enable interrupt when a general call address (0000h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)(1) 1 = Not Acknowledge 0 = Acknowledge bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)(2) 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit; automatically cleared by hardware 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (Master mode only)(2) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (Master mode only)(2) 1 = Initiate Stop condition on SDA and SCL pins; automatically cleared by hardware 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enable bit (Master mode only)(2) 1 = Initiate Repeated Start condition on SDA and SCL pins; automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable/Stretch Enable bit(2) In Master mode: 1 = Initiate Start condition on SDA and SCL pins; automatically cleared by hardware 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: 2: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. If the I2C module is not in Idle mode, this bit may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).  2010 Microchip Technology Inc. DS39635C-page 189 PIC18F6310/6410/8310/8410 17.4.2 OPERATION The MSSP module functions are enabled by setting MSSP Enable bit, SSPEN (SSPCON). The SSPCON1 register allows control of the I 2C operation. Four mode selection bits (SSPCON) allow one of the following I 2C modes to be selected: I2C Master mode, Clock = (FOSC/4) x (SSPADD + 1) I 2C Slave mode (7-bit address) I 2C Slave mode (10-bit address) I 2C Slave mode (7-bit address) with Start and Stop bit interrupts enabled • I 2C Slave mode (10-bit address) with Start and Stop bit interrupts enabled • I 2C Firmware Controlled Master mode, slave is Idle • • • • Selection of any I 2C mode with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRISC bits. To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. 17.4.3 SLAVE MODE In Slave mode, the SCL and SDA pins must be configured as inputs (TRISC set). The MSSP module will override the input state with the output data when required (slave-transmitter). The I 2C Slave mode hardware will always generate an interrupt on an address match. Through the mode select bits, the user can also choose to interrupt on Start and Stop bits When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. 17.4.3.1 Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match and the BF and SSPOV bits are clear, the following events occur: 1. 2. 3. 4. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit, SSPIF (PIR1), is set. The BF bit is cleared by reading the SSPBUF register, while bit, SSPOV, is cleared through software. The SSPSR register value is loaded into the SSPBUF register. The Buffer Full bit, BF, is set. An ACK pulse is generated. MSSP Interrupt Flag bit, SSPIF (PIR1), is set (interrupt is generated, if enabled) on the falling edge of the ninth SCL pulse. In 10-Bit Addressing mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit, R/W (SSPSTAT), must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal ‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the address. The sequence of events for 10-bit addressing is as follows, with Steps 7 through 9 for the slave-transmitter: 1. 2. 3. 4. 5. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: • The Buffer Full bit, BF (SSPSTAT), was set before the transfer was received. • The overflow bit, SSPOV (SSPCON), was set before the transfer was received. Addressing 6. 7. 8. 9. Receive first (high) byte of address (bits, SSPIF, BF and UA (SSPSTAT), are set). Update the SSPADD register with second (low) byte of address (clears bit, UA, and releases the SCL line). Read the SSPBUF register (clears bit, BF) and clear flag bit, SSPIF. Receive second (low) byte of address (SSPIF, BF and UA bits are set). Update the SSPADD register with the first (high) byte of address. If match releases SCL line, this will clear bit, UA. Read the SSPBUF register (clears bit, BF) and clear flag bit, SSPIF. Receive Repeated Start condition. Receive first (high) byte of address (bits, SSPIF and BF, are set). Read the SSPBUF register (clears bit, BF) and clear flag bit, SSPIF. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I2C specification, as well as the requirement of the MSSP module, are shown in timing Parameter #100 and Parameter #101. DS39635C-page 190  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.3.2 Reception When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the no Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit, BF (SSPSTAT), is set or bit, SSPOV (SSPCON1), is set. An MSSP interrupt is generated for each data transfer byte. Flag bit, SSPIF (PIR1), must be cleared in software. The SSPSTAT register is used to determine the status of the byte. If SEN is enabled (SSPCON2 = 1), RC3/SCK/SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting bit, CKP (SSPCON). See Section 17.4.4 “Clock Stretching” for more details. 17.4.3.3 Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and pin, RC3/SCK/SCL, is held low regardless of SEN (see Section 17.4.4 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then, the RC3/SCK/SCL pin should be enabled by setting bit, CKP (SSPCON1). The 8 data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 17-9). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, pin, RC3/SCK/SCL, must be enabled by setting bit, CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared in software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse.  2010 Microchip Technology Inc. DS39635C-page 191 DS39635C-page 192 CKP 2 A6 3 4 A4 5 A3 Receiving Address A5 6 A2 (CKP does not reset to ‘0’ when SEN = 0) SSPOV (SSPCON1) BF (SSPSTAT) (PIR1) SSPIF 1 SCL S A7 7 A1 8 9 ACK R/W = 0 1 D7 3 4 D4 5 D3 Receiving Data D5 Cleared in software SSPBUF is read 2 D6 6 D2 7 D1 8 D0 9 ACK 1 D7 2 D6 3 4 D4 5 D3 Receiving Data D5 6 D2 7 D1 8 D0 Bus master terminates transfer P SSPOV is set because SSPBUF is still full. ACK is not sent. 9 ACK FIGURE 17-8: SDA PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS)  2010 Microchip Technology Inc.  2010 Microchip Technology Inc. 1 2 A6 Data in sampled CKP (SSPCON1) BF (SSPSTAT) SSPIF (PIR1) S A7 3 A5 4 A4 5 A3 6 A2 Receiving Address 7 A1 8 R/W = 1 9 ACK 4 D4 5 D3 Cleared in software 3 D5 6 D2 SSPBUF is written in software 2 D6 CKP is set in software Clear by reading SCL held low while CPU responds to SSPIF 1 D7 Transmitting Data 7 8 D0 9 ACK From SSPIF ISR D1 1 D7 4 D4 5 D3 6 D2 CKP is set in software 7 8 D0 9 ACK From SSPIF ISR D1 Transmitting Data Cleared in software 3 D5 SSPBUF is written in software 2 D6 P FIGURE 17-9: SCL SDA PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS) DS39635C-page 193 DS39635C-page 194 2 1 4 1 5 0 7 A8 UA is set indicating that the SSPADD needs to be updated SSPBUF is written with contents of SSPSR 6 A9 8 9 (CKP does not reset to ‘0’ when SEN = 0) UA (SSPSTAT) SSPOV (SSPCON1) CKP 3 1 Cleared in software BF (SSPSTAT) (PIR1) SSPIF 1 SCL S 1 ACK R/W = 0 A7 2 4 A4 5 A3 6 8 9 A0 ACK UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with low byte of address 7 A2 A1 Cleared in software 3 A5 Dummy read of SSPBUF to clear BF flag 1 A6 Receive Second Byte of Address 1 D7 4 5 6 Cleared in software 3 7 8 9 1 2 4 5 6 Cleared in software 3 D3 D2 Receive Data Byte D1 D0 ACK D7 D6 D5 D4 Cleared by hardware when SSPADD is updated with high byte of address 2 D3 D2 Receive Data Byte D6 D5 D4 Clock is held low until update of SSPADD has taken place 7 8 D1 D0 9 P Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. ACK FIGURE 17-10: SDA Receive First Byte of Address Clock is held low until update of SSPADD has taken place PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS)  2010 Microchip Technology Inc.  2010 Microchip Technology Inc. 2 CKP (SSPCON1) UA (SSPSTAT) BF (SSPSTAT) (PIR1) SSPIF 1 S SCL 1 4 1 5 0 6 7 A9 A8 8 UA is set indicating that the SSPADD needs to be updated SSPBUF is written with contents of SSPSR 3 1 Receive First Byte of Address 1 9 ACK 1 3 4 5 Cleared in software 2 7 UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with low byte of address 6 8 A6 A5 A4 A3 A2 A1 A0 Receive Second Byte of Address Dummy read of SSPBUF to clear BF flag A7 9 ACK 2 3 1 4 1 Cleared in software 1 1 5 0 6 8 9 ACK R/W = 1 1 2 4 5 6 Cleared in software 3 CKP is set in software 9 P Completion of data transmission clears BF flag 8 ACK Bus master terminates transfer CKP is automatically cleared in hardware, holding SCL low 7 D7 D6 D5 D4 D3 D2 D1 D0 Transmitting Data Byte Clock is held low until CKP is set to ‘1’ Write of SSPBUF BF flag is clear initiates transmit at the end of the third address sequence 7 A9 A8 Cleared by hardware when SSPADD is updated with high byte of address. Dummy read of SSPBUF to clear BF flag Sr 1 Receive First Byte of Address Clock is held low until update of SSPADD has taken place FIGURE 17-11: SDA R/W = 0 Clock is held low until update of SSPADD has taken place PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS) DS39635C-page 195 PIC18F6310/6410/8310/8410 17.4.4 CLOCK STRETCHING Both 7 and 10-Bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit (SSPCON2) allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. 17.4.4.1 Clock Stretching for 7-Bit Slave Receive Mode (SEN = 1) In 7-Bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence, if the BF bit is set, the CKP bit in the SSPCON1 register is automatically cleared, forcing the SCL output to be held low. The CKP being cleared to ‘0’ will assert the SCL line low. The CKP bit must be set in the user’s ISR before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring (see Figure 17-13). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition. 17.4.4.2 17.4.4.3 Clock Stretching for 7-Bit Slave Transmit Mode 7-Bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock, if the BF bit is clear. This occurs regardless of the state of the SEN bit. The user’s ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another transmit sequence (see Figure 17-9). Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. 17.4.4.4 Clock Stretching for 10-Bit Slave Transmit Mode In 10-Bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-Bit Slave Receive mode. The first two addresses are followed by a third address sequence which contains the highorder bits of the 10-bit address and the R/W bit set to ‘1’. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is controlled by the BF flag as in 7-Bit Slave Transmit mode (see Figure 17-11). Clock Stretching for 10-Bit Slave Receive Mode (SEN = 1) In 10-Bit Slave Receive mode during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address with the R/W bit cleared to ‘0’. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode. Note: If the user polls the UA bit and clears it by updating the SSPADD register before the falling edge of the ninth clock occurs and if the user hasn’t cleared the BF bit by reading the SSPBUF register before that time, then the CKP bit will still NOT be asserted low. Clock stretching on the basis of the state of the BF bit only occurs during a data sequence, not an address sequence. DS39635C-page 196  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.4.5 Clock Synchronization and the CKP bit When the CKP bit is cleared, the SCL output is forced to ‘0’. However, setting the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has FIGURE 17-12: already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 17-12). CLOCK SYNCHRONIZATION TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SDA DX DX – 1 SCL CKP Master device asserts clock Master device deasserts clock WR SSPCON  2010 Microchip Technology Inc. DS39635C-page 197 DS39635C-page 198 CKP SSPOV (SSPCON1) BF (SSPSTAT) (PIR1) SSPIF 1 SCL S A7 2 A6 3 4 A4 5 A3 6 A2 Receiving Address A5 7 A1 8 9 ACK R/W = 0 3 4 D4 5 D3 Receiving Data D5 Cleared in software 2 D6 If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to ‘0’ and no clock stretching will occur SSPBUF is read 1 D7 6 D2 7 D1 9 ACK 1 D7 BF is set after falling edge of the 9th clock, CKP is reset to ‘0’ and clock stretching occurs 8 D0 CKP written to ‘1’ in software 2 D6 Clock is held low until CKP is set to ‘1’ 3 4 D4 5 D3 Receiving Data D5 6 D2 7 D1 8 D0 Bus master terminates transfer P SSPOV is set because SSPBUF is still full. ACK is not sent. 9 ACK Clock is not held low because ACK = 1 FIGURE 17-13: SDA Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS)  2010 Microchip Technology Inc.  2010 Microchip Technology Inc. 2 1 UA (SSPSTAT) SSPOV (SSPCON1) CKP 3 1 4 1 5 0 6 7 A9 A8 8 UA is set indicating that the SSPADD needs to be updated SSPBUF is written with contents of SSPSR Cleared in software BF (SSPSTAT) (PIR1) SSPIF 1 SCL S 1 9 ACK R/W = 0 A7 2 4 A4 5 A3 6 A2 Cleared in software 3 A5 7 A1 8 A0 Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with low byte of address after falling edge of ninth clock Dummy read of SSPBUF to clear BF flag 1 A6 Receive Second Byte of Address 9 ACK 2 4 5 6 D3 D2 Cleared in software 3 D5 D4 7 D1 8 Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. 9 ACK 1 4 5 6 Cleared in software 3 CKP written to ‘1’ in software 2 D3 D2 Receive Data Byte D7 D6 D5 D4 Clock is held low until CKP is set to ‘1’ D0 Cleared by hardware when SSPADD is updated with high byte of address after falling edge of ninth clock Dummy read of SSPBUF to clear BF flag 1 D7 D6 Receive Data Byte Clock is held low until update of SSPADD has taken place 7 8 9 Bus master terminates transfer P SSPOV is set because SSPBUF is still full. ACK is not sent. D1 D0 ACK Clock is not held low because ACK = 1 FIGURE 17-14: SDA Receive First Byte of Address Clock is held low until update of SSPADD has taken place PIC18F6310/6410/8310/8410 I2C™ SLAVE MODE TIMING SEN = 1 (RECEPTION, 10-BIT ADDRESS) DS39635C-page 199 PIC18F6310/6410/8310/8410 17.4.5 GENERAL CALL ADDRESS SUPPORT If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit) and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit is set (SSPSTAT). If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-Bit Addressing mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 17-15). The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call address is recognized when the General Call Enable bit (GCEN) is enabled (SSPCON2 set). Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. FIGURE 17-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESSING MODE) Address is compared to General Call Address after ACK, set interrupt R/W = 0 ACK D7 General Call Address SDA SCL S 1 2 3 4 5 6 7 8 9 1 Receiving Data ACK D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPIF BF (SSPSTAT) Cleared in software SSPBUF is read SSPOV (SSPCON1) ‘0’ GCEN (SSPCON2) ‘1’ DS39635C-page 200  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 MASTER MODE Note: Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON1 and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit is set or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I 2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. 2. 3. 4. 5. 6. Assert a Start condition on SDA and SCL. Assert a Repeated Start condition on SDA and SCL. Write to the SSPBUF register initiating transmission of data/address. Configure the I2C port to receive data. Generate an Acknowledge condition at the end of a received byte of data. Generate a Stop condition on SDA and SCL. FIGURE 17-16: The MSSP module, when configured in I2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. The following events will cause MSSP Interrupt Flag bit, SSPIF, to be set (MSSP interrupt, if enabled): • • • • • Start condition Stop condition Data transfer byte transmitted/received Acknowledge transmit Repeated Start MSSP BLOCK DIAGRAM (I2C™ MASTER MODE) Internal Data Bus Read SSPM SSPADD Write SSPBUF SDA Baud Rate Generator Shift Clock SDA In SCL In Bus Collision  2010 Microchip Technology Inc. LSb Start bit, Stop bit, Acknowledge Generate Start bit Detect Stop bit Detect Write Collision Detect Clock Arbitration State Counter for end of XMIT/RCV Clock Cntl SCL Receive Enable SSPSR MSb Clock Arbitrate/WCOL Detect (hold off clock source) 17.4.6 Set/Reset, S, P, WCOL (SSPSTAT); Set SSPIF, BCLIF; Reset ACKSTAT, PEN (SSPCON2) DS39635C-page 201 PIC18F6310/6410/8310/8410 17.4.6.1 I2C Master Mode Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted, 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address, followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The Baud Rate Generator used for the SPI mode operation is used to set the SCL clock frequency for either 100 kHz, 400 kHz or 1 MHz I2C operation. See Section 17.4.7 “Baud Rate” for more detail. DS39635C-page 202 A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the Start Enable bit, SEN (SSPCON2). 2. SSPIF is set. The MSSP module will wait the required start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2). 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with 8 bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2). 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the Stop Enable bit, PEN (SSPCON2). 12. Interrupt is generated once the Stop condition is complete.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.7 BAUD RATE 2 In I C Master mode, the Baud Rate Generator (BRG) reload value is placed in the lower 7 bits of the SSPADD register (Figure 17-17). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. The BRG counts down to ‘0’ and stops until another reload has taken place. The BRG count is decremented twice per instruction cycle (TCY) on the Q2 and Q4 clocks. In I2C Master mode, the BRG is reloaded automatically. FIGURE 17-17: Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state. Table 17-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. Table 17-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. The SSPADD BRG value of ‘0x00’ is not supported. BAUD RATE GENERATOR BLOCK DIAGRAM SSPM SSPM Reload SCL Control CLKO TABLE 17-3: SSPADD Reload BRG Down Counter FOSC/4 I2C™ CLOCK RATE W/BRG FCY FCY * 2 BRG Value FSCL (2 Rollovers of BRG) 10 MHz 20 MHz 19h 400 kHz 10 MHz 20 MHz 20h 312.5 kHz 10 MHz 20 MHz 3Fh 100 kHz 4 MHz 8 MHz 0Ah 400 kHz 4 MHz 8 MHz 0Dh 308 kHz 4 MHz 8 MHz 28h 100 kHz 1 MHz 2 MHz 03h 333 kHz 1 MHz 2 MHz 0Ah 100 kHz  2010 Microchip Technology Inc. DS39635C-page 203 PIC18F6310/6410/8310/8410 17.4.7.1 Clock Arbitration Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the FIGURE 17-18: SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 17-18). BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA DX DX – 1 SCL deasserted but slave holds SCL low (clock arbitration) SCL allowed to transition high SCL BRG decrements on Q2 and Q4 cycles BRG Value 03h 02h 01h 00h (hold off) 03h 02h SCL is sampled high, reload takes place and BRG starts its count BRG Reload DS39635C-page 204  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 I2C MASTER MODE START CONDITION TIMING Note: To initiate a Start condition, the user sets the Start Enable bit, SEN (SSPCON2). If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit (SSPSTAT) to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit (SSPCON2) will be automatically cleared by hardware, the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. 17.4.8.1 17.4.8 FIGURE 17-19: If, at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its Idle state. WCOL Status Flag If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete. FIRST START BIT TIMING Write to SEN bit occurs here Set S bit (SSPSTAT) SDA = 1, SCL = 1 TBRG At completion of Start bit, hardware clears SEN bit and sets SSPIF bit TBRG Write to SSPBUF occurs here 1st bit SDA 2nd bit TBRG SCL TBRG S  2010 Microchip Technology Inc. DS39635C-page 205 PIC18F6310/6410/8310/8410 17.4.9 I2C MASTER MODE REPEATED START CONDITION TIMING Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. A Repeated Start condition occurs when the RSEN bit (SSPCON2) is programmed high and the I2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded with the contents of SSPADD and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit (SSPCON2) will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit (SSPSTAT) will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode, or the default first address in 10-bit mode. After the first 8 bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or 8 bits of data (7-bit mode). 17.4.9.1 If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: FIGURE 17-20: WCOL Status Flag Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete. REPEATED START CONDITION WAVEFORM Write to SSPCON2 occurs here. SDA = 1, SCL (no change). Set S (SSPSTAT) SDA = 1, SCL = 1 TBRG TBRG At completion of Start bit, hardware clears RSEN bit and sets SSPIF TBRG 1st bit SDA Falling edge of ninth clock, end of Xmit Write to SSPBUF occurs here TBRG SCL TBRG Sr = Repeated Start DS39635C-page 206  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.10 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF, and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification Parameter #106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification Parameter #107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 17-21). After the write to the SSPBUF, each bit of address will be shifted out on the falling edge of SCL until all 7 address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit (SSPCON2). Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 17.4.10.1 BF Status Flag In Transmit mode, the BF bit (SSPSTAT) is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 17.4.10.2 17.4.10.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit (SSPCON2) is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 17.4.11 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (SSPCON2). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/ low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2). 17.4.11.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 17.4.11.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 17.4.11.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur) after 2 TCY after the SSPBUF write. If SSPBUF is rewritten within 2 TCY, the WCOL bit is set and SSPBUF is updated. This may result in a corrupted transfer. The user should verify that the WCOL flag is clear after each write to SSPBUF to ensure the transfer is correct.  2010 Microchip Technology Inc. DS39635C-page 207 DS39635C-page 208 S R/W PEN SEN BF (SSPSTAT) SSPIF SCL SDA A6 A5 A4 A3 A2 A1 3 4 5 Cleared in software 2 6 7 8 9 After Start condition, SEN cleared by hardware SSPBUF written 1 D7 1 SCL held low while CPU responds to SSPIF ACK = 0 R/W = 0 SSPBUF written with 7-bit address and R/W start transmit A7 Transmit Address to Slave 3 D5 4 D4 5 D3 6 D2 7 D1 8 D0 SSPBUF is written in software Cleared in software service routine from MSSP interrupt 2 D6 Transmitting Data or Second Half of 10-bit Address From slave, clear ACKSTAT bit SSPCON2 P Cleared in software 9 ACK ACKSTAT in SSPCON2 = 1 FIGURE 17-21: SEN = 0 Write SSPCON2 SEN = 1 Start condition begins PIC18F6310/6410/8310/8410 I 2C™ MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)  2010 Microchip Technology Inc.  2010 Microchip Technology Inc. ACKEN SSPOV BF (SSPSTAT) SDA = 0, SCL = 1 while CPU responds to SSPIF SSPIF 4 5 Cleared in software 3 6 2 1 SCL S A6 A5 A4 A3 A2 Transmit Address to Slave A7 SDA 7 A1 8 9 R/W = 1 ACK ACK from Slave 2 3 5 6 7 8 D0 9 ACK 2 3 4 5 6 7 Cleared in software Set SSPIF interrupt at end of Acknowledge sequence Data shifted in on falling edge of CLK 1 D7 D6 D5 D4 D3 D2 D1 Cleared in software Set SSPIF at end of receive 9 ACK is not sent ACK P Set SSPIF interrupt at end of Acknowledge sequence Bus master terminates transfer Set P bit (SSPSTAT) and SSPIF PEN bit = 1 written here SSPOV is set because SSPBUF is still full 8 D0 RCEN cleared automatically Set ACKEN, start Acknowledge sequence SDA = ACKDT = 1 Receiving Data from Slave RCEN = 1, start next receive ACK from Master SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF Cleared in software Set SSPIF interrupt at end of receive 4 Cleared in software 1 D7 D6 D5 D4 D3 D2 D1 Receiving Data from Slave RCEN cleared automatically Master configured as a receiver by programming SSPCON2 (RCEN = 1) FIGURE 17-22: SEN = 0 Write to SSPBUF occurs here Start XMIT Write to SSPCON2 (SEN = 1) Begin Start Condition Write to SSPCON2 to start Acknowledge sequence SDA = ACKDT (SSPCON2) = 0 PIC18F6310/6410/8310/8410 I 2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) DS39635C-page 209 PIC18F6310/6410/8310/8410 17.4.12 ACKNOWLEDGE SEQUENCE TIMING 17.4.13 A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN (SSPCON2). At the end of a receive/ transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit (SSPSTAT) is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 17-24). An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2). When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 17-23). 17.4.12.1 17.4.13.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-23: STOP CONDITION TIMING ACKNOWLEDGE SEQUENCE WAVEFORM Acknowledge sequence starts here, write to SSPCON2 ACKEN = 1, ACKDT = 0 ACKEN automatically cleared TBRG SDA ACK D0 SCL TBRG 8 9 SSPIF Set SSPIF at the end of receive Cleared in software Cleared in software Set SSPIF at the end of Acknowledge sequence Note: TBRG = one Baud Rate Generator period. FIGURE 17-24: STOP CONDITION RECEIVE OR TRANSMIT MODE SCL = 1 for TBRG, followed by SDA = 1 for TBRG after SDA sampled high. P bit (SSPSTAT) is set. Write to SSPCON2, set PEN PEN bit (SSPCON2) is cleared by hardware and the SSPIF bit is set Falling edge of 9th clock TBRG SCL SDA ACK P TBRG TBRG TBRG SCL brought high after TBRG SDA asserted low before rising edge of clock to setup Stop condition Note: TBRG = one Baud Rate Generator period. DS39635C-page 210  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.14 SLEEP OPERATION 17.4.17 2 While in Sleep mode, the I C module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 17.4.15 EFFECT OF A RESET A Reset disables the MSSP module and terminates the current transfer. 17.4.16 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I 2C bus may be taken when the P bit (SSPSTAT) is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the MSSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed in hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • • • • • Address Transfer Data Transfer A Start Condition A Repeated Start Condition An Acknowledge Condition MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF and reset the I2C port to its Idle state (Figure 17-25). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 17-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE Data changes while SCL = 0 SDA line pulled low by another source SDA released by master Sample SDA. While SCL is high, data doesn’t match what is driven by the master. Bus collision has occurred. SDA SCL Set bus collision interrupt (BCLIF) BCLIF  2010 Microchip Technology Inc. DS39635C-page 211 PIC18F6310/6410/8310/8410 17.4.17.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) b) SDA or SCL are sampled low at the beginning of the Start condition (Figure 17-26). SCL is sampled low before SDA is asserted low (Figure 17-27). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 17-28). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to ‘0’ and during this time, if the SCL pins are sampled as ‘0’, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. Note: If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 17-26). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded from SSPADD and counts down to ‘0’. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. FIGURE 17-26: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. BUS COLLISION DURING START CONDITION (SDA ONLY) SDA goes low before the SEN bit is set. Set BCLIF, S bit and SSPIF set because SDA = 0, SCL = 1. SDA SCL Set SEN, enable Start condition if SDA = 1, SCL = 1 SEN cleared automatically because of bus collision. MSSP module reset into Idle state. SEN BCLIF SDA sampled low before Start condition. Set BCLIF. S bit and SSPIF set because SDA = 0, SCL = 1. SSPIF and BCLIF are cleared in software S SSPIF SSPIF and BCLIF are cleared in software DS39635C-page 212  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 17-27: BUS COLLISION DURING A START CONDITION (SCL = 0) SDA = 0, SCL = 1 TBRG TBRG SDA Set SEN, enable Start sequence if SDA = 1, SCL = 1 SCL SCL = 0 before SDA = 0, bus collision occurs. Set BCLIF. SEN SCL = 0 before BRG time-out, bus collision occurs. Set BCLIF. BCLIF Interrupt cleared in software S ‘0’ ‘0’ SSPIF ‘0’ ‘0’ FIGURE 17-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA = 0, SCL = 1 Set S Less than TBRG SDA Set SSPIF TBRG SDA pulled low by other master. Reset BRG and assert SDA. SCL S SCL pulled low after BRG time-out SEN BCLIF Set SEN, enable START sequence if SDA = 1, SCL = 1 ‘0’ S SSPIF SDA = 0, SCL = 1, set SSPIF  2010 Microchip Technology Inc. Interrupts cleared in software DS39635C-page 213 PIC18F6310/6410/8310/8410 17.4.17.2 Bus Collision During a Repeated Start Condition If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 17-29). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. During a Repeated Start condition, a bus collision occurs if: a) b) A low level is sampled on SDA when SCL goes from low level to high level. SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition (see Figure 17-30). When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD and counts down to ‘0’. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. FIGURE 17-29: If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) SDA SCL Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. RSEN BCLIF Cleared in software ‘0’ S ‘0’ SSPIF FIGURE 17-30: BUS COLLISION DURING A REPEATED START CONDITION (CASE 2) TBRG TBRG SDA SCL BCLIF SCL goes low before SDA, set BCLIF. Release SDA and SCL. Interrupt cleared in software RSEN S ‘0’ SSPIF DS39635C-page 214  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 17.4.17.3 Bus Collision During a Stop Condition The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD and counts down to ‘0’. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 17-31). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 17-32). Bus collision occurs during a Stop condition if: a) b) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. After the SCL pin is deasserted, SCL is sampled low before SDA goes high. FIGURE 17-31: BUS COLLISION DURING A STOP CONDITION (CASE 1) TBRG TBRG TBRG SDA SDA sampled low after TBRG, set BCLIF SDA asserted low SCL PEN BCLIF P ‘0’ SSPIF ‘0’ FIGURE 17-32: BUS COLLISION DURING A STOP CONDITION (CASE 2) TBRG TBRG TBRG SDA Assert SDA SCL SCL goes low before SDA goes high, set BCLIF PEN BCLIF P ‘0’ SSPIF ‘0’  2010 Microchip Technology Inc. DS39635C-page 215 PIC18F6310/6410/8310/8410 TABLE 17-4: Name INTCON REGISTERS ASSOCIATED WITH I2C™ OPERATION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 IPR1 TRISC PORTC Data Direction Register 66 SSPBUF Master Synchronous Serial Port Receive Buffer/Transmit Register 64 SSPADD Master Synchronous Serial Port Receive Buffer/Transmit Register 64 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 64 SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 64 SSPSTAT SMP CKE D/A P S R/W UA BF 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in I DS39635C-page 216 2C mode.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.0 ENHANCED UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (EUSART) PIC18F6310/6410/8310/8410 devices have three serial I/O modules: the MSSP module, discussed in the previous chapter and two Universal Synchronous Asynchronous Receiver Transmitter (USART) modules. (Generically, the USART is also known as a Serial Communications Interface or SCI.) The USART can be configured as a full-duplex asynchronous system that can communicate with peripheral devices, such as CRT terminals and personal computers. It can also be configured as a half-duplex synchronous system that can communicate with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs, etc. There are two distinct implementations of the USART module in these devices: the Enhanced USART (EUSART), discussed here and the Addressable USART (AUSART), discussed in the next chapter. For this device family, USART1 always refers to the EUSART, while USART2 is always the AUSART. The EUSART and AUSART modules implement the same core features for serial communications; their basic operation is essentially the same. The EUSART module provides additional features, including automatic baud rate detection and calibration, automatic wake-up on Sync Break reception and 12-bit Break character transmit. These features make it ideally suited for use in Local Interconnect Network bus (LIN/J2602 bus) systems.  2010 Microchip Technology Inc. The EUSART can be configured in the following modes: • Asynchronous (full-duplex) with: - Auto-wake-up on character reception - Auto-baud calibration - 12-bit Break character transmission • Synchronous – Master (half-duplex) with selectable clock polarity • Synchronous – Slave (half-duplex) with selectable clock polarity The pins of the Enhanced USART are multiplexed with PORTC. In order to configure TX1/CK1 and RX1/DT1 as a USART: • SPEN bit (RCSTA1) must be set (= 1) • TRISC bit must be set (= 1) • TRISC bit must be set (= 1) Note: The USART control will automatically reconfigure the pin from input to output as needed. The operation of the Enhanced USART module is controlled through three registers: • Transmit Status and Control Register 1 (TXSTA1) • Receive Status and Control Register 1 (RCSTA1) • Baud Rate Control Register 1 (BAUDCON1) The registers are described Register 18-2 and Register 18-3. in Register 18-1, DS39635C-page 217 PIC18F6310/6410/8310/8410 REGISTER 18-1: R/W-0 TXSTA1: EUSART1 TRANSMIT STATUS AND CONTROL REGISTER R/W-0 CSRC TX9 R/W-0 TXEN (1) R/W-0 R/W-0 R/W-0 R-1 R/W-0 SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit is enabled 0 = Transmit is disabled bit 4 SYNC: AUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care. bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR is empty 0 = TSR is full bit 0 TX9D: 9th bit of Transmit Data Can be address/data bit or a parity bit. Note 1: SREN/CREN overrides TXEN in Sync mode. DS39635C-page 218  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 18-2: RCSTA1: EUSART1 RECEIVE STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SPEN: Serial Port Enable bit 1 = Serial port is enabled 0 = Serial port is disabled bit 6 RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-Bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR are set 0 = Disables address detection, all bytes are received and ninth bit can be used as a parity bit Asynchronous mode 8-Bit (RX9 = 0): Don’t care. bit 2 FERR: Framing Error bit 1 = Framing error (can be cleared by reading RCREG1 register and receiving next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit, CREN) 0 = No overrun error bit 0 RX9D: 9th bit of Received Data bit This can be address/data bit or a parity bit and must be calculated by user firmware.  2010 Microchip Technology Inc. DS39635C-page 219 PIC18F6310/6410/8310/8410 REGISTER 18-3: BAUDCON1: BAUD RATE CONTROL REGISTER 1 R/W-0 R-1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit 1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software) 0 = No BRG rollover has occurred bit 6 RCIDL: Receive Operation Idle Status bit 1 = Receive operation is Idle 0 = Receive operation is active bit 5 RXDTP: Received Data Polarity Select bit Asynchronous mode: 1 = Receive data (RXx) is inverted (active-low) 0 = Receive data (RXx) is not inverted (active-high) Synchronous mode: No affect. bit 4 TXCKP: Clock and Data Polarity Select bit Asynchronous mode: 1 = Idle state for transmit (TXx) is a low level 0 = Idle state for transmit (TXx) is a high level Synchronous mode: 1 = Idle state for clock (CKx) is a high level 0 = Idle state for clock (CKx) is a low level bit 3 BRG16: 16-Bit Baud Rate Register Enable bit 1 = 16-bit Baud Rate Generator – SPBRGH1 and SPBRG1 0 = 8-bit Baud Rate Generator – SPBRG1 only (Compatible mode); SPBRGH1 value ignored bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = EUSART will continue to sample the RXx pin – interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = RXx pin not monitored or rising edge detected Synchronous mode: Unused in this mode. bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h); cleared in hardware upon completion. 0 = Baud rate measurement disabled or completed Synchronous mode: Unused in this mode. DS39635C-page 220  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.1 EUSART Baud Rate Generator (BRG) The BRG is a dedicated, 8-bit or 16-bit generator that supports both the Asynchronous and Synchronous modes of the EUSART. By default, the BRG operates in 8-bit mode; setting the BRG16 bit (BAUDCON1) selects 16-bit mode. The SPBRGH1:SPBRG1 register pair controls the period of a free running timer. In Asynchronous mode, bits, BRGH (TXSTA1) and BRG16 (BAUDCON1), also control the baud rate. In Synchronous mode, BRGH is ignored. Table 18-1 shows the formula for computation of the baud rate for different EUSART modes that only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRGH1:SPBRG1 registers can be calculated using the formulas in Table 18-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 18-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 18-2. It may be advantageous to use the high baud rate (BRGH = 1) or the 16-bit BRG to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency. TABLE 18-1: SYNC Writing a new value to the SPBRGH1:SPBRG1 registers causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. Note: 18.1.1 The BRG value of ‘0’ is not supported. OPERATION IN POWER-MANAGED MODES The device clock is used to generate the desired baud rate. When one of the power-managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG1 register pair. 18.1.2 SAMPLING The data on the RXx pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RXx pin when SYNC is clear or when both BRG16 and BRGH are not set. The data on the RXx pin is sampled once when SYNC is set or when BRGH16 and BRGH are both set. BAUD RATE FORMULAS Configuration Bits BRG16 BRGH BRG/EUSART Mode Baud Rate Formula 0 0 0 8-bit/Asynchronous 0 0 1 8-bit/Asynchronous 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous 1 1 x 16-bit/Synchronous Legend: x = Don’t care, n = Value of SPBRGH1:SPBRG1 register pair EXAMPLE 18-1: FOSC/[64 (n + 1)] FOSC/[16 (n + 1)] FOSC/[4 (n + 1)] CALCULATING BAUD RATE ERROR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Desired Baud Rate = FOSC/(64 ([SPBRGH1:SPBRG1] + 1)) Solving for SPBRGH1:SPBRG1: X = ((FOSC/Desired Baud Rate)/64) – 1 = ((16000000/9600)/64) – 1 = [25.042] = 25 Calculated Baud Rate = 16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate = (9615 – 9600)/9600 = 0.16% TABLE 18-2: Name REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TXSTA1 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR BAUDCON1 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE SPBRGH1 EUSART1 Baud Rate Generator Register High Byte SPBRG1 EUSART1 Baud Rate Generator Register Low Byte Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.  2010 Microchip Technology Inc. Reset Values on Page Bit 0 TX9D RX9D ABDEN 65 65 66 66 65 DS39635C-page 221 PIC18F6310/6410/8310/8410 TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE (K) FOSC = 40.000 MHz FOSC = 20.000 MHz (decimal) Actual Rate (K) % Error — — — — — 1.221 2.441 1.73 255 9.615 0.16 64 19.2 19.531 1.73 57.6 56.818 115.2 125.000 FOSC = 10.000 MHz (decimal) Actual Rate (K) % Error — — — 1.73 255 1.202 2.404 0.16 129 9.766 1.73 31 31 19.531 1.73 -1.36 10 62.500 8.51 4 104.167 Actual Rate (K) % Error 0.3 — — 1.2 — 2.4 9.6 SPBRG value FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error — — — — 0.16 129 1.201 -0.16 103 2.404 0.16 64 2.403 -0.16 51 9.766 1.73 15 9.615 -0.16 12 15 19.531 1.73 7 — — — 8.51 4 52.083 -9.58 2 — — — -9.58 2 78.125 -32.18 1 — — — SPBRG value SPBRG value SPBRG value (decimal) SYNC = 0, BRGH = 0, BRG16 = 0 BAUD RATE (K) FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz (decimal) Actual Rate (K) 0.16 207 0.300 -0.16 103 0.300 -0.16 51 0.16 51 1.201 -0.16 25 1.201 -0.16 12 2.404 0.16 25 2.403 -0.16 12 — — — 9.6 8.929 -6.99 6 — — — — — — 19.2 20.833 8.51 2 — — — — — — Actual Rate (K) % Error 0.3 0.300 1.2 1.202 2.4 SPBRG value % Error (decimal) Actual Rate (K) % Error SPBRG value SPBRG value (decimal) 57.6 62.500 8.51 0 — — — — — — 115.2 62.500 -45.75 0 — — — — — — SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE (K) FOSC = 40.000 MHz FOSC = 20.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — — 9.766 1.73 255 Actual Rate (K) % Error 0.3 — 1.2 — 2.4 9.6 SPBRG value FOSC = 10.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — — 9.615 0.16 FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — — 2.441 1.73 255 2.403 -0.16 207 129 9.615 0.16 64 9.615 -0.16 51 25 SPBRG value SPBRG value SPBRG value (decimal) — 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — SYNC = 0, BRGH = 1, BRG16 = 0 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) % Error FOSC = 2.000 MHz SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) 0.3 — — — — — — 0.300 -0.16 207 1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51 2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25 9.6 9.615 0.16 25 9.615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — — DS39635C-page 222  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE (K) FOSC = 40.000 MHz Actual Rate (K) % Error FOSC = 20.000 MHz SPBRG value (decimal) Actual Rate (K) % Error FOSC = 10.000 MHz (decimal) Actual Rate (K) SPBRG value % Error FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error SPBRG value SPBRG value (decimal) 0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 0.300 -0.04 1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1.201 -0.16 1665 415 2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2.403 -0.16 207 9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51 25 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — SYNC = 0, BRGH = 0, BRG16 = 1 BAUD RATE (K) FOSC = 4.000 MHz FOSC = 2.000 MHz (decimal) Actual Rate (K) % Error 0.04 832 0.300 0.16 207 1.201 2.404 0.16 103 9.6 9.615 0.16 19.2 19.231 57.6 62.500 115.2 125.000 FOSC = 1.000 MHz (decimal) Actual Rate (K) % Error -0.16 415 0.300 -0.16 -0.16 103 1.201 -0.16 51 2.403 -0.16 51 2.403 -0.16 25 25 9.615 -0.16 12 — — — 0.16 12 — — — — — — 8.51 3 — — — — — — 8.51 1 — — — — — — Actual Rate (K) % Error 0.3 0.300 1.2 1.202 2.4 SPBRG value SPBRG value SPBRG value (decimal) 207 SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE (K) FOSC = 40.000 MHz FOSC = 20.000 MHz (decimal) Actual Rate (K) % Error 0.00 33332 0.300 0.00 8332 1.200 0.02 4165 Actual Rate (K) % Error 0.3 0.300 1.2 1.200 2.4 2.400 SPBRG value FOSC = 10.000 MHz (decimal) Actual Rate (K) % Error 0.00 16665 0.300 0.02 4165 1.200 2.400 0.02 2082 2.402 SPBRG value FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error 0.00 8332 0.300 -0.01 6665 0.02 2082 1.200 -0.04 1665 0.06 1040 2.400 -0.04 832 SPBRG value SPBRG value (decimal) 9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9.615 -0.16 207 19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19.230 -0.16 103 57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57.142 0.79 34 115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117.647 -2.12 16 SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 BAUD RATE (K) 0.3 1.2 FOSC = 4.000 MHz Actual Rate (K) % Error 0.300 1.200 0.01 0.04 FOSC = 2.000 MHz (decimal) Actual Rate (K) % Error 3332 832 0.300 1.201 -0.04 -0.16 SPBRG value FOSC = 1.000 MHz (decimal) Actual Rate (K) % Error 1665 415 0.300 1.201 -0.04 -0.16 832 207 SPBRG value SPBRG value (decimal) 2.4 2.404 0.16 415 2.403 -0.16 207 2.403 -0.16 103 9.6 9.615 0.16 103 9.615 -0.16 51 9.615 -0.16 25 19.2 19.231 0.16 51 19.230 -0.16 25 19.230 -0.16 12 57.6 58.824 2.12 16 55.555 3.55 8 — — — 115.2 111.111 -3.55 8 — — — — — —  2010 Microchip Technology Inc. DS39635C-page 223 PIC18F6310/6410/8310/8410 18.1.3 AUTO-BAUD RATE DETECT The Enhanced USART module supports the automatic detection and calibration of baud rate. This feature is active only in Asynchronous mode and while the WUE bit is clear. The automatic baud rate measurement sequence (Figure 18-1) begins whenever a Start bit is received and the ABDEN bit is set. The calculation is self-averaging. While the ABD sequence takes place, the EUSART state machine is held in Idle. The RC1IF interrupt is set once the fifth rising edge on RX1 is detected. The value in the RCREG1 needs to be read to clear the RC1IF interrupt. The contents of RCREG1 should be discarded. Note 1: If the WUE bit is set with the ABDEN bit, Auto-Baud Rate Detection will occur on the byte following the Break character. 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible due to bit error rates. Overall system timing and communication baud rates must be taken into consideration when using the Auto-Baud Rate Detection feature. In the Auto-Baud Rate Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX1 signal, the RX1 signal is timing the BRG. In ABD mode, the internal Baud Rate Generator is used as a counter to time the bit period of the incoming serial byte stream. Once the ABDEN bit is set, the state machine will clear the BRG and look for a Start bit. The Auto-Baud Rate Detect must receive a byte with the value, 55h (ASCII “U”, which is also the LIN/J2602 bus Sync character), in order to calculate the proper bit rate. The measurement is taken over both a low and a high bit time in order to minimize any effects caused by asymmetry of the incoming signal. After a Start bit, the SPBRG1 begins counting up, using the preselected clock source on the first rising edge of RX1. After eight bits on the RX1 pin or the fifth rising edge, an accumulated value totalling the proper BRG period is left in the SPBRGH1:SPBRG1 register pair. Once the 5th edge is seen (this should correspond to the Stop bit), the ABDEN bit is automatically cleared. If a rollover of the BRG occurs (an overflow from FFFFh to 0000h), the event is trapped by the ABDOVF status bit (BAUDCON1). It is set in hardware by BRG rollovers and can be set or cleared by the user in software. ABD mode remains active after rollover events and the ABDEN bit remains set (Figure 18-2). While calibrating the baud rate period, the BRG registers are clocked at 1/8th the preconfigured clock rate. Note that the BRG clock can be configured by the BRG16 and BRGH bits. The BRG16 bit must be set to use both SPBRG1 and SPBRGH1 as a 16-bit counter. This allows the user to verify that no carry occurred for 8-bit modes by checking for 00h in the SPBRGH1 register. Refer to Table 18-4 for counter clock rates to the BRG. DS39635C-page 224 3: To maximize baud rate range, it is recommended to set the BRG16 bit if the auto-baud feature is used. TABLE 18-4: BRG COUNTER CLOCK RATES BRG16 BRGH BRG Counter Clock 0 0 FOSC/512 0 1 FOSC/128 1 0 FOSC/128 1 1 FOSC/32 18.1.3.1 ABD and EUSART Transmission Since the BRG clock is reversed during ABD acquisition, the EUSART transmitter cannot be used during ABD. This means that whenever the ABDEN bit is set, TXREG1 cannot be written to. Users should also ensure that ABDEN does not become set during a transmit sequence. Failing to do this may result in unpredictable EUSART operation.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 18-1: BRG Value AUTOMATIC BAUD RATE CALCULATION XXXXh 0000h 001Ch Start RX1 Pin Edge #1 Bit 1 Bit 0 Edge #2 Bit 3 Bit 2 Edge #3 Bit 5 Bit 4 Edge #4 Bit 7 Bit 6 Edge #5 Stop Bit BRG Clock Auto-Cleared Set by User ABDEN bit RC1IF bit (Interrupt) Read RCREG1 SPBRG1 XXXXh 1Ch SPBRGH1 XXXXh 00h Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0. FIGURE 18-2: BRG OVERFLOW SEQUENCE BRG Clock ABDEN bit RX1 Pin Start Bit 0 ABDOVF bit FFFFh BRG Value XXXXh  2010 Microchip Technology Inc. 0000h 0000h DS39635C-page 225 PIC18F6310/6410/8310/8410 18.2 EUSART Asynchronous Mode The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA1). In this mode, the EUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip dedicated 8-bit/16-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent, but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate depending on the BRGH and BRG16 bits (TXSTA1 and BAUDCON1). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. The TXCKP (BAUDCON) and RXDTP (BAUDCON) bits allow the TX and RX signals to be inverted (polarity reversed). Devices that buffer signals between TTL and RS-232 levels also invert the signal. Setting the TXCKP and RXDTP bits allows for the use of circuits that provide buffering without inverting the signal. interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX1IE (PIE1). TX1IF will be set regardless of the state of TX1IE; it cannot be cleared in software. TX1IF is also not cleared immediately upon loading TXREG1, but becomes valid in the second instruction cycle following the load instruction. Polling TX1IF immediately following a load of TXREG1 will return invalid results. While TX1IF indicates the status of the TXREG1 register, another bit, TRMT (TXSTA1), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TXCKP bit (BAUDCON) allows the TX signal to be inverted (polarity reversed). Devices that buffer signals from TTL to RS-232 levels also invert the signal (when TTL = 1, RS-232 = negative). Inverting the polarity of the TXx pin data by setting the TXCKP bit allows for use of circuits that provide buffering without inverting the signal. Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit, TX1IF, is set when enable bit, TXEN, is set. When operating in Asynchronous mode, the EUSART module consists of the following important elements: • • • • • • • Baud Rate Generator Sampling Circuit Asynchronous Transmitter Asynchronous Receiver Auto-Wake-up on Sync Break Character 12-Bit Break Character Transmit Auto-Baud Rate Detection 18.2.1 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG1. The TXREG1 register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG1 register (if available). Once the TXREG1 register transfers the data to the TSR register (occurs in one TCY), the TXREG1 register is empty and the TX1IF flag bit (PIR1) is set. This DS39635C-page 226 To set up an Asynchronous Transmission: 1. 2. 3. 4. 5. 6. 7. 8. 9. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. If the signal from the TXx pin is to be inverted, set the TXCKP bit. If interrupts are desired, set enable bit, TXIE. If 9-bit transmission is desired, set transmit bit, TX9. Can be used as an address/data bit. Enable the transmission by setting bit, TXEN, which will also set bit, TXIF. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Load data to the TXREG register (starts transmission). If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 18-3: EUSART TRANSMIT BLOCK DIAGRAM Data Bus TX1IF TXREG1 Register TX1IE 8 MSb LSb (8) Pin Buffer and Control 0  TSR Register TX1 pin Interrupt TXEN Baud Rate CLK TRMT BRG16 SPBRGH1 SPBRG1 TX9D Baud Rate Generator FIGURE 18-4: Write to TXREG1 BRG Output (Shift Clock) ASYNCHRONOUS TRANSMISSION Word 1 TX1 (pin) Start bit FIGURE 18-5: bit 0 bit 1 bit 7/8 Stop bit Word 1 TX1IF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) SPEN TX9 1 TCY Word 1 Transmit Shift Reg ASYNCHRONOUS TRANSMISSION (BACK TO BACK) Write to TXREG1 Word 1 Word 2 BRG Output (Shift Clock) TX1 (pin) TX1IF bit (Interrupt Reg. Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Note: Start bit bit 0 1 TCY bit 1 Word 1 bit 7/8 Stop bit Start bit bit 0 Word 2 1 TCY Word 1 Transmit Shift Reg. Word 2 Transmit Shift Reg. This timing diagram shows two consecutive transmissions.  2010 Microchip Technology Inc. DS39635C-page 227 PIC18F6310/6410/8310/8410 TABLE 18-5: Name INTCON REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 TXREG1 TXSTA1 GIE/GIEH PEIE/GIEL Bit 5 EUSART1 Transmit Register 65 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 BAUDCON1 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 EUSART1 Baud Rate Generator Register High Byte 66 SPBRG1 EUSART1 Baud Rate Generator Register Low Byte 65 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission. DS39635C-page 228  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.2.2 EUSART ASYNCHRONOUS RECEIVER The receiver block diagram is shown in Figure 18-6. The data is received on the RX1 pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. The RXDTP bit (BAUDCON) allows the RX signal to be inverted (polarity reversed). Devices that buffer signals from RS-232 to TTL levels also perform an inversion of the signal (when RS-232 = positive, TTL = 0). Inverting the polarity of the RXx pin data by setting the RXDTP bit allows for the use of circuits that provide buffering without inverting the signal. To set up an Asynchronous Reception: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If the signal at the RXx pin is to be inverted, set the RXDTP bit. 4. If interrupts are desired, set enable bit, RCIE. 5. If 9-bit reception is desired, set bit, RX9. 6. Enable the reception by setting bit, CREN. 7. Flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if enable bit, RCIE, was set. 8. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG register. 10. If any error occurred, clear the error by clearing enable bit, CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set.  2010 Microchip Technology Inc. 18.2.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If the signal at the RXx pin is to be inverted, set the RXDTP bit. If the signal from the TXx pin is to be inverted, set the TXCKP bit. 4. If interrupts are required, set the RCEN bit and select the desired priority level with the RCIP bit. 5. Set the RX9 bit to enable 9-bit reception. 6. Set the ADDEN bit to enable address detect. 7. Enable reception by setting the CREN bit. 8. The RCIF bit will be set when reception is complete. The interrupt will be Acknowledged if the RCIE and GIE bits are set. 9. Read the RCSTA register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 10. Read RCREG to determine if the device is being addressed. 11. If any error occurred, clear the CREN bit. 12. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU. DS39635C-page 229 PIC18F6310/6410/8310/8410 FIGURE 18-6: EUSART RECEIVE BLOCK DIAGRAM CREN OERR FERR x64 Baud Rate CLK BRG16 SPBRGH1 SPBRG1 Baud Rate Generator  64 or  16 or 4 RSR Register MSb Stop (8)  7 LSb 1 0 Start RX9 Pin Buffer and Control Data Recovery RX1 RX9D RCREG1 Register FIFO SPEN 8 Interrupt RC1IF Data Bus RC1IE FIGURE 18-7: RX1 (pin) Rcv Shift Reg Rcv Buffer Reg RCREG1 Read Rcv Buffer Reg ASYNCHRONOUS RECEPTION Start bit bit 0 bit 1 bit 7/8 Stop bit Start bit Word 1 RCREG1 bit 0 bit 7/8 Stop bit Start bit bit 7/8 Stop bit Word 2 RCREG1 RC1IF (Interrupt Flag) OERR bit CREN bit Note: This timing diagram shows three words appearing on the RX1 input. The RCREG1 (Receive Buffer) is read after the third word causing the OERR (Overrun) bit to be set. DS39635C-page 230  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 18-6: Name INTCON REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Bit 7 Bit 6 Bit 5 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 RCREG1 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 EUSART1 Receive Register 65 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 BAUDCON1 ABDOVF RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 EUSART1 Baud Rate Generator Register High Byte 66 SPBRG1 EUSART1 Baud Rate Generator Register Low Byte 65 TXSTA1 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception.  2010 Microchip Technology Inc. DS39635C-page 231 PIC18F6310/6410/8310/8410 18.2.4 AUTO-WAKE-UP ON SYNC BREAK CHARACTER During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper byte reception cannot be performed. The auto-wake-up feature allows the controller to wake-up, due to activity on the RX1/DT1 line while the EUSART is operating in Asynchronous mode. The auto-wake-up feature is enabled by setting the WUE bit (BAUDCON). Once set, the typical receive sequence on RX1/DT1 is disabled and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX1/DT1 line. (This coincides with the start of a Sync Break or a Wake-up Signal character for the LIN/J2602 protocol.) Following a wake-up event, the module generates an RC1IF interrupt. The interrupt is generated synchronously to the Q clocks in normal operating modes (Figure 18-8) and asynchronously, if the device is in Sleep mode (Figure 18-9). The interrupt condition is cleared by reading the RCREG1 register. The WUE bit is automatically cleared once a low-to-high transition is observed on the RX1 line following the wake-up event. At this point, the EUSART module is in Idle mode and returns to normal operation. This signals to the user that the Sync Break event is over. 18.2.4.1 Oscillator start-up time must also be considered, especially in applications using oscillators with longer start-up intervals (i.e., XT or HS mode). The Sync Break (or Wake-up Signal) character must be of sufficient length and be followed by a sufficient interval to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. 18.2.4.2 Special Considerations Using the WUE Bit The timing of WUE and RC1IF events may cause some confusion when it comes to determining the validity of received data. As noted, setting the WUE bit places the EUSART in an Idle mode. The wake-up event causes a receive interrupt by setting the RC1IF bit. The WUE bit is cleared after this when a rising edge is seen on RX1/DT1. The interrupt condition is then cleared by reading the RCREG1 register. Ordinarily, the data in RCREG1 will be dummy data and should be discarded. The fact that the WUE bit has been cleared (or is still set) and the RC1IF flag is set should not be used as an indicator of the integrity of the data in RCREG1. Users should consider implementing a parallel method in firmware to verify received data integrity. To assure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. Special Considerations Using Auto-Wake-up Since auto-wake-up functions by sensing rising edge transitions on RX1/DT1, information with any state changes before the Stop bit may signal a false End-of-Character (EOC) and cause data or framing errors. Therefore, to work properly, the initial character in the transmission must be all ‘0’s. This can be 00h (8 bits) for standard RS-232 devices, or 000h (12 bits) for the LIN/J2602 bus. DS39635C-page 232  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 18-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Bit set by user Auto-Cleared WUE bit RX1/DT1 Line RC1IF Cleared due to user read of RCREG1 The EUSART remains in Idle while the WUE bit is set. Note: FIGURE 18-9: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Bit set by user Auto-Cleared WUE bit(2) RX1/DT1 Line Note 1 RC1IF SLEEP Command Executed Note 1: 2: Sleep Ends Cleared due to user read of RCREG1 If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur while the stposc signal is still active. This sequence should not depend on the presence of Q clocks. The EUSART remains in Idle while the WUE bit is set.  2010 Microchip Technology Inc. DS39635C-page 233 PIC18F6310/6410/8310/8410 18.2.5 BREAK CHARACTER SEQUENCE The Enhanced USART module has the capability of sending the special Break character sequences that are required by the LIN/J2602 bus standard. The Break character transmit consists of a Start bit, followed by twelve ‘0’ bits and a Stop bit. The Frame Break character is sent whenever the SENDB and TXEN bits (TXSTA and TXSTA) are set while the Transmit Shift register is loaded with data. Note that the value of data written to TXREG1 will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN/J2602 specification). Note that the data value written to the TXREG1 for the Break character is ignored. The write simply serves the purpose of initiating the proper sequence. The TRMT bit indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 18-10 for the timing of the Break character sequence. 18.2.5.1 Break and Sync Transmit Sequence The following sequence will send a message frame header made up of a Break, followed by an Auto-Baud Sync byte. This sequence is typical of a LIN/J2602 bus master. 1. 2. 3. 4. 5. Load the TXREG1 with a dummy character to initiate transmission (the value is ignored). Write ‘55h’ to TXREG1 to load the Sync character into the transmit FIFO buffer. After the Break has been sent, the SENDB bit is reset by hardware. The Sync character now transmits in the preconfigured mode. When the TXREG1 becomes empty, as indicated by the TX1IF bit, the next data byte can be written to TXREG1. 18.2.6 RECEIVING A BREAK CHARACTER The Enhanced USART module can receive a Break character in two ways. The first method forces configuration of the baud rate at a frequency of 9/13 the typical speed. This allows for the Stop bit transition to be at the correct sampling location (13 bits for Break versus Start bit and 8 data bits for typical data). The second method uses the auto-wake-up feature described in Section 18.2.4 “Auto-Wake-up on Sync Break Character”. By enabling this feature, the EUSART will sample the next two transitions on RX1/DT1, cause an RC1IF interrupt and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Rate Detect feature. For both methods, the user can set the ABD bit once the TX1IF interrupt is observed. Configure the EUSART for the desired mode. Set the TXEN and SENDB bits to set up the Break character. FIGURE 18-10: Write to TXREG1 SEND BREAK CHARACTER SEQUENCE Dummy Write BRG Output (Shift Clock) TX1 (pin) Start bit bit 0 bit 1 bit 11 Stop bit Break TX1IF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB sampled here Auto-Cleared SENDB (Transmit Shift Reg. Empty Flag) DS39635C-page 234  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.3 Once the TXREG1 register transfers the data to the TSR register (occurs in one TCYCLE), the TXREG1 is empty and the TX1IF flag bit (PIR1) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX1IE (PIE1). TX1IF is set regardless of the state of enable bit, TX1IE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG1 register. EUSART Synchronous Master Mode The Synchronous Master mode is entered by setting the CSRC bit (TXSTA). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA). In addition, enable bit, SPEN (RCSTA1), is set in order to configure the TX1 and RX1 pins to CK1 (clock) and DT1 (data) lines, respectively. While flag bit, TX1IF, indicates the status of the TXREG1 register, another bit, TRMT (TXSTA), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. The Master mode indicates that the processor transmits the master clock on the CK1 line. Clock polarity (CK1) is selected with the TXCKP bit (BAUDCON). Setting TXCKP sets the Idle state on CK1 as high, while clearing the bit sets the Idle state as low. 18.3.1 To set up a Synchronous Master Transmission: 1. EUSART SYNCHRONOUS MASTER TRANSMISSION 2. The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG1. The TXREG1 register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG1 register (if available). 3. 4. 5. 6. 7. 8. 9. FIGURE 18-11: SYNCHRONOUS TRANSMISSION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 RC7/RX1/DT1 pin bit 0 bit 1 bit 2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 7 Word 1 RC6/TX1/CK1 pin (TXCKP = 0) RC6/TX1/CK1 pin (TXCKP = 1) Write to TXREG1 Reg Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. If the signal from the CKx pin is to be inverted, set the TXCKP bit. If interrupts are desired, set enable bit, TXIE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. Write Word 1 bit 0 bit 1 bit 7 Word 2 Write Word 2 TX1IF bit (Interrupt Flag) TRMT bit TXEN bit Note: ‘1’ ‘1’ Sync Master mode, SPBRG1 = 0, continuous transmission of two 8-bit words.  2010 Microchip Technology Inc. DS39635C-page 235 PIC18F6310/6410/8310/8410 FIGURE 18-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) RC7/RX1/DT1 pin bit 0 bit 1 bit 2 bit 6 bit 7 RC6/TX1/CK1 pin Write to TXREG1 Reg TX1IF bit TRMT bit TXEN bit TABLE 18-7: Name INTCON REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 RCSTA1 TXREG1 TXSTA1 EUSART1 Transmit Register CSRC BAUDCON1 ABDOVF 65 TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 EUSART1 Baud Rate Generator Register High Byte 66 SPBRG1 EUSART1 Baud Rate Generator Register Low Byte 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. DS39635C-page 236  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.3.2 EUSART SYNCHRONOUS MASTER RECEPTION 4. Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA1), or the Continuous Receive Enable bit, CREN (RCSTA1). Data is sampled on the RX1 pin on the falling edge of the clock. If enable bit, SREN, is set, only a single word is received. If enable bit, CREN, is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. 2. 3. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. Ensure bits, CREN and SREN, are clear. FIGURE 18-13: If the signal from the CKx pin is to be inverted, set the TXCKP bit. 5. If interrupts are desired, set enable bit, RCIE. 6. If 9-bit reception is desired, set bit, RX9. 7. If a single reception is required, set bit, SREN. For continuous reception, set bit, CREN. 8. Interrupt flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if the enable bit, RCIE, was set. 9. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 10. Read the 8-bit received data by reading the RCREG register. 11. If any error occurred, clear the error by clearing bit, CREN. 12. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. SYNCHRONOUS RECEPTION (MASTER MODE, SREN) Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 RC7/RX1/DT1 pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 RC6/TX1/CK1 pin (TXCKP = 0) RC6/TX1/CK1 pin (TXCKP = 1) Write to SREN bit SREN bit CREN bit ‘0’ ‘0’ RC1IF bit (Interrupt) Read RCREG1 Note: Timing diagram demonstrates Sync Master mode with SREN bit = 1 and BRGH bit = 0.  2010 Microchip Technology Inc. DS39635C-page 237 PIC18F6310/6410/8310/8410 TABLE 18-8: Name INTCON REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Bit 7 Bit 6 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 RCREG1 TXSTA1 GIE/GIEH PEIE/GIEL Bit 5 EUSART1 Receive Register CSRC BAUDCON1 ABDOVF 65 TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 EUSART1 Baud Rate Generator Register High Byte 66 SPBRG1 EUSART1 Baud Rate Generator Register Low Byte 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. DS39635C-page 238  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 18.4 EUSART Synchronous Slave Mode Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK1 pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode. 18.4.1 If two words are written to the TXREG1 and then the SLEEP instruction is executed, the following will occur: b) c) d) e) 1. 2. 3. 4. 5. 6. EUSART SYNCHRONOUS SLAVE TRANSMIT The operation of the Synchronous Master and Slave modes are identical except in the case of the Sleep mode. a) To set up a Synchronous Slave Transmission: 7. 8. 9. The first word will immediately transfer to the TSR register and transmit. The second word will remain in the TXREG1 register. Flag bit, TX1IF, will not be set. When the first word has been shifted out of TSR, the TXREG1 register will transfer the second word to the TSR and flag bit, TX1IF, will now be set. If enable bit, TX1IE, is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector. TABLE 18-9: Name Enable the synchronous slave serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. Clear bits, CREN and SREN. If interrupts are desired, set enable bit, TXIE. If the signal from the CKx pin is to be inverted, set the TXCKP bit. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting enable bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREGx register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 INTCON RCSTA1 TXREG1 TXSTA1 GIE/GIEH PEIE/GIEL EUSART1 Transmit Register CSRC BAUDCON1 ABDOVF 65 TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 EUSART1 Baud Rate Generator Register High Byte 66 SPBRG1 EUSART1 Baud Rate Generator Register Low Byte 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.  2010 Microchip Technology Inc. DS39635C-page 239 PIC18F6310/6410/8310/8410 18.4.2 EUSART SYNCHRONOUS SLAVE RECEPTION To set up a Synchronous Slave Reception: 1. The operation of the Synchronous Master and Slave modes is identical except in the case of Sleep or any Idle mode and bit, SREN, which is a “don’t care” in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG1 register; if the RC1IE enable bit is set, the interrupt generated will wake the chip from the low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector. Enable the synchronous master serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. 2. If interrupts are desired, set enable bit, RCIE. 3. If the signal from the CKx pin is to be inverted, set the TXCKP bit. 4. If 9-bit reception is desired, set bit, RX9. 5. To enable reception, set enable bit, CREN. 6. Flag bit, RCIF, will be set when reception is complete. An interrupt will be generated if enable bit, RCIE, was set. 7. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG register. 9. If any error occurred, clear the error by clearing bit, CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. TABLE 18-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name INTCON Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 RCSTA1 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 65 RCREG1 TXSTA1 EUSART1 Receive Register CSRC BAUDCON1 ABDOVF 65 TX9 TXEN SYNC SENDB BRGH TRMT TX9D 65 RCIDL RXDTP TXCKP BRG16 — WUE ABDEN 66 SPBRGH1 Baud Rate Generator Register High Byte 66 SPBRG1 Baud Rate Generator Register Low Byte 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. DS39635C-page 240  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 19.0 ADDRESSABLE UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER TRANSMITTER (AUSART) The Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART) module is very similar in function to the Enhanced USART module, discussed in the previous chapter. It is provided as an additional channel for serial communication with external devices, for those situations that do not require Auto-Baud Detection (ABD) or LIN/J2602 bus support. The AUSART can be configured in the following modes: • Asynchronous (full-duplex) • Synchronous – Master (half-duplex) • Synchronous – Slave (half-duplex)  2010 Microchip Technology Inc. The pins of the AUSART module are multiplexed with the functions of PORTG (RG1/TX2/CK2 and RG2/RX2/DT2, respectively). In order to configure these pins as an AUSART: • SPEN bit (RCSTA2) must be set (= 1) • TRISG bit must be set (= 1) • TRISG bit must be cleared (= 0) for Asynchronous and Synchronous Master modes • TRISG bit must be set (= 1) for Synchronous Slave mode Note: The USART control will automatically reconfigure the pin from input to output as needed. The operation of the Addressable USART module is controlled through two registers: TXSTA2 and RXSTA2. These are detailed in Register 19-1 and Register 19-2 respectively. DS39635C-page 241 PIC18F6310/6410/8310/8410 REGISTER 19-1: TXSTA2: AUSART2 TRANSMIT STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN(1) SYNC — BRGH TRMT TX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-Bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit(1) 1 = Transmit is enabled 0 = Transmit is disabled bit 4 SYNC: AUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 Unimplemented: Read as ‘0’ bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR is empty 0 = TSR is full bit 0 TX9D: 9th bit of Transmit Data bit Can be address/data bit or a parity bit. Note 1: x = Bit is unknown SREN/CREN overrides TXEN in Sync mode. DS39635C-page 242  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 19-2: RCSTA2: AUSART2 RECEIVE STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 SPEN: Serial Port Enable bit 1 = Serial port is enabled (configures RXx/DTx and TXx/CKx pins as serial port pins) 0 = Serial port is disabled (held in Reset) bit 6 RX9: 9-Bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit, CREN, is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-Bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR are set 0 = Disables address detection, all bytes are received and ninth bit can be used as a parity bit Asynchronous mode 9-Bit (RX9 = 0): Don’t care. bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG1 register and receiving next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit, CREN) 0 = No overrun error bit 0 RX9D: 9th bit of Received Data bit This can be address/data bit or a parity bit and must be calculated by user firmware.  2010 Microchip Technology Inc. DS39635C-page 243 PIC18F6310/6410/8310/8410 19.1 AUSART Baud Rate Generator (BRG) The BRG is a dedicated, 8-bit generator that supports both the Asynchronous and Synchronous modes of the AUSART. The SPBRG2 register controls the period of a free-running timer. In Asynchronous mode, BRGH bit (TXSTA) also controls the baud rate. In Synchronous mode, BRGH is ignored. Table 19-1 shows the formula for computation of the baud rate for different AUSART modes, which only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRG2 register can be calculated using the formulas in Table 19-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 19-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 19-2. It may be advantageous to use the high baud rate (BRGH = 1) to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency. TABLE 19-1: Writing a new value to the SPBRG2 register causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. 19.1.1 OPERATION IN POWER-MANAGED MODES The device clock is used to generate the desired baud rate. When one of the power-managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG2 register. 19.1.2 SAMPLING The data on the RX2 pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX2 pin. BAUD RATE FORMULAS Configuration Bits BRG/AUSART Mode Baud Rate Formula 0 Asynchronous FOSC/[64 (n + 1)] 1 Asynchronous FOSC/[16 (n + 1)] x Synchronous FOSC/[4 (n + 1)] SYNC BRGH 0 0 1 Legend: x = Don’t care, n = Value of SPBRG2 register EXAMPLE 19-1: CALCULATING BAUD RATE ERROR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, BRGH = 0: Desired Baud Rate = FOSC/(64 ([SPBRG2] + 1)) Solving for SPBRG2: X = ((FOSC/Desired Baud Rate)/64) – 1 = ((16000000/9600)/64) – 1 = [25.042] = 25 Calculated Baud Rate = 16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate = (9615 – 9600)/9600 = 0.16% TABLE 19-2: Name TXSTA2 RCSTA2 SPBRG2 REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 66 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 66 AUSART2 Baud Rate Generator Register 66 Legend: Shaded cells are not used by the BRG. DS39635C-page 244  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 19-3: BAUD RATES FOR ASYNCHRONOUS MODES BRGH = 0 FOSC = 40.000 MHz FOSC = 20.000 MHz (decimal) Actual Rate (K) % Error — — — 1.221 — 1.73 1.73 255 2.404 0.16 64 9.766 19.531 1.73 31 57.6 56.818 -1.36 115.2 125.000 8.51 BAUD RATE (K) Actual Rate (K) % Error 0.3 1.2 — — — — 2.4 2.441 9.6 9.615 19.2 FOSC = 10.000 MHz (decimal) Actual Rate (K) % Error — 255 — 1.202 — 0.16 0.16 129 2.404 1.73 31 9.766 19.531 1.73 15 10 62.500 8.51 4 104.167 -9.58 SPBRG value FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error — 129 — 1.201 — -0.16 — 103 0.16 64 2.403 -0.16 51 1.73 15 9.615 -0.16 12 19.531 1.73 7 — — — 4 52.083 -9.58 2 — — — 2 78.125 -32.18 1 — — — SPBRG value % Error SPBRG value SPBRG value SPBRG value (decimal) BRGH = 0 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz (decimal) Actual Rate (K) % Error (decimal) Actual Rate (K) 207 0.300 -0.16 103 0.300 -0.16 51 0.16 51 1.201 -0.16 25 1.201 -0.16 12 2.404 0.16 25 2.403 -0.16 12 — — — 8.929 -6.99 6 — — — — — — 19.2 20.833 8.51 2 — — — — — — 57.6 62.500 8.51 0 — — — — — — 115.2 62.500 -45.75 0 — — — — — — BAUD RATE (K) Actual Rate (K) % Error 0.3 0.300 0.16 1.2 1.202 2.4 9.6 SPBRG value SPBRG value (decimal) BRGH = 1 BAUD RATE (K) FOSC = 40.000 MHz FOSC = 20.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — — Actual Rate (K) % Error 0.3 — 1.2 — 2.4 — SPBRG value FOSC = 10.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — 2.441 SPBRG value FOSC = 8.000 MHz (decimal) Actual Rate (K) % Error — — — — — — — — — 1.73 255 2.403 -0.16 207 SPBRG value SPBRG value (decimal) — 9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9.615 -0.16 51 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19.230 -0.16 25 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55.555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — BRGH = 1 BAUD RATE (K) FOSC = 4.000 MHz Actual Rate (K) % Error FOSC = 2.000 MHz SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) 0.3 — — — — — — 0.300 -0.16 207 1.2 1.202 0.16 207 1.201 -0.16 103 1.201 -0.16 51 2.4 2.404 0.16 103 2.403 -0.16 51 2.403 -0.16 25 9.6 9.615 0.16 25 9.615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — —  2010 Microchip Technology Inc. DS39635C-page 245 PIC18F6310/6410/8310/8410 19.2 interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX2IE (PIE3). TX2IF will be set regardless of the state of TX2IE; it cannot be cleared in software. TX2IF is also not cleared immediately upon loading TXREG2, but becomes valid in the second instruction cycle following the load instruction. Polling TX2IF immediately following a load of TXREG2 will return invalid results. AUSART Asynchronous Mode The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA2). In this mode, the AUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip dedicated 8-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. While TX2IF indicates the status of the TXREG2 register, another bit, TRMT (TXSTA2), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The AUSART transmits and receives the LSb first. The AUSART’s transmitter and receiver are functionally independent but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate, depending on the BRGH bit (TXSTA2). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit, TX2IF, is set when enable bit, TXEN is set. When operating in Asynchronous mode, the AUSART module consists of the following important elements: • • • • To set up an Asynchronous Transmission: Baud Rate Generator Sampling Circuit Asynchronous Transmitter Asynchronous Receiver 19.2.1 1. 2. AUSART ASYNCHRONOUS TRANSMITTER 3. 4. The AUSART transmitter block diagram is shown in Figure 19-1. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG2. The TXREG2 register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG2 register (if available). 5. 6. 7. 8. Once the TXREG2 register transfers the data to the TSR register (occurs in one TCY), the TXREG2 register is empty and the TX2IF flag bit (PIR3) is set. This FIGURE 19-1: Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH bit, as required, to achieve the desired baud rate. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set transmit bit, TX9. Can be used as address/data bit. Enable the transmission by setting bit, TXEN, which will also set bit, TX2IF. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Load data to the TXREG2 register (starts transmission). If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. AUSART TRANSMIT BLOCK DIAGRAM Data Bus TX2IF TXREG2 Register TX2IE 8 MSb (8) LSb  Pin Buffer and Control 0 TSR Register TX2 Pin Interrupt TXEN Baud Rate CLK TRMT SPBRG2 Baud Rate Generator SPEN TX9 TX9D DS39635C-page 246  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 19-2: ASYNCHRONOUS TRANSMISSION Write to TXREG2 Word 1 BRG Output (Shift Clock) TX2 (pin) Start bit bit 0 bit 1 bit 7/8 Stop bit Word 1 TX2IF bit (Transmit Buffer Reg. Empty Flag) 1 TCY Word 1 Transmit Shift Reg TRMT bit (Transmit Shift Reg. Empty Flag) FIGURE 19-3: ASYNCHRONOUS TRANSMISSION (BACK TO BACK) Write to TXREG2 Word 1 Word 2 BRG Output (Shift Clock) TX2 (pin) Start bit bit 1 1 TCY TX2IF bit (Interrupt Reg. Flag) bit 7/8 Stop bit Start bit bit 0 Word 2 Word 1 1 TCY Word 1 Transmit Shift Reg. TRMT bit (Transmit Shift Reg. Empty Flag) Note: bit 0 Word 2 Transmit Shift Reg. This timing diagram shows two consecutive transmissions. TABLE 19-4: Name REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 IPR3 — — RC2IP TX2IP — — — CCP3IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D INTCON RCSTA2 TXREG2 TXSTA2 SPBRG2 GIE/GIEH PEIE/GIEL AUSART2 Transmit Register CSRC TX9 TXEN 66 66 SYNC AUSART2 Baud Rate Generator Register — BRGH TRMT TX9D 66 66 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission.  2010 Microchip Technology Inc. DS39635C-page 247 PIC18F6310/6410/8310/8410 19.2.2 AUSART ASYNCHRONOUS RECEIVER 19.2.3 The receiver block diagram is shown in Figure 19-4. The data is received on the RX2 pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If interrupts are required, set the RCEN bit and select the desired priority level with the RC2IP bit. 4. Set the RX9 bit to enable 9-bit reception. 5. Set the ADDEN bit to enable address detect. 6. Enable reception by setting the CREN bit. 7. The RC2IF bit will be set when reception is complete. The interrupt will be Acknowledged if the RC2IE and GIE bits are set. 8. Read the RCSTA2 register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 9. Read RCREG2 to determine if the device is being addressed. 10. If any error occurred, clear the CREN bit. 11. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU. To set up an Asynchronous Reception: 1. Initialize the SPBRG2 register for the appropriate baud rate. Set or clear the BRGH bit, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit, SYNC, and setting bit, SPEN. 3. If interrupts are desired, set enable bit, RC2IE. 4. If 9-bit reception is desired, set bit, RX9. 5. Enable the reception by setting bit, CREN. 6. Flag bit, RC2IF, will be set when reception is complete and an interrupt will be generated if enable bit, RC2IE, was set. 7. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG2 register. 9. If any error occurred, clear the error by clearing enable bit, CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. FIGURE 19-4: SETTING UP 9-BIT MODE WITH ADDRESS DETECT AUSART RECEIVE BLOCK DIAGRAM CREN OERR FERR x64 Baud Rate CLK SPBRG2 Baud Rate Generator  64 or  16 or 4 MSb Stop RSR Register (8) 7  1 LSb 0 Start RX9 Pin Buffer and Control Data Recovery RX2 RX9D RCREG2 Register FIFO SPEN 8 Interrupt RC2IF Data Bus RC2IE DS39635C-page 248  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 19-5: ASYNCHRONOUS RECEPTION Start bit bit 0 RX2 (pin) bit 1 Start bit bit 7/8 Stop bit Rcv Shift Reg Rcv Buffer Reg bit 0 Stop bit Start bit bit 7/8 Stop bit Word 2 RCREG2 Word 1 RCREG2 Read Rcv Buffer Reg RCREG2 bit 7/8 RC2IF (Interrupt Flag) OERR bit CREN Note: This timing diagram shows three words appearing on the RX2 input. The RCREG2 (Receive Buffer 2) is read after the third word, causing the OERR (Overrun) bit to be set. TABLE 19-5: Name INTCON REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 — — RC2IP TX2IP — — — CCP3IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 66 SYNC — BRGH TRMT TX9D 66 IPR3 RCSTA2 RCREG2 TXSTA2 SPBRG2 AUSART2 Receive Register CSRC TX9 TXEN 66 AUSART2 Baud Rate Generator Register 66 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception.  2010 Microchip Technology Inc. DS39635C-page 249 PIC18F6310/6410/8310/8410 19.3 Once the TXREG2 register transfers the data to the TSR register (occurs in one TCYCLE), the TXREG2 is empty and the TX2IF flag bit (PIR3) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TX2IE (PIE3). TX2IF is set regardless of the state of enable bit, TX2IE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG2 register. AUSART Synchronous Master Mode The Synchronous Master mode is entered by setting the CSRC bit (TXSTA2). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit, SYNC (TXSTA2). In addition, enable bit, SPEN (RCSTA2), is set in order to configure the TX2 and RX2 pins to CK2 (clock) and DT2 (data) lines, respectively. While flag bit, TX2IF, indicates the status of the TXREG2 register, another bit, TRMT (TXSTA2), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. The Master mode indicates that the processor transmits the master clock on the CK2 line. 19.3.1 To set up a Synchronous Master Transmission: AUSART SYNCHRONOUS MASTER TRANSMISSION 1. The AUSART transmitter block diagram is shown in Figure 19-1. The heart of the transmitter is the Transmit (Serial) Shift register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG2. The TXREG2 register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG2 (if available). 2. 3. 4. 5. 6. 7. 8. FIGURE 19-6: Initialize the SPBRG2 register for the appropriate baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG2 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. SYNCHRONOUS TRANSMISSION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 RX2/DT2 Pin bit 0 bit 1 bit 2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 7 Word 1 bit 0 bit 1 bit 7 Word 2 TX2/CK2 Pin Write to TXREG2 Reg Write Word 1 Write Word 2 TX2IF bit (Interrupt Flag) TRMT bit TXEN bit Note: ‘1’ ‘1’ Sync Master mode, SPBRG2 = 0, continuous transmission of two 8-bit words. DS39635C-page 250  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 19-7: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) RX2/DT2 Pin bit 0 bit 1 bit 2 bit 6 bit 7 TX2/CK2 Pin Write to TXREG2 Reg TX2IF bit TRMT bit TXEN bit TABLE 19-6: Name INTCON REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 IPR3 — — RC2IP TX2IP — — — CCP3IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 66 RCSTA2 TXREG2 TXSTA2 SPBRG2 AUSART2 Transmit Register CSRC TX9 TXEN 66 SYNC — BRGH TRMT TX9D AUSART2 Baud Rate Generator Register 66 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission.  2010 Microchip Technology Inc. DS39635C-page 251 PIC18F6310/6410/8310/8410 19.3.2 AUSART SYNCHRONOUS MASTER RECEPTION 4. 5. 6. If interrupts are desired, set enable bit, RC2IE. If 9-bit reception is desired, set bit, RX9. If a single reception is required, set bit, SREN. For continuous reception, set bit, CREN. 7. Interrupt flag bit, RC2IF, will be set when reception is complete and an interrupt will be generated if the enable bit, RC2IE, was set. 8. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG2 register. 10. If any error occurred, clear the error by clearing bit, CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA2), or the Continuous Receive Enable bit, CREN (RCSTA2). Data is sampled on the RX2 pin on the falling edge of the clock. If enable bit, SREN, is set, only a single word is received. If enable bit, CREN, is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. 2. 3. Initialize the SPBRG2 register for the appropriate baud rate. Enable the synchronous master serial port by setting bits, SYNC, SPEN and CSRC. Ensure bits, CREN and SREN, are clear. FIGURE 19-8: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 RX2/DT2 Pin bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 TX2/CK2 Pin Write to bit SREN SREN bit CREN bit ‘0’ ‘0’ RC2IF bit (Interrupt) Read RCREG2 Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. TABLE 19-7: Name INTCON REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Bit 7 Bit 6 GIE/GIEH PEIE/GIEL Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 — — RC2IP TX2IP — — — CCP3IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 66 SYNC — BRGH TRMT TX9D IPR3 RCSTA2 RCREG2 TXSTA2 SPBRG2 AUSART2 Receive Register CSRC TX9 TXEN 66 AUSART2 Baud Rate Generator Register Low Byte 66 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. DS39635C-page 252  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 19.4 AUSART Synchronous Slave Mode Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA2). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK2 pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode. 19.4.1 AUSART SYNCHRONOUS SLAVE TRANSMIT If two words are written to the TXREG2 and then the SLEEP instruction is executed, the following will occur: b) c) d) e) 1. Enable the synchronous slave serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. Clear bits, CREN and SREN. If interrupts are desired, set enable bit, TX2IE. If 9-bit transmission is desired, set bit, TX9. Enable the transmission by setting enable bit, TXEN. If 9-bit transmission is selected, the ninth bit should be loaded in bit, TX9D. Start transmission by loading data to the TXREG2 register. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. 2. 3. 4. 5. 6. The operation of the Synchronous Master and Slave modes are identical except in the case of the Sleep mode. a) To set up a Synchronous Slave Transmission: 7. 8. The first word will immediately transfer to the TSR register and transmit. The second word will remain in TXREG2 register. Flag bit, TX2IF, will not be set. When the first word has been shifted out of TSR, the TXREG2 register will transfer the second word to the TSR and flag bit, TX2IF, will now be set. If enable bit, TX2IE,is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector. TABLE 19-8: Name REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 IPR3 — — RC2IP TX2IP — — — CCP3IP 65 SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 66 INTCON RCSTA2 TXREG2 TXSTA2 SPBRG2 GIE/GIEH PEIE/GIEL AUSART2 Transmit Register CSRC TX9 TXEN 66 SYNC — BRGH TRMT TX9D AUSART2 Baud Rate Generator Register Low Byte 66 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission.  2010 Microchip Technology Inc. DS39635C-page 253 PIC18F6310/6410/8310/8410 19.4.2 AUSART SYNCHRONOUS SLAVE RECEPTION To set up a Synchronous Slave Reception: 1. The operation of the Synchronous Master and Slave modes is identical except in the case of Sleep, or any Idle mode and bit, SREN, which is a “don’t care” in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep, or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG2 register; if the RC2IE enable bit is set, the interrupt generated will wake the chip from low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector. Enable the synchronous master serial port by setting bits, SYNC and SPEN, and clearing bit, CSRC. If interrupts are desired, set enable bit, RC2IE. If 9-bit reception is desired, set bit, RX9. To enable reception, set enable bit, CREN. Flag bit, RC2IF, will be set when reception is complete. An interrupt will be generated if enable bit, RC2IE, was set. Read the RCSTA2 register to get the 9th bit (if enabled) and determine if any error occurred during reception. Read the 8-bit received data by reading the RCREG2 register. If any error occurred, clear the error by clearing bit, CREN. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON) are set. 2. 3. 4. 5. 6. 7. 8. 9. TABLE 19-9: Name INTCON REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Bit 7 Bit 6 Bit 5 GIE/GIEH PEIE/GIEL TMR0IE Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR3 — — RC2IF TX2IF — — — CCP3IF 65 PIE3 — — RC2IE TX2IE — — — CCP3IE 65 IPR3 — — RC2IP TX2IP — — — CCP3IP 65 CREN ADDEN FERR OERR RX9D 66 RCSTA2 RCREG2 TXSTA2 SPBRG2 SPEN RX9 SREN AUSART2 Receive Register CSRC TX9 TXEN 66 SYNC — BRGH TRMT TX9D AUSART2 Baud Rate Generator Register Low Byte 66 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. DS39635C-page 254  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 20.0 10-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The Analog-to-Digital (A/D) Converter module has 12 inputs for the PIC18FX310/X410 devices. This module allows conversion of an analog input signal to a corresponding 10-bit digital number. The module has five registers: • • • • • A/D Result High Register (ADRESH) A/D Result Low Register (ADRESL) A/D Control Register 0 (ADCON0) A/D Control Register 1 (ADCON1) A/D Control Register 2 (ADCON2) The ADCON0 register, shown in Register 20-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 20-2, configures the functions of the port pins. The ADCON2 register, shown in Register 20-3, configures the A/D clock source, programmed acquisition time and justification. REGISTER 20-1: ADCON0: A/D CONTROL REGISTER 0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-6 Unimplemented: Read as ‘0’ bit 5-2 CHS: Analog Channel Select bits 0000 = Channel 0 (AN0) 0001 = Channel 1 (AN1) 0010 = Channel 2 (AN2) 0011 = Channel 3 (AN3) 0100 = Channel 4 (AN4) 0101 = Channel 5 (AN5) 0110 = Channel 6 (AN6) 0111 = Channel 7 (AN7) 1000 = Channel 8 (AN8) 1001 = Channel 9 (AN9) 1010 = Channel 10 (AN10) 1011 = Channel 11 (AN11) 1100 = Unimplemented(1) 1101 = Unimplemented(1) 1110 = Unimplemented(1) 1111 = Unimplemented(1) bit 1 GO/DONE: A/D Conversion Status bit When ADON = 1: 1 = A/D conversion is in progress 0 = A/D is Idle bit 0 ADON: A/D On bit 1 = A/D Converter module is enabled 0 = A/D Converter module is disabled Note 1: x = Bit is unknown Performing a conversion on unimplemented channels will return a floating input measurement.  2010 Microchip Technology Inc. DS39635C-page 255 PIC18F6310/6410/8310/8410 REGISTER 20-2: ADCON1: A/D CONTROL REGISTER 1 U-0 U-0 R/W-0 R/W-0 R/W-q R/W-q R/W-q R/W-q — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared AN2 AN1 AN0 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 AN3 0000 AN4 PCFG AN5 PCFG: A/D Port Configuration Control bits: AN6 bit 3-0 AN7 VCFG0: Voltage Reference Configuration bit (VREF+ source): 1 = VREF+ (AN3) 0 = AVDD AN8 bit 4 AN9 VCFG1: Voltage Reference Configuration bit (VREF- source): 1 = VREF- (AN2) 0 = AVSS AN10 Unimplemented: Read as ‘0’ bit 5 AN11 bit 7-6 A A A A D D D D D D D D D D D D A A A A A D D D D D D D D D D D A A A A A A D D D D D D D D D D A A A A A A A D D D D D D D D D A A A A A A A A D D D D D D D D A A A A A A A A A D D D D D D D A A A A A A A A A A D D D D D D A A A A A A A A A A A D D D D D A A A A A A A A A A A A D D D D A A A A A A A A A A A A A D D D A A A A A A A A A A A A A A D D A A A A A A A A A A A A A A A D A = Analog input DS39635C-page 256 x = Bit is unknown D = Digital I/O  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 20-3: ADCON2: A/D CONTROL REGISTER 2 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 ADFM: A/D Result Format Select bit 1 = Right justified 0 = Left justified bit 6 Unimplemented: Read as ‘0’ bit 5-3 ACQT: A/D Acquisition Time Select bits 111 = 20 TAD 110 = 16 TAD 101 = 12 TAD 100 = 8 TAD 011 = 6 TAD 010 = 4 TAD 001 = 2 TAD 000 = 0 TAD(1) bit 2-0 ADCS: A/D Conversion Clock Select bits 111 = FRC (clock derived from A/D RC oscillator)(1) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock derived from A/D RC oscillator)(1) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 Note 1: x = Bit is unknown If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D clock starts. This allows the SLEEP instruction to be executed before starting a conversion.  2010 Microchip Technology Inc. DS39635C-page 257 PIC18F6310/6410/8310/8410 The analog reference voltage is software-selectable to either the device’s positive and negative supply voltage (AVDD and AVSS), or the voltage level on the RA3/AN3/VREF+ and RA2/AN2/VREF- pins. A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion in progress is aborted. Each port pin associated with the A/D Converter can be configured as an analog input or as a digital I/O. The ADRESH and ADRESL registers contain the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRESH/ADRESL registers, the GO/DONE bit (ADCON0 register) is cleared and the A/D Interrupt Flag bit, ADIF, is set. The block diagram of the A/D module is shown in Figure 20-1. The A/D Converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D conversion clock must be derived from the A/D’s internal RC oscillator. The output of the sample and hold is the input into the converter, which generates the result via successive approximation. FIGURE 20-1: A/D BLOCK DIAGRAM CHS 1011 1010 1001 1000 0111 0110 0101 10-Bit A/D Converter Reference Voltage VREF+ VREF- AN8 AN7 AN6 AN5 0011 AN3 0001 AVDD(1) AN9 AN4 0010 VCFG AN10 0100 VAIN (Input Voltage) AN11 0000 AN2 AN1 AN0 X0 X1 1X 0X AVSS(1) Note 1: I/O pins have diode protection to VDD and VSS. DS39635C-page 258  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 Wait for A/D conversion to complete, by either: • Polling for the GO/DONE bit to be cleared OR • Waiting for the A/D interrupt Read A/D Result registers (ADRESH:ADRESL); clear bit, ADIF, if required. For next conversion, go to Step 1 or Step 2, as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 3 TAD is required before the next acquisition starts. 6. 7. FIGURE 20-2: 3FFh 1. 3FEh FIGURE 20-3: 002h 001h 1023 LSB 1023.5 LSB 1022 LSB 1022.5 LSB 3 LSB Analog Input Voltage ANALOG INPUT MODEL VDD Rs VAIN 2 LSB 000h 2.5 LSB 3. 4. A/D TRANSFER FUNCTION 003h 0.5 LSB 2. Configure the A/D module: • Configure analog pins, voltage reference and digital I/O (ADCON1) • Select A/D input channel (ADCON0) • Select A/D acquisition time (ADCON2) • Select A/D conversion clock (ADCON2) • Turn on A/D module (ADCON0) Configure A/D interrupt (if desired): • Clear ADIF bit • Set ADIE bit • Set GIE bit Wait the required acquisition time (if required). Start conversion: • Set GO/DONE bit (ADCON0 register) Digital Code Output The following steps should be followed to perform an A/D conversion: 1 LSB After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 20.1 “A/D Acquisition Requirements”. After this acquisition time has elapsed, the A/D conversion can be started. An acquisition time can be programmed to occur between setting the GO/DONE bit and the actual start of the conversion. 5. 1.5 LSB The value in the ADRESH:ADRESL registers is not modified for a Power-on Reset. The ADRESH:ADRESL registers will contain unknown data after a Power-on Reset. ANx VT = 0.6V RIC 1k CPIN 5 pF Sampling Switch VT = 0.6V SS RSS ILEAKAGE ± 100 nA CHOLD = 25 pF VSS Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to various junctions = Interconnect Resistance RIC = Sampling Switch SS = Sample/Hold Capacitance (from DAC) CHOLD RSS = Sampling Switch Resistance  2010 Microchip Technology Inc. VDD 6V 5V 4V 3V 2V 1 2 3 4 Sampling Switch (k) DS39635C-page 259 PIC18F6310/6410/8310/8410 20.1 A/D Acquisition Requirements For the A/D Converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 20-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor, CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD). The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 2.5 k. After the analog input channel is selected (changed), the channel must be sampled for at least the minimum acquisition time before starting a conversion. EQUATION 20-1: CHOLD Rs Conversion Error VDD Temperature = =  = = 25 pF 2.5 k 1/2 LSb 5V  Rss = 2 k 85C (system max.) ACQUISITION TIME = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient = TAMP + TC + TCOFF EQUATION 20-2: VHOLD or TC Example 20-3 shows the calculation of the minimum required acquisition time, TACQ. This calculation is based on the following application system assumptions: When the conversion is started, the holding capacitor is disconnected from the input pin. Note: TACQ To calculate the minimum acquisition time, Equation 20-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. A/D MINIMUM CHARGING TIME = (VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS))) = -(CHOLD)(RIC + RSS + RS) ln(1/2048) EQUATION 20-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME TACQ = TAMP + TC + TCOFF TAMP = 0.2 s TCOFF = (Temp – 25C)(0.02 s/C) (85C – 25C)(0.02 s/C) 1.2 s Temperature coefficient is only required for temperatures > 25C. Below 25C, TCOFF = 0 ms. TC = -(CHOLD)(RIC + RSS + RS) ln(1/2047) -(25 pF) (1 k + 2 k + 2.5 k) ln(0.0004883) 1.05 s TACQ = 0.2 s + 1 s + 1.2 s 2.4 s DS39635C-page 260  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 20.2 Selecting and Configuring Automatic Acquisition Time The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. It also gives users the option to use an automatically determined acquisition time. Acquisition time may be set with the ACQT bits (ADCON2), which provides a range of 2 to 20 TAD. When the GO/DONE bit is set, the A/D module continues to sample the input for the selected acquisition time, then automatically begins a conversion. Since the acquisition time is programmed, there may be no need to wait for an acquisition time between selecting a channel and setting the GO/DONE bit. Manual acquisition is selected when ACQT = 000. When the GO/DONE bit is set, sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE bit. This option is also the default Reset state of the ACQT bits and is compatible with devices that do not offer programmable acquisition times. In either case, when the conversion is completed, the GO/DONE bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. If an acquisition time is programmed, there is nothing to indicate if the acquisition time has ended, or if the conversion has begun. TABLE 20-1: The A/D conversion time per bit is defined as TAD. The A/D conversion requires 11 TAD per 10-bit conversion. The source of the A/D conversion clock is software-selectable. There are seven possible options for TAD: • • • • • • • 2 TOSC 4 TOSC 8 TOSC 16 TOSC 32 TOSC 64 TOSC Internal RC Oscillator For correct A/D conversions, the A/D conversion clock (TAD) must be as short as possible, but greater than the minimum TAD (approximately 2 s, see Parameter 130 for more information). Table 20-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. Maximum Device Frequency Operation ADCS PIC18F6X10/8X10 PIC18LF6X10/8X10(4) 2 TOSC 000 1.25 MHz 666 kHz 4 TOSC 100 2.50 MHz 1.33 MHz 8 TOSC 001 5.00 MHz 2.66 MHz 16 TOSC 101 10.0 MHz 5.33 MHz 32 TOSC 010 20.0 MHz 10.65 MHz 64 TOSC 110 40.0 MHz 21.33 MHz x11 1.00 MHz(1) 1.00 MHz(2) (3) RC 4: Selecting the A/D Conversion Clock TAD vs. DEVICE OPERATING FREQUENCIES AD Clock Source (TAD) Note 1: 2: 3: 20.3 The RC source has a typical TAD time of 4 s. The RC source has a typical TAD time of 6 s. For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D accuracy may be out of specification. Low-power (PIC18LFXXXX) devices only.  2010 Microchip Technology Inc. DS39635C-page 261 PIC18F6310/6410/8310/8410 20.4 Operation in Power-Managed Modes The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power-managed mode. If the A/D is expected to operate while the device is in a power-managed mode, the ACQT and ADCS bits in ADCON2 should be updated in accordance with the clock source to be used in that mode. After entering the mode, an A/D acquisition or conversion may be started. Once started, the device should continue to be clocked by the same clock source until the conversion has been completed. If desired, the device may be placed into the corresponding Idle mode during the conversion. If the device clock frequency is less than 1 MHz, the A/D RC clock source should be selected. Operation in the Sleep mode requires the A/D FRC clock to be selected. If bits, ACQT, are set to ‘000’ and a conversion is started, the conversion will be delayed one instruction cycle to allow execution of the SLEEP instruction and entry to Sleep mode. The IDLEN bit (OSCCON) must have already been cleared prior to starting the conversion. DS39635C-page 262 20.5 Configuring Analog Port Pins The ADCON1, TRISA and TRISF registers all configure the A/D port pins. The port pins needed as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS bits and the TRIS bits. Note 1: When reading the PORT register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will convert an analog input. Analog levels on a digitally configured input will be accurately converted. 2: Analog levels on any pin defined as a digital input may cause the digital input buffer to consume current out of the device’s specification limits.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 20.6 After the A/D conversion is completed or aborted, a 2 TAD wait is required before the next acquisition can be started. After this wait, acquisition on the selected channel is automatically started. A/D Conversions Figure 20-4 shows the operation of the A/D Converter after the GO bit has been set and the ACQT bits are cleared. A conversion is started after the following instruction to allow entry into Sleep mode before the conversion begins. Figure 20-5 shows the operation of the A/D Converter after the GO/DONE bit has been set and the ACQT bits are set to ‘010’, and selecting a 4 TAD acquisition time before the conversion starts. 20.7 Discharge The discharge phase is used to initialize the value of the capacitor array. The array is discharged before every sample. This feature helps to optimize the unity-gain amplifier as the circuit always needs to charge the capacitor array, rather than charge/discharge based on previous measure values. Clearing the GO/DONE bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. This means the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers). FIGURE 20-4: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. Note: A/D CONVERSION TAD CYCLES (ACQT = 000, TACQ = 0) TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11 TAD1 b4 b1 b0 b6 b7 b2 b9 b8 b3 b5 Conversion starts Discharge Holding capacitor is disconnected from analog input (typically 100 ns) Set GO/DONE bit On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. FIGURE 20-5: A/D CONVERSION TAD CYCLES (ACQT = 010, TACQ = 4 TAD) TAD Cycles TACQT Cycles 1 2 3 Automatic Acquisition Time 4 1 2 3 4 5 6 7 8 9 10 11 b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 Conversion starts (Holding capacitor is disconnected) Set GO/DONE bit (Holding capacitor continues acquiring input)  2010 Microchip Technology Inc. TAD1 Discharge On the following cycle: ADRESH:ADRESL are loaded, GO/DONE bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. DS39635C-page 263 PIC18F6310/6410/8310/8410 20.8 Use of the CCP2 Trigger An A/D conversion can be started by the “Special Event Trigger” of the CCP2 module. This requires that the CCP2M bits (CCP2CON) be programmed as ‘1011’ and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the GO/DONE bit will be set, starting the A/D acquisition and conversion, and the Timer1 (or Timer3) counter will be reset to zero. Timer1 (or Timer3) is reset to automatically repeat the A/D acquisition period with minimal software overhead TABLE 20-2: Name INTCON (moving ADRESH/ADRESL to the desired location). The appropriate analog input channel must be selected and the minimum acquisition period is either timed by the user, or an appropriate TACQ time selected before the “Special Event Trigger” sets the GO/DONE bit (starts a conversion). If the A/D module is not enabled (ADON is cleared), the “Special Event Trigger” will be ignored by the A/D module, but will still reset the Timer1 (or Timer3) counter. REGISTERS ASSOCIATED WITH A/D OPERATION Bit 7 Bit 6 GIE/GIEH PEIE/GIEL Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR1 PSPIF ADIF RC1IF TX1IF SSPIF CCP1IF TMR2IF TMR1IF 65 PIE1 PSPIE ADIE RC1IE TX1IE SSPIE CCP1IE TMR2IE TMR1IE 65 IPR1 PSPIP ADIP RC1IP TX1IP SSPIP CCP1IP TMR2IP TMR1IP 65 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 65 PIE2 OSCFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 65 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 65 ADRESH A/D Result Register High Byte 64 ADRESL A/D Result Register Low Byte 64 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 64 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 64 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 64 PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 66 RF2 RF1 RF0 TRISA PORTF TRISA7(1) TRISA6(1) PORTA Data Direction Register RF7 RF6 RF5 RF4 RF3 66 66 TRISF PORTF Data Direction Register 66 LATF LATF Output Latch Register 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: These pins may be configured as port pins depending on the oscillator mode selected. DS39635C-page 264  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 21.0 COMPARATOR MODULE The analog comparator module contains two comparators that can be configured in a variety of ways. The inputs can be selected from the analog inputs multiplexed with pins RF3 through RF6, as well as the on-chip voltage reference (see Section 22.0 “Comparator Voltage Reference Module”). The digital outputs (normal or inverted) are available at the pin level and can also be read through the control register. REGISTER 21-1: The CMCON register (Register 21-1) selects the comparator input and output configuration. Block diagrams of the various comparator configurations are shown in Figure 21-1. CMCON: COMPARATOR CONTROL REGISTER R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 C2OUT: Comparator 2 Output bit When C2INV = 0: 1 = C2 VIN+ > C2 VIN0 = C2 VIN+ < C2 VINWhen C2INV = 1: 1 = C2 VIN+ < C2 VIN0 = C2 VIN+ > C2 VIN- bit 6 C1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN0 = C1 VIN+ < C1 VINWhen C1INV = 1: 1 = C1 VIN+ < C1 VIN0 = C1 VIN+ > C1 VIN-) bit 5 C2INV: Comparator 2 Output Inversion bit 1 = C2 output is inverted 0 = C2 output is not inverted bit 4 C1INV: Comparator 1 Output Inversion bit 1 = C1 output is inverted 0 = C1 output is not inverted bit 3 CIS: Comparator Input Switch bit When CM = 110: 1 = C1 VIN- connects to RF5/AN10 C2 VIN- connects to RF3/AN8 0 = C1 VIN- connects to RF6/AN11 C2 VIN- connects to RF4/AN9 bit 2-0 CM: Comparator Mode bits Figure 21-1 shows the Comparator modes and the CM bit settings.  2010 Microchip Technology Inc. x = Bit is unknown DS39635C-page 265 PIC18F6310/6410/8310/8410 21.1 Comparator Configuration There are eight modes of operation for the comparators, shown in Figure 21-1. Bits, CM, of the CMCON register are used to select these modes. The TRISF register controls the data direction of the comparator pins for each mode. If the Comparator FIGURE 21-1: A VIN- RF5/AN10/ A CVREF VIN+ A VIN- RF4/AN9 RF3/AN8 A VIN+ C1 Off (Read as ‘0’) C2 Off (Read as ‘0’) Two Independent Comparators CM = 010 A VIN- RF5/AN10/ A CVREF VIN+ RF4/AN9 A VIN- RF3/AN8 A VIN+ RF6/AN11 Note: Comparator interrupts should be disabled during a Comparator mode change; otherwise, a false interrupt may occur. COMPARATOR I/O OPERATING MODES Comparators Reset (POR Default Value) CM = 000 RF6/AN11 mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Section 27.0 “Electrical Characteristics”. Comparators Off CM = 111 RF6/AN11 D VIN- RF5/AN10/ CVREF D VIN+ RF4/AN9 D VIN- RF3/AN8 D VIN+ Off (Read as ‘0’) C2 Off (Read as ‘0’) Two Independent Comparators with Outputs CM = 011 A C1 C1 C1OUT RF6/AN11 RF5/AN10/ A CVREF VINVIN+ C1 C1OUT C2 C2OUT RF2/AN7/C1OUT* C2 C2OUT RF4/AN9 A VIN- RF3/AN8 A VIN+ RF1/AN6/C2OUT* Two Common Reference Comparators CM = 100 A VIN- RF5/AN10/ A CVREF VIN+ RF4/AN9 A VIN- RF3/AN8 D VIN+ RF6/AN11 C1 Two Common Reference Comparators with Outputs CM = 101 C1OUT RF6/AN11 RF5/AN10/ CVREF A VIN- A VIN+ C1 C1OUT C2 C2OUT RF2/AN7/C1OUT* C2 C2OUT RF4/AN9 A VIN- RF3/AN8 D VIN+ RF1/AN6/C2OUT* One Independent Comparator with Output CM = 001 RF6/AN11 A VIN- RF5/AN10/ A CVREF VIN+ C1 C1OUT RF2/AN7/C1OUT* RF4/AN9 RF3/AN8 D VIN- D VIN+ C2 Off (Read as ‘0’) Four Inputs Multiplexed to Two Comparators CM = 110 RF6/AN11 A RF5/AN10/ CVREF A RF4/AN9 A RF3/AN8 A CIS = 0 CIS = 1 VIN- CIS = 0 CIS = 1 VIN- VIN+ VIN+ C1 C1OUT C2 C2OUT CVREF From VREF Module A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON) is the Comparator Input Switch * Setting the TRISF bits will disable the comparator outputs by configuring the pins as inputs. DS39635C-page 266  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 21.2 21.3.2 Comparator Operation INTERNAL REFERENCE SIGNAL A single comparator is shown in Figure 21-2, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input, VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input, VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator, in Figure 21-2, represent the uncertainty due to input offsets and response time. The comparator module also allows the selection of an internally generated voltage reference from the comparator voltage reference module. This module is described in more detail in Section 22.0 “Comparator Voltage Reference Module”. 21.3 21.4 Comparator Reference Depending on the Comparator Operating mode, either an external or internal voltage reference may be used. The analog signal present at VIN- is compared to the signal at VIN+ and the digital output of the comparator is adjusted accordingly (Figure 21-2). FIGURE 21-2: VIN+ VIN- SINGLE COMPARATOR Output VINVIN+ Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (see Section 27.0 “Electrical Characteristics”). 21.5 + – The internal reference is only available in the mode where four inputs are multiplexed to two comparators (CM = 110). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators. Comparator Outputs The comparator outputs are read through the CMCON register. These bits are read-only. The comparator outputs may also be directly output to the RF2 and RF1 I/O pins. When enabled, multiplexors in the output path of the RF2 and RF1 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 21-3 shows the comparator output block diagram. The TRISF bits will still function as an output enable/ disable for the RF2 and RF1 pins while in this mode. Output The polarity of the comparator outputs can be changed using the C2INV and C1INV bits (CMCON). 21.3.1 EXTERNAL REFERENCE SIGNAL When external voltage references are used, the comparator module can be configured to have the comparators operate from the same, or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD and can be applied to either pin of the comparator(s).  2010 Microchip Technology Inc. Note 1: When reading the PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin defined as a digital input may cause the input buffer to consume more current than is specified. DS39635C-page 267 PIC18F6310/6410/8310/8410 + To RA4 or RA5 Pin - Port Pins COMPARATOR OUTPUT BLOCK DIAGRAM MULTIPLEX FIGURE 21-3: D Q Bus Data CxINV Read CMCON EN D Q EN CL From Other Comparator Reset 21.6 Comparator Interrupts The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON, to determine the actual change that occurred. The CMIF bit (PIR2) is the Comparator Interrupt Flag. The CMIF bit must be reset by clearing it. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. Both the CMIE bit (PIE2) and the PEIE bit (INTCON) must be set to enable the interrupt. In addition, the GIE bit (INTCON) must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. Note: If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR registers) interrupt flag may not get set. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) b) Set CMIF bit 21.7 Comparator Operation During Sleep When a comparator is active and the device is placed in Sleep mode, the comparator remains active and the interrupt is functional, if enabled. This interrupt will wake-up the device from Sleep mode, when enabled. While the comparator is powered up, higher Sleep currents than shown in the power-down current specification will occur. Each operational comparator will consume additional current, as shown in the comparator specifications. To minimize power consumption while in Sleep mode, turn off the comparators (CM = 111) before entering Sleep. If the device wakes up from Sleep, the contents of the CMCON register are not affected. 21.8 Effects of a Reset A device Reset forces the CMCON register to its Reset state, causing the comparator module to be in the Comparator Reset mode (CM = 000). This ensures that all potential inputs are analog inputs. Device current is minimized when analog inputs are present at Reset time. The comparators are powered down during the Reset interval. Any read or write of CMCON will end the mismatch condition. Clear flag bit, CMIF. A mismatch condition will continue to set flag bit, CMIF. Reading CMCON will end the mismatch condition and allow flag bit, CMIF, to be cleared. DS39635C-page 268  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 21.9 range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up condition may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 21-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this FIGURE 21-4: COMPARATOR ANALOG INPUT MODEL VDD VT = 0.6V RS < 10k Comparator Input AIN CPIN 5 pF VA RIC VT = 0.6V ILEAKAGE ±100 nA VSS Legend: CPIN VT ILEAKAGE RIC RS VA TABLE 21-1: Name CMCON CVRCON INTCON = = = = = = Input Capacitance Threshold Voltage Leakage Current at the pin due to various junctions Interconnect Resistance Source Impedance Analog Voltage REGISTERS ASSOCIATED WITH COMPARATOR MODULE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 65 CVREN CVROE GIE/GIEH PEIE/GIEL CVRR CVRSS CVR3 CVR2 CVR1 CVR0 65 TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 65 PIE2 OCSFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 65 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 65 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 66 PORTF LATF LATF Output Latch Register 66 TRISF PORTF Data Direction Register 66 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.  2010 Microchip Technology Inc. DS39635C-page 269 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 270  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 22.0 COMPARATOR VOLTAGE REFERENCE MODULE The comparator voltage reference is a 16-tap resistor ladder network that provides a selectable reference voltage. Although its primary purpose is to provide a reference for the analog comparators, it may also be used independently of them. A block diagram is of the module shown in Figure 22-1. The resistor ladder is segmented to provide two ranges of CVREF values and has a power-down function to conserve power when the reference is not being used. The module’s supply reference can be provided from either device VDD/VSS, or an external voltage reference. 22.1 Configuring the Comparator Voltage Reference The voltage reference module is controlled through the CVRCON register (Register 22-1). The Comparator Voltage Reference provides two ranges of output REGISTER 22-1: voltage, each with 16 distinct levels. The range to be used is selected by the CVRR bit (CVRCON). The primary difference between the ranges is the size of the steps selected by the CVREF selection bits (CVR), with one range offering finer resolution. The equations used to calculate the output of the Comparator Voltage Reference are as follows: If CVRR = 1: CVREF = ((CVR)/24) x CVRSRC If CVRR = 0: CVREF = (CVDD x 1/4) + (((CVR)/32) x CVRSRC) The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF- that are multiplexed with RA2 and RA3. The voltage source is selected by the CVRSS bit (CVRCON). The settling time of the comparator voltage reference must be considered when changing the CVREF output (see Table 27-3 in Section 27.0 “Electrical Characteristics”). CVRCON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CVREN CVROE(1) CVRR CVRSS CVR3 CVR2 CVR1 CVR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7 CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down bit 6 CVROE: Comparator VREF Output Enable bit(1) 1 = CVREF voltage level is also output on the RF5/AN10/CVREF pin 0 = CVREF voltage is disconnected from the RF5/AN10/CVREF pin bit 5 CVRR: Comparator VREF Range Selection bit 1 = 0 CVRSRC to 0.667 CVRSRC, with CVRSRC/24 step size 0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size bit 4 CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source, CVRSRC = (VREF+) – (VREF-) 0 = Comparator reference source, CVRSRC = VDD – VSS bit 3-0 CVR: Comparator VREF Value Selection bits (0  (CVR)  15) When CVRR = 1: CVREF = ((CVR)/24)  (CVRSRC) When CVRR = 0: CVREF = (CVRSRC/4) + ((CVR)/32)  (CVRSRC) Note 1: x = Bit is unknown CVROE overrides the TRISF bit setting if enabled for output; RF5 must also be configured as an input by setting TRISF to ‘1’.  2010 Microchip Technology Inc. DS39635C-page 271 PIC18F6310/6410/8310/8410 FIGURE 22-1: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM VREF+ VDD CVRSS = 1 8R CVRSS = 0 CVR R CVREN R R 16-to-1 MUX R 16 Steps R CVREF R R CVRR VREF- 8R CVRSS = 1 CVRSS = 0 22.2 Voltage Reference Accuracy/Error The full range of voltage reference cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 22-1) keep CVREF from approaching the reference source rails. The voltage reference is derived from the reference source; therefore, the CVREF output changes with fluctuations in that source. The tested absolute accuracy of the voltage reference can be found in Section 27.0 “Electrical Characteristics”. 22.3 Operation During Sleep When the device wakes up from Sleep, through an interrupt or a Watchdog Timer time-out, the contents of the CVRCON register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 22.4 Effects of a Reset A device Reset disables the voltage reference by clearing bit, CVREN (CVRCON). This Reset also disconnects the reference from the RA2 pin by clearing bit, CVROE (CVRCON), and selects the high-voltage range by clearing bit, CVRR (CVRCON). The CVR value select bits are also cleared. 22.5 Connection Considerations The voltage reference module operates independently of the comparator module. The output of the reference generator may be connected to the RF5 pin if the TRISF bit and the CVROE bit are both set. Enabling the voltage reference output onto the RF5 pin, with an input signal present, will increase current consumption. Connecting RF5 as a digital output with CVRSS enabled will also increase current consumption. The RF5 pin can be used as a simple D/A output with limited drive capability. Due to the limited current drive capability, a buffer must be used on the voltage reference output for external connections to VREF. Figure 22-2 shows an example buffering technique. DS39635C-page 272  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 22-2: COMPARATOR VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE PIC18FXXXX CVREF Module R(1) Voltage Reference Output Impedance Note 1: TABLE 22-1: Name CVRCON CMCON TRISF + – RF5 CVREF Output R is dependent upon the voltage reference configuration bits, CVRCON and CVRCON. REGISTERS ASSOCIATED WITH THE COMPARATOR VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 65 C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 65 PORTF Data Direction Register 66 Legend: Shaded cells are not used with the comparator voltage reference.  2010 Microchip Technology Inc. DS39635C-page 273 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 274  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 23.0 The High/Low-Voltage Detect Control register (Register 23-1) completely controls the operation of the HLVD module. This allows the circuitry to be “turned off” by the user under software control, which minimizes the current consumption for the device. HIGH/LOW-VOLTAGE DETECT (HLVD) PIC18F6310/6410/8310/8410 devices have a High/Low-Voltage Detect module (HLVD). This is a programmable circuit that allows the user to specify both a device voltage trip point and the direction of change from that point. If the device experiences an excursion past the trip point in that direction, an interrupt flag is set. If the interrupt is enabled, the program execution will branch to the interrupt vector address and the software can then respond to the interrupt. REGISTER 23-1: R/W-0 HLVDCON: HIGH/LOW-VOLTAGE DETECT CONTROL REGISTER U-0 VDIRMAG The block diagram for the HLVD module is shown in Figure 23-1. — R-0 IRVST R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 HLVDEN HLVDL3(1) HLVDL2(1) HLVDL1(1) HLVDL0(1) bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 VDIRMAG: Voltage Direction Magnitude Select bit 1 = Event occurs when voltage equals or exceeds trip point (HLVDL) 0 = Event occurs when voltage equals or falls below trip point (HLVDL) bit 6 Unimplemented: Read as ‘0’ bit 5 IRVST: Internal Reference Voltage Stable Flag bit 1 = Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage range 0 = Indicates that the voltage detect logic will not generate the interrupt flag at the specified voltage range and the HLVD interrupt should not be enabled bit 4 HLVDEN: High/Low-Voltage Detect Power Enable bit 1 = HLVD is enabled 0 = HLVD is disabled bit 3-0 HLVDL: Voltage Detection Limit bits(1) 1110 = Maximum setting • • • 0001 = Minimum setting Note 1: HLVDL modes that result in a trip point, below the valid operating voltage of the device, are not tested.  2010 Microchip Technology Inc. DS39635C-page 275 PIC18F6310/6410/8310/8410 The module is enabled by setting the HLVDEN bit. Each time that the HLVD module is enabled, the circuitry requires some time to stabilize. The IRVST bit is a read-only bit and is used to indicate when the circuit is stable. The module can only generate an interrupt after the circuit is stable and IRVST is set. level at which the device detects a high or low-voltage event, depending on the configuration of the module. When the supply voltage is equal to the trip point, the voltage tapped off of the resistor array is equal to the internal reference voltage generated by the voltage reference module. The comparator then generates an interrupt signal by setting the HLVDIF bit. The VDIRMAG bit determines the overall operation of the module. When VDIRMAG is cleared, the module monitors for drops in VDD below a predetermined set point. When the bit is set, the module monitors for rises in VDD above the set point. 23.1 The trip point voltage is software programmable to any one of 16 values. The trip point is selected by programming the HLVDL bits (HLVDCON). The HLVD module has an additional feature that allows the user to supply the trip voltage to the module from an external source. This mode is enabled when bits, HLVDL, are set to ‘1111’. In this state, the comparator input is multiplexed from the external input pin, HLVDIN. This gives users flexibility because it allows them to configure the High/Low-Voltage Detect interrupt to occur at any voltage in the valid operating range. Operation When the HLVD module is enabled, a comparator uses an internally generated reference voltage as the set point. The set point is compared with the trip point, where each node in the resistor divider represents a trip point voltage. The “trip point” voltage is the voltage FIGURE 23-1: HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT) Externally Generated Trip Point VDD VDD HLVDCON Register HLVDEN HLVDIN 16-to-1 MUX HLVDIN HLVDL VDIRMAG Set HLVDIF HLVDEN BOREN DS39635C-page 276 Internal Voltage Reference  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 23.2 Depending on the application, the HLVD module does not need to be operating constantly. To decrease the current requirements, the HLVD circuitry may only need to be enabled for short periods where the voltage is checked. After doing the check, the HLVD module may be disabled. HLVD Setup The following steps are needed to set up the HLVD module: 1. 2. 3. 4. 5. 6. Disable the module by clearing the HLVDEN bit (HLVDCON). Write the value to the HLVDL bits that select the desired HLVD trip point. Set the VDIRMAG bit to detect high voltage (VDIRMAG = 1) or low voltage (VDIRMAG = 0). Enable the HLVD module by setting the HLVDEN bit. Clear the HLVD interrupt flag (PIR2), which may have been set from a previous interrupt. Enable the HLVD interrupt, if interrupts are desired, by setting the HLVDIE and GIE bits (PIE and INTCON). An interrupt will not be generated until the IRVST bit is set. 23.3 23.4 The internal reference voltage of the HLVD module, specified in electrical specification Parameter D420B, may be used by other internal circuitry, such as the Programmable Brown-out Reset. If the HLVD or other circuits using the voltage reference are disabled to lower the device’s current consumption, the reference voltage circuit will require time to become stable before a low or high-voltage condition can be reliably detected. This start-up time, TIRVST, is an interval that is independent of device clock speed. It is specified in electrical specification Parameter 36 (Table 27-12). The HLVD interrupt flag is not enabled until TIRVST has expired and a stable reference voltage is reached. For this reason, brief excursions beyond the set point may not be detected during this interval. Refer to Figure 23-2 or Figure 23-3. Current Consumption When the module is enabled, the HLVD comparator and voltage divider are enabled and will consume static current. The total current consumption, when enabled, is specified in electrical specification Parameter D022B. FIGURE 23-2: HLVD Start-up Time HIGH/LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0) CASE 1: HLVDIF may not be set VDD VLVD HLVDIF Enable HLVD TIRVST IRVST Internal Reference is stable HLVDIF cleared in software CASE 2: VDD VLVD HLVDIF Enable HLVD TIRVST IRVST Internal Reference is stable HLVDIF cleared in software HLVDIF cleared in software, HLVDIF remains set since HLVD condition still exists  2010 Microchip Technology Inc. DS39635C-page 277 PIC18F6310/6410/8310/8410 FIGURE 23-3: HIGH/LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 1) CASE 1: HLVDIF may not be set VLVD VDD HLVDIF Enable HLVD TIRVST IRVST HLVDIF cleared in software Internal Reference is stable CASE 2: VLVD VDD HLVDIF Enable HLVD TIRVST IRVST Internal Reference is stable HLVDIF cleared in software HLVDIF cleared in software, HLVDIF remains set since HLVD condition still exists Applications In many applications, the ability to detect a drop below, or rise above, a particular threshold is desirable. For example, the HLVD module could be periodically enabled to detect USB attach or detach. This assumes the device is powered by a lower voltage source than the Universal Serial Bus (USB) when detached. An attach would indicate a High-Voltage Detect from, for example, 3.3V to 5V (the voltage on USB) and vice versa for a detach. This feature could save a design a few extra components and an attach signal (input pin). For general battery applications, Figure 23-4 shows a possible voltage curve. Over time, the device voltage decreases. When the device voltage reaches voltage, VA, the HLVD logic generates an interrupt at time, TA. The interrupt could cause the execution of an ISR, which would allow the application to perform “housekeeping tasks” and perform a controlled shutdown before the device voltage exits the valid operating range at TB. The HLVD thus, would give the application a time window, represented by the difference between TA and TB, to safely exit. DS39635C-page 278 FIGURE 23-4: TYPICAL LOW-VOLTAGE DETECT APPLICATION VA VB Voltage 23.5 Time TA TB Legend: VA = HLVD trip point VB = Minimum valid device operating voltage  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 23.6 Operation During Sleep 23.7 When enabled, the HLVD circuitry continues to operate during Sleep. If the device voltage crosses the trip point, the HLVDIF bit will be set and the device will wake-up from Sleep. Device execution will continue from the interrupt vector address if interrupts have been globally enabled. TABLE 23-1: Effects of a Reset A device Reset forces all registers to their Reset state. This forces the HLVD module to be turned off. REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 64 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 63 PIR2 OSCFIF CMIF — — BCLIF HLVDIF TMR3IF CCP2IF 65 PIE2 OCSFIE CMIE — — BCLIE HLVDIE TMR3IE CCP2IE 65 IPR2 OSCFIP CMIP — — BCLIP HLVDIP TMR3IP CCP2IP 65 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the HLVD module.  2010 Microchip Technology Inc. DS39635C-page 279 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 280  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 24.0 A complete discussion of device Resets and interrupts is available in previous sections of this data sheet. SPECIAL FEATURES OF THE CPU In addition to their Power-up and Oscillator Start-up Timers provided for Resets, PIC18F6310/6410/8310/8410 devices have a Watchdog Timer, which is either permanently enabled via the Configuration bits, or software controlled (if configured as disabled). PIC18F6310/6410/8310/8410 devices include several features intended to maximize reliability and minimize cost through elimination of external components. These are: • Oscillator Selection • Resets: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Fail-Safe Clock Monitor • Two-Speed Start-up • Code Protection • ID Locations • In-Circuit Serial Programming (ICSP) The inclusion of an internal RC oscillator also provides the additional benefits of a Fail-Safe Clock Monitor (FSCM) and Two-Speed Start-up. FSCM provides for background monitoring of the peripheral clock and automatic switchover in the event of its failure. Two-Speed Start-up enables code to be executed almost immediately on start-up, while the primary clock source completes its start-up delays. All of these features are enabled and configured by setting the appropriate Configuration register bits. 24.1 The Configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’), to select various device configurations. These bits are mapped, starting at program memory location, 300000h. The oscillator can be configured for the application depending on frequency, power, accuracy and cost. All of the options are discussed in detail in Section 3.0 “Oscillator Configurations”. TABLE 24-1: Configuration Bits The user will note that address, 300000h, is beyond the user program memory space. In fact, it belongs to the configuration memory space (300000h-3FFFFFh), which can only be accessed using table reads. CONFIGURATION BITS AND DEVICE IDs File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 300001h CONFIG1H IESO FCMEN — — FOSC3 FOSC2 300002h CONFIG2L — — — BORV1 BORV0 BOREN1 Bit 1 Bit 0 FOSC1 FOSC0 BOREN0 PWRTEN Default/ Unprogrammed Value 00-- 0111 ---1 1111 300003h CONFIG2H — — — 300004h CONFIG3L WAIT BW — — — — PM1 PM0 11-- --11 300005h CONFIG3H MCLRE — — — — LPT1OSC — CCP2MX 1--- -0-1 300006h CONFIG4L DEBUG XINST — — — — — STVREN 10-- ---1 300008h CONFIG5L — — — — — — — CP ---- ---1 30000Ch CONFIG7L(1) — — — — — — — EBTR ---- ---1 3FFFFEh DEVID1 DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 11qx xxxx(2) 3FFFFFh DEVID2 DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 qq1q(2) Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on individual device. Shaded cells are unimplemented, read as ‘0’. Unimplemented in PIC18F6310/6410 devices; maintain this bit set. See Register 24-9 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user. Note 1: 2:  2010 Microchip Technology Inc. WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN ---1 1111 DS39635C-page 281 PIC18F6310/6410/8310/8410 REGISTER 24-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h) R/P-0 R/P-0 U-0 U-0 R/P-0 R/P-1 R/P-1 R/P-1 IESO FCMEN — — FOSC3 FOSC2 FOSC1 FOSC0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IESO: Internal/External Oscillator Switchover bit 1 = Oscillator Switchover mode is enabled 0 = Oscillator Switchover mode is disabled bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 FOSC: Oscillator Selection bits 11xx = External RC oscillator, CLKO function on RA6 101x = External RC oscillator, CLKO function on RA6 1001 = Internal oscillator block, CLKO function on RA6, port function on RA7 1000 = Internal oscillator block, port function on RA6 and RA7 0111 = External RC oscillator, port function on RA6 0110 = HS oscillator, PLL is enabled (Clock Frequency = 4 x FOSC1) 0101 = EC oscillator, CLKO function on RA6 0100 = EC oscillator, CLKO function on RA6 0011 = External RC oscillator, CLKO function on RA6 0010 = HS oscillator 0001 = XT oscillator 0000 = LP oscillator DS39635C-page 282  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 24-2: U-0 CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h) U-0 — — U-0 — R/P-1 BORV1 R/P-1 BORV0 R/P-1 BOREN1 R/P-1 (1) BOREN0 R/P-1 (1) PWRTEN(1) bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-3 BORV: Brown-out Reset Voltage bits 11 = Minimum setting • • • 00 = Maximum setting bit 2-1 BOREN Brown-out Reset Enable bits(1) 11 = Brown-out Reset is enabled in hardware only (SBOREN is disabled) 10 = Brown-out Reset is enabled in hardware only and disabled in Sleep mode (SBOREN is disabled) 10 = Brown-out Reset is enabled and controlled by software (SBOREN is enabled) 10 = Brown-out Reset is disabled in hardware and software bit 0 PWRTEN: Power-up Timer Enable bit(1) 1 = PWRT is disabled 0 = PWRT is enabled Note 1: The Power-up Timer (PWRT) is decoupled from Brown-out Reset, allowing these features to be independently controlled.  2010 Microchip Technology Inc. DS39635C-page 283 PIC18F6310/6410/8310/8410 REGISTER 24-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h) U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 Unimplemented: Read as ‘0’ bit 4-1 WDTPS: Watchdog Timer Postscale Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 bit 0 WDTEN: Watchdog Timer Enable bit 1 = WDT is enabled 0 = WDT is disabled (control is placed on the SWDTEN bit) DS39635C-page 284 x = Bit is unknown  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 24-4: CONFIG3L: CONFIGURATION REGISTER 3 LOW (BYTE ADDRESS 300004h) R/P-1 R/P-1 U-0 U-0 U-0 U-0 R/P-1 R/P-1 WAIT BW — — — — PM1 PM0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 WAIT: External Bus Data Wait Enable bit 1 = Wait selections are unavailable, device will not wait 0 = Wait is programmed by the WAIT1 and WAIT0 bits of the MEMCOM register (MEMCOM) bit 6 BW: External Bus Data Width Select bit 1 = 16-bit external bus data width 0 = 8-bit external bus data width bit 5-2 Unimplemented: Read as ‘0’ bit 1-0 PM: Processor Data Memory Mode Select bits 11 = Microcontroller mode 10 = Microprocessor mode(1) 01 = Microcontroller with Boot Block mode(1) 00 = Extended Microcontroller mode(1) Note 1: This mode is only available on PIC18F8310/8410 devices.  2010 Microchip Technology Inc. DS39635C-page 285 PIC18F6310/6410/8310/8410 REGISTER 24-5: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h) R/P-1 U-0 U-0 U-0 U-0 R/P-0 U-0 R/P-1 MCLRE — — — — LPT1OSC — CCP2MX bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 MCLRE: MCLR Pin Enable bit 1 = MCLR pin is enabled; RG5 input pin is disabled 0 = RG5 input pin is enabled; MCLR is disabled bit 6-3 Unimplemented: Read as ‘0’ bit 2 LPT1OSC: Low-Power Timer 1 Oscillator Enable bit 1 = Timer1 is configured for low-power operation 0 = Timer1 is configured for higher power operation bit 1 Unimplemented: Read as ‘0 bit 0 CCP2MX: CCP2 MUX bit In Microcontroller Mode only (all devices): 1 = CCP2 input/output is multiplexed with RC1 0 = CCP2 input/output is multiplexed with RE7 In Microprocessor, Extended Microcontroller and Microcontroller with Boot Block Modes (PIC18F8310/8410 devices only): 1 = CCP2 input/output is multiplexed with RC1 0 = CCP2 input/output is multiplexed with RB3 DS39635C-page 286  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 24-6: CONFIG4L: CONFIGURATION REGISTER 4 LOW (BYTE ADDRESS 300006h) R/P-1 R/P-0 U-0 U-0 U-0 U-0 U-0 R/P-1 DEBUG XINST — — — — — STVREN bit 7 bit 0 Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed bit u = Unchanged from programmed state bit 7 DEBUG: Background Debugger Enable bit 1 = Background debugger is disabled, RB6 and RB7 are configured as general purpose I/O pins 0 = Background debugger is enabled, RB6 and RB7 are dedicated to In-Circuit Debug bit 6 XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode are enabled 0 = Instruction set extension and Indexed Addressing mode are disabled (Legacy mode) bit 5-1 Unimplemented: Read as ‘0 bit 0 STVREN: Stack Full/Underflow Reset Enable bit 1 = Stack full/underflow will cause a Reset 0 = Stack full/underflow will not cause a Reset REGISTER 24-7: CONFIG5L: CONFIGURATION REGISTER 5 LOW (BYTE ADDRESS 300008h) U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/C-1 — — — — — — — CP bit 7 bit 0 Legend: R = Readable bit C = Clearable bit -n = Value when device is unprogrammed bit U = Unimplemented bit, read as ‘0’ u = Unchanged from programmed state bit 7-1 Unimplemented: Read as ‘0 bit 0 CP: Code Protection bit 1 = Program memory block is not code-protected 0 = Program memory block is code-protected  2010 Microchip Technology Inc. DS39635C-page 287 PIC18F6310/6410/8310/8410 REGISTER 24-8: CONFIG7L: CONFIGURATION REGISTER 7 LOW (BYTE ADDRESS 30000Ch)(1) U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/C-1 — — — — — — — EBTR(2,3) bit 7 bit 0 Legend: R = Readable bit C = Clearable bit -n = Value when device is unprogrammed bit U = Unimplemented bit, read as ‘0’ u = Unchanged from programmed state bit 7-1 Unimplemented: Read as ‘0 bit 0 EBTR: Table Read Protection bit(2,3) 1= Internal program memory block is not protected from table reads executed from external memory block 0= Internal program memory block is protected from table reads executed from external memory block Note 1: 2: 3: Unimplemented on PIC18F6310/6410 devices; maintain the bit set. Valid for the entire internal program memory block in Extended Microcontroller mode and for only the boot block (0000h to 07FFh) in Microcontroller with Boot Block mode. This bit has no effect in Microcontroller and Microprocessor modes. It is recommended to enable the CP bit to protect the block from external read operations. DS39635C-page 288  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 24-9: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F6310/6410/8310/8410 DEVICES R R R R R R R R DEV2(1) DEV1(1) DEV0(1) REV4 REV3 REV2 REV1 REV0 bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-5 DEV: Device ID bits(1) 110 = PIC18F8310, PIC18F8410 111 = PIC18F6310, PIC18F6410 bit 4-0 REV: Revision ID bits These bits are used to indicate the device revision. Note 1: x = Bit is unknown These values for DEV may be shared with other devices. The specific device is always identified by using the entire DEV bit sequence. REGISTER 24-10: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F6310/6410/8310/8410 DEVICES R R R R R R R R DEV10(1) DEV9(1) DEV8(1) DEV7(1) DEV6(1) DEV5(1) DEV4(1) DEV3(1) bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-0 Note 1: x = Bit is unknown DEV: Device ID bits These bits are used with the DEV bits in the Device ID Register 1 to identify the part number. 0000 0110 = PIC18F6410/8410 devices 0000 1011 = PIC18F6310/8310 devices These values for DEV may be shared with other devices. The specific device is always identified by using the entire DEV bit sequence.  2010 Microchip Technology Inc. DS39635C-page 289 PIC18F6310/6410/8310/8410 24.2 Watchdog Timer (WDT) For PIC18F6310/6410/8310/8410 devices, the WDT is driven by the INTRC source. When the WDT is enabled, the clock source is also enabled. The nominal WDT period is 4 ms and has the same stability as the INTRC oscillator. The 4 ms period of the WDT is multiplied by a 16-bit postscaler. Any output of the WDT postscaler is selected by a multiplexer, controlled by bits in Configuration Register 2H. Available periods range from 4 ms to 131.072 seconds (2.18 minutes). The WDT and postscaler are cleared when any of the following events occur: a SLEEP or CLRWDT instruction is executed, the IRCF bits (OSCCON) are changed or a clock failure has occurred. FIGURE 24-1: SWDTEN WDTEN Note 1: The CLRWDT and SLEEP instructions clear the WDT and postscaler counts when executed. 2: Changing the setting of the IRCF bits (OSCCON) clears the WDT and postscaler counts. 3: When a CLRWDT instruction is executed the postscaler count will be cleared. 24.2.1 CONTROL REGISTER Register 24-11 shows the WDTCON register. This is a readable and writable register, which contains a control bit that allows software to override the WDT enable Configuration bit, but only if the Configuration bit has disabled the WDT. WDT BLOCK DIAGRAM Enable WDT INTRC Control WDT Counter INTRC Source Wake-up from Power Managed Modes 128 Change on IRCF bits Programmable Postscaler 1:1 to 1:32,768 CLRWDT All Device Resets WDTPS Reset WDT Reset WDT 4 Sleep DS39635C-page 290  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 REGISTER 24-11: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — SWDTEN(1) bit 7 bit 0 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value at erase bit ‘1’ = Bit is set ‘0’ = Bit is cleared bit 7-1 Unimplemented: Read as ‘0’ bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit(1) 1 = Watchdog Timer is on 0 = Watchdog Timer is off Note 1: This bit has no effect if the Configuration bit, WDTEN, is enabled. TABLE 24-2: Name RCON WDTCON x = Bit is unknown SUMMARY OF WATCHDOG TIMER REGISTERS Bit 0 Reset Values on Page Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 IPEN SBOREN — RI TO PD POR BOR 64 — — — — — — — SWDTEN 64 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer.  2010 Microchip Technology Inc. DS39635C-page 291 PIC18F6310/6410/8310/8410 24.3 In all other power-managed modes, Two-Speed Start-up is not used. The device will be clocked by the currently selected clock source until the primary clock source becomes available. The setting of the IESO bit is ignored. Two-Speed Start-up The Two-Speed Start-up feature helps to minimize the latency period from oscillator start-up to code execution by allowing the microcontroller to use the INTRC oscillator as a clock source until the primary clock source is available. It is enabled by setting the IESO Configuration bit. 24.3.1 Two-Speed Start-up should be enabled only if the primary oscillator mode is LP, XT, HS or HSPLL (Crystal-Based modes). Other sources do not require a OST start-up delay; for these, Two-Speed Start-up should be disabled. While using the INTRC oscillator in Two-Speed Start-up, the device still obeys the normal command sequences for entering power-managed modes, including serial SLEEP instructions (refer to Section 4.1.2 “Entering Power-Managed Modes”). In practice, this means that user code can change the SCS bits setting or issue SLEEP instructions before the OST times out. This would allow an application to briefly wake-up, perform routine “housekeeping” tasks and return to Sleep before the device starts to operate from the primary oscillator. When enabled, Resets and wake-ups from Sleep mode cause the device to configure itself to run from the internal oscillator block as the clock source, following the time-out of the Power-up Timer after a Power-on Reset is enabled. This allows almost immediate code execution while the primary oscillator starts and the OST is running. Once the OST times out, the device automatically switches to PRI_RUN mode. User code can also check if the primary clock source is currently providing the device clocking by checking the status of the OSTS bit (OSCCON). If the bit is set, the primary oscillator is providing the clock. Otherwise, the internal oscillator block is providing the clock during wake-up from Reset or Sleep mode. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits, IRCF, immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF bits prior to entering Sleep mode. FIGURE 24-2: SPECIAL CONSIDERATIONS FOR USING TWO-SPEED START-UP TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL) Q1 Q2 Q3 Q4 Q2 Q3 Q4 Q1 Q2 Q3 Q1 INTOSC Multiplexer OSC1 TOST(1) TPLL(1) 1 PLL Clock Output 2 n-1 n Clock Transition CPU Clock Peripheral Clock Program Counter PC Wake from Interrupt Event PC + 2 PC + 4 PC + 6 OSTS bit Set Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. DS39635C-page 292  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 24.4 Fail-Safe Clock Monitor The Fail-Safe Clock Monitor (FSCM) allows the microcontroller to continue operation in the event of an external oscillator failure by automatically switching the device clock to the internal oscillator block. The FSCM function is enabled by setting the FCMEN Configuration bit. When FSCM is enabled, the INTRC oscillator runs at all times to monitor clocks to peripherals and provide a backup clock in the event of a clock failure. Clock monitoring (shown in Figure 24-3) is accomplished by creating a sample clock signal, which is the INTRC output divided by 64. This allows ample time between FSCM sample clocks for a peripheral clock edge to occur. The peripheral device clock and the sample clock are presented as inputs to the Clock Monitor latch (CM). The CM is set on the falling edge of the device clock source, but cleared on the rising edge of the sample clock. FIGURE 24-3: FSCM BLOCK DIAGRAM Clock Monitor (CM) Latch (edge-triggered) Peripheral Clock INTRC Source (32 s) ÷ 64 S Q C Q The FSCM will detect failures of the primary or secondary clock sources only. If the internal oscillator block fails, no failure would be detected, nor would any action be possible. 24.4.1 Clock Failure Detected Clock failure is tested for on the falling edge of the sample clock. If a sample clock falling edge occurs while CM is still set, a clock failure has been detected (Figure 24-4). This causes the following: • the FSCM generates an oscillator fail interrupt by setting bit, OSCFIF (PIR2); • the device clock source is switched to the internal oscillator block (OSCCON is not updated to show the current clock source – this is the Fail-Safe condition); and • the WDT is reset. During switchover, the postscaler frequency from the internal oscillator block may not be sufficiently stable for timing-sensitive applications. In these cases, it may be desirable to select another clock configuration and enter an alternate power-managed mode. This can be done to attempt a partial recovery or execute a controlled shutdown. See Section 4.1.2 “Entering Power-Managed Modes” and Section 24.3.1 “Special Considerations for Using Two-Speed Start-up” for more details. FSCM AND THE WATCHDOG TIMER Both the FSCM and the WDT are clocked by the INTRC oscillator. Since the WDT operates with a separate divider and counter, disabling the WDT has no effect on the operation of the INTRC oscillator when the FSCM is enabled. As already noted, the clock source is switched to the INTOSC clock when a clock failure is detected. Depending on the frequency selected by the IRCF bits, this may mean a substantial change in the speed of code execution. If the WDT is enabled with a small prescale value, a decrease in clock speed allows a WDT time-out to occur and a subsequent device Reset. For this reason, Fail-Safe Clock events also reset the WDT and postscaler, allowing it to start timing from when execution speed was changed, and decreasing the likelihood of an erroneous time-out. 24.4.2 488 Hz (2.048 ms)  2010 Microchip Technology Inc. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits, IRCF, immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF bits prior to entering Sleep mode. EXITING FAIL-SAFE OPERATION The Fail-Safe condition is terminated by either a device Reset or by entering a power-managed mode. On Reset, the controller starts the primary clock source specified in Configuration Register 1H (with any required start-up delays that are required for the oscillator mode, such as the OST or PLL timer). The INTOSC multiplexer provides the device clock until the primary clock source becomes ready (similar to a Two-Speed Start-up). The clock source is then switched to the primary clock (indicated by the OSTS bit in the OSCCON register becoming set). The Fail-Safe Clock Monitor then resumes monitoring the peripheral clock. The primary clock source may never become ready during start-up. In this case, operation is clocked by the INTOSC multiplexer. The OSCCON register will remain in its Reset state until a power-managed mode is entered. DS39635C-page 293 PIC18F6310/6410/8310/8410 FIGURE 24-4: FSCM TIMING DIAGRAM Sample Clock Oscillator Failure Device Clock Output CM Output (Q) Failure Detected OSCFIF CM Test Note: 24.4.3 CM Test CM Test The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity. FSCM INTERRUPTS IN POWER-MANAGED MODES By entering a power-managed mode, the clock multiplexer selects the clock source selected by the OSCCON register. Fail-Safe Clock monitoring of the power-managed clock source resumes in the power-managed mode. If an oscillator failure occurs during power-managed operation, the subsequent events depend on whether or not the oscillator failure interrupt is enabled. If enabled (OSCFIF = 1), code execution will be clocked by the INTOSC multiplexer. An automatic transition back to the failed clock source will not occur. If the interrupt is disabled, the device will not exit the power-managed mode on oscillator failure. Instead, the device will continue to operate as before, but clocked by the INTOSC multiplexer. While in Idle mode, subsequent interrupts will cause the CPU to begin executing instructions while being clocked by the INTOSC multiplexer. 24.4.4 POR OR WAKE FROM SLEEP The FSCM is designed to detect oscillator failure at any point after the device has exited Power-on Reset (POR) or low-power Sleep mode. When the primary device clock is in EC, RC or INTRC modes, monitoring can begin immediately following these events. For oscillator modes involving a crystal or resonator (HS, HSPLL, LP or XT), the situation is somewhat different. Since the oscillator may require a start-up time considerably longer than the FCSM sample clock time, a false clock failure may be detected. To prevent this, the internal oscillator block is automatically configured as the device clock and functions until the primary clock is stable (the OST and PLL timers have timed out). This is identical to Two-Speed Start-up mode. Once the primary clock is stable, the INTRC returns to its role as the FSCM source. Note: The same logic that prevents false oscillator failure interrupts on POR, or wake from Sleep, will also prevent the detection of the oscillator’s failure to start at all following these events. This can be avoided by monitoring the OSTS bit and using a timing routine to determine if the oscillator is taking too long to start. Even so, no oscillator failure interrupt will be flagged. As noted in Section 24.3.1 “Special Considerations for Using Two-Speed Start-up”, it is also possible to select another clock configuration and enter an alternate power-managed mode while waiting for the primary clock to become stable. When the new powered-managed mode is selected, the primary clock is disabled. DS39635C-page 294  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 24.5 Program Verification and Code Protection The overall structure of the code protection on the PIC18F6310/6410/8310/8410 Flash devices differs from previous PIC18 devices. For all devices in the PIC18FX310/X410 family, the user program memory is made of a single block. Figure 24-5 shows the program memory organization for individual devices. Code protection for this block is controlled by a single bit, CP (CONFIG5L). The CP bit inhibits external reads and writes; it has no direct effect in normal execution mode. 24.5.1 CODE PROTECTION FROM EXTERNAL TABLE READS The program memory may be read to any location using the table read instructions. The Device ID and the Configuration registers may be read with the table read instructions. For devices with the external memory interface, it is possible to execute a table read from an external program memory space and read the contents of the on-chip memory. An additional code protection bit, FIGURE 24-5: EBTR (CONFIG7L), is used to protect the on-chip program memory space from this possibility. Setting EBTR prevents table read commands from executing on any address in the on-chip program memory space. EBTR is implemented only on devices with the external memory interface. Its operation also depends on the particular mode of operation selected. In Extended Microcontroller mode, programming EBTR enables protection from external table reads for the entire program memory. In Microcontroller with Boot Block mode, only the first 2 Kbytes of on-chip memory (000h to 7FFh) are protected. This is because, only this range of internal program memory is accessible by the microcontroller in this operating mode. When the device is in Micrcontroller or Microprocessor modes, EBTR has no effect on code protection. 24.5.2 CONFIGURATION REGISTER PROTECTION The Configuration registers can only be written via ICSP using an external programmer. No separate protection bit is associated with them. CODE-PROTECTED PROGRAM MEMORY FOR PIC18F6310/6410/8310/8410 MEMORY SIZE/DEVICE 8 Kbytes (PIC18F6310/8310) Address Range 16 Kbytes (PIC18F6410/8410) Address Range Program memory Block 000000h 001FFFh Program memory Block 000000h 003FFFh 002000h Unimplemented Read ‘0’s CP, EBTR 004000h Unimplemented Read ‘0’s 1FFFFFh TABLE 24-3: Block Code Protection Controlled By: (Unimplemented Memory Space) 1FFFFFh SUMMARY OF CODE PROTECTION REGISTERS File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 300008h CONFIG5L — — — — — — — CP 30000Ch CONFIG7L* — — — — — — — EBTR Legend: Shaded cells are unimplemented. * Unimplemented in PIC18F6310/8310 devices; maintain this bit set.  2010 Microchip Technology Inc. DS39635C-page 295 PIC18F6310/6410/8310/8410 24.6 ID Locations 24.8 In-Circuit Debugger Eight memory locations (200000h-200007h) are designated as ID locations, where the user can store checksum or other code identification numbers. These locations are readable during normal execution through the TBLRD instruction. During program/verify, these locations are readable and writable. The ID locations can be read when the device is code-protected. When the DEBUG Configuration bit is programmed to a ‘0’, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB® IDE. When the microcontroller has this feature enabled, some resources are not available for general use. Table 24-4 shows which resources are required by the background debugger. 24.7 TABLE 24-4: In-Circuit Serial Programming PIC18F6310/6410/8310/8410 microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. DS39635C-page 296 DEBUGGER RESOURCES I/O Pins: RB6, RB7 Stack: 2 levels Program Memory: Compare f with WREG, Skip < Decrement f Decrement f, Skip if 0 Decrement f, Skip if Not 0 Increment f Increment f, Skip if 0 Increment f, Skip if Not 0 Inclusive OR WREG with f Move f Move fs (source) to 1st word fd (destination) 2nd word Move WREG to f Multiply WREG with f Negate f Rotate Left f through Carry Rotate Left f (No Carry) Rotate Right f through Carry Rotate Right f (No Carry) Set f Subtract f from WREG with Borrow Subtract WREG from f Subtract WREG from f with Borrow Swap Nibbles in f Test f, Skip if 0 Exclusive OR WREG with f 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 2 C, DC, Z, OV, N C, DC, Z, OV, N Z, N Z Z, N None None None C, DC, Z, OV, N None None C, DC, Z, OV, N None None Z, N Z, N None 1, 2 1, 2 1,2 2 1, 2 4 4 1, 2 1, 2, 3, 4 1, 2, 3, 4 1, 2 1, 2, 3, 4 4 1, 2 1, 2 1 1 1 1 1 1 1 1 1 1 0010 0010 0001 0110 0001 0110 0110 0110 0000 0010 0100 0010 0011 0100 0001 0101 1100 1111 0110 0000 0110 0011 0100 0011 0100 0110 0101 01da 00da 01da 101a 11da 001a 010a 000a 01da 11da 11da 10da 11da 10da 00da 00da ffff ffff 111a 001a 110a 01da 01da 00da 00da 100a 01da ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff 1 1 0101 0101 11da 10da ffff ffff ffff C, DC, Z, OV, N 1, 2 ffff C, DC, Z, OV, N 1 0011 1 (2 or 3) 0110 1 0001 10da 011a 10da ffff ffff ffff ffff None ffff None ffff Z, N None 1, 2 None C, DC, Z, OV, N 1, 2 C, Z, N Z, N C, Z, N Z, N 1, 2 None C, DC, Z, OV, N 4 1, 2 When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP, unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. Table write instructions are unavailable in 64-pin devices in normal operating modes. See Section 7.4 “Writing to Program Memory Space (PIC18F8310/8410 only)” and Section 7.6 “Writing and Erasing On-Chip Program Memory (ICSP Mode)” for more information. DS39635C-page 300  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) 16-Bit Instruction Word Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes BIT-ORIENTED OPERATIONS BCF BSF BTFSC BTFSS BTG f, b, a f, b, a f, b, a f, b, a f, d, a Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set Bit Toggle f 1 1 1 (2 or 3) 1 (2 or 3) 1 1001 1000 1011 1010 0111 bbba bbba bbba bbba bbba ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff None None None None None 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 0010 0110 0011 0111 0101 0001 0100 0nnn 0000 110s kkkk 0000 0000 1111 kkkk 0000 xxxx 0000 0000 1nnn 0000 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0000 0000 kkkk kkkk 0000 xxxx 0000 0000 nnnn 1111 0001 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0100 0111 kkkk kkkk 0000 xxxx 0110 0101 nnnn 1111 000s None None None None None None None None None None 1 1 1 1 2 1 2 1110 1110 1110 1110 1110 1110 1110 1101 1110 1110 1111 0000 0000 1110 1111 0000 1111 0000 0000 1101 0000 0000 2 2 1 0000 0000 0000 1100 0000 0000 kkkk 0001 0000 1, 2 1, 2 3, 4 3, 4 1, 2 CONTROL OPERATIONS BC BN BNC BNN BNOV BNZ BOV BRA BZ CALL n n n n n n n n n n, s CLRWDT DAW GOTO — — n NOP NOP POP PUSH RCALL RESET RETFIE — — — — n s Branch if Carry Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Overflow Branch Unconditionally Branch if Zero Call Subroutine 1st word 2nd word Clear Watchdog Timer Decimal Adjust WREG Go to Address 1st word 2nd word No Operation No Operation Pop Top of Return Stack (TOS) Push Top of Return Stack (TOS) Relative Call Software Device Reset Return from Interrupt Enable RETLW RETURN SLEEP k s — Return with Literal in WREG Return from Subroutine Go into Standby mode Note 1: 2: 3: 4: 5: 1 1 2 TO, PD C None None None None None None All GIE/GIEH, PEIE/GIEL kkkk None 001s None 0011 TO, PD 4 When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP, unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. Table write instructions are unavailable in 64-pin devices in normal operating modes. See Section 7.4 “Writing to Program Memory Space (PIC18F8310/8410 only)” and Section 7.6 “Writing and Erasing On-Chip Program Memory (ICSP Mode)” for more information.  2010 Microchip Technology Inc. DS39635C-page 301 PIC18F6310/6410/8310/8410 TABLE 25-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) 16-Bit Instruction Word Mnemonic, Operands Description Cycles MSb LSb Status Affected Notes LITERAL OPERATIONS ADDLW ANDLW IORLW LFSR k k k f, k MOVLB MOVLW MULLW RETLW SUBLW XORLW k k k k k k Add Literal and WREG AND Literal with WREG Inclusive OR Literal with WREG Move Literal (12-bit) 2nd word to FSR(f) 1st word Move Literal to BSR Move Literal to WREG Multiply Literal with WREG Return with Literal in WREG Subtract WREG from Literal Exclusive OR Literal with WREG 1 1 1 2 1 1 1 2 1 1 0000 0000 0000 1110 1111 0000 0000 0000 0000 0000 0000 1111 1011 1001 1110 0000 0001 1110 1101 1100 1000 1010 kkkk kkkk kkkk 00ff kkkk 0000 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z, OV, N Z, N Z, N None 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 1001 1010 1011 1100 1101 1110 1111 None None None None None None None None None None None None C, DC, Z, OV, N Z, N DATA MEMORY  PROGRAM MEMORY OPERATIONS Table Read 2 Table Read with Post-Increment Table Read with Post-Decrement Table Read with Pre-Increment Table Write 2 Table Write with Post-Increment Table Write with Post-Decrement Table Write with Pre-Increment TBLRD* TBLRD*+ TBLRD*TBLRD+* TBLWT* TBLWT*+ TBLWT*TBLWT+* Note 1: 2: 3: 4: 5: Note: 5 5 5 5 When a PORT register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned. If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP, unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. Table write instructions are unavailable in 64-pin devices in normal operating modes. See Section 7.4 “Writing to Program Memory Space (PIC18F8310/8410 only)” and Section 7.6 “Writing and Erasing On-Chip Program Memory (ICSP Mode)” for more information. All PIC18 instructions may take an optional label argument, preceding the instruction mnemonic, for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s) DS39635C-page 302  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 25.1.1 STANDARD INSTRUCTION SET ADDLW ADD literal to W ADDWF ADD W to f Syntax: ADDLW Syntax: ADDWF Operands: 0  f  255 d  [0,1] a  [0,1] Operation: (W) + (f)  dest Status Affected: N, OV, C, DC, Z k Operands: 0  k  255 Operation: (W) + k  W Status Affected: N, OV, C, DC, Z Encoding: 0000 1111 kkkk kkkk Description: The contents of W are added to the 8-bit literal ‘k’ and the result is placed in W. Words: 1 Cycles: 1 Encoding: 0010 Q1 Q2 Q3 Q4 Read literal ‘k’ Process Data Write to W Example: ADDLW 15h Before Instruction W = 10h After Instruction W = 25h 01da ffff ffff Description: Add W to register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Decode f {,d {,a}} Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWF REG, 0, 0 Before Instruction W = REG = After Instruction W REG  2010 Microchip Technology Inc. = = 17h 0C2h 0D9h 0C2h DS39635C-page 303 PIC18F6310/6410/8310/8410 ADDWFC ADD W and Carry bit to f ANDLW AND literal with W Syntax: ADDWFC Syntax: ANDLW Operands: 0  f  255 d [0,1] a [0,1] f {,d {,a}} Operation: (W) + (f) + (C)  dest Status Affected: N,OV, C, DC, Z Encoding: 0010 Description: 00da ffff Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q1 Q2 Q3 Q4 Read register ‘f’ Process Data Write to destination DS39635C-page 304 (W) .AND. k  W Status Affected: N, Z 0000 ADDWFC 1011 kkkk kkkk Description: The contents of W are ANDed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ANDLW 05Fh Before Instruction W Decode Before Instruction Carry bit = REG = W = After Instruction Carry bit = REG = W = 0  k  255 Operation: W = After Instruction Q Cycle Activity: Example: Operands: Encoding: ffff k = A3h 03h REG, 0, 1 1 02h 4Dh 0 02h 50h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 ANDWF AND W with f BC Branch if Carry Syntax: ANDWF Syntax: BC Operands: 0  f  255 d [0,1] a [0,1] Operands: -128  n  127 Operation: if Carry bit is ‘1’, (PC) + 2 + 2n  PC Status Affected: None f {,d {,a}} Operation: (W) .AND. (f)  dest Status Affected: N, Z Encoding: 0001 Description: Encoding: 01da ffff ffff The contents of W are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: Cycles: 1110 Description: 0010 nnnn nnnn If the Carry bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: 1 Q1 Q2 Q3 Q4 1 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: n ANDWF If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation REG, 0, 0 Before Instruction W = REG = After Instruction W REG = = 17h C2h 02h C2h  2010 Microchip Technology Inc. Example: HERE Before Instruction PC After Instruction If Carry PC If Carry PC BC 5 = address (HERE) = = = = 1; address (HERE + 12) 0; address (HERE + 2) DS39635C-page 305 PIC18F6310/6410/8310/8410 BCF Bit Clear f BN Branch if Negative Syntax: BCF Syntax: BN Operands: 0  f  255 0b7 a [0,1] Operands: -128  n  127 Operation: if Negative bit is ‘1’, (PC) + 2 + 2n  PC Status Affected: None f, b {,a} Operation: 0  f Status Affected: None Encoding: 1001 Description: Encoding: bbba ffff ffff Bit ‘b’ in register ‘f’ is cleared. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 1110 Description: nnnn nnnn 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ BCF Before Instruction FLAG_REG = C7h After Instruction FLAG_REG = 47h FLAG_REG, 7, 0 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE Before Instruction PC After Instruction If Negative PC If Negative PC DS39635C-page 306 0110 If the Negative bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: Q Cycle Activity: Example: n BN Jump = address (HERE) = = = = 1; address (Jump) 0; address (HERE + 2)  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 BNC Branch if Not Carry BNN Branch if Not Negative Syntax: BNC Syntax: BNN n n Operands: -128  n  127 Operands: -128  n  127 Operation: if Carry bit is ‘0’, (PC) + 2 + 2n  PC Operation: if Negative bit is ‘0’, (PC) + 2 + 2n  PC Status Affected: None Status Affected: None Encoding: 1110 0011 nnnn nnnn Encoding: 1110 0111 nnnn nnnn Description: If the Carry bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Description: If the Negative bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Words: 1 Cycles: 1(2) Cycles: 1(2) Q Cycle Activity: If Jump: Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation No operation No operation No operation No operation Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Decode Read literal ‘n’ Process Data No operation If No Jump: Example: If No Jump: HERE Before Instruction PC After Instruction If Carry PC If Carry PC BNC Jump = address (HERE) = = = = 0; address (Jump) 1; address (HERE + 2)  2010 Microchip Technology Inc. Example: HERE Before Instruction PC After Instruction If Negative PC If Negative PC BNN Jump = address (HERE) = = = = 0; address (Jump) 1; address (HERE + 2) DS39635C-page 307 PIC18F6310/6410/8310/8410 BNOV Branch if Not Overflow BNZ Branch if Not Zero Syntax: BNOV Syntax: BNZ n n Operands: -128  n  127 Operands: -128  n  127 Operation: if Overflow bit is ‘0’, (PC) + 2 + 2n  PC Operation: if Zero bit is ‘0’, (PC) + 2 + 2n  PC Status Affected: None Status Affected: None Encoding: 1110 0101 nnnn nnnn Encoding: 1110 0001 nnnn nnnn Description: If the Overflow bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Description: If the Zero bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Words: 1 Cycles: 1(2) Cycles: 1(2) Q Cycle Activity: If Jump: Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation No operation No operation No operation No operation Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Decode Read literal ‘n’ Process Data No operation If No Jump: If No Jump: Example: HERE Before Instruction PC After Instruction If Overflow PC If Overflow PC DS39635C-page 308 BNOV Jump = address (HERE) = = = = 0; address (Jump) 1; address (HERE + 2) Example: HERE Before Instruction PC After Instruction If Zero PC If Zero PC BNZ Jump = address (HERE) = = = = 0; address (Jump) 1; address (HERE + 2)  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 BRA Unconditional Branch BSF Bit Set f Syntax: BRA Syntax: BSF Operands: -1024  n  1023 Operands: Operation: (PC) + 2 + 2n  PC Status Affected: None 0  f  255 0b7 a [0,1] Operation: 1  f Status Affected: None Encoding: n 1101 Description: 0nnn nnnn nnnn Add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Encoding: 1000 Q1 Q2 Q3 Q4 Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation Example: HERE Before Instruction PC After Instruction PC BRA address (HERE) = address (Jump)  2010 Microchip Technology Inc. ffff ffff Bit ‘b’ in register ‘f’ is set. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Jump = bbba Description: Q Cycle Activity: Decode f, b {,a} Example: BSF Before Instruction FLAG_REG After Instruction FLAG_REG FLAG_REG, 7, 1 = 0Ah = 8Ah DS39635C-page 309 PIC18F6310/6410/8310/8410 BTFSC Bit Test File, Skip if Clear BTFSS Bit Test File, Skip if Set Syntax: BTFSC f, b {,a} Syntax: BTFSS f, b {,a} Operands: 0  f  255 0b7 a [0,1] Operands: 0  f  255 0b (W) (unsigned comparison) Operation: (f) –W), skip if (f) < (W) (unsigned comparison) Status Affected: None Status Affected: None Encoding: 0110 Description: f {,a} 010a ffff ffff Compares the contents of data memory location ‘f’ to the contents of the W by performing an unsigned subtraction. If the contents of ‘f’ are greater than the contents of WREG, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Decode Q2 Read register ‘f’ Q3 Process Data Q4 No operation Q1 Q2 Q3 No No No operation operation operation If skip and followed by 2-word instruction: Q1 Q2 Q3 No No No operation operation operation No No No operation operation operation Q4 No operation If skip: Example: HERE NGREATER GREATER Q4 No operation No operation CPFSGT REG, 0 : : Before Instruction PC W After Instruction = = Address (HERE) ? If REG PC If REG PC  =  = W; Address (GREATER) W; Address (NGREATER)  2010 Microchip Technology Inc. Encoding: f {,a} 0110 000a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If the contents of ‘f’ are less than the contents of W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE NLESS LESS CPFSLT REG, 1 : : Before Instruction PC W After Instruction = = Address (HERE) ? If REG PC If REG PC < =  = W; Address (LESS) W; Address (NLESS) DS39635C-page 315 PIC18F6310/6410/8310/8410 DAW Decimal Adjust W Register DECF Decrement f Syntax: DAW Syntax: DECF f {,d {,a}} Operands: None Operands: Operation: If [W >9] or [DC = 1] then, (W) + 6  W; else, (W)  W; 0  f  255 d  [0,1] a  [0,1] Operation: (f) – 1  dest Status Affected: C, DC, N, OV, Z Encoding: If [W > 9] or [C = 1] then, (W) + 6  W, C =1; else, (W)  W Status Affected: 0000 0000 0000 DAW adjusts the eight-bit value in W, resulting from the earlier addition of two variables (each in packed BCD format) and produces a correct packed BCD result. Words: 1 Cycles: 1 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register W Process Data Write W Example 1: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: DAW Before Instruction = = = ffff Words: Q Cycle Activity: W = C = DC = After Instruction ffff Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. 0111 Description: 01da Description: C Encoding: W C DC Example 2: 0000 A5h 0 0 DECF Before Instruction CNT = Z = After Instruction CNT = Z = CNT, 1, 0 01h 0 00h 1 05h 1 0 Before Instruction W = C = DC = After Instruction W C DC = = = DS39635C-page 316 CEh 0 0 34h 1 0  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 DECFSZ Decrement f, skip if 0 DCFSNZ Decrement f, skip if not 0 Syntax: DECFSZ f {,d {,a}} Syntax: DCFSNZ Operands: 0  f  255 d  [0,1] a  [0,1] Operands: 0  f  255 d  [0,1] a  [0,1] Operation: (f) – 1  dest, skip if result = 0 Operation: (f) – 1  dest, skip if result  0 Status Affected: None Status Affected: None Encoding: 0010 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Encoding: 0100 Description: Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Q1 Q2 Q3 Q4 No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation DECFSZ GOTO CNT, 1, 1 LOOP Example: HERE CONTINUE Before Instruction PC = After Instruction CNT = If CNT = PC = If CNT  PC = Address (HERE) CNT – 1 0; Address (CONTINUE) 0; Address (HERE + 2)  2010 Microchip Technology Inc. ffff ffff 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: No operation 11da The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is 1, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: Q Cycle Activity: Q1 f {,d {,a}} If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE ZERO NZERO Before Instruction TEMP After Instruction TEMP If TEMP PC If TEMP PC DCFSNZ : : TEMP, 1, 0 = ? = = =  = TEMP – 1, 0; Address (ZERO) 0; Address (NZERO) DS39635C-page 317 PIC18F6310/6410/8310/8410 GOTO Unconditional Branch INCF Increment f Syntax: GOTO k Syntax: INCF Operands: 0  k  1048575 Operands: Operation: k  PC Status Affected: None 0  f  255 d  [0,1] a  [0,1] Operation: (f) + 1  dest Status Affected: C, DC, N, OV, Z Encoding: 1st word (k) 2nd word(k) 1110 1111 Description: 1111 k19kkk k7kkk kkkk kkkk0 kkkk8 GOTO allows an unconditional branch Encoding: 0010 2 Cycles: 2 Q1 Q2 Q3 Q4 Read literal ‘k’, No operation Read literal ’k’, Write to PC No operation No operation Example: No operation No operation 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: INCF Before Instruction CNT = Z = C = DC = After Instruction CNT = Z = C = DC = DS39635C-page 318 ffff Words: GOTO THERE After Instruction PC = Address (THERE) ffff The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Q Cycle Activity: Decode 10da Description: anywhere within entire 2-Mbyte memory range. The 20-bit value ‘k’ is loaded into PC. GOTO is always a two-cycle instruction. Words: f {,d {,a}} CNT, 1, 0 FFh 0 ? ? 00h 1 1 1  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 INCFSZ Increment f, skip if 0 INFSNZ Syntax: INCFSZ Syntax: INFSNZ 0  f  255 d  [0,1] a  [0,1] f {,d {,a}} Increment f, skip if not 0 f {,d {,a}} Operands: 0  f  255 d  [0,1] a  [0,1] Operands: Operation: (f) + 1  dest, skip if result = 0 Operation: (f) + 1  dest, skip if result  0 Status Affected: None Status Affected: None Encoding: 0011 11da ffff ffff Encoding: 0100 Description: 10da ffff ffff The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q Cycle Activity: Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Decode Read register ‘f’ Process Data Write to destination Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation If skip: If skip: If skip and followed by 2-word instruction: If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE NZERO ZERO Before Instruction PC = After Instruction CNT = If CNT = PC = If CNT  PC = INCFSZ : : Address (HERE) CNT + 1 0; Address (ZERO) 0; Address (NZERO)  2010 Microchip Technology Inc. CNT, 1, 0 Example: HERE ZERO NZERO Before Instruction PC = After Instruction REG =  If REG PC = If REG = PC = INFSNZ REG, 1, 0 Address (HERE) REG + 1 0; Address (NZERO) 0; Address (ZERO) DS39635C-page 319 PIC18F6310/6410/8310/8410 IORLW Inclusive OR literal with W IORWF Inclusive OR W with f Syntax: IORLW k Syntax: IORWF Operands: 0  k  255 Operands: Operation: (W) .OR. k  W Status Affected: N, Z 0  f  255 d  [0,1] a  [0,1] Operation: (W) .OR. (f)  dest Status Affected: N, Z Encoding: 0000 1001 kkkk kkkk Description: The contents of W are ORed with the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Encoding: 0001 Q1 Q2 Q3 Q4 Read literal ‘k’ Process Data Write to W Example: IORLW Before Instruction W = After Instruction W = 9Ah ffff ffff Inclusive OR W with register ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 35h Q Cycle Activity: BFh Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: IORWF Before Instruction RESULT = W = After Instruction RESULT = W = DS39635C-page 320 00da Description: Q Cycle Activity: Decode f {,d {,a}} RESULT, 0, 1 13h 91h 13h 93h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 LFSR Load FSR MOVF Move f Syntax: LFSR f, k Syntax: MOVF Operands: 0f2 0  k  4095 Operands: Operation: k  FSRf 0  f  255 d  [0,1] a  [0,1] Status Affected: None Operation: f  dest Status Affected: N, Z Encoding: 1110 1111 1110 0000 00ff k7kkk k11kkk kkkk Description: The 12-bit literal ‘k’ is loaded into the file select register pointed to by ‘f’. Words: 2 Cycles: 2 Encoding: 0101 Q1 Q2 Q3 Q4 Read literal ‘k’ MSB Process Data Write literal ‘k’ MSB to FSRfH Decode Read literal ‘k’ LSB Process Data Write literal ‘k’ to FSRfL Example: After Instruction FSR2H FSR2L LFSR 2, 3ABh = = 03h ABh ffff ffff The contents of register ‘f’ are moved to a destination dependent upon the status of ‘d’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write W Example: MOVF Before Instruction REG W After Instruction REG W  2010 Microchip Technology Inc. 00da Description: Q Cycle Activity: Decode f {,d {,a}} REG, 0, 0 = = 22h FFh = = 22h 22h DS39635C-page 321 PIC18F6310/6410/8310/8410 MOVFF Move f to f MOVLB Move literal to low nibble in BSR Syntax: MOVFF fs,fd Syntax: MOVLW k Operands: 0  fs  4095 0  fd  4095 Operands: 0  k  255 Operation: k  BSR None Operation: (fs)  fd Status Affected: Status Affected: None Encoding: Encoding: 1st word (source) 2nd word (destin.) 1100 1111 Description: ffff ffff ffff ffff ffffs ffffd The contents of source register ‘fs’ are moved to destination register ‘fd’. Location of source ‘fs’ can be anywhere in the 4096-byte data space (000h to FFFh) and location of destination ‘fd’ can also be anywhere from 000h to FFFh. Either source or destination can be W (a useful special situation). MOVFF is particularly useful for transferring a data memory location to a peripheral register (such as the transmit buffer or an I/O port). The MOVFF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register Words: 2 Cycles: 2 (3) 0000 0001 kkkk kkkk Description: The eight-bit literal ‘k’ is loaded into the Bank Select Register (BSR). The value of BSR always remains ‘0’, regardless of the value of k7:k4. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write literal ‘k’ to BSR MOVLB 5 Example: Before Instruction BSR Register = After Instruction BSR Register = 02h 05h Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ (src) Process Data No operation Decode No operation No operation Write register ‘f’ (dest) No dummy read Example: MOVFF Before Instruction REG1 REG2 After Instruction REG1 REG2 DS39635C-page 322 REG1, REG2 = = 33h 11h = = 33h 33h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 MOVLW Move literal to W MOVWF Move W to f Syntax: MOVLW k Syntax: MOVWF Operands: 0  k  255 Operands: Operation: kW 0  f  255 a  [0,1] Status Affected: None Encoding: 0000 Description: 1110 kkkk kkkk The eight-bit literal ‘k’ is loaded into W. Words: 1 Cycles: 1 Operation: (W)  f Status Affected: None Encoding: 0110 Q1 Q2 Q3 Q4 Read literal ‘k’ Process Data Write to W Example: MOVLW After Instruction W = 5Ah 111a ffff ffff Description: Move data from W to register ‘f’. Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Decode f {,a} 5Ah Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: MOVWF REG, 0 Before Instruction W = REG = After Instruction W REG  2010 Microchip Technology Inc. = = 4Fh FFh 4Fh 4Fh DS39635C-page 323 PIC18F6310/6410/8310/8410 MULLW Multiply literal with W MULWF Multiply W with f Syntax: MULLW Syntax: MULWF Operands: 0  f  255 a  [0,1] Operation: (W) x (f)  PRODH:PRODL Status Affected: None k Operands: 0  k  255 Operation: (W) x k  PRODH:PRODL Status Affected: None Encoding: 0000 Description: 1101 kkkk kkkk An unsigned multiplication is carried out between the contents of W and the 8-bit literal ‘k’. The 16-bit result is placed in PRODH:PRODL register pair. PRODH contains the high byte. W is unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A Zero result is possible but not detected. Words: 1 Cycles: 1 Encoding: 0000 Q1 Q2 Q3 Q4 Read literal ‘k’ Process Data Write registers PRODH: PRODL Example: MULLW 0C4h Before Instruction W PRODH PRODL After Instruction W PRODH PRODL = = = E2h ? ? = = = E2h ADh 08h 001a ffff ffff Description: An unsigned multiplication is carried out between the contents of W and the register file location ‘f’. The 16-bit result is stored in the PRODH:PRODL register pair. PRODH contains the high byte. Both W and ‘f’ are unchanged. None of the Status flags are affected. Note that neither Overflow nor Carry is possible in this operation. A Zero result is possible but not detected. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Decode f {,a} Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write registers PRODH: PRODL Example: MULWF REG, 1 Before Instruction W REG PRODH PRODL After Instruction W REG PRODH PRODL DS39635C-page 324 = = = = C4h B5h ? ? = = = = C4h B5h 8Ah 94h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 NEGF Negate f NOP No Operation Syntax: NEGF Syntax: NOP Operands: 0  f  255 a  [0,1] f {,a} Operands: None Operation: No operation None Operation: (f)+1f Status Affected: Status Affected: N, OV, C, DC, Z Encoding: Encoding: 0110 Description: 110a ffff Location ‘f’ is negated using two’s complement. The result is placed in the data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 0000 1111 ffff 0000 xxxx Description: No operation. Words: 1 Cycles: 1 0000 xxxx 0000 xxxx Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation Example: None. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: NEGF Before Instruction REG = After Instruction REG = REG, 1 0011 1010 [3Ah] 1100 0110 [C6h]  2010 Microchip Technology Inc. DS39635C-page 325 PIC18F6310/6410/8310/8410 POP Pop Top of Return Stack PUSH Push Top of Return Stack Syntax: POP Syntax: PUSH Operands: None Operands: None Operation: (TOS)  bit bucket Operation: (PC + 2)  TOS Status Affected: None Status Affected: None Encoding: 0000 0000 0000 0110 Description: The TOS value is pulled off the return stack and is discarded. The TOS value then becomes the previous value that was pushed onto the return stack. This instruction is provided to enable the user to properly manage the return stack to incorporate a software stack. Words: 1 Cycles: 1 Encoding: 0000 0101 The PC + 2 is pushed onto the top of the return stack. The previous TOS value is pushed down on the stack. This instruction allows implementing a software stack by modifying TOS and then pushing it onto the return stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation POP TOS value No operation POP GOTO NEW Q1 Q2 Q3 Q4 Decode PUSH PC + 2 onto return stack No operation No operation Example: Before Instruction TOS Stack (1 level down) = = 0031A2h 014332h After Instruction TOS PC = = 014332h NEW DS39635C-page 326 0000 Description: Q Cycle Activity: Example: 0000 PUSH Before Instruction TOS PC = = 345Ah 0124h After Instruction PC TOS Stack (1 level down) = = = 0126h 0126h 345Ah  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 RCALL Relative Call RESET Reset Syntax: RCALL Syntax: RESET n Operands: -1024  n  1023 Operands: None Operation: (PC) + 2  TOS, (PC) + 2 + 2n  PC Operation: Reset all registers and flags that are affected by a MCLR Reset. Status Affected: None Status Affected: All Encoding: 1101 Description: 1nnn nnnn nnnn Subroutine call with a jump up to 1K from the current location. First, return address (PC + 2) is pushed onto the stack. Then, add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Encoding: 0000 Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation 1111 1111 This instruction provides a way to execute a MCLR Reset in software. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Start Reset No operation No operation Example: Q Cycle Activity: 0000 Description: After Instruction Registers = Flags* = RESET Reset Value Reset Value Push PC to stack No operation Example: No operation HERE RCALL Jump Before Instruction PC = Address (HERE) After Instruction PC = Address (Jump) TOS = Address (HERE + 2)  2010 Microchip Technology Inc. DS39635C-page 327 PIC18F6310/6410/8310/8410 RETFIE Return from Interrupt RETLW Return literal to W Syntax: RETFIE {s} Syntax: RETLW k Operands: s  [0,1] Operands: 0  k  255 Operation: (TOS)  PC, 1  GIE/GIEH or PEIE/GIEL; if s = 1, (WS)  W, (STATUSS)  STATUS, (BSRS)  BSR, PCLATU, PCLATH are unchanged Operation: k  W, (TOS)  PC, PCLATU, PCLATH are unchanged Status Affected: None Status Affected: 0000 0000 Description: 0000 0001 Words: 1 Cycles: 2 Q Cycle Activity: kkkk kkkk W is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). The high address latch (PCLATH) remains unchanged. Words: 1 Cycles: 2 000s Return from interrupt. Stack is popped and Top-of-Stack (TOS) is loaded into the PC. Interrupts are enabled by setting either the high or low-priority global interrupt enable bit. If ‘s’ = 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, STATUS and BSR. If ‘s’ = 0, no update of these registers occurs. 1100 Description: GIE/GIEH, PEIE/GIEL. Encoding: Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Pop PC from stack, Write to W No operation No operation No operation No operation Example: Q1 Q2 Q3 Q4 Decode No operation No operation Pop PC from stack Set GIEH or GIEL No operation Encoding: No operation Example: RETFIE After Interrupt PC W BSR STATUS GIE/GIEH, PEIE/GIEL No operation No operation 1 = = = = = TOS WS BSRS STATUSS 1 CALL TABLE ; ; ; ; : TABLE ADDWF PCL ; RETLW k0 ; RETLW k1 ; : : RETLW kn ; W = offset Begin table End of table Before Instruction W = After Instruction W DS39635C-page 328 W contains table offset value W now has table value = 07h value of kn  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 RETURN Return from Subroutine RLCF Rotate Left f through Carry Syntax: RETURN {s} Syntax: RLCF Operands: s  [0,1] Operands: Operation: (TOS)  PC; if s = 1, (WS)  W, (STATUSS)  STATUS, (BSRS)  BSR, PCLATU, PCLATH are unchanged 0  f  255 d  [0,1] a  [0,1] Operation: (f)  dest, (f)  C, (C)  dest Status Affected: C, N, Z Status Affected: None Encoding: 0000 Encoding: 0000 0001 001s Description: Return from subroutine. The stack is popped and the top of the stack (TOS) is loaded into the program counter. If ‘s’= 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, STATUS and BSR. If ‘s’ = 0, no update of these registers occurs. Words: 1 Cycles: 2 0011 Description: Q2 Q3 Q4 Decode No operation Process Data Pop PC from stack No operation No operation No operation Words: 1 Cycles: 1 Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: Before Instruction REG = C = After Instruction REG = W = C =  2010 Microchip Technology Inc. ffff Q Cycle Activity: RETURN After Instruction: PC = TOS ffff register f C Q1 Example: 01da The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Q Cycle Activity: No operation f {,d {,a}} RLCF REG, 0, 0 1110 0110 0 1110 0110 1100 1100 1 DS39635C-page 329 PIC18F6310/6410/8310/8410 RLNCF Rotate Left f (no carry) RRCF Rotate Right f through Carry Syntax: RLNCF Syntax: RRCF Operands: 0  f  255 d  [0,1] a  [0,1] Operands: 0  f  255 d  [0,1] a  [0,1] Operation: (f)  dest, (f)  dest Operation: Status Affected: N, Z (f)  dest, (f)  C, (C)  dest Status Affected: C, N, Z Encoding: 0100 Description: f {,d {,a}} 01da ffff ffff The contents of register ‘f’ are rotated one bit to the left. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Encoding: 0011 Description: register f Words: 1 Cycles: 1 Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Before Instruction REG = After Instruction REG = DS39635C-page 330 00da RLNCF Words: 1 Cycles: 1 0101 0111 ffff register f Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination REG, 1, 0 1010 1011 ffff The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’, If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. C Q Cycle Activity: Example: f {,d {,a}} Example: RRCF Before Instruction REG = C = After Instruction REG = W = C = REG, 0, 0 1110 0110 0 1110 0110 0111 0011 0  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 RRNCF Rotate Right f (no carry) SETF Syntax: RRNCF Syntax: SETF Operands: 0  f  255 d  [0,1] a  [0,1] Operands: 0  f  255 a [0,1] Operation: FFh  f Operation: (f)  dest, (f)  dest Status Affected: None Status Affected: f {,d {,a}} Encoding: N, Z Encoding: 0100 Description: 00da ffff ffff The contents of register ‘f’ are rotated one bit to the right. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If ‘a’ is ‘0’, the Access Bank will be selected, overriding the BSR value. If ‘a’ is ‘1’, then the bank will be selected as per the BSR value. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. register f Words: 1 Cycles: 1 Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination RRNCF Before Instruction REG = After Instruction REG = Example 2: f {,a} 0110 100a ffff ffff Description: The contents of the specified register are set to FFh. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: Q Cycle Activity: Example 1: Set f SETF Before Instruction REG After Instruction REG REG,1 = 5Ah = FFh REG, 1, 0 1101 0111 1110 1011 RRNCF REG, 0, 0 Before Instruction W = REG = After Instruction ? 1101 0111 = = 1110 1011 1101 0111 W REG  2010 Microchip Technology Inc. DS39635C-page 331 PIC18F6310/6410/8310/8410 SLEEP Enter Sleep mode SUBFWB Subtract f from W with borrow Syntax: SLEEP Syntax: SUBFWB Operands: None Operands: Operation: 00h  WDT, 0  WDT postscaler, 1  TO, 0  PD 0 f 255 d  [0,1] a  [0,1] Operation: (W) – (f) – (C) dest Status Affected: N, OV, C, DC, Z Status Affected: TO, PD Encoding: 0000 Encoding: 0000 0000 0011 Description: The Power-Down status bit (PD) is cleared. The Time-out status bit (TO) is set. Watchdog Timer and its postscaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Words: 1 Cycles: 1 0101 Q1 Q2 Q3 Q4 No operation Process Data Go to Sleep Example: SLEEP Before Instruction TO = ? ? PD = After Instruction 1† TO = 0 PD = † If WDT causes wake-up, this bit is cleared. DS39635C-page 332 01da ffff ffff Description: Subtract register ‘f’ and Carry flag (borrow) from W (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Decode f {,d {,a}} Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination SUBFWB REG, 1, 0 Example 1: Before Instruction REG = 3 W = 2 C = 1 After Instruction REG = FF W = 2 C = 0 Z = 0 N = 1 ; result is negative SUBFWB REG, 0, 0 Example 2: Before Instruction REG = 2 W = 5 C = 1 After Instruction REG = 2 W = 3 C = 1 Z = 0 N = 0 ; result is positive SUBFWB REG, 1, 0 Example 3: Before Instruction REG = 1 W = 2 C = 0 After Instruction REG = 0 W = 2 C = 1 Z = 1 ; result is zero N = 0  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 SUBLW Subtract W from literal SUBWF Subtract W from f Syntax: SUBLW k Syntax: SUBWF Operands: 0 k 255 Operands: Operation: k – (W) W Status Affected: N, OV, C, DC, Z 0 f 255 d  [0,1] a  [0,1] Operation: (f) – (W) dest Status Affected: N, OV, C, DC, Z Encoding: 0000 1000 kkkk kkkk Description: W is subtracted from the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Encoding: 0101 Q1 Q2 Q3 Q4 Read literal ‘k’ Process Data Write to W Example 1: SUBLW W C Z N = = = = Example 2: 01h 1 ; result is positive 0 0 SUBLW 02h Before Instruction W = C = After Instruction 1 Cycles: 1 W C Z N = = = = Example 3: 00h 1 ; result is zero 1 0 SUBLW 02h Before Instruction W = C = After Instruction W C Z N = = = = Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination SUBWF REG, 1, 0 Example 1: 02h ? 03h ? FFh ; (2’s complement) 0 ; result is negative 0 1 Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 2: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 3: Before Instruction REG = W = C = After Instruction REG = W = C = Z = N =  2010 Microchip Technology Inc. ffff Words: 02h 01h ? ffff Subtract W from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is V, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is V, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Before Instruction W = C = After Instruction 11da Description: Q Cycle Activity: Decode f {,d {,a}} 3 2 ? 1 2 1 0 0 ; result is positive SUBWF REG, 0, 0 2 2 ? 2 0 1 1 0 SUBWF ; result is zero REG, 1, 0 1 2 ? FFh ;(2’s complement) 2 0 ; result is negative 0 1 DS39635C-page 333 PIC18F6310/6410/8310/8410 SUBWFB Subtract W from f with Borrow SWAPF Swap f Syntax: SUBWFB Syntax: SWAPF f {,d {,a}} Operands: 0  f  255 d  [0,1] a  [0,1] Operands: 0  f  255 d  [0,1] a  [0,1] Operation: (f) – (W) – (C) dest Operation: Status Affected: N, OV, C, DC, Z (f)  dest, (f)  dest Status Affected: None Encoding: 0101 Description: f {,d {,a}} 10da ffff ffff Subtract W and the Carry flag (borrow) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Decode Q2 Read register ‘f’ Example 1: SUBWFB Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 2: Q4 Write to destination (0001 1001) (0000 1101) 0Ch 0Dh 1 0 0 (0000 1011) (0000 1101) 10da ffff ffff The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination REG, 1, 0 19h 0Dh 1 0011 Description: Example: SWAPF Before Instruction REG = After Instruction REG = REG, 1, 0 53h 35h ; result is positive SUBWFB REG, 0, 0 Before Instruction REG = W = C = After Instruction REG = W = C = Z = N = Example 3: 1Bh 1Ah 0 (0001 1011) (0001 1010) 1Bh 00h 1 1 0 (0001 1011) SUBWFB Before Instruction REG = W = C = After Instruction REG = W C Z N Q3 Process Data Encoding: = = = = DS39635C-page 334 ; result is zero REG, 1, 0 03h 0Eh 1 (0000 0011) (0000 1101) F5h (1111 0100) ; [2’s comp] (0000 1101) 0Eh 0 0 1 ; result is negative  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TBLRD Table Read TBLRD Table Read (Continued) Syntax: TBLRD ( *; *+; *-; +*) Example 1: TBLRD Operands: None Operation: if TBLRD *, (Prog Mem (TBLPTR))  TABLAT, TBLPTR – No Change; if TBLRD *+, (Prog Mem (TBLPTR))  TABLAT, (TBLPTR) + 1  TBLPTR; if TBLRD *-, (Prog Mem (TBLPTR))  TABLAT, (TBLPTR) – 1  TBLPTR; if TBLRD +*, (TBLPTR) + 1  TBLPTR, (Prog Mem (TBLPTR))  TABLAT Before Instruction TABLAT TBLPTR MEMORY(00A356h) After Instruction TABLAT TBLPTR Example 2: Status Affected: None Encoding: 0000 0000 0000 TBLRD Before Instruction TABLAT TBLPTR MEMORY(01A357h) MEMORY(01A358h) After Instruction TABLAT TBLPTR *+ ; = = = 55h 00A356h 34h = = 34h 00A357h +* ; = = = = AAh 01A357h 12h 34h = = 34h 01A358h 10nn nn=0 * =1 *+ =2 *=3 +* Description: This instruction is used to read the contents of Program Memory (P.M.). To address the program memory, a pointer called Table Pointer (TBLPTR) is used. The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLRD instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read Program Memory) No operation No operation (Write TABLAT)  2010 Microchip Technology Inc. DS39635C-page 335 PIC18F6310/6410/8310/8410 TBLWT Table Write TBLWT Table Write (Continued) Syntax: TBLWT ( *; *+; *-; +*) Example 1: TBLWT *+; Operands: None Operation: if TBLWT*, (TABLAT)  Holding Register, TBLPTR – No Change; if TBLWT*+, (TABLAT)  Holding Register, (TBLPTR) + 1  TBLPTR; if TBLWT*-, (TABLAT)  Holding Register, (TBLPTR) – 1  TBLPTR; if TBLWT+*, (TBLPTR) + 1  TBLPTR, (TABLAT)  Holding Register Status Affected: Example 2: None Encoding: Description: Before Instruction TABLAT = 55h TBLPTR = 00A356h HOLDING REGISTER (00A356h) = FFh After Instructions (table write completion) TABLAT = 55h TBLPTR = 00A357h HOLDING REGISTER (00A356h) = 55h 0000 0000 0000 11nn nn=0 * =1 *+ =2 *=3 +* This instruction uses the 3 LSBs of TBLPTR to determine which of the 8 holding registers the TABLAT is written to. The holding registers are used to program the contents of Program Memory (P.M.). (Refer to Section 7.0 “Program Memory” for additional details on programming Flash memory.) The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. The LSb of the TBLPTR selects which byte of the program memory location to access. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLWT instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 TBLWT +*; Before Instruction TABLAT = 34h TBLPTR = 01389Ah HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = FFh After Instruction (table write completion) TABLAT = 34h TBLPTR = 01389Bh HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = 34h Note: The TBLWT instruction is not available in PIC18F6310/6410 devices (i.e., 64-pin devices) in normal operating modes. TBLWT can only be used by PIC18F8310/8410 devices with the external memory interface and only when writing to an external memory device. For more information, refer to Section 7.4 “Writing to Program Memory Space (PIC18F8310/8410 only)” and Section 7.6 “Writing and Erasing On-Chip Program Memory (ICSP Mode)”. Q Cycle Activity: Q1 Decode Q2 Q3 Q4 No No No operation operation operation No No No No operation operation operation operation (Write to (Read Holding TABLAT) Register ) DS39635C-page 336  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TSTFSZ Test f, skip if 0 XORLW Syntax: TSTFSZ f {,a} Syntax: XORLW k Operands: 0  f  255 a  [0,1] Operands: 0 k 255 Operation: (W) .XOR. k W Operation: skip if f = 0 Status Affected: N, Z Status Affected: None Encoding: Encoding: 0110 Description: Exclusive OR literal with W 011a ffff ffff If ‘f’ = 0, the next instruction, fetched during the current instruction execution, is discarded and a NOP is executed, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. 0000 1010 kkkk kkkk Description: The contents of W are XORed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: XORLW 0AFh Before Instruction Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation W = After Instruction W = B5h 1Ah If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE NZERO ZERO Before Instruction PC After Instruction If CNT PC If CNT PC TSTFSZ : : CNT, 1 = Address (HERE) = =  = 00h, Address (ZERO) 00h, Address (NZERO)  2010 Microchip Technology Inc. DS39635C-page 337 PIC18F6310/6410/8310/8410 XORWF Exclusive OR W with f Syntax: XORWF Operands: 0  f  255 d  [0,1] a  [0,1] Operation: (W) .XOR. (f) dest Status Affected: N, Z Encoding: 0001 f {,d {,a}} 10da ffff ffff Description: Exclusive OR the contents of W with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in the register ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank. If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f 95 (5Fh). See Section 25.2.3 for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: XORWF Before Instruction REG = W = After Instruction REG = W = DS39635C-page 338 REG, 1, 0 AFh B5h 1Ah B5h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 25.2 Extended Instruction Set In addition to the standard 75 instructions of the PIC18 instruction set, PIC18F6310/6410/8310/8410 devices also provide an optional extension to the core CPU functionality. The added features include eight additional instructions that augment Indirect and Indexed Addressing operations and the implementation of Indexed Literal Offset Addressing for many of the standard PIC18 instructions. A summary of the instructions in the extended instruction set is provided in Table 25-3. Detailed descriptions are provided in Section 25.2.2 “Extended Instruction Set”. The opcode field descriptions in Table 25-1 (page 298) apply to both the standard and extended PIC18 instruction sets. Note: The additional features of the extended instruction set are disabled by default. To enable them, users must set the XINST Configuration bit. The instructions in the extended set can all be classified as literal operations which either manipulate the File Select Registers, or use them for Indexed Addressing. Two of the instructions, ADDFSR and SUBFSR, each have an additional special instantiation for using FSR2. These versions (ADDULNK and SUBULNK) allow for automatic return after execution. The extended instructions are specifically implemented to optimize re-entrant program code (that is, code that is recursive or that uses a software stack) written in high-level languages, particularly C. Among other things, they allow users working in high-level languages to perform certain operations on data structures more efficiently. These include: • dynamic allocation and de-allocation of software stack space when entering and leaving subroutines • Function Pointer invocation • Software Stack Pointer manipulation • manipulation of variables located in a software stack TABLE 25-3: EXTENDED INSTRUCTION SYNTAX Most of the extended instructions use indexed arguments, using one of the File Select Registers and some offset to specify a source or destination register. When an argument for an instruction serves as part of Indexed Addressing, it is enclosed in square brackets (“[ ]”). This is done to indicate that the argument is used as an index or offset. The MPASM Assembler will flag an error if it determines that an index or offset value is not bracketed. When the extended instruction set is enabled, brackets are also used to indicate index arguments in byte-oriented and bit-oriented instructions. This is in addition to other changes in their syntax. For more details, see Section 25.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”. Note: In the past, square brackets have been used to denote optional arguments in the PIC18 and earlier instruction sets. In this text and going forward, optional arguments are denoted by braces (“{ }”). EXTENSIONS TO THE PIC18 INSTRUCTION SET 16-Bit Instruction Word Mnemonic, Operands ADDFSR ADDULNK CALLW MOVSF f, k k MOVSS zs, zd PUSHL SUBFSR SUBULNK k f, k k Note: 25.2.1 The instruction set extension and the Indexed Literal Offset Addressing mode were designed for optimizing applications written in C; the user may likely never use these instructions directly in assembler. The syntax for these commands is provided as a reference for users who may be reviewing code that has been generated by a compiler. zs, fd Description Cycles MSb Add Literal to FSR Add Literal to FSR2 and Return Call Subroutine using WREG Move zs (source) to 1st word fd (destination) 2nd word Move zs (source) to 1st word zd (destination) 2nd word Store Literal at FSR2, Decrement FSR2 Subtract Literal from FSR Subtract Literal from FSR2 and Return 1 2 2 2 2 1 1 2 1110 1110 0000 1110 1111 1110 1111 1110 1110 1110 LSb 1000 1000 0000 1011 ffff 1011 xxxx 1010 1001 1001 ffkk 11kk 0001 0zzz ffff 1zzz xzzz kkkk ffkk 11kk kkkk kkkk 0100 zzzz ffff zzzz zzzz kkkk kkkk kkkk Status Affected None None None None None None None None All PIC18 instructions may take an optional label argument, preceding the instruction mnemonic, for use in symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s)  2010 Microchip Technology Inc. DS39635C-page 339 PIC18F6310/6410/8310/8410 25.2.2 EXTENDED INSTRUCTION SET ADDFSR Add Literal to FSR ADDULNK Syntax: ADDFSR f, k Syntax: ADDULNK k Operands: 0  k  63 f  [0, 1, 2] Operands: 0  k  63 Operation: FSR(f) + k  FSR(f) Status Affected: None Encoding: 1110 FSR2 + k  FSR2, Operation: (TOS) PC Status Affected: 1000 ffkk kkkk Description: The 6-bit literal ‘k’ is added to the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR ADDFSR 2, 23h Before Instruction FSR2 = After Instruction FSR2 = 03FFh 0422h None Encoding: 1110 11kk kkkk The 6-bit literal ‘k’ is added to the contents of FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be though of as a special case of the ADDFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR No Operation No Operation No Operation No Operation Example: DS39635C-page 340 1000 Description: Q Cycle Activity: Example: Add Literal to FSR2 and Return ADDULNK 23h Before Instruction FSR2 = PC = 03FFh 0100h After Instruction FSR2 = PC = 0422h (TOS)  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 CALLW Subroutine Call Using WREG MOVSF Syntax: CALLW Syntax: MOVSF [zs], fd Operands: None Operands: Operation: (PC + 2)  TOS, (W)  PCL, (PCLATH)  PCH, (PCLATU)  PCU 0  zs  127 0  fd  4095 Operation: ((FSR2) + zs)  fd Status Affected: None Status Affected: None Encoding: 0000 0000 0001 0100 Description First, the return address (PC + 2) is pushed onto the return stack. Next, the contents of W are written to PCL; the existing value is discarded. Then, the contents of PCLATH and PCLATU are latched into PCH and PCU, respectively. The second cycle is executed as a NOP instruction while the new next instruction is fetched. Unlike CALL, there is no option to update W, STATUS or BSR. Words: 1 Cycles: 2 Move Indexed to f Encoding: 1st word (source) 2nd word (destin.) Q1 Q2 Q3 Q4 Read WREG Push PC to stack No operation No operation No operation No operation No operation HERE Before Instruction PC = PCLATH = PCLATU = W = After Instruction PC = TOS = PCLATH = PCLATU = W = 2 Cycles: 2 Q Cycle Activity: Q1 Decode address (HERE) 10h 00h 06h  2010 Microchip Technology Inc. zzzzs ffffd Words: CALLW 001006h address (HERE + 2) 10h 00h 06h 0zzz ffff The contents of the source register are moved to destination register ‘fd’. The actual address of the source register is determined by adding the 7-bit literal offset ‘zs’ in the first word to the value of FSR2. The address of the destination register is specified by the 12-bit literal ‘fd’ in the second word. Both addresses can be anywhere in the 4096-byte data space (000h to FFFh). The MOVSF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. Decode Example: 1011 ffff Description: Q Cycle Activity: Decode 1110 1111 Q2 Q3 Determine Determine source addr source addr No operation No operation No dummy read Example: MOVSF Before Instruction FSR2 Contents of 85h REG2 After Instruction FSR2 Contents of 85h REG2 Q4 Read source reg Write register ‘f’ (dest) [05h], REG2 = 80h = = 33h 11h = 80h = = 33h 33h DS39635C-page 341 PIC18F6310/6410/8310/8410 MOVSS Move Indexed to Indexed PUSHL Syntax: Store Literal at FSR2, Decrement FSR2 Operands: MOVSS [zs], [zd] 0  zs  127 0  zd  127 Syntax: PUSHL k Operands: 0k  255 Operation: ((FSR2) + zs)  ((FSR2) + zd) Operation: Status Affected: None k  (FSR2), FSR2 - 1 FSR2 Status Affected: None Encoding: 1st word (source) 2nd word (dest.) 1110 1111 Description 1011 xxxx 1zzz xzzz zzzzs zzzzd The contents of the source register are moved to the destination register. The addresses of the source and destination registers are determined by adding the 7-bit literal offsets ‘zs’ or ‘zd’, respectively, to the value of FSR2. Both registers can be located anywhere in the 4096-byte data memory space (000h to FFFh). The MOVSS instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. If the resultant destination address points to an indirect addressing register, the instruction will execute as a NOP. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Decode Decode Q2 Q3 Determine Determine source addr source addr Determine dest addr Example: 1110 1010 kkkk kkkk Description: The 8-bit literal ‘k’ is written to the data memory address specified by FSR2. FSR2 is decremented by ‘1’ after the operation. This instruction allows users to push values onto a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process data Write to destination Example: PUSHL 08h Before Instruction FSR2H:FSR2L Memory (01ECh) = = 01ECh 00h After Instruction FSR2H:FSR2L Memory (01ECh) = = 01EBh 08h Read source reg Write to dest reg MOVSS [05h], [06h] Before Instruction FSR2 Contents of 85h Contents of 86h After Instruction FSR2 Contents of 85h Contents of 86h DS39635C-page 342 Determine dest addr Q4 Encoding: = 80h = 33h = 11h = 80h = 33h = 33h  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 SUBFSR Subtract Literal from FSR Syntax: SUBFSR f, k Subtract Literal from FSR2 and Return SUBULNK 0  k  63 Syntax: SUBULNK k f  [ 0, 1, 2 ] Operands: 0  k  63 Operation: FSRf – k  FSRf Operation: Status Affected: None Operands: Encoding: 1110 Description: 1001 ffkk kkkk The 6-bit literal ‘k’ is subtracted from the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 FSR2 – k  FSR2 (TOS) PC Status Affected: None Encoding: 1110 Q1 Q2 Q3 Q4 Read register ‘f’ Process Data Write to destination Example: SUBFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 03DCh kkkk Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination No Operation No Operation No Operation No Operation Example:  2010 Microchip Technology Inc. 11kk The 6-bit literal ‘k’ is subtracted from the contents of the FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be though of as a special case of the SUBFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Q Cycle Activity: Decode 1001 Description: SUBULNK 23h Before Instruction FSR2 = PC = 03FFh 0100h After Instruction FSR2 = PC = 03DCh (TOS) DS39635C-page 343 PIC18F6310/6410/8310/8410 25.2.3 Note: BYTE-ORIENTED AND BIT-ORIENTED INSTRUCTIONS IN INDEXED LITERAL OFFSET MODE Enabling the PIC18 instruction set extension may cause legacy applications to behave erratically or fail entirely. In addition to eight new commands in the extended set, enabling the extended instruction set also enables Indexed Literal Offset addressing (Section 6.5.1 “Indexed Addressing with Literal Offset”). This has a significant impact on the way that many commands of the standard PIC18 instruction set are interpreted. When the extended set is disabled, addresses embedded in opcodes are treated as literal memory locations: either as a location in the Access Bank (a = 0) or in a GPR bank designated by the BSR (a = 1). When the extended instruction set is enabled and a = 0, however, a file register argument of 5Fh or less is interpreted as an offset from the pointer value in FSR2 and not as a literal address. For practical purposes, this means that all instructions that use the Access RAM bit as an argument – that is, all byte-oriented and bit-oriented instructions, or almost half of the core PIC18 instructions – may behave differently when the extended instruction set is enabled. When the content of FSR2 is 00h, the boundaries of the Access RAM are essentially remapped to their original values. This may be useful in creating backward compatible code. If this technique is used, it may be necessary to save the value of FSR2 and restore it when moving back and forth between C and assembly routines in order to preserve the Stack Pointer. Users must also keep in mind the syntax requirements of the extended instruction set (see Section 25.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”). Although the Indexed Literal Offset mode can be very useful for dynamic stack and pointer manipulation, it can also be very annoying if a simple arithmetic operation is carried out on the wrong register. Users who are accustomed to the PIC18 programming must keep in mind that, when the extended instruction set is enabled, register addresses of 5Fh or less are used for Indexed Literal Offset Addressing. Representative examples of typical byte-oriented and bit-oriented instructions in the Indexed Literal Offset mode are provided on the following page to show how execution is affected. The operand conditions shown in the examples are applicable to all instructions of these types. DS39635C-page 344 25.2.3.1 Extended Instruction Syntax with Standard PIC18 Commands When the extended instruction set is enabled, the file register argument ‘f’ in the standard byte-oriented and bit-oriented commands is replaced with the literal offset value ‘k’. As already noted, this occurs only when f is less than or equal to 5Fh. When an offset value is used, it must be indicated by square brackets (“[ ]”). As with the extended instructions, the use of brackets indicates to the compiler that the value is to be interpreted as an index or an offset. Omitting the brackets, or using a value greater than 5Fh within brackets, will generate an error in the MPASM Assembler. If the index argument is properly bracketed for Indexed Literal Offset addressing, the Access RAM argument is never specified; it will automatically be assumed to be ‘0’. This is in contrast to standard operation (extended instruction set disabled), when ‘a’ is set on the basis of the target address. Declaring the Access RAM bit in this mode will also generate an error in the MPASM assembler. The destination argument ‘d’ functions as before. In the latest versions of the MPASM assembler, language support for the extended instruction set must be explicitly invoked. This is done with either the command line option /y, or the PE directive in the source listing. 25.2.4 CONSIDERATIONS WHEN ENABLING THE EXTENDED INSTRUCTION SET It is important to note that the extensions to the instruction set may not be beneficial to all users. In particular, users who are not writing code that uses a software stack may not benefit from using the extensions to the instruction set. Additionally, the Indexed Literal Offset Addressing mode may create issues with legacy applications written to PIC18 assembler. This is because instructions in the legacy code may attempt to address registers in the Access Bank below 5Fh. Since these addresses are interpreted as literal offsets to FSR2 when the instruction set extension is enabled, the application may read or write to the wrong data addresses. When porting an application to the PIC18F6310/6410/8310/8410, it is very important to consider the type of code. A large, re-entrant application that is written in C and would benefit from efficient compilation will do well when using the instruction set extensions. Legacy applications that heavily use the Access Bank will most likely not benefit from using the extended instruction set.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 ADDWF ADD W to Indexed (Indexed Literal Offset mode) BSF Bit Set Indexed (Indexed Literal Offset mode) Syntax: ADDWF Syntax: BSF [k], b Operands: 0  k  95 d  [0,1] Operands: 0  f  95 0b7 Operation: (W) + ((FSR2) + k)  dest Operation: 1  ((FSR2) + k) Status Affected: N, OV, C, DC, Z Status Affected: None Encoding: [k] {,d} 0010 Description: 01d0 kkkk kkkk The contents of W are added to the contents of the register indicated by FSR2, offset by the value ‘k’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Encoding: 1000 bbb0 kkkk kkkk Description: Bit ‘b’ of the register indicated by FSR2, offset by the value ‘k’, is set. Words: 1 Cycles: 1 Q Cycle Activity: Words: 1 Q1 Q2 Q3 Q4 Cycles: 1 Decode Read register ‘f’ Process Data Write to destination Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write to destination Example: ADDWF [OFST] ,0 Before Instruction W OFST FSR2 Contents of 0A2Ch After Instruction W Contents of 0A2Ch = = = 17h 2Ch 0A00h = 20h = 37h = 20h Example: BSF Before Instruction FLAG_OFST FSR2 Contents of 0A0Ah After Instruction Contents of 0A0Ah [FLAG_OFST], 7 = = 0Ah 0A00h = 55h = D5h SETF Set Indexed (Indexed Literal Offset mode) Syntax: SETF [k] Operands: 0  k  95 Operation: FFh  ((FSR2) + k) Status Affected: None Encoding: 0110 1000 kkkk kkkk Description: The contents of the register indicated by FSR2, offset by ‘k’, are set to FFh. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write register Example: SETF Before Instruction OFST FSR2 Contents of 0A2Ch After Instruction Contents of 0A2Ch  2010 Microchip Technology Inc. [OFST] = = 2Ch 0A00h = 00h = FFh DS39635C-page 345 PIC18F6310/6410/8310/8410 25.2.5 SPECIAL CONSIDERATIONS WITH MICROCHIP MPLAB IDE TOOLS The latest versions of Microchip’s software tools have been designed to fully support the extended instruction set of the PIC18F6310/6410/8310/8410 family of devices. This includes the MPLAB C18 compiler, MPASM assembly language and MPLAB Integrated Development Environment (IDE). When selecting a target device for software development, MPLAB IDE will automatically set default Configuration bits for that device. The default setting for the XINST Configuration is ‘0’, disabling the extended instruction set and Indexed Literal Offset Addressing. For proper execution of applications developed to take advantage of the extended instruction set, XINST must be set during programming. DS39635C-page 346 To develop software for the extended instruction set, the user must enable support for the instructions and the Indexed Addressing mode in their language tool(s). Depending on the environment being used, this may be done in several ways: • A menu option or dialog box within the environment that allows the user to configure the language tool and its settings for the project • A command line option • A directive in the source code These options vary between different compilers, assemblers and development environments. Users are encouraged to review the documentation accompanying their development systems for the appropriate information.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 26.0 DEVELOPMENT SUPPORT The PIC® microcontrollers and dsPIC® digital signal controllers are supported with a full range of software and hardware development tools: • Integrated Development Environment - MPLAB® IDE Software • Compilers/Assemblers/Linkers - MPLAB C Compiler for Various Device Families - HI-TECH C for Various Device Families - MPASMTM Assembler - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB Assembler/Linker/Librarian for Various Device Families • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debuggers - MPLAB ICD 3 - PICkit™ 3 Debug Express • Device Programmers - PICkit™ 2 Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration/Development Boards, Evaluation Kits, and Starter Kits 26.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16/32-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - In-Circuit Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either C or assembly) • One-touch compile or assemble, and download to emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (C or assembly) - Mixed C and assembly - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power.  2010 Microchip Technology Inc. DS39635C-page 347 PIC18F6310/6410/8310/8410 26.2 MPLAB C Compilers for Various Device Families The MPLAB C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC18, PIC24 and PIC32 families of microcontrollers and the dsPIC30 and dsPIC33 families of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 26.3 HI-TECH C for Various Device Families The HI-TECH C Compiler code development systems are complete ANSI C compilers for Microchip’s PIC family of microcontrollers and the dsPIC family of digital signal controllers. These compilers provide powerful integration capabilities, omniscient code generation and ease of use. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. The compilers include a macro assembler, linker, preprocessor, and one-step driver, and can run on multiple platforms. 26.4 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for PIC10/12/16/18 MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: 26.5 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 26.6 MPLAB Assembler, Linker and Librarian for Various Device Families MPLAB Assembler produces relocatable machine code from symbolic assembly language for PIC24, PIC32 and dsPIC devices. MPLAB C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire device instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process DS39635C-page 348  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 26.7 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C Compilers, and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. 26.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC and MCU devices. It debugs and programs PIC® Flash MCUs and dsPIC® Flash DSCs with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The emulator is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with incircuit debugger systems (RJ11) or with the new highspeed, noise tolerant, Low-Voltage Differential Signal (LVDS) interconnection (CAT5). The emulator is field upgradable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, run-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables.  2010 Microchip Technology Inc. 26.9 MPLAB ICD 3 In-Circuit Debugger System MPLAB ICD 3 In-Circuit Debugger System is Microchip's most cost effective high-speed hardware debugger/programmer for Microchip Flash Digital Signal Controller (DSC) and microcontroller (MCU) devices. It debugs and programs PIC® Flash microcontrollers and dsPIC® DSCs with the powerful, yet easyto-use graphical user interface of MPLAB Integrated Development Environment (IDE). The MPLAB ICD 3 In-Circuit Debugger probe is connected to the design engineer's PC using a high-speed USB 2.0 interface and is connected to the target with a connector compatible with the MPLAB ICD 2 or MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3 supports all MPLAB ICD 2 headers. 26.10 PICkit 3 In-Circuit Debugger/ Programmer and PICkit 3 Debug Express The MPLAB PICkit 3 allows debugging and programming of PIC® and dsPIC® Flash microcontrollers at a most affordable price point using the powerful graphical user interface of the MPLAB Integrated Development Environment (IDE). The MPLAB PICkit 3 is connected to the design engineer's PC using a full speed USB interface and can be connected to the target via an Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The connector uses two device I/O pins and the reset line to implement in-circuit debugging and In-Circuit Serial Programming™. The PICkit 3 Debug Express include the PICkit 3, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. DS39635C-page 349 PIC18F6310/6410/8310/8410 26.11 PICkit 2 Development Programmer/Debugger and PICkit 2 Debug Express 26.13 Demonstration/Development Boards, Evaluation Kits, and Starter Kits The PICkit™ 2 Development Programmer/Debugger is a low-cost development tool with an easy to use interface for programming and debugging Microchip’s Flash families of microcontrollers. The full featured Windows® programming interface supports baseline (PIC10F, PIC12F5xx, PIC16F5xx), midrange (PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30, dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit microcontrollers, and many Microchip Serial EEPROM products. With Microchip’s powerful MPLAB Integrated Development Environment (IDE) the PICkit™ 2 enables in-circuit debugging on most PIC® microcontrollers. In-Circuit-Debugging runs, halts and single steps the program while the PIC microcontroller is embedded in the application. When halted at a breakpoint, the file registers can be examined and modified. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The PICkit 2 Debug Express include the PICkit 2, demo board and microcontroller, hookup cables and CDROM with user’s guide, lessons, tutorial, compiler and MPLAB IDE software. 26.12 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an MMC card for file storage and data applications. DS39635C-page 350 The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Also available are starter kits that contain everything needed to experience the specified device. This usually includes a single application and debug capability, all on one board. Check the Microchip web page (www.microchip.com) for the complete list of demonstration, development and evaluation kits.  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR and RA4) .......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +8.5V Total power dissipation (Note 1) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA Output clamp current, IOK (VO < 0 or VO > VDD)  20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk byall ports .......................................................................................................................200 mA Maximum current sourced by all ports ..................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOL x IOL) 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin, rather than pulling this pin directly to VSS. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.  2010 Microchip Technology Inc. DS39635C-page 351 PIC18F6310/6410/8310/8410 FIGURE 27-1: PIC18F6310/6410/8310/8410 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) 6.0V 5.5V Voltage 5.0V 4.5V PIC18F6310/6410 PIC18F8310/8410 4.2V 4.0V 3.5V 3.0V 2.5V 2.0V FMAX Frequency FMAX = 20 MHz in 8-bit External Memory mode. FMAX = 40 MHz in all other modes. FIGURE 27-2: PIC18F6310/6410/8310/8410 VOLTAGE-FREQUENCY GRAPH (EXTENDED) 6.0V 5.5V Voltage 5.0V 4.5V PIC18F6310/6410 PIC18F8310/8410 4.2V 4.0V 3.5V 3.0V 2.5V 2.0V FMAX Frequency FMAX = 20 MHz in 8-bit External Memory mode. FMAX = 25 MHz in all other modes. DS39635C-page 352  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-3: PIC18LF6310/6410/8310/8410 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) 6.0V 5.5V PIC18LF6310/6410 PIC18LF8310/8410 Voltage 5.0V 4.5V 4.2V 4.0V 3.5V 3.0V 2.5V 2.0V FMAX 4 MHz Frequency In 8-bit External Memory mode: FMAX = (9.55 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz, if VDDAPPMIN  4.2V; FMAX = 25 MHz, if VDDAPPMIN > 4.2V. In all other modes: FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz; FMAX = 40 MHz, if VDDAPPMIN > 4.2V. Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application.  2010 Microchip Technology Inc. DS39635C-page 353 PIC18F6310/6410/8310/8410 27.1 DC Characteristics: Supply Voltage PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Symbol VDD D001 Characteristic Min Typ Max Units PIC18LFX310/X410 2.0 — 5.5 V PIC18F6310/6410/8310/8410 4.2 — 5.5 V Supply Voltage D001B AVDD Analog Supply Voltage VDD – 0.3 VDD + 0.3 — V D001C AVSS AVSS Analog Ground Voltage VSS – 0.3 VSS + 0.3 — V D002 VDR RAM Data Retention Voltage(1) 1.5 — — V D003 VPOR VDD Start Voltage to Ensure Internal Power-on Reset Signal — — 0.7 V D004 SVDD VDD Rise Rate to Ensure Internal Power-on Reset Signal 0.05 — — VBOR Brown-out Reset Voltage D005 Legend: Note 1: 2: Conditions See Section 5.3 “Power-on Reset (POR)” for details V/ms See Section 5.3 “Power-on Reset (POR)” for details BORV = 11 1.96 2.06 2.16 BORV = 10 2.64 2.78 2.92 V V BORV = 01(2) 4.11 4.33 4.55 V BORV = 00 4.41 4.64 4.87 V Shading of rows is to assist in readability of the table. This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data. With BOR enabled, full-speed operation (FOSC = 40 MHz) is supported until a BOR occurs. This is valid although VDD may be below the minimum voltage for this frequency. DS39635C-page 354  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Power-Down Current (IPD)(1) PIC18LFX310/X410 PIC18LFX310/X410 All devices Legend: Note 1: 2: 3: 4: 0.1 1.0 A -40°C 0.1 1.0 A +25°C 0.3 5.0 A +85°C 0.1 2.0 A -40°C 0.1 2.0 A +25°C 0.3 8.0 A +85°C 0.1 2.0 A -40°C 0.1 2.0 A +25°C 0.4 15 A +85°C 11 50 A +125°C VDD = 2.0V (Sleep mode) VDD = 3.0V (Sleep mode) VDD = 5.0V (Sleep mode) Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.  2010 Microchip Technology Inc. DS39635C-page 355 PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2,3) PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices Legend: Note 1: 2: 3: 4: 12 26 A -40°C 12 24 A +25°C 12 23 A +85°C 32 50 A -40°C 27 48 A +25°C 22 46 A +85°C 84 134 A -40°C 82 128 A +25°C 72 122 A +85°C 90 145 A 125°C .26 .8 mA -40°C .26 .8 mA +25°C .26 .8 mA +85°C .48 1.04 mA -40°C .44 .96 mA +25°C .48 .88 mA +85°C .88 1.84 mA -40°C .88 1.76 mA +25°C .8 1.68 mA +85°C +125°C 1.25 2.2 mA 0.6 1.7 mA -40°C 0.6 1.6 mA +25°C 0.6 1.5 mA +85°C 1.0 2.4 mA -40°C 1.0 2.4 mA +25°C 1.0 2.4 mA +85°C 2.0 4.2 mA -40°C 2.0 4 mA +25°C 2.0 3.8 mA +85°C 2.7 4.3 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 31 kHz (RC_RUN mode, Internal oscillator source) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 1 MHz (RC_RUN mode, Internal oscillator source) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 4 MHz (RC_RUN mode, Internal oscillator source) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. DS39635C-page 356  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2,3) PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices Legend: Note 1: 2: 3: 4: 2.3 6.4 A -40°C 2.5 6.4 A +25°C 2.9 8.8 A +85°C 3.6 8.8 A -40°C 3.8 8.8 A +25°C 4.6 12 A +85°C 7.4 16 A -40°C 7.8 13 A +25°C 9.1 29 A +85°C 21 97 A +125°C 132 450 A -40°C 140 450 A +25°C 152 450 A +85°C 200 600 A -40°C 216 600 A +25°C 252 600 A +85°C 400 990 A -40°C 420 990 A +25°C 440 990 A +85°C 850 1.2 A +125°C 272 690 A -40°C 280 690 A +25°C 288 690 A +85°C 416 990 A -40°C 432 990 A +25°C 464 990 A +85°C .8 1.9 mA -40°C .9 1.9 mA +25°C .9 1.9 mA +85°C 1.6 2.2 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 31 kHz (RC_IDLE mode, Internal oscillator source) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 1 MHz (RC_IDLE mode, Internal oscillator source) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 4 MHz (RC_IDLE mode, Internal oscillator source) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.  2010 Microchip Technology Inc. DS39635C-page 357 PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2,3) PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices All devices All devices Legend: Note 1: 2: 3: 4: 250 500 A -40°C 260 500 A +25°C 250 500 A +85°C 550 650 A -40°C 480 650 A +25°C 460 650 A +85°C 1.2 1.6 mA -40°C 1.1 1.5 mA +25°C 1.0 1.4 mA +85°C 1.5 1.9 mA +125°C 0.72 2.0 mA -40°C 0.74 2.0 mA +25°C 0.74 2.0 mA +85°C 1.3 3.0 mA -40°C 1.3 3.0 mA +25°C 1.3 3.0 mA +85°C 2.7 6.0 mA -40°C 2.6 6.0 mA +25°C 2.5 6.0 mA +85°C 4.2 8 mA +125°C 15 35 mA -40°C 16 35 mA +25°C 16 35 mA +85°C 21 40 mA -40°C 21 40 mA +25°C 21 40 mA +85°C 30 50 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 1 MHZ (PRI_RUN, EC oscillator) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 4 MHz (PRI_RUN, EC oscillator) VDD = 5.0V VDD = 4.2V FOSC = 40 MHZ (PRI_RUN, EC oscillator) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. DS39635C-page 358  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2,3) PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices All devices All devices Legend: Note 1: 2: 3: 4: 59 117 A -40°C 59 108 A +25°C 63 104 A +85°C 108 243 A -40°C 108 225 A +25°C 117 216 A +85°C 270 432 A -40°C 216 405 A +25°C 270 387 A +85°C 300 430 A +125°C 234 428 A -40°C 230 405 A +25°C 243 387 A +85°C 378 810 A -40°C 387 765 A +25°C +85°C 405 729 A 0.8 1.35 mA -40°C 0.8 1.26 mA +25°C 0.8 1.17 mA +85°C +125°C 1 1.4 mA 5.4 14.4 mA -40°C 5.6 14.4 mA +25°C 5.9 14.4 mA +85°C 7.3 16.2 mA -40°C 8.2 16.2 mA +25°C 7.5 16.2 mA +85°C 19 18 mA +125°C VDD = 2.0V VDD = 3.0V FOSC = 1 MHz (PRI_IDLE mode, EC oscillator) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 4 MHz (PRI_IDLE mode, EC oscillator) VDD = 5.0V VDD = 4.2 V FOSC = 40 MHz (PRI_IDLE mode, EC oscillator) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.  2010 Microchip Technology Inc. DS39635C-page 359 PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2,3) All devices All devices All devices All devices Legend: Note 1: 2: 3: 4: 7.5 16 mA -40°C 7.4 15 mA +25°C 7.3 14 mA +85°C 10 21 mA -40°C 10 20 mA +25°C 9.7 19 mA +85°C 17 35 mA -40°C 17 35 mA +25°C 17 35 mA +85°C 23 40 mA -40°C 23 40 mA +25°C 23 40 mA +85°C VDD = 4.2V FOSC = 4 MHZ, 16 MHz internal (PRI_RUN HSPLL mode) VDD = 5.0V FOSC = 4 MHZ, 16 MHz internal (PRI_RUN HSPLL mode) VDD = 4.2V FOSC = 10 MHZ, 40 MHz internal (PRI_RUN HSPLL mode) VDD = 5.0V FOSC = 10 MHZ, 40 MHz internal (PRI_RUN HSPLL mode) Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. DS39635C-page 360  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Supply Current (IDD)(2) PIC18LFX310/X410 PIC18LFX310/X410 All devices PIC18LFX310/X410 PIC18LFX310/X410 All devices Legend: Note 1: 2: 3: 4: 13 40 A -10°C 14 40 A +25°C 16 40 A +70°C 34 74 A -10°C 31 70 A +25°C 28 67 A +70°C 72 150 A -10°C 65 150 A +25°C 59 150 A +70°C 90 170 A +125°C 5.5 15 A -10°C 5.8 15 A +25°C 6.1 18 A +70°C 8.2 30 A -10°C 8.6 30 A +25°C 8.8 35 A +70°C 13 80 A -10°C 13 80 A +25°C 13 85 A +70°C 22 90 A +125°C VDD = 2.0V VDD = 3.0V FOSC = 32 kHz(4) (SEC_RUN mode, Timer1 as clock) VDD = 5.0V VDD = 2.0V VDD = 3.0V FOSC = 32 kHz(4) (SEC_IDLE mode, Timer1 as clock) VDD = 5.0V Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications.  2010 Microchip Technology Inc. DS39635C-page 361 PIC18F6310/6410/8310/8410 27.2 DC Characteristics: Power-Down and Supply Current PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Typ Max Units Conditions Module Differential Currents (IWDT, IBOR, ILVD, IOSCB, IAD) D022 (IWDT) D022A (IBOR) Watchdog Timer Brown-out Reset (4) High/Low-Voltage Detect (4) D022B (ILVD) D025 (IOSCB) Timer1 Oscillator D026 (IAD) A/D Converter Legend: Note 1: 2: 3: 4: 1.7 4.0 A -40°C 2.1 4.0 A +25°C 2.6 5.0 A +85°C 2.2 6.0 A -40°C 2.4 6.0 A +25°C 2.8 7.0 A +85°C 2.9 10.0 A -40°C 3.1 10.0 A +25°C 3.3 13.0 A +85°C 20 190 A +125°C 17 50.0 A -40C to +85C 47 60.0 A -40C to +85C 90 200 A -40C to +125C VDD = 2.0V VDD = 3.0V VDD = 5.0V VDD = 3.0V VDD = 5.0V 14 38.0 A -40C to +85C VDD = 2.0V 18 40.0 A -40C to +85C VDD = 3.0V 21 45.0 A -40C to +85C 90 2000 A -40C to +125C 1.0 3.5 A -40C 1.1 3.5 A +25C 1.1 4.5 A +70C 1.2 4.5 A -40C 1.3 4.5 A +25C 1.2 5.5 A +70C 1.8 6.0 A -40C 1.9 6.0 A +25C +85C VDD = 5.0V 32 kHz on Timer1(4) VDD = 2.0V 32 kHz on Timer1(4) VDD = 3.0V VDD = 5.0V 1.9 7.0 A 1.0 3.0 A — VDD = 2.0V 1.0 4.0 A — VDD = 3.0V 1.0 8.0 A — 15 60 A +125C VDD = 5.0V 32 kHz on Timer1(4) A/D on, not converting, 1.6 s  TAD  6.4 s Shading of rows is to assist in readability of the table. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS, and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins are tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT is enabled/disabled as specified. When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. DS39635C-page 362  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.3 DC Characteristics: PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA  +85°C for industrial -40°C TA  +125°C for extended DC CHARACTERISTICS Param Symbol No. VIL Characteristic Min Max Units Conditions VSS 0.15 VDD V VDD < 4.5V — 0.8 V 4.5V  VDD 5.5V Input Low Voltage I/O Ports: D030 with TTL Buffer D030A D031 with Schmitt Trigger Buffer D031A RC3 and RC4 D031B VSS 0.2 VDD V VSS 0.3 VDD V I2C™ enabled VSS 0.8 V SMBus enabled D032 MCLR VSS 0.2 VDD V D033 OSC1 VSS 0.3 VDD V HS, HSPLL modes D033A D033B D034 OSC1 OSC1 T13CKI VSS VSS VSS 0.2 VDD 0.3 0.3 V V V RC, EC modes(1) XT, LP modes 0.25 VDD + 0.8V VDD V VDD < 4.5V 2.0 VDD V 4.5V  VDD 5.5V VIH Input High Voltage I/O Ports: D040 with TTL Buffer D040A 0.8 VDD VDD V RC3 and RC4 0.7 VDD VDD V I2C enabled 2.1 VDD V SMBus enabled D042 MCLR 0.8 VDD VDD V D043 OSC1 0.7 VDD VDD V HS, HSPLL modes D043A D043B D043C D044 OSC1 OSC1 OSC1 T13CKI 0.8 VDD 0.9 VDD 1.6 1.6 VDD VDD VDD VDD V V V V EC mode RC mode(1) XT, LP modes — 200 nA 50 nA VDD < 5.5V VSS ≤ VPIN ≤ VDD, Pin at high-impedance VDD < 3V VSS ≤ VPIN ≤ VDD, Pin at high-impedance D041 with Schmitt Trigger Buffer D041A D041B IIL D060 Input Leakage Current(2,3) I/O Ports D061 D063 D070 Note 1: 2: 3: MCLR — 1 A Vss VPIN VDD OSC1 — 1 A Vss VPIN VDD 50 400 A VDD = 5V, VPIN = VSS IPU Weak Pull-up Current IPURB PORTB Weak Pull-up Current In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin.  2010 Microchip Technology Inc. DS39635C-page 363 PIC18F6310/6410/8310/8410 27.3 DC Characteristics: PIC18F6310/6410/8310/8410 (Industrial, Extended) PIC18LF6310/6410/8310/8410 (Industrial) (Continued) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA  +85°C for industrial -40°C TA  +125°C for extended DC CHARACTERISTICS Param Symbol No. VOL Characteristic Min Max Units Conditions Output Low Voltage D080 I/O Ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40C to +85C D083 OSC2/CLKO (RC, RCIO, EC, ECIO modes) — 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C VOH Output High Voltage(3) D090 I/O Ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C D092 OSC2/CLKO (RC, RCIO, EC, ECIO modes) VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V, -40C to +85C Capacitive Loading Specs on Output Pins D100 COSC2 OSC2 pin — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101 CIO All I/O pins and OSC2 (in RC mode) — 50 pF To meet the AC Timing Specifications D102 CB SCL, SDA — 400 pF I2C™ Specification Note 1: 2: 3: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. DS39635C-page 364  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 27-1: MEMORY PROGRAMMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended DC Characteristics Param No. Sym Characteristic Min Typ† Max Units Conditions 10.0 — 12.0 V — — 1 mA E/W -40C to +85C Program Flash Memory D110 VPP Voltage on MCLR/VPP pin D113 IDDP Supply Current during Programming D130 EP Cell Endurance — 1K — D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating voltage D132 VIE VDD for Block Erase 2.75 — 5.5 V Using ICSP port D132A VIW VDD for Externally Timed Erase or Write 2.75 — 5.5 V Using ICSP port D132B VPEW VDD for Self-timed Write VMIN — 5.5 V VMIN = Minimum operating voltage D133 TIE ICSP™ Block Erase Cycle Time — 4 — ms VDD > 4.5V D133A TIW ICSP Erase or Write Cycle Time (externally timed) 2 — — ms VDD > 4.5V D133A TIW Self-Timed Write Cycle Time — 2 — ms 40 100 — D134 TRETD Characteristic Retention Year Provided no other specifications are violated † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.  2010 Microchip Technology Inc. DS39635C-page 365 PIC18F6310/6410/8310/8410 TABLE 27-2: COMPARATOR SPECIFICATIONS Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C, unless otherwise stated. Param No. Sym Characteristics Min Typ Max Units Comments D300 VIOFF Input Offset Voltage — ±5.0 ±10 mV D301 VICM Input Common Mode Voltage 0 — VDD – 1.5 V D302 CMRR Common Mode Rejection Ratio 55 — — dB D303 TRESP Response Time(1) — 150 400 ns PIC18FXXXX — 150 600 ns PIC18LFXXXX, VDD = 2.0V — — 10 s D303A D304 Note 1: TMC2OV Comparator Mode Change to Output Valid Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD. TABLE 27-3: VOLTAGE REFERENCE SPECIFICATIONS Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C, unless otherwise stated. Param No. Sym Characteristics Min Typ Max Units VDD/24 — VDD/32 LSb D310 VRES Resolution D311 VRAA Absolute Accuracy — — — — 1/4 1/2 LSb LSb D312 VRUR Unit Resistor Value (R) — 2k —  TSET Time(1) — — 10 s 310 Note 1: Settling Comments Low Range (CVRR = 1) High Range (CVRR = 0) Settling time measured while CVRR = 1 and CVR transitions from ‘0000’ to ‘1111’. DS39635C-page 366  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS For VDIRMAG = 1: VDD VHLVD (HLVDIF set by hardware) (HLVDIF can be cleared in software) VHLVD VDD For VDIRMAG = 0: HLVDIF TABLE 27-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial Param Symbol No. D420 D420B VBG Characteristic Min Typ† Max Units HLVD Voltage on VDD LVV = 0000 Transition LVV = 0001 1.80 1.86 1.91 V 1.96 2.06 2.06 V LVV = 0010 2.16 2.27 2.38 V LVV = 0011 2.35 2.47 2.59 V LVV = 0100 2.43 2.56 2.69 V LVV = 0101 2.64 2.78 2.92 V LVV = 0110 2.75 2.89 3.03 V LVV = 0111 2.95 3.10 3.26 V LVV = 1000 3.24 3.41 3.58 V LVV = 1001 3.43 3.61 3.79 V LVV = 1010 3.53 3.72 3.91 V LVV = 1011 3.72 3.92 4.12 V LVV = 1100 3.92 4.13 4.34 V LVV = 1101 4.11 4.33 4.55 V LVV = 1110 4.41 4.64 4.87 V — 1.20 — V Band Gap Reference LVV = 1111 Voltage Value Conditions HLVDIN input external † Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.  2010 Microchip Technology Inc. DS39635C-page 367 PIC18F6310/6410/8310/8410 27.4 27.4.1 AC (Timing) Characteristics TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKO cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low I2C only AA output access BUF Bus free TCC:ST (I2C specifications only) CC HD Hold ST DAT DATA input hold STA Start condition DS39635C-page 368 3. TCC:ST 4. Ts (I2C specifications only) (I2C specifications only) T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T13CKI WR P R V Z Period Rise Valid High-impedance High Low High Low SU Setup STO Stop condition  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 27.4.2 TIMING CONDITIONS Note: The temperature and voltages specified in Table 27-5 apply to all timing specifications unless otherwise noted. Figure 27-5 specifies the load conditions for the timing specifications. TABLE 27-5: Because of space limitations, the generic terms “PIC18FXXXX” and “PIC18LFXXXX” are used throughout this section to refer to the PIC18F6310/6410/ 8310/8410 and PIC18LF6310/6410/8310/ 8410 families of devices specifically and only those devices. TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC AC CHARACTERISTICS FIGURE 27-5: Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA +85°C for industrial -40°C  TA +125°C for extended Operating voltage VDD range as described in DC spec, Section 27.1 and Section 27.3. LF parts operate for industrial temperatures only. LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 Load Condition 2 VDD/2 RL CL Pin VSS CL Pin RL = 464 VSS  2010 Microchip Technology Inc. CL = 50 pF for all pins except OSC2/CLKO and including D and E outputs as ports DS39635C-page 369 PIC18F6310/6410/8310/8410 27.4.3 TIMING DIAGRAMS AND SPECIFICATIONS FIGURE 27-6: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL) Q4 Q1 Q2 Q3 Q4 Q1 OSC1 1 3 4 3 4 2 CLKO TABLE 27-6: Param. No. 1A EXTERNAL CLOCK TIMING REQUIREMENTS Symbol FOSC Characteristic Min Max Units External CLKI Frequency(1) DC 1 MHz DC 25 MHz HS Oscillator mode DC 31.25 kHz LP Oscillator mode DC 40 MHz EC Oscillator mode DC 4 MHz RC Oscillator mode Oscillator Frequency(1) 1 TOSC External CLKI Period(1) Oscillator Period(1) 2 TCY Instruction Cycle Time(1) 3 TOSL, TOSH External Clock in (OSC1) High or Low Time 4 Note 1: TOSR, TOSF External Clock in (OSC1) Rise or Fall Time Conditions XT, RC Oscillator mode 0.1 4 MHz XT Oscillator mode 4 25 MHz HS Oscillator mode 4 10 MHz HS + PLL Oscillator mode 5 200 kHz LP Oscillator mode 1000 — ns XT, RC Oscillator mode 40 — ns HS Oscillator mode 32 — s LP Oscillator mode 25 — ns EC Oscillator mode 250 — ns RC Oscillator mode 0.25 10 s XT Oscillator mode 40 250 ns HS Oscillator mode 100 250 ns HS + PLL Oscillator mode 5 200 s LP Oscillator mode 100 — ns TCY = 4/FOSC, Industrial 160 — ns TCY = 4/FOSC, Extended 30 — ns XT Oscillator mode 2.5 — s LP Oscillator mode 10 — ns HS Oscillator mode — 20 ns XT Oscillator mode — 50 ns LP Oscillator mode — 7.5 ns HS Oscillator mode Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. DS39635C-page 370  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 27-7: Param No. PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V) Sym Characteristic Min Typ† Max 4 16 — — 10 40 Units F10 F11 FOSC Oscillator Frequency Range FSYS On-Chip VCO System Frequency F12 trc PLL Start-up Time (Lock Time) — — 2 ms CLK CLKO Stability (Jitter) -2 — +2 % F13 Conditions MHz HS mode only MHz HS mode only † Data in “Typ” column is at 5V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 27-8: AC CHARACTERISTICS: INTERNAL RC ACCURACY PIC18F6310/6410/8310/8410 (INDUSTRIAL) PIC18LF6310/6410/8310/8410 (INDUSTRIAL) PIC18LF6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial PIC18F6310/6410/8310/8410 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C  TA  +85°C for industrial -40°C  TA  +125°C for extended Param No. Device Min Typ Max Units Conditions INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1) PIC18LF6310/6410/8310/8410 PIC18F6310/6410/8310/8410 INTRC Accuracy @ Freq = 31 kHz Legend: Note 1: 2: -2 +/-1 2 % +25°C VDD = 2.7-3.3 V -5 — 5 % -10°C to +85°C VDD = 2.7-3.3 V -10 +/-1 10 % -40°C to +85°C VDD = 2.7-3.3 V -2 +/-1 2 % +25°C VDD = 4.5-5.5 V -5 — 5 % -10°C to +85°C VDD = 4.5-5.5 V -10 +/-1 10 % -40°C to +85°C VDD = 4.5-5.5 V (2) PIC18LF6310/6410/8310/8410 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3 V PIC18F6310/6410/8310/8410 26.562 — 35.938 kHz -40°C to +85°C VDD = 4.5-5.5 V Shading of rows is to assist in readability of the table. Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift. INTRC frequency after calibration.  2010 Microchip Technology Inc. DS39635C-page 371 PIC18F6310/6410/8310/8410 FIGURE 27-7: CLKO AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 CLKO 13 14 19 12 18 16 I/O pin (Input) 15 17 I/O pin (Output) New Value Old Value 20, 21 TABLE 27-9: Param No. CLKO AND I/O TIMING REQUIREMENTS Symbol Characteristic Min Typ Max Units Conditions 10 TOSH2CKL OSC1  to CLKO  — 75 200 ns (Note 1) 11 TOSH2CKH OSC1  to CLKO  — 75 200 ns (Note 1) 12 TCKR CLKO Rise Time — 35 100 ns (Note 1) 13 TCKF CLKO Fall Time — 35 100 ns (Note 1) 14 TCKL2IOV CLKO  to Port Out Valid — — 0.5 TCY + 20 ns (Note 1) 15 TIOV2CKH Port In Valid before CLKO  16 TCKH2IOI Port In Hold after CLKO  17 TOSH2IOV OSC1 (Q1 cycle) to Port Out Valid 18 TOSH2IOI 18A OSC1 (Q2 cycle) to Port Input Invalid (I/O in hold time) 0.25 TCY + 25 — — ns (Note 1) 0 — — ns (Note 1) — 50 150 ns PIC18FXXXX 100 — — ns PIC18LFXXXX 200 — — ns 19 TIOV2OSH Port Input Valid to OSC1(I/O in setup time) 0 — — ns 20 TIOR Port Output Rise Time 20A 21 TIOF 21A Port Output Fall Time PIC18FXXXX — 10 25 ns PIC18LFXXXX — — 60 ns PIC18FXXXX — 10 25 ns PIC18LFXXXX — — 60 ns 22† TINP INTx pin High or Low Time TCY — — ns 23† TRBP RB Change INTx High or Low Time TCY — — ns VDD = 2.0V VDD = 2.0V VDD = 2.0V † These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC. DS39635C-page 372  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-8: PROGRAM MEMORY READ TIMING DIAGRAM Q1 Q2 Q3 Q4 Q1 Q2 OSC1 AD BA0 Address Address Address AD Data from External 150 151 Address 163 160 162 161 155 166 167 168 ALE 164 169 171 CE 171A OE 165 TABLE 27-10: PROGRAM MEMORY READ TIMING REQUIREMENTS Param. No Symbol Characteristics Min Typ Max Units 0.25 TCY – 10 — — ns 150 TadV2alL Address Out Valid to ALE (address setup time) 151 TalL2adl ALE  to Address Out Invalid (address hold time) 5 — — ns 155 TalL2oeL ALE to OE  10 0.125 TCY — ns AD high-Z to OE (bus release to OE) 160 TadZ2oeL 161 ToeH2adD OE  to AD Driven 162 TadV2oeH LS Data Valid before OE (data setup time) 0 — — ns 0.125 TCY – 5 — — ns 20 — — ns 163 ToeH2adl OE  to Data In Invalid (data hold time) 0 — — ns 164 TalH2alL ALE Pulse Width — TCY — ns 165 ToeL2oeH OE Pulse Width 0.5 TCY – 5 0.5 TCY — ns 166 TalH2alH ALE  to ALE  (cycle time) — 0.25 TCY — ns 167 Tacc Address Valid to Data Valid 0.75 TCY – 25 — — ns 168 Toe OE  to Data Valid — 0.5 TCY – 25 ns 169 TalL2oeH ALE to OE  0.625 TCY – 10 — 0.625 TCY + 10 ns 171 TalH2csL Chip Enable Active to ALE  0.25 TCY – 20 — — ns 171A TubL2oeH AD Valid to Chip Enable Active — — 10 ns  2010 Microchip Technology Inc. DS39635C-page 373 PIC18F6310/6410/8310/8410 FIGURE 27-9: PROGRAM MEMORY WRITE TIMING DIAGRAM Q1 Q2 Q3 Q4 Q1 Q2 OSC1 AD BA0 Address Address 166 AD Data Address Address 153 150 156 151 ALE 171 CE 171A 154 WRH or WRL 157A 157 UB or LB TABLE 27-11: PROGRAM MEMORY WRITE TIMING REQUIREMENTS Param. No Symbol Characteristics Min Typ Max Units 150 TadV2alL Address Out Valid to ALE (address setup time) 0.25 TCY – 10 — — ns 151 TalL2adl ALE  to Address Out Invalid (address hold time) 5 — — ns 153 TwrH2adl WRn  to Data Out Invalid (data hold time) 154 TwrL WRn Pulse Width 156 TadV2wrH Data Valid before WRn (data setup time) 157 TbsV2wrL Byte Select Valid before WRn (byte select setup time) 157A TwrH2bsI WRn  to Byte Select Invalid (byte select hold time) 166 TalH2alH ALE  to ALE  (cycle time) 171 TalH2csL Chip Enable Active to ALE  171A TubL2oeH AD Valid to Chip Enable Active DS39635C-page 374 5 — — ns 0.5 TCY – 5 0.5 TCY — ns 0.5 TCY – 10 — — ns 0.25 TCY — — ns 0.125 TCY – 5 — — ns — 0.25 TCY — ns 0.25 TCY – 20 — — ns — — 10 ns  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 31 34 34 I/O pins FIGURE 27-11: BROWN-OUT RESET TIMING BVDD VDD 35 VBGAP = 1.2V VIRVST Enable Internal Reference Voltage Internal Reference Voltage Stable 36 TABLE 27-12: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS Param. Symbol No. Characteristic 30 TMCL MCLR Pulse Width (low) 31 TWDT Watchdog Timer Time-out Period (no postscaler) 32 TOST Oscillator Start-up Timer Period 33 TPWRT Power-up Timer Period 34 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset 35 TBOR Brown-out Reset Pulse Width 36 TIRVST Time for Internal Reference Voltage to become stable 37 TLVD Low-Voltage Detect Pulse Width 38 TCSD CPU Start-up Time 39 TIOBST Time for INTRC Block to stabilize  2010 Microchip Technology Inc. Min Typ Max Units 2 — — s 3.4 4.1 4.71 ms 1024 TOSC — 1024 TOSC — 55.5 65.5 75 ms — 2 — s 200 — — s — 20 50 s 200 — — s — 10 — s — 1 — ms Conditions TOSC = OSC1 period VDD  BVDD (see D005) VDD  VLVD DS39635C-page 375 PIC18F6310/6410/8310/8410 FIGURE 27-12: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 41 40 42 T1OSO/T13CKI 46 45 47 48 TMR0 or TMR1 TABLE 27-13: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Param No. Symbol Characteristic 40 TT0H T0CKI High Pulse Width 41 TT0L T0CKI Low Pulse Width 42 TT0P T0CKI Period No prescaler With prescaler No prescaler With prescaler 45 TT1H ns 10 — ns 0.5 TCY + 20 — ns ns ns With prescaler Greater of: 20 ns or (TCY + 40)/N — ns T13CKI Synchronous, no prescaler High Time Synchronous, PIC18FXXXX with prescaler PIC18LFXXXX 0.5 TCY + 20 — ns 10 — ns 25 — ns 30 — ns 50 — ns 0.5 TCY + 5 — ns PIC18FXXXX T13CKI Low Time Synchronous, no prescaler Synchronous, with prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 25 — ns Conditions N = prescale value (1, 2, 4,..., 256) VDD = 2.0V VDD = 2.0V VDD = 2.0V PIC18FXXXX 30 — ns PIC18LFXXXX 50 — ns VDD = 2.0V Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4, 8) TT1P T13CKI Input Period FT 1 T13CKI Oscillator Input Frequency Range Synchronous TCKE2TMRI Delay from External T13CKI Clock Edge to Timer Increment DS39635C-page 376 — — Asynchronous 48 0.5 TCY + 20 — Asynchronous 47 Units 10 No prescaler PIC18LFXXXX TT1L Max TCY + 10 Asynchronous 46 Min 60 — ns DC 50 kHz 2 TOSC 7 TOSC —  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-13: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES) CCPx (Capture Mode) 50 51 52 CCPx (Compare or PWM Mode) 53 54 TABLE 27-14: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES) Param Symbol No. 50 51 TCCL TCCH Characteristic Min Max Units CCPx Input Low No prescaler Time With PIC18FXXXX prescaler PIC18LFXXXX 0.5 TCY + 20 — ns 10 — ns 20 — ns CCPx Input High Time 0.5 TCY + 20 — ns No prescaler With prescaler 52 TCCP CCPx Input Period 53 TCCR CCPx Output Fall Time 54 TCCF CCPx Output Fall Time  2010 Microchip Technology Inc. Conditions VDD = 2.0V PIC18FXXXX 10 — ns PIC18LFXXXX 20 — ns VDD = 2.0V 3 TCY + 40 N — ns N = prescale value (1, 4 or 16) — 25 ns PIC18FXXXX PIC18LFXXXX — 45 ns PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V VDD = 2.0V DS39635C-page 377 PIC18F6310/6410/8310/8410 FIGURE 27-14: EXAMPLE SPI MASTER MODE TIMING (CKE = 0) SS 70 SCK (CKP = 0) 78 79 79 78 SCK (CKP = 1) 80 bit 6 - - - - - - 1 MSb SDO LSb 75, 76 SDI MSb In bit 6 - - - - 1 LSb In 74 73 TABLE 27-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0) Param No. Symbol Characteristic Min Max Units 70 TSSL2SCH, TSSL2SCL SS  to SCK  or SCK  Input TCY — ns 73 TDIV2SCH, TDIV2SCL Setup Time of SDI Data Input to SCK Edge 100 — ns 74 TSCH2DIL, TSCL2DIL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TDOR SDO Data Output Rise Time 76 TDOF SDO Data Output Fall Time 78 TSCR SCK Output Rise Time 79 TSCF SCK Output Fall Time 80 TSCH2DOV, SDO Data Output Valid after TSCL2DOV SCK Edge DS39635C-page 378 PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns — 25 ns PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns — 25 ns PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns Conditions VDD = 2.0V VDD = 2.0V VDD = 2.0V  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-15: EXAMPLE SPI MASTER MODE TIMING (CKE = 1) SS 81 SCK (CKP = 0) 79 73 SCK (CKP = 1) 80 78 MSb SDO bit 6 - - - - - - 1 LSb bit 6 - - - - 1 LSb In 75, 76 SDI MSb In 74 TABLE 27-16: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1) Param. No. Symbol Characteristic Min Max Units 73 TDIV2SCH, TDIV2SCL Setup Time of SDI Data Input to SCK Edge 20 — ns 74 TSCH2DIL, TSCL2DIL Hold Time of SDI Data Input to SCK Edge 40 — ns 75 TDOR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns 76 TDOF SDO Data Output Fall Time 78 TSCR SCK Output Rise Time 79 TSCF SCK Output Fall Time 80 TSCH2DOV, SDO Data Output Valid after TSCL2DOV SCK Edge 81 — 25 ns PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns — 25 ns PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns TCY — ns TDOV2SCH, SDO Data Output Setup to SCK Edge TDOV2SCL  2010 Microchip Technology Inc. Conditions VDD = 2.0V VDD = 2.0V VDD = 2.0V DS39635C-page 379 PIC18F6310/6410/8310/8410 FIGURE 27-16: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0) SS 70 SCK (CKP = 0) 83 71 72 SCK (CKP = 1) 80 MSb SDO bit 6 - - - - - - 1 LSb 75, 76 MSb In SDI 77 bit 6 - - - - 1 LSb In 74 73 TABLE 27-17: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0) Param No. Symbol Characteristic Min 70 TSSL2SCH, SS  to SCK  or SCK  Input TSSL2SCL 71 TSCH SCK Input High Time Continuous TSCL SCK Input Low Time 71A 72 72A TCY — ns 1.25 TCY + 30 — ns Single Byte 40 — ns Continuous 1.25 TCY + 30 — ns Single Byte 40 — ns 20 — ns — ns 40 — ns PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns — 25 ns TSSH2DOZ SS  to SDO Output High-impedance 10 50 ns TSCH2DOV, SDO Data Output Valid after SCK Edge PIC18FXXXX TSCL2DOV PIC18LFXXXX — 50 ns — 100 ns 1.5 TCY + 40 — ns 73 TDIV2SCH, Setup Time of SDI Data Input to SCK Edge TDIV2SCL 73A TB2B 74 TSCH2DIL, Hold Time of SDI Data Input to SCK Edge TSCL2DIL 75 TDOR SDO Data Output Rise Time 76 TDOF SDO Data Output Fall Time 77 80 83 Note 1: 2: Max Units Conditions Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 TSCH2SSH, SS  after SCK Edge TSCL2SSH (Note 1) (Note 1) (Note 2) VDD = 2.0V VDD = 2.0V Requires the use of Parameter #73A. Only if Parameter #71A and #72A are used. DS39635C-page 380  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 FIGURE 27-17: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1) 82 SS SCK (CKP = 0) 70 83 71 72 SCK (CKP = 1) 80 MSb SDO bit 6 - - - - - - 1 LSb 75, 76 SDI MSb In 77 bit 6 - - - - 1 LSb In 74 TABLE 27-18: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1) Param No. Symbol Characteristic Min 70 TSSL2SCH, SS  to SCK  or SCK  Input TSSL2SCL 71 TSCH SCK Input High Time TSCL SCK Input Low Time 73A TB2B Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 74 TSCH2DIL, Hold Time of SDI Data Input to SCK Edge TSCL2DIL 75 TDOR SDO Data Output Rise Time 76 TDOF SDO Data Output Fall Time 77 80 71A 72 72A TCY — ns 1.25 TCY + 30 — ns Single Byte 40 — ns Continuous 1.25 TCY + 30 — ns Single Byte 40 — ns (Note 1) — ns (Note 2) 40 — ns — 25 ns Continuous PIC18FXXXX PIC18LFXXXX 82 83 Max Units Conditions — 45 ns — 25 ns TSSH2DOZ SS to SDO Output High-Impedance 10 50 ns TSCH2DOV, SDO Data Output Valid after SCK TSCL2DOV Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns TSSL2DOV SDO Data Output Valid after SS  Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns 1.5 TCY + 40 — ns TSCH2SSH, SS  after SCK Edge TSCL2SSH Note 1: 2: (Note 1) VDD = 2.0V VDD = 2.0V VDD = 2.0V Requires the use of Parameter #73A. Only if Parameter #71A and #72A are used.  2010 Microchip Technology Inc. DS39635C-page 381 PIC18F6310/6410/8310/8410 FIGURE 27-18: I2C™ BUS START/STOP BITS TIMING SCL 91 93 90 92 SDA Stop Condition Start Condition TABLE 27-19: I2C™ BUS START/STOP BITS REQUIREMENTS (SLAVE MODE) Param. Symbol No. 90 91 92 93 TSU:STA THD:STA TSU:STO Characteristic Max Units Conditions ns Only relevant for Repeated Start condition ns After this period, the first clock pulse is generated Start Condition 100 kHz mode 4700 — Setup Time 400 kHz mode 600 — Start Condition 100 kHz mode 4000 — Hold Time 400 kHz mode 600 — Stop Condition 100 kHz mode 4700 — Setup Time 400 kHz mode 600 — 100 kHz mode 4000 — 400 kHz mode 600 — THD:STO Stop Condition Hold Time FIGURE 27-19: Min ns ns I2C™ BUS DATA TIMING 103 102 100 101 SCL 90 106 107 91 92 SDA In 110 109 109 SDA Out DS39635C-page 382  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 27-20: I2C™ BUS DATA REQUIREMENTS (SLAVE MODE) Param. No. 100 Symbol THIGH 101 TLOW 102 TR 103 TF TSU:STA 90 THD:STA 91 THD:DAT 106 TSU:DAT 107 TSU:STO 92 109 TAA 110 TBUF D102 CB Note 1: 2: Characteristic Clock High Time Min Max Units Conditions 100 kHz mode 4.0 — s PIC18FXXXX must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — s PIC18FXXXX must operate at a minimum of 10 MHz MSSP Module 1.5 TCY — 100 kHz mode 4.7 — s PIC18FXXXX must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — s PIC18FXXXX must operate at a minimum of 10 MHz MSSP Module 1.5 TCY — 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF Start Condition Setup Time 100 kHz mode 4.7 — s 400 kHz mode 0.6 — s Only relevant for Repeated Start condition Clock Low Time SDA and SCL Rise Time SDA and SCL Fall Time Start Condition Hold Time Data Input Hold Time Data Input Setup Time 100 kHz mode 4.0 — s 400 kHz mode 0.6 — s 100 kHz mode 0 — ns 400 kHz mode 0 0.9 s 100 kHz mode 250 — ns 400 kHz mode 100 — ns Stop Condition Setup Time 100 kHz mode 4.7 — s 400 kHz mode 0.6 — s 100 kHz mode — 3500 ns 400 kHz mode — — ns Output Valid from Clock Bus Free Time Bus Capacitive Loading 100 kHz mode 4.7 — s 400 kHz mode 1.3 — s — 400 pF CB is specified to be from 10 to 400 pF After this period, the first clock pulse is generated (Note 2) (Note 1) Time the bus must be free before a new transmission can start As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement, TSU:DAT  250 ns, must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification), before the SCL line is released.  2010 Microchip Technology Inc. DS39635C-page 383 PIC18F6310/6410/8310/8410 FIGURE 27-20: MASTER SSP I2C™ BUS START/STOP BITS TIMING WAVEFORMS SCL 93 91 90 92 SDA Stop Condition Start Condition TABLE 27-21: MASTER SSP I2C™ BUS START/STOP BITS REQUIREMENTS Param. Symbol No. 90 91 TSU:STA Characteristic Only relevant for Repeated Start condition ns After this period, the first clock pulse is generated 2(TOSC)(BRG + 1) — 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 100 kHz mode 2(TOSC)(BRG + 1) — 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 100 kHz mode 2(TOSC)(BRG + 1) — 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 100 kHz mode 2(TOSC)(BRG + 1) — 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — THD:STA Start Condition TSU:STO Stop Condition THD:STO Stop Condition Maximum pin capacitance = 10 pF for all FIGURE 27-21: ns 100 kHz mode Hold Time Note 1: Units Setup Time Setup Time 93 Max Start Condition Hold Time 92 Min I2C Conditions ns ns pins. MASTER SSP I2C™ BUS DATA TIMING 103 102 100 101 SCL 90 106 91 107 92 SDA In 109 109 110 SDA Out DS39635C-page 384  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 27-22: MASTER SSP I2C™ BUS DATA REQUIREMENTS Param. Symbol No. 100 101 THIGH TLOW Characteristic Min Max Units Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms (1) 2(TOSC)(BRG + 1) — ms 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) — 300 ns 1 MHz mode 102 103 90 91 TR TF TSU:STA SDA and SCL Rise Time SDA and SCL Fall Time Start Condition Setup Time THD:STA Start Condition Hold Time 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) — 100 ns 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 0 — ns 106 THD:DAT Data Input Hold Time 100 kHz mode 400 kHz mode 0 0.9 ms 107 TSU:DAT 100 kHz mode 250 — ns 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 100 kHz mode — 3500 ns 400 kHz mode — 1000 ns (1) 1 MHz mode — — ns 100 kHz mode 4.7 — ms 400 kHz mode 1.3 — ms — 400 pF 109 110 D102 Note 1: 2: TAA TBUF CB Data Input Setup Time Output Valid from Clock Bus Free Time Bus Capacitive Loading Conditions CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF Only relevant for Repeated Start condition After this period, the first clock pulse is generated (Note 2) Time the bus must be free before a new transmission can start 2C Maximum pin capacitance = 10 pF for all I pins. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but Parameter #107  250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, Parameter #102 + Parameter #107 = 1000 + 250 = 1250 ns (for 100 kHz mode,) before the SCL line is released.  2010 Microchip Technology Inc. DS39635C-page 385 PIC18F6310/6410/8310/8410 FIGURE 27-22: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING RC6/TX1/CK1 pin 121 121 RC7/RX1/DT1 pin 120 122 TABLE 27-23: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS Param No. 120 Symbol Characteristic TCKH2DTV SYNC XMIT (MASTER and SLAVE) Clock High to Data Out Valid PIC18FXXXX Min Max Units — 40 ns PIC18LFXXXX — 100 ns 121 TCKRF Clock Out Rise Time and Fall Time (Master mode) PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns 122 TDTRF Data Out Rise Time and Fall Time PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns FIGURE 27-23: RC6/TX1/CK1 Pin Conditions VDD = 2.0V VDD = 2.0V VDD = 2.0V USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING 125 RC7/RX1/DT1 Pin 126 TABLE 27-24: USART SYNCHRONOUS RECEIVE REQUIREMENTS Param. No. Symbol Characteristic 125 TDTV2CKL SYNC RCV (MASTER and SLAVE) Data Hold before CKx  (DTx hold time) 126 TCKL2DTL DS39635C-page 386 Data Hold after CKx  (DTx hold time) Min Max Units 10 — ns 15 — ns Conditions  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TABLE 27-25: A/D CONVERTER CHARACTERISTICS: PIC18F6310/6410/8310/8410 (INDUSTRIAL) PIC18LF6310/6410/8310/8410 (INDUSTRIAL) Param No. Sym Characteristic Min Typ Max Units — — 10 bit Conditions VREF  3.0V A01 NR Resolution A03 EIL Integral Linearity Error — — > >  (  !" # $% &" '  ()"&'"!&)  & #*&&  & #   + '% ! & !   & ,!- '   ' !! #.#&"# '#% ! &"!!#% ! &"!!! & $ #/'' !#  ' !  #&    .0/ 1+2 1 !' !  &  $ & " !**&"&&   ! .32  %   ' !("!" *&"&&   (%%' & " ! !      * + 1 DS39635C-page 392  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 )           ##   !" #$  % & ' ( 3& '!&" & 4 # * !(  ! ! &   4   % & & # & && 255***' '5 4   2010 Microchip Technology Inc. DS39635C-page 393 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 394  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 APPENDIX A: REVISION HISTORY Revision A (June 2004) Original data sheet for PIC18F6310/6410/8310/8410 devices. APPENDIX B: DEVICE DIFFERENCES The differences between the devices listed in this data sheet are shown in Table B-1. Revision B (May 2007) Updated Electrical Characteristics and packaging diagrams. Revision C (October 2010) Changes to electricals in Section 27.0 “Electrical Characteristics” and minor text edits throughout document. TABLE B-1: DEVICE DIFFERENCES Features Program Memory (Bytes) Program Memory (Instructions) External Memory Interface I/O Ports Packages  2010 Microchip Technology Inc. PIC18F6310 PIC18F6410 PIC18F8310 PIC18F8410 8K 16K 8K 16K 4096 8192 4096 8192 No No Yes Yes Ports A, B, C, D, E, Ports A, B, C, D, E, Ports A, B, C, D, E, Ports A, B, C, D, E, F, G F, G F, G, H, J F, G, H, J 64-Pin TQFP 64-Pin TQFP 80-Pin TQFP 80-Pin TQFP DS39635C-page 395 PIC18F6310/6410/8310/8410 APPENDIX C: CONVERSION CONSIDERATIONS This appendix discusses the considerations for converting from previous versions of a device to the ones listed in this data sheet. Typically, these changes are due to the differences in the process technology used. An example of this type of conversion is from a PIC16C74A to a PIC16C74B. Not Applicable DS39635C-page 396 APPENDIX D: MIGRATION FROM BASELINE TO ENHANCED DEVICES This section discusses how to migrate from a Baseline device (i.e., PIC16C5X) to an Enhanced MCU device (i.e., PIC18FXXX). The following are the list of modifications over the PIC16C5X microcontroller family: Not Currently Available  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 APPENDIX E: MIGRATION FROM MID-RANGE TO ENHANCED DEVICES A detailed discussion of the differences between the mid-range MCU devices (i.e., PIC16CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN716, “Migrating Designs from PIC16C74A/74B to PIC18C442”. The changes discussed, while device specific, are generally applicable to all mid-range to enhanced device migrations. APPENDIX F: MIGRATION FROM HIGH-END TO ENHANCED DEVICES A detailed discussion of the migration pathway and differences between the high-end MCU devices (i.e., PIC17CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN726, “PIC17CXXX to PIC18CXXX Migration”. This Application Note is available as Literature Number DS00726. This Application Note is available as Literature Number DS00716.  2010 Microchip Technology Inc. DS39635C-page 397 PIC18F6310/6410/8310/8410 NOTES: DS39635C-page 398  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 INDEX A A/D ................................................................................... 255 A/D Converter Interrupt, Configuring ....................... 259 Acquisition Requirements ........................................ 260 ADCON0 Register .................................................... 255 ADCON1 Register .................................................... 255 ADCON2 Register .................................................... 255 ADRESH Register ............................................ 255, 258 ADRESL Register .................................................... 255 Analog Port Pins ...................................................... 148 Analog Port Pins, Configuring .................................. 262 Associated Registers ............................................... 264 Calculating the Minimum Required Acquisition Time .............................................. 260 Configuring the Module ............................................ 259 Conversion Clock (TAD) ........................................... 261 Conversion Status (GO/DONE Bit) .......................... 258 Conversions ............................................................. 263 Converter Characteristics ........................................ 387 Discharge ................................................................. 263 Operation in Power-Managed Modes ...................... 262 Selecting, Configuring Automatic Acquisition Time .............................................. 261 Special Event Trigger (CCP) .................................... 264 Use of the CCP2 Trigger .......................................... 264 Absolute Maximum Ratings ............................................. 351 AC (Timing) Characteristics ............................................. 368 Load Conditions for Device Timing Specifications ................................................... 369 Parameter Symbology ............................................. 368 Temperature and Voltage Specifications ................. 369 Timing Conditions .................................................... 369 Access Bank ...................................................................... 77 ACKSTAT ........................................................................ 207 ACKSTAT Status Flag ..................................................... 207 ADCON0 Register ............................................................ 255 GO/DONE Bit ........................................................... 258 ADCON1 Register ............................................................ 255 ADCON2 Register ............................................................ 255 ADDFSR .......................................................................... 340 ADDLW ............................................................................ 303 Addressable Universal Synchronous Asynchronous Receiver Transmitter (AUSART). See AUSART. ADDULNK ........................................................................ 340 ADDWF ............................................................................ 303 ADDWFC ......................................................................... 304 ADRESH Register ............................................................ 255 ADRESL Register .................................................... 255, 258 Analog-to-Digital Converter. See A/D. ANDLW ............................................................................ 304 ANDWF ............................................................................ 305 Assembler MPASM Assembler .................................................. 348 AUSART Asynchronous Mode ................................................ 246 Associated Registers, Receive ........................ 249 Associated Registers, Transmit ....................... 247 Receiver ........................................................... 248 Setting up 9-Bit Mode with Address Detect ........................................ 248 Transmitter ....................................................... 246  2010 Microchip Technology Inc. Baud Rate Generator (BRG) ................................... 244 Associated Registers ....................................... 244 Baud Rate Error, Calculating ........................... 244 Baud Rates, Asynchronous Modes ................. 245 High Baud Rate Select (BRGH Bit) ................. 244 Operation in Power-Managed Modes .............. 244 Sampling ......................................................... 244 Synchronous Master Mode ...................................... 250 Associated Registers, Receive ........................ 252 Associated Registers, Transmit ....................... 251 Reception ........................................................ 252 Transmission ................................................... 250 Synchronous Slave Mode ........................................ 253 Associated Registers, Receive ........................ 254 Associated Registers, Transmit ....................... 253 Reception ........................................................ 254 Transmission ................................................... 253 Auto-Wake-up on Sync Break Character ......................... 232 B Bank Select Register (BSR) .............................................. 75 Baud Rate Generator ...................................................... 203 BC .................................................................................... 305 BCF ................................................................................. 306 BF .................................................................................... 207 BF Status Flag ................................................................. 207 Block Diagrams 16-Bit Byte Select Mode ............................................ 99 16-Bit Byte Write Mode .............................................. 97 16-Bit Word Write Mode ............................................ 98 8-Bit Multiplexed Mode ............................................ 102 A/D ........................................................................... 258 Analog Input Model .................................................. 259 AUSART Receive .................................................... 248 AUSART Transmit ................................................... 246 Baud Rate Generator .............................................. 203 Capture Mode Operation ......................................... 169 Comparator I/O Operating Modes ....................................... 266 Comparator Analog Input Model .............................. 269 Comparator Output .................................................. 268 Comparator Voltage Reference ............................... 272 Comparator Voltage Reference Output Buffer Example .................................... 273 Compare Mode Operation ....................................... 171 Device Clock .............................................................. 40 EUSART Receive .................................................... 230 EUSART Transmit ................................................... 227 External Clock Input, EC Oscillator ........................... 36 External Clock Input, HS Oscillator ........................... 36 External Power-on Reset Circuit (Slow VDD Power-up) ........................................ 57 Fail-Safe Clock Monitor ........................................... 293 Generic I/O Port Operation ...................................... 125 High/Low-Voltage Detect with External Input .......... 276 Interrupt Logic .......................................................... 110 MSSP (I2C Master Mode) ........................................ 201 MSSP (I2C Mode) .................................................... 186 MSSP (SPI Mode) ................................................... 177 On-Chip Reset Circuit ................................................ 55 PIC18F6310/6410 ..................................................... 12 PIC18F8310/8410 ..................................................... 13 PLL (HS Mode) .......................................................... 37 PORTD and PORTE (Parallel Slave Port) ............... 148 PWM Operation (Simplified) .................................... 173 RC Oscillator Mode ................................................... 37 DS39635C-page 399 PIC18F6310/6410/8310/8410 RCIO Oscillator Mode ................................................ 37 Reads From Program Memory .................................. 91 Single Comparator ................................................... 267 Table Read and Table Write Operations ................... 89 Timer0 in 16-Bit Mode .............................................. 152 Timer0 in 8-Bit Mode ................................................ 152 Timer1 ...................................................................... 156 Timer1 (16-Bit Read/Write Mode) ............................ 156 Timer2 ...................................................................... 162 Timer3 ...................................................................... 164 Timer3 (16-Bit Read/Write Mode) ............................ 164 Watchdog Timer ....................................................... 290 BN .................................................................................... 306 BNC .................................................................................. 307 BNN .................................................................................. 307 BNOV ............................................................................... 308 BNZ .................................................................................. 308 BOR. See Brown-out Reset. BOV .................................................................................. 311 BRA .................................................................................. 309 Break Character (12-Bit) Transmit and Receive .............. 234 BRG. See Baud Rate Generator. Brown-out Reset (BOR) ............................................. 58, 281 Detecting .................................................................... 58 Disabling in Sleep Mode ............................................ 58 Software Enabled ....................................................... 58 BSF .................................................................................. 309 BTFSC ............................................................................. 310 BTFSS .............................................................................. 310 BTG .................................................................................. 311 BZ ..................................................................................... 312 C C Compilers MPLAB C18 ............................................................. 348 CALL ................................................................................ 312 Capture (CCP Module) ..................................................... 169 Associated Registers ............................................... 172 CCP Pin Configuration ............................................. 169 CCPR2H:CCPR2L Registers ................................... 169 Software Interrupt .................................................... 170 Timer1/Timer3 Mode Selection ................................ 169 Capture/Compare/PWM (CCP) ........................................ 167 Capture Mode. See Capture. CCP Mode and Timer Resources ............................ 168 CCPRxH Register .................................................... 168 CCPRxL Register ..................................................... 168 Compare Mode. See Compare. Interconnect Configurations ..................................... 168 Module Configuration ............................................... 168 CLRF ................................................................................ 313 CLRWDT .......................................................................... 313 Code Examples 16 x 16 Signed Multiply Routine .............................. 108 16 x 16 Unsigned Multiply Routine .......................... 108 8 x 8 Signed Multiply Routine .................................. 107 8 x 8 Unsigned Multiply Routine .............................. 107 Changing Between Capture Prescalers ................... 170 Computed GOTO Using an Offset Value ................... 72 Executing Back to Back Sleep Instructions ................ 46 Fast Register Stack .................................................... 72 How to Clear RAM (Bank 1) Using Indirect Addressing ......................................................... 84 Implementing a Real-Time Clock Using a Timer1 Interrupt Service .................................. 159 Initializing PORTA .................................................... 125 DS39635C-page 400 Initializing PORTB .................................................... 128 Initializing PORTC ................................................... 131 Initializing PORTD ................................................... 134 Initializing PORTE .................................................... 137 Initializing PORTF .................................................... 140 Initializing PORTG ................................................... 142 Initializing PORTH ................................................... 144 Initializing PORTJ .................................................... 146 Loading the SSPBUF (SSPSR) Register ................. 180 Reading a Flash Program Memory Word .................. 91 Saving STATUS, WREG and BSR Registers in RAM ............................................. 124 Code Protection ............................................................... 281 COMF .............................................................................. 314 Comparator ...................................................................... 265 Analog Input Connection Considerations ................ 269 Associated Registers ............................................... 269 Configuration ........................................................... 266 Effects of a Reset .................................................... 268 Interrupts ................................................................. 268 Operation ................................................................. 267 Operation During Sleep ........................................... 268 Outputs .................................................................... 267 Reference ................................................................ 267 External Signal ................................................ 267 Internal Signal .................................................. 267 Response Time ........................................................ 267 Comparator Specifications ............................................... 366 Comparator Voltage Reference ....................................... 271 Accuracy and Error .................................................. 272 Associated Registers ............................................... 273 Configuring .............................................................. 271 Connection Considerations ...................................... 272 Effects of a Reset .................................................... 272 Operation During Sleep ........................................... 272 Compare (CCP Module) .................................................. 170 Associated Registers ............................................... 172 CCP Pin Configuration ............................................. 170 CCPR2 Register ...................................................... 170 Software Interrupt Mode .......................................... 170 Special Event Trigger .............................. 165, 170, 264 Timer1/Timer3 Mode Selection ................................ 170 Computed GOTO ............................................................... 72 CONFIG2L (Configuration 2 Low) ................................... 283 Configuration Bits ............................................................ 281 Configuration Register Protection .................................... 295 Conversion Considerations .............................................. 396 CPFSEQ .......................................................................... 314 CPFSGT .......................................................................... 315 CPFSLT ........................................................................... 315 Crystal Oscillator/Ceramic Resonator ................................ 35 Customer Change Notification Service ............................ 409 Customer Notification Service ......................................... 409 Customer Support ............................................................ 409 D Data Addressing Modes .................................................... 84 Comparing Addressing Modes with the Extended Instruction Set Enabled ..................... 87 Direct ......................................................................... 84 Indexed Literal Offset ................................................ 86 Indirect ....................................................................... 84 Inherent and Literal .................................................... 84  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 Data Memory ..................................................................... 75 Access Bank .............................................................. 77 and the Extended Instruction Set ............................... 86 Bank Select Register (BSR) ....................................... 75 General Purpose Registers ........................................ 77 Map for PIC18F6310/6410/8310/8410 Devices ......... 76 Special Function Registers ........................................ 78 DAW ................................................................................. 316 DC Characteristics ........................................................... 363 Power-Down and Supply Current ............................ 355 Supply Voltage ......................................................... 354 DCFSNZ .......................................................................... 317 DECF ............................................................................... 316 DECFSZ ........................................................................... 317 Development Support ...................................................... 347 Device Differences ........................................................... 395 Device Overview .................................................................. 9 Features (table) .......................................................... 11 New Core Features ...................................................... 9 Device Reset Timers .......................................................... 59 PLL Lock Time-out ..................................................... 59 Power-up Timer (PWRT) ........................................... 59 Time-out Sequence .................................................... 59 Device Reset Timer Oscillator Start-up Timer (OST) ......... 59 Direct Addressing ............................................................... 85 E Effect on Standard PIC Instructions ................................. 344 Effects of Power-Managed Modes on Various Clock Sources ............................................... 43 Electrical Characteristics .................................................. 351 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART). See EUSART. Equations 16 x 16 Signed Multiplication Algorithm ................... 108 16 x 16 Unsigned Multiplication Algorithm ............... 108 A/D Acquisition Time ................................................ 260 A/D Minimum Charging Time ................................... 260 Errata ................................................................................... 7 EUSART Asynchronous Mode ................................................ 226 12-Bit Break Transmit and Receive ................. 234 Associated Registers, Receive ........................ 231 Associated Registers, Transmit ....................... 228 Auto-Wake-up on Sync Break ......................... 232 Receiver ........................................................... 229 Setting up 9-Bit Mode with Address Detect ..... 229 Transmitter ....................................................... 226 Baud Rate Generator (BRG) .................................... 221 Associated Registers ....................................... 221 Auto-Baud Rate Detect .................................... 224 Baud Rate Error, Calculating ........................... 221 Baud Rates, Asynchronous Modes ................. 222 High Baud Rate Select (BRGH Bit) ................. 221 Operation in Power-Managed Modes .............. 221 Sampling .......................................................... 221 Synchronous Master Mode ...................................... 235 Associated Registers, Receive ........................ 238 Associated Registers, Transmit ....................... 236 Reception ......................................................... 237 Transmission ................................................... 235 Synchronous Slave Mode ........................................ 239 Associated Registers, Receive ........................ 240 Associated Registers, Transmit ....................... 239 Reception ......................................................... 240 Transmission ................................................... 239  2010 Microchip Technology Inc. Extended Instruction Set ADDFSR .................................................................. 340 ADDULNK ............................................................... 340 and Using MPLAB IDE Tools .................................. 346 CALLW .................................................................... 341 Considerations for Use ............................................ 344 MOVSF .................................................................... 341 MOVSS .................................................................... 342 PUSHL ..................................................................... 342 SUBFSR .................................................................. 343 SUBULNK ................................................................ 343 External Memory Interface ................................................. 95 16-Bit Byte Select Mode ............................................ 99 16-Bit Byte Write Mode .............................................. 97 16-Bit Mode ............................................................... 97 16-Bit Mode Timing ................................................. 100 16-Bit Word Write Mode ............................................ 98 8-Bit Mode ............................................................... 102 8-Bit Mode Timing ................................................... 103 and the Program Memory Modes .............................. 96 Associated Registers ............................................... 105 PIC18F8310/8410 External Bus, I/O Port Functions .............................................. 96 F Fail-Safe Clock Monitor ........................................... 281, 293 Interrupts in Power-Managed Modes ...................... 294 POR or Wake from Sleep ........................................ 294 WDT During Oscillator Failure ................................. 293 Fast Register Stack ........................................................... 72 Firmware Instructions ...................................................... 297 Flash Program Memory Associated Registers ................................................. 93 Operation During Code-Protect ................................. 92 Reading ..................................................................... 90 FSCM. See Fail-Safe Clock Monitor. G GOTO .............................................................................. 318 H Hardware Multiplier .......................................................... 107 Introduction .............................................................. 107 Operation ................................................................. 107 Performance Comparison ........................................ 107 High/Low-Voltage Detect ................................................. 275 Applications ............................................................. 278 Associated Registers ............................................... 279 Characteristics ......................................................... 367 Current Consumption .............................................. 277 Effects of a Reset .................................................... 279 Operation ................................................................. 276 During Sleep .................................................... 279 Start-up Time ................................................... 277 Setup ....................................................................... 277 Typical Application ................................................... 278 HLVD. See High/Low-Voltage Detect. ............................. 275 DS39635C-page 401 PIC18F6310/6410/8310/8410 I I/O Ports ........................................................................... 125 I2C Mode (MSSP) Acknowledge Sequence Timing ............................... 210 Associated Registers ............................................... 216 Baud Rate Generator ............................................... 203 Bus Collision During a Repeated Start Condition .................. 214 During a Start Condition ................................... 212 During a Stop Condition ................................... 215 Clock Arbitration ....................................................... 204 Clock Stretching ....................................................... 196 10-Bit Slave Receive Mode (SEN = 1) ............. 196 7-Bit Slave Receive Mode (SEN = 1) ............... 196 Effect of a Reset ...................................................... 211 General Call Address Support ................................. 200 I2C Clock Rate w/BRG ............................................. 203 Master Mode ............................................................ 201 Operation ......................................................... 202 Reception ......................................................... 207 Repeated Start Condition Timing ..................... 206 Start Condition ................................................. 205 Transmission .................................................... 207 Transmit Sequence .......................................... 202 Multi-Master Communication, Bus Collision and Arbitration .................................................. 211 Multi-Master Mode ................................................... 211 Operation ................................................................. 190 Read/Write Bit Information (R/W Bit) ............... 190, 191 Registers .................................................................. 186 Serial Clock (RC3/SCK/SCL) ................................... 191 Slave Mode .............................................................. 190 Addressing ....................................................... 190 Reception ......................................................... 191 Sleep Operation ....................................................... 211 Stop Condition Timing .............................................. 210 Transmission ............................................................ 191 ID Locations ............................................................. 281, 296 Idle Modes PRI_IDLE ................................................................... 51 INCF ................................................................................. 318 INCFSZ ............................................................................ 319 In-Circuit Debugger .......................................................... 296 In-Circuit Serial Programming (ICSP) ...................... 281, 296 Indexed Literal Offset Addressing and Standard PIC18 Instructions ............................. 344 Indexed Literal Offset Mode ....................................... 86, 344 Effect on Standard PIC18 Instructions ....................... 86 Mapping the Access Bank ......................................... 88 Indirect Addressing ............................................................ 85 INFSNZ ............................................................................ 319 Initialization Conditions for all Registers ...................... 63–66 Instruction Cycle ................................................................. 73 Clocking Scheme ....................................................... 73 Instruction Flow/Pipelining ................................................. 73 Instruction Set .................................................................. 297 ADDLW .................................................................... 303 ADDWF .................................................................... 303 ADDWF (Indexed Literal Offset mode) .................... 345 ADDWFC ................................................................. 304 ANDLW .................................................................... 304 ANDWF .................................................................... 305 BC ............................................................................ 305 BCF .......................................................................... 306 BN ............................................................................ 306 DS39635C-page 402 BNC ......................................................................... 307 BNN ......................................................................... 307 BNOV ...................................................................... 308 BNZ ......................................................................... 308 BOV ......................................................................... 311 BRA ......................................................................... 309 BSF .......................................................................... 309 BSF (Indexed Literal Offset mode) .......................... 345 BTFSC ..................................................................... 310 BTFSS ..................................................................... 310 BTG ......................................................................... 311 BZ ............................................................................ 312 CALL ........................................................................ 312 CLRF ....................................................................... 313 CLRWDT ................................................................. 313 COMF ...................................................................... 314 CPFSEQ .................................................................. 314 CPFSGT .................................................................. 315 CPFSLT ................................................................... 315 DAW ........................................................................ 316 DCFSNZ .................................................................. 317 DECF ....................................................................... 316 DECFSZ .................................................................. 317 Extended Instructions .............................................. 339 Syntax .............................................................. 339 General Format ........................................................ 299 GOTO ...................................................................... 318 INCF ........................................................................ 318 INCFSZ .................................................................... 319 INFSNZ .................................................................... 319 IORLW ..................................................................... 320 IORWF ..................................................................... 320 LFSR ....................................................................... 321 MOVF ...................................................................... 321 MOVFF .................................................................... 322 MOVLB .................................................................... 322 MOVLW ................................................................... 323 MOVWF ................................................................... 323 MULLW .................................................................... 324 MULWF .................................................................... 324 NEGF ....................................................................... 325 NOP ......................................................................... 325 Opcode Field Descriptions ....................................... 298 POP ......................................................................... 326 PUSH ....................................................................... 326 RCALL ..................................................................... 327 RESET ..................................................................... 327 RETFIE .................................................................... 328 RETLW .................................................................... 328 RETURN .................................................................. 329 RLCF ....................................................................... 329 RLNCF ..................................................................... 330 RRCF ....................................................................... 330 RRNCF .................................................................... 331 SETF ....................................................................... 331 SETF (Indexed Literal Offset mode) ........................ 345 SLEEP ..................................................................... 332 SUBFWB ................................................................. 332 SUBLW .................................................................... 333 SUBWF .................................................................... 333 SUBWFB ................................................................. 334 SWAPF .................................................................... 334  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 TBLRD ..................................................................... 335 TBLWT ..................................................................... 336 TSTFSZ ................................................................... 337 XORLW .................................................................... 337 XORWF .................................................................... 338 Summary Table ........................................................ 300 INTCON Register RBIF Bit .................................................................... 128 INTCON Registers ........................................................... 111 Inter-Integrated Circuit. See I2C. Internal Oscillator Block ..................................................... 38 Adjustment ................................................................. 38 INTIO Modes .............................................................. 38 INTOSC Frequency Drift ............................................ 38 INTOSC Output Frequency ........................................ 38 OSCTUNE Register ................................................... 38 Internal RC Oscillator Use with WDT .......................................................... 290 Internet Address ............................................................... 409 Interrupt Sources ............................................................. 281 A/D Conversion Complete ....................................... 259 Context Saving During Interrupts ............................. 124 Interrupt-on-Change (RB7:RB4) .............................. 128 INTx Pin ................................................................... 124 PORTB, Interrupt-on-Change .................................. 124 TMR0 ....................................................................... 124 TMR0 Overflow ........................................................ 153 TMR1 Overflow ........................................................ 155 TMR2 to PR2 Match (PWM) .................................... 173 TMR3 Overflow ................................................ 163, 165 Interrupts .......................................................................... 109 Interrupts, Flag Bits Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ......................................................... 128 INTOSC, INTRC. See Internal Oscillator Block. IORLW ............................................................................. 320 IORWF ............................................................................. 320 IPR Registers ................................................................... 120 L LFSR ................................................................................ 321 M Master Clear (MCLR) ......................................................... 57 Master Synchronous Serial Port (MSSP). See MSSP. Memory Organization ......................................................... 67 Data Memory ............................................................. 75 Program Memory ....................................................... 67 Memory Programming Requirements .............................. 365 Microchip Internet Web Site ............................................. 409 Migration from Baseline to Enhanced Devices ................ 396 Migration from High-End to Enhanced Devices ............... 397 Migration from Mid-Range to Enhanced Devices ............ 397 MOVF ............................................................................... 321 MOVFF ............................................................................ 322 MOVLB ............................................................................ 322 MOVLW ........................................................................... 323 MOVSS ............................................................................ 342 MOVWF ........................................................................... 323 MPLAB ASM30 Assembler, Linker, Librarian .................. 348 MPLAB Integrated Development Environment Software ................................................................... 347 MPLAB PM3 Device Programmer ................................... 350 MPLAB REAL ICE In-Circuit Emulator System ................ 349 MPLINK Object Linker/MPLIB Object Librarian ............... 348  2010 Microchip Technology Inc. MSSP ACK Pulse ....................................................... 190, 191 Control Registers (general) ..................................... 177 I2C Mode. See I2C Mode. Module Overview ..................................................... 177 SPI Master/Slave Connection .................................. 181 SPI Mode. See SPI Mode. SSPBUF .................................................................. 182 SSPSR .................................................................... 182 MULLW ............................................................................ 324 MULWF ............................................................................ 324 N NEGF ............................................................................... 325 NOP ................................................................................. 325 O Oscillator Clock Sources ........................................................... 40 Selecting the 31 kHz Source ............................. 41 Selection Using OSCCON Register .................. 41 External Clock Input .................................................. 36 RC ............................................................................. 37 RCIO Mode ................................................................ 37 Switching ................................................................... 40 Transitions ................................................................. 41 Oscillator Configuration ..................................................... 35 EC .............................................................................. 35 ECIO .......................................................................... 35 HS .............................................................................. 35 HSPLL ....................................................................... 35 Internal Oscillator Block ............................................. 38 INTIO1 ....................................................................... 35 INTIO2 ....................................................................... 35 LP .............................................................................. 35 RC ............................................................................. 35 RCIO .......................................................................... 35 XT .............................................................................. 35 Oscillator Selection .......................................................... 281 Oscillator Start-up Timer (OST) ................................. 43, 281 Oscillator, Timer1 ..................................................... 155, 165 Oscillator, Timer3 ............................................................. 163 P Packaging ........................................................................ 389 Details ...................................................................... 390 Marking .................................................................... 389 Parallel Slave Port (PSP) ................................................. 148 Associated Registers ............................................... 150 RE0/RD Pin ............................................................. 148 RE1/WR Pin ............................................................ 148 RE2/CS Pin ............................................................. 148 Select (PSPMODE Bit) ............................................ 148 PIC18 Instruction Execution, Extended ............................. 88 PIE Registers ................................................................... 117 Pin Functions AVDD .......................................................................... 30 AVDD .......................................................................... 21 AVSS .......................................................................... 21 AVSS .......................................................................... 30 OSC1/CLKI/RA7 .................................................. 14, 22 OSC2/CLKO/RA6 ................................................ 14, 22 RA0/AN0 .............................................................. 15, 23 RA1/AN1 .............................................................. 15, 23 RA2/AN2/VREF- ................................................... 15, 23 RA3/AN3/VREF+ .................................................. 15, 23 DS39635C-page 403 PIC18F6310/6410/8310/8410 RA4/T0CKI ........................................................... 15, 23 RA5/AN4/HLVDIN ................................................ 15, 23 RB0/INT0 ............................................................. 16, 24 RB1/INT1 ............................................................. 16, 24 RB2/INT2 ............................................................. 16, 24 RB3/INT3 ................................................................... 16 RB3/INT3/CCP2 ......................................................... 24 RB4/KBI0 ............................................................. 16, 24 RB5/KBI1 ............................................................. 16, 24 RB6/KBI2/PGC .................................................... 16, 24 RB7/KBI3/PGD .................................................... 16, 24 RC0/T1OSO/T13CKI ........................................... 17, 25 RC1/T1OSI/CCP2 ................................................ 17, 25 RC2/CCP1 ........................................................... 17, 25 RC3/SCK/SCL ..................................................... 17, 25 RC4/SDI/SDA ...................................................... 17, 25 RC5/SDO ............................................................. 17, 25 RC6/TX1/CK1 ...................................................... 17, 25 RC7/RX1/DT1 ...................................................... 17, 25 RD0/AD0/PSP0 .......................................................... 26 RD0/PSP0 .................................................................. 18 RD1/AD1/PSP1 .......................................................... 26 RD1/PSP1 .................................................................. 18 RD2/AD2/PSP2 .......................................................... 26 RD2/PSP2 .................................................................. 18 RD3/AD3/PSP3 .......................................................... 26 RD3/PSP3 .................................................................. 18 RD4/AD4/PSP4 .......................................................... 26 RD4/PSP4 .................................................................. 18 RD5/AD5/PSP5 .......................................................... 26 RD5/PSP5 .................................................................. 18 RD6/AD6/PSP6 .......................................................... 26 RD6/PSP6 .................................................................. 18 RD7/AD7/PSP7 .......................................................... 26 RD7/PSP7 .................................................................. 18 RE0/AD8/RD .............................................................. 27 RE0/RD ...................................................................... 19 RE1/AD9/WR ............................................................. 27 RE1/WR ..................................................................... 19 RE2/AD10/CS ............................................................ 27 RE2/CS ...................................................................... 19 RE3 ............................................................................ 19 RE3/AD11 .................................................................. 27 RE4 ............................................................................ 19 RE4/AD12 .................................................................. 27 RE5 ............................................................................ 19 RE5/AD13 .................................................................. 27 RE6 ............................................................................ 19 RE6/AD14 .................................................................. 27 RE7/CCP2 ................................................................. 19 RE7/CCP2/AD15 ....................................................... 27 RF0/AN5 .............................................................. 20, 28 RF1/AN6/C2OUT ................................................. 20, 28 RF2/AN7/C1OUT ................................................. 20, 28 RF3/AN8 .............................................................. 20, 28 RF4/AN9 .............................................................. 20, 28 RF5/AN10/CVREF ................................................. 20, 28 RF6/AN11 ............................................................ 20, 28 RF7/SS ................................................................ 20, 28 RG0/CCP3 ........................................................... 21, 29 RG1/TX2/CK2 ...................................................... 21, 29 RG2/RX2/DT2 ...................................................... 21, 29 RG3 ...................................................................... 21, 29 RG4 ...................................................................... 21, 29 RG5 ...................................................................... 21, 29 RG5/MCLR/VPP ................................................... 14, 22 DS39635C-page 404 RH0/AD16 ................................................................. 29 RH1/AD17 ................................................................. 29 RH2/AD18 ................................................................. 29 RH3/AD19 ................................................................. 29 RH4 ........................................................................... 29 RH5 ........................................................................... 29 RH6 ........................................................................... 29 RH7 ........................................................................... 29 RJ0/ALE .................................................................... 30 RJ1/OE ...................................................................... 30 RJ2/WRL ................................................................... 30 RJ3/WRH ................................................................... 30 RJ4/BA0 .................................................................... 30 RJ5/CE ...................................................................... 30 RJ6/LB ....................................................................... 30 RJ7/UB ...................................................................... 30 VDD ............................................................................ 21 VDD ............................................................................ 30 VSS ............................................................................ 21 VSS ............................................................................ 30 Pinout I/O Descriptions PIC18F6310/6410 ..................................................... 14 PIC18F8310/8410 ..................................................... 22 PIR Registers ................................................................... 114 PLL .................................................................................... 37 HSPLL Oscillator Mode ............................................. 37 Use with INTOSC ................................................ 37, 38 POP ................................................................................. 326 POR. See Power-on Reset. PORTA Associated Registers ............................................... 127 Functions ................................................................. 126 LATA Register ......................................................... 125 PORTA Register ...................................................... 125 TRISA Register ........................................................ 125 PORTB Associated Registers ............................................... 130 Functions ................................................................. 129 LATB Register ......................................................... 128 PORTB Register ...................................................... 128 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) ........ 128 TRISB Register ........................................................ 128 PORTC Associated Registers ............................................... 133 Functions ................................................................. 132 LATC Register ......................................................... 131 PORTC Register ...................................................... 131 RC3/SCK/SCL Pin ................................................... 191 TRISC Register ........................................................ 131 PORTD ............................................................................ 148 Associated Registers ............................................... 136 Functions ................................................................. 135 LATD Register ......................................................... 134 PORTD Register ...................................................... 134 TRISD Register ........................................................ 134 PORTE Analog Port Pins ...................................................... 148 Associated Registers ............................................... 139 Functions ................................................................. 138 LATE Register ......................................................... 137 PORTE Register ...................................................... 137 PSP Mode Select (PSPMODE Bit) .......................... 148 RE0/RD Pin ............................................................. 148 RE1/WR Pin ............................................................. 148 RE2/CS Pin ............................................................. 148 TRISE Register ........................................................ 137  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 PORTF Associated Registers ............................................... 141 Functions ................................................................. 141 LATF Register .......................................................... 140 PORTF Register ...................................................... 140 TRISF Register ........................................................ 140 PORTG Associated Registers ............................................... 143 Functions ................................................................. 143 LATG Register ......................................................... 142 PORTG Register ...................................................... 142 TRISG Register ........................................................ 142 PORTH Associated Registers ............................................... 145 Functions ................................................................. 145 LATH Register ......................................................... 144 PORTH Register ...................................................... 144 TRISH Register ........................................................ 144 PORTJ Associated Registers ............................................... 147 Functions ................................................................. 147 LATJ Register .......................................................... 146 PORTJ Register ....................................................... 146 TRISJ Register ......................................................... 146 Postscaler, WDT Assignment (PSA Bit) .............................................. 153 Rate Select (T0PS2:T0PS0 Bits) ............................. 153 Switching Between Timer0 and WDT ...................... 153 Power-Managed Modes ..................................................... 45 and Multiple Sleep Commands .................................. 46 Clock Sources ............................................................ 45 Clock Transitions, Status Indicators ........................... 46 Entering ...................................................................... 45 Exiting Idle and Sleep Modes .................................... 53 by Interrupt ......................................................... 53 by Reset ............................................................. 53 by WDT Time-out ............................................... 53 Without an Oscillator Start-up Delay .................. 53 Idle Modes ................................................................. 50 Operation ................................................................. 105 Run Modes ................................................................. 46 Selecting .................................................................... 45 Sleep Mode ................................................................ 50 Summary (table) ........................................................ 45 Power-on Reset (POR) .............................................. 57, 281 Oscillator Start-up Timer (OST) ................................. 59 Power-up Timer (PWRT) ........................................... 59 Time-out Sequence .................................................... 59 Power-up Delays ................................................................ 43 Power-up Timer (PWRT) ........................................... 43, 281 Prescaler, Capture ........................................................... 170 Prescaler, Timer0 ............................................................. 153 Assignment (PSA Bit) .............................................. 153 Rate Select (T0PS2:T0PS0 Bits) ............................. 153 Switching Between Timer0 and WDT ...................... 153 Prescaler, TMR2 .............................................................. 174 Program Counter ............................................................... 70 PCL, PCH and PCU Registers ................................... 70 PCLATH and PCLATU Registers .............................. 70 Program Memory ............................................................... 89 Code Protection, from Table Reads ......................... 295 Control Registers ....................................................... 90 TABLAT (Table Latch) Register ......................... 90 TBLPTR (Table Pointer) Register ...................... 90 Erasing External Memory (PIC18F8X10) ................... 92  2010 Microchip Technology Inc. Instructions ................................................................ 74 Two-Word Instructions ....................................... 74 Interrupt Vector .......................................................... 67 Look-up Tables .......................................................... 72 Map and Stack (diagram) .......................................... 67 Memory Access for PIC18F8310/8410 Modes .......... 69 Memory Maps for PIC18FX310/X410 Modes ............ 69 PIC18F8310/8410 Memory Modes ............................ 68 Reset Vector .............................................................. 67 Table Reads and Table Writes .................................. 89 Writing and Erasing On-Chip Program Memory (ICSP Mode) ........................................ 92 Writing To Unexpected Termination ................................... 92 Write Verify ........................................................ 92 Writing to Memory Space (PIC18F8X10) .................. 92 Program Memory Modes Extended Microcontroller ........................................... 96 Microcontroller ........................................................... 96 Microprocessor .......................................................... 96 Microprocessor with Boot Block ................................ 96 Program Verification and Code Protection ...................... 295 Associated Registers ............................................... 295 Programming, Device Instructions ................................... 297 PSP.See Parallel Slave Port. Pulse-Width Modulation. See PWM (CCP Module). PUSH ............................................................................... 326 PUSH and POP Instructions .............................................. 71 PUSHL ............................................................................. 342 PWM (CCP Module) Associated Registers ............................................... 175 Duty Cycle ............................................................... 174 Example Frequencies/Resolutions .......................... 174 Period ...................................................................... 173 Setup for PWM Operation ....................................... 174 TMR2 to PR2 Match ................................................ 173 Q Q Clock ............................................................................ 174 R RAM. See Data Memory. RCALL ............................................................................. 327 RCON Register Bit Status During Initialization .................................... 62 Reader Response ............................................................ 410 Register File ....................................................................... 77 Register File Summary ................................................ 79–82 Registers ADCON0 (A/D Control 0) ......................................... 255 ADCON1 (A/D Control 1) ......................................... 256 ADCON2 (A/D Control 2) ......................................... 257 BAUDCON1 (Baud Rate Control 1) ......................... 220 CCPxCON (Capture/Compare/PWM Control) ......... 167 CMCON (Comparator Control) ................................ 265 CONFIG1H (Configuration 1 High Byte) .................. 282 CONFIG2H (Configuration 2 High) .......................... 284 CONFIG3H (Configuration 3 High) .......................... 286 CONFIG3L (Configuration 3 Low) ........................... 285 CONFIG4L (Configuration 4 Low) ........................... 287 CONFIG5L (Configuration 5 Low) ........................... 287 CONFIG7L (Configuration 7 Low) ........................... 288 CVRCON (Comparator Voltage Reference Control) .......................................... 271 DEVID1 (Device ID 1) .............................................. 289 DEVID2 (Device ID 2) .............................................. 289 DS39635C-page 405 PIC18F6310/6410/8310/8410 HLVDCON (HLVD Control) ...................................... 275 INTCON (Interrupt Control) ...................................... 111 INTCON2 (Interrupt Control 2) ................................. 112 INTCON3 (Interrupt Control 3) ................................. 113 IPR1 (Peripheral Interrupt Priority 1) ........................ 120 IPR2 (Peripheral Interrupt Priority 2) ........................ 121 IPR3 (Peripheral Interrupt Priority 3) ........................ 122 MEMCON (Memory Control) ...................................... 95 OSCCON (Oscillator Control) .................................... 42 OSCTUNE (Oscillator Tuning) ................................... 39 PIE1 (Peripheral Interrupt Enable 1) ........................ 117 PIE2 (Peripheral Interrupt Enable 2) ........................ 118 PIE3 (Peripheral Interrupt Enable 3) ........................ 119 PIR1 (Peripheral Interrupt Request (Flag) 1) ........... 114 PIR2 (Peripheral Interrupt Request (Flag) 2) ........... 115 PIR3 (Peripheral Interrupt Request (Flag) 3) ........... 116 PSPCON (Parallel Slave Port Control) .................... 149 RCON (Reset Control) ....................................... 56, 123 RCSTA2 (AUSART2 Receive Status and Control) ..................................................... 243 SSPCON1 (MSSP Control 1, SPI Mode) ................. 179 SSPCON2, (I2C Mode) ............................................ 189 SSPSTAT (MSSP Status, I2C Mode) ............... 187, 188 SSPSTAT (MSSP Status, SPI Mode) .............. 178, 219 T0CON (Timer0 Control) .......................................... 151 T1CON (Timer1 Control) .......................................... 155 T2CON (Timer2 Control) .......................................... 161 T3CON (Timer3 Control) .......................................... 163 TXSTA1 (EUSART1 Transmit Status and Control) ..................................................... 218 TXSTA2 (AUSART2 Transmit Status and Control) ..................................................... 242 WDTCON (Watchdog Timer Control) ....................... 291 RESET ............................................................................. 327 Reset .................................................................................. 55 MCLR Reset, Normal Operation ................................ 55 MCLR Reset, Power Managed Modes ...................... 55 Power-on Reset (POR) .............................................. 55 Programmable Brown-out Reset (BOR) .................... 55 RESET Instruction ..................................................... 55 Stack Full Reset ......................................................... 55 Stack Underflow Reset .............................................. 55 Watchdog Timer (WDT) Reset ................................... 55 Resets .............................................................................. 281 RETFIE ............................................................................ 328 RETLW ............................................................................. 328 RETURN .......................................................................... 329 Return Address Stack ........................................................ 70 Return Stack Pointer (STKPTR) ........................................ 71 Revision History ............................................................... 395 RLCF ................................................................................ 329 RLNCF ............................................................................. 330 RRCF ............................................................................... 330 RRNCF ............................................................................. 331 Run Modes PRI_RUN ................................................................... 46 RC_RUN .................................................................... 48 SEC_RUN .................................................................. 46 DS39635C-page 406 S SCK ................................................................................. 177 SDI ................................................................................... 177 SDO ................................................................................. 177 Serial Clock, SCK ............................................................ 177 Serial Data In (SDI) .......................................................... 177 Serial Data Out (SDO) ..................................................... 177 Serial Peripheral Interface. See SPI Mode. SETF ................................................................................ 331 Slave Select (SS) ............................................................. 177 SLEEP ............................................................................. 332 Sleep Mode OSC1 and OSC2 Pin States ...................................... 43 Software Simulator (MPLAB SIM) ................................... 349 Special Event Trigger. See Compare (CCP Module). Special Features of the CPU ........................................... 281 Special Function Registers ................................................ 78 Map ............................................................................ 78 SPI Mode (MSSP) Associated Registers ............................................... 185 Bus Mode Compatibility ........................................... 185 Effects of a Reset .................................................... 185 Enabling SPI I/O ...................................................... 181 Master Mode ............................................................ 182 Master/Slave Connection ......................................... 181 Operation ................................................................. 180 Serial Clock .............................................................. 177 Serial Data In ........................................................... 177 Serial Data Out ........................................................ 177 Slave Mode .............................................................. 183 Slave Select ............................................................. 177 Slave Select Synchronization .................................. 183 Sleep Operation ....................................................... 185 SPI Clock ................................................................. 182 Typical Connection .................................................. 181 SS .................................................................................... 177 SSPOV ............................................................................ 207 SSPOV Status Flag ......................................................... 207 SSPSTAT Register R/W Bit ............................................................ 190, 191 Stack Full/Underflow Resets .............................................. 72 Standard Instructions ....................................................... 297 SUBFSR .......................................................................... 343 SUBFWB ......................................................................... 332 SUBLW ............................................................................ 333 SUBULNK ........................................................................ 343 SUBWF ............................................................................ 333 SUBWFB ......................................................................... 334 SWAPF ............................................................................ 334 T T0CON Register PSA Bit .................................................................... 153 T0CS Bit .................................................................. 152 T0PS2:T0PS0 Bits ................................................... 153 T0SE Bit .................................................................. 152 Table Pointer Operations (table) ........................................ 90 Table Reads/Table Writes ................................................. 72 TBLRD ............................................................................. 335 TBLWT ............................................................................. 336 Time-out in Various Situations (table) ................................ 59  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 Timer0 .............................................................................. 151 16-Bit Mode Timer Reads and Writes ...................... 152 Associated Registers ............................................... 153 Clock Source Edge Select (T0SE Bit) ...................... 152 Clock Source Select (T0CS Bit) ............................... 152 Operation ................................................................. 152 Overflow Interrupt .................................................... 153 Prescaler. See Prescaler, Timer0. Timer1 .............................................................................. 155 16-Bit Read/Write Mode ........................................... 157 Associated Registers ............................................... 159 Interrupt .................................................................... 158 Low-Power Option ................................................... 157 Operation ................................................................. 156 Oscillator .......................................................... 155, 157 Oscillator Layout Considerations ............................. 158 Overflow Interrupt .................................................... 155 Resetting, Using a Special Event Trigger Output (CCP) ................................................... 158 TMR1H Register ...................................................... 155 TMR1L Register ....................................................... 155 Use as a Real-Time Clock ....................................... 158 Using as a Clock Source .......................................... 157 Timer2 .............................................................................. 161 Associated Registers ............................................... 162 Interrupt .................................................................... 162 Operation ................................................................. 161 Output ...................................................................... 162 PR2 Register ............................................................ 173 TMR2 to PR2 Match Interrupt .................................. 173 Timer3 .............................................................................. 163 16-Bit Read/Write Mode ........................................... 165 Associated Registers ............................................... 165 Operation ................................................................. 164 Oscillator .......................................................... 163, 165 Overflow Interrupt ............................................ 163, 165 Special Event Trigger (CCP) .................................... 165 TMR3H Register ...................................................... 163 TMR3L Register ....................................................... 163 Timing Diagrams A/D Conversion ........................................................ 388 Acknowledge Sequence .......................................... 210 Asynchronous Reception ................................. 230, 249 Asynchronous Transmission ............................ 227, 247 Asynchronous Transmission (Back to Back) ......................................... 227, 247 Automatic Baud Rate Calculation ............................ 225 Auto-Wake-up Bit (WUE) During Normal Operation ............................................ 233 Auto-Wake-up Bit (WUE) During Sleep ................... 233 Baud Rate Generator with Clock Arbitration ............ 204 BRG Overflow Sequence ......................................... 225 BRG Reset Due to SDA Arbitration During Start Condition ................................................. 213 Brown-out Reset (BOR) ........................................... 375 Bus Collision During a Repeated Start Condition (Case 1) ........................................... 214 Bus Collision During a Repeated Start Condition (Case 2) ........................................... 214 Bus Collision During a Start Condition (SCL = 0) ......................................... 213 Bus Collision During a Start Condition (SDA Only) ...................................... 212 Bus Collision During a Stop Condition (Case 1) ...... 215 Bus Collision During a Stop Condition (Case 2) ...... 215  2010 Microchip Technology Inc. Bus Collision for Transmit and Acknowledge .......... 211 Capture/Compare/PWM (All CCP Modules) ............ 377 CLKO and I/O .......................................................... 372 Clock Synchronization ............................................. 197 Clock/Instruction Cycle .............................................. 73 Example SPI Master Mode (CKE = 0) ..................... 378 Example SPI Master Mode (CKE = 1) ..................... 379 Example SPI Slave Mode (CKE = 0) ....................... 380 Example SPI Slave Mode (CKE = 1) ....................... 381 External Clock (All Modes Except PLL) ................... 370 External Memory Bus for SLEEP (16-Bit Microprocessor Mode) ..................................... 101 External Memory Bus for SLEEP (8-Bit Microprocessor Mode) ..................................... 104 External Memory Bus for TBLRD (16-Bit Extended Microcontroller Mode) ...................... 100 External Memory Bus for TBLRD (16-Bit Microprocessor Mode) ..................................... 100 External Memory Bus for TBLRD (8-Bit Extended Microcontroller Mode) ...................... 103 External Memory Bus for TBLRD (8-Bit Microprocessor Mode) ..................................... 103 Fail-Safe Clock Monitor ........................................... 294 High/Low-Voltage Detect (VDIRMAG = 1) ............... 278 High/Low-Voltage Detect Characteristics ................ 367 High/Low-Voltage Detect Operation (VDIRMAG = 0) ............................................... 277 I2C Bus Data ............................................................ 382 I2C Bus Start/Stop Bits ............................................ 382 I2C Master Mode (7 or 10-Bit Transmission) ........... 208 I2C Master Mode (7-Bit Reception) ......................... 209 I2C Master Mode First Start Bit ................................ 205 I2C Slave Mode (10-Bit Reception, SEN = 0) .......... 194 I2C Slave Mode (10-Bit Reception, SEN = 1) .......... 199 I2C Slave Mode (10-Bit Transmission) .................... 195 I2C Slave Mode (7-bit Reception, SEN = 0) ............ 192 I2C Slave Mode (7-Bit Reception, SEN = 1) ............ 198 I2C Slave Mode (7-Bit Transmission) ...................... 193 I2C Slave Mode General Call Address Sequence (7 or 10-Bit Address Mode) ............ 200 I2C Stop Condition Receive or Transmit Mode ........ 210 Master SSP I2C Bus Data ....................................... 384 Master SSP I2C Bus Start/Stop Bits ........................ 384 Parallel Slave Port (PSP) Read ............................... 150 Parallel Slave Port (PSP) Write ............................... 149 Program Memory Read ........................................... 373 Program Memory Write ........................................... 374 PWM Output ............................................................ 173 Repeated Start Condition ........................................ 206 Reset, Watchdog Timer (WDT), Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) ..... 375 Send Break Character Sequence ............................ 234 Slave Synchronization ............................................. 183 Slow Rise Time (MCLR Tied to VDD, VDD Rise > TPWRT) ............................................ 61 SPI Mode (Master Mode) ........................................ 182 SPI Mode (Slave Mode, CKE = 0) ........................... 184 SPI Mode (Slave Mode, CKE = 1) ........................... 184 Synchronous Reception (Master Mode, SREN) ..................................................... 237, 252 Synchronous Transmission ............................. 235, 250 Synchronous Transmission (Through TXEN) ...................................... 236, 251 Time-out Sequence on POR w/PLL Enabled (MCLR Tied to VDD) .......................................... 61 DS39635C-page 407 PIC18F6310/6410/8310/8410 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 1) ....................... 60 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 2) ....................... 60 Time-out Sequence on Power-up (MCLR Tied to VDD, VDD Rise TPWRT) .............. 60 Timer0 and Timer1 External Clock .......................... 376 Transition for Entry to PRI_IDLE Mode ...................... 51 Transition for Entry to SEC_RUN Mode .................... 47 Transition for Entry to Sleep Mode ............................ 50 Transition for Two-Speed Start-up (INTOSC to HSPLL) ......................................... 292 Transition for Wake From Idle to Run Mode .............. 51 Transition for Wake From Sleep (HSPLL) ................. 50 Transition From RC_RUN Mode to PRI_RUN Mode ................................................. 49 Transition From SEC_RUN Mode to PRI_RUN Mode (HSPLL) .................................. 47 Transition to RC_RUN Mode ..................................... 49 USART Synchronous Receive (Master/Slave) ........ 386 USART Synchronous Transmission (Master/Slave) .................................................. 386 Timing Diagrams and Specifications A/D Conversion Requirements ................................ 388 AC Characteristics Internal RC Accuracy ....................................... 371 Capture/Compare/PWM Requirements (All CCP Modules) ........................................... 377 CLKO and I/O Requirements ................................... 372 Example SPI Mode Requirements (Master Mode, CKE = 0) .................................. 378 Example SPI Mode Requirements (Master Mode, CKE = 1) .................................. 379 Example SPI Mode Requirements (Slave Mode, CKE = 0) .................................... 380 Example SPI Slave Mode Requirements (CKE = 1) .................................. 381 External Clock Requirements .................................. 370 I2C Bus Data Requirements (Slave Mode) .............. 383 I2C Bus Start/Stop Bits Requirements (Slave Mode) .................................................... 382 DS39635C-page 408 Master SSP I2C Bus Data Requirements ................ 385 Master SSP I2C Bus Start/Stop Bits Requirements .................................................. 384 PLL Clock ................................................................ 371 Program Memory Read Requirements .................... 373 Program Memory Write Requirements .................... 374 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ........................................ 375 Timer0 and Timer1 External Clock Requirements .................................................. 376 USART Synchronous Receive Requirements ......... 386 USART Synchronous Transmission Requirements .................................................. 386 Top-of-Stack Access .......................................................... 70 TRISE Register PSPMODE Bit .......................................................... 148 TSTFSZ ........................................................................... 337 Two-Speed Start-up ................................................. 281, 292 Two-Word Instructions Example Cases .......................................................... 74 TXSTA1 Register BRGH Bit ................................................................. 221 TXSTA2 Register BRGH Bit ................................................................. 244 V Voltage Reference Specifications .................................... 366 W Watchdog Timer (WDT) ........................................... 281, 290 Associated Registers ............................................... 291 Control Register ....................................................... 290 During Oscillator Failure .......................................... 293 Programming Considerations .................................. 290 WCOL ...................................................... 205, 206, 207, 210 WCOL Status Flag ................................... 205, 206, 207, 210 WWW Address ................................................................ 409 WWW, On-Line Support ...................................................... 7 X XORLW ............................................................................ 337 XORWF ........................................................................... 338  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2010 Microchip Technology Inc. DS39635C-page 409 PIC18F6310/6410/8310/8410 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: PIC18F6310/6410/8310/8410 Literature Number: DS39635C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS39635C-page 410  2010 Microchip Technology Inc. PIC18F6310/6410/8310/8410 PIC18F6310/6410/8310/8410 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Device Temperature Range Package Pattern Examples: a) b) Device PIC18F6310/6410/8310/8410(1), PIC18F6310/6410/8310/8410T(2); VDD range 4.2V to 5.5V PIC18LF6310/6410/8310/8410(1), PIC18LF6310/6410/8310/8410T(2); VDD range 2.0V to 5.5V Temperature Range I E Package = = PT = c) PIC18LF6410-I/PT 301 = Industrial temp., TQFP package, Extended VDD limits, QTP pattern #301. PIC18F8410-I/PT = Industrial temp., TQFP package, normal VDD limits. PIC18F8410-E/PT = Extended temp., TQFP package, normal VDD limits. -40C to +85C (Industrial) -40C to +125C (Extended) TQFP (Thin Quad Flatpack) Note 1: Pattern QTP, SQTP, Code or Special Requirements (blank otherwise)  2010 Microchip Technology Inc. 2: F = Standard Voltage Range LF = Wide Voltage Range T = in tape and reel DS39635C-page 411 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7830 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 08/04/10 DS39635C-page 412  2010 Microchip Technology Inc.
PIC18F8310T-I/PT 价格&库存

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