PIC18LF2431-I/MM

Product Change Notification - JAON-08RMMS268 - 25 Nov 2016 - CCB 2697.001/.002/... Page 1 of 3  Search ... PRODUCTS | APPLICATIONS | DESIGN SUPPORT | TRAINING | SAMPLE AND BUY | ABOUT US | CONTACT US | myMicrochip Login Product Change Notification - JAON-08RMMS268   Date: 25 Nov 2016 Product Category: Touch Sensing Technologies; 16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers Notification subject: CCB 2697.001/.002/.003/.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at Notification text: MTAI site. PCN Status: Final notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls). Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S (6x6mm), 28L QFN (6x6mm), 20L QFN (4x4mm), 16L QFN (4x4mm) and 16L QFN (3x3mm) packages at MTAI assembly site. Pre Change: Using gold (Au) bond wire Post Change: Using gold (Au) bond wire or palladium coated copper with gold flash (CuPdAu) bond wire Pre and Post Change Summary: Pre Change Post Change Assembly Site MTAI assembly site MTAI assembly site Wire material Au wire Au wire or CuPdAu wire Die attach material 3280 3280 Molding compound material G700LTD G700LTD Lead frame material C194 C194 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve manufacturability and qualify Palladium coated copper with gold flash (CuPdAu) bond wire http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-08RMMS... 11/28/2016 Product Change Notification - JAON-08RMMS268 - 25 Nov 2016 - CCB 2697.001/.002/... Page 2 of 3 Change Implementation Status: In Progress Estimated First Ship Date: January 25, 2017 (Date code: 1704) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Time Table Summary: November 2016 July 2016 -> Workweek 27 28 29 30 Initial PCN Issue Date January 2017 -> 44 45 46 47 1 2 3 4 X Qual Report Availability X Final PCN Issue Date X Estimated Implementation Date X Method to Identify Change: Traceability code Qualification Report: Please open the attachments included with this PCN labeled as PCN_#_Qual Report. Revision History: November 25, 2016: Issued final notification. The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-08RMMS268_Qual Report.pdf PCN_JAON-08RMMS268_Affected CPN.pdf PCN_JAON-08RMMS268_Affected CPN.xls Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from the left navigation bar. To opt out of future offer or information emails (other than product change notification emails), click here to go to microchipDIRECT and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services." http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-08RMMS... 11/28/2016 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR AR1010-I/ML AR1010T-I/ML AR1011-I/ML AR1011T-I/ML AR1020-I/ML AR1020T-I/ML AR1021-I/ML AR1021T-I/ML DSPIC30F1010-20E/MM DSPIC30F1010-30I/MM DSPIC30F2010-20E/MM DSPIC30F2010-20I/MM DSPIC30F2010-30I/MM DSPIC30F2010T-20E/MM DSPIC30F2010T-20I/MM DSPIC30F2010T-30I/MM DSPIC30F2010T-30V/MMA31 DSPIC30F2011-20E/ML DSPIC30F2011-20I/ML DSPIC30F2011-30I/ML DSPIC30F2012-20E/ML DSPIC30F2012-20I/ML DSPIC30F2012-30I/ML DSPIC30F2012T-30I/ML DSPIC30F2020-20E/MM DSPIC30F2020-30I/MM DSPIC30F2020T-30I/MM MCP23016-I/ML MCP23016T-I/ML MCP23017-E/ML MCP23017T-E/ML MCP23S17-E/ML MCP23S17T-E/ML MCP4231-103E/ML MCP4231-104E/ML MCP4231-502E/ML MCP4231-503E/ML MCP4231T-103E/ML MCP4231T-104E/ML MCP4231T-502E/ML MCP4231T-503E/ML MCP4241-103E/ML MCP4241-104E/ML Page 1 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR MCP4241-502E/ML MCP4241-503E/ML MCP4241T-103E/ML MCP4241T-104E/ML MCP4241T-502E/ML MCP4241T-503E/ML MCP4251-103E/ML MCP4251-104E/ML MCP4251-502E/ML MCP4251-503E/ML MCP4251T-103E/ML MCP4251T-104E/ML MCP4251T-502E/ML MCP4251T-503E/ML MCP4261-103E/ML MCP4261-104E/ML MCP4261-502E/ML MCP4261-503E/ML MCP4261T-103E/ML MCP4261T-104E/ML MCP4261T-502E/ML MCP4261T-503E/ML MCP4331-103E/ML MCP4331-104E/ML MCP4331-502E/ML MCP4331-503E/ML MCP4331T-103E/ML MCP4331T-104E/ML MCP4331T-502E/ML MCP4331T-503E/ML MCP4341-103E/ML MCP4341-104E/ML MCP4341-502E/ML MCP4341-503E/ML MCP4341T-103E/ML MCP4341T-104E/ML MCP4341T-502E/ML MCP4341T-503E/ML MCP4351-103E/ML MCP4351-104E/ML MCP4351-502E/ML MCP4351-503E/ML MCP4351T-103E/ML Page 2 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR MCP4351T-104E/ML MCP4351T-502E/ML MCP4351T-503E/ML MCP4361-103E/ML MCP4361-104E/ML MCP4361-502E/ML MCP4361-503E/ML MCP4361T-103E/ML MCP4361T-104E/ML MCP4361T-502E/ML MCP4361T-503E/ML MCP4431-103E/ML MCP4431-104E/ML MCP4431-502E/ML MCP4431-503E/ML MCP4431T-103E/ML MCP4431T-104E/ML MCP4431T-502E/ML MCP4431T-503E/ML MCP4441-103E/ML MCP4441-104E/ML MCP4441-502E/ML MCP4441-503E/ML MCP4441T-103E/ML MCP4441T-104E/ML MCP4441T-502E/ML MCP4441T-503E/ML MCP4451-103E/ML MCP4451-104E/ML MCP4451-502E/ML MCP4451-503E/ML MCP4451T-103E/ML MCP4451T-104E/ML MCP4451T-502E/ML MCP4451T-503E/ML MCP4461-103E/ML MCP4461-104E/ML MCP4461-502E/ML MCP4461-503E/ML MCP4461T-103E/ML MCP4461T-104E/ML MCP4461T-502E/ML MCP4461T-503E/ML Page 3 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR MCP4631T-103E/ML MCP4631T-104E/ML MCP4631T-502E/ML MCP4631T-503E/ML MCP4641T-103E/ML MCP4641T-104E/ML MCP4641T-502E/ML MCP4641T-503E/ML MCP4651T-103E/ML MCP4651T-104E/ML MCP4651T-502E/ML MCP4651T-503E/ML MCP4661T-103E/ML MCP4661T-104E/ML MCP4661T-104QE/ML MCP4661T-502E/ML MCP4661T-503E/ML MCP4661T-503QE/ML PIC16F505-E/MG PIC16F505-I/MG PIC16F505T-E/MG PIC16F505T-I/MG PIC16F506-E/MG PIC16F506-I/MG PIC16F506T-E/MG PIC16F506T-I/MG PIC16F526-E/MG PIC16F526-I/MG PIC16F526T-I/MG PIC16F527-E/ML PIC16F527-I/ML PIC16F527T-I/ML PIC16F570-E/ML PIC16F570-I/ML PIC16F570T-I/ML PIC16F610-E/ML PIC16F610-I/ML PIC16F610T-E/ML PIC16F610T-I/ML PIC16F616-E/ML PIC16F616-H/ML PIC16F616-I/ML PIC16F616T-E/ML Page 4 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC16F616T-E/MLC07 PIC16F616T-I/ML PIC16F616T-I/ML034 PIC16F616T-I/ML042 PIC16F616T-I/ML066 PIC16F627A-E/ML PIC16F627A-I/ML PIC16F627AT-I/ML PIC16F628A-E/ML PIC16F628A-I/ML PIC16F628AT-E/ML PIC16F628AT-I/ML PIC16F630-E/ML PIC16F630-I/ML PIC16F630T-I/ML PIC16F630T-I/ML079 PIC16F631-E/ML PIC16F631-I/ML PIC16F631T-I/ML PIC16F636-I/ML PIC16F636T-I/ML PIC16F636T-I/ML037 PIC16F648A-E/ML PIC16F648A-I/ML PIC16F648AT-E/ML PIC16F648AT-I/ML PIC16F676-E/ML PIC16F676-I/ML PIC16F676T-I/ML PIC16F677-E/ML PIC16F677-I/ML PIC16F677T-I/ML PIC16F677T-I/ML035 PIC16F677T-I/ML037 PIC16F684-E/ML PIC16F684-I/ML PIC16F684T-I/ML PIC16F684T-I/ML065 PIC16F684T-I/ML070 PIC16F685-E/ML PIC16F685-I/ML PIC16F685T-E/ML PIC16F685T-I/ML Page 5 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC16F687-E/ML PIC16F687-E/ML034 PIC16F687-I/ML PIC16F687T-E/ML PIC16F687T-I/ML PIC16F688-E/ML PIC16F688-I/ML PIC16F688T-I/ML PIC16F688T-I/MLAPL PIC16F689-E/ML PIC16F689-I/ML PIC16F689T-E/ML PIC16F689T-I/ML PIC16F690-E/ML PIC16F690-I/ML PIC16F690T-E/ML PIC16F690T-I/ML PIC16F690T-I/MLC12 PIC16F72-E/ML PIC16F72-I/ML PIC16F72T-I/ML PIC16F737-E/ML PIC16F737-I/ML PIC16F737T-I/ML PIC16F73-E/ML PIC16F73-I/ML PIC16F73T-I/ML PIC16F753-E/ML PIC16F753-I/ML PIC16F753T-I/ML PIC16F767-E/ML PIC16F767-I/ML PIC16F767T-E/ML PIC16F767T-I/ML PIC16F76-I/ML PIC16F76T-I/ML PIC16F785-E/ML PIC16F785-I/ML PIC16F785-I/MLC15 PIC16F785T-E/ML PIC16F785T-I/ML PIC16F785T-I/ML045 PIC16F785T-I/ML047 Page 6 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC16F785T-I/MLC15 PIC16F818-E/ML PIC16F818-I/ML PIC16F818T-I/ML PIC16F819-E/ML PIC16F819-I/ML PIC16F819T-E/ML PIC16F819T-I/ML PIC16F873A-E/ML PIC16F873A-I/ML PIC16F873AT-I/ML PIC16F876A-E/ML PIC16F876A-I/ML PIC16F876AT-E/ML PIC16F876AT-I/ML PIC16F87-I/ML PIC16F882-E/ML PIC16F882-I/ML PIC16F882T-I/ML PIC16F883-E/ML PIC16F883-I/ML PIC16F883T-E/ML PIC16F883T-I/ML PIC16F883T-I/ML031 PIC16F886-E/ML PIC16F886-I/ML PIC16F886T-E/ML PIC16F886T-I/ML PIC16F886T-I/MLC06 PIC16F88-E/ML PIC16F88-I/ML PIC16F88T-I/ML PIC16F913-E/ML PIC16F913-I/ML PIC16F913T-I/ML PIC16F916-E/ML PIC16F916-I/ML PIC16F916T-I/ML PIC16F916T-I/MLC02 PIC16HV610-E/ML PIC16HV610-I/ML PIC16HV610T-I/ML PIC16HV616-E/ML Page 7 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC16HV616-I/ML PIC16HV616T-E/ML PIC16HV616T-I/ML PIC16HV753-E/ML PIC16HV753-I/ML PIC16HV753T-I/ML PIC16HV785-E/ML PIC16HV785-I/ML PIC16HV785T-E/ML PIC16HV785T-I/ML PIC16LF627A-I/ML PIC16LF627AT-I/ML PIC16LF628A-I/ML PIC16LF628AT-I/ML PIC16LF648A-I/ML PIC16LF648AT-I/ML PIC16LF72-I/ML PIC16LF72-I/ML026 PIC16LF72T-I/ML PIC16LF737-I/ML PIC16LF73-I/ML PIC16LF73T-I/ML PIC16LF767-I/ML PIC16LF767T-I/ML PIC16LF76-I/ML PIC16LF76T-I/ML057 PIC16LF818-I/ML PIC16LF818T-I/ML PIC16LF819-I/ML PIC16LF819T-I/ML PIC16LF873A-I/ML PIC16LF873AT-I/ML PIC16LF876A-I/ML PIC16LF876AT-I/ML PIC16LF87-I/ML PIC16LF88-I/ML PIC16LF88T-I/ML PIC18F1220-E/ML PIC18F1220-H/ML PIC18F1220-I/ML PIC18F1220T-I/ML PIC18F1230-E/ML PIC18F1230-I/ML Page 8 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC18F1230-I/MLXXX PIC18F1320-E/ML PIC18F1320-H/ML PIC18F1320-I/ML PIC18F1320T-I/ML PIC18F1330-E/ML PIC18F1330-I/ML PIC18F1330-I/MLXXX PIC18F1330-ICD/ML PIC18F2221-E/ML PIC18F2221-I/ML PIC18F2221T-I/ML PIC18F2321-E/ML PIC18F2321-I/ML PIC18F2331-E/MM PIC18F2331-I/MM PIC18F2331T-I/MM PIC18F2410-E/ML PIC18F2410-I/ML PIC18F2420-E/ML PIC18F2420-I/ML PIC18F2420T-E/ML PIC18F2420T-I/ML PIC18F2423-E/ML PIC18F2423-I/ML PIC18F2423T-I/ML PIC18F2431-E/MM PIC18F2431-I/MM PIC18F2431T-E/MM PIC18F2431T-I/MM PIC18F2450-I/ML PIC18F2450T-I/ML PIC18F2480-E/ML PIC18F2480-I/ML PIC18F2480-I/MLC01 PIC18F2480T-E/ML PIC18F2480T-I/ML PIC18F2510-E/ML PIC18F2510-I/ML PIC18F2510T-E/ML PIC18F2510T-I/ML PIC18F2520-E/ML PIC18F2520-I/ML Page 9 of 10 JAON-08RMMS268 - CCB 2697.001-.004 Final Notice: Qualification of CuPdAu wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S, 28L, 20L, and 16L QFN packages at MTAI site. Affected Catalog Part Numbers (CPN) PCN_JAON-08RMMS268 CATALOG_PART_NBR PIC18F2520T-I/ML PIC18F2523-E/ML PIC18F2523-I/ML PIC18F2523T-I/ML PIC18F2580-E/ML PIC18F2580-I/ML PIC18F2580T-E/ML PIC18F2580T-I/ML PIC18LF1220-I/ML PIC18LF1230-I/ML PIC18LF1320-I/ML PIC18LF1320T-I/ML PIC18LF1330-I/ML PIC18LF2221-I/ML PIC18LF2321-I/ML PIC18LF2321T-I/ML PIC18LF2331-I/MM PIC18LF2331T-I/MM PIC18LF2410-I/ML PIC18LF2410T-I/ML PIC18LF2420-I/ML PIC18LF2420T-I/ML PIC18LF2420T-I/ML025 PIC18LF2423-I/ML PIC18LF2423T-I/ML PIC18LF2431-I/MM PIC18LF2431T-I/MM PIC18LF2450-I/ML PIC18LF2450T-I/ML206 PIC18LF2480-I/ML PIC18LF2480T-I/ML PIC18LF2510-I/ML PIC18LF2510T-I/ML PIC18LF2520-I/ML PIC18LF2520T-I/ML PIC18LF2523-I/ML PIC18LF2523T-I/ML PIC18LF2580-I/ML Page 10 of 10