PIC18F24/25K42
28-Pin, Low-Power High-Performance High-Temperature Microcontrollers
Description
The PIC18F24/25K42 microcontrollers are available in 28-pin devices. These devices feature a 12-bit ADC with
Computation (ADC2) automating Capacitive Voltage Divider (CVD) techniques for advanced touch sensing, averaging,
filtering, oversampling and threshold comparison, Temperature Sensor, Vectored Interrupt Controller with fixed latency
for handling interrupts, System Bus Arbiter, Direct Memory Access capabilities, UART with support for Asynchronous,
DMX, DALI and LIN transmissions, SPI, I2C, memory features like Memory Access Partition (MAP) to support
customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory
calibration values to help improve temperature sensor accuracy.
Core Features
Memory
• C Compiler Optimized RISC Architecture
• Operating Speed:
- Up to 64 MHz clock input
- 62.5 ns minimum instruction cycle
• Two Direct Memory Access (DMA) Controllers:
- Data transfers to SFR/GPR spaces from
either Program Flash Memory, Data
EEPROM or SFR/GPR spaces
- User-programmable source and destination
sizes
- Hardware and software-triggered data
transfers
• System Bus Arbiter with User-Configurable
Priorities for Scanner and DMA1/DMA2 with
Respect to the Main Line and Interrupt Execution
• Vectored Interrupt Capability:
- Selectable high/low priority
- Fixed interrupt latency
- Programmable vector table base address
• 31-Level Deep Hardware Stack
• Low-Current Power-on Reset (POR)
• Configurable Power-up Timer (PWRT)
• Brown-out Reset (BOR)
• Low-Power BOR (LPBOR) Option
• Windowed Watchdog Timer (WWDT):
- Variable prescaler selection
- Variable window size selection
- Configurable in hardware or software
•
•
•
•
2020 Microchip Technology Inc.
Up to 128 KB Flash Program Memory
Up to 8 KB Data SRAM Memory
Up to 1 KB Data EEPROM
Memory Access Partition (MAP):
- Configurable boot and app region sizes with
individual write-protections
• Programmable Code Protection
• Device Information Area (DIA) stores:
- Unique IDs and Device IDs
- Temp Sensor factory-calibrated data
- Fixed Voltage Reference calibrated data
• Device Configuration Information (DCI) Stores:
- Erase row size
- Number of write latches per row
- Number of user rows
- Data EEPROM memory size
- Pin count
Operating Characteristics
• Operating Voltage Range:
- 2.7V to 5.5V
• Temperature Range:
- High-Temp: -40°C to 150°C
Power-Saving Functionality
• Doze mode: Ability to run CPU core slower than
the system clock
• Idle mode: Ability to halt CPU core while internal
peripherals continue operating
• Sleep mode: Lowest power consumption
• Peripheral Module Disable (PMD):
- Ability to disable unused peripherals to
minimize power consumption
DS40002113A-page 1
PIC18F24/25K42
Digital Peripherals
• Three 8-Bit Timers (TMR2/4/6) with Hardware
Limit Timer (HLT):
- Hardware monitoring and Fault detection
• Four 16-Bit Timers (TMR0/1/3/5)
• Four Configurable Logic Cell (CLC):
- Integrated combinational and sequential logic
• Three Complementary Waveform Generators
(CWGs):
- Rising and falling edge dead-band control
- Full-bridge, half-bridge, 1-channel drive
- Multiple signal sources
- Programmable dead band
- Fault-shutdown input
• Four Capture/Compare/PWM (CCP) Modules
• Four 10-Bit Pulse-Width Modulators (PWMs)
• Numerically Controlled Oscillator (NCO):
- Generates true linear frequency control
- High resolution using 20-bit accumulator and
20-bit increment values
• DSM: Data Signal Modulator:
- Multiplex two carrier clocks, with glitch
prevention feature
- Multiple sources for each carrier
• Programmable CRC with Memory Scan:
- Reliable data/program memory monitoring for
fail-safe operation (e.g., Class B)
- Calculate CRC over any portion of program
memory or data EEPROM
• Two UART Modules:
- Modules are asynchronous and compatible
with RS-232 and RS-485
- One of the UART modules supports LIN
master and slave, DMX-512 mode, DALI
gear and device protocols
- Automatic and user-timed BREAK period
generation
- DMA compatible
- Automatic checksums
- Programmable 1, 1.5, and 2 Stop bits
- Wake-up on BREAK reception
• One SPI Module:
- Configurable length bytes
- Configurable length data packets
- Receive-without-transmit option
- Transmit-without-receive option
- Transfer byte counter
- Separate transmit and receive buffers with 2byte FIFO and DMA capabilities
2020 Microchip Technology Inc.
• Two I2C Modules, SMBus, PMBus™ Compatible:
- Supports Standard-mode (100 kHz), Fastmode (400 kHz) and Fast-mode plus (1 MHz)
modes of operation
- Dedicated address, transmit and receive
buffers
- Bus collision detection with arbitration
- Bus time-out detection and handling
- Multi-Master mode
- Separate transmit and receive buffers with 2byte FIFO and DMA capabilities
- I2C, SMBus 2.0 and SMBus 3.0, and 1.8V
input level selections
• Device I/O Port Features:
- 24 I/O pins
- One input-only pin (RE3)
- Individually programmable I/O direction,
open-drain, slew rate, weak pull-up control
- Interrupt-on-change (on up to 25 I/O pins)
- Three external interrupt pins
• Peripheral Pin Select (PPS):
- Enables pin mapping of digital I/O
• Signal Measurement Timer (SMT):
- 24-bit timer/counter with prescaler
DS40002113A-page 2
PIC18F24/25K42
Analog Peripherals
Flexible Oscillator Structure
• Analog-to-Digital Converter with Computation
(ADC2):
- 12-bit with up to 35 external channels
- Automated post-processing
- Automated math functions on input signals:
averaging, filter calculations, oversampling
and threshold comparison
- Operates in Sleep
- Integrated charge pump for improved lowvoltage operation
• Hardware Capacitive Voltage Divider (CVD):
- Automates touch sampling and reduces
software size and CPU usage when touch or
proximity sensing is required
- Adjustable sample and hold capacitor array
- Two guard ring output drives
• Temperature Sensor:
- Internal connection to ADC
- Can be calibrated for improved accuracy
• Two Comparators:
- Low-Power/High-Speed mode
- Fixed Voltage Reference at noninverting
input(s)
- Comparator outputs externally accessible
• 5-Bit Digital-to-Analog Converter (DAC):
- 5-bit resolution, rail-to-rail
- Positive Reference Selection
- Unbuffered I/O pin output
- Internal connections to ADCs and
comparators
• Voltage Reference:
- Fixed Voltage Reference with 1.024V, 2.048V
and 4.096V output levels
• High-Precision Internal Oscillator:
- Selectable frequency range up to 64 MHz
- ±1% at calibration (nominal)
• Low-Power Internal 32 kHz Oscillator
(LFINTOSC)
• External 32 kHz Crystal Oscillator (SOSC)
• External Oscillator Block with:
- x4 PLL with external sources
- Three crystal/resonator modes up to 20 MHz
- Three external clock modes up to 20 MHz
• Fail-Safe Clock Monitor
• Oscillator Start-up Timer (OST):
- Ensures stability of crystal oscillator sources
2020 Microchip Technology Inc.
Note:
This document is supplemented by the
“PIC18(L)F24/25K42 Low-Power High
Performance Microcontrollers with XLP"
Data
Sheet
(DS40001869).
See
Section 1.0, Device Overview.
DS40002113A-page 3
Data Sheet Index
Program Flash Memory (KB)
Data EEPROM (B)
Data SRAM (bytes)
I/O Pins
12-Bit ADC2
(ch)
5-Bit DAC
Comparator
8-Bit/ (with HLT) /16-Bit Timer
Window Watchdog Timer
(WWDT)
Signal Measurement Timer
(SMT)
CCP/10-Bit PWM
CWG
NCO
CLC
Zero-Cross Detect
Direct Memory Access (DMA)
(ch)
Memory Access Partition
Vectored Interrupts
UART
I2C/SPI
Peripheral Pin Select
Peripheral Module Disable
Debug (1)
2020 Microchip Technology Inc.
PIC18(L)F24/25K42 FAMILY TYPES
PIC18(L)F24K42
A
16
256
1024
25
24
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F25K42
A
32
256
2048
25
24
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F26K42
B
64
1024
4096
25
24
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F27K42
B
128
1024
8192
25
24
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F45K42
B
32
256
2048
36
35
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F46K42
B
64
1024
4096
36
35
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F47K42
B
128
1024
8192
36
35
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F55K42
B
32
256
2048
44
43
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F56K42
B
64
1024
4096
44
43
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
PIC18(L)F57K42
B
128
1024
8192
44
43
1
2
3/4
Y
Y
4/4
3
1
4
Y
2
Y
Y
2
2/1
Y
Y
I
Device
Note 1:
I – Debugging integrated on chip.
Unshaded devices are described in this document.
DS40002113A-page 4
Note:
A:
DS40001869
PIC18(L)F24/25K42 Data Sheet, 28-Pin
B:
DS40001919
PIC18(L)F26/27/45/46/47/55/56/57K42 Data Sheet, 28/40/44/48-Pin
For other small form-factor package availability and marking information, visit
http://www.microchip.com/packaging or contact your local sales office.
PIC18F24/25K42
Data Sheet Index:
PIC18F24/25K42
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Electrical Characteristics .............................................................................................................................................................. 8
Appendix A: Revision History............................................................................................................................................................... 14
The Microchip WebSite ........................................................................................................................................................................ 15
Customer Change Notification Service ................................................................................................................................................ 15
Customer Support ................................................................................................................................................................................ 15
Product Identification System .............................................................................................................................................................. 16
2020 Microchip Technology Inc.
DS40002113A-page 5
PIC18F24/25K42
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Website; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our website at www.microchip.com to receive the most current information on all of our products.
2020 Microchip Technology Inc.
DS40002113A-page 6
PIC18F24/25K42
1.0
DEVICE OVERVIEW
This document contains device-specific information for
the following devices, operating in an ambient
temperature range between -40°C and 150°C:
• PIC18F24K42
Note:
• PIC18F25K42
This data sheet documents only the
devices’ features and specifications that
are in addition to the features and
specifications of the non-specialty
PIC18(L)F24/25K42
devices.
For
information on the features and
specifications shared by this document’s
high-temperature devices and the nonspecialty devices, see the “PIC18(L)F24/
25K42
28-Pin,
Low-Power
High
Performance Microcontrollers with XLP
Technology” Data Sheet (DS40001869).
The PIC18F24/25K42 devices offer the advantages
of all PIC18 microcontrollers, namely high
computational performance at an economical price,
with the addition of high-endurance Program Flash
Memory,
Universal Asynchronous
Receiver
Transmitter (UART), Serial Peripheral Interface
(SPI), Inter-integrated Circuit (I 2C), Direct Memory
Access (DMA), Configurable Logic Cells (CLC),
Signal Measurement Timer (SMT), Numerically
Controlled Oscillator (NCO), and Analog-to-Digital
Converter with Computation (ADC2).
2020 Microchip Technology Inc.
The primary differentiating features and specifications
of the high-temperature PIC18F24/25K42 devices are:
• Above 125°C, the number of program Flash
memory and EEPROM programming cycles are
significantly reduced (see Section 2.0 “Electrical
Characteristics”)
• All AC timing specifications are increased by 30%
This derating factor includes parameters, such as
TPWRT
• Maximum HS+PLL frequency of operation (See
Table 2-1)
Note 1: The test duration for AEC-Q100 reliability
testing for devices operating at 150°C is
1,000 hours. Any design operating at
125°C to 150°C for longer than that
period is not warranted without prior written approval from Microchip Technology
Inc.
2: Writes are not allowed for Flash program
memory above 125°C.
3: The low voltage versions of these
devices, PIC18LF24/25K42, are not
released for operation above +125°C.
4: Errata Sheet DS80000724 lists various
mask revisions. 150°C operation applies
only to revisions A4 and later.
DS40002113A-page 7
PIC18F24/25K42
2.0
ELECTRICAL CHARACTERISTICS
Note: Other than some basic data, this section documents only the high-temperature PIC18F24/25K42 devices’
specifications that differ from those of the non-specialty PIC18F24/25K42 devices. For detailed information on
the electrical specifications shared by the high-temperature and non-specialty devices, see the “PIC18(L)F24/
25K42 28-Pin, Low-Power High Performance Microcontrollers with XLP Technology” Data Sheet
(DS40001869).
Absolute Maximum Ratings(†)
2.1
Ambient temperature under bias ...................................................................................................... -40°C to +150°C
Storage temperature ........................................................................................................................ -65°C to +155°C
Maximum junction temperature ........................................................................................................................ 155°C
Voltage on pins with respect to VSS
on VDD pin
PIC18F24/25K42 ....................................................................................................................... -0.3V to +6.5V
on MCLR pin .......................................................................................................................... -0.3V to + 9.0V
on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V)
Maximum current
on VSS pin(1)
-40°C TA +85°C .............................................................................................................. 350 mA
85°C TA +125°C ............................................................................................................. 120 mA
125°C TA +150°C ............................................................................................................. 24 mA
on
VDD pin(1)
-40°C TA +85°C .............................................................................................................. 250 mA
85°C TA +125°C ............................................................................................................... 85 mA
125°C TA +150°C ............................................................................................................. 24 mA
on any I/O pin ........................................................................................................................................... 5 mA
Clamp current, IK (VPIN < VSS or VPIN > VDD) ............................................................................................... 20 mA
Total power dissipation(2)................................................................................................................................ 800 mW
Note 1:
2:
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Table XX-Y to calculate device
specifications.
Power dissipation is calculated as follows:
PDIS = VDD x {IDD - IOH} + VDD - VOH) x IOH} + VOL x IOL
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
2020 Microchip Technology Inc.
DS40002113A-page 8
PIC18F24/25K42
2.2
Standard Operating Conditions
The standard operating conditions for any device are defined as:
Operating Voltage:
Operating Temperature:
VDDMIN VDD VDDMAX
TA_MIN TA TA_MAX
VDD — Operating Supply Voltage(1)
PIC18F24/25K42
VDDMIN (Fosc 32 MHz).......................................................................................................... +2.7V
VDDMIN (Fosc > 32 MHz).......................................................................................................... +3.0V
VDDMAX .................................................................................................................................... +5.5V
TA — Operating Ambient Temperature Range
High Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................. +150°C
Note 1:
2.3
See Parameter Supply Voltage, DC Characteristics: Supply Voltage (High Temperature).
DC Characteristics
TABLE 2-1:
SUPPLY VOLTAGE (HIGH TEMPERATURE)
PIC18F24/25K42
Param
Symbol
No.
Standard Operating Conditions (unless otherwise stated)
Characteristic
Min.
+150°C
Typ.†
Max.
+150°C
2.7
3.0
—
—
5.5
5.5
Units
Conditions
Supply Voltage
D002
VDD
†
V
FOSC 32 MHz
FOSC 32 MHz
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
FIGURE 2-1:
VOLTAGE-FREQUENCY GRAPH, -40°C TA +150°C
64 MHz
VDD (V)
5.5V
3.0V
2.7V
0
32 MHz
4
8
16
32
64
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2020 Microchip Technology Inc.
DS40002113A-page 9
PIC18F24/25K42
TABLE 2-2:
DC CHARACTERISTICS: SUPPLY CURRENT (IDD)(1,2)
Standard Operating Conditions (unless otherwise stated)
PIC18F24/25K42
Param
No.
Symbol
Device Characteristic
Conditions
Max.
+150°C
Units
VDD
D100
IDDXT4
XT = 4 MHz
1400
uA
3.0V
D101
IDDHFO16
HFINTOSC = 16 MHz
4.5
mA
3.0V
D102
IDDHFOPLL
HFINTOSC = 64 MHz
16.3
mA
3.0V
D103
IDDHSPLL64 HS+PLL = 64 MHz
15.3
mA
3.0V
D104
IDDIDLE
3.5
mA
3.0V
Note 1:
Idle mode, HFINTOSC = 16 MHz
The test conditions for all IDD measurements in Active-Operation mode are: OSC1: external square wave, from rail-torail; all I/O pins tri-stated, pulled to VDD; MCLR=VDD; WDT disabled.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
2:
TABLE 2-3:
DC CHARACTERISTICS: POWER-DOWN CURRENTS (IPD)(1,2,3)
Standard Operating Conditions (unless otherwise stated)
VREPGM = 1
PIC18F24/25K42
Param
No.
D200
Notes
Symbol
Device Characteristic
Conditions
Max.
+150°C
Units
39.0
uA
3.0V
VDD
Notes
IPD
IPD Base
71.0
uA
3.0V
D201
IPD_WDT
Low Frequency Internal Oscillator/
WDT
40.0
uA
3.0V
D202
IPD_SOSC
Secondary Oscillator (SOSC)
41.0
uA
3.0V
D203
IPD_FVR
FVR
96.0
uA
3.0V
D204
IPD_BOR
Brown-out Reset (BOR)
48.0
uA
3.0V
D206
IPD_HLVD
High/Low-Voltage Detect (HLVD)
48.0
uA
3.0V
D207
IPD_ADCA
ADC – Non-converting
39.0
uA
3.0V
ADC not converting(4)
D208
IPD_CMP
Comparator
76.0
uA
3.0V
High-powering mode
D200A
Note 1:
2:
3:
4:
VREGPM=0
The peripheral current is the sum of the base IPD and the additional current consumed when this peripheral is enabled.
The peripheral current can be determined by substracting the base IDD or IPD current from this limit. Max. values
should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
All peripheral currents listed are on a per-peripheral basis if more than one instance of a peripheral is available.
ADC clock source is ADCRC.
2020 Microchip Technology Inc.
DS40002113A-page 10
PIC18F24/25K42
TABLE 2-4:
Param.
No.
MEMORY SPECIFICATIONS (150°C)
Sym.
Characteristic
Min.
+150°C
Typ.†
Max.
+150°C
Units
Conditions
1k
—
—
E/W
125°C TA150°C
100
—
—
E/W
125°C TA150°C
Data EEPROM Memory Specifications
MEM20
ED
DataEE Byte Endurance
Program Flash Memory Specifications
MEM30
†
EP
Flash Memory Cell Endurance
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
2020 Microchip Technology Inc.
DS40002113A-page 11
PIC18F24/25K42
2.4
AC Characteristics
TABLE 2-5:
INTERNAL OSCILLATOR PARAMETERS(1)
PIC18F24/25K42
Param
No.
Standard Operating Conditions (unless otherwise stated)
Symbol
Device Characteristic
Min.
+150°C
Typ.†
Max.
+150°C
Units
Conditions
OS50
FHFOSC
Precision Calibrated HFINTOSC
Frequency
—
—
—
—
—
—
4
8
12
16
48
64
—
—
—
—
—
—
MHz
See Figure 3-2
OS51
FHFOSCLP
Low-Power Optimized HFINTOSC
Frequency
0.85
1.70
1
2
1.15
2.30
MHz
-40°C to 150°C
FLFOSC
Internal LFINTOSC Frequency
23.25
31
38.75
kHz
-40°C to 150°C
OS53*
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
FIGURE 3-2:
PRECISION-CALIBRATED HFINTOSC FREQUENCY ACCURACY OVER DEVICE
VDD AND TEMPERATURE
150
± 9%
125
Temperature (°C)
85
60
± 5%
0
-40
1.8
2.0
2.3
2.7
3.5
4.0
4.5
5.0
5.5
VDD (V)
2020 Microchip Technology Inc.
DS40002113A-page 12
PIC18F24/25K42
TABLE 2-6:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,
BROWN-OUT TIMER AND LOW-POWER BROWN-OUT RESET SPECIFICATIONS
PIC18F24/25K42
Param
No.
RST06
Standard Operating Conditions (unless otherwise stated)
Symbol
VBOR
Min.
Max.
Typ.†
Units
+150°C
+150°C
Device Characteristic
Brown-out Reset Voltage
2.56
2.43
2.85
2.7
3.14
2.97
V
Conditions(1)
BORV = 00
BORV = 01
†
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Do not use BORV = 10 and 11 for High-Temperature operation (125°C TA150°C).
TABLE 2-7:
Param.
No.
HLVD01
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
Sym.
Characteristic
Min.
+150°C
Typ.†
Max.
+150°C
Units
VDET
Voltage Detection
2.45
2.75
3.05
V
HLVDSEL[3:0] = 0101
2.58
2.90
3.22
V
HLVDSEL[3:0] = 0110
2.80
3.15
3.50
V
HLVDSEL[3:0] = 0111
2.98
3.35
3.72
V
HLVDSEL[3:0] = 1000
3.20
3.60
4.00
V
HLVDSEL[3:0] = 1001
3.34
3.75
4.16
V
HLVDSEL[3:0] = 1010
3.56
4.00
4.44
V
HLVDSEL[3:0] = 1011
3.74
4.20
4.66
V
HLVDSEL[3:0] = 1100
3.87
4.35
4.83
V
HLVDSEL[3:0] = 1101
4.14
4.65
5.16
V
HLVDSEL[3:0] = 1110
Conditions(1)
†
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Do not use HLVDSEL[3:0] = 0000 through 0100 for High-Temperature operation (125°C TA150°C).
TABLE 2-8:
FIXED VOLTAGE REFERENCE (FVR) SPECIFICATIONS
PIC18F24/25K42
Param.
No.
Symbol
Standard Operating Conditions (unless otherwise stated)
Characteristic
Min.
+150°C
Typ.†
Max.
+150°C
Units
Conditions
FVR01
VFVR1
1x Gain (1.024V)
-9
—
+9
%
VDD 2.7V, -40°C to 150°C
FVR02
VFVR2
2x Gain (2.048V)
-9
—
+9
%
VDD 2.7V, -40°C to 150°C
FVR03
VFVR4
4x Gain (4.096V)
-9
—
+9
%
VDD 4.75V, -40°C to 150°C
†
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
2020 Microchip Technology Inc.
DS40002113A-page 13
PIC18F24/25K42
APPENDIX A:
REVISION HISTORY
Revision A (02/2020)
Original mini data sheet for the high-temperature
devices in the PIC18F24/25K42 devices.
2020 Microchip Technology Inc.
DS40002113A-page 14
PIC18F24/25K42
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata, application notes and sample programs, design
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• General Technical Support – Frequently Asked
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•
•
•
•
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Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in
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Technical support is available through the website
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CUSTOMER CHANGE NOTIFICATION
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Microchip’s customer notification service helps keep
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To register, access the Microchip website at
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2020 Microchip Technology Inc.
DS40002113A-page 15
PIC18F24/25K42
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
X
/XX
XXX
Tape and Reel
Option
Temperature
Range
Package
Pattern
PART NO.
Device
Examples:
a)
b)
Device:
PIC18F24K42
PIC18F25K42
Tape and Reel
Option:
Blank
T
= Standard packaging (tube or tray)
= Tape and Reel(1)
Temperature
Range:
H
= -40C to +150C
Package:
SS
5N
=
=
Pattern:
(High Temperature)
SSOP
VQFN with Wettable Flanks
QTP, SQTP, Code or Special Requirements
(blank otherwise)
2020 Microchip Technology Inc.
PIC18F25K42-H/P: Part number:
PIC18F25K42, Tape and Reel Option: Blank,
Temperature Range: H, Package: P, Pattern:
Blank
PIC18F25K42T-H/ST: Part number:
PIC18F25K42, Tape and Reel Option: T,
Temperature Range: H, Package: ST, Pattern:
Blank
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DS40002113A-page 16
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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hold harmless Microchip from any and all damages, claims,
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Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
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APT, ClockWorks, The Embedded Control Solutions Company,
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Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
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TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
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USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 Microchip Technology Inc.
ISBN: 978-1-5224-5588-2
DS40002113A-page 17
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DS40002113A-page 18
05/14/19
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