PL602-00DC

PL602-00 Multiplier XO IC Die for 12 to 25MHz Parallel Resonant Crystals FEATURES DIE CONFIGURATION      VDD VDD S0V S1V S2V Integrated crystal oscillator circuitry (XO). Low phase noise (-125dBc @ 10kHz offset and 155.52MHz output) Selectable frequency multipliers (x1, x2, x4, x8 as bonding options). 3.3V supply voltage. Uses inexpensive fundamental -mode parallel resonant crystals (from 12 to 25MHz). Selectable High Drive (30mA) or Standard Drive (10mA) output. Available in DIE (65 mil x 62 mil). 25 23 21 20 19 18 (1550,1475) Die ID: 4444-44 62 mil   OE^ 65 mil XIN 27 XOUT 29 C502B 13 CLK 10 GND The PL602-00 is a monolithic low jitter and low phase noise (-125dBc @10kHz offset and 155.52MHz output), high performance CMOS XO IC. This flexible device can be used as a XO with output frequencies ranging from F XIN x 1 to F XIN x 8 thanks to selector pads allowing bonding options (see Divider Selection Table on this page). This makes the PL602-00 ideal for a wide range of applications from 12MHz to 200MHz (including 50MHz, 77.76MHz, 125MHz and 155.52MHz, etc.). BLOCK DIAGRAM S[0:2] XIn XO XOut Selectable PLL DIE SPECIFICATIONS Name Value Size Reverse side Pad dimensions Thickness 62 x 65 m il GND 80 m icron x 80 micron 8 m il CLK GND 7 DESCRIPTION (0,0) Y Note: X ^ denotes internal pull up V denotes internal pull down MULTIPLIER SELECTION SELECTION S2 S1 S0 0 0 0 0 0 1 0 1 0 1 1 1 1 0 1 1 0 1 0 0 1 0 1 1 F XIN CLK (MHz) F XIN x 2 F XIN x 4 12MHz – 25MHz F XIN x 1 F XIN x 8 F XIN x 2* F XIN x 4* F XIN x 1* F XIN x 8* Note: - Selector pads default t o ‘0’, wire bond to VDD to set to ‘1’ - (*) High-drive CMOS output PAD DESCRIPTION Name Number XIN XOUT 27 29 GND 7,10 CLK 13 S[0:2] VDD 18,19,20 21, 23 OE 25 Description Crystal input connection. Crystal connection. Ground. Clock Output. Frequency selection pad 3.3V Power Supply. Output Enable: ‘0’ to disable (tristate output), 1’ (default value when not connected) to enabled the output. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474-1000 • www.micrel.com Rev 11/16/11 Page 1 PL602-00 Multiplier XO IC Die for 12 to 25MHz Parallel Resonant Crystals ELECTRICAL SPECIFICATIONS 1. Absolute Maximum Ratings PARAMETERS SYMBOL MIN. MAX. UNITS V V V Supply Voltage Input Voltage, dc VDD VI -0.5 4.6 VDD +0.5 Output Voltage, dc Storage Temperature Ambient Operating Temperature* VO TS TA -0.5 -65 -40 VDD +0.5 150 85 C C Junction Temperature Lead Temperature (soldering, 10s) ESD Protection, Human Body Model TJ 125 260 2 C C kV Exposure of the device under conditions beyond the limits specified by Maximum Ratings for extended periods may cause permane nt damage to the device and affect product reliability. These conditions represent a stress rating only, and functional operations of the device at these or any other conditions above the operational limits noted in this specification is not implied. * Note: Operating Temperature is guaranteed by design for all parts (COMMERCIAL and INDUSTRIAL), but tested fo r COMMERCIAL grade only. 2. DC Electrical Specifications PARAMETERS Supply Current, Dynam ic, with Loaded Output Operating Voltage Output drive current (High Drive) Output drive current (Standard Drive) SYMBOL IDD CONDITIONS MIN. TYP. F XIN = 12 - 25MHz Output load of 10pF VDD I OH VOH = VDD -0.4V, V DD =3.3V 2.97 30 I OL I OH I OL VOL = 0.4V, V DD = 3.3V VOH = VDD -0.4V, V DD =3.3V VOL = 0.4V, V DD = 3.3V 30 10 10 MAX. UNITS 35 mA 3.63 V mA mA mA mA 3. AC Electrical Specifications PARAMETERS Input Crystal Frequency Output Clock Rise/Fall Time (Standard Drive) Output Clock Rise/Fall Time (High Drive) Output Clock Duty Cycle SYMBOL CONDITIONS MIN. TYP. 12 0.3V ~ 3.0V with 15 pF load 3.0 0.3V ~ 3.0V with 15 pF load 1.2 Measured @ 50% V DD 45 50 MAX. UNITS 25 MHz ns 55 % Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474-1000 • www.micrel.com Rev 11/16/11 Page 2 PL602-00 Multiplier XO IC Die for 12 to 25MHz Parallel Resonant Crystals 4. Crystal Specifications PARAMETERS Crystal Resonator Frequency Crystal Loading Rating Recommended ESR SYMBOL CONDITIONS MIN. F XIN Parallel Fundamental Mode 12 C L ( xtal) RE TYP. MAX. UNITS 25 MHz 20 AT cut pF 30  5. Jitter and Phase Noise Specification PARAMETERS RMS Period Jitter (1 sigma – 1000 samples) Phase Noise relative to carrier Carrier Frequency 44MHz Phase Noise relative to carrier Carrier Frequency 155.52MHz CONDITIONS at 155MHz, with capacitive decoupling between VDD and GND. MIN. TYP. MAX. UNITS 20 ps @100Hz offset -113 dBc/Hz @1kHz offset -130 dBc/Hz @10kHz offset -135 dBc/Hz @100kHz offset -128 dBc/Hz @1MHz offset -128 dBc/Hz @100Hz offset -100 dBc/Hz @1kHz offset -115 dBc/Hz @10kHz offset -125 dBc/Hz @100kHz offset -116 dBc/Hz @1MHz offset -114 dBc/Hz @10MHz offset -132 dBc/Hz @40MHz offset -142 dBc/Hz Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474-1000 • www.micrel.com Rev 11/16/11 Page 3 PL602-00 Multiplier XO IC Die for 12 to 25MHz Parallel Resonant Crystals PAD ASSIGNMENT Pad # Name X (m) Y (m) Description 7 GND 1042 109 Ground. 10 GND 1400 259 Ground. 13 CLK 1400 716 CMOS clock output. 18 S2 1232 1365 Used to select multiplication factor and drive level. Internal pull down. 19 S1 1042 1365 Used to select multiplication factor an d drive level. Internal pull down. 20 S0 854 1365 Used to select multiplication factor and drive level. Internal pull down. 21 VDD 659 1365 3.3V power supply. 23 VDD 459 1365 3.3V power supply. 25 OE 194 1365 Used to enable/disable the output(s). In ternal pull up. 27 XIN 109 1017 Crystal input. See crystal specification page 3. 29 XOUT 109 646 Crystal output. See crystal specification page 3. ORDERING INFORMATION For part ordering, please contact our Sales Department: 2180 Fortune Drive, San Jose, CA 95131, USA Tel: (408) 944-0800 Fax: (408) 474-1000 PART NUMBER The order number for this device is a combination of the following: Device number, Package type and Operating temperature range PL 602-00 D C TEMPERATURE C=COMMERCIAL I=INDUSTRAL PART NUMBER PACKAGE TYPE D=DIE Order Number Marking Package Option PL602-00DC P602-00DC Die – Waffle Pack Micrel Inc., reserves the right to make changes in its products or specificati ons, or both at any time without notice. The information furnished by Micrel is believed to be accurate and reliable. However, Micrel makes no guarantee or warranty concerning the accuracy of said info rmation and shall not be responsible for any loss or d amage of whatever nature resulting from the use of, or reliance upon this product. LIFE SUPPORT POLICY: Micrel’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the Presi dent of Micrel Inc. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1(408) 944 -0800 • fax +1(408) 474-1000 • www.micrel.com Rev 11/16/11 Page 4