PL60203X
HCSL-Compatible Clock Generator for
PCI Express
General Description
The PL60203X is the smallest, high performance, lowest
power, 2 differential output clock IC available for HCSL
timing applications. PL60203X offers -130dBc at 10kHz
offset at 100MHz, with a very low jitter (2ps TIE RMS),
making it ideal for HCSL applications requiring small size
and low power.
Datasheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Block Diagram
Features
Input frequency:
Fundamental crystal or reference input: 25MHz.
Output frequency:
PL602031: 2 x 25MHz differential outputs.
PL602032: 2 x 100MHz differential outputs.
PL602033: 2 x 125MHz differential outputs.
PL602034: 2 x 200MHz differential outputs.
Very low jitter: 28ps peak-to-peak typical.
Very low phase noise:
-130dBc at 10kHz offset at 100MHz.
Compliant with PCI-Express Gen1, Gen2, and Gen3.
Power supply range: 2.25V to 3.63V.
Operating temperature range: -40°C to +85°C.
Available in 16-pin QFN, RoHS and PFOS compliant
package.
Applications
Servers
Storage systems
Switches and routers
Gigabit Ethernet
Set-top boxes/DVRs
Ripple Blocker is a trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
December 11, 2013
Revision 1.1
hbwhelp@micrel.com or (408) 955-1690
Micrel, Inc.
PL60203X
Ordering Information
Marking
Shipping
Junction Temperature
Range
Package
PL602031UMG
602031
Tube
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602031UMG TR
602031
Tape and Reel
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602032UMG
602032
Tube
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602032UMG TR
602032
Tape and Reel
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602033UMG
602033
Tube
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602033UMG TR
602033
Tape and Reel
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602034UMG
602034
Tube
–40° to +85°C
16-Pin 3mm x 3mm QFN
PL602034UMG TR
602034
Tape and Reel
–40° to +85°C
16-Pin 3mm x 3mm QFN
Part Number
(1)
Note:
1. The devices are RoHS and PFOS compliant.
December 11, 2013
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PL60203X
Pin Configuration
16-Pin QFN (Top View)
Pin Description
Pin Number
Pin Name
Pin Type
1
XIN, FIN
I
Crystal input pin or reference clock input.
2
GND0
I
GND connection for CLK0.
3, 4
CLK0[0:1]
O
Differential clock output pair
5
VDD0
P
VDD connection for CLK0
6, 7
CLK1[0:1]
O
Differential clock output pair
10
VDD1
P
VDD connection for CLK1
11
OE1
I
Output enable pin for CLK1. High=Enabled, Low=Disabled. OE1 has a
60KΩ pull-up resistor.
12
GND1
P
GND connection for CLK1
15
XOUT
O
Crystal output pin
16
OE0
I
Output enable pin for CLK0. High=Enabled, Low=Disabled. OE0 has a
60KΩ pull-up resistor.
8, 9
13, 14
DNC
Do not connect.
ePad
Center pad for thermal relief. Connect to GND.
December 11, 2013
Pin Function
3
Revision 1.1
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PL60203X
Absolute Maximum Ratings(2)
Operating Ratings(4)
Supply Voltage (VIN) .................................................... +4.6V
Lead Temperature (soldering, 10s) ............................ 260°C
Storage Temperature (TS) .......................................... 150°C
(3)
ESD Rating ............................................................... 2.0kV
Supply Voltage (VIN) ..................................... –0.5V to +4.6V
Ambient Temperature (TA) .......................... –40°C to +85°C
(5)
Package Thermal Resistance
QFN Still-air (JA) ............................................... 60°C/W
QFN Junction-to-board (JB) ............................. 33°C/W
AC Electrical Characteristics(6)
VDD = 3.3V ±10% or 2.5V ±10%, TA = -40°C to +85°C, HCSL termination applied.
Parameter
Condition
Min.
Crystal input frequency
Fundamental crystal
Input (FIN) frequency
Input (FIN) signal amplitude
Output frequency
Internally AC coupled
Typ.
Max.
Units
25
MHz
25
MHz
0.9
VDD
Vpp
PL602031
25
MHz
PL602032
100
MHz
PL602033
125
MHz
PL602034
200
MHz
Output enable time
OE function, TA=25°C, add one clock period to this
measurement for a useable clock output.
10
ns
Output disable time
OE function, TA=25°C
10
ns
Setting time
At power up (VDD ≥ 2.25V)
10
ms
VDD sensitivity
Frequency vs. VDD ±10%, crystal input only.
2
ppm
Output rise time
20/80%
0.3
0.5
ns
Output fall time
20/80%
0.3
0.5
ns
Duty cycle
At VDD/2
50
55
%
Period jitter, peak-to-peak
With capacitive decoupling between VDD and GND at 100MHz;
10,000 samples measured
28
ps
Phase jitter, RMS
For 10kHz to 10MHz integration range
2.1
ps
-2
45
DC Electrical Characteristics(6)
VDD = 3.3V ±10% or 2.5V ±10%, TA = -40°C to +85°C, HCSL termination applied.
Symbol
Parameter
Condition
IDD
Supply current, dynamic
At 100MHz, no load
VDD
Operating voltage
VOL
Output low voltage
VOH
Output high voltage
December 11, 2013
Min.
Typ.
Max.
Units
50
70
mA
3.63
V
0.05
V
0.85
V
2.25
HCSL termination,
(RS = 150Ω, RT = 49.9Ω) 3.3V
(RS = 100Ω, RT = 49.9Ω) 2.5V
4
0.65
0.75
Revision 1.1
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PL60203X
Crystal Characteristics(6)
VDD = 3.3V ±10% or 2.5V ±10%, TA = -40°C to +85°C.
Symbol
Parameter
Min.
Typ.
FXIN
Fundamental crystal resonator
25
MHz
CL (XTAL)
Crystal load rating
18
pF
Maximum sustainable drive level
Max.
500
Operating drive level
100
Units
µW
µW
C0
Crystal shunt capacitance
6
pF
ESR
Effective series resistance, fundamental
45
Ω
Notes:
2. Exceeding the absolute maximum ratings may damage the device.
3. Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5k in series with 100pF.
4. The device is not guaranteed to function outside its operating ratings.
5. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. JA and JB values
are determined for a 4-layer board in still-air number, unless otherwise stated.
6. Specification for packaged product only
December 11, 2013
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Revision 1.1
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Micrel, Inc.
PL60203X
PCI Express/HCSL Compatible Layout Guidelines
Figure 1 below demonstrates how to terminate the complementary LVCMOS outputs of PL60203X for use with HCSL
inputs.
Figure 1. Terminating the complementary LVCMOS outputs for use with HCSL inputs.
December 11, 2013
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PL60203X
PCB Layout Considerations for Performance Optimization
The following guidelines are designed to assist you with a performance-optimized PCB design:
Keep all the PCB traces to PL60203X as short as
possible. Also keep all other traces as far away
from PL60203X as possible.
Place the crystal as close as possible to both
crystal pins of the device. This will reduce the
cross-talk between the crystal and the other
signals.
Separate crystal pin traces from the other signals
on the PCB, but allow ample distance between the
two crystal pin traces.
Place a 0.01µF decoupling capacitor between
VDD and GND on the component side of the PCB,
close to the VDD pin. It is not recommended to
place this component on the backside of the PCB.
It is highly recommended to keep the VDD and
GND traces as short as possible.
When connecting long traces (>1 inch) to a CMOS
output, it is important to design the traces as a
transmission line, or “stripline”, to avoid reflections
or ringing. In this case, the CMOS output needs to
be matched to the trace impedance. Usually,
“striplines” are designed for 50Ω impedance and
CMOS outputs usually have an impedance of less
than 50Ω, so matching can be achieved by adding
a resistor in series with the CMOS output pin to
the “stripline” trace.
Power Supply Filtering Recommendations
Preferred filter, using Micrel MIC94300 or MIC94310 Ripple Blocker™:
Alternative, traditional filter, using a ferrite bead:
December 11, 2013
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Revision 1.1
hbwhelp@micrel.com or (408) 955-1690
Micrel, Inc.
PL60203X
Package Information(7)
16-Pin QFN
Note:
7. Package information is correct as of the publication date. For updates and most current information, go to: www.micrel.com.
December 11, 2013
8
Revision 1.1
hbwhelp@micrel.com or (408) 955-1690
Micrel, Inc.
PL60203X
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability
whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties
relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2013 Micrel, Incorporated.
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