RN2483
Low-Power Long Range LoRa® Technology
Transceiver Module
General Features
•
•
•
•
On-Board LoRaWAN™ Protocol Stack
ASCII Command Interface over UART
Compact Form Factor: 17.8 x 26.7 x 3.34 mm
Castellated SMT Pads for Easy and Reliable PCB
Mounting
• Environmentally Friendly, RoHS Compliant
• European RED Certified Radio Module
• Device Firmware Upgrade (DFU) over UART, see
“RN2483 LoRa® Technology Module Command
Reference User’s Guide” (DS40001784)
Operational
• Single Operating Voltage: 2.1V to 3.6V (3.3V
typical)
• Temperature Range: -40°C to +85°C
• Low-Power Consumption
• Programmable RF Communication Bit Rate up to
300 kbps with FSK Modulation, 10937 bps with
LoRa Technology Modulation
• Integrated MCU, Crystal, EUI-64 Node Identity
Serial EEPROM, Radio Transceiver with Analog
Front End, Matching Circuitry
• 14 GPIOs for Control and Status, Shared with 13
Analog Inputs
RF/Analog Features
• Low-Power Long Range Transceiver Operating in
the 433 MHz and 868 MHz Frequency Bands
• High Receiver Sensitivity: Down to -146 dBm
• TX Power: Adjustable up to +14 dBm high
Efficiency PA
• FSK, GFSK and LoRa Technology Modulation
• IIP3 = -11 dBm
• Up to 15 km Coverage at Suburban and up to 5
km Coverage at Urban Area
2015-2021 Microchip Technology Inc.
Description
Microchip’s RN2483 Low-Power Long Range LoRa
Technology Transceiver module provides an easy-touse, low-power solution for long range wireless data
transmission. The advanced command interface offers
rapid time to market.
The RN2483 module complies with the LoRaWAN
Class A protocol specifications. It integrates RF, a
baseband
controller,
command
Application
Programming Interface (API) processor, making it a
complete long range solution.
The RN2483 module is suitable for simple long range
sensor applications with external host MCU.
Applications
•
•
•
•
•
•
Automated Meter Reading
Home and Building Automation
Wireless Alarm and Security Systems
Industrial Monitoring and Control
Machine to Machine (M2M)
Internet of Things (IoT)
DS50002346F-page 1
RN2483
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 3
2.0 General Specifications ................................................................................................................................................................. 6
3.0 Typical Hardware Connections..................................................................................................................................................... 9
4.0 Physical Dimensions ...................................................................................................................................................................11
5.0 Application Information............................................................................................................................................................... 12
6.0 Regulatory Approval ................................................................................................................................................................... 13
Appendix A: Revision History ............................................................................................................................................................... 17
The Microchip WebSite ........................................................................................................................................................................ 19
Customer Change Notification Service ................................................................................................................................................ 19
Customer Support ................................................................................................................................................................................ 19
Product Identification System............................................................................................................................................................... 21
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Most Current Data Sheet
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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DS50002346F-page 2
2015-2021 Microchip Technology Inc.
RN2483
DEVICE OVERVIEW
LoRa Technology modulation also provides significant
advantages in both blocking and selectivity compared to
the conventional modulation techniques, solving the
traditional design compromise between extended range,
interference immunity and low-power consumption.
The RN2483 transceiver module features LoRa
Technology RF modulation, which provides long range
spread spectrum communication with high interference
immunity.
The RN2483 module delivers exceptional phase noise,
selectivity, receiver linearity and IIP3 for significantly
lower power consumption. Figure 1-1, Figure 1-2 and
Figure 1-3 show the top view, the pinout and the block
diagram of the module.
RN2483 PIN DIAGRAM
RN2483 TOP VIEW
RFL 25
GND 24
RFH 23
FIGURE 1-1:
FIGURE 1-2:
28 GND
29 NC
30 3*&B,17
31 3*'B,17
GND 20
NC 19
NC 18
NC 17
32 RESET
33 GND
NC 16
NC 15
34 VDD
35 GPIO0
GPIO10 14
GPIO11 13
38 GPIO3
39 GPIO4
GPIO12 10
GPIO13 9
36 GPIO1
37 GPIO2
VDD 12
GND 11
40 GPIO5
41 GND
GND 8
UART_RX 7
UART_TX 6
42 NC
43 GPIO6
RESERVED 5
RESERVED 4
44 GPIO7
45 GPIO8
UART_CTS 3
UART_RTS 2
GND 1
46 GPIO9
47 GND
FIGURE 1-3:
GND 22
GND 21
Using LoRa Technology modulation technique,
RN2483 can achieve a receiver sensitivity of -146 dBm.
The high sensitivity combined with the integrated
+14 dBm power amplifier yields industry leading link
budget, which makes it optimal for applications
requiring extended range and robustness.
GND 27
GND 26
1.0
RN2483 BLOCK DIAGRAM
Host MCU
RN2483 Module
MCU
UART
Command Processor
LoRaWAN™ Protocol Stack
14 GPIO Pins
I2C
Real-Time
Clock
EUI-64
EEPROM
32768 Hz
Crystal
User Hardware:
Status LEDs, Switches, Logic IOs, etc.
2015-2021 Microchip Technology Inc.
SPI
LoRa® Technology
Radio
Antenna
433 MHz
Antenna
868 MHz
DS50002346F-page 3
RN2483
Table 1-1 describes the RN2483 pins.
TABLE 1-1:
PIN DESCRIPTION
Pin
Name
Type
Description
1
GND
Power
Ground supply terminal
2
UART_RTS
Output
Communication UART RTS signal(1), or GPIO
3
UART_CTS
Input
Communication UART CTS signal(1), or GPIO
4
RESERVED
—
Do not connect
5
RESERVED
—
Do not connect
6
UART_TX
Output
Communication UART Transmit (TX)
7
UART_RX
Input
Communication UART Receive (RX)
8
GND
Power
Ground supply terminal
9
GPIO13
Input/Output
General purpose I/O pin or analog input
10
GPIO12
Input/Output
General purpose I/O pin or analog input
11
GND
Power
Ground supply terminal
12
VDD
Power
Positive supply terminal
13
GPIO11
Input/Output
General purpose I/O pin or analog input
14
GPIO10
Input/Output
General purpose I/O pin or analog input
15
NC
—
Not connected
16
NC
—
Not connected
17
NC
—
Not connected
18
NC
—
Not connected
19
NC
—
Not connected
20
GND
Power
Ground supply terminal
21
GND
Power
Ground supply terminal
22
GND
Power
Ground supply terminal
23
RFH
RF analog
RF signal pin for high band
24
GND
Power
Ground supply terminal
25
RFL
RF analog
RF signal pin for low band
26
GND
Power
Ground supply terminal
27
GND
Power
Ground supply terminal
28
GND
Power
Ground supply terminal
29
NC
—
Not connected
30
PGC_INT
Input/Output
Internal MCU ICSP program clock or general
purpose I/O pin(2)
31
PGD_INT
Input/Output
Internal MCU ICSP program data or general purpose
I/O pin (2)
32
RESET
Input
Active-low device Reset input
33
GND
Power
Ground supply terminal
34
VDD
Power
Positive supply terminal
35
GPIO0
Input/Output
General purpose I/O pin or analog input
36
GPIO1
Input/Output
General purpose I/O pin or analog input
37
GPIO2
Input/Output
General purpose I/O pin or analog input
38
GPIO3
Input/Output
General purpose I/O pin or analog input
39
GPIO4
Input/Output
General purpose I/O pin
40
GPIO5
Input/Output
General purpose I/O pin or analog input
41
GND
Power
Ground supply terminal
42
NC
—
Not connected
DS50002346F-page 4
2015-2021 Microchip Technology Inc.
RN2483
TABLE 1-1:
PIN DESCRIPTION (CONTINUED)
Pin
Name
Type
Description
43
GPIO6
Input/Output
General purpose I/O pin or analog input
44
GPIO7
Input/Output
General purpose I/O pin or analog input
45
GPIO8
Input/Output
General purpose I/O pin or analog input
46
GPIO9
Input/Output
General purpose I/O pin or analog input
47
GND
Power
Ground supply terminal
Note 1: Optional handshake lines are supported in future firmware releases.
2: The “RN2483 LoRa® Technology Module Command Reference User’s Guide” (DS40001784) uses the pin
name TEST0 for PGC_INT and TEST1 for PGD_INT.
2015-2021 Microchip Technology Inc.
DS50002346F-page 5
RN2483
2.0
GENERAL SPECIFICATIONS
Table 2-1 provides the general specifications for the
module. Table 2-2, Table 2-3 and Table 2-4 provide the
electrical characteristics, current consumption and
TABLE 2-1:
dimensions of the module, respectively. Table 2-5
shows the RF output power calibration data. Table 2-6
shows the RF output power at different supply voltages
and temperatures.
GENERAL SPECIFICATIONS
Specification
Description
Frequency Band
863.000 MHz to 870.000 MHz; 433.050 MHz to 434.790 MHz
Modulation Method
FSK, GFSK and LoRa Technology modulation
Maximum Over-the-Air Data Rate
300 kbps with FSK modulation; 10937 bps with LoRa Technology modulation
RF Connection
Board edge connection
Interface
UART
Operation Range
Up to 15 km coverage at suburban; up to 5 km coverage at urban area
Sensitivity at 1% PER
-146 dBm(1)
RF TX Power
Adjustable up to max. 10 dBm on 433 MHz band (limited to meet regulations);
max. 14 dBm on the 868 MHz band(2)
Temperature (operating)
-40°C to +85°C
Temperature (storage)
-40°C to +115°C
Humidity
10% ~ 90% non-condensing
Note 1: Dependent on modulation settings, Receiver Bandwidth (RBW) and Spreading Factor (SF).
2: TX power is adjustable. For more information, refer to the “RN2483 LoRa® Technology Module Command
Reference User’s Guide” (DS40001784).
TABLE 2-2:
ELECTRICAL CHARACTERISTICS
Parameter
Min.
Typ.
Max.
Units
Supply Voltage
2.1
—
3.6
V
Voltage on any pin with respect to VSS (except VDD) and RESET
-0.3
—
VDD + 0.3
V
Voltage on VDD with respect to VSS
3.9
V
-0.3
—
Voltage on RESET with respect to VSS
0
—
+11
V
Input Clamp Current (IIK) (VI < 0 or VI > VDD)
—
—
+/-20
mA
mA
Output Clamp Current (IOK) (VO < 0 or VO > VDD)
—
—
+/-20
GPIO sink/source current each
—
—
25/25
mA
Total GPIO sink/source current
—
—
200/185
mA
RAM Data Retention Voltage (in Sleep mode or Reset state)
1.5
—
—
V
VDD Start Voltage to ensure internal Power-on Reset signal
—
—
0.7
V
VDD Rise Rate to ensure internal Power-on Reset signal
0.05
—
—
V/ms
Brown-out Reset Voltage
1.75
1.9
2.05
V
Logic Input Low Voltage
—
—
0.15 x VDD
V
Logic Input High Voltage
0.8 x VDD
—
—
V
Input Leakage at