RN4678
Bluetooth® Dual Mode Module
Features
• Bluetooth® Classic (BR/EDR) and Low Energy (LE)
• Certified to FCC, ISED, MIC, KCC, NCC and
SRRC Radio Regulations
• European Radio Equipment Directive (RED)
Assessed Radio Module
• Qualified for Bluetooth SIG v5.0 Core Specification
• Transparent UART mode for Seamless Serial
Data over Bluetooth Classic using Serial Port
Profile (SPP) and Bluetooth Low Energy (BLE)
using Generic Attribute (GATT) Profile
• Easily Programmable through ASCII Commands
and Easily Configurable with Available PIC® MCU
Driver Library
• Firmware can be Upgraded in the Field over
UART (Flash version)
• Integral Chip Antenna (RN4678)
• Integrated Crystal, Internal Voltage Regulator and
Matching Circuitry
• Available Configurable I/O Pins for Control or
Status Indication
• Supports Apple® iPod® Accessory Protocol
(iAP2) (only RN4678APL)
• Supports Bluetooth LE Secure Connections
• Bluetooth LE Data Packet Length Extension
• Small and Compact Surface Mount Module
• Castellated SMT Pads for Easy and Reliable PCB
Mounting
• Ideal for Portable Battery-Operated Devices
RF/Analog
• Frequency: 2.402 GHz to 2.480 GHz
• RX Sensitivity: -90 dBm (BR/EDR), -92 dBm (LE)
• Class 2 Output Power (+1.5 dBm typical)
Data Throughput
Data Throughput at 1 Mbps UART Baud Rate:
• BR/EDR: up to 32 Kbytes/s
• LE: up to 7 Kbytes/s
Data Throughput at 115200 bps UART Baud Rate
• BR/EDR: up to 10 Kbytes/s
• LE: up to 6 Kbytes/s
Operating Conditions
• Operating Voltage Range: 3.3V to 4.2V
• Operating Temperature Range: -20°C to +70°C
2016-2022 Microchip Technology Inc.
MAC/Baseband/Higher Layer Features
• Secure AES128 Encryption
• Bluetooth Classic: GAP, SPP, SDP, RFCOMM and
L2CAP
• Bluetooth Low Energy: GAP, GATT, ATT, SMP
and L2CAP
Applications
•
•
•
•
•
•
Internet of Things (IoT)
Secure Payment
Home and Security
Health and Fitness
Industrial and Data Logger
LED Lighting (16 configurations)
Description
The RN4678 module is a fully certified, Bluetooth v5.0
compliant (BR/EDR/LE) Dual mode module, available
for customers to easily add Dual mode Bluetooth
wireless capability to their products. The RN4678 is
built around Microchip’s IS1678 Bluetooth Dual mode
chip. Refer to Section 8.0 “Ordering Information”.
The RN4678 provides a convenient method for cable
replacement for smartphones or tablets for data
transfer and control based on the Bluetooth protocols.
Data transfer is achieved through the Bluetooth link by
sending or receiving data through SPP in Bluetooth
(BT) Classic mode and through Transparent UART in
the BLE mode. The ASCII interface provides an easy
way to learn the operation and to integrate the module
with any microprocessor or microcontroller (MCU) with
a UART interface.
DS50002519G-page 1
RN4678
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 3
2.0 Application Information..................................................................................................................................................................... 7
3.0 Electrical Characteristics................................................................................................................................................................ 15
4.0 Radio Characteristics ..................................................................................................................................................................... 19
5.0 Physical Dimensions ...................................................................................................................................................................... 20
6.0 Reflow Profile ................................................................................................................................................................................. 23
7.0 Module Placement ......................................................................................................................................................................... 24
8.0 Ordering Information ...................................................................................................................................................................... 27
9.0 Regulatory Approval....................................................................................................................................................................... 28
Appendix A: Revision History ............................................................................................................................................................... 34
The Microchip Website ........................................................................................................................................................................ 36
Customer Change Notification Service ............................................................................................................................................... 36
Customer Support ............................................................................................................................................................................... 36
Product Identification System ............................................................................................................................................................. 37
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Website; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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Customer Notification System
Register on our website at www.microchip.com to receive the most current information on all of our products.
2016-2022 Microchip Technology Inc.
DS50002519G-page 2
RN4678
1.0
DEVICE OVERVIEW
The RN4678 is a complete and fully regulatory certified
module with an integral ceramic chip antenna and RF
shield.
The RN4678 module is a fully certified, embedded
Bluetooth (BR/EDR/LE) wireless module. The module
includes an on-board Bluetooth stack, power management subsystem, a 2.4 GHz transceiver and RF power
amplifier. Customers can embed Bluetooth functionality
into any application using the RN4678 module.
The RN4678 is a small, compact and surface-mounted
module with castellated pads for easy and reliable host
PCB mounting. The module is compatible with standard pick-and-place equipment and can independently
maintain a low-power wireless connection. Low-power
usage and flexible power management maximize the
lifetime of the RN4678 module in battery-operated
devices. A wide operating temperature range enables
its applications in indoor and outdoor environments.
The RN4678 enables rapid product development and
faster time to market, and it is designed to provide
integrators with the following features:
•
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with low-cost system
Interoperability with Bluetooth host
Wide range of applications
FIGURE 1-1:
The following figure illustrates the internal block
diagram of the RN4678 module.
RN4678 INTERNAL BLOCK DIAGRAM
RN4678 BT Dual Mode Module
BAT_ IN
SW_ BTN
LDO33_O
LDO18_O
VDD_IO
RST_N
Antenna
PMU
BAT_ DET
Matching
SW_ BTN
LDO3V3_OUT
LDO1V8_OUT
IS1678 S/SM
Bluetooth
Baseband
& RF
16 MHz
CRYSTAL
VDDIO
RST_N
Core
320 KB ROM
28 KB SRAM
WAKEUP
WAKEUP
MCU
GPIO
LED DRIVER
LED
4 Mb Flash
(Only IS1678SM)
TXD
RXD
UART
HOST
MCU
RTS
CTS
EEPROM
2016-2022 Microchip Technology Inc.
DS50002519G-page 3
RN4678
The following table provides the description of the various pins of the RN4678 module.
TABLE 1-1:
PIN DESCRIPTION
RN4678
Pin Name
Type
Description
1
GND
Power
Ground reference.
2
GND
Power
Ground reference.
3
GND
Power
Ground reference.
4
BAT_IN
Power
Battery Input (3.3V to 4.2V),
Main positive supply input,
Connect to 10 µF (X5R/X7R) capacitor.
5
SW_BTN
DI
6
LDO33_O
Power
Internal 3.3V LDO output; can source no more than 50 mA.
7
VDD_IO
Power
I/O positive supply input. For internal use only; do not connect to other
devices.
8
LDO18_O
Power
Internal 1.8V LDO output. For internal use only; do not connect to other
devices.
• Software Button:
- H: Power On
- L: Power Off
• By default, this functionality is disabled. Refer to “RN4678 Command
Reference User Guide” (DS50002506) to enable the feature
9
WAKEUP
DI
10
PMULDO_O
Power
11
P0_4
DO
Status indication pin. Indicates the current status of BLE data
transmission.
High: Data currently transmitting
Low: No current data transmission
12
P1_5
DO
Status indication pin. Indicates the current connection status.
High: Powered on and not connected
Low: Connected to peer device
13
P1_2
DO
GPIO pin. Internally pulled up by default.
14
P1_3
DIO
GPIO pin. Internally pulled up by default.
15
P1_7/CTS
DIO
Configurable control or indication pin or UART CTS (input).
16
P0_5
DIO
Configurable control or indication pin.
17
P0_0/RTS
DIO
Configurable control or indication pin or UART RTS (output).
18
P2_0
DI
System configuration pin. Along with the P2_4 and EAN pins, used to
set the module in any of the following three modes: Application mode
(for normal operation), Test mode (to change EEPROM values) and
Write Flash mode (to enter the new firmware into the module); refer to
Table 2-1.
19
P2_4
DI
System configuration pin. Along with the P2_0 and EAN pins, used to
set the module in any of the following three modes: Application mode
(for normal operation), Test mode (to change EEPROM values) and
Write Flash mode (to enter new firmware into the module); refer to
Table 2-1.
20
EAN
DI
External address bus negative pin. System configuration pin along with
the P2_0 and P2_4 pins, used to set the module in any of the following
three modes: Application mode (for normal operation), Test mode (to
change EEPROM values) and Write Flash mode (to enter new
firmware into the module); refer to Table 2-1.
21
RST_N
DI
Module Reset (internal pull-up). Apply a pulse of at least 63 ns.
2016-2022 Microchip Technology Inc.
Wake-up from Sleep mode (active-low) (internal pull-up).
Power management unit output. For internal use only; do not connect
to other devices.
DS50002519G-page 4
RN4678
TABLE 1-1:
PIN DESCRIPTION (CONTINUED)
RN4678
Pin Name
Type
22
RXD
DI
Description
UART data input.
23
TXD
DO
UART data output.
24
P3_1
DIO
Configurable control or indication pin (Internally pulled up if configured
as an input).
25
P3_2
DIO
Configurable control or indication pin (Internally pulled up if configured
as an input).
26
P3_3
DIO
Configurable control or indication pin (Internally pulled up if configured
as an input).
27
P3_4
DIO
Configurable control or indication pin (Internally pulled up if configured
as an input).
28
P3_6
DIO
Do not connect.
29
P3_7
DIO
Configurable control or indication pin (Internally pulled up if configured
as an input).
30
LED
DO
Status LED, connect to LDO33_0.
31
GND
Power
—
BT_RF
AIO
32
GND
Power
Ground reference.
33
GND
Power
Ground reference.
Legend: A = Analog
D = Digital
2016-2022 Microchip Technology Inc.
Ground reference.
External antenna connection (50 Ohms).
I = Input O = Output
DS50002519G-page 5
RN4678
The following figure illustrates the pin diagram of the
RN4678 module.
FIGURE 1-2:
RN4678 PIN DIAGRAM
33 GND
GND 1
32 GND
GND 2
GND 3
BAT_IN 4
SW_BTN 5
31 GND
30 LED
29 P3_7
LDO33_O 6
VDD_IO 7
LDO18_O 8
28 P3_6
27 P3_4
WAKEUP 9
26 P3_3
25 P3_2
PMULDO_O 10
P0_4 11
24 P3_1
P1_5 12
P1_2 13
23 TXD
22 RXD
2016-2022 Microchip Technology Inc.
EAN 20
RST_N 21
P2_4 19
P2_0 18
P0_5 16
P0_0/RTS 17
P1_7/CTS 15
P1_3 14
DS50002519G-page 6
RN4678
2.0
APPLICATION INFORMATION
2.1
Module Configuration
from the RN4678, the CTS pin (RN4678 input pin) must
be pulled high. The RN4678 pulls the RTS pin (output
pin) low to indicate that it can accept data.
2.3
For the I/O pins, P2_0, P2_4 and EAN, place the
RN4678 into Operating mode. Each of these pins has
internal pull-up, and allows configuration settings and
firmware to be updated from UART. Table 2-1 provides
system configuration details.
2.2
Control and Indication I/O Pins
The GPIO pins of the RN4678 module can be configured to different functions using the ASCII command
interface. Table 2-2 shows the various pins in the
RN4678 module that are available for configuration and
their default configuration settings. Table 2-3 provides
details on each of the functions available.
Flow Control
Flow control is enabled by default on the RN4678
module. With the flow control enabled, the RTS and
CTS lines need to be connected to the corresponding
lines for the module to operate. To pause data flow
TABLE 2-1:
SYSTEM CONFIGURATION SETTINGS
P2_0
P2_4
EAN
Low
Low
High
Write FLASH
Low
High
Low
Write EEPROM and Test mode
High
High
Low
Normal Operational/Application mode
TABLE 2-2:
CONTROL AND INDICATION I/O PIN ASSIGNMENTS
Pin Symbol
P0_0
Note 1:
2:
Operational Mode
Default Configuration
UART_RTS(1,2)
P0_5
N/C
P1_7
UART_CTS(1,2)
P3_1
INQUIRY CONTROL
P3_2
LINK_DROP_CONTROL (DISCONNECT)
P3_3
UART_RX_IND
P3_4
PAIRING_KEY
P3_7
LOW_BATTERY_IND
The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7.
The RTS and CTS pins can be configured as GPIOs if flow control is disabled.
2016-2022 Microchip Technology Inc.
DS50002519G-page 7
RN4678
TABLE 2-3:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
Function Name
Description
Low Battery Indication
Pin output goes low when the battery level is below a specified level. Default
battery low indication voltage level is 3.4V.
RSSI Indication
Use this pin to indicate the quality of the link based on the RSSI level. If the
RSSI level is lower than the specified values, then the RSSI indication pin
goes low.
Link Drop Control
Use this pin to force the module to drop the current BLE link with a peer
device. Pulling the Link Drop pin low forces a disconnect. The pin must be
pulled low for at least 10 ms.
UART RX Indication
Use this pin to enable communication with the UART when the module is in
Low-Power mode. When not in Low-Power mode, the module runs on a
16 MHz clock. If Low-Power mode is enabled on the module by using
command, SO,1, the module runs on a 32 kHz clock, thus reducing power
consumption. However, in Low-Power mode, the host MCU cannot
communicate with the module via the UART since the UART is not
operational. If the user intends to provide data or commands via UART in
the Low-Power mode, then the UART_RX_IND pin must be pulled low and
the user needs to wait for at least five milliseconds before sending the data.
Pulling the UART_RX_IND pin low allows the module to operate the
16 MHz clock and to enable UART.
Pairing Key
Use this pin to force the module to enter Standby mode. The pin must be
pulled down for at least 160 ms.
Inquiry Control
This pin forces the module to enter Inquiry mode (BT Classic). The pin must
be pulled low for at least 240 ms for the device to enter Inquiry mode.
Profile_IND
This pin is used to indicate whether the current connection is in BR/EDR
(BT Classic) or in Bluetooth® Low Energy (BLE). If the Profile_IND pin is
high, then the current connection is a BR/EDR connection. If low, then the
current connection is a BLE connection. This pin is valid only for the Link
state.
2016-2022 Microchip Technology Inc.
DS50002519G-page 8
RN4678
2.4
Power Tree
The following figure illustrates the power tree diagram
of the RN4678.
FIGURE 2-1:
POWER TREE DIAGRAM
BAT_IN
3.3v˜4.2v
PMULDO
o
PMU Logic
LDO18_EN
SW_BTN
LDO18
1v8
VCC_RF
AVDD_SAR
VDD_XO
LDO33_EN
LDO33
2016-2022 Microchip Technology Inc.
3v3
VDD_IO
LED
EEPROM
DS50002519G-page 9
RN4678
2.5
Software Button (SW_BTN)
The following figures show the timing diagrams for the
RN4678 with regard to the SW_BTN and the other relevant pins in different states of the module.
The Software Button (SW_BT) pin powers the main
sections of the module into operation. If the SW_BTN
pin is low, the module is turned off. After turning the
module on via the SW_BTN, the host MCU must wait
for a specific time before sending the first command.
The timing diagrams for the SW_BTN, other related
pins and the time delay are required before the host
MCU sends the first command.
Note:
By default, the SW_BTN functionality is
disabled and it can be enabled using the
host MCU commands. Refer to the
“RN4678 Command Reference User’s
Guide” (DS50002506) for more details.
FIGURE 2-2:
SW_BTN TIME (HIGH) AT APP MODE(1,2)
BAT_IN
MCU State
Power on
/Initial
Idle
Power on
SW_BTN
LDO18_O
RST_N
P1_5
10 ms
40 ms
4 ms
P0_4
UART
command
MCU send UART command
(BT UART RX)
475 ms
Note 1: Time duration (475 ms) is for reference purposes only. Use the Status Indication pins to verify the exact
time when the host MCU can start sending the commands.
2: Reset pin is not connected.
2016-2022 Microchip Technology Inc.
DS50002519G-page 10
RN4678
FIGURE 2-3:
SW_BTN TIME (LOW) AT ACCESS STATES(1)
BAT_IN
SW_BTN
12 ms
RST_N
LDO33_O
140 ms
Note 1: Reset pin is not connected.
FIGURE 2-4:
SW_BTN TIME (LOW) AT LINK STATES(1,2)
BAT_IN
SW_BTN
RST_N
LDO33_O
830 ms
140 ms
Note 1: 830 ms time duration is a typical value measured on iPhone® 6 and this time duration can vary from one
smartphone to another.
2: Reset pin is not connected.
2016-2022 Microchip Technology Inc.
DS50002519G-page 11
RN4678
2.6
Wake-up
The WAKEUP input pin wakes the RN4678 module
from Deep Sleep mode. The WAKEUP pin is active-low
and puts the module in Standby mode. The following
figure illustrates the timing diagram of the RN4678 in
the Wake-up mode.
FIGURE 2-5:
WAKE-UP TIME(1)
WAKE UP
P0_4
P1_5
85ms
Note 1: The 85 ms is for reference time. Use the Status Indication pins to verify the exact results.
2.7
External Reset
The RN4678 provides an External Reset pin which
resets the module. The Reset pin, RST_N, is activelow. The following figure shows the timing diagram for
the RST_N pin of the RN4678 module.
FIGURE 2-6:
TIMING WAVEFORMS ON RESET(1,2)
RST_N
RST_N state
RST_N
trigger
System RESET
P0_4
P1_5
4 ms
350 ms
Note 1: The RST_N state trigger must be greater than 63 ns.
2: Time duration (350 ms) is for reference purpose only. Use the Status Indication pins to verify the exact results.
2016-2022 Microchip Technology Inc.
DS50002519G-page 12
RN4678
2.8
LED Driver
The following are the LED status indications. Each
indication is a configurable flashing sequence:
The RN4678 has a dedicated LED driver and the LED
can be connected directly to this pin, as shown in the
following figure.
The maximum current sourcing for the LED is 5 mA.
The brightness of this LED can be configured via an
ASCII command.
•
•
•
•
•
FIGURE 2-7:
2.9
LED DRIVER
FIGURE 2-8:
(3.3V to 4.2V)
Host MCU Interface Over UART
The following figure illustrates an example of the UART
interface with host MCU and a power scheme using
3.3V to the VDD. From the LDO33_O pin, voltage can
be routed to the VDD_IO pin and the external circuitry,
including the MCU. This power scheme ensures that
the RN4678 and the MCU I/O voltages are compatible.
LDO33_O
LED1
Standby
Link Back
Low Battery
Inquiry
Link
RN4678518
Module
Note:
The internal 3.3V LDO current source
must not exceed 50 mA (maximum).
POWER AND MCU INTERFACE EXAMPLE FOR RN4678
3.3V
P1_5/STATUS_IND_1
I/O
P0_4/UART_TX_IND/STATUS_IND_2
I/O
SW_BTN
WAKE_UP
RST_N
I/O
I/O
I/O
BAT_IN
10uF
LDO33_O
RN4678
MODULE
LDO18_O
Note:2
VDD_IO
(Note:1)
EAN
P2_4
P2_0
LED
P3_7
P3_4
P3_3
P3_2
P3_1
P0_5
I/O
I/O
I/O
I/O
I/O
I/O
P0_0/RTS
P1_7/CTS
CTS
RTS
TXD
RXD
RX
TX
VDD
HOST
MCU
System Configuration
Note 1: Ensure that VDD_IO and MCU VDD voltages are compatible.
2: The control and indication ports are configurable.
2016-2022 Microchip Technology Inc.
DS50002519G-page 13
Reference Circuit
The following figure illustrates the reference schematic of the power supply
design implemented for the RN4678.
RN4678 REFERENCE CIRCUIT
BAT_IN
C3
LDO33_O
4
6
7
10
8
R4
C4
10 μF
U1
RN4678
1 μF
100R
D1
BLUE
30
GND
BAT_IN
LDO33_O
VDD_IO
PMULDO_O
LDO18_O
LED
GND
MCU
Status indication
UART
11
P0_4
12
P1_5
RXD
TXD
P1_7
P0_0
22
UART_RX
23
UART_TX
15
P1_7/CTS
17
P0_0/RTS
P1_2
P1_3
13
P1_2
14
P1_3
5
SW_BTN
9
WAKEUP
21
RST
P0_5
P3_1
P3_2
P3_3
P3_4
P3_6
P3_7
16
24
25
26
27
28
29
SW_BTN
W-UP
RST
W-UP
RST
SW2
P0_5
P3_1
P3_2
P3_3
P3_4
P3_6
P3_7
SW3
RESET
GND
WAKEUP
GND
SW_BTN
1
2
3
31
32
33
18
19
20
Functional GPIO
RESET, W-UP, SW-BTN
P0_4
P1_5
GND
GND
GND
GND
GND
GND
P2_0
P2_4
EAN
FIGURE 2-9:
B
2016-2022 Microchip Technology Inc.
2.10
SW1
SW_BTN
R1
20k
6
5
4
GND
GND
RN4678
DS50002519G-page 14
System
Configuration
3
2
1
JP1
JP2
JP3
LDO33_O
RN4678
3.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the electrical characteristics of the RN4678 module. Additional information is
provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the RN4678 devices are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-20°C to +70°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Maximum output current sunk by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin.....................................................................................................12 mA
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 15
RN4678
The following tables provide the recommended
operating conditions and the electrical specifications of
the module.
TABLE 3-1:
RECOMMENDED OPERATING CONDITIONS
Rating
Min.
Typical
Max.
Ambient Operating Temperature Range
-20ºC
+25ºC
+70ºC
Relative Humidity (Operating)
10%
—
90%
10%
—
90%
—
±2 KV
—
Relative Humidity (Storage)
ESD
HBM
MM
HTOL(1)
—
±200V
—
—
1000 hrs
—
Supply Voltage: BAT_IN
3.3V
—
4.2V
Supply Voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR
1.8V
1.9V
2.1V
SW_BTN
3.3V
—
4.2V
—
—
3.6V
LED1
Reset VTH,res Threshold Voltage
—
1.6V
—
VIL Input Logic Level Low
-0.3V
—
0.8V
VIH Input Logic Level High
2.0V
—
3.6V
—
—
0.4V
VOL Output Logic Level Low (IOl = 12 mA)
VOH Output Logic Level High (IOh = 12 mA)
2.4V
—
—
RF Continuous TX Mode
—
—
43 mA
RF Continuous RX Mode
—
—
37 mA
Note 1:
HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V.
TABLE 3-2:
3.3V LDO ELECTRICAL PARAMETERS(1,2)
Parameter
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
Output Current (VIN = 3.6V/Load Regulation with 100 mV Drop)
—
100
—
mA
Quiescent Current (VIN = 3.6V)
—
150
—
µA
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
Output Current (VIN = 3.6V/Load Regulation with 0.3 mV Drop)
—
100
—
µA
Quiescent Current (VIN = 3.6V)
—
120
—
µA
Note 1:
2:
With 10 µF capacitor at LDO33_O as the condition for IP verification.
Output voltage can be calibrated using the MP tool.
TABLE 3-3:
PMU LDO(1,2)
Parameter
Note 1:
2:
With 1 µF capacitor at PMULDO_O as the condition for IP verification.
Output voltage can be calibrated by using the MP tool.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 16
RN4678
TABLE 3-4:
SAR-ADC AND BATTERY VOLTAGE DETECTOR
Parameter
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
AVDD_SAR Power Supply
—
1.8
—
V
SAR_BAT Detection
(1)
3.3
—
4.2
V
Resolution
—
10
—
bit
Operating Current (including band gap)
—
—
1
mA
Deep Sleep Current
—
—
1
µA
Note 1:
SAR_BAT is connected with BAT_IN internally for battery voltage detection.
TABLE 3-5:
INTENSITY CONTROLLABLE LED DRIVER
Parameter
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
Open-Drain Voltage
—
—
3.6
V
Current Step
—
0.3
—
mA
Programmable Current Range
0
—
5
mA
Intensity Control
—
16
—
step
Power-Down Open-Drain Current
—
—
1
µA
Deep Sleep Current
—
—
1
µA
TABLE 3-6:
POWER CONSUMPTION-CLASSIC(1)
Test Condition
Current Consumption (avg.) (mA)
Remarks
Standby Mode
2.543
—
Deep Sleep Mode
0.281
—
Connected+Sniff, Master (no data)
0.710
No data were transmitted,
Sniff interval = 500 ms
Connected+Sniff, Slave (no data)
0.70
No data were transmitted,
Sniff interval = 500 ms
Data, Master
14.08
Data transmitted at 115200 bps,
Block size = 500
Data, Slave
19.06
Data transmitted at 115200 bps,
Block size = 500
Note 1:
Classic BR/EDR and RX_IND functions are enabled.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 17
RN4678
TABLE 3-7:
POWER CONSUMPTION-LOW ENERGY(1,2)
Test Condition
Deep Sleep mode
LE Fast Advertising
Current Consumption
(avg.) (mA)
Remarks
0.28
—
2.09
LE fast advertising interval = 100 ms
1.51
LE fast advertising interval = 160 ms
0.63
LE fast advertising interval = 500 ms
2.75
LE fast advertising interval = 100 ms + Beacon 100 ms
0.83
LE fast advertising interval = 500 ms + Beacon 500 ms
0.62
LE reduced power advertising interval = 961 ms
1.65
LE reduced power advertising
interval = 961 ms + Beacon 100 ms
0.84
LE reduced power advertising
interval = 961 ms + Beacon 500 ms
Connected (no data)
0.57
Connection interval = 1500 ms
0.61
Connection interval = 600 ms
Connected (iPhone® 6 to module)
0.45
Connection interval = 500 ms
Reduced Power Advertising
Connected (module to iPhone 6)
Note 1:
2:
0.60
Connection interval = 200 ms
6.6
Connection interval = 500 ms
7.0
Connection interval = 200 ms
Low energy RX_IND function is enabled.
Only low energy.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 18
RN4678
4.0
RADIO CHARACTERISTICS
The following table provides the transmitter
performance characteristics of the RN678/RN4678U
module.
TABLE 4-1:
TRANSMITTER PERFORMANCE(1,2)
Min.
Typical
Max.
Bluetooth®
Specification
BDR Power
—
1.5
—
-6 ~ +4
EDR (2M/3M) Power
—
-1
—
-6 ~ +4
LE Power
—
0.5
—
-20 ~ +10
Note 1:
2:
Unit
dBm
The RF transmit power can be calibrated during production by using the MP Tool software and the
MT8852 Bluetooth Test equipment.
Test condition: VCC RF = 1.80V, temperature = +25ºC.
The following table provides the receiver performance characteristics of the RN678/RN4678U module.
TABLE 4-2:
RECEIVER PERFORMANCE(1)
Min.
Typical
Max.
BDR Sensitivity
—
-90
—
EDR 2M Sensitivity
—
-90
—
EDR 3M Sensitivity
—
-82
—
LE Sensitivity
—
-92
—
Note 1:
Bluetooth®
Specification
Unit
≤-70
dBm
Test condition: VCC RF = 1.80V, temperature = +25ºC.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 19
RN4678
5.0
PHYSICAL DIMENSIONS
The following figure illustrates the physical dimensions
of the RN4678 module.
RN4678 MODULE DIMENSIONS
1
33
10.2
(Bottom View)
22.0
21.2
20.1
21.5
19.9
18.0
18.95
17.3
18.0
16.95
shield mounting hole
14.90
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
1.0mm
0.7mm
(Bottom View)
1.1mm
0.7
0.0
0.0
0.0
0.7mm
9.3
8.2
7.1
6.0
4.9
3.8
2.7
0.5mm
Dimentions are in millimeters
Tolerances:
2.4
0.6
0.0
11.2
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.8
shield
mounting
hole
12.0
22.0
21.2
20.1
(Side View)
11.2
0.8
2.0
(Top View)
2.0
FIGURE 5-1:
PCB Thickness: +/- 0.06 mm
1.0mm
Pad Detail
2016-2022 Microchip Technology Inc.
DS50002519G-Page 20
RN4678
The following figure illustrates the recommended host
PCB footprint.
FIGURE 5-2:
RN4678 RECOMMENDED PCB FOOTPRINT
11.2
9.2
2.0
(Top View)
22.0
Top Copper
21.2
Keep Out Area
20.1
18.0
18.0
16.0
0.5mm
1.5mm
13.9
12.8
11.7
10.6
9.5
Silkscreen
area
8.4
7.3
0.7mm
6.2
5.1
1.1mm
4.0
2.9
1.8
2016-2022 Microchip Technology Inc.
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.0
DS50002519G-Page 21
RN4678
The following figure illustrates the recommendations
for mounting the RN4678 on the host PCB, and also
shows the minimum ground plane area to the left and
right of the module for the best antenna performance.
Avoid the top copper layer near the test pin area. When
designing the host PCB, the areas under the antenna
must not contain any top, inner or bottom copper layer.
FIGURE 5-3:
A low-impedance ground plane ensures best radio
performance (best range and lowest noise). The
ground plane can be extended beyond the minimum
recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all
external metal at least 31 mm away from the ceramic
chip antenna.
RN4678 HOST PCB MOUNTING SUGGESTION
This area needs to
have top metal copper
that is connected to
Ground for optimal
functioning of the chip
antenna.
This purple hashed
area must not have
any top metal layer
copper. It can have
bottom copper layer.
This area (purple with
dots) needs to have
both top and bottom
copper layers
connected to Ground
for optimal operation
of the antenna.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 22
RN4678
6.0
REFLOW PROFILE
• Standard: IPC/JEDEC J-STD-020
- Condition: Preheat: 150~200ºC for
60 ~ 120 seconds.
- Average ramp-up rate (217ºC to peak):
3ºC/sec max.
- Temperature maintained above 217ºC:
60 ~ 150 seconds.
- Time within 5ºC of peak temperature:
30 ~ 40 seconds.
- Peak temperature: 260ºC +5/-0.
- Ramp-down rate (peak to 217ºC):
6ºC/sec. max.
- Time 25ºC to peak temperature:
8 minutes max.
- Cycle interval: 5 minutes.
It is highly recommended that the RN678/RN4678U be
assembled using a standard lead-free reflow profile,
IPC/JEDEC J-STD-020. The RN678/RN4678U can be
soldered to the host PCB by using the standard leaded
and lead-free solder reflow profile.
To avoid damage to the module, follow these
recommendations:
• Follow solder reflow recommendations provided
in Microchip Technology Application Note, AN233
“Solder Reflow Recommendation” (DS00233).
• Refer to the solder paste data sheet for specific
reflow profile recommendations.
• Do not exceed the Peak Temperature (TP) of +250ºC.
• Use no-clean flux solder paste.
• Do not wash as moisture can be trapped under
the shield.
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
FIGURE 6-1:
REFLOW PROFILE
Ramp-up Rate:
3ºC/sec max.
(217ºC to Peak)
Peak: 260ºC +5/-0
255ºC
Ramp-Down Rate:
6ºC/sec max.
(Peak to 217ºC)
217ºC
200ºC
150ºC
30 ~ 40 sec.
60 ~ 120 sec.
60 ~ 150 sec.
Time (sec)
2016-2022 Microchip Technology Inc.
DS50002519G-Page 23
RN4678
7.0
MODULE PLACEMENT
For a Bluetooth wireless product, the antenna placement affects the performance of the whole system. The
antenna requires free space to radiate the RF signal
and it cannot be surrounded by the ground plane.
Microchip recommends that the areas underneath the
antenna on the host PCB must not contain copper on
FIGURE 7-1:
TABLE 7-1:
the top, inner or bottom layer. The following figure illustrates an example of good and poor antenna placement
on a host PCB with ground plane.
The ground plane can be extended beyond the minimum recommended, as required for the main PCB
EMC noise reduction. For the best range performance,
keep all external metal away from the ceramic chip
antenna, that is, a minimum of 15 mm away.
MODULE PLACEMENT EXAMPLES
RECOMMENDED ANTENNA
Description
Manufacturer Part Number
Manufacturer
ANT ANT3216A063R2400A, PIFA, 2.4 GHz, L3.2W1.6
ANT3216A063R2400A
Yageo Corp.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 24
RN4678
The following figure illustrates the RN4678 module
mounted on the RN4678 Evaluation Board (EVB). It
also shows the recommended keep out area for the
antenna.
FIGURE 7-2:
Note:
KEEP OUT AREA RECOMMENDED FOR ANTENNA
For additional information on free space for antenna placement design, refer to the design rule document
of the antenna manufacturer.
2016-2022 Microchip Technology Inc.
DS50002519G-Page 25
RN4678
7.1
RN4678 Ceramic Chip Antenna
The RN4678 contains an integral ceramic chip
antenna. The following figure illustrates the antenna
radiation pattern of the ceramic chip antenna on the
RN4678.
FIGURE 7-3:
RN4678 ANTENNA RADIATION PATTERN
Parameter
Values
Frequency
2450 MHz
Peak Gain
1.63 dBi
Efficiency
71.55%
2016-2022 Microchip Technology Inc.
DS50002519G-Page 26
2016-2022 Microchip Technology Inc.
8.0
ORDERING INFORMATION
The following table provides ordering information for the RN678/RN4678U
module.
TABLE 8-1:
ORDERING INFORMATION
Device
RN4678-V/RM100
Microchip IC
IS1678SM
Antenna
Description
Shield
Regulatory Certification
Ordering Number
On-Board BT Dual Mode, Class 2
Yes
FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678-V/RM100
RN4678APL-V/RM100 IS1678SM
On-Board BT Dual Mode, Class 2, Use with
Apple® MFI
Yes
FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678APL-V/RM100
RN4678-V/RM113
IS1678SM
On-Board BT Dual Mode, Class 2
Yes
FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678-V/RM113
RN4678APL-V/RM113 IS1678SM
On-Board BT Dual Mode, Class 2
Yes
FCC, ISED, RED, MIC,
KCC, NCC, SRRC
RN4678APL-V/RM113
Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products.
RN4678
DS50002519G-Page 27
RN4678
9.0
REGULATORY APPROVAL
This section outlines the regulatory information for the
RN4678 module for the following countries:
•
•
•
•
•
•
•
United States
Canada
Europe
Japan
Korea
Taiwan
Other Regulatory Jurisdictions
9.1
United States
The RN4678 module has received Federal Communications Commission (FCC) CFR47 Telecommunications,
Part 15 Subpart C “Intentional Radiators” single modular
approval in accordance with Part 15.212 Modular
Transmitter approval. Single modular transmitter
approval is defined as a complete RF transmission subassembly, designed to be incorporated into another
device, that must demonstrate compliance with FCC
rules and policies independent of any host. A transmitter
with a Modular Grant can be installed in different end-use
products (referred to as a host, host product or host
device) by the Grantee or other equipment manufacturer,
then the host product may not require additional testing
or equipment authorization for the transmitter function
provided by that specific module or limited module
device.
The user must comply with all of the instructions
provided by the Grantee, which indicate installation
and/or operating conditions necessary for compliance.
A host product itself is required to comply with all other
applicable FCC equipment authorization regulations,
requirements and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regulations for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification or
Declaration of Conformity) as appropriate (e.g.,
Bluetooth and Wi-Fi® transmitter modules may also
contain digital logic functions).
9.1.1
LABELING AND USER
INFORMATION REQUIREMENTS
The RN4678 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label can use wording
as follows:
Contains Transmitter Module
FCC ID: A8TBM78ABCDEFGH
or
Contains FCC ID: A8TBM78ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation.
A user’s manual for the product should include the
following statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment
and receiver.
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV
technician for help.
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division
Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm.
2016-2022 Microchip Technology Inc.
DS50002519G-page 28
RN4678
9.1.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB Publication 447498
General RF Exposure Guidance provides guidance in
determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for
human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission
(FCC).
Output power listed is conducted. This grant is valid
only when the module is sold to OEM integrators and
must be installed by the OEM or OEM integrators. This
transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification
and must not be co-located or operating in conjunction
with any other antenna or transmitters within a host
device, except in accordance with FCC multitransmitter
product procedures. This module is approved for
installation into mobile or/and portable host platforms.
9.1.3
APPROVED ANTENNAS
To maintain modular approval in the United States,
only the antenna types that have been tested shall be
used. It is permissible to use a different antenna, provided it is the same antenna type, antenna gain (equal
to or less than), with similar in-band and out-of-band
characteristics (refer to specification sheet for cutoff
frequencies).
For RN4678, the approval is received using an integral
chip antenna.
9.1.4
HELPFUL WEBSITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET)
Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
9.2
Canada
The RN4678 module has been certified for use in
Canada under Innovation, Science and Economic
Development Canada (ISED, formerly Industry
Canada), Radio Standards Procedure (RSP) RSP-100,
Radio Standards Specification (RSS) RSS-Gen and
RSS-247. Modular approval permits the installation of
a module in a host device without the need to recertify
the device.
2016-2022 Microchip Technology Inc.
9.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements (from RSP-100, Issue 12,
Section 5): The host product shall be properly labeled
to identify the module within the host device.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host product;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word, “Contains”, or similar wording expressing
the same meaning, as follows:
Contains transmitter module
IC: 12246A-BM78SPPS5M2
User Manual Notice for License-Exempt Radio Apparatus
(from Section 8.4, RSS-Gen, Issue 5, March 2019):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a conspicuous location in the user manual, or alternatively on the
device or both:
This device contains license-exempt transmitter(s)/
receiver(s) that comply with Innovation, Science and
Economic Development Canada’s license-exempt
RSS(s). Operation is subject to the following two
conditions:
1. This device may not cause interference;
2. This device must accept any interference,
including interference that may cause undesired
operation of the device.
L’émetteur/récepteur exempt de licence contenu
dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement
économique Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux
deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage
est susceptible d’en compromettre
le fonctionnement.
DS50002519G-page 29
RN4678
Transmitter Antenna (from Section 6.8 RSS-GEN,
Issue 5, March 2019): User manuals for transmitters
shall display the following notice in a conspicuous
location:
This radio transmitter [IC: 12246A-BM78SPPS5M2]
has been approved by Innovation, Science and
Economic Development Canada to operate with the
antenna types listed below, with the maximum permissible gain indicated. Antenna types not included
in this list that have a gain greater than the maximum
gain indicated for any type listed are strictly
prohibited for use with this device.
Le présent émetteur radio
[IC: 12246A-BM78SPPS5M2] a été approuvé par
Innovation, Sciences et Développement économique
Canadapour fonctionner avec les types d'antenne
énumérés cidessous et ayant un gain admissible
maximal Les types d'antenne non inclus dans cette
liste, et dont le gain est supérieur au gain maximal
indiqué pour tout type figurant sur la liste, sont
strictement interdits pour l'exploitation de l'émetteur.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for
use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for
each.
9.2.2
RF EXPOSURE
9.3
Europe
The RN4678 module is Radio Equipment Directive
(RED) assessed, CE marked, and has been manufactured and tested with the intention of being integrated
into a final product.
The RN4678 module has been tested to RED 2014/53/
EU Essential Requirements mentioned in the following
European Compliance table.
TABLE 9-1:
EUROPEAN COMPLIANCE
Certification
Standards
Safety
EN 62368
Health
EN 62311
Electromagnetic
Compatibility (EMC)
EN 301 489-1
Radio
EN300 328
Article
3.1a
3.1b
EN 301 489-17
3.2
The ETSI provides guidance on modular devices in
“Guide to the application of harmonised standards covering Article 3.1b and Article 3.2 of the Directive 2014/
53/EU RED to multi-radio and combined radio and
non-radio equipment” document available at:
http://www.etsi.org/deliver/etsi_eg/203300_203399/
203367/01.01.01_60/eg_203367v010101p.pdf.
Note:
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in
RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All
Frequency Bands).
To maintain conformance to the standards
listed in the preceding European Compliance table, the module shall be installed in
accordance with the installation instructions in this data sheet and shall not be
modified. When integrating a radio module
into a completed product, the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
This transmitter is restricted for use with a specific
antenna tested in this application for certification and
must not be co-located or operating in conjunction with
any other antenna or transmitters, except in
accordance with Innovation, Science and Economic
Development Canada multitransmitter guidelines.
9.3.1
The device operates at an output power level which is
within the ISED SAR test exemption limits at any user
distance.
The label on the final product which contains the
RN4678 module must follow CE marking requirements.
9.2.3
9.3.2
APPROVED ANTENNAS
LABELING AND USER
INFORMATION REQUIREMENTS
CONFORMITY ASSESSMENT
For RN4678, the approval is received using an integral
chip antenna.
From ETSI Guidance Note EG 203367, Section 6.1,
non-radio products are combined with a radio product:
9.2.4
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equivalent assessment conditions (i.e., host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the
combined equipment against Article 3.2 of the RED is
required.
HELPFUL WEBSITES
Innovation, Science and Economic Development
Canada (ISED): http://www.ic.gc.ca/.
2016-2022 Microchip Technology Inc.
DS50002519G-page 30
RN4678
9.3.2.1
Simplified EU Declaration of
Conformity
Hereby, Microchip Technology Inc. declares that the
radio equipment type RN4678 is in compliance with
Directive 2014/53/EU.
The full text of the EU declaration of conformity for this
product is available at:
https://www.microchip.com/wwwproducts/en/RN4678
(available under Documents > Certifications).
9.3.3
APPROVED ANTENNAS
For RN4678, the approval is received using an integral
chip antenna.
9.3.4
9.4.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4678 module must follow Japan marking
requirements. The integrator of the module must refer
to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC)
website.
The RN4678 module is labeled with its own technical
conformity mark and certification number. The final
product in which this module is being used must have
a label referring to the type certified module inside:
HELPFUL WEBSITES
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in
Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be
downloaded from the European Radio Communications
Committee (ECC) at: http://www.ecodocdb.dk/.
Additional helpful websites are:
9.4.2
HELPFUL WEBSITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
• Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/
european-standards/harmonised-standards/red_en
• European Conference of Postal and
Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards
Institute (ETSI): http://www.etsi.org
• The Radio Equipment Directive Compliance
Association (REDCA): http://www.redca.eu/
Association of Radio Industries and Businesses (ARIB):
http://www.arib.or.jp/english/
9.4
9.5.1
Japan
The RN4678 module has received type certification,
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installation
instructions are followed and no modifications of the
module are allowed. Additional testing may be required:
9.5
Korea
The RN4678 module has received certification of
conformity in accordance with the Radio Waves Act.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
RN4678 module must follow KC marking requirements.
The integrator of the module should refer to the labeling
requirements for Korea available on the Korea
Communications Commission (KCC) website.
The RN4678 module is labeled with its own KC mark.
The final product requires the KC mark and certificate
number of the module:
• If the host product is subject to electrical appliance
safety (for example, powered from an AC mains),
the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The
integrator must contact their conformance
laboratory to determine if this testing is required.
• There is a voluntary Electromagnetic Compatibility
(EMC) test for the host product administered by
VCCII: http://www.vcci.jp/vcci_e/index.html.
2016-2022 Microchip Technology Inc.
DS50002519G-page 31
RN4678
9.5.2
HELPFUL WEBSITES
9.6.2
HELPFUL WEBSITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Communications Commission (NCC):
http://www.ncc.gov.tw
National Radio Research Agency (RRA):
http://rra.go.kr
9.7
9.6
Taiwan
The RN4678 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product must contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
9.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
China
The RN4678 module has received certification of conformity in accordance with the China MIIT Notice 2014-01
of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final
product does not require additional radio certification
provided installation instructions are followed and no
modifications of the module are allowed.
For expiry date, refer to SRRC certificate available at:
https://www.microchip.com/wwwproducts/en/RN4678
9.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
The RN4678 module is labeled with its own CMIIT ID
as follows:
For the RN4678 module, due to limited module size, the
NCC mark and ID are displayed in the data sheet and/or
packaging, and cannot be displayed on the module label:
CMIIT ID: 2016DJ5735
When the host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label
containing the statement, “This device contains SRRC
approved Radio module CMIIT ID: 2016DJ5735”.
Refer to the SRRC certificate available in the RN4678
product page for expiry date.
The user’s manual must contain below warning (for RF
device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
9.8
UKCA (UK Conformity Assessed)
The RN4678 module is a UK conformity assessed
radio module that meets all the essential requirements
according to CE RED requirements.
9.8.1
LABELING REQUIREMENTS FOR
MODULE AND USER’S
REQUIREMENTS
The label on the final product that contains the RN4678
module must follow the UKCA marking requirements.
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
2016-2022 Microchip Technology Inc.
DS50002519G-page 32
RN4678
to recertify the module for other reasons, contact
Microchip for the required utilities and
documentation.
The UKCA mark above is printed on the module itself
or on the packing label.
Additional details for the label requirement are available at:
https://www.gov.uk/guidance/using-the-ukca-marking#check-whether-you-need-to-use-the-new-ukcamarking.
9.8.2
UKCA DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type RN4678 is in compliance with the
Radio Equipment Regulations 2017.
The full text of the UKCA declaration of conformity for
this product is available (under Documents > Certifications) at:
• https://www.microchip.com/en-us/product/
RN4678
9.8.3
APPROVED ANTENNAS
The testing of the RN4678 module was performed with
the antennas listed in Table 7-1 and Figure 7-3.
9.8.4
HELPFUL WEB SITES
For more information on the UKCA regulatory approvals, refer to the https://www.gov.uk/guidance/placingmanufactured-goods-on-the-market-in-great-britain.
9.9
Other Regulatory Information
• For information about other countries’ jurisdictions
not covered here, refer to:
www.microchip.com/RN4678
(available under Documents>Certifications).
• Should other regulatory jurisdiction certification be
required by the customer, or the customer needs
2016-2022 Microchip Technology Inc.
DS50002519G-page 33
RN4678
APPENDIX A:
REVISION HISTORY
Revision G (July 2022)
This revision includes the following changes:
TABLE G-1:
MAJOR SECTION UPDATES
Section
“UKCA (UK Conformity Assessed)”
Description
Added UKCA regulatory approval information.
Revision F (February 2021)
Revision C (March 2019)
• Updated Table 1-1.
• Updated Section 9.2.1 “Labeling and User
Information Requirements”.
• Added Section 9.1.3 “Approved Antennas”.
• Added Section 9.2.3 “Approved Antennas”.
• Updated Section 9.3 “Europe”.
• Updated Section 9.7 “China”.
This revision includes the following changes and minor
updates to text and formatting, which were
incorporated throughout the document.
Revision E (February 2020)
Updated Figure 2-9.
Revision D (May 2019)
Updated China labeling ID in Section 9.7.1 “Labeling
and User Information Requirements”.
TABLE A-1:
MAJOR SECTION UPDATES
Section
Description
“Features”
Updated certification information
“Data Throughput”
Updated Kbytes/s
Section 1.0 “Device Overview”
Updated Figure 1-1 and Table 1-1
Section 2.0 “Application Information”
• Updated Table 2-3
• Added SW_BTN note in Section 2.5 “Software Button
(SW_BTN)”
Section 3.0 “Electrical Characteristics”
• Updated storage temperature
• Updated current consumption values in Table 3-6 and Table 3-7
Section 5.0 “Physical Dimensions”
Updated Figure 5-1 and Figure 5-2
Section 8.0 “Ordering Information”
Updated Table 8-1 with certification information
Section 9.0 “Regulatory Approval”
•
•
•
•
Updated IC to ISED in Section 9.2 “Canada”
Updated RED certification information in Section 9.3 “Europe”
Updated Section 9.6 “Taiwan”
Added Section 9.7 “China”
Revision B (January 2018)
• Updated Figure 1-1, Figure 1-2, and Figure 5-3.
• Updated Table 1-1.
• Added Section 2.2 “Flow Control”.
2016-2022 Microchip Technology Inc.
• Updated Section 8.0 “Ordering Information”
• Updated Section “Product Identification
System”
• Removed Figure 1-3, Figure 2-9, Figure 5-4,
Figure 5-5, and Figure 5-6.
DS50002519G-page 34
RN4678
Revision A (June 2016)
This is the initial released version of the document.
2016-2022 Microchip Technology Inc.
DS50002519G-page 35
RN4678
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2016-2022 Microchip Technology Inc.
DS50002519G-page 36
RN4678
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.
V
PART NO.
Temperature
Range
Device
RM
XXX
Package
Firmware
Revision
Number
Device:
RN4678:
Temperature
Range:
V
= -20C to +70C (Various)
Package:
RM
= Radio Module
Example:
RN4678-V/RM100: Various temperature
Ceramic Chip Antenna
2016-2022 Microchip Technology Inc.
DS50002519G-page 37
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AVR,
AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory,
CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq,
Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB,
megaAVR, Microsemi, Microsemi logo, MOST, MOST logo,
MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity,
SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer,
Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are
registered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge,
ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, Clockstudio, CodeGuard, CryptoAuthentication,
CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, InCircuit Serial Programming, ICSP, INICnet, Intelligent Paralleling,
IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display,
KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, Trusted Time, TSHARC, USBCheck, VariSense,
VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016-2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2016-2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-6683-0556-0
DS50002519G-page 38
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
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Tel: 91-80-3090-4444
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DS50002519G-page 39
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