SG109T-883B

SG109 5 - Volt Fixed Voltage Regulators Description Features The SG109 is a self-contained 5V regulator designed to provide local regulation at currents up to 1A for digital logic cards. This device is available in the hermetic TO-3 and TO-39 packages.  Fully Compatible with TTL and DTL      Output Current in Excess of 1A Internal Thermal Overload Protection No Additional External Components Bandgap Reference Voltage Foldback Current Limiting The SG109's design has protective features principally current limiting to control the peak currents and thermal shutdown to protect against excessive power dissipation. These features make the device blowout proof. With the only added component being an optional input bypass capacitor, this regulator becomes extremely easy to apply. Utilizing an improved Bandgap reference design, problems that are normally associated with the Zener diode references, such as, drift in output voltage and large changes in the line and load regulation have been eliminated. High Reliability Features Following are the high reliability features of SG109:  Available to MIL-STD-883, ¶ 1.2.1  MSC-AMS level "S" processing available  MIL-M38510/10701BXA SG109T-JAN Block Diagram Figure 1 · Block Diagram February 2015 Rev 1.2 www.microsemi.com © 2015 Microsemi Corporation 1 Absolute Maximum Ratings (Note 1) Operating Junction Temperature Hermetic (K and T Packages).................................. 150°C Lead Temperature (Soldering, 10 Seconds) ........... 300°C Input Voltage ........................................................................ 35V Power Dissipation ........................................... Internally Limited Storage Temperature Range ............................. -65°C to 150°C Note 1. Exceeding these ratings could cause damage to the device. Thermal Data K Package: Thermal Resistance - Junction to Case, θJC ............. 3.0°C/W Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA). Note B. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. Thermal Resistance - Junction to Ambient, θJA ....... .. 35°C/W T Package: Thermal Resistance-Junction to Case, θJC ................ 15°C/W Thermal Resistance-Junction to Ambient, θJA .......... 120°C/W Recommended Operating Conditions (Note 2) Operating Junction Temperature Range Input Voltage Range ............................................... 7.0V to 25V SG109 ....................................................... -55°C to 150°C Note 2. Range over which the device is functional. Electrical Characteristics (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG109 with -55°C ≤ TA ≤ 150°C and for VIN = 10V, IOUT = 500mA (K-package) and I = 100mA (T-package). Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.) Parameter Output Voltage Line Regulation Load Regulation Total Output Voltage Tolerance Quiescent Current Quiescent Current Change Output Noise Voltage Long Term Stability Ripple Rejection Test Conditions TA = 25°C VIN = 7.1V to 25V, TA = 25°C TA = 25°C K-Package: IOUT = 5mA to 1.5A T-package: IOUT =5mA to 500mA VIN= 7.4V to 25V K-Package: IOUT = 5mA to 1.0A, P ≤ 20W T-package: IOUT =5mA to 200mA, P ≤ 2W VIN = 7.4V to 25V With Line : VIN = 7.4V to 25V With Load: K-Package: IOUT = 5mA to 1.0A T-package: IOUT =5mA to 200mA f = 10Hz to 100kHz, TA = 25°C Min. 4.7 4.6 4.6 50 TA = 25°C 2 SG109 Typ. 5.05 4.0 Max. 5.3 50 15 15 100 50 mV mV 5.0 5.0 5.4 5.4 10 0.5 0.8 0.8 V 40 10 Units V mV mA mA mA mA µV mV dB Application Circuits INPUT OUTPUT 1kΩ * Required if regulator is in appreciable distance from power supply filter. ** Although no output capacitor is needed for stability it does improve transient response. Figure 3 · Adjustable Output Regulator Figure 2 · Fixed 5V Regulator Connection Diagrams and Ordering Information (See Notes Below) Package Part No. 3-TERMINAL TO-3 METAL CAN K-PACKAGE SG109K-883B SG109K Ambient Temperature Range -55°C to 125°C -55°C to 125°C Connection Diagram VIN 1 2 CASE IS GROUND VOUT 3-PIN TO-39 METAL CAN T-PACKAGE SG109T-883B SG109T-JAN SG109T -55°C to 125°C -55°C to 125°C -55°C to 125°C VOUT 2 GND 3 1 VIN CASE IS GROUND Note 1. Contact factory for JAN product availability. 2. All parts are viewed from the top. 3. Packages use Pb37/Sn63 hot solder lead finish, contact factory for availability of RoHS versions. 3 Package Outline Dimensions Package Outline Dimensions Controlling dimensions are in inches, metric equivalents are shown for general information. D DIM MAX 7.62 30.40 1.09 0.270 1.177 0.038 0.300 1.197 0.043 L D S e 19.43 16.64 10.67 19.68 17.14 11.18 0.765 0.655 0.420 0.775 0.675 0.440 e1 F 5.21 1.52 5.72 2.03 0.205 0.060 0.225 0.080 fp 3.84 4.09 0.151 0.161 L R1 R 10.79 3.33 12.57 12.19 4.78 13.34 0.425 0.131 0.495 0.480 0.188 0.525 R 2 e e1 MIN 6.86 29.90 0.97 S fp MAX A q b q R1 INCHES MIN A F b MILLIMETERS Note: 1 Dimensions do not include protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage. Figure 4 · K 3-Pin Metal Can TO-3 Package Dimensions D D1 Q A e F 2 b L1 3 1 e1 L α b1 k DIM MILLIMETERS MIN MAX INCHES MIN MAX A b b1 D D1 e e1 F k k1 L L1 Q α 4.19 4.70 0.41 0.48 0.41 0.53 8.89 9.40 8.13 8.51 5.08 BSC 2.54 TYP 1.02 0.71 0.86 0.74 1.14 12.70 14.48 1.27 90° TYP 45° TYP 0.165 0.185 0.016 0.019 0.016 0.021 0.350 0.370 0.320 0.335 0.200 BSC 0.100 TYP 0.040 0.028 0.034 0.029 0.045 0.500 0.570 0.050 90° TYP 45° TYP Note: k1 Dimensions do not include protrusions; these shall not exceed 0.155mm (.006”) on any side. Lead dimension shall not include solder coverage. Figure 5 · T 3-Pin Metal Can TO-39 Package Dimensions 4 Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 E-mail: sales.support@microsemi.com © 2015 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. 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