SG1503/SG2503/SG3503
Precision 2.5-Volt Reference
Description
The SG1503 is a monolithic integrated circuit
implementing a self-contained precision voltage
reference generator. It is internally trimmed for ±1%
accuracy and requires less than 2mA quiescent
current. SG1503 can deliver greater than 10mA output
current while achieving total load and line induced
tolerances of less than 0.5%.
In addition to voltage accuracy, internal trimming
achieves a temperature coefficient of output voltage of
typically 10 ppm/°C. As a result, these references are
excellent choices for applications in critical
instrumentation and D-to-A converter systems. The
SG1503 is specified for operation over the full military
ambient temperature range of -55°C to 125°C, while
the SG2503 is designed for -25°C to 85°C and the
SG3503 for commercial applications of 0°C to 70°C.
Features
Output Voltage Trimmed to ±1%
Input Voltage Range of 4.5V to 40V
Temperature Coefficient of 10ppm/°C
Quiescent Current Typically 1.5mA
Output Current in excess of 10mA
Interchangeable with MC1503 and AD580
Application
Available to MIL-STD-883, ¶ 1.2.1
Available to DSCC
Standard Microcircuit Drawing (SMD)
®
Microsemi Level “S” Processing Available
Functional Diagram
VIN
I1 = I2
VO
1.25V
GND
Figure 1 · Functional Block Diagram
December 2014 Rev. 1.3a
www.microsemi.com
© 2014 Microsemi Corporation
1
Precision 2.5-Volt Reference
Connection Diagrams and Ordering Information
Ambient
Temperature
Type
Package
Part Number
8-PIN
ceramic
DIP
SG1503Y-DESC
SG1503Y
Packaging
Type
Connection Diagram
SG1503Y-883B
-55°C to 125°C
Y
-25°C to 85°C
0°C to 70°C
-25°C to 85°C
M
0°C to 70°C
-25°C to 85°C
DM
0°C to 70°C
8-PIN
plastic DIP
Pb-free /
RoHS
Transition
DC: 0503*
8-PIN
plastic
SOIC
Pb-free /
RoHS
Transition
DC: 0440*
CERDIP
SG2503Y
SG3503Y
SG2503M
PDIP
SG3503M
SG2503DM
SOIC
SG3503DM
VIN
1
8
N.C.
Vout
2
7
N.C.
GND
3
6
N.C.
N.C.
4
5
N.C.
Y Package: PbSn Lead Finish
M Package: Pb-free / RoHS 100%
Matte Tin Lead Finish
VIN
1
8
VOUT
GND
N.C.
2
7
3
6
4
5
DM Package: Pb-free / RoHS
100% Matte Tin Lead Finish
SG1503T-883B
-55°C to 125°C
T
-25°C to 85°C
0°C to 70°C
3-PIN
METAL
CAN
2
2
TO-39
GND
3
1
VIN
SG2503T
SG3503T
Notes:
1. Contact factory for JAN and DESC product availability.
2. All packages are viewed from the top.
*RoHS compliant
VOUT
SG1503T-DESC
SG1503T
N.C.
N.C.
N.C.
N.C.
T Package: PbSn Lead Finish
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Input Voltage
Storage Temperature Range
Value
Units
40
V
°C
-65 to 150
Operating Junction Temperature
Hermetic (T, Y Packages)
150
Plastic (M, DM Packages)
Lead Temperature (Soldering, 10 seconds)
150
300
260 (+0, -5)
°C
°C
°C
°C
Value
Units
Thermal Resistance-Junction to Case, θJC
15
°C/W
Thermal Resistance-Junction to Ambient, θJA
Y Package
120
°C/W
Thermal Resistance-Junction to Case, θJC
Thermal Resistance-Junction to Ambient, θJA
50
130
°C/W
°C/W
M Package
Thermal Resistance-Junction to Case, θJC
60
°C/W
95
°C/W
Pb-free / RoHS Peak Solder Reflow Temp (40s max. exp.)
Note: Exceeding these ratings could cause damage to the device.
Thermal Data
Parameter
T Package
Thermal Resistance-Junction to Ambient, θJA
DM Package
Thermal Resistance-Junction to Case, θJC
55
°C/W
Thermal Resistance-Junction to Ambient, θJA
165
°C/W
Notes:
1. Junction Temperature Calculation: TJ = TA + (PD × θJA).
2. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
3
Precision 2.5-Volt Reference
Recommended Operating Conditions
Value
Units
4.5 to 40
V
SG1503
-55 to 125
°C
SG2503
-25 to 85
°C
0 to 70
°C
Parameter
Input Voltage
Operating Ambient Temperature Range
SG3503
Note: Range over which the device is functional.
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1503 with
-55°C ≤ TA ≤ 125°C, SG2503/SG3503 with 0°C ≤ TA ≤ 70°C, VIN = 15V, and IL = 0mA. Low duty cycle pulse testing
techniques are used that maintains junction and case temperatures equal to the ambient temperature.)
Test Conditions
Parameter
Output Voltage
Input Voltage
SG1503/2503
TA = 25°C
Min
2.485
TA = 25°C
4.7
4.5
Typ
2.500
VIN= 5V TO 15V
VIN = 15V TO 40V
Line Regulation
IL = 10mA
IL = 10mA, VIN = 30V
Load Regulation
Temperature Regulation
(SG1503 only)
(SG2503/SG3503 only)
Quiescent Current
Short Circuit Current
VIN = 40V
TA = 25°C
Ripple Rejection
Output Noise
f = 120Hz, TA = 25°C
BW = 10kHz, TA = 25°C
15
Voltage Stability
SG3503
Max
2.515
Min
2.475
40
40
4.7
4.5
Typ
2.500
Max
2.525
Units
V
40
40
V
V
1
3
3
5
1
3
3
10
mV
mV
3
4
5
8
3
4
10
15
mV
mV
15
2.5
20
5
5
10
mV
mV
1.5
20
2.0
30
1.5
20
2.0
30
mA
mA
15
76
100
76
100
dB
µV rms
250
250
µV/khr
Ripple Rejection – (dB)
Output Voltage – (V)
Characteristics Curves
2.52
2.50
VIN = 15V
IO = 0
2.48
-20
VIN = 15V
VIN = 10V
IO = 0
TA = 25 oC
-40
-60
-80
-50
0
50
100
150
Junction Temperature – (oC)
Figure 2 · Output Voltage versus Temperature
4
0
10
100
1k
10k
100k
Frequency – (Hz)
Figure 3. Ripple Rejection
1M
Package Outline Dimensions
Package Outline Dimensions
Controlling dimensions are in inches; metric equivalents are shown for general information.
Y 8-Pin CERDIP Package Dimensions
Dim
D
5
8
E
11
4
A
Q
SEATING
PLANE
e
H
c
L
b
INCHES
MIN
MAX
A
4.32
5.08
0.170
0.200
b
0.38
0.51
0.015
0.020
b2
1.04
1.65
0.045
0.065
c
0.20
0.38
0.008
0.015
D
9.52
10.29
0.375
0.405
E
5.59
7.11
0.220
0.280
e
eA
b2
MILLIMETERS
MIN
MAX
2.54 BSC
0.100 BSC
eA
7.37
7.87
0.290
0.310
H
0.63
1.78
0.025
0.070
L
3.18
4.06
0.125
0.160
α
-
15°
-
15°
Q
0.51
1.02
0.020
0.040
Note:
α
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension shall
not include solder coverage.
Figure 4 · Y 8-Pin CERDIP Package Dimensions
M 8-Pin PDIP Package Dimensions
Dim
D
A
A2
b
b2
c
D
E
e
E1
L
θ
8
E1
11
b2
A2
E
A
L
H
c
θ
e
b
MILLIMETERS
MIN
MAX
5.08
3.30 Typ.
0.38
0.51
0.76
1.65
0.20
0.38
10.16
7.62 BSC
2.54 BSC
6.10
6.86
3.05
0°
15°
INCHES
MIN
MAX
0.200
1.30 Typ.
0.145
0.020
0.030
0.065
0.008
0.015
0.400
0.300 BSC
0.100 BSC
0.240
0.270
0.120
0°
15°
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 5 · M 8-Pin PDIP Package Dimensions
5
Precision 2.5-Volt Reference
DM 8-Pin SOIC Package Dimensions
Dim
D
A
A1
A2
b
c
D
E
e
H
L
θ
*LC
8
H
E
1
e
A2
A
INCHES
MIN
MAX
0.053
0.069
0.004
0.010
0.049
0.060
0.013
0.020
0.007
0.010
0.189
0.205
0.228
0.244
0.050 BSC
0.150
0.158
0.016
0.050
0°
8°
0.004
*Lead Co-planarity
b
A1
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
1.25
1.52
0.33
0.51
0.19
0.25
4.83
5.21
5.79
6.20
1.27 BSC
3.81
4.01
0.40
1.27
0°
8°
.010
L
c
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 6 · DM 8-Pin SOIC Package Dimensions
T 3-Pin Metal Can TO-39
Dim
D
D1
Q
A
e
F
b
2
L1
e1
1
3
L
α
b1
k
k1
A
b
b1
D
D1
e
e1
F
k
k1
L
L1
Q
α
MILLIMETERS
MIN
MAX
4.19
4.70
0.41
0.48
0.41
0.53
8.89
9.40
8.13
8.51
5.08 BSC
2.54 TYP
1.02
0.71
0.86
0.74
1.14
12.70
14.48
1.27
90° TYP
45° TYP
INCHES
MIN
MAX
0.165
0.185
0.016
0.019
0.016
0.021
0.350
0.370
0.320
0.335
0.200 BSC
0.100 TYP
0.040
0.028
0.034
0.029
0.045
0.500
0.570
0.050
90° TYP
45° TYP
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 7 · T 3-Pin Metal Can TO-39
6
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SG1503/SG2503/SG3503.1/12.14
