SG2524BJ

SG1524B/SG2524B/SG3524B Datasheet Regulating Pulse Width Modulator July 2018 Regulating Pulse Width Modulator Contents 1 Revision History ............................................................................................................................. 1 1.1 Revision 2.0 ........................................................................................................................................ 1 1.2 Revision 1.4 ........................................................................................................................................ 1 1.3 Revision 1.1 ........................................................................................................................................ 1 2 Product Overview .......................................................................................................................... 2 2.1 Features .............................................................................................................................................. 2 2.2 High Reliability Features ..................................................................................................................... 2 2.3 Block Diagram ..................................................................................................................................... 3 3 Electrical Specifications .................................................................................................................. 4 3.1 Recommended Operating Conditions ................................................................................................ 6 3.2 Typical Performance Curves ............................................................................................................... 7 3.3 Absolute Maximum Ratings ................................................................................................................ 8 4 Package Information ...................................................................................................................... 9 4.1 Thermal Data .................................................................................................................................... 13 5 Ordering Information ................................................................................................................... 14 Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 Regulating Pulse Width Modulator 1 Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication. 1.1 Revision 2.0 Revision 2.0 was published in July 2018. In revision 2.0 of this document, the format was updated to the latest template. The following is the summary of changes in revision 2.0 of this document Corrected a typo in the title of the document. Formatting edits were done. 1.2 Revision 1.4 Revision 1.4 was published in December 2014. The following is the summary of changes in revision 1.4 of this document. Corrected a typo in the Features (see page 2) section. Corrected a typo in the Ordering Information (see page 14) section. 1.3 Revision 1.1 Revision 1.1 was published in February 1994. It was the first publication of this document. Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 1 Regulating Pulse Width Modulator 2 Product Overview The SG1524B is a pulse width modulator for switching power supplies, that gives improved performance over industry standards, like the SG1524. This is a direct pin-for-pin replacement for the earlier device, and combines advanced processing techniques and circuit design to provide improved reference accuracy, and extended common mode range at the error amplifier and current limit inputs. A DC-coupled flip-flop eliminates triggering and glitch problems, and a pulse width modulator data latch prevents edge oscillations. The circuit incorporates true digital shutdown for high speed response, while an under voltage lockout circuit prevents spurious outputs when the supply voltage is too low for stable operation. Full double-pulse suppression logic insures alternating output pulses when the shutdown pin is used for pulse-by-pulse current limiting. SG1524B is specified for operation over the full military ambient temperature range of –55 °C to 125 °C. It is characterized for the industrial range of –25 °C to 85 °C, and is designed for the commercial range of 0 °C to 70 °C. 2.1 Features The main features of SG1524B are as follows. 7 V to 40 V operation 5 V reference trimmed to ±1% 100 Hz to 400 kHz oscillator range Excellent external sync capability Dual 100 mA output transistors Wide current limit common mode range DC-coupled toggle flip-flop PWM data latch Undervoltage lockout Full double pulse suppression logic 60 V output collectors 2.2 High Reliability Features The high reliability features of SG1524B are as follows. Available to MIL-STD-883 MSC-AMS level "S" processing available Available to DSCC-standard microcircuit drawing (SMD) Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 2 Regulating Pulse Width Modulator 2.3 Block Diagram The following figure shows the block diagram of SG1524B. Figure 1 • SG1524B Block Diagram Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 3 Regulating Pulse Width Modulator 3 Electrical Specifications This section shows the electrical characteristics of SG1524B/SG2524B/SG3524B. If not specified, these specifications apply over the operating ambient temperatures for SG1524B with –55 °C ≤ TA ≤ 125 °C, SG2524B with –25 °C ≤ T A ≤ 85 °C, SG3524B with 0 °C ≤ T A ≤ 70 °C, and VIN = 20 V. Low duty cycle pulse testing techniques are used, that maintain junction and case temperatures equal to the ambient temperature. The following table shows the parameters and test conditions of SG1524B/SG2524B/SG3524B. Table 1 • Electrical Characteristics Parameter Test Conditions SG1524B/2524B SG3524B Units Min Typical Max Min Typical Max 4.95 4.90 Reference Section (IL = 0 mA) Output voltage TJ = 25 °C 5.00 5.05 5.00 5.10 V Line regulation VIN = 7 V to 40 V 3 20 3 30 mV Load regulation IL = 0 mA to 20 mA 5 30 5 50 mV Temperature stability1 Over operating temperature range 15 50 15 50 mV Total output voltage range Over line, load and temperature 4.90 5.20 V Short circuit current VREF–0 V 25 5.10 4.80 50 120 25 50 120 mA 4.3 4.5 4.7 4.2 4.5 4.9 V 42 45 48 40 45 50 kHz Undervoltage Lockout Section Threshold voltage Oscillator Section (FOSC = 45 kHz, RT = 2700 Ω, CT = 0.01 μF) Initial accuracy TJ = 25 °C Voltage stability VIN = 7 V to 40 V 0.1 1 0.1 1 % Temperature stability1 Over operating range 1 2 1 2 % Minimum frequency1 RT = 150 kΩ, CT = 0.1 μF 50 140 400 50 120 Hz Maximum frequency RT = 2 kΩ, CT = 470 pF 400 600 Sawtooth peak voltage VIN = 40 V Sawtooth valley voltage VIN = 7 V 400 600 3.5 3.9 3.5 kHz 3.9 V 0.6 1 0.6 1 V Clock amplitude 3.0 4.0 3.0 4.0 V Clock pulse width 0.2 0.5 1.2 0.2 0.5 1.2 µs 0.5 5 2 10 mV 1 5 1 10 µA Error Amplifier Section (VCM = 2.3 V to VREF) Input offset voltage Input bias current RS ≤ 2 kΩ Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 4 Regulating Pulse Width Modulator Parameter Test Conditions SG1524B/2524B Input offset current SG3524B Units 1 DC open loop gain RL ≥ 10 MΩ Output low level ISINK = 100 μA 60 78 0.2 1 60 0.5 78 0.2 µA dB 0.5 V VPIN 1 - VPIN 2 ≥ 150 mV Output high level ISource = 100 μA VPIN 2 - VPIN 1 ≥ 150 mV 3.8 4.2 3.8 4.2 V Common mode rejection VCM = 2.3 V to VREF 70 90 70 90 dB Supply voltage rejection VIN = 7 V to 40 V 76 100 76 100 dB Gain-bandwidth product1 TJ = 25 °C 1 2 1 2 MHz P.W.M. Comparator ( FOSC = 45 kHz, RT = 2700 Ω, CT = 0.01 μF) Minimum duty cycle VCOMP = 0.5 V Maximum duty cycle VCOMP = 3.9 V 0 45 49 180 200 220 –3 –10 0 % 45 49 % 170 200 230 mV –3 –10 µA Current Limit Amplifier Section (VCM = 0 V to 17.5 V) Sense voltage Input bias current Shutdown Input Section High input voltage High input current 2.0 VSHUTDOWN = 5 V 2.0 0.10.1 Low input voltage 11 V 0.10.1 11 mA 0.6 0.6 50 50 μA 0.4 2.0 V V Output Section for each Transistor Collector leakage current VCE = 60 V Collector saturation voltage IC = 10 mA IC = 100 mA Emitter output voltage IE = 10 mA IE = 100 mA Emitter voltage rise time1 RE = 2 kΩ, TA = 25 °C 0.2 0.5 0.2 0.5 μs Collector voltage fall time RC = 2 kΩ, TA = 25 °C 0.1 0.2 0.1 0.2 μs VIN = 40 V, VSHUTDOWN = 2.0 V 5 12 5 12 mA 0.2 1.0 17.5 17 0.4 2.0 19 18 0.2 1.0 17.5 17 19 18 V V Power Consumption Standby current Note: Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 5 Regulating Pulse Width Modulator Note: 1. These parameters, although guaranteed over the recommended operating conditions, are not tested in production. 3.1 Recommended Operating Conditions The following table shows recommended operating conditions of SG1524B/SG2524B/SG3524B. Here, the operating conditions refer to ranges over which the device is functional. Table 2 • Recommended Operating Conditions Parameter Value Unit Input voltage (VIN) 7 to 40 V Collector voltage 0 to 60 V Error A common mode range 2.3 to VREF V Current limit sense common mode range 0 to VIN to 2.5 V V Output current (each transistor) 0 to 100 mA Reference load current 0 to 20 mA Oscillator charging current 25 to 1.8 μA/mA Oscillator frequency range 100 to 400 Hz/kHz Oscillator timing resistor (RT) 2 to 150 kΩ Oscillator timing capacitor (CT) 1 to 0.1 nF/μF SG1524B –55 to 125 °C SG2524B –25 to 85 °C SG3524B 0 to 70 °C Operating Ambient Temperature Range Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 6 Regulating Pulse Width Modulator 3.2 Typical Performance Curves The following figures show characteristic curves of SG1524B. The conditions are, VIN = 20 V, TA = 25 °C. Figure 2 • Oscillator Frequency vs. Timing Resistor and Capacitor Figure 3 • SG1524B Dead Times vs. Timing Capacitance (RT = 2.7 kΩ) Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 7 Regulating Pulse Width Modulator Figure 4 • SG1524B Error Amplitude Voltage Gain vs. Frequency over Rf 3.3 Absolute Maximum Ratings The following table shows the absolute maximum ratings of SG1524B/SG2524B/SG3524B. The absolute maximum ratings refer to values beyond which damage may occur. Table 3 • Absolute Maximum Ratings Parameter Value Units Input voltage (+VIN) 42 V Collector voltage 60 V Logic inputs –0.3 to 5.5 V Current limit sense inputs –0.3 to VIN V Output current (each transistor) 200 mA Reference load current 50 mA Oscillator charging current 5 mA Hermetic (J, and L Packages) 150 °C Plastic (N, and DW Packages) 150 °C Storage temperature range –65 to 150 °C Lead temperature (soldering, 10 seconds) 300 °C RoHS peak package solder reflow temperature (40 seconds maximum exposure) 260 (0, –5) °C Operating Junction Temperature Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 8 Regulating Pulse Width Modulator 4 Package Information This section shows the package outline dimensions and thermal specifications of SG1524B/SG2524B/SG3524B. Controlling dimensions are in inches, and metric equivalents are shown for general information. The following figure and table show DW 16-pin SOWB package and its dimensions. Dimensions do not include protrusions and should not exceed 0.155 mm (0.006 in.) on any side. Lead dimension should not include solder coverage. Figure 5 • DW 16-Pin SOWB Package Table 4 • DW 16-Pin SOWB Package Dimensions Dimensions Millimeters Inches Minimum Maximum Minimum Maximum A A1 A2 1.35 0.10 1.25 1.75 0.25 1.52 0.053 0.004 0.049 0.069 0.010 0.060 b c D 0.33 0.19 9.78 0.51 0.25 10.01 0.013 0.007 0.385 0.020 0.010 0.394 E 5.79 6.20 0.228 0.244 e H 1.27 BSC 3.81 4.01 0.150 0.158 L Θ Lead coplanarity 0.40 0 - 1.27 8 0.10 0.016 0 - 0.050 8 0.004 0.050 BSC The following figure and table show N 16-pin plastic dual inline package and its dimensions. Dimensions Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 9 Regulating Pulse Width Modulator The following figure and table show N 16-pin plastic dual inline package and its dimensions. Dimensions do not include protrusions and should not exceed 0.155 mm (0.006 in.) on any side. Lead dimension should not include solder coverage. Figure 6 • N 16-Pin Plastic Dual Inline Package Table 5 • N 16-Pin Plastic Dual Inline Package Dimensions Dimensions Millimeters Inches Minimum Maximum Minimum Maximum A A1 0.38 5/08 0.51 0.015 0.200 0.040 A2 3.30 typical b b2 c 0.38 0.76 0.20 0.51 1.52 0.38 0.015 0.030 0.008 0.020 0.060 0.015 D 18.54 20.57 0.730 0.810 e 2.54 BSC E1 6.10 E 7.62 BSC L 3.05 - 0.120 - θ - 15° - 15° 0.130 typical 0.100 BSC 6.60 0.240 0.260 0.300 BSC The following figure and table show J 16-pin ceramic dual inline package and its dimensions. Dimensions Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 10 Regulating Pulse Width Modulator The following figure and table show J 16-pin ceramic dual inline package and its dimensions. Dimensions do not include protrusions and should not exceed 0.155 mm (0.006 in.) on any side. Lead dimension should not include solder coverage. Figure 7 • J 16-Pin Ceramic Dual Inline Package Table 6 • J 16-Pin Ceramic Dual Inline Package Dimensions Dimensions Millimeters Inches Minimum Maximum Minimum Maximum A b b2 0.38 1.04 5.08 0.51 1.65 0.015 0.045 0.200 0.020 0.065 c D E 0.20 19.30 5.59 0.38 19.94 7.11 0.008 0.760 0.220 0.015 0.785 0.280 e 2.54 BSC eA H 7.37 0.63 7.87 1.78 0.290 0.025 0.310 0.070 L α Q 3.18 0.51 5.08 15° 1.02 0.125 0.020 0.200 15° 0.040 0.100 BSC The following figure and table show L 20-pin ceramic leadless chip carrier (LCC) package and its outline Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 11 Regulating Pulse Width Modulator The following figure and table show L 20-pin ceramic leadless chip carrier (LCC) package and its outline dimensions. All exposed metalized area should be gold plated, 60 micro-inch minimum thickness over nickel plated base, if not specified in purchase order. Figure 8 • L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Table 7 • L 20-Pin Ceramic Leadless Chip Carrier (LCC) Package Outline Dimensions DIM Millimeters Inches Minimum Maximum Minimum Maximum D/E 8.64 9.14 0.340 0.360 E3 - 8.128 - 0.320 e 1.270 BSC 0.050 BSC B1 0.635 typical 0.025 typical L A 1.02 1.626 h 1.016 typical A1 A2 1.372 - 1.68 1.168 0.054 - 0.066 0.046 L2 1.91 2.41 0.075 0.95 B3 0.203 R 1.52 2.286 0.040 0.064 0.060 0.090 0.040 typical 0.008 R Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 12 Regulating Pulse Width Modulator 4.1 Thermal Data The following table shows the thermal data specifications of SG1524B/SG2524B/SG3524B. Table 8 • Thermal Data Specifications Parameter Value Units Thermal resistance-junction to case, θJC 30 °C/W Thermal resistance-junction to ambient, θJA 80 °C/W Thermal resistance-junction to case, θJC 40 °C/W Thermal resistance-junction to ambient, θJA 65 °C/W Thermal resistance-junction to case, θJC 40 °C/W Thermal resistance-junction to ambient, θJA 95 °C/W Thermal resistance-junction to case, θJC 35 °C/W Thermal resistance-junction to ambient, θJA 120 °C/W J Package N Package DW Package L Package Notes: Junction temperature calculation: TJ = TA + (PD x θJA). The above numbers for θJC are maximum for the limiting thermal resistance of the package in a standard mounting configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device or pc-board system. All of the them assume no ambient airflow. Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 13 Regulating Pulse Width Modulator 5 Ordering Information The following figures and tables show the connection diagrams and ordering information of SG1524B. Figure 9 • 16-Pin Dual Inline Package N Package: RoHS complaint/Pb-free transition DC: 0503 N Package: RoHS/Pb-free 100% matte tin lead finish Table 9 • Ordering Information of 16-Pin Dual Inline Package Ambient Temperature Type Package Part Number Packaging Type 55 °C to 125 °C J 16-pin ceramic dual inline package SG1524BJ CERDIP (ceramic dual in-line package) SG1524BJ-883B SG2524BJ-DESC –25 °C to 85 °C 0 °C to 70 °C N 16-pin dual inline plastic package SG2524BN SG3524BN PDIP (plastic dual in-line package) Figure 10 • 16-Pin Small Outline Wide Body Package DW Package: RoHS complaint/Pb-free transition DC: 0516 DW Package: RoHS/Pb-free 100% matte tin lead finish Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 14 Regulating Pulse Width Modulator Table 10 • Ordering Information of 16-Pin Small Outline Wide Body Package Ambient Temperature Type Package Part Number Packaging Type –25 °C to 85 °C DW 16-pin dual inline plastic package SG2524BDW SOWB 20-pin ceramic leadless chip carrier SG1524BL-883B 0 °C to 70 °C –55 °C to 125 °C L SG3524BDW SG1524BL CLCC (Ceramic leadless chip carrier) Figure 11 • 20-Pin Ceramic Leadless Chip Carrier Table 11 • Ordering Information of 20-Pin Ceramic Leadless Chip Carrier Ambient Temperature Type Package Part Number Packaging Type –55 °C to 125 °C L 20-pin ceramic leadless chip carrier SG1524BL-883B CLCC SG1524BL Notes: Contact your Microsemi representative for DESC product availability. All packages are viewed from the top. Hermetic packages, J and L use Sn63/Pb37 hot solder lead finish. Contact your Microsemi representative for availability of RoHS versions. Available in tape and reel. Append the letters "TR" to the part number: SG3524BDW-TR. Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 15 Regulating Pulse Width Modulator Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. Microsemi Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com www.microsemi.com © 2018 Microsemi. All rights reserved. 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Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www. microsemi.com. SG1524B-2.00-0718 Microsemi Proprietary and Confidential. SG1524B/SG2524B/SG3524B Datasheet Revision 2.0 16