SST11CP22-GN

SST11CP22 5.1-5.9 GHz 802.11ac WLAN Power Amplifier Features Product Description • • • • • SST11CP22 is a 50Ω, RF-matched Power Amplifier Module (PAM) with a FCC-compliant, harmonic filter that is based on the highly-reliable InGaP/GaAs HBT technology. • • • • • • 50Ω input and output match including DC blocks Integrated harmonic filter Operating voltage: VCC = 5.0V Operating frequency: 5.1 to 5.9 GHz High linear output power, typical performance: - 802.11a OFDM Spectrum mask compliant up to 24 dBm - 802.11n HT40 OFDM Spectrum mask compliant up to 23 dBm - 3% EVM up to 20 dBm for 802.11a, 54 Mbps signal - 2.5% EVM up to 19 dBm for 802.11n, HT40 - 1.8% EVM up to 18 dBm for 802.11ac, MCS9, 80 MHz BW (bandwidth) signal Gain: Typically 31 dB gain across 5.1–5.9 GHz Idle current: Typically ~320 mA ICQ High-speed power-up/down - Turn on/off time (10%-90%) 20 dB linear dynamic range - VSWR insensitive All devices are RoHS compliant Operating over the 5.1–5.9 GHz frequency band, SST11CP22 meets 802.11a spectrum mask requirements up to 24 dBm and 802.11n HT40 spectrum mask at 23 dBm. With 802.11a modulation, this PA typically provides up to 20.5 dBm with 3% EVM, and provides 18 dBM with less than 1.8% dynamic EVM using 802.11ac modulation, MCS9, 80 MHz bandwidth. This power amplifier module also features easy board-level operation, with a simple application circuit requiring only four external components. With its high-speed power-up/-down control, SST11CP22 is controllable directly from the baseband chip. SST11CP22 also features a wide dynamic-range, linear power detector that is temperature-stable and VSWRinsensitive. SST11CP22 is offered in 20-contact QFN package. See Figure 2-1 for pin assignments and Table 2-1 for pin descriptions. Applications • WLAN (IEEE 802.11a/n/ac) • HyperLAN2 • Multimedia  2015 Microchip Technology Inc. DS70005126B-page 1 SST11CP22 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. 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DS70005126B-page 2  2015 Microchip Technology Inc. SST11CP22 FUNCTIONAL BLOCKS VCC3 GND GND FUNCTIONAL BLOCK DIAGRAM VCC2 FIGURE 1-1: VCC1 1.0 20 19 18 17 16 NC 1 15 GND 14 GND GND 2 RF-IN 3 Output Match/ Filter Input Match GND 4 12 GND Bias Circuit 11 GND PEN 5 6 7 8 9 10 NC NC NC NC DET  2015 Microchip Technology Inc. 13 RFOUT 70005126 B1.0 DS70005126B-page 3 SST11CP22 PIN ASSIGNMENTS VCC3 GND GND PIN ASSIGNMENTS FOR 20-CONTACT UQFN VCC2 FIGURE 2-1: VCC1 2.0 20 19 18 17 16 NC 1 15 GND GND 2 14 GND RF-IN 3 13 RFOUT GND 4 12 GND PEN 5 11 GND 6 7 8 9 10 NC NC NC NC DET 70005126 P1.0 TABLE 2-1: Symbol PIN DESCRIPTION Pin Name Function GND Pin No. 0 Center ground contact The center pad should be connected to RF ground with several low inductance, low resistance vias. NC 1 No Connection Unconnected, no internal connection GND 2 Ground RFIN 3 RF input GND 4 Ground PEN 5 PA enable PA enable control input NC 6 No Connection Unconnected, no internal connection NC 7 No Connection Unconnected, no internal connection NC 8 No Connection Unconnected, no internal connection NC 9 No Connection Unconnected, no internal connection TX detector output RF input port DET 10 TX detector output GND 11 Ground GND 12 Ground RF OUT 13 RF Out GND 14 Ground GND 15 Ground GND 16 Ground GND 17 Ground VCC3 18 PA supply PA Supply VCC2 19 PA supply PA Supply VCC1 20 PA supply PA Supply DS70005126B-page 4 RF Output port  2015 Microchip Technology Inc. SST11CP22 3.0 ELECTRICAL SPECIFICATIONS The AC and DC specifications for the power amplifier interface signals. Refer to Table 3-2 for the DC voltage and current specifications. Refer to Figures 4-1 through 4-7 for the RF performance. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Supply Voltage at pins 18, 19, and 20 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V Supply voltage to pins 5, 6, and 7 (VPEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20ºC to +85ºC Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Maximum Output Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 dBm Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds TABLE 3-1: OPERATING RANGE Range Ambient Temp VCC Industrial -10°C to +85°C 5.0V-6.0V TABLE 3-2: DC ELECTRICAL CHARACTERISTICS Symbol Parameter Typ Max. Unit VCC Supply Voltage Min. 5.0 6.0 V ICC Supply Current @ POUT = 20 dBm 370 mA ICQ VCC Quiescent Current 320 mA 2 µA 2.85 V IOFF Shutdown Current VPEN Recommended Enable Voltage IPEN Total Enable Current VDET RF Power Detector Voltage Output Range, 0 to 23 dBm Voltage at 20 dBm  2015 Microchip Technology Inc. 8 0.15 mA 1.0 0.75 V V DS70005126B-page 5 SST11CP22 TABLE 3-3: Symbol FL-U AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION VCC = 5.0V, VPEN=2.85V, 25 °C UNLESS OTHERWISE SPECIFIED Parameter Min. Frequency range 5.1 Typ Max. 5.9 Unit GHz Output power at 3% EVM at 54 Mbps OFDM signal, 802.11a 20.5 dBm Output power at 2.5% dynamic EVM 802.11n HT40 19 dBm Output power 1.8% dynamic EVM MCS9 80 MHz BW 18 dBm ACPRA output power level with 802.11a mask compliance @ 6Mbps OFDM 24 dBm ACPRN40 output power level with 802.11n HT40 mask compliance 23 dBm G Power gain from 5.18-5.9 GHz 31 dB RL RF input return loss 10 dB Linear Power 2ƒ0 Second harmonic power density at 24 dBm -45 dBm/MHz 3ƒ0 Third harmonic power density at 24 dBm -50 dBm/MHz DS70005126B-page 6  2015 Microchip Technology Inc. SST11CP22 4.0 TYPICAL PERFORMANCE CHARACTERISTICS Test Conditions: VCC = 5.0V, TA = 25°C, VPEN = 2.85V, 802.11a 54 Mbps OFDM Modulation, 50% Duty Cycle, 25°C Unless otherwise specified FIGURE 4-1: S-PARAMETERS 40 S11 30 S21 20 S12 S-Parameter (dB) 10 S22 0 -10 -20 -30 -40 -50 -60 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Frequency, GHz 70005121 Sparams 1.0 FIGURE 4-2: DYNAMIC EVM VERSUS OUTPUT POWER, 802.11a 54 Mbps, 50% DUTY CYCLE, VPEN=2.85V 10 9 Freq=5.180 GHz 8 Freq=5.500 GHz 7 EVM (%) Freq=5.850 GHz 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm)  2015 Microchip Technology Inc. 70005126 F4.2 DS70005126B-page 7 SST11CP22 FIGURE 4-3: DYNAMIC EVM VERSUS OUTPUT POWER, 802.11n MCS7-HT40, 40 MHz, 50% DUTY CYCLE, VPEN=2.85V 10 EVM (%) 9 8 5180 7 5500 6 5850 5 4 3 2 1 0 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm) 70005126 F5.1 DYNAMIC EVM VERSUS OUTPUT POWER, 802.11ac MCS9, 80 MHz, 60 µS PULSE, 50% DUTY CYCLE, VPEN=2.85V FIGURE 4-4: 10 9 EVM (%) 8 7 5180 MHz 6 5500 MHz 5 5850 MHz 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm) DS70005126B-page 8 70005126 F6.2  2015 Microchip Technology Inc. SST11CP22 FIGURE 4-5: INSTANTANEOUS POWER SUPPLY CURRENT VERSUS OUTPUT POWER, VCC=5.0V, 802.11ac MCS9, 80 MHz, 60 µs PULSE, 50% DUTY CYCLE VPEN=2.85V 460 440 420 400 5180 MHz Supply Current (mA) 380 360 5500 MHz 340 5850 MHz 320 300 280 260 240 220 200 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm) FIGURE 4-6: 70005126 F8.1 POWER GAIN VERSUS OUTPUT POWER 40 38 36 Power Gain (dB) 34 32 30 28 26 24 22 Freq=5.180 GHz 20 Freq=5.500 GHz 18 Freq=5.850 GHz 16 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm)  2015 Microchip Technology Inc. 70005126 F9.2 DS70005126B-page 9 SST11CP22 FIGURE 4-7: DETECTOR VOLTAGE VERSUS OUTPUT POWER, VPEN=2.85V 1.2 1.1 Detector Voltage (V) 1.0 5180 MHz 0.9 0.8 5500 MHz 0.7 5850 MHz 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Output Power (dBm) FIGURE 4-8: 70005126 F10.3 TYPICAL SCHEMATIC FOR 802.11a/n/ac APPLICATIONS, VCC=5.0V, VPEN=2.85V VCC 0.1 µF 0.1 µF 0.1 µF 10 µF 20 19 18 17 16 1 15 2 14 3 13 4 12 5 11 50Ω RFIN PEN 50Ω 6 7 8 9 10 DET DS70005126B-page 10 RFOUT 70005126 schematic 1.1  2015 Microchip Technology Inc. SST11CP22 5.0 PACKAGE INFORMATION 20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C SEATING PLANE A1 A (A3) 0.08 C SIDE VIEW 0.10 C A B D2 0.10 C A B K E2 2 1 L NOTE 1 N 20 X b 0.07 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-252A Sheet 1 of 2  2015 Microchip Technology Inc. DS70005126B-page 11 SST11CP22 20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Pins e Pitch A Overall Height Standoff A1 (A3) Terminal Thickness E Overall Width Exposed Pad Width E2 D Overall Length D2 Exposed Pad Length b Terminal Width L Terminal Length K Terminal-to-Exposed-Pad MIN 0.50 0.00 2.45 2.45 0.20 0.35 0.20 MILLIMETERS NOM 20 0.50 BSC 0.55 0.02 0.15 REF 4.00 BSC 2.50 4.00 BSC 2.50 0.25 0.40 - MAX 0.60 0.05 2.55 2.55 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-252A Sheet 2 of 2 DS70005126B-page 12  2015 Microchip Technology Inc. SST11CP22 TABLE 5-1: REVISION HISTORY Revision Description Date A • Initial release of data sheet Jul 2013 B • • • Revised Product Description on page 1 Updated Figures 4-2 to 4-8 Updated Tables 3-2 and 3-3 Mar 2015  2015 Microchip Technology Inc. DS70005126B-page 13 SST11CP22 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS70005126B-page 14  2015 Microchip Technology Inc. SST11CP22 6.0 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXX Device Package Valid Combinations: SST11CP22-GN SST11CP22-GN-K Device: SST11CP22 = 51.-5.9 GHz Power Amplifier Package: GN = UQFN (4mm x 4mm), 0.6 max thickness 20-contact Evaluation Kit K Flag  2015 Microchip Technology Inc. = Evaluation Kit DS70005126B-page 15 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. 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Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-63277-179-7 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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