SST11LF04-Q3CE

SST11LF04 4.9-5.9 GHz High-Linearity, High-Efficiency Front-end Module FEATURES Applications • Input/output ports internally matched to 50 and DC decoupled • Package available - 16-contact X2QFN – 2.5mm x 2.5mm x 0.4mm (max) • Devices are RoHS compliant • • • • • Transmitter Chain • Operating voltage 3.0V to 5.0V • Gain: - Typically 30 dB gain across 4.9-5.9 GHz at 3.3V • Typical linear output power at 3.3V: - Meets 802.11a OFDM ACPR requirement up to 21 dBm - Meets 802.11ac spectrum mask requirement up to 20 dBm - 3.0% dynamic EVM up to 18 dBm for 802.11a, 54 Mbps - 1.75% dynamic EVM up to 16 dBm for 802.11ac, MCS9, 80 MHz • Operating current for 802.11a/n/ac applications - 270 mA @ POUT = 18 dBm for 802.11a at 3.3V • IPEN: 6 mA • Idle current: 210 mA ICQ • Low shut-down current: ~2 µA • High-speed power-up/down - Turn on/off time (10%–90%) 20 dB dynamic range on-chip power detection Receiver Chain • Gain: - Typically 12 dB gain across 4.9-5.9 GHz • Noise figure - Typically 2.95 dB across 4.9-5.9 GHz • LNA bypass loss - Typically 8 dB  2014 Microchip Technology Inc. WLAN–IEEE 802.11a/n/ac WAVE(IEEE 802.11p) Home RF Cordless phones 5 GHz ISM wireless equipment PRODUCT DESCRIPTION SST11LF04 is a 4.9-5.9 GHz Front-end Module (FEM) designed in compliance with IEEE 802.11a/n/p/ac applications. Based on GaAs pHEMT/HBT technology, it combines a high-performance Power Amplifier (PA), a low-noise amplifier (LNA) and an antenna Tx/Rx switch (SW). The input/output RF ports are singleended and internally matched to 50 . These RF ports are DC decoupled, and require no external DC-blocking capacitors or matching components. This helps reduce the system board Bill of Materials (BOM) cost. There are two functional components to the FEM: the Transmitter (TX) chain and the Receiver (RX) chain. The TX chain includes a high-efficiency PA based on the InGaP/GaAs HBT technology. At 3.3V, the transmitter typically provides 30 dB gain and provides 802.11a spectrum mask compliance at 21 dBm. The TX chain has excellent linearity, typically 3% dynamic EVM at 18 dBm output power, with 802.11a, 54 Mbps operation and requires only 270 mA DC current. It also provides up to 16 dBm output power with 1.75% dynamic EVM using 802.11ac MCS9, 80 MHz modulation. SST11LF04 transmitter features a high-speed powerup/-down control with low current (total IPEN ~6 mA). SST11LF04 has an excellent on-chip, single-ended power detector that is stable over temperature and insensitive to output VSWR. This detector features a wide dynamic-range (20 dB) with dB-wise linear operation, thus providing a reliable solution to board-level power control. The Rx chain provides typically 12 dB gain with 2.95 dB noise figure. With the LNA bypassed, the receiver loss is typically 8 dB with P1dB>20 dBm. SST11LF04 is offered in a16-contact X2QFN package. See Figure 2-1 for pin assignments and Table 2-1 for pin descriptions. DS70005081B-page 1 SST11LF04 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). 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DS70005081B-page 2  2014 Microchip Technology Inc. SST11LF04 FUNCTIONAL BLOCKS GND ANT FUNCTIONAL BLOCK DIAGRAM CRX FIGURE 1-1: LEN 1.0 16 15 14 13 GND 1 12 GND SW RX 2 11 VCC LNA PA GND 3 10 VCC PA  2014 Microchip Technology Inc. 5 6 7 8 PEN GND TX 9 NC VDET VCC 4 75081 B1.4 DS70005081B-page 3 SST11LF04 PIN ASSIGNMENTS GND ANT PIN ASSIGNMENTS FOR 16-CONTACT X2QFN CRX FIGURE 2-1: LEN 2.0 16 15 14 13 GND 1 12 GND Top View (Contacts facing down) 11 VCC RF and DC GND 10 VCC RX 2 GND 3 TABLE 2-1: Symbol GND 5 6 7 8 PEN GND TX 9 NC VDET VCC 4 75081 P1.3 PIN DESCRIPTION Pin No. 1 Pin Name Ground RX 2 GND 3 Ground VCC 4 Power Supply VDET 5 PEN 6 GND 7 Type1 Function Ground pad O LNA output Ground pad PWR O I Ground Supply Voltage Detector output voltage PA enable Ground pad TX 8 NC 9 I RF transmit input VCC 10 Power Supply PWR Supply voltage VCC 11 Power Supply PWR Supply voltage GND 12 Ground ANT 13 No Connection Ground pad I/O Antenna GND 14 CRX 15 I Switch control pin voltage Ground pad LEN 16 I LNA Enable 1. I=Input, O=Output DS70005081B-page 4  2014 Microchip Technology Inc. SST11LF04 3.0 ELECTRICAL SPECIFICATIONS The DC and RF specifications for the power amplifier are specified below. Refer to Table 3-2 for the DC voltage and current specifications. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Tx input power to pin 8 (TX)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Rx input power to pin 13 (ANT with LNA ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Average Tx output power from pin 13 (ANT)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +22 dBm Supply Voltage at pins 4, 10, and 11 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.2V PA enable voltage to pin 6 (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V DC supply current (ICC)3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds 1. At 5.0V bias, the RF-input power must be less than 5 dBm while operating into a maximum antenna port VSWR of 6:1. At 5.5V bias, the maximum VSWR is 2:1 with a maximum input-RF power of 5 dBm. 2. Never measure with CW source. Pulsed single-tone source with