SST12LF09-Q3CE

SST12LF09 2.4 GHz High-Linearity, WLAN Front-End Module FEATURES APPLICATIONS • Input/output ports internally matched to 50 and DC decoupled • Package available - 16-contact X2QFN – 2.5mm x 2.5mmx 0.4mm • All non-Pb (lead-free) devices are RoHS compliant • • • • Transmitter Chain • Gain: - Typically 24 dB gain • Dynamic linear output power: - Meets 802.11g OFDM ACPR requirement up to 21 dBm using 3.6V VCC and 22.5 dBm using 5V VCC - 17 dBm using 3.6V, 18 dBm using 5.0V, at 3% EVM for 802.11g, 54 Mbps - 15 dBm using 3.6V, 16 dBm using 5.0V, at 1.75% dynamic EVM for 256 QAM, 40 MHz bandwidth • Operating current - 150 mA @ POUT = 17 dBm for 802.11g, 3.6V - 130 mA @ POUT = 15 dBm for MCS9, 3.6V • PA Control current, IPEN:25 dBm  2013 Microchip Technology Inc. DS75083B-page 1 SST12LF09 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via Email at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS75083B-page 2  2013 Microchip Technology Inc. SST12LF09 FUNCTIONAL BLOCKS CRX CBT FUNCTIONAL BLOCK DIAGRAM GND FIGURE 2-1: ANT 2.0 16 15 14 13 DET 1 12 GND NC 2 VCC 3 11 BT LNA PA 10 VCC PA 5 6 7 8 PEN GND RX 9 LEN TX VCC 4 75083 B1.2  2013 Microchip Technology Inc. DS75083B-page 3 SST12LF09 PIN ASSIGNMENTS CRX CBT PIN ASSIGNMENTS FOR 16-CONTACT X2QFN GND FIGURE 3-1: ANT 3.0 16 15 14 13 DET 1 12 GND Top View (Contacts facing down) NC 2 VCC 3 11 BT 10 VCC RF and DC GND 5 6 7 8 PEN GND RX 9 LEN TX VCC 4 75083 P1.0 4.0 PIN DESCRIPTIONS TABLE 4-1: Symbol PIN DESCRIPTION Pin No. Pin Name Type1 Function DET 1 NC 2 VCC 3 Power Supply PWR Supply voltage Power Supply PWR Supply voltage O Detector output voltage ground No connect VCC 4 TX 5 PEN 6 GND 7 RX 8 O Rx output LEN 9 I LNA enable I RF transmit input I PA enable Ground Ground pad VCC 10 PWR BT 11 I/O GND 12 CBT 13 I Bluetooth switch control CRX 14 I Receiver switch control voltage GND 15 ANT 16 Ground Supply voltage Bluetooth RF port Ground pad Ground Ground Pad I/O Antenna 1. I=Input, O=Output DS75083B-page 4  2013 Microchip Technology Inc. SST12LF09 5.0 ELECTRICAL SPECIFICATIONS The DC and RF specifications for the power amplifier are specified below. Refer to Table 5-2 for the DC voltage and current specifications. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Tx input power to pin 5 (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Rx input power to pin 16 (ANT with LNA ON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm Average Tx output power from pin 16 (ANT)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +26 dBm Supply Voltage at pins 3 and 4 (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +5.5V PA Enable Voltage to pin 6 (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds 1. Never measure with CW source. Pulsed single-tone source with