SST26VF016B
2.5V/3.0V 16 Mbit Serial Quad I/O (SQI) Flash Memory
Features
• Single Voltage Read and Write Operations
- 2.7-3.6V or 2.3-3.6V
• Serial Interface Architecture
- Nibble-wide multiplexed I/O’s with SPI-like serial
command structure
- Mode 0 and Mode 3
- x1/x2/x4 Serial Peripheral Interface (SPI) Protocol
• High Speed Clock Frequency
- 2.7-3.6V: 104 MHz max
- 2.3-3.6V: 80 MHz max
• Burst Modes
- Continuous linear burst
- 8/16/32/64 Byte linear burst with wrap-around
• Superior Reliability
- Endurance: 100,000 Cycles (min)
- Greater than 100 years Data Retention
• Low Power Consumption:
- Active Read current: 15 mA (typical @ 104 MHz)
- Standby Current: 15 µA (typical)
• Fast Erase Time
- Sector/Block Erase: 18 ms (typ), 25 ms (max)
- Chip Erase: 35 ms (typ), 50 ms (max)
• Page-Program
- 256 Bytes per page in x1 or x4 mode
• End-of-Write Detection
- Software polling the BUSY bit in status register
• Flexible Erase Capability
- Uniform 4 KByte sectors
- Four 8 KByte top and bottom parameter overlay
blocks
- One 32 KByte top and bottom overlay blocks
- Uniform 64 KByte overlay blocks
• Write-Suspend
- Suspend Program or Erase operation to access
another block/sector
• Software Reset (RST) mode
• Software Write Protection
- Individual-Block Write Protection with permanent
lock-down capability
- 64 KByte blocks, two 32 KByte blocks, and
eight 8 KByte parameter blocks
- Read Protection on top and bottom 8 KByte
parameter blocks
2019 Microchip Technology Inc.
• Security ID
- One-Time Programmable (OTP) 2 KByte,
Secure ID
- 64 bit unique, factory pre-programmed
identifier
- User-programmable area
• Temperature Range
- Industrial: -40°C to +85°C
- Industrial Plus: -40°C to +105°C
- Extended: -40°C to +125°C
• Automotive AECQ-100 Qualified
• Packages Available
- 8-contact WDFN (6mm x 5mm)
- 8-lead SOIJ (5.28 mm)
- 8-lead SOIC (3.90 mm)
• All devices are RoHS compliant
Product Description
The Serial Quad I/O™ (SQI™) family of flash-memory
devices features a six-wire, 4-bit I/O interface that
allows for low-power, high-performance operation in a
low pin-count package. SST26VF016B also supports
full command-set compatibility to traditional Serial
Peripheral Interface (SPI) protocol. System designs
using SQI flash devices occupy less board space and
ultimately lower system costs.
All members of the 26 Series, SQI family are manufactured with proprietary, high-performance CMOS SuperFlash® technology. The split-gate cell design and thickoxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
SST26VF016B significantly improves performance and
reliability, while lowering power consumption. These
devices write (Program or Erase) with a single power
supply of 2.3-3.6V. The total energy consumed is a
function of the applied voltage, current, and time of
application. Since for any given voltage range, the
SuperFlash technology uses less current to program
and has a shorter erase time, the total energy consumed during any Erase or Program operation is less
than alternative flash memory technologies.
SST26VF016B is offered in 8-contact WDFN (6 mm x
5 mm), 8-lead SOIJ (5.28 mm), and 8-lead SOIC
(3.90 mm). See Figures 2-1 through 2-3 for pin assignments.
DS20005262F-page 1
SST26VF016B
TO OUR VALUED CUSTOMERS
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last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS20005262F-page 2
2019 Microchip Technology Inc.
SST26VF016B
1.0
BLOCK DIAGRAM
FIGURE 1-1:
FUNCTIONAL BLOCK DIAGRAM
OTP
Address
Buffers
and
Latches
X - Decoder
SuperFlash
Memory
Y - Decoder
Page Buffer,
I/O Buffers
and
Data Latches
Control Logic
Serial Interface
WP# HOLD# SCK
CE#
SIO [3:0]
20005262 B1.0
2019 Microchip Technology Inc.
DS20005262F-page 3
SST26VF016B
2.0
PIN DESCRIPTION
FIGURE 2-1:
PIN DESCRIPTION FOR
8-LEAD SOIJ
CE#
1
8
VDD
SO/SIO1
2
7
HOLD/SIO3
WP#/SIO2
3
6
SCK
VSS
4
5
SI/SIO0
Top View
FIGURE 2-3:
CE#
1
SO/SIO1
2
8
VDD
7
HOLD/SIO3
Top View
WP#/SIO2
3
6
SCK
VSS
4
5
SI/SIO0
20005262 08-soij S2A P1.0
FIGURE 2-2:
PIN DESCRIPTION FOR 8LEAD SOIC
20005262 08-soic SA P1.0
PIN DESCRIPTION FOR
8-CONTACT WDFN
CE#
1
SO/SIO1
2
8
VDD
7
HOLD/SIO3
Top View
WP#/SIO2
3
6
SCK
VSS
4
5
SI/SIO0
20005262 08-wson QA P1.0
TABLE 2-1:
PIN DESCRIPTION
Symbol
Pin Name
Functions
SCK
Serial Clock
To provide the timing of the serial interface.
Commands, addresses, or input data are latched on the rising edge of the clock
input, while output data is shifted out on the falling edge of the clock input.
SIO[3:0]
Serial Data
Input/Output
To transfer commands, addresses, or data serially into the device or data out of
the device. Inputs are latched on the rising edge of the serial clock. Data is
shifted out on the falling edge of the serial clock. The Enable Quad I/O (EQIO)
command instruction configures these pins for Quad I/O mode.
SI
Serial Data Input
for SPI mode
To transfer commands, addresses or data serially into the device. Inputs are
latched on the rising edge of the serial clock. SI is the default state after a power
on reset.
SO
Serial Data Output
for SPI mode
To transfer data serially out of the device. Data is shifted out on the falling edge
of the serial clock. SO is the default state after a power on reset.
CE#
Chip Enable
The device is enabled by a high to low transition on CE#. CE# must remain low
for the duration of any command sequence; or in the case of Write operations,
for the command/data input sequence.
WP#
Write Protect
The WP# is used in conjunction with the WPEN and IOC bits in the Configuration register to prohibit write operations to the Block-Protection register. This pin
only works in SPI, single-bit and dual-bit Read mode.
HOLD#
Hold
Temporarily stops serial communication with the SPI Flash memory while the
device is selected. This pin only works in SPI, single-bit and dual-bit Read mode
and must be tied high when not in use.
VDD
Power Supply
To provide power supply voltage.
VSS
Ground
DS20005262F-page 4
2019 Microchip Technology Inc.
SST26VF016B
3.0
MEMORY ORGANIZATION
The SST26VF016B SQI memory array is organized in
uniform, 4 KByte erasable sectors with the following
erasable blocks: eight 8 KByte parameter, two 32
KByte overlay, and thirty 64 KByte overlay blocks. See
Figure 3-1.
FIGURE 3-1:
MEMORY MAP
Top of Memory Block
8 KByte
8 KByte
8 KByte
8 KByte
32 KByte
...
64 KByte
2 Sectors for 8 KByte blocks
8 Sectors for 32 KByte blocks
16 Sectors for 64 KByte blocks
64 KByte
...
4 KByte
4 KByte
4 KByte
4 KByte
64 KByte
32 KByte
8 KByte
8 KByte
8 KByte
8 KByte
Bottom of Memory Block
20005262 F41.0
2019 Microchip Technology Inc.
DS20005262F-page 5
SST26VF016B
4.0
DEVICE OPERATION
SST26VF016B supports both Serial Peripheral Interface (SPI) bus protocol and a 4-bit multiplexed SQI bus
protocol. To provide backward compatibility to traditional SPI Serial Flash devices, the device’s initial state
after a power-on reset is SPI mode which supports
multi-I/O (x1/x2/x4) Read/Write commands. A command instruction configures the device to SQI mode.
The dataflow in the SQI mode is similar to the SPI
mode, except it uses four multiplexed I/O signals for
command, address, and data sequence.
bus master is in stand-by mode and no data is being
transferred. The SCK signal is low for Mode 0 and SCK
signal is high for Mode 3. For both modes, the Serial
Data I/O (SIO[3:0]) is sampled at the rising edge of the
SCK clock signal for input, and driven after the falling
edge of the SCK clock signal for output. The traditional
SPI protocol uses separate input (SI) and output (SO)
data signals as shown in Figure 4-1. The SQI protocol
uses four multiplexed signals, SIO[3:0], for both data in
and data out, as shown in Figure 4-2. This means the
SQI protocol quadruples the traditional bus transfer
speed at the same clock frequency, without the need
for more pins on the package.
SQI Flash Memory supports both Mode 0 (0,0) and
Mode 3 (1,1) bus operations. The difference between
the two modes is the state of the SCK signal when the
FIGURE 4-1:
SPI PROTOCOL (TRADITIONAL 25 SERIES SPI DEVICE)
CE#
SCK
MODE 3
MODE 3
MODE 0
MODE 0
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SI
MSB
SO
HIGH IMPEDANCE
DON'T CARE
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
MSB
FIGURE 4-2:
20005262 F03.0
SQI SERIAL QUAD I/O PROTOCOL
CE#
MODE 3
MODE 3
CLK
MODE 0
SIO(3:0)
MODE 0
C1 C0
A5
A4
A3
A2
A1
A0
H0
L0
H1
L1
H2
L2
H3
L3
MSB
20005262 F04.0
4.1
Device Protection
SST26VF016B offers a flexible memory protection
scheme that allows the protection state of each individual block to be controlled separately. In addition, the
Write-Protection Lock-Down register prevents any
change of the lock status during device operation. To
avoid inadvertent writes during power-up, the device is
write-protected by default after a power-on reset cycle.
A Global Block-Protection Unlock command offers a
single command cycle that unlocks the entire memory
array for faster manufacturing throughput.
For extra protection, there is an additional non-volatile
register that can permanently write-protect the BlockProtection register bits for each individual block. Each
of the corresponding lock-down bits are one time programmable (OTP)—once written, they cannot be
erased. Data that had been previously programmed
into these blocks cannot be altered by programming or
erase and is not reversible
DS20005262F-page 6
4.1.1
INDIVIDUAL BLOCK PROTECTION
SST26VF016B has a Block-Protection register which
provides a software mechanism to write-lock the individual memory blocks and write-lock, and/or read-lock,
the individual parameter blocks. The Block-Protection
register is 48 bits wide: two bits each for the eight 8
KByte parameter blocks (write-lock and read-lock), and
one bit each for the remaining 32 KByte and 64 KByte
overlay blocks (write-lock). See Table 5-6 for address
range protected per register bit.
Each bit in the Block-Protection register (BPR) can be
written to a ‘1’ (protected) or ‘0’ (unprotected). For the
parameter blocks, the most significant bit is for readlock, and the least significant bit is for write-lock. Readlocking the parameter blocks provides additional security for sensitive data after retrieval (e.g., after initial
boot). If a block is read-locked all reads to the block
return data 00H.
2019 Microchip Technology Inc.
SST26VF016B
The Write Block-Protection Register command is a
two-cycle command which requires that Write-Enable
(WREN) is executed prior to the Write Block-Protection
Register command. The Global Block-Protection
Unlock command clears all write protection bits in the
Block-Protection register.
4.1.2
Writing a ‘0’ in any location in the nVWLDR has no
effect on either the nVWLDR or the corresponding
Write-Lock bit in the BPR.
Note that if the Block-Protection register had been previously locked down, see “Write-Protection Lock-Down
(Volatile)”, the device must be power cycled before
using the nVWLDR. If the Block-Protection register is
locked down and the Write nVWLDR command is
accessed, the command will be ignored.
WRITE-PROTECTION LOCK-DOWN
(VOLATILE)
To prevent changes to the Block-Protection register,
use the Lock-Down Block-Protection Register (LBPR)
command to enable Write-Protection Lock-Down.
Once Write-Protection Lock-Down is enabled, the
Block-Protection register can not be changed. To avoid
inadvertent lock down, the WREN command must be
executed prior to the LBPR command.
4.2
To reset Write-Protection Lock-Down, performing a power
cycle on the device is required. The Write-Protection LockDown status may be read from the Status register.
4.1.3
WRITE-LOCK LOCK-DOWN (NONVOLATILE)
The non-Volatile Write-Lock Lock-Down register is an
alternate register that permanently prevents changes
to the block-protect bits. The non-Volatile Write-Lock
Lock-Down register (nVWLDR) is 40 bits wide per
device: one bit each for the eight 8-KByte parameter
blocks, and one bit each for the remaining 32 KByte
and 64 KByte overlay blocks. See Table 5-6 for address
range protected per register bit.
The hardware Write Protection pin (WP#) is used in conjunction with the WPEN and IOC bits in the configuration
register to prohibit write operations to the Block-Protection and Configuration registers. The WP# pin function
only works in SPI single-bit and dual-bit read mode when
the IOC bit in the configuration register is set to ‘0’.
The WP# pin function is disabled when the WPEN bit
in the configuration register is ‘0’. This allows installation of SST26VF016B in a system with a grounded
WP# pin while still enabling Write to the Block-Protection register. The Lock-Down function of the Block-Protection Register supersedes the WP# pin, see Table 41 for Write Protection Lock-Down states.
The factory default setting at power-up of the WPEN bit
is ‘0’, disabling the Write Protect function of the WP#
after power-up. WPEN is a non-volatile bit; once the bit
is set to ‘1’, the Write Protect function of the WP# pin
continues to be enabled after power-up. The WP# pin
only protects the Block-Protection Register and Configuration Register from changes. Therefore, if the WP#
pin is set to low before or after a Program or Erase
command, or while an internal Write is in progress, it
will have no effect on the Write command.
Writing ‘1’ to any or all of the nVWLDR bits disables the
change mechanism for the corresponding Write-Lock
bit in the BPR, and permanently sets this bit to a ‘1’
(protected) state. After this change, both bits will be set
to ‘1’, regardless of the data entered in subsequent
writes to either the nVWLDR or the BPR. Subsequent
writes to the nVWLDR can only alter available locations
that have not been previously written to a ‘1’. This
method provides write-protection for the corresponding
memory-array block by protecting it from future program or erase operations.
TABLE 4-1:
Hardware Write Protection
The IOC bit takes priority over the WPEN bit in the configuration register. When the IOC bit is ‘1’, the function
of the WP# pin is disabled and the WPEN bit serves no
function. When the IOC bit is ‘0’ and WPEN is ‘1’, setting the WP# pin active low prohibits Write operations
to the Block Protection Register.
WRITE PROTECTION LOCK-DOWN STATES
WP#
IOC
WPEN
WPLD
Execute WBPR Instruction
Configuration Register
L
0
1
1
Not Allowed
Protected
L
0
0
1
Not Allowed
Writable
L
0
1
0
Not Allowed
Protected
L
01
02
0
Allowed
Writable
H
0
X
1
Not Allowed
Writable
H
0
X
0
Allowed
Writable
X
1
X
1
Not Allowed
Writable
1
2
0
Allowed
Writable
X
0
1. Default at power-up Register settings
2. Factory default setting is ‘0’. This is a non-volatile bit; default at power-up is the value set prior to power-down.
2019 Microchip Technology Inc.
DS20005262F-page 7
SST26VF016B
4.3
Security ID
SST26VF016B offers a 2 KByte Security ID (Sec ID)
feature. The Security ID space is divided into two parts
– one factory-programmed, 64-bit segment and one
user-programmable segment. The factory-programmed segment is programmed during part manufacture with a unique number and cannot be changed.
The user-programmable segment is left unprogrammed for the customer to program as desired.
Use the Program Security ID (PSID) command to program the Security ID using the address shown in Table
5-5. The Security ID can be locked using the Lockout
Security ID (LSID) command. This prevents any future
write operations to the Security ID.
The factory-programmed portion of the Security ID
can’t be programmed by the user; neither the factoryprogrammed nor user-programmable areas can be
erased.
4.4
Hold Operation
The HOLD# pin pauses active serial sequences without resetting the clocking sequence. This pin is active
after every power up and only operates during SPI
single-bit and dual-bit modes. SST26VF016B ships
FIGURE 4-3:
with the IOC bit set to ‘0’ and the HOLD# pin function
enabled. The HOLD# pin is always disabled in SQI
mode and only works in SPI single-bit and dual-bit read
mode.
To activate the Hold mode, CE# must be in active low
state. The Hold mode begins when the SCK active low
state coincides with the falling edge of the HOLD# signal. The Hold mode ends when the HOLD# signal’s rising edge coincides with the SCK active low state.
If the falling edge of the HOLD# signal does not coincide with the SCK active low state, then the device
enters Hold mode when the SCK next reaches the
active low state. Similarly, if the rising edge of the
HOLD# signal does not coincide with the SCK active
low state, then the device exits Hold mode when the
SCK next reaches the active low state. See Figure 4-3.
Once the device enters Hold mode, SO will be in high
impedance state while SI and SCK can be VIL or VIH.
If CE# is driven active high during a Hold condition, it
resets the internal logic of the device. As long as
HOLD# signal is low, the memory remains in the Hold
condition. To resume communication with the device,
HOLD# must be driven active high, and CE# must be
driven active low.
HOLD CONDITION WAVEFORM.
SCK
HOLD#
Active
Hold
Active
Hold
Active
20005262 F46.0
DS20005262F-page 8
2019 Microchip Technology Inc.
SST26VF016B
4.5
Status Register
The Status register is a read-only register that provides
the following status information: whether the flash
memory array is available for any Read or Write operation, if the device is write-enabled, whether an erase
or program operation is suspended, and if the Block-
TABLE 4-2:
Protection register and/or Security ID are locked down.
During an internal Erase or Program operation, the Status register may be read to determine the completion of
an operation in progress. Table 4-2 describes the function of each bit in the Status register.
STATUS REGISTER
Default at
Power-up
Read/Write
(R/W)
Write operation status
1 = Internal Write operation is in progress
0 = No internal Write operation is in progress
0
R
WEL
Write-Enable Latch status
1 = Device is write-enabled
0 = Device is not write-enabled
0
R
2
WSE
Write Suspend-Erase status
1 = Erase suspended
0 = Erase is not suspended
0
R
3
WSP
Write Suspend-Program status
1 = Program suspended
0 = Program is not suspended
0
R
4
WPLD
Write Protection Lock-Down status
1 = Write Protection Lock-Down enabled
0 = Write Protection Lock-Down disabled
0
R
5
SEC1
Security ID status
1 = Security ID space locked
0 = Security ID space not locked
01
R
6
RES
Reserved for future use
0
R
7
BUSY
Write operation status
1 = Internal Write operation is in progress
0 = No internal Write operation is in progress
0
R
Bit
Name
Function
0
BUSY
1
1. The Security ID status will always be ‘1’ at power-up after a successful execution of the Lockout Security ID instruction, otherwise default at power-up is ‘0’.
2019 Microchip Technology Inc.
DS20005262F-page 9
SST26VF016B
4.5.1
WRITE-ENABLE LATCH (WEL)
The Write-Enable Latch (WEL) bit indicates the status
of the internal memory’s Write-Enable Latch. If the
WEL bit is set to ‘1’, the device is write enabled. If the
bit is set to ‘0’ (reset), the device is not write enabled
and does not accept any memory Program or Erase,
Protection Register Write, or Lock-Down commands.
The Write-Enable Latch bit is automatically reset under
the following conditions:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Power-up
Reset
Write-Disable (WRDI) instruction
Page-Program instruction completion
Sector-Erase instruction completion
Block-Erase instruction completion
Chip-Erase instruction completion
Write-Block-Protection register instruction
Lock-Down Block-Protection register instruction
Program Security ID instruction completion
Lockout Security ID instruction completion
Write-Suspend instruction
SPI Quad Page program instruction completion
Write Status Register
4.5.2
WRITE SUSPEND ERASE STATUS
(WSE)
The Write Suspend-Erase status (WSE) indicates
when an Erase operation has been suspended. The
WSE bit is ‘1’ after the host issues a suspend command
during an Erase operation. Once the suspended Erase
resumes, the WSE bit is reset to ‘0’.
TABLE 4-3:
Bit
0
IOC
2
RES
3
BPNV
4
5
6
RES
RES
RES
7
WPEN
WRITE SUSPEND PROGRAM
STATUS (WSP)
The Write Suspend-Program status (WSP) bit indicates
when a Program operation has been suspended. The
WSP is ‘1’ after the host issues a suspend command
during the Program operation. Once the suspended
Program resumes, the WSP bit is reset to ‘0’.
4.5.4
WRITE PROTECTION LOCK-DOWN
STATUS (WPLD)
The Write Protection Lock-Down status (WPLD) bit
indicates when the Block-Protection register is lockeddown to prevent changes to the protection settings.
The WPLD is ‘1’ after the host issues a Lock-Down
Block-Protection command. After a power cycle, the
WPLD bit is reset to ‘0’.
4.5.5
SECURITY ID STATUS (SEC)
The Security ID Status (SEC) bit indicates when the
Security ID space is locked to prevent a Write command. The SEC is ‘1’ after the host issues a Lockout
SID command. Once the host issues a Lockout SID
command, the SEC bit can never be reset to ‘0.’
4.5.6
BUSY
The Busy bit determines whether there is an internal
Erase or Program operation in progress. If the BUSY
bit is ‘1’, the device is busy with an internal Erase or
Program operation. If the bit is ‘0’, no Erase or Program
operation is in progress.
4.6
Configuration Register
The Configuration register is a Read/Write register that
stores a variety of configuration information. See Table
4-3 for the function of each bit in the register.
CONFIGURATION REGISTER
Name
RES
1
4.5.3
Function
Default at Power-up
Reserved
0
I/O Configuration for SPI Mode
1 = WP# and HOLD# pins disabled
01
0 = WP# and HOLD# pins enabled
Reserved
0
Block-Protection Volatility State
1 = No memory block has been permanently locked
1
0 = Any block has been permanently locked
Reserved
0
Reserved
0
Reserved
0
Write-Protection Pin (WP#) Enable
1 = WP# enabled
02
0 = WP# disabled
Read/Write (R/W)
R
R/W
R
R
R
R
R
R/W
1. Default at Power-up is ‘0’
2. Factory default setting. This is a non-volatile bit; default at power-up will be the setting prior to power-down.
DS20005262F-page 10
2019 Microchip Technology Inc.
SST26VF016B
4.6.1
I/O CONFIGURATION (IOC)
The I/O Configuration (IOC) bit re-configures the I/O
pins. The IOC bit is set by writing a ‘1’ to Bit 1 of the
Configuration register. When IOC bit is ‘0’ the WP# pin
and HOLD# pin are enabled (SPI or Dual Configuration
setup). When IOC bit is set to ‘1’ the SIO2 pin and SIO3
pin are enabled (SPI Quad I/O Configuration setup).
The IOC bit must be set to ‘1’ before issuing the following SPI commands: SQOR (6BH), SQIOR (EBH),
RBSPI (ECH), and SPI Quad page program (32H).
Without setting the IOC bit to ‘1’, those SPI commands
are not valid. The I/O configuration bit does not apply
when in SQI mode. The default at power-up is ‘0’.
4.6.2
BLOCK-PROTECTION VOLATILITY
STATE (BPNV)
The Block-Protection Volatility State bit indicates
whether any block has been permanently locked with
the non-Volatile Write-Lock Lock-Down register
(nVWLDR). When no bits in the nVWLDR have been
set, the BPNV is ‘1’; this is the default state from the
factory. When one or more bits in the nVWLDR are set
to ‘1’, the BPNV bit will be ‘0’ from that point forward,
even after power-up.
4.6.3
WRITE-PROTECT ENABLE (WPEN)
The Write-Protect Enable (WPEN) bit is a non-volatile
bit that enables the WP# pin.
The Write-Protect (WP#) pin and the Write-Protect
Enable (WPEN) bit control the programmable hardware write-protect feature. Setting the WP# pin to low,
and the WPEN bit to ‘1’, enables Hardware write-protection. To disable Hardware write protection, set either
the WP# pin to high or the WPEN bit to ‘0’. There is
latency associated with writing to the WPEN bit. Poll
the BUSY bit in the Status register, or wait TWPEN, for
the completion of the internal, self-timed Write operation. When the chip is hardware write protected, only
Write operations to Block-Protection and Configuration
registers are disabled. See “Hardware Write Protection” on page 7 and Table 4-1 on page 7 for more information about the functionality of the WPEN bit.
2019 Microchip Technology Inc.
DS20005262F-page 11
SST26VF016B
5.0
INSTRUCTIONS
Instructions are used to read, write (erase and program), and configure the SST26VF016B. The complete list of the instructions is provided in Table 5-1.
TABLE 5-1:
DEVICE OPERATION INSTRUCTIONS FOR SST26VF016B
Mode
Command
Cycle1
SPI
No Operation
00H
RSTEN
Reset Enable
RST5
Reset Memory
Instruction Description
SQI
Address
Cycle(s)2, 3
Dummy
Cycle(s)3
Data
Cycle(s)3
X
X
0
0
0
66H
X
X
0
0
0
99H
X
X
0
0
0
0
0
0
0
0
0
0
0
1 to
X
0
1
1 to
X
0
0
2
0
0
1 to
0
1
1 to
3
0
1 to
Max4
Freq
Configuration
NOP
EQIO
Enable Quad I/O
38H
X
RSTQIO6
Reset Quad I/O
FFH
X
RDSR
Read Status Register
05H
X
X
WRSR
Write Status Register
01H
X
RDCR
Read Configuration
Register
35H
X
Read
Read Memory
03H
HighSpeed
Read
Read Memory at Higher
Speed
0BH
SQOR7
SPI Quad Output Read
6BH
SQIOR8
SPI Quad I/O Read
EBH
X
3
3
1 to
SDOR
SPI Dual Output Read
3BH
X
3
1
1 to
SDIOR10
SPI Dual I/O Read
BBH
X
3
1
1 to
SB
Set Burst Length
C0H
X
X
0
0
1
RBSQI
SQI Read Burst with Wrap
0CH
X
3
3
n to
RBSPI8
SPI Read Burst with Wrap
ECH
X
3
3
n to
JEDEC-ID JEDEC-ID Read
9FH
X
Quad J-ID
Quad I/O J-ID Read
AFH
SFDP
Serial Flash Discoverable
Parameters
5AH
X
X
104 MHz
/ 80 MHz
Read
9
X
3
3
1 to
X
3
1
1 to
X
3
1
1 to
X
40 MHz
104 MHz
/ 80 MHz
80 MHz
104 MHz
/ 80 MHz
Identification
X
0
0
3 to
0
1
3 to
3
1
1 to
104 MHz
/ 80 MHz
Write
WREN
Write Enable
06H
X
X
0
0
0
WRDI
Write Disable
04H
X
X
0
0
0
11
SE
Erase 4 KBytes of Memory
Array
20H
X
X
3
0
0
BE12
Erase 64, 32 or 8 KBytes of
Memory Array
D8H
X
X
3
0
0
CE
Erase Full Array
C7H
X
X
0
0
0
X
PP
Page Program
02H
X
SPI Quad
PP7
SQI Quad Page
Program
32H
X
DS20005262F-page 12
3
0
1 to 256
3
0
1 to 256
104 MHz
/ 80 MHz
2019 Microchip Technology Inc.
SST26VF016B
TABLE 5-1:
DEVICE OPERATION INSTRUCTIONS FOR SST26VF016B
Mode
Dummy
Cycle(s)3
Data
Cycle(s)3
Max4
Freq
104 MHz
/ 80 MHz
SPI
SQI
Address
Cycle(s)2, 3
WRSU
Suspends Program/Erase
B0H
X
X
0
0
0
WRRE
Resumes Program/Erase
30H
X
X
0
0
0
RBPR
Read Block-Protection
Register
72H
X
0
0
1 to6
X
0
1
1 to6
WBPR
Write Block-Protection
Register
42H
X
X
0
0
1 to 6
LBPR
Lock Down
Block-Protection
Register
8DH
X
X
0
0
0
nVWLDR
non-Volatile Write LockDown Register
E8H
X
X
0
0
1 to 6
ULBPR
Global Block Protection
Unlock
98H
X
X
0
0
0
RSID
Read Security ID
88H
X
2
1
1 to 2048
X
2
3
1 to 2048
Instruction Description
Command
Cycle1
Protection
PSID
Program User
Security ID area
A5H
X
X
2
0
1 to 256
LSID
Lockout Security ID Programming
85H
X
X
0
0
0
104 MHz
/ 80 MHz
Power Saving
DPD
Deep Power-down Mode
B9H
X
X
0
0
0
RDPD
Release from Deep Powerdown and Read ID
ABH
X
X
3
0
1 to
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
104 MHz
/ 80 MHz
Command cycle is two clock periods in SQI mode and eight clock periods in SPI mode.
Address bits above the most significant bit of each density can be VIL or VIH.
Address, Dummy/Mode bits, and Data cycles are two clock periods in SQI and eight clock periods in SPI mode.
The max frequency for all instructions is up to 104 MHz from 2.7-3.6V and up to 80 MHz from 2.3-3.6V unless otherwise noted.
For Extended temperature (125°C), max frequency is up to 80 MHz.
RST command only executed if RSTEN command is executed first. Any intervening command will disable Reset.
Device accepts eight-clock command in SPI mode, or two-clock command in SQI mode.
Data cycles are two clock periods. IOC bit must be set to ‘1’ before issuing the command.
Address, Dummy/Mode bits, and data cycles are two clock periods. IOC bit must be set to ‘1’ before issuing the command.
Data cycles are four clock periods.
Address, Dummy/Mode bits, and Data cycles are four clock periods.
Sector Addresses: Use AMS - A12, remaining address are don’t care, but must be set to VIL or VIH.
Blocks are 64 KByte, 32 KByte, or 8KByte, depending on location. Block Erase Address: AMS - A16 for 64 KByte; AMS - A15
for 32 KByte; AMS - A13 for 8 KByte. Remaining addresses are don’t care, but must be set to VIL or VIH.
2019 Microchip Technology Inc.
DS20005262F-page 13
SST26VF016B
5.1
No Operation (NOP)
The Reset operation requires the Reset-Enable command followed by the Reset command. Any command
other than the Reset command after the Reset-Enable
command will disable the Reset-Enable.
The No Operation command only cancels a Reset
Enable command. NOP has no impact on any other
command.
5.2
Once the Reset-Enable and Reset commands are successfully executed, the device returns to normal operation Read mode and then does the following: resets the
protocol to SPI mode, resets the burst length to
8 Bytes, clears all the bits, except for bit 4 (WPLD) and
bit 5 (SEC), in the Status register to their default states,
and clears bit 1 (IOC) in the configuration register to its
default state. A device reset during an active Program
or Erase operation aborts the operation, which can
cause the data of the targeted address range to be corrupted or lost. Depending on the prior operation, the
reset timing may vary. Recovery from a Write operation
requires more latency time than recovery from other
operations. See Table 8-2 on page 46 for Rest timing
parameters.
Reset-Enable (RSTEN) and Reset
(RST)
The Reset operation is used as a system (software)
reset that puts the device in normal operating Ready
mode. This operation consists of two commands:
Reset-Enable (RSTEN) followed by Reset (RST).
To reset SST26VF016B, the host drives CE# low,
sends the Reset-Enable command (66H), and drives
CE# high. Next, the host drives CE# low again, sends
the Reset command (99H), and drives CE# high, see
Figure 5-1.
FIGURE 5-1:
RESET SEQUENCE
TCPH
CE#
MODE 3
MODE 3
MODE 3
CLK
MODE 0
SIO(3:0)
MODE 0
MODE 0
C1 C0
C3 C2
2005262 F05.0
Note: C[1:0] = 66H; C[3:2] = 99H
5.3
Read (40 MHz)
will automatically increment until the highest memory
address is reached. Once the highest memory address
is reached, the address pointer will automatically return
to the beginning (wrap-around) of the address space.
The Read instruction, 03H, is supported in SPI bus protocol only with clock frequencies up to 40 MHz. This
command is not supported in SQI bus protocol. The
device outputs the data starting from the specified
address location, then continuously streams the data
output through all addresses until terminated by a lowto-high transition on CE#. The internal address pointer
FIGURE 5-2:
Initiate the Read instruction by executing an 8-bit command, 03H, followed by address bits A[23:0]. CE# must
remain active low for the duration of the Read cycle.
See Figure 5-2 for Read Sequence.
READ SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
39 40
47 48
55 56
63 64
70
MODE 0
03
SI
MSB
SO
ADD.
MSB
HIGH IMPEDANCE
ADD.
ADD.
N
DOUT
MSB
DS20005262F-page 14
N+1
DOUT
N+2
DOUT
N+3
DOUT
N+4
DOUT
20005262 F29.0
2019 Microchip Technology Inc.
SST26VF016B
5.4
Enable Quad I/O (EQIO)
The Enable Quad I/O (EQIO) instruction, 38H, enables
the flash device for SQI bus operation. Upon completion of the instruction, all instructions thereafter are
FIGURE 5-3:
expected to be 4-bit multiplexed input/output (SQI
mode) until a power cycle or a “Reset Quad I/O instruction” is executed. See Figure 5-3.
ENABLE QUAD I/O SEQUENCE
CE#
MODE 3
SCK
0
2
1
3
4
5
6
7
MODE 0
SIO0
38
SIO[3:1]
20005262 F43.0
Note: SIO[3:1] must be driven VIH
5.5
Reset Quad I/O (RSTQIO)
where it can accept new command instruction. An additional RSTQIO is required to reset the device to SPI
mode.
The Reset Quad I/O instruction, FFH, resets the device
to 1-bit SPI protocol operation or exits the Set Mode
configuration during a read sequence. This command
allows the flash device to return to the default I/O state
(SPI) without a power cycle, and executes in either 1bit or 4-bit mode. If the device is in the Set Mode configuration, while in SQI High-Speed Read mode, the
RSTQIO command will only return the device to a state
FIGURE 5-4:
To execute a Reset Quad I/O operation, the host drives
CE# low, sends the Reset Quad I/O command cycle
(FFH) then, drives CE# high. Execute the instruction in
either SPI (8 clocks) or SQI (2 clocks) command
cycles. For SPI, SIO[3:1] are don’t care for this command, but should be driven to VIH or VIL. See Figures
5-4 and 5-5.
RESET QUAD I/O SEQUENCE (SPI)
CE#
MODE 3
SCK
0
1
2
3
4
5
6
7
MODE 0
FF
SIO0
SIO[3:1]
20005262 F73.0
Note: SIO[3:1]
FIGURE 5-5:
RESET QUAD I/O SEQUENCE (SQI)
CE#
MODE 3
SCK
SIO(3:0)
0
1
F
F
MODE 0
20005262 F74.0
2019 Microchip Technology Inc.
DS20005262F-page 15
SST26VF016B
5.6
High-Speed Read
Initiate High-Speed Read by executing an 8-bit command, 0BH, followed by address bits A[23-0] and a
dummy byte. CE# must remain active low for the duration of the High-Speed Read cycle. See Figure 5-6 for
the High-Speed Read sequence for SPI bus protocol.
The High-Speed Read instruction, 0BH, is supported in
both SPI bus protocol and SQI protocol. This
instruction supports frequencies of up to 80 or 104 MHz
with additional dummy input cycles prior to first data
byte output. On power-up, the device is set to use SPI.
FIGURE 5-6:
HIGH-SPEED READ SEQUENCE (SPI) (C[1:0] = 0BH)
CE#
MODE 3
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
39 40
47 48
55 56
63 64
80
71 72
SCK MODE 0
0B
SI/SIO0
ADD.
ADD.
ADD.
X
N
DOUT
MSB
HIGH IMPEDANCE
SO/SIO1
N+1
DOUT
N+2
DOUT
N+3
DOUT
N+4
DOUT
20005262 F31.0
In SQI protocol, the host drives CE# low then sends
one High-Speed Read command cycle, 0BH, followed
by three address cycles, a Set Mode Configuration
cycle, and two dummy cycles. Each cycle is two nibbles
(clocks) long, most significant nibble first.
mand, 0BH, and does not require the op-code to be
entered again. The host may initiate the next Read
cycle by driving CE# low, then sending the four-bits
input for address A[23:0], followed by the Set Mode
configuration bits M[7:0], and two dummy cycles. After
the two dummy cycles, the device outputs the data
starting from the specified address location. There are
no restrictions on address location access.
After the dummy cycles, the device outputs data on the
falling edge of the SCK signal starting from the specified address location. The device continually streams
data output through all addresses until terminated by a
low-to-high transition on CE#. The internal address
pointer automatically increments until the highest memory address is reached, at which point the address
pointer returns to address location 000000H. During
this operation, blocks that are Read-locked will output
data 00H.
When M[7:0] is any value other than AXH, the device
expects the next instruction initiated to be a command
instruction. To reset/exit the Set Mode configuration,
execute the Reset Quad I/O command, FFH. While in
the Set Mode configuration, the RSTQIO command will
only return the device to a state where it can accept
new command instruction. An additional RSTQIO is
required to reset the device to SPI mode. See Figure 510 for the SPI Quad I/O Mode Read sequence when
M[7:0] = AXH.
The Set Mode Configuration bit M[7:0] indicates if the
next instruction cycle is another SQI High-Speed Read
command. When M[7:0] = AXH, the device expects the
next continuous instruction to be another Read com-
FIGURE 5-7:
HIGH-SPEED READ SEQUENCE (SQI)
CE#
0
1
MODE 0 MSN
LSN
C0
C1
MODE 3
2
3
A5
A4
4
5
6
7
8
9
A3
A2
A1
A0
M1
M0
10
11
12
13
14
15
20
21
SCK
SIO(3:0)
Command
Address
Mode
Note: MSN= Most Significant Nibble, LSN = Least Significant Nibble
Hx = High Data Nibble, Lx = Low Data Nibble C[1:0]=0BH
DS20005262F-page 16
X
X
X
Dummy
X
H0
L0
Data Byte 0
H8
L8
Data Byte 7
20005262 F47.0
2019 Microchip Technology Inc.
SST26VF016B
5.7
SPI Quad-Output Read
The SPI Quad-Output Read instruction supports frequencies of up to 80 or 104 MHz with additional dummy
input cycles prior to first data byte output.
SST26VF016B requires the IOC bit in the configuration
register to be set to ‘1’ prior to executing the command.
Initiate SPI Quad-Output Read by executing an 8-bit
command, 6BH, followed by address bits A[23-0] and a
dummy byte. CE# must remain active low for the duration of the SPI Quad Mode Read. See Figure 5-8 for the
SPI Quad Output Read sequence.
FIGURE 5-8:
Following the dummy byte, the device outputs data
from SIO[3:0] starting from the specified address location. The device continually streams data output
through all addresses until terminated by a low-to-high
transition on CE#. The internal address pointer automatically increments until the highest memory address
is reached, at which point the address pointer returns
to the beginning of the address space.
SPI QUAD OUTPUT READ
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
39 40 41
MODE 0
6BH
SIO0
OP Code
A[23:16]
A[15:8]
Address
A[7:0]
X
b4 b0
b4 b0
Dummy
Data
Byte 0
Data
Byte N
SIO1
b5 b1
b5 b1
SIO2
b6 b2
b6 b2
SIO3
b7 b3
b7 b3
Note: MSN= Most Significant Nibble, LSN = Least Significant Nibble
2019 Microchip Technology Inc.
20005262 F48.3
DS20005262F-page 17
SST26VF016B
5.8
SPI Quad I/O Read
The SPI Quad I/O Read (SQIOR) instruction supports
frequencies of up to 80 or 104 MHz with additional
dummy input cycles prior to first data byte output.
SST26VF016B requires the IOC bit in the configuration
register to be set to ‘1’ prior to executing the command.
Initiate SQIOR by executing an 8-bit command, EBH.
The device then switches to 4-bit I/O mode for address
bits A[23-0], followed by the Set Mode configuration
bits M[7:0], and two dummy bytes.CE# must remain
active low for the duration of the SPI Quad I/O Read.
See Figure 5-9 for the SPI Quad I/O Read sequence.
The Set Mode Configuration bit M[7:0] indicates if the
next instruction cycle is another SPI Quad I/O Read
command. When M[7:0] = AXH, the device expects the
next continuous instruction to be another Read command, EBH, and does not require the op-code to be
entered again. The host may set the next SQIOR cycle
by driving CE# low, then sending the four-bit wide input
for address A[23:0], followed by the Set Mode configuration bits M[7:0], and two dummy cycles. After the two
dummy cycles, the device outputs the data starting
from the specified address location. There are no
restrictions on address location access.
Following the dummy bytes, the device outputs data
from the specified address location. The device continually streams data output through all addresses until
terminated by a low-to-high transition on CE#. The
internal address pointer automatically increments until
the highest memory address is reached, at which point
the address pointer returns to the beginning of the
address space.
FIGURE 5-9:
When M[7:0] is any value other than AXH, the device
expects the next instruction initiated to be a command
instruction. To reset/exit the Set Mode configuration,
execute the Reset Quad I/O command, FFH. See Figure 5-10 for the SPI Quad I/O Mode Read sequence
when M[7:0] = AXH.
SPI QUAD I/O READ SEQUENCE
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
MODE 0
SIO0
EBH
A20 A16 A12 A8 A4 A0 M4 M0 X X X X b4 b0 b4 b0
SIO1
A21 A17 A13 A9 A5 A1 M5 M1 X X X X b5 b1 b5 b1
SIO2
A22 A18 A14 A10 A6 A2 M6 M2 X X X X b6 b2 b6 b2
SIO3
A23 A19 A15 A11 A7 A3 M7 M3 X X X X b7 b3 b7 b3
MSN LSN
Address
Note: MSN= Most Significant Nibble, LSN = Least Significant Nibble
DS20005262F-page 18
Set
Mode
Dummy
Data Data
Byte 0 Byte 1
20005262 F49.2
2019 Microchip Technology Inc.
SST26VF016B
FIGURE 5-10:
BACK-TO-BACK SPI QUAD I/O READ SEQUENCES WHEN M[7:0] = AXH
CE#
0 1 2 3 4 5 6 7 8 9 10 11 12 13
SCK
SIO0
b4 b0 b4 b0
A20 A16 A12 A8 A4 A0 M4 M0 X X X X b4 b0
SIO1
b5 b1 b5 b1
A21 A17 A13 A9 A5 A1 M5 M1 X X X X b5 b1
SIO2
b6 b2 b6 b2
A22 A18 A14 A10 A6 A2 M6 M2 X X X X b6 b2
MSN LSN
SIO3
b7 b3 b7 b3
A23 A19 A15 A11 A7 A3 M7 M3 X X X X b7 b3
Data Data
Byte Byte
N+1
N
Set
Mode
Address
Dummy
Data
Byte 0
20005262 F50.2
Note: MSN=
5.9
Set Burst
sends the Set Burst command cycle (C0H) and one
data cycle, then drives CE# high. After power-up or
reset, the burst length is set to eight Bytes (00H). See
Table 5-2 for burst length data and Figures 5-11 and 512 for the sequences.
The Set Burst command specifies the number of bytes
to be output during a Read Burst command before the
device wraps around. It supports both SPI and SQI protocols. To set the burst length the host drives CE# low,
TABLE 5-2:
BURST LENGTH DATA
Burst Length
High Nibble (H0)
Low Nibble (L0)
8 Bytes
0h
0h
16 Bytes
0h
1h
32 Bytes
0h
2h
64 Bytes
0h
3h
FIGURE 5-11:
SET BURST LENGTH SEQUENCE (SQI)
CE#
MODE 3
SCK
SIO(3:0)
0
1
2
3
MODE 0
C1 C0 H0 L0
MSN LSN
20005262 F32.0
Note: MSN = Most Significant
Nibble, LSN = Least Significant Nibble, C[1:0]=C0H
2019 Microchip Technology Inc.
DS20005262F-page 19
SST26VF016B
FIGURE 5-12:
SET BURST LENGTH SEQUENCE (SPI)
CE#
MODE 3
SCK
SIO0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
MODE 0
C0
DIN
SIO[3:1]
20005262 F51.0
Note: SIO[3:1] must
5.10
SQI Read Burst with Wrap (RBSQI)
SQI Read Burst with wrap is similar to High Speed
Read in SQI mode, except data will output continuously
within the burst length until a low-to-high transition on
CE#. To execute a SQI Read Burst operation, drive
CE# low then send the Read Burst command cycle
(0CH), followed by three address cycles, and then
three dummy cycles. Each cycle is two nibbles (clocks)
long, most significant nibble first.
After the dummy cycles, the device outputs data on the
falling edge of the SCK signal starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low-tohigh transition on CE#.
During RBSQI, the internal address pointer automatically increments until the last byte of the burst is
reached, then it wraps around to the first byte of the
burst. All bursts are aligned to addresses within the
burst length, see Table 5-3. For example, if the burst
length is eight Bytes, and the start address is 06h, the
burst sequence would be: 06h, 07h, 00h, 01h, 02h,
03h, 04h, 05h, 06h, etc. The pattern repeats until the
command is terminated by a low-to-high transition on
CE#.
During this operation, blocks that are Read-locked will
output data 00H.
TABLE 5-3:
5.11
SPI Read Burst with Wrap (RBSPI)
SPI Read Burst with Wrap (RBSPI) is similar to SPI
Quad I/O Read except the data will output continuously
within the burst length until a low-to-high transition on
CE#. To execute a SPI Read Burst with Wrap operation, drive CE# low, then send the Read Burst command cycle (ECH), followed by three address cycles,
and then three dummy cycles.
After the dummy cycle, the device outputs data on the
falling edge of the SCK signal starting from the specified address location. The data output stream is continuous through all addresses until terminated by a low-tohigh transition on CE#.
During RBSPI, the internal address pointer automatically increments until the last byte of the burst is
reached, then it wraps around to the first byte of the
burst. All bursts are aligned to addresses within the
burst length, see Table 5-3. For example, if the burst
length is eight Bytes, and the start address is 06h, the
burst sequence would be: 06h, 07h, 00h, 01h, 02h,
03h, 04h, 05h, 06h, etc. The pattern repeats until the
command is terminated by a low-to-high transition on
CE#.
During this operation, blocks that are Read-locked will
output data 00H.
BURST ADDRESS RANGES
Burst Length
Burst Address Ranges
8 Bytes
00-07H, 08-0FH, 10-17H, 18-1FH...
16 Bytes
00-0FH, 10-1FH, 20-2FH, 30-3FH...
32 Bytes
00-1FH, 20-3FH, 40-5FH, 60-7FH...
64 Bytes
00-3FH, 40-7FH, 80-BFH, C0-FFH
DS20005262F-page 20
2019 Microchip Technology Inc.
SST26VF016B
5.12
SPI Dual-Output Read
Following the dummy byte, SST26VF016B outputs
data from SIO[1:0] starting from the specified address
location. The device continually streams data output
through all addresses until terminated by a low-to-high
transition on CE#. The internal address pointer automatically increments until the highest memory address
is reached, at which point the address pointer returns
to the beginning of the address space.
The SPI Dual-Output Read instruction supports frequencies of up to 80 or 104 MHz with additional dummy
input cycles prior to first data byte output. Initiate SPI
Dual-Output Read by executing an 8-bit command,
3BH, followed by address bits A[23-0] and a dummy
byte. CE# must remain active low for the duration of the
SPI Dual-Output Read operation. See Figure 5-13 for
the SPI Quad Output Read sequence.
FIGURE 5-13:
FAST READ, DUAL-OUTPUT SEQUENCE
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
3BH
SIO0
A[23:16]
A[15:8]
SIO1
OP Code
Address
Note: MSB = Most Significant Bit.
5.13
39 40 41
31 32
MODE 0
SPI Dual I/O Read
The SPI Dual I/O Read (SDIOR) instruction supports
up to 80 MHz frequency. Initiate SDIOR by executing
an 8-bit command, BBH. The device then switches to
2-bit I/O mode for address bits A[23-0], followed by the
Set Mode configuration bits M[7:0].CE# must remain
active low for the duration of the SPI Dual I/O Read.
See Figure 5-14 for the SPI Dual I/O Read sequence.
A[7:0]
b6 b5 b3 b1
b6 b5 b3 b1
MSB
b7 b4 b2 b0
b7 b4 b2 b0
X
Dummy
Data
Byte 0
Data
Byte N
20005262 F52.3
execute the Reset Quad I/O command, FFH. See Figure 5-15 for the SPI Dual I/O Read sequence when
M[7:0] = AXH.
Following the Set Mode configuration bits, the
SST26VF016B outputs data from the specified address
location. The device continually streams data output
through all addresses until terminated by a low-to-high
transition on CE#. The internal address pointer automatically increments until the highest memory address
is reached, at which point the address pointer returns
to the beginning of the address space.
The Set Mode Configuration bit M[7:0] indicates if the
next instruction cycle is another SPI Dual I/O Read
command. When M[7:0] = AXH, the device expects the
next continuous instruction to be another SDIOR command, BBH, and does not require the op-code to be
entered again. The host may set the next SDIOR cycle
by driving CE# low, then sending the two-bit wide input
for address A[23:0], followed by the Set Mode configuration bits M[7:0]. After the Set Mode Configuration bits,
the device outputs the data starting from the specified
address location. There are no restrictions on address
location access.
When M[7:0] is any value other than AXH, the device
expects the next instruction initiated to be a command
instruction. To reset/exit the Set Mode configuration,
2019 Microchip Technology Inc.
DS20005262F-page 21
SST26VF016B
FIGURE 5-14:
SPI DUAL I/O READ SEQUENCE
CE#
MODE 3
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
MODE 0
SCK
SIO0
6 4 2 0 6 4 2 0 6 4 2 0 6 4
BBH
SIO1
7 5 3 1 7 5 3 1 7 5 3 1 7 5
A[23:16]
A[7:0]
A[15:8]
M[7:0]
CE#(cont’)
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
SCK(cont’)
I/O Switches from Input to Output
SIO0(cont’)
6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6
MSB
SIO1(cont’)
MSB
MSB
MSB
7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7
Byte 0
Byte 2
Byte 1
Byte 3
20005262 F53.1
Note: MSB=
Most Significant Bit, LSB = Least Significant Bit
FIGURE 5-15:
BACK-TO-BACK SPI DUAL I/O READ SEQUENCES WHEN M[7:0] = AXH
CE#
MODE 3
0 1 2
3 4 5 6 7 8 9 10 11 12 13 14 15
MODE 0
SCK
I/O Switch
SIO0 6 4
MSB
SIO1 7 5
6 4 2 0 6 4 2 0 6 4 2 0 6 4
6 4 2 0
MSB
7 5 3 1 7 5 3 1 7 5 3 1 7 5
7 5 3 1
A[23:16]
A[15:8]
A[7:0]
M[7:0]
CE#(cont’)
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
SCK(cont’)
I/O Switches from Input to Output
SIO0(cont’)
6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6
MSB
SIO1(cont’)
Byte 0
Note: MSB=
Most
DS20005262F-page 22
MSB
MSB
MSB
7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7
Byte 1
Byte 2
Byte 3
20005262 F54.1
2019 Microchip Technology Inc.
SST26VF016B
5.14
JEDEC-ID Read (SPI Protocol)
Immediately
following
the
command
cycle,
SST26VF016B output data on the falling edge of the
SCK signal. The data output stream is continuous until
terminated by a low-to-high transition on CE#. The
device outputs three bytes of data: manufacturer,
device type, and device ID, see Table 5-4. See Figure
5-16 for instruction sequence.
Using traditional SPI protocol, the JEDEC-ID Read
instruction identifies the device as SST26VF016B and
the manufacturer as Microchip®. To execute a JECECID operation the host drives CE# low then sends the
JEDEC-ID command cycle (9FH).
TABLE 5-4:
DEVICE ID DATA OUTPUT
Device ID
Product
Manufacturer ID (Byte 1)
Device Type (Byte 2)
Device ID (Byte 3)
SST26VF016B
BFH
26H
41H
FIGURE 5-16:
JEDEC-ID SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
MODE 0
SI
SO
9F
HIGH IMPEDANCE
26
BF
MSB
Device ID
MSB
20005262 F38.0
5.15
Read Quad J-ID Read (SQI
Protocol)
Immediately following the command cycle and one
dummy cycle, SST26VF016B outputs data on the falling edge of the SCK signal. The data output stream is
continuous until terminated by a low-to-high transition
of CE#. The device outputs three bytes of data: manufacturer, device type, and device ID, see Table 5-4. See
Figure 5-17 for instruction sequence.
The Read Quad J-ID Read instruction identifies the
device as SST26VF016B and manufacturer as Microchip. To execute a Quad J-ID operation the host drives
CE# low and then sends the Quad J-ID command cycle
(AFH). Each cycle is two nibbles (clocks) long, most
significant nibble first.
FIGURE 5-17:
QUAD J-ID READ SEQUENCE
CE#
MODE 3
0
1
2
C0
C1
X
3
4
5
MSN
LSN
H0
L0
7
6
8
9
H2
L2
10
11
12
13
N
SCK
MODE 0
SIO(3:0)
X
Dummy
BFH
H1
L1
26H
Device ID
H0
L0
H1
BFH
L1
26H
HN
LN
N
20005262 F55.0
Note: MSN = Most significant Nibble; LSN= Least Significant Nibble. C{1:0]=AFH
2019 Microchip Technology Inc.
DS20005262F-page 23
SST26VF016B
5.16
Serial Flash Discoverable
Parameters (SFDP)
ware support for all future Serial Flash device families.
See Table 11-1 on page 61 for address and data values.
The Serial Flash Discoverable Parameters (SFDP)
contain information describing the characteristics of the
device. This allows device-independent, JEDEC IDindependent, and forward/backward compatible soft-
FIGURE 5-18:
Initiate SFDP by executing an 8-bit command, 5AH, followed by address bits A[23-0] and a dummy byte. CE#
must remain active low for the duration of the SFDP
cycle. For the SFDP sequence, see Figure 5-18.
SERIAL FLASH DISCOVERABLE PARAMETERS SEQUENCE
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
39 40
47 48
55 56
63 64
71 72
80
MODE 0
5A
SI
ADD.
ADD.
ADD.
X
N
DOUT
MSB
HIGH IMPEDANCE
SO
N+1
DOUT
N+2
DOUT
N+3
DOUT
N+4
DOUT
20005262 F56.0
5.17
Sector-Erase
To execute a Sector-Erase operation, the host drives
CE# low, then sends the Sector Erase command cycle
(20H) and three address cycles, and then drives CE#
high. Address bits [AMS:A12] (AMS = Most Significant
Address) determine the sector address (SAX); the
remaining address bits can be VIL or VIH. To identify the
completion of the internal, self-timed, Write operation,
poll the BUSY bit in the Status register, or wait TSE. See
Figures 5-19 and 5-20 for the Sector-Erase sequence.
The Sector-Erase instruction clears all bits in the
selected 4 KByte sector to ‘1,’ but it does not change a
protected memory area. Prior to any write operation,
the Write-Enable (WREN) instruction must be executed.
FIGURE 5-19:
4 KBYTE SECTOR-ERASE SEQUENCE– SQI MODE
CE#
MODE 3
SCK
0
1
2
4
6
MODE 0
SIO(3:0)
C1 C0 A5 A4 A3 A2 A1 A0
MSN LSN
20005262 F07.0
Note: MSN = Most Significant Nibble, LSN = Least Significant Nibble, C[1:0] = 20H
FIGURE 5-20:
4 KBYTE SECTOR-ERASE SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
20
SI
MSB
SO
15 16
23 24
31
MODE 0
ADD.
ADD.
ADD.
MSB
HIGH IMPEDANCE
20005262 F57.0
DS20005262F-page 24
2019 Microchip Technology Inc.
SST26VF016B
5.18
Block-Erase
To execute a Block-Erase operation, the host drives
CE# low then sends the Block-Erase command cycle
(D8H), three address cycles, then drives CE# high.
Address bits AMS-A13 determine the block address
(BAX); the remaining address bits can be VIL or VIH. For
32 KByte blocks, A14:A13 can be VIL or VIH; for 64
KByte blocks, A15:A13 can be VIL or VIH. Poll the BUSY
bit in the Status register, or wait TBE, for the completion
of the internal, self-timed, Block-Erase operation. See
Figures 5-21 and 5-22 for the Block-Erase sequence.
The Block-Erase instruction clears all bits in the
selected block to ‘1’. Block sizes can be 8 KByte, 32
KByte or 64 KByte depending on address, see Figure
3-1, Memory Map, for details. A Block-Erase instruction
applied to a protected memory area will be ignored.
Prior to any write operation, execute the WREN instruction. Keep CE# active low for the duration of any command sequence.
FIGURE 5-21:
BLOCK-ERASE SEQUENCE (SQI)
CE#
MODE 3
SCK
0
1
2
4
6
MODE 0
SIO(3:0)
C1 C0 A5 A4 A3 A2 A1 A0
MSN LSN
20005262 F08.0
Note: MSN = Most Significant Nibble,
LSN = Least Significant Nibble
C[1:0] = D8H
FIGURE 5-22:
BLOCK-ERASE SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31
MODE 0
D8
SI
MSB
SO
ADDR
ADDR
ADDR
MSB
HIGH IMPEDANCE
20005262 F58.0
2019 Microchip Technology Inc.
DS20005262F-page 25
SST26VF016B
5.19
Chip-Erase
To execute a Chip-Erase operation, the host drives
CE# low, sends the Chip-Erase command cycle (C7H),
then drives CE# high. Poll the BUSY bit in the Status
register, or wait TSCE, for the completion of the internal,
self-timed, Write operation. See Figures 5-23 and 5-24
for the Chip Erase sequence.
The Chip-Erase instruction clears all bits in the device
to ‘1.’ The Chip-Erase instruction is ignored if any of the
memory area is protected. Prior to any write operation,
execute the WREN instruction.
FIGURE 5-23:
CHIP-ERASE SEQUENCE (SQI)
CE#
MODE 3
SCK
0
1
MODE 0
SIO(3:0)
C1 C0
20005262 9.1
Note: C[1:0] = C7H
FIGURE 5-24:
CHIP-ERASE SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7
MODE 0
C7
SI
MSB
SO
HIGH IMPEDANCE
20005262 F59.0
DS20005262F-page 26
2019 Microchip Technology Inc.
SST26VF016B
5.20
Page-Program
partial Byte to be ignored. Poll the BUSY bit in the Status register, or wait TPP, for the completion of the internal, self-timed, Write operation. See Figures 5-25 and
5-26 for the Page-Program sequence.
The Page-Program instruction programs up to 256
Bytes of data in the memory, and supports both SPI
and SQI protocols. The data for the selected page
address must be in the erased state (FFH) before initiating the Page-Program operation. A Page-Program
applied to a protected memory area will be ignored.
Prior to the program operation, execute the WREN
instruction.
When executing Page-Program, the memory range for
the SST26VF016B is divided into 256 Byte page
boundaries. The device handles shifting of more than
256 Bytes of data by maintaining the last 256 Bytes of
data as the correct data to be programmed. If the target
address for the Page-Program instruction is not the
beginning of the page boundary (A[7:0] are not all
zero), and the number of bytes of data input exceeds or
overlaps the end of the address of the page boundary,
the excess data inputs wrap around and will be programmed at the start of that target page.
To execute a Page-Program operation, the host drives
CE# low then sends the Page Program command cycle
(02H), three address cycles followed by the data to be
programmed, then drives CE# high. The programmed
data must be between 1 to 256 Bytes and in whole Byte
increments; sending less than a full Byte will cause the
FIGURE 5-25:
PAGE-PROGRAM SEQUENCE (SQI)
CE#
MODE 3
SCK
0
2
4
6
8
10
12
MODE 0
SIO(3:0)
C1 C0 A5 A4 A3 A2 A1 A0 H0 L0 H1 L1 H2 L2
HN LN
MSN LSN
Data Byte 0 Data Byte 1 Data Byte 2
Data Byte 255
20005262 F10.1
Note:
MSN = Most Significant Nibble, LSN = Least Significant Nibble
FIGURE 5-26:
PAGE-PROGRAM SEQUENCE (SPI)
CE#
MODE 3
SCK
23 24
15 16
0 1 2 3 4 5 6 7 8
31 32
39
MODE 0
SI
ADD.
02
MSB
SO
ADD.
ADD.
Data Byte 0
LSB MSB
LSB MSB
LSB
HIGH IMPEDANCE
2079
2078
2077
2076
2075
2074
2073
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
2072
CE#(cont’)
SCK(cont’)
SI(cont’)
Data Byte 1
MSB
SO(cont’)
Data Byte 255
Data Byte 2
LSB MSB
LSB
MSB
LSB
HIGH IMPEDANCE
20005262 F60.1
2019 Microchip Technology Inc.
DS20005262F-page 27
SST26VF016B
5.21
SPI Quad Page-Program
The SPI Quad Page-Program instruction programs up
to 256 Bytes of data in the memory. The data for the
selected page address must be in the erased state
(FFH) before initiating the SPI Quad Page-Program
operation. A SPI Quad Page-Program applied to a protected memory area will be ignored. SST26VF016B
requires the ICO bit in the configuration register to be
set to ‘1’ prior to executing the command. Prior to the
program operation, execute the WREN instruction.
To execute a SPI Quad Page-Program operation, the
host drives CE# low then sends the SPI Quad PageProgram command cycle (32H), three address cycles
followed by the data to be programmed, then drives
CE# high. The programmed data must be between 1 to
256 Bytes and in whole Byte increments. The com-
FIGURE 5-27:
mand cycle is eight clocks long, the address and data
cycles are each two clocks long, most significant bit
first. Poll the BUSY bit in the Status register, or wait TPP,
for the completion of the internal, self-timed, Write
operation.See Figure 5-27.
When executing SPI Quad Page-Program, the memory
range for the SST26VF016B is divided into 256 Byte
page boundaries. The device handles shifting of more
than 256 Bytes of data by maintaining the last 256
Bytes of data as the correct data to be programmed. If
the target address for the SPI Quad Page-Program
instruction is not the beginning of the page boundary
(A[7:0] are not all zero), and the of bytes of data input
exceeds or overlaps the end of the address of the page
boundary, the excess data inputs wrap around and will
be programmed at the start of that target page.
SPI QUAD PAGE-PROGRAM SEQUENCE
CE#
MODE 3
SCK
SIO0
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
MODE 0
32H
A20A16A12 A8 A4 A0 b4 b0 b4 b0
b4 b0
SIO1
A21 A17A13 A9 A5 A1 b5 b1 b5 b1
b5 b1
SIO2
A22 A18A14A10 A6 A2 b6 b2 b6 b2
b6 b2
MSN LSN
SIO3
A23 A19 A15 A11 A7 A3 b7 b3 b7 b3
b7 b3
Data Data
Byte 0 Byte 1
Data
Byte
255
Address
20005262 F61.1
5.22
Write-Suspend and Write-Resume
Write-Suspend allows the interruption of Sector-Erase,
Block-Erase, SPI Quad Page-Program, or Page-Program operations in order to erase, program, or read
data in another portion of memory. The original operation can be continued with the Write-Resume command. This operation is supported in both SQI and SPI
protocols.
Only one write operation can be suspended at a time;
if an operation is already suspended, the device will
ignore the Write-Suspend command. Write-Suspend
during Chip-Erase is ignored; Chip-Erase is not a valid
command while a write is suspended. The WriteResume command is ignored until any write operation
(Program or Erase) initiated during the Write-Suspend
is complete. The device requires a minimum of 500 µs
between each Write-Suspend command.
DS20005262F-page 28
5.23
Write-Suspend During SectorErase or Block-Erase
Issuing a Write-Suspend instruction during SectorErase or Block-Erase allows the host to program or
read any sector that was not being erased. The device
will ignore any programming commands pointing to the
suspended sector(s). Any attempt to read from the suspended sector(s) will output unknown data because the
Sector- or Block-Erase will be incomplete.
To execute a Write-Suspend operation, the host drives
CE# low, sends the Write Suspend command cycle
(B0H), then drives CE# high. The Status register indicates that the erase has been suspended by changing
the WSE bit from ‘0’ to ‘1,’ but the device will not accept
another command until it is ready. To determine when
the device will accept a new command, poll the BUSY
bit in the Status register or wait TWS.
2019 Microchip Technology Inc.
SST26VF016B
5.24
Write Suspend During Page
Programming or SPI Quad Page
Programming
Issuing a Write-Suspend instruction during Page Programming allows the host to erase or read any sector
that is not being programmed. Erase commands pointing to the suspended sector(s) will be ignored. Any
attempt to read from the suspended page will output
unknown data because the program will be incomplete.
To execute a Write Suspend operation, the host drives
CE# low, sends the Write Suspend command cycle
(B0H), then drives CE# high. The Status register indicates that the programming has been suspended by
changing the WSP bit from ‘0’ to ‘1,’ but the device will
not accept another command until it is ready. To determine when the device will accept a new command, poll
the BUSY bit in the Status register or wait TWS.
5.25
Write-Resume
Write-Resume restarts a Write command that was suspended, and changes the suspend status bit in the Status register (WSE or WSP) back to ‘0’.
To execute a Write-Resume operation, the host drives
CE# low, sends the Write Resume command cycle
(30H), then drives CE# high. To determine if the internal, self-timed Write operation completed, poll the
BUSY bit in the Status register, or wait the specified
time TSE, TBE or TPP for Sector-Erase, Block-Erase, or
Page-Programming, respectively. The total write time
before suspend and after resume will not exceed the
uninterrupted write times TSE, TBE or TPP.
5.26
Read Security ID
The Read Security ID operation is supported in both
SPI and SQI modes. To execute a Read Security ID
(SID) operation in SPI mode, the host drives CE# low,
sends the Read Security ID command cycle (88H), two
address cycles, and then one dummy cycle. To execute
TABLE 5-5:
a Read Security ID operation in SQI mode, the host
drives CE# low and then sends the Read Security ID
command, two address cycles, and three dummy
cycles.
After the dummy cycles, the device outputs data on the
falling edge of the SCK signal, starting from the specified address location. The data output stream is continuous through all SID addresses until terminated by a
low-to-high transition on CE#. See Table 5-5 for the
Security ID address range.
5.27
Program Security ID
The Program Security ID instruction programs one to
2040 Bytes of data in the user-programmable, Security
ID space. This Security ID space is one-time programmable (OTP). The device ignores a Program Security
ID instruction pointing to an invalid or protected
address, see Table 5-5. Prior to the program operation,
execute WREN.
To execute a Program SID operation, the host drives
CE# low, sends the Program Security ID command
cycle (A5H), two address cycles, the data to be programmed, then drives CE# high. The programmed data
must be between 1 to 256 Bytes and in whole Byte
increments.
The device handles shifting of more than 256 Bytes of
data by maintaining the last 256 Bytes of data as the
correct data to be programmed. If the target address for
the Program Security ID instruction is not the beginning
of the page boundary, and the number of data input
exceeds or overlaps the end of the address of the page
boundary, the excess data inputs wrap around and will
be programmed at the start of that target page.
The Program Security ID operation is supported in both
SPI and SQI mode. To determine the completion of the
internal, self-timed Program SID operation, poll the
BUSY bit in the software status register, or wait TPSID
for the completion of the internal self-timed Program
Security ID operation.
PROGRAM SECURITY ID
Program Security ID
Address Range
Unique ID Pre-Programmed at factory
0000 – 0007H
User Programmable
0008H – 07FFH
2019 Microchip Technology Inc.
DS20005262F-page 29
SST26VF016B
5.28
Lockout Security ID
mands function in both SPI and SQI modes. The Status
register may be read at any time, even during a Write
operation. When a Write is in progress, poll the BUSY
bit before sending any new commands to assure that
the new commands are properly received by the
device.
The Lockout Security ID instruction prevents any future
changes to the Security ID, and is supported in both
SPI and SQI modes. Prior to the operation, execute
WREN.
To execute a Lockout SID, the host drives CE# low,
sends the Lockout Security ID command cycle (85H),
then drives CE# high. Poll the BUSY bit in the software
status register, or wait TPSID, for the completion of the
Lockout Security ID operation.
5.29
To Read the Status or Configuration registers, the host
drives CE# low, then sends the Read-Status-Register
command cycle (05H) or the Read Configuration Register command (35H). A dummy cycle is required in
SQI mode. Immediately after the command cycle, the
device outputs data on the falling edge of the SCK signal. The data output stream continues until terminated
by a low-to-high transition on CE#. See Figures 5-28
and 5-29 for the instruction sequence.
Read-Status Register (RDSR) and
Read-Configuration Register
(RDCR)
The Read-Status Register (RDSR) and Read-Configuration Register (RDCR) commands output the contents
of the Status and Configuration registers. These com-
FIGURE 5-28:
READ-STATUS-REGISTER AND READ-CONFIGURATION REGISTER
SEQUENCE (SQI)
CE#
MODE 3
0
2
4
6
8
SCK MODE 0
MSN LSN
SIO(3:0)
C1 C0 X
X H0 L0 H0 L0
Dummy
H0 L0
Status Byte Status Byte
Status Byte
20005262 F11.0
Note: MSN = Most Significant Nibble; LSN = Least Significant Nibble, C[1:0]=05H or 35H
FIGURE 5-29:
READ-STATUS-REGISTER AND READ-CONFIGURATION REGISTER
SEQUENCE (SPI)
CE#
MODE 3
SCK
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
MODE 0
05 or 35H
SI
MSB
SO
HIGH IMPEDANCE
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
MSB
Status or Configuration
Register Out
20005262 F62.1
DS20005262F-page 30
2019 Microchip Technology Inc.
SST26VF016B
5.30
Write-Status Register (WRSR)
low, then sends the Write-Status Register command
cycle (01H), two cycles of data, and then drives CE#
high. Values in the second data cycle will be accepted
by the device. See Figures 5-30 and 5-31.
The Write-Status Register (WRSR) command writes
new values to the Configuration register. To execute a
Write-Status Register operation, the host drives CE#
FIGURE 5-30:
WRITE-STATUS-REGISTER SEQUENCE (SQI)
CE#
MODE 3
SCK
0
1
2
3
4
5
MODE 0
MSN LSN
SIO[3:0]
C1 C0 H0 L0 H0 L0
Command Status
Byte
Configuration
Byte
20005262 F63.1
Note: MSN = Most Significant Nibble; LSN = Least Significant Nibble, XX = Don’t Care, C[1:0]=01H
FIGURE 5-31:
WRITE-STATUS-REGISTER SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7
MODE 0
MODE 3
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
MODE 0
01
06
SI
MSB
SO
MSB
STATUS
CONFIGURATION
REGISTER
REGISTER
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
MSB
MSB
HIGH IMPEDANCE
20005262 F64.1
Note: XX = Don’t Care
2019 Microchip Technology Inc.
DS20005262F-page 31
SST26VF016B
5.31
Write-Enable (WREN)
Protection Register, Lock-Down Block-Protection Register, Non-Volatile Write-Lock Lock-Down Register, SPI
Quad Page program, and Write-Status Register. To
execute a Write Enable the host drives CE# low then
sends the Write Enable command cycle (06H) then
drives CE# high. See Figures 5-32 and 5-33 for the
WREN instruction sequence.
The Write Enable (WREN) instruction sets the WriteEnable-Latch bit in the Status register to ‘1,’ allowing
Write operations to occur. The WREN instruction must
be executed prior to any of the following operations:
Sector Erase, Block Erase, Chip Erase, Page Program,
Program Security ID, Lockout Security ID, Write Block-
FIGURE 5-32:
WRITE-ENABLE SEQUENCE (SQI)
CE#
MODE 3
SCK
0
1
0
6
MODE 0
SIO[3:0]
20005262 F12.1
FIGURE 5-33:
WRITE-ENABLE SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7
MODE 0
06
SI
MSB
SO
HIGH IMPEDANCE
20005262 F18.0
DS20005262F-page 32
2019 Microchip Technology Inc.
SST26VF016B
5.32
Write-Disable (WRDI)
during any internal write operations. Any Write operation started before executing WRDI will complete. Drive
CE# high before executing WRDI.
The Write-Disable (WRDI) instruction sets the WriteEnable-Latch bit in the Status register to ‘0,’ preventing
Write operations. The WRDI instruction is ignored
FIGURE 5-34:
To execute a Write-Disable, the host drives CE# low,
sends the Write Disable command cycle (04H), then
drives CE# high. See Figures 5-34 and 5-35.
WRITE-DISABLE (WRDI) SEQUENCE (SQI)
CE#
MODE 3
SCK
0
1
0
4
MODE 0
SIO(3:0)
20005262 F33.1
FIGURE 5-35:
WRITE-DISABLE (WRDI) SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7
MODE 0
04
SI
MSB
SO
HIGH IMPEDANCE
20005262 F19.0
2019 Microchip Technology Inc.
DS20005262F-page 33
SST26VF016B
5.33
Read Block-Protection Register
(RBPR)
After the command cycle, the device outputs data on
the falling edge of the SCK signal starting with the most
significant bit(s), see Table 5-6 for definitions of each bit
in the Block-Protection register. The RBPR command
does not wrap around. After all data has been output,
the device will output 0H until terminated by a low-tohigh transition on CE#. Figures 5-36 and 5-37.
The Read Block-Protection Register instruction outputs
the Block-Protection register data which determines
the protection status. To execute a Read Block-Protection Register operation, the host drives CE# low, and
then sends the Read Block-Protection Register command cycle (72H). A dummy cycle is required in SQI
mode.
FIGURE 5-36:
READ BLOCK-PROTECTION REGISTER SEQUENCE (SQI)
CE#
MODE 3
0
2
4
6
8
10
12
SCK
SIO[3:0]
C1 C0 X
X H0 L0 H1 L1 H2 L2 H3 L3 H4 L4
MSN LSN
BPR [m:m-7]
HN LN
BPR [7:0]
20005262 F34.2
Note: MSN = Most Significant Nibble, LSN = Least Significant Nibble
Block-Protection Register (BPR), m = 47 for SST26VF016B, C[1:0]=72H
FIGURE 5-37:
READ BLOCK-PROTECTION REGISTER SEQUENCE (SPI)
CE#
MODE 3
SCK
SIO0
0 1 2 3 4 5 6 7 8
15 16
23 24
32 33
MODE 0
72H
OP Code
SIO
Data Byte 0
Data Byte 1 Data Byte 2
Data Byte N
20005262 F65.1
DS20005262F-page 34
2019 Microchip Technology Inc.
SST26VF016B
5.34
Write Block-Protection Register
(WBPR)
To execute a Write Block-Protection Register operation
the host drives CE# low, sends the Write Block-Protection Register command cycle (42H), sends 18 cycles of
data, and finally drives CE# high. Data input must be
most significant bit(s) first. See Table 5-6 for definitions
of each bit in the Block-Protection register. See Figures
5-38 and 5-39.
The Write Block-Protection Register (WBPR) command changes the Block-Protection register data to
indicate the protection status. Execute WREN before
executing WBPR.
FIGURE 5-38:
WRITE BLOCK-PROTECTION REGISTER SEQUENCE (SQI)
CE#
MODE 3
SCK
0
2
4
6
8
10
12
MODE 0
SIO(3:0)
C1 C0 H0 L0 H1 L1 H2 L2 H3 L3 H4 L4 H5 L5
HN LN
MSN LSN
BPR [m:m-7]
BPR [7:0]
Note: MSN = Most Significant Nibble, LSN = Least Significant Nibble
Block-Protection Register (BPR) m = 47, C[1:0]=42H.
FIGURE 5-39:
WRITE BLOCK-PROTECTION REGISTER SEQUENCE (SPI).
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
MODE 0
OP Code
SI
42H
Data Byte0
Data Byte1 Data Byte2
Data ByteN
SO
20005262 F66.1
Note: C[1:0]=42H
2019 Microchip Technology Inc.
DS20005262F-page 35
SST26VF016B
5.35
Lock-Down Block-Protection
Register (LBPR)
cycling; this allows the Block-Protection register to be
changed. Execute WREN before initiating the LockDown Block-Protection Register instruction.
The Lock-Down Block-Protection Register instruction
prevents changes to the Block-Protection register
during device operation. Lock-Down resets after power
FIGURE 5-40:
To execute a Lock-Down Block-Protection Register, the
host drives CE# low, then sends the Lock-Down BlockProtection Register command cycle (8DH), then drives
CE# high.
LOCK-DOWN BLOCK-PROTECTION REGISTER (SQI)
CE#
MODE 3
SCK
0
1
MODE 0
SIO(3:0)
C1 C0
20005262 F30.1
Note: C[1:0]=8DH
FIGURE 5-41:
LOCK-DOWN BLOCK-PROTECTION REGISTER (SPI)
CE#
MODE 3
SCK
SIO0
0
1
2
3
4
5
6
7
MODE 0
8D
SIO[3:1]
20005262 F67.0
DS20005262F-page 36
2019 Microchip Technology Inc.
SST26VF016B
5.36
Non-Volatile Write-Lock LockDown Register (nVWLDR)
After CE# goes high, the non-volatile bits are programmed and the programming time-out must complete before any additional commands, other than
Read Status Register, can be entered. Poll the BUSY
bit in the Status register, or wait TPP, for the completion
of the internal, self-timed, Write operation. Data inputs
must be most significant bit(s) first.
The Non-Volatile Write-Lock Lock-Down Register
(nVWLDR) instruction controls the ability to change the
Write-Lock bits in the Block-Protection register. Execute WREN before initiating the nVWLDR instruction.
To execute nVWLDR, the host drives CE# low, then
sends the nVWLDR command cycle (E8H), followed by
18 cycles of data, and then drives CE# high.
FIGURE 5-42:
WRITE-LOCK LOCK-DOWN REGISTER SEQUENCE (SQI)
CE#
MODE 3
SCK
0
2
4
6
8
10
12
MODE 0
SIO(3:0)
E
8 H0 L0 H1 L1 H2 L2 H3 L3 H4 L4 H5 L5
HN LN
MSN LSN
nVWLDR[m:m-7]
BPR [7:0]
20005262 F36.0
Note: MSN= Most Significant Nibble; LSN = Least Significant Nibble
Write-Lock Lock-Down Register (nVWLDR) m = 47
FIGURE 5-43:
WRITE-LOCK LOCK-DOWN REGISTER SEQUENCE (SPI)
CE#
MODE 3
SCK
0 1 2 3 4 5 6 7 8
15 16
23 24
31 32
MODE 0
OP Code
SI
E8H
Data Byte0
Data Byte1 Data Byte2
Data ByteN
SO
20005262 F69.1
2019 Microchip Technology Inc.
DS20005262F-page 37
SST26VF016B
5.37
Global Block-Protection Unlock
(ULBPR)
To execute a ULBPR instruction, the host drives CE#
low, then sends the ULBPR command cycle (98H), and
then drives CE# high.
The Global Block-Protection Unlock (ULBPR) instruction clears all write-protection bits in the Block-Protection register, except for those bits that have been
locked down with the nVWLDR command. Execute
WREN before initiating the ULBPR instruction.
FIGURE 5-44:
GLOBAL BLOCK-PROTECTION UNLOCK (SQI)
CE#
MODE 3
SCK
0
1
MODE 0
SIO(3:0)
C1 C0
20005262 F20.1
Note: C[1:0]=98H
FIGURE 5-45:
GLOBAL BLOCK-PROTECTION UNLOCK (SPI)
CE#
MODE 3
SCK
SIO0
0
1
2
3
4
5
6
7
MODE 0
98
SIO[3:1]
20005262 F68.0
DS20005262F-page 38
2019 Microchip Technology Inc.
SST26VF016B
BLOCK-PROTECTION REGISTER FOR SST26VF016B 1
TABLE 5-6:
BPR Bits
Read Lock
Write Lock/nVWLDR2
Address Range
Protected Block
Size
47
46
1FE000H - 1FFFFFH
8 KByte
45
44
1FC000H - 1FDFFFH
8 KByte
43
42
1FA000H - 1FBFFFH
8 KByte
41
40
1F8000H - 1F9FFFH
8 KByte
39
38
006000H - 007FFFH
8 KByte
37
36
004000H - 005FFFH
8 KByte
35
34
002000H - 003FFFH
8 KByte
33
32
000000H - 001FFFH
8 KByte
31
1F0000H - 1F7FFFH
32 KByte
30
008000H - 00FFFFH
32 KByte
29
1E0000H - 1EFFFFH
64 KByte
28
1D0000H -1DFFFFH
64 KByte
27
1C0000H -1CFFFFH
64 KByte
26
1B0000H - 1BFFFFH
64 KByte
25
1A0000H - 1AFFFFH
64 KByte
24
190000H - 19FFFFH
64 KByte
23
180000H - 18FFFFH
64 KByte
22
170000H - 17FFFFH
64 KByte
21
160000H - 16FFFFH
64 KByte
20
150000H - 15FFFFH
64 KByte
19
140000H - 14FFFFH
64 KByte
18
130000H - 13FFFFH
64 KByte
17
120000H - 12FFFFH
64 KByte
16
110000H - 11FFFFH
64 KByte
15
100000H - 10FFFFH
64 KByte
14
0F0000H - 0FFFFFH
64 KByte
13
0E0000H - 0EFFFFH
64 KByte
12
0D0000H - 0DFFFFH
64 KByte
11
0C0000H - 0CFFFFH
64 KByte
10
0B0000H - 0BFFFFH
64 KByte
9
0A0000H - 0AFFFFH
64 KByte
8
090000H - 09FFFFH
64 KByte
7
080000H - 08FFFFH
64 KByte
6
070000H - 07FFFFH
64 KByte
5
060000H - 06FFFFH
64 KByte
4
050000H - 05FFFFH
64 KByte
3
040000H - 04FFFFH
64 KByte
2
030000H - 03FFFFH
64 KByte
1
020000H - 02FFFFH
64 KByte
0
010000H - 01FFFFH
64 KByte
1. The default state after a Power-on Reset is write-protected BPR[47:0] = 5555 FFFF FFFF
2. nVWLDR bits are one-time-programmable. Once a WLLDR bit is set, the protection state of that particular block is permanently write-locked.
2019 Microchip Technology Inc.
DS20005262F-page 39
SST26VF016B
5.38
Deep Power-Down
Enter Deep Power-down mode by initiating the Deep
Power-down (DPD) instruction (B9H) while driving CE#
low. CE# must be driven high before executing the
DPD instruction. After CE# is driven high, it requires a
delay of TDPD before the standby current ISB is reduced
to deep power-down current IDPD. See Table 5-7 for
Deep Power-down timing. If the device is busy performing an internal erase or program operation, initiating a
Deep Power-down instruction will not placed the device
in Deep Power-down mode. See Figures 5-46 and 5-47
for the DPD instruction sequence.
The Deep Power-down (DPD) instruction puts the
device in the lowest power consumption mode–the
Deep Power-down mode. The Deep Power-down
instruction is ignored during an internal write operation.
While the device is in Deep Power-down mode, all
instructions will be ignored except for the Release
Deep Power-down instruction.
TABLE 5-7:
Symbol
TDPD
TSBR
DEEP POWER-DOWN
Parameter
CE# High to Deep Power-down
CE# High to Standby Mode
Min
CE#
Units
µs
µs
TDPD
MODE 3
SCK
Max
3
10
1
0
MODE 0
B
9
MSN
LSN
SIO(3:0)
Standby Mode Deep Power-Down Mode
20005262 F100.0
Note: MSN= Most Significant Nibble; LSN = Least Significant Nibble
FIGURE 5-46:
DEEP POWER-DOWN (DPD) SEQUENCE–SQI MODE
CE#
TDPD
MODE 3
SCK
0 1 2 3 4 5 6 7
MODE 0
B9
SI
MSB
SO
HIGH IMPEDANCE
Standby Mode Deep Power-Down Mode
20005262 F101.0
FIGURE 5-47:
DS20005262F-page 40
DEEP POWER-DOWN (DPD)–SPI MODE
2019 Microchip Technology Inc.
SST26VF016B
5.39
Release from Deep Power-Down
and Read ID
To execute RDPD and read the Device ID, the host
drives CE# low then sends the Deep Power-Down
command cycle (ABH), three dummy clock cycles, and
then drives CE# high. The device outputs the Device ID
on the falling edge of the SCK signal following the
dummy cycles. The data output stream is continuous
until terminated by a low-to-high transition on CE, and
will return to Standby mode and be ready for the next
instruction after TSBR. See Figures 5-48 and 5-49 for
the command sequence.
Release from Deep Power-Down (RDPD) and Read ID
instruction exits Deep Power-down mode. To exit Deep
Power down mode, execute the RDPD. During this
command, the host drives CE# low, then sends the
Deep Power-Down command cycle (ABH), and then
drives CE# high. The device will return to Standby
mode and be ready for the next instruction after TSBR.
TSBR
CE#
MODE 3
0
1
SCK MODE 0
Op Code
SIO[3:0]
C1
C0
MSN
LSN
X
X
X
X
X
X
D1 D0
Device ID
Deep Power-Down Mode Standby Mode
20005262 F102.0
Note: C[1:0]=ABH
FIGURE 5-48:
RELEASE FROM DEEP POWER-DOWN (RDPD) AND READ ID SEQUENCE–SQI MODE
TSBR
CE#
MODE 3
0
1
2
3
4
5
6
7
8
15 16
23 24
32 33
40
SCK MODE 0
Op Code
SIO[3:0]
AB
XX
XX
XX
Device ID
Deep Power-Down Mode Standby Mode
20005262 F103.0
FIGURE 5-49:
RELEASE FROM DEEP POWER-DOWN (RDPD) AND READ ID SEQUENCE–SPI MODE
2019 Microchip Technology Inc.
DS20005262F-page 41
SST26VF016B
6.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational
sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may
affect device reliability.)
Temperature Under Bias. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (