SST39VF3202B-70-4C-B3KE

32 Mbit (x16) Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet The SST39VF320xB devices are 2M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST’s proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF320xB write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC standard pin assignments for x16 memories. Features • Organized as 2M x16 • Security-ID Feature – SST: 128 bits; User: 128 words • Single Voltage Read and Write Operations • Fast Read Access Time: – 2.7-3.6V – 70 ns • Superior Reliability • Latched Address and Data – Endurance: 100,000 Cycles (Typical) – Greater than 100 years Data Retention • Low Power Consumption (typical values at 5 MHz) – Active Current: 6 mA (typical) – Standby Current: 4 µA (typical) – Auto Low Power Mode: 4 µA (typical) • Hardware Block-Protection/WP# Input Pin – Top Block-Protection (top 32 KWord) for SST39VF3202B – Bottom Block-Protection (bottom 32 KWord) for SST39VF3201B • Sector-Erase Capability – Uniform 2 KWord sectors • Block-Erase Capability – Uniform 32 KWord blocks • Chip-Erase Capability • Erase-Suspend/Erase-Resume Capabilities • Hardware Reset Pin (RST#) ©2011 Silicon Storage Technology, Inc. • Fast Erase and Word-Program: – Sector-Erase Time: 18 ms (typical) – Block-Erase Time: 18 ms (typical) – Chip-Erase Time: 35 ms (typical) – Word-Program Time: 7 µs (typical) • Automatic Write Timing – Internal VPP Generation • End-of-Write Detection – Toggle Bits – Data# Polling • CMOS I/O Compatibility • JEDEC Standard – Flash EEPROM Pin Assignments • Packages Available – 48-lead TSOP (12mm x 20mm) – 48-ball TFBGA (6mm x 8mm) • All non-Pb (lead-free) devices are RoHS compliant www.microchip.com DS25111A 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Product Description The SST39VF320xB devices are 2M x16 CMOS Multi-Purpose Flash Plus (MPF+) manufactured with SST’s proprietary, high-performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39VF320xB write (Program or Erase) with a 2.7-3.6V power supply. These devices conform to JEDEC standard pin assignments for x16 memories. Featuring high performance Word-Program, the SST39VF320xB devices provide a typical WordProgram time of 7 µsec. These devices use Toggle Bit or Data# Polling to indicate the completion of Program operation. To protect against inadvertent write, they have on-chip hardware and Software Data Protection schemes. Designed, manufactured, and tested for a wide spectrum of applications, these devices are offered with a guaranteed typical endurance of 100,000 cycles. Data retention is rated at greater than 100 years. The SST39VF320xB devices are suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption. They inherently use less energy during Erase and Program than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. These devices also improve flexibility while lowering the cost for program, data, and configuration storage applications. The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles. To meet high-density, surface mount requirements, the SST39VF320xB devices are offered in 48-lead TSOP and 48-ball TFBGA packages. See Figure 2 and Figure 3 for pin assignments. ©2011 Silicon Storage Technology, Inc. DS25111A 2 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Block Diagram SuperFlash Memory X-Decoder Memory Address Address Buffer Latches Y-Decoder CE# OE# WE# WP# RESET# Control Logic I/O Buffers and Data Latches DQ15 - DQ0 1384 B1.0 Figure 1: Functional Block Diagram A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RST# NC WP# NC A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Standard Pinout Top View Die Up 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 NC VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VDD DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 1384 48-tsop EK P1.0 Figure 2: Pin Assignments for 48-lead TSOP ©2011 Silicon Storage Technology, Inc. DS25111A 3 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet TOP VIEW (balls facing down) 6 5 A13 A12 A14 A15 A16 NC DQ15 VSS A8 A10 A11 DQ7 DQ14 DQ13 DQ6 WE# RST# NC A19 DQ5 DQ12 VDD DQ4 NC WP# A18 A20 DQ2 DQ10 DQ11 DQ3 A9 4 3 2 1 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 A3 A4 A2 A1 A0 CE# OE# VSS A B C D E F G H 1384 4-tfbga B1K P2.0 Figure 3: pin assignments for 48-ball TFBGA Table 1: Pin Description Symbol Pin Name Functions AMS1-A0 Address Inputs To provide memory addresses. During Sector-Erase AMS-A11 address lines will select the sector. During Block-Erase AMS-A15 address lines will select the block. DQ15-DQ0 Data Input/output To output data during Read cycles and receive input data during Write cycles. Data is internally latched during a Write cycle. The outputs are in tri-state when OE# or CE# is high. WP# Write Protect To protect the top/bottom boot block from Erase/Program operation when grounded. RST# Reset To reset and return the device to Read mode. CE# Chip Enable To activate the device when CE# is low. OE# Output Enable To gate the data output buffers. WE# Write Enable To control the Write operations. VDD Power Supply To provide power supply voltage: 2.7-3.6V VSS Ground NC No Connection Unconnected pins. T1.0 25111 1. AMS = Most significant address AMS = A20 for SST39VF320xB ©2011 Silicon Storage Technology, Inc. DS25111A 4 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Device Operation Commands are used to initiate the memory operation functions of the device. Commands are written to the device using standard microprocessor write sequences. A command is written by asserting WE# low while keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever occurs last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first. The SST39VF320xB also have the Auto Low Power mode which puts the device in a near standby mode after data has been accessed with a valid Read operation. This reduces the IDD active read current from typically 9 mA to typically 4 µA. The Auto Low Power mode reduces the typical IDD active read current to the range of 2 mA/MHz of Read cycle time. The device exits the Auto Low Power mode with any address transition or control signal transition used to initiate another Read cycle, with no access time penalty. Note that the device does not enter Auto-Low Power mode after power-up with CE# held steadily low, until the first address transition or CE# is driven high. Read The Read operation of the SST39VF320xB is controlled by CE# and OE#, both have to be low for the system to obtain data from the outputs. CE# is used for device selection. When CE# is high, the chip is deselected and only standby power is consumed. OE# is the output control and is used to gate data from the output pins. The data bus is in high impedance state when either CE# or OE# is high. Refer to the Read cycle timing diagram for further details (Figure 5). Word-Program Operation The SST39VF320xB are programmed on a word-by-word basis. Before programming, the sector where the word exists must be fully erased. The Program operation is accomplished in three steps. The first step is the three-byte load sequence for Software Data Protection. The second step is to load word address and word data. During the Word-Program operation, the addresses are latched on the falling edge of either CE# or WE#, whichever occurs last. The data is latched on the rising edge of either CE# or WE#, whichever occurs first. The third step is the internal Program operation which is initiated after the rising edge of the fourth WE# or CE#, whichever occurs first. The Program operation, once initiated, will be completed within 10 µs. See Figure 6 and Figure 7 for WE# and CE# controlled Program operation timing diagrams and Figure 21 for flowcharts. During the Program operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. Any commands issued during the internal Program operation are ignored. During the command sequence, WP# should be statically held high or low. Sector/Block-Erase Operation The Sector- (or Block-) Erase operation allows the system to erase the device on a sector-by-sector (or block-by-block) basis. The SST39VF320xB offer both Sector-Erase and Block-Erase mode. The sector architecture is based on uniform sector size of 2 KWord. The Block-Erase mode is based on uniform block size of 32 KWord. The Sector-Erase operation is initiated by executing a six-byte command sequence with Sector-Erase command (50H) and sector address (SA) in the last bus cycle. The BlockErase operation is initiated by executing a six-byte command sequence with Block-Erase command (30H) and block address (BA) in the last bus cycle. The sector or block address is latched on the falling edge of the sixth WE# pulse, while the command (50H or 30H) is latched on the rising edge of the sixth WE# pulse. The internal Erase operation begins after the sixth WE# pulse. The End-of-Erase operation can be determined using either Data# Polling or Toggle Bit methods. See Figure 11 and Figure 12 ©2011 Silicon Storage Technology, Inc. DS25111A 5 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet for timing waveforms and Figure 25 for the flowchart. Any commands issued during the Sector- or Block-Erase operation are ignored. When WP# is low, any attempt to Sector- (Block-) Erase the protected block will be ignored. During the command sequence, WP# should be statically held high or low. Erase-Suspend/Erase-Resume Commands The Erase-Suspend operation temporarily suspends a Sector- or Block-Erase operation thus allowing data to be read from any memory location, or program data into any sector/block that is not suspended for an Erase operation. The operation is executed by issuing one byte command sequence with EraseSuspend command (B0H). The device automatically enters read mode typically within 10 µs after the Erase-Suspend command had been issued. Valid data can be read from any sector or block that is not suspended from an Erase operation. Reading at address location within erase-suspended sectors/ blocks will output DQ2 toggling and DQ6 at ‘1’. While in Erase-Suspend mode, a Word-Program operation is allowed except for the sector or block selected for Erase-Suspend. To resume Sector-Erase or Block-Erase operation which has been suspended the system must issue Erase Resume command. The operation is executed by issuing one byte command sequence with Erase Resume command (30H) at any address in the last Byte sequence. Chip-Erase Operation The SST39VF320xB provide a Chip-Erase operation, which allows the user to erase the entire memory array to the “1” state. This is useful when the entire device must be quickly erased. The Chip-Erase operation is initiated by executing a six-byte command sequence with Chip-Erase command (10H) at address 555H in the last byte sequence. The Erase operation begins with the rising edge of the sixth WE# or CE#, whichever occurs first. During the Erase operation, the only valid read is Toggle Bit or Data# Polling. See Table 6 for the command sequence, Figure 10 for timing diagram, and Figure 25 for the flowchart. Any commands issued during the Chip-Erase operation are ignored. When WP# is low, any attempt to Chip-Erase will be ignored. During the command sequence, WP# should be statically held high or low. Write Operation Status Detection The SST39VF320xB provide two software means to detect the completion of a Write (Program or Erase) cycle, in order to optimize the system write cycle time. The software detection includes two status bits: Data# Polling (DQ7) and Toggle Bit (DQ6). The End-of-Write detection mode is enabled after the rising edge of WE#, which initiates the internal Program or Erase operation. The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or Toggle Bit read may be simultaneous with the completion of the write cycle. If this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either DQ7 or DQ6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two (2) times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. ©2011 Silicon Storage Technology, Inc. DS25111A 6 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Data# Polling (DQ7) When the SST39VF320xB are in the internal Program operation, any attempt to read DQ7 will produce the complement of the true data. Once the Program operation is completed, DQ7 will produce true data. Note that even though DQ7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 µs. During internal Erase operation, any attempt to read DQ7 will produce a ‘0’. Once the internal Erase operation is completed, DQ7 will produce a ‘1’. The Data# Polling is valid after the rising edge of fourth WE# (or CE#) pulse for Program operation. For Sector-, Block- or Chip-Erase, the Data# Polling is valid after the rising edge of sixth WE# (or CE#) pulse. See Figure 8 for Data# Polling timing diagram and Figure 22 for a flowchart. Toggle Bits (DQ6 and DQ2) During the internal Program or Erase operation, any consecutive attempts to read DQ6 will produce alternating “1”s and “0”s, i.e., toggling between 1 and 0. When the internal Program or Erase operation is completed, the DQ6 bit will stop toggling. The device is then ready for the next operation. For Sector, Block-, or Chip-Erase, the toggle bit (DQ6) is valid after the rising edge of sixth WE# (or CE#) pulse. DQ6 will be set to ‘1’ if a Read operation is attempted on an Erase-Suspended Sector/Block. If Program operation is initiated in a sector/block not selected in Erase-Suspend mode, DQ6 will toggle. An additional Toggle Bit is available on DQ2, which can be used in conjunction with DQ6 to check whether a particular sector is being actively erased or erase-suspended. Table 2 shows detailed status bits information. The Toggle Bit (DQ2) is valid after the rising edge of the last WE# (or CE#) pulse of Write operation. See Figure 9 for Toggle Bit timing diagram and Figure 22 for a flowchart. Table 2: Write Operation Status Status DQ7 DQ6 DQ2 DQ7# Toggle No Toggle Standard Erase 0 Toggle Toggle Read from Erase-Suspended Sector/Block 1 1 Toggle Read from Non- Erase-Suspended Sector/ Block Data Data Data Program DQ7# Toggle N/A Normal Operation Standard Program Erase-Suspend Mode T2.0 25111 Note: DQ7, DQ6 and DQ2 require a valid address when reading status information. ©2011 Silicon Storage Technology, Inc. DS25111A 7 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Data Protection The SST39VF320xB provide both hardware and software features to protect nonvolatile data from inadvertent writes. Hardware Data Protection Noise/Glitch Protection: A WE# or CE# pulse of less than 5 ns will not initiate a write cycle. VDD Power Up/Down Detection: The Write operation is inhibited when VDD is less than 1.5V. Write Inhibit Mode: Forcing OE# low, CE# high, or WE# high will inhibit the Write operation. This prevents inadvertent writes during power-up or power-down. Hardware Block Protection The SST39VF3202B support top hardware block protection, which protects the top 32 KWord block of the device. The SST39VF3201B support bottom hardware block protection, which protects the bottom 32 KWord block of the device. The Boot Block address ranges are described in Table 3. Program and Erase operations are prevented on the 32 KWord when WP# is low. If WP# is left floating, it is internally held high via a pull-up resistor, and the Boot Block is unprotected, enabling Program and Erase operations on that block. Table 3: Boot Block Address Ranges Product Address Range Bottom Boot Block SST39VF3201B 000000H-007FFFH Top Boot Block SST39VF3202B 1F8000H-1FFFFFH T3.0 25111 ©2011 Silicon Storage Technology, Inc. DS25111A 8 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Hardware Reset (RST#) The RST# pin provides a hardware method of resetting the device to read array data. When the RST# pin is held low for at least TRP, any in-progress operation will terminate and return to Read mode. When no internal Program/Erase operation is in progress, a minimum period of TRHR is required after RST# is driven high before a valid Read can take place. See Figure 17. The Erase or Program operation that has been interrupted needs to be re-initiated after the device resumes normal operation mode to ensure data integrity. Software Data Protection (SDP) The SST39VF320xB provide the JEDEC approved Software Data Protection scheme for all data alteration operations, i.e., Program and Erase. Any Program operation requires the inclusion of the threebyte sequence. The three-byte load sequence is used to initiate the Program operation, providing optimal protection from inadvertent Write operations, e.g., during the system power-up or power-down. Any Erase operation requires the inclusion of six-byte sequence. These devices are shipped with the Software Data Protection permanently enabled. See Table 6 for the specific software command codes. During SDP command sequence, invalid commands will abort the device to read mode within TRC. The contents of DQ15-DQ8 can be VIL or VIH, but no other value, during any SDP command sequence. Common Flash Memory Interface (CFI) The SST39VF320xB also contain the CFI information to describe the characteristics of the device. In order to enter the CFI Query mode, the system must write the three-byte sequence, same as product ID entry command with 98H (CFI Query command) to address 555H in the last byte sequence. The system can also enter the CFI Query mode, by using the one-byte sequence with 55H on Address and 98H on Data Bus. Once the device enters the CFI Query mode, the system can read CFI data at the addresses given in Tables 7 through 9. The system must write the CFI Exit command to return to Read mode from the CFI Query mode. Product Identification The Product Identification mode identifies the devices as the SST39VF3201B and SST39VF3202B, and the manufacturer as SST. This mode may be accessed through software operations. Users may use the Software Product Identification operation to identify the part (i.e., using the device ID) when using multiple manufacturers in the same socket. For details, see Table 6 for software operation, Figure 13 for the Software ID Entry and Read timing diagram and Figure 23 for the Software ID Entry command sequence flowchart. Table 4: Product Identification Address Data 0000H BFH SST39VF3201B 0001H 235DH SST39VF3202B 0001H 235CH Manufacturer’s ID Device ID T4.0 25111 ©2011 Silicon Storage Technology, Inc. DS25111A 9 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Product Identification Mode Exit/CFI Mode Exit In order to return to the standard Read mode, the Software Product Identification mode must be exited. Exit is accomplished by issuing the Software ID Exit command sequence, which returns the device to the Read mode. This command may also be used to reset the device to the Read mode after any inadvertent transient condition that apparently causes the device to behave abnormally, e.g., not read correctly. Please note that the Software ID Exit/CFI Exit command is ignored during an internal Program or Erase operation. See Table 6 for software command codes, Figure 15 for timing waveform, and Figure 23 and Figure 24 for flowcharts. Security ID The SST39VF320xB devices offer a 136 word Security ID space. The Secure ID space is divided into two segments - one factory programmed segment and one user programmed segment. The first segment is programmed and locked at SST with a random 128-bit number. The 128-word user segment is left un-programmed for the customer to program as desired. To program the user segment of the Security ID, the user must use the Security ID Word-Program command. To detect end-of-write for the SEC ID, read the toggle bits. Do not use Data# Polling. Once this is complete, the Sec ID should be locked using the User Sec ID Program Lock-Out. This disables any future corruption of this space. Note that regardless of whether or not the Sec ID is locked, neither Sec ID segment can be erased. The Secure ID space can be queried by executing a three-byte command sequence with Enter Sec ID command (88H) at address 555H in the last byte sequence. To exit this mode, the Exit Sec ID command should be executed. Refer to Table 6 for more details. ©2011 Silicon Storage Technology, Inc. DS25111A 10 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Operations Table 5: Operation Modes Selection Mode CE# OE# WE# DQ Address Read VIL VIL VIH DOUT AIN Program VIL VIH VIL DIN AIN VIL X1 Sector or block address, XXH for Chip-Erase Erase VIL Standby VIH X X High Z X X VIL X High Z/ DOUT X X X VIH High Z/ DOUT X VIL VIL VIH Write Inhibit VIH Product Identification Software Mode See Table 6 T5.0 25111 1. X can be VIL or VIH, but no other value. Table 6: Software Command Sequence Command Sequence 1st Bus Write Cycle 2nd Bus Write Cycle Addr1 Addr1 Data2 Addr1 Data2 Addr1 Data2 Data AAH Data2 3rd Bus Write Cycle 4th Bus Write Cycle Word-Program 555H AAH 2AAH 55H 555H A0H WA3 Sector-Erase 555H AAH 2AAH 55H 555H 80H 555H 5th Bus Write Cycle 6th Bus Write Cycle Addr1 Data2 Addr1 Data2 2AAH 55H SAX4 4 50H Block-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H BAX 30H Chip-Erase 555H AAH 2AAH 55H 555H 80H 555H AAH 2AAH 55H 555H 10H Erase-Suspend XXXXH B0H Erase-Resume XXXXH 30H ID5 555H AAH 2AAH 55H 555H 88H User Security ID Word-Program 555H AAH 2AAH 55H 555H A5H WA6 Data User Security ID Program Lock-Out 555H AAH 2AAH 55H 555H 85H XXH6 0000H Software ID Entry7,8 555H AAH 2AAH 55H 555H 90H CFI Query Entry 555H AAH 2AAH 55H 555H 98H CFI Query Entry 55H 98H Software ID Exit9,10 /CFI Exit/Sec ID Exit 555H AAH 2AAH 55H 555H F0H Software ID Exit9,10 /CFI Exit/Sec ID Exit XXH F0H Query Sec T6.0 25111 1. Address format A10-A0 (Hex). Addresses A11- A20 can be VIL or VIH, but no other value, for Command sequence for SST39VF320xB. 2. DQ15-DQ8 can be VIL or VIH, but no other value, for Command sequence 3. WA = Program Word address 4. SAX for Sector-Erase; uses AMS-A11 address lines BAX, for Block-Erase; uses AMS-A15 address lines AMS = Most significant address AMS = A20 for SST39VF320xB ©2011 Silicon Storage Technology, Inc. DS25111A 11 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet 5. With AMS-A4 = 0; Sec ID is read with A3-A0, SST ID is read with A3 = 0 (Address range = 000000H to 000007H), User ID is read with A3 = 1 (Address range = 000008H to 000087H). Lock Status is read with A7-A0 = 0000FFH. Unlocked: DQ3 = 1 / Locked: DQ3 = 0. 6. Valid Word-Addresses for Sec ID are from 000000H-000007H and 000008H to 000087H. 7. The device does not remain in Software Product ID Mode if powered down. 8. With AMS-A1 =0; SST Manufacturer ID = 00BFH, is read with A0 = 0, SST39VF3201B Device ID = 235DH, is read with A0 = 1, SST39VF3202B Device ID = 235CH, is read with A0 = 1. AMS = Most significant address AMS = A20 for SST39VF320xB 9. Both Software ID Exit operations are equivalent 10. If users never lock after programming, Sec ID can be programmed over the previously unprogrammed bits (data=1) using the Sec ID mode again (the programmed “0” bits cannot be reversed to “1”). Valid Word-Addresses for Sec ID are from 000000H-000007H and 000008H to 000087H. Table 7: CFI Query Identification String1 for SST39VF320xB Address Data 10H 0051H 11H 0052H 12H 0059H 13H 0002H 14H 0000H 15H 0000H 16H 0000H 17H 0000H 18H 0000H 19H 0000H 1AH 0000H Data Query Unique ASCII string “QRY” Primary OEM command set Address for Primary Extended Table Alternate OEM command set (00H = none exists) Address for Alternate OEM extended Table (00H = none exits) T7.0 25111 1. Refer to CFI publication 100 for more details. Table 8: System Interface Information for SST39VF320xB Address Data 1BH 0027H Data VDD Min (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1CH 0036H VDD Max (Program/Erase) DQ7-DQ4: Volts, DQ3-DQ0: 100 millivolts 1DH 0000H VPP min. (00H = no VPP pin) 1EH 0000H VPP max. (00H = no VPP pin) 1FH 0003H Typical time out for Word-Program 2N µs (23 = 8 µs) 20H 0000H Typical time out for min. size buffer program 2N µs (00H = not supported) 21H 0004H Typical time out for individual Sector/Block-Erase 2N ms (24 = 16 ms) 22H 0005H Typical time out for Chip-Erase 2N ms (25 = 32 ms) 23H 0001H Maximum time out for Word-Program 2N times typical (21 x 23 = 16 µs) 24H 0000H Maximum time out for buffer program 2N times typical 25H 0001H Maximum time out for individual Sector/Block-Erase 2N times typical (21 x 24 = 32 ms) 26H 0001H Maximum time out for Chip-Erase 2N times typical (21 x 25 = 64 ms) T8.0 25111 ©2011 Silicon Storage Technology, Inc. DS25111A 12 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Table 9: Device Geometry Information for SST39VF320xB Address Data 27H 0016H Device size = 2N Bytes (16H = 22; 222 = 4MByte) Data 28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface 29H 0000H 2AH 0000H 2BH 0000H Maximum number of bytes in multi-byte write = 2N (00H = not supported) 2CH 0002H Number of Erase Sector/Block sizes supported by device 2DH 00FFH Sector Information (y + 1 = Number of sectors; z x 256B = sector size) 2EH 0003H y = 1023 + 1 = 1024 sectors (03FFH = 1023) 2FH 0010H 30H 0000H z = 16 x 256 Bytes = 4 KBytes/sector (0010H = 16) 31H 003FH Block Information (y + 1 = Number of blocks; z x 256B = block size) 32H 0000H y = 63 + 1 = 64 blocks (003FH = 63) 33H 0000H 34H 0001H z = 256 x 256 Bytes = 64 KBytes/block (0100H = 256) T9.0 25111 ©2011 Silicon Storage Technology, Inc. DS25111A 13 12/11 32 Mbit Multi-Purpose Flash Plus SST39VF3201B / SST39VF3202B A Microchip Technology Company Data Sheet Electrical Specifications Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V Transient Voltage (