SY100EL33ZG

SY100EL33L 3.3V ECL ÷ 4 Divider Features General Description • • • • • • The SY100EL33L is an integrated ÷4 divider. The differential clock inputs and the VBB allow a differential, single-ended or AC-coupled interface to the device. If used, the VBB output should be bypassed to ground with a 0.01µF capacitor. Also note that the VBB is designed to be used as an input bias on the EL33L only; the VBB output has limited current sink and source capability. The Reset pin is asynchronous and is asserted on the rising edge. Upon power-up, the internal flip-flops will attain a random state; the Reset input allows for the synchronization of multiple EL33Ls in a system. 3.3V Power Supply 640ps Propagation Delay (typical) 4.2 GHz Toggle Frequency (typical) High Bandwidth Output Transitions Internal 75 kΩ Input Pull-Down Resistors Available in 8-Pin SOIC Package Package Type SY100EL33L 8-Pin SOIC (Z8-1)  2018 Microchip Technology Inc. DS20006076A-page 1 SY100EL33L 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † PECL Power Supply Voltage (VCC) (Note 1)…………………………………………………………………+8V NECL Power Supply Voltage (VEE) (Note 2)…………………………………………………………………-8V PECL Mode Input Voltage (VIN) (Note 3)………………………………………………………………… +6V NECL Mode Input Voltage (VIN) (Note 4)………………………………………………………………… -6V Continuous Output Currrent (IOUT)…………………………………………………………………………50mA Surge Output Currrent (IOUT)………………………………………………………….......………………100mA † Notice: Stresses above those listed under “Absolute Maximum ratings” may cause permanent damage to the device. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: VEE = 0V 2: VCC = 0V 3: VEE = 0V, VIN ≤ VCC 4: VCC = 0V, VIN ≥ VEE TABLE 1-1: DC ELECTRICAL CHARACTERISTICS Electrical Characteristics PECL: VCC = 3.0V to 3.8V; VEE = 0V; TA = -40°C to 85°C, unless otherwise stated (Note 1) Parameter Symbol Min. Typ. Max. Units Power Supply Voltage VCC 3.0 3.3 3.8 V Power Supply Current IEE — 27 33 — 31 37 Output High Voltage (Note 2) VOH Output Low Voltage (Note 2) VOL Input High Voltage (Single Ended) VCC – 1.085 VCC – 1.005 VCC – 0.88 VCC – 1.025 VCC – 0.955 VCC – 0.88 mA V VCC – 1.830 VCC – 1.695 VCC – 1.555 VCC – 1.810 VCC – 1.705 VCC – 1.620 VIH VCC – 1.165 — VCC – 0.880 V Input Low Voltage (Single Ended) VIL VCC – 1.810 — VCC – 1.475 V Output Reference Voltage V VBB VCC – 1.38 — VCC – 1.26 V Input High Current IIH — — 150 µA Input Low Current IIL 0.5 — — µA Note 1: 2: Test Condition TA = -40°C to +25°C TA = +85°C TA = -40°C TA = 0°C to 85°C TA = -40°C TA = 0°C to 85°C VIN = VIL (Min) Devices are designed to meet the DC specifications shown in the above table after thermal equilibration has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. Outputs are terminated through a 50 Ω resistor to VCC – 2.0V.  2018 Microchip Technology Inc. DS20006076A-page 2 SY100EL33L TABLE 1-2: DC ELECTRICAL CHARACTERISTICS Electrical Characteristics NECL: VEE = -3.8V to -3.0V; VCC = 0V; TA = -40°C to 85°C, unless otherwise stated (Note 1) Parameter Symbol Min. Typ. Max. Units Power Supply Voltage VEE -3.8 -3.3 -3 V Power Supply Current IEE — 27 33 — 31 37 Output High Voltage (Note 2) VOH -1.085 -1.005 -0.88 -1.025 -0.955 -0.88 Output Low Voltage (Note 2) VOL -1.830 -1.695 -1.555 -1.810 -1.705 -1.620 Input High Voltage (Single Ended) VIH -1.165 — -0.880 V Input Low Voltage (Single Ended) VIL -1.810 — -1.475 V Output Reference Voltage mA TA = 0°C to 85°C TA = -40°C V TA = 0°C to 85°C VBB -1.380 — -1.260 V IIH — — 150 µA Input Low Current IIL 0.5 — — µA 2: TA = -40°C to +25°C TA = +85°C TA = -40°C V Input High Current Note 1: Test Condition VIN = VIL (Min) Devices are designed to meet the DC specifications shown in the above table after thermal equilibration has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained. Outputs are terminated through a 50 Ω resistor to VCC – 2.0V. TABLE 1-3: AC ELECTRICAL CHARACTERISTICS(1) Electrical Characteristics: VCC = 3.0V to 3.8V; VEE = 0V or VEE = -3.8V to -3.0V; VCC = 0V; TA = -40°C to 85°C, unless otherwise stated Parameter Symbol Maximum Toggle Frequency Prop. Delay CLK to Q Min. fMAX tPD Typ. Max. Units GHz 3.8 4.2 — 490 630 770 ps TA = -40°C 540 630 720 ps TA = 0°C 550 640 730 ps TA = +25°C 590 670 760 ps TA = +85°C 310 460 610 ps TA = -40°C 360 460 560 ps TA = 0°C to +25°C TA = +85°C Propagation Delay RESET to Q tPD 380 480 580 ps Input Swing (Note 1) VPP 100 — 1000 mV Output Rise/Fall Time Q (20% to 80%) tr/tf 100 225 350 ps Note 1: Test Condition Input swing for which AC parameters are ensured. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Operating Temperature Range TA –40 — +85 °C — Storage Temperature TS –65 — +150 °C — TLEAD — — +260 °C Soldering, 20 sec. Temperature Ranges Lead Temperature  2018 Microchip Technology Inc. DS20006076A-page 3 SY100EL33L 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin Number 1 2, 3 PIN FUNCTION TABLE Pin Name Reset Description Asynchronous Reset CLK, /CLK Clock Inputs 4 VBB 5 VEE 6, 7 Q, /Q Data Outputs 8 VCC Positive Power Supply  2018 Microchip Technology Inc. Reference Voltage Output Negative Power Supply DS20006076A-page 4 SY100EL33L 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 8-Lead SOIC* XXXXX WNNN Legend: XX...X Y YY WW NNN e3 * Example 33L XEL52 2138 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (⎯) symbol may not be to scale.  2018 Microchip Technology Inc. DS20006076A-page 5 SY100EL33L 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2018 Microchip Technology Inc. DS20006076A-page 6 SY100EL33L PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device X X -XX Examples: a) SY100EL33LZG(3) b) SY100EL33LZG-TR(2,3) Package Temperature Special Processing Range 3.3V ÷ 4 Divider Device: SY100EL33L Package Z = 8-Lead SOIC Temperature Range: G = –40°C to +85°C (Pb-Free NiPdAu) Special Processing: = TR = 95/Tube 1,000/Reel Note: Note 1: 2: 3: 8-Lead SOIC (Z8-1) package, –40°C to +85°C Industrial Temp. (Pb-Free NiPdAu), 95/Tube 8-Lead SOIC (Z8-1) package, –40°C to +85°C Industrial Temp. (Pb-Free NiPdAu), 1,000/Reel Contact factory for die availability. Dice are ensured at TA = 25°C, DC Electricals only. Tape and Reel. Pb-Free package is recommended for new designs.  2018 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006076A-page 7 SY100EL33L APPENDIX A: REVISION HISTORY Revision A (September 2018) • Converted Micrel document SY100EL33L to Microchip data sheet DS20006076A. • Minor text changes throughout. • Removed all reference to the EOL SY10EL33 and SY100EL33 versions.  2018 Microchip Technology Inc. DS20006076A-page 8 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-3548-8 == ISO/TS 16949 ==  2018 Microchip Technology Inc. DS20006076A-page 9 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra’anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078  2018 Microchip Technology Inc. China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 DS20006076A-page 10 08/15/18