TC1300
300 mA CMOS LDO with Shutdown, Bypass and
Independent Delayed Reset Function
Features
General Description
• LDO with Integrated Microcontroller Reset
Monitor Functionality
• Low Input Supply Current (80 µA, typical)
• Very Low Dropout Voltage
• 10 µsec (typ.) Wake-Up Time from SHDN
• 300 mA Output Current
• Standard or Custom Output and Detected
Voltages
• Power-Saving Shutdown Mode
• Bypass Input for Quiet Operation
• Separate Input for Detected Voltage
• 140 msec Minimum RESET Output Duration
• Space-Saving MSOP Package
• Specified Junction Temperature Range:
-40°C to +125°C
The TC1300 combines a low dropout regulator and a
microcontroller reset monitor in an 8-Pin MSOP package. Total supply current is 80 µA (typical), 20 to 60
times lower than bipolar regulators.
Applications
•
•
•
•
•
Battery-Operated Systems
Portable Computers
Medical Instruments
Pagers
Cellular / GSM / PHS Phones
The TC1300 has a precise output with a typical accuracy of ±0.5%. Other key features include low noise
operation, low dropout voltage and internal feedforward compensation for fast response to step
changes in load. The TC1300 has both over-temperature and over-current protection. When the shutdown
control (SHDN) is low, the regulator output voltage falls
to zero, RESET output remains valid and supply current is reduced to 30 µA (typical). The TC1300 is rated
for 300 mA of output current and stable with a 1 µF output capacitor.
An active-low RESET is asserted when the detected
voltage (VDET) falls below the reset voltage threshold.
The RESET output remains low for 300 msec (typical)
after VDET rises above reset threshold. The TC1300
also has a fast wake-up response time (10 µsec.,
typical) when released from shutdown.
Typical Application Circuit
Related Literature
RESET
MSOP
GND 3
Bypass 4
2
C1
1 µF
TC1300VUA
VDET
VIN
VOUT
8
3
4
GND
Bypass
NC
SHDN
VDET
7
C2
1 µF
TC1300
CBYPASS
470 pF
(Optional)
Package Type
RESET 1
VOUT 2
VOUT
RESET
+
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765.
• AN766, “Pin-Compatible CMOS Upgrades to
Bipolar LDOs”, DS00766.
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792.
1
6
Battery
5
Shutdown Control
(from Power
Control Logic)
8 VDET
7 VIN
6 NC
5 SHDN
2001-2012 Microchip Technology Inc.
DS21385D-page 1
TC1300
1.0
ELECTRICAL
CHARACTERISTICS
PIN DESCRIPTIONS
Pin
Absolute Maximum Ratings*
RESET
Input Voltage ....................................................................6.5V
Output Voltage ................................. (VSS - 0.3) to (VIN + 0.3)
Power Dissipation ......................... Internally Limited (Note 6)
Operating Junction Temperature, TJ ....... – 40°C < TJ< 150°C
Maximum Junction Temperature, Tj .............................. 150°C
Storage Temperature................................... – 65°C to +150°C
Maximum Voltage on Any Pin ............. (VSS-0.3) to (VIN+0.3)
VOUT
GND
*Notice: Stresses above those listed under “maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Description
RESET output remains low while VDET is
below the reset voltage threshold and for
300 msec after VDET rises above reset theshold.
Regulated Voltage Output
Ground Terminal
Bypass
Reference Bypass Input. Connecting an
optional 470 pF to this input further reduces
output noise.
SHDN
Shutdown Control Input. The regulator is fully
enabled when a logic high is applied to this
input. The regulator enters shutdown when a
logic low is applied to this input. During shutdown, regulator output voltage falls to zero,
RESET output remains valid and supply current is reduced to 30 µA (typ.).
NC
No connect
VIN
Power Supply Input
VDET
Detected Input Voltage. VDET and VIN can be
connected together.
ELECTRICAL CHARACTERISTICS
VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
IOUTMAX
300
—
—
mA
VOUT
—
VR - 2.5%
VR ± 0.5%
—
—
VR + 2.5%
V
VOUT/T
—
25
—
Line Regulation
VOUT/VIN
—
0.02
0.35
%
(VR + 1V) < VIN < 6V
Load Regulation
VOUT/VOUT
—
0.5
2.0
%
IL = 0.1 mA to IOUTMAX, Note 3
Input Operating Voltage
Maximum Output Current
Output Voltage
VOUT Temperature Coefficient
Conditions
Note 7
Note 1
ppm/°C Note 2
Note 1: VR is the regulator output voltage setting.
2:
6
VOUTMAX – V OUTMIN 10
TCV OUT = ------------------------------------------------------------------------------------V OUT T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT).
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
DS21385D-page 2
2001-2012 Microchip Technology Inc.
TC1300
ELECTRICAL CHARACTERISTICS (CONTINUED)
VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
VIN –VOUT
—
1
70
210
30
130
390
mV
IL = 0.1 mA
IL = 100 mA
IL = 300 mA
Supply Current
ISS1
—
80
160
µA
SHDN = VIH
Shutdown Supply Current
ISS2
—
30
60
µA
SHDN = 0V
Power Supply Rejection Ratio
PSRR
—
60
—
dB
f 1 kHz, CBYPASS = 1 nF
Output Short Circuit Current
IOUTSC
—
800
1200
mA
VOUT = 0V
VOUT/PD
—
0.04
—
%/W
Note 5
Output Noise
eN
—
900
—
nV/Hz
Wake-Up Time
(from Shutdown Mode)
tWK
—
10
20
µsec
CIN = 1 µF, VIN = 5V,
COUT = 4.7 µF, IL = 30 mA,
See Figure 3-2
Settling Time
(from Shutdown Mode)
ts
—
50
—
µsec
CIN = 1 µF, VIN = 5V
COUT = 4.7 µF
IL = 30 mA, See Figure 3-2
Thermal Shutdown Die
Temperature
TSD
—
150
—
°C
Thermal Shutdown Hysteresis
THYS
—
10
—
°C
RthetaJA
—
200
—
SHDN Input High Threshold
VIH
45
—
—
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low Threshold
VIL
—
—
15
%VIN
VIN = 2.5V to 6.0V
Dropout Voltage (Note 4)
Thermal Regulation
Thermal Resistance Junction to
Case
Conditions
f < 1 kHz, COUT = 1 µF,
RLOAD = 50
CBYPASS = 1 nF
°C/Watt EIA/JEDEC JESD51-751-7 4Layer Board
Note 1: VR is the regulator output voltage setting.
2:
6
VOUTMAX – V OUTMIN 10
TCV OUT = ------------------------------------------------------------------------------------V
T
OUT
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT).
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
2001-2012 Microchip Technology Inc.
DS21385D-page 3
TC1300
ELECTRICAL CHARACTERISTICS (CONTINUED)
VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Voltage Range
VDET
1.0
1.2
—
—
6.0
6.0
V
TA = 0°C to +70°C
TA = – 40°C to +125°C
Reset Threshold
VTH
2.59
2.63
2.66
V
TC1300R-XX, TA = +25°C
2.55
—
2.70
TC1300R-XX,
TA = – 40°C to +125°C
2.36
2.40
2.43
TC1300Y-XX, TA = +25°C
2.32
—
2.47
TC1300Y-XX,
TA = – 40°C to +125°C
VTH / T
—
30
—
ppm/°C
VDET to Reset Delay
tRPD
—
160
—
µsec
Reset Active Timeout Period
tRPU
140
300
560
msec
RESET Output Voltage Low
VOL
—
—
0.3
V
VDET = VTH min,
ISINK = 1.2 mA
RESET Output Voltage High
VOH
0.8 VDET
—
—
V
VDET > VTH max,
ISOURCE = 500 µA
RESET Output
Reset Threshold Tempco
VDET = VTH to (VTH – 100 mV)
Note 1: VR is the regulator output voltage setting.
2:
6
VOUTMAX – V OUTMIN 10
TCV OUT = -------------------------------------------------------------------------------------V OUT T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum VIN has to meet two conditions: VIN 2.7V and VIN (VR + VDROPOUT).
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
DS21385D-page 4
2001-2012 Microchip Technology Inc.
TC1300
2.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
Line Regulation (%)
0.035
VOUT = 3.0V
VIN = 3.5V to 6.0V
0.030
0.025
0.020
0.015
0.010
0.005
0.000
Reset Active Time-out Period
(ms)
Note:
450
400
350
300
250
200
150
100
50
0
-40 -25 -10
5
20
35
50
65
80
95 110 125
-40 -25 -10
Junction Temperature (°C)
FIGURE 2-1:
Temperature.
Line Regulation vs.
35
10.00
VOUT = 5.0V
0.10
VOUT = 3.0V
0.08
VOUT = 2.5V
0.06
0.04
0.02
-40 -25 -10
5
65
80
95 110 125
1.00
0.10
0.01
0.01
20 35 50 65 80 95 110 125
1
1.00
0.10
10
10.00
100
100.00
1000
1000.00
Frequency (kHz)
Junction Temperature (°C)
FIGURE 2-2:
Temperature.
50
RLOAD = 50 Ohms
COUT = 1 µF
VIN = VOUT + 1V
Output Noise (µV/lHz)
0.12
0.00
Supply Current vs.
FIGURE 2-5:
Output Noise vs. Frequency.
0.30
2.500
VOUT = 2.5V
2.498
2.497
2.496
2.495
2.494
VIN = VOUT + 1V
IOUT = 100 µA
VOUT = 2.5V
2.493
2.492
Dropout Voltage (V)
2.499
Output Voltage (V)
20
FIGURE 2-4:
Reset Active Time-out
Period vs. Temperature.
0.14
Supply Current (mA)
5
Junction Temperature (°C)
0.25
TJ = -40°C
TJ = +125°C
0.20
0.15
TJ = +25°C
0.10
0.05
0.00
2.491
-40 -25 -10
5
20
35
50
65
80
95 110 125
0
FIGURE 2-3:
Temperature.
Normalized VOUT vs.
2001-2012 Microchip Technology Inc.
100
200
300
400
Load Current (mA)
Junction Temperature (°C)
FIGURE 2-6:
Current (2.5V).
Dropout Voltage vs. Load
DS21385D-page 5
TC1300
2.0 TYPICAL CHARACTERISTICS (CON’T)
60
VIN = 3.8V
VOUT = 2.8V
IOUT = 50 mA
COUT = 10 μF
COUTesr = 0.25 :
CBYPASS = 0 μF
45
30
15
0.3
VOUT = 5.0V
Dropout Voltage (V)
Power Supply Ripple Rejection
(dB)
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
0
0.25
TJ = +125°C
0.2
0.15
TJ = +25°C
0.1
0.05
0
10
1k
1000
100
10k
10000
100k
100000
1M
100000
0
100
Frequency (Hz)
200
300
400
Load Current (mA)
FIGURE 2-7:
Power Supply Rejection
Ratio vs. Frequency.
Reset Voltage Threshold (V)
TJ = -40°C
FIGURE 2-10:
Current (5.0V).
Dropout Voltage vs. Load
FIGURE 2-11:
Wake-Up Response Time.
2.6330
2.6325
2.6320
2.6315
2.6310
2.6305
2.6300
2.6295
2.6290
2.6285
2.6280
2.6275
-40 -25 -10
5
20
35
50
65
80
95 110 125
Load Regulation (1 mA to 300
mA) %
FIGURE 2-8:
Reset Voltage Threshold vs.
Junction Temperature.
0.90
VIN = VOUT + 1V
0.80
VOUT = 3.0V
0.70
0.60
0.50
VOUT = 2.5V
0.40
VOUT = 5.0V
0.30
0.20
-40 -25 -10
5
20
35
50
65
80
95 110 125
VDET to RESET Delay Time (µS)
Junction Temperature (°C)
300
250
10 mV Overdrive
200
100 mV Overdrive
150
100
50
0
-40 -25 -10
FIGURE 2-9:
Temperature.
DS21385D-page 6
Load Regulation vs.
5
20
35
50
65
80
95 110 125
Junction Temperature (°C)
Junction Temperature (°C)
FIGURE 2-12:
Temperature.
VDET to Reset Delay vs.
2001-2012 Microchip Technology Inc.
TC1300
2.0 TYPICAL CHARACTERISTICS (CON’T)
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
FIGURE 2-13:
Load Transient Response
1 µF Output Capacitor.
FIGURE 2-16:
Line Transient Response
10 µF Output Capacitor.
0.30
VDET = VTH - 20 mV
RESET VOL (V)
0.25
ISINK = 3.2 mA
0.20
0.15
ISINK = 1.2 mA
0.10
0.05
0.00
-40 -25 -10
5
20
35
50
65
80
95 110 125
Junction Temperature (°C)
FIGURE 2-14:
Line Transient Response
1 µF Output Capacitor.
FIGURE 2-17:
RESET Output Voltage Low
vs. Junction Temperature.
3.960
RESET VOH (V)
3.950
ISOURCE = 500 µA
3.940
3.930
3.920
ISOURCE = 800 µA
3.910
3.900
VDET = 4.0V
3.890
-40 -25 -10
5
20
35
50
65
80
95 110 125
Junction Temperature (°C)
FIGURE 2-15:
Load Transient Response
10 µF Output Capacitor.
2001-2012 Microchip Technology Inc.
FIGURE 2-18:
RESET Output Voltage High
vs. Junction Temperature.
DS21385D-page 7
TC1300
3.0
DETAILED DESCRIPTION
The TC1300 is a combination of a fixed output, low
dropout
regulator
and
a
microcontroller
monitor/RESET. Unlike bipolar regulators, the TC1300
supply current does not increase with load current. In
addition, VOUT remains stable and within regulation
over the entire specified operating load range (0 mA to
300 mA) and operating input voltage range (2.7V to
6.0V).
Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN)
is above VIH. The regulator is shutdown (disabled)
when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate or an I/O port of a microcontroller. If the SHDN input is not required, it should be
connected directly to the input supply. While in shutdown, supply current decreases to 30 µA (typical),
VOUT falls to zero and RESET remains valid.
3.1
RESET Output
The RESET output is driven active-low within 160 µsec
of VDET falling through the reset voltage threshold.
RESET is maintained active for a minimum of
140 msec after VDET rises above the reset threshold.
The TC1300 has an active-low RESET output. The output of the TC1300 is valid down to VDET = 1V and is
optimized to reject fast transient glitches on the VDET
line.
Microcontroller
RESET
C1
1 µF
RESET
VDET
2 V
OUT
VIN 7
TC1300
3
4
GND
NC
VDET
C2
1 µF
6
Battery
Bypass SHDN 5
CBYPASS
470 pF
(Optional)
FIGURE 3-1:
8
+
VOUT
1
TC1300, the selected output capacitor equivalent
series resistance (ESR) range is 0.1 ohms to 5 ohms
when using 1 µF of output capacitance, and 0.01 ohms
to 5 ohms when using 10 µF of output capacitance.
Because of the ESR requirement, tantalum and aluminum electrolytic capacitors are recommended. Aluminum electrolytic capacitors are not recommended for
operation at temperatures below -25°C. When operating from sources other than batteries, rejection and
transient responses can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
3.3
Bypass Input (Optional)
An optional 470 pF capacitor connected from the
Bypass input to ground reduces noise present on the
internal reference, which in turn significantly reduces
output noise and improves PSRR performance. This
input may be left unconnected. Larger capacitor values
may be used, but results in a longer time period to rated
output voltage when power is initially applied.
3.4
Turn On Response
The turn-on response is defined as two separate
response categories, Wake-Up Time (tWK) and Settling
Time (tS).
The TC1300 has a fast Wake-Up Time (10 µsec typical) when released from shutdown. See Figure 3-2 for
the Wake-Up Time designated as tWK. The Wake-Up
Time is defined as the time it takes for the output to rise
to 2% of the VOUT value after being released from
shutdown.
The total turn-on response is defined as the Settling
Time (tS) (see Figure 3-2). Settling Time (inclusive with
tWK) is defined as the condition when the output is
within 2% of its fully enabled value (50 µsec typical)
when released from shutdown. The settling time of the
output voltage is dependent on load conditions and
output capacitance on VOUT (RC response).
Shutdown Control
(from Power
Control Logic)
Typical Application Circuit.
VIH
SHDN
VIL
tS
98%
3.2
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
A 1 µF capacitor should also be connected from VIN to
GND if there is more than 10 inches of wire between
the regulator and the AC filter capacitor, or if a battery
is used as the power source. As with all low dropout
regulators, a minimum output capacitance is required
to stabilize the output voltage. For the TC1300, a minimum of 1 µF of output capacitance is enough to stabilize the device over the entire operating load and line
range. The selected output capacitor plays an important role is compensating the LDO regulator. For the
DS21385D-page 8
VOUT
2%
tWK
FIGURE 3-2:
Wake-Up Response Time.
2001-2012 Microchip Technology Inc.
TC1300
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds 150°C. The
regulator remains off until the die temperature drops to
approximately 140°C.
4.2
The worst case actual power dissipation equation can
be used in conjunction with the LDO maximum allowable power dissipation equation to ensure regulator
thermal operation is within limits. For example:
Given:
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output
current. The following equation is used to calculate
worst case actual power dissipation:
EQUATION
VINMAX
=
4.1V
VOUTMIN
=
3.0V -2.5%
ILOADMAX
=
200 mA
TJMAX
=
125°C
TAMAX
=
55°C
JA
=
200°C/W
Find:
EQUATION:
PD V INMAX – VOUTMIN I LOADMAX
ACTUAL POWER
DISSIPATION
PD V INMAX – VOUTMIN ILOADMAX
Where:
PD = worst case actual power dissipation
VINMAX = maximum voltage on VIN
VOUTMIN = minimum regulator output voltage
ILOADMAX = maximum output (load) current
= 4.1 – 3.0 .975 200 10
= 220 mW
EQUATION:
The maximum allowable power dissipation, PDMAX, is a
function of the maximum ambient temperature (TAMAX),
the maximum recommended die temperature (125°C)
and the thermal resistance from junction-to-air (JA).
The MSOP-8 package has a JA of approximately
200°C/Watt when mounted on a FR4 dielectric copper
clad PC board.
EQUATION
T JMAX – T AMAX
PDMAX = ------------------------------------------ JA
–3
MAXIMUM ALLOWABLE
POWER DISSIPATION
T JMAX – T AMAX
PDMAX = ------------------------------------------ JA
125 – 55
= ------------------------200
= 350 mW
In this example, the TC1300 dissipates a maximum of
only 220 mW; below the allowable limit of 350 mW. In a
similar manner, the maximum actual power dissipation
equation and the maximum allowable power dissipation equation can be used to calculate maximum current and/or input voltage limits. For example, the
maximum allowable VIN is found by substituting the
maximum allowable power dissipation of 350 mW into
the actual power dissipation equation, from which
VINMAX = 4.97V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads and wide power
supply bus lines combine to lower JA and, therefore,
increase the maximum allowable power dissipation
limit.
2001-2012 Microchip Technology Inc.
DS21385D-page 9
TC1300
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Example:
8-Lead MSOP
XXXXXX
1300RA
YWWNNN
YWWNNN
Part Number
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21385D-page 10
Marking Code
(XXXXXX)
TC1300R - 2.5VUA
1300RA
TC1300Y - 2.7VUA
1300YF
TC1300R - 2.8VUA
1300RB
TC1300R - 2.85VUA
1300RC
TC1300R - 3.0VUA
1300RD
TC1300R - 3.3VUA
1300RE
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2001-2012 Microchip Technology Inc.
TC1300
5.2
Package Dimensions
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size:
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in.
2001-2012 Microchip Technology Inc.
DS21385D-page 11
TC1300
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1
A2
A
A1
c
(F)
L
INCHES
Units
Number of Pins
Pitch
Dimension Limits
n
p
Overall Height
MILLIMETERS*
NOM
MIN
MAX
NOM
MIN
.026
0.65
1.18
.044
A
0.86
0.97
4.67
4.90
.5.08
.122
2.90
3.00
3.10
.122
2.90
3.00
3.10
.022
.028
0.40
0.55
0.70
.037
.039
0.90
0.95
1.00
6
0
.004
.006
.008
0.10
0.15
0.20
.010
.012
.016
0.25
0.30
0.40
.038
0.76
.006
0.05
.193
.200
.114
.118
.114
.118
L
.016
.035
Foot Angle
F
Lead Thickness
c
Lead Width
Mold Draft Angle Top
B
Mold Draft Angle Bottom
Molded Package Thickness
A2
.030
Standoff
A1
.002
E
.184
Molded Package Width
E1
Overall Length
D
Foot Length
Footprint (Reference)
§
Overall Width
MAX
8
8
.034
0
0.15
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Drawing No. C04-111
DS21385D-page 12
2001-2012 Microchip Technology Inc.
TC1300
6.0
REVISION HISTORY
Revision D (November 2010)
Added a note to each package outline drawing.
2001-2012 Microchip Technology Inc.
DS21385D-page 13
TC1300
NOTES:
DS21385D-page 14
2001-2012 Microchip Technology Inc.
TC1300
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X.X
X
/XX
Device
Output
Voltages
Temperature
Range
Package
Device:
TC1300X-X.XXXX:
300mA CMOS LDO w/Shutdown,
Bypass & Independent Delayed
Reset
TC1300X-X.XXXXTR: 300mA CMOS LDO w/Shutdown,
Bypass & Independent Delayed
Reset (Tape and Reel)
Examples:
a)
b)
c)
d)
Output Voltages:
RESET Threshold
Voltages:
- 2.4V = Y
- 2.63V = R
2.5V
2.7V
2.8V
2.85V
3.0V
3.3V
=
=
=
=
=
=
2.5
2.7
2.8
2.85
3.0
3.3
Temperature Range:
V
Package:
UA = Micro Small Outline Package (MSOP), 8-lead
= -40°C to +125°C
e)
f)
g)
TC1300R-2.5VUA: 300mA CMOS LDO w/
Shutdown, Bypass & Independent Delayed
Reset, 2.5V output voltage, 2.63V RESET
Threshold.
TC1300R-2.8VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset,
2.8V output voltage, 2.63V RESET Threshold.
TC1300R-2.85VUA: 300mA CMOS LDO w/
Shutdown, Bypass & Independent Delayed
Reset, 2.85V output voltage, 2.63V RESET
Threshold.
TC1300R-3.0VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset,
3.0V output voltage, 2.63V RESET Threshold.
TC1300R-3.3VUA: 300mA CMOS LDO w/Shutdown, Bypass & Independent Delayed Reset,
3.3V output voltage, 2.63V RESET Threshold.
TC1300R-2.85VUATR: 300mA CMOS LDO w/
Shutdown, Bypass & Independent Delayed
Reset, 2.85V output voltage, 2.63V RESET
Threshold, tape and reel.
TC1300Y-2.7VUA: 300mA CMOS LDO w/ Shutdown, Bypass & independant Delayed Reset,
2.7V output voltage, 2.4V RESET Threshold.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21385D-page15
TC1300
NOTES:
DS21385D-page 16
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767832
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21385D-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21385D-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/27/12
2001-2012 Microchip Technology Inc.
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