TC1410COA

TC1410/TC1410N 0.5A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Will Withstand 500 mA Reverse Current • Input Will Withstand Negative Inputs up to 5V • Electrostatic Discharge (ESD) Protected: 2.0 kV (HBM) and 400V (MM) • High Peak Output Current: 0.5A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 500 pF in 25 ns • Short Delay Time: 30 ns typical • Consistent Delay Times With Changes in Supply Voltage • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 16 • Available in Space-Saving 8-pin MSOP Package • Pinout – same as TC1411/TC1412/TC1413 The TC1410/TC1410N are 0.5A CMOS buffers/drivers. They will not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against Electrostatic Discharge (ESD) up to 2.0 kV (HBM) and 400V (MM). Switch Mode Power Supplies Line Drivers Pulse Transformer Drive Relay Driver 8-Pin MSOP/PDIP/SOIC VDD 1 IN 2 NC 3 GND 4 2 8 7 6 5 VDD OUT OUT GND 6,7 Inverting VDD 1 IN 2 TC1410N • • • • Package Type TC1410 Applications As MOSFET drivers, the TC1410/TC1410N can easily charge a 500 pF gate capacitance in 25 ns with matched rise and fall times and provide low enough impedance in both the ‘ON’ and ‘OFF’ states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. NC 3 GND 4 2 8 VDD 7 OUT 6 OUT 5 GND 6,7 Non-inverting NC = No Connection Note: Duplicate pins must be connected together for proper operation.  2001-2015 Microchip Technology Inc. DS20001389F-page 1 TC1410/TC1410N Functional Block Diagram TC1410 VDD Inverting Output 300 mV Output Non-inverting Output Input Effective Input C = 10 pF 4.7V TC1410N GND DS20001389F-page 2  2001-2015 Microchip Technology Inc. TC1410/TC1410N 1.0 † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA  70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65°C to +150°C Maximum Junction Temperature ...................... +150°C DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V  VDD  16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym. Min. Typ. Max. Units Logic ‘1’, High Input Voltage VIH 2.0 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current IIN -1 — 1 µA -10 — 10 Conditions Input 0V  VIN  VDD, TA = +25°C -40°C  TA  +85°C Output High Output Voltage VOH VDD – 0.025 — — V DC Test Low Output Voltage VOL — — 0.025 V DC Test Output Resistance RO — 16 22  VDD = 16V, IO = 10 mA, TA = +25°C — 20 28 Peak Output Current Latch-Up Protection Withstand Reverse Current 0°C TA  +70°C -40°C  TA  +85°C — 20 28 IPK — 0.5 — A VDD = 16V IREV — 0.5 — A Duty cycle  2%, t  300 µs, VDD = 16V tR — 25 35 ns TA = +25°C — 27 40 0°C  TA  +70°C — 29 40 -40°C  TA  +85°C, Figure 4-1 — 25 35 — 27 40 Switching Time (Note 1) Rise Time Fall Time tF Delay Time Delay Time Note 1: tD1 tD2 ns TA = +25°C 0°C  TA  +70°C -40°C  TA  +85°C, Figure 4-1 — 29 40 — 30 40 — 33 45 0°C  TA  +70°C — 35 45 -40°C  TA  +85°C, Figure 4-1 — 30 40 — 33 45 0°C  TA  +70°C — 35 45 -40°C  TA  +85°C, Figure 4-1 ns ns TA = +25°C TA = +25°C Switching times ensured by design.  2001-2015 Microchip Technology Inc. DS20001389F-page 3 TC1410/TC1410N DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V  VDD  16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym. Min. Typ. Max. Units mA Conditions Power Supply Power Supply Current Note 1: IS — 0.5 1.0 — 0.1 0.15 VIN = 3V, VDD = 16V VIN = 0V Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  16V. Parameters Sym. Min. Typ. Max. Units Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Conditions Temperature Ranges Package Thermal Resistances Thermal Resistance, 8L-MSOP JA — 211 — ºC/W Thermal Resistance, 8L-PDIP JA — 89.3 — ºC/W Thermal Resistance, 8L-SOIC JA — 149.5 — ºC/W DS20001389F-page 4  2001-2015 Microchip Technology Inc. TC1410/TC1410N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V. 500 500 TA = +25°C 400 VIN = 3V ISUPPLY (µA) ISUPPLY (µA) 400 300 200 100 0 VSUPPLY = 16V VIN = 3V 6 8 10 12 14 200 100 VIN = 0V 4 300 0 16 VIN = 0V -40 -20 0 VDD (V) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. 1.6 FIGURE 2-4: vs. Temperature. 1.6 TA = +25°C 1.4 1.3 VIL 1.2 60 80 Quiescent Supply Current VSUPPLY = 16V 4 VIH 1.4 1.3 VIL 1.2 6 8 10 12 14 1.1 16 -40 -20 VDD (V) FIGURE 2-2: Voltage. 0 20 40 60 80 TEMPERATURE (°C) Input Threshold vs. Supply FIGURE 2-5: Temperature. 50 Input Threshold vs. 50 TA = +85°C 40 RDS-ON (Ohms) 40 RDS-ON (Ohms) 40 1.5 VIH VTHRESHOLD (V) VTHRESHOLD (V) 1.5 1.1 20 TEMPERATURE (°C) TA = +25°C 30 20 TA = -40°C 10 30 20 TA = +85°C TA = +25°C 10 TA = -40°C 0 0 4 6 8 10 12 VDD (V) FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.  2001-2015 Microchip Technology Inc. 14 16 4 6 8 10 12 14 16 VDD (V) FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. DS20001389F-page 5 TC1410/TC1410N Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V. 100 100 CLOAD = 500 pF 80 60 tFALL (nsec) tRISE (nsec) 80 TA = +85°C TA = +25°C 40 20 0 4 6 8 100 10 VDD (V) 60 TA = +85°C 40 TA = +25°C 20 TA = -40°C FIGURE 2-7: Voltage. TA = -40°C 12 14 0 16 4 6 8 FIGURE 2-10: Voltage. Rise Time vs. Supply 100 CLOAD = 500 pF TA = +85°C tD2 (nsec) 60 TA = +25°C 40 14 16 CLOAD = 500 pF 60 TA = +85°C TA = +25°C 40 TA = -40°C 20 4 6 8 FIGURE 2-8: Supply Voltage. 10 VDD (V) 12 14 4 TA = +25°C VDD = 16V Propagation Delays (nsec) tFALL 40 20 500 1000 1500 2000 2500 3000 8 3500 DS20001389F-page 6 Rise and Fall Times vs. 12 14 16 Propagation Delay vs. tD2 41 tD1 37 33 29 25 0 500 1000 CLOAD (pF) FIGURE 2-9: Capacitive Load. 10 VDD (V) TA = +25°C VDD = 16V tRISE 60 0 6 FIGURE 2-11: Supply Voltage. Propagation Delay vs. 80 0 0 16 45 100 tRISE, tFALL (nsec) 12 Fall Time vs. Supply TA = -40°C 20 0 10 VDD (V) 80 80 tD1 (nsec) CLOAD = 500 pF 1500 2000 2500 3000 3500 CLOAD (pF) FIGURE 2-12: Capacitive Load. Propagation Delays vs.  2001-2015 Microchip Technology Inc. TC1410/TC1410N 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. TC1410 MSOP, PDIP, SOIC TC1410N MSOP, PDIP, SOIC 1 VDD VDD 2 IN IN 3.1 Supply input, 4.5V to 16V Control input 3 NC NC 4 GND GND Ground 5 GND GND Ground 6 OUT OUT CMOS push-pull output, common to pin 7 7 OUT OUT CMOS push-pull output, common to pin 6 8 VDD VDD Supply input, 4.5V to 16V Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Description Control Input (IN) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input also has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow.  2001-2015 Microchip Technology Inc. No connection 3.3 CMOS Push-Pull Output (OUT, OUT) The MOSFET driver output is a low-impedance, CMOS, push-pull style output, capable of driving a capacitive load with 0.5 A peak currents. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. DS20001389F-page 7 TC1410/TC1410N 4.0 APPLICATIONS INFORMATION +5V 90% Input VDD = 16V 0V 1.0 µF 0.1 µF 1, 8 Input 10% tD1 tD2 tF VDD tR 90% 90% Output 2 6, 7 Output 10% 10% 0V Inverting Driver CL = 500 pF TC1410 TC1410 TC1410N +5V 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL  10 ns 0V VDD 10% tD1 90% Output 0V 90% tR 10% tF tD2 10% Non-inverting Driver TC1410N FIGURE 4-1: DS20001389F-page 8 Switching Time Test Circuit.  2001-2015 Microchip Technology Inc. TC1410/TC1410N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example TC1410 e3 256 CPA^^ 1316 OR TC1410 CPA256 1316 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2001-2015 Microchip Technology Inc. DS20001389F-page 9 TC1410/TC1410N 8-Lead SOIC (3.90 mm) NNN Example TC1410C OA^^ e3 1316 256 OR TC1410 COA1316 256 8-Lead MSOP (3x3 mm) Example 1410E 316256 DS20001389F-page 10  2001-2015 Microchip Technology Inc. TC1410/TC1410N /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A 3/$1( L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2001-2015 Microchip Technology Inc. DS20001389F-page 11 TC1410/TC1410N /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20001389F-page 12  2001-2015 Microchip Technology Inc. TC1410/TC1410N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2015 Microchip Technology Inc. DS20001389F-page 13 TC1410/TC1410N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001389F-page 14  2001-2015 Microchip Technology Inc. TC1410/TC1410N      !"#$%& '  ! "# $% &"'"" ($)  % *++&&&!  !+$  2001-2015 Microchip Technology Inc. DS20001389F-page 15 TC1410/TC1410N 8$ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001389F-page 16  2001-2015 Microchip Technology Inc. TC1410/TC1410N UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2015 Microchip Technology Inc. DS20001389F-page 17 TC1410/TC1410N 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001389F-page 18  2001-2015 Microchip Technology Inc. TC1410/TC1410N NOTES:  2001-2015 Microchip Technology Inc. DS20001389F-page 19 TC1410/TC1410N APPENDIX A: REVISION HISTORY Revision F (February 2015) The following is the list of modifications: 1. 2. Updated package drawings in Section 5.0 “Packaging Information”. Minor typographical changes. Revision E (May 2013) The following is the list of modifications: 1. 2. Updated the values for Electrostatic Discharge in the Features and General Description columns. Updated the Pin Description table in Section 3.0 “Pin Descriptions”. DS20001389F-page 20  2001-2015 Microchip Technology Inc. TC1410/TC1410N NOTES:  2001-2015 Microchip Technology Inc. DS20001389F-page 21 TC1410/TC1410N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Examples: a) b) Device: TC1410: 0.5A Single MOSFET Driver, Inverting TC1410N: 0.5A Single MOSFET Driver, Non-inverting Temperature Range: C E Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead c) = = 0°C to +70°C -40°C to +85°C TC1410COA: 0.5A Single MOSFET driver, SOIC package, 0°C to +70°C. TC1410CPA: 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1410EUA713: Tape and Reel, 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C. a) TC1410NCPA: b) TC1410NEPA: c) TC1410NEUA: * MSOP package is only available in E-Temp. DS20001389F-page 22 0.5A Single MOSFET driver, PDIP package, 0°C to +70°C. 0.5A Single MOSFET driver, PDIP package, -40°C to +85°C. 0.5A Single MOSFET driver, MSOP package, -40°C to +85°C.  2001-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-063-9 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2001-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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