TC1411NEOA713

TC1411/TC1411N 1A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Withstands 500 mA Reverse Current • Input Withstands Negative Inputs Up to 5V • Electrostatic Discharge (ESD) Protected: 2.0 kV (HBM) and 400V (MM) • High Peak Output Current: 1A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 1000 pF in 25 ns • Short Delay Time: 30 ns typical • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 8Ω • Available in Space-Saving 8-pin MSOP Package • Pinout – same as TC1410/TC1412/TC1413 The TC1411/TC1411N are 1A CMOS buffers/drivers. They do not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against Electrostatic Discharge (ESD) up to 2.0 kV (HBM) and 400V (MM). As MOSFET drivers, the TC1411/TC1411N can easily charge a 1000 pF gate capacitance in 25 ns with matched rise and fall times. To ensure that the MOSFET’s intended state is not affected even by large transients, low enough impedance in both the ‘ON’ and ‘OFF’ states are provided. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. Package Types 8-Pin MSOP/PDIP/SOIC Applications • • • • Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Relay Driver VDD 1 8 VDD VDD 1 IN 2 7 OUT IN 2 6 OUT NC 3 TC1411 NC 3 GND 4 TC1411N 5 GND GND 4 2 6,7 Inverting 8 VDD 7 OUT 6 OUT 5 GND 2 6,7 Non-Inverting NC = No Internal Connection Note:  2001-2013 Microchip Technology Inc. For proper operation, duplicate pins must be connected together. DS20001390E-page 1 TC1411/TC1411N Functional Block Diagram TC1411 VDD Inverting Outputs 300 mV Output Non-Inverting Outputs Input Effective Input C = 10 pF 4.7V TC1411N GND DS20001390E-page 2  2001-2013 Microchip Technology Inc. TC1411/TC1411N 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA ≤ 70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range .............. -65°C to +150°C Maximum Junction Temperature ...................... +150°C DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym Min Typ Max Units Logic ‘1’, High Input Voltage VIH 2.0 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current IIN -1.0 — 1.0 µA -10 — 10 Conditions Input 0V ≤ VIN ≤ VDD, TA = +25°C -40°C ≤ TA ≤ +85°C Output High Output Voltage VOH VDD – 0.025 — — V DC Test Low Output Voltage VOL — — 0.025 V DC Test Output Resistance RO — 8 11 Ω VDD = 16V, IO = 10 mA, TA = +25°C — 10 14 0°C ≤ TA ≤ +70°C — 10 14 -40°C ≤ TA ≤ +85°C Peak Output Current IPK — 1.0 — A VDD = 16V Latch-Up Protection Withstand Reverse Current IREV — 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µs, VDD = 16V tR — 25 35 ns TA = +25°C Switching Time (Note 1) Rise Time Fall Time tF Delay Time Delay Time Note 1: tD1 tD2 — 27 40 0°C ≤ TA ≤ +70°C — 29 40 -40°C ≤ TA ≤ +85°C, Figure 4-1 — 25 35 — 27 40 — 29 40 — 30 40 ns TA = +25°C 0°C ≤ TA ≤ +70°C -40°C ≤ TA ≤ +85°C, Figure 4-1 ns TA = +25°C — 33 45 0°C ≤ TA ≤ +70°C — 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1 — 30 40 — 33 45 0°C ≤ TA ≤ +70°C — 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1 ns TA = +25°C Switching times ensured by design.  2001-2013 Microchip Technology Inc. DS20001390E-page 3 TC1411/TC1411N DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, over the operating temperature range with 4.5V ≤ VDD ≤ 16V. Typical values are measured at TA = +25°C, VDD = 16V. Parameters Sym Min Typ Max Units IS — 0.5 1.0 mA — 0.1 0.15 Conditions Power Supply Power Supply Current Note 1: VIN = 3V, VDD = 16V VIN = 0V Switching times ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Specified Temperature Range (V) TA -40 — +125 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Thermal Resistance, 8L-MSOP θJA — 211 — ºC/W Thermal Resistance, 8L-PDIP θJA — 89.3 — ºC/W Thermal Resistance, 8L-SOIC θJA — 149.5 — ºC/W Package Thermal Resistances DS20001390E-page 4  2001-2013 Microchip Technology Inc. TC1411/TC1411N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 500 500 TA = +25°C 400 VIN = 3V ISUPPLY (μA) ISUPPLY (μA) 400 300 200 100 0 VSUPPLY = 16V VIN = 3V 6 8 10 12 14 200 100 VIN = 0V 4 300 VIN = 0V 0 16 -40 -20 VDD (V) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. 1.6 FIGURE 2-4: vs. Temperature. 1.6 TA = +25°C 1.4 1.3 VIL 1.2 40 60 80 Quiescent Supply Current VSUPPLY = 16V 4 VIH 1.4 1.3 VIL 1.2 6 8 10 12 14 16 1.1 -40 -20 VDD (V) FIGURE 2-2: Voltage. Input Threshold vs. Supply FIGURE 2-5: Temperature. TA = +85°C 40 60 80 Input Threshold vs. 20 TA = +25°C 15 10 TA = -40°C TA = +85°C 15 TA = +25°C 10 5 5 0 4 20 25 RDS-ON (Ohms) 20 0 TEMPERATURE (°C) 25 RDS-ON (Ohms) 20 1.5 VIH VTHRESHOLD (V) VTHRESHOLD (V) 1.5 1.1 0 TEMPERATURE (°C) 6 8 10 VDD (V) 12 14 FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.  2001-2013 Microchip Technology Inc. 16 0 TA = -40°C 4 6 8 10 VDD (V) 12 14 16 FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage. DS20001390E-page 5 TC1411/TC1411N Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V. 100 100 CLOAD = 1000 pF 80 TA = +85°C tFALL (nsec) tRISE (nsec) 80 60 TA = +25°C 40 20 0 4 6 8 100 10 VDD (V) 60 TA = +85°C TA = +25°C 40 20 TA = -40°C FIGURE 2-7: Voltage. TA = -40°C 12 14 0 16 4 6 8 10 FIGURE 2-10: Voltage. Rise Time vs. Supply 100 CLOAD = 1000 pF tD2 (nsec) TA = +85°C TA = +25°C 40 20 CLOAD = 1000 pF TA = +85°C 60 TA = +25°C 40 TA = -40°C 20 4 6 8 FIGURE 2-8: Supply Voltage. 100 10 VDD (V) 12 14 0 16 4 6 8 FIGURE 2-11: Supply Voltage. Propagation Delay vs. 10 VDD (V) 12 14 16 Propagation Delay vs. 36 TA = +25°C VDD = 16V Propagation Delays (nsec) TA = +25°C VDD = 16V 80 tRISE, tFALL (nsec) 16 Fall Time vs. Supply TA = -40°C tRISE 60 tFALL 40 20 0 14 80 60 0 12 VDD (V) 80 tD1 (nsec) CLOAD = 1000 pF tD2 34 32 tD1 30 28 26 0 500 1000 1500 2000 2500 3000 3500 0 500 1000 FIGURE 2-9: Capacitive Load. DS20001390E-page 6 Rise and Fall Times vs. 1500 2000 2500 3000 3500 CLOAD (pF) CLOAD (pF) FIGURE 2-12: Capacitive Load. Propagation Delays vs.  2001-2013 Microchip Technology Inc. TC1411/TC1411N 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. TC1411 MSOP, PDIP, SOIC TC1411N MSOP, PDIP, SOIC 1 VDD VDD 2 IN IN Control input No connection Description Supply input, 4.5V to 16V 3 NC NC 4 GND GND Ground 5 GND GND Ground 6 OUT OUT CMOS push-pull output, common to pin 7 7 OUT OUT CMOS push-pull output, common to pin 6 8 VDD VDD Supply input, 4.5V to 16V 3.1 Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor is chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Control Input (IN) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 CMOS Push-pull Output (OUT, OUT) The MOSFET driver output is a low impedance, CMOS push-pull style output, capable of driving a capacitive load with 1A peak currents. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 No Connect (NC) No internal connection.  2001-2013 Microchip Technology Inc. DS20001390E-page 7 TC1411/TC1411N 4.0 APPLICATION INFORMATION +5V 90% Input VDD = 16V 0V 4.7 µF 0.1 µF 1, 8 Input 10% tD1 tD2 tF VDD tR 90% 90% Output 2 6, 7 Output 10% 10% 0V CL = 1000 pF Inverting Driver TC1411 TC1411 TC1411N +5V 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL ≤ 10 ns 0V VDD 10% tD1 90% tR Output 0V 10% 90% tD2 tF 10% Non-Inverting Driver TC1411N FIGURE 4-1: DS20001390E-page 8 Switching Time Test Circuit.  2001-2013 Microchip Technology Inc. TC1411/TC1411N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example TC1411 e3 256 CPA^^ 1317 OR TC1411 CPA256 1317 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code RoHS Compliant JEDEC designator for Matte Tin (Sn) This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2001-2013 Microchip Technology Inc. DS20001390E-page 9 TC1411/TC1411N 8-Lead SOIC (3.90 mm) NNN Example TC1411C e3 1317 OA^^ 256 OR TC1411 COA1317 256 8-Lead MSOP (3x3 mm) Example 1411E 317256 DS20001390E-page 10  2001-2013 Microchip Technology Inc. TC1411/TC1411N 8$ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 11 TC1411/TC1411N UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001390E-page 12  2001-2013 Microchip Technology Inc. TC1411/TC1411N 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 13 TC1411/TC1411N           4& '!&" & 5 #*!(  ! ! &  5 %&& #& && 366***' '6 5 N NOTE 1 E1 1 3 2 D E A2 A L A1 c e eB b1 b 7&! ' !:'&! 8"') %! 8,9. 8 8 8; < = &  & &  > >  # #5 5 !!  1 - 1 2! & &  1 > > "# &"# ?#& .  - -1 # #5 ?#& .  1 = ; : &  -= -1   & & : 1 - 1 : #5 !!  =  1 )    )  =  2 > > 7 : #?#& :* : #?#& ; * + 2, -    !"# $% &" ' ()"&'"!&) & #*&& & #   +%&,& !& - ' !!#.#&"# '#%! &"!!#%! &"!!!& $ #/ !#   ' !#&  .01 2,32!' !  & $& " !**&"&&  !    * , =2 DS20001390E-page 14  2001-2013 Microchip Technology Inc. TC1411/TC1411N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2013 Microchip Technology Inc. DS20001390E-page 15 TC1411/TC1411N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001390E-page 16  2001-2013 Microchip Technology Inc. TC1411/TC1411N   ! " "##$%&'!"(  4& '!&" & 5 #*!(  ! ! &  5 %&& #& && 366***' '6 5  2001-2013 Microchip Technology Inc. DS20001390E-page 17 TC1411/TC1411N NOTES: DS20001390E-page 18  2001-2013 Microchip Technology Inc. TC1411/TC1411N APPENDIX A: REVISION HISTORY Revision E (June 2013) The following is the list of modifications: • Updated the values for Electrostatic Discharge (ESD) in the Features and General Description columns. • Updated the Pin Description table in Section 3.0, Pin Descriptions. • Updated package marking information and drawings in Section 5.0, Packaging Information. • Minor grammatical and spelling corrections. Revision D (September 2006) • Added -40°C to +125°C temperature range to Temperature Characteristics table and Product Information System page. • Added disclaimer to package outline drawings. Revision C (March 2003) • Added 8-Lead MSOP Package. Revision B (May 2002) • Converted TELCOM data sheet for Embedded Control Handbook Revision A (March 2001) • Original Release of this Document.  2001-2013 Microchip Technology Inc. DS20001390E-page 19 TC1411/TC1411N NOTES: DS20001390E-page 20  2001-2013 Microchip Technology Inc. TC1411/TC1411N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Examples: a) b) Device: TC1411: 1 A Single MOSFET Driver, Inverting TC1411N: 1 A Single MOSFET Driver, Non-Inverting Temperature Range: C E V Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead c) = = = 0°C to +70°C -40°C to +85°C -40°C to +125°C d) * MSOP package is only available in E-Temp.  2001-2013 Microchip Technology Inc. TC1411COA: 1A Single MOSFET driver, 8LD SOIC package, 0°C to +70°C. TC1411CPA: 1A Single MOSFET driver, 8LD PDIP package, 0°C to +70°C. TC1411EUA713: Tape and Reel, 1A Single MOSFET driver, 8LD MSOP package, -40°C to +85°C. TC1411VOA713: Tape and Reel, 1A Single MOSFET driver, 8LD SOIC package, -40°C to +125°C. a) TC1411NCPA: b) TC1411NEPA: c) TC1411NEUA: d) TC1411NVPA: 1A Single MOSFET driver, 8LD PDIP package, 0°C to +70°C. 1A Single MOSFET driver, 8LD PDIP package, -40°C to +85°C. 1A Single MOSFET driver, 8LD MSOP package, -40°C to +85°C. 1A Single MOSFET driver, 8LD PDIP package, -40°C to +125°C. DS20001390E-page 21 TC1411/TC1411N NOTES: DS20001390E-page 22  2001-2013 Microchip Technology Inc. TC1411/TC1411N THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2001-2013 Microchip Technology Inc. DS20001390E-page 23 TC1411/TC1411N NOTES: DS20001390E-page 24  2001-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-244-7 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2001-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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