TC1413COA

TC1413/TC1413N 3A High-Speed MOSFET Drivers Features General Description • Latch-Up Protected: Withstands 500 mA Reverse Current • Input Withstands Negative Inputs Up to 5V • Electrostatic Discharge (ESD) Protected: 2.0 kV (HBM) and 400V (MM) • High Peak Output Current: 3A • Wide Input Supply Voltage Operating Range: - 4.5V to 16V • High Capacitive Load Drive Capability: - 1800 pF in 20 ns • Short Delay Time: 35 ns typical • Matched Delay Times • Low Supply Current - With Logic ‘1’ Input: 500 µA - With Logic ‘0’ Input: 100 µA • Low Output Impedance: 2.7 • Available in Space-Saving 8-pin MSOP Package • Pinout - same as TC1410/TC1411/TC1412 The TC1413/TC1413N are 3A CMOS buffers/drivers. They do not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against electrostatic discharge (ESD) up to 2.0 kV (HBM) and 400V (MM). Applications • • • • Switch Mode Power Supplies Line Drivers Pulse Transformer Drive Relay Driver As MOSFET drivers, the TC1413/TC1413N can easily charge a 1800 pF gate capacitance in 20 ns with matched rise and fall times. To ensure the MOSFET’s intended state will not be affected even by large transients, low enough impedance in both the ‘On’ and ‘Off’ states are provided. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. Package Type 8-Pin MSOP/PDIP/SOIC VDD 1 8 VDD VDD 1 IN 2 7 OUT IN 2 6 OUT NC 3 5 GND GND 4 TC1413 NC 3 GND 4 2 6,7 Inverting 8 VDD TC1413N 7 OUT 6 OUT 5 GND 2 6,7 Non-Inverting NC = No Internal Connection Note:  2001-2015 Microchip Technology Inc. For proper operation, duplicate pins must be connected together. DS20001392E-page 1 TC1413/TC1413N Functional Block Diagram TC1413 VDD Inverting Outputs 300 mV Output Non-Inverting Outputs Input Effective Input C = 10 pF 4.7V TC1413N GND DS20001392E-page 2  2001-2015 Microchip Technology Inc. TC1413/TC1413N 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings† Supply Voltage ..................................................... +20V Input Voltage ...................... VDD + 0.3V to GND – 5.0V Power Dissipation (TA  70°C) MSOP .......................................................... 340 mW PDIP ............................................................ 730 mW SOIC............................................................ 470 mW Storage Temperature Range.............. -65°C to +150°C Maximum Junction Temperature ...................... +150ºC DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise noted, TA = +25°C, with 4.5V  VDD  16V. Parameters Sym. Min. Typ. Max. Units Logic ‘1’, High Input Voltage VIH 2.0 — — V Logic ‘0’, Low Input Voltage VIL — — 0.8 V Input Current IIN -1.0 — 1.0 µA -10 — 10 Conditions Input 0V  VIN  VDD, TA = +25°C -40°C  TA  +85°C Output High Output Voltage VOH VDD – 0.025 — — V DC Test Low Output Voltage VOL — — 0.025 V DC Test Output Resistance RO — 2.7 4.0  VDD = 16V, IO = 10 mA, TA = +25°C — 3.3 5.0 0°C  TA  +70°C -40°C  TA  +85°C — 3.3 5.0 Peak Output Current IPK — 3.0 — A VDD = 16V Latch-Up Protection Withstand Reverse Current IREV — 0.5 — A Duty cycle  2%, t  300 µs, VDD = 16V tR — 20 28 ns TA = +25°C — 22 33 — 24 33 — 20 28 — 22 33 — 24 33 — 35 45 — 40 50 — 40 50 — 35 45 — 40 50 0°C  TA  +70°C — 40 50 -40°C  TA  +85°C, Figure 4-1 — 0.5 1.0 — 0.1 0.15 Switching Time (Note 1) Rise Time Fall Time tF Delay Time Delay Time tD1 tD2 0°C  TA  +70°C -40°C  TA  +85°C, Figure 4-1 ns TA = +25°C 0°C  TA  +70°C -40°C  TA  +85°C, Figure 4-1 ns TA = +25°C, 0°C  TA  +70°C -40°C  TA  +85°C, Figure 4-1 ns TA = +25°C Power Supply Power Supply Current Note 1: IS mA VIN = 3V, VDD = 16V VIN = 0V Switching times ensured by design.  2001-2015 Microchip Technology Inc. DS20001392E-page 3 TC1413/TC1413N TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V. Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range (C) TA 0 — +70 ºC Specified Temperature Range (E) TA -40 — +85 ºC Maximum Junction Temperature TJ — — +150 ºC Storage Temperature Range TA -65 — +150 ºC Thermal Resistance, 8L-MSOP JA — 211 — ºC/W Thermal Resistance, 8L-PDIP JA — 89.3 — ºC/W Thermal Resistance, 8L-SOIC JA — 149.5 — ºC/W Package Thermal Resistances DS20001392E-page 4  2001-2015 Microchip Technology Inc. TC1413/TC1413N 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V. 500 500 TA = +25°C VSUPPLY = 16V VIN = 3V 400 VIN = 3V ISUPPLY (µA) ISUPPLY (µA) 400 300 200 100 0 300 200 100 VIN = 0V 0 4 6 8 10 12 14 16 VIN = 0V -40 -20 0 VDD (V) FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage. FIGURE 2-4: vs. Temperature. 1.6 1.6 TA = +25°C 40 60 80 Quiescent Supply Current VSUPPLY = 16V 1.5 VIH VTHRESHOLD (V) VTHRESHOLD (V) 1.5 1.4 1.3 1.2 4 6 VIH 1.4 1.3 VIL 1.2 VIL 1.1 8 10 12 14 16 1.1 -40 -20 0 FIGURE 2-2: Voltage. Input Threshold vs. Supply FIGURE 2-5: Temperature. 9 9 8 8 7 7 RDS-ON (Ohms) TA = +85°C 6 TA = +25°C 5 20 40 60 80 TEMPERATURE (°C) VDD (V) RDS-ON (Ohms) 20 TEMPERATURE (°C) 4 3 Input Threshold vs. TA = +85°C 6 5 TA = +25°C 4 3 TA = -40°C 2 2 TA = -40°C 1 1 4 6 8 10 VDD (V) 12 14 FIGURE 2-3: High State Output Resistance vs. Supply Voltage.  2001-2015 Microchip Technology Inc. 16 4 6 8 10 VDD (V) 12 14 16 FIGURE 2-6: Low State Output Resistance vs. Supply Voltage. DS20001392E-page 5 TC1413/TC1413N Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V. 70 70 CLOAD = 1800 pF CLOAD = 1800 pF 60 50 TA = +85°C 40 TA = +25°C 30 20 10 tFALL (nsec) tRISE (nsec) 60 6 40 TA = +85°C TA = +25°C 30 20 TA = -40°C 4 50 TA = -40°C 8 10 12 14 10 16 4 6 8 10 VDD (V) FIGURE 2-7: Voltage. Rise Time vs. Supply FIGURE 2-10: Voltage. 16 Fall Time vs. Supply CLOAD = 1800 pF CLOAD = 1800 pF 100 90 90 80 tD2 (nsec) TA = +85°C 80 tD1 (nsec) 14 100 110 70 TA = +25°C 60 50 TA = +85°C 70 60 TA = +25°C 50 40 40 TA = -40°C 30 30 TA = -40°C 20 20 4 6 FIGURE 2-8: Supply Voltage. 8 10 VDD (V) 12 14 16 4 6 8 10 12 14 16 VDD (V) Propagation Delay vs. FIGURE 2-11: Supply Voltage. 40 Propagation Delay vs. 35 TA = +25°C VDD = 16V tFALL 20 10 0 Propagation Delays (nsec) tRISE 30 tRISE, tFALL (nsec) 12 VDD (V) TA = +25°C VDD = 16V 34 tD2 33 tD1 32 31 30 29 28 0 1000 2000 3000 4000 5000 0 1000 FIGURE 2-9: Capacitive Load. DS20001392E-page 6 Rise and Fall Times vs. 2000 3000 4000 5000 CLOAD (pF) CLOAD (pF) FIGURE 2-12: Capacitive Load. Propagation Delays vs.  2001-2015 Microchip Technology Inc. TC1413/TC1413N 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. . TABLE 3-1: PIN FUNCTION TABLE Pin No. TC1413 MSOP, PDIP, SOIC TC1413N MSOP, PDIP, SOIC 1 VDD VDD 2 IN IN Control input No connection 3.1 Supply input, 4.5V to 16V 3 NC NC 4 GND GND Ground 5 GND GND Ground 6 OUT OUT CMOS push-pull output, common to pin 7 7 OUT OUT CMOS push-pull output, common to pin 6 8 VDD VDD Supply input, 4.5V to 16V Supply Input (VDD) The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor is chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested. 3.2 Description Control Input (IN) The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds which prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 CMOS Push-Pull Output (OUT, OUT) The MOSFET driver output is a low-impedance, CMOS push-pull style output, capable of driving a capacitive load with 3A peak currents. 3.4 Ground (GND) The ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return. 3.5 No Connect (NC) No internal connection.  2001-2015 Microchip Technology Inc. DS20001392E-page 7 TC1413/TC1413N 4.0 APPLICATION INFORMATION +5V 90% Input VDD = 16V 0V 1.0 µF 0.1 µF 1, 8 Input 10% tD1 tD2 tF VDD tR 90% 90% Output 2 6, 7 Output 10% 10% 0V CL = 1800 pF Inverting Driver TC1413 TC1413 TC1413N +5V 90% Input 4, 5 Input: 100 kHz, square wave, tRISE = tFALL  10 ns 0V VDD 10% tD1 90% tR Output 0V 10% 90% tD2 tF 10% Non-Inverting Driver TC1413N FIGURE 4-1: DS20001392E-page 8 Switching Time Test Circuit.  2001-2015 Microchip Technology Inc. TC1413/TC1413N 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example TC1413 e3 256 CPA^^ 1318 OR TC1413 CPA256 1318 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code RoHS Compliant JEDEC® designator for Matte Tin (Sn) This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2001-2015 Microchip Technology Inc. DS20001392E-page 9 TC1413/TC1413N 8-Lead SOIC (3.90 mm) Example TC1413C e3 1318 OA^^ 256 NNN OR TC1413 COA1318 256 8-Lead MSOP (3x3 mm) Example 1413E 318256 DS20001392E-page 10  2001-2015 Microchip Technology Inc. TC1413/TC1413N /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A 3/$1( L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2001-2015 Microchip Technology Inc. DS20001392E-page 11 TC1413/TC1413N /HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20001392E-page 12  2001-2015 Microchip Technology Inc. TC1413/TC1413N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2015 Microchip Technology Inc. DS20001392E-page 13 TC1413/TC1413N Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001392E-page 14  2001-2015 Microchip Technology Inc. TC1413/TC1413N      !"#$%& '  ! "# $% &"'"" ($)  % *++&&&!  !+$  2001-2015 Microchip Technology Inc. DS20001392E-page 15 TC1413/TC1413N 8$ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001392E-page 16  2001-2015 Microchip Technology Inc. TC1413/TC1413N UA Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2001-2015 Microchip Technology Inc. DS20001392E-page 17 TC1413/TC1413N 8-Lead Plastic Micro Small Outline Package (UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001392E-page 18  2001-2015 Microchip Technology Inc. TC1413/TC1413N APPENDIX A: REVISION HISTORY Revision E (February 2015) The following is the list of modifications: • Updated the values for electrostatic discharge in the Features and General Description columns. • Updated the Pin Description table in Section 3.0, Pin Descriptions. • Updated package marking information and drawings in Section 5.0, Packaging Information. • Minor grammatical and spelling corrections. Revision D (December 2012) • Added a note to each package outline drawing. Revision C (March 2003) • Undocumented changes. Revision B (May 2001) • Undocumented changes. Revision A (March 2001) • Original Release of this Document.  2001-2015 Microchip Technology Inc. DS20001392E-page 19 TC1413/TC1413N NOTES: DS20001392E-page 20  2001-2015 Microchip Technology Inc. TC1413/TC1413N PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Examples: a) b) Device: TC1413: 3A Single MOSFET Driver, Inverting TC1413N: 3A Single MOSFET Driver, Non-Inverting Temperature Range: C E Package: OA = Plastic SOIC, (150 mil Body), 8-lead OA713 = Plastic SOIC, (150 mil Body), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead * (Tape and Reel) PA = Plastic DIP (300 mil Body), 8-lead c) = = 0°C to +70°C -40°C to +85°C TC1413COA: 3A Single MOSFET driver, SOIC package, 0°C to +70°C. TC1413CPA: 3A Single MOSFET driver, PDIP package, 0°C to +70°C. TC1413EUA713:Tape and Reel, 3A Single MOSFET driver, MSOP package, -40°C to +85°C. a) TC1413NCPA: b) TC1413NEPA: c) TC1413NEUA: * MSOP package is only available in E-Temp.  2001-2015 Microchip Technology Inc. 3A Single MOSFET driver, PDIP package, 0°C to +70°C. 3A Single MOSFET driver, PDIP package, -40°C to +85°C. 3A Single MOSFET driver, MSOP package, -40°C to +85°C. DS20001392E-page 21 TC1413/TC1413N NOTES: DS20001392E-page 22  2001-2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-094-3 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2001-2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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