TC2054/2055/2186
50 mA, 100 mA, and 150 mA CMOS LDOs
with Shutdown and Error Output
Features
General Description
• Low Supply Current (55 µA Typical) for Longer
Battery Life
• Low Dropout Voltage: 140 mV (Typical) @
150 mA
• High Output Voltage Accuracy: ±0.4% (Typical)
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
• ERROR Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Fast Shutdown Reponse Time: 60 µs (Typical)
• Overcurrent and Overtemperature Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators
• Standard Output Voltage Options:
- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,
3.3V, 5.0V
The TC2054, TC2055 and TC2186 are high accuracy
(typically ±0.4%) CMOS upgrades for older (bipolar)
low dropout regulators. Designed specifically for
battery-operated systems, the devices’ total supply
current is typically 55 µA at full load (20 to 60 times
lower than in bipolar regulators).
Applications
•
•
•
•
•
•
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular / GSMS / PHS Phones
Pagers
VIN
5-Pin SOT-23A
Top View
VOUT 5
3
VOUT
ERROR
5
4
VOUT
TC2054
TC2055
TC2186
1 µF
1 µF
2
The TC2054, TC2055 and TC2186 are stable with a
low esr ceramic output capacitor of 1 µF and have a
maximum output current of 50 mA, 100 mA and
150 mA, respectively. This LDO Family also features a
fast response time (60 µs typically) when released from
shutdown.
Package Type
Typical Application
1 V
IN
The devices’ key features include low noise operation,
low dropout voltage – typically 45 mV (TC2054); 90 mV
(TC2055); and 140 mV (TC2186) at full load - and fast
response to step changes in load. An error output
(ERROR) is asserted when the devices are
out-of-regulation (due to a low input voltage or
excessive output current). Supply current is reduced to
0.5 µA (maximum) and both VOUT and ERROR are
disabled when the shutdown input is low. The devices
also incorporate overcurrent and overtemperature
protection.
1
GND TC2054
TC2055
TC2186
SHDN
ERROR
2
3
1M
VIN
4
GND SHDN
ERROR
Shutdown Control
(from Power Control Logic)
© 2009 Microchip Technology Inc.
DS21663D-page 1
TC2054/2055/2186
NOTES:
DS21663D-page 2
© 2009 Microchip Technology Inc.
TC2054/2055/2186
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ......................................................... 6.5V
Output Voltage ............................... (-0.3) to (VIN + 0.3)
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods my
affect device reliability.
Operating Temperature .................. -40°C < TJ< 125°C
Storage Temperature ......................... -65°C to +150°C
Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V
ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
Note 1
mA
TC2054
Input Operating Voltage
Maximum Output Current
Output Voltage
IOUTMAX
VOUT
VOUT Temperature
Coefficient
TCVOUT
Line Regulation
Load Regulation
Conditions
50
—
—
100
—
—
TC2055
150
—
—
TC2186
VR - 2.0% VR ± 0.4% VR + 2.0%
V
Note 2
—
20
—
ppm/°C Note 3
—
40
—
ΔVOUT/
ΔVIN
—
0.05
0.5
%
(VR + 1V) < VIN < 6V
ΔVOUT/
VOUT
-1.0
0.33
+1.0
%
TC2054;TC2055 IL = 0.1 mA to IOUTMAX
-2.0
0.43
+2.0
TC2186
IL = 0.1 mA to IOUTMAX
Note 6
Dropout Voltage, Note 7
VIN – VOUT
—
2
—
—
45
70
mV
IL = 100 µA
IL = 50 mA
—
90
140
TC2015; TC2185 IL = 100 mA
—
140
210
TC2185
IL = 150 mA
Note 7
Supply Current
IIN
—
55
80
µA
SHDN = VIH, IL=0
IINSD
—
0.05
0.5
µA
SHDN = 0V
Power Supply Rejection
Ratio
PSRR
—
50
—
dB
FRE ≤ 100 kHz
Output Short Circuit Current
IOUTSC
160
300
—
mA
VOUT = 0V
Shutdown Supply Current
Note 1:
2:
3:
4:
5:
6:
The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
TCVOUT =
6
(V
–V
) × 10
OUTMAX
OUTMIN
----------------------------------------------------------------------------------------V
× ΔT
OUT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value at a 1V differential.
8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
10: Hysteresis voltage is referenced by VR.
11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
© 2009 Microchip Technology Inc.
DS21663D-page 3
TC2054/2055/2186
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
ΔVOUT/ΔPD
—
0.04
—
V/W
Thermal Shutdown Die
Temperature
TSD
—
160
—
°C
Output Noise
eN
—
600
—
nV /
√Hz
IL = IOUTMAX, F = 10 kHz
Response Time
(from Shutdown Mode)
tR
—
60
—
µs
VIN = 4V
CIN = 1 µF, COUT = 10 µF
IL = 0.1 mA, Note 11
SHDN Input High Threshold
VIH
60
—
—
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low Threshold
VIL
—
—
15
%VIN
VIN = 2.5V to 6.0V
VINMIN
1.0
—
—
V
Output Logic Low Voltage
VOL
—
—
400
mV
ERROR Threshold Voltage
VTH
—
0.95 x VR
—
V
ERROR Positive Hysteresis
VHYS
—
50
—
mV
Note 10
VOUT to ERROR Delay
tDELAY
—
2
—
ms
VOUT from VR = 3V to 2.8V
RERROR
—
126
—
Ω
VDD = 2.5V, VOUT = 2.5V
Thermal Regulation
Conditions
Note 8
SHDN Input
ERROR OUTPUT
Minimum VIN Operating
Voltage
Resistance from ERROR to
GND
Note 1:
2:
3:
4:
5:
6:
IOL = 0.1 mA
1 mA Flows to ERROR,
IOL = 1 mA, VIN = 2V
See Figure 4-2
The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
TCVOUT =
6
(V
–V
) × 10
OUTMAX
OUTMIN
----------------------------------------------------------------------------------------V OUT × ΔT
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value at a 1V differential.
8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
10: Hysteresis voltage is referenced by VR.
11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Extended Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
θJA
—
255
—
°C/W
Conditions
Temperature Ranges:
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
DS21663D-page 4
© 2009 Microchip Technology Inc.
TC2054/2055/2186
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
0
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-20
PSRR (dB)
PSRR (dB)
-20
0
IOUT = 100 µA
COUT = 1 µF Ceramic
-40
-60
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-40
-60
-80
-80
IOUT = 150 mA
COUT = 10 µF Ceramic
-100
-100
10
10
100
100
1000
1,000
10k
10,000
100k
100,000
10
10
1M
1,000,000
100
100
1000
1,000
FIGURE 2-4:
Ratio.
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-20
PSRR (dB)
-20
PSRR (dB)
Power Supply Rejection
0
0
-40
-60
-80
100k
100,000
1M
1,000,000
f (Hz)
f (Hz)
FIGURE 2-1:
Ratio.
10k
10,000
Power Supply Rejection
VINDC = 4V
VINAC = 100 mVp-p
VOUTDC = 3V
-40
-60
-80
IOUT = 150 mA
COUT = 1 µF Ceramic
IOUT = 150 mA
COUT = 10 µF Tantalum
-100
-100
10
10
100
100
1,000
1000
10,000
10k
100,000
100k
10
10
1,000,000
1M
100
100
1000
1,000
f (Hz)
FIGURE 2-2:
Ratio.
10k
10,000
100k
100,000
1M
1,000,000
f (Hz)
Power Supply Rejection
FIGURE 2-5:
Ratio.
Power Supply Rejection
0.160
VOUT = 1.8V
0.140
0.120
1
0.100
COUT = 1 µF
DOV (V)
Noise (µV/√Hz)
10
0.1
T = 25°C
T = 130°C
0.080
T = -45°C
0.060
0.01
0.001
0.01
FIGURE 2-3:
0.040
0.020
0.1
1
10
Frequency (kHz)
100
1000
Output Noise vs. Frequency.
© 2009 Microchip Technology Inc.
0.000
0
100
50
150
ILOAD (mA)
FIGURE 2-6:
Dropout Voltage vs. ILOAD.
DS21663D-page 5
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
65.00
1.9
VOUT = 1.8V
1.88
63.00
1.86
1.84
59.00
VOUT (V)
IDD (μA)
61.00
VIN = 2.8V
1.82
VIN = 2.8V
1.8
1.78
57.00
1.76
1.74
55.00
1.72
1.7
53.00
-45
5
55
105
0
155
15
30
45
60
FIGURE 2-7:
IDD vs. Temperature.
FIGURE 2-10:
Current.
2.9
120
135
150
Output Voltage vs. Output
Temp = +130˚C
2.8
VIN = 6.0V
VIN = 3.8V
2.75
VOUT (V)
2.75
VOUT (V)
105
VOUT = 2.8V
IOUT = 0.1mA
2.85
VIN = 6.5V
2.8
2.7
2.65
Temp = +25˚C
Temp = -45˚C
2.7
2.65
2.6
2.6
2.55
2.55
2.5
2.5
-50
-35
-20
-5
10
25
40
55
70
85 100
115 130
3.5
145
4
4.5
5
FIGURE 2-8:
Temperature.
Output Voltage vs.
FIGURE 2-11:
Voltage.
1.9
6
6.5
7
Output Voltage vs. Supply
1.9
VOUT = 1.8V
IOUT = 0.1mA
1.88
5.5
VIN (V)
Temperature (˚C)
VOUT = 1.8V
IOUT = 0.1mA
1.88
1.86
1.86
1.84
VIN = 6.0V
1.84
VIN = 6.5V
1.82
VOUT (V)
VOUT (V)
90
2.9
VOUT = 2.8V
IOUT = 0.1mA
2.85
75
ILOAD (mA)
Temperature (°C)
1.8
1.78
VIN = 2.8V
Temp = +130˚C
1.82
1.8
1.78
Temp = +25˚C
Temp = -45˚C
1.76
1.76
1.74
1.74
1.72
1.72
1.7
1.7
-50
-35
-20
-5
10
25
40
55
70
85
100
115 130 145
2.7
3.2
FIGURE 2-9:
Temperature.
DS21663D-page 6
Output Voltage vs.
3.7
4.2
4.7
5.2
5.7
6.2
6.7
VIN (V)
Temperature (˚C)
FIGURE 2-12:
Voltage.
Dropout Voltage vs. Supply
© 2009 Microchip Technology Inc.
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
V IN = 3.8V
VOUT = 2.8V
C IN = 1 μF Ceramic
V IN = 3.0V
VOUT = 2.8V
C IN = 1μF Ceramic
C OUT= 1 μF Ceramic
Frequency = 1 KHz
C OUT= 10μF Ceramic
Frequency = 10KHz
V OUT
100mV/DIV
V OUT
100mV / DIV
Load Current
Load Current
150mA
Load
100μA
FIGURE 2-13:
Load Transient Response.
150mA
Load
100μA
FIGURE 2-16:
Load Transient Response.
Load Transient Response in Dropout Mode
V IN = 4.0V
VOUT = 3.0V
C OUT = 10μF
C BYP = 0.01μF
I OUT = 100μA
VOUT
100mV/DIV
V SHDN
150mA
VIN = 3.105V
VOUT = 3.006V
CIN = 1μF Ceramic
COUT = 1μF Ceramic
RLOAD = 20Ω
FIGURE 2-14:
Dropout Mode.
100μA
V OUT
Load Transient Response in
FIGURE 2-17:
VOUT = 2.8V
C OUT= 1μF Ceramic
C BYP = 470pF
I OUT= 100μA
Shutdown Delay.
V SHDN
50mV / DIV
V OUT
2V / DIV
Input Voltage
V OUT
6V
4V
V IN = 4.0V
VOUT = 3.0V
C OUT = 10μF
C BYP = 0.01μF
I OUT = 100μA
FIGURE 2-15:
Line Transient Response.
© 2009 Microchip Technology Inc.
FIGURE 2-18:
Shutdown Wake-up Time.
DS21663D-page 7
TC2054/2055/2186
Note: Unless otherwise indicated, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
RPULLUP = 100kΩ
IOUT = 0.3mA
VIN
1V/Div
3.42V
2.8V
VOUT
1V/Div
3.0V
2.8V
VERROR 2V/Div
0V
FIGURE 2-19:
DS21663D-page 8
VOUT to ERROR Delay.
© 2009 Microchip Technology Inc.
TC2054/2055/2186
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Symbol
1
VIN
2
GND
3
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is
applied to this input. The regulator enters shutdown when a logic low is applied
to this input. During shutdown, output voltage falls to zero, ERROR is open
circuited and supply current is reduced to 0.5 µA (maximum).
4
ERROR
Out-of-Regulation Flag. (Open-drain output). This output goes low when VOUT is
out-of-tolerance by approximately -5%.
5
VOUT
3.1
Description
Unregulated supply input.
Ground terminal.
Regulated voltage output.
Unregulated Supply Input (VIN)
3.4
Out-of-Regulation Flag (ERROR)
Connect the unregulated input supply to the VIN pin. If
there is a large distance between the input supply and
the LDO regulator, some input capacitance is
necessary for proper operation. A 1 µF capacitor,
connected from VIN to ground, is recommended for
most applications.
The open-drain ERROR flag provides indication that
the regulator output voltage is not in regulation. The
ERROR pin will be low when the output is typically
below 5% of its specified value.
3.2
Connect the output load to VOUT of the LDO. Also
connect one side of the LDO output decoupling
capacitor as close as possible to the VOUT pin.
Ground Terminal (GND)
Connect the unregulated input supply ground return to
GND. Also connect one side of the 1 µF typical input
decoupling capacitor close to this pin and one side of
the output capacitor COUT to this pin.
3.3
3.5
Regulated Voltage Output (VOUT)
Shutdown Control Input (SHDN)
The regulator is fully enabled when a logic-high is
applied to SHDN. The regulator enters shutdown when
a logic-low is applied to this input. During shutdown, the
output voltage falls to zero and the supply current is
reduced to 0.5 µA (maximum).
© 2009 Microchip Technology Inc.
DS21663D-page 9
TC2054/2055/2186
NOTES:
DS21663D-page 10
© 2009 Microchip Technology Inc.
TC2054/2055/2186
4.0
DETAILED DESCRIPTION
The TC2054, TC2055 and TC2186 are precision fixed
output voltage regulators. (If an adjustable version is
desired, refer to the TC1070/TC1071/TC1187 data
sheet (DS21353). Unlike bipolar regulators, the
TC2054, TC2055 and TC2186 supply current does not
increase with load current. In addition, VOUT remains
stable and within regulation over the entire 0 mA to
maximum output current operating load range.
Figure 4-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05 µA
(typical), VOUT falls to zero volts, and ERROR is
open-circuited.
VIN
VOUT
BATTERY
VOUT
1 µF
C1
1 µF
TC2054
GND TC2055
TC2186
V+
SHDN
4.1
HYSTERESIS (VHYS)
VTH
ERROR
VIH
VOL
FIGURE 4-2:
4.2
Error Output Operation.
Output Capacitor
A 1 µF (minimum) capacitor from VOUT to ground is
required. The output capacitor should have an effective
series resistance of 0.01Ω. to 5Ω for VOUT = 2.5V, and
0.05Ω. to 5Ω for VOUT < 2.5V. Ceramic, tantalum and
aluminum electrolytic capacitors can be used. (Since
many aluminum electrolytic capacitors freeze at
approximately
-30°C,
solid
tantalums
are
recommended for applications operating below -25°C).
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
ERROR
Shutdown Control
(to CMOS Logic or Tie C2 Required Only
to VIN if unused) if ERROR is used as a
Processor RESET Signal
(See Text)
FIGURE 4-1:
VOUT
R1
1MΩ
BATTLOW
or RESET
0.2 µF
C2
Typical Application Circuit.
ERROR Open-Drain Output
ERROR is driven low whenever VOUT falls out of
regulation by more than -5% (typical). This condition
may be caused by low input voltage, output current
limiting or thermal limiting. The ERROR threshold is 5%
below rated VOUT regardless of the programmed
output voltage value (e.g. ERROR = VOL at 4.75V
(typical) for a 5.0V regulator and 2.85V (typical) for a
3.0V regulator). ERROR output operation is shown in
Figure 4-2.
4.3
Input Capacitor
A 1 µF capacitor should be connected from VIN to GND
if there is more than 10 inches of wire between the
regulator and this AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitors can be used (since many
aluminum
electrolytic
capacitors
freeze
at
approximately -30°C, solid tantalum are recommended
for applications operating below -25°C). When
operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
Note that ERROR is active when VOUT falls to VTH, and
inactive when VOUT rises above VTH by VHYS.
As shown in Figure 4-1, ERROR can be used as a
battery low flag or as a processor RESET signal (with
the addition of timing capacitor C2). R1 x C2 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 ms to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
The ERROR pin sink current is self-limiting to
approximately 18 mA.
© 2009 Microchip Technology Inc.
DS21663D-page 11
TC2054/2055/2186
NOTES:
DS21663D-page 12
© 2009 Microchip Technology Inc.
TC2054/2055/2186
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when the die temperature exceeds
approximately 160°C. The regulator remains off until
the die temperature cools to approximatley 150°C.
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 3.0V +10%
VOUTMIN
= 2.7V – 2.5%
ILOADMAX = 40 mA
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current.
TAMAX
Find:
1. Actual power dissipation
Equation 5-1 is used to calculate worst case power
dissipation:
EQUATION 5-1:
= +55°C
2. Maximum allowable dissipation
Actual power dissipation:
P D ≈ ( V INMAX – V OUTMIN )I LOADMAX
P D = ( V INMAX – V OUTMIN )I LOADMAX
Where:
= [ ( 3.0 × 1.1 ) – ( 2.7 × 0.975 ) ]40 × 10
PD
= Worst-case actual power dissipation
VINMAX
= Maximum voltage on VIN
VOUTMIN
= Minimum regulator output voltage
= 26.7mW
Maximum allowable power dissipation:
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (125 °C) and the thermal resistance from
junction-to-air (θJA). The 5-Pin SOT-23A package has
a θJA of approximately 220°C/Watt when mounted on a
typical two layer FR4 dielectric copper clad PC board.
EQUATION 5-2:
T JMAX – T AMAX
P DMAX = -------------------------------------θ JA
Where all terms are previously defined.
© 2009 Microchip Technology Inc.
–3
T JMAX – T AMAX
P DMAX = -------------------------------------θ JA
– 55= 125
-------------------220
= 318mW
In this example, the TC2054 dissipates a maximum of
only 26.7 mW; far below the allowable limit of 318 mW.
In a similar manner, Equation 5-1 and Equation 5-2 can
be used to calculate maximum current and/or input
voltage limits.
5.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θJA and, therefore,
increase the maximum allowable power dissipation
limit.
DS21663D-page 13
TC2054/2055/2186
NOTES:
DS21663D-page 14
© 2009 Microchip Technology Inc.
TC2054/2055/2186
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SOT-23
5
TABLE 6-1:
4
2
TC2054
TC2055
TC2186
1.8
SA
TA
VA
2.5
SB
TB
VB
2.6
SH
TH
VH
2.7
SC
TC
VC
2.8
SD
TD
VD
2.85
SE
TE
VE
3
Legend: XX...X
NN
6.2
5
(V)
XXNN
1
Example:
PART NUMBER CODE AND
TEMPERATURE RANGE
3.0
SF
TF
VF
3.3
SG
TG
VG
5.0
SK
TJ
VJ
4
SA25
1
2
3
Customer-specific information
Alphanumeric traceability code
Taping Information
Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
for 713 Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size:
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8 mm
4 mm
3000
7 in.
5-Pin SOT-23A
© 2009 Microchip Technology Inc.
DS21663D-page 15
TC2054/2055/2186
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