TC427EUA713

Product Change Notification - JAON-17JDSD193 - 05 Aug 2016 - CCB 2596 Final Notic... Page 1 of 3  Search ... PRODUCTS | APPLICATIONS | DESIGN SUPPORT | TRAINING | SAMPLE AND BUY | ABOUT US | CONTACT US | myMicrochip Login Product Change Notification - JAON-17JDSD193   Date: 05 Aug 2016 Product Category: Analog (Thermal, Power Management & Safety) Notification subject: CCB 2596 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K wafer technology available in 8L MSOP package at MTAI Notification text: assembly site. PCN Status: Final notification Microchip Parts Affected: Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN. NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls). Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K wafer technology available in 8L MSOP package at MTAI assembly site. Pre Change: Gold (Au) bond wire Post Change: Palladium coated copper with gold flash (CuPdAu) bond wire Pre and Post Change Summary: Pre Change Post Change Assembly Site MTAI assembly site MTAI assembly site Wire material Au wire CuPdAu wire Die attach material 8390A 8390A Molding compound material G600 G600 Lead frame material CDA194 CDA194 Impacts to Data Sheet: None Change Impact: None Reason for Change: To improve manufacturability and qualify palladium coated copper with gold flash (CuPdAu) bond wire. Change Implementation Status: In Progress http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-17JDSD193... 8/8/2016 Product Change Notification - JAON-17JDSD193 - 05 Aug 2016 - CCB 2596 Final Notic... Page 2 of 3 Estimated First Ship Date: September 4, 2016 (date code: 1635) NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts. Time Table Summary: June 2016 WW August 2016 July 2016 September 2016 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 Initial PCN Issue Date X Qual Report Availability X Final PCN Issue Date X Estimated Implementation Date X Method to Identify Change: Traceability code Qualification Report: Please open the attachments included with this PCN labeled as PCN_#_Qual Report. Revision History: June 9, 2016: Issued initial notification. August 5, 2016: Issued final notification. Attached the qualification report. Provided estimated first ship date on September 4, 2016. The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products. Attachment(s): PCN_JAON-17JDSD193_Qual_Report.pdf PCN_JAON-17JDSD193_Affected_CPN.pdf PCN_JAON-17JDSD193_Affected_CPN.xls Please contact your local Microchip sales office with questions or concerns regarding this notification. Terms and Conditions: If you wish to change your product/process change notification (PCN) profile please log on to our website at http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from the left navigation bar. To opt out of future offer or information emails (other than product change notification emails), click here to go to microchipDIRECT and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services."  Products | Applications | Design Support | Training | Sample and Buy | About Us |  Contact Us | Legal | Investors | Careers | Support http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-17JDSD193... 8/8/2016 JAON-17JDSD193 - CCB 2596 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K wafer technology available in 8L MSOP package at MTAI assembly site. Affected Catalog Part Numbers (CPN) PCN_JAON-17JDSD193 CATALOG_PART_NBR TC1410EUA TC1410EUA713 TC1410NEUA TC1410NEUA713 TC1410NVUA TC1410NVUA713 TC1411EUA TC1411EUA713 TC1411NEUA TC1411NEUA713 TC1411NVUA TC1411NVUA713 TC1411VUA TC1411VUA713 TC1412EUA TC1412EUA713 TC1412NEUA TC1412NEUA713 TC1413EUA TC1413EUA713 TC1413NEUA TC1413NEUA713 TC1426CUA TC1426CUA713 TC1427CUA TC1427CUA713 TC1428CUA TC1428CUA713 TC426CUA TC426CUA713 TC426EUA TC426EUA713 TC427CUA TC427CUA713 TC427EUA TC427EUA713 TC428CUA TC428CUA713 TC428EUA TC428EUA713 TC4426ACUA TC4426ACUA713 TC4426AEUA Page 1 of 2 JAON-17JDSD193 - CCB 2596 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 40K wafer technology available in 8L MSOP package at MTAI assembly site. Affected Catalog Part Numbers (CPN) PCN_JAON-17JDSD193 CATALOG_PART_NBR TC4426AEUA713 TC4426AVUA TC4426AVUA713 TC4426CUA TC4426CUA713 TC4426EUA TC4426EUA713 TC4426VUA TC4426VUA713 TC4427AEUA TC4427AEUA713 TC4427AVUA TC4427AVUA713 TC4427CUA TC4427CUA713 TC4427EUA TC4427EUA713 TC4427VUA TC4427VUA713 TC4428AEUA TC4428AEUA713 TC4428AVUA TC4428AVUA713 TC4428CUA TC4428CUA713 TC4428EUA TC4428EUA713 TC4428VUA TC4428VUA713 Page 2 of 2