TC426/TC427/TC428
1.5A Dual High-Speed Power MOSFET Drivers
Package Type
Features:
• High-Speed Switching (CL = 1000 pF): 30 nsec
• High Peak Output Current: 1.5A
• High Output Voltage Swing:
- VDD -25 mV
- GND +25 mV
• Low Input Current (Logic ‘0’ or ‘1’): 1 A
• TTL/CMOS Input Compatible
• Available in Inverting and Noninverting
Configurations
• Wide Operating Supply Voltage:
- 4.5V to 18V
• Current Consumption:
- Inputs Low – 0.4 mA
- Inputs High – 8 mA
• Single Supply Operation
• Low Output Impedance: 6
• Pinout Equivalent of DS0026 and MMH0026
• Latch-Up Resistant: Withstands > 500 mA
Reverse Current
• ESD Protected: 2 kV
Switch Mode Power Supplies
Pulse Transformer Drive
Clock Line Driver
Coax Cable Driver
Device Selection Table
Part
Number
Package
Configuration
Temp.
Range
TC426COA
TC426CPA
TC426EOA
TC426EPA
TC426IJA
TC426MJA
8-Pin SOIC
8-Pin PDIP
8-Pin SOIC
8-Pin PDIP
8-Pin CERDIP
8-Pin CERDIP
Inverting
Inverting
Inverting
Inverting
Inverting
Inverting
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-25°C to +85°C
-55°C to +125°C
TC427COA
TC427CPA
TC427EOA
TC427EPA
TC427IJA
TC427MJA
8-Pin SOIC
8-Pin PDIP
8-Pin SOIC
8-Pin PDIP
8-Pin CERDIP
8-Pin CERDIP
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
Noninverting
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-25°C to +85°C
-55°C to +125°C
TC428COA
TC428CPA
TC428EOA
TC428EPA
TC428IJA
TC428MJA
8-Pin SOIC
8-Pin PDIP
8-Pin SOIC
8-Pin PDIP
8-Pin CERDIP
8-Pin CERDIP
Complementary
Complementary
Complementary
Complementary
Complementary
Complementary
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
-25°C to +85°C
-55°C to +125°C
2002-2012 Microchip Technology Inc.
8 NC
NC 1
IN A 2
GND 3
7 OUT A
TC426
IN B 4
NC 1
7 OUT A
TC427
Inverting
6 VDD
2, 4
7, 5
Noninverting
5 OUT B
8 NC
NC 1
IN A 2
IN B 4
7, 5
8 NC
IN B 4
GND 3
2, 4
5 OUT B
IN A 2
GND 3
6 VDD
2
7
4
5
7 OUT A
TC428
6 VDD
5 OUT B
Complementary
NC = No internal connection
General Description:
The TC426/TC427/TC428 are dual CMOS high-speed
drivers. A TTL/CMOS input voltage level is translated
into a rail-to-rail output voltage level swing. The CMOS
output is within 25 mV of ground or positive supply.
The low-impedance, high-current driver outputs swing
a 1000 pF load 18V in 30 nsec. The unique current and
voltage drive qualities make the TC426/TC427/TC428
ideal power MOSFET drivers, line drivers, and DC-toDC converter building blocks.
Applications:
•
•
•
•
8-Pin PDIP/SOIC/CERDIP
Input logic signals may equal the power supply voltage.
Input current is a low 1 A, making direct interface
to CMOS/bipolar switch-mode power supply control
ICs possible, as well as open-collector analog
comparators.
Quiescent power supply current is 8 mA maximum. The
TC426 requires 1/5 the current of the pin-compatible
bipolar DS0026 device. This is important in DC-to-DC
converter applications with power efficiency constraints
and high-frequency switch-mode power supply
applications. Quiescent current is typically 6 mA when
driving a 1000 pF load 18V at 100 kHz.
The inverting TC426 driver is pin-compatible with the
bipolar DS0026 and MMH0026 devices. The TC427 is
noninverting; the TC428 contains an inverting and noninverting driver.
Other pin compatible driver families are the TC1426/
TC1427/TC1428,
TC4426/TC4427/TC4428
and
TC4426A/TC4427A/TC4428A.
DS21415D-page 1
TC426/TC427/TC428
Functional Block Diagram
V+
≈500 μA
≈2.5 μA
TC426
TC427
TC428
Noninverting
Output
Inverting
Output
(TC427)
(TC426)
Input
GND
NOTE: TC428 has one inverting and one noninverting driver.
Ground any unused driver input.
DS21415D-page 2
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings*
Supply Voltage ..................................................... +20V
Input Voltage, Any Terminal
................................... VDD + 0.3V to GND – 0.3V
Power Dissipation (TA 70°C)
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
SOIC ....................................................... 470 mW
Derating Factor
PDIP....................................................... 8 mW/°C
CERDIP .............................................. 6.4 mW/°C
SOIC ...................................................... 4 mW/°C
Operating Temperature Range
C Version ........................................ 0°C to +70°C
I Version ....................................... -25°C to +85°C
E Version...................................... -40°C to +85°C
M Version ................................... -55°C to +125°C
Storage Temperature Range.............. -65°C to +150°C
TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C with 4.5V VDD18V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
Logic 1, High Input Voltage
2.4
—
—
V
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-1
—
1
A
0VVINVDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
VOL
Low Output Voltage
—
—
0.025
V
ROH
High Output Resistance
—
10
15
IOUT = 10 mA, VDD = 18V
ROL
Low Output Resistance
—
6
10
IOUT = 10 mA, VDD = 18V
IPK
Peak Output Current
—
1.5
—
A
Switching Time (Note 1)
tR
Rise Time
—
—
30
nsec
Figure 3-1, Figure 3-2
tF
Fall Time
—
—
30
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
50
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
—
—
—
—
8
0.4
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
2002-2012 Microchip Technology Inc.
DS21415D-page 3
TC426/TC427/TC428
TC426/TC427/TC428 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD18V, unless otherwise noted.
Input
VIH
Logic 1, High Input Voltage
2.4
—
—
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
V
IIN
Input Current
-10
—
10
A
0VVINVDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
VOL
Low Output Voltage
—
—
0.025
V
ROH
High Output Resistance
—
13
20
IOUT = 10 mA, VDD = 18V
ROL
Low Output Resistance
—
8
15
IOUT = 10 mA, VDD = 18V
Switching Time (Note 1)
tR
Rise Time
—
—
60
nsec
Figure 3-1, Figure 3-2
tF
Fall Time
—
—
60
nsec
Figure 3-1, Figure 3-2
tD1
Delay Time
—
—
75
nsec
Figure 3-1, Figure 3-2
tD2
Delay Time
—
—
120
nsec
Figure 3-1, Figure 3-2
—
—
—
—
12
0.6
mA
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Power Supply
Power Supply Current
IS
Note
1:
Switching times ensured by design.
DS21415D-page 4
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin PDIP,
SOIC, CERDIP)
Symbol
1
NC
Description
No Internal Connection.
2
IN A
Control Input A, TTL/CMOS compatible logic input.
3
GND
Ground.
4
IN B
5
OUT B
CMOS totem-pole output.
6
VDD
Supply input, 4.5V to 18V.
7
OUT A
CMOS totem-pole output.
8
NC
2002-2012 Microchip Technology Inc.
Control Input B, TTL/CMOS compatible logic input.
No internal Connection.
DS21415D-page 5
TC426/TC427/TC428
3.0
APPLICATIONS INFORMATION
3.4
3.1
Supply Bypassing
The supply current vs frequency and supply current
vs capacitive load characteristic curves will aid in
determining power dissipation calculations.
Charging and discharging large capacitive loads
quickly requires large currents. For example, charging
a 1000 pF load to 18V in 25 nsec requires an 0.72A
current from the device power supply.
To ensure low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for supply bypassing. Low-inductance ceramic
disk capacitors with short lead lengths (< 0.5 in.) should
be used. A 1 F film capacitor in parallel with one or two
0.1 F ceramic disk capacitors normally provides
adequate bypassing.
3.2
Grounding
The TC426 and TC428 contain inverting drivers.
Ground potential drops developed in common ground
impedances from input to output will appear as
negative feedback and degrade switching speed
characteristics.
Individual ground returns for the input and output
circuits or a ground plane should be used.
3.3
Input Stage
The input voltage level changes the no-load or
quiescent supply current. The N-channel MOSFET
input stage transistor drives a 2.5 mA current source
load. With a logic ‘1’ input, the maximum quiescent
supply current is 8 mA. Logic ‘0’ input level signals
reduce quiescent current to 0.4 mA maximum.
Minimum power dissipation occurs for logic ‘0’ inputs
for the TC426/TC427/TC428. Unused driver inputs
must be connected to VDD or GND.
The drivers are designed with 100 mV of hysteresis.
This provides clean transitions and minimizes output
stage current spiking when changing states. Input
voltage thresholds are approximately 1.5V, making the
device TTL compatible over the 4.5V to 18V supply
operating range. Input current is less than 1 A over
this range.
The TC426/TC427/TC428 may be directly driven by
the TL494, SG1526/1527, SG1524, SE5560, and
similar switch-mode power supply integrated circuits.
DS21415D-page 6
Power Dissipation
The TC426/TC427/TC428 CMOS drivers have greatly
reduced quiescent DC power consumption. Maximum
quiescent current is 8 mA compared to the DS0026 40
mA specification. For a 15V supply, power dissipation
is typically 40 mW.
Two other power dissipation components are:
• Output stage AC and DC load power.
• Transition state power.
Output stage power is:
Po = PDC + PAC
= Vo (IDC) + f CL VS2
Where:
Vo
IDC
f
Vs
= DC output voltage
= DC output load current
= Switching frequency
= Supply voltage
In power MOSFET drive applications the PDC term is
negligible. MOSFET power transistors are high-impedance, capacitive input devices. In applications where
resistive loads or relays are driven, the PDC component
will normally dominate.
The magnitude of PAC is readily estimated for several
cases:
A.
B.
1. f
2. CL
3. Vs
4. PAC
= 200 kHZ
=1000 pf
= 18V
= 65 mW
1. f
2. CL
3. Vs
4. PAC
= 200 kHz
=1000 pf
= 15V
= 45 mW
During output level state changes, a current surge will
flow through the series connected N and P channel
output MOSFETS as one device is turning “ON” while
the other is turning “OFF”. The current spike flows only
during output transitions. The input levels should not be
maintained between the logic ‘0’ and logic ‘1’ levels.
Unused driver inputs must be tied to ground and
not be allowed to float. Average power dissipation will
be reduced by minimizing input rise times. As shown in
the characteristic curves, average supply current is
frequency dependent.
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
VDD = 18V
VDD = 18V
1 μF
Input
0.1 μF
1
1 μF
Output
Input
0.1 μF
1
Output
CL = 1000 pF
CL = 1000 pF
2
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
2
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
TC426
(1/2 TC428)
TC427
(1/2 TC428)
+5V
90%
+5V
Input
90%
Input
10%
0V
tD1
tD2
tF
18V
0V
tR
10%
18V
90%
90%
tD1
90%
10%
10%
0V
FIGURE 3-1:
Time Test Circuit
90%
tD2
tR
Output
Output
tF
10%
0V
10%
FIGURE 3-2:
Noninverting Driver
Switching Time Test Circuit
Inverting Driver Switching
+15V
30.
29.
28.
4.7 μF
1N4001
6
2
fIN = 10 kHz
1/2
TC426
–
7
FIGURE 3-3:
+
1N4001
26.
25.
24.
VOUT
23.
10 μF
3
27.
VOUT (V)
+
–
0.1 μF
+
–
47 μF
22.
0
10 20 30 40 50 60 70 80 90 100
IOUT (mA)
0
10 20 30 40 50 60 70 80 90 100
Voltage Doubler
+15V
-5
-6
+
-7
4.7 μF
-8
VOUT (V)
0.1 μF
–
2
fIN = 10 kHz
6
1/2
TC426
3
+
7
–
VOUT
1N4001
-9
-10
-11
-12
10 μF
1N4001
–
+
47 μF
-13
-14
IOUT (mA)
FIGURE 3-4:
Voltage Inverter
2002-2012 Microchip Technology Inc.
DS21415D-page 7
TC426/TC427/TC428
4.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Rise and Fall Times vs.
Supply Voltage
70
DELAY TIME (ns)
tR
tF
tD2
70
50
tD1
0
5
10
15
SUPPLY VOLTAGE (V)
20
5
0
70
60
50
tD1
Rise and Fall Times vs.
Capacitive Load
400 kHz
TA = +25°C
VDD = 18V
100
50
40
200 kHz
30
10
20 kHz
0
1
10
Supply Current vs. Frequency
100
1000
CAPACITIVE LOAD (pF)
10
10K
High Output vs. Voltage
VDD = 18V
TA = +25°C
5V
10
⎥ VDD – VOUT ⎥ (V)
1.76
10V
10K
1.20
TA = +25°C
20
100
1000
CAPACITIVE LOAD (pF)
Low Output vs. Voltage
2.20
TA = +25°C
CL = 1000 pF
tF
20
50
25
75 100 125 150
TEMPERATURE (°C)
30
tR
60
10
0
25
50
75 100 125 150
TEMPERATURE (°C)
TIME (ns)
80
30
-25
0
1K
TA = +25°C
VDD = 18V
70
SUPPLY CURRENT (mA)
DELAY TIME (ns)
0
-25
20
80
tD2
40
SUPPLY CURRENT (mA)
10
15
SUPPLY VOLTAGE (V)
Supply Current vs.
Capacitive Load
100
90
tF
20
10
Delay Times vs. Temperature
CL = 1000 pF
VDD = 18V
25
15
30
10
tR
30
60
40
CL = 1000 pF
VDD = 18V
35
VDD = 8V
1.32
13V
0.88
18V
0.44
OUTPUT VOLTAGE (V)
TIME (ns)
40
20
CL = 1000 pF
TA = +25°C
80
50
30
40
90
CL = 1000 pF
TA = +25°C
60
Rise and Fall Times vs.
Temperature
Delay Times vs. Supply Voltage
TIME (ns)
Note:
VDD = 5V
0.96
0.72
10V
0.48
15V
0.24
0
1
10
100
FREQUENCY (kHz)
DS21415D-page 8
1000
0
10 20 30 40 50 60 70 80 90 100
CURRENT SOURCED (mA)
0
10 20 30 40 50 60 70 80 90 100
CURRENT SUNK (mA)
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
TYPICAL CHARACTERISTICS (CONTINUED)
Supply Voltage vs.
Quiescent Supply Current
Supply Voltage vs.
Quiescent Supply Current
20
No Load
Both Inputs Logic ‘1’
TA = +25°C
15
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
20
10
5
0
15
10
5
0
1
2
3
4
5
SUPPLY CURRENT (mA)
No Load
Both Inputs Logic ‘0’
TA = +25°C
6
0
50
100 150 200 250
SUPPLY CURRENT (mA)
300
Thermal Derating Curves
1600
MAX. POWER (mW)
1400
8-Pin DIP
1200
8-Pin CERDIP
1000
800
8-Pin SOIC
600
400
200
0
0
10
20
30
40
50
60
70
80
90
100
110
120
AMBIENT TEMPERATURE (°C)
2002-2012 Microchip Technology Inc.
DS21415D-page 9
TC426/TC427/TC428
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
Pin 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
DS21415D-page 10
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
5.3
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
2002-2012 Microchip Technology Inc.
DS21415D-page 11
TC426/TC427/TC428
Package Dimensions (Continued)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin CERDIP (Narrow)
.110 (2.79)
.090 (2.29)
Pin 1
.300 (7.62)
.230 (5.84)
.020 (0.51) Min.
.055 (1.40) Max.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.200 (5.08)
.160 (4.06)
.040 (1.02)
.020 (0.51)
.150 (3.81)
Min.
.200 (5.08)
.125 (3.18)
.015 (0.38)
.008 (0.20)
3° Min.
.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)
Dimensions: inches (mm)
DS21415D-page 12
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
Package Dimensions (Continued)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
Pin 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) Typ.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° Max.
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
2002-2012 Microchip Technology Inc.
DS21415D-page 13
TC426/TC427/TC428
6.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
DS21415D-page 14
2002-2012 Microchip Technology Inc.
TC426/TC427/TC428
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2002-2012 Microchip Technology Inc.
DS21415D-page 15
TC426/TC427/TC428
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FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
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Device: TC426/TC427/TC428
Literature Number: DS21415D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21415D-page 16
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767900
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21415D-page 17
Worldwide Sales and Service
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Tel: 91-11-4160-8631
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Tel: 43-7242-2244-39
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Tel: 45-4450-2828
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Tel: 91-20-2566-1512
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Tel: 33-1-69-53-63-20
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Tel: 905-673-0699
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Australia - Sydney
Tel: 61-2-9868-6733
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Tel: 86-10-8569-7000
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Tel: 86-755-8864-2200
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Taiwan - Kaohsiung
Tel: 886-7-213-7828
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Taiwan - Taipei
Tel: 886-2-2508-8600
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China - Xian
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Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21415D-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/27/12
2002-2012 Microchip Technology Inc.
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