TC4403
1.5A High-Speed, Floating Load Driver
Features
General Description
•
•
•
•
•
•
•
The TC4403 is a modified version of the TC4425 driver,
intended to drive floating or isolated loads requiring
high-current pulses. The load is intended to be connected between the outputs without other reference to
supply or ground. Then, only when both logic inputs
and the VDD input are energized, is power supplied to
the load. This construction allows the implementation
of a wide variety of redundant input controllers.
Low Quiescent Current: 300A Max
Capacitive Inputs With 300mV Hysteresis
Both Inputs Must Be Driven to Drive Load
Low Output Leakage
High Peak Current Capability
Fast Output Rise Time
Outputs Individually Testable
Applications
• Isolated Load Drivers
• Pulsers
• Safety Interlocks
Device Selection Table
Part Number
Package
Temp. Range
TC4403CPA
8-Pin PDIP
0°C to +70°C
TC4403EPA
8-Pin PDIP
-40°C to +85°C
TC4403MJA
8-Pin CERDIP
-55°C to +125°C
Package Type
8-Pin PDIP/CERDIP
NC
1
8
NC
IN (VDD)
2
7
OUT (VDD)
GND
3
6
VDD
IN (GND)
4
5
OUT (GND)
TC4403
2002-2012 Microchip Technology Inc.
The low OFF-state output leakage and independence
of the two half-circuits permit a wide variety of testing
schemes to be utilized to assure functionality. The high
peak current capability, short internal delays, and fast
output rise and fall times ensure that sufficient power
will be available to the load when it is needed. The TTL
and CMOS compatible inputs allow operation from a
wide variety of input devices. The ability to swing the
inputs negative without affecting device performance
allows negative biases to be placed on the inputs for
greater safety. In addition, the capacitive nature of the
inputs allows the use of series resistors on the inputs
for extra noise suppression.
The TC4403 is built for outstanding ruggedness and
reliability in harsh applications. Input voltage excursions above the supply voltage or below ground are
clamped internally without damaging the device. The
output stages are power MOSFETs with high-speed
body diodes to prevent damage to the driver from
inductive kickbacks.
DS21417C-page 1
TC4403
Functional Block Diagram
6
7
300mV Input
Hysteresis
5
IN (GND)
IN (VDD)
VDD
OUT (VDD)
OUT (GND)
4
2
TC4403
GND
3
Effective Input
C = 20pF
(Each Input)
Typical Application
+15V
TC4422
Power
6
RT
2
Fire
7
RLOAD
TC4403
RT
4
Arm
5
3
1 MΩ
1 MΩ
-15V
DS21417C-page 2
2002-2012 Microchip Technology Inc.
TC4403
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage..................................................... +22V
Package Thermal Resistance
CERDIP RJ-A........................................ 150C/W
CERDIP RJ-C ......................................... 50°C/W
PDIP RJ-A ............................................. 125°C/W
PDIP RJ-C ............................................... 42°C/W
Operating Temperature Range
C Version .........................................0°C to +70°C
E Version ..................................... -40°C to +85°C
M Version................................... -55°C to +125°C
Storage Temperature Range ............. -65°C to +150°C
TC4403 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, with 4.5V VDD18V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
Logic 1, High Input Voltage
2.4
—
—
V
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-1000
±10
±1000
nA
-5VVINVDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
VOL
Low Output Voltage
—
—
0.025
V
ROS
Sourcing Output Resistance
—
2.8
5
IOUT = 10mA, VDD = 18V
ROG
Grounding Output Resistance
—
3.5
5
IOUT = -10mA, VDD = 18V
IPK
Peak Output Current
—
1.5
—
A
—
23
35
nsec
Switching Time (Note 1)
tR
Rise Time
Figure 3-1, CL = 1800pF
tF
Fall Time
—
25
35
nsec
Figure 3-1, CL = 1800pF
tD1
Delay Time
—
33
75
nsec
Figure 3-1, CL = 1800pF
tD2
Delay Time
—
38
75
nsec
Figure 3-1, CL = 1800pF
—
—
1.5
0.15
2.5
0.25
mA
Power Supply
Power Supply Current
IS
Note
1:
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Switching times ensured by design.
2002-2012 Microchip Technology Inc.
DS21417C-page 3
TC4403
TC4403 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Over operating temperature range with 4.5V VDD 18V, unless otherwise noted.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Input
VIH
Logic 1, High Input Voltage
2.4
—
—
V
VIL
Logic 0, Low Input Voltage
—
—
0.8
V
IIN
Input Current
-10,000
±10
±10,000
nA
-5VVINVDD
Output
VOH
High Output Voltage
VDD – 0.025
—
—
V
VOL
Low Output Voltage
—
—
0.025
V
ROS
Sourcing Output Resistance
—
3.7
8
VIN= 2.4V, IOUT = 10mA, VDD = 18V
ROG
Grounding Output Resistance
—
4.3
8
VIN= 2.4V, IOUT = -10mA, VDD = 18V
Switching Time (Note 1)
tR
Rise Time
—
28
60
nsec
Figure 3-1, CL = 1800pF
tF
Fall Time
—
32
60
nsec
Figure 3-1, CL = 1800pF
tD1
Delay Time
—
32
100
nsec
Figure 3-1, CL = 1800pF
tD2
Delay Time
—
38
100
nsec
Figure 3-1, CL = 1800pF
—
—
2
0.2
3.5
0.3
mA
Power Supply
Power Supply Current
IS
Note
1:
VIN = 3V (Both Inputs)
VIN = 0V (Both Inputs)
Switching times ensured by design.
DS21417C-page 4
2002-2012 Microchip Technology Inc.
TC4403
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
(8-Pin PDIP,
CERDIP)
PIN FUNCTION TABLE
Symbol
1
NC
2
IN (VDD)
3
GND
4
IN (GND)
5
OUT (GND)
6
VDD
7
OUT (VDD)
8
NC
2002-2012 Microchip Technology Inc.
Description
No connection.
Control input VDD, TTL/CMOS compatible logic input signal, controls OUT (VDD).
Ground.
Control Input GND, TTL/CMOS compatible logic input signal, controls OUT (GND).
Output GND, CMOS Pull Down Output.
Supply Input, 4.5V to 18V.
Output VDD, CMOS pull-up output.
No connection.
DS21417C-page 5
TC4403
3.0
APPLICATIONS INFORMATION
FIGURE 3-1:
SWITCHING TIME TEST CIRCUITS
VDD = 16V
VDD = 16V
1μF
WIMA
MKS-2
0.1μF
MLC
1μF
WIMA
MKS-2
10kΩ
Output
Input VDD
0.1μF
MLC
Input VDD
CL = 1800pF
TC4403
TC4403
CL = 1800pF
Input GND
Input GND
Output
10KΩ
+5V
+5V
Input
Input
0V
16V
10%
tD1
0V
DS21417C-page 6
90%
16V
90%
Output
0V
10%
tF
Output
10%
0V
tD1
tR
10%
2002-2012 Microchip Technology Inc.
TC4403
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Fall Time vs. Supply Voltage
Rise Time vs. Supply Voltage
100
100
4700pF
p
TA
°C
tFALL (nsec)
tRISE (nsec)
3300pF
60
2200pF
p
40
1500pF
p
1000pF
p
20
470pF
3300pF
60
2200pF
p
40
1500pF
p
1000pF
p
20
470pF
0
0
4
6
8
10
12
VDD (V)
14
16
4
18
6
8
10
12
VDD (V)
14
16
18
Fall Time vs. Capacitive Load
Rise Time vs. Capacitive Load
100
100
TA = +25°C
TA = +25°C
5V
60
5V
80
10V
15V
40
tFALL (nsec)
80
tRISE (nsec)
TA = +25°C
4700pF
p
80
80
20
60
10V
15V
40
20
0
100
0
100
10,000
1000
CLOAD (pF)
1000
CLOAD (pF)
Rise and Fall Times vs.
Temperature
10,000
Propagation Delay vs.
Input Amplitude
32
C
V
= 2200pF
= 18V
tFALL
TIME (nsec)
28
tRISE
26
24
tRISE
22
20
C
VDD
100
DELAY TIME (nsec)
30
tD1
80
60
40
tD2
tFALL
18
-55 -35 -15 5 25 45 65 85 105 125
TEMPERATURE (°C)
2002-2012 Microchip Technology Inc.
= 2200pF
20
0
1
2
3
4
5 6 7 8
INPUT (V)
9 10 11 12
DS21417C-page 7
TC4403
TYPICAL CHARACTERISTICS (CONTINUED)
Delay Time vs. Temperature
Delay Time vs. Supply Voltage
50
50
°C
45
DELAY TIME (ns)
DELAY TIME (nsec)
CLOAD = 2200pF
C
T
45
40
tD2
35
tD1
30
tD2
40
35
tD1
30
25
25
20
-55 -35 -15
20
4
6
8
10
12
14
16
18
5
25
45
65
85 105 125
TEMPERATURE (°C)
VDD (V)
Quiescent Current vs. Temperature
Quiescent Current vs. Voltage
1.4
TA = +25°C
BOTH INPUTS = 1
1.2
IQUIESCENT (mA)
IQUIESCENT (mA)
1
BOTH INPUTS = 0
0.1
1.0
INPUTS = 1
0.8
0.6
0.4
0.2
INPUTS = 0
0.0
0.01
4
6
8
10
12
14
16
-55 -35 -15
18
45
65
85 105 125
1600
5.1
4.5
2.768V
3.9
2.727V
+
2.7
MAX. POWER (mW)
1400
CLOSED CIRCUIT VOLTAGE
25
Thermal Derating Curves
Typical Discharge Characteristics
5.7
3.3
5
TEMPERATURE (°C)
VDD (V)
8 Pin DIP
1200
8 Pin CERDIP
1000
800
600
400
200
+
0
0
10
20
30
40
50
60
70
80
90
100
110
120
AMBIENT TEMPERATURE (°C)
2.1
1.5
0
75
150
225
300
525
75 HOURS
HOURS OF SERVICE
DS21417C-page 8
2002-2012 Microchip Technology Inc.
TC4403
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.015 (0.38)
.008 (0.20)
3° MIN.
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
2002-2012 Microchip Technology Inc.
DS21417C-page 9
TC4403
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin CERDIP (Narrow)
.110 (2.79)
.090 (2.29)
PIN 1
.300 (7.62)
.230 (5.84)
.020 (0.51) MIN.
.055 (1.40) MAX.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.200 (5.08)
.160 (4.06)
.040 (1.02)
.020 (0.51)
.150 (3.81)
MIN.
.200 (5.08)
.125 (3.18)
.015 (0.38)
.008 (0.20)
3° MIN.
.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)
Dimensions: inches (mm)
DS21417C-page 10
2002-2012 Microchip Technology Inc.
TC4403
6.0
REVISION HISTORY
Revision C (December 2012)
Added a note to each package outline drawing.
2002-2012 Microchip Technology Inc.
DS21417C-page 11
TC4403
NOTES:
DS21417C-page 12
2002-2012 Microchip Technology Inc.
TC4403
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21417C-page13
TC4403
NOTES:
DS21417C-page14
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767924
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21417C-page 15
Worldwide Sales and Service
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DS21417C-page 16
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11/27/12
2002-2012 Microchip Technology Inc.
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