TC4423A/TC4424A/TC4425A
3A Dual High-Speed Power MOSFET Drivers
Features
General Description
• High Peak Output Current: 4.5A (typical)
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 1800 pF in 12 ns
• Short Delay Times: 40 ns (typical)
• Matched Rise/Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 1.0 mA (maximum)
- With Logic ‘0’ Input – 150 µA (maximum)
• Low Output Impedance: 2.5Ω (typical)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing Up To
5V
• Pin compatible with the TC4423/TC4424/TC4425
and TC4426A/TC4427A/TC4428A devices
• Space-saving 8-Pin 150 mil body SOIC and 8-Pin
6x5 DFN Packages
The TC4423A/TC4424A/TC4425A devices are a family
of dual-output 3A buffers/MOSFET drivers. These
devices are improved versions of the earlier TC4423/
TC4424/TC4425 dual-output 3A driver family. This
improved version features higher peak output current
drive capability, lower shoot-throught current, matched
rise/fall times and propagation delay times. The
TC4423A/TC4424A/TC4425A devices are pincompatible with the existing TC4423/TC4424/TC4425
family. An 8-pin SOIC package option has been added
to the family. The 8-pin DFN package option offers
increased power dissipation capability for driving
heavier capacitive or resistive loads.
The TC4423A/TC4424A/TC4425A MOSFET drivers
can easily charge and discharge 1800 pF gate
capacitance in under 20 ns, provide low enough
impedances in both the on and off states to ensure the
MOSFET’s intended state will not be affected, even by
large transients.
The TC4423A/TC4424A/TC4425A inputs may be
driven directly from either TTL or CMOS (2.4V to 18V).
In addition, the 300 mV of built-in hysteresis provides
noise immunity and allows the device to be driven from
slow rising or falling waveforms.
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Direct Drive of Small DC Motors
The TC4423A/TC4424A/TC4425A dual-output 3A
MOSFET driver family is offerd with a -40oC to +125oC
temperature rating, making it useful in any wide
temperature range application.
Package Types
8-Pin PDIP/SOIC TC4423A TC4424A TC4425A
NC
IN A
GND
IN B
8
1
2 TC4423A 7
3 TC4424A 6
4 TC4425A 5
8-Pin 6x5
DFN (1)
NC 1
IN A 2
GND
3
IN B 4
NC
OUT A
VDD
OUT B
TC4423A
TC4424A
TC4425A
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
TC4423A TC4424A TC4425A
8
NC
NC
NC
7
OUT A
OUT A
OUT A
6
VDD
VDD
VDD
5
OUT B
OUT B
OUT B
TC4423A TC4424A TC4425A
16-Pin SOIC (Wide)
NC
IN A
NC
GND
GND
NC
IN B
NC
1
16
2
15
3
4
5
6
7
8
TC4423A
TC4424A
TC4425A
14
13
12
11
10
9
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
NC
OUT A
OUT A
VDD
VDD
OUT B
OUT B
NC
Note 1: Exposed pad of the DFN package is electrically isolated.
2: Duplicate pins must both be connected for proper operation.
© 2007 Microchip Technology Inc.
DS21998B-page 1
TC4423A/TC4424A/TC4425A
Functional Block Diagram(1)
Inverting
VDD
750 µA
300 mV
Output
Non-inverting
Input
Effective
Input C = 20 pF
(Each Input)
GND
4.7V
TC4423A Dual Inverting
TC4424A Dual Non-inverting
TC4425A Inverting / Non-inverting
Note 1: Unused inputs should be grounded.
DS21998B-page 2
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
Supply Voltage ................................................................+20V
Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA=50°C)
8L PDIP .......................................................................1.2W
8L SOIC.................................................................... 0.61W
16L SOIC.....................................................................1.1W
8L DFN .................................................................... Note 3
DC CHARACTERISTICS (NOTE 2)
Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.4
1.5
—
V
Logic ‘0’, Low Input Voltage
VIL
—
1.3
0.8
V
Input Current
IIN
–1
—
1
µA
Input Voltage
VIN
-5
—
VDD+0.3
V
Conditions
Input
0V ≤ VIN ≤ VDD
Output
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance, High
ROH
—
2.2
3.0
Ω
IOUT = 10 mA, VDD = 18V
Output Resistance, Low
ROL
—
2.8
3.5
Ω
IOUT = 10 mA, VDD = 18V
Peak Output Current
IPK
—
4.5
—
A
10V≤ VDD ≤18V (Note 2)
Latch-Up Protection Withstand Reverse Current
IREV
—
>1.5
—
A
Duty cycle ≤ 2%, t ≤ 300 µsec.
Rise Time
tR
—
12
21
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Fall Time
tF
—
12
21
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
tD1
—
40
48
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
tD2
—
41
48
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
VDD
4.5
—
18
V
IS
—
1.0
2.0
mA
VIN = 3V (Both inputs)
IS
—
0.15
0.25
mA
VIN = 0V (Both inputs)
Switching Time (Note 1)
Power Supply
Supply Voltage
Power Supply Current
Note 1:
2:
3:
Switching times ensured by design.
Tested during characterization, not production tested.
Package power dissipation is dependent on the copper pad area on the PCB.
© 2007 Microchip Technology Inc.
DS21998B-page 3
TC4423A/TC4424A/TC4425A
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.4
Logic ‘0’, Low Input Voltage
VIL
—
Input Current
IIN
High Output Voltage
Low Output Voltage
Conditions
—
—
V
—
0.8
V
–10
—
+10
µA
VOH
VDD – 0.025
—
—
V
VOL
—
—
0.025
V
Output Resistance, High
ROH
—
3.1
6
Ω
IOUT = 10 mA, VDD = 18V
Output Resistance, Low
ROL
—
3.7
7
Ω
IOUT = 10 mA, VDD = 18V
Rise Time
tR
—
20
31
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Fall Time
tF
—
22
31
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
tD1
—
50
66
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
Delay Time
tD2
—
50
66
ns
Figure 4-1, Figure 4-2,
CL = 1800 pF
IS
—
—
2.0
0.2
3.0
0.3
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Input
0V ≤ VIN ≤ VDD
Output
Switching Time (Note 1)
Power Supply
Power Supply Current
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (V)
TA
–40
—
+125
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
–65
—
+150
°C
Thermal Resistance, 8L-6x5 DFN
θJA
—
33.2
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
84.6
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
163
—
°C/W
Thermal Resistance, 16L-SOIC
θJA
—
90
—
°C/W
Package Thermal Resistances
DS21998B-page 4
Typical four-layer board with
vias to ground plane
© 2007 Microchip Technology Inc.
TC4423A/TC4424A/TC4425A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C with 4.5V