TC4426M/TC4427M/TC4428M
1.5A Dual High-Speed Power MOSFET Drivers
Features
General Description
• High Peak Output Current – 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability – 1000 pF
in 25 ns (typ.)
• Short Delay Times – 40 ns (typ.)
• Matched Rise and Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 4 mA
- With Logic ‘0’ Input – 400 µA
• Low Output Impedance – 7
• Latch-Up Protected: Will Withstand 0.5A Reverse
Current
• Input: Will Withstand Negative Inputs Up to 5V
• ESD Protected – 4 kV
• Pin-Compatible with the TC426M/TC427M/
TC428M, TC4426AM/TC4427AM/TC4428AM
Devices
• Wide Operating Temperature Range:
- -55°C to +125°C
• See TC4426/TC4427/TC4428 data sheet
(DS21422) for additional temperature range and
packaging offerings
The TC4426M/TC4427M/TC4428M are improved
versions of the earlier TC426M/TC427M/TC428M
family of MOSFET drivers. The TC4426M/TC4427M/
TC4428M devices have matched rise and fall times
when charging and discharging the gate of a MOSFET.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
4 kV.
The TC4426M/TC4427M/TC4428M MOSFET drivers
can
easily
charge/discharge
1000 pF
gate
capacitances in under 30 ns and provide low enough
impedances in both the on and off states to ensure the
MOSFET's intended state will not be affected, even by
large transients.
The TC4426AM/TC4427AM/TC4428AM family of
devices are also compatible drivers. The TC4426AM/
TC4427AM/TC4428AM devices have matched
leading and falling edge input-to-output delay times, in
addition to the matched rise and fall times of the
TC4426M/TC4427M/TC4428M devices.
Applications
Package Types
8-Pin CERDIP TC4426M TC4427M TC4428M
NC 1
IN A 2
GND 3
IN B 4
2005-2013 Microchip Technology Inc.
TC4426M
TC4427M
TC4428M
• Switch-mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
8 NC
NC
NC
7 OUT A
OUT A
OUT A
6 VDD
VDD
VDD
5 OUT B
OUT B
OUT B
DS21938B-page 1
TC4426M/TC4427M/TC4428M
Functional Block Diagram
VDD
Inverting
300 mV
Output
Non-Inverting
Input
Effective
Input C = 12 pF
(Each Input)
4.7V
TC4426M/TC4427M/TC4428M(1)
(2)
GND
Note 1: The TC4426M has two inverting drivers; the TC4427M has two non-inverting drivers;
the TC4428M has one inverting and one non-inverting driver.
2: Ground any unused driver input.
DS21938B-page 2
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
1.0
ELECTRICAL
CHARACTERISTICS
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings †
Supply Voltage ................................................................+22V
Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND – 5V)
Storage Temperature Range .........................-65°C to +150°C
Maximum Junction Temperature ................................. +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Logic ‘1’, High Input Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1.0
—
+1.0
µA
0VVINVDD
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC TEST
Low Output Voltage
VOL
—
—
0.025
V
DC TEST
Output Resistance
RO
—
7
10
IOUT = 10 mA, VDD = 18V
Peak Output Current
IPK
—
1.5
—
A
VDD = 18V
Latch-Up Protection
Withstand Reverse Current
IREV
—
>0.5
—
A
Duty cycle2%, t 300 µs
VDD = 18V
tR
—
19
30
ns
Figure 4-1
Fall Time
tF
—
25
30
ns
Figure 4-1
Delay Time
tD1
—
20
30
ns
Figure 4-1
Delay Time
tD2
—
40
50
ns
Figure 4-1
IS
—
—
—
—
4.5
0.4
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Input
Output
Switching Time (Note 1)
Rise Time
Power Supply
Power Supply Current
Note 1:
Switching times ensured by design.
2005-2013 Microchip Technology Inc.
DS21938B-page 3
TC4426M/TC4427M/TC4428M
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.4
Logic ‘0’, Low Input Voltage
VIL
—
Input Current
IIN
High Output Voltage
Conditions
—
—
V
—
0.8
V
-10
—
+10
µA
0VVINVDD
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
9
12
IOUT = 10 mA, VDD = 18V
Peak Output Current
IPK
—
1.5
—
A
VDD = 18V
Latch-Up Protection
Withstand Reverse Current
IREV
—
>0.5
—
A
Duty cycle2%, t 300 µs
VDD = 18V
Input
Output
Switching Time (Note 1)
Rise Time
tR
—
—
40
ns
Figure 4-1
Fall Time
tF
—
—
40
ns
Figure 4-1
Delay Time
tD1
—
—
40
ns
Figure 4-1
Delay Time
tD2
—
—
60
ns
Figure 4-1
IS
—
—
—
—
8.0
0.6
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs)
Power Supply
Power Supply Current
Note 1:
Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (M)
TA
-55
—
+125
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
JA
—
150
—
ºC/W
Package Thermal Resistances
Thermal Resistance, 8L-CERDIP
DS21938B-page 4
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
100
100
2200 pF
2200 pF
80
1500 pF
1500 pF
tFALL (nsec)
tRISE (nsec)
80
60
1000 pF
40
60
1000 pF
40
470 pF
470 pF
20
20
100 pF
100 pF
0
0
4
6
FIGURE 2-1:
Voltage.
8
10
14
12
VDD (V)
16
18
Rise Time vs. Supply
100
4
8
FIGURE 2-4:
Voltage.
10
12
VDD (V)
14
16
18
Fall Time vs. Supply
100
5V
5V
80
80
tFALL (nsec)
tRISE (nsec)
6
10V
60
15V
40
20
60
10V
15V
40
20
0
100
1000
CLOAD (pF)
FIGURE 2-2:
Load.
0
100
10,000
Rise Time vs. Capacitive
1000
CLOAD (pF)
FIGURE 2-5:
Load.
10,000
Fall Time vs. Capacitive
60
TIME (nsec)
50
Propagation Delay (nsec)
C LOAD = 1000 pF
VDD = 17.5V
40
30
tFALL
20
10
–55 –35 –15
FIGURE 2-3:
Temperature.
tRISE
80
75
70
65
60
55
50
45
40
35
30
25
20
CLOAD = 1000 pF
VIN = 5V
tD2
tD1
4
5
25 45 65 85
TEMPERATURE (˚C)
Rise and Fall Times vs.
2005-2013 Microchip Technology Inc.
6
105 125
8
10
12
14
16
18
VDD (V)
FIGURE 2-6:
Supply Voltage.
Propagation Delay Time vs.
DS21938B-page 5
TC4426M/TC4427M/TC4428M
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
45
CLOAD = 1000 pF
55
VDD = 12V
50
45
tD2
40
35
30
tD1
25
CLOAD = 1000 pF
VIN = 5V
VDD = 18V
tD2
40
Delay Time (nsec)
Propagation Delay (nsec)
60
20
35
30
25
20
tD1
15
15
10
10
0
1
2
3
4
5
6
7
8
9
10
11
12
-55
-35
-15
Input Amplitude (V)
FIGURE 2-7:
Input Amplitude.
5
25
45
65
85
105 125
Temperature (ºC)
Propagation Delay Time vs.
FIGURE 2-10:
Temperature.
Propagation Delay Time vs.
4.0
IQUIESCENT (mA)
IQUIESCENT (mA)
V DD = 18V
BOTH INPUTS = 1
1
3.5
3.0
BOTH INPUTS = 1
2.5
BOTH INPUTS = 0
0.1
4
6
8
FIGURE 2-8:
Voltage.
10
12
VDD
14
16
2.0
–55 –35 –15
18
Supply Current vs. Supply
FIGURE 2-11:
Temperature.
25 45
TA ( C)
65
85
105 125
Supply Current vs.
25
25
20
20
WORST CASE @ TJ = +150 C
RDS(ON) (Ω)
RDS(ON) (Ω)
5
15
TYP @ TA = +25 C
10
WORST CASE @ TJ = +150 C
15
TYP @ TA = +25 C
10
8
8
5
5
4
6
8
10
12
14
16
18
4
6
VDD
FIGURE 2-9:
Supply Voltage.
DS21938B-page 6
Output Resistance (ROH) vs.
FIGURE 2-12:
Supply Voltage.
8
10
12
VDD
14
16
18
Output Resistance (ROL) vs.
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
Note: Unless otherwise indicated, TA = +25ºC with 4.5V VDD 18V.
60
VDD = 18V
60
2 MHz
VDD = 18V
50
1000 pF
2200 pF
50
ISUPPLY (mA)
ISUPPLY (mA)
900 kHz
40
600 kHz
30
20
200 kHz
10
40
100 pF
30
20
10
20 kHz
0
100
1000
CLOAD (pF)
FIGURE 2-13:
Capacitive Load.
0
10,000
Supply Current vs.
10
FIGURE 2-16:
Frequency.
60
VDD = 12V
50
50
40
40
ISUPPLY (mA)
ISUPPLY (mA)
Supply Current vs.
60
2 MHz
VDD = 12V
30
900 kHz
20
600 kHz
10
1000
CLOAD (pF)
FIGURE 2-14:
Capacitive Load.
2200 pF
1000 pF
30
20
100 pF
10
200 kHz
20 kHz
0
100
0
10
10,000
Supply Current vs.
100
1000
FREQUENCY (kHz)
FIGURE 2-17:
Frequency.
60
Supply Current vs.
60
VDD = 6V
VDD = 6V
50
50
40
30
ISUPPLY (mA)
ISUPPLY (mA)
100
1000
FREQUENCY (kHz)
2 MHz
20
900 kHz
600 kHz
200 kHz
20 kHz
10
0
100
FIGURE 2-15:
Capacitive Load.
1000
CLOAD (pF)
2200 pF
30
1000 pF
20
10
10,000
Supply Current vs.
2005-2013 Microchip Technology Inc.
40
100 pF
0
10
FIGURE 2-18:
Frequency.
100
1000
FREQUENCY (kHz)
Supply Current vs.
DS21938B-page 7
TC4426M/TC4427M/TC4428M
Note: Unless otherwise indicated, TA = +25ºC with
4.5V VDD 18V.
–8
10
9
8
7
6
A • sec
5
4
3
2
–9
10
Note:
4
6
8
10
12
VDD
14
16
18
The values seen in this graph represent the
loss seen by both drivers in a package
during one complete cycle. For a single
driver, divide the stated values by 2. For a
single transition of a single driver, divide
the stated value by 4.
FIGURE 2-19:
Supply Voltage.
DS21938B-page 8
Crossover Energy vs.
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
8-Pin
CERDIP
Symbol
1
NC
No connection
2
IN A
Input A
3
GND
Ground
4
IN B
Input B
5
OUT B
6
VDD
7
OUT A
8
NC
3.1
3.3
Output A & B (OUT A and OUT B)
MOSFET drivers OUT A & B are low-impedance,
CMOS push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and
fall times equivalent.
Description
3.4
Output B
Supply input
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
Output A
No connection
Inputs A & B (IN A and IN B)
MOSFET drivers IN A & B are high-impedance, TTL/
CMOS-compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching even when the
rise and fall time of the input signal is very slow.
3.2
Ground (GND)
GND is the device return pin. The ground pin(s) should
have a low-impedance connection to the bias supply
source return. High peak currents will flow out of the
ground pin(s) when the capacitive load is being
discharged.
2005-2013 Microchip Technology Inc.
DS21938B-page 9
TC4426M/TC4427M/TC4428M
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 18V
0V
4.7 µF
0.1 µF
Input
tD1
7
VDD
tR
90%
90%
Output
5
10%
10%
0V
Inverting Driver
CL = 1000 pF
4
tD2
tF
Output
6
2
10%
+5V
90%
Input
3
Input: 100 kHz,
square wave,
tRISE = tFALL 10 ns
0V
VDD
10%
tD1 90%
tR
Output
0V
10%
90%
tD2
tF
10%
Non-Inverting Driver
FIGURE 4-1:
DS21938B-page 10
Switching Time Test Circuit.
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead CERDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
TC4427
3
MJA e^^256
0543
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2005-2013 Microchip Technology Inc.
DS21938B-page 11
TC4426M/TC4427M/TC4428M
8-Lead Ceramic Dual In-line – 300 mil (CERDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
2
1
n
D
E
A2
A
c
L
B1
eB
B
A1
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Standoff §
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
*Controlling Parameter
JEDEC Equivalent: MS-030
A
A1
E
E1
D
L
c
B1
B
eB
p
MIN
.160
.020
.290
.230
.370
.125
.008
.045
.016
.320
INCHES*
NOM
8
.100
.180
.030
.305
.265
.385
.163
.012
.055
.018
.360
MAX
.200
.040
.320
.300
.400
.200
.015
.065
.020
.400
MILLIMETERS
NOM
8
2.54
4.06
4.57
0.51
0.77
7.37
7.75
5.84
6.73
9.40
9.78
3.18
4.13
0.20
0.29
1.14
1.40
0.41
0.46
8.13
9.15
MIN
MAX
5.08
1.02
8.13
7.62
10.16
5.08
0.38
1.65
0.51
10.16
Drawing No. C04-010
DS21938B-page 12
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
APPENDIX A:
REVISION HISTORY
Revision B (January 2013)
Added a note to each package outline drawing.
Revision A (February 2005)
• Original Release of this Document.
2005-2013 Microchip Technology Inc.
DS21938B-page 13
TC4426M/TC4427M/TC4428M
NOTES:
DS21938B-page 14
2005-2013 Microchip Technology Inc.
TC4426M/TC4427M/TC4428M
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX
Device and Temperature
Range
Package
Device and
Temperature Range:
TC4426M:
TC4427M:
TC4428M:
Package:
1.5A Dual MOSFET Driver, Inverting,
-55°C to +125°C
1.5A Dual MOSFET Driver, Non-Inverting,
-55°C to +125°C
1.5A Dual MOSFET Driver, Complementary,
-55°C to +125°C
JA = Ceramic Dual In-line (300 mil Body), 8-lead
2005-2013 Microchip Technology Inc.
Examples:
a)
TC4426MJA:
1.5A Dual MOSFET
driver, Inverting,
-55°C to +125°C,
8LD CERDIP package.
a)
TC4427MJA:
1.5A Dual MOSFET
driver, Non-Inverting,
-55°C to +125°C,
8LD CERDIP package.
a)
TC4428MJA:
1.5A Dual MOSFET
driver, Complementary,
-55°C to +125°C,
8LD CERDIP package.
DS21938B-page 15
TC4426M/TC4427M/TC4428M
NOTES:
DS21938B-page 16
2005-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2005-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769195
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2005-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21938B-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21938B-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
2005-2013 Microchip Technology Inc.
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