TC624VPA

TC622/TC624 Low Cost Single Trip Point Temperature Sensor Features: General Description: • Temperature Set Point Easily Programs with a Single External Resistor • Operates with 2.7V Power Supply (TC624) • TO-220 Package for Direct Mounting to Heatsink (TC622XAT) or Standard 8-Pin PDIP and SOIC The TC622 and TC624 are programmable solid-state temperature sensors designed to replace mechanical switches in sensing and control applications. Both devices integrate the temperature sensor with a voltage reference and all required detector circuitry. The desired temperature set point is set by the user with a single external resistor. Applications: • • • • • Power Supply Over-Temperature Detection Consumer Electronics Fire/Heat Detection UPSs, Amplifiers, Motors CPU Thermal Management in PCs Ambient temperature is sensed and compared to the programmed set point. The OUT and OUT outputs are driven to their active state when the measured temperature exceeds the programmed set point. The TC622 has a power supply voltage range of 4.5V to 18.0V while the TC624 operates over a power supply range of 2.7V to 4.5V. Both devices are usable over a temperature range of -40°C to +125°C (TC622VXX, TC624VXX). Both devices feature low supply current making them suitable for portable applications. Eight-pin through-hole and surface mount packages are available. The TC622 is also offered in a 5-pin TO-220 package. The TC622 and TC624 are single point temperature detectors ideal for use in a wide variety of applications. Device Selection Table Part Number Voltage Operation Package Ambient Temperature TC622COA 4.5V to 18V 8-Pin SOIC 0°C to +70°C TC622CPA 4.5V to 18V 8-Pin PDIP 0°C to +70°C TC622EAT 4.5V to 18V 5-Pin TO-220 -40°C to +85°C TC622EOA 4.5V to 18V 8-Pin SOIC -40°C to +85°C TC622EPA 4.5V to 18V 8-Pin PDIP -40°C to +85°C TC622VAT 4.5V to 18V 5-Pin TO-220 -40°C to +125°C TC622VOA 4.5V to 18V 8-Pin SOIC -40°C to +125°C TC622VPA 4.5V to 18V 8-Pin PDIP -40°C to +125°C TC624COA 2.7V to 4.5V 8-Pin SOIC 0°C to +70°C TC624CPA 2.7V to 4.5V 8-Pin PDIP 0°C to +70°C TC624EOA 2.7V to 4.5V 8-Pin SOIC -40°C to +85°C TC624EPA 2.7V to 4.5V 8-Pin PDIP -40°C to +85°C TC624VOA 2.7V to 4.5V 8-Pin SOIC -40°C to +125°C TC624VPA 2.7V to 4.5V 8-Pin PDIP -40°C to +125°  2001-2012 Microchip Technology Inc. DS21440D-page 1 TC622/TC624 Package Type SOIC 7 VDD 6 NC 4 5 TSET NC 1 8 NC OUT 2 7 VDD OUT 3 6 NC GND 4 OUT 2 OUT 3 GND TC622CPA TC622EPA TC622VPA TC624CPA TC624EPA TC624VPA NC 1 OUT 2 OUT 3 TC622COA TC622EOA TC622VOA 8 NC 7 VDD 6 NC GND 4 5 TSET NC 1 8 NC OUT 2 7 VDD OUT 3 6 NC GND 4 5 TSET TC624COA TC624EOA TC624VOA TC622EAT TC622VAT 1 2 3 4 5 GND TSET NC 1 VDD 8 NC SOT-220 OUT OUT PDIP 5 TSET Note: For TO-220 Package, Pin 3 is connected to case heatsink. Functional Block Diagram +9V 9V Battery RSET Horn 1 VDD NC 7 Microcontrollers 5 TSET NC TC622 TC624 6 4 DS21440D-page 2 OUT 8 3 NC GND OUT 2 ALARM  2001-2012 Microchip Technology Inc. TC622/TC624 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Supply Voltage (TC622) ......................................... 20V (TC624) ........................................ 5.5V Input Voltage Any Input .. (GND – 0.3V) to (VDD +0.3V) Operating Temperature ...................... -40°C to +125°C C Version .............................. 0°C to +70°C E Version ........................... -40°C to +85°C V Version ......................... -40°C to +125°C Storage Temperature ......................... -65°C to +150°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. . TC622/TC624 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Over operating temperature range, unless otherwise specified. Sym Parameter Device Min Typ Max Unit VDD Supply Voltage Range TC622 TC624 4.5 2.7 — — 18 4.5 V IDD Supply Current TC622 TC624 — — 200 170 600 300 A 5.0V  VDD  18V 2.7V  VDD  4.5V VOH Output Voltage (High) TC622 0.90 x VDD — — V 0.80 x VDD — — 5.0V  VDD  18V, -40°C  TA  +125°C, IOH = 250 A IOH = 500 A VOL Output Voltage (Low) TC622 — — — — — — 0.15 x VDD 0.30 x VDD 0.35 x VDD V -40°C  TA  +85°C, IOL = 500 A IOL = 1 mA -40°C  TA  +125°C, IOL = 1 mA VOH Output Voltage (High) TC624 — 0.90 x VDD 0.80 x VDD — — — — V Output Voltage (Low) TC624 — — — — — — 0.1 x VDD 0.2 x VDD 0.25 x VDD V -40°C  TA  +85°C, IOL = 500 A IOL = 1 mA -40°C  TA  +125°C, IOL = 1 mA T-5 T-5 T±1 T±1 T+5 T+5 °C TSET = Programmed Temperature TSET = Programmed Temperature — — 2 2 — — °C VOL TSET Absolute Accuracy TC622 TC624 OUT Trip Point Hysteresis TC622 TC624  2001-2012 Microchip Technology Inc. Test Conditions 2.7V  VDD  4.5V -40°C  TA  +125°C, IOH = 250 A IOH = 500 A DS21440D-page 3 TC622/TC624 2.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin PDIP) Symbol 1 NC 2 OUT Active low output. 3 OUT Active high output. 4 GND Ground Terminal. 5 TSET Temperature set point. Connect an external 1% resistor from TSET to VCC to set trip point. Description No Internal Connection. 6 NC No Internal Connection. 7 VDD Power supply input. 8 NC No Internal Connection. Pin No. (5-Pin SOT-220) Symbol 1 OUT 2 OUT Active high output. 3 VDD Power supply input. 4 GND Ground Terminal. 5 TSET Temperature set point. Connect an external 1% resistor from TSET to VCC to set trip point. DS21440D-page 4 Description Active low output.  2001-2012 Microchip Technology Inc. TC622/TC624 3.0 DETAILED DESCRIPTION 3.1 Trip Point Programming 3.2 When the temperature of the device exceeds the programmed temperature trip point, TSET, the OUT and OUT outputs are driven into their active states. The desired trip point temperature is programmed with a single external resistor connected between the TSET input and VCC. The relationship between the resistor value and the trip point temperature is given by Equation 3-1. Hysteresis To prevent output “chattering” at the trip point temperature, the temperature detector in the TC622/TC624 has 2°C hysteresis (see Figure 3-2). The outputs are driven active when the temperature crosses the set point determined by the external resistor. As temperature declines below the set point, the hysteresis action will hold the outputs true until the temperature drops 2°C below the threshold. Temperature EQUATION 3-1: Set Point (Set Point – 2 Degrees C) RTRIP = 0.5997 x T 2.1312 Where: RTRIP = Programming resistor value in Ohms T = Desired trip temperature in degrees Kelvin. OUT For example, as shown in Figure 3-1, to program the device to trip at 50°C, the programming resistor is: OUT FIGURE 3-2: RTRIP = 0.5997 x ((50 + 273.15)2.1312) = 133.65 k TC622/TC624 Hysteresis RESISTANCE, RTRIP (kΩ) 250 200 150 100 50 -55 -35 -15 5 25 45 65 85 105 125 TEMPERATURE (°C) FIGURE 3-1: Programming Resistor Values vs. Temperature  2001-2012 Microchip Technology Inc. DS21440D-page 5 TC622/TC624 4.0 TYPICAL APPLICATIONS 4.1 Over-Temperature Shutdown 4.2 Cooling and Heating Applications The TC622/TC624 can be used to control a DC fan as shown in Figure 4-2. The fan turns on when the sensed temperature rises above TSET and remains on until the temperature falls below TSET - 2°C. The TC622 can be used to create a simple over-temperature shutdown circuit. In this circuit, temperature is sensed within the system enclosure (internal system ambient) or at the heatsink itself. When measured temperature exceeds a preset limit, a fault is indicated and the system shuts down. Figure 4-3 shows the TC622 acting as a heater thermostat. Circuit operation is identical to that of the cooling fan application. Figure 4-1 illustrates an over-temperature shutdown circuit using the TC622 sensor in a single TO-220 package, allowing direct attachment to the heatsink surface. As shown, the TC622 outputs are driven active when the heatsink temperature equals the trip point temperature set by RTRIP. When this happens, the crowbar circuit is activated, causing the supply output to fold back to zero. The TC622 outputs remain active until the heatsink temperature falls a minimum of 2°C (built-in hysteresis) below the trip point temperature, at which time the device again allows normal supply operation. Heatsink Output Device TC622 VCC Output Device Circuit Board TC622 Heatsink Mounting VOUT Power Good Signal RTRIP TC622 TSET VDD OUT GND OVERTEMP Crowbar Circuit OUT Heatsink Surface FIGURE 4-1: DS21440D-page 6 TC622 Power Supply Over-Temperature Shutdown  2001-2012 Microchip Technology Inc. TC622/TC624 +2.7 to 4.5V +12V +4.5 to 18.0V RSET 1 RSET VDD 7 NC 5 T SET + 1 DC Fan NC 8 VDD 7 NC GND NC 8 TC622 OUT 3 OUT 2 6 N-Channel Logic Level MOSFET TSET TSET – 2 C NC 4 GND Temperature Temperature 4 NC Heater 5T SET TC624 6 +12V OUT N-Channel Level Logic MOSFET OUT 2 TSET TSET – 2 C OUT Fan "On" OUT Heater "On" FIGURE 4-2: for Notebook PC TC624 As A Fan Controller  2001-2012 Microchip Technology Inc. FIGURE 4-3: Thermostat TC622 As A Heater DS21440D-page 7 TC622/TC624 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) DS21440D-page 8 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in  2001-2012 Microchip Technology Inc. TC622/TC624 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 5.4 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° Max. .050 (1.27) .016 (0.40) Dimensions: inches (mm)  2001-2012 Microchip Technology Inc. DS21440D-page 9 TC622/TC624 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 5-Pin TO-220 .185 (4.70) .165 (4.19) .117 (2.97) .103 (2.62) .415 (10.54) .390 (9.91) .156 (3.96) .140 (3.56) Dia. .055 (1.40) .045 (1.14) .293 (7.44) .204 (5.18) 3° - 7.5° 5 PLCS. .613 (15.57) .569 (14.45) .037 (0.95) .025 (0.64) .590 (14.99) .482 (12.24) .025 (0.64) .012 (0.30) .072 (1.83) .062 (1.57) Pin 1 .273 (6.93) .263 (6.68) .115 (2.92) .087 (2.21) Dimensions: inches (mm) DS21440D-page 10  2001-2012 Microchip Technology Inc. TC622/TC624 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing.  2001-2012 Microchip Technology Inc. DS21440D-page 11 TC622/TC624 NOTES: DS21440D-page 12  2001-2012 Microchip Technology Inc. TC622/TC624 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2001-2012 Microchip Technology Inc. DS21440D-page 13 TC622/TC624 NOTES: DS21440D-page 14  2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768242 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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