TC648
Fan Speed Controller with Auto-Shutdown
and Over-Temperature Alert
Features
• Temperature Proportional Fan Speed for Acoustic
Control and Longer Fan Life
• Efficient PWM Fan Drive
• 3.0V to 5.5V Supply Range:
- Fan Voltage Independent of TC648
Supply Voltage
- Supports any Fan Voltage
• Over-temperature Fault Detection
• Automatic Shutdown Mode for “Green” Systems
• Supports Low Cost NTC/PTC Thermistors
• Space Saving 8-Pin MSOP Package
Applications
•
•
•
•
•
•
Power Supplies
Computers
Portable Computers
Telecom Equipment
UPSs, Power Amps
General Purpose Fan Speed Control
Available Tools
• Fan Controller Demonstration Board (TC642DEMO)
• Fan Controller Evaluation Kit (TC642EV)
Package Types
SOIC/PDIP/MSOP
VIN
1
CF
2
VAS
3
GND
4
TC648
8
VDD
7
VOUT
6
OTF
5
NC
General Description
The TC648 is a switch mode, fan speed controller for
use with brushless DC fans. Temperature proportional
speed control is accomplished using pulse width modulation (PWM). A thermistor (or other voltage output
temperature sensor) connected to the VIN input
furnishes the required control voltage of 1.25V to 2.65V
(typical) for 0% to 100% PWM duty cycle. The TC648
can be configured to operate in either auto-shutdown or
minimum speed mode. In auto-shutdown mode, fan
operation is automatically suspended when measured
temperature (VIN) is lower than a user programmed
minimum setting (VAS). The fan is automatically
restarted, and proportional speed control restored,
when VIN exceeds VAS (plus hysteresis). Operation in
minimum speed mode is similar to auto-shutdown
mode, with the exception that the fan is operated at a
user programmed minimum setting when the measured temperature is low. An integrated Start-up Timer
ensures reliable motor start-up at turn-on, and when
coming out of shutdown or auto-shutdown mode.
The over-temperature fault output (OTF) is asserted
when the PWM reaches 100% duty cycle, indicating a
possible thermal runaway situation.
The TC648 is available in the 8-pin plastic DIP, SOIC
and MSOP packages and is available in the industrial
and extended commercial temperature ranges.
2001-2012 Microchip Technology Inc.
DS21448D-page 1
TC648
Functional Block Diagram
VIN
+
VOTF
–
–
VDD
OTF
PWM
+
CF
Control
Logic
VOUT
Start-up
Timer
OTF
Clock
Generator
–
VAS
+
SHDN
–
+
VSHDN
GND
DS21448D-page 2
TC648
NC
2001-2012 Microchip Technology Inc.
TC648
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage ......................................................... 6V
Input Voltage, Any Pin... (GND – 0.3V) to (VDD + 0.3V)
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at
these or any other conditions above those indicated in the
operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Resistance:
PDIP (RJA)............................................. 125°C/W
SOIC (RJA) ............................................ 155°C/W
MSOP (RJA) .......................................... 200°C/W
Specified Temperature Range............ -40°C to +125°C
Storage Temperature Range.............. -65°C to +150°C
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise specified, TMIN TA TMAX, VDD = 3.0V to 5.5V
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VDD
Supply Voltage
3.0
—
5.5
V
IDD
Supply Current, Operating
—
0.5
1.0
mA
Pins 6, 7 Open,
CF = 1 µF, VIN = VC(MAX)
IDD(SHDN)
Supply Current, Shutdown/
Auto-shutdown Mode
—
25
—
µA
Pins 6, 7 Open;
Note 1
CF =1 µF, VIN = 0.35V
IIN
VIN, VAS Input Leakage
-1.0
—
+1.0
µA
Note 1
VOUT Output
tR
VOUT Rise Time
—
—
50
µsec
IOH = 5 mA, Note 1
tF
VOUT Fall Time
—
—
50
µsec
IOL = 1 mA, Note 1
IOL
Sink Current at VOUT Output
1.0
—
—
mA
VOL = 10% of VDD
IOH
Source Current at VOUT
Output
5.0
—
—
mA
VOH = 80% of VDD
SENSE Input Threshold
Voltage with Respect to GND
50
70
90
mV
Note 1
Output Low Voltage
—
—
0.3
V
2.5
2.65
2.8
V
SENSE Input
VTH(SENSE)
OTF Output
VOL
IOL = 2.5 mA
VIN, VAS Inputs
VC(MAX),VOTF Voltage at VIN for 100% Duty
Cycle and Overtemp. Fault
VC(SPAN)
VC(MAX) - VC(MIN)
1.3
1.4
1.5
V
VAS
Auto-shutdown Threshold
VC(MAX) ~
VC(SPAN)
—
VC(MAX)
V
VSHDN
Voltage Applied to VIN to
Ensure Reset/Shutdown
—
—
VDD x 0.13
V
VREL
Voltage Applied to VIN to
Release Reset Mode
VDD x 0.19
—
—
V
VHYST
Hysteresis on VSHDN, VREL
—
0.01 x VDD
—
V
VHAS
Hysteresis on Auto-shutdown
Comparator
—
70
—
mV
VDD = 5V
Note 1: Ensured by design, not tested.
2001-2012 Microchip Technology Inc.
DS21448D-page 3
TC648
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise specified, TMIN TA TMAX, VDD = 3.0V to 5.5V
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Pulse Width Modulator
FOSC
PWM Frequency
26
30
34
Hz
CF = 1.0 µF
tSTARTUP
Start-up Timer
—
32/F
—
Sec
CF = 1.0 µF
Note 1: Ensured by design, not tested.
DS21448D-page 4
2001-2012 Microchip Technology Inc.
TC648
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No.
PIN FUNCTION TABLE
Symbol
Description
2.3
Analog Input (VAS)
An external resistor divider connected to the VAS input
sets the auto-shutdown threshold. Auto-shutdown
occurs when VIN VAS. During shutdown, supply
current falls to 25 µA (typical). The fan is automatically
restarted when VIN (VAS +VHAS) (see Section 5.0,
“Typical Applications” for more details).
1
VIN
Analog Input
2
CF
Analog Output
3
VAS
Analog Input
4
GND
Ground Terminal
GND denotes the ground Terminal.
2.5
5
NC
No Internal Connection
6
OTF
Digital (Open Collector) Output
7
VOUT
Digital Output
8
VDD
Power Supply Input
2.1
Analog Input (VIN)
The thermistor network (or other temperature sensor)
connects to the VIN input. A voltage range of 1.25V to
2.65V (typical) on this pin drives an active duty cycle of
0% to 100% on the VOUT pin (see Section 5.0, “Typical
Applications”, for more details).
2.2
Analog Output (CF)
CF is the positive terminal for the PWM ramp generator
timing capacitor. The recommended CF is 1 µF for
30 Hz PWM operation.
2.4
Ground (GND)
No Connect
No internal connection.
2.6
Digital Output (OTF)
OTF goes low to indicate an over-temperature
condition. This occurs when the voltage at VIN > VOTF
(see Section 1.0, "Electrical Characteristics"). An overtemperature indication is a non-latching condition.
2.7
Digital Output (VOUT)
VOUT is an active high complimentary output that drives
the base of an external NPN transistor (via an appropriate base resistor) or the gate of an N-channel MOSFET. This output has asymmetrical drive (see
Section 1.0, “Electrical Characteristics”).
2.8
Power Supply Input (VDD)
VDD may be independent of the fan’s power supply
(see Section 1.0, “Electrical Characteristics”).
2001-2012 Microchip Technology Inc.
DS21448D-page 5
TC648
3.0
DETAILED DESCRIPTION
3.5
3.1
PWM
If the voltage on VIN becomes less than the voltage on
VAS, the fan is automatically shut off (auto-shutdown
mode). The TC648 exits auto-shutdown mode when
the voltage on VIN becomes higher than the voltage on
VAS by VHAS (the auto-shutdown hysteresis voltage
(see Figure 3-1)). The Start-up Timer is triggered and
normal operation is resumed upon exiting auto-shutdown mode. The VAS input should be grounded if autoshutdown mode is not used.
The PWM circuit consists of a ramp generator and
threshold detector. The frequency of the PWM is
determined by the value of the capacitor connected to
the CF pin. A frequency of 30 Hz is recommended for
most applications (CF = 1 µF). The PWM is also the
time base for the Start-up Timer (see Section 3.3,
“Start-up Timer”). The PWM voltage control range is
1.25V to 2.65V (typical) for 0% to 100% output duty
cycle.
3.2
VOUT Output
The VOUT pin is designed to drive a low cost transistor
or MOSFET as the low side power switching element in
the system. Various examples of driver circuits will be
shown throughout this data sheet. This output has
asymmetric complementary drive and is optimized for
driving NPN transistors or N-channel MOSFETs. Since
the system relies on PWM rather than linear control,
the power dissipation in the power switch is kept to a
minimum. Generally, very small devices (TO-92 or SOT
packages) will suffice.
3.3
Start-Up Timer
To ensure reliable fan start-up, the Start-up Timer turns
the VOUT output on for 32 cycles of the PWM whenever
the fan is started from the off state. This occurs at
power-up and when coming out of shutdown or autoshutdown mode. If the PWM frequency is 30 Hz
(CF = 1 µF), the resulting start-up time will be
approximately one second.
3.4
Over-Temperature Fault (OTF)
Output
OTF is asserted when the PWM control voltage applied
to VIN becomes greater than that needed to drive 100%
duty cycle (see Section 1.0, “Electrical Characteristics”). This indicates that the fan is at maximum drive,
and the potential exists for system overheating. Either
heat dissipation in the system has gone beyond the
cooling system’s design limits, or some subtle fault
exists (such as fan bearing failure or an airflow obstruction). This output may be treated as a “System Overheat” warning and used to trigger system shutdown or
some other corrective action. OTF will become inactive
when VIN < VOTF.
DS21448D-page 6
3.6
Auto-Shutdown Mode
Shutdown Mode (Reset)
If an unconditional shutdown and/or device reset is
desired, the TC648 may be placed in shutdown mode
by forcing VIN to a logic low (i.e., VIN < VSHDN) (see
Figure 3-1). In this mode, all functions cease and the
OTF output is unconditionally inactive. The TC648
should not be shut down unless all heat producing
activity in the system is at a negligible level. The TC648
exits shutdown mode when VIN becomes greater than
VREL, the release voltage.
Entering shutdown mode also performs a complete
device reset. Shutdown mode resets the TC648 into its
power-up state. OTF is unconditionally inactive in shutdown mode. Upon exiting shutdown mode (VIN >
VREL), the Start-up Timer will be triggered and normal
operation will resume, assuming VIN > VAS + VHAS
Note: If VIN < VAS when the device exits shutdown
mode, the fan will not restart as it will be in auto-shutdown mode.
If VIN is not greater than (VAS + VHAS) upon exiting
shutdown mode, the fan will not be restarted. To ensure
that a complete reset takes place, the user’s circuitry
must ensure that VIN > (VAS + VHAS) when the device
is released from shutdown mode. A recommended
algorithm for management of the TC648 by a host
microcontroller or other external circuitry is given in
Section 5.0, “Typical Applications”. A small amount of
hysteresis, typically one percent of VDD (50 mV at
VDD = 5.0V), is designed into the VSHDN/VREL threshold. The levels specified for VSHDN and VREL in
Section 1.0, “Electrical Characteristics”, include this
hysteresis plus adequate margin to account for normal
variations in the absolute value of the threshold and
hysteresis.
CAUTION: Shutdown mode is unconditional. That is,
the fan will remain off as long as the VIN pin is being
held low or VIN < VAS + VHAS.
2001-2012 Microchip Technology Inc.
TC648
TC646
Status
Normal
Operation
Auto-Shutdown
Mode
Normal
Operation
ShutDown
Normal
Operation
HI
2.6V
VAS + VHAS
VAS
TEMP.
1.2V
tRESET
VIN
VREL
VSHDN
LO
GND
Time
FIGURE 3-1:
4.0
TC648 Nominal Operation.
SYSTEM BEHAVIOR
The flowcharts describing the TC648’s behavioral
algorithms are shown in Figure 4-1. They can be
summarized as follows:
4.1
Power-Up
(1) Assuming the device is not being held in shutdown or auto-shutdown mode (VIN > VAS)..........
(2) Turn VOUT output on for 32 cycles of the PWM
clock. This ensures that the fan will start from a
dead stop.
(3) Branch to Normal Operation.
(4) End.
4.2
Normal Operation
Normal Operation is an endless loop which may only
be exited by entering shutdown or auto-shutdown
mode. The loop can be thought of as executing at the
frequency of the oscillator and PWM.
(1) Drive VOUT to a duty cycle proportional to VIN on a
cycle by cycle basis.
(2) If an over-temperature fault occurs, (VIN > VOTF),
activate OTF; release OTF when VIN < VOTF.
(3) Is the TC648 in shutdown or auto-shutdown
mode?
If so.....
a. VOUT duty cycle goes to zero.
b. OTF is disabled.
c. Exit the loop and wait for VIN > (VAS + VHAS),
then execute Power-up sequence.
(4) End.
2001-2012 Microchip Technology Inc.
DS21448D-page 7
TC648
Normal
Operation
Power-Up
Power-on
Reset
OTF = 1
VOUT Duty
Cycle Prop.
to VIN
Yes
Minimum
Speed Mode
VAS ≈ 0V
Yes
No
VIN > VOTF?
No
Yes
VIN < VAS?
OTF = 0
AutoShutdown
VOUT = 0
OTF = 1
No
No
VIN >
(VAS + VHAS)
Yes
VIN < VAS ?
YES
AutoShutdown
VOUT = 0
Fire Start-up
Timer
No
Normal
Operation
Minimum
Speed Mode
VOUT = 0
Yes
VIN ≈ 0V ?
No
VIN > 1.25V
No
VIN > 1.25V ?
No
VOUT = 0
Yes
Yes
Power-Up
VOUT Duty Cycle Proportional to VIN
Yes
VIN > VOTF?
No
OTF = 0
FIGURE 4-1:
DS21448D-page 8
OTF = 1
TC648 Behavioral Algorithm Flowcharts.
2001-2012 Microchip Technology Inc.
TC648
5.0
TYPICAL APPLICATIONS
analysis. At the very least, anyone contemplating a
design using the TC648 should consult the documentation for both the TC642EV (DS21403) and
TC642DEMO (DS21401). Figure 5-1 shows the base
schematic for the TC642DEMO.
Designing with the TC648 involves the following:
(1) The temperature sensor network must be
configured to deliver 1.25V to 2.65V on VIN for 0%
to 100% of the temperature range to be regulated.
An Excel-based spreadsheet is also available for
designing the thermistor network for the TC64X fan
controllers. This file (TC64X Therm) is available for
downloading from the Microchip website at
www.microchip.com.
(2) The auto-shutdown temperature must be set with
a voltage divider on VAS (if used).
(3) The output drive transistor and base resistor must
be selected.
(4) If reset/shutdown capability is desired, the drive
requirements of the external signal or circuit must
be considered.
The TC642 demonstration and prototyping board
(TC642DEMO) and the TC642 Evaluation Kit
(TC642EV) provide working examples of TC648 circuits and prototyping aids. The TC642DEMO is a
printed circuit board optimized for small size and ease
of inclusion into system prototypes. The TC642EV is a
larger board intended for benchtop development and
+5V*
CB
1 µF
+12V
NTC
R1
Fan
Shutdown**
VIN
VDD
CB
0.01 µF
R2
OTF
+5V
OverTemperature
Interrupt
Q1
RBASE
TC648
VOUT
R3
VAS
CB
0.01 µF
NC
CF
R4
CF
1 µF
NOTES:
FIGURE 5-1:
GND
*See cautions regarding latch-up considerations in Section 5.0, "Typical Applications".
**Optional. See Section 5.0, "Typical Applications", for details.
Typical Application Circuit.
2001-2012 Microchip Technology Inc.
DS21448D-page 9
TC648
5.1
EQUATION
Temperature Sensor Design
VDD x R2
The temperature signal connected to VIN must output a
voltage in the range of 1.25V to 2.65V (typical) for 0%
to 100% of the temperature range of interest. The
circuit in Figure 5-2 illustrates a convenient way to provide this signal using a temperature dependent voltage
divider circuit.
RTEMP (T1) + R2
VDD x R2
RTEMP (T2) + R2
= V(T1)
= V(T2)
Where T1 and T2 are the chosen temperatures and
RTEMP is the parallel combination of the thermistor
and R1.
VDD
IDIV
RT1
R1 = 100 kΩ
NTC Thermistor
100 kΩ @25˚C
VIN
These two equations facilitate solving for the two
unknown variables, R1 and R2. More information about
thermistors may be obtained from AN679, “Temperature Sensing Technologies”, and AN685, “Thermistors
in Single Supply Temperature Sensing Circuits”, which
can be downloaded from Microchip's web site at
www.microchip.com.
5.2
R2 = 23.2 kΩ
FIGURE 5-2:
Circuit.
Temperature Sensing
RT1 is a conventional NTC thermistor and R1 and R2
are standard resistors. The supply voltage (VDD) is
divided between R2 and the parallel combination of
RT1 and R1. For convenience, the parallel combination
of RT1 and R1 will be referred to as RTEMP. The resistance of the thermistor at various temperatures is
obtained from the manufacturer’s specifications.
Thermistors are often referred to in terms of their resistance at 25°C.
Generally, the thermistor shown in Figure 5-2 is a nonlinear device with a negative temperature coefficient
(also called an NTC thermistor). In Figure 5-2, R1 is
used to linearize the thermistor temperature response
and R2 is used to produce a positive temperature
coefficient at the VIN node. As an added benefit, this
configuration produces an output voltage delta of 1.4V,
which is well within the range of the VC(SPAN)
specification of the TC648. A 100 kNTC thermistor is
selected for this application in order to keep IDIV to a
minimum.
For the voltage range at VIN to be equal to 1.25V to
2.65V, the temperature range of this configuration is
0°C to 50°C. If a different temperature range is required
from this circuit, R1 should be chosen to equal the
resistance value of the thermistor at the center of this
new temperature range. It is suggested that a maximum temperature range of 50°C be used with this circuit due to thermistor linearity limitations. With this
change, R2 is adjusted according to the following
equations:
DS21448D-page 10
Minimum Speed Mode
The TC648 is configured for minimum speed mode by
grounding VAS and designing the temperature sensor
network such that VIN operates the fan at relatively constant, minimum speed when the thermistor is at
minimum temperature. Figure 5-3 shows operation in
minimum speed mode. The 0% and 100% fan speeds
correspond to VIN values of 1.25V and 2.65V, typical.
Minimum system temperature (TMIN) is defined as the
lowest measured temperature at which proportional fan
speed control is required by the system. The fan
operates at minimum speed for all temperatures below
TMIN and at speeds proportional to the measured
temperature between TMIN and TMAX.
Fan Speed
100%
Minimum
Speed
0%
TMIN
FIGURE 5-3:
Operation.
TMAX
Minimum Fan Speed Mode
Temperature sensor design consists of a two-point
calculation: one at TMIN and one at TMAX. At TMIN, the
ohmic value of the thermistor must be much higher
than that of R1 so that minimum speed is determined
primarily by the values of R1 and R2. At TMAX, the
ohmic value of the thermistor must result in a VIN of
2.65V nominal. The design procedure consists of initially choosing R1 to be 10 times smaller than the
2001-2012 Microchip Technology Inc.
TC648
thermistor resistance at TMIN. R2 is then calculated to
deliver the desired speed at TMIN. The values for R1, R2
and RT1 are then checked at TMAX for 2.65V nominal.
It may be necessary to adjust the values of R1 and R2
after the initial calculation to obtain the desired results.
The design equations are:
5.3
EQUATION
As with the VIN input, 1.25V to 2.65V corresponds to
the temperature range of interest from T1 to T2,
respectively. Assuming that the temperature sensor
network designed previously is linearly related to
temperature, the shutdown temperature TAS is related
to T2 and T1 by:
R1 = (0.1)(RT1MIN)
Where: RT1 = Thermistor resistance at TMIN
EQUATION
R2 =
(RT1MIN)(R1)(VMIN)
Auto-Shutdown Temperature
Design
A voltage divider on VAS sets the temperature at which
the part is automatically shut down if the sensed
temperature at VIN drops below the set temperature at
VAS (i.e. VIN < VAS).
EQUATION
(RT1MIN + R1)(VDD - VMIN)
Where VMIN = the value of VIN required for
minimum fan speed. VDD = Power Supply Voltage
2.65 - 1.25V
T2 - T1
VAS =
EQUATION
VMAX =
(RT1MIN)(R1)(VMIN)
R2 (R1 + RT1MAX )(VDD)
Where RT1MAX = thermistor resistance at TMAX,
VMAX = the value of VIN required for maximum
fan speed.
Because the thermistor characteristics are fixed, it may
not be possible, in certain applications, to obtain the
desired values of VMIN and VMAX using the above
equations. In this case, the circuit in Figure 5-4 can be
used. Diode D1 clamps VIN to the voltage required to
sustain minimum speed. The calculations of R1 and
R2 for the temperature sensor are identical to the
equation on the previous page.
VAS - 1.25
=
TAS - T1
( T1.4V- T )(T
2
1
AS -
T1) + 1.25
For example, if 1.25V and 2.65V at VIN corresponds to
a temperature range of T1 = 0°C to T2 = 125°C, and the
auto-shutdown temperature desired is 25°C, then the
VAS voltage is:
EQUATION
VAS =
1.4V
(25 - 0) + 1.25 = 1.53V
(125 - 0)
The VAS voltage may be set using a simple resistor
divider, as shown in Figure 5-5.
VDD
VDD
R1
R3
RT1
R1
IDIV
VIN
D1
R4
IIN
VAS
R2
R2
GND
FIGURE 5-4:
Minimum Fan Speed Circuit.
2001-2012 Microchip Technology Inc.
FIGURE 5-5:
VAS Circuit.
DS21448D-page 11
TC648
Per Section 1.0, “Electrical Characteristics”, the leakage current at the VAS pin is no more than 1 µA. It is
conservative to design for a divider current, IDIV, of
100 µA. If VDD = 5.0V then…
EQUATION
IDIV =
1e–4A
5.0V
=
R1 + R2
5.0V
R1 + R2 =
, therefore
= 50,000 = 50 k
1e–4A
We can further specify R1 and R2 by the condition that
the divider voltage is equal to our desired VAS. This
yields the following:
EQUATION
VAS =
VDD x R2
R1 + R2
Solving for the relationship between R1 and R2 results
in the following equation:
EQUATION
R1 = R2 x
VDD - VAS
VAS
Table 5-1 gives examples of some commonly available
transistors and MOSFETs. This table should be used
as a guide only since there are many transistors and
MOSFETs which will work just as well as those listed.
The critical issues when choosing a device to use as
Q1 are: (1) the breakdown voltage (V(BR)CEO or VDS
(MOSFET)) must be large enough to withstand the
highest voltage applied to the fan (Note: This will occur
when the fan is off); (2) 5 mA of base drive current must
be enough to saturate the transistor when conducting
the full fan current (transistor must have sufficient
gain); (3) the VOUT voltage must be high enough to sufficiently drive the gate of the MOSFET to minimize the
RDS(on) of the device; (4) rated fan current draw must
be within the transistor's/MOSFET's current handling
capability; and (5) power dissipation must be kept
within the limits of the chosen device.
A base-current limiting resistor is required with bipolar
transistors. The correct value for this resistor can be
determined as follows:
VOH
R2 x (5 - 1.53)
=
1.53
For this example, R1 = (2.27) R2. Substituting this relationship back into the original equation yields the
resistor values:
R2 = 15.3 k, and R1 = 34.7 k
In this case, the standard values of 34.8 k and
15.4 k are very close to the calculated values and
would be more than adequate.
5.4
fans with nominal operating currents of no more than
200 mA, a single transistor usually suffices. Above
200 mA, the Darlington or MOSFET solution is
recommended. For the power dissipation to be kept
low, it is imperative that the pass transistor be fully saturated when "on".
Output Drive Transistor Selection
The TC648 is designed to drive an external transistor
or MOSFET for modulating power to the fan. This is
shown as Q1 in Figures 5-1, 5-6, 5-7,and 5-8. The
VOUT pin has a minimum source current of 5 mA and a
minimum sink current of 1 mA. Bipolar transistors or
MOSFETs may be used as the power switching element, as is shown in Figure 5-6. When high current
gain is needed to drive larger fans, two transistors may
be used in a Darlington configuration. These circuit
topologies are shown in Figure 5-6: (a) shows a single
NPN transistor used as the switching element; (b) illustrates the Darlington pair; and (c) shows an N-channel
MOSFET.
= VBE(SAT) + VRBASE
VRBASE = RBASE x IBASE
IBASE
= IFAN / hFE
VOH is specified as 80% of VDD in Section 1.0,
“Electrical Characteristics”; VBE(SAT) is given in the
chosen transistor data sheet. It is now possible to solve
for RBASE.
EQUATION
RBASE =
VOH - VBE(SAT)
IBASE
Some applications benefit from the fan being powered
from a negative supply to keep motor noise out of the
positive supply rails. This can be accomplished by the
method shown in Figure 5-7. Zener diode D1 offsets
the -12V power supply voltage, holding transistor Q1 off
when VOUT is low. When VOUT is high, the voltage at
the anode of D1 increases by VOH, causing Q1 to turn
on. Operation is otherwise the same as in the case of
fan operation from +12V.
One major advantage of the TC648’s PWM control
scheme versus linear speed control is that the power
dissipation in the pass element is kept very low.
Generally, low cost devices in very small packages,
such as TO-92 or SOT, can be used effectively. For
DS21448D-page 12
2001-2012 Microchip Technology Inc.
TC648
VDD
VDD
VDD
Fan
Fan
Fan
RBASE
RBASE
VOUT
VOUT
Q1
Q1
Q1
VOUT
Q2
GND
GND
GND
a) Single Bipolar Transistor
FIGURE 5-6:
TABLE 5-1:
Device
MMBT2222A
MPS2222A
MPS6602
b) Darlington Transistor Pair
C) N-Channel MOSFET
Output Drive Transistor Circuit Topologies.
TRANSISTORS AND MOSFETS FOR Q1 (VDD = 5V)
Package
Max. VBE(sat)/VGS
(V)
Min. HFE
VCEO/VDS
(V)
Fan Current
(mA)
Suggested
RBASE ()
SOT-23
1.2
50
40
150
800
TO-92
1.2
50
40
150
800
TO-92
1.2
50
40
500
301
SI2302
SOT-23
2.5
NA
20
500
Note 1
MGSF1N02E
SOT-23
2.5
NA
20
500
Note 1
SI4410
SO-8
4.5
NA
30
1000
Note 1
SI2308
SOT-23
4.5
NA
60
500
Note 1
Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times.
2001-2012 Microchip Technology Inc.
DS21448D-page 13
TC648
+5V
VDD
R2*
2.2 kΩ
VOUT
TC648
D1
12.0V
Zener
Fan
Q 1*
R 4*
10 kΩ
GND
-12V
NOTE: *Value depends on the specific application and is shown for example only.
FIGURE 5-7:
5.5
Powering the Fan from a -12V Supply.
Latch-up Considerations
Auto-Shutdown Mode Design Example
As with any CMOS IC, the potential exists for latch-up
if signals are applied to the device which are outside
the power supply range. This is of particular concern
during power-up if the external circuitry (such as the
sensor network, VAS divider or shutdown circuit) are
powered by a supply different from that of the TC648.
Care should be taken to ensure that the TC648’s VDD
supply powers up first. If possible, the networks
attached to VIN and VAS should connect to the VDD supply at the same physical location as the IC itself. Even
if the IC and any external networks are powered by the
same supply, physical separation of the connecting
points can result in enough parasitic capacitance and/
or inductance in the power supply connections to delay
one power supply “routing” versus another.
Step 1. Calculate R1 and R2 based on using an NTC
having a resistance of 10 k at TMIN (25°C)
and 4.65 k at TMAX (45°C) (see Figure 5-8).
5.6
5.7
Power Supply Routing and
Bypassing
Noise present on the VIN and VAS inputs may cause
erroneous operation of the OTF output. As a result,
these inputs should be bypassed with a 0.01 µF capacitor mounted as close to the package as possible. This
is especially true of VIN, which is usually driven from a
high impedance source (such as a thermistor). Additionally, the VDD input should be bypassed with a 1 µF
capacitor and grounds should be kept as short as possible. To keep fan noise off the TC648 ground pin, individual ground returns for the TC648 and the low side of
the fan drive device should be used.
R1 = 20.5 k
R2 = 3.83 k
Step 2. Set auto-shutdown level.
VAS = 1.8V
Limit the divider current to 100 µA
R5 = 33 k
R6 = 18 k
Step 3. Design the output circuit
Maximum fan motor current = 250 mA.
Q1 beta is chosen at 50 from which
R7 = 800 .
Minimum Speed Mode Design
Example
Given:
Minimum speed = 40%(1.8V)
TMIN = 30°C, TMAX = 95°C
Thermistor = 100 k at 25°C
RTMIN = 79.4 k, RTMAX = 6.5 k
Step 1: Calculate R1:
R1 = 7.9 k (Use closest standard value:
7.87 k)
Calculate R2:
R2 = 4.05 k (Use closest standard value:
4.02 k)
Step 2: Verify VMAX:
VMAX = 2.64V
DS21448D-page 14
2001-2012 Microchip Technology Inc.
TC648
+5V
RESET
Shutdown
Open-Drain
Device
(Optional)
NTC
10 kΩ
@ 25˚C
1
R1
20.5 kΩ
R2
3.83 kΩ
CB
0.01 μF
CB
1 μF
VIN
+12V
+5V
8
VDD
4
Fan
GND
OTF
6
TC648
3 VAS
CB
0.01 μF
2
R6
CF
18 kΩ
CB
1 μF
FIGURE 5-8:
5.8
Q1
R7
800Ω
+5V
R5
33 kΩ
Thermal
Fault
VOUT
NC
7
5
Design Example.
TC648 as a Microcontroller
Peripheral
In a system containing a microcontroller or other host
intelligence, the TC648 can be effectively managed as
a CPU peripheral. Routine fan control functions can be
performed by the TC648 without processor intervention. The microcontroller receives temperature data
from one or more points throughout the system. It
calculates a fan operating speed based on an algorithm
specifically designed for the application at hand. The
processor controls fan speed using complementary
port bits I/O1 through I/O3.
Resistors R1 through R6 (5% tolerance) form a crude
3-bit DAC that translates the 3-bit code from the
processor's outputs into a 1.6V DC control signal. A
monolithic DAC or digital pot may be used instead of
the circuit shown in Figure 5-9.
With VAS set at 1.8V, the TC648 enters auto-shutdown
when the processor's output code is 000[B]. Output
codes 001[B] to 111[B] operate the fan from roughly
40% to 100% of full speed. An open-drain output from
the processor (I/O0) can be used to reset the TC648
following detection of a fault condition. The OTF output
can be connected to the processor's interrupt input, or
to another I/O pin, for polled operation.
2001-2012 Microchip Technology Inc.
DS21448D-page 15
TC648
+12V
+5V
(RESET)(Optional)
Open-Drain
I/O0
Outputs
R1
110 kΩ
I/O1 (MSB)
Analog or Digital
Temperature
Data from one or
more Sensors
CMOS
Outputs
R2
240 kΩ
I/O2
I/O3
+5V
1 V
IN
(LSB)
R5
1.5 kΩ
+5V
.01 μF
+
R7
R4
33 kΩ
18 kΩ
+5V
R
8
18 kΩ
R6
1 kΩ
GND
FIGURE 5-9:
DS21448D-page 16
+ CB
1 μFR
CB
R3
360 kΩ
CMOS
Microcontroller
VDD
2 C
F
3
CB
VOUT 7
TC648
1 μF
VAS
OTF
Fan
8
6
9
800Ω
2N2222A
+5V
R10
10 kΩ
.01 μF
4
NC 5
GND
INT
TC648 as a Microcontroller Peripheral.
2001-2012 Microchip Technology Inc.
TC648
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
NNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
YYWW
NNN
8-Lead MSOP
e3
*
Note:
TC648VPA
025
0215
Example:
TC648VOA
0215
025
Example:
TC648E
215025
XXXXXX
YWWNNN
Legend: XX...X
Y
YY
WW
NNN
Example:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2001-2012 Microchip Technology Inc.
DS21448D-page 17
TC648
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
E
A2
A
L
c
A1
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
§
A
A2
A1
E
E1
D
L
c
B1
B
eB
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21448D-page 18
2001-2012 Microchip Technology Inc.
TC648
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
h
45×
c
A2
A
f
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
f
c
B
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2001-2012 Microchip Technology Inc.
DS21448D-page 19
TC648
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
p
E1
D
2
B
n
1
A2
A
c
A1
(F)
L
Number of Pins
Pitch
Overall Height
MILLIMETERS*
INCHES
Units
Dimension Limits
n
p
MAX
NOM
MIN
MIN
NOM
0.65
.026
.044
A
1.18
.038
0.76
.006
0.05
.193
.200
.114
.118
.114
.118
L
.016
.035
Foot Angle
F
Lead Thickness
c
.004
Lead Width
B
.010
Mold Draft Angle Top
Mold Draft Angle Bottom
Molded Package Thickness
A2
.030
Standoff
A1
.002
E
.184
Molded Package Width
E1
Overall Length
D
Foot Length
Footprint (Reference)
§
Overall Width
MAX
8
8
0.86
0.97
4.67
4.90
.5.08
.122
2.90
3.00
3.10
.122
2.90
3.00
3.10
.022
.028
0.40
0.55
0.70
.037
.039
0.90
0.95
1.00
6
0
.006
.008
0.10
0.15
0.20
.012
.016
0.25
0.30
0.40
.034
0
0.15
6
7
7
7
7
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed. 010" (0.254mm) per side.
Drawing No. C04-111
DS21448D-page 20
2001-2012 Microchip Technology Inc.
TC648
6.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for 713 Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
2001-2012 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
DS21448D-page 21
TC648
7.0
REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
DS21448D-page 22
2001-2012 Microchip Technology Inc.
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2001-2012 Microchip Technology Inc.
DS21448D-page 23
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device:
Literature Number: DS21448D
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21448D-page 24
2001-2012 Microchip Technology Inc.
TC648
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Device:
TC648:
Temperature Range:
V
E
Package:
PA = Plastic DIP (300 mil Body), 8-lead
OA = Plastic SOIC, (150 mil Body), 8-lead
UA = Plastic Micro Small Outline (MSOP), 8-lead
Examples:
a)
TC648VOA:
PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
SOIC package.
b)
TC648VUA:
c)
TC648VPA:
d)
TC648EOA713: PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
SOIC package, Tape and Reel.
PWM Fan Speed Controller w/Auto Shutdown
and Overtemperature Alert
= 0C to +85C
= -40C to +85C
PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
MSOP package.
PWM Fan Speed Controller
w/Auto Shutdown and Over-Temperature Alert,
PDIP package.
* PDIP package is only offered in the V temp range
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21448D-page25
TC648
NOTES:
DS21448D-page 26
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768297
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21448D-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
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Technical Support:
http://www.microchip.com/
support
Web Address:
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Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21448D-page 28
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
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