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TC682COA713

TC682COA713

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC REG SWTCHD CAP INV 10MA 8SOIC

  • 数据手册
  • 价格&库存
TC682COA713 数据手册
TC682 Inverting Voltage Doubler Features: General Description: • 99.9% Voltage Conversion Efficiency • 92% Power Conversion Efficiency • Wide Input Voltage Range: - +2.4V to +5.5V • Only 3 External Capacitors Required • 185 A Supply Current • Space-Saving 8-Pin SOIC and 8-Pin PDIP Packages The TC682 is a CMOS charge pump converter that provides an inverted doubled output from a single positive supply. An on-board 12 kHz (typical) oscillator provides the clock and only 3 external capacitors are required for full circuit implementation. Low output source impedance (typically 140), provides output current up to 10 mA. The TC682 features low quiescent current and high efficiency, making it the ideal choice for a wide variety of applications that require a negative voltage derived from a single positive supply (for example: generation of -6V from a 3V lithium cell or -10V generated from a +5V logic supply). Applications: • • • • • • • -10V from +5V Logic Supply -6V from a Single 3V Lithium Cell Portable Handheld Instruments Cellular Phones LCD Display Bias Generator Panel Meters Operational Amplifier Power Supplies The minimum external parts count and small physical size of the TC682 make it useful in many mediumcurrent, dual voltage analog power supplies. Functional Block Diagram VIN Device Selection Table Package Operating Temp. Range TC682COA 8-Pin SOIC 0°C to +70°C TC682CPA 8-Pin PDIP 0°C to +70°C TC682EOA 8-Pin SOIC -40°C to +85°C Part Number TC682EPA 8-Pin PDIP +2.4V < VIN < +5.5V VIN C1 + C 1+ – C 1– + C 2+ – C 2– TC682 C2 -40°C to +85°C VOUT VOUT = -(2 x VIN ) VOUT GND + COUT GND All Caps = 3.3 μF Package Type 8-Pin PDIP C1– 1 C2+ 2 C2– 3 TC682CPA TC682EPA VOUT 4  2002-2012 Microchip Technology Inc. 8-Pin SOIC 8 NC C 1– 1 7 C 1+ C 2+ 2 6 VIN C 2– 3 5 GND VOUT 4 TC682COA TC682EOA 8 NC 7 C1+ 6 VIN 5 GND DS21453D-page 1 TC682 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* VIN .......................................................................+5.8V VIN dV/dT ........................................................ 1V/sec VOUT ...................................................................-11.6V Short-Circuit Duration - VOUT ..................... Continuous Power Dissipation (TA 70°C) 8-Pin PDIP ..............................................730 mW 8-Pin SOIC ..............................................470 mW Operating Temperature Range.............-40°C to +85°C Storage Temperature (Unbiased) .......-65°C to +150°C *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC682 ELECTRICAL SPECIFICATIONS Electrical Characteristics: Over operating temperature range, VIN = +5V, test circuit Figure 3-1 unless otherwise noted. Min Typ Max Units VIN Symbol Supply Voltage Range Parameter 2.4 — 5.5 V RL = 2 k Test Conditions IIN Supply Current — — 185 — 300 400 A RL = , TA = 25°C RL =  ROUT VOUT Source Resistance — — 140 — 170 180 230 320  IL– = 10 mA, TA = 25°C IL– = 10 mA IL– = 5 mA, VIN = 2.8V FOSC Oscillator Frequency — 12 — kHz PEFF Power Efficiency 90 92 — % RL = 2 k, TA = 25°C VOUTEFF Voltage Conversion Efficiency 99 99.9 — % VOUT, RL =  DS21453D-page 2  2002-2012 Microchip Technology Inc. TC682 2.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP, SOIC) Symbol 1 C1– 2 C2+ Input. Capacitor C2 positive terminal. 3 C2– Input. Capacitor C2 negative terminal. 4 VOUT Output. Negative output voltage (-2VIN). 5 GND Input. Ground. Description Input. Capacitor C1 negative terminal. 6 VIN Input. Power supply voltage. 7 C1+ Input. Capacitor C1 positive terminal. 8 NC No connection.  2002-2012 Microchip Technology Inc. DS21453D-page 3 TC682 3.0 DETAILED DESCRIPTION +5V VIN (+5V) C1 7 + + – SW1 C 1+ 1 – C2 6 VIN + C 1– – TC682 2 C 2+ 3 C 2– C1 SW2 VOUT 4 – 5 + COUT RL VOUT + C2 – – + SW4 C3 -10V V–OUT GND SW3 FIGURE 3-3: Charge Pump – Phase 2 GND All Caps = 3.3 μF FIGURE 3-1: 3.1 3.3 TC682 Test Circuit Phase 1 VSS charge storage – before this phase of the clock cycle, capacitor C1 is already charged to +5V. C1+ is then switched to ground and the charge in C1– is transferred to C2–. Since C2+ is at +5V, the voltage potential across capacitor C2 is now -10V. + – SW3 VOUT + C1 – SW2 C2 SW4 – + C3 3.2 Charge Pump – Phase 1 Phase 2 VSS transfer – phase two of the clock connects the negative terminal of C2 to the negative side of reservoir capacitor C3 and the positive terminal of C2 to ground, transferring the generated -10V to C3. Simultaneously, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground. C2 is then switched to VCC and GND and Phase 1 begins again. DS21453D-page 4 3.4 Efficiency Considerations • The charge pump switches have virtually no offset and are extremely low on resistance. • Minimal power is consumed by the drive circuitry. • The impedances of the reservoir and pump capacitors are negligible. For the TC682, efficiency is as shown below: -5V FIGURE 3-2: The TC682 has on-chip Zener diodes that clamp VIN to approximately 5.8V, and VOUT to -11.6V. Never exceed the maximum supply voltage or excessive current will be shunted by these diodes, potentially damaging the chip. The TC682 will operate over the entire operating temperature range with an input voltage of 2V to 5.5V. Theoretically a charge pump voltage multiplier can approach 100% efficiency under the following conditions: VIN = +5V SW1 Maximum Operating Limits Voltage Efficiency = VOUT / (-2VIN) VOUT = -2VIN + VDROP VDROP = (IOUT) (ROUT) Power Loss = IOUT (VDROP) There will be a substantial voltage difference between VOUT and -2VIN if the impedances of the pump capacitors C1 and C2 are high with respect to their respective output loads. Larger values of reservoir capacitor C3 will reduce output ripple. Larger values of both pump and reservoir capacitors improve the efficiency. See Section 4.2 “Capacitor Selection” “Capacitor Selection”.  2002-2012 Microchip Technology Inc. TC682 4.0 TYPICAL APPLICATIONS 4.1 Negative Doubling Converter Output voltage ripple is affected by C3. Typically the larger the value of C3 the less the ripple for a given load current. The formula for P-P VRIPPLE is given below: The most common application of the TC682 is as a charge pump voltage converter which provides a negative output of two times a positive input voltage (Figure 4-1). + C1 22 μF 1 C2 + C1– TABLE 4-1: TC682 3 C – 2 4 V–OUT VIN GND 6 VIN 5 GND + C3 22 μF V–OUT FIGURE 4-1: 4.2 For a 10 F (0.5 ESR) capacitor for C3, fPUMP = 10 kHz and IOUT = 10 mA the peak-to-peak ripple voltage at the output will be less then 60 mV. In most applications (IOUT < = 10 mA) a 10-20 F capacitor and 1-5 F pump capacitors will suffice. Table 4-2 shows VRIPPLE for different values of C3 (assume 1 ESR). C1+ 7 2 C + 2 22 μF VRIPPLE = {1/[2(fPUMP x C3)] + 2(ESRC3)} (IOUT) Inverting Voltage Doubler Capacitor Selection The output resistance of the TC682 is determined, in part, by the ESR of the capacitors used. An expression for ROUT is derived as shown below: ROUT = 2(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +2(RSW1 + RSW2 + ESRC1 + RSW3 + RSW4 + ESRC2) +1/(fPUMP x C1) +1/(fPUMP x C2) +ESRC3 OUTPUT RESISTANCE VS. C1, C2 C1, C2 (F) ROUT() 0.05 4085 0.10 2084 0.47 510 1.00 285 3.30 145 5.00 125 10.00 105 22.00 94 100.00 87 TABLE 4-2: VRIPPLE PEAK-TO-PEAK VS. C3 (IOUT 10mA) C3 (F) VRIPPLE (mV) 0.50 1020 Assuming all switch resistances are approximately equal: 1.00 520 3.30 172 ROUT = 16RSW + 4ESRC1 + 4ESRC2 + ESRC3 +1/(fPUMP x C1) +1/(fPUMP x C2) 5.00 120 10.00 70 22.00 43 100.00 25 ROUT is typically 140 at +25°C with VIN = +5V and 3.3 F low ESR capacitors. The fixed term (16RSW) is about 80-90. It can be seen easily that increasing or decreasing values of C1 and C2 will affect efficiency by changing ROUT. However, be careful about ESR. This term can quickly become dominant with large electrolytic capacitors. Table 4-1 shows ROUT for various values of C1 and C2 (assume 0.5 ESR). C1 must be rated at 6VDC or greater while C2 and C3 must be rated at 12VDC or greater.  2002-2012 Microchip Technology Inc. DS21453D-page 5 TC682 4.3 Paralleling Devices 4.4 Paralleling multiple TC682s reduces the output resistance of the converter. The effective output resistance is the output resistance of a single device divided by the number of devices. As illustrated in Figure , each requires separate pump capacitors C1 and C2, but all can share a single reservoir capacitor. -5V Regulated Supply From A Single 3V Battery Figure 4-3 shows a -5V power supply using one 3V battery. The TC682 provides -6V at VOUT, which is regulated to -5V by the negative LDO. The input to the TC682 can vary from 3V to 5.5V without affecting regulation appreciably. A TC54 device is connected to the battery to detect undervoltage. This unit is set to detect at 2.7V. With higher input voltage, more current can be drawn from the outputs of the TC682. With 5V at VIN, 10 mA can be drawn from the regulated output. Assuming 150 source resistance for the converter, with IL–= 10 mA, the charge pump will droop 1.5V. VIN C1+ + 10 μF – VIN 10 μF C1– + – C1+ C1 – TC682 TC682 C2+ + 10 μF – + 10 μF – V–OUT C2– VIN GND C2 + C2 – V–OUT GND Negative Supply – + C–OUT 22 μF GND FIGURE 4-2: Paralleling TC682 for Lower Output Source Resistance + 10 μF – + – C1+ VIN C1– Ground 3V + 10 μF – C2+ TC682 + VSS V–OUT C2– GND VOUT VIN – 22 μF + C – OUT 1 μF – -5 Supply Negative LDO Regulator TC54VC2702Exx VOUT VIN LOW BATTERY VSS FIGURE 4-3: DS21453D-page 6 Negative Supply Derived from 3V Battery  2002-2012 Microchip Technology Inc. TC682 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Circuit of Figure 3-1, C1 = C2 = COUT = 3.3 F, TA = 25°C unless otherwise noted. Output Resistance vs. VIN VOUT vs. Load Current 240 -7.5 220 -8.0 200 -8.5 VOUT (V) OUTPUT RESISTANCE (Ω) C1 – C3 = 3.3 µF 180 -9.0 160 -9.5 140 -10.0 120 VIN = 5V -10.5 1 2 3 5 4 0 6 5 VIN (V) Supply Current vs. VIN 250 200 150 100 50 1 2 3 15 Output Source Resistance vs. Temperature NO LOAD OUTPUT SOURCE RESISTANCE (Ω) SUPPLY CURRENT (μA) 300 10 LOAD CURRENT (mA) 5 4 6 VIN (V) 200 VIN = 5V IOUT = 10 mA 180 160 140 120 100 80 -50 0 50 100 TEMPERATURE (°C) Output Ripple vs. Output Current OUTPUT RIPPLE (mV PK-PK) 200 VIN = 5V 150 C3 = 10 μF 100 C3 = 100 μF 50 0 0 5 10 15 20 OUTPUT CURRENT (mA)  2002-2012 Microchip Technology Inc. DS21453D-page 7 TC682 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) DS21453D-page 8 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in  2002-2012 Microchip Technology Inc. TC682 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° Max. .050 (1.27) .016 (0.40) Dimensions: inches (mm)  2002-2012 Microchip Technology Inc. DS21453D-page 9 TC682 7.0 REVISION HISTORY Revision D Added a note to each package outline drawing. DS21453D-page 10  2002-2012 Microchip Technology Inc. TC682 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2002-2012 Microchip Technology Inc. DS21453D-page 11 TC682 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC682 Literature Number: DS21453D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21453D-page 12  2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768341 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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TC682COA713 价格&库存

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