TC7652
Low Noise, Chopper Stabilized Operational Amplifier
Features
General Description
•
•
•
•
•
•
•
•
The TC7652 is a lower noise version of the TC7650,
sacrificing some input specifications (bias current and
bandwidth) to achieve a 10x reduction in noise. All the
other benefits of the chopper technique are present,
(i.e, freedom from offset adjust, drift and reliability problems from external trim components). Like the TC7650,
the TC7652 requires only two noncritical external caps
for storing the chopped null potentials. There are no
significant chopping spikes, internal effects or overrange lockup problems.
Low Offset Over Temperature Range: 10V
Ultra Low Long Term Drift: 150nV/Month
Low Temperature Drift: 100nV/C
Low DC Input Bias Current: 15pA
High Gain, CMRR and PSRR: 110dB Min
Low Input Noise Voltage: 0.2Vp-p (DC to 1Hz)
Internally Compensated for Unity Gain Operation
Clamp Circuit for Fast Overload Recovery
Applications
•
•
•
•
•
Instrumentation
Medical Instrumentation
Embedded Control
Temperature Sensor Amplifier
Strain Gage Amplifier
Device Selection Table
Part Number
Package
Temperature
Range
TC7652CPA
8-Pin Plastic DIP
0°C to +70°C
TC7652CPD
14-Pin Plastic DIP
0°C to +70°C
Package Type
8-Pin DIP
CA
1
8 CB
-Input 2
+Input 3
7
TC7652CPA
VDD
6 Output
5 Output
Clamp
VSS 4
14-Pin DIP
CB 1
14 INT/EXT
CA 2
EXT CLK
13 In
12 INT CLK
Out
NC 3
-Input 4
+Input 5
TC7652CPD
11 VDD
10 Output
NC 6
9
Output
Clamp
VSS 7
8
CRETN
NC = No Internal Connection
(May Be Used As Input Guard)
2001-2012 Microchip Technology Inc.
DS21464C-page 1
TC7652
Functional Block Diagram
TC7652
14-Pin DIP Only
Output Clamp
(Not On "Z" Pinout)
Output Clamp
Circuit
INT/EXT
EXT CLK IN
CLK OUT
Oscillator
Main
Amplifier
A
Inputs
B
Output
CB
NULL
Intermod
Comparator
B
B
B
CA
A
NULL
Amplifier
A
CRETN (1)
NULL
VSS
NOTE 1: For 8-pin DIP connect to VSS, or to CRET on "Z" pinout.
DS21464C-page 2
2001-2012 Microchip Technology Inc.
TC7652
1.0
ELECTRICAL
CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Total Supply Voltage (VDD to VSS) ....................... +18V
*Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated in the operation sections of the specifications is not
implied. Exposure to Absolute Maximum Rating conditions
for extended periods my affect device reliability.
Input Voltage .................... (VDD +0.3V) to (VSS – 0.3V)
Voltage on Oscillator Control Pins...............VDD to VSS
Duration of Output Short Circuit .....................Indefinite
Current Into Any Pin............................................ 10mA
While Operating (Note 1)............................100A
Package Power Dissipation (TA < 70°C
8-Pin Plastic DIP ....................................... 730mW
14-Pin Plastic DIP ..................................... 800mW
Storage Temperature Range.............. -65°C to +150°C
Operating Temperature Range
C Device .......................................... 0°C to +70°C
I Device......................................... -25°C to +85°C
TC7652 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated.
Symbol
Parameter
Min
Typ
Max
Units
VOS
Input Offset Voltage
—
±2
±5
V
TCVOS
Average Temperature Co-efficient of
Input Offset Voltage
—
0.01
0.05
V/°C
Test Conditions
TA = +25°C
0°C < TA < +70°C
VOS/DT
Offset Voltage vs Time
—
150
—
nV/mo
IBIAS
Input Bias Current (CLK On)
—
—
—
30
100
250
100
—
1000
pA
TA = +25°C
0°C < TA < +70°C
-25°C < TA < +85°C
IBIAS
Input Bias Current (CLK Off)
—
—
—
15
35
100
30
—
1000
pA
TA = +25°C
0°C < TA < +70°C
-25°C < TA < +85°C
pA
IOS
Input Offset Current
—
25
150
RIN
Input Resistance
—
1012
—
OL
Large Signal Voltage Gain
120
150
—
dB
RL = 10k, VOUT = ±4V
VOUT
Output Voltage Swing (Note 2)
±4.7
—
±4.85
±4.95
—
—
V
RL = 10k
RL = 100k
CMVR
Common Mode Voltage Range
-4.3
—
+3.5
V
MRR
Common Mode Rejection Ratio
120
140
—
dB
CMVR = -4.3V to +3.5V
PSRR
Power Supply
120
140
—
dB
±3V to ±8V
eN
Input Noise Voltage
—
—
0.2
0.7
1.5
5
VP-P
VP-P
IN
Input Noise Current
—
0.01
—
pA/
Hz
GBW
Unity Gain Bandwidth
—
0.4
—
MHz
SR
Slew Rate
—
1
—
Overshoot
—
15
—
%
Operating Supply Range
5
—
16
V
VDD, VSS
RS = 100, DC to 1Hz
DC to 10Hz
f= 10Hz
V/sec CL = 50pF, RL = 10k
Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Typically 1mA is safe however, this is not
guaranteed.
2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics.
3: See “Output Clamp” under detailed description.
2001-2012 Microchip Technology Inc.
DS21464C-page 3
TC7652
TC7652 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated.
Symbol
Parameter
Min
Typ
Max
Units
—
1
3
mA
No Load
Internal Chopping Frequency
100
275
—
Hz
Pins 12 – 14 Open (DIP)
Clamp ON Current (Note 3)
25
100
—
A
RL = 100k
Clamp OFF Current (Note 3)
—
1
—
pA
-4V VOUT < +10V
IS
Supply Current
fCH
Test Conditions
Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Typically 1mA is safe however, this is not
guaranteed.
2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics.
3: See “Output Clamp” under detailed description.
DS21464C-page 4
2001-2012 Microchip Technology Inc.
TC7652
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Symbol
Description
8-pin DIP
14-pin DIP
1,8
2,1
CA, CB
Nulling capacitor pins
2
4
-INPUT
Inverting Input
3
5
+INPUT
4
7
VSS
5
9
OUTPUT
CLAMP
Output Voltage Clamp
6
10
OUTPUT
Output
7
11
VDD
Positive Power Supply
—
3,6
NC
No internal connection
—
8
—
12
CRETN
—
13
EXT CLK IN
—
14
INT/EXT
Non-inverting Input
Negative Power Supply
Capacitor current return pin
INT CLK OUT Internal Clock Output
2001-2012 Microchip Technology Inc.
External Clock Input
Select Internal or External Clock
DS21464C-page 5
TC7652
3.0
DETAILED DESCRIPTION
3.1
Capacitor Connection
FIGURE 3-1:
R2
1MΩ
Connect the null storage capacitors to the CA and CB
pins with a common connection to the CRET pin (14-pin
TC7652) or to VSS (8-pin TC7652). When connecting to
VSS, avoid injecting load current IR drops into the
capacitive circuitry by making this connection directly
via a separate wire or PC trace.
3.2
3.3
R1
1kΩ
Clock
The TC7652 has a 550Hz internal oscillator, which is
divided by two before clocking the input chopper
switches. The 275Hz chopping frequency is available
at INT CLK OUT (Pin 12) on 14-pin devices. In normal
operation, INT/EXT (Pin 14), which has an internal pullup, can be left open.
An external clock can also be used. To disable the
internal clock and use an external one, the INT/EXT pin
must be tied to VSS. The external clock signal is then
applied to the EXT CLK IN input (Pin 13). An internal
divide-by-two provides a 50% switching duty cycle. The
capacitors are only charged when EXT CLK IN is high,
so a 50% to 80% positive duty cycle is recommended
for higher clock frequencies. The external clock can
swing between VDD and VSS, with the logic threshold
about 2.5V below VDD.
The output of the internal oscillator, before the divideby-two circuit, is available at EXT CLK IN when INT/
EXT is high or unconnected. This output can serve as
the clock input for a second TC7652 (operating in a
master/slave mode), so that both op amps will clock at
the same frequency. This prevents clock intermodulation effects when two TC7652's are used in a differential amplifier configuration.
DS21464C-page 6
TC7652
+
C
R
Output
C
0.1µF
Output Clamp
In chopper stabilized amplifiers, the output clamp pin
reduces overload recovery time. When a connection is
made to the inverting input pin (summing junction), a
current path is created between that point and the output pin, just before the device output saturates. This
prevents uncontrolled differential input voltages and
charge build-up on correction storage capacitors. Output swing is reduced.
TEST CIRCUIT
0.1µF
If the TC7652's output saturates, error voltages on the
external capacitors will slow overload recovery. This
condition can be avoided if a strobe signal is available.
The strobe signal is applied to EXT CLK IN and the
overload signal is applied to the amplifier while the
strobe is LOW. In this case, neither capacitor will be
charged. The low leakage of the capacitor pins allow
long measurements to be made within eligible errors
(typical capacitor drift is 10V/sec).
4.0
TYPICAL APPLICATIONS
4.1
Component Selection
CA and CB (external capacitors)should be in the 0.1F
to 1F range. For minimum clock ripple noise, use a
1F capacitor in broad bandwidth circuits. For limited
bandwidth applications where clock ripple is filtered
out, use a 0.1F capacitor for slightly lower offset voltage. High quality, film type capacitors (polyester or
polypropylene) are recommended, although a lower
grade ceramic may work in some applications. For
quickest settling after initial turn-on, use low dielectric
absorption capacitors (e.g., polypropylene). With
ceramic capacitors, settling to 1V takes several seconds.
4.2
Static Protection
Although input diodes static protect all device pins,
avoid strong electrostatic fields and discharges that
can cause degraded diode junction characteristics and
produce increased input-leakage currents.
2001-2012 Microchip Technology Inc.
TC7652
4.3
Output Stage/Load Driving
with a 1k load), and this lower gain is inconsequential.
For wide band, the best frequency response occurs
with a load resistor of at least 10k. This produces a
6dB/octave response from 0.1Hz to 2MHz, with phase
shifts of less than 2 degrees in the transition region,
where the main amplifier takes over from the null amplifier.
The output circuit is high impedance (about 18k).
With lesser loads, the chopper amplifier behaves
somewhat like a transconductance amplifier with an
open-loop gain proportional to load resistance. (For
example, the open-loop gain is 17dB lower with a 1k.
load than with a 10k load.) If the amp is used only for
DC, the DC gain is typically greater than 120dB (even
FIGURE 4-1:
CONNECTION OF INPUT GUARDS
Inverting Amplifier
Follower
R2
R1
Input
TC7652
TC7652
-
Output
+
Input
+
Output
Noninverting Amplifier
R2
TC7652
Output
+
R1
Input
4.4
Thermoelectric Effects
The thermoelectric (Seebeck) effects in thermocouple
junctions of dissimilar metals, alloys, silicon, etc. limit
ultra high precision DC amplifiers. Unless all junctions
are at the same temperature, thermoelectric voltages
around 0.1V/C (up to tens of V/C for some materials) are generated. To realize the low offset voltages of
the chopper, avoid temperature gradients. Enclose
components to eliminate air movement, especially from
power dissipating elements in the system. Where possible, use low thermoelectric co-efficient connections.
Keep power supply voltages and power dissipation to a
minimum. Use high impedance loads and seek maximum separation from surrounding heat disipating elements.
2001-2012 Microchip Technology Inc.
4.5
Guarding
To benefit from TC7652 low input currents, take care
assembling printed circuit boards. Clean boards with
alcohol or TCE and blow dry with compressed air. To
prevent contamination, coat boards with epoxy or silicone rubber.
Even if boards are cleaned and coated, leakage currents may occur because input pins are next to pins at
supply potentials. To reduce this leakage, use guarding
to lower the voltage difference between the inputs and
adjacent metal runs. The guard (a conductive ring surrounding inputs) is connected to a low impedance point
at about the same voltage as inputs. The guard
absorbs leakage currents from high voltage pins.
The 14-pin dual-in-line arrangement simplifies guarding. Like the LM108 pin configuration (but unlike the
101A and 741), pins next to inputs are not used.
DS21464C-page 7
TC7652
4.6
FIGURE 4-3:
Pin Compatibility
Where possible, the 8-pin device pinout conforms to
such industry standards as the LM101 and LM741. Null
storing external capacitors connect to Pins 1 and 8,
which are usually for offset null or compensation capacitors. Output clamp (Pin 5) is similarly used. For OP05
and OP07 devices, replacement of the offset null
potentiometer (connected between Pins 1 and 8 and
VDD by two capacitors from those pins to VSS) provides
compatibility. Replacing the compensation capacitor
between Pins 1 and 8 by two capacitors to VSS is
required. The same operation (with the removal of any
connection to Pin 5) works for LM101, A748 and similar parts.
Because NC pins provide guarding between input and
other pins, the 14-pin device pinout conforms closely to
the LM108. Because this device does not use any extra
pins and does not provide offset nulling (but requires a
compensation capacitor), some layout changes are
necessary to convert to the TC7652.
4.7
R2
Input
Output
+
0.1µF
FIGURE 4-4:
0.1µF
USING 741 TO BOOST
OUTPUT DRIVE
CAPABILITY
TC7652
+15V
+
NONINVERTING
AMPLIFIER WITH
OPTIONAL CLAMP
0.1µF
TC7652
Input
TC7652
–
-7.5V
Figures 4-2 and 4-3 show basic inverting and noninverting amplifier circuits using the output clamping circuit to enhance overload recovery performance. The
only limitations on replacing other op amps with the
TC7652 are supply voltage (±8V maximum) and output
drive capability (10k load for full swing). Overcome
these limitations with a booster circuit (Figure 4-4) to
combine output capabilities of the LM741 (or other
standard device) with input capabilities of the TC7652.
These two form a composite device, therefore, when
adding the feedback network, the monitor loop gains
stability.
0.1µF
Clamp
R1
Some Applications
FIGURE 4-2:
INVERTING AMPLIFIER
WITH OPTIONAL CLAMP
+
741
+
In
–
Out
–
-7.5V
-15V
0.1
µF
0.1
µF
10kΩ
Figure 4-5 shows the clamp circuit of a zero offset comparator. Because the clamp circuit requires the inverting input to follow the input signal, problems with a
chopper stabilized op amp are avoided. The threshold
input must tolerate the output clamp current VIN/R
without disrupting other parts of the system.
Figure 4-6 shows how the TC7652 can offset null high
slew rate and wideband amplifiers.
Mixing the TC7652 with circuits operating at ±15V
requires a lower supply voltage divider with the TC7660
voltage converter circuit operated "backwards." Figure
4-7 shows an approximate connection.
Output
–
Clamp
R3
R2
FIGURE 4-5:
LOW OFFSET
COMPARATOR
0.1µF
R1
0.1µF
TC7652
VIN
+
VOUT
–
Clamp
VTH
200kΩ to 2mΩ
DS21464C-page 8
2001-2012 Microchip Technology Inc.
TC7652
FIGURE 4-6:
1437 OFFSET NULLED BY
TC7652
TC7652
+
–
22kΩ
22kΩ
+
Out
In
–
FIGURE 4-7:
Fast
Amplifier
SPLITTING +15V WITH
THE 7660 AT >95%
EFFICIENCY
2
8
+15V
TC7660
3
10µF
+7.5V
10µF
4
6
5
0V
1MW
2001-2012 Microchip Technology Inc.
DS21464C-page 9
TC7652
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Supply Current
vs ± Supply Voltage
1400
Output Resistance
vs Output Voltage
0.1mA
-5.0
OUTPUT VOLTAGE (V)
1200
SUPPLY CURRENT (µA)
Positive Clamp Current
1 mA
1000
800
600
400
CLAMP CURRENT
5.0
SINK
-4.0
SOURCE
0.01mA
1µA
0.1µA
0.01µA
1nA
0.1nA
200
0.01nA
-3.0
0
2
3
4
5
6
7
± SUPPLY VOLTAGE (V)
8
100
Negative Clamp Current
1M
1pA
4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
OUTPUT VOLTAGE (V)
Noise at 0.1Hz to 100Hz
Noise at 0.1Hz to 10Hz
1k
10k
100k
OUTPUT RESISTANCE (W)
1mA
2 µV/DIV
1µA
1 µV/DIV
CLAMP CURRENT
0.1mA
0.01mA
0.1µA
0.01µA
1nA
0.1nA
0.01nA
1 sec/DIV
1 sec/DIV
Slew Rate
Noise at 0.1Hz to 1Hz
Phase Gain (Bode Plot)*
60
GAIN
GAIN (dB)
0.5V/DIV
1 µV/DIV
40
30
20
10
+240
+180
50
PHASE
+120
+60
0
-60
PHASE (deg)
1pA
4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
OUTPUT VOLTAGE (V)
-120
0
-180
-10
-20
1 sec/DIV
DS21464C-page 10
5 µsec/DIV
1
10 100
1k 10k 100k 1M
FREQUENCY (Hz)
*NOTE:
±5V, ±2.5V supplies; no load to 10k load.
2001-2012 Microchip Technology Inc.
TC7652
Input Offset Voltage vs Common Mode Voltage
4.0
INPUT OFFSET
VOLTAGE (µV)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
-6
-4
-2
0
2
4
COMMON MODE VOLTAGE (V)
2001-2012 Microchip Technology Inc.
DS21464C-page 11
TC7652
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking information not available at this time.
DS21464C-page 12
2001-2012 Microchip Technology Inc.
TC7652
6.2
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.015 (0.38)
.008 (0.20)
3˚MIN.
.400 (10.16)
.310 (7.87)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
14-Pin PDIP (Narrow)
PIN 1
.260 (6.60)
.240 (6.10)
.310 (7.87)
.290 (7.37)
.770 (19.56)
.745 (18.92)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.015 (0.38)
.008 (0.20)
3˚MIN.
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.070 (1.78)
.045 (1.14)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
2001-2012 Microchip Technology Inc.
DS21464C-page 13
TC7652
7.0
REVISION HISTORY
Revision C (December 2012)
Added a note to each package outline drawing.
DS21464C-page 14
2001-2012 Microchip Technology Inc.
TC7652
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21464C-page 15
TC7652
NOTES:
DS21464C-page 16
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768419
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21464C-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21464C-page 18
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
2001-2012 Microchip Technology Inc.
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