TC913BCOA713

TC913A/TC913B Dual Auto-Zeroed Operational Amplifiers Package Type Features: • First Monolithic Dual Auto-Zeroed Operational Amplifier • Chopper Amplifier Performance Without External Capacitors: - VOS: 15 V Max. - VOS: Drift; 0.15 V/°C Max. - Saves Cost of External Capacitors • SOIC Packages Available • High DC Gain; 120dB • Low Supply Current; 650 A • Low Input Voltage Noise: - 0.65 VP-P (0.1 Hz to 10 Hz) • Wide Common Mode Voltage Range: - VSS to VDD - 2V • High Common Mode Rejection; 116dB • Dual or Single Supply Operation: - ±3.3V to ±8.3V - +6.5V to +16V • Excellent AC Operating Characteristics: - Slew Rate; 2.5V/sec - Unity-Gain Bandwidth; 1.5 MHz • Pin Compatible with LM358, OP-14, MC1458, ICL7621, TL082, TLC322 Applications: • • • • • Instrumentation Medical Instrumentation Embedded Control Temperature Sensor Amplifier Strain Gage Amplifier PDIP TC913ACPA TC913BCPA OUT A 1 -IN A 2 B + +IN A 3 V 8 V A - + DD 7 OUT B - 4 SS 6 -IN B 5 +IN B SOIC TC913ACOA TC913BCOA OUT A 1 -IN A 2 A - + +IN A 3 V 4 SS 8 V DD B + 7 OUT B - 6 -IN B 5 +IN B General Description: The TC913 is the world’s first complete monolithic, dual auto-zeroed operational amplifier. The TC913 sets a new standard for low-power, precision dual-operational amplifiers. Chopper-stabilized or auto-zeroed amplifiers offer low offset voltage errors by periodically sampling offset error, and storing correction voltages on capacitors. Previous single amplifier designs required two user-supplied, external 0.1F error storage correction capacitors — much too large for on-chip integration. The unique TC913 architecture requires smaller capacitors, making on-chip integration possible. Microvolt offset levels are achieved and external capacitors are not required. The TC913 system benefits are apparent when contrasted with a TC7650 chopper amplifier circuit implementation. A single TC913 replaces two TC7650’s and four capacitors. Five components and assembly steps are eliminated. Device Selection Table Temp. Range Offset Voltage Part Number Package TC913ACOA 8-Pin SOIC 0°C to +70°C 15 V TC913ACPA 8-Pin PDIP 0°C to +70°C 15 V TC913BCOA 8-Pin SOIC 0°C to +70°C 30 V TC913BCPA 8-Pin PDIP 0°C to +70°C 30 V  2001-2012 Microchip Technology Inc. The TC913 pinout matches many popular dual-operational amplifiers: OP-04, TLC322, LM358, and ICL7621 are typical examples. In many applications, operating from dual 5V power supplies or single supplies, the TC913 offers superior electrical performance, and can be a functional drop-in replacement; printed circuit board rework is not necessary. The TC913’s low offset voltage error eliminates offset voltage trim potentiometers often needed with bipolar and low accuracy CMOS operational amplifiers. The TC913 takes full advantage of Microchip’s proprietary CMOS technology. Unity gain bandwidth is 1.5 MHz and slew rate is 2.5V/sec. DS21482D-page 1 TC913A/TC913B Functional Block Diagram VDD VSS 4 8 TC913 VOS Correction Amplifier + A A – B * B Internal Oscillator (fOSC 200 Hz) * -Input -Input +Input +Input A B A B 2 6 5 3 + Main Amplifier Low-Impedance Output Buffer + 1 - 7 Output A Output B 1 of 2 Amplifier Shown *NOTE: Internal capacitors. No external capacitors required. DS21482D-page 2  2001-2012 Microchip Technology Inc. TC913A/TC913B 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Total Supply Voltage (VDD to VSS) ....................... +18V Input Voltage ...................... (VDD +0.3V) to (VSS -0.3V) Current Into Any Pin........................................... 10 mA While Operating ......................................... 100 A Package Power Dissipation (TA – 70°C) Plastic DIP ............................................... 730 mW Plastic SOIC ............................................ 470 mW Operating Temperature Range C Device .......................................... 0°C to +70°C Storage Temperature Range.............. -65°C to +150°C TC913A AND TC913B ELECTRICAL SPECIFICATIONS Electrical Characteristics: VS = ±5V, TA = +25°C, unless otherwise indicated. TC913A Symbol Min Typ Max Min Typ Max Unit Input Offset Voltage — 5 15 — 15 30 V TCVOS Average Temp. Coefficient of Input Offset Voltage — — 0.05 0.05 0.15 0.15 — — 0.1 0.1 0.25 0.25 V/°C V/°C IB Average Input Bias Current — — — — — — 90 3 4 — — — — — — 120 4 6 pA nA nA TA = +25°C 0°C  TA  +70°C -25°C  TA  +85° IOS Average Input Offset Current — — 5 — 20 1 — — 10 — 40 1 pA nA TA = +25°C TA = +85°C eN Input Voltage Noise — — 0.6 11 — — — — 0.6 11 — — VP-P VP-P VOS Parameter TC913B Test Conditions TA = +25°C 0°C  TA  +70°C -25°C  TA  +85°C (Note 1) 0.1 to 1 Hz, RS  100 0.1 to 10 Hz, RS  100 VSS  VCM  VDD - 2.2 CMRR Common Mode Rejection Ratio 110 116 — 100 110 — dB CMVR Common Mode Voltage Range VSS — VDD - 2 VSS — VDD - 2 V Open-Loop Voltage Gain 115 120 — 110 120 — dB RL = 10 k, VOUT = ±4V VSS + 0.3 — VDD - 0.9 VSS + 0.3 — VDD -0.9 V RL = 10 k — 1.5 — — 1.5 — MHz AOL VOUT Output Voltage Swing BW Closed Loop Bandwidth SR Closed Loop Gain = +1 V/sec RL = 10 k, CL = 50 pF Slew Rate — 2.5 — — 2.5 — PSRR Power Supply Rejection Ratio 110 — — 100 — — dB ±3.3V to ±5.5V VS Operating Supply Voltage Range ±3.5 7.0 — — ±8.3 16 ±3.5 7.0 — — ±8.3 16 V V Split Supply Single Supply IS Quiescent Supply Current — 0.65 0.85 — — 1.1 mA Note 1: VS = ±5V Characterized; not 100% tested.  2001-2012 Microchip Technology Inc. DS21482D-page 3 TC913A/TC913B 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin PDIP) (8-Pin SOIC) Symbol 1 OUT A Description Output 2 -IN A Inverting Input 3 +IN A Non-inverting Input 4 VSS 5 +IN B 6 -IN B 7 OUT B 8 VDD DS21482D-page 4 Negative Power Supply Non-inverting Input Inverting Input Output Positive Power Supply  2001-2012 Microchip Technology Inc. TC913A/TC913B 3.0 DETAILED DESCRIPTION 3.1 Theory of Operation Each of the TC913’s two Op Amps actually consists of two amplifiers. A main amplifier is always connected from the input to the output. A separate nulling amplifier alternately nulls its own offset and then the offset of the amplifier. Since each amplifier is continuously being nulled, offset voltage drift with time, temperature and power supply variations is greatly reduced. All nulling circuitry is internal and the nulling operation is transparent to the user. Offset nulling voltages are stored on two internal capacitors. An internal oscillator and control logic, shared by the TC913’s two amplifiers, control the nulling process. 3.2 Pin Compatibility 3.3 Overload Recovery The TC913 recovers quickly from output saturation. Typical recovery time from positive output saturation is 20 msec. Negative output saturation recovery time is typically 5 msec. 3.4 Avoiding Latch-up Junction-isolated CMOS circuits inherently contain a parasitic p-n-p-n transistor circuit. Voltages exceeding the supplies by 0.3V should not be applied to the device pins. Larger voltages can turn the p-n-p-n device on, causing excessive device power supply current and power dissipation. The TC913’s power supplies should be established at the same time or before input signals are applied. If this is not possible, input current should be limited to 0.1 mA to avoid triggering the p-n-p-n structure. The TC913 pinout is compatible with OP-14, LM358, MC1458, LT1013, TLC322, and similar dual Op Amps. In many circuits operating from single or ±5V supplies, the TC913 is a drop-in replacement offering DC performance rivaling that of the best single Op Amps. The TC913’s amplifiers include a low-impedance class AB output buffer. Some previous CMOS chopper amplifiers used a high-impedance output stage which made open-loop gain dependent on load resistance. The TC913’s open-loop gain is not dependent on load resistance.  2001-2012 Microchip Technology Inc. DS21482D-page 5 TC913A/TC913B 4.0 TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Input Offset Voltage vs. Common Mode Voltage 1200 INPUT OFFSET VOLTAGE (µV) SUPPLY CURRENT (µA) VA = ±5V 1000 800 600 400 200 0 2 3 4 5 6 ± SUPPLY VOLTAGE (V) 7 8 ± OUTPUT VOLTAGE (V) Output Voltage Swing vs. Load Resistance 5.0 TA = +25°C VS = ±5V 4.2 Gain and Phase vs. Frequency 50 35 TA = +25°C 30 TA = +25°C 25 20 15 225 VS = ±5V 40 PHASE 30 180 TA = +25°C RL = 10 kW 135 GAIN 20 90 10 45 0 0 -10 -45 -20 -90 5 -30 -135 0 -40 10k 10 -6 -5 -4 -3 -2 -1 0 1 2 3 4 INPUT COMMON MODE VOLTAGE (V) Negative Overload Recovery Time PHASE (deg) Supply Current vs. ± Supply Voltage CLOSED-LOOP GAIN (dB) Note: -180 10M 100k 1M FREQUENCY (Hz) Positive Overload Recovery Time RL = 10 kW -SWING TA = +25°C +SWING OUTPUT = 2 V/DIV INPUT 0V 0V 3.4 2.6 OUTPUT = 2 V/DIV 1.8 Gain = –20 1.0 100 1k 10k 100k LOAD RESISTANCE (W) DS21482D-page 6 1M HORIZONTAL SCALE = 20 msec/DIV INPUT INPUT GAIN = –20 HORIZONTAL SCALE = 20 msec/DIV  2001-2012 Microchip Technology Inc. TC913A/TC913B 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N)  2001-2012 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21482D-page 7 TC913A/TC913B 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC Pin 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) Typ. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .010 (0.25) .007 (0.18) 8° Max. .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .050 (1.27) .016 (0.40) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .022 (0.56) .015 (0.38) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .310 (7.87) Dimensions: inches (mm) DS21482D-page 8  2001-2012 Microchip Technology Inc. TC913A/TC913B 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing.  2001-2012 Microchip Technology Inc. DS21482D-page 9 TC913A/TC913B NOTES: DS21482D-page 10  2001-2012 Microchip Technology Inc. TC913A/TC913B THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.  2001-2012 Microchip Technology Inc. DS21482D-page 11 TC913A/TC913B READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC913A/TC913B Literature Number: DS21482D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21482D-page 12  2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768440 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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