UPR15E3/TR7

UPR5e3, UPR10e3, UPR15e3 2.5 Amp High Efficiency Ultrafast Rectifier KEY FEATURES DESCRIPTION The Microsemi UPR5e3, UPR10e3, and UPR15e3 Powermite high efficiency rectifiers are RoHS compliant and offers optimized forward voltage characteristics with reverse blocking capabilities up to 150 Volts. They are ideal for surface mount applications that operate at high frequencies. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates possibility of solder flux entrapment during assembly and a unique locking tab acts as an efficient heat path from die to mounting plane for external heat sinking with very low thermal resistance junction to case (bottom). Its innovative design makes this device ideal for use with automatic insertion equipment. ƒ Low thermal resistance DO-216 package for higher current operation ƒ Utrasfast recovery time of 25 ns ƒ RoHS Compliant with e3 suffix part number ƒ Efficient heat path with Integral locking bottom metal tab ƒ Low forward voltage ƒ Full metallic bottom eliminates flux entrapment ƒ Compatible with automatic insertion ƒ Low profile-maximum height of 1mm WWW . Microsemi .C OM ® IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) APPLICATIONS/BENEFITS Rating Symbol Value Unit Working Peak Reverse Voltage UPR5e3 Working Peak Reverse Voltage UPR10e3 Working Peak Reverse Voltage UPR15e3 VRWM VRWM VRWM 50 100 150 V V V Io 2.5 A Switching and Regulating Power Supplies. Charge Pump Circuits Reduces reverse recovery loss with low IRM Small 8.45 mm2 foot print (See mounting pad details next page) MECHANICAL & PACKAGING Average Rectified Output Current (at rated VRWM, TC =75ºC) Non-Repetitive Peak Forward Surge Current 8.3ms Single half-sine wave Storage Temperature IFSM 25 A TSTG -55 to +150 ºC Junction Temperature TJ -55 to +150 ºC THERMAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED) Thermal Resistance Junction-to-case (bottom) Junction-to-ambient (1) ƒ ƒ ƒ ƒ RθJC RθJA 10 240 ºC/ Watt ºC/ Watt (1) When mounted on FR-4 PC board using 1 oz copper with recommended minimum foot print See further details and dimensions on last page Copyright © 2007 10-15-2007 Rev C Microsemi Page 1 UPS5 e3, 10 e3, 15e3 DO-216 • CASE: Void-free transfer molded thermosetting epoxy compound meeting UL94V-0 • FINISH: Annealed matte-Tin plating over copper and readily solderable per MILSTD-750 method 2026 (consult factory for Tin-Lead plating) • POLARITY: See figure (left) • MARKING: UPR5e3: R05• UPR10e3: R10• UPR15e3: R15• • WEIGHT: 0.016 grams (approx.) • Package dimension on last page • Tape & Reel option: 12 mm tape per Standard EIA-481-B, 3000 on 7 inch reel and 12,000 on 13” reel UPR5e3, UPR10e3, UPR15e3 2.5 Amp High Efficiency Ultrafast Rectifier ELECTRICAL PARAMETERS @ 25°C (unless otherwise specified) Symbol Forward Voltage (Note 1) Forward Voltage (Note 1) Conditions Min Typ. Max Units IF = 2.0 Amps 0.975 V IF = 2.0 Amps, TJ = 100C 0.895 V Reverse Current IR VR = VRWM, TJ = 25 ºC 2.0 µA Reverse Current IR VR = VRWM, TJ = 100 ºC 50 µA Reverse Recovery Time trr IF = 0.5 A; IR = 1.0 A: IREC = 0.25 A 25 ns WWW . Microsemi .C OM Parameter Note: 1 Short duration test pulse used to minimize self – heating effect. PACKAGE & MOUNTING PAD DIMENSIONS Copyright © 2007 10-15-2007 Rev C (All dimensions +/-.005 inches) Microsemi MOUNTING PAD in inches Page 2 UPS5e3, 10e3, 15e3 DO-216 Package