USB3740B
High Speed USB 2.0 Switch with ESD Protection
and Low Standby Current
Features
• flexPWRTM Technology
- 30nA Active/Standby Current
- Extremely low power design ideal for battery
powered applications
• Control inputs accommodate 1.8V to 5V inputs
• DP/DM tolerate up to 5.5V
• -40°C to +85°C Operating Temperature
• 10-pin, QFN, RoHS compliant package;
(1.3mm x 1.8mm x 0.55mm height, 0.4mm pitch)
• 10-pin, QFN, RoHS compliant package;
(1.6mm x 2.1mm x 0.55mm height, 0.5mm pitch)
• Automotive option
• High Speed USB Mux for multiplexing the USB
lanes between different functions
- Switch the USB connector between two different functions
- Up to 1GHz Bandwidth
• USB Port ESD Protection (DP/DM)
- 8kV HBM
Block Diagram
USB3740B
DM
HS USB
Switch
ESD Protection
DP
ESD Protection
USB Connector
DP_2
DM_2
DP_1
DM_1
DP
DM
DP
DM
USB 2.0 PHY,
Processor, or
Accessory
USB 2.0 PHY,
Processor, or
Accessory
VDD
VDD
OE_N
GND
2011 - 2015 Microchip Technology Inc.
S
Processor
DS00001725D-page 1
USB3740B
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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DS00001725D-page 2
2011 - 2015 Microchip Technology Inc.
USB3740B
Table of Contents
1.0 General Description ........................................................................................................................................................................ 4
2.0 Pin Layout ....................................................................................................................................................................................... 5
3.0 Electrical Specifications .................................................................................................................................................................. 6
4.0 General Operation .......................................................................................................................................................................... 7
5.0 Application Notes ............................................................................................................................................................................ 8
6.0 Package Outlines ............................................................................................................................................................................ 9
The Microchip Web Site ...................................................................................................................................................................... 16
Customer Change Notification Service ............................................................................................................................................... 16
Customer Support ............................................................................................................................................................................... 16
Product Identification System ............................................................................................................................................................. 17
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 3
USB3740B
1.0
GENERAL DESCRIPTION
The USB3740B is a USB 2.0 compliant High Speed switch that provides robust ESD protection to the interface in an
extremely small package. Outstanding ESD robustness eliminates the need for external ESD protection devices to save
eBOM cost and PCB area.
The high bandwidth capabilities of the USB3740B enable extremely low high frequency loss and an exceptionally clean
USB 2.0 High Speed eye diagram.
FIGURE 1-1:
USB3740B USB 2.0 HIGH SPEED EYE DIAGRAM
Input to Switch
1.1
Output of Switch
Reference Document
Universal Serial Bus Specification, Revision 2.0
DS00001725D-page 4
2011 - 2015 Microchip Technology Inc.
USB3740B
2.0
PIN LAYOUT
2.1
Pin Diagram
The USB3740B is available in both a 0.4mm pitch QFN (1.3mm x 1.8mm x 0.55mm height) and 0.5mm pitch QFN
(1.6mm x 2.1mm x 0.55mm height) package. The 0.5mm pitch package can be ordered in standard or automotive configurations. For additional ordering information, refer to the Product Identification System section.
2.2
1
5
7
VDD
DM_2
4
2
S
6
3
DP_2
OE_N
DM_1
USB3740B PACKAGE DIAGRAM
DP_1
FIGURE 2-1:
10
DP
9
DM
8
GND
Ball/Pin Definitions
The following table details the ball/pin definitions for the package diagram above.
Type/
Direction
Pin
Name
10
DP
Analog
9
DM
Analog
2
DP_1
Analog
1
DM_1
Analog
6
DP_2
Analog
7
DM_2
Analog
8
GND
Analog
Ground
5
VDD
Analog
Power
4
S
Digital Input
Switch control. Refer to Table 4-1.
3
OE_N
Digital Input
Active low switch Output Enable. Refer to Table 4-1.
2011 - 2015 Microchip Technology Inc.
Description
USB Mux Output
USB Mux Input 1
USB Mux Input 2
DS00001725D-page 5
USB3740B
3.0
ELECTRICAL SPECIFICATIONS
3.1
Absolute Maximum Ratings
TABLE 3-1:
ABSOLUTE MAXIMUM RATINGS
Description
Rating
VDD Voltage to GND
-0.3 to 6.0
Unit
V
Any other pin to GND
-0.3 to VDD+0.5
V
Operating Temperature Range
-40 to +85
C
-55 to +150
C
8,000
V
Storage Temperature Range
ESD Rating
HBM
Stresses beyond the Absolute Maximum Ratings may damage the USB3740B.
3.2
Electrical Specifications
TABLE 3-2:
ELECTRICAL SPECIFICATIONS
Characteristic
Symbol
MIN
TYP
MAX
Units
Conditions
VDD = 5.0V, TA = -40C to 85C, all typical values at TA = 25C unless otherwise noted.
VDD Recommended Operating Conditions
Input Voltage
VDD
Active/Standby
IDD
3.0
5.5
V
30
175
nA
1
2
5
ohm
1
2
2.5
USB Mux Characteristics
USB Mux On Resistance
RON_USB
0V < Vin < 3.3V
0V < Vin < 0.4V
USB Mux Off Leakage
IOFF_USB
100
200
nA
0V < Vin < 3.3V
On Capacitance
CON_USB
5
7
pF
VDD = 3V
Off Capacitance
COFF_USB
Off Isolation
-30
Crosstalk
Bandwidth (-3dB)
BW
3
4
pF
VDD = 3V
-32
-40
dB
RL = 50 ohm, F = 250MHz
-30
-45
-60
dB
RL = 50 ohm, F = 250MHz
950
1000
1100
MHz
RL = 50 ohm, CL = 0pF
850
950
980
RL = 50 ohm, CL = 5pF
530
560
600
RL = 50 ohm, CL = 10pF
Control Signal Characteristics
Input Logic High Threshold
VIN_H
Input Logic Low Threshold
VIN_L
DS00001725D-page 6
1.4
V
0.4
V
2011 - 2015 Microchip Technology Inc.
USB3740B
4.0
GENERAL OPERATION
The USB3740B is a high bandwidth switch suitable for many applications, including High Speed USB. The mux allows
high speed signals to pass through and still meet HS USB signaling requirements.
The USB3740B will protect the system from ESD stress events on all DP and DM pins. The USB3740B provides ESD
protection to the IEC-61000 ESD specification.
The USB mux is designed to pass High Speed USB signals to the USB connector, and allows for two USB inputs to be
multiplexed into one USB output.
The USB Mux is designed to pass USB signals from 0 to VDD. It is not designed to pass signals that go above VDD or
below ground.
The USB3740B switches are controlled by the digital signals OE_N and S, as shown in Table 4-1.
TABLE 4-1:
USB3740B SWITCH STATES DEFINITION
OE_N
S
1
X
STANDBY:
• Both switch paths disconnected.
• Lowest power state
0
0
DP = DP1, DM = DM1:
0
1
DP = DP2, DM = DM2:
2011 - 2015 Microchip Technology Inc.
Switch State
DS00001725D-page 7
USB3740B
5.0
APPLICATION NOTES
5.1
ESD Performance
The USB3740B is protected from ESD strikes. By eliminating the requirement for external ESD protection devices,
board space is conserved, and the board manufacturer is enabled to reduce cost. The advanced ESD structures integrated into the USB3740B protect the device whether or not it is powered up.
5.1.1
HUMAN BODY MODEL (HBM) PERFORMANCE
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing,
and is done without power applied to the IC. To pass the test, the device must have no change in operation or performance due to the event. The USB3740B HBM performance is detailed in Table 3-1.
DS00001725D-page 8
2011 - 2015 Microchip Technology Inc.
USB3740B
6.0
PACKAGE OUTLINES
6.1
1.3mm x 1.8mm QFN
FIGURE 6-1:
10-PIN, 1.3MM X 1.8MM QFN PACKAGE OUTLINE
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
NOTE 1
A
N
B
1
E
(DATUM B)
2
(DATUM A)
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
A1
C
A
SEATING
PLANE
(A3)
SIDE VIEW
10X
0.08 C
4X L1
6X L
2
1
NOTE 1
N
10X b
0.07
0.05
e
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-386A Sheet 1 of 2
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 9
USB3740B
FIGURE 6-2:
10-PIN, 1.3MM X 1.8MM QFN PACKAGE DIMENSIONS
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Length
Overall Width
Terminal Width
Terminal Length
Terminal Length
Units
Dimension Limits
N
e
A
A1
A3
D
E
b
L
L1
MIN
0.50
0.00
0.15
0.35
0.45
MILLIMETERS
NOM
10
0.40 BSC
0.55
0.02
0.127 REF
1.30 BSC
1.80 BSC
0.20
0.40
0.50
MAX
0.60
0.05
0.25
0.45
0.55
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-386A Sheet 2 of 2
DS00001725D-page 10
2011 - 2015 Microchip Technology Inc.
USB3740B
FIGURE 6-3:
10-PIN, 1.3MM X 1.8MM QFN PACKAGE LAND PATTERN
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X
20
G2
1
C2
2
G1
Y1
E
SILK SCREEN
Y2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X10)
X
Contact Pad Length (X6)
Y1
Contact Pad Length (X4)
Y2
Contact Pad to Pad (X6)
G1
Contact Pad to Pad (X4)
G2
MIN
MILLIMETERS
NOM
0.40 BSC
1.10
1.70
MAX
0.20
0.70
0.80
0.20
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2386A
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 11
USB3740B
6.2
1.6mm x 2.1mm QFN
FIGURE 6-4:
10-PIN, 1.6MM X 2.1MM QFN PACKAGE OUTLINE
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (3V) - 1.6.x2.1 mm Body [UQFN
Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
NOTE 1
(DATUM B)
1
E
2
(DATUM A)
2X
0.10 C
2X
TOP VIEW
0.10 C
0.10 C
C
A1
A
SEATING
PLANE
10X
SIDE VIEW
(A3)
0.08 C
K2
4x L2
e
2
1
K1
NOTE 1
6X L1
N
e
BOTTOM VIEW
10X b
0.10
0.05
C A B
C
Microchip Technology Drawing C04-381A Sheet 1 of 2
DS00001725D-page 12
2011 - 2015 Microchip Technology Inc.
USB3740B
FIGURE 6-5:
10-PIN, 1.6MM X 2.1MM QFN PACKAGE DIMENSIONS
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (3V) - 1.6x2.1 mm Body [UQFN]
Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Width
Overall Length
Terminal Width
Terminal Length
Terminal Length
Terminal Clearance
Terminal Clearance
Units
Dimension Limits
N
e
A
A1
(A3)
E
D
b
L1
L2
K1
K2
MIN
0.50
0.00
0.20
0.35
0.60
0.20
0.20
MILLIMETERS
NOM
10
0.50 BSC
0.55
0.02
0.127 REF
2.10 BSC
1.60 BSC
0.25
0.40
0.65
-
MAX
0.60
0.05
0.30
0.45
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-379A Sheet 2 of 2
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 13
USB3740B
FIGURE 6-6:
10-PIN, 1.6MM X 2.1MM QFN PACKAGE LAND PATTERN
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (3V) - 1.6.x2.1 mm Body [UQFN
Chip-On-Lead
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
4X Y2
10
10X X1
1
C2 e
2
6X G1
6X Y1
e
SILK SCREEN
C1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X10)
X1
Contact Pad Length (X6)
Y1
Contact Pad Length (X4)
Y2
Contact Pad to Center Pad (X6)
G1
MIN
MILLIMETERS
NOM
0.50 BSC
1.325
2.075
MAX
0.30
0.825
1.075
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2381A
DS00001725D-page 14
2011 - 2015 Microchip Technology Inc.
USB3740B
APPENDIX A:
TABLE A-1:
DATA SHEET REVISION HISTORY
REVISION HISTORY
Revision
Section/Figure/Entry
Correction
DS00001725D (03-11-15)
Section 6.0, "Package
Outlines," on page 9
Updated 1.6x2.1 UQFN and 1.3x1.8 UQFN
package drawings.
DS00001725C (12-11-14)
Cover
Added bullet: “Automotive option (1.6 x 2.1mm,
0.5mm pitch package only)“
Added sub-bullet: “8kV HBM”
DS00001725B (08-21-14)
FIGURE 6-1: 10-pin, 1.3mm
x 1.8mm QFN Package
Outline on page 9 and
FIGURE 6-4: 10-pin, 1.6mm
x 2.1mm QFN Package
Outline on page 12
Updated package drawings to latest revision C
Product Identification
System
Added automotive ordering code information.
Added tape and reel quantity information.
Section 2.1, "Pin Diagram,"
on page 5
Clarified which package is available for the
automotive option.
All: Cover, Order Codes
Made operating temperature references generic
“-40°C to +85°C”
Document is converted to Microchip template; Product Identification System page
replaces Ordering Information.
DS00001725A replaces the
previous SMSC version,
Rev. 1.2
Title changed from “High Speed Switch for Mobile
and Portable Applications” to “High Speed USB 2.0
Switch with ESD Protection and Low Standby
Current”
Rev. 1.2 (07-30-12)
Table 3-1, “Absolute
Maximum Ratings,” on
page 6
Corrected “Any other pin to GND” row’s rating to “0.3 to VDD+0.5V”
Rev. 1.1 (12-15-11)
Section 2.2, "Ball/Pin
Definitions"
In Section 2.2, changed the description of Pin #8
as follows: “Ground”
Rev. 1.0 (08-03-11)
Data Sheet Release
2011 - 2015 Microchip Technology Inc.
DS00001725D-page 15
USB3740B
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
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CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support
DS00001725D-page 16
2011 - 2015 Microchip Technology Inc.
USB3740B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Standard Ordering Codes
PART NO.
-
Device
[X](1)
-
XXX
Package
Tape and Reel
Option
Examples:
a)
b)
Device:
Package:
USB3740B
AI2
AI9
=
=
USB3740B-AI2-TR
10-pin QFN RoHS Compliant package
(1.3 x 1.8 x 0.55mm, 0.4mm pitch)
Tape & Reel
USB3740B-AI9-TR
10-pin QFN RoHS Compliant package
(1.6 x 2.1 x 0.55mm, 0.5mm pitch)
Tape & Reel
10-pin QFN (1.3 x 1.8 x 0.55mm, 0.4mm pitch)
10-pin QFN (1.6 x 2.1 x 0.55mm, 0.5mm pitch)
Note 1:
Tape and Reel
Option:
Blank
TR
= Tray packaging
= Tape and Reel
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Reel size is 3,000.
Automotive Ordering Code
PART NO.
Device
Device:
X(2) Tape
and
Reel
X
Temp.
/
XX
-
XXX
Example:
a)
Package
Automotive
Code
USB3740T-I/ML-V01
Tape & Reel
10-pin QFN RoHS Compliant package
(1.6mm x 2.1mm, 0.5mm pitch),
Automotive
USB3740
Tape and Reel:
T
= Tape and Reel
Temperature:
I
= -40°C to +85°C
Package:
ML
= 10-pin QFN (1.6mm x 2.1mm, 0.5mm pitch)
Automotive Code:
V01
= Automotive
2011 - 2015 Microchip Technology Inc.
Note 2:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Reel size is 3,000.
DS00001725D-page 17
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK,
MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial
Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2011 - 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632771148
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS00001725D-page 18
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2011 - 2015 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
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Tel: 66-2-694-1351
Fax: 66-2-694-1350
01/27/15
DS00001725D-page 19
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