USB5533B
3-Port SS/HS USB Hub Controller
General Description
The USB5533B hub is a 3-port SuperSpeed/Hi-Speed,
low-power, configurable hub controller family fully compliant with the USB 3.0 Specification. The USB5533B
supports 5 Gbps SuperSpeed (SS), 480 Mbps HiSpeed (HS), 12 Mbps Full-Speed (FS) and 1.5 Mbps
Low-Speed (LS) USB signaling for complete coverage
of all defined USB operating speeds.
The USB5533B supports USB 2.0 speeds through its
USB 2.0 hub controller. The new SuperSpeed hub controller operates in parallel with the USB 2.0 controller,
so the 5 Gbps SuperSpeed data transfers are not
affected by the slower USB 2.0 traffic.
The USB5533B supports battery charging on a per port
basis. On battery charging enabled ports, the devices
provide automatic USB data line handshaking. The
handshaking supports USB 1.2 Charging Downstream
Port (CDP), Dedicated Charging Port (DCP) and nonUSB 1.2 devices.
The USB5533B is configured for operation through
internal default settings, where custom configurations
are supported through an on-chip OTP ROM, an external SPI ROM, or SMBus.
Product Features
• USB 3.0 compliant 5 Gbps, 480 Mbps, 12 Mbps
and 1.5 Mbps operation, USB pins are 5 V tolerant
- Integrated termination and pull-up/pull-down
resistors
• Three downstream USB 3.0 ports
• Supports battery charging of most popular battery
powered devices
- USB-IF Battery Charging rev. 1.2 support
(DCP & CDP)
- Apple Portable product charger emulation
- Blackberry charger emulation
- Chinese YD/T 1591-2006 charger emulation
- Chinese YD/T 1591-2009 charger emulation
- Supports additional portable devices
2012 - 2015 Microchip Technology Inc.
• Emulates portable/handheld native wall chargers
- Charging profiles emulate a handheld
device’s wall charger to enable fast charging
(minutes vs. hours)
• Enables charging from a mobile platform that is
off
• Support tablets’ high current requirements
• Optimized for low-power operation and low thermal dissipation
• Vendor Specific Messaging (VSM) support for
firmware upload over USB
• Configuration via OTP ROM, SPI ROM, or SMBus
• On-chip 8051 µC manages VBUS, and other hub
signals
• 8 KB RAM, 32 KB ROM
• One Time programmable (OTP) ROM: 8 kbit
- Includes on-chip charge pump
• Single 25 MHz XTAL or clock input for all on-chip
PLL and clocking requirements
• Supports JTAG boundary scan
• PHYBoost (USB 2.0)
- Selectable drive strength for improved signal
integrity
• VariSense (USB 2.0)
- controls the receiver sensitivity enabling four
programmable levels of USB signal receive
sensitivity
• IETF RFC 4122 compliant 128-bit UUID
Software Features
• Compatible with Microsoft Windows 7, Vista, XP,
Mac OSX10.4+, and Linux Hub Drivers
DS00001680C-page 1
USB5533B
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS00001680C-page 2
2012 - 2015 Microchip Technology Inc.
USB5533B
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Block Diagram ................................................................................................................................................................................. 6
3.0 Pin Information ................................................................................................................................................................................ 7
4.0 Standard Interface Connections ................................................................................................................................................... 13
5.0 Functional Operation ..................................................................................................................................................................... 24
6.0 DC Parameters ............................................................................................................................................................................. 55
7.0 AC Specifications .......................................................................................................................................................................... 59
8.0 Package Drawing .......................................................................................................................................................................... 62
Appendix A: Data Sheet Revision History ........................................................................................................................................... 64
Appendix B: Acronyms ........................................................................................................................................................................ 66
Appendix C: References ..................................................................................................................................................................... 67
The Microchip Web Site ...................................................................................................................................................................... 68
Customer Change Notification Service ............................................................................................................................................... 68
Customer Support ............................................................................................................................................................................... 68
Product Identification System ............................................................................................................................................................. 69
2012 - 2015 Microchip Technology Inc.
DS00001680C-page 3
USB5533B
1.0
INTRODUCTION
1.1
Conventions
Within this manual, the following abbreviations and symbols are used to improve readability.
Example
BIT
FIELD.BIT
x…y
BITS[m:n]
PIN
Name of a single bit within a field
Name of a single bit (BIT) in FIELD
Range from x to y, inclusive
Groups of bits from m to n, inclusive
Pin Name
zzzzb
Binary number (value zzzz)
0xzzz
Hexadecimal number (value zzz)
zzh
Hexadecimal number (value zz)
rsvd
Reserved memory location. Must write 0, read value indeterminate
code
Instruction code, or API function or parameter
Multi Word Name
Used for multiple words that are considered a single unit, such as:
Resource Allocate message, or Connection Label, or Decrement Stack Pointer instruction.
Section Name
Section or Document name.
x
1.2
Description
Don’t care
indicate a Parameter is optional or is only used under some conditions
{,Parameter}
Braces indicate Parameter(s) that repeat one or more times.
[Parameter]
Brackets indicate a nested Parameter. This Parameter is not real and actually decodes into
one or more real parameters.
Overview
The USB5533B hub is a 3-port, low-power, configurable Hub Controller fully compliant with the USB 3.0 Specification
2. The USB5533B supports 5 Gbps SuperSpeed (SS), 480 Mbps Hi-Speed (HS), 12 Mbps Full-Speed (FS) and
1.5 Mbps Low-Speed (LS) USB signaling for complete coverage of all defined USB operating speeds.
All required resistors on the USB ports are integrated into the hub. This includes all series termination resistors and all
required pull-down and pull-up resistors on D+ and D- pins. The over-current sense inputs for the downstream facing
ports have internal pull-up resistors.
The USB5533B hub includes programmable features such as:
• MultiTRAKTM Technology (USB 2.0): implements a dedicated Transaction Translator (TT) for each port. Dedicated TTs help maintain consistent full-speed data throughput regardless of the number of active downstream
connections.
• PortSwap (USB 2.0): allows direct alignment of USB signals (D+/D-) to connectors to avoid uneven trace length
or crossing of the USB differential signals on the PCB.
• PHYBoost (USB 2.0): enables 4 programmable levels of USB signal drive strength in downstream port transceivers. PHYBoost will also attempt to restore USB signal integrity.
As shown on the Product Identification System page, two USB5533B firmware versions are available: “-5000” and “6080”. These options differ in the following ways:
• The Dynamic Charging Port feature and related DYNCPDIS_N pin function are only available on the -6080
device. Refer to Section 5.1.3, "Dynamic Charging Port (6080 Only)" for additional details.
• The TRST/DYNCPDIS_N/UCS_SMBALERT_N pin buffer type is “IPU” in the -6080 device and “I” in the -5000
device. Refer to Pin Information on page 7 for additional details.
• The Global Suspend power consumption has been significantly lowered in the -6080 device. Refer to Section 6.3,
"Power Consumption" for additional details.
DS00001680C-page 4
2012 - 2015 Microchip Technology Inc.
USB5533B
1.3
Configurable Features
The USB5533B hub controller provides a default configuration that is sufficient for most applications. When initialized
in the default configuration, the following features may be configured:
•
•
•
•
•
Downstream non-removable ports, where the hub will automatically report as a compound device
Downstream disabled ports
Downstream port power control and over-current detection on a ganged or individual basis
USB signal drive strength
USB differential pair pin location
The USB5533B hub controllers can alternatively be configured by OTP or as an SMBus slave device. When configured
by an OTP or over SMBus, the following configurable features are provided:
• Support for compound devices on a port-by-port basis
• Selectable over-current sensing and port power control on an individual or ganged basis to match the circuit board
component selection
• Customizable vendor ID, product ID, and device ID
• Configurable delay time for filtering the over-current sense inputs
• Indication of the maximum current that the hub consumes from the USB upstream port
• Indication of the maximum current required for the hub controller
• Custom string descriptors (up to 30 characters): Product, manufacturer, and serial number
2012 - 2015 Microchip Technology Inc.
DS00001680C-page 5
DS00001680C-page 6
RX
SS
PHY
TX
SS
PHY
Buffer
Buffer
Registers
& Hub I/O
USB2.0
PHY
SS
PHY
RX
Buffer
USB2.0
PHY
Downstream USB Port 2
SS
PHY
TX
Buffer
Registers
& Hub I/O
APB Bus
2k OTP
Reset & 8051
Boot Seq.
XData to
APB Bridge
SS
PHY
RX
Buffer
USB2.0
PHY
Downstream USB Port 3
SS
PHY
TX
Buffer
HS/FS/LS Routing Logic
VBUS
Control
XData
USB 2.0 Hub Controller
8k RAM
32k ROM
Embedded
8051 µC
Downstream RX SS bus
Downstream TX SS bus
Downstream USB Port 1
Buffer
SS
PHY
SS
PHY
USB2.0
PHY
Timer
SPI
Master
SPI
FIGURE 2-1:
USB 3.0 Hub Controller
RX
TX
2.0
Buffer
Common
Block
& PLL
Upstream USB Port
USB5533B
BLOCK DIAGRAM
USB5533B BLOCK DIAGRAM
2012 - 2015 Microchip Technology Inc.
USB5533B
3.0
PIN INFORMATION
This chapter outlines the pinning configurations for each chip. The detailed pin descriptions are listed by function in Section 3.2, "Pin Descriptions (Grouped by Function)," on page 8.
Pin Configurations
TMS/OCS2
TCK/OCS1
TRST/DYNCPDIS_N/
UCS_SMBALERT_N
TDI/OCS3
TDO
SPI_DI
SPI_DO
SPI_CLK
SPI_CE_N
SM_CLK
SM_DAT
PRT_PWR1/PRT_CTL1
PRT_PWR2/PRT_CTL2
VDD33
PRT_PWR3/PRT_CTL3
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
USB5533B 64-PIN QFN
VBUS
FIGURE 3-1:
48
3.1
TEST
49
32
NC
RESET_N
50
31
VDD12
VDD12
51
30
NC
VDD33
52
29
NC
USB2DP_UP
53
28
VDD12
USB2DM_UP
54
27
NC
USB3DP_TXUP
55
26
NC
USB3DM_TXUP
56
NC
VDD12
57
USB5533B
25
24
USB3DP_RXUP
58
(Top View QFN-64)
NC
23
USB3DM_RXDN3
USB3DM_RXUP
59
22
USB3DP_RXDN3
ATEST
60
21
VDD12
XTALOUT
61
20
USB3DM_TXDN3
XTALIN/CLK_IN
62
19
USB3DP_TXDN3
VDD33
63
18
USB2DM_DN3
RBIAS
64
17
USB2DP_DN3
Ground Pad
5
6
7
8
9
10
11
12
13
14
15
16
VDD12
USB3DP_RXDN1
USB3DM_RXDN1
VDD12
USB2DP_DN2
USB2DM_DN2
USB3DP_TXDN2
USB3DM_TXDN2
VDD12
USB3DP_RXDN2
USB3DM_RXDN2
VDD33
3
USB3DP_TXDN1
4
2
USB2DM_DN1
USB3DM_TXDN1
1
USB2DP_DN1
(must be connected to VSS with a via field)
Indicates pins on the bottom of the device.
2012 - 2015 Microchip Technology Inc.
DS00001680C-page 7
USB5533B
3.2
Pin Descriptions (Grouped by Function)
An N at the end of a signal name indicates that the active (asserted) state occurs when the signal is at a low voltage
level. When the N is not present, the signal is asserted when it is at a high voltage level. The terms assertion and negation are used exclusively in order to avoid confusion when working with a mixture of active low and active high signals.
The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high
or low voltage. The term negate, or negation, indicates that a signal is inactive.
TABLE 3-1:
USB5533B PIN DESCRIPTIONS
Symbol
Buffer Type
Description
USB 3.0 INTERFACE
USB3DP_TXUP
IO-U
USB 3 Upstream
Upstream SuperSpeed transmit data plus
USB3DM_TXUP
IO-U
USB 3 Upstream
Upstream SuperSpeed transmit data minus
USB3DP_RXUP
IO-U
USB 3 Upstream
Upstream SuperSpeed receive data plus
USB3DM_RXUP
IO-U
USB 3 Upstream
Upstream SuperSpeed receive data minus
USB3DP_TXDN[3:1]
IO-U
USB 3 Downstream
Downstream SuperSpeed transmit data plus for ports 1 through 3.
USB3DM_TXDN[3:1]
IO-U
USB 3 Downstream
Downstream SuperSpeed transmit data minus for ports 1 through 3.
USB3DP_RXDN[3:1]
IO-U
USB 3 Downstream
Downstream SuperSpeed receive data plus for ports 1 through 3.
USB3DM_RXDN[3:1]
IO-U
USB 3 Downstream
Downstream SuperSpeed receive data minus for ports 1 through 3.
USB 2.0 INTERFACE
USB2DP_UP
IO-U
USB Bus Data
These pins connect to the upstream USB bus data signals.
USB2DM_UP
IO-U
USB Bus Data
These pins connect to the upstream USB bus data signals.
USB2DP_DN[3:1]
USB2DM_DN[3:1]
DS00001680C-page 8
IO-U
IO-U
USB Downstream
Downstream Hi-Speed data plus for ports 1 through 3.
USB Downstream
Downstream Hi-Speed data minus for ports 1 through 3.
2012 - 2015 Microchip Technology Inc.
USB5533B
TABLE 3-1:
USB5533B PIN DESCRIPTIONS (CONTINUED)
Symbol
Buffer Type
Description
USB PORT CONTROL
PRT_PWR[3:1]/
PRT_CTL[3:1]
O12
USB Power Enable
Enables power to USB peripheral devices downstream.
Note:
VBUS
I
This pin also provides configuration strap functions.
See Note 3-1.
Upstream VBUS Power Detect
This pin can be used to detect the state of the upstream bus power. The
device monitors this pin to determine when to assert the internal D+ pullup resistor (signaling a connect event).
When designing a detachable hub, this pin should be connected to
VBUS on the upstream port via a 2:1 voltage divider. Two 100 k
resistors are suggested.
For self-powered applications with a permanently attached host, this pin
must be connected to a dedicated host control output, or connected to
the 3.3 V domain that powers the host (typically VDD33).
SPI INTERFACE (4 PINS)
SPI_CE_N
O12
SPI_CLK
O12
SPI Enable
SPI Clock
SPI Serial Data Out
SPI_DO
O12
The output for the SPI port.
Note:
SPI_DI
I
This pin also provides configuration strap functions.
See .
SPI Serial Data In
The SPI data in to the controller from the ROM. This pin has a weak
internal pull-down applied at all times to prevent floating.
JTAG/OCS INTERFACE
JTAG Asynchronous Reset
TRST
DYNCPDIS_N
IPU
(Note 3-4)
Note:
If using the SMBus interface, a pull-up on this signal will enable
Legacy Mode, while leaving it unconnected or pulled-down will
enable Advanced Mode.
Note:
Only available in test mode.
Dynamic Charging Port Disable
This active-low signal is used to globally disable Battery Charging
support on all USB downstream ports configured as Charging Ports.
Note:
UCS_SMBALERT_N
This signal available in -6080 versions only
UCS1002 SMBus Alert
When charging port is enabled and SMBus devices are used, this signal
acts as an active-low SMBus alert.
2012 - 2015 Microchip Technology Inc.
DS00001680C-page 9
USB5533B
TABLE 3-1:
USB5533B PIN DESCRIPTIONS (CONTINUED)
Symbol
Buffer Type
Description
JTAG Clock
TCK
This input is used for JTAG boundary scan and has a weak pull-down.
It can be left floating or grounded when not used. If the JTAG is
connected, then this signal will be detected high, and the software
disables the pull up after reset.
I
Note:
Only available in test mode.
Over-Current Sense 1
OCS1
Input from external current monitor indicating an over-current condition.
Note:
This pin also provides configuration strap functions.
See Note 3-3.
JTAG TMS
TMS
Used for JTAG boundary scan.
Note:
OCS2
I
Only available in test mode.
Over-Current Sense 2
Input from external current monitor indicating an over-current condition.
Note:
This pin also provides configuration strap functions.
See Note 3-3.
JTAG TDI
TDI
Used for JTAG boundary scan.
Note:
OCS3
I
Only available in test mode.
Over-Current Sense 3
Input from external current monitor indicating an over-current condition.
Note:
This pin also provides configuration strap functions.
See Note 3-3.
JTAG TDO
TDO
O12
Used for JTAG boundary scan.
Note:
Only available in test mode.
MISC
RESET_N
IS
Reset Input
The system uses this active low signal to reset the chip. The active low
pulse should be at least 1 s wide.
Crystal Input: 25 MHz crystal.
XTALIN
CLK_IN
ICLKx
This pin connects to either one terminal of the crystal or to an external
25 MHz clock when a crystal is not used.
External Clock Input
This pin connects to either one terminal of the crystal or to an external
25 MHz clock when a crystal is not used.
XTALOUT
OCLKx
Crystal Output
The clock output, providing a crystal 25 MHz. When an external clock
source is used to drive XTALIN/CLK_IN, this pin becomes a no
connect.
TEST
IPD
Test Pin
Treat as a no connect pin or connect to ground. No trace or signal
should be routed or attached to this pin.
DS00001680C-page 10
2012 - 2015 Microchip Technology Inc.
USB5533B
TABLE 3-1:
USB5533B PIN DESCRIPTIONS (CONTINUED)
Symbol
Buffer Type
RBIAS
I-R
Description
USB Transceiver Bias
A12.0 k (+/- 1%) resistor is attached from ground to this pin to set the
transceiver’s internal bias settings.
A
ATEST
Analog Test Pin
This signal is used for testing the chip and must always be connected
to ground.
SM_CLK
I/O12
SMBus Clock
SM_DAT
I/O12
SMBus Data Pin
(7) NC
-
No connect pins
DIGITAL AND POWER
(4) VDD33
3.3 V Power
(8) VDD12
1.25 V Power
Ground Pad
VSS
This exposed pad is the device’s only connection to VSS and the
primary thermal conduction path. Connect to an appropriate via field.
Note 3-1
The PRT_PWR[3:1] pins can optionally provide additional configuration strap functions to
enable/disable the associated port and configure its battery charging capabilities. Configuration strap
values are latched on device reset. Table 3-2 details the functions associated with the various strap
settings.
Strapping features are enabled by default and can be optionally disabled via the Pro-Touch software
programming tool. For additional information on the Pro-Touch programming tool, contact your local
sales representative.
Strapping functions are not supported for designs that support OCS but not power switching.
TABLE 3-2:
PRT_PWR[3:1] CONFIGURATION STRAP STATES
PRT_PWR[3:1]
Strap Setting
Port State
Battery Charging
No Pull-Up or Pull-Down
Enabled
Disabled
Pull-Down:
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