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UTC2000-I/MG

UTC2000-I/MG

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    VFQFN16_EP

  • 描述:

    USB, Type-C Controller PMIC 16-QFN (3x3)

  • 数据手册
  • 价格&库存
UTC2000-I/MG 数据手册
UTC2000 Basic USB Type-C Controller TM Highlights Key Benefits • Transition any existing USB Type-A design to a USB Type-C Downstream Facing Port or any existing Type-B design to a USB Type-C Upstream Facing Port • Leverage the USB Type-C reversible cable and compact form factor • For use with USB 2.0, USB 3.0 or USB 3.1 • Supports legacy, 1.5A, & 3.0A USB Type-C charging profiles • Compact 3 x 3mm 16-pin QFN package • Commercial, industrial, and automotive extended temperature support • Requires minimal design effort TM Target Applications • • • • • • • Laptops Desktop PCs Monitors USB Hubs USB Wall Chargers Industrial Automotive  2015 Microchip Technology Inc. • USB Type-C cable connection and orientation detection • Orientation detection indicator for optional USB switch control • Powered cable detection with VCONN powered cable supply control • CFG_SEL pin configurable charging profiles: - 5V Legacy DFP mode (500mA for USB 2.0, 900mA for USB 3.0/USB 3.1) - 5V @ 1.5A DFP mode - 5V @ 3.0A DFP mode - UFP mode • ENABLE pin for host/hub port control • VMON pin monitors VBUS overvoltage conditions • USB Type-C Audio Adapter detection and control • OCS# fault input pin • FAULT_IND fault indicator output pin • Operating Voltage Range: - 4.5V to 5.5V • Package - 16-pin QFN (3 x 3 x 0.9mm) • Environmental - Commercial temperature range (0°C to +70°C) - Industrial temperature range (-40°C to +85°C) - Extended temperature range (-40°C to +125°C) DS00001957C-page 1 UTC2000 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00001957C-page 2  2015 Microchip Technology Inc. UTC2000 Table of Contents 1.0 Introduction ..................................................................................................................................................................................... 4 2.0 Pin Descriptions .............................................................................................................................................................................. 7 3.0 Functional Description .................................................................................................................................................................. 11 4.0 Operational Characteristics ........................................................................................................................................................... 19 5.0 UTC2000 System Application ....................................................................................................................................................... 23 6.0 Packaging Information .................................................................................................................................................................. 33 Appendix A: Data Sheet Revision History ........................................................................................................................................... 37 The Microchip Web Site ...................................................................................................................................................................... 39 Customer Change Notification Service ............................................................................................................................................... 39 Customer Support ............................................................................................................................................................................... 39 Product Identification System ............................................................................................................................................................. 40  2015 Microchip Technology Inc. DS00001957C-page 3 UTC2000 1.0 INTRODUCTION 1.1 General Description The USB Type-CTM Specification was introduced in August 2014 and substantially expands the capabilities of USB. The key new features include: • New Connector - Smaller Form Factor - 24 Pins - Reversible Insertion • Simplified Current Capability Marking - Resistor-divider implementation instead of DP/DM “handshake” The Microchip UTC2000 USB Type-C controller targets designers who wish to gain the benefits of the small, reversible form factor and elevated charging current abilities of a USB Type-C solution while minimally impacting the overall cost per port. The UTC2000 USB Type-C controller is a cost-effective, simple solution that facilitates rapid migration of legacy USB 2.0/3.0 designs to the USB Type-C connector. The UTC2000 controller is designed for USB 2.0/3.0 Downstream Facing Port (DFP) and Upstream Facing Port (UFP) applications and performs all of the necessary detection and control required for implementing a basic USB Type-C connector. The UTC2000 features ADCs that monitor the CC1 and CC2 pins of the USB Type-C receptacle to detect various connection events. In a DFP application, passive cables, powered cables, and USB audio adapters can all be detected. Controls for enabling a USB +5V port power switch, VCONN 5V active cable supply, and audio adapter enable are all included. Additional features include host enable control and overcurrent detection. In a UFP application, the UTC2000 detects a valid USB Type-C connection, the plug orientation, and the charging capability of the DFP. The UTC2000 also monitors VBUS to ensure a valid VBUS range and detected overcurrent. The UTC2000 can operate from a single 4.5V-5.5V supply and is available in commercial, industrial and extended temperature range options. 1.2 USB Type-CTM Downstream Facing Port (DFP) Implementation Overview A UTC2000 Implementation of a DFP minimally requires 5 major components/circuitry blocks: • • • • Microchip UTC2000 A USB 2.0 downstream port (USB 3.0/USB 3.1 may optionally be implemented based upon system requirements) A USB Type-C Receptacle A 5V Port Power Controller capable of supplying the advertised current capability (advertised with the value of Rp and the pull-up voltage) • CC Pin Circuitry: - Rp Pull-Up Resistors - VCONN Control/Switching Note: A High-Speed or Super Speed USB switch is also recommended but optional. For USB 2.0 applications, this component may be omitted. For USB 3.0/USB 3.1 applications, this component may only be omitted if two USB 3.0/USB 3.1 downstream ports are dedicated for use on the USB Type-C port. A system diagram utilizing the UTC2000 in a DFP application is shown in Figure 1-1. DS00001957C-page 4  2015 Microchip Technology Inc. UTC2000 FIGURE 1-1: TYPICAL DFP APPLICATION BLOCK DIAGRAM PPC_EN OCS# USB Host 5V Port Power Controller USB VBUS USB USB Mux/ Switch USB PLUG_ORIENTATION# ENABLE VCONN VCONN1_OUT# 5V VCONN2_OUT# Microchip UTC2000 (DFP Mode) Rp Rp CC1 CC2 1.3 Type-C Upstream Facing Port (UFP) Implementation Overview A UTC2000 Implementation of a UFP minimally requires 4 major components/circuitry blocks: • • • • Microchip UTC2000 A USB 2.0 upstream port (USB 3.0/USB 3.1 may optionally be implemented based upon system requirements) A USB Type-C Receptacle CC Pin Circuitry: - Rd Pull-Up Resistors Note: A High-Speed or Super Speed USB switch is also recommended but optional. For USB 2.0 applications, this component may be omitted. For USB 3.0/USB 3.1 applications, this component may not be omitted unless a Microchip Hub with FlexConnect is utilized. Refer to the Microchip USB5734 USB Type-C Evaluation Board for details on implementation. A system diagram utilizing the UTC2000 in a UFP application is shown in Figure 1-2.  2015 Microchip Technology Inc. DS00001957C-page 5 UTC2000 FIGURE 1-2: TYPICAL UFP APPLICATION BLOCK DIAGRAM Optional Protection From OV,OC VBUS System Power Current Sense USB Mux/ Switch USB USB USB USB Device PLUG_ORIENTATION# OCS# CONNECTED# VMON LEGACY_IND# CC1 ADC input resistors limit leakage when unpowered CC2 Rd 1.4 Microchip UTC2000 (UFP Mode) 1.5A_IND# Rd 3.0A_IND# Glossary of Terms TABLE 1-1: GLOSSARY OF TERMS Term Definition ADC Analog to Digital Converter AFE Analog Front End CC Generic reference to USB Type-CTM Cable / Connector CC1/CC2 pins DFP Downstream Facing Port (USB Type-C Cable and Connector Specification definition) DRP Dual Role Port (USB Type-C Cable and Connector Specification definition) Microchip Microchip Technology Incorporated POR Power-On Reset USB Type-C USB Type-C Cable / Connector UFP Upstream Facing Port (USB Type-C Cable and Connector Specification definition) 1.5 References • USB Type-CTM Cable and Connector Specification: http://www.usb.org/developers/docs/ Note: USB Type-CTM and USB-CTM are trademarks of USB Implementers Forum. DS00001957C-page 6  2015 Microchip Technology Inc. UTC2000 2.0 PIN DESCRIPTIONS The UTC2000 pin diagram can be seen in Figure 2-1. Table 2-1 provides a pin assignment table. Pin descriptions are provided in Section 2.2 “Pin Descriptions”. Pin Assignments NC VSS PIN ASSIGNMENTS VDD FIGURE 2-1: NC 2.1 16 15 14 13 TABLE 2-1: ENABLE 3 FAULT_IND 4 UTC2000 5 6 7 11 PLUG_ORIENTATION# 10 PPC_EN/3.0A_IND# 9 VCONN1_OUT#/1.5A_IND# 8 VCONN2_OUT#/LEGACY_IND# 2 CC1 CFG_SEL 12 VMON CC2 1 AUDIO_ADAPTER/CONNECTED# OCS# PIN ASSIGNMENTS Pin Number Pin Name 1 OCS# 2 CFG_SEL 3 ENABLE 4 FAULT_IND 5 AUDIO_ADAPTER/CONNECTED# 6 CC2 7 CC1 8 VCONN2_OUT#/LEGACY_IND# 9 VCONN1_OUT#/1.5A_IND# 10 PPC_EN/3.0A_IND# 11 PLUG_ORIENTATION# 12 VMON 13 VSS 14 NC 15 NC VDD 16 Note 1: The exposed pad should be connected to VSS.  2015 Microchip Technology Inc. DS00001957C-page 7 UTC2000 2.2 Pin Descriptions TABLE 2-2: PIN DESCRIPTIONS Name Symbol Buffer Type Description Digital Inputs Controller Enable ENABLE IS Active high enable signal. The UTC2000 will remain in its default, inactive state unless this pin is asserted high. If unused, tie this pin to VDD through a 10kΩ pull-up resistor. Fault Input OCS# IS (PU) This active low signal is asserted by the +5V VBUS power supplying device to notify the UTC2000 when a system fault condition has occurred. Typically, this signal is used for overcurrent or overvoltage conditions, but it can be used for any system related failure. All digital control outputs will revert to their default, deasserted state when this pin is asserted. Normal operation will resume after deassertion of this pin. After any OCS# assertion, a fault flag will be set and the FAULT_IND pin will assert. This flag is only cleared after a device reset or power cycle. If unused, this pin can be left floating. Analog Inputs Configuration Selection CFG_SEL ADC This analog to digital converter pin is sampled at power-on at Vcfg_samp to place the UTC2000 in either DFP or UFP mode. Once in UFP mode, the UTC2000 will always remain in UFP mode and can only switch to DFP mode after a power-on reset. Once in DFP mode, the UTC2000 can actively switch between 3.0A, 1.5A, or the default legacy (500mA USB 2.0, 900mA USB 3.0/USB 3.1) DFP modes without power cycling. When switching between DFP modes, the voltage thresholds and ranges for connection detection on the CC1/CC2 pins are modified accordingly. Refer to Table 3-1 for additional details. VBUS Voltage Monitor VMON ADC This analog to digital converter pin monitors the input voltage on the VBUS pin of the USB receptacle. The UTC2000 will enter the fault state and deassert all outputs if the voltage exceeds 0.8V on the VMON pin (>6.4V on VBUS). A fault flag will be set and the FAULT_IND will assert after any overvoltage occurrence. This flag is only cleared after a device reset or power cycle. This pin is required for UFP Modes. If unused in DFP Modes, tie this pin to GND through a 10kΩ pull-down resistor. DS00001957C-page 8  2015 Microchip Technology Inc. UTC2000 TABLE 2-2: PIN DESCRIPTIONS (CONTINUED) Name Symbol Buffer Type CC1 Monitor CC1 ADC Description This analog to digital converter input pin monitors the USB Type-CTM CC1 signal to detect various USB Type-C connections. Refer to Table 3-1for additional details. CC2 Monitor CC2 ADC This analog to digital converter input pin monitors the USB Type-C CC2 signal to detect various USB Type-C connections. See Table 3-1 for additional details. Digital Outputs +5V VBUS Power Supply Enable PPC_EN O25 DFP Modes Only. Active high output which controls the 5V supply to VBUS. This pin only asserts when a valid USB TypeC connection is detected. Plug Orientation Indicator PLUG_ORIENTATION# OD25 This active low output pin indicates the USB Type-C cable plug orientation. This pin remains high in the default unconnected state or when an Rd pull-down resistor is detected on CC1. The pin will assert low when an Rd pull-down resistor is detected on CC2. CC1 VCONN Supply Control VCONN1_OUT# OD25 DFP Modes Only. Open drain, active low VCONN supply control to CC1 for supplying 5V to active cable circuitry. See Section 3.4 “VCONN Supply Control (DFP Modes Only)” for additional details. CC2 VCONN Supply Control VCONN2_OUT# OD25 DFP Modes Only. Open drain, active low VCONN supply control to CC2 for supplying 5V to active cable circuitry. See Section 3.4 “VCONN Supply Control (DFP Modes Only)” for additional details. Audio Adapter Indicator and Control AUDIO_ADAPTER O25 DFP Modes Only. Active high pin which indicates the detection of a USB audio adapter device. This pin is intended to control a high speed USB and audio switch which toggles between standard USB 2.0 DP/DM Signaling and audio signaling. Fault Indicator FAULT_IND O25 Active high fault indicator output. Output is asserted after an overcurrent event on OCS# is detected. Output is deasserted after toggling the ENABLE input pin or after a power-on reset. Connected State Indicator CONNECTED# OD25 UFP Mode Only. Open drain pin which asserts when a valid USB Type-C connection is detected on the CC pin, and when VBUS is within the valid voltage range. Legacy Charging Indicator LEGACY_IND# OD25 UFP Mode Only. Open drain pin which asserts low when a valid USB Type-C connection is detected and Legacy 500mA/ 900mA charging capability is detected. 1.5A Charging Indicator 1.5A_IND# OD25 UFP Mode Only. Open drain pin which asserts low when a valid USB Type-C connection is detected and 1.5A USB TypeC charging capability is detected. 3.0A Charging Indicator 3.0A_IND# OD25 UFP Mode Only. Open drain pin which asserts low when a valid USB Type-C connection is detected and 3.0A USB TypeC charging capability is detected.  2015 Microchip Technology Inc. DS00001957C-page 9 UTC2000 TABLE 2-2: PIN DESCRIPTIONS (CONTINUED) Name Symbol Buffer Type Power VDD P Description Power and Ground 5.0V Power Input. A minimum of one 0.1uF bypass capacitor placed close to the pin is recommended. The “high” level of all digital outputs will be equivalent to the VDD supply voltage. Ground 2.3 VSS P Ground. The exposed pad must also be connected to VSS/ ground. Buffer Types TABLE 2-3: BUFFER TYPES Buffer Type Description ADC Analog to digital input IS Schmitt-triggered input O25 OD25 P PU Output with 25mA sink and 25mA source Open-drain output with 25mA sink and 25mA source Power 100 µA (typical) internal pull-up. Note: Note: Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled high, an external resistor must be added. Refer to Section 4.3, DC Characteristics for electrical characteristics. DS00001957C-page 10  2015 Microchip Technology Inc. UTC2000 3.0 FUNCTIONAL DESCRIPTION This chapter describes the functional descriptions for the following device sub-systems. • • • • • • • Section 3.1, Configuration Selection Section 3.2, DFP Modes Functional State Machine Section 3.3, UFP Mode Functional State Machine Section 3.4, VCONN Supply Control (DFP Modes Only) Section 3.5, USB Audio Adapter (DFP Modes Only) Section 3.6, UFP Mode Connection and Charging Capability Detection Indicator Section 3.7, Connection and Disconnection Detection Debounce 3.1 Configuration Selection The CFG_SEL pin is sampled at power-on at Vcfg_samp and the UTC2000 is placed in either UFP or DFP modes of operation. If the CFG_SEL pin is within one of the DFP mode ranges upon power-on, it will operate in DFP mode. While in DFP mode, the CFG_SEL pin is constantly monitored and can be placed in any of the DFP modes at any time by the system controller. Switching from DFP to UFP modes cannot be achieved without a power-on reset. Table 3-1 displays the voltage ranges for the DFP profile. If the CFG_SEL pin is within the UFP mode range upon power-on, it will operate in UFP mode. For UFP designs, it is recommended to tie CFG_SEL to VDD through a pull-up resistor to ensure that UFP mode is entered when VDD crosses the POR threshold. Switching from UFP to DFP modes cannot be achieved without a power-on reset. Table 32 displays the voltage ranges for the UFP profile. TABLE 3-1: CFG_SEL Voltage DFP CONFIGURATION SELECTION VOLTAGE MONITORING THRESHOLDS Profile CC1/CC2 No Connection Voltage Range CC1/CC2 Rd Detection Voltage Range CC1/CC2 Ra Detection Voltage Range 1.2V - 1.3V 3A Capable DFP 5.0V - 2.75V 2.60V - 0.85V 0.80V - 0.00V 0.7V - 0.8V 1.5A Capable DFP 5.0V - 1.65V 1.60V - 0.45V 0.40V - 0.00V 0.0V - 0.30V Default Legacy USB Capable DFP 5.0V - 1.65V 1.60V - 0.25V 0.20V - 0.00V TABLE 3-2: UFP CONFIGURATION SELECTION VOLTAGE MONITORING THRESHOLDS CFG_SEL Voltage No Connection Voltage Range 1.75V - VDD 0.0V - 0.25V  2015 Microchip Technology Inc. CC1/CC2 Legacy CC1/CC2 1.5A CC1/CC2 3.0A Charging Connection Charging Connection Charging Connection Voltage Range Voltage Range Voltage Range 0.25V - 0.70V 0.70V-1.31V > 1.31V DS00001957C-page 11 UTC2000 3.2 DFP Modes Functional State Machine A visual representation of the UTC2000 DFP state machine behavior is shown in Figure 3-1. The various states are detailed in the following sub-sections. FIGURE 3-1: DFP MODES STATE MACHINE DIAGRAM DFP Mode Connection States Unflipped Passive Cable CFG_SEL = 0.0V – 0.3V (Legacy Profile) or CFG_SEL = 0.7V – 0.8V (1.5A Profile) or CFG_SEL = 1.2V –1.3V (1.5A Profile) CC1 detects Rd CC2 detects NC PPC_EN = High PLUG_ORIENTATION# = High VCONN1_OUT# = High VCONN2_OUT# = High AUDIO ADAPTER = Low Unflipped Powered Cable CC1 detects Rd CC2 detects Ra Disabled Idle PPC_EN = Low PLUG_ORIENTATION# = High VCONN1_OUT# = High VCONN2_OUT# =High AUDIO ADAPTER = Low ENABLE Low > High Enabled Idle Connection Detected (No Connection Detected) ENABLE High > Low PPC_EN = Low PLUG_ORIENTATION# = High VCONN1_OUT# = High VCONN2_OUT# =High AUDIO ADAPTER = Low (100ms-200ms debounce) Connection Lost PPC_EN = High PLUG_ORIENTATION# = High VCONN1_OUT# = High VCONN2_OUT# = Low AUDIO ADAPTER = Low Flipped Passive Cable CC1 detects NC CC2 detects Rd (10-20ms debounce) PPC_EN = High PLUG_ORIENTATION# = Low VCONN1_OUT# = High VCONN2_OUT# = High AUDIO ADAPTER = Low 10-20ms debounce change detected, transition to new state Flipped Powered Cable OCS# De-asserted and/or VMON < 0.8V CC1 detects Ra CC2 detects Rd Fault Deassert all outputs PPC_EN = High PLUG_ORIENTATION# = Low VCONN1_OUT# = Low VCONN2_OUT# = High AUDIO ADAPTER = Low Set FAULT_IND High OCS# Asserted or VMON > 0.8V (no debounce) 3.2.1 USB Audio Adapter CC1 detects Ra CC2 detects Ra PPC_EN = Low PLUG_ORIENTATION# = High VCONN1_OUT# = High VCONN2_OUT# = High AUDIO ADAPTER = High DISABLED IDLE The UTC2000 will remain in a disabled, inactive state if ENABLE is asserted low, or the voltage on CFG_SEL is not within a valid configuration range. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: Low PLUG_ORIENTATION#: High VCONN1_OUT#: High VCONN2_OUT#: High AUDIO_ADAPTER: Low 3.2.2 ENABLED IDLE If both ENABLE is asserted high and CFG_SEL is in a valid configuration range, the UTC2000 will actively monitor the CC1 and CC2 pins for a connect event. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: Low PLUG_ORIENTATION#: High VCONN1_OUT#: High VCONN2_OUT#: High AUDIO_ADAPTER: Low DS00001957C-page 12  2015 Microchip Technology Inc. UTC2000 3.2.3 CONNECTED (UNFLIPPED PASSIVE CABLE) If both ENABLE is asserted high and CFG_SEL is in a valid configuration range and an Rd pull-down resistor is sensed on the CC1 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED PASSIVE CABLE)” state. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: High PLUG_ORIENTATION#: High VCONN1_OUT#: High VCONN2_OUT#: High AUDIO_ADAPTER: Low 3.2.4 CONNECTED (UNFLIPPED ACTIVE CABLE) If ENABLE is asserted high, CFG_SEL is in a valid configuration range, an Rd pull-down resistor is sensed on the CC1 pin, and an Ra pull-down resistor is sensed on the CC2 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED ACTIVE CABLE)” state. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: High PLUG_ORIENTATION#: High VCONN1_OUT#: High VCONN2_OUT#: Low AUDIO_ADAPTER: Low 3.2.5 CONNECTED (FLIPPED PASSIVE CABLE) If both ENABLE is asserted high and CFG_SEL is in a valid configuration range and an Rd pull-down resistor is sensed on the CC2 pin, the UTC2000 will enter the “CONNECTED (FLIPPED PASSIVE CABLE)” state. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: High PLUG_ORIENTATION#: Low VCONN1_OUT#: High VCONN2_OUT#: High AUDIO_ADAPTER: Low 3.2.6 CONNECTED (FLIPPED ACTIVE CABLE) If ENABLE is asserted high, CFG_SEL is in a valid configuration range, an Rd pull-down resistor is sensed on the CC2 pin, and an Ra pull-down resistor is sensed on the CC1 pin, the UTC2000 will enter the “CONNECTED (UNFLIPPED ACTIVE CABLE)” state. While in this state, the state of the digital outputs are as follows: • • • • • PPC_EN: High PLUG_ORIENTATION#: Low VCONN1_OUT#: Low VCONN2_OUT#: High AUDIO_ADAPTER: Low  2015 Microchip Technology Inc. DS00001957C-page 13 UTC2000 3.2.7 CONNECTED (USB AUDIO ADAPTER) If ENABLE is asserted high, CFG_SEL is in a valid configuration range, and Ra pull-down resistors are sensed on both CC1 and CC2 pins the UTC2000 will enter the “CONNECTED (UNFLIPPED ACTIVE CABLE)” state. Note: A typical USB audio adapter device will simply short CC1 and CC2 to ground. This implementation is functionally equivalent to using two Ra resistors. While in this state, the state of the digital outs are as follows: • • • • • PPC_EN: Low PLUG_ORIENTATION#: High VCONN1_OUT#: High VCONN2_OUT#: High AUDIO_ADAPTER: High 3.2.8 FAULT (OVERCURRENT OR OVERVOLTAGE) If OCS# is asserted low while in any state, the UTC2000 will set all of its outputs to the default state and will transition into the fault state. An internal overcurrent flag will be set and FAULT_IND will drive high. Normal operation will resume after OCS# is deasserted. The FAULT_IND pin will continue to drive low until a power cycle occurs. If VMON exceeds 0.8V at any state, the UTC2000 will set all of its outputs to the default state and will transition into the fault state. An internal overvoltage flag will be set and FAULT_IND will drive high. Normal operation will resume after VMON is deasserted. The FAULT_IND pin will continue to drive low until a power cycle occurs. DS00001957C-page 14  2015 Microchip Technology Inc. UTC2000 3.3 UFP Mode Functional State Machine A visual representation of the UTC2000 UFP state machine behavior is shown in Figure 3-2. The various states are detailed in the following sub-sections. FIGURE 3-2: UFP MODE STATE MACHINE DIAGRAM UFP Mode Connection States 0.5 < VMON < 0.6875V CFG_SEL = 1.75V – VDD (4.0 < VBUS < 5.5V) Unflipped Legacy Connection CC1 detects Legacy CC2 detects NC CONNECTED# = Low PLUG_ORIENTATION# = High LEGACY_IND# = Low 1.5A_IND# = High 3.0A_IND# = High Unflipped 1.5A Connection CC1 detects 1.5A CC2 detects NC CONNECTED# = Low PLUG_ORIENTATION# = High LEGACY_IND# = High 1.5A_IND# = Low 3.0A_IND# = High Unflipped 3.0A Connection Idle (No Connection Detected) CONNECTED# = High PLUG_ORIENTATION# = High LEGACY_IND# = High 1.5A_IND# = High 3.0A_IND# = High Connection Detected (100-150ms debounce) CC1 detects 3.0A CC2 detects NC Connection Lost (10-20ms debouce) CONNECTED# = Low PLUG_ORIENTATION# = High LEGACY_IND# = High 1.5A_IND# = High 3.0A_IND# = Low 10-20ms debounce Flipped Legacy Connection OCS# De-asserted and/or VMON < 0.8V CC1 detects NC CC2 detects Legacy Fault Deassert all outputs Set FAULT_IND High change detected, transition to new state CONNECTED# = Low PLUG_ORIENTATION# = Low LEGACY_IND# = Low 1.5A_IND# = High 3.0A_IND# = High Fllipped 1.5A Connection OCS# Asserted or VMON > 0.8V CC1 detects NC CC2 detects 1.5A (no debounce) CONNECTED# = Low PLUG_ORIENTATION# = Low LEGACY_IND# = High 1.5A_IND# = Low 3.0A_IND# = High Fllipped 3.0A Connection CC1 detects NC CC2 detects 3.0A 3.3.1 CONNECTED# = Low PLUG_ORIENTATION# = Low LEGACY_IND# = High 1.5A_IND# = High 3.0A_IND# = Low IDLE The UTC2000 will remain in a disabled, inactive state if ENABLE is asserted low, or the voltage on CFG_SEL is not within a valid configuration range. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: High (Not Asserted) PLUG_ORIENTATION#: High (Not Asserted) LEGACY_IND#: High (Not Asserted) 1.5A_IND#: High (Not Asserted) 3.0A_IND#: High (Not Asserted)  2015 Microchip Technology Inc. DS00001957C-page 15 UTC2000 3.3.2 CONNECTED (UNFLIPPED LEGACY CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a Legacy Rp pull-up resistor is sensed on the CC1 pin (and no connection detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED LEGACY CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: High (Not Asserted) LEGACY_IND#: Low (Asserted) 1.5A_IND#: High (Not Asserted) 3.0A_IND#: High (Not Asserted) 3.3.3 CONNECTED (UNFLIPPED 1.5A CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a 1.5A Rp pull-up resistor is sensed on the CC1 pin (and no connection detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED 1.5A CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: High (Not Asserted) LEGACY_IND#: High (Not Asserted) 1.5A_IND#: Low (Asserted) 3.0A_IND#: High (Not Asserted) 3.3.4 CONNECTED (UNFLIPPED 3.0A CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a 3.0A Rp pull-up resistor is sensed on the CC1 pin (and no connection detected on the CC2 pin) the UTC2000 will enter the “CONNECTED (UNFLIPPED 3.0A CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: High (Not Asserted) LEGACY_IND#: High (Not Asserted) 1.5A_IND#: High (Not Asserted) 3.0A_IND#: Low (Asserted) 3.3.5 CONNECTED (FLIPPED LEGACY CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a Legacy Rp pull-up resistor is sensed on the CC2 pin (and no connection detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED LEGACY CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: Low (Asserted) LEGACY_IND#: High (Asserted) 1.5A_IND#: High (Not Asserted) 3.0A_IND#: High (Not Asserted) DS00001957C-page 16  2015 Microchip Technology Inc. UTC2000 3.3.6 CONNECTED (FLIPPED L1.5A CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a 1.5A Rp pull-up resistor is sensed on the CC2 pin (and no connection detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED 1.5A CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: Low (Asserted) LEGACY_IND#: High (Not Asserted) 1.5A_IND#: Low (Asserted) 3.0A_IND#: High (Not Asserted) 3.3.7 CONNECTED (FLIPPED 3.0A CONNECTION) If VBUS is in a valid range (4.5V-5.5V) and a 3.0A Rp pull-up resistor is sensed on the CC2 pin (and no connection detected on the CC1 pin) the UTC2000 will enter the “CONNECTED (FLIPPED 3.0A CONNECTION)” state. While in this state, the state of the digital outputs are as follows: • • • • • CONNECTED#: Low (Asserted) PLUG_ORIENTATION#: Low (Asserted) LEGACY_IND#: High (Not Asserted) 1.5A_IND#: High (Not Asserted) 3.0A_IND#: Low (Asserted) 3.3.8 FAULT (OVERCURRENT OR OVERVOLTAGE) If OCS# is asserted low while in any state, the UTC2000 will set all of its outputs to the default state and will transition into the fault state. An internal overcurrent flag will be set and FAULT_IND will drive high. Normal operation will resume after OCS# is deasserted. The FAULT_IND pin will continue to drive low until a reset or power cycle occurs. If VMON exceeds 0.8V (6.4V on VBUS) at any state, the UTC2000 will set all of its outputs to the default state and will transition into the fault state. An internal overvoltage flag will be set and FAULT_IND will drive high. Normal operation will resume after VMON is deasserted. The FAULT_IND pin will continue to drive low until a reset or power cycle occurs. 3.4 VCONN Supply Control (DFP Modes Only) VCONN1_OUT# and VCONN2_OUT# are open drain, active low output signals used to control a 5V voltage supply to power a powered USB Type-C cable. Powered cable support is mandatory for all USB Type-C applications which implement USB 3.0/USB 3.1. For USB 2.0 systems, powered cable support is optional. The VCONN supply control signals will assert low when one of the following conditions are met: • VCONN1_OUT# will assert low if an Rd resistor is detected on CC2 and an Ra resistor is detected on CC1. The signal will remain asserted until the Rd resistor on CC2 is no longer sensed (USB cable is detached). • VCONN2_OUT# will assert low if an Rd resistor is detected on CC1 and an Ra resistor is detected on CC2. The signal will remain to asserted until the Rd resistor on CC1 is no longer sensed (USB cable is detached). 3.5 Note: USB Audio Adapter (DFP Modes Only) Additional details for implementing Audio Adapter mode are detailed in Appendix A of the USB Type-CTM Cable and Connector Specification. AUDIO_ADAPTER is an active high output signal that is used to indicate when a USB audio adapter is detected. AUDIO_ADAPTER will assert high when an Ra resistor is detected on both CC1 and CC2 pins. The signal will remain asserted until either or both Ra resistors is no longer sensed. This signal is intended to control a high-speed switch that toggles between USB differential data and an audio signal.The switch that is selected must be capable of supporting USB 2.0 as well as audio signals ranging from -3.0V to +3.0V. Additional electrical details can be found in section A-3 of the USB Type-CTM Cable and Connector Specification.  2015 Microchip Technology Inc. DS00001957C-page 17 UTC2000 Two additional signals are also used when operating in Audio Adapter mode. These signals are Mic/AGND and AGND/ Mic which should be connected to SBU1 and SBU2 respectively. 3.6 UFP Mode Connection and Charging Capability Detection Indicator While operating in UFP mode, there are 4 outputs that indicate connection state. CONNECTED# is an open drain output that asserts when any of the three valid USB Type-C connections are detected. Legacy charging mode (500mA for USB 2.0 connections, 900mA for USB 3.0/USB 3.1 connections) is detected when a DFP with a 56k Rp pull-up resistor is detected. 1.5A charging is detected when a DFP with a 22k Rp pull-up resistor is detected. 3.0A charging is detected when a DFP with a 10k Rp pull-up resistor is detected. The LEGACY_IND#, 1.5A_IND#, and 3.0A_IND# open drain outputs assert low to indicate which type of connection was detected. These outputs can be fed to the battery charging management circuitry of the USB device to appropriately regulate the amount of current draw. The CONNECTED# signal may also be used to gate the VBUS voltage to system power if an added level of protection from high voltage is desired. 3.7 Connection and Disconnection Detection Debounce A debounce is implemented to eliminate unwanted connect/disconnect events due to cable jostling or USB Power Delivery messaging. A transition from the ENABLED IDLE state to any connected state is debounced by 100ms-200ms. A transition from any connected state to any other connected state or from any connected state to the ENABLED IDLE state is debounced by 10ms-20ms. DS00001957C-page 18  2015 Microchip Technology Inc. UTC2000 4.0 OPERATIONAL CHARACTERISTICS 4.1 Absolute Maximum Ratings(†) Ambient temperature under bias............................................................................................................ -40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on pins with respect to VSS on VDD pin .................................................................................................................................. -0.3V to +6.5V on all other pins .............................................................................................................. -0.3V to (VDD + 0.3V) Maximum current on VSS pin(4-1) 0°C ≤ TA ≤ +70°C ..................................................................................................................... 95 mA -40°C ≤ TA ≤ +85°C .................................................................................................................. 85 mA -40°C ≤ TA ≤ +125°C ................................................................................................................ 35 mA on VDD pin(1) 0°C ≤ TA ≤ +70°C ..................................................................................................................... 95 mA -40°C ≤ TA ≤ +85°C .................................................................................................................. 85 mA -40°C ≤ TA ≤ +125°C ................................................................................................................ 35 mA on any I/O pin ....................................................................................................................................... ±25 mA Clamp current, IK (VPIN < 0 or VPIN > VDD) ......................................................................................................... ±20 mA Note 4-1 Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. 4.2 Standard Operating Conditions The standard operating conditions for this device are defined as: Operating Voltage: Operating Temperature: VDDMIN ≤ VDD ≤ VDDMAX TA_MIN ≤ TA ≤ TA_MAX VDD — Operating Supply Voltage(4-2) VDDMIN ....................................................................................................................................... +4.5V VDDMAX ...................................................................................................................................... +5.5V TA — Operating Ambient Temperature Range Commercial Temperature TA_MIN ........................................................................................................................................... 0°C TA_MAX ...................................................................................................................................... +70°C Industrial Temperature TA_MIN ........................................................................................................................................ -40°C TA_MAX ...................................................................................................................................... +85°C Extended Temperature TA_MIN ........................................................................................................................................ -40°C TA_MAX .................................................................................................................................... +125°C Note 4-2 Refer to Parameter D001, DC Characteristics: Supply Voltage.  2015 Microchip Technology Inc. DS00001957C-page 19 UTC2000 4.3 DC Characteristics TABLE 4-1: SUPPLY VOLTAGE Param. No. Sym. D001 VDD Characteristic Min. — VPORR* D004 SVDD D005 VCFG_SAMP Note 1: Conditions — Vddmax 5.5 V 1.6 — V Power-on Reset Rearm Voltage(1) VDD Rise Rate(2) — 0.8 — V 0.05 — — V/ms Ensures that the Power-on Reset signal is released properly. CFG_SEL Sampling Threshold Voltage — * Units Power-on Reset Release Voltage(1) VPOR D003 Max. Supply Voltage Vddmin 4.5 D002* Typ† 3.6 — V These parameters are characterized but not tested. See Figure 4-1, POR and POR REARM with Slow Rising VDD. FIGURE 4-1: POR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR SVDD VSS NPOR(1) POR REARM VSS TVLOW(3) Note 1: 2: 3: DS00001957C-page 20 TPOR(2) When NPOR is low, the device is held in Reset. TPOR 1 μs typical. TVLOW 2.7 μs typical.  2015 Microchip Technology Inc. UTC2000 SUPPLY CURRENT (IDD)(1) TABLE 4-2: Conditions Param. No. Device Characteristics Min. Typ Max. Units D006 Disabled — 185 205 uA D007 Enabled — 185 205 uA 5.0 -40°C ≤ TA ≤ +85°C D008 Enabled & Connected — 1.30 1.35 mA 5.0 -40°C ≤ TA ≤ +85°C Note 1: VDD Note 5.0 -40°C ≤ TA ≤ +85°C The supply current is mainly a function of the operating voltage. Other factors, such as I/O pin loading and switching rate also have an impact on the current consumption. TABLE 4-3: I/O PORTS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Min. Typ† VIL Max. Units Conditions Input Low Voltage I/O PORT: D009 — — 0.8 V 4.5V ≤ VDD ≤ 5.5V D009A — — 0.15 VDD V 3.0V ≤ VDD ≤ 4.5V Input High Voltage VIH D010 2.0 — — V 4.5V ≤ VDD ≤ 5.5V D010A 0.25 VDD + 0.8 — — V 3.0V ≤ VDD ≤ 4.5V Input Leakage Current(1) IIL D011 I/O Ports — ±5 ± 125 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 85°C — ±5 ± 1000 nA VSS ≤ VPIN ≤ VDD, Pin at high-impedance, 125°C V Iol = 8 mA, Vdd = 5V Iol = 6 mA, Vdd = 3.3V Iol = 1.8 mA, Vdd = 1.8V V Ioh = 3.5 mA, Vdd = 5V Ioh = 3 mA, Vdd = 3.3V Ioh = 1 mA, Vdd = 1.8V VOL D012 Output Low Voltage I/O Ports — 0.6 — Voh D013 Output High Voltage I/O Ports Vdd - 0.7 — — Capacitive Loading Specifications on Output Pins D014* CIO All I/O pins — — 50 pF * † These parameters are characterized but not tested. Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin.  2015 Microchip Technology Inc. DS00001957C-page 21 UTC2000 TABLE 4-4: TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Min. 100 16 — D018 200 ms 20 ms VMON Fault Detection Reaction Delay 0.460 1 ms OCS# Fault Detection Reaction Delay tOCS#_FAULT † 160 10 tVMON_FAULT D017 Units CC1/CC2 Disconnection or Connection Change Debounce Delay tDISCONNECT_DEBOUNCE D016 Max. CC1/CC2 Connection Detection Debounce Delay tCONNECT_DEBOUNCE D015 Typ† — 0.410 1 ms Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. TABLE 4-5: THERMAL CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Param. No. Sym. Characteristic Typ. Units Conditions TH01 θJA Thermal Resistance Junction to Ambient 55.3 °C/W 16-pin QFN 3x3x0.9mm package TH02 θJC Thermal Resistance Junction to Case 10 °C/W 16-pin QFN 3x3x0.9mm package TH03 TJMAX Maximum Junction Temperature 150 °C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 Pinternal Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/θJA(2) Note 1: 2: IDD is current to run the chip alone without driving any load on the output pins. TA = Ambient Temperature; TJ = Junction Temperature DS00001957C-page 22  2015 Microchip Technology Inc. UTC2000 5.0 UTC2000 SYSTEM APPLICATION This chapter explains external requirements for UTC2000 applications and provides some example diagrams. • • • • • • • • • • • • • Section 5.1, 5V VBUS Switch (DFP Modes Only) Section 5.2, Rp Pull-Up Resistor (DFP Modes Only) Section 5.3, Rd Pull-Down Resistor (UFP Mode Only) Section 5.4, VCONN Active Cable Supply (DFP Modes Only) Section 5.5, CC Pin Isolation (DFP Only) Section 5.6, CC Pin Current Limiting Resistors (UFP Only) Section 5.7, VBUS Monitoring Section 5.8, USB Signal Multiplexer Section 5.9, Application Example: 3.0A Capable USB 3.0/USB 3.1 DFP Section 5.10, Application Example: 1.5A Capable USB 2.0 DFP Section 5.11, Application Example: 500mA Capable USB 2.0 DFP with Audio Adapter Support Section 5.12, Application Example: 3.0A Capable USB Type-CTM Charging Port (AC Adapter) Section 5.13, Application Example: UFP Device 5.1 5V VBUS Switch (DFP Modes Only) A 5V USB port power switch with active high enable input and an overcurrent indicator output is required. The USB Type-C receptacle must not supply 5V to the VBUS pins until a valid connection is detected. The UTC2000 controller asserts the active high PPC_EN signal to control the 5V port power supply to VBUS upon detection of a valid USB TypeC connection. The port power switch controlled by the UTC2000 shall also have built in overcurrent detection set to a threshold that is appropriate for the current capability profile that is being selected per Table 5-1. An overcurrent threshold of 125% (of the selected DFP profile current) is appropriate, as the threshold may not be tripped at any current less than or equal to the selected current profile. The 5V VBUS port power controller should indicate that an overcurrent event has occurred by pulling the OCS# signal to the UTC2000 controller low. 5.2 Rp Pull-Up Resistor (DFP Modes Only) A Downstream Facing Port is required to supply voltage to both CC pins through a pull-up resistor. The pull-up voltage may be either 5.0V volts or 3.3V. A UFP must implement a Rd pull-down resistor to ground. When a DFP to UFP connection is made, a resistor divider is formed, and the voltage at the CC pin can be measured to interpret the type of connection. Table 5-1 describes the possible values of the Rp pull-up resistor. Note: A constant current source may also be implemented instead of a pull-up resistor. TABLE 5-1: RP PULL-UP RESISTOR VALUES Resistor Pull-Up to 4.75 - 5.5V Resistor Pull-Up to 3.3V ± 5% Current Source Legacy USB: 500mA USB 2.0 900mA USB 3.0/USB 3.1 56 kΩ ± 20% 36 kΩ ± 20% 80 µA ± 20% 1.5A 22 kΩ ± 5% 12 kΩ ± 5% 180 µA ± 8% 3.0A 10 kΩ ± 5% 4.7 kΩ ± 5% 330 µA ± 8% DFP Advertisement The UTC2000 measures the voltages on both CC pins via it’s internal ADCs. The CC pin voltage ranges, as defined in the USB Type-CTM Cable and Connector Specification, are shown in Table 3-1. 5.3 Rd Pull-Down Resistor (UFP Mode Only) An Upstream Facing Port is required to implement a 5.1k +/- 10% Rd pull-down resistor to ground connected to both CC1 and CC2 pins on the Type-C receptacle. When a DFP to UFP connection is made, a resistor divider is formed, and the voltage at the CC pin can be measured to interpret the charging capability of the DFP.  2015 Microchip Technology Inc. DS00001957C-page 23 UTC2000 5.4 VCONN Active Cable Supply (DFP Modes Only) All USB Type-C receptacles must be able to supply power to an active cable if USB 3.0/USB 3.1 signaling is implemented. Supplying VCONN is optional if only USB 2.0 is implemented. The simplest implementation is to add a FET (or series of FETs) that switches in the VCONN voltage directly to the CC pin node. The VCONN supply must be capable of supplying 1.0W of continuous power and may not supply more than 1.25A at the moment of plug contact. A bulk capacitance of 10µF to 220µF must also be switched in with VCONN. The bulk capacitance may not need to be a discrete capacitor if the supply’s output capacitance already meets this requirement. Overcurrent detection is recommended, but not required per the USB Type-CTM Cable and Connector Specification. A simple implementation example is shown in Figure 5-1 below. Note: Rds_on must be carefully considered to ensure that the USB Type-CTM Cable and Connector Specification requirements for VCONN supply current and voltage range are met. FIGURE 5-1: EXAMPLE VCONN SUPPLY CONNECTION VCONN 1.0W Supply 10uF-220uF Bulk Cap Rp Pull-Up Voltage VCONN1_OUT# Rp Rp VCONN2_OUT# CC1 CC2 Note: 5.5 It is also recommended to implement additional circuitry to make the CC1 and CC2 pins high impedance when the DFP is in an unpowered state. Refer to Figure 5-7 for an example. CC Pin Isolation (DFP Only) The CC pins on a DFP must be high-impedance when the DFP is powered off. This is to prevent VBUS backdrive in a situation when a DFP connects to an unpowered DFP and detects the Rp pull-up resistors as an Rd pull-down. Therefore, it is recommended that some isolation FETs are implemented that disconnect the CC pins from the Rp pull-up resistors and VCONN supply circuitry when powered off. 5.6 CC Pin Current Limiting Resistors (UFP Only) Because most UFP designs require operation even when unpowered, resistors placed directly in front of the CC1 and CC2 pins are recommended to limit the amount of leakage current through the UTC2000 ADC inputs when unpowered. 10kΩ resistors are the recommended value. Failure to place current limiting resistors could result in a failure to detect a USB attach due to a shift in CC voltage. DS00001957C-page 24  2015 Microchip Technology Inc. UTC2000 5.7 VBUS Monitoring DFP Modes: An optional VBUS monitoring function may be implemented to protect the system from higher than expected voltages on VBUS (from a malfunctioning connected USB device) by preventing the UTC2000 from enabling the 5V port switch. Additional back-drive protection or isolation circuitry must be implemented for thorough protection. This feature requires the VMON pin to be connected to VBUS through a resistor divider network that divides the VBUS voltage by a factor of 8. A 35.7kΩ resistor over a 5.1kΩ resistor is recommended, as shown in the Figure 5-7, Figure 58, and Figure 5-9 below. UFP Mode: The VBUS monitoring function is required and used to verify a valid VBUS range before asserting the CONNECTED pin or any charge capability indicator outputs. A fault condition will also be flagged if higher than expected voltage on VBUS (from a malfunctioning connected USB device) is detected. Additional back-drive protection or isolation circuitry must be implemented for thorough protection. This features requires the VMON pin to be connected to VBUS through a resistor divider network that divides the VBUS voltage by a factor of 8. 5.8 USB Signal Multiplexer There are several options for connecting the USB signals to the USB Type-C receptacles. These options differ slightly between USB 2.0 and USB 3.0/USB 3.1 applications, as detailed in the following sub-sections. 5.8.1 USB 2.0 OPTION 1: HIGH-SPEED MULTIPLEXER/SWITCH The most robust solution for USB 2.0 applications is to use a USB High-Speed switch to control the routing of the USB signals. The Microchip USB3740 is a cost-effective solution for this purpose and offers several benefits: • • • • • • Extreme ESD: +- 15KV (IEC) Low Power: 5uA(on), 1uA (off) Off Isolation: less than -40dB High bandwidth: up to 1 GHz Preserves signal integrity Small Package: 1.3 x 1.8 mm – 10pin DFN (.4mm pitch) FIGURE 5-2: BLOCK DIAGRAM OF USB 2.0 OPTION 1: HIGH-SPEED SWITCH DM DM DM1 DM DP2 DP2 S PLUG_ORIENTATION# (from UTC2000)  2015 Microchip Technology Inc. DD+ D- USB Type-CTM Connector DM Microchip USB 3740 Switch B7 DP D+ B6 DP DP A7 DP DP1 A6 USB2.0 Host/ Hub/ Device DS00001957C-page 25 UTC2000 5.8.2 USB 2.0 OPTION 2: SHORT DP/DM PINS TOGETHER The simplest solution is to short together the DP / DM pins at the receptacle. Only one DP / DM pair at the connector will be active at once. Note that this implementation will negatively affect the integrity of the USB signals because of the creation of stubs on the USB traces. FIGURE 5-3: BLOCK DIAGRAM OF USB 2.0 OPTION 2: SHORT DP/DM PINS TOGETHER USB2.0 Host/ Hub/ Device 5.8.3 DP DP DM DM A 6 D+ A 7 D- B 6 D+ B 7 D- USB 2.0 OPTION 3: USE TWO DOWNSTREAM PORTS (DFP ONLY) If two downstream ports are available, then they may both be connected to the DP / DM pins on the USB Type-C receptacle. Only one of the ports will be active and able to be used at once. Note: If using a Microchip Hub with FlexConnect, a muxless UFP design is possible. Refer to the Microchip USB5734 USB Type-C Reference Design and Evaluation Platform for details. FIGURE 5-4: BLOCK DIAGRAM OF USB 2.0 OPTION 3: USE TWO DOWNSTREAM PORTS DP2 DS00001957C-page 26 D+ D- USB Type-CTM Connector DP2 D- B7 DM B6 DM1 D+ A7 DP A6 USB Host/ Hub DP1  2015 Microchip Technology Inc. UTC2000 5.8.4 USB 3.0/USB 3.1 OPTION 1: SUPER SPEED MULTIPLEXER/SWITCH In a USB 3.0/USB 3.1 UFP application, or a USB 3.0/USB 3.1 DFP application where only one downstream port is available, a Super-Speed USB 3.0/USB 3.1 switch must be used to control the routing of the USB signals. FIGURE 5-5: BLOCK DIAGRAM OF USB 3.0/USB 3.1 OPTION 1: SUPER-SPEED MUX/SWITCH SSTX- SSRX2DP DM SSTX2+ S SSTX2- RX1D+ DTX1+ TX1- USB Type-CTM Connector SSTX- RX1+ A3 SSTX+ TX1- A2 DM USB3.0/ SSTX1USB 3.1 DM Super-Speed Mux SSRX2+ SSTX+ DP B7 DP TX1+ B6 SSTX1+ B10 SSRX- B11 SSRX- D- A3 DM A2 SSRX+ D+ A7 USB 3.0/ USB 3.1 Host/ Hub/ Device SSRX+ RX1- A6 DP RX1+ B10 SSRX1- B11 SSRX1+ PLUG_ORIENTATION# (from UTC2000)  2015 Microchip Technology Inc. DS00001957C-page 27 UTC2000 5.8.5 USB 3.0/USB 3.1 OPTION 2: USE TWO DOWNSTREAM PORTS (DFP ONLY) If two downstream ports are available, then they may both be connected to the USB pins on the USB Type-C receptacle. Only one of the ports will be active and able to be used at once. Note: If using a Microchip Hub with FlexConnect, a muxless UFP design is possible. Refer to the Microchip USB5734 Type-C Reference Design and Evaluation Platform for details. FIGURE 5-6: BLOCK DIAGRAM OF USB 3.0/USB 3.1 OPTION 2: USE TWO DOWNSTREAM PORTS TX1- USB Type-CTM Connector DS00001957C-page 28 TX1+ A3 SSTX2- D- A2 SSTX2+ D+ B7 DM2 RX1- B6 DP2 RX1+ B10 SSRX2- TX1- B11 SSRX2+ TX1+ A3 SSTX1DP D- A2 SSTX1+ USB 3.0/ USB 3.1 Host/ Hub D+ A7 DM1 RX1- A6 DP1 RX1+ B10 SSRX1- B11 SSRX1+  2015 Microchip Technology Inc. UTC2000 5.9 Application Example: 3.0A Capable USB 3.0/USB 3.1 DFP FIGURE 5-7: USB 3.0/USB 3.1 APPLICATION SCHEMATIC 9 9 3RUW3RZHU&RQWUROOHU 9B,1 9B287 (1$%/( 2&6 N N 9%86 N 9 $ $ 7;$ 7;$  9'' 2&6 33&B(1 X)  966 (3$' 9021 3/8*B25,(17$7,21 )URP+RVW+XE  7R62&  (1$%/( $8',2B$'$37(5 )$8/7B,1' 9  &)*B6(/ 87& 9&211B287 9&211B287 && &&    86%5; 389ROWDJH 86%5; 86%7; 86%7; N 5; 5; 5;$ 5;$ 7; 7; 5;% 5;% 6 7;% 7;%   % % $ $ % % 86%6ZLWFK   $ $ 86%'3 86%'0   % % 9&211 9&211 9 9 $ % N N N N 9 $ % 7; 7; 5; 5; 5; 5; 7; 7; ' ' ' ' && && 6%8 6%8 *1' TM 86%7\SH& ,VRODWLRQ)(7V ZKHQXQSRZHUHG  2015 Microchip Technology Inc. DS00001957C-page 29 UTC2000 5.10 Application Example: 1.5A Capable USB 2.0 DFP FIGURE 5-8: USB 2.0 APPLICATION SCHEMATIC 9 3RUW3RZHU&RQWUROOHU 9 9B,1 9B287 (1$%/( 2&6 N 9%86 $ $ % % 9  9'' 2&6 33&B(1 X)  966 (3$' 9021 3/8*B25,(17$7,21 )URP+RVW+XE  7R62&  (1$%/( $8',2B$'$37(5 )$8/7B,1' 9&211B287 9&211B287 9  &)*B6(/ && &&   $ $ N 86%'3 86%'0 % %  N  $ $    % % 9&211RSWLRQDO IRU86%V\VWHPV 9 9 $ %   N $ % N 87& 7; 7; 5; 5; 5; 5; 7; 7; ' ' ' ' && && 6%8 6%8 *1' 9 86%7\SH& TM ,VRODWLRQ)(7V ZKHQXQSRZHUHG 5.11 Application Example: 500mA Capable USB 2.0 DFP with Audio Adapter Support FIGURE 5-9: USB 2.0 WITH AUDIO ADAPTER APPLICATION SCHEMATIC 9 9 N 3RUW3RZHU&RQWUROOHU 9B,1 9B287 (1$%/( 2&6 9%86 N 9 N 86%$XGLR6ZLWFK  86%'3 86%'0 9'' 2&6 33&B(1 X)  966 (3$' 9021 3/8*B25,(17$7,21 )URP+RVW+XE  7R62&   (1$%/( )$8/7B,1' &)*B6(/ $8',2B$'$37(5 9&211B287 9&211B287 && &&   '3 '0 $8',2/ $8',25   9'' $8',2B/ $8',2B5 6 '3 '0 *1' $ $ % % 9 $ $ % % $ $    9&211RSWLRQDO IRU86%V\VWHPV % % 9 9 $ %   N 0LF$*1' $ $*1'0LF % N 87& 7; 7; 5; 5; 5; 5; 7; 7; ' ' ' ' && && 6%8 6%8 *1' 9 ,VRODWLRQ)(7V ZKHQXQSRZHUHG DS00001957C-page 30 86%7\SH& TM  2015 Microchip Technology Inc. UTC2000 Application Example: 3.0A Capable USB Type-CTM Charging Port (AC Adapter) 5.12 FIGURE 5-10: 3.0A CHARGING PORT (AC ADAPTER) APPLICATION SCHEMATIC 9 9 3RUW3RZHU&RQWUROOHU 9B,1 9B287 (1$%/( 2&6 N 9%86 $ $ N 9  % % 9'' 2&6 33&B(1 X) 9  966 (3$' 9021 3/8*B25,(17$7,21  7R3:50DQDJHPHQW  (1$%/( $8',2B$'$37(5 )$8/7B,1' 9&211B287 9&211B287 9  &)*B6(/ && &&   $ $ N  9 9  % %  N N $ $     % % 9 ,VRODWLRQ)(7V ZKHQXQSRZHUHG $ % 87& $ % 7; 7; 5; 5; 5; 5; 7; 7; ' ' ' ' && && 6%8 6%8 *1' 86%7\SH& 5.13 TM Application Example: UFP Device FIGURE 5-11: UFP DEVICE APPLICATION SCHEMATIC R_SENSE VBUS RX1+ RX1RX2RX2+ TX2+ TX2D+ DD+ DCC1 CC2 SBU1 SBU2 B11 B10 A10 A11 B2 B3 A6 A7 B6 B7 RX+A RX-A RXRX+ RX-B RX+B TX+ TX- TX+B TX-B S USB3 RXUSB3 RX+ Current Sense 10k 5V USB3 TX+ USB3 TX- 1 5.1k 12 USB3.0 Switch 11 USB2 DP USB2 DM 5 10 9 8 To PWR Management To PWR Management To PWR Management A5 B5 A8 B8 35.7k 10k 10k 5.1lk 5.1k - TX+A TX-A + A2 A3 OCS TX1+ TX1- To System Power 5V 7 6 VDD OCS# 5V VMON PLUG_ORIENTATION# CONNECTED# 3.0A_IND# 1.5A_IND# LEGACY_IND# CC1 CC2 16 VSS EPAD ENABLE FAULT_IND CFG_SEL 13 0.1uF 10k 3 4 To PWR Management 2 10k UTC2000 GND USB Type C  2015 Microchip Technology Inc. DS00001957C-page 31 UTC2000 Note: The pass FET and current sense circuitry connected to VBUS are for high voltage protection and are optional. If high voltage protection is required and the device is bus powered or battery powered (and may have a dead battery), a high voltage tolerant regulator must also be implemented to power the UTC2000 while it qualifies the USB Type-C connection. DS00001957C-page 32  2015 Microchip Technology Inc. UTC2000 6.0 Note: 6.1 PACKAGING INFORMATION For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Package Marking Information FIGURE 6-1: 16-PIN QFN PACKAGE MARKING INFORMATION Example 16-Lead QFN (3x3x0.9 mm) PIN 1 PIN 1 Legend: UC X A YY WW NNN Note: UTC2000 Designator Temperature range designator: (Blank=commercial, i=industrial, e= extended) Automotive designator (0=non-automotive, V=automotive) Year code (last two digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2015 Microchip Technology Inc. DS00001957C-page 33 UTC2000 6.2 Package Details FIGURE 6-2: DS00001957C-page 34 16-PIN QFN PACKAGE (DRAWING)  2015 Microchip Technology Inc. UTC2000 FIGURE 6-3: 16-PIN QFN PACKAGE (DIMENSIONS)  2015 Microchip Technology Inc. DS00001957C-page 35 UTC2000 FIGURE 6-4: DS00001957C-page 36 16-PIN QFN PACKAGE (LAND PATTERN)  2015 Microchip Technology Inc. UTC2000 APPENDIX A: TABLE A-1: DATA SHEET REVISION HISTORY REVISION HISTORY Revision Level & Date Section/Figure/Entry DS00001957C (08-06-15) Cover, Section 1.1, "General Description", Section 4.2, "Standard Operating Conditions", Figure 6-1, Product Identification System on page 40 • Changed “Automotive extended temperature” to “extended temperature” as the extended temperature range is available in automotive and non-automotive versions. • Updated “XXX” automotive code description. Table 2.2, "Pin Descriptions" Updated first sentence of CFG_SEL description Section 3.1, "Configuration Selection" • Updated first sentence to reference VCFG_SAMP • Updated 2nd and 3rd paragraph to make the mode ranges conditional “upon power-on”. • Added new sentence to third paragraph: “For UFP designs, it is recommended to tie CFG_SEL to VDD through a pull-up resistor to ensure that UFP mode is entered when VDD crosses the POR threshold.” FIGURE 3-1: DFP Modes State Machine Diagram on page 12, FIGURE 3-2: UFP Mode State Machine Diagram on page 15, FIGURE 5-11: UFP Device Application Schematic on page 31 Updated figures Table 3-1, "DFP Configuration Selection Voltage Monitoring Thresholds", Table 32, "UFP Configuration Selection Voltage Monitoring Thresholds" Updated CFG_SEL Voltage column values Table 4-1, "Supply Voltage" Added VCFG_SAMP parameter Table 4-2, "Supply Current (Idd)(1)" Added supply current numbers Table 4-3, "I/O Ports" DS00001957B (07-30-15)  2015 Microchip Technology Inc. Correction • Removed text from “characteristics” column of D008 and D009 rows • Updated voltage to 5.0V in footer Table 4-4, "Timing Parameters" Added new timing parameters table FIGURE 5-3: Block Diagram of USB 2.0 Option 2: Short DP/DM Pins Together on page 26 Corrected errant blue box around USB Type-C Connector Product Identification System on page 40 “Automotive Extended” changed to “Extended” DS00001957C-page 37 UTC2000 Revision Level & Date Section/Figure/Entry Correction Figure 1-2, "Typical UFP Application Block Diagram" and Figure 5-11, "UFP Device Application Schematic" Figures modified to include CC1/CC2 inputs Table 2.2, "Pin Descriptions" Configuration Selection and Fault Indicator descriptions modified Section 3.1, "Configuration Selection", Section modified Section 3.7, "Connection and Disconnection Detection Debounce" and Section 5.6, "CC Pin Current Limiting Resistors (UFP Only)" Sections added Document Release, “Confidential” removed from document footer DS00001957A (06-25-15) DS00001957C-page 38 All Initial Preliminary Release  2015 Microchip Technology Inc. UTC2000 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support  2015 Microchip Technology Inc. DS00001957C-page 39 UTC2000 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X]( 1) PART NO. Device - [X] Tape and Reel Temperature Option Range /XX Package [XXX] Automotive a) b) Device: UTC2000 Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel ( 1) Temperature Range: Blank I E = 0°C to +70°C (Commercial) = -40°C to +85°C (Industrial) = -40°C to +125°C (Extended) Package: MG = 16-Pin QFN (3x3x0.9mm) Automotive: Blank XXX = Non-automotive = Automotive (3 character internal designator) DS00001957C-page 40 Examples: c) UTC2000/MG Standard packaging, Commercial temperature, 16-pin QFN package UTC2000T-I/MG Tape and Reel, Industrial temperature, 16-pin QFN package UTC2000-E/MG042 Standard packaging, Automotive extended temperature, 16-pin QFN package Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: For other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office.  2015 Microchip Technology Inc. UTC2000 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781632776884 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00001957C-page 41 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 07/14/15 DS00001957C-page 42  2015 Microchip Technology Inc.
UTC2000-I/MG 价格&库存

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UTC2000-I/MG
    •  国内价格
    • 1000+11.66000

    库存:8126