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Microsemi Corporation January 09, 2017 Product/Process Change Notification No: 0317 Change Classification: Major; Packing Method Subject: Label and Packing Material Changes Description of Change: Microsemi Ethernet and Networking Technologies (ENT) is changing the packing materials and all packing labels for our products. The changes are detailed in the provided attachment. Reason for Change: Microsemi ENT is standardizing the packing material and labeling. Products Affected by this Change: All Microsemi ENT products are affected. ENT product numbers begin with “VSC.” Production Shipment Schedule: Effective February 9, 2017, shipments may have the new labels and packing materials. Contact Information: If you have further questions related to this topic, contact Microsemi's Technical Support at ENT.quality@microsemi.com. Regards, Microsemi Corporation Any projected dates in this PCN are based on the most current product information at the time this PCN is being issued, but they may change due to unforeseen circumstances. For the latest schedule and any other information, please contact your local Microsemi Sales Office, the factory contact shown above, or your local distributor. This Product/Process Change Notification is confidential and proprietary information of Microsemi and is intended only for distribution by Microsemi to its customers, for customers’ use only. It must not be copied or provided to any third party without Microsemi's prior written consent. Microsemi Corporation One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996 E-mail: sales.support@microsemi.com. www.microsemi.com MSC-F-0003 Rev 4 Do Not Distribute Outside Microsemi Without Written Permission Page 1 of 1 Power Matters.TM PCN0317 Label & Packing Information © 2016 Microsemi Corporation. Company Proprietary 1 Label Information Item From To Inner Label © 2016 Microsemi Corporation. Company Proprietary Power Matters.TM 2 Label Information Item From To Outer Shipping Label © 2016 Microsemi Corporation. Company Proprietary Power Matters.TM 3 Label Information Item From To MSL Label © 2016 Microsemi Corporation. Company Proprietary Power Matters.TM 4 Packing Information Item From To Bubble Wrap 20”x19” 24”x24” Moisture Barrier Bag 10”x20” 10”x22” Humidity Indicator Card Sud-Chemie: 200014484 Dessicare Inc 04BW14C10 © 2016 Microsemi Corporation. Company Proprietary Power Matters.TM 5 Packing Information Item From To Desiccant Sud-Chemie Desi Pak Tyvek Dessicare Inc 02BM10A16 Inner Boxes 14.76”x5.98”x3.39” (LxWxH) 14.5”x7”x3.25” (LxWxH) © 2016 Microsemi Corporation. Company Proprietary Power Matters.TM 6 Microsemi Corporation (MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiationhardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable antitamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally. Learn more at www.microsemi.com Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 email: sales.support@microsemi.com www.microsemi.com Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. ©2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Power Matters