Transition Socket
Specification
2010 Microchip Technology Inc.
DS51194S
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-069-0
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51194S-page 2
2010 Microchip Technology Inc.
Transition Socket Specification
INTRODUCTION
Transition sockets are products that allow header
boards (for next generation in-circuit emulators or
in-circuit debuggers) or device adapters (for the
MPLAB ICE 2000 in-circuit emulator) to interface to
sockets on target applications.
Typically, header boards or device adapters have connectors that match development cycle device formats,
such as DIP or PLCC. However, target sockets will
match compact production device formats, such as
SOIC, SSOP, QFP, or QFN. The solution is transition
sockets. A transition socket is specifically designed to
provide compatibility between two differing types of IC
package formats.
Transition sockets are typically composed of two parts:
the adapter socket and the adapter header. The
adapter socket is designed to plug into the header
board or device adapter on one side, and the adapter
header on the other. The adapter header is then
soldered down to the target application.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to using
transition sockets:
1.
2.
Shorter product development cycle
Reduced expense in the design, layout and
prototype testing
A typical product design cycle has two important
phases: the prototype design phase and the production
design phase. Traditionally, these phases were different simply because the prototype used a microcontroller with a different package type. However, with the
availability of the transition sockets, the prototype
design can be identical to the production design
because a transition socket can be used to bridge
microcontroller package differences.
2010 Microchip Technology Inc.
WHAT TRANSITION SOCKETS ARE
CURRENTLY AVAILABLE?
Microchip Technology currently offers the transition
sockets listed in the “Table of Contents” following this
introductory section.
Use the on-line Development Tools Selector (DTS) to
find the transition sockets available for each header
board or for each device adapter. For more on header
boards or device adapters, see:
• Header Board Specification (DS51292)
• MPLAB® ICE 2000 Processor Module and Device
Adapter Specification (DS51140)
• MPLAB® ICE 4000 Processor Module and Device
Adapter Specification (DS51298)
Please
see
the
Microchip
web
site
(www.microchip.com) for the DTS and most current
version of all documents.
HOW CAN I OBTAIN MAXIMUM
BENEFIT FROM THE USE OF
TRANSITION SOCKETS?
Attention to component placement should be
considered to provide adequate clearance for the
transition socket interface to the PCB footprint. This is
especially true for any tall components such as connector headers, radial components or voltage regulators.
Refer to the transition socket mechanical drawings for
dimensions.
DS51194S-page 3
Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
GLOSSARY
Attention to component placement should be considered in mating the adapter sockets to the SOIC/SSOP
headers.
DIP – Dual In-line Package
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
Terms used in this document:
DFN – Dual Flat No lead
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
2010 Microchip Technology Inc.
Table of Contents
Current Sockets
SOIC Transition Socket
XLT08SO-1
8-lead DIP to 8-lead SOIC ............................................................................................................................................. 9
XLT08SN-1
8-lead DIP to 8-lead SOIC (Narrow) ............................................................................................................................ 10
XLT14SO-1
14-lead DIP to 14-lead SOIC ....................................................................................................................................... 10
XLT18SO-1
18-lead DIP to 18-lead SOIC ....................................................................................................................................... 11
XLT20SO1-1
20-lead DIP to 20-lead SOIC ....................................................................................................................................... 11
XLT28SO-1
28-lead DIP to 28-lead SOIC ....................................................................................................................................... 12
SSOP Transition Socket
XLT14SS-1
14-lead DIP to 14-lead SSOP ...................................................................................................................................... 13
XLT20SS-1
18-lead DIP to 20-lead SSOP ...................................................................................................................................... 14
XLT20SS1-1
20-lead DIP to 20-lead SSOP ...................................................................................................................................... 14
XLT28SS-1
28-lead DIP to 28-lead SSOP ...................................................................................................................................... 15
XLT28SS2-1
28-lead DIP to 28-lead SSOP (PIC16X55/57) ............................................................................................................. 15
PLCC Transition Socket
XLT44L2
44-lead PLCC (0.050”) ................................................................................................................................................. 16
QFP Transition Socket
XLT44PT3
44-lead QFP (0.8 mm) ................................................................................................................................................. 18
XLT64PT5, XLT80PT3
64/80-lead QFP (0.5 mm) ............................................................................................................................................ 18
XLT80PT2
80-lead QFP (0.65 mm) ............................................................................................................................................... 19
SOT/DFN/QFN Transition Sockets
XLT06SOT
14-lead DIP to 6-lead SOT-23 ..................................................................................................................................... 22
XLT08DFN2
14-lead DIP to 8-lead DFN ........................................................................................................................................... 22
2010 Microchip Technology Inc.
DS51194S-page 5
Transition Socket Specification
XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5
Multi-lead DIP to Multi-lead QFN, Top View ................................................................................................................. 23
Multi-lead DIP to Multi-lead QFN, Side View ................................................................................................................ 23
Multi-lead DIP to Multi-lead QFN Cables ..................................................................................................................... 23
XLT20QFN-1
20-lead DIP Adapter Socket ......................................................................................................................................... 24
20-lead QFN Header (Surface Foot) ............................................................................................................................ 24
XLT20QFN-1 Soldering Suggestions ........................................................................................................................... 25
DS51194S-page 6
2010 Microchip Technology Inc.
Transition Socket Specification
Discontinued Sockets
PDIP Transition Socket
XLT28XP (Discontinued)
28-lead DIP 0.300-inch Male to 0.600-inch Female ..................................................................................................... 26
SOIC Transition Socket
XLT08SO (Discontinued – see XLT08SO-1 or XLT08SN-1)
8-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 27
8-lead SOIC Header .................................................................................................................................................... 27
XLT14SO (Discontinued – see XLT14SO-1)
14-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 28
14-lead SOIC Header .................................................................................................................................................. 28
XLT18SO (Discontinued – see XLT18SO-1)
18-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 28
18-lead SOIC Header ................................................................................................................................................. 28
XLT20SO1 (Discontinued – see XLT20SO1-1)
20-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 29
20-lead SOIC Header ................................................................................................................................................. 29
XLT28SO (Discontinued – see XLT28SO-1)
28-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 29
28-lead SOIC Header .................................................................................................................................................. 29
SSOP Transition Socket
XLT14SS (Discontinued – see XLT14SS-1)
14-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 30
14-lead SSOP Header ................................................................................................................................................. 30
XLT20SS (Discontinued – see XLT20SS-1)
18-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 31
20-lead SSOP Header ................................................................................................................................................. 31
XLT20SS1 (Discontinued – see XLT20SS1-1)
20-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 31
20-lead SSOP Header ................................................................................................................................................. 31
XLT28SS (Discontinued – see XLT28SS-1)
XLT28SS2 (Discontinued – see XLT28SS2-1)
28-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 32
28-lead SSOP Header ................................................................................................................................................. 32
PLCC Transition Socket
XLT68L1, XLT84L1 (Discontinued)
68/84-lead Adapter Socket .......................................................................................................................................... 34
QFP Transition Socket
XLT44PT (Discontinued – see XLT44PT3)
44-lead QFP to 0.8 mm Adapter Socket ...................................................................................................................... 35
XLT64PT1 (Discontinued)
XLT64PT2 (Discontinued – see XLT64PT5)
XLT80PT (Discontinued – see XLT80PT3)
64/80-lead QFP to 0.5 mm Adapter Socket ................................................................................................................. 36
XLT64PT3 (Discontinued – see XLT64PT5)
64-lead QFP to 0.8mm Adapter Socket ....................................................................................................................... 36
XLT64PT4 (Discontinued – see XLT64PT5)
64-lead QFP (0.8 mm) ................................................................................................................................................. 37
2010 Microchip Technology Inc.
DS51194S-page 7
Transition Socket Specification
SOT/DFN/QFN Transition Sockets
XLT08DFN (Discontinued – see XLT08DFN2)
8-lead DIP to 0.025-inch Adapter Socket ..................................................................................................................... 39
XLT28QFN (Discontinued – see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 39
XLT28QFN2 (Discontinued – see XLT28QFN3)
18-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 40
XLT44QFN (Discontinued – see XLT44QFN2)
40-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 40
44-lead QFN Header .................................................................................................................................................... 40
DS51194S-page 8
2010 Microchip Technology Inc.
Transition Socket Specification
CURRENT SOCKETS
XLT08SO-1
8-lead DIP to 8-lead SOIC
The transition sockets in this section are currently
available from Microchip.
10.16mm
[0.400"]
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware is
shown in Figure 1.
10.16mm
[0.400"]
FIGURE 1: SOIC TRANSITION SOCKET
7.62mm
[0.300"]
2.54mm [0.100"]
Cable to Processor Module
Top View
PDIP Device Adapter
Gold Standoffs/
Adapters
Adapter Socket
SOIC Transition Socket
SOIC Header
Target/Application Board
13.83mm ±0.38mm
[0.545" ±0.015"]
assembled
10.00mm[0.394"]
assembled
There are two components of the SOIC transition
socket::
1.
2.
Adapter socket that connects to the DIP device
adapter
SOIC header that is to be soldered down to the
target application
1.27mm typ. [0.050"]
Side View
Microchip offers the following SOIC transition sockets:
• XLT08SO-1: One 8-lead DIP adapter socket and
one 8-lead SOIC header (5.28mm body size)
• XLT08SN-1: One 8-lead DIP adapter socket and
one 8-lead SOIC header (3.9mm body size)
• XLT14SO-1: One 14-lead DIP adapter socket and
one 14-lead SOIC header
• XLT18SO-1: One 18-lead DIP adapter socket and
one 18-lead SOIC header
• XLT20SO1-1: One 20-lead DIP adapter socket
and one 20-lead SOIC header
• XLT28SO-1: One 28-lead DIP adapter socket and
one 28-lead SOIC header
8.15mm
[0.321"]
7.93mm
[0.312"]
End View
See the drawings in this section for layout dimensions.
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
2010 Microchip Technology Inc.
DS51194S-page 9
Transition Socket Specification
XLT08SN-1
XLT14SO-1
8-lead DIP to 8-lead SOIC (Narrow)
14-lead DIP to 14-lead SOIC
18.16mm
[0.715"]
10.16mm
[0.400"]
10.16mm
[0.400"]
7.62mm
[0.300"]
7.62mm
[0.300"]
10.16mm
[0.400"]
2.54mm [0.100"]
2.54mm typ. [0.100"]
Top View
13.83mm ±0.38mm
[0.545" ±0.015"]
assembled
Top View
10.00mm[0.394"]
assembled
13.68mm[0.539"]
assembled
9.84mm[0.388"]
assembled
1.27mm typ. [0.050"]
1.27mm typ. [0.050"]
Side View
8.15mm
[0.321"]
8.25mm
[0.325"]
5.99mm
[0.236"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 10
Side View
5.99mm
[0.236"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
2010 Microchip Technology Inc.
Transition Socket Specification
XLT18SO-1
XLT20SO1-1
18-lead DIP to 18-lead SOIC
20-lead DIP to 20-lead SOIC
22.86mm
[0.900"]
25.40mm [1.000"]
10.16mm
[0.400"]
7.62mm
[0.300"]
7.62mm
[0.300"]
[0.400"]
2.54mm typ. [0.100"]
2.54mm typ. [0.100"]
Top View
Top View
13.95mm ±.38mm assembled
[0.549" ±0.015"]
10.11mm ±.38mm assembled
[0.398" ±0.015"]
13.92mm ± 0.381mm
[0.548" ± 0.015"] assembled
0.43mm typ. [0.017"]
0.43mm typ. [0.017"]
1.27mm typ. [0.050"]
1.27mm typ. [0.050"]
Side View
Side View
8.15mm
[0.321"]
8.15mm
[0.321"]
12.40mm[0.488"]
assembled
9.93mm
[0.391"]
9.42mm
[0.371"]
End View
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
2010 Microchip Technology Inc.
DS51194S-page 11
Transition Socket Specification
XLT28SO-1
28-lead DIP to 28-lead SOIC
35.56mm
[1.400"]
7.62mm
[0.300"]
11.25mm
[0.443"]
2.54mm typ. [0.100"]
10.16mm
[0.400"]
Top View
14.29mm ±.38mm
[0.563"±0.015"]
10.46mm[0.412]
0.43mm typ. [0.017"]
1.27mm typ. [0.050"]
Side View
8.15mm
[0.321"]
9.93mm
[0.391"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 12
2010 Microchip Technology Inc.
Transition Socket Specification
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware is
shown in Figure 2.
XLT14SS-1
14-lead DIP to 14-lead SSOP
18.16mm
[0.715"]
FIGURE 2: SSOP TRANSITION SOCKET
Cable to Processor Module
PDIP Device Adapter
7.62mm
[0.300"]
10.16mm
[0.400"]
Gold Standoffs/
Adapters
2.54mm typ. [0.100"]
Adapter Socket
SSOP Transition Socket
SSOP Header
Target/Application Board
The SSOP transition sockets are similar to the SOIC
transition sockets. There are two parts to the SSOP
transition socket:
1.
2.
Top View
Adapter socket that connects to the DIP device
adapter.
SSOP header that gets soldered down to the
target application.
10.19mm ±0.38mm
[0.401" ±0.015"] assembled
0.65mm typ.
Microchip offers the following SSOP transition sockets:
• XLT14SS-1: One 14-lead DIP adapter socket and
one 14-lead SSOP header
• XLT20SS-1: One 18-lead DIP adapter socket and
one 20-lead SSOP header
• XLT20SS1-1: One 20-lead DIP adapter socket
and one 20-lead SSOP header
• XLT28SS-1: One 28-lead DIP adapter socket and
one 28-lead SSOP header
• XLT28SS2-1: One 28-lead DIP adapter socket
and one 28-lead SSOP header (PIC16X55/57)
See the drawings in this section for layout dimensions
and clearances for tall components.
2010 Microchip Technology Inc.
6.35mm ±0.38mm
[0.250" ±0.015"]
assembled
Side View
7.10mm
[0.280"]
5.33mm ±0.38mm
[0.210" ±0.015"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 13
Transition Socket Specification
XLT20SS-1
XLT20SS1-1
18-lead DIP to 20-lead SSOP
20-lead DIP to 20-lead SSOP
25.4mm [1"]
22.9mm [0.900"]
7.6mm
[0.300"]
7.6mm 10mm
[0.300"]
[0.394"]
10.2mm
[0.402"]
Top View
Top View
2.5mm Typ. [0.100"]
2.5mm Typ. [0.100"]
8.3mm ±0.38mm
[0.328"±0.015"]
11.9mm [0.469"]
assembled
7.6mm ±0.38
[0.298"±0.015"]
0.65mm pitch typ.
[0.026"]
0.65mm pitch typ.
[0.026"]
Side View
Side View
7.6mm
[0.300"]
7.6mm
[0.300"]
Compatible target
board land pattern
(not to scale)
11.96mm ±0.38mm
[0.471" ±0.015"]
assembled
Compatible target
board land pattern
(not to scale)
11.96mm ±0.38mm
[0.471" ±0.015"]
assembled
A
A
B
B
A < 0.235
B > 0.335
A < 0.235
B > 0.335
7mm [0.275"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 14
7mm [0.275"]
End View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
2010 Microchip Technology Inc.
Transition Socket Specification
XLT28SS-1
XLT28SS2-1
28-lead DIP to 28-lead SSOP
28-lead DIP to 28-lead SSOP (PIC16X55/57)
35.56mm
[1.400"]
35.56mm
[1.400"]
10.16mm
[0.400"]
7.62mm
[0.300"]
10.16mm
[0.400"]
7.62mm
[0.300"]
2.54mm typ. [0.100"]
2.54mm typ. [0.100"]
Top View
10.57mm ±.38mm
[0.416"±0.015"]
Top View
10.57mm ±.38mm
[0.416"±0.015"]
1.27mm
[0.050"]
1.27mm
[0.050"]
0.65mm typ. [0.026"]
0.65mm typ. [0.026"]
10.21mm
[0.402"]
10.21mm
[0.402"]
Side View
Side View
Recommended target
PCB land pattern
5.26mm [0.207"]
max.
8.15mm
[0.321"]
Recommended target
PCB land pattern
5.26mm [0.207"]
max.
8.15mm
[0.321"]
6.35mm ±.38mm
[0.250"±0.015"]
6.35mm ±.38mm
[0.250"±0.015"]
8.78mm [0.346"]
min.
7.77mm
[0.306"]
End View
SF-SO28G-L-01
outline
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
2010 Microchip Technology Inc.
7.77mm
[0.306"]
End View
8.78mm [0.346"]
min.
SF-SO28G-L-01
outline
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 15
Transition Socket Specification
PLCC TRANSITION SOCKET
A PLCC transition socket and associated hardware is
shown in Figure 3.
FIGURE 3: PLCC TRANSITION SOCKET
XLT44L2
44-lead PLCC (0.050”)
27.94mm [1.100”]
2.79mmx45° [0.110”]
Cable to Processor Module
PLCC Device Adapter
27.94mm
[1.100”]
PLCC Transition Socket
20.32mm
[0.800”]
Target/Application Board
The PLCC transition socket is required for use along
with the PLCC device adapters. The DAF18-1 device
adapter is equipped with eight socket strips that interface with one of two transition sockets. The DAF18-3
device adapter is equipped with four socket strips that
interface with one transition socket.
The PLCC transition sockets are designed with a
threaded insert in the center of the footprint so that a
4/40 screw can securely fasten the transition socket to
the device adapter.
TOP VIEW
*Caution: Pin 1 on the device adapter side (top of socket)
is 180 degrees from pin 1 on the target side (bottom of
socket).
1.27mm typ. [0.050”]
The PLCC transition sockets are designed to be soldered to the target PCB PLCC surface mount pattern or
inserted into a PLCC socket on the target PCB.
Note:
To avoid solder bridging, do not place vias
within 0.025-inch of the PLCC footprint.
Also, any vias near the PLCC should be
directly on the centerline of the pad.
14.94mm
[0.588”]
21.93mm
[0.863”]
Microchip offers the following PLCC transition sockets:
• XLT44L2: One 44-lead PLCC transition socket
RECOMMENDED PCB LAYOUT
0.43mm typ. [0.017”]
1.27mm typ. [0.050”]
FRONT/SIDE
VIEW
0.865”
0.024”
0.050”
DS51194S-page 16
0.074”
2010 Microchip Technology Inc.
Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 4: QFP TRANSITION SOCKET
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
Note:
QFP TRANSITION SOCKET
SOLDERING TIPS
• Use controlled soldering iron tip temperatures
between 300C and 325C (570F to 615F)
• If possible, use a PACE mini wave soldering iron
tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the
opposite side, then the remaining two sides.
• Soldering iron tip movement should be in the
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
• Use generous amounts of soldering flux to aid in
the solder flow action.
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
There are two parts to the QFP transition socket:
1.
2.
Adapter socket that connects to the QFP device
adapter
QFP header that gets soldered down to the
target application
Microchip offers the following QFP transition sockets:
• XLT44PT3: One 44-lead QFP adapter socket and
one 44-lead QFP header (0.8 mm)
• XLT64PT5: One 64-lead QFP adapter socket and
one 64-lead QFP header (0.5 mm)
• XLT80PT2: One 80-lead QFP adapter socket and
one 80-lead QFP header (0.65 mm)
• XLT80PT3: One 80-lead QFP adapter socket and
one 80-lead QFP header (0.5 mm)
See the drawings in this section for layout dimensions
and clearances for tall components.
2010 Microchip Technology Inc.
DS51194S-page 17
Transition Socket Specification
XLT44PT3
XLT64PT5, XLT80PT3
44-lead QFP (0.8 mm)
64/80-lead QFP (0.5 mm)
0.300
68
1
34
44
QFP
PIN 1
51
QFP
PIN 1
0.300
1
52
33
1.100
TOP
VIEW
11
A
TOP
VIEW
23
17
12
35
18
22
34
A
1.100
B
0.800
0.018
0.018
0.050
0.050
FRONT/
SIDE
VIEW
FRONT/
SIDE
VIEW
0.352
0.352
0.225
0.225
0.065
0.065
0.80 mm
Refer to the “Package Specification” for
PCB footprint dimensions (DS00049).
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
0.50 mm
Refer to the “Package Specification” for
PCB footprint dimensions (DS00049).
A
B
XLT64PT5
1.250
0.960
XLT80PT3
1.450
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-lead.
DS51194S-page 18
2010 Microchip Technology Inc.
Transition Socket Specification
XLT80PT2
TABLE 1:
80-lead QFP (0.65 mm)
84
DVA/DAF INTERFACE
SPECIFICATION FOR QFP
PACKAGES
64
63
1
Socket
Package Style*
QFP
PIN 1
A
DVA/DAF
Interface
Specification**
XLT44PT3
44PT TQFP
44PQ MQFP
44KW PQFP
DVA-44PL
XLT64PT5
64PT
DVA-68PL
XLT80PT2
80PF
DVA-84PL
XLT80PT3
21
*
Refer to the “Package Specification” for PCB
footprint dimensions (DS00049).
** Refer to the processor module and device
adapter specification for interface and
dimensions to DVA/DAF (ICE 2000: “MPLAB®
ICE 2000 Processor Module and Device Adapter
Specification” (DS51140); ICE 4000: “MPLAB®
ICE 4000 Processor Module and Device Adapter
Specification” (DS51298)).
43
22
42
A
TOP
VIEW
B
0.018
0.050
FRONT/
SIDE
VIEW
0.352
0.225
0.065
0.65mm
Refer to the “Package Specification” for
PCB footprint dimensions (DS00049).
A
B
1.450
1.160
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
2010 Microchip Technology Inc.
DS51194S-page 19
Transition Socket Specification
SOT/DFN/QFN TRANSITION
SOCKETS
FIGURE 8: QFN TWO-PART TRANSITION
SOCKET
Cable to Processor Module
SOT/DFN/QFN transition sockets and associated
hardware are shown below.
PDIP Device Adapter
Gold Standoffs/
Adapters
FIGURE 5: SOT TRANSITION SOCKET WITH
CABLE
QFN Transition Socket
Cable to Processor Module
Target/Application Board
PDIP Device Adapter
Two-part transition sockets consist of:
Gold Standoffs/
Adapters
1.
SOT Transition Socket
Cables
Target/Application Board
FIGURE 6: DFN TRANSITION SOCKET WITH
CABLE
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
DFN Transition Socket
Cables
Target/Application Board
FIGURE 7: QFN TRANSITION SOCKET WITH
CABLE
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
2.
Adapter socket that connects to the DIP device
adapter
QFN header that is to be soldered down to the
target application
Microchip offers the following SOT/DFN/QFN transition
sockets:
• XLT06SOT: One 14-lead DIP to 6-lead SOT-23
transition socket with cable
• XLT08DFN2: One 14-lead DIP to 8-lead DFN
transition socket with cable
• XLT16QFN1: One 14-lead DIP to 16-lead QFN
transition socket with cable
• XLT20QFN-1: One 20-lead DIP adapter socket
and one 20-lead QFN header
• XLT28QFN3: One 18-lead DIP to 28-lead QFN
transition socket with cable
• XLT28QFN4: One 28-lead DIP to 28-lead QFN
transition socket with cable
• XLT44QFN2: One 40-lead DIP to 44-lead QFN
transition socket with cable
• XLT44QFN3: One 28-lead DIP to 44-lead QFN
transition socket with cable
• XLT44QFN4: One 28-lead DIP to 44-lead QFN
transition socket with cable
• XLT44QFN5: One 18-lead DIP to 44-lead QFN
transition socket with cable
See the drawings in this section for layout dimensions.
QFN Transition Socket
Cables
Target/Application Board
DS51194S-page 20
2010 Microchip Technology Inc.
Transition Socket Specification
RECOMMENDED INSTALLATION OF
TRANSITION SOCKETS WITH
CABLES
3.
4.
5.
For transition sockets that use a cable, follow these
instructions for installing your transition socket on the
target board.
Center each cable on the footprint (see below).
Tape down each cable to prevent movement.
Solder each lead to target pad.
Remove tape and clean
center cable
on target footprint
pin 1
PCB Layout Considerations:
header pins
facing down
Make sure you leave enough room on the PCB to
accommodate the cable, i.e., space your target pads
for each device far enough apart so that the cable from
one pad group will not interfere with another pad group.
6-Pin SOT Solder Instructions:
1.
2.
3.
4.
Remove protective cable covering from end of
cable.
Position cables on target board (see below).
Tape down to prevent movement.
Solder each lead to target pad.
Remove tape and clean.
16-Pin QFN Assembly Instructions:
1.
2.
3.
4.
Start with cable associated with pin 1.
Fold cable up and over, forming a radius.
Header pins will now be facing upwards.
Mate with the socket on the underside of the
transition socket assembly, making sure pin 1
mates with the pin labeled “QFN Pin 1”.
Fold over and mate the other cables.
28/44-Pin QFN Solder Instructions:
2.
8-Pin DFN Solder Instructions:
1.
2.
3.
4.
Prepare leads by trimming narrowest portion to
0.10-inch maximum in length (see below).
Position cables on target board (see below).
Tape down to prevent movement.
Solder each lead to target pad.
Remove tape and clean.
3.
4.
5.
Remove protective cable jacket from stripped
end of cable.
Lay out with long cables opposing each other
and short cables opposing each other (see
below).
Place center lead (6th lead for 44-pin, 4th lead
for 28-pin) on center target pad to center each
cable on the footprint (see below). Tape down
each cable to prevent movement.
Solder each lead to target pad.
Remove tape and clean
pin 1
long
1.
pin 1
use center lead
to center cable
on target footprint
trim leads
pin 1
short
header pins
facing down
long
short
8-Pin DFN Assembly Instructions:
1.
2.
3.
4.
Start with cable associated with pin 1.
Fold cable up and over, forming a radius.
Mate with the header on the side of the transition
socket assembly, making sure pin 1 mates with
the pin labeled “DFN Pin 1”.
Fold over and mate the other cable.
28/44-Pin QFN Assembly Instructions:
1.
2.
3.
16-Pin QFN Solder Instructions:
1.
2.
Remove protective cable jacket from stripped
end of cable.
Lay out the four cables in a “+” pattern (see
below).
2010 Microchip Technology Inc.
4.
Start with cable associated with pin 1.
Fold cable up and over, forming a radius.
Header pins will now be facing upwards.
Mate with the socket on the underside of the
transition socket assembly, making sure pin 1
mates with the pin labeled “QFN Pin 1”.
Fold over and mate the other cables.
DS51194S-page 21
Transition Socket Specification
The recommended target board footprint layout for
different pin-counts is shown here.
XLT06SOT
14-lead DIP to 6-lead SOT-23
0.80
FIGURE 9: 6-PIN SOT, 8-PIN DFN
DVA Pin 1
RECOMMENDED PCB LAYOUT
0.90
50 mils
16 mils
TOP
VIEW
24 mils
0.30
FIGURE 10: 16-PIN QFN
1.50
SIDE
VIEW
24 mils
11 mils
26 mils
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
XLT08DFN2
FIGURE 11: 20-PIN QFN
14-lead DIP to 8-lead DFN
DVA Pin 1: Location of 14-lead DIP pin 1
1.35
28 mils
11 mils
DVA Pin 1
DFN Pin 1
19 mils
0.30
0.90
FIGURE 12: 28-PIN QFN
2.37
0.24
24 mils
TOP
VIEW
11 mils
26 mils
0.30
FIGURE 13: 44-PIN QFN
0.09
SIDE
VIEW
16 mils
13 mils
26 mils
DS51194S-page 22
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
2010 Microchip Technology Inc.
Transition Socket Specification
Multi-lead DIP to Multi-lead QFN, Side View
XLT16QFN1, XLT28QFN3, XLT28QFN4,
XLT44QFN2, XLT44QFN3, XLT44QFN4,
XLT44QFN5
0.56
Multi-lead DIP to Multi-lead QFN, Top View
XLT16QFN1 – 14L DIP to 16L QFN
1.25
DVA Pin 1
QFN Pin 1
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
1.15
Multi-lead DIP to Multi-lead QFN Cables
0.85
TOP VIEW
XLT28QFN3 – 18L DIP to 28L QFN (Shown)
XLT44QFN5 – 18L DIP to 44L QFN
TOP
VIEW
0.40
2.45
DVA Pin 1
QFN Pin 1
0.40
SIDE
VIEW
1.15
BOTTOM
VIEW
TOP VIEW
C
XLT28QFN4 – 28L DIP to 28L QFN (Shown)
XLT44QFN3 – 28L DIP to 44L QFN
XLT44QFN4 – 28L DIP to 44L QFN
2.45
cable
XLT16QFN1
QFN Pin 1
DVA Pin 1
1.15
1-4
C
1.30
XLT28QFN3/4 1,2
1.30
3,4
2.00
XLT44QFN2/3 1,2
XLT44QFN4/5 3,4
1.30
2.00
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
TOP VIEW
Drawing shown is for 28-lead DIP.
XLT44QFN2 – 40L DIP to 44L QFN
2.45
1.15
DIP 1
DVA Pin 1
QFN Pin 1
TOP VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
2010 Microchip Technology Inc.
DS51194S-page 23
Transition Socket Specification
XLT20QFN-1
20-lead QFN Header (Surface Foot)
20-lead DIP Adapter Socket
4.72mm [0.186"]
11.4mm
[0.450"]
3.20mm [0.126"]
2
0
1
9
2
1
1
8
1
7
1
5
1
6
1
4
0.80mm typ.
26.6mm
[1.049"]
3.20mm
[0.126"]
2.5mm
[0.100"]
4.72mm
[0.186"]
1
3
3
4
6
5
7
8
1
1
1
2
9
1
0
Gnd/index
pin
Top View
7.6mm
[0.300"]
4.00mm [0.157"]
Top View
0.50mm typ. [0.020"]
Bottom View
20
2.3mm [0.093"]
2.7mm [0.105"]
7.8mm [0.307"] *
4.2mm [0.165"]
3.9mm [0.154"] *
4.00mm
[0.157"]
1.2mm [0.047"] *
SF-MLF20A-A-02F
(included)
* Assembled
2
0
1
9
2
1
1
8
1
7
1
5
1
6
1
4
1
3
3
4
6
5
7
8
1
1
1
2
9
1
0
1
2.13mm
[0.084"]
2.75mm
[0.108"]
3.3mm [0.130"]
2.13mm [0.084"]
2.75mm [0.108"]
Side View
Bottom View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
3.30mm
[0.130"]
Side View
Tolerances: diameters ±0.03 mm [±0.001"],
PCB perimeters ±0.13 mm [±0.005"],
PCB thicknesses ±0.18 mm [±0.007"],
pitches (from true position) ±0.08 mm [±0.003"],
all other tolerances ±0.13 mm [±0.005"] unless
stated otherwise.
DS51194S-page 24
2010 Microchip Technology Inc.
Transition Socket Specification
XLT20QFN-1 Soldering Suggestions
This socket is difficult to solder since the device pins
are not exposed, but embedded, into the socket’s
Surface Foot (SF).
1.
2.
3.
4.
5.
To start, add tack flux to the target land pattern.
Visually align the QFN SF with the target land
pattern. Then solder two opposite SF pins to the
target lands so that the SF does not move
around.
Finish soldering the rest of the SF pins.
If the SF has a middle ground pin, feed solder
through the bottom side of hte target board via
holes. This will connect the center QFN SF pin
to the target board.
Check each solder connection on the QFN SF
pins.
You are now ready to attach the QFN header to the SF.
2010 Microchip Technology Inc.
DS51194S-page 25
Transition Socket Specification
DISCONTINUED SOCKETS
XLT28XP (Discontinued)
28-lead DIP 0.300-inch Male to 0.600-inch Female
The transition sockets in this section are discontinued
and may no longer be ordered from Microchip. They
are kept in this document as a reference for customers
who still have these sockets.
PDIP TRANSITION SOCKET
1.400"
TOP
VIEW
0.700"
A PDIP transition socket and associated hardware is
shown in Figure 1.
FIGURE 1: PDIP TRANSITION SOCKET
Cable to Processor Module
SIDE
VIEW
PDIP Device Adapter
0.100"
0.300-inch Male to 0.600-inch Female Adapter Socket
(PDIP Transition Socket)
0.600"
Gold Standoffs/Adapters
FRONT/
REAR
VIEW
Target/Application Board
0.300"
The PDIP transition socket is a 0.300-inch Male to
0.600-inch Female adapter socket.
Microchip offers the following PDIP transition socket:
• XLT28XP: One 28-lead DIP transition socket and
two 28-lead gold standoffs
See the drawings in this section for layout dimensions.
DS51194S-page 26
2010 Microchip Technology Inc.
Transition Socket Specification
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware is
shown in Figure 2.
XLT08SO (Discontinued – see XLT08SO-1 or
XLT08SN-1)
8-lead DIP to 0.050-inch Adapter Socket
FIGURE 2: SOIC TRANSITION SOCKET
Cable to Processor Module
TOP
VIEW
SIDE
VIEW
BOTTOM
VIEW
FRONT/
REAR
VIEW
PDIP Device Adapter
Gold Standoffs/
Adapters
Adapter Socket
SOIC Transition Socket
SOIC Header
Target/Application Board
8-lead SOIC Header
There are two components of the SOIC transition
socket:
1.
2.
Adapter socket that connects to the PDIP device
adapter
SOIC header that is to be soldered down to the
target application
TOP
VIEW
F
The following SOIC transition sockets have been discontinued:
• XLT08SO: One adapter socket and three 8-lead
SOIC headers
• XLT14SO: One adapter socket and three 14-lead
SOIC headers
• XLT18SO: One adapter socket and three 18-lead
SOIC headers
• XLT20SO1: One adapter socket and three
20-lead SOIC headers
• XLT28SO: One adapter socket and three 28-lead
SOIC headers
E
FRONT/
REAR
VIEW
D
A
G
B
SIDE
VIEW
C
See the drawings in this section for layout dimensions.
Note:
The SOIC header is designed for SOIC
body width of 0.300-inch. The adapter
leads should be cut to fit the 0.150-inch
and 0.208-inch SOIC body widths.
A
B
C
D
E
F
G
0.060
0.410
0.050
0.075
0.178
0.050
0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
2010 Microchip Technology Inc.
DS51194S-page 27
Transition Socket Specification
XLT14SO (Discontinued – see XLT14SO-1)
XLT18SO (Discontinued – see XLT18SO-1)
14-lead DIP to 0.050-inch Adapter Socket
18-lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
TOP
VIEW
SIDE
VIEW
BOTTOM
VIEW
FRONT/
REAR
VIEW
BOTTOM
VIEW
SIDE
VIEW
14-lead SOIC Header
TOP
VIEW
FRONT/
REAR
VIEW
F
18-lead SOIC Header
E
FRONT/
REAR
VIEW
D
G
A
TOP
VIEW
B
SIDE
VIEW
F
E
FRONT/
REAR
VIEW
C
D
A
B
C
D
E
F
G
0.060
0.410
0.050
0.075
0.178
0.050
0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
A
G
B
SIDE
VIEW
The SOIC header is designed for an SOIC body width of
0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
C
A
B
C
D
E
F
G
0.060
0.410
0.050
0.075
0.178
0.050
0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
DS51194S-page 28
2010 Microchip Technology Inc.
Transition Socket Specification
XLT20SO1 (Discontinued – see XLT20SO1-1)
XLT28SO (Discontinued – see XLT28SO-1)
20-lead DIP to 0.050-inch Adapter Socket
28-lead DIP to 0.050-inch Adapter Socket
TOP
VIEW
TOP
VIEW
BOTTOM
VIEW
BOTTOM
VIEW
SIDE
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
FRONT/
REAR
VIEW
20-lead SOIC Header
28-lead SOIC Header
TOP
VIEW
TOP
VIEW
F
F
E
FRONT/
REAR
VIEW
E
FRONT/
REAR
VIEW
D
D
A
G
A
B
G
B
SIDE
VIEW
SIDE
VIEW
C
C
A
B
C
D
E
F
G
A
B
C
D
E
F
G
0.060
0.410
0.050
0.075
0.178
0.050
0.050
0.060
0.410
0.050
0.075
0.178
0.050
0.050
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300-inch.
The SOIC header is designed for an SOIC body width of
0.300-inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
2010 Microchip Technology Inc.
DS51194S-page 29
Transition Socket Specification
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware is
shown in Figure 3.
XLT14SS (Discontinued – see XLT14SS-1)
14-lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
FIGURE 3: SSOP TRANSITION SOCKET
Cable to Processor Module
PDIP Device Adapter
BOTTOM
VIEW
Gold Standoffs/
Adapters
Adapter Socket
SSOP Header
SSOP Transition Socket
SIDE
VIEW
Target/Application Board
The SSOP transition sockets are similar to the SOIC
transition sockets. There are two parts to the SSOP
transition socket:
1.
2.
FRONT/
REAR
VIEW
Adapter socket that connects to the PDIP device
adapter.
SSOP header that gets soldered down to the
target application.
14-lead SSOP Header
Note:
To keep the leads straight during assembly
and shipping, the SSOP headers are
shipped with break-away tabs attached to
the leads. Please remove the break-away
tabs before applying power to the target
system. Be careful not to bend the leads
prior to soldering to the target application.
TOP
VIEW
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
The following SSOP transition sockets have been discontinued:
• XLT14SS: One adapter socket and three 14-lead
SSOP headers
• XLT20SS: One adapter socket and three 20-lead
SSOP headers
• XLT20SS1: One adapter socket and three 20-lead
SSOP headers
• XLT28SS: One adapter socket and three 28-lead
SSOP headers
• XLT28SS2: One adapter socket and three 28-lead
SSOP headers for PIC16C55/57
F
FRONT/
REAR
VIEW
E
D
G
A
B
SIDE
VIEW
See the drawings in this section for layout dimensions
and clearances for tall components.
C
A
B
C
D
E
F
G
0.035
0.300
0.023
0.080
0.186
0.043
0.025
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break-away tabs are to be removed prior to providing power.
DS51194S-page 30
2010 Microchip Technology Inc.
Transition Socket Specification
XLT20SS (Discontinued – see XLT20SS-1)
XLT20SS1 (Discontinued – see XLT20SS1-1)
18-lead DIP to 0.8 mm Adapter Socket
20-lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
TOP
VIEW
BOTTOM
VIEW
BOTTOM
VIEW
SIDE
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
FRONT/
REAR
VIEW
20-lead SSOP Header
20-lead SSOP Header
TOP
VIEW
Shipped with
break-away tabs
attached to leads
TOP
VIEW
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
* Top drawing shown
with clip-on shrouds
installed
F
F
FRONT/
REAR
VIEW
FRONT/
REAR
VIEW
E
E
D
D
A
A
B
G
G
B
SIDE
VIEW
SIDE
VIEW
C
C
A
B
C
D
E
F
G
A
B
C
D
E
F
G
0.040
0.295
0.026
0.075
0.190
0.047
0.0315
0.040
0.295
0.026
0.075
0.190
0.047
0.0315
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break-away tabs are to be removed prior to providing power.
Break-away tabs are to be removed prior to providing power.
2010 Microchip Technology Inc.
DS51194S-page 31
Transition Socket Specification
XLT28SS (Discontinued – see XLT28SS-1)
XLT28SS2 (Discontinued – see XLT28SS2-1)
28-lead DIP to 0.8 mm Adapter Socket
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
28-lead SSOP Header
TOP
VIEW Shipped with
break-away tabs
attached to leads
Remove prior to
applying power.
* Top drawing
shown with clip-on
shrouds installed
F
FRONT/
REAR
VIEW
E
D
SIDE
VIEW
G
A
B
C
A
B
C
D
E
F
G
0.040
0.295
0.026
0.075
0.190
0.047
0.0315
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Break-away tabs are to be removed prior to applying
power.
DS51194S-page 32
2010 Microchip Technology Inc.
Transition Socket Specification
PLCC TRANSITION SOCKET
RECOMMENDED PCB LAYOUT
A PLCC transition socket and associated hardware is
shown in Figure 4.
A
FIGURE 4: PLCC TRANSITION SOCKET
Cable to Processor Module
PLCC Device Adapter
0.024
PLCC Transition Socket
Target/Application Board
The PLCC transition socket is required for use along
with the PLCC device adapters. The DAF18-1 device
adapter is equipped with eight socket strips that interface with one of two transition sockets. The DAF18-3
device adapter is equipped with four socket strips that
interface with one transition socket.
The PLCC transition sockets are designed with a
threaded insert in the center of the footprint so that a
4/40 screw can securely fasten the transition socket to
the device adapter.
The PLCC transition sockets are designed to be soldered to the target PCB PLCC surface mount pattern or
inserted into a PLCC socket on the target PCB.
Note:
0.050
0.074
A
68-lead
1.025
84-lead
1.225
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 68-lead.
To avoid solder bridging, do not place vias
within 0.025-inch of the PLCC footprint.
Also, any vias near the PLCC should be
directly on the centerline of the pad.
The following PLCC transition sockets have been
discontinued:
• XLT68L1: One 68-lead PLCC transition socket
• XLT84L1: One 84-lead PLCC transition socket
2010 Microchip Technology Inc.
DS51194S-page 33
Transition Socket Specification
XLT68L1, XLT84L1 (Discontinued)
68/84-lead Adapter Socket
A
Tooling hole with
#4-40 threaded insert.
B
A
TOP VIEW
A
B
68-lead
1.300
0.960
84-lead
1.400
1.160
*Caution: Pin 1 on the device adapter side (top of socket)
is 180 degrees from pin 1 on the target side (bottom of
socket).
0.018
0.050
0.580
0.850
0.018
0.050
FRONT/
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 68-lead.
DS51194S-page 34
2010 Microchip Technology Inc.
Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 5: QFP TRANSITION SOCKET
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
Note:
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
QFP TRANSITION SOCKET
SOLDERING TIPS
• Before soldering, consider keeping the
break-away tabs in place during soldering.
• Use controlled soldering iron tip temperatures
between 300C and 325C (570F to 615F)
• If possible, use a PACE mini wave soldering iron
tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the
opposite side, then the remaining two sides.
• Soldering iron tip movement should be in the
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
• Use generous amounts of soldering flux to aid in
the solder flow action.
• If the break-away tabs are removed after soldering (using a dental pick or equivalent), any solder
bridging between leads can be repaired by simply
gently touching the soldering tip to the lead tip.
The following QFP transition sockets have been
discontinued:
• XLT44PT: One 44-lead QFP transition socket,
0.80 mm
• XLT64PT1: One 64-lead QFP transition socket,
0.5 mm (PIC16C92X)
Note:
Pin 1
The XLT64PT1 for the PIC16C92X is not
symmetrical. Please note Pin 1 orientation
prior to soldering to the target system.
CAUTION
The 64 and 80-pin QFP headers are very delicate
and can be easily damaged!
XLT44PT (Discontinued – see XLT44PT3)
44-lead QFP to 0.8 mm Adapter Socket
1
ST92X
TOP
VIEW
0.90
TOP
VIEW
0.90
0.80
• XLT64PT2: One 64-lead QFP transition socket,
0.5 mm (PIC17CXXX)
• XLT64PT3: One 64-lead QFP transition socket,
0.8 mm (dsPIC30F)
• XLT64PT4: One 64-lead QFP adapter socket and
one 64-lead QFP header (0.8 mm)
• XLT80PT: One 80-lead QFP transition socket,
0.5 mm
FRONT/
SIDE
VIEW
0.05
0.300
0.130
0.80 mm
0.365
0.55
0.65
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
2010 Microchip Technology Inc.
DS51194S-page 35
Transition Socket Specification
XLT64PT1 (Discontinued)
XLT64PT2 (Discontinued – see XLT64PT5)
XLT80PT (Discontinued – see XLT80PT3)
XLT64PT3 (Discontinued – see XLT64PT5)
64-lead QFP to 0.8mm Adapter Socket
64/80-lead QFP to 0.5 mm Adapter Socket
TOP
VIEW
TOP
VIEW
1.05
A
Break-Away
Tabs
1.05
0.95
0.05
A
FRONT/
SIDE
VIEW
0.300
B
0.05
FRONT/
SIDE
VIEW
0.140
0.330
0.80 mm
0.50
0.100
0.70
0.80
0.5 mm
C
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
D
A
B
C
D
XLT64PT1
XLT64PT2
1.25
0.95
0.400
0.500
XLT80PT
1.45
1.15
0.475
0.575
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
Drawing shown is for 64-lead.
This drawing shown with break-away tabs attached to
the leads.
Break-away tabs are to be removed prior to applying
power.
DS51194S-page 36
2010 Microchip Technology Inc.
Transition Socket Specification
XLT64PT4 (Discontinued – see XLT64PT5)
TABLE 1:
64-lead QFP (0.8 mm)
68
DVA/DAF INTERFACE
SPECIFICATION FOR QFP
PACKAGES
52
1
Socket
51
Package Style*
QFP
PIN 1
XLT44PT
44PT TQFP
44PQ MQFP
44KW PQFP
DVA-44PL
XLT64PT1
64PT special –
PIC16C923/4,
PIC16C925/6 only
DVA-68PL2
XLT64PT2
64PT
DVA-68PL
80PT
DVA-84PL
1.250
TOP
VIEW
17
35
18
34
DVA/DAF
Interface
Specification**
XLT64PT3
1.250
XLT64PT4
XLT80PT
0.960
0.018
*
0.050
FRONT/
SIDE
VIEW
0.355
0.225
Refer to the “Package Specification” for PCB
footprint dimensions (DS00049).
** Refer to the processor module and device
adapter specification for interface and
dimensions to DVA/DAF (ICE 2000: “MPLAB®
ICE 2000 Processor Module and Device Adapter
Specification” (DS51140); ICE 4000: “MPLAB®
ICE 4000 Processor Module and Device Adapter
Specification” (DS51298)).
0.065
0.80 mm
Refer to the “Package Specification” for
PCB footprint dimensions (DS00049).
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
2010 Microchip Technology Inc.
DS51194S-page 37
Transition Socket Specification
SOT/DFN/QFN TRANSITION
SOCKETS
SOT/DFN/QFN transition sockets and associated
hardware are shown below.
RECOMMENDED PCB LAYOUT
The recommended target board footprint layout for
different pin-counts is shown here.
FIGURE 8: 8-PIN DFN
FIGURE 6: DFN/QFN TWO-PART
TRANSITION SOCKET
Cable to Processor Module
PDIP Device Adapter
50 mils
16 mils
Gold Standoffs/
Adapters
24 mils
DFN/QFN Transition Socket
FIGURE 9: 28-PIN QFN
Target/Application Board
FIGURE 7: QFN TRANSITION SOCKET
24 mils
11 mils
Cable to Processor Module
26 mils
PDIP Device Adapter
Gold Standoffs/
Adapters
FIGURE 10: 44-PIN QFN
QFN Transition Socket
Target/Application Board
The following SOT/DFN/QFN transition sockets have
been discontinued:
• XLT08DFN: One 8-lead DFN transition socket.
(Replaced by XLT08DFN2.)
• XLT28QFN: One 28-lead QFN transition socket.
(Replaced by XLT28QFN4.)
• XLT28QFN2: One 28-lead QFN transition socket.
(Replaced by XLT28QFN3.)
• XLT44QFN: One 44-lead QFN two-part transition
socket. (Replaced by XLT44QFN2.)
16 mils
13 mils
26 mils
See the drawings in this section for layout dimensions.
DS51194S-page 38
2010 Microchip Technology Inc.
Transition Socket Specification
XLT08DFN (Discontinued – see XLT08DFN2)
XLT28QFN (Discontinued – see XLT28QFN4)
8-lead DIP to 0.025-inch Adapter Socket
28-lead DIP to 0.025-inch Adapter Socket
400 mils
600 mils
400 mils
1400 mils
TOP
VIEW
TOP
VIEW
DIP socket
DIP socket
425 mils
SIDE
VIEW
250 mils
Solder
480 mils
170 mils
160 mils
62 mils
Solder
PCB pads
PCB pads
SIDE
VIEW
2010 Microchip Technology Inc.
DS51194S-page 39
Transition Socket Specification
XLT28QFN2 (Discontinued – see XLT28QFN3)
XLT44QFN (Discontinued – see XLT44QFN2)
18-lead DIP to 0.025-inch Adapter Socket
40-lead DIP to 0.025-inch Adapter Socket
0.900
2.058
0.600
0.695
DIP 1
TOP
VIEW
TOP
VIEW
SIDE
VIEW
0.480
0.730
0.50
SIDE
VIEW
0.875
DIP 1
0.026
0.236
Pin 1 of QFN
BOTTOM
VIEW
BOTTOM
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
44-lead QFN Header
0.315
0.315
TOP
VIEW
BOTTOM
VIEW
SIDE
VIEW
Solder
0.195
0.026
PCB pads
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
DS51194S-page 40
2010 Microchip Technology Inc.
Transition Socket Specification
APPENDIX A:
A.1
REVISION HISTORY
Revision N (February 2006)
The following is a list of modifications:
1.
2.
3.
A.2
Added Appendix A: Revision History.
Removed “Preliminary” from the document’s
footer.
Added notes referring user to the “Packaging
Specification” (DS00049) for PCB footprint
dimensions in the “Two-Part QFP Sockets”
section.
Revision P (September 2006)
The following is a list of modifications:
1.
2.
3.
A.3
Removed “MPLAB ICE 2000/4000” from the
name of the document. This document now
applies to multiple tools, and the document title
was renamed to reflect this.
Updated document to reflect support of 4 tools.
Updated document to include break-away tab
information for XLT64PT1, XLT64PT2 and
XLT80PT.
Revision Q (July 2008)
The following is a list of modifications:
1.
A.4
Update for new SOIC, SSOP and QFN sockets.
Revision R (July 2009)
The following is a list of modifications:
1.
A.5
Updated the first paragraph in the
“Introduction” section.
Revision S (March 2010)
The following is a list of modifications:
1.
2.
Obsoleted XLT28XP and XLT64PT4
Added XLT44QFN4 and XLT44QFN5.
2010 Microchip Technology Inc.
DS51194S-page 41
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01/05/10
DS51194S-page 42
2010 Microchip Technology Inc.
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