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ZL30363GDG2003Y

ZL30363GDG2003Y

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    144-BGA

  • 描述:

    IC CLK TRANSLATOR 2CH 144LBGA

  • 数据手册
  • 价格&库存
ZL30363GDG2003Y 数据手册
ZL30363 IEEE 1588 and Synchronous Ethernet Packet Clock Network Synchronizer Short Form Data Sheet May 2013 Features • Two independent clock channels • Frequency and Phase Sync over Packet Networks • • • • • Ordering Information: ZL30363GDG2 144 Pin LBGA Frequency accuracy performance for WCDMAFDD, GSM, LTE-FDD and femtocell applications Pb Free Tin/Silver/Copper -40oC to +85oC Package size: 13 x 13 mm Frequency performance for ITU-T G.823 and G.824 synchronization interface, as well as G.8261 PNT PEC and CES interfaces Phase Synchronization performance for WCDMA-TDD, Mobile WiMAX, TD-SCDMA and CDMA2000 applications Client holdover and reference switching between multiple Servers Physical Layer Equipment Clocks Synchronization • Any input clock rate from 1 Hz to 750 MHz • Automatic hitless reference switching and digital holdover on reference fail • Flexible two-stage architecture to support conversion between SONET/SDH and OTN rates • Digital PLLs with programmable bandwidth from 0.1 mHz up to 1 kHz • Programmable synthesizers • Any output clock rate from 1 Hz to 750 MHz with maximum jitter below 0.63 ps RMS Operates from a single crystal resonator or clock oscillator Configurable via SPI/I2C interface • ITU-T G.8262 for SyncE EEC option 1 and 2 • ITU-T G.813 for SONET/SDH SEC option 1 and 2 • Telcordia GR-1244 and GR-253 Stratum 3 and SMC • • • Trays Support for G.781 SETS Osci Osco ZL30363 Master Clock Ref0 Diff / Single Ended Fr0= Br0*Kr0*Mr0/Nr0 Ref1 Diff / Single Ended Fr1= Br1*Kr1*Mr1/Nr1 Ref2 Diff / Single Ended Fr2= Br2*Kr2*Mr2/Nr2 Ref3 Diff / Single Ended Fr3= Br3*Kr3*Mr3/Nr3 Ref4 Diff / Single Ended Fr4= Br4*Kr4*Mr4/Nr4 Ref5 Diff / Single Ended Fr5= Br5*Kr5*Mr5/Nr5 Ref6 Diff / Single Ended Fr6= Br6*Kr6*Mr6/Nr6 Ref7 Diff / Single Ended Fr7= Br7*Kr7*Mr7/Nr7 Ref8 Diff / Single Ended Fr8= Br8*Kr8*Mr8/Nr8 Ref9 Single Ended Fr9= Br9*Kr9*Mr9/Nr9 Ref10 Single Ended Fr10= Br10*Kr10*Mr10/Nr10 Clock Generator 0 Synthesizer 0 Fs= Bs0*Ks0*16*Ms0/Ns0 Clock Generator 1 Synthesizer 1 Fs= Bs1*Ks1*16*Ms1/Ns1 DPLL0/NCO0 Select Loop band., Phase slope limit DPLL1/NCO1 Select Loop band., Phase slope limit Clock Generator 2 Synthesizer 2 Fs= Bs2*Ks2*16*Ms2/Ns2 Clock Generator 3 State Machine JTAG Reference Monitors JTAG pwr_b Configuration and Status GPIO Synthesizer 3 Fs= Bs3*Ks3*16*Ms3/Ns3 SPI / I2C Figure 1 - Functional Block Diagram 1 Copyright 2013, Microsemi Corporation. All Rights Reserved. Div A LVPECL hpdiff0_p/n Div B LVPECL hpdiff1_p/n Div C LVCMOS hpoutclk0 Div D LVCMOS hpoutclk1 Div A LVPECL hpdiff2_p/n Div B LVPECL hpdiff3_p/n Div C LVCMOS hpoutclk2 Div D LVCMOS hpoutclk3 Div A LVPECL hpdiff4_p/n Div B LVPECL hpdiff5_p/n Div C LVCMOS hpoutclk4 Div D LVCMOS hpoutclk5 Div A LVPECL hpdiff6_p/n Div B LVPECL hpdiff7_p/n Div C LVCMOS hpoutclk6 Div D LVCMOS hpoutclk7 ZL30363 Short Form Data Sheet Detailed Features General • Two independent clock channels • • Operates from a single crystal resonator or clock oscillator Configurable via its SPI/I2C interface Time Synchronization Algorithm • External algorithm controls software digital PLL to adjust frequency and phase alignment • Frequency, Phase and Time Synchronization over IP, MPLS and Ethernet Packet Networks • Frequency accuracy performance for WCDMA-FDD, GSM, LTE-FDD and femtocell applications, with target performance less than ± 15 ppb. • Frequency performance for ITU-T G.823 and G.824 synchronization interface, as well as G.8261 PNT EEC, PNT PEC and CES interface specifications. • Phase Synchronization performance for WCDMA-TDD, Mobile WiMAX, TD-SCDMA and CDMA2000 applications with target performance less than ± 1 s phase alignment. • Time Synchronization for UTC-traceability and GPS replacement. • Client reference switching between multiple Servers • Client holdover when Server packet connectivity is lost Electrical Clock Inputs • Nine input references configurable as single ended or differential and two single ended input references • Synchronize to any clock rate from 1 Hz to 750 MHz on differential inputs • Synchronize to any clock rate from 1 Hz to 177.75 MHz on singled-ended inputs • Any input reference can be fed with sync (frame pulse) or clock. • • Synchronize to sync pulse and sync pulse/clock pair. Flexible input reference monitoring automatically disqualifies references based on frequency and phase irregularities • • LOS • Single cycle monitor • Precise frequency monitor • Coarse frequency monitor • Guard soak timer Per input clock delay compensation Electrical Clock Engine • Digital PLLs filter jitter from 0.1 mHz up to 1 kHz • Flexible two-stage architecture translates between arbitrary data rates, line coding rates and FEC rates • Internal state machine automatically controls mode of operation (free-run, locked, holdover) • Automatic hitless reference switching and digital holdover on reference fail • Physical-to-physical reference switching 2 Microsemi Corporation ZL30363 • • Physical-to-packet reference switching • Packet-to-physical reference switching • Packet-to-packet reference switching Short Form Data Sheet Support for wide variety of Equipment Clock specifications • SyncE • • ITU-T G.8262 option 1 EEC (Europe/China) • ITU-T G.8262 option 2 (USA) SONET/SDH • • ITU-T G.813 option 1 SEC (Europe/China) • ITU-T G.813 option 2 (USA) • ANSI T1.105/Telcordia GR-253 Stratum 3 for SONET • Telcordia GR-253 SMC PDH • • • • ITU-T G.812 Type I SSU ITU-T G.812 Type III, ANSI T1.101/Telcordia GR-1244 Stratum 3E, including phase build out ANSI T1.101/Telcordia GR-1244 Stratum 3 ANSI T1.101/Telcordia GR-1244 Stratum 4E/4 • Selectable phase slope limiting • Holdover better than 1 ppb (when using < 0.1 Hz filter) • Supports ITU-T G.823, G.824 and G.8261 for 2048 kbit/s and 1544 kbit/s interfaces • Supports G.781 SETS Electrical Clock Generation • Four programmable synthesizers • Eight LVPECL outputs • Two LVPECL outputs per synthesizer • • Generate any clock rate from 1 Hz to 750 MHz • Maximum jitter below 0.63 ps rms • Meets OC-192, STM-64, 1 GbE and 10 GbE interface jitter requirements Eight LVCMOS outputs • Two LVCMOS outputs per synthesizer • Generate any clock rate from 1 Hz to 177.75 MHz • Programmable output advancement/delay to accommodate trace delays or compensate for system routing paths • Outputs may be disabled to save power API Software • Interfaces to 1588-capable PHY and switches with integrated timestamping • Abstraction layer for independence from OS and CPU, from embedded SoC to home-grown • Fits into centralized, highly integrated pizza box architectures as well as distributed architectures with multiple line cards and timing cards 3 Microsemi Corporation ZL30363 Short Form Data Sheet Applications • ITU-T G.8262 System Timing Cards which support 1 GbE and 10 GbE interfaces • Telcordia GR-253 Carrier Grade SONET/SDH Stratum 3 System Timing Cards • System Timing Cards which supports ITU-T G.781 SETS (SDH Equipment Timing Source) • Integrated basestation reference clock for air interface for GSM, WCDMA, LTE and WiMAX macro, micro, or femtocells • Mobile Backhaul NID, edge router or access aggregation node • EPON/GE-PON and GPON OLT • EPON/GE-PON and GPON ONU/OLT • DSLAM and RT-DSLAM • 10 Gigabit line cards • Synchronous Ethernet, 10 GBASE-R, and 10 GBASE-W • SONET/SDH, Fibre Channel, XAUI 4 Microsemi Corporation Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi. This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request. For more information about all Microsemi products visit our website at www.microsemi.com/timing-and-synchronization TECHNICAL DOCUMENTATION – NOT FOR RESALE Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 © 2013 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.
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