AG203-86G

AG203-86 InGaP HBT Gain Block `Product Features • • • • • • • • DC – 6000 MHz 19.5 dB Gain @ 900 MHz +8 dBm P1dB @ 900 MHz +21 dBm OIP3@ 900 MHz Single Voltage Supply Internally matched to 50 Ω Robust 1000V ESD, Class 1C Lead-free/green/RoHS-compliant SOT-86 package Applications • • • • • Product Description Functional Diagram The AG203-86 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 900 MHz, the AG203-86 typically provides 19.5 dB gain, +21 dBm OIP3, and +8 dBm P1dB. The device combines dependable performance with consistent quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85 °C and is housed in a leadfree/green/RoHS-compliant SOT-86 (micro-X) industrystandard SMT package. GND 4 RF In 3 RF Out 1 2 GND The AG203-86 consists of a Darlington-pair amplifier using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. Function Input Output/Bias Ground Pin No. 1 3 2, 4 The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AG203-86 will work for other various applications within the DC to 6 GHz frequency range such as CATV and WiMAX. Mobile Infrastructure CATV / FTTX WLAN / ISM RFID WiMAX / WiBro Specifications (1) Parameter Units Min MHz MHz dB dB dB dBm dBm dBm dB MHz dB dBm dBm V mA DC Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Output IP2 Noise Figure Test Frequency Gain Output P1dB Output IP3 (2) Device Voltage Device Current 16.2 Typ Max 6000 900 19.4 25 15 +8.0 +20.8 +25 3.1 1900 17.2 +7.3 +20.7 4.05 20 Typical Performance (1) Parameter Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure Units MHz dB dB dB dBm dBm dB Typical 500 20 -25 -15 +8.1 +20.8 3.1 900 19.4 -25 -15 +8.0 +20.8 3.1 1900 17.2 -20 -15 +7.3 +20.7 3.3 2140 16.6 -16 -15 +7.2 +20.5 3.3 18.2 1. Test conditions: 25 ºC, Supply Voltage = +5 V, Rbias = 47.5 Ω, 50 Ω System. 2. 3OIP measured with two tones at an output power of -10 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Storage Temperature DC Voltage RF Input Power (continuous) Thermal Resistance, Rth Junction Temperature -55 to +125 °C +4.5 V +10 dBm 457°C/W +177°C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. Description AG203-86G InGaP HBT Gain Block AG203-86PCB 700 – 2400 MHz Fully Assembled Eval. Board (lead-free/green/RoHS-compliant SOT-86 Package) Standard tape / reel size = 3000 pieces on a 7” reel Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 1 of 5 March 2008 AG203-86 InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +5 V, Rbias = 47.5 Ω, Icc = 20 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 20.2 -20 -13 +8.2 +21.0 3.1 500 20.0 -25 -15 +8.1 +20.8 3.1 900 19.4 -25 -15 +8.0 +20.8 3.1 1900 17.2 -20 -15 +7.3 +20.7 3.3 2140 16.6 -16 -15 +7.2 +20.5 3.3 2400 16.0 -16 -14 +7.2 +20.3 3.4 3500 14.1 -16 -18 +6.5 5800 10.7 -16 -15 1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = 4.05 V, Rbias = 47.5 Ω, Icc = 20 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of -10 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Gain vs. Frequency Return Loss 18 16 14 +25 C 1 +85 C 2 Frequency (GHz) -20 -30 S11 3 0 4 1 2 3 4 5 30 15 10 4 25 2 2.5 3 0 200 Frequency (GHz) +25c +85c -40 C 400 600 800 18 Gain (dB) 5 0 Gain 16 16 12 14 16 8 14 4 0 Output Power 10 1.5 2 2.5 Frequency (GHz) 1 3 3.5 1.5 2 2.5 3 frequency = 2000 MHz 14 10 Gain 12 6 10 2 8 -2 Output Power -10 1 +85 C Output Power / Gain vs. Input Power frequency = 900 MHz 12 +85 C +25 C Frequency (GHz) -5 0.5 0.5 Frequency (MHz) 20 0 0 1000 Output Power / Gain vs. Input Power 10 +25 C 2 0 P1dB vs. Frequency -40 C 3 1 -40c Output Power (dBm) 1.5 4.5 Noise Figure vs. Frequency 15 1 4.0 5 +85 C 5 0.5 3.5 Device Voltage (V) 20 0 10 0 3.0 6 NF (dB) 20 OIP2 (dBm) 35 +25 C Optimal operating point 20 Output IP2 vs. Frequency 25 -40 C 30 Frequency (GHz) Output IP3 vs. Frequency OIP3 (dBm) S22 -40 12 0 -10 Gain (dB) -40 C 40 Device Current (mA) S11, S22 (dB) Gain (dB) 20 P1dB (dBm) I-V Curve 0 Output Power (dBm) 22 4 -4 -20 -16 -12 -8 -4 Input Power (dBm) 0 4 6 -6 -20 -16 -12 -8 -4 Input Power (dBm) 0 4 Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 2 of 5 March 2008 AG203-86 InGaP HBT Gain Block Typical Device RF Performance (cont’d) Supply Bias = +6 V, Rbias = 98 Ω, Icc = 20 mA Gain vs. Frequency Output IP3 vs. Frequency OIP3 (dBm) Gain (dB) 20 18 16 Output IP2 vs. Frequency 25 35 20 30 OIP2 (dBm) 22 15 10 20 14 -40 C -40 C +25 C +85 C 0 1 +25 C +85 C 2 Frequency (GHz) 3 0 4 +25c +85c 15 0.5 1 1.5 2 2.5 3 0 200 Frequency (GHz) 400 600 800 1000 Frequency (MHz) Noise Figure vs. Frequency P1dB vs. Frequency 5 10 4 5 NF (dB) P1dB (dBm) -40c 5 12 25 0 -5 -40 C +25 C 3 2 1 +85 C -40 C +25 C +85 C 0 -10 0 0.5 1 1.5 2 2.5 3 3.5 0 4 0.5 1 Frequency (GHz) 1.5 2 2.5 3 Frequency (GHz) Typical Device RF Performance Supply Bias = +8 V, Rbias = 198 Ω, Icc = 20 mA Gain vs. Frequency Output IP3 vs. Frequency OIP3 (dBm) Gain (dB) 20 18 16 Output IP2 vs. Frequency 25 35 20 30 OIP2 (dBm) 22 15 10 20 14 -40 C -40 C +25 C +85 C 0 1 2 Frequency (GHz) +25 C +85 C 3 0 4 +25c -40c 15 0.5 1 1.5 2 2.5 3 0 200 Frequency (GHz) 400 600 800 1000 Frequency (MHz) Noise Figure vs. Frequency P1dB vs. Frequency 5 10 4 5 NF (dB) P1dB (dBm) +85c 5 12 25 0 -5 -40 C +25 C 3 2 1 +85 C -40 C +25 C +85 C 0 -10 0 0.5 1 1.5 2 2.5 Frequency (GHz) 3 3.5 4 0 0.5 1 1.5 2 2.5 3 Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 3 of 5 March 2008 AG203-86 InGaP HBT Gain Block Application Circuit Vcc Icc = 20 mA R1 Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN RF OUT AG203-86 C2 Blocking Capacitor C1 Blocking Capacitor Recommended Component Values Reference Designator 50 500 L1 820 nH 220 nH C1, C2, C4 .018 µF 1000 pF Frequency (MHz) 900 1900 2200 68 nH 27 nH 22 nH 100 pF 68 pF 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. L1 C1, C2 C3 C4 R1 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 µF chip capacitor Do Not Place 47.5 Ω 1% tolerance Size 0603 0603 0603 Recommended Bias Resistor Values S upply R1 value S ize Voltage 5V 47.5 ohms 0603 6V 98 ohms 0603 7V 148 ohms 0805 8V 198 ohms 0805 9V 248 ohms 1206 10 V 298 ohms 1210 12 V 398 ohms 1210 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +5 V. A 1% tolerance resistor is recommended. 0603 Typical Device Data S-Parameters (Vdevice = +4.05 V, ICC = 20 mA, T = 25 °C, calibrated to device leads. Freq (MHz) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 3250 3500 3750 4000 4250 4500 4750 5000 5250 5500 5750 6000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -22.84 -23.86 -27.29 -26.07 -25.11 -22.93 -22.25 -20.95 -19.51 -16.43 -16.78 -16.30 -16.36 -17.08 -18.26 -20.54 -24.06 -26.27 -28.81 -29.10 -29.66 -27.47 -23.43 -20.02 -17.60 -0.07 9.00 28.82 34.92 29.08 24.43 14.88 2.45 -8.95 -13.31 -23.33 -34.19 -40.45 -46.15 -50.28 -49.45 -47.33 -34.92 -7.87 4.10 -6.98 -47.93 -76.94 -92.84 -100.20 20.75 20.67 20.50 20.14 19.67 19.20 18.61 18.05 17.41 16.82 16.42 15.94 15.44 15.04 14.61 14.22 13.82 13.42 12.97 12.58 12.26 11.89 11.53 11.26 10.98 177.32 166.89 153.87 141.62 129.97 118.62 108.25 98.43 89.13 81.09 75.17 66.69 59.03 51.80 44.52 37.06 29.86 22.90 15.72 8.48 1.83 -4.38 -10.48 -16.74 -22.74 -23.39 -23.73 -23.63 -23.52 -23.71 -22.95 -23.00 -22.57 -22.18 -21.84 -22.12 -21.11 -20.69 -20.33 -19.98 -19.86 -19.34 -18.89 -18.65 -18.33 -17.90 -17.79 -17.36 -17.43 -17.06 0.76 2.56 1.56 1.40 -0.82 0.96 -0.16 1.41 2.42 -1.23 -6.06 -6.07 -4.81 -6.56 -9.18 -14.94 -14.68 -20.14 -21.13 -26.55 -29.89 -34.21 -36.99 -39.01 -44.67 -13.40 -13.66 -15.89 -16.64 -17.55 -17.47 -17.07 -16.20 -15.55 -13.16 -13.53 -14.17 -15.24 -16.92 -19.42 -22.27 -21.48 -19.26 -17.44 -15.98 -14.84 -15.32 -15.49 -15.72 -15.62 -3.20 -11.48 -24.47 -41.51 -58.52 -77.84 -93.14 -104.31 -110.13 -105.60 -109.50 -114.41 -120.33 -126.45 -142.16 -170.32 152.21 128.72 118.35 114.86 117.23 122.63 131.30 145.53 155.14 Device S-parameters are available for download from the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 4 of 5 March 2008 AG203-86 InGaP HBT Gain Block AG203-86G (Green / Lead-free Sot-86 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper. Outline Drawing Product Marking The component will be marked with a “N” designator followed by a two-digit numeric lot code on the top surface of the package. The obsolete tin-lead package is marked with a “C” designator followed by a two-digit numeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1C Passes ≥ 1000V min. Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes ≥ 1000V min. Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 5 of 5 March 2008