EH-FOC1-1

HYDRA-X FOC Head Power Application Controllers TM PAC5220 Expansion - HYDRA-X FOC Head User’s Guide www.active-semi.com Copyright © 2016 Active-Semi, Inc. CONTENTS Contents ...............................................................................................................................................................2 Overview ..............................................................................................................................................................3 HYDRA-X FOC Head Resources ........................................................................................................................5 Header Descriptions .........................................................................................................................................5 HYDRA-X20 Pinout and Signal Connectivity ...................................................................................................6 Power Input ......................................................................................................................................................8 External and Internal Resources ......................................................................................................................9 HYDRA-X FOC Head Hardware ....................................................................................................................... 10 External Potentiometer (J14) ......................................................................................................................... 10 External Thermistor (J15) .............................................................................................................................. 10 S1 and S2 Push Buttons ............................................................................................................................... 11 RC PWM Remote Control Input (J13) ........................................................................................................... 11 HYDRA-X FOC Head Schematic ...................................................................................................................... 13 About Active-Semi............................................................................................................................................. 14 - 2 - Rev 2.0 January 2016 OVERVIEW Active-Semi’s HYDRA-X FOC Head is an expansion board for the Hydra-X20/23 Body board, providing a complete motor solution. Although developed to control tri-phase Brushless DC (BLDC) motors or Permanent Magnet Synchronous Machines (PMSM), the module can be utilized to drive other motor topologies including, but not limited to, brushed DC motors or tri phase steppers. The HYDRA-X FOC Head has been designed to accommodate a robust power stage made of six surface mount power MOSFETs rated at 30V and a maximum of 50A. For higher voltage applications, the surface mount FETs can be interchanged. The module contains all of the passive components required to properly polarize and protect the switch elements. This module was designed taking into consideration two FOC control methodologies: Hall Sensor FOC and sensorless FOC. A connector is provided to connect hall sensor signals. In parallel to these connections, the board provides three SENSE resistors utilized to measure phase currents which the FOC algorithm employs during commutation. All that is required from the user is to download the pertinent firmware into the HydraX20/23 Body board, and establish the respective motor connections. Other resources made available to prospective developers are a potentiometer which could be used to control motor speed, two push buttons, and a series of connectors which could be used to add external switches. A placeholder for a thermistor was designed into the system allowing developers to add their own version of a thermal protection directly interfaced at the FET block. Active-Semi’s HYDRA-X FOC Head kit consists of the following: • • • HYDRA-X FOC Head module HYDRA-X FOC Head User’s Guide Schematics, BOM and Layout Drawings - 3 - Rev 2.0 January 2016 Figure 1: HYDRA-X FOC Head Block Diagram Solution Benefits: • • • • • Ideal for most medium voltage and high current motor driving applications. Six powerful FET switches allow for high current motor driving. Motor can be controlled remotely through an RC radio or an UART based serial communications channel such as a BlueTooth module (Bluetooth module not included). Can be programmed to drive FOC motors in sensored or sensorless implementations. Schematics, BOM, Layout drawings available The following sections provide information about the hardware features of Active-Semi’s HYDRA-X FOC Head turnkey solution. - 4 - Rev 2.0 January 2016 HYDRA-X FOC HEAD RESOURCES Header Descriptions The following table shows the female header descriptions for the HYDRA-X10 Body module. Header J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 J11 J12 J13 J14 J15 Pin 1-10 1-8 1-20 1-10 1-6 1 2 3 4 5 6 1 2 3 4 1 2 3 1 2 3 1 2 J16 1 2 Description Refer to HYDRA-X20 pinout diagram Refer to HYDRA-X20 pinout diagram Refer to HYDRA-X20 pinout diagram Refer to HYDRA-X20 pinout diagram Refer to HYDRA-X20 pinout diagram Hall Sensor Inputs Hall Sensor VCC (5V) Hall Sensor U Phase Hall Sensor V Phase Hall Sensor W Phase Optional Hall Sensor Input (FG) Hall Sensor GND VIN Power Input -Spade connector (16V to 48V) GND Power Input – Spade Connector U Phase Output – Spade Connector V Phase Output – Spade Connector W Phase Output – Spade Connector Extern UART connector. UART VCC (5V) UART RX UART TX UART GND External RC PWM connector. RC PWM Signal Digital Input (PD4) RC PWM VCC (5V) RC PWM GND External Potentiometer Input External Potentiometer VCC (Voltage Divided VCC = 5V) External Potentiometer Analog Input (PC4) External Potentiometer GND Optional Thermistor connector Thermistor Analog Input (AIO2) Thermistor GND External Push Button External Push Button Digital Input (PE5) Extern Push Button GND - 5 - Rev 2.0 January 2016 HYDRA-X20 FOC System Pinout and Signal Connectivity The following diagram shows the male header pinout for the HYDRA-X FOC Head module, as seen from above: Figure 2 HYDRA-X FOC Head Pinout The HYDRA-X FOC Head module interfaces with the HYDRA-X20 and Hydra-X23/23S Body modules. Figure 3 HYDRA-X20 Body Pinout - 6 - Rev 2.0 January 2016 Figure 4 HYDRA-X23/23S Body Pinout More information on the HYDRA-X20/23/23S Body modules, and their respective User’s Guide, can be downloaded from the HYDRA-X website at www.active-semi.com/hydra. - 7 - Rev 2.0 January 2016 Power Input Power to the Hydra-X FOC Head module should be connected to the J7/J8 Spade connectors. The voltage magnitude applied to the module should not exceed the employed FET VDS voltage. Default FETs (BSC011N03LS) have a VDS of 30V. A suggested alternative for up to 60V voltage applications is the BSC076N06NS3 with a VDS of 60V. Powering the HYDRA-X FOC Head through the J7/J8 connectors will power the HYDRA-X20/23 Body board. Power to the body board is applied through the J4 VIN and GND terminal. NOTE: Applying power to the HYDRA-X FOC system through the HYDRA-X20/23 J7 connector is not recommended. Since this is a high current application, and the header connectors are not rated to handle such high currents, it is crucial that current is supplied through the spade connectors into the headers and not vice versa. The HYDRA-X FOC Head is not protected against voltage reversal. Voltage polarity must be observed before applying power to the module. Failing to follow correct voltage polarity connections will adversely affect HYDRA-X FOC Head power FETs. - 8 - Rev 2.0 January 2016 External and Internal Resources The following table illustrates the systems resources utilized Header J6 J6 J6 J6 J12 J12 J13 J14 J15 J16 Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Internal Pin 2 3 4 5 2 3 1 2 1 1 - Description Hall Sensor U Phase Hall Sensor V Phase Hall Sensor W Phase Optional Hall Sensor Input (FG) UART RX UART TX RC PWM Signal Digital Input External Potentiometer Analog Input Thermistor Analog Input External Push Button Digital Input VIN Analog Input R11 Potentiometer Analog Input S1 Push Button Digital Input S2 Push Button Digital Input PHASE U Output (Voltage Divided) PHASE V Output (Voltage Divided) PHASE W Output (Voltage Divided) SENSE Resistor + Terminal PHASE U Low Side FET Gate Drive PHASE U High Side FET Gate Drive PHASE U Boot Strap PHASE U High Side Source PHASE V Low Side FET Gate Drive PHASE V High Side FET Gate Drive PHASE V Boot Strap PHASE V High Side Source PHASE W Low Side FET Gate Drive PHASE W High Side FET Gate Drive PHASE W Boot Strap PHASE W High Side Source - 9 GPIO Resource PD2 PD3 PD6 PD7 PE2 PE1 PD4 PC4 AIO2 PE5 PC4 PC2 PE4 PE5 AIO7 AIO8 AIO9 AIO1 DRL0 DRH3 DRB3 DRS3 DRL1 DRH4 DRB4 DRS4 DRL2 DRH5 DRB5 DRS5 - Rev 2.0 January 2016 HYDRA-X FOC HEAD HARDWARE External Potentiometer (J14) For applications wanting to utilize an external potentiometer, the 3 pin header connector gives access to analog input PC4. The potentiometer resource is pulled up via a 5.1K resistor. In the event the external potentiometer requires a different pull up resistance, resistor R19 can be modified accordingly with a 0603 package of suitable resistive value. Figure 5 External Potentiometer Circuitry External Thermistor (J15) In order to protect power FETs from being adversely affected by extremely high temperatures, a thermistor input is provided. Thermistor temperature can be sampled through analog input AIO2. By default, the thermistor’s pull up resistor is a Non Populate component. User can select appropriate pull up resistor (0603 package) and populate at the R18 footprint location. Figure 6 External Thermistor Circuitry - 10 - Rev 2.0 January 2016 S1 and S2 Push Buttons Two push buttons (S1 and S2) are made available for users requiring to add further control functionality to the motor drive system. Push button S1 is assigned to resource PE4 whereas push button S2 is assigned to resource PE5. Alternatively, a non-populated two pin connector (J16) is made available in order to allow for an external switch to be added at a later time, if required. Figure 7 External Thermistor Circuitry RC PWM Remote Control Input (J13) Users wanting to control a motor by employing an off the shelf Remote Control (RC) radio, can take advantage of the 3 pin header connector J13. This pin provides 5V power to the receiver module and accepts the typical 1.0 to 2.0 ms PWM signal. Firmware decoding the RC PWM signal is part of our sample code made available at the HYDRA-X Blog. RC PWM control signal can be sampled via the PD4 resource. Figure 8 RC PWM Interface Circuitry - 11 - Rev 2.0 January 2016 Hall Sensor Inputs (DAC Outputs – Optional) (J6) The terminal block J6 offers users with access to 4 PDx pin resources. Although the initial intention for this connector is to allow for hall sensors to be interfaced to the microcontroller, an alternate function is to use the PDx resources as outputs. Some applications may take advantage of the output configuration to implement a DAC by adding a simple RC filter to a programmable PWM output. The module ships with the resistors and capacitors for the Hall Sensor feature populated. That is R1, R2, R3 and R4; and C1, C2, C4 and C8. To enable the DAC feature, the C1, C2, C4 and C8 should be removed and the C16, C18, C19 and C20 capacitors populated. Depending on the PWM frequency employed to generate the DAC function, it may become necessary to change the R1, R2, R3 and R4 as well. Typical values utilized with the FOC firmware are 0.1 uF for the capacitors and 4.3K for the resistor. Figure 9 Hall Sensor Input / DAC outputs - 12 - Rev 2.0 January 2016 HYDRA-X FOC HEAD SCHEMATIC Figure 10:HYDRA-X FOC Head Schematic Diagram - 13 - Rev 2.0 January 2016 ABOUT ACTIVE-SEMI Founded in 2004 in Silicon Valley and headquartered in Allen, Texas, Active-Semi is a rapidly emerging leader in the multi-billion dollar power management IC and intelligent digital motor drive IC markets. The company's portfolio of analog and mixed signal SoCs (systems-on-chips) are scalable core platforms used in charging, powering and embedded digital control systems for end applications such as industrial, commercial and consumer equipment. The company offers power application microcontrollers, DC/DC, AC/DC, PMU and LED drivers that significantly reduce solution size and cost while improving systemlevel reliability. Active-Semi's turnkey solutions deliver energy-saving power conversion architectures that minimize energy usage and compress system development cycle-time by greater than 50 percent. Active-Semi ships 50 million power ICs per quarter and reached the "one billion units shipped" milestone in May 2012. The multi-national company focuses on commercializing industry leading power management IC solution platforms and has developed broad intellectual property with over 150 patents granted and pending. For more information visit: http://active-semi.com/ LEGAL INFORMATION & DISCLAIMER Copyright © 2012-2015 Active-Semi, Inc. All rights reserved. All information provided in this document is subject to legal disclaimers. Active-Semi reserves the right to modify its products, circuitry or product specifications without notice. Active-Semi products are not intended, designed, warranted or authorized for use as critical components in life-support, life-critical or safety-critical devices, systems, or equipment, nor in applications where failure or malfunction of any Active-Semi product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Active-Semi accepts no liability for inclusion and/or use of its products in such equipment or applications. Active-Semi does not assume any liability arising out of the use of any product, circuit, or any information described in this document. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of Active-Semi or others. Active-Semi assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. Customers should evaluate each product to make sure that it is suitable for their applications. Customers are responsible for the design, testing, and operation of their applications and products using Active-Semi products. Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. All products are sold subject to ActiveSemi's terms and conditions of sale supplied at the time of order acknowledgment. Exportation of any Active-Semi product may be subject to export control laws. Active-Semi™, Active-Semi logo, Solutions for Sustainability™, Power Application Controller™, Micro Application Controller™, Multi-Mode Power Manager™, Configurable Analog Front End™, and Application Specific Power Drivers™ are trademarks of Active-Semi, I. ARM® is a registered trademark and Cortex™ is a trademark of ARM Limited. All referenced brands and trademarks are the property of their respective owners. - 14 - Rev 2.0 January 2016