TQP7M9106

TQP7M9106 2 Watt High Linearity Amplifier Applications Repeaters BTS Transceivers BTS High Power Amplifiers CDMA / WCDMA / LTE General Purpose Wireless 24 Pin 4x4 mm QFN Package Product Features General Description GND/NC GND/NC 19 GND/NC GND/NC 20 21 22 4 15 5 14 6 13 GND/NC RFout/Vcc RFout/Vcc RFout/Vcc GND/NC GND/NC GND/NC GND/NC Iref 12 16 11 3 10 GND/NC 17 9 RFin 18 2 GND/NC RFin GND/NC GND/NC GND/NC 1 GND/NC GND/NC 23 24 Vbias 8 50−1500 MHz +33 dBm P1dB at 940 MHz +50 dBm Output IP3 at 940 MHz 20.8 dB Gain at 940 MHz +5V Single Supply, 455 mA Current Patented internal RF overdrive protection Patented internal DC overvoltage protection On chip ESD protection Shut-down capability Capable of handling 10:1 VSWR at Vcc=+5 V, 0.9 GHz, 33 dBm CW Pout or 23.5 dBm WCDMA Pout 7           Functional Block Diagram GND/NC      Pin Configuration The TQP7M9106 is a high linearity, high gain 2W driver amplifier in industry standard, RoHS compliant, QFN surface mount package. This InGaP/GaAs HBT delivers high performance across 0.05 to 1.5 GHz range of frequencies while achieving 20.8 dB gain, +50 dBm OIP3 and +33 dBm P1dB at 940MHz while only consuming 455 mA quiescent current. All devices are 100% RF and DC tested. Pin No. Symbol 1 4, 5 14, 15, 16 18 2, 3, 6-13, 17, 19-24 Vbias RFin RFout/Vcc Iref GND/NC The TQP7M9106 incorporates patented on-chip circuit techniques that differentiate it from other products in the market. The amplifier integrates an on-chip DC over-voltage and RF over-drive protection. This protects the amplifier from electrical DC voltage surges and high input RF input power levels that may occur in a system. The TQP7M9106 is targeted for use as a driver amplifier in wireless infrastructure where high linearity, medium power, and high efficiency are required. The device is an excellent candidate for transceiver line cards and high power amplifiers in current and next generation multi-carrier 3G / 4G base stations. Datasheet: Rev D 01-24-13 © 2013 TriQuint Ordering Information Part No. Description TQP7M9106 2 W High Linearity Amplifier TQP7M9106-PCB900 920−960 MHz Evaluation Board Standard T/R size = 2500 pieces on a 13” reel. - 1 of 8 - Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Min Typ Device Voltage (VCC) Case Temperature 6 Tj for >10 hours MTTF 4.75 -40 5.0 Rating Storage Temperature ° RF Input Power, CW, 50Ω, T=25 C Device Voltage (VCC) -65 to 150°C +30 dBm +8 V Operation of this device outside the parameter ranges given above may cause permanent damage. Max Units 5.25 +85 +170 V °C °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VCC=+5 V, Temp= +25°C, tuned application circuit Parameter Operational Frequency Range Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 WCDMA Channel Power Noise Figure Quiescent Current (ICQ) Reference Current (Iref) Thermal Resistance, θjc Conditions Min Typ 50 19 Pout = +17 dBm/tone, ∆f = 1 MHz (1) ACLR=-50 dBc 32 +46 360 Junction to case Max 1500 940 20.8 9.2 12.7 +33.1 +50.3 +23.5 4.8 455 8.9 17.2 22 510 Units MHz MHz dB dB dB dBm dBm dBm dB mA mA °C/W Notes: 1. ACLR Test set-up: 3GPP WCDMA, TM1+64 DPCH, +5 MHz offset, PAR = 9.7 dB at 0.01% Prob. Datasheet: Rev D 01-24-13 © 2013 TriQuint - 2 of 8 - Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Device Characterization Data Gain & Max Stable Gain 30 Output reflection coefficients 1 25 Gain (dB) Input reflection coefficients Gain Gmax 20 1 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 15 0 -1 -0.75 -0.5 -0.25 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0 0.25 0.5 0.75 1 -1 -0.75 -0.5 -0.25 0 -0.2 -0.2 -0.4 -0.4 -0.6 -0.6 -0.8 -0.8 -1 -1 0.25 0.5 0.75 1 Frequency (GHz) Note: The gain for the unmatched device in 50 ohm system is shown as the trace in black color, [gain (S(21)]. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown as the blue trace [Gmax]. The impedance plots are shown from 0.05 – 4 GHz. S-Parameters Test Conditions: VCC=+5 V, ICQ=450 mA, T=+25°C, unmatched 50 ohm system, calibrated to device leads Freq (GHz) 0.05 0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 S11 (dB) -0.44 -0.52 -0.50 -0.54 -0.53 -0.56 -0.62 -0.72 -0.89 -1.08 -1.27 -1.38 -1.48 -1.62 -1.90 -2.39 -3.38 -5.41 -8.79 -7.36 -3.69 -2.78 Datasheet: Rev D 01-24-13 © 2013 TriQuint S11 (ang) -114.25 -146.09 -164.26 -176.18 178.67 175.24 171.69 167.05 162.02 156.59 150.93 145.46 139.99 134.72 129.34 124.31 121.03 121.85 141.69 -178.09 -170.72 -168.72 S21 (dB) 19.78 16.00 13.87 11.35 9.50 8.04 6.85 6.03 5.70 5.69 5.48 5.28 4.89 4.85 5.02 4.93 5.32 6.17 6.71 5.31 0.70 -0.74 S21 (ang) 144.69 138.73 132.03 121.63 112.30 104.69 98.63 91.72 85.91 79.97 72.26 63.03 53.16 45.77 36.67 26.06 14.17 -3.37 -26.85 -52.42 -76.13 -86.65 - 3 of 8 - S12 (dB) -42.10 -43.22 -40.75 -40.83 -41.24 -40.31 -39.99 -39.96 -39.07 -37.92 -37.57 -36.04 -36.36 -35.84 -34.86 -34.10 -33.25 -32.23 -31.82 -32.46 -36.73 -37.56 S12 (ang) 39.11 20.45 6.76 3.60 0.84 1.88 3.20 4.12 0.13 -5.54 -7.78 -20.25 -23.44 -33.51 -43.30 -48.61 -62.68 -83.93 -110.34 -138.25 -172.04 176.73 S22 (dB) -1.98 -1.71 -1.50 -1.55 -1.56 -1.53 -1.53 -1.56 -1.69 -1.79 -1.95 -2.21 -2.57 -2.83 -3.01 -2.94 -2.76 -2.38 -1.88 -1.53 -1.47 -1.65 S22 (ang) -159.88 -170.16 -175.13 -177.80 -176.22 -175.02 -173.42 -172.13 -171.07 -169.68 -168.21 -167.59 -169.42 -173.07 -178.95 174.59 167.99 163.09 159.52 155.58 151.81 152.04 Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier TQP7M9106-PCB900 Evaluation Board (920-960 MHz) Vcc +5V C7 19 21 22 20 GND/NC GND/NC GND/NC 23 RFout GND/NC GND/NC 7 18 17 C15 100 pF L1 18 nH 0805 16 C3 J3 100 pF RF Output 15 C2 14 8.2 pF 13 12 6 6.8 pF RFin GND/NC C8 RFout GND/NC L5 8.2 nH 5 U1 RFin 11 22 pF GND/NC 24 2.4 pF GND/NC GND/NC 4 C10 RFout GND/NC 0 C9 51  GND/NC GND/NC 10 RF Input C11 GND/NC GND/NC J2 3 Iref GND/NC 2 R2 C1 100 pF B1 0 L3 0 Vbias 1 C2 C8 L5 C10 C3 GND/NC B1 R1 L1 C14 U1 C9 8 R2 C17 1000 pF R1 68 nH 0603 0.1 uF 100 pF C11 10 uF 6032 C13 R3 0 C15 L3 L4 R3 C1 L4 0 C14 C7 R7 240  D3 SM05T1G C17 C13 9 R6 R8 R6 280  Notes: 1. 2. 3. 4. 5. 6. 7. Components shown on the silkscreen but not on the schematic are not used. 0 Ω resistor can be replaced with copper trace in the target application layout. To power down the device, voltage can be applied to Vref to control Iref by placing resistor R8 and removing R7. The recommended component values are dependent upon the frequency of operation. All components are of 0603 size unless stated on the schematic. R1 is critical for device linearity performance. Critical component placement locations: Distance between center of C8 and TQP7M9106 (U1) device package is 243 mil (11.7º at 940MHz) Distance between center of L5 and TQP7M9106 (U1) device package is 452 mil (21.8º at 940MHz) Distance between center of C9 and TQP7M9106 (U1) device package is 275 mil (13.3º at 940MHz) Distance between center of C2 and TQP7M9106 (U1) device package is 355 mil (17.2º at 940MHz) Bill of Material − TQP7M9106-PCB900 Reference Des. Description Manuf. Part Number U1 Value n/a 2W High Linearity Amplifier TriQuint TQP7M9106 n/a n/a Printed Circuit Board TriQuint D3 n/a Zener, dual, SOT-23 various B1, L3, L4, R3, C11 0Ω Resistor, Chip, 0603, 5%, 1/16W various R2 51 Ω Resistor, Chip, 0603, 5%, 1/16W various R6 280 Ω Resistor, Chip, 0603, 1%, 1/16W various R7 240 Ω Resistor, Chip, 0603, 1%, 1/16W various C2 8.2 pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P C7 10 uF Capacitor , Tantalum, 6032, 35V, 10% C8 6.8pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P AVX 06035J6R8ABSTR C9 2.4 pF Capacitor, Chip, 0603, ±0.05pF, 50 V, Accu-P AVX 06035J2R4ABSTR C10 22 pF Capacitor, Chip, 0603, 5%, 50 V, NPO/COG various C1, C3, C14, C15 100 pF Capacitor, Chip, 0603, 5%, 50V, NPO/COG various C13 0.1 uF Capacitor, Chip, 0603, 50V, X5R, 10% various C17 1000 pF Capacitor, Chip, 0603, 10%, 50V, NPO/COG various Coilcraft 0805CS-180XJLB AVX 06035J8R2ABSTR various L1 18 nH Inductor, 0805, 5%, Coilcraft CS Series L5 8.2 nH Inductor, 0603, 5% Toko LL1608-FSL8N2 R1 68 nH Inductor, 0603, 5% Toko LL1608-FSL68N R4, C12, C4 Datasheet: Rev D 01-24-13 © 2013 TriQuint n/a Do Not Place - 4 of 8 - Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Typical Performance − TQP7M9106-PCB900 Test conditions unless otherwise noted: VCC=+5 V, Temp=+25°C Parameter Conditions Output Return Loss Output P1dB Output IP3 WCDMA Channel Power Noise Figure Quiescent Collector Current, ICQ Pout= +17 dBm/tone, Δf=1 MHz ACLR=-50 dBc Units Typical Value Frequency Gain Input Return Loss (1) 920 20.6 8.5 940 20.8 9.2 960 21 9.4 MHz dB dB 11.3 +32.9 +49.8 +23.3 4.8 12.7 +33.1 +50.3 +23.5 4.8 455 14.9 +33.2 +50.5 +23.5 4.8 dB dBm dBm dBm dB mA Notes: 1. ACLR Test set-up: 3GPP WCDMA, TM1+64 DPCH, +5 MHz offset, PAR = 9.7 dB at 0.01% Prob. Performance Plots − TQP7M9106-PCB900 Test conditions unless otherwise noted: VCC=+5 V, Temp=+25°C Return Loss (dB) 20 - 40°C +25°C +85°C 18 0.93 0.94 0.95 -10 -15 -20 0.92 0.96 0.93 Frequency (GHz) ACLR vs. Output Power at 940MHz -45 -50 Frequency : 940 MHz ACLR (dBm) ACLR (dBm) W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -55 - 40 °C +25°C +85 °C -60 19 21 23 35 17 19 21 23 25 11 P1dB vs. Frequency 17 19 Datasheet: Rev D 01-24-13 © 2013 TriQuint 21 P1dB (dBm) 23 19 21 23 Icc vs. Output Power 1000 800 33 32 +85°C +25°C −40°C 700 600 500 30 15 Output Power / Tone(dBm) 17 900 31 35 15 Output Power / Tone(dBm) 34 13 13 Frequency : 940 MHz Temp.=+25oC 50 11 - 40 °C +25°C +85 °C 40 35 40 0.96 45 Output Power (dBm) 920 MHz 940 MHz 960 MHz 0.95 50 1MHz Tone Spacing 45 0.94 1MHz Tone Spacing -55 25 OIP3 vs. Output Power vs. Frequency Temp.=+25oC 0.93 OIP3 vs. Output Power at 940MHz 55 Temp.=+25oC 920 MHz 940 MHz 960 MHz Output Power (dBm) 55 -15 Frequency (GHz) -65 17 -10 -20 0.92 0.96 -60 -65 OIP3 (dBm) 0.95 ACLR vs. Output Power vs. Frequency -45 W-CDMA 3GPP Test Model 1+64 DPCH PAR = 9.7dB @ 0.01% Probability 3.84 MHz BW -50 0.94 - 40°C +25°C +85°C -5 Frequency (GHz) OIP3 (dBm) 17 0.92 - 40°C +25°C +85°C -5 Output Return Loss vs. Frequency 0 Icc (mA) Gain (dB) 21 19 Input Return Loss vs. Frequency 0 Return Loss (dB) Gain vs. Frequency 22 400 920 930 940 Frequency (MHz) - 5 of 8 - 950 960 15 19 23 27 31 35 Output Power (dBm) Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Symbol 1 Vbias 4, 5 RF IN 14, 15, 16 RFout / Vcc 18 Iref 2, 3, 6-13, 17, 19-24 GND Backside Paddle RF/DC GND GND/NC 19 GND/NC GND/NC GND/NC 20 21 5 14 6 13 GND/NC RFout/Vcc RFout/Vcc RFout/Vcc GND/NC GND/NC GND/NC GND/NC Iref 12 15 11 4 GND/NC Pin No. 22 GND/NC 16 7 GND/NC 3 10 RFin 17 9 RFin 2 GND/NC GND/NC 18 GND/NC GND/NC 1 8 Vbias 23 24 GND/NC Pin Configuration and Description Description Voltage supply for active bias for the amp. Connect to same supply voltage as Vcc. RF Input. Requires external match for optimal performance. External DC Block required. RF Output. Requires external match for optimal performance. External DC Block and supply voltage is required. Reference current into internal active bias current mirror. Current into Iref sets device quiescent current. Also, can be used as on/off control. RF/DC Ground Connection RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint. Evaluation Board PCB Information TriQuint PCB 1078282 Material and Stack-up 1 oz. Cu top layer 0.014" Nelco N-4000-13 1 oz. Cu inner layer 0.062 ± 0.006 Finished Board Thickness Nelco N-4000-13 εr=3.7 typ. 1 oz. Cu inner layer 0.014" Nelco N-4000-13 1 oz. Cu bottom layer 50 ohm line dimensions: Datasheet: Rev D 01-24-13 © 2013 TriQuint width = .031” spacing = .035" - 6 of 8 - Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Package Marking and Dimensions Marking: Part Number – 7M9106 Date Code – YYMM Lot code – AaXXXX 6 Pin #1 IDENTIFIER CHAMFER 0.300 x 45° 4.000 24X 0.50 Pitch 24X 0.25±0.05 TERMINAL #1 IDENTIFIER 7M9106 YYMM AaXXXX 4.000 2.70±0.05 Exp. DAP 6 4 24X 0.40±0.05 2.50 Ref. R.075 5 2.70±0.05 Exp. DAP GND/THERMAL PAD .10 C 24X .850±0.050 .08 C 5 SEATING PLANE 0.000 0.050 .203 Ref. C Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally enhanced plastic very thin fine pitch quad flat no lead package (QFN). 3. Dimension and tolerance formats conform to ASME Y14.4M-1994. 4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins. 6. Package body length/width does not include plastic flash protrusion across mold parting line. PCB Mounting Pattern 3 PACKAGE OUTLINE 16X 0.50 PITCH R.19 24X 0.38 0.19 1 (SOLDER MASK) MINIMUM BACKSIDE THERMAL CONTACT AREA 6 1 24X 0.70 2.70 2.70 0.64 0.64 2.70 BACK SIDE COMPONENT SIDE Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 5. Place mounting screws near the part to fasten a back side heat sink. 6. Do not apply solder mask to the back side of the PC board in the heat sink contact region. 7. Ensure that the backside via region makes good physical contact with the heat sink. Datasheet: Rev D 01-24-13 © 2013 TriQuint - 7 of 8 - Disclaimer: Subject to change without notice TQP7M9106 2 Watt High Linearity Amplifier Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260°C maximum reflow temperature) and tin/lead (245°C maximum reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: Annealed matte tin over copper. ESD Rating: Value: Test: Standard: Class 1C ≥ 1000 V and < 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Value: Test: Standard: Class IV Passes ≥ 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101 RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). MSL Rating MSL Rating: Level 1 Test: 260°C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 This product also has the following attributes:  Lead Free  Halogen Free (Chlorine, Bromine)  Antimony Free  TBBP-A (C15H12Br402) Free  PFOS Free  SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: info-sales@tqs.com Tel: Fax: For technical questions and application information: +1.503.615.9000 +1.503.615.8902 Email: sjcapplications.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev D 01-24-13 © 2013 TriQuint - 8 of 8 - Disclaimer: Subject to change without notice