1200V-35mW SiC FET
Rev. C, December 2019
DATASHEET
Description
UF3C120040K3S
CASE
CASE
D (2)
This SiC FET device is based on a unique ‘cascode’ circuit
configuration, in which a normally-on SiC JFET is co-packaged with a Si
MOSFET to produce a normally-off SiC FET device. The device’s
standard gate-drive characteristics allows for a true “drop-in
replacement” to Si IGBTs, Si FETs, SiC MOSFETs or Si superjunction
devices. Available in the TO-247-3L package, this device exhibits ultralow gate charge and exceptional reverse recovery characteristics,
making it ideal for switching inductive loads when used with
recommended RC-snubbers, and any application requiring standard
gate drive.
Features
w Typical on-resistance RDS(on),typ of 35mW
w Maximum operating temperature of 175°C
w Excellent reverse recovery
G (1)
w Low gate charge
w Low intrinsic capacitance
w ESD protected, HBM class 2
1
2 3
w Very low switching losses (required RC-snubber loss negligible
under typical operating conditions)
S (3)
.
Typical applications
Part Number
Package
Marking
UF3C120040K3S
TO-247-3L
UF3C120040K3S
w EV charging
w PV inverters
w Switch mode power supplies
w Power factor correction modules
w Motor drives
w Induction heating
Datasheet: UF3C120040K3S
Rev. C, December 2019
1
Maximum Ratings
Parameter
Symbol
VDS
VGS
Drain-source voltage
Gate-source voltage
Continuous drain current 1
ID
Pulsed drain current 2
Single pulsed avalanche energy 3
Power dissipation
Maximum junction temperature
Operating and storage temperature
IDM
EAS
Ptot
TJ,max
TJ, TSTG
Max. lead temperature for soldering,
1/8” from case for 5 seconds
TL
Test Conditions
DC
TC = 25°C
TC = 100°C
TC = 25°C
L=15mH, IAS =4.2A
TC = 25°C
Value
Units
1200
-25 to +25
65
47
175
132.3
429
175
-55 to 175
V
V
A
A
A
mJ
W
°C
°C
250
°C
1. Limited by TJ,max
2. Pulse width tp limited by TJ,max
3. Starting TJ = 25°C
Thermal Characteristics
Parameter
Thermal resistance, junction-to-case
Datasheet: UF3C120040K3S
Symbol
Test Conditions
RqJC
Rev. C, December 2019
Value
Min
Typ
Max
0.27
0.35
Units
°C/W
2
Electrical Characteristics (TJ = +25°C unless otherwise specified)
Typical Performance - Static
Parameter
Drain-source breakdown voltage
Total drain leakage current
Total gate leakage current
Drain-source on-resistance
Gate threshold voltage
Gate resistance
Symbol
Test Conditions
BVDS
VGS=0V, ID=1mA
IDSS
IGSS
RDS(on)
VG(th)
RG
Value
Min
Typ
Max
1200
V
VDS=1200V,
VGS=0V, TJ=25°C
8
VDS=1200V,
VGS=0V, TJ=175°C
35
VDS=0V, TJ=25°C,
VGS=-20V / +20V
6
20
VGS=12V, ID=40A,
TJ=25°C
35
45
VGS=12V, ID=40A,
TJ=125°C
VGS=12V, ID=40A,
TJ=175°C
VDS=5V, ID=10mA
Units
150
mA
mA
mW
56
73
4
f=1MHz, open drain
5
4.5
6
V
W
Typical Performance - Reverse Diode
Parameter
Diode continuous forward current 1
Diode pulse current 2
Forward voltage
Test Conditions
IS
TC=25°C
65
A
IS,pulse
TC=25°C
175
A
VFSD
Reverse recovery charge
Qrr
Reverse recovery time
trr
Reverse recovery charge
Qrr
Reverse recovery time
trr
Datasheet: UF3C120040K3S
Value
Symbol
Min
Typ
VGS=0V, IF=20A,
TJ=25°C
1.5
VGS=0V, IF=20A,
TJ=175°C
1.95
VR=800V, IF=40A,
VGS=-5V, RG_EXT=10W
di/dt=2400A/ms,
TJ=25°C
VR=800V, IF=40A,
VGS=-5V, RG_EXT=10W
di/dt=2400A/ms,
TJ=150°C
Rev. C, December 2019
Max
Units
2
V
358
nC
25
ns
259
nC
22
ns
3
Typical Performance - Dynamic
Parameter
Value
Symbol
Test Conditions
Ciss
Coss
Crss
VDS=100V, VGS=0V
f=100kHz
1500
210
1.7
pF
Effective output capacitance, energy
related
Coss(er)
VDS=0V to 800V,
VGS=0V
112
pF
Effective output capacitance, time
related
Coss(tr)
VDS=0V to 800V,
VGS=0V
280
pF
COSS stored energy
Eoss
VDS=800V, VGS=0V
35.6
mJ
Total gate charge
Gate-drain charge
Gate-source charge
QG
QGD
QGS
VDS=800V, ID=40A,
VGS = -5V to15V
51
11
19
nC
Turn-on delay time
td(on)
Input capacitance
Output capacitance
Reverse transfer capacitance
tr
Rise time
td(off)
Turn-off delay time
tf
Fall time
4
EON
4
EOFF
Turn-on energy including RS energy
Turn-off energy including RS energy
Total switching energy including RS
energy4
ETOTAL
Min
Typ
VDS=800V, ID=40A, Gate
Driver =-5V to +15V,
Turn-on RG,EXT=1W,
Turn-off RG,EXT=22W
Inductive Load,
FWD: same device with
VGS = -5V and RG = 22W,
RC snubber: RS=5W and
CS=220pF, TJ=25°C
26
61
1222
227
1449
Snubber RS energy during turn-off
ERS_OFF
9.5
td(on)
37
tr
td(off)
Turn-off delay time
tf
Fall time
4
EON
4
EOFF
Turn-on energy including RS energy
Turn-off energy including RS energy
Total switching energy including RS
energy4
ETOTAL
Snubber RS energy during turn-on
ERS_ON
Snubber RS energy during turn-off
ERS_OFF
VDS=800V, ID=40A, Gate
Driver =-5V to +15V,
Turn-on RG,EXT=1W,
Turn-off RG,EXT=22W
Inductive Load,
FWD: same device with
VGS = -5V and RG = 22W,
RC snubber: RS=5W and
CS=220pF, TJ=150°C
ns
20
ERS_ON
Rise time
Units
38
Snubber RS energy during turn-on
Turn-on delay time
Max
mJ
7.3
25
63
ns
21
1183
261
1444
mJ
7.1
9.5
4. The switching performance are evaluated with a RC snubber circuit as shown in Figure 24.
Datasheet: UF3C120040K3S
Rev. C, December 2019
4
120
120
100
100
Drain Current, ID (A)
Drain Current, ID (A)
Typical Performance Diagrams
80
Vgs = 15V
60
Vgs = 10V
Vgs = 8V
40
Vgs = 7.5V
Vgs = 7V
20
Vgs = 15V
Vgs = 10V
60
Vgs = 8V
40
Vgs = 7V
Vgs = 6.5V
20
Vgs = 6.5V
0
Vgs = 6V
0
0
1
2
3
4
5
6
7
8
Drain-Source Voltage, VDS (V)
9
10
Figure 1. Typical output characteristics at TJ = - 55°C,
tp < 250ms
120
60
1
2
3 4 5 6 7 8 9
Drain-Source Voltage, VDS (V)
10
Figure 2. Typical output characteristics at TJ = 25°C,
tp < 250ms
On Resistance, RDS_ON (P.U.)
80
0
2.5
Vgs = 15V
Vgs = 8V
Vgs = 7V
Vgs = 6.5V
Vgs = 6V
Vgs = 5.5V
100
Drain Current, ID (A)
80
40
20
2.0
1.5
1.0
0.5
0.0
0
0
1
2 3 4 5 6 7 8
Drain-Source Voltage, VDS (V)
9
Figure 3. Typical output characteristics at TJ = 175°C,
tp < 250ms
Datasheet: UF3C120040K3S
-75 -50 -25 0 25 50 75 100 125 150 175
Junction Temperature, TJ (°C)
10
Figure 4. Normalized on-resistance vs. temperature
at VGS = 12V and ID = 40A
Rev. C, December 2019
5
120
Tj = 175°C
Tj = 25°C
Tj = - 55°C
125
100
75
50
25
Tj = 25°C
Tj = 175°C
80
60
40
20
0
0
0
20
40
60
80
Drain Current, ID (A)
100
120
Figure 5. Typical drain-source on-resistances at VGS =
12V
0
2 3 4 5 6 7 8
Gate-Source Voltage, VGS (V)
9
10
Gate-Source Voltage, VGS (V)
20
5
4
3
2
1
0
-100
1
Figure 6. Typical transfer characteristics at VDS = 5V
6
Threshold Voltage, Vth (V)
Tj = -55°C
100
Drain Current, ID (A)
On-Resistance, RDS(on) (mW)
150
15
10
5
0
-5
-50
0
50
100
150
Junction Temperature, TJ (°C)
Figure 7. Threshold voltage vs. junction temperature
at VDS = 5V and ID = 10mA
Datasheet: UF3C120040K3S
0
200
10
20
30
40
Gate Charge, QG (nC)
50
60
Figure 8. Typical gate charge at VDS = 800V and ID =
40A
Rev. C, December 2019
6
0
0
Vgs = -5V
Vgs = 0V
Vgs = 5V
-20
Vgs = 8V
-30
-40
-50
Vgs = 0V
Vgs = 5V
-20
Vgs = 8V
-30
-40
-50
-60
-60
-4
-3
-2
-1
Drain-Source Voltage, VDS (V)
0
Figure 9. 3rd quadrant characteristics at TJ = -55°C
-4
-3
-2
-1
Drain-Source Voltage, VDS (V)
0
Figure 10. 3rd quadrant characteristics at TJ = 25°C
0
80
70
-10
60
-20
-30
EOSS (mJ)
Drain Current, ID (A)
Vgs = - 5V
-10
Drain Current, ID (A)
Drain Current, ID (A)
-10
Vgs = - 5V
-50
40
30
Vgs = 0V
-40
50
Vgs = 5V
20
Vgs = 8V
10
0
-60
-4
-3
-2
-1
Drain-Source Voltage, VDS (V)
Figure 11. 3rd quadrant characteristics at TJ = 175°C
Datasheet: UF3C120040K3S
0
0
200
400
600
800 1000
Drain-Source Voltage, VDS (V)
1200
Figure 12. Typical stored energy in COSS at VGS = 0V
Rev. C, December 2019
7
10,000
70
DC Drain Current, ID (A)
Capacitance, C (pF)
Ciss
1,000
Coss
100
10
60
50
40
30
20
10
Crss
0
1
0
-75 -50 -25 0 25 50 75 100 125 150 175
Case Temperature, TC (°C)
200 400 600 800 1000 1200
Drain-Source Voltage, VDS (V)
Figure 13. Typical capacitances at f = 100kHz and VGS
= 0V
Figure 14. DC drain current derating
1
Thermal Impedance, ZqJC (°C/W)
Power Dissipation, Ptot (W)
500
400
300
200
100
0
-75 -50 -25 0 25 50 75 100 125 150 175
Case Temperature, TC (°C)
Figure 15. Total power dissipation
Datasheet: UF3C120040K3S
0.1
0.01
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
Single Pulse
0.001
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01
Pulse Time, tp (s)
Figure 16. Maximum transient thermal impedance
Rev. C, December 2019
8
400
1ms
100
350
10ms
250
10
100ms
1
Qrr (nC)
Drain Current, ID (A)
300
1ms
DC
200
150
100
10ms
50
0.1
0
1
10
100
1000
Drain-Source Voltage, VDS (V)
0
Figure 17. Safe operation area at TC = 25°C, D = 0,
Parameter tp
2500
20
VDS = 800V, VGS = -5V/15V
RC snubber: CS=220pF,
RS=5W, FWD: same device
with VGS=-5V, RG = 22W
2000
1500
500
50
75 100 125 150
Junction Temperature, TJ (°C)
175
Rs Etot
Rs Eon
Rs Eoff
18
Etot
Eon
Eoff
1000
25
Figure 18. Reverse recovery charge Qrr vs. junction
temperture
Snubber RS Energy (mJ)
Switching Energy (mJ)
VDS = 800V, IS = 40A,
di/dt = 2400A/ms,
VGS = -5V, RG =10W
16
14
12
10
8
6
4
2
0
0
0
10
20
30
40
Drain Current, ID (A)
50
60
0
10
20
30
40
Drain Current, ID (A)
50
60
(a)
(b)
Figure 19. Clamped inductive switching energy (a) and RC snubber energy loss (b) vs. drain current at TJ = 25°C,
turn-on RG_EXT = 1W, and turn-off RG_EXT = 22W
Datasheet: UF3C120040K3S
Rev. C, December 2019
9
8
Turn-on Sunbber RS Energy (mJ)
1600
Turn-on Energy, Eon (mJ)
1400
1200
1000
800
VDS = 800V, ID = 40A,
VGS = -5V/15V, TJ = 25°C
RC snubber: CS=220pF, RS = 5W
FWD: same device with VGS = -5V,
RG = 22W
600
400
200
0
7
6
5
4
3
2
1
0
0
5
10
15
20
25
Total External Turn-on RG, RG_EXT (W)
30
0
5
10
15
20
25
Total External Turn-on RG, RG_EXT (W)
30
(a)
(b)
Figure 20. Clamped inductive switching turn-on energy including RC snubber energy loss (a) and RC snubber
energy loss (b) as a function of total external turn-on gate resistor RG_EXT
400
15
Turn-off Sunbber RS Energy (mJ)
Turn-Off Energy, Eoff (mJ)
350
300
250
200
150
VDS = 800V, ID = 40A,
VGS = -5V/15V, TJ = 25°C
RC snubber: CS=220pF, RS = 5W
FWD: same device with VGS = -5V
100
50
0
12
9
6
3
0
0
10
20
30
40
Total External Turn-off RG, RG,EXT (W)
50
0
10
20
30
40
Total External Turn-off RG, RG_EXT (W)
50
(a)
(b)
Figure 21. Clamped inductive switching turn-off energy including RC snubber energy loss (a) and RC snubber
energy loss (b) as a function of total external turn-off gate resistor RG_EXT
Datasheet: UF3C120040K3S
Rev. C, December 2019
10
2000
1500
16
Snubber RS Energy (mJ)
1750
Switching Energy (mJ)
18
Etot
Eon
Eoff
1250
1000
VDS = 800V, VGS = -5V/15V, RG_ON = 1W,
RG_OFF = 22W, FWD: same device with
VGS=-5V, RG=22W, RC snubber: CS =
220pF, RS = 5W
750
500
250
Rs Etot
Rs Eon
Rs Eoff
14
12
10
8
6
4
2
0
0
0
25
50
75 100 125 150
Junction Temperature, TJ (°C)
0
175
25
50
75 100 125 150
Junction Temperature, TJ (°C)
175
(a)
(b)
Figure 22. Clamped inductive switching energy including RC snubber energy loss (a) and RC snubber energy loss
(b) as a function of junction temperature at ID = 40A
2000
1500
80
Snubber RS Energy (mJ)
1750
Switching Energy (mJ)
90
Etot
Eon
Eoff
1250
1000
VDS = 800V, VGS = -5V/15V
RG_ON = 1W, RG_OFF = 22W
FWD: same device with VGS=-5V,
RG=22W, RC snubber: RS = 5W
750
500
250
70
Rs Etot
Rs Eon
Rs Eoff
60
50
40
30
20
10
0
0
200
400
600
Snubber Capacitance, CS (pF)
800
0
0
200
400
600
Snubber Capacitance, CS (pF)
800
(a)
(b)
Figure 23. Clamped inductive switching energy including RC snubber energy loss (a) and RC snubber energy loss
(b) as a function of snubber capacitance at ID = 40A and TJ = 25°C
Datasheet: UF3C120040K3S
Rev. C, December 2019
11
Figure 24. Clamped inductive load switching test circuit
An RC snubber (RS = 5W and CS = 220pF) is required to improve the turn-off waveforms.
Applications Information
SiC FETs are enhancement-mode power switches formed by a highvoltage SiC depletion-mode JFET and a low-voltage silicon MOSFET
connected in series. The silicon MOSFET serves as the control unit
while the SiC JFET provides high voltage blocking in the off state. This
combination of devices in a single package provides compatibility with
standard gate drivers and offers superior performance in terms of low
on-resistance (RDS(on)), output capacitance (Coss), gate charge (QG), and
reverse recovery charge (Qrr) leading to low conduction and switching
losses. The SiC FETs also provide excellent reverse conduction
capability eliminating the need for an external anti-parallel diode.
Information on all products and contained herein is intended for
description only. No license, express or implied, to any intellectual
property rights is granted within this document.
UnitedSiC assumes no liability whatsoever relating to the choice,
selection or use of the UnitedSiC products and services described
herein.
Like other high performance power switches, proper PCB layout
design to minimize circuit parasitics is strongly recommended due to
the high dv/dt and di/dt rates. An external gate resistor is
recommended when the FET is working in the diode mode in order to
achieve the optimum reverse recovery performance. For more
information on SiC FET operation, see www.unitedsic.com.
Disclaimer
UnitedSiC reserves the right to change or modify any of the products
and their inherent physical and technical specifications without prior
notice. UnitedSiC assumes no responsibility or liability for any errors
or inaccuracies within.
Datasheet: UF3C120040K3S
Rev. C, December 2019
12