105675-HMC434

0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8 Prescaler HMC434 Data Sheet FUNCTIONAL BLOCK DIAGRAM Ultralow SSB phase noise: −150 dBc/Hz typical Single-ended input/outputs Output power: −2 dBm typical Single supply operation: 3 V Ultrasmall, surface-mount, 2.90 mm × 2.80 mm, 6-lead SOT-23 package VCC HMC434 IN ÷8 OUT APPLICATIONS DC to C band PLL prescalers Very small aperture terminal (VSAT) radios Unlicensed national information infrastructure (UNII) and point to point radios IEEE 802.11a and high performance radio local area network (HiperLAN) WLAN Fiber optics Cellular/3G infrastructure GND 15684-001 FEATURES Figure 1. GENERAL DESCRIPTION The HMC434 is a low noise, static, divide by 8 prescaler monolithic microwave integrated circuit (MMIC) utilizing indium gallium phosphide/gallium arsenide (InGaP/GaAs) heterojunction bipolar transistor (HBT) technology in an ultrasmall surface-mount 6-lead SOT-23 package. The HMC434 features single-ended inputs and outputs for reduced component count and cost. The low additive single sideband (SSB) phase noise of −150 dBc/Hz at 100 kHz offset helps the user maintain optimal system noise performance. The HMC434 operates from near dc (square wave) or 200 MHz (sine wave) to 8 GHz input frequency with a single 3 V dc supply. Rev. G Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2017–2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC434 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Interface Schematics .....................................................................5 Functional Block Diagram .............................................................. 1 Typical Performance Characteristics ..............................................6 General Description ......................................................................... 1 Applications Information .................................................................7 Revision History ............................................................................... 2 Evaluation Board PCB ..................................................................7 Specifications..................................................................................... 3 PCB Material Stackup ...................................................................8 Absolute Maximum Ratings ............................................................ 4 Outline Dimensions ..........................................................................9 Thermal Resistance ...................................................................... 4 Ordering Guide .............................................................................9 ESD Caution .................................................................................. 4 REVISION HISTORY 4/2019—Rev. F to Rev. G Change to Figure 11 ......................................................................... 6 Changes to Ordering Guide ............................................................ 9 8/2017—Rev. E to Rev. F Added Endnote 2, Table 1................................................................ 3 This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. 3/2017—Rev. 04.0410 to Rev. E Updated Format .................................................................. Universal Changes to Features Section, Figure 1, and General Description Section..............................................................................................................1 Changes to Table 1.............................................................................3 Changes to Table 2.............................................................................4 Added Thermal Resistance Section and Table 3; Renumbered Sequentially ........................................................................................4 Added Figure 2; Renumbered Sequentially ...................................5 Changes to Table 4, Figure 4, Figure 5, and Figure 6 ....................5 Changes to Figure 7, Figure 8, Figure 9, and Figure 10 ................6 Added Applications Information Section ......................................7 Changes to Evaluation Board PCB Section, Table 5, and Figure 13, and Figure 14 ...................................................................7 Added PCB Material Stackup Section and Figure 15 ...................8 Updated Outline Dimensions ..........................................................9 Change to Ordering Guide...............................................................9 Rev. G | Page 2 of 9 Data Sheet HMC434 SPECIFICATIONS VCC = 3 V, TA = 25°C, 50 Ω system, unless otherwise noted. PIN is input power. Table 1. Parameter RADIO FREQUENCY (RF) INPUT Frequency 1, 2 Power RF OUTPUT SSB Phase Noise Power REVERSE LEAKAGE SUPPLY Voltage (VCC) Current (ICC) 1 2 Min Typ Max Unit Test Conditions / Comments 0.2 –10 0 0 0 8 +10 10 GHz dBm dBm Sine wave input fIN = 1.0 GHz to 3.0 GHz fIN = 3.0 GHz to 8.0 GHz dBc/Hz dBm dBm 100 kHz offset, PIN = 0 dBm, fIN = 4.0 GHz fIN = 1.0 GHz to 8.0 GHz PIN = 0 dBm, fIN = 4.0 GHz, output terminated –5 2.85 −150 –2 −25 3 62 3.15 83 Below 200 MHz, a square wave input is required. For stable operation without an input signal, refer to AN-1463. Rev. G | Page 3 of 9 V mA HMC434 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Supply Voltage (VCC) RF Input Power (VCC = 3 V) Temperature Operating Storage Junction, TJ Nominal (TA = 85°C) Reflow ESD Sensitivity Human Body Model (HBM) Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Rating −0.3 V to +3.5 V 13 dBm θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. −40°C to +85°C −65°C to +125°C 135°C 99°C 260°C Table 3. Thermal Resistance Package Type RJ-6 Class 0 1 2 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. θJA1 359 Simulated values per JEDEC JESD51-12 standards. Junction to GND package pin. ESD CAUTION Rev. G | Page 4 of 9 θJC2 70 Unit °C/W Data Sheet HMC434 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS NIC 1 6 OUT 5 VCC 4 NIC GND 2 IN 3 TOP VIEW (Not to Scale) NOTES 1. NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF AND DC GROUND WITHOUT AFFECTING PERFORMANCE. THE NIC PINS ARE TYPICALLY TIED TO GND FOR ENHANCED THERMAL PERFORMANCE (BUT NOT REQUIRED). 15684-002 HMC434 Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 4 Mnemonic NIC 2 3 5 6 GND IN VCC OUT Description Not Internally Connected. These pins can be connected to RF and dc ground without affecting performance. The NIC pins are typically tied to GND for enhanced thermal performance (but not required). Ground. This pin must be connected to both RF and dc ground. RF Input. This pin must be dc blocked. Supply Voltage (3 V). RF Output. This pin must be dc blocked. INTERFACE SCHEMATICS GND 15684-003 VCC 50Ω 15684-005 OUT Figure 3. GND Interface Schematic Figure 5. OUT Interface Schematic 50Ω 8pF 15684-004 IN 15684-006 VCC VCC Figure 6. VCC Interface Schematic Figure 4. IN Interface Schematic Rev. G | Page 5 of 9 HMC434 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 20 15 15 10 10 5 INPUT POWER (dBm) RECOMMENDED OPERATING WINDOW 0 –5 –10 3 4 5 6 7 8 9 10 –20 5 SSB PHASE NOISE (dBc/Hz) OUTPUT POWER (dBm) 2 1 0 –1 –2 –3 2 3 4 5 6 7 8 9 10 INPUT FREQUENCY (GHz) 15684-008 –4 1 Figure 8. Output Power vs. Frequency at Various Temperatures 0 –10 –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 –150 –160 –170 100 3 4 5 6 7 8 9 10 1k 10k 100k 1M 10M OFFSET FREQUENCY (Hz) Figure 11. Residual SSB Phase Noise (Carrier Frequency = 320 MHz, PIN = 0 dBm) 0 0 –5 –5 –10 –10 POWER LEVEL (dBm) –15 –20 –25 –30 –35 –40 –45 –15 –20 –25 –30 –35 –30 –50 PFEEDTHROUGH SECOND HARMONIC THIRD HARMONIC 0 1 2 3 4 5 6 7 8 9 INPUT FREQUENCY (GHz) 10 –45 –50 15684-009 –55 –60 2 Figure 10. Input Sensitivity Window at Various Temperatures 3 0 1 INPUT FREQUENCY (GHz) TA = +85°C TA = +25°C TA = –40°C 4 0 15684-010 2 15684-011 1 15684-007 0 Figure 7. Input Sensitivity Window OUTPUT POWER (dBc) –5 –15 MAX PIN MIN PIN INPUT FREQUENCY (GHz) –5 0 –10 –15 –20 MAX PIN, TA = +85°C MIN PIN, TA = +85°C MAX PIN, TA = +25°C MIN PIN, TA = +25°C MAX PIN, TA = –40°C MIN PIN, TA = –40°C 5 0 1 2 3 4 5 6 7 8 INPUT FREQUENCY (GHz) Figure 12. Reverse Leakage (PIN = 0 dBm) Figure 9. Output Harmonic Content (PIN = 0 dBm) Rev. G | Page 6 of 9 9 10 15684-012 INPUT POWER (dBm) In Figure 9, PFEEDTHROUGH is the power of the output spectrum at the input frequency. Data Sheet HMC434 APPLICATIONS INFORMATION EVALUATION BOARD PCB J3 VCC C4 10µF Use RF circuit design techniques for the PCB used in the application. Ensure that signal lines have 50 Ω impedance when the package ground leads are connected directly to the ground plane (see Figure 14). Use a sufficient number of via holes to connect the top and bottom ground planes. C2 100pF The evaluation board has two connectors, as shown in Figure 14. The RF input connector (J1) and the RF output connector (J2) are PCB mount SMA connectors. RFOUT J2 5 6 VCC OUT U1 SMA RFIN J1 C1 100pF IN GND 3 2 15684-013 HMC434 The evaluation board is powered from a single 3 V supply; connect this supply using the J3 (VCC) and J4 (GND) test points. See Figure 13 and Table 5 for the evaluation board schematic and the bill of materials, respectively. SMA C3 1000pF GND J4 Figure 13. Evaluation Board Schematic Table 5. List of Materials for Evaluation PCB 105675-HMC4341 Item J1, J2 J3, J4 C1, C2 C3 C4 U1 PCB2 Description PCB mount SMA RF connectors DC pins 100 pF capacitors, 0402 package 1000 pF capacitors, 0402 package 10 μF tantalum capacitors, 1206 package HMC434/HMC434E, divide by 8 105199 evaluation board 105199 is the raw bare PCB identifier. Reference 105675-HMC434 when ordering the complete evaluation PCB. 2 Circuit board material: Arlon 25FR or Rogers RO4350B. 15684-014 1 Figure 14. Evaluation Board—Top View Rev. G | Page 7 of 9 HMC434 Data Sheet PCB MATERIAL STACKUP The evaluation board is built using Arlon 25FR or Rogers RO4350B and standard FR4 materials. RF trace widths are designed to achieve a controlled 50 Ω characteristic impedance. The complete PCB stackup is shown in Figure 15. 0.5oz (18µm) FINISHED COPPER ARLON 25FR OR ROGERS RO4350B LAMINATE 0.010" 0.5oz (18µm) FINISHED COPPER FR4 PREPREG 0.0645" ± 0.0025" COPPER TO COPPER 0.5oz (18µm) FINISHED COPPER 0.5oz (18µm) FINISHED COPPER Figure 15. Evaluation Board PCB Stackup Rev. G | Page 8 of 9 15684-015 FR4 LAMINATE Data Sheet HMC434 OUTLINE DIMENSIONS 3.00 2.90 2.80 1.70 1.60 1.50 6 5 4 1 2 3 PIN 1 INDICATOR 3.00 2.80 2.60 0.95 BSC 1.90 BSC 1.45 MAX 0.95 MIN .15 MAX .05 MIN 0.50 MAX 0.30 MIN 0.20 MAX 0.08 MIN SEATING PLANE 10° 4° 0° 0.60 BSC COMPLIANT TO JEDEC STANDARDS MO-178-AB 0.55 0.45 0.35 12-16-2008-A 1.30 1.15 0.90 Figure 16. 6-Lead Small Outline Transistor Package [SOT-23] (RJ-6) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC434 HMC434TR HMC434E HMC434ETR 105675-HMC434 1 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Package Description 6-Lead Small Outline Transistor Package [SOT-23] 6-Lead Small Outline Transistor Package [SOT-23] 6-Lead Small Outline Transistor Package [SOT-23] 6-Lead Small Outline Transistor Package [SOT-23] Evaluation Board The HMC434E and HMC434ETR are RoHS compliant parts. ©2017–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D15684-0-4/19(G) Rev. G | Page 9 of 9 Package Option RJ-6 RJ-6 RJ-6 RJ-6