GaAs, MMIC, I/Q, Downconverter,
20 GHz to 28 GHz
HMC977
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
19 NIC
20 NIC
21 NIC
22 NIC
NIC 1
18 NIC
NIC 2
17 GND
VDRF 3
16 IF2
15 NIC
VDLO2 4
×2
VDLO1 5
14 IF1
13 GND
NIC 12
NIC 11
NIC 10
9
8
LO
GND
7
NIC 6
NIC
Point to point and point to multipoint radios
Military radar, electronic warfare (EW), and electronic
intelligence (ELINT)
Satellite communications
21858-001
APPLICATIONS
HMC977
23 RF
Conversion gain: 14 dB typical
Image rejection: 21 dBc typical at 20 GHz to 26.5 GHz
2× LO to RF isolation: 45 dB typical at 20 GHz to 26.5 GHz
Noise figure: 2.5 dB typical at 20 GHz to 26.5 GHz
Input IP3: 1 dBm typical at 20 GHz to 26.5 GHz
LO drive range: 2 dBm to 6 dBm
24-lead 4 mm × 4 mm LFCSP
24 GND
FEATURES
Figure 1.
GENERAL DESCRIPTION
The HMC977 is a compact, gallium arsenide (GaAs),
monolithic microwave integrated circuit (MMIC), inphase and
quadrature (I/Q) downconverter in a leadless, RoHS compliant,
surface-mount technology (SMT) package. This device provides a
small signal conversion gain of 14 dB with a noise figure of
2.5 dB and 21 dBc of image rejection. The HMC977 utilizes a
low noise amplifier (LNA) followed by an image reject mixer
which is driven by an active 2× multiplier. The image reject
Rev. D
mixer eliminates the need for a filter following the LNA and
removes thermal noise at the image frequency. I and Q mixer
outputs are provided and an external 90° hybrid is required to
select the required sideband. The HMC977 is a much smaller
alternative to hybrid style image reject mixer downconverter
assemblies and is compatible with surface-mount manufacturing
techniques.
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2019 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC977
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Specifications ............................................................... 3
Absolute Maximum Ratings............................................................ 4
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 1000 MHz, Lower Sideband ............................................. 10
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 2000 MHz, Upper Sideband ............................................. 11
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 2000 MHz, Lower Sideband ............................................. 12
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 3300 MHz, Upper Sideband ............................................. 13
Thermal Resistance ...................................................................... 4
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 3300 MHz, Lower Sideband ............................................. 14
ESD Caution .................................................................................. 4
Spurious Performance ............................................................... 15
Pin Configuration and Function Descriptions ............................. 5
Theory of Operation ...................................................................... 16
Interface Schematics..................................................................... 6
Applications Information .............................................................. 17
Typical Performance Characteristics ............................................. 7
Evaluation PCB ........................................................................... 18
Data Taken as IRM with External 90° Hybrid at the IF Ports,
IF = 1000 MHz, Upper Sideband ............................................... 7
Layout .......................................................................................... 19
Quadrature Channel Data Taken Without 90° Hybrid at the
IF Ports, IF = 1000 MHz, Upper Sideband ............................... 9
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
REVISION HISTORY
This Hittite Microwave Products data sheet has been reformatted
to meet the styles and standards of Analog Devices, Inc.
11/2019—v02.0815 to Rev. D
Updated Format .................................................................. Universal
Changed HMC977LP4E to HMC977 .............................. Universal
Changes to Figure 1 .......................................................................... 1
Changes to the Electrical Specifications Section .......................... 3
Added Figure 2; Renumbered Sequentially ...................................5
Changes to M × N Spurious Outputs,
IF = 1000 MHz Section .................................................................. 15
Added Theory of Operation Section ........................................... 16
Added Applications Information Section ................................... 17
Changes to Figure 52...................................................................... 17
Change to Table 6 ........................................................................... 18
Added Figure 54 ............................................................................. 19
Rev. D | Page 2 of 20
Data Sheet
HMC977
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
20 GHz to 26.5 GHz
TA = 25°C, IF = 1000 MHz, local oscillator (LO) = 6 dBm, drain bias voltage (VDD) = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper
sideband. All measurements performed as downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless
otherwise noted.
Table 1.
Parameter
FREQUENCY RANGE
RF
LO
IF
LO DRIVE RANGE
CONVERSION GAIN (AS IMAGE REJECT
MIXER (IRM))
NOISE FIGURE
IMAGE REJECTION
INPUT POWER FOR 1 dB COMPRESSION (P1dB)
ISOLATION
2× LO to RF
2× LO to IF
INPUT THIRD-ORDER INTERCEPT (IP3)
AMPLITUDE BALANCE
PHASE BALANCE
SUPPLY VOLTAGE
TOTAL SUPPLY CURRENT
Test Conditions/Comments
Min
20
8.3
DC
2
11
35
Data taken without external 90° hybrid at the IF ports
Data taken without external 90° hybrid at the IF ports
No power sequence is required
3.325
Typ
Max
Units
26.5
15
3.5
6
14
GHz
GHz
GHz
dBm
dB
2.5
21
−8
dB
dBc
dBm
45
20
1
0.3
17
3.5
170
dB
dB
dBm
dB
Degree
V
mA
3.675
210
26.5 GHz to 28 GHz
TA = 25°C, IF = 1000 MHz, LO = 6 dBm, VDD = VDLO1 = VDLO2 = VDRF = 3.5 V dc, upper sideband. All measurements performed as
downconverter with upper sideband selected and external 90° hybrid at the IF ports, unless otherwise noted
Table 2.
Parameter
FREQUENCY RANGE
RF
LO
IF
LO DRIVE RANGE
CONVERSION GAIN (AS IRM)
NOISE FIGURE
IMAGE REJECTION
INPUT P1dB
ISOLATION
2× LO to RF
2× LO to IF
INPUT IP3
AMPLITUDE BALANCE
PHASE BALANCE
SUPPLY VOLTAGE
TOTAL SUPPLY CURRENT
Test Conditions/Comments
Min
26.5
11.5
DC
2
11
34
Data taken without external 90° hybrid at the IF ports
Data taken without external 90° hybrid at the IF ports
No power sequence is required
Rev. D | Page 3 of 20
3.325
Typ
Max
Units
28
15.7
3.5
6
14
3
20
−7
GHz
GHz
GHz
dBm
dB
dB
dBc
dBm
39
30
3
0.3
12
3.5
170
dB
dB
dBm
dB
Degree
V
mA
3.675
210
HMC977
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 3.
Parameter
RF Input Power
LO Drive
VDD
Continuous Power Dissipation (PDISS), TA =
85°C (Derates 17.7 mW/°C Above 85°C)1
Temperature
Junction (Channel), TJ
Peak Reflow (Moisture Sensitivity Level 1,
MSL12)
Storage Range
Operating Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
1
2
Thermal resistance is directly linked to printed circuit board (PCB)
design and operating environment. Close attention to PCB
thermal design is required.
Rating
2 dBm
10 dBm
5.0 V
1.6 W
θJC is the channel to case thermal resistance, channel to bottom
of package.
Table 4. Thermal Resistance
Package Type1
HCP-24-2
175°C
260°C
1
−65°C to +150°C
−40°C to +85°C
Class 1A (250 V)
θJC
56.3
Unit
°C/W
Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 mm × 4 mm thermal vias. Refer to JEDEC standard JESD51-2 for
additional information.
ESD CAUTION
PDISS is a theoretical number calculated by (TJ − 85°C)/θJC.
Based on IPC/JEDEC J-STD-20 MSL classifications.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. D | Page 4 of 20
Data Sheet
HMC977
20 NIC
19 NIC
22 NIC
21 NIC
24 GND
23 RF
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
18 NIC
NIC 1
NIC 2
17 GND
VDRF 3
HMC977
16 IF2
VDLO2 4
TOP VIEW
15 NIC
VDLO1 5
14 IF1
NIC 6
NOTES
1. NIC = NOT INTERNALLY CONNECTED. DO NOT
CONNECT TO THIS PIN.
2. EPAD. THE EPAD MUST BE CONNECTED TO GND.
21858-102
NIC 12
NIC 11
NIC 10
GND 9
LO 8
NIC 7
13 GND
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1, 2, 6, 7, 10 to 12,
15, 18 to 22
3
4
5
8
9, 13, 17, 24
14
Mnemonic
NIC
Description
Not Internally Connected. These pins are not connected internally.
VDRF
VDLO2
VDLO1
LO
GND
IF1
16
IF2
23
RF
Power Supply for the RF Low Noise Amplifier. See Figure 3 for the interface schematic.
Power Supply for the Second Stage LO Amplifier. See Figure 4 for the interface schematic.
Power Supply for the First Stage LO Amplifier. See Figure 5 for the interface schematic.
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic.
Ground Connect. Connect these pins to RF and dc ground. See Figure 7 for the interface schematic.
First Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to
dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF
frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or
device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
Second Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation
to dc, block this pin externally using a series capacitor with a value chosen to pass the necessary IF
frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or
device nonfunctionality or device failure may result. See Figure 8 for the interface schematic.
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. See Figure 9 for the interface
schematic.
Exposed Pad. The EPAD must be connected to GND.
EPAD
Rev. D | Page 5 of 20
HMC977
Data Sheet
GND
21858-044
Figure 7. GND Interface Schematic
Figure 3. VDRF Interface Schematic
IF1, IF2
21858-049
21858-045
VDLO2
Figure 8. IF1 and IF2 Interface Schematic
Figure 4. VDLO2 Interface Schematic
21858-046
VDLO1
RF
Figure 5. VDLO1 Interface Schematic
Figure 9. RF Interface Schematic
21858-047
LO
21858-050
VDRF
21858-048
INTERFACE SCHEMATICS
Figure 6. LO Interface Schematic
Rev. D | Page 6 of 20
Data Sheet
HMC977
TYPICAL PERFORMANCE CHARACTERISTICS
25
25
20
20
15
10
15
10
2dBm
4dBm
6dBm
8dBm
5
5
+85°C
+25°C
–40°C
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
0
20
21858-002
23
24
25
26
27
28
Figure 13. Conversion Gain vs. RF Frequency at Various LO Drives
0
0
–5
RF RETURN LOSS (dB)
–10
IMAGE REJECTION (dBc)
22
RF FREQUENCY (GHz)
Figure 10. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
–20
–30
–40
22
23
24
25
26
27
28
–15
–20
RF FREQUENCY (GHz)
+85°C
+25°C
–40°C
–30
20
21858-003
21
–10
–25
+85°C
+25°C
–40°C
–50
20
21
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 11. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
21858-006
0
20
21858-005
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, UPPER SIDEBAND
Figure 14. RF Return Loss vs. RF Frequency Over Temperature,
LO Frequency = 24 GHz
0
0
IF1
IF2
–3
IF RETURN LOSS (dB)
–10
–15
–6
–9
–12
–20
–25
10
11
12
13
14
15
16
LO FREQUENCY (GHz)
Figure 12. LO Return Loss vs. LO Frequency Over Temperature,
LO Drive = 6 dBm
–15
0
1
2
3
4
IF FREQUENCY (GHz)
Figure 15. IF Return Loss vs. IF Frequency, LO Frequency = 24 GHz,
LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
Rev. D | Page 7 of 20
21858-007
+85°C
+25°C
–40°C
21858-004
LO RETURN LOSS (dB)
–5
Data Sheet
0
10
–10
LO TO RF ISOLATION (dB)
20
0
–10
–20
–30
–50
20
21
22
2LO/RF
LO/RF
–20
–30
–40
–50
–60
–70
23
24
25
26
27
28
RF FREQUENCY (GHz)
–80
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 16. RF to IF and LO to IF Isolation vs. RF Frequency, LO Drive = 6 dBm,
Data Taken Without External 90° Hybrid
21858-011
–40
RF/IF2
RF/IF1
2LO/IF1
2LO/IF2
21858-008
RF TO IF AND LO TO IF ISOLATION (dB)(dB)
HMC977
Figure 19. LO to RF Isolation vs. RF Frequency LO Drive = 6 dBm,
Data Taken Without External 90° Hybrid
0
15
–2
10
INPUT IP3 (dBm)
INPUT P1dB (dBm)
–4
–6
–8
–10
5
0
–5
–12
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
–15
20
Figure 17. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
+85°C
+25°C
–40°C
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-012
21
21858-009
–16
20
–10
+85°C
+25°C
–40°C
–14
Figure 20. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
8
10
NOISE FIGURE (dB)
0
–5
4
2
–15
20
2dBm
4dBm
6dBm
8dBm
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
28
Figure 18. Input IP3 vs. RF Frequency at Various LO Drives
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IF FREQUENCY (GHz)
Figure 21. Noise Figure vs. IF Frequency, LO Frequency = 10 GHz,
LO Drive = 6 dBm, Data Taken Without External 90° Hybrid
Rev. D | Page 8 of 20
21858-013
–10
21858-010
INPUT IP3 (dBm)
6
5
Data Sheet
HMC977
QUADRATURE CHANNEL DATA TAKEN WITHOUT 90° HYBRID AT THE IF PORTS, IF = 1000 MHZ, UPPER
SIDEBAND
20
6
15
5
RESPONSE (dB)
NOISE FIGURE (dB)
10
4
3
2
5
0
–5
–10
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
–20
0.5
30
PHASE BALANCE (Degrees)
1.5
1.0
0.5
0
–0.5
–1.0
2dBm
4dBm
6dBm
2.5
3.0
3.5
4.0
2dBm
4dBm
6dBm
25
20
15
10
5
0
22
23
24
25
RF FREQUENCY (GHz)
26
27
28
21858-015
AMPLITUDE BALANCE (dB)
35
21
2.0
Figure 24. Conversion Gain and Return Loss Over IF Bandwidth
2.0
–2.0
20
1.5
IF FREQUENCY (GHz)
Figure 22. Noise Figure vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
–1.5
1.0
Figure 23. Amplitude Balance vs. RF Frequency at Various LO Drives
–5
20
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 25. Phase Balance vs. RF Frequency at Various LO Drives
Rev. D | Page 9 of 20
21858-017
21
CONVERSION GAIN
RETURN LOSS
–15
21858-014
0
20
+85°C
+25°C
–40°C
21858-016
1
HMC977
Data Sheet
25
25
20
20
15
10
15
10
5
5
+85°C
+25°C
–40°C
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
0
20
21858-018
0
20
22
23
24
25
26
27
28
Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives
0
0
+85°C
+25°C
–40°C
–10
+85°C
+25°C
–40°C
–2
–4
INPUT P1dB (dBm)
–20
–30
–40
–6
–8
–10
–12
–50
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
–16
20
Figure 27. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 30. Input P1dB vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
15
+85°C
+25°C
–40°C
10
10
INPUT IP3 (dBm)
5
0
–5
5
0
–5
–10
21
22
23
24
25
RF FREQUENCY (GHz)
26
27
28
21858-020
–10
–15
20
21
21858-022
21
21858-019
–60
20
–14
Figure 28. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
Rev. D | Page 10 of 20
–15
20
2dBm
4dBm
6dBm
8dBm
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
Figure 31. Input IP3 vs. RF Frequency at Various LO Drives
28
21858-023
IMAGE REJECTION (dBc)
21
RF FREQUENCY (GHz)
Figure 26. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
INPUT IP3 (dBm)
2dBm
4dBm
6dBm
8dBm
21858-021
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 1000 MHz, LOWER SIDEBAND
Data Sheet
HMC977
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, UPPER SIDEBAND
15
25
+85°C
+25°C
–40°C
10
INPUT IP3 (dBm)
15
10
5
23
24
25
26
27
28
–15
20
22
23
24
25
26
27
28
Figure 35. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
15
+85°C
+25°C
–40°C
–10
2dBm
4dBm
6dBm
8dBm
10
–20
INPUT IP3 (dBm)
IMAGE REJECTION (dBc)
21
RF FREQUENCY (GHz)
0
–30
–40
5
0
–5
–10
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-025
–50
Figure 33. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
20
15
10
5
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-026
2dBm
4dBm
6dBm
8dBm
21
–15
20
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
Figure 36. Input IP3 vs. RF Frequency at Various LO Drives
25
CONVERSION GAIN (dB)
–5
21858-027
22
21858-024
21
Figure 32. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
0
20
0
–10
RF FREQUENCY (GHz)
–60
20
5
Figure 34. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 11 of 20
28
21858-028
CONVERSION GAIN (dB)
20
0
20
+85°C
+25°C
–40°C
HMC977
Data Sheet
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 2000 MHz, LOWER SIDEBAND
15
25
10
INPUT IP3 (dBm)
15
10
5
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 37. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
–15
20
INPUT IP3 (dBm)
IMAGE REJECTION (dBc)
24
25
26
27
28
2dBm
4dBm
6dBm
8dBm
10
–20
–30
–40
5
0
–5
21
22
23
24
25
26
27
28
21858-030
–10
RF FREQUENCY (GHz)
Figure 38. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
20
15
10
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-031
2dBm
4dBm
6dBm
8dBm
21
–15
20
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
Figure 41. Input IP3 vs. RF Frequency at Various LO Drives
25
CONVERSION GAIN (dB)
23
15
–10
0
20
22
Figure 40. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
+85°C
+25°C
–40°C
5
21
RF FREQUENCY (GHz)
0
–50
20
–5
21858-032
23
21858-029
22
0
–10
+85°C
+25°C
–40°C
21
5
Figure 39. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 12 of 20
28
21858-033
CONVERSION GAIN (dB)
20
0
20
+85°C
+25°C
–40°C
Data Sheet
HMC977
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, UPPER SIDEBAND
15
25
10
15
10
5
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 42. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
23
24
25
26
27
28
10
–20
–30
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-035
22
Figure 43. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
20
15
10
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-036
2dBm
4dBm
6dBm
8dBm
21
–5
2dBm
4dBm
6dBm
8dBm
–15
20
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
Figure 46. Input IP3 vs. RF Frequency at Various LO Drives
25
5
0
–10
+85°C
+25°C
–40°C
21
5
Figure 44. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 13 of 20
28
21858-038
INPUT IP3 (dBm)
IMAGE REJECTION (dBc)
22
15
–40
CONVERSION GAIN (dB)
21
Figure 45. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
–10
0
20
+85°C
+25°C
–40°C
RF FREQUENCY (GHz)
0
–50
20
–5
–15
20
21858-034
21
0
–10
+85°C
+25°C
–40°C
0
20
5
21858-037
INPUT IP3 (dBm)
CONVERSION GAIN (dB)
20
HMC977
Data Sheet
DATA TAKEN AS IRM WITH EXTERNAL 90° HYBRID AT THE IF PORTS, IF = 3300 MHz, LOWER SIDEBAND
15
25
+85°C
+25°C
–40°C
10
15
10
5
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
22
23
24
25
26
27
28
15
2dBm
4dBm
6dBm
8dBm
10
INPUT IP3 (dBm)
–20
–30
–40
5
0
–5
21
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-040
–10
Figure 48. Image Rejection vs. RF Frequency Over Temperature,
LO Drive = 6 dBm
20
15
10
22
23
24
25
26
27
28
RF FREQUENCY (GHz)
21858-041
2dBm
4dBm
6dBm
8dBm
21
21
22
23
24
25
26
27
RF FREQUENCY (GHz)
Figure 51. Input IP3 vs. RF Frequency at Various LO Drives
25
5
–15
20
Figure 49. Conversion Gain vs. RF Frequency at Various LO Drives
Rev. D | Page 14 of 20
28
21858-043
IMAGE REJECTION (dBc)
21
Figure 50. Input IP3 vs. RF Frequency Over Temperature, LO Drive = 6 dBm
–10
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
RF FREQUENCY (GHz)
+85°C
+25°C
–40°C
0
20
–5
–15
20
0
–50
20
0
–10
21858-039
0
20
5
21858-042
INPUT IP3 (dBm)
CONVERSION GAIN (dB)
20
Data Sheet
HMC977
SPURIOUS PERFORMANCE
M × N Spurious Outputs, IF = 1000 MHz
RF = 24 GHz, and RF input power = −20 dBm. LO frequency =
11.5 GHz, and LO drive = 4 dBm. All values are in dBc below IF
power level (RF − 2 × LO). Spur values are (M × RF) − (N × LO).
N/A means not applicable.
M × RF
0
1
2
3
4
0
N/A
−20
−72.6
N/A
N/A
1
−22.6
−29.3
−72.6
N/A
N/A
N × LO
2
−7.4
0
−57.6
−74.6
N/A
3
−28.8
−33
−43.6
−74.6
N/A
4
−37.2
−37.3
−51.6
−74.6
N/A
Rev. D | Page 15 of 20
HMC977
Data Sheet
THEORY OF OPERATION
The HMC977 is a compact, GaAs, MMIC, I/Q downconverter
in a leadless, RoHS compliant, SMT package. The device can be
used as either an image reject mixer or a SSB upconverter. The
mixer uses two standard, double balanced, mixer cells and a
90° hybrid. This device is a smaller alternative to a hybrid style
image reject mixer and a SSB upconverter assembly. The
HMC977 eliminates the need for wire bonding, allowing the
use of the surface-mount manufacturing techniques.
Rev. D | Page 16 of 20
Data Sheet
HMC977
APPLICATIONS INFORMATION
Figure 52 shows the typical application circuit for the HMC977.
To select the appropriate sideband, an external 90° hybrid
coupler is needed. For applications not requiring operation to
dc, use an off chip dc blocking capacitor. The common-mode
voltage for each IF port is 0 V.
To select the lower sideband, connect the IF2 pin to the 90°
port of the hybrid and the IF1 pin to the 0° port of the hybrid.
To select the upper sideband (low side LO), connect the IF2 pin
to the 0° port of the hybrid and the IF1 pin to the 90° port of
the hybrid.
COUPLER
×2
AUTOMATIC
GAIN
CONTROL
IF OUT
RF
20GHz TO 28GHz
Figure 52. Typical Application Circuit
Rev. D | Page 17 of 20
21858-051
LO
8.3GHz TO 15.7GHz
BAND-PASS
FILTER
HMC977
Data Sheet
EVALUATION PCB
Table 6. List of Materials for Evaluation PCB 1316561
It is recommended to use RF circuit design techniques with the
circuit board used in the application. Signal lines must have 50 Ω
impedance, and the package ground leads and exposed paddle
must be connected directly to the ground plane similar to that
shown Figure 54. A sufficient number of via holes must be used
to connect the top and bottom ground planes. The evaluation
circuit board shown in Figure 53 is available from Analog
Devices, Inc., upon request.
Item
J1
J2, J3
J5 to J8
C1, C4, C7
C2, C5, C8
C3, C6, C9
U1
PCB2
1
2
Description
PCB mount, Subminiature Version A (SMA), RF
connector, SRI
PCB mount K connectors, SRI
DC pins
100 pF capacitors, 0402 package
10 nF capacitors, 0402 package
4.7 μF capacitors, Case A package
HMC977
131653 evaluation board
Reference this number when ordering complete evaluation PCB.
Circuit board material: Rogers 4350.
131653-1
VDL02
VDRF
J5
VDLO1
J6
GND
J7
J8
U1
+
C3
C9
+
RFIN
C6
J3
C5
C8 C7
IF2
C4
H977
XXXX
IF1
C2 C1
LO
J1
Figure 53. Evaluation PCB
Rev. D | Page 18 of 20
J4
21858-052
J2
+
Data Sheet
HMC977
0.178" SQUARE
LAYOUT
SOLDERMASK
Solder the exposed pad on the underside of the HMC977 to a
low thermal and electrical impedance ground plane. This pad is
typically soldered to an exposed opening in the solder mask on
the evaluation board. Connect these ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package. Figure 54 shows the PCB
land pattern footprint for the HMC977 evaluation board.
0.006" MASK/METAL OVERLAP
0.010" MIN MASK WIDTH
GROUND PAD
PAD SIZE
0.026" × 0.010"
PIN 1
0.0197"
[0.50]
0.116"
MASK
OPENING
0.034"
TYPICAL
VIA SPACING
0.010"
TYPICAL VIA
0.110" SQUARE
GROUND PAD
0.098" SQUARE MASK OPENING
0.020 × 45° CHAMFER FOR PIN 1
Figure 54. 131656-HMC977LP4E PCB Land Pattern Footprint
Rev. D | Page 19 of 20
21858-054
0.010" REF
0.030"
MASK OPENING
HMC977
Data Sheet
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
PIN 1
INDICATOR
0.30
0.25
0.18
1
18
0.50
BSC
2.95
2.80 SQ
2.65
EXPOSED
PAD
13
TOP VIEW
1.00
0.90
0.80
0.50
0.40
0.30
6
12
7
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
PKG-000000
SEATING
PLANE
P IN 1
I N D IC ATO R AR E A OP T IO N S
(SEE DETAIL A)
24
19
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8.
08-30-2018-A
4.10
4.00 SQ
3.90
Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.90 mm Package Height
(HCP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC977LP4E
HMC977LP4ETR
131656-HMC977LP4E
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Assembly Board
The models are RoHS complaint parts.
See the Absolute Maximum Ratings section.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D21858-0-11/19(D)
Rev. D | Page 20 of 20
Lead Finish
100% Matte Sn
100% Matte Sn
MSL
Rating2
MSL1
MSL1
Package
Option
HCP-24-2
HCP-24-2
