REVISIONS
LTR
DATE (YR-MO-DA)
APPROVED
A
Add device type 02 and RHA designator “R” requirements.
Make changes to 1.2.2, 1.4, and Table I. Make a change to case outline X
pin 32 under Figure 2. Add paragraphs 1.5, 4.4.4.1, and Table IIB.
Delete AVCC, DVCC, and tCMIN tests as specified under Table I. - ro
DESCRIPTION
08-10-31
R. HEBER
B
Add device type 03 tested at low dose rate. Make change to paragraphs 1.2.2,
1.4, and 1.5. Make changes to footnotes 1/, 2/, and 3/ as specified under
Table I. Make change to Table IIB and paragraph 4.4.4.1. -rrp
11-06-14
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
REV
B
B
B
B
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
PMIC N/A
PREPARED BY
DAN WONNELL
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
RAYMOND MONNIN
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
RAYMOND MONNIN
DRAWING APPROVAL DATE
04-10-25
REVISION LEVEL
B
MICROCIRCUIT, DIGITAL-LINEAR, A/D
CONVERTER, 14-BIT, 80 MSPS, MONOLITHIC
SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-04230
1 OF 13
5962-E388-11
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
04230
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
02
V
X
C
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Operating temperature
Circuit function
01
AD6645
-35°C ≤ TC ≤ +85°C
A/D converter, 14-bit, 80 MSPS
02
AD6645
-55°C ≤ TA ≤ +125°C
03
AD6645
-55°C ≤ TA ≤ +125°C
Radiation hardened A/D converter,
14-bit, 80 MSPS
Radiation hardened A/D converter,
14-bit, 80 MSPS
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
52
Package style
Quad flat pack with non-conductive tie bars
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
2
1.3 Absolute maximum ratings. 1/
Analog supply voltage (AVCC) ..................................................................... 0 V dc to 7 V dc
Digital supply voltage (DVCC) ......................................................................
Analog input voltage ....................................................................................
Analog input current ....................................................................................
Digital input voltage .....................................................................................
Digital output current ...................................................................................
Junction temperature (TJ) ............................................................................
Lead temperature (soldering, 10 seconds) ..................................................
Storage temperature range ..........................................................................
Thermal resistance, junction-to-case (θJC) ..................................................
0 V dc to 7 V dc
0 V dc to AVCC
25 mA
0 V dc to AVCC
4 mA
+175°C
+300°C
-65°C to +150°C
7.2°C/W
1.4 Recommended operating conditions.
Analog supply voltage (AVCC) ..................................................................... 4.75 V dc to 5.25 V dc
Digital supply voltage (DVCC) ...................................................................... 3.0 V dc to 3.6 V dc
Case operating temperature range (TC) for device type 01 ......................... -35°C to +85°C
Ambient operating temperature range (TA) for device types 02 and 03 ...... -55°C to +125°C
1.5 Radiation features:
Device type 02:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ................. 100 krads (Si) 2/
Device type 03:
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s) ........................ 50 krads (Si) 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
3/ For device type 03, radiation end point limits for the noted parameters are guaranteed for the conditions specified in
MIL-STD-883, method 1019, condition D.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Timing waveforms. The timing waveforms shall be as specified on figure 3.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range for device type 01 and ambient operating temperature range for device types 02 and 03.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.
Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in
accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 81 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
AVCC = 5 V, DVCC = 3.3 V,
fc = 80 MSPS
Group A
subgroups
Device
type
unless otherwise specified
Resolution
RES
Offset error
OE
Gain error
Min
4/ 5/
Digital supply current
Power consumption
IDVCC
Max
All
14
1, 2, 3
All
-10
+10
M,D,P,L,R
1
02
-10
+10
M,D,P,L
1
03
-10
+10
1, 2, 3
01
-10
+10
1
02, 03
-10
+10
-14
+14
2,3
IAVCC
Unit
1, 2, 3
AE
Analog supply current
Limits
Bits
M,D,P,L,R
1
02
-10
+10
M,D,P,L
1
03
-10
+10
1, 2, 3
All
320
M,D,P,L,R
1
02
320
M,D,P,L
1
03
320
1, 2, 3
All
45
M,D,P,L,R
1
02
45
M,D,P,L
1
03
45
1.75
AVCC = 5.0 V
DVCC = 3.3 V
mV
%FS
mA
mA
PD
4/
1, 2, 3
All
Differential input voltage
VDIFF
5/
1, 2, 3
01
0.4
Vp-p
Output voltage, logic “1”
VOH
1, 2, 3
01
2.85
V
02, 03
2.8
DVCC = 3.3 V, IOH = 0
5/
DVCC = 3.3 V, IOH = 0 4/
Output voltage, logic “0”
VOL
1, 2, 3
DVCC = 3.3 V, IOL = 0 5/
DVCC = 3.3 V, IOL = 0 4/
No missing codes
4/
4,5,6
01
0.5
02, 03
0.5
02, 03
0
W
V
0
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
5
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions 1/ 2/ 3/
AVCC = 5 V, DVCC = 3.3 V,
fc = 80 MSPS
Group A
subgroups
Device
type
unless otherwise specified
Differential non-linearity
DNL
6/
4,5
02, 03
6
Signal to noise ratio
(SNR) at -1 dBFS
SNR
70.1 MHz
30 MHz
70 MHz
Signal to noise ratio
and distortion (SINAD)
at -1 dBFS
SINAD
30 MHz
70 MHz
Spurious free dynamic
range (SFDR) at
-1 dBFS
Worst case second or
third harmonic at
-1 dBFS
SFDR
2nd or
30 MHz
Worst case fourth or
4 th
higher harmonic at
plus
-1 dBFS
30 MHz
70 MHz
-1
2.0
M,D,P,L
4
03
-1
1.5
4, 5, 6
01
68.5
4/ 6/
LSB
dB
67
4,5
02, 03
72
6
70.5
4,5
71.5
6
70
4, 5, 6
01
68
4/ 6/
dB
65
4,5
4/ 6/
4/ 6/
02, 03
71.5
6
70
4,5
71
6
69.5
4, 5, 6
01
76
4/ 6/
dBc
67
4/ 6/
4
3rd
70 MHz
1.5
1.5
4/ 6/
150.1 MHz
-1
-1
4/ 6/
70.1 MHz
Max
02
4/ 6/
150.1 MHz
Min
4
4/ 6/
70.1 MHz
Unit
M,D,P,L,R
4/ 6/
150.1 MHz
Limits
4/ 6/
4/ 6/
82
5
80
6
79
4
82
5
80
6
79
4,5
4/ 6/
02, 03
02, 03
dB
84
6
80
4,5
84
6
80
dB
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
6
TABLE I. Electrical performance characteristics - continued.
Test
Symbol
Conditions 1/ 2/ 3/
AVCC = 5 V, DVCC = 3.3 V,
fc = 80 MSPS
Limits
Group A
subgroups
Device
type
Unit
unless otherwise specified
Two tone
intermodulation
distortion (IMD)
rejection
IMDR
At -7 dBFS, F1, F2 4/ 6/ 7/
ENCODE pulse width
HIGH
tENCH
ENCODE pulse width
LOW
tENCL
Min
Max
4, 5, 6
01
75.5
dBc
4/ 5/ 8/
9, 10, 11
All
5.625
ns
4/ 5/ 8/
9, 10, 11
All
5.625
ns
4/ 5/
9, 10, 11
All
1.0
3.1
ns
Encode rising to
dataready falling
tDR
Encode rising to
dataready rising
tE_DR
50% duty cycle 4/ 5/
9, 10, 11
All
7.3
9.4
ns
ENCODE to DATA
falling low
tE_FL
4/ 5/
9, 10, 11
All
2.4
7.0
ns
ENCODE to DATA
rising low
tE_RL
4/ 5/
9, 10, 11
All
1.4
4.7
ns
ENCODE to DATA
delay (hold time)
tH_E
4/ 5/
9, 10, 11
All
1.4
4.7
ns
ENCODE to DATA
delay (setup time)
tS_E
4/ 5/
9, 10, 11
All
tENC-
tENC-
tE_FL(MAX)
tE_FL(MIN)
5.3
10.0
50% duty cycle 4/ 5/
ns
Dataready to DATA
delay (hold time)
tH_DR
50% duty cycle 4/ 5/ 9/
9, 10, 11
All
6.6
7.9
ns
Dataready to DATA
delay (setup time)
tS_DR
50% duty cycle 4/ 5/ 9/
9, 10, 11
All
2.1
5.1
ns
1/
2/
For device type 01; -35°C ≤ TC ≤ +85°C. For device types 02 and 03; -55°C ≤ TA ≤ +125°C.
Device type 02 supplied to this drawing has been characterized through all levels M, D, P, L, R of irradiation. Device type
03 supplied to this drawing has been characterized through all levels M, D, P, L of irradiation. However,
device type 02 is only tested at the “R” level and device type 03 is only tested at the “L” level. Pre and Post irradiation
values are identical unless otherwise specified in Table I. When performing post irradiation electrical measurements for any
4/
5/
RHA level, TA = +25°C.
For device type 02, this part may be dose rate sensitive in a space environment and may demonstrate enhanced low
dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified
in MIL-STD-883, method 1019, condition A for device type 02 and condition D for device type 03. Device type 03, has been
tested at low dose rate.
Not tested post irradiation.
Parameter tested as part of device initial characterization and after design and process changes.
6/
7/
All AC parameters tested by driving ENCODE and ENCODE differentially.
F1 = 70.1 MHz, F2 = 72.1 MHz.
8/
Parameter is a function of tENCL and tENCH.
9/
Dataready to DATA delay (tH_DR and tS_DR) is dependent on tENC and duty cycle.
3/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
7
Case outline X
Symbol
A
A1
A2
A3
b
B/C
B1 / C1
D/E
D1 / E1
e
L
L1
Inches
Millimeters
Min
Max
.099
.131
.090
.120
.063
.077
.019
.031
0.015 BSC
.495
.505
.395
.405
1.440
1.460
.575
.585
.040 BSC
1.090
1.110
.590
.610
Min
Max
2.155
3.327
2.286
3.048
1.600
1.956
0.483
0.787
0.381 BSC
12.573
12.827
10.033
10.287
36.576
37.084
14.605
14.859
1.016 BSC
27.686
28.194
14.986
15.494
NOTE:
1. The U.S. Government preferred system of measurement is the metric S.I. system. However, since this item was
originally designed using inch-pound units of measurements, in the event of conflict between the metric and
inch-pound units, the inch-pound units shall take precedence.
2. Dimensions B1/C1 identify the exposed heat sink.
FIGURE 1. Case outline.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
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A
REVISION LEVEL
B
SHEET
8
Device types
All
Device types
All
Case outline
X
Case outline
X
Terminal
number
Terminal symbol
Terminal
number
Terminal symbol
1
DVCC
27
GND
2
GND
28
AVCC
3
VREF
29
GND
4
GND
30
AVCC
5
ENC
31
Do not connect
6
ENC
32
Do not connect
7
GND
33
DVCC
8
AVCC
34
GND
9
AVCC
35
DMID
10
GND
36
D0 (LSB)
11
AIN
37
D1
12
AIN
38
D2
13
GND
39
D3
14
AVCC
40
D4
15
GND
41
D5
16
AVCC
42
GND
17
GND
43
DVCC
18
AVCC
44
D6
19
GND
45
D7
20
C1
46
D8
21
GND
47
D9
22
AVCC
48
D10
23
GND
49
D11
24
C2
50
D12
25
GND
51
D13 (MSB)
26
AVCC
52
DRY
FIGURE 2. Terminal connections.
STANDARD
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DSCC FORM 2234
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REVISION LEVEL
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9
NOTE: Normally, tA = -500 ps.
FIGURE 3. Timing waveforms.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
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A
REVISION LEVEL
B
SHEET
10
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
STANDARD
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DSCC FORM 2234
APR 97
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A
REVISION LEVEL
B
SHEET
11
TABLE IIA. Electrical test requirements.
Test requirements
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
1
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
class Q
Device
class V
1
1
1,2,3,4,5,6, 1/ 2/
9,10,11
1,2,3,4,5,6,9,10,11
1
1,2,3,4,5,6, 1/
9,10,11
1,2,3,4,5,6,9,
10,11
1
1
1
1
1,4
1,4
1,4
1,2,3,4,5,6, 1/
9,10,11
1,2,3,4,5,6,9,10,11
1 2/
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be computed with reference to the previous interim
electrical parameters. Delta parameters are excluded from PDA.
TABLE IIB. 240 hour burn-in and group C end-point electrical parameters. TA = +25°C.
Parameter
Device type
240 hour
delta limits
Group C
Delta limts
Units
IAVCC
02, 03
±6
±6
mA
IDVCC
02, 03
±2
±2
mA
OE
02, 03
±4
±4
mV
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
12
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019, condition A device type 02, condition D for device type 03 and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime -VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-04230
A
REVISION LEVEL
B
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 11-06-14
Approved sources of supply for SMD 5962-04230 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-0423001QXC
24355
AD6645ASQ/QMLQ
5962R0423002VXC
24355
AD6645ASQ/QMLR
5962L0423003VXC
24355
AD6645ASQ/QMLL
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
24355
Vendor name
and address
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: 7910 Triad Center Drive
Greensboro, NC 27409-9605
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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